JP5198551B2 - Wiring board non-contact transfer device and wiring board manufacturing method - Google Patents

Description

  The present invention relates to a non-contact conveyance device for a wiring substrate that conveys a wiring substrate that is an object to be conveyed using the action of an air current, and a method for manufacturing a wiring substrate using the non-contact conveyance device.

  Conventionally, a wiring board is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board is transported to a line for performing the next process every time the manufacturing process is completed. As a conventional transport method, a method has been proposed in which the surface of the wiring board is sucked with a negative pressure on the lower surface of the suction head having an air suction hole and the wiring board is transported together with the suction head in this state. Yes. However, when the wiring board is transported by the suction head, there is a problem that foreign matter (dust) generated by dirt or wear of the suction head adheres to the wiring board.

  In view of this, there has been proposed a transfer device that reduces the adhesion of foreign matter to the wiring board by transferring the object to be transferred such as the wiring board while sucking in a non-contact state (see, for example, Patent Document 1). Such a transport device includes a transport head, a gas supply hole (air blowing hole) that opens at the front end surface (suction surface) of the transport head, and a nozzle that is attached to the transport head and has a disk portion. . Then, when the suction surface of the transport head is brought close to the wiring board and the air supplied from the gas supply hole is led out to the outside through a slit formed between the suction surface and the disk portion, the air is transferred to the transport head. Radiated outwards. As a result, the space between the nozzle and the wiring board becomes negative pressure, and the wiring board is sucked and held by the transport head. In this state, if the transfer head is transferred using a robot arm or the like, the wiring board can be transferred in a non-contact state.

  By the way, in said prior art, since some discharge | released air collides with a wiring board, the foreign material on a board | substrate main surface can be blown away with the collided air, and can be removed. However, since the removed foreign matter diffuses together with the air, the foreign matter floats around the wiring board. As a result, foreign matters floating around the surface are likely to adhere to the surface of another wiring board. Further, in the above-described inspection process performed after the wiring board is transported, the wiring board is inspected for continuity by bringing an inspection jig such as a probe into contact with the solder bump on the surface of the wiring board. Therefore, if a continuity test is performed with foreign matter adhering to the surface of the solder bumps, foreign matter that does not conduct will be caught between the probe and the solder bumps. There is a possibility that it is determined to be a good product.

  Therefore, a technique has been proposed in which foreign matter on the main surface of the substrate is collected by sucking air from the dust collection holes. In this way, the diffusion of foreign matter to the periphery of the wiring board can be suppressed, so that the adhesion of foreign matter to another wiring board can be suppressed. Therefore, in the continuity inspection, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board is improved.

Japanese Patent Laying-Open No. 2005-219922 (FIGS. 1 to 5 etc.)

  However, although the central axis of the dust collection hole is arranged perpendicular to the main surface of the substrate, most of the air ejected from the air blowing holes flows substantially parallel to the main surface of the substrate. For this reason, when sucking air from the dust collection hole, the direction in which the air flows must be greatly changed (almost 90 ° change) and guided into the dust collection hole. It is difficult. As a result, the foreign matter that could not be collected diffuses around the wiring substrate, so that the foreign matter may adhere to another wiring substrate again.

  The present invention has been made in view of the above-mentioned problems, and a first object of the invention is wiring that can more reliably suppress the diffusion of foreign matter to the surroundings by efficiently collecting the foreign matter from the dust collection hole. An object of the present invention is to provide a non-contact transfer device for a substrate. A second object is to provide a suitable method for manufacturing a wiring board using the non-contact transfer device.

And as a means (means 1) for solving the above-mentioned subject, it has a suction part provided with an air blowing hole opened in the inner peripheral surface of the above-mentioned concave part provided with a concave part on the suction surface, and said air In a non-contact transport device that transports the substrate main surface of the wiring substrate that is the object to be transported by sucking and holding the suction surface by the negative pressure generated by the air ejected from the blow hole along the inner peripheral surface of the recess, An annular convex portion protruding so as to surround the suction surface is formed on the outer peripheral portion of the suction surface, and a dust collection hole for collecting foreign matter on the main surface of the substrate is formed in the concave portion of the suction surface. An outer region and an inner region of the convex portion are provided, and the suction portion is provided with a linear dust collection passage communicating with the dust collection hole, and the dust collection passage includes the suction surface and the While opening at the side of the suction part, the central axis is the suction There are non-contact transport apparatus of the wiring board, characterized in that it is arranged in a state inclined 15 ° to 60 ° with respect.

  Therefore, according to the non-contact conveyance device of the means 1, the air that flows out of the concave portion and flows almost parallel to the main surface of the substrate is less likely to flow out of the convex portion. If the air is sucked from the dust collecting hole in the, the diffused foreign matter can be efficiently collected together with the air. Therefore, the diffusion of foreign matter around the wiring substrate can be more reliably suppressed, and the adhesion of foreign matter to another wiring substrate can be more reliably suppressed. Therefore, in the continuity inspection, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board is improved.

  The total flow rate of air sucked from the dust collection holes is not particularly limited, but is preferably set larger than the total flow rate of air ejected to the inner area of the convex portion on the suction surface. In this way, since most of the air ejected to the inner region of the convex portion can be sucked from the dust collection hole, the flow velocity of the air ejected to the inner region of the convex portion increases. As a result, the pressure in the space generated between the suction surface of the suction portion and the substrate main surface of the wiring board can be greatly reduced, so that the wiring board can be reliably sucked. Specifically, it is preferable that the total flow rate of air sucked from the dust collection holes is set to be 1.1 times or more and 2.0 times or less of the total flow rate of air ejected to the inner region of the convex portion. . If the total flow rate of air sucked from the dust collection hole is less than 1.2 times the total flow rate of air jetted to the inner area of the convex portion, the flow velocity of air jetted to the inner area of the convex portion is It cannot be so high. As a result, the pressure in the space generated between the suction surface and the substrate main surface does not drop so much, and the wiring board cannot be reliably sucked. On the other hand, if the total flow rate of air sucked from the dust collection hole is larger than 2.0 times the total flow rate of air jetted into the inner area of the convex portion, the flow velocity of air jetted into the inner area of the convex portion is Since it becomes too high, the pressure of the space generated between the suction surface and the main surface of the substrate is too low. As a result, when the wiring board is sucked, the wiring board may be damaged by applying a large force.

