JP3078804B1 - Metal ball arrangement method and arrangement device - Google Patents

Abstract

Kind Code: A1 Abstract: A method and an apparatus for arranging metal balls collectively on a metal ball to be arrayed, even if the number of metal balls to be transferred is increased and the diameter is reduced, the metal balls are reliably separated from the metal ball suction holes. And a method and apparatus for arranging metal spheres. SOLUTION: A metal ball suction hole 6 is arranged on an array plate 5 of a metal ball array jig 1, a metal ball 4 is sucked into the metal ball suction hole 6, and
Next, in the metal ball arrangement method in which the attracted metal spheres 4 are transferred to the arrangement target 2 and the metal spheres 4 are collectively mounted on the arrangement target 2, the arrangement plate 5 is formed of metal foil, and the metal spheres are adsorbed from the surface of the arrangement plate 5. The thickness of the metal foil and the diameter of the metal ball suction hole 6 are determined so that the top of the metal ball 4 protrudes toward the back side of the arrangement plate 5 when the metal ball 4 is sucked into the hole 6. 2. A method and an apparatus for arranging metal spheres, wherein the metal spheres 4 are separated from the metal sphere suction holes 6 by pressing the pressing tool 7 against the metal spheres 4 from the back side of the arrangement plate 5 when transferring to the metal spheres 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for arranging metal spheres on a metal ball arrangement object, and more particularly to an electrode on a semiconductor chip, an electrode on a semiconductor mounting substrate or a semiconductor element electrode as a ball bump. The present invention relates to a method and an apparatus for arranging fine metal spheres.

[0002]

2. Description of the Related Art As means for collectively arranging and fixing metal spheres to an object, a metal sphere arrangement jig having an arrangement plate in which metal sphere adsorption holes are arranged is prepared. There is known a technique in which metal spheres are arranged corresponding to positions at which metal spheres are arranged, and the metal spheres are sucked into metal sphere suction holes and the metal spheres are collectively transferred to an object. In particular, as a bump serving as a bonding medium between electrodes of a semiconductor chip and an external circuit, or a bump of a ball grid array (BGA), a technique of transferring a fine metal sphere to a semiconductor substrate, a semiconductor chip, or the like to form a bump is important. It has become to. A metal ball array jig having a metal ball suction hole at a position corresponding to an electrode of a semiconductor chip or the like is prepared, and a fine metal ball on which a bump is to be formed is previously sucked into the suction hole, and the metal ball array jig is transferred. The metal ball is transferred to the transfer table, and an array target such as a semiconductor chip is placed on the transfer table in advance as a target to which the metal ball is to be transferred, and the metal ball is transferred to an electrode formed on the surface of the semiconductor chip or the like. It is.

With the recent increase in the degree of integration of semiconductor elements, the number of electrodes per semiconductor has been increasing. Number of electrodes 100 to 30
The number is generally zero, and more recently, a semiconductor device having 500 to 1000 electrodes has also appeared. The diameter of metal spheres has also been reduced, and recently 800 μm in diameter.
The following metal spheres are the mainstream, with a diameter of 300 μm
The following metal spheres are also used: In the above-described technique of transferring metal spheres as bumps, the same number of metal spheres as one semiconductor electrode are transferred at once.

As a metal ball, a gold ball or a solder ball is used. When a gold ball is used, the gold ball is bonded to the electrode on the arrangement target surface by thermocompression bonding. When a solder ball is used as a metal ball, a flux is usually applied to the transfer position of the array target or the solder ball before transferring the metal ball to the array target. The solder balls are transferred to the arrangement target from the metal ball suction holes of the arrangement plate by the adhesive force of the flux, and then heated to melt the solder balls.
Reflow occurs and solder bumps are formed.

[0005] The metal spheres adsorbed in the metal sphere suction holes are stuck in the suction holes or the suction force acts between the arrangement plate and the metal spheres, so that the metal spheres are released even if the suction of the metal sphere suction holes is released. In some cases, the player cannot stay away from the array board. When a solder ball is used as a metal ball, the solder ball is transferred to an arrangement target by the adhesive force of the flux, so that the adsorbing force between the metal ball and the array plate due to biting or adsorbing force is smaller than the adhesive force of the flux. If the metal spheres become large, the metal spheres will remain on the array plate without being transferred to the array target.

