JP2008177264A - Ball transfer mask and ball mounting device using the same - Google Patents

Ball transfer mask and ball mounting device using the same Download PDF

Info

Publication number
JP2008177264A
JP2008177264A JP2007007908A JP2007007908A JP2008177264A JP 2008177264 A JP2008177264 A JP 2008177264A JP 2007007908 A JP2007007908 A JP 2007007908A JP 2007007908 A JP2007007908 A JP 2007007908A JP 2008177264 A JP2008177264 A JP 2008177264A
Authority
JP
Japan
Prior art keywords
mask
ball
wafer
transfer mask
ball transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007007908A
Other languages
Japanese (ja)
Inventor
Motomichi Ito
元通 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Proterial Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2007007908A priority Critical patent/JP2008177264A/en
Publication of JP2008177264A publication Critical patent/JP2008177264A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/742—Apparatus for manufacturing bump connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/11001—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate
    • H01L2224/11005—Involving a temporary auxiliary member not forming part of the manufacturing apparatus, e.g. removable or sacrificial coating, film or substrate for aligning the bump connector, e.g. marks, spacers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/113—Manufacturing methods by local deposition of the material of the bump connector
    • H01L2224/1133—Manufacturing methods by local deposition of the material of the bump connector in solid form
    • H01L2224/11334—Manufacturing methods by local deposition of the material of the bump connector in solid form using preformed bumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01042—Molybdenum [Mo]

Abstract

<P>PROBLEM TO BE SOLVED: To provide a ball transfer mask wherein displacement of a conductive ball, which is once mounted in a specified pattern on an arranged object transferred to the opening of a mask, can be eliminated when the mask is removed from the arranged object, in the ball transfer mask to which micro balls are mounted in the specified pattern on the arranged object, and to provide a ball mounting device using the same. <P>SOLUTION: The ball transfer mask wherein micro balls are mounted in a specified pattern on the arranged object is provided with a plurality of openings corresponding to the pattern wherein the balls can be inserted. In this case, a low adhesive part is formed at least in a surface to be in contact with the arranged object. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、被配列体にボールを搭載するために用いられるボール振込み用マスク及びこれを用いたボール搭載装置に係わり、特に電子部品等の製造において微小なボールを高密度で搭載する場合に好適なボール振込み用マスク及びこれを用いたボール搭載装置に関する。   The present invention relates to a ball transfer mask used for mounting a ball on an object to be arranged and a ball mounting apparatus using the same, and particularly suitable for mounting minute balls at a high density in manufacturing electronic components and the like. The present invention relates to a ball transfer mask and a ball mounting apparatus using the same.

導電性を有するボール（以下導電性ボールと称する）が、所定のパターンで整列された状態となるように搭載された被配列体の一例として、例えばＢＧＡ（Ｂａｌｌ Ｇｒｉｄ Ａｌｌａｙ）タイプやＦＣ（Ｆｒｉｐ−Ｃｈｉｐ）タイプなどエリアアレイ型の突起状接続バンプを有する半導体装置、基板またはそれらのパッケージなどの電子部品がある。   As an example of an arrayed body on which conductive balls (hereinafter referred to as conductive balls) are mounted so as to be aligned in a predetermined pattern, for example, a BGA (Ball Grid Array) type or FC (Frip- There is an electronic component such as a semiconductor device having a protruding connection bump of an area array type such as a (Chip) type, a substrate or a package thereof.

接続バンプを形成する方法としては、導電性ボールを電極に搭載する導電性ボール方式の他に、半田や銅などの導電材を含んだペーストを電子部品の電極に印刷するペースト方式、導電材をメッキや蒸着する膜付け方式などがある。最近では、電極の配列は高密度化し、それに伴い接続バンプの大きさも小型化する傾向にあり、小型の接続バンプを形成する場合には、接続バンプの整列精度や生産性の面で有利な導電性ボール方式が採用される場合が多い。   As a method for forming the connection bump, in addition to the conductive ball method in which conductive balls are mounted on the electrodes, a paste method in which a paste containing a conductive material such as solder or copper is printed on the electrode of the electronic component, a conductive material is used. There are filming methods such as plating and vapor deposition. Recently, the arrangement of electrodes has been increased in density, and the size of the connection bumps has also been reduced accordingly. When forming a small connection bump, the conductive property is advantageous in terms of alignment accuracy and productivity of the connection bump. In many cases, the sex ball method is adopted.

導電性ボール方式によれば、前記接続バンプは、ソルダーペーストやフラックスなど粘着性を有する接続助剤を電極に塗布する塗布工程と、接続助剤が印刷された電極に導電性ボールを搭載する搭載工程と、その導電性ボールを加熱するなどして接続バンプを形成するバンプ形成工程を経て形成される。前記搭載工程における導電性ボールの搭載方法として、従来から、負圧を利用した吸着ヘッドで導電性ボールを吸着し電極上へ移送して搭載する吸着方式や、電極のパターンに対応した貫通孔状の開口部が形成された平板状のマスクを用い、マスク上に供給された導電性ボールを移動させて開口部に装入する振込み方式が知られている。   According to the conductive ball method, the connection bump is applied by applying an adhesive connection aid such as solder paste or flux to the electrode, and mounting the conductive ball on the electrode printed with the connection aid. It is formed through a process and a bump forming process of forming a connection bump by heating the conductive ball. As a mounting method of the conductive ball in the mounting step, conventionally, a suction method in which the conductive ball is sucked by a suction head using negative pressure and transferred onto the electrode and mounted, and a through hole shape corresponding to the electrode pattern is used. There is known a transfer method in which a conductive mask supplied on the mask is moved and inserted into the opening using a flat mask in which the opening is formed.

本出願人は、電子部品の更なる多端子化、小型化の要求に対応するため、１００μｍ以下の径小の導電性ボールでも信頼性高く搭載できる方式を鋭意研究開発し、特開２００５−１０１５０２号（特許文献１）で特許出願している。特許文献１における搭載方式は振込み方式であり、マスクを被配列体に位置合わせする第１のステップと、軸芯をほぼそろえて配設された複数の線状部材をマスク上で水平移動させ、マスク上に供給された導電性ボールを位置決め開口部に装入する第２のステップを有するものである。特に、第２のステップにおいて、軟磁性材で形成したマスクを吸引して被配列体面に密着させるとともに、線状部材の側面部をマスク表面に沿い移動させることに特徴を有している。これにより、線状部材で導電性ボールを確実に移動させて開口部に装入することができる上、一旦被配列体に載置された導電性ボールを掻き出すことも少なく、また載置された導電性ボールがマスクと被配列体の間に潜り込むことはないので、未搭載率がｐｐｍレベルという極めて高い搭載能力を実現した。
特開２００５−１０１５０２号公報 The present applicant has earnestly researched and developed a method capable of mounting a conductive ball having a diameter of 100 μm or less with high reliability in order to meet the demand for further multi-terminal and miniaturization of electronic components. (Patent document 1). The mounting method in Patent Document 1 is a transfer method, and a first step of aligning the mask with the object to be arrayed and a plurality of linear members arranged with the axes substantially aligned are horizontally moved on the mask, It has a second step of inserting the conductive ball supplied on the mask into the positioning opening. In particular, the second step is characterized in that a mask formed of a soft magnetic material is sucked and brought into close contact with the surface of the arrayed object, and the side surface of the linear member is moved along the mask surface. As a result, the conductive ball can be reliably moved by the linear member to be inserted into the opening, and the conductive ball once placed on the arrayed object is rarely scraped and placed. Since the conductive balls do not sink between the mask and the object to be arrayed, an extremely high mounting capability with a non-mounting rate of ppm level was realized.
JP-A-2005-101502

