KR101308410B1 - Ultrasonic bonding apparatus having Changeable Pressure Part - Google Patents

Abstract

Ultrasonic bonding apparatus of the present invention is a jig base moving in the up and down direction, the pressing member formed in the lower portion of the pressing surface for moving in the up and down direction in accordance with the movement of the jig base, pressurizing the bonding object, the bottom of the jig base It is located on the stage spaced apart from the ultrasonic horn and vibrating according to the applied frequency and the substrate and the chip is located, and coupled with the ultrasonic horn to the vibration energy of the vibration of the ultrasonic horn to the substrate and chip It includes a fixing jig for transmitting.

Description

Ultrasonic bonding apparatus having a replaceable pressure member {Ultrasonic bonding apparatus having Changeable Pressure Part}

The present invention relates to an ultrasonic bonding apparatus, and more particularly, to an ultrasonic bonding apparatus which can replace and couple the pressing member formed differently according to the form of the bonding surface of the bonding object or the shape of the bonding object.

Printed Circuit Boards (PCBs) are now widely used in electronic devices, and various methods of bonding circuit chips to printed circuit boards have been implemented.

One method for bonding a circuit chip to a printed circuit board is die bonding the circuit chip onto a lead frame, and wire-bonding the electrode and the lead frame of the IC chip to a resin. Surface Mount Technology (SMT) was used to form a package by molding and then print a cream solder onto a circuit board and perform a reflow process.

This has a problem that the process is long, requires a long time for production, and it is difficult to miniaturize the circuit board.

Therefore, in order to shorten the process and reduce the size and weight, a method of directly mounting a bumped circuit chip on a printed circuit board has been used.

In particular, in the process of thermally fusion mounting the bumped circuit chip on a printed circuit board, anisotropic conductive film (ACF) is first applied on the printed circuit board, and then the circuit chip is vibrated at an ultrasonic frequency range. It was shown that the thermal bonding to the circuit board by the thermal energy through the vibration energy.

However, the error in placing the chip on the circuit board, the error in installing the stage where the circuit board is located, and the pressing member transmitting the vibration, the error in the thickness of the anisotropic conductive adhesive for bonding the circuit board and the chip, or uneven coating The pressing surface and the bonding object are not arranged in parallel due to the like.

Since the contact surface of the pressurized surface and the object to be bonded does not exactly match, vibration energy is transmitted in the point contact state instead of the surface contact, and energy loss occurs. Furthermore, the conversion of thermal energy through the vibration energy is not sufficient. There was a problem that a defect occurred.

In order to solve the problem, there is also a problem that damage may occur due to the application of a high load to the chip in the case of additionally applying a load to the surface contact the point contact.

Furthermore, even if the chip and the pressing surface in parallel contact, there was also a problem that the alignment of the pressing surface and the bonding surface may occur due to the application of the vibration of the ultrasonic horn due to the application of the vibration of the pressing surface and the bonding surface.

In the conventional ultrasonic bonding apparatus, as the ultrasonic horn is fixed to the pressing part to pressurize, the ultrasonic horn applying the vibration moves along the movement of the pressing part, so that a precise error occurs in the joint surface for applying vibration. There was also a problem that the reliability of the chip coupling was low.

In addition, the pressing member is fixedly formed to have a special shape of the bonding surface, or in the case of a chip processed in a special shape is pressed by one pressing member, the effective vibration is not transmitted through the pressing member, the chip and the substrate There was a problem that a poor bonding occurred.

The present invention is to solve the above-mentioned problems, to provide an ultrasonic bonding apparatus that can be bonded to the chip by using a pressing portion corresponding to the shape of the chip provided to replace the pressing portion of the pressing member.

In addition, by separating the ultrasonic horn and the pressing member, to provide an ultrasonic bonding apparatus fixed to the ultrasonic horn on the stage.

In addition, the present invention provides an ultrasonic bonding apparatus in which the pressing surface is variable to form a horizontal angle and a predetermined angle according to a load applied to the pressing surface due to an unbalance between the pressing surface and the contact object.

The problems of the present invention are not limited to the above-mentioned problems, and other problems not mentioned can be clearly understood by those skilled in the art from the following description.