  Here, the “wiring board” includes not only a single product wiring board but also a multi-cavity wiring board in which a plurality of substrate forming regions to be wiring boards are arranged along the plane direction. Examples of the material for forming the wiring board include inorganic materials such as ceramics, metals, and semiconductors, and organic materials such as resins. These materials are considered in consideration of cost, workability, insulation, mechanical strength, and the like. It can be suitably selected from the inside. Preferable examples of the ceramic material include low-temperature fired materials such as alumina, glass ceramic, and crystallized glass, aluminum nitride, silicon carbide, and silicon nitride. Suitable examples of the metal material include copper, a copper alloy, and an iron nickel alloy. A preferred example of the semiconductor material is silicon. Preferred examples of the resin material include polyimide resin, epoxy resin, bismaleimide-triazine resin, polyphenylene ether resin, and the like. In addition, composite materials of these resins and glass fibers (glass woven fabric or glass nonwoven fabric) or organic fibers such as polyamide fibers may be used. Alternatively, a resin-resin composite material obtained by impregnating a thermosetting resin such as an epoxy resin with a three-dimensional network fluorine-based resin base material such as continuous porous PTFE may be used. In particular, from the viewpoint of cost reduction, it is preferable to select an organic material such as a resin material as a wiring board forming material. With such a wiring board, a fine conductor layer can be formed relatively easily and accurately.

  Further, it is preferable that the height of the convex portion is set such that the convex portion and the wiring substrate are slightly separated in a state where the main surface of the wiring substrate is sucked and held by the suction surface of the suction portion. If the gap between the suction surface and the main surface of the substrate is blocked by the convex portion by making the convex portion too high, the flow of air that flows out of the concave portion and is sucked from the dust collecting hole is disturbed. As a result, as the flow rate of air sucked from the dust collection hole decreases, the flow rate of air blown from the air blow hole decreases, so the air blown from the air blow hole has a negative load necessary for suction of the wiring board. It may be difficult to generate pressure and the wiring board may not be sucked. On the other hand, if the convex portion is made too low, the air sucked from the dust collecting hole tends to flow out of the convex portion, so that it is difficult to guide the foreign matter collected together with the air into the dust collecting hole.

  In addition, it is preferable that the dust collection hole is arrange | positioned in multiple places along a convex part so that a recessed part may be surrounded. In this way, the air discharged from the recess can be reliably sucked from the plurality of dust collecting holes, so that the foreign matter on the main surface of the substrate can be reliably recovered together with the air.

  Here, the number of dust collection holes is not particularly limited. However, when many dust collection holes are provided on the suction surface, there is a problem that the processing cost of the suction part increases. On the other hand, when only a small number of dust collection holes are provided on the suction surface, air cannot be sucked from the dust collection holes, so that foreign matter on the main surface of the substrate cannot be reliably collected.

  In addition, the shape of the opening of the dust collecting hole when viewed from the front is not particularly limited, but for example, the dust collecting hole is preferably a long hole extending along the convex portion. In this way, it becomes easier to increase the total flow rate of air sucked from the dust collection hole than when the dust collection hole is a circular hole, for example. Furthermore, the suction surface is a surface having a substantially rectangular shape, and the length of the long hole is preferably set to 60% or more and 80% or less of the length of one side constituting the suction surface. If the length of the long hole is less than 60% of the length of one side, air can hardly be sucked from the long hole, so that foreign matter on the main surface of the substrate cannot be reliably collected. On the other hand, when the length of the long holes is larger than 80% of the length of one side, it is difficult to open all the long holes on the suction surface when the long holes are arranged at a plurality of locations.

  The suction part is provided with a dust collection channel that communicates with the dust collection hole. The dust collection channel opens at the suction surface and the side surface of the suction unit, and the central axis is 15 ° or more with respect to the suction surface. It is preferable to arrange in an inclined state of 60 ° or less. If the angle at which the central axis is inclined with respect to the suction surface is less than 15 °, it is difficult to provide a dust collection channel in the suction part. On the other hand, if the angle at which the central axis is inclined with respect to the suction surface is larger than 60 °, the direction in which air flows must be changed greatly and guided into the dust collecting flow path. It becomes difficult to collect.

  Moreover, it is preferable to provide a vacuuming means for collecting foreign matter on the main surface of the substrate by sucking air from the dust collection holes. In this way, since the foreign matter on the main surface of the substrate is reliably collected, the collected foreign matter is prevented from diffusing again and adhering to the wiring board.

  Further, as means (means 2) for solving the above-described problems, the non-contact transfer device described in the above means 1 is used to suck and hold the main surface of the wiring board, which is a transferred object, on the suction face. In the method of manufacturing a wiring substrate by transporting the substrate, the air is sucked from a dust collection hole disposed in an outer region of the concave portion and an inner region of the convex portion on the suction surface. Collecting foreign matter on the surface, the total flow rate of air sucked from the dust collection hole is set to be larger than the total flow rate of air ejected to the inner area of the convex portion on the suction surface There is a non-contact conveyance method of the wiring board to be performed.