最近では、一枚の大型ウエハーに数十万個〜数百万個の導電性ボールを搭載して接続バンプを形成し、その後ダイサー等で分離して多数の半導体チップやエリアアレイ型パッケージ用基板などを切出すという量産性に優れた製造方法が採用されるようになっている。特許文献１の搭載方法によれば、従来の振込み式の搭載方法に比べ極めて高い搭載率を達成することができるが、未搭載箇所を完全になくすことは難しい。このため、切出された後の個々の基板等を１００％の歩留まりで製造するためには、リペアを行うことが必要となる。ここで、リペアとは、マスクを取外した後、導電性ボールの搭載状況を検査し、未搭載箇所がある場合にはそこに導電性ボールを１個ずつ搭載する処理であり、導電性ボールが電極上から脱落した場合には、脱落した導電性ボールを取り除いて新たな導電性ボールが電極に搭載される。そして、脱落する導電性ボールが多量になると、リペア工程の負担が大きくなると共に搭載タクトが長くなり生産性にも問題が生じる。   Recently, hundreds of thousands to millions of conductive balls are mounted on a single large wafer to form connection bumps, which are then separated by a dicer or the like to produce a large number of semiconductor chips and area array type package substrates. Manufacturing methods that excel in mass productivity, such as cutting out, are now being adopted. According to the mounting method of Patent Document 1, an extremely high mounting rate can be achieved as compared with the conventional transfer-type mounting method, but it is difficult to completely eliminate the unmounted portion. For this reason, it is necessary to perform repair in order to manufacture individual substrates after being cut out with a yield of 100%. Here, the repair is a process in which after the mask is removed, the mounting state of the conductive balls is inspected, and when there are unmounted portions, the conductive balls are mounted one by one. When it falls off from the electrode, the dropped conductive ball is removed and a new conductive ball is mounted on the electrode. If a large amount of the conductive balls fall off, the burden on the repair process increases and the mounting tact time becomes longer, causing a problem in productivity.

このような導電性ボールが電極から脱落する現象は被配列体からマスクを取外すときに生じ易い。ここで、電極には、粘着性を有する接続助剤（粘着剤）が塗布されているので、電極上に搭載された導電性ボールは接続助剤の粘着力で電極に固定され、外力が作用しない限り電極から脱落することはない。しかし、マスクを被配列体から取外すとき、マスクの一部分が被配列体と密着して変形してしまい、導電性ボールがそのマスクから横向きの力（被配列体の導電性ボールを搭載する面に対し略水平方向に作用する力）を受け、粘着剤の粘着力に抗して電極から脱落することがある。   Such a phenomenon that the conductive balls fall off the electrodes is likely to occur when the mask is removed from the arrayed body. Here, since the electrode is coated with an adhesive connection aid (adhesive), the conductive ball mounted on the electrode is fixed to the electrode by the adhesive force of the connection aid, and external force acts. If not, it will not fall off the electrode. However, when the mask is removed from the arrayed body, a part of the mask is in close contact with the arrayed body and deforms, and the conductive balls are subjected to a lateral force from the mask (on the surface on which the conductive balls of the arrayed body are mounted). Against the adhesive force of the adhesive, and may fall off from the electrode.

すなわち、マスクを取外す時、被配列体に対しマスクが垂直方向に移動する限り、マスクの開口部の壁面も垂直方向に移動するので、導電性ボールと接触していても、導電性ボールはわずかに上向きに擦られるだけで横向きの力は作用しない。また、特許文献１のマスクでは、マスクの開口部を上面から底面に向かい広がる逆テーパ状とすることで、導電性ボールが開口部側面に接触した状態であっても、マスクを取外す時に開口部側面がボールから遠ざかるように構成されている。   That is, when the mask is removed, as long as the mask moves in the vertical direction with respect to the arrayed object, the wall surface of the opening of the mask also moves in the vertical direction. The side force is not applied. Further, in the mask of Patent Document 1, the opening of the mask is formed in a reverse taper shape extending from the top surface to the bottom surface, so that the opening can be removed when the mask is removed even when the conductive ball is in contact with the side surface of the opening. The side is configured to be away from the ball.

しかしながら、マスクの被配列体と接触する面が鏡面状になっていたり、被配列体の表面（被配列体の導電性ボールを搭載する面）が軟質樹脂材のようにマスクとなじみ易い材質の場合には、マスクと被配列体との接触している部分が真空状態になる等して部分的にマスクと被配列体が密着してしまうことがある。このような場合、図９に示すように、マスク８２の全体が被配列体３から均一に離れないため、密着部分８２９を支点にしてマスク８２はたわみ変形しながら移動する。そうすると、開口部８２１の壁面は垂直方向のみならず水平方向にも移動するため、導電性ボール２は壁面で横向きに押され、電極３１から脱落することがある。特に、導電性ボールの直径が１００μｍ以下と微小な場合には、それに応じボールを配列するマスクの厚みも薄く構成されるので、マスクはたわみ変形し易い。このような剛性の低いマスクは、被配列体から離れた瞬間に弦のように振動する。更に、導電性ボールが微小な場合には、粘着剤はマスクへの付着を避けるように薄く塗布されるので、粘着剤による導電性ボールの保持力は小さい。そのため、導電性ボールは弦のように振動するマスクによって弾き飛ばされて電極から脱落してしまうことがある。
本発明は、上記従来技術の問題を本願発明者らが鋭意検討のうえなされたものであり、微小なボールを所定のパターンで被配列体に搭載するボール振込み用マスクにおいて、マスクの開口部に振込まれ被配列体に一旦所定パターンで搭載された導電性ボールが、マスクを被配列体から取外す時に、位置ずれすることを解消可能なボール振込み用マスク及びこれを用いたボール搭載装置を提供することを目的としている。 However, the surface of the mask that contacts the arrayed body is mirror-like, or the surface of the arrayed body (the surface on which the conductive balls of the arrayed body are mounted) is made of a material that is easily compatible with the mask, such as a soft resin material. In some cases, a portion where the mask and the arrayed body are in contact with each other may be in a vacuum state, and the mask and the arrayed body may be partially adhered. In such a case, as shown in FIG. 9, since the entire mask 82 is not uniformly separated from the arrayed body 3, the mask 82 moves while being bent and deformed with the contact portion 829 as a fulcrum. Then, since the wall surface of the opening 821 moves not only in the vertical direction but also in the horizontal direction, the conductive ball 2 may be pushed sideways on the wall surface and fall off the electrode 31. In particular, when the diameter of the conductive ball is as small as 100 μm or less, the thickness of the mask on which the balls are arranged is accordingly reduced, so that the mask is easily deformed. Such a low-rigidity mask vibrates like a string at a moment away from the arrayed object. Further, when the conductive ball is very small, the adhesive is thinly applied so as to avoid adhesion to the mask, so that the holding force of the conductive ball by the adhesive is small. For this reason, the conductive ball may be flipped off by the mask that vibrates like a string and fall off the electrode.
The present invention has been made by the inventors of the present invention after earnestly examining the above-mentioned problems of the prior art. In a ball transfer mask in which a minute ball is mounted on an arrayed body in a predetermined pattern, the opening of the mask is provided. Provided is a ball transfer mask and a ball mounting apparatus using the same, in which the conductive balls once transferred and mounted on the arrayed object in a predetermined pattern can be displaced when the mask is removed from the arrayed object. The purpose is that.

