JP5198550B2 - Wiring board non-contact transfer device and wiring board manufacturing method - Google Patents

Abstract

The present invention aims at providing a device for conveying a wiring substrate without a contact in which a sucking section can be changed according to a type of substrate in a short time, so that the efficiency for fabrication of the wiring substrate is increased. The device for conveying the wiring substrate without a contact according to the present invention comprises a sucking section 20 which includes a sucking head 211 and a sucking head supporting section 201. A plurality of gas-blowing holes 81 are arranged on the sucking head 211. Furthermore, ion gas-blowing holes 82 for blowing ion gas toward a main surface of the substrate are arranged on the sucking head supporting section 201. Moreover, the sucking head supporting section 201 supports the sucking head 211, which can be changed.

Description

  The present invention relates to a non-contact conveyance device for a wiring substrate that conveys a wiring substrate that is an object to be conveyed using the action of an air current, and a method for manufacturing a wiring substrate using the non-contact conveyance device.

  Conventionally, a wiring board is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board is transported to a line for performing the next process every time the manufacturing process is completed. As a conventional transport method, a method has been proposed in which the surface of the wiring board is sucked with a negative pressure on the lower surface of the suction head having an air suction hole and the wiring board is transported together with the suction head in this state. Yes. However, when the wiring board is transported by the suction head, there is a problem that foreign matter (dust) generated by dirt or wear of the suction head adheres to the wiring board.

  In view of this, there has been proposed a transfer device that reduces the adhesion of foreign matter to the wiring board by transferring the object to be transferred such as the wiring board while sucking in a non-contact state (see, for example, Patent Document 1). Such a conveying device includes a suction part (conveyance head), a gas supply hole (air blowing hole) that opens at the tip surface (suction surface) of the suction part, a nozzle that is attached to the suction part and has a disk part, etc. It has. Then, when the suction surface of the suction part is brought close to the wiring board and the air supplied from the gas supply hole is led out to the outside through a slit formed between the suction surface and the disk part, the air is supplied to the suction part. Radiated outwards. As a result, the space between the vicinity of the nozzle and the wiring board becomes negative pressure, and the wiring board is sucked and held by the suction portion. In this state, if the suction part is transferred using a robot arm or the like, the wiring board can be transferred in a non-contact state.

  However, in the prior art described in Patent Document 1, when air flows in the suction portion, static electricity is generated due to friction between the air and the suction portion, and the suction portion is charged. Further, since a part of the released air collides with the wiring board, static electricity is generated due to friction between the air and the wiring board, and the wiring board is also charged. At this time, foreign matters floating around the surface of the wiring board are likely to adhere to the surface of the wiring board. Once attached, it is difficult to remove the foreign matters. Further, in the above-described inspection process performed after the wiring board is transported, the wiring board is inspected for continuity by bringing an inspection jig such as a probe into contact with the solder bump on the surface of the wiring board. Therefore, if a continuity test is performed with foreign matter adhering to the surface of the solder bumps, foreign matter that does not conduct will be caught between the probe and the solder bumps. There is a possibility that it is determined to be a good product.

  Therefore, by blowing ion air from the ion air blowing hole toward the main surface of the wiring board, the foreign matter on the main surface of the wiring board is blown away with ion air and the static electricity charged on the wiring board is neutralized (static elimination). Technology has been proposed. In this way, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter in the continuity test, and thus the yield of the wiring board is improved.

Japanese Patent Laying-Open No. 2005-219922 (FIGS. 1 to 5 etc.)

  In addition, the suction unit may transport not only one type of wiring board but also a plurality of types of wiring boards having different external dimensions. However, since the weight of the wiring board varies depending on the outer dimensions of the wiring board, it is necessary to increase or decrease the suction force (suspension force) of the suction portion according to the outer dimensions of the wiring board. For example, since a wiring board having a small external dimension is relatively light, it is not necessary to increase the suspension force so much. On the other hand, since a wiring board having a large external dimension tends to be heavy, the suspension force must be increased.

  Here, as a method of increasing / decreasing the suspension force, it is conceivable to change the installation mode of the air blowing holes according to the external dimensions of the wiring board. However, since there is an ion air flow path for supplying ion air to the above-described ion air blow hole in the suction part, the structure of the ion air flow path must be changed in conjunction with changing the installation mode of the air blow hole. I must. Therefore, it is difficult to use one suction part in common for a plurality of types of wiring boards. Therefore, in order to easily realize a configuration for increasing / decreasing the suspension force, it is preferable to prepare a suction part for each type of wiring board and replace the whole suction part every time the type of wiring board changes. However, since it is necessary to replace many parts including accessory devices in accordance with the replacement of the suction part, it takes a long time to replace the suction part, and there is a problem that the manufacturing efficiency of the wiring board is very low. It is also conceivable to adjust the suspension force by adjusting the air pressure without changing the structure of the suction part. However, many conditions need to be set according to the type of wiring board, and the management becomes complicated, making it difficult to control the air pressure.

  The present invention has been made in view of the above problems, and a first object of the present invention is to improve the manufacturing efficiency of the wiring board by making it possible to change the structure of the suction portion in a short time according to the type of the wiring board. An object of the present invention is to provide a non-contact transfer device for a wiring board that can be improved. A second object is to provide a suitable method for manufacturing a wiring board using the non-contact transfer device.

  And as a means (means 1) for solving the above-mentioned subject, it is provided with a suction part provided with a plurality of air blowing holes which are provided with a recess on the suction surface and open on the inner peripheral surface of the recess, Non-contact that conveys the substrate main surface of the circuit board that is the object to be conveyed by sucking and holding the substrate main surface of the wiring substrate by the negative pressure generated by the air ejected from the plurality of air blowing holes along the inner peripheral surface of the recess. In the transport apparatus, the suction part includes a suction head having the plurality of air blowing holes, and a head support part provided with ion air blowing holes for supporting the suction head and blowing ion air to the substrate main surface. And a non-contact transfer device for a wiring board, wherein the suction head is replaceable.

  Therefore, according to the non-contact conveyance device of the above means 1, not the entire suction part is replaced according to the type of the wiring board, but only the suction head constituting a part of the suction part is replaced. Since the ion air blowing holes are provided in the head support portion, it is not necessary to change the structure for blowing ion air to the main surface of the substrate when replacing the suction head. Therefore, since the structure of the suction portion can be changed in a short time according to the type of the wiring board, the manufacturing efficiency of the wiring board can be improved.

  The “wiring board” includes not only a single product wiring board but also a multi-cavity wiring board in which a plurality of substrate forming regions to be wiring boards are arranged along the plane direction. Examples of the material for forming the wiring board include inorganic materials such as ceramics, metals, and semiconductors, and organic materials such as resins. These materials are considered in consideration of cost, workability, insulation, mechanical strength, and the like. It can be suitably selected from the inside. Preferable examples of the ceramic material include low-temperature fired materials such as alumina, glass ceramic, and crystallized glass, aluminum nitride, silicon carbide, and silicon nitride. Suitable examples of the metal material include copper, a copper alloy, and an iron nickel alloy. A preferred example of the semiconductor material is silicon. Preferred examples of the resin material include polyimide resin, epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, and the like. In addition, composite materials of these resins and glass fibers (glass woven fabric or glass nonwoven fabric) or organic fibers such as polyamide fibers may be used. Alternatively, a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. In particular, from the viewpoint of cost reduction, it is preferable to select an organic material such as a resin material as a wiring board forming material. With such a wiring board, a fine conductor layer can be formed relatively easily and accurately.

