JP2000340935A - Ball mounting jig and ball mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely mount balls for coping with warpage of a board. SOLUTION: A ball-mounting jig which mounts solder balls 4a-4d on a board 5, etc., has an elastic element 3 attached to a surface which adheres by suction the solder balls 4a-4d. Even if the board 5 is warped, the warp is adsorbed by the deformation of the elastic element 3, and the solder balls 4a-4d can be mounted accurately and surely without missing balls. The elastic element 3 may be attached to the outside of the jig, so as to be pressed against the ball attracting surface or may also be attached replaceably.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ball mounting jig and a ball mounting method, and more particularly, to a ball mounting jig for accurately and reliably mounting a ball on a warped substrate without displacement or ball drop. The present invention relates to a jig and a ball mounting method.

[0002]

2. Description of the Related Art In general, the number of input / output terminals of a semiconductor device tends to increase with higher performance and higher integration of the semiconductor device. QFP (Quad with lead)
Flat Package) has been used. However, there is a limit to the number of terminals in the method of drawing out in four directions, and in order to cope with the further increase in the number of terminals, a BGA (Ball) in which solder bumps are arranged on the entire back surface of the package.
Grid Array) packages have been used.

The above-mentioned method of forming the BGA on the back surface of the package or on the substrate is performed by printing a solder paste and then performing heating and melting, or by forming a spherical solder ball on the back surface of the package or on the pad of the substrate in advance. There is used a method of forming by performing heating and melting after mounting using the adhesive force of the applied flux, solder paste, or the like.

FIG. 17 is a sectional view showing a method for mounting a ball by the above-mentioned conventional ball suction jig. This ball suction jig is used for forming a BGA by a suction method using solder balls. The ball suction unit 9 is made of metal, glass, or the like, and has holes formed in accordance with the arrangement of a package for mounting a ball and a BGA formed on a substrate. Vacuum suction of the solder balls is performed using the holes, and the positions of the solder balls 4a, 4b, 4c, and 4d adsorbed to the pads 6 on the package or the substrate 5 to which the flux or the solder paste has been applied in advance, and then the vacuum suction is performed. After stopping, the solder ball is mounted on the pad 6 by using an adhesive force such as a flux or a solder paste. At this time, if the substrate 5 is warped as shown in FIG. 17, the solder balls 4a and 4d near the end of the jig do not contact the pad 6, so that the solder balls 4a and 4d roll without being placed on the pad 6 and cause positional displacement. Sometimes. If the solder balls 4a, 4d that are not in contact with the pad 6 and are separated from the pad 6 are brought down to contact the pad 6, the solder balls 4b, 4c already in contact with the pad 6 Excessive force is applied and solder balls 4b and 4c are crushed,
The hole for sucking the solder ball of the ball sucking portion 9 is hardly inserted. Therefore, even after the ball suction portion 9 is raised, the solder balls 4b and 4c are not mounted on the pads 6 of the substrate 5 but remain on the ball suction portion 9 side, and a ball mounting defect may occur.

When the ball is released from the suction portion 9, even if the suction is stopped, the solder ball may not be separated from the suction hole due to the influence of static electricity or the like. It was necessary to press the solder ball. As a solution to this, contrary to vacuum suction, there is a method in which a small amount of air is blown out from the suction hole to separate the solder ball from the suction jig.However, if the blowout is too strong, the solder ball scatters without falling to a predetermined position. Is difficult to control.

In order to improve the separation of the ball from the jig among the ball mounting jigs, as shown in FIG.
There is also a ball suction jig which is provided with 0 so that the solder ball is easily separated from the ball suction portion 9. However, if the substrate is warped even in this type of ball suction jig, the solder ball is separated from the ball suction jig at a position where the solder ball floats from the pad of the substrate, so that a displacement of the solder ball may occur. . Further, if the separated solder ball is pressed until it comes into contact with the pad 6, the solder ball may bite into the ball push-out pin 10, causing a mounting failure or breaking the ball push-out pin. Further, the jig becomes complicated, so that it is difficult to cope with a BGA having a fine pitch, and there is a problem that the price of the jig increases.