本発明は、微小なボールを所定のパターンで被配列体に搭載するボール振込み用マスクにおいて、前記パターンに対応し前記ボールが挿通可能な複数の開口部を有し、少なくとも前記被配列体と当接する面には低粘着質部が形成されているボール振込み用マスクである。かかるボール振込み用マスクによれば、マスクと被配列体を密接させたときに上記低粘着質部により被配列体との過度な密着を低減することができる。
ここで、前記低粘着質部は固体潤滑材で形成することが好ましく、また、前記低粘着質部に微細な凹凸が形成する構成としても好ましい。
さらに、前記被配列体と当接する面において、少なくともボール搭載領域以外の領域に低粘着質部が形成されている構成とすれば良い。
本発明は、微小なボールを所定のパターンで被配列体に搭載するボール振込み用マスクにおいて、前記ボールが挿通可能な複数の開口部が形成された平板状の基体部と、前記被配列体と当接して基体部を被配列体から所定隙間隔てるため基体部の一面側に形成された支持部とを有し、少なくとも前記支持部の前記被配列体と当接する面には低粘着質部が形成されているボール振込み用マスクである。
ここで、前記低粘着質部は固体潤滑材で形成することが好ましく、また、前記低粘着質部に微細な凹凸が形成する構成としても好ましい。
また、前記支持部は、被配列体とボール搭載領域内で当接する突出部と、被配列体とボール搭載領域外で当接する周辺部とで構成され、少なくとも前記周辺部の前記被配列体と当接する面には前記低粘着質部が形成されている構成とすれば良い。
本発明は、ボールを所定のパターンで被配列体に搭載する搭載装置において、上記いずれかのボール振込み用マスクを使用するボール搭載装置である。 The present invention provides a ball transfer mask for mounting minute balls on an arrayed object in a predetermined pattern, and has a plurality of openings through which the balls can be inserted corresponding to the pattern. This is a ball transfer mask in which a low adhesion part is formed on the contact surface. According to such a ball transfer mask, when the mask and the object to be arranged are brought into close contact with each other, excessive adhesion with the object to be arranged can be reduced by the low-adhesive portion.
Here, the low-adhesive part is preferably formed of a solid lubricant, and a configuration in which fine irregularities are formed in the low-adhesive part is also preferable.
Further, the low-adhesive portion may be formed at least in a region other than the ball mounting region on the surface in contact with the arrayed body.
The present invention provides a ball transfer mask for mounting minute balls on an arrayed body in a predetermined pattern, a flat base portion having a plurality of openings into which the balls can be inserted, and the arrayed body. And a support portion formed on one surface side of the base portion for separating the base portion from the arrayed body by a predetermined gap, and at least a surface of the support portion that contacts the arrayed body has a low adhesive portion It is a ball transfer mask that is formed.
Here, the low-adhesive part is preferably formed of a solid lubricant, and a configuration in which fine irregularities are formed in the low-adhesive part is also preferable.
Further, the support portion is configured by a protruding portion that comes into contact with the object to be arranged in the ball mounting area, and a peripheral part that comes in contact with the object to be arranged outside the ball mounting area, and at least the object to be arranged in the peripheral part. What is necessary is just to set it as the structure by which the said low adhesiveness part is formed in the surface to contact | abut.
The present invention is a ball mounting apparatus that uses any one of the above ball transfer masks in a mounting apparatus that mounts balls on an arrayed body in a predetermined pattern.

上記本発明によれば、マスクを取外す時に、マスクの開口部に振込まれ被配列体に一旦所定パターンで搭載された導電性ボールが、マスクを被配列体から取外す時に、位置ずれすることを解消可能である。もって、その位置ずれしたボールをリペア処理する時間が短縮でき、極めて高い作業能率を図ることができる。   According to the present invention, when the mask is removed, the conductive balls, which are transferred to the opening of the mask and once mounted in a predetermined pattern on the arrayed object, are not displaced when the mask is removed from the arrayed object. Is possible. Therefore, the time for repairing the misaligned ball can be shortened, and extremely high work efficiency can be achieved.

以下、本発明について、その実施態様に係るボール振込み用マスク（以下マスクと称する場合がある。）及びボール搭載装置に基づいて説明する。
以下の実施態様では、図５に示すように、導電性ボールである半田ボールを、被配列体であるウエハー３に所定のパターンで形成された電極３１に配列する場合を例にして説明する。ここで、ウエハー３は、シリコン、樹脂又はセラミックなど周知の導電性材料、非導電性材料又はそれらの積層体などを用いた円板状のものであり、多数の半導体チップ３２が切出される。通常、多数の半導体チップ３２を効率的に製造するため、ウエハー３の内部には多数のチップ３２が規則的にかつ密接して配置される。各チップ３２には電極３１が所定パターンで形成されるため、電極３１もウエハー３の表面上の所定の区域内に集合している。以下の説明では、電極３１が集合したウエハー３の表面上の区域をボール搭載領域３４と言う。また、電極３１の上面には、粘着性を有するフラックス（図示せず）が所定の厚みで塗布されている。
なお、以下の実施態様では被配列体としてウエハー３を例として説明するが、本発明は実施態様に限定されることなく、被配列体としては樹脂基板、セラミックス基板等の電子部材若しくは当該基板等にボールを搭載する搭載装置の部材なども含まれる。また、被配列体に搭載するボールとして導電性ボールである半田ボール２を例として説明するが、本発明は実施態様に限定されることなく例えば銅ボールその他の金属製ボール、樹脂ボール若しくはセラミックスボールその他の導電性を有しないボール又は金属が表面に被覆されたボール等に適用することができる。 Hereinafter, the present invention will be described based on a ball transfer mask (hereinafter sometimes referred to as a mask) and a ball mounting device according to the embodiment.
In the following embodiment, as shown in FIG. 5, a description will be given by taking as an example a case where solder balls, which are conductive balls, are arranged on electrodes 31 formed in a predetermined pattern on a wafer 3 which is an arrayed body. Here, the wafer 3 has a disk shape using a known conductive material such as silicon, resin or ceramic, a non-conductive material, or a laminate thereof, and a large number of semiconductor chips 32 are cut out. Usually, in order to efficiently manufacture a large number of semiconductor chips 32, a large number of chips 32 are regularly and closely arranged inside the wafer 3. Since the electrodes 31 are formed in a predetermined pattern on each chip 32, the electrodes 31 are also gathered in a predetermined area on the surface of the wafer 3. In the following description, an area on the surface of the wafer 3 where the electrodes 31 are gathered is referred to as a ball mounting area 34. Further, an adhesive flux (not shown) is applied to the upper surface of the electrode 31 with a predetermined thickness.
In the following embodiment, the wafer 3 will be described as an example of the arrayed body. However, the present invention is not limited to the embodiment, and the arrayed body may be an electronic member such as a resin substrate or a ceramic substrate, the substrate, or the like. Also includes a member of a mounting device for mounting a ball on the head. Further, the solder ball 2 which is a conductive ball will be described as an example of the ball to be mounted on the arrayed body. However, the present invention is not limited to the embodiment, for example, a copper ball or other metal ball, a resin ball or a ceramic ball. The present invention can be applied to other non-conductive balls or balls whose surfaces are coated with metal.

図１に自動化されたボール搭載装置１の一例を示す。本ボール搭載装置１は、ウエハー３を位置決めする搭載部３０と、マスク２２と、前記ウエハー３に位置決めされたマスク２２の上面を水平移動する振込具２７とを備えている。搭載部３０はウエハー３が水平にセットされるホルダ３１０と、ホルダ３１０の直下に配置された磁気発生器３１４と、ウエハー３を所定の高さに位置決めするホルダ昇降手段２９を有している。マスク水平移動手段２３は、マスク２２が張られた枠を保持して水平に支持するとともに水平方向に移動し、ウエハー３に対してマスク２２の水平方向の位置決めを行なう。振込具２７は水平方向移動手段（図示せず）により、マスク上面を水平移動することができる。さらに、前記マスク２２の上面に半田ボール２を供給するボール供給手段２４、余った半田ボール２をマスク２２の上面から除去するボール除去手段２６が装備されている。以下、ホルダ３１０、磁気発生器３１４、マスク２２、振込具２７、ホルダ昇降手段２９、マスク水平移動手段２３、ボール供給手段２４及びボール除去手段２６について説明する。   FIG. 1 shows an example of an automated ball mounting apparatus 1. The ball mounting apparatus 1 includes a mounting portion 30 for positioning the wafer 3, a mask 22, and a transfer tool 27 that horizontally moves on the upper surface of the mask 22 positioned on the wafer 3. The mounting unit 30 includes a holder 310 on which the wafer 3 is set horizontally, a magnetic generator 314 disposed immediately below the holder 310, and a holder lifting / lowering means 29 for positioning the wafer 3 at a predetermined height. The mask horizontal moving means 23 holds the frame on which the mask 22 is stretched and supports it horizontally and moves in the horizontal direction to position the mask 22 in the horizontal direction with respect to the wafer 3. The transfer tool 27 can move horizontally on the upper surface of the mask by means of horizontal movement means (not shown). Further, ball supply means 24 for supplying solder balls 2 to the upper surface of the mask 22 and ball removal means 26 for removing excess solder balls 2 from the upper surface of the mask 22 are provided. Hereinafter, the holder 310, the magnetic generator 314, the mask 22, the transfer tool 27, the holder lifting / lowering means 29, the mask horizontal moving means 23, the ball supply means 24, and the ball removing means 26 will be described.