  Therefore, according to the non-contact conveyance method of the means 2, the wiring board can be manufactured while efficiently collecting the foreign matter from the dust collecting hole by using the non-contact conveyance device of the means 1. Therefore, for example, in the continuity inspection after the conveyance, it is difficult to determine that the wiring board is defective due to the adhesion of foreign matter, so that the yield of the wiring board can be improved. Further, the total flow rate of air sucked from the dust collection holes is set to be larger than the total flow rate of air ejected to the inner area of the convex portion. As a result, since most of the air ejected to the inner area of the convex portion can be sucked from the dust collection hole, the flow velocity of the air ejected to the inner area of the convex portion is increased. Therefore, since the pressure of the space generated between the suction surface of the suction portion and the substrate main surface of the wiring board can be greatly reduced, the wiring board can be sucked more reliably.

  The wiring board forming material is preferably an organic material such as a resin material. In particular, the wiring board is a resin wiring board having an electrode forming area on which a plurality of protruding electrodes are arranged on the main surface of the board. Preferably there is. The reason for this is that when the wiring board is to be transported in a contact state, there is a problem that the protruding electrode formed on the main surface of the wiring board is crushed by the suction portion and deformed. This is because the significance of adopting the non-contact conveyance device of the above means occurs. Further, since the resin wiring board has a problem that static electricity is likely to be accumulated and foreign matters are likely to adhere to it, it is significant to adopt the above means for solving this problem.

The front view which shows schematic structure of the non-contact conveying apparatus in 1st Embodiment. Sectional drawing which shows schematic structure of a wiring board. The bottom view which shows schematic structure of a non-contact conveying apparatus. The bottom view which shows a suction part. AA line sectional view of Drawing 4. The bottom view which shows the positional relationship of an air blowing hole and an ion air blowing hole. The principal part sectional view showing a suction part. The bottom view which shows the suction head which can be attached to a head support part. The bottom view which shows the suction head which can be attached to a head support part. The bottom view which shows the suction head which can be attached to a head support part. The circuit diagram which shows a non-contact conveying apparatus. The front view which shows the resin-made pads in 2nd Embodiment. Similarly, a side view showing a resin pad and a suction head.

[First Embodiment]
Hereinafter, a first embodiment embodying the present invention will be described in detail with reference to the drawings.

  As shown in FIG. 1, the transport head 11 provided in the non-contact transport device transports a wiring board 110 that is a transported object by using the action of an air current.

  As shown in FIG. 2, the wiring board 110 of this embodiment is an organic package (resin wiring board) for mounting an IC chip, and shows a state after a plurality of manufacturing steps and before an inspection step. Yes. The wiring substrate 110 has a substantially rectangular plate shape in plan view of 30 mm length × 30 mm width. Further, the wiring substrate 110 includes a substantially rectangular core substrate 111, a first buildup layer 114 formed on the core main surface 112 (upper surface in FIG. 2) of the core substrate 111, and a core back surface of the core substrate 111. And a second buildup layer 115 formed on the lower surface 113 (the lower surface in FIG. 2). The build-up layers 114 and 115 have a structure in which a resin insulating layer made of a thermosetting resin (epoxy resin) and a conductor layer made of copper are alternately laminated. In addition, terminal pads 116 (projection electrodes) are formed in an array at a plurality of locations on the substrate main surface 120 (on the upper surface of the first buildup layer 114) of the wiring substrate 110, and on the substrate back surface 121 of the wiring substrate 110. BGA pads 117 are formed in an array at a plurality of locations (on the lower surface of the second buildup layer 115). Further, a plurality of solder bumps 118 (protruding electrodes) are disposed on the surface of the terminal pad 116. Each solder bump 118 is connected to a terminal of an IC chip having a rectangular flat plate shape. Note that an area formed by each terminal pad 116 and each solder bump 118 is an electrode forming area 119 on which an IC chip can be mounted.

  The transfer head 11 shown in FIGS. 1 and 3 is attached to the tip of an arm of a transfer articulated robot (not shown). The transport head 11 includes a slide table 2 and a suction unit 20 attached to the slide table 2 via a connection plate 12 having an L shape when viewed from the front. The slide table 2 is attached to a table body 3 extending along the vertical direction, and can move up and down. The suction unit 20 approaches and separates from the wiring board 110 with the suction surface 21 facing the wiring board 110.

  In addition, the transport head 11 includes an air chuck 181 that holds and fixes the wiring board 110 so that the circuit board 110 cannot be displaced. The air chuck 181 is connected to the chuck main body 183, a pair of arm portions 182 that are fixed to the chuck main body 183 at the base end portion and extend away from the suction portion 20, and a distal end portion of the arm portion 182. And a pair of contact portions 184 facing each other. The chuck main body 183 drives both the arm portions 182 to bring the both contact portions 184 closer to and away from each other. Further, both contact parts 184 are formed of a resin (PEEK resin in the present embodiment) having a hardness higher than that of the wiring board 110, and have engaging recesses 185 on the inner side. Both engaging recesses 185 are configured to hold two corners located on opposite sides of the four corners constituting the wiring board 110 when the substrate holding and fixing the slide table 2 is lowered.

  As shown in FIGS. 4 and 5, the suction part 20 includes a suction part main body 22, a protruding member support 51, and a resin pad 40. The suction part main body 22 is formed of a metal material (in this embodiment, an aluminum alloy containing platinum), and has a substantially rectangular parallelepiped shape of 50 mm long × 50 mm wide × 67 mm high. The suction unit body 22 includes a suction head 211 that forms the lower part of the suction unit body 22 and a head support unit 201 that forms the upper part of the suction unit body 22 and supports the suction head 211. The support part 201 has a structure that can be divided from each other. The head support portion 201 is formed of a block material having a substantially rectangular parallelepiped shape with a length of 50 mm, a width of 50 mm, and a height of 22 mm.