Ultrasonic bonding apparatus of the present invention for solving the above problems is a jig base moving in the up and down direction, a body portion formed with a first coupling portion and a second coupling portion detachably coupled to the first coupling portion is formed in the body It is coupled to the detachable portion, the pressing member including a pressing portion formed on the pressing surface for pressing the bonding object is coupled between the jig base and the pressing member to provide an elastic force between the pressing member and the jig base. And vibrating according to an applied frequency and an elastic member for coupling the pressing member to the jig base such that the pressing surface is in surface contact with the bonding object, and vibrating to the bonding object through the pressing surface of the pressing member. It includes an ultrasonic horn coupled to the pressing member to be delivered.

The pressing member may include an elastic member fixing part protruding along the circumference of the pressing part, and the elastic member may be coupled between the fixing part and the jig base.

An insertion hole is formed in the jig base, and a fixing hole is formed in the fixing part, and the elastic member is supported on the upper surface of the jig base while being supported by the insertion hole, and one end of which is moved to the shaft support part. It may be further fitted to the coupling, the other end is a shaft that is fixed to the fixing hole and the spring is inserted into the shaft may further include a spring to provide an elastic force between the jig base and the fixing portion.

In addition, an upper surface of the pressing member is formed with an ultrasonic horn fixing portion into which the ultrasonic horn is inserted, the ultrasonic horn is formed with an insertion hole into which the ultrasonic fixing part is inserted, and an insertion portion into which the ultrasonic horn fixing portion is fitted is formed. It may further include a fixing member coupled to the upper portion of the ultrasonic horn to fix the ultrasonic horn to the upper surface of the pressing member.

The control unit may further include a sensing unit provided on the pressing surface to determine whether the rigid pressing surface and the contact object are in contact with the surface, and a controller configured to control the upward and downward movement of the jig base according to the sensing result of the sensing unit.

Meanwhile, the ultrasonic bonding device according to another embodiment of the present invention has a jig base moving in up and down directions, a body portion in which a first coupling portion is formed, and a second coupling portion detachably coupled to the first coupling portion, and is detachable from the body portion. Is coupled to be possible, the pressing surface for pressing the bonding object is a pressing member including a pressing portion formed in the lower portion, the ultrasonic horn which is located on the stage disposed spaced below the jig base, and vibrating according to the applied frequency and The substrate and the chip is located on the upper side, and coupled to the ultrasonic horn includes a fixing jig for transmitting the vibration energy by the vibration of the ultrasonic horn to the substrate and the chip.

A vibration blocking unit may be provided between the stage and the ultrasonic horn to block the vibration generated from the ultrasonic horn from being transmitted to the stage.

In addition, it is coupled between the jig base and the pressing member to provide an elastic force between the pressing member and the jig base, and to couple the pressing member to the jig base so that the pressing surface is in surface contact with the bonding object. It may further include an elastic member.

The pressing member may include a pressing part having a pressing surface and an elastic member fixing part protruding along a circumference of the pressing part, and the elastic member may be coupled between the fixing part and the jig base.

An insertion hole is formed in the jig base, and a fixing hole is formed in the fixing part, and the elastic member is supported on the upper surface of the jig base while being supported by the insertion hole, and one end of which is moved to the shaft support part. It may be further fitted to the coupling, the other end is a shaft that is fixed to the fixing hole and the spring is inserted into the shaft may further include a spring to provide an elastic force between the jig base and the fixing portion.

Ultrasonic bonding apparatus according to the present invention having the above configuration has the following effects.

First, it is possible to improve the transmission efficiency of the vibration energy of the ultrasonic horn by combining the pressing unit according to the shape of the contact surface of the bonding object or the overall shape of the bonding object.

Second, the ultrasonic horn that generates vibration energy transmitted to the bonding object while vibrating is fixedly fixed to the lower stage, thereby reducing the precision error on the joint surface that may occur when the ultrasonic horn moves, resulting in more reliable bonding results. This has the advantage of being available.

Third, by using the transfer of the unbalanced load of the pressing surface caused by the unbalance of the bonding object and the pressing surface is aligned so that the pressing surface is parallel to the bonding surface. Therefore, it is possible to prevent unnecessary loss of vibration energy due to the point contact between the pressing surface and the bonding surface according to various situations.