１−１．ホルダ
ホルダ３１０は、非磁性ステンレス、樹脂などの非磁性材料を用い、図１、６に示すように、左方に立設した壁部３１３と、ウエハー３を装着自在にした挿着凹部３１２とを備えている。ホルダ３１０の底部には、前記挿着凹部３１２の底面に開口した開口部３１１ａと外部に開口した開口部３１１ｂと、前記開口部３１１ａと３１１ｂを連通する流体通路３１１が形成されており、前記開口部３１１ｂには負圧を発生する負圧発生手段が連結されている。挿着凹部３１２にウエハー３を装着した後に負圧発生手段で負圧を発生すれば、挿着凹部３１２の底面にウエハー３が密着し、ウエハー３は水平に保持される。 1-1. Holder The holder 310 is made of a nonmagnetic material such as nonmagnetic stainless steel or resin. As shown in FIGS. 1 and 6, a wall portion 313 erected on the left side, and an insertion recess 312 on which the wafer 3 can be freely mounted. It has. At the bottom of the holder 310, an opening 311a that opens to the bottom surface of the insertion recess 312 and an opening 311b that opens to the outside, and a fluid passage 311 that connects the openings 311a and 311b are formed. A negative pressure generating means for generating a negative pressure is connected to the portion 311b. If a negative pressure is generated by the negative pressure generating means after the wafer 3 is mounted in the insertion recess 312, the wafer 3 comes into close contact with the bottom surface of the insertion recess 312 and the wafer 3 is held horizontally.

１−２．磁気発生器
磁気発生器３１４は、図６に示すように、磁石３１５と磁石３１５を保持固定するヨーク３１６を有し、後述するように、磁石３１５から発生する磁力でマスク２２及び振込具２７の線状部材２７１を下方に引付ける作用を担っている。磁石３１５は、ホルダ３１０の下部に図示しない昇降手段により昇降自在に組み込まれ、上昇端位置にてウエハー３に密接可能な程度の磁力でマスク２２を吸引する。また、下降端位置ではマスク２２の吸引が解除される。また、磁石３１５は、ウエハー３に対し平面的に対向するように略平板状に設けられている。 1-2. As shown in FIG. 6, the magnetic generator 314 has a magnet 315 and a yoke 316 that holds and fixes the magnet 315, and, as will be described later, the magnetic force generated from the magnet 315 generates the mask 22 and the transfer tool 27. It plays the role of pulling the linear member 271 downward. The magnet 315 is incorporated in a lower part of the holder 310 by an elevating means (not shown) so as to be movable up and down, and attracts the mask 22 with a magnetic force that is close to the wafer 3 at the raised end position. Further, the suction of the mask 22 is released at the lower end position. The magnet 315 is provided in a substantially flat plate shape so as to face the wafer 3 in a planar manner.

１−３．マスク
マスク２２について図２〜４を参照しつつ説明する。図２は、水平面内でウエハー３に位置決めされ、鉛直方向においてウエハー３の表面に当接された状態のマスク２２を示す断面図、図３は本発明の一態様であるマスク２２を底面側（マスク２２のウエハー３との当接面側）から見た斜視図、図３は本発明の別の態様であるマスク４２を底面側から見た斜視図である。なお、図３及び図４中において破線３ａは、マスク２２・４２がウエハー３に位置決めされたときに対応するウエハー３の外周縁部を示している。
マスク２２は、図２、３に示すように、平板状の基体部１３２と、基体部１３２の一面に形成された支持部１３３とを備えている。基体部１３２には、ウエハー３の電極３１の配列パターンに対応し半田ボール２が挿通可能な貫通孔状の開口部１３１が形成されている。
支持部１３３の鉛直方向における構成について説明する。支持部１３３は、図２、３に示すように、その底面がウエハー３の表面と当接して基体部１３２をウエハー３から所定隙間ｔだけ隔てるために設けられており、マスク２２においては基体部１３２の底面から見てｔの高さを有する突起状に形成されている。ここで、支持部１３３の高さｔは、基体部１３２にフラックスが付着しないように調整されることが好ましい。このように、基体部１３２の下面と電極３１上面までの距離を確保することで、通常の状態ではフラックスが基体部１３２に付着することは防止される。なお、上記支持部１３３の高さを含むマスク２２の厚みＴは、電極３１の上に半田ボール２が搭載されたときに当該半田ボール２の頂部とマスク２２の上面とがほぼ一致するように構成されている。
次に、支持部１３３の平面方向における構成について説明する。支持部１３３は、マスク２２の開口部１３１がウエハー３の電極３１に一致するようマスク２２をウエハー３に位置合わせし、マスク２２の底面（支持部１３３の底面）をウエハー３の上面に当接した時、支持部１３３が電極３１に触れないように電極３１を避けた箇所に形成されている。 1-3. Mask The mask 22 will be described with reference to FIGS. 2 is a cross-sectional view showing the mask 22 positioned on the wafer 3 in the horizontal plane and in contact with the surface of the wafer 3 in the vertical direction. FIG. 3 shows the mask 22 according to one embodiment of the present invention on the bottom surface side ( FIG. 3 is a perspective view of a mask 42 according to another aspect of the present invention as viewed from the bottom surface side. 3 and 4, a broken line 3 a indicates an outer peripheral edge portion of the wafer 3 corresponding to the masks 22 and 42 positioned on the wafer 3.
As shown in FIGS. 2 and 3, the mask 22 includes a flat base portion 132 and a support portion 133 formed on one surface of the base portion 132. The base portion 132 is formed with a through-hole-shaped opening 131 through which the solder ball 2 can be inserted, corresponding to the arrangement pattern of the electrodes 31 of the wafer 3.
A configuration in the vertical direction of the support portion 133 will be described. As shown in FIGS. 2 and 3, the support portion 133 is provided so that the bottom surface thereof is in contact with the surface of the wafer 3 to separate the base portion 132 from the wafer 3 by a predetermined gap t. It is formed in a protruding shape having a height t as viewed from the bottom surface of 132. Here, the height t of the support portion 133 is preferably adjusted so that the flux does not adhere to the base portion 132. Thus, by securing the distance between the lower surface of the base portion 132 and the upper surface of the electrode 31, it is possible to prevent the flux from adhering to the base portion 132 in a normal state. It should be noted that the thickness T of the mask 22 including the height of the support portion 133 is such that when the solder ball 2 is mounted on the electrode 31, the top of the solder ball 2 and the upper surface of the mask 22 substantially coincide. It is configured.
Next, the structure in the planar direction of the support part 133 is demonstrated. The support unit 133 aligns the mask 22 with the wafer 3 so that the opening 131 of the mask 22 coincides with the electrode 31 of the wafer 3, and the bottom surface of the mask 22 (the bottom surface of the support unit 133) is in contact with the top surface of the wafer 3. In this case, the support part 133 is formed at a place avoiding the electrode 31 so as not to touch the electrode 31.