  A first port mounting hole 30 that opens at the upper surface 202 of the head support 201 is provided at the center of the head support 201. A first port 90 is attached to the first port attachment hole 30. The first port 90 is made of a conductive metal, and an antistatic tube (not shown) made of a material obtained by mixing carbon black into polyurethane is connected to the first port 90. Further, a pair of screw insertion holes 34 that open on the upper surface 202 are provided in an outer region of the first port mounting hole 30 in the head support portion 201. The suction unit 20 is attached to the transport head 11 by screwing a screw (not shown) penetrating the connection plate 12 of the transport head 11 into the screw insertion hole 34. Further, a projecting member 61 projects from the center of the lower surface 203 of the head support portion 201 (that is, the connection surface with the suction head 211). Further, the head support portion 201 has an upper pin accommodation hole 35 that opens at the lower surface 203, and an opening at the side surface of the head support portion 201 (that is, the outer peripheral surface 25 of the suction portion 20) and the upper pin accommodation hole 35. An engaging pin hole 36 that communicates is provided. A member connection connector 37 is attached to the side surface of the head support portion 201. The member connection connector 37 includes an engagement pin 38, and the distal end portion of the engagement pin 38 is inserted into the engagement pin hole 36. The engagement pin 38 is urged toward the upper pin accommodation hole 35 by a spring 39.

  As shown in FIGS. 4 and 5, the suction head 211 has a structure in which a head main body 212 and a head front end portion 213 constituting a lower end portion of the suction head 211 are integrally formed. The head main body 212 has a substantially rectangular parallelepiped shape with a length of 50 mm, a width of 50 mm, and a height of 36 mm, and the head tip 213 has a substantially rectangular parallelepiped shape with a length of 28 mm × width of 28 mm × height of 9 mm. The head main body 212 is provided with a second port mounting hole 31, a third port mounting hole 32, and a fourth port mounting hole 33 that open on the side surface of the head main body 212 (that is, the outer peripheral surface 25 of the suction portion 20). Yes. A second port 91 is attached to the second port attachment hole 31, and a third port 92 is attached to the third port attachment hole 32. Further, a fourth port 93 is attached to the fourth port attachment hole 33. Each port 91 to 93 is made of a conductive metal, and an antistatic tube is connected to each port 91 to 93.

  As shown in FIG. 5, a support insertion hole 26 that penetrates the upper surface 23 and the lower surface 24 of the suction head 211 is provided at the center of the suction head 211. The upper end 23 side end of the support insertion hole 26 is a screw hole, and the lower end 24 side end of the support insertion hole 26 is a recess that becomes an annular flow path 223 of an air flow path 221 described later. ing. Further, in the outer region of the support body insertion hole 26 in the head main body 212, a lower pin accommodation hole 28 that opens at the upper surface 23 and an opening at the side surface of the head main body 212 and communicate with the lower pin accommodation hole 28. An air vent hole 29 is provided. Therefore, the distal end portion of the pin 19 is inserted into the upper pin accommodation hole 35 on the head support portion 201 side, and the proximal end portion of the pin 19 is inserted into the lower pin accommodation hole 28. By engaging the distal end portion of the engagement pin 38 with the constricted portion 18, the head support portion 201 and the suction head 211 are fixed to each other.

  As shown in FIG. 5, the suction head 211 is provided with 16 dust collection channels 191 that open at the lower surface 24. Each dust collecting channel 191 is disposed in an outer region of the support insertion hole 26 in the suction head 211. Each dust collection channel 191 communicates with the third port mounting hole 32 and is connected to the dust collection unit 151 (see FIG. 11). The suction head 211 is provided with four suction channels 195 that open at the lower surface 24. Each adsorption channel 195 is disposed in the outer region of the support insertion hole 26 and each dust collection channel 191 in the suction head 211. The adsorption channel 195 communicates with the fourth port mounting hole 33 and is connected to the adsorption unit 161 (see FIG. 11).

  The protruding member support 51 is accommodated in the support insertion hole 26 of the suction head 211, and the upper end portion is screwed to the upper end 23 side end of the support insertion hole 26. The protruding member support 51 is made of a metal material (aluminum in the present embodiment) and has a substantially annular shape with an outer diameter of 11 mm and a height of 42 mm. The protruding member support 51 is provided with a protruding member insertion hole 55 having an inner diameter of 9 mm. The protruding member insertion hole 55 passes through the upper surface 52 and the lower surface 53 (see FIG. 7) of the protruding member support 51.

  As shown in FIGS. 4 to 7, the protruding member 61 is inserted into the protruding member insertion hole 55 and has a substantially annular shape with an outer diameter of 7 mm and a height of 42 mm. Inside the protruding member 61, an ion air passage 71 having an inner diameter of 2.5 mm for supplying ion air is provided. The ion air flow channel 71 is opened at the front end surface 62 (lower end surface) of the protruding member 61 that constitutes a part of the suction surface 21. The ion air flow path 71 communicates with the first port mounting hole 30 and is connected to the ionizer 141 (see FIG. 11). Furthermore, the suction surface 21 is provided with a circular recess 73 as viewed from below. Further, at the center of the recess 73, a nozzle tip portion 75 having a substantially trapezoidal cross section and a circular shape when viewed from below is projected. The ion air channel 71 is a linear channel extending along the central axis A1 of the recess 73.

  Further, ion air blowing holes 82 communicating with the ion air flow channel 71 are provided at six locations in the center of the recess 73. More specifically, each ion air blowing hole 82 is provided so as to surround the nozzle tip 75 on a virtual circle C1 set concentrically with the central axis A1. Moreover, each ion air blowing hole 82 is arrange | positioned at equal angle (60 degrees) space | intervals on the basis of central axis A1. Each ion air blowing hole 82 has a circular shape and an inner diameter of 1.0 mm. Each ion air blowing hole 82 is arranged such that the central axis is perpendicular to the substrate main surface 120 of the wiring board 110, and the ion air supplied from the ion air flow channel 71 is perpendicular to the substrate main surface 120. It comes to spray. Further, the center axis of each ion air outlet hole 82 extends along the center axis A1 of the ion air flow path 71 and is disposed in parallel with the center axis A1.