  The plurality of air blowing holes are arranged on a virtual circle concentric with the central axis of the recess, and the suction head is a plurality of types of suction heads having different distances from the central axis of the recess to the plurality of air blowing holes. The head support portion is preferably used in common for a plurality of types of suction heads. In this way, the distance from the central axis of the recess to the plurality of air blowing holes is changed by exchanging the suction head according to the type of the wiring board, so that the suction force (suspension force) of the suction portion is increased. Can be changed. In addition, since the head support portion is commonly used for a plurality of types of suction heads, it is not necessary to prepare a plurality of types of head support portions. Therefore, cost reduction of a non-contact conveyance apparatus can be achieved. Furthermore, if a plurality of air blowing holes are evenly arranged on the virtual circle, even if ion air ejected from the ion air blowing holes diffuses in the vicinity of each air blowing hole by the air ejected from the air blowing holes, It diffuses over the entire main surface of the substrate. Therefore, it is possible to reliably and uniformly perform the removal of foreign matters on the substrate main surface using ion air and the charge removal of the wiring board using ion air.

  In addition, a projecting member projects from the center of the connection surface of the head support portion with the suction head, and the projecting member is inserted into an insertion hole provided in the center of the suction head, and ion air is blown into the ion air outlet hole. The ion air flow path is a linear flow path extending along the central axis of the ion air outlet hole, and at the tip surface of the protruding member constituting a part of the suction surface It is preferable that the ion air blowing hole is opened. In this case, the suction head and the head support portion can be reliably positioned by inserting the protruding member into the insertion hole. Further, since the ion air channel is a linear channel extending along the central axis of the ion air outlet hole, the resistance of the ion air flowing through the ion air channel is reduced, and the increase in the internal pressure of the ion air channel is also suppressed. As a result, it is not necessary to reduce the supply pressure of the ion air in order to suppress the increase in the internal pressure, so that a sufficient flow rate of the ion air ejected from the ion air blowing hole can be ensured. Therefore, it is possible to reliably remove the foreign matter on the main surface of the substrate using ion air and remove the charge of the wiring board using ion air. Therefore, for example, in the continuity inspection after the conveyance, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board can be improved.

  Further, when the suction head has an air flow path for supplying air to the plurality of air blowing holes in addition to the ion air flow path, it is usually considered that the air flow path is arranged on the side of the ion air flow path. However, if the flow area of the ion air flow path is increased in order to increase the flow rate of ion air, the proportion of the air flow path occupying the suction portion decreases accordingly, so the flow area of the air flow path is reduced and the air flow is reduced. The flow rate of air flowing through the road will decrease. In order to solve this problem, it is conceivable to increase the flow area of the air flow path, but this leads to an increase in the size of the suction part. Therefore, the air flow path has, for example, an introduction flow path extending from the outer peripheral surface of the suction head to the insertion hole side, an annular shape surrounding the insertion hole and extending along the central axis of the insertion hole, and at the upstream end. It is preferable to comprise an annular flow path communicating with the introduction flow path and communicating with the plurality of air blowing holes at the downstream end. In this way, since the annular flow path constituting the air flow path surrounds the ion air flow path, the suction part can be downsized compared to the case where the air flow path is arranged on the side of the ion air flow path. it can. Moreover, since a part of the air flow path becomes an annular flow path, the flow area of the air flow path can be secured, and the flow rate of the air flowing through the air flow path can be increased.

  Further, it is preferable that the suction head is provided with at least one of a plurality of dust collection holes for collecting foreign matters on the main surface of the substrate and a plurality of vacuum suction holes for vacuuming. In this way, when collecting foreign matter on the main surface of the board by sucking air from the dust collection holes, it is possible to prevent the foreign matter from spreading around the wiring board. It can be suppressed. Therefore, for example, in the continuity inspection after conveyance, the possibility that the wiring board is determined as a defective product due to the adhesion of foreign matters is reduced, so that the yield of the wiring board can be improved. Also, when the suction of the wiring board is assisted by evacuation from the vacuum suction hole, the lateral displacement of the wiring board being transported is suppressed, so the wiring board can be transported in a stable posture even during high-speed transport. can do.

  In addition, it is preferable that the dust collection hole is always arranged on the outer peripheral portion of the suction surface in order to reliably collect the foreign matter released to the outside of the suction portion. Further, it is preferable that the vacuum suction hole is always arranged at the outer peripheral portion of the suction surface in order to suck the outer peripheral portion of the main surface of the substrate and reliably stabilize the posture of the wiring board. From the above, the dust collection hole and the vacuum suction hole are preferably provided in the suction head that is exchanged according to the type of the wiring board as described above. In this way, even if the type of the wiring board is changed, the dust collection hole and the vacuum suction hole can always be arranged on the outer peripheral portion of the suction surface.

Further, as another means (means 2) for solving the above problem, the non-contact transfer device described in the above means 1 is used to suck the substrate main surface of the wiring board that is the transferred object to the suction surface. it is method for manufacturing a wiring substrate characterized by holding to you transport.

  Therefore, according to the manufacturing method of the means 2, the wiring board can be manufactured by exchanging the suction head using the non-contact transfer device of the means 1. Therefore, since the structure of the suction part can be changed in a short time according to the type of the wiring board, the manufacturing efficiency of the wiring board can be improved.

The front view which shows schematic structure of the non-contact conveying apparatus in 1st Embodiment. Sectional drawing which shows schematic structure of a wiring board. The bottom view which shows schematic structure of a non-contact conveying apparatus. The bottom view which shows a suction part. AA line sectional view of Drawing 4. The bottom view which shows the positional relationship of an air blowing hole and an ion air blowing hole. The principal part sectional view showing a suction part. The bottom view which shows the suction head which can be attached to a head support part. The bottom view which shows the suction head which can be attached to a head support part. The bottom view which shows the suction head which can be attached to a head support part. The circuit diagram which shows a non-contact conveying apparatus. The front view which shows the resin-made pads in 2nd Embodiment. Similarly, a side view showing a resin pad and a suction pad. The top view which shows the suction part in other embodiment. Similarly, sectional drawing which shows a suction part.

[First Embodiment]
Hereinafter, a first embodiment embodying the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the transport head 11 provided in the non-contact transport device transports a wiring board 110 that is a transported object by using the action of an air current.

  As shown in FIG. 2, the wiring board 110 of this embodiment is an organic package (resin wiring board) for mounting an IC chip, and shows a state after a plurality of manufacturing steps and before an inspection step. Yes. The wiring substrate 110 has a substantially rectangular plate shape in plan view of 30 mm length × 30 mm width. Further, the wiring substrate 110 includes a substantially rectangular core substrate 111, a first buildup layer 114 formed on the core main surface 112 (upper surface in FIG. 2) of the core substrate 111, and a core back surface of the core substrate 111. And a second buildup layer 115 formed on the lower surface 113 (the lower surface in FIG. 2). The build-up layers 114 and 115 have a structure in which a resin insulating layer made of a thermosetting resin (epoxy resin) and a conductor layer made of copper are alternately laminated. In addition, terminal pads 116 (projection electrodes) are formed in an array at a plurality of locations on the substrate main surface 120 (on the upper surface of the first buildup layer 114) of the wiring substrate 110, and on the substrate back surface 121 of the wiring substrate 110. BGA pads 117 are formed in an array at a plurality of locations (on the lower surface of the second buildup layer 115). Further, a plurality of solder bumps 118 (protruding electrodes) are disposed on the surface of the terminal pad 116. Each solder bump 118 is connected to a terminal of an IC chip having a rectangular flat plate shape. Note that an area formed by each terminal pad 116 and each solder bump 118 is an electrode forming area 119 on which an IC chip can be mounted.

  The transfer head 11 shown in FIGS. 1 and 3 is attached to the tip of an arm of a transfer articulated robot (not shown). The transport head 11 includes a slide table 2 and a suction unit 20 attached to the slide table 2 via a connection plate 12 having an L shape when viewed from the front. The slide table 2 is attached to a table body 3 extending along the vertical direction, and can move up and down. The suction unit 20 approaches and separates from the wiring board 110 with the suction surface 21 facing the wiring board 110.

