JP5198499B2 - Wiring board non-contact transfer device and wiring board manufacturing method - Google Patents

Description

  The present invention relates to a non-contact conveyance device for a wiring substrate that conveys a wiring substrate that is an object to be conveyed using the action of an air current, and a method for manufacturing a wiring substrate using the non-contact conveyance device.

  Conventionally, a wiring board is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board is transported to a line for performing the next process every time the manufacturing process is completed. As a conventional transport method, a method has been proposed in which the surface of the wiring board is sucked with a negative pressure on the lower surface of the suction head having an air suction hole and the wiring board is transported together with the suction head in this state. Yes. However, when the wiring board is transported by the suction head, there is a problem that foreign matter (dust) generated by dirt or wear of the suction head adheres to the wiring board.

  In view of this, there has been proposed a transfer device that reduces the adhesion of foreign matter to the wiring board by transferring the object to be transferred such as the wiring board while sucking in a non-contact state (see, for example, Patent Document 1). Such a transport apparatus includes a transport head, a gas supply hole that opens at the front end surface (suction surface) of the transport head, and a nozzle that is attached to the transport head and has a disk portion. Then, when the suction surface of the transport head is brought close to the wiring board and the air supplied from the gas supply hole is led out to the outside through a slit formed between the suction surface and the disk portion, the air is transferred to the transport head. Radiated outwards. As a result, the space between the nozzle and the wiring board becomes negative pressure, and the wiring board is sucked and held by the transport head. In this state, if the transfer head is transferred using a robot arm or the like, the wiring board can be transferred in a non-contact state.

  However, when air flows through the transport head, static electricity is generated due to friction between the air and the transport head, and the transport head is charged. Further, since a part of the released air collides with the wiring board, static electricity is generated due to friction between the air and the wiring board, and the wiring board is also charged. At this time, foreign matters floating around the surface of the wiring board are likely to adhere to the surface of the wiring board. Once attached, it is difficult to remove the foreign matters. Further, in the above-described inspection process performed after the wiring board is transported, the wiring board is inspected for continuity by bringing an inspection jig such as a probe into contact with the solder bump on the surface of the wiring board. Therefore, if a continuity test is performed with foreign matter adhering to the surface of the solder bumps, foreign matter that does not conduct will be caught between the probe and the solder bumps. There is a possibility that it is determined to be a good product.

  Therefore, by blowing ion air from the ion air blowing hole toward the main surface of the wiring board, the foreign matter on the main surface of the wiring board is blown away with ion air and the static electricity charged on the wiring board is neutralized (static elimination). Technology has been proposed. There has also been proposed a technique in which two air blowing holes are provided at positions different from the ion air blowing holes, and the ion air is diffused over the entire main surface of the substrate by the air blown from each air blowing hole. According to the above configuration, it becomes difficult to determine that the wiring board is defective due to the adhesion of foreign matter in the continuity test, so that the yield of the wiring board is improved.

Japanese Patent Laying-Open No. 2005-219922 (FIGS. 1 to 5 etc.)

  However, even if ion air is released to the periphery of the wiring board, when the charged transport head approaches the wiring board, ions contained in the ion air flow to the transport head side. As a result, ions do not reach the wiring board, which causes a problem that static electricity charged on the wiring board cannot be neutralized. Further, only two air blowing holes are provided, and most of the air blown out from each air blowing hole flows in the direction in which the air blowing holes are opened. As a result, most of the ion air diffuses in the vicinity of the air blowing holes and does not diffuse over the entire main surface of the substrate, making it difficult to uniformly remove foreign substances or remove static electricity.

  The present invention has been made in view of the above-mentioned problems, and a first object thereof is wiring capable of reliably and uniformly removing foreign substances and removing static electricity by diffusing ion air over the entire main surface of the substrate. An object of the present invention is to provide a non-contact transfer device for a substrate. A second object is to provide a suitable method for manufacturing a wiring board using the non-contact transfer device.

  And as a means (means 1) for solving the above-mentioned problem, it comprises a suction part provided with a plurality of air blowing holes which are provided with a recess on the suction surface and open on the inner peripheral surface of the recess, Non-contact transport that transports the substrate main surface of the circuit board that is the object to be transported while being sucked and held by the suction surface by the negative pressure generated by the air ejected from the plurality of air blowing holes along the inner peripheral surface of the recess. In the apparatus, an ion air blowing hole for blowing ion air to the main surface of the substrate is provided in a central portion of the concave portion, and the plurality of air blowing holes are on a virtual circle set concentrically with the central axis of the concave portion. Three or more are provided so as to surround the ion air blowing hole, and are arranged at equiangular intervals with respect to the central axis of the recess, and are opposed to the tangent line of the virtual circle that touches at the position of the air blowing hole. It is open Te in a state inclined by the same angle is non-contact transport apparatus of the wiring board characterized by.

  Therefore, according to the non-contact conveyance device of the means 1, three or more air blowing holes are provided so as to surround the ion air blowing holes, and are arranged at equiangular intervals with respect to the central axis of the recess. It opens in the state which inclined only the same angle with respect to the tangent of the virtual circle which touches in the position of a blowing hole. That is, in the said means 1, the air blowing hole opened in the same direction is arrange | positioned equally. For this reason, even if the air ejected from each air blowing hole flows in the direction in which the air blowing hole opens and the ion air is diffused in the vicinity of each air blowing hole by the air ejected from the air blowing hole, Spreads reliably over the entire surface. Therefore, it is possible to reliably and uniformly perform the removal of foreign matters on the substrate main surface using ion air and the charge removal of the wiring board using ion air. Therefore, for example, in the continuity inspection after the conveyance, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board can be improved.

  Moreover, since the flow rate of the air ejected from each air blowing hole can be increased by providing three or more air blowing holes, the wiring is more than the conventional structure in which only two air blowing holes are provided. The force for sucking the substrate is increased. In addition, since the air flow is stabilized as a result of providing three or more air blowing holes, the wiring board can be prevented from rotating during suction.

  The “wiring board” includes not only a single product wiring board but also a multi-cavity wiring board in which a plurality of substrate forming regions to be wiring boards are arranged along the plane direction. Examples of the material for forming the wiring board include inorganic materials such as ceramics, metals, and semiconductors, and organic materials such as resins. These materials are considered in consideration of cost, workability, insulation, mechanical strength, and the like. It can be suitably selected from the inside. Preferable examples of the ceramic material include low-temperature fired materials such as alumina, glass ceramic, and crystallized glass, aluminum nitride, silicon carbide, and silicon nitride. Suitable examples of the metal material include copper, a copper alloy, and an iron nickel alloy. A preferred example of the semiconductor material is silicon. Preferred examples of the resin material include polyimide resin, epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, and the like. In addition, composite materials of these resins and glass fibers (glass woven fabric or glass nonwoven fabric) or organic fibers such as polyamide fibers may be used. Alternatively, a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. In particular, from the viewpoint of cost reduction, it is preferable to select an organic material such as a resin material as a wiring board forming material. With such a wiring board, a fine conductor layer can be formed relatively easily and accurately.