  As shown in FIGS. 5 and 7, the suction head 211 is provided with an air flow path 221 for supplying air separately from the ion air flow path 71. The air flow path 221 includes an introduction flow path 222 and an annular flow path 223. The introduction flow path 222 extends from the outer peripheral surface 25 of the suction part 20 (head main body 212) to the protruding member insertion hole 55 side (ion air flow path 71 side). The introduction flow path 222 communicates with the second port 91 and is connected to the air unit 231 (see FIG. 11). The annular flow path 223 is a flow path formed between the support insertion hole 26 and the protruding member support 51, and surrounds the protruding member insertion hole 55 (ion air flow path 71), and the protruding member insertion hole 55. Is formed in an annular shape extending along the central axis (the central axis of the ion air passage 71). The annular flow path 223 communicates with the introduction flow path 222 at the upstream end.

  As shown in FIGS. 4 to 7, the suction portion 20 (head tip portion 213) communicates with the downstream end portion of the annular flow path 223 and opens on the inner peripheral surface of the recess 73. Holes 81 are provided at six locations. Each air blowing hole 81 is configured to eject the air supplied from the air flow path 221 into the recess 73. Then, the air blown out from each air blowing hole 81 is guided along the circumferential direction of the recess 73 and collides with the ion air blown from the ion air blowing hole 82 toward the substrate main surface 120, thereby causing the ion air to flow. The entire main surface 120 of the substrate is diffused. Note that the suction unit 20 of the present embodiment is a Bernoulli chuck that holds the wiring board 110 by using the Bernoulli effect generated by the air flow generated between the suction part main body 22 and the wiring board 110.

  As shown in FIG. 6, each air blowing hole 81 is arranged so as to be rotationally symmetric with respect to the central axis A <b> 1 of the recess 73, and opens along the circumferential direction of the recess 73. Yes. Specifically, each air blowing hole 81 is arranged so as to surround each ion air blowing hole 82 on a virtual circle C2 set concentrically with the central axis A1. In addition, the air blowing holes 81 are arranged at equiangular (60 °) intervals with respect to the central axis A1. Furthermore, each air blowing hole 81 is inclined by the same angle θ1 (30 ° in the present embodiment) to the center side of the recess 73 with respect to the tangent L1 of the virtual circle C2 that is in contact with the position of the air blowing hole 81. It is open. In addition, each air blowing hole 81 is opened in a state where it is not inclined to the outside of the recess 73 with respect to the suction surface 21. That is, each air blowing hole 81 opens in parallel to the suction surface 21. Further, the air blowing hole 81 opens toward the adjacent air blowing hole 81. In addition, the internal diameter of each air blowing hole 81 is set to 1.2 mm.

  As shown in FIG. 4, the resin pad 40 is attached to the head tip 213, and the front surface (lower surface) is the suction surface 21. The resin pad 40 is made of a resin material (ether urethane in the present embodiment) and has a substantially rectangular plate shape with a length of 28 mm × width of 28 mm × height of 2.0 mm. Further, a through hole 41 having a diameter of 16 mm is provided at the center of the resin pad 40. The through-hole 41 is configured to expose the concave portion 73 and the like of the suction unit main body 22. Further, the resin pad 40 is provided with a substantially rectangular annular convex portion 43 in a plan view protruding from the suction surface 21 by 1.0 mm on the outer peripheral portion of the suction surface 21 having a substantially rectangular shape. The convex portion 43 is a protrusion having a width of 1.0 mm that protrudes so as to surround the suction surface 21. Note that the four corner portions 44 constituting the convex portion 43 have a substantially rectangular shape in a plan view of 4.5 mm long × 4.5 mm wide. Further, the resin pad 40 is provided with four vacuum suction holes 45 opened at the respective corners 44. That is, each vacuum suction hole 45 is disposed so as to open in the outer region of the through hole 41 and the recess 73. Each vacuum suction hole 45 communicates with the suction flow path 195 of the suction head 211 (see FIG. 5).

  Further, the resin pad 40 is provided with a dust collection hole 42 for collecting foreign matter on the board main surface 120 (see FIG. 2) of the wiring board 110. The dust collecting holes 42 are arranged at 16 locations along the convex portion 43 so as to surround the concave portion 73, and are arranged at equal intervals along the convex portion 43. More specifically, each dust collecting hole 42 is disposed so as to open in the outer region of the concave portion 73 (through hole 41) and in the inner region of the convex portion 43. Each dust collection hole 42 communicates with the dust collection channel 191. In addition, the internal diameter of each dust collection hole 42 is set larger than the width | variety (1.0 mm) of the convex part 43, and is set to 2.5 mm in this embodiment. In the present embodiment, the total flow rate of air sucked from the dust collection holes 42 is set to be larger than the total flow rate of air ejected to the inner area of the convex portion 43 in the suction surface 21.

  Note that the suction head 211 of this embodiment is selected from four types of suction heads according to the outer dimensions of the wiring board to be transported. More specifically, the suction head 211 is selected when it is a wiring board having a vertical and horizontal length of 29 mm or more and 37.5 mm or less. When the wiring board has a vertical and horizontal length of 19 mm or more and 22 mm or less, the suction head 250 (see FIG. 8) is selected. Further, when the wiring board has a vertical and horizontal length of 23 mm or more and 27 mm or less, the suction head 260 (see FIG. 9) is selected, and the vertical and horizontal lengths of 40 mm or more and 50 mm or less, or 50 mm. In the case of a substrate, the suction head 270 (see FIG. 10) is selected. From the above, the suction head 211 is selected when transporting the wiring board 110 (see FIG. 2) having a vertical and horizontal length of 30 mm. The wiring board 110 is selected from a plurality of types of wiring boards having different external dimensions. Further, the suction head 211 can be replaced with suction heads 250, 260, and 270. The head support portion 201 is used in common for each of the suction heads 211, 250, 260, and 270.