Fourth, there is an advantage that it is possible to simply correct the change in alignment that may occur between the pressing surface and the contact surface due to the vibration application of the ultrasonic horn.

Fifth, there is an advantage that the pressing surface can be restored to its original state at the same time as the separation of the pressing surface and the contact surface by using the elastic force.

The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view of an ultrasonic bonding device according to an embodiment of the present invention;
Figure 2 is an exploded perspective view of the ultrasonic bonding device according to an embodiment of the present invention;
Figure 3 is a cross-sectional view of the ultrasonic bonding device according to an embodiment of the present invention;
4 to 6 are views showing a process of bonding a circuit chip to a printed circuit board using an ultrasonic bonding apparatus according to an embodiment of the present invention;
7 is a cross-sectional view showing a state in which the ultrasonic bonding apparatus according to an embodiment of the present invention is arranged to form a predetermined angle with the vertical axis in the vertical direction;
8 is a view showing a state in which the elastic member of the ultrasonic welding apparatus according to an embodiment of the present invention moved to form a predetermined angle with respect to the vertical axis.
9 is a view showing a state in which the pressing portion 21 of the ultrasonic welding apparatus according to an embodiment of the present invention;
10 is a perspective view of the ultrasonic bonding apparatus according to another embodiment of the present invention;
11 is a cross-sectional view of the ultrasonic welding device according to another embodiment of the present invention;
12 to 14 are views showing a process of bonding a circuit chip to a printed circuit board using the ultrasonic bonding apparatus of another embodiment of the present invention;
15 is a view showing a state in which the pressing member of the ultrasonic bonding apparatus according to another embodiment of the present invention is moved to form a predetermined angle with respect to the vertical axis;
Figure 16 is a view showing a state in which the pressing portion of the ultrasonic bonding apparatus according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. In describing the present embodiment, the same designations and the same reference numerals are used for the same components, and further description thereof will be omitted.

1 is a perspective view of an ultrasonic bonding apparatus according to an embodiment of the present invention, Figure 2 is an exploded perspective view of the ultrasonic bonding apparatus according to an embodiment of the present invention, Figure 3 is an ultrasonic bonding according to an embodiment of the present invention Section of the device.

1 to 3, the ultrasonic bonding apparatus 1 of the present invention is a device for bonding a circuit chip to a printed circuit board, etc., the jig base 10, the pressing member 20, the elastic member 30 and Ultrasonic horn 40 is included.

The jig base 10 is provided to be movable in the up and down directions, and presses the circuit chip C to the printed circuit board P located in the stage 100 while moving up and down. Specifically, in this embodiment, the force applied to the jig base 10 is transmitted to the pressing member 20 through the elastic member 30 to be described later, the pressing member 20 is a circuit chip on the printed circuit board (P) (C) is pressurized.

Meanwhile, the jig base 10 has an insertion hole 12 to which the elastic member 30 is coupled, and the coupling relationship between the insertion hole 12 and the elastic member 30 will be described later.

The pressing member 20 is formed with a pressing surface 20a for pressing the circuit object C, that is, the circuit chip C in this embodiment. The pressing surface 20a may be formed in various forms to transmit vibrations of the ultrasonic horn 40 to the bonding object and to form a wide contact surface with the bonding object. Although not shown, a suction port for sucking the circuit chip C may be formed on the pressing surface.

On the other hand, the pressing surface 20a should be in surface contact with the bonding object in order to effectively transmit the vibration of the ultrasonic horn 40 to the bonding object. Therefore, the pressing surface 20a in the present invention is aligned again according to the bonding surface of the bonding object by the elastic member 30 which couples the pressing member 20 to the jig base 10 to be movable.

In addition, a sensing unit (not shown) may be provided on the pressing surface 20a to determine whether the pressing surface 20a and the circuit chip C make surface contact. The sensing unit is installed with a variety of sensors to determine whether the pressing surface (20a) is in accurate surface contact with the circuit chip (C).

For example, when a plurality of contact sensors are provided on the pressing surface 20a, downward movement of the jig base 10 may be appropriately adjusted until a contact signal is input through all the contact sensors. Therefore, when the pressing surface 20a and the circuit chip C do not make an accurate contact, the jig base 10 may be moved downward, and when the contact is made correctly, the jig base 10 may be stopped to stop the circuit chip C. Excessive load on) can be prevented.