  The wiring board forming material is preferably an organic material such as a resin material. In particular, the wiring board is a resin wiring board having an electrode forming area in which a plurality of protruding electrodes are arranged on the main surface of the board. Preferably there is. The reason for this is that when the wiring board is to be transported in a contact state, there is a problem that the protruding electrode formed on the main surface of the wiring board is crushed by the suction portion and deformed. This is because the significance of adopting the non-contact conveyance device of the above means occurs. Further, since the resin wiring board has a problem that static electricity is likely to be accumulated and foreign matters are likely to adhere to it, it is significant to adopt the above means for solving this problem.

  Although the number of air blowing holes is 3 or more, it is particularly preferably 3 or more and 10 or less. If the suction part has more than 10 air blowing holes, it is difficult to open all the air blowing holes on the inner peripheral surface of the recess. There is also a problem that the processing cost of the suction part becomes high. Further, if the number of air blowing holes is an even number, the air blowing holes can be easily arranged at equal angular intervals with the central axis of the recess as a reference, so that the suction part can be easily designed.

  Here, for example, the plurality of air blowing holes are preferably opened in a state of being inclined by 15 ° or more and 45 ° or less to the center side of the recess with respect to the tangent. If the angle at which the air blowing hole inclines toward the center of the recess with respect to the tangential line is less than 15 °, it becomes difficult to bring the air blown out from the air blowing hole into contact with the ion air. There is a possibility that it cannot be diffused. On the other hand, if the angle at which the air blowing hole inclines toward the center of the recess with respect to the tangential line is greater than 45 °, the flow of ion air is disturbed when the air blown from the ion air collides with the ion air. Foreign matter on the main surface cannot be reliably removed.

  Moreover, it is preferable that several air blowing holes are opened in the state which inclined only -20 degrees or more and 20 degrees or less to the outer side of the recessed part with respect to the suction surface, for example. If the angle at which the air blowing hole inclines to the outside of the recess with respect to the suction surface is smaller than −20 °, the distance between the suction surface and the main surface of the substrate becomes small when the wiring board is sucked and held on the suction surface. Therefore, the flow velocity of the air ejected from the air blowing hole becomes too high. As a result, static electricity is likely to be generated due to friction between air and the wiring board, and the wiring board is likely to be charged. On the other hand, if the angle at which the air blowing hole is inclined to the outside of the recess with respect to the suction surface is greater than 20 °, the distance between the suction surface and the substrate main surface becomes too large when the wiring board is sucked and held on the suction surface. End up. As a result, since the flow velocity of the air blown out from the air blowing hole becomes too low, it becomes difficult for the air to diffuse ion air over the entire substrate main surface.

  Furthermore, the inner diameter of the plurality of air blowing holes is not particularly limited. For example, the inner diameter may be set to 0.5 mm or more and 2.0 mm or less. If the inner diameter is less than 0.5 mm, the amount of air passing through the air blowing hole is reduced, so that there is a possibility that the ion air cannot be sufficiently diffused by the air blown out from the air blowing hole. On the other hand, if the inner diameter is larger than 2.0 mm, the flow velocity of the air passing through the air blowing hole becomes too low. In this case as well, there is a possibility that the ion air cannot be sufficiently diffused by the air blown out from the air blowing hole. There is.

  Moreover, the shape of the ion air blowing hole is not particularly limited. For example, the central axis of the ion air blowing hole is preferably arranged perpendicular to the substrate main surface of the wiring board. In this way, air can be blown vertically from the ion air blowing hole toward the main surface of the substrate. As a result, since the momentum of air colliding with the substrate main surface is stronger than when air is blown obliquely toward the substrate main surface, the foreign matter on the substrate main surface can be more reliably removed.

  Note that the suction unit has, for example, an air flow path for supplying air to the plurality of air blowing holes and an ion air flow path for supplying ion air to the ion air blowing holes, respectively. The structure of the ion air channel is not particularly limited, but for example, the ion air channel is preferably a linear channel extending along the central axis of the ion air outlet hole. If the ion air flow path is bent in a complicated manner, the resistance of the ion air flowing through the ion air flow path increases, and the internal pressure of the ion air flow path increases. As a result, ions are saturated in the ion air flow path, and accordingly, the release of ions from the ionizer is stopped.

  In addition, when the suction part has an air channel and an ion air channel separately, it is usually considered to arrange the air channel on the side of the ion air channel. However, if the flow area of the ion air flow path is increased in order to increase the flow rate of ion air, the proportion of the air flow path occupying the suction portion decreases accordingly, so the flow area of the air flow path is reduced and the air flow is reduced. The flow rate of air flowing through the road will decrease. In order to solve this problem, it is conceivable to increase the flow area of the air flow path, but this leads to an increase in the size of the suction part. Therefore, the air flow path has, for example, an introduction flow path that extends from the outer peripheral surface of the suction portion to the ion air blowing hole side, an annular shape that surrounds the ion air flow path and extends along the central axis of the ion air flow path, It is preferable that an end portion communicates with the introduction passage and an annular passage communicates with the plurality of air blowing holes at the downstream end portion. In this way, since the annular flow path constituting the air flow path surrounds the ion air flow path, the suction part can be downsized compared to the case where the air flow path is arranged on the side of the ion air flow path. it can. Moreover, since a part of the air flow path becomes an annular flow path, the flow area of the air flow path can be secured, and the flow rate of the air flowing through the air flow path can be increased.

  Further, as another means (means 2) for solving the above problem, the non-contact transfer device described in the above means 1 is used to suck the substrate main surface of the wiring board that is the transferred object to the suction surface. In the method of manufacturing a wiring board by holding and transporting, ion air is blown from the ion air blowing holes toward the main surface of the board, and blown out from the plurality of air blowing holes along the inner peripheral surface of the recess. There is a method of manufacturing a wiring board, wherein foreign substances on the main surface of the substrate are removed by diffusing the ion air blown from the ion air blowing holes to the entire main surface of the substrate by the air that has been performed.

  Therefore, according to the manufacturing method of the means 2, the wiring board can be manufactured by reliably and uniformly removing the foreign matter and removing the charge of the wiring board using the non-contact transfer device of the means 1. Therefore, for example, in the continuity inspection after the conveyance, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board can be improved.