These problems are caused by the warpage of the substrate shown in FIGS.
This applies not only to the case where the central portion is convex as shown in FIG. 8, but also to the case where the central portion is concave and the case where the convex and concave are combined.

Therefore, there has been a demand for a ball mounting jig and a ball mounting method capable of securely mounting solder balls even if the substrate is warped.

[0009]

As described above, the conventional example has a problem that it is difficult to securely mount the solder ball at a predetermined position.

Accordingly, an object of the present invention is to provide a solder ball mounting jig and a solder ball mounting method capable of reliably mounting a solder ball even if a substrate is warped in order to solve the above-mentioned problem. is there.

[0011]

In order to achieve the above object, a ball mounting jig according to the present invention is a ball mounting jig for mounting a solder ball on a substrate or the like. The substrate is characterized in that even if the substrate or the like has a warp, the warp is absorbed by the deformation of the elastic material and the solder ball can be accurately and reliably mounted without chipping.

Another embodiment of the ball mounting jig of the present invention is a ball mounting jig for mounting a solder ball on a substrate or the like. The substrate is characterized in that even if the substrate or the like has a warp, the warp is absorbed by the deformation of the elastic material and the solder ball can be accurately and reliably mounted without chipping.

Preferably, the elastic material has a hole having substantially the same diameter as a suction hole provided on a surface for sucking the solder ball for vacuum suction of the solder ball.

Further, the elastic material is preferably replaceable.

Further, in the ball mounting method of the present invention, in a ball mounting method of mounting a solder ball on a substrate or the like, an elastic material is attached to a surface on which the solder ball is adsorbed.
Even if the substrate or the like has a warp, the warp is absorbed by the deformation of the elastic material and the solder ball can be accurately and reliably mounted without chipping the ball.

In another embodiment of the ball mounting method of the present invention, in a ball mounting method for mounting a solder ball on a substrate or the like, an elastic material is provided outside the jig so as to be in contact with a surface on which the solder ball is attracted. It is characterized in that even if there is a warp in the mounting or the substrate, the warp is absorbed by the deformation of the elastic material, so that the solder ball can be mounted accurately and surely without dropping the ball.

[0017]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a sectional view showing the configuration of the embodiment of the present invention. The ball mounting jig and the ball mounting method of the present invention are characterized in that accurate and reliable ball mounting is performed on a warped substrate without any positional deviation, ball missing or the like. As shown in FIG. 1, an elastic material 3 such as silicone, rubber, or the like is attached to a portion of a ball mounting jig 2 fixed to a head portion 1 of a ball mounting device for sucking a solder ball.

Next, the operation of the embodiment of the present invention will be described with reference to FIGS.

As shown in FIG. 2, when the solder balls 4a to 4d are mounted on the substrate 5 or the pads of the semiconductor package, when the substrate is pressurized in a warped state, as shown in FIG. Since the solder balls 4a and 4d float from the pads 6 on the substrate, the solder balls may not be accurately placed on the pads and may be displaced.
However, in the ball mounting jig of the present invention, since the solder balls 4a to 4d are sucked through the elastic material 3, the pad 6 is pressed while the solder balls 4 are sucked as shown in FIG. be able to. Further, even when the solder ball 4 is pressed against the pad 6 and pressed, the elastic material 3 is deformed, so that the solder ball is not crushed or cut into the suction hole. Absorbing allows accurate ball mounting.