In particular, when a metal arrangement plate is used, the metal balls are likely to bite into and adhere to the metal ball adsorption holes, so that there is a high probability that the metal balls will remain on the arrangement plate during transfer. Was often used.

[0007] Inside the metal ball array jig, behind the array plate,
A pin pressing tool having the same number of pins as the number of metal ball suction holes is provided, and the metal ball is pressed into the metal ball suction hole by pressing the pins of the pin pressing tool into the metal ball suction hole when the metal balls are transferred to the arrangement target. The technique of separating from the ball suction hole is used. Thus, the metal sphere is pushed out of the metal sphere suction hole by the pin of the pin pressing tool, and the metal sphere can be transferred to the arrangement target without the metal sphere remaining on the arrangement plate.
Thereby, a metal thing can also be used as an arrangement plate.

[0008]

As described above, the number of metal spheres mounted on one semiconductor element has increased and the diameter of the metal spheres has been reduced with the increase in the degree of integration of semiconductors.
Inevitably, the number of pins of the pin pusher increases, and the diameter of the pins must be reduced. The increase in the number of pins has led to an increase in the price of the pin pusher. In addition, the reduction in the diameter of the pin reduces the rigidity of the pin, and a case may occur in which the pressing force for separating the metal ball from the metal ball suction hole cannot be sufficiently secured.

The present invention provides a method and apparatus for arranging metal spheres adsorbed on metal ball suction holes on an arrangement plate of a metal sphere arrangement jig onto an arrangement object and mounting the metal spheres on the arrangement object collectively. It is an object of the present invention to provide a method and an apparatus for arranging metal spheres, which can surely separate metal spheres from metal sphere suction holes even if the number of metal spheres to be transferred increases and the diameter of the metal spheres decreases, and a method for manufacturing the same.

[0010]

That is, the gist of the present invention is as follows. (1) A metal ball suction hole 6 is arranged on an array plate 5 of a metal ball array jig 1, a metal ball 4 is sucked into the metal ball suction hole 6, and then the sucked metal ball 4 is transferred to an array target 2. In the metal ball arrangement method of mounting the metal balls 4 collectively on the arrangement target 2, the arrangement plate 5 is formed of metal foil, and when the metal balls 4 are attracted from the surface of the arrangement plate 5 to the metal ball adsorption holes 6, the metal balls are arranged. The thickness of the metal foil and the diameter of the metal ball suction hole 6 are determined so that the tops of the metal balls 4 protrude toward the rear side of the array plate 5, and the metal balls 4 adsorbed are aligned with the array object 2.
A metal ball 4 is separated from a metal ball suction hole 6 by pressing a pressing tool 7 against the metal ball 4 from the rear surface side of the array plate 5 when transferring to the metal ball. (2) The thickness of the arrangement plate 5 is set to 1/7 to 1/4 of the diameter of the metal sphere, and the diameter of the metal sphere suction hole 6 is set to 0.8 to the diameter of the metal sphere.
The metal ball arrangement method according to the above (1), wherein the method is 0.9 times. (3) The method for arranging metal spheres according to the above (1) or (2), wherein the arrangement plate 5 having the metal sphere suction holes 6 is formed by electroforming. (4) The method for arranging metal spheres according to (1) or (2), wherein the metal sphere suction holes 6 of the array plate 5 are pierced by a laser processing method. (5) a metal ball arrangement jig 1 having an arrangement plate 5 in which metal ball adsorption holes 6 are arranged and adsorbing metal balls 4 to the metal ball adsorption holes 6;
A pusher 7 that presses the metal spheres 4 adsorbed in the metal sphere suction holes 6 inside the metal sphere array jig 1 and a metal sphere 4 sucked into the metal sphere suction holes 6 of the metal sphere alignment jig 1 A transfer table 3 on which the metal ball arraying object 2 is placed in order to transfer the metal ball arraying object 2 to the metal ball arraying object 2. The arraying plate 5 is formed of metal foil. The thickness of the metal foil and the diameter of the metal ball suction hole 6 are determined so that the top of the metal ball 4 protrudes toward the back side of the arrangement plate 5 when the ball 4 is sucked. When the ball 4 is attracted and the attracted metal ball 4 is transferred to the arrangement target 2, the metal ball 4 is separated from the metal ball attracting hole 6 by pressing the pressing tool 7 against the metal ball 4 from the back side of the array plate 5. A metal sphere arrangement device, wherein the metal spheres 4 are collectively mounted on the arrangement target 2. (6) The thickness of the array plate 5 is set to 1/7 to 1/4 of the diameter of the metal sphere, and the diameter of the metal ball suction hole 6 is set to 0.8 to the diameter of the metal sphere.
(5) The metal ball arrangement device according to the above (5), wherein the magnification is 0.9 times. (7) The metal ball arrangement device according to (5) or (6), wherein the arrangement plate 5 having the metal ball suction holes 6 is formed by electroforming. (8) The metal ball arrangement device according to (5) or (6), wherein the metal ball suction holes 6 of the arrangement plate 5 are perforated by a laser processing method. (9) The method for manufacturing an array plate used in the metal ball array device according to (5) or (6), wherein the array plate 5 having the metal ball suction holes 6 is formed by electroforming. (10) The metal ball suction holes 6 of the array plate 5 are drilled by a laser processing method (5) or (6).
3. A method for producing an array plate used in the metal ball array device according to 1.).