The front view which shows schematic structure of the non-contact conveying apparatus in this embodiment. Sectional drawing which shows schematic structure of a wiring board. The bottom view which shows schematic structure of a non-contact conveying apparatus. The bottom view which shows a suction part. AA line sectional view of Drawing 4. The bottom view which shows the positional relationship of an air blowing hole. The principal part sectional view showing a suction part. The circuit diagram which shows a non-contact conveying apparatus. The front view which shows the resin-made pads in other embodiment. The side view which shows resin-made pads and a lower side member.

  Hereinafter, an embodiment embodying the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the transport head 11 provided in the non-contact transport device transports a wiring board 110 that is a transported object by using the action of an air current.

  As shown in FIG. 2, the wiring board 110 of this embodiment is an organic package (resin wiring board) for mounting an IC chip, and shows a state after a plurality of manufacturing steps and before an inspection step. Yes. The wiring substrate 110 includes a substantially rectangular plate-shaped core substrate 111, a first buildup layer 114 formed on a core main surface 112 (upper surface in FIG. 2) of the core substrate 111, and a core back surface 113 ( The second buildup layer 115 is formed on the lower surface in FIG. The build-up layers 114 and 115 have a structure in which a resin insulating layer made of a thermosetting resin (epoxy resin) and a conductor layer made of copper are alternately laminated. In addition, terminal pads 116 (projection electrodes) are formed in an array at a plurality of locations on the substrate main surface 120 (on the upper surface of the first buildup layer 114) of the wiring substrate 110, and on the substrate back surface 121 of the wiring substrate 110. BGA pads 117 are formed in an array at a plurality of locations (on the lower surface of the second buildup layer 115). Further, a plurality of solder bumps 118 (protruding electrodes) are disposed on the surface of the terminal pad 116. Each solder bump 118 is connected to a terminal of an IC chip having a rectangular flat plate shape. Note that an area formed by each terminal pad 116 and each solder bump 118 is an electrode forming area 119 on which an IC chip can be mounted.

  The transfer head 11 shown in FIGS. 1 and 3 is attached to the tip of an arm of a transfer articulated robot (not shown). The transport head 11 includes a slide table 2 and a suction unit 20 attached to the slide table 2 via a connection plate 12 having an L shape when viewed from the front. The slide table 2 is attached to a table body 3 extending along the vertical direction, and can move up and down. The suction unit 20 approaches and separates from the wiring board 110 with the suction surface 21 facing the wiring board 110.

  In addition, the transport head 11 includes an air chuck 181 that holds and fixes the wiring board 110 so that the circuit board 110 cannot be displaced. The air chuck 181 is connected to the chuck main body 183, a pair of arm portions 182 that are fixed to the chuck main body 183 at the base end portion and extend away from the suction portion 20, and a distal end portion of the arm portion 182. And a pair of contact portions 184 facing each other. The chuck main body 183 drives both the arm portions 182 to bring the both contact portions 184 closer to and away from each other. Further, both contact parts 184 are formed of a resin (PEEK resin in the present embodiment) having a hardness higher than that of the wiring board 110, and have engaging recesses 185 on the inner side. Both engaging recesses 185 are configured to hold two corners located on opposite sides of the four corners constituting the wiring board 110 when the substrate holding and fixing the slide table 2 is lowered.

  As shown in FIGS. 4 and 5, the suction unit 20 includes a suction unit body 22, a nozzle support 51, and a resin pad 40. The suction part main body 22 is formed of a metal material (in this embodiment, an aluminum alloy containing platinum), and has a substantially rectangular parallelepiped shape of 50 mm long × 50 mm wide × 67 mm high. The suction part main body 22 includes an upper member 201 that constitutes the upper part of the suction part main body 22 and a lower member 211 that constitutes the lower part of the suction part main body 22, and the members 201 and 211 can be divided from each other. It has become. The upper member 201 is formed of a block material having a substantially rectangular parallelepiped shape of 50 mm long × 50 mm wide × 22 mm high.

  A first port mounting hole 30 that opens at the upper surface 202 of the upper member 201 is provided at the center of the upper member 201. A first port 90 is attached to the first port attachment hole 30. The first port 90 is made of a conductive metal, and an antistatic tube (not shown) made of a material obtained by mixing carbon black into polyurethane is connected to the first port 90. A nozzle 61 protrudes from the center of the lower surface 203 of the upper member 201. Further, a pair of screw insertion holes 34 that open on the upper surface 202 is provided in the outer region of the first port mounting hole 30 in the upper member 201. The suction unit 20 is attached to the transport head 11 by screwing a screw (not shown) penetrating the connection plate 12 of the transport head 11 into the screw insertion hole 34. Further, the upper member 201 has an upper pin accommodation hole 35 that opens at the lower surface 203 of the upper member 201, and an upper pin accommodation hole 35 that opens at the side surface (the outer peripheral surface 25 of the suction portion 20) of the upper member 201. And an engaging pin hole 36 communicating with each other. A member connection connector 37 is attached to the side surface of the upper member 201. The member connection connector 37 includes an engagement pin 38, and the distal end portion of the engagement pin 38 is inserted into the engagement pin hole 36. The engagement pin 38 is urged toward the upper pin accommodation hole 35 by a spring 39.

  As shown in FIGS. 4 and 5, the lower member 211 is formed of a block material having a substantially rectangular parallelepiped shape of 50 mm long × 50 mm wide × 45 mm high. The lower member 211 is provided with a second port mounting hole 31, a third port mounting hole 32, and a fourth port mounting hole 33 that open on the side surface (the outer peripheral surface 25 of the suction portion 20) of the lower member 211. Yes. A second port 91 is attached to the second port attachment hole 31, and a third port 92 is attached to the third port attachment hole 32. Further, a fourth port 93 is attached to the fourth port attachment hole 33. Each port 91 to 93 is made of a conductive metal, and an antistatic tube is connected to each port 91 to 93.

  Further, a first nozzle insertion hole 26 that penetrates the upper surface 23 and the lower surface 24 of the lower member 211 is provided at the center of the lower member 211. The upper end 23 side end portion of the first nozzle insertion hole 26 is a screw hole, and the lower end 24 side end portion of the first nozzle insertion hole 26 is a recess that becomes an annular flow path 223 of an air flow path 221 described later. It has become. Furthermore, in the outer region of the first nozzle insertion hole 26 in the lower member 211, there are a lower pin accommodation hole 28 that opens on the upper surface 23 of the lower member 211, and a side surface of the lower member 211 (the outer periphery of the suction portion 20). An air vent hole 29 that opens at the surface 25) and communicates with the lower pin accommodating hole 28 is provided. Therefore, the distal end portion of the pin 19 is inserted into the upper pin accommodation hole 35 on the upper member 201 side, and the proximal end portion of the pin 19 is inserted into the lower pin accommodation hole 28 and is provided at the distal end portion of the pin 19. The members 201 and 211 are fixed to each other by engaging the tip of the engaging pin 38 with the constricted portion 18.