As a result, the ultrasonic bonding apparatus 1 of the present invention may further include a controller (not shown) that can control the up and down movement of the jig base 10 according to the signal of the sensing unit. In addition, as the sensing unit, various sensing means for determining whether the pressing surface 20a, such as a pressure sensor, may be applied.

9 is a view showing a state in which the pressing portion 21 of the ultrasonic bonding apparatus according to an embodiment of the present invention, referring to Figure 9 the pressing member 20 in the present embodiment the body portion 24 , A pressing part 21 and an elastic member fixing part 22.

Body portion 24 has a first coupling portion (24a) is formed, the pressing portion 21 is formed with a second coupling portion (21a) detachably coupled to the first coupling portion (24a). That is, the pressing portion 21 in the present embodiment is provided with a plurality of different forms depending on the contact surface or the shape of the bonding object of the bonding object is possible to replace the coupling.

On the other hand, a change in vibration energy transmitted to the bonding object may occur according to a change in the shape of the pressing unit, and the change may be provided as preset data according to the shape of the pressing unit 21 and the applied pressing force.

The pressing part 21 is provided with a pressing surface at the bottom, and provides a movement path of the vibration so as to transmit the vibration transmitted through the ultrasonic horn 40 to the bonding object through the pressing surface 20a.

The elastic member fixing portion 22 protrudes along the circumference of the pressing portion 21. And one end of the elastic member 30 is fixed. Specifically, four fixing holes 22a into which the lower ends of the shaft 31 of the elastic member 30 are inserted are formed in the elastic member fixing part 20.

On the other hand, the ultrasonic horn 40 to be described later may be coupled to various positions to transmit the vibration generated by the ultrasonic wave to the pressing member 20, in this embodiment, the ultrasonic wave can be fixed to the upper surface of the pressing member 20 The Hongo government can be formed, in this embodiment, the ultrasonic fixing portion 23 is formed to protrude upward on the upper surface of the pressing member 20 so that the insertion hole 40a of the ultrasonic horn 40 can be fitted.

The elastic member 30 is coupled between the jig base 10 and the pressing member 20 to provide an elastic force between the pressing member 20 and the jig base 10, the pressing surface 20a is in surface contact with the bonding object The pressing member 20 is coupled to the jig base 10 so as to be movable.

Specifically, the elastic member 30 in the present embodiment includes a shaft support 34, a shaft 31, a spring 32, and a bush 33.

The shaft support part 34 is fitted to the insertion hole 10a while being supported by the upper surface of the jig base 10. That is, the upper part of the shaft support part 34 is formed to have a cross-sectional area larger than the cross-sectional area of the insertion hole 10a and is supported on the upper surface of the jig base 10, and the lower part is inserted into and fixed to the insertion hole 10a. And the shaft support portion 34 is formed with a hole that is fitted so that the upper portion of the shaft can be moved finely in the up, down direction.

The shaft 31 has an upper end coupled to the shaft support 34 to allow fine movement. Specifically, in the present embodiment, the upper portion of the shaft 31 is inserted into the hole formed in the shaft support portion 34 is inserted.

Meanwhile, the size of the circumference of the shaft 31 and the size of the hole of the shaft support part 34 remain fixed when the shaft 31 is fitted into the hole of the shaft support part 34 and no external force is applied. When an external force of magnitude or more is applied, the shaft 31 is formed to have a size capable of moving finely upward through the hole of the shaft support part 34.

That is, as the specific shaft 31 of the plurality of shafts 31 finely moves upward according to the imbalance of the force input through the pressing surface 20a, the pressing member 20 moves finely on the horizontal plane. Accordingly, the pressing surface 20a is arranged to form an angle with the horizontal surface.

When the pressing surface 20a and the circuit chip C come into surface contact with the movement of the pressing surface 20a, the external force applied through the pressing surface 20a is uniformly applied to the pressing surface 20a, and the shaft ( 31) no longer moves.

And as the pressing surface 20a is separated from the circuit chip C, the external force through the pressing surface 20a is removed, and the shaft 31 moved upward is returned to its original position by the elastic force of the spring 32. You will come back.