As another embodiment of the present invention, as shown in FIG. 9, this elastic material 3 is not directly attached to the ball suction surface side of the ball mounting jig, but the elastic material 3 is attached to the mounting jig. It is also possible to adopt a structure that is fixed on the outside and is in contact with the suction surface. In this case, in order to bring the solder balls 4a, 4d floating from the pad 6 into contact with the pad 6 due to the warpage of the substrate, the elastic material fixing portion 8 is lowered to
Is deformed so as to separate from the suction part. FIG. 12 shows the state at this time. As described above, by deforming the elastic material 3 so as to follow the warpage of the substrate, the floating solder balls 4a and 4d come into contact with the pads 6 and accurate ball mounting can be performed.

[0022]

Next, an embodiment of the present invention will be described in detail with reference to the drawings.

Referring to the ball mounting jig of FIG. 1, a ball suction jig 2 made of a material such as metal or glass is fixed to a head portion 1 of an apparatus for mounting a ball suction jig of a ball mounting apparatus. The ball suction jig 2 is fixed to the head 1 by a method of vacuum-suctioning a portion of the ball suction jig 2 that contacts the device head 1, a method of fixing by screwing, or using another jig from outside. Although any method such as a fixing method may be used, a structure that can be attached and detached rather than fixed with an adhesive or the like is desirable so as to be compatible with various ball sizes and ball arrangements. Further, a portion of the ball suction jig 2 fixed to the device head 1 is provided with a vacuum suction flow path connected to a vacuum suction hole provided in the device head 1, Further, a hole for vacuum suction of a solder ball continuously connected from a vacuum suction channel is provided on the lower surface. This hole is formed in accordance with the pattern for mounting the solder ball.

Next, the operation of the embodiment of the present invention will be described in detail.

First, a method for mounting a solder ball on a substrate will be described using this embodiment.

FIG. 2 shows a state where the solder balls are suctioned by vacuum suction from the apparatus when the solder balls are mounted using the ball mounting jig of the present invention. By vacuum suction from the mounting device in the direction of the arrow in FIG. 2, the solder balls 4 a, 4 b, 4 c, and 4 d are suctioned to the elastic material 3 through the ball suction jig 2. Also, the substrate 5
Is fixed on a stage 7 of the apparatus by vacuum suction or a jig, and a ball mounting jig is arranged on the substrate 5 so that the solder balls 4 and the pads 6 of the substrate 5 coincide with each other. Here, it is desirable to supply an adhesive material such as flux or solder paste on the pads 6 of the substrate 5 in order to securely mount the solder balls (not shown). FIG. 2 shows a state in which the substrate 5 is warped, and the figure shows a case where the warp is large for easy understanding.

Next, as shown in FIG.
Then, the ball mounting jig is lowered until the ball contacts the pad 6. The lowering of the ball mounting jig causes the solder balls 4b,
4c is in contact with the pad 6 of the substrate 5, but since the warp of the substrate 5 is large, the solder balls 4a and 4d at the ends do not come into contact with the pad 6 and are left floating. When the vacuum suction is stopped in this state, the solder balls 4a and 4d
Since it falls from a position distant from the camera, there is a possibility that a positional shift may occur.

Therefore, as shown in FIG. 4, the solder balls 4a and 4
The ball suction jig is further lowered until d contacts the pad 6. At this time, an extra force is applied to the solder balls 4b and 4c which have been in contact with the pad 6 first, but in this embodiment, the elastic material 3 is attached to the tip of the ball suction jig 2. Therefore, all the solder balls can be brought into contact with the pads 6 of the substrate 5 without the solder balls 4b and 4c being crushed due to the deformation of the elastic material 3, and as shown in FIG. However, accurate and reliable ball mounting can be performed.

In the above, the solder ball mounting on a substrate having a convex warp has been described. However, a substrate having a concave warp as shown in FIGS. Similarly, accurate solder ball mounting can be performed on a substrate having the same. Further, since the solder balls can be pressed and mounted even on a substrate having no warp, accurate and reliable mounting of the solder balls can be performed.

Next, another embodiment of the present invention will be described.

FIG. 9 is a sectional view showing the structure of another embodiment of the present invention.