  As shown in FIG. 5, the lower member 211 is provided with 16 dust collection channels 191 that open at the lower surface 24. Each dust collection channel 191 is disposed in an outer region of the first nozzle insertion hole 26 in the lower member 211. Each dust collection channel 191 communicates with the third port mounting hole 32 and is connected to the dust collection unit 151 (see FIG. 8). The lower member 211 is provided with four adsorption channels 195 that open at the lower surface 24. Each adsorption channel 195 is disposed in the outer region of the first nozzle insertion hole 26 and each dust collection channel 191 in the lower member 211. The adsorption channel 195 communicates with the fourth port mounting hole 33 and is connected to the adsorption unit 161 (see FIG. 8).

  The nozzle support 51 is housed in the first nozzle insertion hole 26 of the lower member 211, and the upper end portion is screwed to the upper surface 23 side end of the first nozzle insertion hole 26. The nozzle support 51 is formed of a metal material (aluminum in the present embodiment) and has a substantially annular shape with an outer diameter of 11 mm and a height of 42 mm. The nozzle support 51 is provided with a second nozzle insertion hole 55 having an inner diameter of 3.5 mm. The second nozzle insertion hole 55 passes through the upper surface 52 and the lower surface 53 (see FIG. 7) of the nozzle support 51.

  As shown in FIGS. 4 to 7, the nozzle 61 is inserted into the second nozzle insertion hole 55 and has a substantially annular shape with an outer diameter of 7 mm and a height of 42 mm. Inside the nozzle 61, an ion air passage 71 having an inner diameter of 2.5 mm for supplying ion air is provided. The ion air channel 71 is opened at the lower end surface 62 of the nozzle 61 that constitutes a part of the suction surface 21. Further, the ion air flow channel 71 communicates with the first port mounting hole 30 and is connected to the ionizer 141 (see FIG. 8). Furthermore, the lower end surface 62 (suction surface 21 of the suction part 20) of the nozzle 61 is provided with a concave part 73 having a circular shape when viewed from below. Further, at the center of the recess 73, a nozzle tip portion 75 having a substantially trapezoidal cross section and a circular shape when viewed from below is projected.

  Further, ion air blowing holes 82 communicating with the ion air flow channel 71 are provided at six locations in the center of the recess 73. Specifically, the ion air blowing holes 82 are arranged at equiangular (60 °) intervals with respect to the central axis C <b> 1 of the recess 73, and open at the outer peripheral portion of the nozzle tip 75. Each ion air blowing hole 82 is arranged such that the central axis is perpendicular to the substrate main surface 120 of the wiring board 110, and the ion air supplied from the ion air flow channel 71 is perpendicular to the substrate main surface 120. It comes to spray. That is, the ion air channel 71 is a linear channel extending along the central axis of the ion air outlet hole 82.

  As shown in FIGS. 5 and 7, the lower member 211 is provided with an air flow path 221 for supplying air separately from the ion air flow path 71. The air flow path 221 includes an introduction flow path 222 and an annular flow path 223. The introduction flow path 222 extends from the outer peripheral surface 25 of the suction part 20 to the ion air blowing hole 82 side. The introduction flow path 222 communicates with the second port 91 and is connected to the air unit 231 (see FIG. 8). The annular channel 223 is a channel formed between the first nozzle insertion hole 26 and the nozzle support 51, and surrounds the ion air channel 71 and extends along the central axis of the ion air channel 71. I am doing. The annular flow path 223 communicates with the introduction flow path 222 at the upstream end.

  As shown in FIGS. 4 to 7, the suction portion 20 communicates with the downstream end of the annular flow path 223 and has six air blowing holes 81 opened on the inner peripheral surface of the recess 73. Is provided. Each air blowing hole 81 is configured to eject the air supplied from the air flow path 221 into the recess 73. Then, the air blown out from each air blowing hole 81 is guided along the circumferential direction of the recess 73 and collides with the ion air blown from the ion air blowing hole 82 toward the substrate main surface 120, thereby causing the ion air to flow. The entire main surface 120 of the substrate is diffused. Note that the suction unit 20 of the present embodiment is a Bernoulli chuck that holds the wiring board 110 by using the Bernoulli effect generated by the air flow generated between the suction part main body 22 and the wiring board 110.

  As shown in FIG. 6, each air blowing hole 81 is arranged so as to be rotationally symmetric with respect to the central axis C <b> 1 of the recess 73, and opens along the circumferential direction of the recess 73. Yes. More specifically, each air blowing hole 81 is provided so as to surround each ion air blowing hole 82 on a virtual circle C2 set concentrically with the central axis C1. Further, the air blowing holes 81 are arranged at equiangular (60 °) intervals with respect to the central axis C1. Furthermore, each air blowing hole 81 is inclined by the same angle θ1 (30 ° in the present embodiment) to the center side of the recess 73 with respect to the tangent L1 of the virtual circle C2 that is in contact with the position of the air blowing hole 81. It is open. In addition, each air blowing hole 81 is opened in a state where it is not inclined to the outside of the recess 73 with respect to the suction surface 21. That is, each air blowing hole 81 opens in parallel to the suction surface 21. Further, the air blowing hole 81 opens toward the adjacent air blowing hole 81. In addition, the internal diameter of each air blowing hole 81 is set to 1.2 mm.

  As shown in FIG. 4, the resin pad 40 is attached to the lower member 211, and the front surface (lower surface) is the suction surface 21. The resin pad 40 is made of a resin material (ether urethane in this embodiment), and has a substantially rectangular plate shape with a length of 37 mm × width of 37 mm × height of 2.0 mm. Further, a through hole 41 having a diameter of 16 mm is provided at the center of the resin pad 40. The through-hole 41 is configured to expose the concave portion 73 and the like of the suction unit main body 22. Further, the resin pad 40 is provided with 16 dust collecting holes 42 communicating with the dust collecting flow path 191. Each dust collection hole 42 is disposed so as to open in the outer region of the through hole 41 and the recess 73, and is arranged at equal intervals along the outer peripheral edge (four sides) of the resin pad 40 so as to surround the recess 73. Has been.

  As shown in FIG. 4, convex portions 44 that protrude 1.0 mm from the suction surface 21 are formed at the outermost peripheral portion of the suction surface 21, that is, at the four corners of the resin pad 40. Further, four vacuum suction holes 45 are arranged in the resin pad 40 so as to open at the respective convex portions 44. That is, each vacuum suction hole 45 is disposed so as to open in the outer region of the through hole 41 and the recess 73. Each vacuum suction hole 45 communicates with the suction flow path 195 of the lower member 211 (see FIG. 5).