  In addition, the transport head 11 includes an air chuck 181 that holds and fixes the wiring board 110 so that the circuit board 110 cannot be displaced. The air chuck 181 is connected to the chuck main body 183, a pair of arm portions 182 that are fixed to the chuck main body 183 at the base end portion and extend away from the suction portion 20, and a distal end portion of the arm portion 182. And a pair of contact portions 184 facing each other. The chuck main body 183 drives both the arm portions 182 to bring the both contact portions 184 closer to and away from each other. Further, both contact parts 184 are formed of a resin (PEEK resin in the present embodiment) having a hardness higher than that of the wiring board 110, and have engaging recesses 185 on the inner side. Both engaging recesses 185 are configured to hold two corners located on opposite sides of the four corners constituting the wiring board 110 when the substrate holding and fixing the slide table 2 is lowered.

  As shown in FIGS. 4 and 5, the suction part 20 includes a suction part main body 22, a protruding member support 51, and a resin pad 40. The suction part main body 22 is formed of a metal material (in this embodiment, an aluminum alloy containing platinum), and has a substantially rectangular parallelepiped shape of 50 mm long × 50 mm wide × 67 mm high. The suction unit body 22 includes a suction head 211 that forms the lower part of the suction unit body 22 and a head support unit 201 that forms the upper part of the suction unit body 22 and supports the suction head 211. The support part 201 has a structure that can be divided from each other. The head support portion 201 is formed of a block material having a substantially rectangular parallelepiped shape with a length of 50 mm, a width of 50 mm, and a height of 22 mm.

  A first port mounting hole 30 that opens at the upper surface 202 of the head support 201 is provided at the center of the head support 201. A first port 90 is attached to the first port attachment hole 30. The first port 90 is made of a conductive metal, and an antistatic tube (not shown) made of a material obtained by mixing carbon black into polyurethane is connected to the first port 90. Further, a pair of screw insertion holes 34 that open on the upper surface 202 are provided in an outer region of the first port mounting hole 30 in the head support portion 201. The suction unit 20 is attached to the transport head 11 by screwing a screw (not shown) penetrating the connection plate 12 of the transport head 11 into the screw insertion hole 34. Further, a projecting member 61 projects from the center of the lower surface 203 of the head support portion 201 (that is, the connection surface with the suction head 211). Further, the head support portion 201 has an upper pin accommodation hole 35 that opens at the lower surface 203, and an opening at the side surface of the head support portion 201 (that is, the outer peripheral surface 25 of the suction portion 20) and the upper pin accommodation hole 35. An engaging pin hole 36 that communicates is provided. A member connection connector 37 is attached to the side surface of the head support portion 201. The member connection connector 37 includes an engagement pin 38, and the distal end portion of the engagement pin 38 is inserted into the engagement pin hole 36. The engagement pin 38 is urged toward the upper pin accommodation hole 35 by a spring 39.

  As shown in FIGS. 4 and 5, the suction head 211 has a structure in which a head main body 212 and a head front end portion 213 constituting a lower end portion of the suction head 211 are integrally formed. The head main body 212 has a substantially rectangular parallelepiped shape with a length of 50 mm, a width of 50 mm, and a height of 36 mm, and the head tip 213 has a substantially rectangular parallelepiped shape with a length of 28 mm × width of 28 mm × height of 9 mm. The head main body 212 is provided with a second port mounting hole 31, a third port mounting hole 32, and a fourth port mounting hole 33 that open on the side surface of the head main body 212 (that is, the outer peripheral surface 25 of the suction portion 20). Yes. A second port 91 is attached to the second port attachment hole 31, and a third port 92 is attached to the third port attachment hole 32. Further, a fourth port 93 is attached to the fourth port attachment hole 33. Each port 91 to 93 is made of a conductive metal, and an antistatic tube is connected to each port 91 to 93.

  As shown in FIG. 5, a support insertion hole 26 that penetrates the upper surface 23 and the lower surface 24 of the suction head 211 is provided at the center of the suction head 211. The upper end 23 side end of the support insertion hole 26 is a screw hole, and the lower end 24 side end of the support insertion hole 26 is a recess that becomes an annular flow path 223 of an air flow path 221 described later. ing. Further, in the outer region of the support body insertion hole 26 in the head main body 212, a lower pin accommodation hole 28 that opens at the upper surface 23 and an opening at the side surface of the head main body 212 and communicate with the lower pin accommodation hole 28. An air vent hole 29 is provided. Therefore, the distal end portion of the pin 19 is inserted into the upper pin accommodation hole 35 on the head support portion 201 side, and the proximal end portion of the pin 19 is fitted into the lower pin accommodation hole 28. By engaging the tip of the engaging pin 38 with the provided constricted portion 18, the head support portion 201 and the suction head 211 are fixed to each other.

  As shown in FIG. 5, the suction head 211 is provided with 16 dust collection channels 191 that open at the lower surface 24. Each dust collecting channel 191 is disposed in an outer region of the support insertion hole 26 in the suction head 211. Each dust collection channel 191 communicates with the third port mounting hole 32 and is connected to the dust collection unit 151 (see FIG. 11). The suction head 211 is provided with four suction channels 195 that open at the lower surface 24. Each adsorption channel 195 is disposed in the outer region of the support insertion hole 26 and each dust collection channel 191 in the suction head 211. The adsorption channel 195 communicates with the fourth port mounting hole 33 and is connected to the adsorption unit 161 (see FIG. 11).

  The protruding member support 51 is accommodated in the support insertion hole 26 of the suction head 211, and the upper end portion is screwed to the upper end 23 side end of the support insertion hole 26. The protruding member support 51 is made of a metal material (aluminum in the present embodiment) and has a substantially annular shape with an outer diameter of 11 mm and a height of 42 mm. The protruding member support 51 is provided with an insertion hole 55 having an inner diameter of 9 mm. The insertion hole 55 passes through the upper surface 52 and the lower surface 53 (see FIG. 7) of the protruding member support 51.

  As shown in FIGS. 4 to 7, the protruding member 61 is inserted into the insertion hole 55 and has a substantially annular shape with an outer diameter of 7 mm and a height of 42 mm. Inside the protruding member 61, an ion air passage 71 having an inner diameter of 2.5 mm for supplying ion air is provided. The ion air flow channel 71 is opened at the front end surface 62 (lower end surface) of the protruding member 61 that constitutes a part of the suction surface 21. The ion air flow path 71 communicates with the first port mounting hole 30 and is connected to the ionizer 141 (see FIG. 11). Furthermore, the suction surface 21 is provided with a circular recess 73 as viewed from below. Further, at the center of the recess 73, a nozzle tip portion 75 having a substantially trapezoidal cross section and a circular shape when viewed from below is projected. The ion air channel 71 is a linear channel extending along the central axis A1 of the recess 73.

  Further, ion air blowing holes 82 communicating with the ion air flow channel 71 are provided at six locations in the center of the recess 73. More specifically, each ion air blowing hole 82 is provided so as to surround the nozzle tip 75 on a virtual circle C1 set concentrically with the central axis A1. Moreover, each ion air blowing hole 82 is arrange | positioned at equal angle (60 degrees) space | intervals on the basis of central axis A1. Each ion air blowing hole 82 has a circular shape and an inner diameter of 1.0 mm. Each ion air blowing hole 82 is arranged such that the central axis is perpendicular to the substrate main surface 120 of the wiring board 110, and the ion air supplied from the ion air flow channel 71 is perpendicular to the substrate main surface 120. It comes to spray. Further, the center axis of each ion air outlet hole 82 extends along the center axis A1 of the ion air flow path 71 and is disposed in parallel with the center axis A1.