  Further, the suction heads 211, 250, 260, and 270 are different from each other in the vertical and horizontal lengths of the head tip portions 213, 251, 261, and 271. Furthermore, the suction heads 211, 250, 260, and 270 are different from each other in the installation mode of the air blowing holes 81, 253, 263, and 273. More specifically, the suction heads 211, 250, 260, 270 have distances from the central axes A1, A2, A3, A4 of the recesses 73, 252, 262, 272 to the air blowing holes 81, 253, 263, 273, respectively. They are different from each other. In the suction head 211 of this embodiment, the vertical and horizontal lengths of the head tip 213 are set to 28 mm, and the distance from the central axis A1 to the air blowing hole 81 is set to 9 mm. Further, in the suction head 250, the vertical and horizontal lengths of the head tip portion 251 are set to 18 mm, and the distance from the central axis A2 of the concave portion 252 to the air blowing hole 253 is set to 9 mm. In the suction head 260, the longitudinal and lateral lengths of the head tip 261 are set to 22 mm, and the distance from the central axis A3 of the recess 262 to the air blowing hole 263 is set to 9 mm. In the suction head 270, the vertical and horizontal lengths of the head tip 271 are set to 38 mm, and the distance from the central axis A4 of the recess 272 to the air blowing hole 273 is set to 15 mm.

  Further, an electrostatic potential sensor 105 (see FIG. 11) is installed at the contact portion 184 of the air chuck 181. The electrostatic potential sensor 105 is embedded in the contact portion 184 and is disposed so as to be exposed from the engagement recess 185 of the contact portion 184. That is, the electrostatic potential sensor 105 is provided at a position in contact with the outer peripheral edge of the wiring board 110. The electrostatic potential sensor 105 measures static electricity charged on the wiring board 110 and outputs a static electricity measurement signal.

  Next, the system configuration of the non-contact conveyance device will be described.

  As shown in FIG. 11, the non-contact conveyance device includes an air supply source 131 that sends out pressurized air. In addition, the non-contact conveyance device includes an air supply channel 130 that can communicate between the air supply source 131 and the suction unit 20. The air supply channel 130 is branched into a first air channel 140, a second air channel 150, and a third air channel 160 on the downstream side. The first air flow path 140 communicates with the ion air flow path 71 of the suction unit 20 via the antistatic tube and the first port 90 (see P3 in FIGS. 5 and 11). The second air flow path 150 communicates with the air flow path 221 of the suction unit 20 via the antistatic tube and the second port 91 (see P2 in FIGS. 5 and 11). The third air flow path 160 communicates with the suction flow path 195 of the suction unit 20 via the antistatic tube and the fourth port 93 (see P1 in FIGS. 5 and 11).

  As shown in FIG. 11, an air supply valve 132 is installed on the air supply channel 130. The air supply valve 132 is disposed on the downstream side of the air supply source 131, and switches the air supply flow path 130 between an open state and a closed state. The air supply valve 132 is configured to be able to supply air to the downstream side when switched to the open state. Note that the air supply valve 132 of the present embodiment is an electromagnetic valve that is operated by a solenoid (not shown).

  An air pressure adjusting unit 133 that adjusts the air pressure in the air supply channel 130 to a constant value is installed on the air supply channel 130. That is, the air pressure adjustment unit 133 is connected to the air supply valve 132 and the air supply source 131 through the air supply flow path 130 in a flow path. The air pressure adjustment unit 133 includes an air filter 134, a pressure gauge 135, and a pressure reducing valve 136. The air filter 134 is disposed on the downstream side of the air supply valve 132, and removes foreign matters contained in the air passing through the air supply flow path 130. The pressure gauge 135 is disposed downstream of the air filter 134 and measures the pressure of air passing through the air supply flow path 130. Further, the pressure reducing valve 136 is disposed on the downstream side of the pressure gauge 135, performs pressure reduction of the air passing through the air supply flow path 130, and supplies the reduced air to the downstream side. An air filter 137 is installed on the air supply channel 130. The air filter 137 is disposed on the downstream side of the pressure reducing valve 136 and removes moisture contained in the air passing through the air supply flow path 130.

  As shown in FIG. 11, an ion air unit 147 is installed on the first air flow path 140. The ion air unit 147 includes a pressure reducing valve 145, a pressure gauge 146, an electromagnetic valve 143, an air filter 144, and an ionizer 141. The pressure reducing valve 145 is disposed on the downstream side of the air filter 137, performs pressure reduction of the air passing through the first air flow path 140, and supplies the reduced air to the downstream side. The pressure gauge 146 is disposed on the downstream side of the pressure reducing valve 145 and measures the pressure of air passing through the first air flow path 140.

  Moreover, the electromagnetic valve 143 is arrange | positioned in the downstream of the pressure gauge 146, and switches the 1st air flow path 140 to an open state or a closed state. When the electromagnetic valve 143 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to reduce the air pressure. The electromagnetic valve 143 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101 described later. The air filter 144 is disposed on the downstream side of the electromagnetic valve 143, and removes foreign matters contained in ion air passing through the first air flow path 140.