支持部１３３は、ほぼ同一形状の凸状体としてマスク２２のほぼ全面に形成してもよいが、マスク２２の強度や装着性、また製造面を考慮すると、ウエハー３のボール搭載領域３４内はウエハー３との当接面積の小さな突出部１３５とし、ボール搭載領域３４の外は当接面積の大きな面状の周辺部１３６として形成するとよい。図３は円柱状の突出部１３５でマスク２２を構成した例であるが、この突出部１３５の形状、大きさや配列位置については、突出部１３５自体にフラックスが付着しないよう、また基体部１３２が撓んでもフラックスが基体部１３２に付着しない程度におさまるよう、基体部１３２の厚さ、形成される開口部１３１の位置及び磁気吸引力等に基づいて設定するとよい。このように、マスク２２はフラックスが付着しないような構造としているので、マスク取外し時に、マスク２２がフラックスで引張られることはない。なお、突出部は、図４において符号４３５で示すように、枠状のものとして構成することもできる。   The support part 133 may be formed on the substantially entire surface of the mask 22 as a convex body having substantially the same shape. However, in consideration of the strength, wearability, and manufacturing surface of the mask 22, the inside of the ball mounting area 34 of the wafer 3 is The protrusion 135 having a small contact area with the wafer 3 may be formed, and the outside of the ball mounting area 34 may be formed as a planar peripheral portion 136 having a large contact area. FIG. 3 shows an example in which the mask 22 is constituted by a columnar protrusion 135. With respect to the shape, size, and arrangement position of the protrusion 135, the base portion 132 is arranged so that flux does not adhere to the protrusion 135 itself. It may be set based on the thickness of the base portion 132, the position of the opening 131 to be formed, the magnetic attraction force, and the like so that the flux does not adhere to the base portion 132 even if it is bent. Thus, since the mask 22 has a structure in which the flux does not adhere, the mask 22 is not pulled by the flux when the mask is removed. In addition, as shown by the reference numeral 435 in FIG.

マスク２２は、前記磁気発生器３１４からの磁力により吸引されて支持部１３３の底面がウエハー３の上面に密着するようにＮｉやＦｅなど軟磁性材を構成部材に含んでいる。これにより、ウエハー３に変形がある場合でも、マスク２２はウエハー３に倣って変形し、マスク２２とウエハー３の間に支持部１３３の高さｔ以上の隙間を生ずることはなく、その隙間から半田ボール２が漏れてしまうことはない。なお、支持部１３３は、基体部１３２と一体的に構成しても、基体部１３２とは別体とし基体部１３２に固着する構成としてもよい。例えば、開口部１３１が形成された厚さＴの軟磁性材からなる平板をフォトリソプロセスに通し、所定な部分を深さｔだけエッチング加工で除去して支持部１３３を形成したり、配列用開口部１３１が形成された厚さ（Ｔ−ｔ）の薄い基体部１３２に電気鋳造（メッキ）で厚さｔの支持部１３３を形成してもよい。またマスク２２全体として磁気吸引される限り、一方を軟磁性材、他方を樹脂で構成してもよい。   The mask 22 includes a soft magnetic material such as Ni or Fe as a constituent member so that the bottom surface of the support portion 133 is in close contact with the upper surface of the wafer 3 by being attracted by the magnetic force from the magnetic generator 314. As a result, even when the wafer 3 is deformed, the mask 22 is deformed following the wafer 3, and no gap more than the height t of the support portion 133 is generated between the mask 22 and the wafer 3. The solder ball 2 will not leak. The support portion 133 may be configured integrally with the base portion 132 or may be configured separately from the base portion 132 and fixed to the base portion 132. For example, a flat plate made of a soft magnetic material having a thickness T in which the opening 131 is formed is passed through a photolithography process, and a predetermined portion is removed by etching to a depth t to form a support portion 133, or an array opening The support portion 133 having a thickness t may be formed by electroforming (plating) on the thin base portion 132 having the portion 131 formed thereon (Tt). As long as the entire mask 22 is magnetically attracted, one may be made of a soft magnetic material and the other may be made of a resin.

ここで、マスク２２は、磁石３１５の磁力で吸引されウエハー３に密接されるので、支持部１３３とウエハー３の材質の組合せによっては支持部１３３の底面がウエハー３の上面に過度に密着して、マスク取外し時に、マスク２２がウエハー３から離れ難くなる場合がある。このため、この密着力が大きくならないよう、支持部１３３の底面側には粘着性を低減する処理がなされ、低粘着質部１３８が形成されている。かかる低粘着質部１３８を形成するためには支持部１３３の底面に固体潤滑材をコーティングすればよく、更に固体潤滑材としては撥水性が良好なもの程好ましい。そのような固体潤滑材としては、例えばフッ素系樹脂、二硫化モリブデン、グラファイト、ＤＬＣ（ダイヤモンドライクカーボン）、シリコン樹脂などを使用することができる。なお、強い密着はウエハー３と比較的大きな面積で密接する周辺部１３６で起こりやすい。したがって、周辺部１３６の少なくともウエハー３との当接面（図３，４にハッチングで示した部位）に低粘着質部１３８を形成しておくことが好ましい。突出部１３５は密着する面積が小さいので密着力が小さく、必ずしも低粘着質部１３８は形成されていなくてもよい。以上のようにマスク２２を構成することにより、マスク取外し時に、マスク２２はウエハー３から容易に離れるので、たわみ変形せず平面状態を維持して離版させることができる。   Here, since the mask 22 is attracted by the magnetic force of the magnet 315 and is in close contact with the wafer 3, the bottom surface of the support 133 is excessively in close contact with the upper surface of the wafer 3 depending on the combination of the support 133 and the material of the wafer 3. When removing the mask, the mask 22 may be difficult to separate from the wafer 3 in some cases. For this reason, in order to prevent this adhesion force from increasing, a process for reducing the adhesiveness is performed on the bottom surface side of the support portion 133, and the low-adhesiveness portion 138 is formed. In order to form such a low-adhesive part 138, the bottom surface of the support part 133 may be coated with a solid lubricant, and a solid lubricant having better water repellency is preferable. As such a solid lubricant, for example, fluorine resin, molybdenum disulfide, graphite, DLC (diamond-like carbon), silicon resin, or the like can be used. Note that strong adhesion tends to occur at the peripheral portion 136 that is in close contact with the wafer 3 with a relatively large area. Therefore, it is preferable to form the low-adhesion portion 138 on at least the contact surface of the peripheral portion 136 with the wafer 3 (the portion indicated by hatching in FIGS. 3 and 4). Since the projecting portion 135 has a small contact area, the adhesion force is small, and the low-adhesiveness portion 138 is not necessarily formed. By configuring the mask 22 as described above, the mask 22 is easily separated from the wafer 3 when the mask is removed, so that the plate 22 can be released while maintaining a flat state without being deformed.

１−４．振込具
振込具２７は、図７に示すように、保持部材２７２間で軸芯をほぼ揃えて配設された軟磁性材からなる複数の線状部材２７１を備えている。線状部材２７１は柔軟性のある磁性ステンレス細線を用いるとよく、マスク２２の上面を移動する時は、図７に示すように、マスク上面に対し腹部が当接するように位置決めされ、マスク２２の上面に対し相対的に水平移動する。なお、腹部とは、線状部材２７１の側面部分のうち、半田ボール２に当接するほぼ直線状をなす部分のことである。 1-4. As shown in FIG. 7, the transfer tool 27 includes a plurality of linear members 271 made of a soft magnetic material arranged with the shaft cores substantially aligned between the holding members 272. As the linear member 271, a flexible magnetic stainless steel thin wire may be used. When the upper surface of the mask 22 is moved, the linear member 271 is positioned so that the abdomen is in contact with the upper surface of the mask 22 as shown in FIG. Move horizontally relative to the top surface. The abdomen refers to a portion of the side surface portion of the linear member 271 that has a substantially linear shape that contacts the solder ball 2.