  As shown in FIGS. 5 and 7, the suction head 211 is provided with an air flow path 221 for supplying air separately from the ion air flow path 71. The air flow path 221 includes an introduction flow path 222 and an annular flow path 223. The introduction flow path 222 extends from the outer peripheral surface 25 of the suction head 211 (head body 212) to the insertion hole 55 side (ion air flow path 71 side). The introduction flow path 222 communicates with the second port 91 and is connected to the air unit 231 (see FIG. 11). The annular flow path 223 is a flow path formed between the support insertion hole 26 and the protruding member support 51, and surrounds the insertion hole 55 (ion air flow path 71) and has a central axis ( It has an annular shape extending along the central axis of the ion air passage 71. The annular flow path 223 communicates with the introduction flow path 222 at the upstream end.

  As shown in FIGS. 4 to 7, the suction portion 20 (head tip portion 213) communicates with the downstream end portion of the annular flow path 223 and opens on the inner peripheral surface of the recess 73. Holes 81 are provided at six locations. Each air blowing hole 81 is configured to eject the air supplied from the air flow path 221 into the recess 73. Then, the air blown out from each air blowing hole 81 is guided along the circumferential direction of the recess 73 and collides with the ion air blown from the ion air blowing hole 82 toward the substrate main surface 120, thereby causing the ion air to flow. The entire main surface 120 of the substrate is diffused. Note that the suction unit 20 of the present embodiment is a Bernoulli chuck that holds the wiring board 110 by using the Bernoulli effect generated by the air flow generated between the suction part main body 22 and the wiring board 110.

  As shown in FIG. 6, each air blowing hole 81 is arranged so as to be rotationally symmetric with respect to the central axis A <b> 1 of the recess 73, and opens along the circumferential direction of the recess 73. Yes. Specifically, each air blowing hole 81 is arranged so as to surround each ion air blowing hole 82 on a virtual circle C2 set concentrically with the central axis A1. In addition, the air blowing holes 81 are arranged at equiangular (60 °) intervals with respect to the central axis A1. Furthermore, each air blowing hole 81 is inclined by the same angle θ1 (30 ° in the present embodiment) to the center side of the recess 73 with respect to the tangent L1 of the virtual circle C2 that is in contact with the position of the air blowing hole 81. It is open. In addition, each air blowing hole 81 is opened in a state where it is not inclined to the outside of the recess 73 with respect to the suction surface 21. That is, each air blowing hole 81 opens in parallel to the suction surface 21. Further, the air blowing hole 81 opens toward the adjacent air blowing hole 81. In addition, the internal diameter of each air blowing hole 81 is set to 1.2 mm.

  As shown in FIG. 4, the resin pad 40 is attached to the head tip 213, and the front surface (lower surface) is the suction surface 21. The resin pad 40 is made of a resin material (ether urethane in the present embodiment) and has a substantially rectangular plate shape with a length of 28 mm × width of 28 mm × height of 2.0 mm. Further, a through hole 41 having a diameter of 16 mm is provided at the center of the resin pad 40. The through-hole 41 is configured to expose the concave portion 73 and the like of the suction unit main body 22. Further, the resin pad 40 is provided with 16 dust collecting holes 42 communicating with the dust collecting flow path 191. Each dust collection hole 42 is disposed so as to open in the outer region of the through hole 41 and the recess 73, and is arranged at equal intervals along the outer peripheral edge (four sides) of the resin pad 40 so as to surround the recess 73. Has been.

  Further, convex portions 44 protruding from the suction surface 21 by 1.0 mm are formed on the outer peripheral portion of the suction surface 21, that is, on the four corners of the resin pad 40. Further, four vacuum suction holes 45 are arranged in the resin pad 40 so as to open at the respective convex portions 44. That is, each vacuum suction hole 45 is disposed so as to open in the outer region of the through hole 41 and the recess 73. Each vacuum suction hole 45 communicates with the suction flow path 195 of the suction head 211 (see FIG. 5).

  Note that the suction head 211 of this embodiment is selected from four types of suction heads according to the outer dimensions of the wiring board to be transported. More specifically, the suction head 211 is selected when it is a wiring board having a vertical and horizontal length of 29 mm or more and 37.5 mm or less. When the wiring board has a vertical and horizontal length of 19 mm or more and 22 mm or less, the suction head 250 (see FIG. 8) is selected. Further, when the wiring board has a vertical and horizontal length of 23 mm or more and 27 mm or less, the suction head 260 (see FIG. 9) is selected, and the vertical and horizontal lengths of 40 mm or more and 50 mm or less, or 50 mm. In the case of a substrate, the suction head 270 (see FIG. 10) is selected. From the above, the suction head 211 is selected when transporting the wiring board 110 (see FIG. 2) having a vertical and horizontal length of 30 mm. The wiring board 110 is selected from a plurality of types of wiring boards having different external dimensions. Further, the head support portion 201 is used in common for each of the suction heads 211, 250, 260, and 270.

  The suction head 211 of the present embodiment can be replaced with suction heads 250, 260, and 270. Accordingly, a method of replacing the suction head will be described in the case where, for example, a wiring board having a vertical and horizontal length of 20 mm is transported after the wiring board 110 is transported. First, the engagement pin 38 is pulled to release the engagement of the distal end portion of the engagement pin 38 with the constricted portion 18 of the pin 19. Then, the suction head 211 is moved in a direction away from the head support portion 201. As a result, the tip end portion of the pin 19 is pulled out from the upper pin accommodation hole 35 on the head support portion 201 side, the protruding member 61 is pulled out from the insertion hole 55, and the suction head 211 is removed from the head support portion 201.

  Next, the suction head 250 is selected from the suction heads 211, 250, 260, and 270 in order to transport a wiring board having a vertical and horizontal length of 20 mm, and the selected suction head 250 is attached to the head support unit 201. . Specifically, the suction head 250 is moved in a direction to approach the head support portion 201, and the protruding member 61 is inserted into an insertion hole (not shown) provided in the suction head 250. In addition, the distal end portion of the pin (not shown) is inserted into the upper pin accommodation hole 35 and the base end portion of the pin is fitted into the lower pin accommodation hole (not shown) on the suction head 250 side. The distal end portion of the engaging pin 38 is engaged with a constricted portion provided at the distal end portion. As a result, the head support portion 201 and the suction head 250 are fixed to each other, and the suction head 211 originally attached to the head support portion 201 is replaced with the suction head 250.

  The insertion hole of the suction head 250 is the same as the insertion hole 55 of the suction head 211, and the lower pin accommodation hole of the suction head 250 is the same as the lower pin accommodation hole 28 of the suction head 211. The pin fitted into the lower pin accommodation hole is the same as the pin 19 fitted into the lower pin accommodation hole 28. The suction heads 260 and 270 are also provided with an insertion hole similar to the insertion hole 55 and a lower pin accommodation hole similar to the lower pin accommodation hole 28, and the lower pin accommodation hole is similar to the pin 19. The pins are fitted.

  Further, the suction heads 211, 250, 260, and 270 are different from each other in the vertical and horizontal lengths of the head tip portions 213, 251, 261, and 271. Furthermore, the suction heads 211, 250, 260, and 270 are different from each other in the installation mode of the air blowing holes 81, 253, 263, and 273. More specifically, the suction heads 211, 250, 260, 270 have distances from the central axes A1, A2, A3, A4 of the recesses 73, 252, 262, 272 to the air blowing holes 81, 253, 263, 273, respectively. They are different from each other. In the suction head 211 of this embodiment, the vertical and horizontal lengths of the head tip 213 are set to 28 mm, and the distance from the central axis A1 to the air blowing hole 81 is set to 9 mm. Further, in the suction head 250, the vertical and horizontal lengths of the head tip portion 251 are set to 18 mm, and the distance from the central axis A2 of the concave portion 252 to the air blowing hole 253 is set to 9 mm. In the suction head 260, the longitudinal and lateral lengths of the head tip 261 are set to 22 mm, and the distance from the central axis A3 of the recess 262 to the air blowing hole 263 is set to 9 mm. In the suction head 270, the vertical and horizontal lengths of the head tip 271 are set to 38 mm, and the distance from the central axis A4 of the recess 272 to the air blowing hole 273 is set to 15 mm. In the present embodiment, the greater the distance from the central axis of the recess to the air blowing hole, the greater the suction force (suspension force) that sucks the wiring board when air is ejected from the air blowing hole.