  An electrostatic potential sensor 105 (see FIG. 8) is installed at the contact portion 184 of the air chuck 181. The electrostatic potential sensor 105 is embedded in the contact portion 184 and is disposed so as to be exposed from the engagement recess 185 of the contact portion 184. That is, the electrostatic potential sensor 105 is provided at a position in contact with the outer peripheral edge of the wiring board 110. The electrostatic potential sensor 105 measures static electricity charged on the wiring board 110 and outputs a static electricity measurement signal.

  Next, the system configuration of the non-contact conveyance device will be described.

  As shown in FIG. 8, the non-contact conveyance device includes an air supply source 131 that sends out pressurized air. In addition, the non-contact conveyance device includes an air supply channel 130 that can communicate between the air supply source 131 and the suction unit 20. The air supply channel 130 is branched into a first air channel 140, a second air channel 150, and a third air channel 160 on the downstream side. The first air flow path 140 communicates with the ion air flow path 71 of the suction unit 20 via the antistatic tube and the first port 90 (see P3 in FIGS. 5 and 8). The second air flow path 150 communicates with the air flow path 221 of the suction unit 20 via the antistatic tube and the second port 91 (see P2 in FIGS. 5 and 8). The third air flow path 160 communicates with the suction flow path 195 of the suction unit 20 via the antistatic tube and the fourth port 93 (see P1 in FIGS. 5 and 8).

  As shown in FIG. 8, an air supply valve 132 is installed on the air supply channel 130. The air supply valve 132 is disposed on the downstream side of the air supply source 131, and switches the air supply flow path 130 between an open state and a closed state. The air supply valve 132 is configured to be able to supply air to the downstream side when switched to the open state. Note that the air supply valve 132 of the present embodiment is an electromagnetic valve that is operated by a solenoid (not shown).

  An air pressure adjusting unit 133 that adjusts the air pressure in the air supply channel 130 to a constant value is installed on the air supply channel 130. That is, the air pressure adjustment unit 133 is connected to the air supply valve 132 and the air supply source 131 through the air supply flow path 130 in a flow path. The air pressure adjustment unit 133 includes an air filter 134, a pressure gauge 135, and a pressure reducing valve 136. The air filter 134 is disposed on the downstream side of the air supply valve 132, and removes foreign matters contained in the air passing through the air supply flow path 130. The pressure gauge 135 is disposed downstream of the air filter 134 and measures the pressure of air passing through the air supply flow path 130. Further, the pressure reducing valve 136 is disposed on the downstream side of the pressure gauge 135, performs pressure reduction of the air passing through the air supply flow path 130, and supplies the reduced air to the downstream side. An air filter 137 is installed on the air supply channel 130. The air filter 137 is disposed on the downstream side of the pressure reducing valve 136 and removes moisture contained in the air passing through the air supply flow path 130.

  As shown in FIG. 8, an ion air unit 147 is installed on the first air flow path 140. The ion air unit 147 includes a pressure reducing valve 145, a pressure gauge 146, an electromagnetic valve 143, an air filter 144, and an ionizer 141. The pressure reducing valve 145 is disposed on the downstream side of the air filter 137, performs pressure reduction of the air passing through the first air flow path 140, and supplies the reduced air to the downstream side. The pressure gauge 146 is disposed on the downstream side of the pressure reducing valve 145 and measures the pressure of air passing through the first air flow path 140.

  Moreover, the electromagnetic valve 143 is arrange | positioned in the downstream of the pressure gauge 146, and switches the 1st air flow path 140 to an open state or a closed state. When the electromagnetic valve 143 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to reduce the air pressure. The electromagnetic valve 143 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101 described later. The air filter 144 is disposed on the downstream side of the electromagnetic valve 143, and removes foreign matters contained in ion air passing through the first air flow path 140.

  As shown in FIG. 8, the ionizer 141 is a DC ionizer, and is arranged on the downstream side of the air filter 144. The ionizer 141 applies an DC voltage to each discharge needle, an ionizer body 142 communicating with the first air flow path 140, two discharge needles (positive and negative discharge needles) protruding into the ionizer body 142. High-voltage power supply. Each discharge needle generates ions around the tip by performing corona discharge when a DC voltage is applied. More specifically, the positive electrode discharge needle generates positive ions when the polarity of the applied DC voltage is positive (+), and the negative electrode discharge needle has a negative (-) polarity of the applied DC voltage. In this case, anions are generated. The ionizer 141 generates ion air by mixing the generated ions with the air guided into the ionizer body 142. Further, the ionizer 141 discharges the generated ion air to the downstream side of the first air flow path 140. The ion air is guided to the ion air channel 71 of the suction unit 20 through the antistatic tube and the first port 90.

  As shown in FIG. 8, an air unit 231 is installed on the second air flow path 150. The air unit 231 includes an electromagnetic valve 232, a flow rate adjustment valve 233, and an air filter 234. The electromagnetic valve 232 is disposed on the downstream side of the air filter 137, and switches the second air flow path 150 to an open state or a closed state. When the electromagnetic valve 232 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The electromagnetic valve 232 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 233 is disposed in the middle of the flow path connecting the electromagnetic valve 232 and the air filter 234, and the air flowing through the second air flow path 150 is quantitatively exhausted so that the pressure of the air is constant. It is a throttle valve that adjusts the pressure to be reduced. The air filter 234 is disposed on the downstream side of the flow rate adjustment valve 233 and removes foreign matters contained in the air passing through the second air flow path 150.

  As shown in FIG. 8, an adsorption unit 161 is installed on the third air flow path 160. Further, the adsorption unit 161 branches into a substrate adsorption channel 158 and a vacuum break channel 159 communicating with the third air channel 160.

  A first electromagnetic valve 162 and an air filter 167 are installed on the substrate adsorption flow path 158. The first electromagnetic valve 162 is disposed on the downstream side of the air filter 137 and switches the substrate adsorption flow path 158 between an open state and a closed state. When the first solenoid valve 162 is switched to the open state, the air in the vicinity of the vacuum suction hole 45 of the suction unit 20 is evacuated through the suction flow path 195, the fourth port 93, the air filter 167, and the like. At the same time, air is appropriately sucked to adjust the air pressure. The first electromagnetic valve 162 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  As shown in FIG. 8, a second electromagnetic valve 168, a flow rate adjustment valve 169, and a pressure switch 170 are installed on the vacuum breaking channel 159. The second electromagnetic valve 168 is disposed on the downstream side of the air filter 137, and the vacuum break channel 159 is switched to an open state or a closed state. When the second electromagnetic valve 168 is switched to the open state, the second electromagnetic valve 168 supplies air to the connection flow path connecting the air filter 167 and the suction unit 20 to weaken the degree of vacuum of the connection flow path. . At the same time, when the second electromagnetic valve 168 is switched to the open state, the air flowing through the vacuum breaking flow path 159 is appropriately discharged to adjust the pressure reduction. Note that the second electromagnetic valve 168 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 169 is disposed in the middle of the flow path connecting the second electromagnetic valve 168 and the pressure switch 170, and the air flowing through the vacuum breaking flow path 159 is quantitatively exhausted to reduce the pressure of the air. This is a throttle valve that adjusts the pressure to a constant value. The pressure switch 170 is disposed on the downstream side of the flow rate adjustment valve 169 and the air filter 167. The pressure switch 170 is turned on when the pressure in the vacuum break channel 159 exceeds a predetermined value (that is, vacuum break), and outputs a vacuum break signal to the CPU 102 of the control device 101. It is supposed to be.