ここで、複数の線状部材２７１は高い密度で束ねられているので、図８に示すように、水平移動する際、一部の線状部材２７１が変形しその隙間から半田ボール２が漏れても、その後方に隣接する別の線状部材２７１で漏れた半田ボール２を捕捉して移動させることができる。さらに、線状部材２７１は、磁気発生器３１４が生じる磁力により下向きに引付けられ、マスク２２の上面に腹部が押付けられた状態で水平移動するので、半田ボール２を後方にほとんど漏らすことなく捕捉して移送でき、半田ボール２を配列用開口部１３１に円滑に挿入することができる。   Here, since the plurality of linear members 271 are bundled at a high density, as shown in FIG. 8, when moving horizontally, some of the linear members 271 are deformed and the solder balls 2 leak from the gaps. In addition, the solder ball 2 leaked by another linear member 271 adjacent to the rear side can be captured and moved. Further, the linear member 271 is attracted downward by the magnetic force generated by the magnetic generator 314 and moves horizontally with the abdomen pressed against the upper surface of the mask 22, so that the solder ball 2 is captured almost without leaking backward. The solder balls 2 can be smoothly inserted into the array openings 131.

１−５．ホルダ昇降手段
ウエハー３を装着する前のホルダ３１０の初期位置は、図１に示す矢印Ａにおいて下方の位置とする。ホルダ昇降手段２９は、ウエハー着脱位置、マスク装入位置及び半田ボール搭載位置で位置決めされ、ウエハー３の着脱、マスク２２の着脱及び半田ボール２の搭載が行なわれる。 1-5. Holder Lifting Means The initial position of the holder 310 before mounting the wafer 3 is a lower position in the arrow A shown in FIG. The holder lifting / lowering means 29 is positioned at the wafer attaching / detaching position, the mask loading position, and the solder ball mounting position, and the wafer 3 is attached / detached, the mask 22 is attached / detached, and the solder ball 2 is mounted.

１−６．マスク水平移動手段
マスク２２の初期位置は、図１に示す矢印Ｂにおいて右方の位置とする。マスク水平移送手段２３は、ホルダ昇降手段２９がマスク装入位置に位置決めされた時、初期位置からマスク２２を左方に移動させる。マスク２２は、その左側端面がホルダ３１０の壁部３１３の右側面に当接して水平方向の位置決めがされる。 1-6. Mask horizontal moving means The initial position of the mask 22 is set to the right side in the arrow B shown in FIG. The mask horizontal transfer means 23 moves the mask 22 to the left from the initial position when the holder elevating means 29 is positioned at the mask loading position. The mask 22 is positioned in the horizontal direction with its left end face in contact with the right side face of the wall portion 313 of the holder 310.

１−７．ボール供給手段
ボール供給手段２４は、マスク２２の右側端の上方に配置され、半田ボール２を供給する供給口２４１を有し、電極３１の個数より多い、例えば１．５〜３倍の半田ボール２を定量秤量し、マスク２２の上面に供給する。 1-7. Ball supply means The ball supply means 24 is disposed above the right end of the mask 22, has a supply port 241 for supplying the solder balls 2, and has, for example, 1.5 to 3 times more solder balls than the number of electrodes 31. 2 is weighed and supplied to the upper surface of the mask 22.

１−８．ボール除去手段
ボール除去手段２６は、マスク２２の左側端に配設され、半田ボール２を吸引する吸引口２６１を有し、振込具２７で移動させられマスク２２の左側端上に残った半田ボールを吸引除去する。 1-8. Ball removing means The ball removing means 26 is disposed at the left end of the mask 22, has a suction port 261 for sucking the solder balls 2, is moved by the transfer tool 27, and remains on the left end of the mask 22. Remove by suction.

次に、ボール搭載装置１の動作について説明する。
（１）ウエハーをセットするステップ
ホルダ３１０をウエハー着脱位置に移動させ、ウエハー３を挿着凹部２１２に装着し、負圧発生手段で吸引して固定する。
（２）マスクを装入するステップ
ホルダ３１０をマスク装入位置に上昇させるとともに、マスク２２を左方に移動させて、ウエハー３に位置合わせする。このとき、マスク２２の底面とウエハー３の上面との間には所定の間隔があいている。
（３）マスクを密接するステップ
ホルダ３１０を半田ボール搭載位置に上昇させ、マスク２２の底面とウエハー３の上面とを当接させる。この時、既に、図２に示すように開口部１３１が電極３１に位置合わせされている。次に、磁気発生器３１４の磁石３１５を上昇させ、マスク２２の支持部１３３の底面をウエハー３の上面に倣い密接させる。ウエハー３に変形がある場合でも、ウエハー３とマスク２２の間には空隙が生じない。 Next, the operation of the ball mounting apparatus 1 will be described.
(1) Step of setting the wafer The holder 310 is moved to the wafer attaching / detaching position, the wafer 3 is mounted in the insertion recess 212, and is sucked and fixed by the negative pressure generating means.
(2) Step of loading mask The holder 310 is raised to the mask loading position, and the mask 22 is moved to the left to align with the wafer 3. At this time, a predetermined gap is provided between the bottom surface of the mask 22 and the top surface of the wafer 3.
(3) Step of closely contacting the mask The holder 310 is raised to the solder ball mounting position, and the bottom surface of the mask 22 and the top surface of the wafer 3 are brought into contact with each other. At this time, the opening 131 is already aligned with the electrode 31 as shown in FIG. Next, the magnet 315 of the magnetic generator 314 is raised, and the bottom surface of the support portion 133 of the mask 22 is brought into close contact with the upper surface of the wafer 3. Even when the wafer 3 is deformed, no gap is generated between the wafer 3 and the mask 22.

（４）半田ボールを搭載するステップ
電極３１の個数以上の半田ボール２をボール供給手段２４でマスク２２の上面に供給する。次いで、振込具２７をマスク２２の上面に対し相対的に水平移動し、マスク２２の開口部１３１に半田ボール２を挿入する。
（５）半田ボールを除去するステップ
搭載ステップ後にマスク上に残った半田ボール２をボール除去手段２６で除去する。なお、複数のウエハー３を処理する場合には、マスク２２上の残ボールを一時的に開口部１３１から離れた場所に退避させておき、全てのウエハー３の搭載が完了した後に除去する方が半田ボールの使用効率の点で望ましい。 (4) Step of Mounting Solder Balls Solder balls 2 equal to or more than the number of electrodes 31 are supplied to the upper surface of the mask 22 by the ball supply means 24. Next, the transfer tool 27 is moved horizontally relative to the upper surface of the mask 22, and the solder ball 2 is inserted into the opening 131 of the mask 22.
(5) Step of removing solder ball The solder ball 2 remaining on the mask after the mounting step is removed by the ball removing means 26. When processing a plurality of wafers 3, it is better to temporarily remove the remaining balls on the mask 22 to a place away from the opening 131 and remove them after all the wafers 3 are mounted. This is desirable in terms of the solder ball usage efficiency.