  As shown in FIG. 11, the ionizer 141 is a DC ionizer, and is arranged on the downstream side of the air filter 144. The ionizer 141 applies an DC voltage to each discharge needle, an ionizer body 142 communicating with the first air flow path 140, two discharge needles (positive and negative discharge needles) protruding into the ionizer body 142. High-voltage power supply. Each discharge needle generates ions around the tip by performing corona discharge when a DC voltage is applied. More specifically, the positive electrode discharge needle generates positive ions when the polarity of the applied DC voltage is positive (+), and the negative electrode discharge needle has a negative (-) polarity of the applied DC voltage. In this case, anions are generated. The ionizer 141 generates ion air by mixing the generated ions with the air guided into the ionizer body 142. Further, the ionizer 141 discharges the generated ion air to the downstream side of the first air flow path 140. The ion air is guided to the ion air channel 71 of the suction unit 20 through the antistatic tube and the first port 90.

  As shown in FIG. 11, an air unit 231 is installed on the second air flow path 150. The air unit 231 includes an electromagnetic valve 232, a flow rate adjustment valve 233, and an air filter 234. The electromagnetic valve 232 is disposed on the downstream side of the air filter 137, and switches the second air flow path 150 to an open state or a closed state. When the electromagnetic valve 232 is switched to the open state, the air can be supplied to the downstream side, and the air pressure is appropriately discharged to adjust the air pressure to a reduced pressure. The electromagnetic valve 232 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 233 is disposed in the middle of the flow path connecting the electromagnetic valve 232 and the air filter 234, and the air flowing through the second air flow path 150 is quantitatively exhausted so that the pressure of the air is constant. It is a throttle valve that adjusts the pressure to be reduced. The air filter 234 is disposed on the downstream side of the flow rate adjustment valve 233 and removes foreign matters contained in the air passing through the second air flow path 150.

  As shown in FIG. 11, an adsorption unit 161 is installed on the third air flow path 160. Further, the adsorption unit 161 branches into a substrate adsorption channel 158 and a vacuum break channel 159 communicating with the third air channel 160.

  A first electromagnetic valve 162 and an air filter 167 are installed on the substrate adsorption flow path 158. The first electromagnetic valve 162 is disposed on the downstream side of the air filter 137 and switches the substrate adsorption flow path 158 between an open state and a closed state. When the first solenoid valve 162 is switched to the open state, the air in the vicinity of the vacuum suction hole 45 of the suction unit 20 is evacuated through the suction flow path 195, the fourth port 93, the air filter 167, and the like. At the same time, air is appropriately sucked to adjust the air pressure. The first electromagnetic valve 162 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  As shown in FIG. 11, a second electromagnetic valve 168, a flow rate adjustment valve 169, and a pressure switch 170 are installed on the vacuum breaking channel 159. The second electromagnetic valve 168 is disposed on the downstream side of the air filter 137, and the vacuum break channel 159 is switched to an open state or a closed state. When the second electromagnetic valve 168 is switched to the open state, the second electromagnetic valve 168 supplies air to the connection flow path connecting the air filter 167 and the suction unit 20 to weaken the degree of vacuum of the connection flow path. . At the same time, when the second electromagnetic valve 168 is switched to the open state, the air flowing through the vacuum breaking flow path 159 is appropriately discharged to adjust the pressure reduction. Note that the second electromagnetic valve 168 of the present embodiment is a two-position, direct-acting normally closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101. The flow rate adjusting valve 169 is disposed in the middle of the flow path connecting the second electromagnetic valve 168 and the pressure switch 170, and the air flowing through the vacuum breaking flow path 159 is quantitatively exhausted to reduce the pressure of the air. This is a throttle valve that adjusts the pressure to a constant value. The pressure switch 170 is disposed on the downstream side of the flow rate adjustment valve 169 and the air filter 167. The pressure switch 170 is turned on when the pressure in the vacuum break channel 159 exceeds a predetermined value (that is, vacuum break), and outputs a vacuum break signal to the CPU 102 of the control device 101. It is supposed to be.

  As shown in FIG. 11, the non-contact conveyance device includes a vacuum channel 153, and a dust collection unit 151 is installed on the vacuum channel 153. The vacuum channel 153 communicates with the dust collection channel 191 of the suction unit 20 via the antistatic tube and the third port 92 (see P4 in FIGS. 5 and 11). The dust collection unit 151 includes an electromagnetic valve 152 and an air filter 157. The electromagnetic valve 152 switches the vacuum channel 153 to an open state or a closed state. When the solenoid valve 152 is switched to the open state, the solenoid valve 152 sucks air in the vicinity of the dust collection hole 42 of the suction unit 20 through the dust collection flow path 191, the third port 92, the air filter 157, and the like. The air pressure is adjusted by pressurizing air appropriately. That is, the dust collection unit 151 has a function as a vacuuming means for collecting foreign matter on the main surface 120 of the substrate by sucking (evacuating) air from the dust collection hole 42. The electromagnetic valve 152 of this embodiment is a two-position, direct-acting normally-closed electromagnetic valve that is operated by a single-action solenoid, and is switched to an open state based on a control signal output from the control device 101.

  Next, the electrical configuration of the non-contact conveyance device will be described.

  As shown in FIG. 11, the non-contact conveyance device includes a control device 101 that controls the entire device. The control device 101 includes a CPU 102, a ROM 103, a RAM 104, an input / output circuit, and the like. The CPU 102 is electrically connected to the air supply valve 132, the ionizer 141, the electromagnetic valves 143, 152, 232, the first electromagnetic valve 162, and the second electromagnetic valve 168, and controls them by various driving signals.

  The CPU 102 is configured to receive an electrostatic measurement signal output from the electrostatic potential sensor 105. Then, the CPU 102 determines whether the wiring board 110 attracted by the suction unit 20 is charged positively (+) or negatively (−) based on the polarity of the electrostatic charge indicated by the electrostatic measurement signal. It is supposed to be. When it is determined that the wiring board 110 is positively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to perform control to generate negative ions on the discharge needle on the negative electrode side. It has become. On the other hand, when it is determined that the wiring board 110 is negatively charged, the CPU 102 outputs a drive signal to the ionizer 141 and applies a DC voltage to generate positive ions in the positive discharge needle. It is like that. According to such control, static electricity charged on the wiring board 110 can be reliably neutralized.