  As shown in FIG. 8, the non-contact transfer device includes a vacuum channel 153, and a dust collection unit 151 is installed on the vacuum channel 153. The vacuum channel 153 communicates with the dust collecting channel 191 of the suction unit 20 via the antistatic tube and the third port 92 (see P4 in FIGS. 5 and 8). The dust collection unit 151 includes an electromagnetic valve 152 and an air filter 157. The electromagnetic valve 152 switches the vacuum channel 153 to an open state or a closed state. When the solenoid valve 152 is switched to the open state, the solenoid valve 152 sucks air in the vicinity of the dust collection hole 42 of the suction unit 20 through the dust collection flow path 191, the third port 92, the air filter 157, and the like. The air pressure is adjusted by pressurizing air appropriately. The electromagnetic valve 152 of this embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  Next, the electrical configuration of the non-contact conveyance device will be described.

  As shown in FIG. 8, the non-contact conveyance device includes a control device 101 that controls the entire device. The control device 101 includes a CPU 102, a ROM 103, a RAM 104, an input / output circuit, and the like. The CPU 102 is electrically connected to the air supply valve 132, the ionizer 141, the electromagnetic valves 143, 152, 232, the first electromagnetic valve 162, and the second electromagnetic valve 168, and controls them by various driving signals.

  The CPU 102 is configured to receive an electrostatic measurement signal output from the electrostatic potential sensor 105. Then, the CPU 102 determines whether the wiring board 110 attracted by the suction unit 20 is charged positively (+) or negatively (−) based on the polarity of the electrostatic charge indicated by the electrostatic measurement signal. It is supposed to be. When it is determined that the wiring board 110 is positively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to perform control to generate negative ions on the discharge needle on the negative electrode side. It has become. On the other hand, when it is determined that the wiring board 110 is negatively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to generate positive ions in the positive discharge needle. It is like that. According to such control, static electricity charged on the wiring board 110 can be reliably neutralized.

  In this embodiment, although the DC ionizer 141 is used, an AC ionizer may be used instead. The AC type ionizer includes an ionizer body, one discharge needle protruding into the ionizer body, and a high-voltage power source that applies an AC voltage to the discharge needle. When an alternating voltage is applied, the discharge needle generates a cation or an anion according to the polarity of the applied alternating voltage. In this case, when the electrostatic measurement signal output from the electrostatic potential sensor 105 is input, the CPU 102 determines whether or not the wiring board 110 is charged based on the electrostatic charge amount indicated by the electrostatic measurement signal. When it is determined that the wiring board 110 is charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to increase the output of the ionizer 141. On the other hand, when it is determined that the wiring board 110 is not charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to weaken the output of the ionizer 141. Such control can reliably prevent the wiring board 110 from being charged. Further, it is possible to prevent the ionizer 141 from operating more than necessary.

  Next, a non-contact conveyance method for the wiring board 110 will be described.

  The wiring board 110 of the present embodiment is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board 110 is placed on a board support (not shown) every time the manufacturing process is completed. In this state, the wiring board 110 is transferred using a non-contact transfer device. More specifically, the transfer head 11 is lowered by driving the arm of the transfer articulated robot.

  In the subsequent air ejection process, the CPU 102 outputs drive signals to the air supply valve 132 and the electromagnetic valve 232 to switch the air supply valve 132 and the electromagnetic valve 232 to the open state. As a result, the pressurized air sent from the air supply source 131 passes through the air supply channel 130 and is guided to the second air channel 150. Then, the air guided to the second air flow path 150 flows into the suction unit 20 via the second port 91 (see P2 in FIGS. 5 and 8) and is guided to the air flow path 221.

  In the present embodiment, the air guided to the air flow path 221 passes through the air blowing hole 81 and is jetted from the air blowing hole 81 along the inner peripheral surface of the recess 73. As a result, most of the air ejected from the air blowing hole 81 flows in the direction in which the air blowing hole 81 opens and flows out of the recess 73, and then passes through the gap between the suction surface 21 and the substrate main surface 120. At this time, a high-speed flow is discharged to the outside of the suction unit 20. As a result, the space generated between the suction surface 21 and the substrate main surface 120 becomes negative pressure, and the substrate main surface 120 of the wiring substrate 110 is sucked and held by the suction surface 21 (see FIG. 1). A part of the air ejected from the air blowing hole 81 flows along the circumferential direction of the recess 73 to form a swirling flow.

  In the subsequent dust collection process, the CPU 102 outputs a drive signal to the electromagnetic valve 152 to switch the electromagnetic valve 152 to the open state. As a result, air in the vicinity of the dust collection hole 42 of the suction unit 20 is sucked through the dust collection flow path 191 and the third port 92 (see P4 in FIGS. 5 and 8). As a result, the foreign matter adhering on the board main surface 120 of the wiring board 110 is collected together with air.

  In the subsequent ion air ejection process, the CPU 102 outputs drive signals to the ionizer 141 and the electromagnetic valve 143. As a result, the electromagnetic valve 143 is switched to the open state and the ionizer 141 is activated. The pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and flows into the ionizer 141 on the first air flow path 140. The ionizer 141 generates ion air by mixing ions with the air introduced into the ionizer body 142. The ionizer 141 releases the generated ion air to the downstream side of the ionizer 141. Further, the ion air discharged from the ionizer 141 flows into the suction unit 20 through the first air flow path 140 and the first port 90 (see P3 in FIGS. 5 and 8), and is guided to the ion air flow path 71. .

  In the present embodiment, the ion air guided to the ion air flow path 71 is blown vertically from the ion air blowing hole 82 toward the substrate main surface 120 of the wiring substrate 110 to remove foreign matters on the substrate main surface 120. Further, the air blown out from the air blowing hole 81 collides with the ion air blown from the ion air blowing hole 82. As a result, ion air diffuses over the entire substrate main surface 120, so that foreign matter on the substrate main surface 120 is reliably removed by being blown away.