The arrangement plate of the conventional metal ball arrangement jig is formed by using a metal plate or a resin plate having a predetermined thickness, and forming a metal ball suction hole using a drill or the like on the arrangement plate. . In the present invention, the arrangement plate 5 is formed of a metal foil. Thereby, the thickness of the arrangement plate 5 can be reduced, and the top of the metal ball 4 projects to the rear surface of the arrangement plate when the metal ball 4 is sucked into the metal ball suction hole 6 from the surface of the arrangement plate 5. It is possible to determine the thickness of the metal foil and the diameter of the metal ball suction hole. Since the top of the metal ball 4 protrudes to the rear side of the arrangement plate at the time of suction, there is no need to use a pin pusher having pins equal to the number of metal balls as in the related art when separating the metal ball 4 from the metal ball suction hole 6. If a pressing tool 7 having a simple flat pressing portion is prepared and arranged inside the metal ball array jig 1 and the pressing tool 7 is pressed against the rear surface of the array plate 5, all of the metal balls 4 adsorbed can be obtained. Can be collectively separated from the metal ball adsorption hole 6.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a method for transferring fine metal spheres to a semiconductor substrate, a semiconductor chip, or the like as a bump serving as a bonding medium between an electrode of a semiconductor chip and an external circuit or a bump of a ball grid array (BGA). The present invention is particularly useful as a method and an apparatus for forming bumps by using the method. In this case, the arrangement target 2 is a semiconductor substrate or a semiconductor chip for transferring a fine metal sphere, and the metal sphere 4 is a gold ball or a solder ball as a bump. As metal spheres to which the present invention is applied, fine metal spheres having a diameter of 40 μm to 800 μm are particularly effective.

An embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 1, the metal ball arrangement jig 1
One end thereof has an array plate 5, and a pusher 7 is arranged inside. The arrangement plate 5 is a flat plate having a metal sphere suction hole 6 penetrating through the surface thereof.
Is vacuum-evacuated to make the metal ball suction hole 6 a negative pressure, and the metal ball 4 can be sucked. The pressing tool 7 has a flat pressing portion facing the rear surface of the array plate 5, and can perform an operation of pressing or pulling the flat pressing portion against the rear surface of the array plate. The operation of the pusher 7 can be performed by pneumatic drive, motor drive, hydraulic drive, or the like.