The other end of the shaft 31 is fixed to the fixing hole 22a of the pressing member 20. As a result, the pressing member 20 and the ultrasonic horn 40 are coupled to the jig base 10 by the shaft 31.

The spring 32 has an inner diameter larger than that of the shaft 31 to be fitted to the shaft 31, and the bush 32 is fitted to the upper portion of the spring 32 to fix the spring 32 to the shaft 31. do.

And the spring 32 is to provide an elastic force between the jig base 10 and the pressing member 20. Therefore, pressure is applied through the pressing surface 20a to make a surface contact with the bonding object while the pressing surface 20a is changed, and then the pressing surface 20a is restored to its original position by the elastic force of the spring 32. do.

The ultrasonic horn 40 vibrates at a specific frequency by the supplied energy. Then, the vibration energy is transmitted to the pressing member 20, and the transmitted vibration energy is transferred to the anisotropic conductive film positioned between the circuit chip C and the printed circuit board P through the pressurizing surface. Thermal fusion is induced.

Specifically, the ultrasonic horn 40 in the present embodiment is formed with a insertion hole 40a through which the ultrasonic horn fixing part 23 of the pressing member 20 is fitted. In the present invention, the ultrasonic horn 40 is fixed to the pressure member 20 while the fixing member 50 having the insertion portion 50a in which the ultrasonic horn fixing portion 40 is fitted is coupled to the upper portion of the ultrasonic horn 40. Let's go.

4 to 6 are views illustrating a process of bonding a circuit chip to a printed circuit board using an ultrasonic bonding apparatus according to an embodiment of the present invention.

4 and 6, a process in which the pressing surface 20a makes surface contact with the bonding object by using the ultrasonic bonding apparatus according to the present invention will be described.

Referring to FIG. 4, when the circuit chip C is located at the mounting point of the printed circuit board P, the mounting process of the circuit chip C, the horizontal maintenance when the stage 100 is arranged, and the printed circuit board P ) And the bonding surface of the circuit chip C contacting the pressing surface 20a is not arranged in parallel depending on the nonuniform coating or thickness of the anisotropic conductive film between the circuit chip and the circuit chip C. In this case, the bonding surface of the circuit chip C forms a horizontal line and a first angle α.

As the jig base 10 moves downward, the contact surface between the pressing surface 20a and the circuit chip C is primarily in point contact. In this case, if the pressing surface 20a is disposed horizontally, the bonding surface of the pressing surface 20a and the circuit chip C also forms a first angle α.

In this case, a touch signal is applied to some of the touch sensors of the above-described sensing unit (not shown), and the control unit (not shown) may apply the touch signal to the corresponding touch sensor so as to check the surface contact. Until the jig base 10 is moved further down. (See Figure 5).

Figure 7 is a cross-sectional view showing a state in which the ultrasonic bonding apparatus according to an embodiment of the present invention is arranged to form a predetermined angle with the vertical axis in the up and down direction, Figure 8 is an ultrasonic bonding apparatus according to an embodiment of the present invention Figure is a view showing a state in which the elastic member is moved to form a predetermined angle with respect to the vertical axis.

Referring to FIGS. 7 and 8, an external force is applied at a point where the pressing surface 20a primarily contacts the bonding surface of the circuit chip C as the jig base 10 moves downward. And as the external force is applied to the portion away from the center of the pressing surface (20a) receives a force from the lower portion to the upper portion of the elastic member 20 located in the portion to which the external force is applied.

Therefore, the shaft 31, which is fitted to the shaft fixing part 34 so as to be finely moved, is finely moved upward, and thus the pressing member 20 is inclined on the horizontal plane.

According to the nonuniform point contact between the pressing surface 20a and the circuit chip c described above, a nonuniform load is applied to a specific point of the pressing surface 20a, and the As the external force is applied, the specific shaft 31 moves upward.

As a result, the heights of the upper ends of the plurality of shafts 31 are different from each other. Accordingly, the pressing member 20 fixed to the lower ends of the shafts 31 is arranged to form a predetermined angle with the horizontal plane.