（６）マスクをウエハーから取外すステップ
磁石３１５を下降させてマスク２２の磁力による吸引を解いた後に、ホルダ３１０をマスク着脱位置まで下降させてマスク２２を離版させ、次いでマスク２２を右方に移動させて取外す。ホルダ３１０の下降時、周辺部１３６の底面には低粘着質部１３８が形成されているので、マスク２２とウエハー３とが密着することはなくマスク２２はたわまずにスムースに離版する。即ち、マスク２２は全面がほぼ同時にウエハー３から離版するので、離版時にマスク２２が傾いたり、振動を生じることはない。
（７）ウエハーを取外すステップ
ホルダ３１０をウエハー着脱位置まで下降させてウエハー３を取外し、半田ボール２が搭載されたウエハー３をリフロー工程に搬出する。なお、ボール搭載装置１の中にリペア装置を組み込んでウエハー３を取外す前にリペアを行うようにすると効率的であり望ましい。 (6) Step of removing the mask from the wafer After the magnet 315 is lowered to release the attraction by the magnetic force of the mask 22, the holder 310 is lowered to the mask attaching / detaching position to release the mask 22, and then the mask 22 is moved to the right. Move to remove. When the holder 310 is lowered, the low-viscosity portion 138 is formed on the bottom surface of the peripheral portion 136, so that the mask 22 and the wafer 3 are not in close contact with each other, and the mask 22 is smoothly released without bending. That is, since the entire surface of the mask 22 is released from the wafer 3 almost simultaneously, the mask 22 does not tilt or vibrate during release.
(7) Step of removing wafer The holder 310 is lowered to the wafer attaching / detaching position, the wafer 3 is removed, and the wafer 3 on which the solder balls 2 are mounted is carried out to the reflow process. It should be noted that it is efficient and desirable to perform repair before the wafer 3 is removed by incorporating the repair device into the ball mounting device 1.

なお、上記マスク２２の低粘着質部１３８は固体潤滑材で形成する態様の例であったが、支持部１３３の底部に微細な凹凸が形成された低粘着部を設けることによりマスク２２とウエハー３との粘着性を低減させることができる。このような微細な凹凸は、例えばエッチングやレーザ加工によりマスク２２の底面に微小穴を形成したり、メッキにより同底面に微小突起を形成することで、設けることができる。この凹凸の粗さは対象となるボールの大きさその他の条件により適宜設定されるものであるが、例えば直径が２０〜１００μｍ程度の微小なボールを対象とする場合には、１〜数ミクロン程度の粗さの凹凸を形成することが好ましい。ここで、上記実施態様のマスク２２に代えて、支持部１３３の底部をエッチングで加工し、表面平均粗さＲａは１．１〜２．３μｍの微細な凹凸が形成された低粘着質部を有するマスクを用いて上記マスク２２の実施態様と同様にウエハー３に半田ボール２を搭載したところ、上記マスク２２と同様にマスクはウエハー３に密着せず、半田ボール２の電極３１からの脱落もなかった。   Although the low-adhesive portion 138 of the mask 22 is an example of an embodiment formed of a solid lubricant, the mask 22 and the wafer can be formed by providing a low-adhesive portion having fine irregularities formed at the bottom of the support portion 133. 3 can be reduced. Such fine irregularities can be provided, for example, by forming a minute hole on the bottom surface of the mask 22 by etching or laser processing, or by forming a minute protrusion on the bottom surface by plating. The roughness of the unevenness is appropriately set depending on the size of the target ball and other conditions. For example, when the target is a minute ball having a diameter of about 20 to 100 μm, the roughness is about 1 to several microns. It is preferable to form irregularities of roughness. Here, instead of the mask 22 of the above-described embodiment, the bottom of the support portion 133 is processed by etching, and the surface average roughness Ra is a low-adhesive portion on which fine unevenness of 1.1 to 2.3 μm is formed. When the solder balls 2 are mounted on the wafer 3 using the mask having the mask 22 as in the embodiment of the mask 22, the mask does not adhere to the wafer 3 similarly to the mask 22, and the solder balls 2 may be detached from the electrodes 31. There wasn't.

また、（１）上記フラックス等、マスクと被配列体の間に介在物が無く、当該介在物のマスクへの付着を考慮する必要のない場合、（２）介在物があっても介在物が付着しない程度に例えばマスクの開口部の大きさを十分に確保できる場合には、上記マスク２２を構成する突出部１３５は必要なく、マスクは基体部のみ、すなわち平板状体として構成してもよい。この場合は、マスクの底面側に低粘着質部を形成すればよい。   (1) When there is no inclusion between the mask and the arrayed object such as the above-mentioned flux and it is not necessary to consider the attachment of the inclusion to the mask, (2) the inclusion is present even if there is an inclusion. For example, when the size of the opening of the mask can be sufficiently secured to such an extent that it does not adhere, the projection 135 constituting the mask 22 is not necessary, and the mask may be configured only as a base portion, that is, as a flat body. . In this case, a low-adhesive part may be formed on the bottom side of the mask.

また、前述したマスク２２は、磁力吸引されるように構成部材に軟磁性材を有するものとして説明したが、磁気吸引されない材質、例えば樹脂や非磁性ステンレスだけで構成されたマスクであっても、本発明の特徴とする技術を備えることはでき、本発明のマスクに含まれる。この場合、前述した磁気発生器３１４ではマスクを吸引してウエハーに密着させることができない。そのため、ホルダ３１０には、前述したウエハーを負圧で吸引保持するための流体通路に加え、マスクをウエハーから外れた箇所で負圧吸引できるような流体通路を形成し、負圧発生手段を作用させることでウエハーに密接させることができる。この他にも、ボール搭載装置の構造、例えば上記ホルダ２１、ホルダ昇降手段２９、マスク水平移動手段２３、ボール供給手段２４、ボール除去手段２６などは、対象ウエハーの品種数や大きさ、許容搭載時間などに応じた適宜の構造をとることができる。また、マスク離版動作は、マスク２２とウエハー３が相対的に垂直方向に離れればよく、マスク２２側を上昇させるような構造として、マスク２２を上昇させて行ってもよい。   The above-described mask 22 has been described as having a soft magnetic material as a constituent member so as to be attracted by a magnetic force. However, even if the mask 22 is composed of a material that is not magnetically attracted, such as a resin or nonmagnetic stainless steel, The technique characterized by the present invention can be provided and included in the mask of the present invention. In this case, the above-described magnetic generator 314 cannot attract the mask and adhere to the wafer. Therefore, in addition to the above-described fluid passage for sucking and holding the wafer at a negative pressure, the holder 310 is formed with a fluid passage capable of sucking the mask at a location where the mask is removed from the wafer, thereby acting as a negative pressure generating means. By doing so, it can be brought into close contact with the wafer. In addition to this, the structure of the ball mounting apparatus, such as the holder 21, the holder lifting / lowering means 29, the mask horizontal moving means 23, the ball supply means 24, the ball removing means 26, etc. An appropriate structure according to time or the like can be taken. Further, the mask release operation may be performed by raising the mask 22 as long as the mask 22 and the wafer 3 are relatively separated from each other in the vertical direction and the mask 22 is raised.

本発明のボール搭載装置の一例を示す図である。It is a figure which shows an example of the ball | bowl mounting apparatus of this invention. 図１のマスクの部分拡大断面図である。It is a partial expanded sectional view of the mask of FIG. 図１のマスクの斜視図である。ウエハーと電極の関係を表す図である。It is a perspective view of the mask of FIG. It is a figure showing the relationship between a wafer and an electrode. 本発明に係る別の態様のマスクの斜視図である。It is a perspective view of the mask of another aspect which concerns on this invention. 図１のウエハーと電極の関係を表す図である。It is a figure showing the relationship between the wafer of FIG. 1, and an electrode. 図１のホルダ及び磁気発生器の部分の断面図である。It is sectional drawing of the part of the holder of FIG. 1, and a magnetic generator. 振込み具とマスクの関係を示す斜視図である。It is a perspective view which shows the relationship between a transfer tool and a mask. 振込み具によるボール振込み動作を示す図である。It is a figure which shows the ball | bowl transfer operation | movement by a transfer tool. マスク取外し時にマスクの一部がウエハーに密着している時のマスク状態を示す図である。It is a figure which shows a mask state when some masks are closely_contact | adhered to a wafer at the time of mask removal.