  In the subsequent positioning step, the arm of the transfer articulated robot is driven to raise the wiring board 110 together with the transfer head 11. Further, the suction table 20 is lowered by driving the slide table 2 of the transport head 11, and the suction surface 21 of the suction unit 20 is brought close to the board main surface 120 of the wiring board 110. Then, the air chuck 181 of the transport head 11 is driven to bring the contact portion 184 of the arm portion 182 closer to the wiring board 110. As a result, the engagement recess 185 of each contact portion 184 engages with the two corners of the wiring board 110, and the wiring board 110 is held and fixed without being misaligned.

  In the subsequent adsorption process, the CPU 102 outputs a drive signal to the first electromagnetic valve 162. As a result, the first electromagnetic valve 162 is switched to the open state, and the ion air in the vicinity of the vacuum suction hole 45 of the suction unit 20 passes through the suction flow path 195 and the fourth port 93 (see P1 in FIGS. 5 and 8). It is evacuated. As a result, the substrate main surface 120 of the wiring substrate 110 is stably held by the suction surface 21 by the suction force by the Bernoulli effect and the suction force by vacuuming.

  Thereafter, the air chuck 181 of the transport head 11 is driven to separate the contact portion 184 from the wiring board 110. As a result, the engagement of the engagement recess 185 with respect to the corner of the wiring board 110 is released. Further, the suction table 20 is raised by driving the slide table 2 of the transport head 11.

  Then, the arm of the transfer articulated robot is driven to transfer the wiring board 110 to the inspection process line. When the wiring board 110 reaches the inspection process line, the wiring board 110 is released, and the wiring board 110 is placed on a support for the inspection process line. Specifically, the CPU 102 performs control for switching the electromagnetic valve 143 to the closed state, and blocks the first air flow path 140. As a result, the supply of ion air to the suction unit 20 is stopped, and the ejection of ion air from the ion air blowing hole 82 ends. At the same time, the CPU 102 performs control for switching the electromagnetic valve 152 to the closed state, thereby blocking the vacuum flow path 153. As a result, the suction of air from the dust collection hole 42 is completed. In addition, the arm of the transfer articulated robot is driven to lower the wiring board 110 together with the transfer head 11.

  Next, the CPU 102 performs control for switching the electromagnetic valve 232 to the closed state, and blocks the second air flow path 150. As a result, the supply of air to the suction unit 20 is stopped, and the ejection of air from the air blowing hole 81 is completed. At the same time, the CPU 102 performs control for switching the first electromagnetic valve 162 to the closed state, thereby blocking the vacuum flow path 153.

  Further, the CPU 102 outputs a drive signal to the second electromagnetic valve 168. As a result, the second electromagnetic valve 168 is switched to the open state, and the pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and the third air flow path 160 and is guided to the vacuum break flow path 159. Then, the air is supplied to the connection flow path connecting the air filter 167 and the suction unit 20. And the vacuum breakage of the connection channel is performed, the degree of vacuum of the connection channel is weakened, and the force for sucking the wiring board 110 is weakened. As a result, evacuation of ion air from the vacuum suction hole 45 is completed. Thereafter, the CPU 102 performs control for switching the second electromagnetic valve 168 to the closed state, thereby blocking the third air flow path 160.

  Then, the arm of the transfer articulated robot is driven to raise the transfer head 11. As a result, the transport head 11 is separated from the wiring board 110, and the wiring board 110 is placed on a support for a line for an inspection process.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the non-contact conveyance device of the present embodiment, the six air blowing holes 81 are provided so as to surround the ion air blowing holes 82, and are arranged at equiangular intervals with the central axis C1 of the recess 73 as a reference. The opening is made in a state inclined by the same angle θ1 with respect to the tangent L1 of the virtual circle C2. That is, in this embodiment, the air blowing holes 81 that open in the same direction are evenly arranged. For this reason, even if the air blown out from each air blowing hole 81 flows in the direction in which the air blowing hole 81 opens and the ion air is diffused in the vicinity of each air blowing hole 81 by the air blown out from the air blowing hole 81, Reliably diffuses to the entire main surface 120 of the substrate. Therefore, it is possible to reliably and uniformly perform the removal of foreign matters on the substrate main surface 120 using ion air and the charge removal of the wiring board 110 using ion air. Therefore, in the continuity inspection after conveyance, when a probe (not shown) is brought into contact with the solder bump 118 on the substrate main surface 120, foreign matter that does not conduct is caught between the probe and the solder bump 118. Is prevented. As a result, it is difficult to determine that the wiring board 110 is a defective product due to the presence of foreign matter, so that the yield of the wiring board 110 is improved.

  (2) In this embodiment, since the six air blowing holes 81 are provided, the flow rate of the air blown out from each air blowing hole 81 can be increased, so that only two air blowing holes are provided. The force for sucking the wiring board 110 can be increased as compared with the conventional structure. As a result, the ion air blown to the board main surface 120 is mixed with the air blown out from the air blowing hole 81 after being pushed back to the suction face 21 side as the wiring board 110 is sucked. Can diffuse. In addition, as a result of providing three or more air blowing holes 81, the airflow becomes stable, so that the wiring board 110 can be prevented from rotating during suction.

  (3) In the case of the conventional structure in which only two air blowing holes are provided, if even one air blowing hole is blocked by the presence of foreign matter, the total amount of air blown from the air blowing hole is halved. The ion air cannot be sufficiently diffused by the air. On the other hand, in this embodiment, since the six air blowing holes 81 are provided, even if some of the air blowing holes 81 are blocked, the total amount of air ejected from the air blowing holes 81 hardly decreases. For this reason, ion air can be reliably diffused using the air ejected from the air blowing hole 81.

  (4) In the present embodiment, when the wiring board 110 is transported, each process is performed in the order of air ejection process → dust collection process → ion air ejection process → positioning process → adsorption process. That is, since the suction force of the wiring board 110 can be weakened by ejecting the ion air from the ion air blowing holes 82 before the positioning process, the convex portions 44 of the resin pad 40 and the wiring board 110 after the positioning process. Can reduce the contact resistance. Therefore, the wiring board 110 can be prevented from being damaged or soiled by friction with the convex portion 44.

  (5) In the present embodiment, the foreign substance is removed and the wiring board 110 is neutralized by continuing to blow out air and ion air even while the wiring board 110 is being transported. That is, since the process of transporting the wiring board 110 and the process of removing foreign substances and removing charges can be performed simultaneously, the manufacturing efficiency of the wiring board 110 is improved.