  Further, an electrostatic potential sensor 105 (see FIG. 11) is installed at the contact portion 184 of the air chuck 181. The electrostatic potential sensor 105 is embedded in the contact portion 184 and is disposed so as to be exposed from the engagement recess 185 of the contact portion 184. That is, the electrostatic potential sensor 105 is provided at a position in contact with the outer peripheral edge of the wiring board 110. The electrostatic potential sensor 105 measures static electricity charged on the wiring board 110 and outputs a static electricity measurement signal.

  Next, the system configuration of the non-contact conveyance device will be described.

  As shown in FIG. 11, the non-contact conveyance device includes an air supply source 131 that sends out pressurized air. In addition, the non-contact conveyance device includes an air supply channel 130 that can communicate between the air supply source 131 and the suction unit 20. The air supply channel 130 is branched into a first air channel 140, a second air channel 150, and a third air channel 160 on the downstream side. The first air flow path 140 communicates with the ion air flow path 71 of the suction unit 20 via the antistatic tube and the first port 90 (see P3 in FIGS. 5 and 11). The second air flow path 150 communicates with the air flow path 221 of the suction unit 20 via the antistatic tube and the second port 91 (see P2 in FIGS. 5 and 11). The third air flow path 160 communicates with the suction flow path 195 of the suction unit 20 via the antistatic tube and the fourth port 93 (see P1 in FIGS. 5 and 11).

  As shown in FIG. 11, an air supply valve 132 is installed on the air supply channel 130. The air supply valve 132 is disposed on the downstream side of the air supply source 131, and switches the air supply flow path 130 between an open state and a closed state. The air supply valve 132 is configured to be able to supply air to the downstream side when switched to the open state. Note that the air supply valve 132 of the present embodiment is an electromagnetic valve that is operated by a solenoid (not shown).

  An air pressure adjusting unit 133 that adjusts the air pressure in the air supply channel 130 to a constant value is installed on the air supply channel 130. That is, the air pressure adjustment unit 133 is connected to the air supply valve 132 and the air supply source 131 through the air supply flow path 130 in a flow path. The air pressure adjustment unit 133 includes an air filter 134, a pressure gauge 135, and a pressure reducing valve 136. The air filter 134 is disposed on the downstream side of the air supply valve 132, and removes foreign matters contained in the air passing through the air supply flow path 130. The pressure gauge 135 is disposed downstream of the air filter 134 and measures the pressure of air passing through the air supply flow path 130. Further, the pressure reducing valve 136 is disposed on the downstream side of the pressure gauge 135, performs pressure reduction of the air passing through the air supply flow path 130, and supplies the reduced air to the downstream side. An air filter 137 is installed on the air supply channel 130. The air filter 137 is disposed on the downstream side of the pressure reducing valve 136 and removes moisture contained in the air passing through the air supply flow path 130.

  As shown in FIG. 11, an ion air unit 147 is installed on the first air flow path 140. The ion air unit 147 includes a pressure reducing valve 145, a pressure gauge 146, an electromagnetic valve 143, an air filter 144, and an ionizer 141. The pressure reducing valve 145 is disposed on the downstream side of the air filter 137, performs pressure reduction of the air passing through the first air flow path 140, and supplies the reduced air to the downstream side. The pressure gauge 146 is disposed on the downstream side of the pressure reducing valve 145 and measures the pressure of air passing through the first air flow path 140.

  Moreover, the electromagnetic valve 143 is arrange | positioned in the downstream of the pressure gauge 146, and switches the 1st air flow path 140 to an open state or a closed state. When the electromagnetic valve 143 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to reduce the air pressure. The electromagnetic valve 143 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101 described later. The air filter 144 is disposed on the downstream side of the electromagnetic valve 143, and removes foreign matters contained in ion air passing through the first air flow path 140.

  As shown in FIG. 11, the ionizer 141 is a DC ionizer, and is arranged on the downstream side of the air filter 144. The ionizer 141 applies an DC voltage to each discharge needle, an ionizer body 142 communicating with the first air flow path 140, two discharge needles (positive and negative discharge needles) protruding into the ionizer body 142. High-voltage power supply. Each discharge needle generates ions around the tip by performing corona discharge when a DC voltage is applied. More specifically, the positive electrode discharge needle generates positive ions when the polarity of the applied DC voltage is positive (+), and the negative electrode discharge needle has a negative (-) polarity of the applied DC voltage. In this case, anions are generated. The ionizer 141 generates ion air by mixing the generated ions with the air guided into the ionizer body 142. Further, the ionizer 141 discharges the generated ion air to the downstream side of the first air flow path 140. The ion air is guided to the ion air channel 71 of the suction unit 20 through the antistatic tube and the first port 90.

  As shown in FIG. 11, an air unit 231 is installed on the second air flow path 150. The air unit 231 includes an electromagnetic valve 232, a flow rate adjustment valve 233, and an air filter 234. The electromagnetic valve 232 is disposed on the downstream side of the air filter 137, and switches the second air flow path 150 to an open state or a closed state. When the electromagnetic valve 232 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The electromagnetic valve 232 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 233 is disposed in the middle of the flow path connecting the electromagnetic valve 232 and the air filter 234, and the air flowing through the second air flow path 150 is quantitatively exhausted so that the pressure of the air is constant. It is a throttle valve that adjusts the pressure to be reduced. The air filter 234 is disposed on the downstream side of the flow rate adjustment valve 233 and removes foreign matters contained in the air passing through the second air flow path 150.

  As shown in FIG. 11, an adsorption unit 161 is installed on the third air flow path 160. Further, the adsorption unit 161 branches into a substrate adsorption channel 158 and a vacuum break channel 159 communicating with the third air channel 160.

  A first electromagnetic valve 162 and an air filter 167 are installed on the substrate adsorption flow path 158. The first electromagnetic valve 162 is disposed on the downstream side of the air filter 137 and switches the substrate adsorption flow path 158 between an open state and a closed state. When the first solenoid valve 162 is switched to the open state, the air in the vicinity of the vacuum suction hole 45 of the suction unit 20 is evacuated through the suction flow path 195, the fourth port 93, the air filter 167, and the like. At the same time, air is appropriately sucked to adjust the air pressure. The first electromagnetic valve 162 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  As shown in FIG. 11, a second electromagnetic valve 168, a flow rate adjustment valve 169, and a pressure switch 170 are installed on the vacuum breaking channel 159. The second electromagnetic valve 168 is disposed on the downstream side of the air filter 137, and the vacuum break channel 159 is switched to an open state or a closed state. When the second electromagnetic valve 168 is switched to the open state, the second electromagnetic valve 168 supplies air to the connection flow path connecting the air filter 167 and the suction unit 20 to weaken the degree of vacuum of the connection flow path. . At the same time, when the second electromagnetic valve 168 is switched to the open state, the air flowing through the vacuum breaking flow path 159 is appropriately discharged to adjust the pressure reduction. Note that the second electromagnetic valve 168 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 169 is disposed in the middle of the flow path connecting the second electromagnetic valve 168 and the pressure switch 170, and the air flowing through the vacuum breaking flow path 159 is quantitatively exhausted to reduce the pressure of the air. This is a throttle valve that adjusts the pressure to a constant value. The pressure switch 170 is disposed on the downstream side of the flow rate adjustment valve 169 and the air filter 167. The pressure switch 170 is turned on when the pressure in the vacuum break channel 159 exceeds a predetermined value (that is, vacuum break), and outputs a vacuum break signal to the CPU 102 of the control device 101. It is supposed to be.