符号の説明Explanation of symbols

１ ボール搭載装置
２ 半田ボール
３ ウエハー
２２ ボール振込みマスク
３１ 電極
３１０ ホルダ
３１４ 磁気発生器
２７ 振込具
２７１ 線状部材
２９ ホルダ昇降手段
１３２ 基体部
１３３ 支持部
１３５ 突出部
１３６ 周辺部
１３８ 低粘着質部 DESCRIPTION OF SYMBOLS 1 Ball mounting apparatus 2 Solder ball 3 Wafer 22 Ball transfer mask 31 Electrode 310 Holder 314 Magnetic generator 27 Transfer tool 271 Linear member 29 Holder raising / lowering means 132 Base part 133 Support part 135 Protrusion part 136 Peripheral part 138 Low adhesion part

Claims (9)

微小なボールを所定のパターンで被配列体に搭載するボール振込み用マスクにおいて、前記パターンに対応し前記ボールが挿通可能な複数の開口部を有し、少なくとも前記被配列体と当接する面には低粘着質部が形成されているボール振込み用マスク。 In a ball transfer mask for mounting minute balls on an arrayed body in a predetermined pattern, the mask has a plurality of openings through which the balls can be inserted corresponding to the pattern, and at least on a surface that contacts the arrayed body A ball transfer mask with a low adhesion part. 前記低粘着質部は、固体潤滑材で形成されている請求項１記載のボール振込み用マスク。 The ball transfer mask according to claim 1, wherein the low-adhesive portion is formed of a solid lubricant. 前記低粘着質部には微細な凹凸が形成されている請求項１記載のボール振込み用マスク。 The ball transfer mask according to claim 1, wherein fine irregularities are formed in the low-adhesive portion. 前記被配列体と当接する面において、少なくともボール搭載領域以外の領域に低粘着質部が形成されている請求項１乃至３のいずれかに記載のボール振込み用マスク。 The ball transfer mask according to any one of claims 1 to 3, wherein a low-adhesive portion is formed at least in a region other than the ball mounting region on the surface in contact with the arrayed body. 微小なボールを所定のパターンで被配列体に搭載するボール振込み用マスクにおいて、
前記ボールが挿通可能な複数の開口部が形成された平板状の基体部と、
前記被配列体と当接して基体部を被配列体から所定隙間隔てるため基体部の一面側に形成された支持部とを有し、
少なくとも前記支持部の前記被配列体と当接する面には低粘着質部が形成されているボール振込み用マスク。 In a ball transfer mask that mounts minute balls on an arrayed body in a predetermined pattern,
A flat base portion having a plurality of openings into which the balls can be inserted;
A support portion formed on one surface side of the base portion in order to contact the arrayed body and separate the base portion from the arrayed body with a predetermined gap;
A ball transfer mask in which a low-adhesive part is formed on at least a surface of the support part that contacts the arrayed body. 前記低粘着質部は、固体潤滑材で形成されている請求項５記載のボール振込み用マスク。 The ball transfer mask according to claim 5, wherein the low-adhesive part is formed of a solid lubricant. 前記低粘着質部には、微細な凹凸が形成されている請求項５記載のボール振込み用マスク。 The ball transfer mask according to claim 5, wherein fine irregularities are formed in the low adhesion part. 前記支持部は、被配列体とボール搭載領域内で当接する突出部と、被配列体とボール搭載領域外で当接する周辺部とで構成され、少なくとも前記周辺部の前記被配列体と当接する面には前記低粘着質部が形成されている請求項５乃至７のいずれかに記載のボール振込み用マスク。 The support portion includes a protruding portion that comes into contact with the object to be arranged in the ball mounting area, and a peripheral portion that comes into contact with the object to be arranged outside the ball mounting area, and at least comes into contact with the object to be arranged in the peripheral portion. The ball transfer mask according to claim 5, wherein the low-adhesion portion is formed on a surface. ボールを所定のパターンで被配列体に搭載する搭載装置において、 請求項１乃至８のいずれかに記載のボール振込み用マスクを使用するボール搭載装置。 9. A mounting apparatus for mounting a ball on an arrayed body in a predetermined pattern, wherein the ball mounting apparatus uses the ball transfer mask according to any one of claims 1 to 8.
JP2007007908A 2007-01-17 2007-01-17 Ball transfer mask and ball mounting device using the same Pending JP2008177264A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007007908A JP2008177264A (en) 2007-01-17 2007-01-17 Ball transfer mask and ball mounting device using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007007908A JP2008177264A (en) 2007-01-17 2007-01-17 Ball transfer mask and ball mounting device using the same

Publications (1)

Publication Number Publication Date
JP2008177264A true JP2008177264A (en) 2008-07-31

Family

ID=39704093

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007007908A Pending JP2008177264A (en) 2007-01-17 2007-01-17 Ball transfer mask and ball mounting device using the same

Country Status (1)

Country Link
JP (1) JP2008177264A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050182A (en) * 2008-08-20 2010-03-04 Bonmaaku:Kk Metal mask and method of manufacturing the same
JP2010135457A (en) * 2008-12-03 2010-06-17 Hitachi Plant Technologies Ltd Solder ball printer
JP2019004181A (en) * 2014-07-07 2019-01-10 マクセルホールディングス株式会社 Array mask
JP2020053540A (en) * 2018-09-26 2020-04-02 アスリートＦａ株式会社 Substrate adsorption fixed stage and ball mounting device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010050182A (en) * 2008-08-20 2010-03-04 Bonmaaku:Kk Metal mask and method of manufacturing the same
JP2010135457A (en) * 2008-12-03 2010-06-17 Hitachi Plant Technologies Ltd Solder ball printer
JP2019004181A (en) * 2014-07-07 2019-01-10 マクセルホールディングス株式会社 Array mask
JP7022159B2 (en) 2014-07-07 2022-02-17 マクセル株式会社 Alignment mask
JP7326541B2 (en) 2014-07-07 2023-08-15 マクセル株式会社 array mask
JP2020053540A (en) * 2018-09-26 2020-04-02 アスリートＦａ株式会社 Substrate adsorption fixed stage and ball mounting device
JP7109076B2 (en) 2018-09-26 2022-07-29 アスリートＦａ株式会社 Substrate adsorption/fixation stage and ball mounting device

Similar Documents

Publication Publication Date Title
JP4221728B2 (en) Conductive ball arrangement mask and conductive ball arrangement apparatus using the same
US6213386B1 (en) Method of forming bumps
JP2011040744A (en) Semiconductor chip attaching apparatus and method of the same
TWI679293B (en) Film forming device
JP2008177264A (en) Ball transfer mask and ball mounting device using the same
JP2008263053A (en) Mask for arrangement, and its manufacturing method
JP4271241B2 (en) Micro ball mounting device
JP2004335973A (en) Substrate supporting jig
JP3770496B2 (en) Method and apparatus for mounting conductive ball
JP4683326B2 (en) Conductive ball mounting device
JP4348696B2 (en) Conductive ball array mask and array device using the same
JP2007073762A (en) Method of releasing in burn-in test and alignment device for use in burn-in test
JP4655269B2 (en) Method and apparatus for mounting conductive ball
JP4356077B2 (en) Method and apparatus for mounting conductive ball
JP4457354B2 (en) Conductive ball mounting device and alignment member incorporated in conductive ball mounting device
JP4478954B2 (en) Conductive ball mounting device
JP4078262B2 (en) Ball array plate, ball array device, and ball array method
JP4092707B2 (en) Method and apparatus for mounting conductive ball
JP4341036B2 (en) Method and apparatus for mounting conductive ball
JP5177694B2 (en) Conductive ball mounting device
JP2008205056A (en) Mask for arranging solder ball, and manufacturing method for the same
JP2008016611A (en) Holder for mounting ball having different diameter, and method for mounting ball having different diameter
JP3078804B1 (en) Metal ball arrangement method and arrangement device
JP2008066753A (en) Ball arraying plate, ball arraying device, and ball arraying method
JP4165805B2 (en) Solder ball adsorption base manufacturing method