As shown in FIG. 1 (a), the arrangement plate 5 of the metal ball arrangement jig 1 is brought close to the metal ball group, and vacuum suction is performed from the back of the metal ball suction hole 6 to obtain the arrangement shown in FIGS. As shown in (b), the metal spheres 4 are sucked into the metal sphere suction holes 6. At this time, FIG.
As shown in (a) and (b), the pressing tool 7 in the metal ball array jig is located away from the array plate 5.

The metal ball suction holes 6 are arranged corresponding to the positions of the electrodes of the semiconductor chip or the like of the arrangement target 2 to which the metal balls 4 are to be transferred. The arrangement target 2 is placed on the transfer table 3, and FIG.
As shown in (c) to (e), the metal sphere arrangement jig 1 in which the metal spheres 4 are previously adsorbed to all the metal sphere adsorption holes 6 is brought into close contact with the arrangement target 2 on the transfer table 3, and the metal spheres 4 are arranged. Transfer to Subject 2.

When the metal ball 4 is a gold ball, the arrangement target 2 on the transfer table is heated in advance, and the electrode on the arrangement target 2 and the gold ball are pressed by thermocompression. When the metal ball 4 is a solder ball, the flux is printed and applied to the electrode position of the arrangement target 2 on the transfer table, or the flux is applied to the tip of the solder ball attracted to the metal ball arrangement jig. In this state, the solder ball is brought into contact with the arrangement target 2, and the solder ball is adhered to the arrangement target by the adhesive force of the flux to perform transfer.

As shown in FIGS. 1C and 2C, when the metal spheres 4 adsorbed in the metal sphere suction holes 6 come into close contact with the arrangement target 2, the vacuum suction of the metal sphere arrangement jig 1 is released. At the same time, the pressing tool 7 in the metal ball arrangement jig is moved and brought into close contact with the top of the metal ball 4.

When the metal ball 4 is a gold ball, the entire metal ball array jig 1 is pressed (down) while the pressing tool 7 is pressed against the top of the gold ball, so that the gold ball is pressed against the array object (FIG. 1). 2 (d ₁ )). Gold ball bonding simultaneously, or further a pushing member 7 pushes down the push member 7 after crimping tightly attached to the back face of the array plate (FIG. 1 (d), the FIG. ₂ (d 2)).

When the metal ball 4 is a solder ball, the pressing tool 7 is lowered until it comes into contact with the top of the solder ball (FIG. 2).
(D ₁ )). Next, while the pressing tool 7 is relatively lowered with respect to the metal ball array jig 1, the entire metal ball array jig 1 is raised at the same speed as the lowering speed. With reference to the arrangement target 2, the pusher 7 is fixed and the arrangement plate 5 rises, so that the solder ball is held between the pusher 7 and the arrangement target 2 and closely adhered to the solder ball through the metal ball suction hole. The ball is pulled apart (FIG. 1 (d), FIG. 2 (d ₂ )).

In the state where the metal balls 4 are attracted, the tops of the metal balls protrude from the rear surface of the arrangement plate. It is pushed and separated from the metal ball suction hole 6. Metal ball array jig 1 with pressing tool 7 pressed against the back of the array plate
1 (e) and FIG. 2
As shown in (e), the state where the metal sphere 4 is pressed against the arrangement target 2 is maintained. Therefore, even if the metal sphere 4 is biting into the metal sphere suction hole 6, the metal sphere 4 becomes Transfer to the arrangement target 2 is ensured, and the metal balls 4 do not remain on the arrangement plate 5.

The array plate 5 is preferably formed of a stainless steel foil among metal foils. This is because the stainless steel foil has sufficient rigidity to attract and transfer the metal sphere, is easy to process, and has excellent corrosion resistance.

As the material of the surface of the pressing tool 7 which comes into contact with the metal sphere, if the metal sphere is a gold ball, the temperature will be high because the thermocompression bonding method is used when the metal sphere is joined to the arrangement object 2. It is desirable to be composed of metal. When the metal ball is a solder ball, it is desirable that the metal ball is made of resin having good releasability in order to prevent adhesion between the solder ball and the pressing tool. As the resin, PEEK having conductivity or nylon or the like can be used.