  As shown in FIG. 11, the non-contact conveyance device includes a vacuum channel 153, and a dust collection unit 151 is installed on the vacuum channel 153. The vacuum channel 153 communicates with the dust collection channel 191 of the suction unit 20 via the antistatic tube and the third port 92 (see P4 in FIGS. 5 and 11). The dust collection unit 151 includes an electromagnetic valve 152 and an air filter 157. The electromagnetic valve 152 switches the vacuum channel 153 to an open state or a closed state. When the solenoid valve 152 is switched to the open state, the solenoid valve 152 sucks air in the vicinity of the dust collection hole 42 of the suction unit 20 through the dust collection flow path 191, the third port 92, the air filter 157, and the like. The air pressure is adjusted by pressurizing air appropriately. The electromagnetic valve 152 of this embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  Next, the electrical configuration of the non-contact conveyance device will be described.

  As shown in FIG. 11, the non-contact conveyance device includes a control device 101 that controls the entire device. The control device 101 includes a CPU 102, a ROM 103, a RAM 104, an input / output circuit, and the like. The CPU 102 is electrically connected to the air supply valve 132, the ionizer 141, the electromagnetic valves 143, 152, 232, the first electromagnetic valve 162, and the second electromagnetic valve 168, and controls them by various driving signals.

  The CPU 102 is configured to receive an electrostatic measurement signal output from the electrostatic potential sensor 105. Then, the CPU 102 determines whether the wiring board 110 attracted by the suction unit 20 is charged positively (+) or negatively (−) based on the polarity of the electrostatic charge indicated by the electrostatic measurement signal. It is supposed to be. When it is determined that the wiring board 110 is positively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to perform control to generate negative ions on the discharge needle on the negative electrode side. It has become. On the other hand, when it is determined that the wiring board 110 is negatively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to generate positive ions in the positive discharge needle. It is like that. According to such control, static electricity charged on the wiring board 110 can be reliably neutralized.

  In this embodiment, although the DC ionizer 141 is used, an AC ionizer may be used instead. The AC ionizer includes an ionizer body, one discharge needle protruding from the ionizer body, and a high-voltage power source that applies an AC voltage to the discharge needle. When an alternating voltage is applied, the discharge needle generates a cation or an anion according to the polarity of the applied alternating voltage. In this case, when the electrostatic measurement signal output from the electrostatic potential sensor 105 is input, the CPU 102 determines whether or not the wiring board 110 is charged based on the electrostatic charge amount indicated by the electrostatic measurement signal. When it is determined that the wiring board 110 is charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to increase the output of the ionizer 141. On the other hand, when it is determined that the wiring board 110 is not charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to weaken the output of the ionizer 141. Such control can reliably prevent the wiring board 110 from being charged. Further, it is possible to prevent the ionizer 141 from operating more than necessary.

  Next, a non-contact conveyance method for the wiring board 110 will be described.

  The wiring board 110 of the present embodiment is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board 110 is placed on a board support (not shown) every time the manufacturing process is completed. In this state, the wiring board 110 is transferred using a non-contact transfer device. More specifically, the transfer head 11 is lowered by driving the arm of the transfer articulated robot. In the present embodiment, one suction head (suction head 211 in this case) is selected from the four types of suction heads 211, 250, 260, and 270 according to the external dimensions of the wiring board, and the selected suction head is selected. The transport head 11 is lowered while attached to the head support 201.

  In the subsequent air ejection process, the CPU 102 outputs drive signals to the air supply valve 132 and the electromagnetic valve 232 to switch the air supply valve 132 and the electromagnetic valve 232 to the open state. As a result, the pressurized air sent from the air supply source 131 passes through the air supply channel 130 and is guided to the second air channel 150. Then, the air guided to the second air flow path 150 flows into the suction unit 20 via the second port 91 (see P2 in FIGS. 5 and 11) and is guided to the air flow path 221.

  In the present embodiment, the air guided to the air flow path 221 passes through the air blowing hole 81 and is jetted from the air blowing hole 81 along the inner peripheral surface of the recess 73. As a result, most of the air ejected from the air blowing hole 81 flows in the direction in which the air blowing hole 81 opens and flows out of the recess 73, and then passes through the gap between the suction surface 21 and the substrate main surface 120. At this time, a high-speed flow is discharged to the outside of the suction unit 20. As a result, the space generated between the suction surface 21 and the substrate main surface 120 becomes negative pressure, and the substrate main surface 120 of the wiring substrate 110 is sucked and held by the suction surface 21 (see FIG. 1). A part of the air ejected from the air blowing hole 81 flows along the circumferential direction of the recess 73 to form a swirling flow.

  In the subsequent dust collection process, the CPU 102 outputs a drive signal to the electromagnetic valve 152 to switch the electromagnetic valve 152 to the open state. As a result, air in the vicinity of the dust collection hole 42 of the suction unit 20 is sucked through the dust collection passage 191 and the third port 92 (see P4 in FIGS. 5 and 11). As a result, the foreign matter adhering on the board main surface 120 of the wiring board 110 is collected together with air.

  In the subsequent ion air ejection process, the CPU 102 outputs drive signals to the ionizer 141 and the electromagnetic valve 143. As a result, the electromagnetic valve 143 is switched to the open state and the ionizer 141 is activated. The pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and flows into the ionizer 141 on the first air flow path 140. The ionizer 141 generates ion air by mixing ions with the air introduced into the ionizer body 142. The ionizer 141 releases the generated ion air to the downstream side of the ionizer 141. Further, the ion air discharged from the ionizer 141 flows into the suction unit 20 through the first air flow path 140 and the first port 90 (see P3 in FIGS. 5 and 11) and is guided to the ion air flow path 71. .

  In the present embodiment, the ion air guided to the ion air flow path 71 is blown vertically from the ion air blowing hole 82 toward the substrate main surface 120 of the wiring substrate 110 to remove foreign matters on the substrate main surface 120. Further, the air blown out from the air blowing hole 81 collides with the ion air blown from the ion air blowing hole 82. As a result, ion air diffuses over the entire substrate main surface 120, so that foreign matter on the substrate main surface 120 is reliably removed by being blown away.

  Further, in the present embodiment, the substrate main surface 120 is sucked and held on the suction surface 21, and at the same time, the ion air blown from the ion air blowing holes 82 is pushed back toward the suction surface 21 by the wiring substrate 110 sucked and held. Spread throughout. As a result, ions contained in the ion air come into contact with the entire substrate main surface 120, and static electricity charged on the wiring board 110 is removed.

  In the subsequent positioning step, the arm of the transfer articulated robot is driven to raise the wiring board 110 together with the transfer head 11. Further, the suction table 20 is lowered by driving the slide table 2 of the transport head 11, and the suction surface 21 of the suction unit 20 is brought close to the board main surface 120 of the wiring board 110. Then, the air chuck 181 of the transport head 11 is driven to bring the contact portion 184 of the arm portion 182 closer to the wiring board 110. As a result, the engagement recess 185 of each contact portion 184 engages with the two corners of the wiring board 110, and the wiring board 110 is held and fixed without being misaligned.

  In the subsequent adsorption process, the CPU 102 outputs a drive signal to the first electromagnetic valve 162. As a result, the first electromagnetic valve 162 is switched to the open state, and the ion air in the vicinity of the vacuum suction hole 45 of the suction unit 20 passes through the suction flow path 195 and the fourth port 93 (see P1 in FIGS. 5 and 11). It is evacuated. As a result, the substrate main surface 120 of the wiring substrate 110 is stably held by the suction surface 21 by the suction force by the Bernoulli effect and the suction force by vacuuming.