In the above-described embodiment, the elastic material 3 is attached to the tip of the ball suction jig. However, in another embodiment described here, the elastic material 3 is attached to the outside of the ball suction jig of the apparatus. And is in contact with the ball suction jig 2. Therefore, by lowering the elastic material fixing portion 8 to separate the elastic material 3 from the ball suction jig 2,
The ball mounting can be performed by separating the solder ball from the ball mounting jig. Further, a hole is provided in the elastic material 3 at the same position as the suction hole of the ball suction jig 2 so that the solder ball can be sucked by vacuum suction from the device.

Next, a ball mounting method using another embodiment of the present invention will be described.

In FIG. 10, the elastic material 3 is attached to the apparatus outside the ball suction jig 2 using the elastic material fixing portion 8, and the elastic material 3 is located at a position in contact with the ball suction surface of the ball suction jig. Be placed. The solder balls 4 are sucked to the elastic material 3 by vacuum suction from the device through the suction holes of the ball suction jig 2. Further, under the ball suction jig, the ball mounting jig is arranged so that the substrate 5 is fixed on the stage 7 of the apparatus by suction or the like, and the solder ball 4 is located just above the pad 6 of the substrate 5. Is done. Here, it is desirable to supply an adhesive material such as a flux or a solder paste to the pads 6 of the substrate 5 in order to securely mount the solder balls (not shown).

Next, as shown in FIG. 11, when the entire ball suction jig is lowered, the solder balls 4
It contacts the upper pad 6. At this time, if the substrate 5 is warped as shown in FIG.
a and 4d are separated from each other without contacting the pads 6 of the substrate 5.

Here, when the solder balls 4a, 4d are less separated from the pad 6, the elastic material fixing portion 8 is lowered to move the elastic material 3 from the ball suction jig 2 as shown in FIG. Separate the solder balls 4a, 4d into the pad 6
And solder balls can be mounted accurately and reliably.

The solder balls 4a and 4d are
In the case shown in FIG. 12, when the solder ball is relatively far away from the pad 6 (when the warpage of the substrate is large), the solder ball may fall from a position far from the pad 6 to cause a positional shift. By lowering the entire ball mounting jig in the same manner as in the embodiment shown in FIG. 1, the solder ball 4 can be pressed against the pad 6 and mounted. At that time, since the elastic material 3 is deformed,
The solder balls 4 do not collapse or cut into the suction holes.

As described above, in other embodiments, it is possible to mount a solder ball accurately on a warped substrate without displacement.

Further, the other embodiment has an advantage that the elastic material is not fixed to the ball suction jig, so that the replacement when the elastic material is deteriorated can be easily performed.

Here, the pattern for mounting the solder balls will be described.
In a regular pattern such as a grid pattern shown in FIG. 15 or a peripheral pattern shown in FIG. However, an irregular pattern as shown in FIG. 16 may be used. Also, a ball suction jig 2
Silicone on the side of the bottom of the
An elastic material 3 made of an elastic material such as rubber is arranged. The elastic material 3 has a ball suction hole formed so as to be connected to and connected to a solder ball suction hole formed in the ball suction jig 2. The vacuum suction by the device is performed by the head portion 1 of the device, the ball suction jig 2,
By performing the process through the elastic material 3, the solder balls can be attracted to the elastic material 3. In the present invention, since the structure in which the solder balls are adsorbed by the elastic material 3, even when sufficient pressure is applied to absorb the warpage of the substrate when the solder balls are mounted on the substrate or the pads of the semiconductor package, Due to the deformation of the elastic material, the solder balls do not bite into the suction holes, so that a ball mounting defect does not occur.

The case where a solder ball is mounted on a substrate or the like has been described above. However, it goes without saying that the ball mounting jig of the present invention can be applied to any ball other than solder, such as gold, silver, and copper.