In the present invention, the arrangement plate 5 (metal foil) is arranged such that when the metal spheres 4 are sucked from the surface of the arrangement plate 5 into the metal sphere suction holes 6, the tops of the metal spheres 4 protrude toward the back side of the arrangement plate. It is an essential condition to determine the thickness of the metal ball and the diameter of the metal ball suction hole 6. In order to satisfy such conditions, it is necessary that the thickness of the array plate and the diameter of the metal sphere suction holes satisfy the following relationship. t <[D− (D ² −d ² ) ^1/2 ] / 2 where D is the diameter of the metal sphere, d is the diameter of the metal sphere adsorption hole, and t is the thickness of the array plate.

In the case of a metal ball, particularly a soft metal ball such as a solder ball, the metal ball 4 is deformed when it is attracted to the metal ball attracting hole 6, so that it is thicker than the arrangement plate thickness t shown in the above equation. In some cases, an array plate can be used. By actually performing an experiment using the metal spheres 4, the optimum metal sphere suction hole diameter and the arrangement plate thickness can be determined.

Further, the thickness of the array plate 5 is set to 1 / the diameter of the metal ball.
It is preferable that the diameter is 7 to 1/4, and the diameter of the metal ball adsorption hole 6 is 0.8 to 0.9 times the diameter of the metal ball.

If the thickness of the arrangement plate 5 is 1/7 or more of the diameter of the metal sphere, the rigidity of the arrangement plate can be ensured, and the metal sphere is transferred to the arrangement target at the time of vacuum suction for attracting the metal sphere. The deflection of the array plate at the time can be suppressed within a necessary range. If the thickness of the arrangement plate 5 is not more than 1/4 of the diameter of the metal sphere, the degree of freedom in selecting the diameter when determining the diameter of the metal sphere suction hole so that the top of the metal sphere protrudes toward the rear surface of the arrangement plate is ensured. Is preferred.

The diameter of the metal ball adsorption hole 6 is equal to the diameter of the metal ball.
When the thickness is eight times or more, the degree of freedom in selecting the thickness when determining the thickness of the arrangement plate such that the top of the metal ball 4 protrudes toward the rear surface of the arrangement plate is preferable, which is preferable. When the diameter of the metal ball attracting hole 6 becomes close to the diameter of the metal ball 4, the metal ball 4 is pressed when the metal ball 4 is pressed against the array plate 5 when the metal ball is attracted or transferred to the arrangement target 2. It becomes easy to bite into the suction hole 6. When the diameter of the metal ball adsorption hole 6 is 0.9 times or less of the metal ball diameter, the biting can be suppressed, which is preferable.

Arrangement plate 5 having metal ball suction holes 6 of the present invention
Can be employed as a method for manufacturing a metal foil as a flat plate by drilling a metal ball suction hole 6 by means such as drilling. Furthermore, utilizing the characteristic that the object to be pierced is a metal foil, the metal foil can be pierced using a laser processing method. According to the laser processing method, it is possible to perform highly accurate drilling even when the diameter of the metal ball suction hole 6 is reduced.

Instead of forming a hole in a metal foil as a flat plate, a pattern of metal ball adsorption holes is formed on a glass mask or the like using an electroforming method, and the metal is adsorbed by depositing the metal on the mask. It is also possible to produce metal foils with holes directly. One array plate with many metal ball adsorption holes
The array plate can be manufactured at a low cost because the array plate can be formed in a single deposit. In addition, since the pattern of the metal ball suction holes can be formed on the glass mask with high positional accuracy, the positional accuracy of the metal ball suction holes on the array plate is remarkably higher than the conventional method of forming metal ball suction holes using a drill. To improve. When the array plate is manufactured by the electroforming method, the material of the array plate is preferably nickel metal or a nickel-cobalt alloy.