Therefore, when the pressing surface 20a comes into surface contact with the bonding surface of the circuit chip C, and the ultrasonic horn 40 vibrates after the surface contact, the vibration energy is transmitted through the pressing surface 20a. It is uniformly transmitted to the bonding surface of, so that the entire printed circuit board P and the circuit chip C are bonded more precisely.

On the other hand, when the pressing surface 20a is separated from the circuit chip C after the bonding, the spring 32 is restored by the elastic force that has been deformed, and the shaft 31 that has moved upward has its original position by the elastic force. Will be restored.

10 is a perspective view of the ultrasonic bonding apparatus according to another embodiment of the present invention, Figure 11 is a cross-sectional view of the ultrasonic bonding apparatus according to another embodiment of the present invention. 10 and 11, another embodiment of the present invention will be described, and portions overlapping with the above-described embodiment will be omitted.

Specifically, the ultrasonic horn 40 in the present embodiment is located on the stage 100 spaced apart from the lower portion of the jig base 10. In addition, the surface 100 to which the stage 100 and the ultrasonic horn are bonded is provided with an anti-vibration film 100a that prevents vibration generated from the ultrasonic horn from being transmitted to the stage 100. Therefore, the vibration energy according to the vibration of the ultrasonic horn is absorbed by the anti-vibration film 100a and prevents the stage 100 from shaking according to the vibration generated from the ultrasonic horn 40.

On the other hand, the substrate (P) and the chip (C) is located on the upper portion of the ultrasonic horn 40, coupled to the ultrasonic horn 40 to transfer the vibration energy by the vibration of the ultrasonic horn 40 to the substrate and the chip. . The upper surface of the fixing jig 60 to which the substrate P and the chip C are fixed may be formed in various forms in which the substrate or the chip can be stably fixed.

In the present embodiment, unlike the above embodiment, the fixing jig 60 to which the circuit chip C and the printed circuit board P are fixed is bonded instead of the upper pressing member 20 moving to align the bonding surface. It will move to align the face. Therefore, the joining surface of the pressing member 20 is moved so that the joining surface of the circuit chip C coincides with the horizontal line in a state where the pressurizing member 20 is horizontal, and thus the joining surface of the circuit chip C and the pressing member 20 Pressurized surface of the surface contact.

Specifically, the fixing jig 60 in the present embodiment includes a support part 62 having a seating surface on which the chip or substrate is seated and an elastic member fixing part 61 protruding along the circumference of the support part 62. do. And the elastic member 70 to be described later is coupled between the fixing portion and the stage. In addition, the elastic member fixing portion 61 is formed with an insertion hole in which the shaft 71 of the elastic member 70 to be described later is fitted to allow fine movement in the up and down directions.

And the elastic member 70 in the present embodiment is fitted to the shaft 71 and the shaft 71 is one end is fixed to the stage 100 and the other end is fitted into the insertion hole of the elastic member fixing portion 61 It further includes a spring for providing an elastic force between the stage 100 and the elastic member fixing portion 61.

12 to 14 are views illustrating a process of bonding a circuit chip to a printed circuit board using the ultrasonic bonding apparatus of another embodiment of the present invention. 11 to 13, the process of allowing the surface of the bonding object of the present invention and the pressing surface of the pressing member 20 to make surface contact may include the elastic member 70 having the elasticity of the stage 100 and the fixing jig 60. Except for the portion which is coupled between the member fixing portions 61 to move the bonding surface of the circuit chip C to coincide with the horizontal plane, the overall configuration and operation are the same as those of the above-described embodiment, and thus the description thereof will be omitted. .

15 is a view showing a state in which the fixing jig of the ultrasonic bonding apparatus according to another embodiment of the present invention is moved to form a predetermined angle with respect to the vertical axis, the vertical movement of the shaft 31 is also the elastic member 20 Except for being located between the stage 100 and the elastic member fixing portion 61, the overall configuration is the same as the above embodiment.

16 is a view showing a state in which the pressing portion of the present embodiment is separated from the pressing member, and as in the above embodiment, the pressing portion 20 is connected to the first coupling portion 20a and the support plate 10 to the second coupling portion 10a. ) Is formed so that the pressing unit 20 may be replaced in various forms according to the contact surface and the shape of the object to be bonded.