  (6) In this embodiment, the lower surface 24 side end portion of the first nozzle insertion hole 26 is a concave portion that becomes the annular flow path 223 of the air flow path 221, and the nozzle support accommodated in the first nozzle insertion hole 26. The annular flow path 223 is formed only by screwing the upper end portion of the body 51 to the end portion on the upper surface 23 side of the first nozzle insertion hole 26. For this reason, compared with the case where the lower member 211 is processed and the annular flow path 223 is formed, the annular flow path 223 can be formed easily.

  In addition, you may change this embodiment as follows.

  In the above embodiment, normal air that is not mixed with ions is used as the air that is ejected from the air blowing hole 81. However, the air that can be ejected from the air blowing hole 81 may be ion air that is discharged from the ionizer 141.

  In the above embodiment, the structures of the resin pad 40 and the suction unit 20 may be changed. For example, the resin pad 240 shown in FIGS. 9 and 10 is provided with four long holes 242. Each long hole 242 is disposed so as to open in an outer region than the region where the dust collection hole 42 is provided in the above-described embodiment, and extends along the outer peripheral edge (four sides) of the resin pad 40. . Each long hole 242 communicates with a dust collection channel 244 provided in the lower member 243 constituting the suction portion. The dust collecting flow path 244 opens at the lower surface 245 and the side surface 246 and is disposed in a state where the central axis C3 is inclined by 60 ° with respect to the lower surface 245. Each dust collection channel 244 is not connected to the dust collection unit 151 (see FIG. 8) but communicates with the outside of the lower member 243. That is, the long hole 242 and the dust collecting flow path 244 function as an air vent that releases air or ion air in the vicinity of the long hole 242 of the suction portion upward.

  In the above embodiment, the nozzle 61 protrudes from the center of the lower surface 203 of the upper member 201. That is, the nozzle 61 is integrally formed with the upper member 201. However, the nozzle 61 may be separated from the upper member 201. For example, the nozzle 61 may be screwed to the upper member 201.

  In the above embodiment, at least one of the dust collection unit 151 and the adsorption unit 161 may be omitted. Further, when the adsorption unit 161 is not omitted, the devices (second electromagnetic valve 168, flow rate adjustment valve 169, and pressure switch 170) installed on the vacuum breaking channel 159 of the adsorption unit 161 may be omitted.

  In the above embodiment, the control of the air supply valve 132, the ionizer 141, the electromagnetic valve 143, the electromagnetic valve 152, the electromagnetic valve 232, the first electromagnetic valve 162, and the second electromagnetic valve 168 is controlled by one CPU 102. Each control may be performed by a separate CPU.

  -Although the non-contact conveyance apparatus of the said embodiment was designed to convey the wiring board 110 of a single product, for example, a plurality of substrate forming regions that should become the wiring board 110 are arranged along the plane direction. You may make it convey the wiring board for individual picking.

  In the above embodiment, the wiring board 110 is transported using the articulated robot for transportation equipped with the suction unit 20, but the wiring board 110 is transported using transport means such as a conveyor equipped with the suction unit 20. May be.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) In the above means 1, a non-contact transfer device for a wiring board, wherein an ionizer is provided separately from the suction part, and ion air discharged from the ionizer is used as ion air blown from the ion air blowing hole. .

  (2) In the above means 1, non-contact of the wiring board characterized in that a dust collecting hole for collecting foreign matter on the main surface of the substrate is disposed so as to open in an outer region of the concave portion on the suction surface. Conveying device.

  (3) A non-contact transfer device for a wiring board according to the above means 1, wherein a vacuum suction hole for evacuating is disposed so as to open in an outer region of the recess.

DESCRIPTION OF SYMBOLS 20 ... Suction part 21 ... Suction surface 25 ... Outer peripheral surface 71 of a suction part ... Ion air flow path 73 ... Recess 81 ... Air blowing hole 82 ... Ion air blowing hole 110 ... Wiring board 116 as a to-be-conveyed object ... Terminal pad as protruding electrode 118 ... Solder bumps 119 as protruding electrodes ... Electrode forming region 120 ... Substrate main surface 221 ... Air flow path 222 ... Introduction flow path 223 ... Annular flow path C1 ... Center axis C2 of the recess ... Virtual circle L1 ... Tangent line θ1 of virtual circle …angle

Claims (6)

The suction surface is provided with a recess, and has a suction portion provided with a plurality of air blowing holes that open on the inner peripheral surface of the recess, and is ejected from the plurality of air blowing holes along the inner peripheral surface of the recess. In the non-contact transport device that transports the substrate main surface of the wiring substrate that is the object to be transported by sucking and holding the suction surface by the negative pressure generated by the air,
An ion air blowing hole for blowing ion air to the substrate main surface is provided at the center of the recess,
The plurality of air blowing holes are provided in three or more so as to surround the ion air blowing holes on a virtual circle concentrically set with the central axis of the recess, and are equiangularly spaced with respect to the central axis of the recess. A non-contact transfer device for a wiring board, which is arranged and opened in a state inclined by the same angle with respect to a tangent of the imaginary circle contacting at the position of the air blowing hole.   2. The non-contact of the wiring board according to claim 1, wherein the plurality of air blowing holes are opened in a state inclined by 15 ° or more and 45 ° or less toward the center of the recess with respect to the tangent. Conveying device. The non-contact transfer device for a wiring board according to claim 1 or 2 , wherein the plurality of air blowing holes have an inner diameter of 0.5 mm or more and 2.0 mm or less. The suction part has an air flow path for supplying air to the plurality of air blowing holes and an ion air flow path for supplying ion air to the ion air blowing holes, respectively.
The ion air channel is a linear channel extending along the central axis of the ion air outlet hole,
The air flow path has an introduction flow path that extends from the outer peripheral surface of the suction portion toward the ion air blowing hole side, and an annular shape that surrounds the ion air flow path and extends along the central axis of the ion air flow path. communicating at the end in the inlet flow path, according to any one of claims 1 to 3, characterized in that it consists of an annular passage which communicates with said plurality of air blowing ports at the downstream end Non-contact transfer device for wiring boards. The wiring board, the wiring board according to the plurality of projecting electrodes are electrodes formed areas arranged in any one of claims 1 to 4, characterized in that a resin wiring board having on the substrate main surface Non-contact transfer device. Using the non-contact transfer device according to any one of claims 1 to 5 , a circuit board is manufactured by transporting the substrate main surface of the circuit board, which is an object to be transported, by suction holding the suction surface. In the way to
While blowing ion air from the ion air blowing hole toward the substrate main surface,
By diffusing ion air blown from the ion air blowing holes to the whole substrate main surface by air jetted from the plurality of air blowing holes along the inner peripheral surface of the concave portion, foreign matter on the substrate main surface is removed. A method of manufacturing a wiring board, comprising removing the wiring board.

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