When the metal spheres 4 are sucked into the metal sphere suction holes 6 of the metal sphere arrangement jig 1, the metal spheres to be prepared are as shown in FIG.
Can be placed in the tray 9 as shown in FIG. Further, a temporary arrangement plate 12 having a holding hole 13 for the metal ball 4 as shown in FIG. 3 is prepared, and as shown in FIGS. The metal balls 4 are held in the holding holes 13 of the metal ball arrangement jig 1 as shown in FIG.
, The metal balls 4 are received from the holding holes 13 of the temporary arrangement plate 12 and are attracted. By using the temporary arrangement plate 12,
It is possible to prevent a problem that the extra metal balls 4 are attracted to the array plate 5 or a problem that the metal ball attracting holes 6 that do not attract the metal balls 4 are generated.

[0031]

EXAMPLE The present invention was applied to a case where solder balls having a diameter of 760 μm and a diameter of 250 μm were transferred onto a semiconductor substrate. The number of solder balls transferred at one time was 336 for any diameter. Invention Example No. 1 and Comparative Example No. 1 3 is an array of solder balls having a diameter of 760 μm,
Invention Example No. 2 and Comparative Example No. 4 is 250 μm in diameter
Were arranged.

The contents of the present invention will be described with reference to FIGS. Invention Example No. 1, the arrangement plate 5 has a thickness of 1
The diameter of the metal ball adsorption hole 6 was 680 μm using a 50 μm stainless steel foil. Invention Example No. In 2,
A 50 μm thick stainless steel foil was used for the array plate 5, and the diameter of the metal ball suction holes 6 was 225 μm. Metal ball suction hole 6
The laser processing method was adopted as the method for manufacturing the.

The pressing member 7 is made of PEEK having conductivity,
As shown in FIG. 1, it is arranged inside the metal ball arrangement jig 1 as a shape having a flat pressing portion that is in close contact with the back surface of the arrangement plate 5,
The arrangement plate 5 can be brought into close contact with or pulled away from the back surface by pneumatic driving.

As a comparative example, an example in which an array plate made of conductive PEEK was used and a pin pusher was used to separate a metal ball from a metal ball suction hole was implemented. Comparative Example No. Comparative Example No. 3 has a diameter of 760 μm. 4 used a 250 μm solder ball. The diameter of each metal ball adsorption hole is 500μ
A stainless steel pin having a diameter of 450 μm and 140 μm, a length of 4 mm, and a length of 4 mm and a length of 3 mm were arranged as 336 pins.

Inventive Example No. As for Nos. 1 and 2, the solder balls did not remain on the array plate 5 at all, and a good array could be obtained. In addition, assembling of the metal ball arrangement jig was easy, and efficient arrangement could be performed.

As for the comparative example, the comparative example No. In Comparative Example No. 3, no bending of the pin occurred. 250 of 4
In the m-diameter ball arrangement, the pin of the pin pressing tool was bent when the arrangement was repeated 20 times, and further continuous processing was impossible. Also, in Comparative Example No. In all cases, it took several hours to assemble the pin pusher onto the metal ball array jig, which hindered efficient production. The manufacturing cost of the pin pusher is the same as that of the present invention. It was expensive compared to the manufacturing cost of the pusher of 1 and 2.

[0037]

According to the present invention, a method and an apparatus for arranging metal spheres in which metal spheres adsorbed on metal sphere suction holes on an arrangement plate of a metal sphere arrangement jig are transferred to an arrangement object and the metal spheres are collectively mounted on the arrangement object. In this case, the metal sphere can be reliably separated from the metal sphere suction hole, and the transfer failure trouble of the metal sphere can be eliminated. Further, the arrangement plate can be made of metal, so that the cost of processing parts of the metal ball arrangement device can be reduced, and the construction period can be shortened.

[Brief description of the drawings]

FIG. 1 is a schematic view showing a metal ball arrangement method of the present invention;
(A) is a situation in which the metal ball array jig is brought closer to the metal ball,
(B) is a situation in which metal spheres are adsorbed to metal sphere adsorption holes, (c)
Shows a situation in which the adsorbed metal sphere is brought into close contact with the arrangement target, (d) shows a situation in which the pressing tool of the metal sphere arrangement jig is pressed down, and (e) shows a situation in which the metal sphere is transferred to the arrangement subject.