It will be apparent to those skilled in the art that the present invention can be embodied in other specific forms without departing from the spirit or scope of the invention as defined in the appended claims. It is obvious to them. Therefore, the above-described embodiments should be regarded as illustrative rather than restrictive, and thus, the present invention is not limited to the above description and may be modified within the scope of the appended claims and their equivalents.

10: jig base 20: pressing member
30: elastic member 31: shaft
32: spring 34: shaft support
40: ultrasonic horn 60: fixed jig

Claims (10)

Jig base moving in the up and down direction;
A body portion having a first coupling portion and a second coupling portion detachably coupled to the first coupling portion are formed to be detachably coupled to the body portion, and a pressing surface formed at a lower portion of the pressing surface for pressing the bonding object. Pressing member;
An elastic force coupled between the jig base and the pressing member to provide an elastic force between the pressing member and the jig base, and to couple the pressing member to the jig base such that the pressing surface is in surface contact with a bonding object. absence; And
An ultrasonic horn which vibrates according to the applied frequency and is coupled to the pressing member so that the vibration is transmitted to the bonding object through the pressing surface of the pressing member;
Ultrasonic bonding apparatus comprising a. The method of claim 1,
The pressing member includes an elastic member fixing part protruding along the circumference of the pressing portion,
The elastic member is an ultrasonic bonding device coupled between the fixing portion and the jig base. The method of claim 2,
An insertion hole is formed in the jig base, and a fixing hole is formed in the fixing part.
The elastic member is supported on the upper surface of the jig base, the shaft support portion to be inserted into the insertion hole, one end is fitted to be movable to the shaft support portion, the other end is fitted to the shaft and the shaft fixed to the fixing hole Ultrasonic bonding apparatus further comprises a spring to give an elastic force between the jig base and the fixing portion. The method of claim 1,
On the upper surface of the pressing member is formed an ultrasonic horn fixing portion into which the ultrasonic horn is inserted,
The ultrasonic horn is formed with an insertion hole into which the ultrasonic horn fixing part is fitted.
And an inserting portion into which the ultrasonic horn fixing portion is fitted, the fixing member being coupled to an upper portion of the ultrasonic horn to fix the ultrasonic horn to the upper surface of the pressing member. The method of claim 1,
The ultrasonic bonding apparatus further includes a sensing unit provided on the pressing surface to determine whether the steel pressing surface and the contact object is in contact with the surface, and a controller for controlling the up and down movement of the jig base according to the sensing result of the sensing unit. Jig base moving in the up and down direction;
A body portion having a first coupling portion and a second coupling portion detachably coupled to the first coupling portion are formed to be detachably coupled to the body portion, and a pressing surface formed at a lower portion of the pressing surface for pressing the bonding object. Pressing member;
An ultrasonic horn positioned at a stage spaced below the jig base and vibrating according to an applied frequency; And
A fixing jig having a substrate and a chip disposed thereon and coupled to the ultrasonic horn to transmit vibration energy of the ultrasonic horn to the substrate and the chip;
Ultrasonic bonding apparatus comprising a. The method according to claim 6,
Ultrasonic bonding device provided between the stage and the ultrasonic horn with a vibration blocking unit for blocking the vibration generated in the ultrasonic horn to be transmitted to the stage. The method according to claim 6,
An elastic force coupled between the jig base and the pressing member to provide an elastic force between the pressing member and the jig base, and to couple the pressing member to the jig base such that the pressing surface is in surface contact with a bonding object. Ultrasonic bonding apparatus further comprising a member. 9. The method of claim 8,
The pressing member includes a pressing portion formed with a pressing surface, the elastic member fixing portion protruding along the circumference of the pressing portion,
The elastic member is an ultrasonic bonding device coupled between the fixing portion and the jig base. 10. The method of claim 9,
An insertion hole is formed in the jig base, and a fixing hole is formed in the fixing part.
The elastic member is supported on the upper surface of the jig base, the shaft support portion to be inserted into the insertion hole, one end is fitted to be movable to the shaft support portion, the other end is fitted to the shaft and the shaft fixed to the fixing hole Ultrasonic bonding apparatus further comprises a spring to give an elastic force between the jig base and the fixing portion.

Images