[0042]

According to the present invention, by attaching an elastic material to the tip of the ball suction jig, the elastic material is deformed and absorbs the force even when the solder ball is pressed against the pad of the substrate and pressurized. Therefore, the solder balls can be accurately and reliably mounted on the substrate without biting into the solder balls or deforming the solder balls. Therefore, there is an effect that solder balls can be accurately and reliably mounted on a warped substrate.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a configuration of an embodiment of the present invention.

FIG. 2 is a sectional view showing an operation (before pressurization) of the embodiment of the present invention.

FIG. 3 is a sectional view showing the operation (after pressurization) of the embodiment of the present invention.

FIG. 4 is a cross-sectional view showing an operation (after completion of pressurization) of the embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a solder ball mounted using the embodiment of the present invention.

FIG. 6 is a cross-sectional view showing the operation of the embodiment of the present invention (before pressing when the substrate is warped in reverse).

FIG. 7 is a cross-sectional view showing the operation of the embodiment of the present invention (after pressurization when the substrate is warped in reverse).

FIG. 8 is a cross-sectional view showing a solder ball (when the substrate is warped upside down) mounted using the embodiment of the present invention.

FIG. 9 is a sectional view showing the configuration of another embodiment of the present invention.

FIG. 10 is a sectional view showing the operation (before pressurization) of another embodiment of the present invention.

FIG. 11 is a sectional view showing an operation (during pressurization) of another embodiment of the present invention.

FIG. 12 is a sectional view showing the operation (after pressurization) of another embodiment of the present invention.

FIG. 13 is a cross-sectional view showing an operation (after completion of pressurization) of another embodiment of the present invention.

FIG. 14 is a cross-sectional view illustrating an example of a ball mounting pattern (lattice pattern) according to the embodiment of the present invention.

FIG. 15 is a schematic diagram showing an example of a ball mounting pattern (regular pattern) in the example of the present invention.

FIG. 16 is a schematic diagram showing an example of a ball mounting pattern (irregular pattern) in the example of the present invention.

FIG. 17 is a sectional view showing a conventional example.

FIG. 18 is a sectional view showing another conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Head part 2 Ball suction jig 3 Elastic material 4a, 4b, 4c, 4d Solder ball 5 Substrate 6 Pad 7 Stage 8 Elastic material fixing part 9 Ball suction part 10 Ball pushing pin

Claims (6)

[Claims] 1. A ball mounting jig for mounting a solder ball on a substrate or the like, comprising a resilient material attached to a surface on which the solder ball is adsorbed. A ball mounting jig capable of absorbing the warpage by the deformation of the ball and accurately and reliably mounting the solder ball without dropping the ball. 2. A ball mounting jig for mounting a solder ball on a substrate or the like, comprising: an elastic material attached to the outside of the jig so as to contact a surface on which the solder ball is adsorbed; A ball mounting jig that absorbs warpage due to deformation of the elastic material and can accurately and surely mount the solder ball without chipping. 3. The method according to claim 2, wherein the elastic material has a hole having substantially the same diameter as a suction hole provided on a surface for suctioning the solder ball for vacuum suction of the solder ball.
The ball mounting jig according to claim 1. 4. The ball mounting jig according to claim 1, wherein said elastic material is replaceable. 5. A ball mounting method for mounting a solder ball on a substrate or the like, comprising: attaching an elastic material to a surface on which the solder ball is adsorbed;
A ball mounting method, wherein even if the substrate or the like has a warp, the warp is absorbed by the deformation of the elastic material, and the solder ball can be mounted accurately and reliably without chipping the ball. 6. A ball mounting method for mounting a solder ball on a substrate or the like, wherein an elastic material is attached to the outside of the jig so as to make contact with a surface on which the solder ball is adsorbed, and the substrate or the like is warped. A ball mounting method for absorbing the warpage due to the deformation of the elastic material so that the solder ball can be mounted accurately and reliably without chipping.