FIGS. 2A to 2C are diagrams illustrating a method of arranging metal spheres by enlarging the vicinity of metal sphere adsorption holes according to the present invention. FIGS.
(D ₁ ) shows the situation where the metal sphere is brought into close contact with the object to be arranged and the pressing tool is brought into close contact with the top of the metal sphere,
(D ₂ ) shows a situation where the pressing tool is further brought into close contact with the array plate.

FIG. 3 is a schematic view showing a method of adsorbing metal spheres using a temporary arrangement plate in the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Metal ball arrangement jig 2 Arrangement object 3 Transfer stand 4 Metal ball 5 Arrangement plate 6 Metal ball adsorption hole 7 Pusher 8 Chamfer part 9 Tray 12 Temporary arrangement plate 13 Holding hole 14 Metal ball supply device 15 Through hole

Claims (10)

(57) [Claims] 1. A metal ball suction hole is arranged on an array plate of a metal ball array jig, a metal ball is sucked into the metal ball suction hole, and then the attracted metal ball is transferred to an object to be arrayed to transfer the metal ball. In the method of arranging metal balls to be collectively mounted on an arrangement object, the arrangement plate is formed of metal foil, and when the metal spheres are sucked into the metal sphere suction holes from the surface of the arrangement plate, the tops of the metal spheres are on the rear side of the arrangement plate. Determine the thickness of the metal foil and the diameter of the metal sphere suction hole so as to protrude, and press the pressing tool against the metal sphere from the back side of the array plate when transferring the sucked metal sphere to the arrangement target, so that the metal sphere is pressed. A method for arranging metal spheres, comprising separating the metal spheres from the suction holes. 2. The thickness of the array plate is 1/7 to 1 of the diameter of the metal ball.
The method according to claim 1, wherein the diameter of the metal sphere suction hole is 0.8 to 0.9 times the diameter of the metal sphere. 3. The metal ball arrangement method according to claim 1, wherein the arrangement plate having the metal ball suction holes is formed by electroforming. 4. The metal ball suction hole of the array plate is formed by laser processing.
3. The method for arranging metal spheres according to 1.). 5. A metal ball arrangement jig having an arrangement plate on which metal ball adsorption holes are arranged, for adsorbing metal balls to the metal ball adsorption holes, and a metal ball adsorption hole inside the metal ball arrangement jig. A pressing tool that presses the metal spheres adsorbed on, and a transfer table on which the metal sphere array target is placed to transfer the metal spheres adsorbed to the metal sphere suction holes of the metal sphere array jig to the metal sphere array target, The arrangement plate is formed of metal foil, and the thickness of the metal foil and the metal ball adsorption are adjusted such that the top of the metal ball protrudes toward the rear surface of the arrangement plate when the metal sphere is adsorbed from the surface of the arrangement plate to the metal ball adsorption hole. The diameter of the hole is determined, the metal sphere is sucked into the metal ball suction hole of the array plate, and the metal tool is pressed against the metal ball from the back side of the array plate when the sucked metal ball is transferred to the array target. Separate the spheres from the metal sphere adsorption holes and collectively mount the metal spheres on the arrangement target A metal ball arrangement device characterized by the above-mentioned. 6. The thickness of the array plate is set to 1/7 to 1 of the metal ball diameter.
6. The metal ball arrangement device according to claim 5, wherein the diameter of the metal ball adsorption hole is 0.8 to 0.9 times the metal ball diameter. 7. The metal ball arrangement device according to claim 5, wherein the arrangement plate having the metal ball suction holes is formed by electroforming. 8. The metal ball suction hole of the array plate is drilled by a laser processing method.
The metal ball arrangement device according to any one of the above. 9. The method for manufacturing an array plate used in a metal ball array device according to claim 5, wherein the array plate having the metal ball suction holes is formed by electroforming. 10. The method for manufacturing an array plate used in a metal ball array apparatus according to claim 5, wherein the metal ball suction holes of the array plate are perforated by a laser processing method.