  Thereafter, the air chuck 181 of the transport head 11 is driven to separate the contact portion 184 from the wiring board 110. As a result, the engagement of the engagement recess 185 with respect to the corner of the wiring board 110 is released. Further, the suction table 20 is raised by driving the slide table 2 of the transport head 11.

  Then, the arm of the transfer articulated robot is driven to transfer the wiring board 110 to the inspection process line. When the wiring board 110 reaches the inspection process line, the wiring board 110 is released, and the wiring board 110 is placed on a support for the inspection process line. Specifically, the CPU 102 performs control for switching the electromagnetic valve 143 to the closed state, and blocks the first air flow path 140. As a result, the supply of ion air to the suction unit 20 is stopped, and the ejection of ion air from the ion air blowing hole 82 ends. At the same time, the CPU 102 performs control for switching the electromagnetic valve 152 to the closed state, thereby blocking the vacuum flow path 153. As a result, the suction of air from the dust collection hole 42 is completed. In addition, the arm of the transfer articulated robot is driven to lower the wiring board 110 together with the transfer head 11.

  Next, the CPU 102 performs control for switching the electromagnetic valve 232 to the closed state, and blocks the second air flow path 150. As a result, the supply of air to the suction unit 20 is stopped, and the ejection of air from the air blowing hole 81 is completed. At the same time, the CPU 102 performs control for switching the first electromagnetic valve 162 to the closed state, thereby blocking the vacuum flow path 153.

  Further, the CPU 102 outputs a drive signal to the second electromagnetic valve 168. As a result, the second electromagnetic valve 168 is switched to the open state, and the pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and the third air flow path 160 and is guided to the vacuum break flow path 159. Then, the air is supplied to the connection flow path connecting the air filter 167 and the suction unit 20. And the vacuum breakage of the connection channel is performed, the degree of vacuum of the connection channel is weakened, and the force for sucking the wiring board 110 is weakened. As a result, evacuation of ion air from the vacuum suction hole 45 is completed. Thereafter, the CPU 102 performs control for switching the second electromagnetic valve 168 to the closed state, thereby blocking the third air flow path 160.

  Then, the arm of the transfer articulated robot is driven to raise the transfer head 11. As a result, the transport head 11 is separated from the wiring board 110, and the wiring board 110 is placed on a support for a line for an inspection process.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the non-contact transfer apparatus of this embodiment, the entire suction part is not replaced according to the type of the wiring board, but only the suction heads 211, 250, 260, and 270 constituting a part of the suction part are replaced. doing. Since the ion air blowing hole 82 is provided in the head support portion 201, it is not necessary to change the structure for blowing ion air to the substrate main surface 120 when the suction heads 211, 250, 260, and 270 are replaced. . Therefore, since the structure of the suction portion can be changed in a short time according to the type of the wiring board, the manufacturing efficiency of the wiring board can be improved. Moreover, according to the present embodiment in which only the suction heads 211, 250, 260, and 270 are replaced, it is not necessary to replace many parts (including expensive accessory devices) used for spraying ion air. The rise can be suppressed.

  (2) By the way, it is preferable that the dust collecting hole is always arranged on the outer peripheral portion of the suction surface in order to reliably collect the foreign matter released to the outside of the suction portion. Further, the vacuum suction hole is preferably always arranged on the outer peripheral portion of the suction surface in the same manner as the dust collection hole, in order to suck the outer peripheral portion of the main surface of the substrate and reliably stabilize the posture of the wiring board. On the other hand, it is preferable that the ion air blowing hole 82 is always arranged at the center of the suction surface in order to reliably diffuse ion air over the entire main surface of the substrate.

  From the above, in this embodiment, the dust collection holes 42, 254, 264, 274 and the vacuum suction holes 45, 255 are added to the suction heads 211, 250, 260, 270 to be replaced according to the external dimensions of the wiring board. 265, 275 are provided. On the other hand, in the head support portion 201 used in common for each of the suction heads 211, 250, 260, and 270, an ion air blowing hole 82 is provided in the protruding member 61 in the center portion. As a result, even if the external dimensions of the wiring board are changed, the dust collection hole and the vacuum suction hole are always arranged on the outer peripheral portion of the suction surface, so that foreign matter can be reliably collected, The posture of the wiring board can be reliably stabilized. Even if the external dimensions of the wiring board are changed, the ion air blowing hole 82 is always disposed at the center of the suction surface, so that the ion air can be reliably diffused over the entire main surface of the board.

  (3) In the present embodiment, the foreign substance is removed and the wiring board 110 is neutralized by continuing to blow out air and ion air even while the wiring board 110 is being transported. That is, not only can the structure of the suction part be changed in a short time, but also the process of transporting the wiring board 110 and the process of removing or removing foreign matter can be performed at the same time, so that the manufacturing efficiency of the wiring board 110 is further improved. To do.

  (4) In the present embodiment, the lower end 24 side end portion of the support body insertion hole 26 is a recess that becomes the annular flow path 223 of the air flow path 221, and the protruding member support body accommodated in the support body insertion hole 26. The annular flow path 223 is formed only by screwing the upper end portion of 51 to the end portion on the upper surface 23 side of the support body insertion hole 26. For this reason, compared with the case where the suction channel 211 is processed to form the annular channel 223, the annular channel 223 can be easily formed.

[Second Embodiment]
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. Here, it demonstrates centering on the part which is different from 1st Embodiment, and abbreviate | omits description instead of attaching | subjecting the same member number about a common part.

  In the present embodiment, the structure of the resin pad and the suction part is different from that of the first embodiment. More specifically, the resin pad 300 shown in FIGS. 12 and 13 has a substantially rectangular annular projection in plan view that protrudes 1.0 mm from the suction surface 301 on the outer periphery of the suction surface 301 having a substantially rectangular shape. 302 is formed. The convex part 302 is a protrusion with a width of 1.0 mm that is provided so as to surround the suction surface 301. Note that the four corner portions 303 constituting the convex portion 302 have a substantially rectangular shape in a plan view of length 2.0 mm × width 2.0 mm. Further, four vacuum suction holes 304 are arranged in the resin pad 300 so as to open at the respective corners 303. Each vacuum suction hole 304 is the same as the vacuum suction hole 45 of the first embodiment.

  Further, a through hole 305 that exposes the recess 73 is provided in the center of the resin pad 300. Further, the resin pad 300 is provided with a long hole 306 for collecting foreign matter on the substrate main surface 120. The long holes 306 are arranged at four locations along the convex portion 302 so as to surround the concave portion 73 on the outer peripheral portion of the suction surface 301. Each of the long holes 306 is disposed outside the concave portion 73 (through hole 305) and opens in the inner region of the convex portion 302, and extends along the convex portion 302. The length of each long hole 306 is set to 80% (specifically, 24 mm) of the length (30 mm) of one side constituting the suction surface 301. The width of each long hole 306 is set to 2.0 mm.

  As shown in FIG. 13, the suction head 310 constituting the suction portion has a structure in which a head main body 311 and a head front end portion 312 constituting the lower end portion of the suction head 310 are integrally formed. The head main body 311 has a substantially rectangular parallelepiped shape of 50 mm long × 50 mm wide × 36 mm high, and the head tip 312 has a substantially rectangular parallelepiped shape of 30 mm long × 30 mm wide × 9 mm high. The head tip 312 is provided with four dust collecting flow paths 313 communicating with the long holes 306. Each dust collecting channel 313 is opened at the lower surface 314 and the side surface 315, and the central axis C3 is disposed in a state inclined by 60 ° with respect to the lower surface 314 (suction surface 301). In addition, the length of each dust collection channel 313 is set to the same size as the length of the long hole 306 (24 mm in this embodiment). The width of each dust collection channel 313 is set to about 1.7 mm. Each dust collection channel 313 is connected to a dust collector (not shown). In the present embodiment, the total flow rate of air sucked from the long hole 306 is set to be larger than the total flow rate of air ejected to the inner area of the convex portion 302 in the suction surface 301.

  Therefore, according to the present embodiment, most of the air and ion air containing foreign matter can be sucked into the dust collecting flow path 313 through the long hole 306. For this reason, while being able to implement | achieve the structure which does not leak air to the outer side of a suction part, a foreign material can be collect | recovered efficiently.

  In addition, you may change the said embodiment as follows.

  In the above embodiment, the tip end portion of the pin is inserted into the upper pin accommodation hole 35 on the head support portion 201 side and the base end portion of the pin is fitted into the lower pin accommodation hole, The engaging pin 38 is engaged with a constricted portion. As a result, the head support portion 201 and the suction heads 211, 250, 260, and 270 are fixed to each other. However, the fixing structure between the head support portion 201 and the suction heads 211, 250, 260, and 270 may be another structure.

  For example, as shown in FIGS. 14 and 15, two support side magnets 283 provided on the lower surface 282 side of the head support portion 281 and two head sides provided on the upper surface 285 side of the suction head 284. A magnet 286 is connected. The suction unit 280 may be configured by fixing the head support unit 281 and the suction head 284 to each other using the two connection screws 287. Note that the upper surface 288 of the head support portion 281 and the upper surface 285 of the suction head 284 have a substantially rectangular shape of 44 mm long × 54 mm wide. Both support portion side magnets 283 are provided on the outer peripheral portion of the head support portion 281 and are spaced apart from each other on an imaginary line L2 extending in parallel with the long side constituting the upper surface 288. Further, both the head-side magnets 286 are provided on the outer peripheral portion of the suction head 284 and are spaced apart from each other on an imaginary line (not shown) extending in parallel with the long side constituting the upper surface 285. The support portion side magnet 283 and the head side magnet 286 are disposed to face each other, and the lower surface of the support portion side magnet 283 and the upper surface of the head side magnet 286 are separated from each other by about several millimeters. Note that one each of the support part side magnet 283 and the head side magnet 286 may be provided, or three or more may be provided. Both connection screws 287 are provided on the outer peripheral portion of the head support portion 281 and are spaced apart from each other on the diagonal line L3 of the upper surface 288.

  In the above embodiment, among the air blowing holes 81, 253, 263, 273, the ion air blowing holes 82, the dust collection holes 42, 254, 264, 274 and the vacuum suction holes 45, 255, 265, 275, the ion air blowing holes 82 Only the head support 201 was provided. However, in addition to the ion air blowing holes 82, the dust collection holes 42, 254, 264, 274 and the vacuum suction holes 45, 255, 265, 275 may be provided in the head support portion 201.

  In the above embodiment, normal air in which ions are not mixed is used as the air ejected from the air blowing holes 81, 253, 263, and 273. However, the air blown from the air blowing holes 81 253 263 273 may be ion air discharged from the ionizer 141.

  In the above embodiment, the protruding member 61 protrudes from the central portion of the lower surface 203 of the head support portion 201. That is, the protruding member 61 is integrally formed with the head support portion 201. However, the protruding member 61 may be separated from the head support 201. For example, the protruding member 61 may be screwed to the head support portion 201.

  In the above embodiment, at least one of the dust collection unit 151 and the adsorption unit 161 may be omitted. Further, when the adsorption unit 161 is not omitted, the devices (second electromagnetic valve 168, flow rate adjustment valve 169, and pressure switch 170) installed on the vacuum breaking channel 159 of the adsorption unit 161 may be omitted.

  In the above embodiment, the control of the air supply valve 132, the ionizer 141, the electromagnetic valve 143, the electromagnetic valve 152, the electromagnetic valve 232, the first electromagnetic valve 162, and the second electromagnetic valve 168 is controlled by one CPU 102. Each control may be performed by a separate CPU.

  -Although the non-contact conveyance apparatus of the said embodiment was designed to convey the wiring board 110 of a single product, for example, a plurality of substrate forming regions that should become the wiring board 110 are arranged along the plane direction. You may make it convey the wiring board for individual picking.

  In the above embodiment, the wiring board 110 is transported using the articulated robot for transportation equipped with the suction unit 20, but the wiring board 110 is transported using transport means such as a conveyor equipped with the suction unit 20. May be.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) In the above means 1, the wiring board is a resin wiring board having an electrode forming area on which the plurality of protruding electrodes are arranged on the main surface of the board, and a plurality of types of wiring boards having different external dimensions. A non-contact transfer device for a wiring board, which is selected from the above.

  (2) In the above means 1, the suction head is disposed in a plurality of dust collection passages communicating with the plurality of dust collection holes and in an outer region of the plurality of dust collection passages in the suction head. A non-contact transfer device for a wiring board comprising at least one of a plurality of suction channels communicating with the plurality of vacuum suction holes.

20, 280 ... suction part 21 ... suction surface 25 ... outer peripheral surfaces 42, 254, 264, 274 ... suction holes 45, 255, 265, 275 ... vacuum suction holes 55 ... insertion holes 61 ... projecting members 62 ... projecting The front end surface 71 of the member ... the ion air flow paths 73, 252, 262, 272 ... the concave portions 81, 253, 263, 273 ... the air blowing holes 82 ... the ion air blowing holes 110 ... the wiring substrate 120 as the object to be conveyed ... the substrate main surface 201, 281... Head support portions 203 and 282... Lower surfaces 211, 250, 260, 270 and 284 as connection surfaces of the head support portions to the suction heads. Suction head 221. , A2, A3, A4 ... central axis C2 of the recess ... virtual circle

Claims (6)

The suction surface is provided with a recess, and has a suction portion provided with a plurality of air blowing holes that open on the inner peripheral surface of the recess, and is ejected from the plurality of air blowing holes along the inner peripheral surface of the recess. In the non-contact transport device that transports the substrate main surface of the wiring substrate that is the object to be transported by sucking and holding the suction surface by the negative pressure generated by the air,
The suction part is
A suction head having the plurality of air blowing holes;
Non-contact conveyance of a wiring board, comprising: a head support portion that supports the suction head and is provided with an ion air blowing hole for blowing ion air to the main surface of the substrate, wherein the suction head is replaceable apparatus. The plurality of air blowing holes are arranged on a virtual circle concentric with the central axis of the recess,
The suction head is selected from a plurality of types of suction heads having different distances from the central axis of the recess to the plurality of air blowing holes,
The non-contact transfer device for a wiring board according to claim 1, wherein the head support portion is used in common for the plurality of types of suction heads. A projecting member protrudes from a central portion of the connection surface of the head support portion with the suction head,
The protruding member is inserted into an insertion hole provided in a central portion of the suction head, and has an ion air flow path for supplying ion air to the ion air blowing hole.
The ion air flow path is a linear flow path extending along the central axis of the ion air blowing hole, and the ion air blowing hole is opened at a tip surface of a protruding member constituting a part of the suction surface. The non-contact transfer device for a wiring board according to claim 1 or 2. The suction head has an air flow path for supplying air to the plurality of air blowing holes,
The air flow path has an introduction flow path extending from the outer peripheral surface of the suction head to the insertion hole side, an annular shape surrounding the insertion hole and extending along the center axis of the insertion hole, and an upstream end. The non-contact transfer device for a wiring board according to claim 3, further comprising an annular flow path that communicates with the introduction flow path and communicates with the plurality of air blowing holes at an end on the downstream side.   2. The suction head is provided with at least one of a plurality of dust collecting holes for collecting foreign matter on the main surface of the substrate and a plurality of vacuum suction holes for vacuuming. The non-contact conveyance apparatus of the wiring board of any one of 4. Using a non-contact conveyance system according to any one of claims 1 to 5, wiring, wherein you transport holding sucking the substrate main surface of the wiring substrate as an object to be conveyed to the suction surface A method for manufacturing a substrate.

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