  In this embodiment, although the DC ionizer 141 is used, an AC ionizer may be used instead. The AC ionizer includes an ionizer body, one discharge needle protruding from the ionizer body, and a high-voltage power source that applies an AC voltage to the discharge needle. When an alternating voltage is applied, the discharge needle generates a cation or an anion according to the polarity of the applied alternating voltage. In this case, when the electrostatic measurement signal output from the electrostatic potential sensor 105 is input, the CPU 102 determines whether or not the wiring board 110 is charged based on the electrostatic charge amount indicated by the electrostatic measurement signal. When it is determined that the wiring board 110 is charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to increase the output of the ionizer 141. On the other hand, when it is determined that the wiring board 110 is not charged, the CPU 102 outputs a drive signal to the ionizer 141 and performs control to weaken the output of the ionizer 141. Such control can reliably prevent the wiring board 110 from being charged. Further, it is possible to prevent the ionizer 141 from operating more than necessary.

  Next, a non-contact conveyance method for the wiring board 110 will be described.

  The wiring board 110 of the present embodiment is manufactured through a plurality of manufacturing processes, and is shipped after undergoing an inspection process for conducting a continuity test. The wiring board 110 is placed on a board support (not shown) every time the manufacturing process is completed. In this state, the wiring board 110 is transferred using a non-contact transfer device. More specifically, the transfer head 11 is lowered by driving the arm of the transfer articulated robot. In the present embodiment, one suction head (suction head 211 in this case) is selected from the four types of suction heads 211, 250, 260, and 270 according to the external dimensions of the wiring board, and the selected suction head is selected. The transport head 11 is lowered while attached to the head support 201.

  In the subsequent air ejection process, the CPU 102 outputs drive signals to the air supply valve 132 and the electromagnetic valve 232 to switch the air supply valve 132 and the electromagnetic valve 232 to the open state. As a result, the pressurized air sent from the air supply source 131 passes through the air supply channel 130 and is guided to the second air channel 150. Then, the air guided to the second air flow path 150 flows into the suction unit 20 via the second port 91 (see P2 in FIGS. 5 and 11) and is guided to the air flow path 221.

  In the present embodiment, the air guided to the air flow path 221 passes through the air blowing hole 81 and is jetted from the air blowing hole 81 along the inner peripheral surface of the recess 73. As a result, most of the air ejected from the air blowing hole 81 flows in the direction in which the air blowing hole 81 opens and flows out of the recess 73, and then passes through the gap between the suction surface 21 and the substrate main surface 120. At this time, a high-speed flow is discharged to the outside of the suction unit 20. As a result, the space generated between the suction surface 21 and the substrate main surface 120 becomes negative pressure, and the substrate main surface 120 of the wiring substrate 110 is sucked and held by the suction surface 21 (see FIG. 1). A part of the air ejected from the air blowing hole 81 flows along the circumferential direction of the recess 73 to form a swirling flow.

  In the subsequent dust collection process, the CPU 102 outputs a drive signal to the electromagnetic valve 152 to switch the electromagnetic valve 152 to the open state. As a result, air in the vicinity of the dust collection hole 42 of the suction unit 20 is sucked through the dust collection passage 191 and the third port 92 (see P4 in FIGS. 5 and 11). As a result, the foreign matter adhering on the board main surface 120 of the wiring board 110 is collected together with air.

  In the subsequent ion air ejection process, the CPU 102 outputs drive signals to the ionizer 141 and the electromagnetic valve 143. As a result, the electromagnetic valve 143 is switched to the open state and the ionizer 141 is activated. The pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and flows into the ionizer 141 on the first air flow path 140. The ionizer 141 generates ion air by mixing ions with the air introduced into the ionizer body 142. The ionizer 141 releases the generated ion air to the downstream side of the ionizer 141. Further, the ion air discharged from the ionizer 141 flows into the suction unit 20 through the first air flow path 140 and the first port 90 (see P3 in FIGS. 5 and 11) and is guided to the ion air flow path 71. .

  In the present embodiment, the ion air guided to the ion air flow path 71 is blown vertically from the ion air blowing hole 82 toward the substrate main surface 120 of the wiring substrate 110 to remove foreign matters on the substrate main surface 120. Further, the air blown out from the air blowing hole 81 collides with the ion air blown from the ion air blowing hole 82. As a result, ion air diffuses over the entire substrate main surface 120, so that foreign matter on the substrate main surface 120 is reliably removed by being blown away.

  Further, in the present embodiment, the substrate main surface 120 is sucked and held on the suction surface 21, and at the same time, the ion air blown from the ion air blowing holes 82 is pushed back toward the suction surface 21 by the wiring substrate 110 sucked and held. Spread throughout. As a result, ions contained in the ion air come into contact with the entire substrate main surface 120, and static electricity charged on the wiring board 110 is removed.

  In the subsequent positioning step, the arm of the transfer articulated robot is driven to raise the wiring board 110 together with the transfer head 11. Further, the suction table 20 is lowered by driving the slide table 2 of the transport head 11, and the suction surface 21 of the suction unit 20 is brought close to the board main surface 120 of the wiring board 110. Then, the air chuck 181 of the transport head 11 is driven to bring the contact portion 184 of the arm portion 182 closer to the wiring board 110. As a result, the engagement recess 185 of each contact portion 184 engages with the two corners of the wiring board 110, and the wiring board 110 is held and fixed without being misaligned.

  In the subsequent adsorption process, the CPU 102 outputs a drive signal to the first electromagnetic valve 162. As a result, the first electromagnetic valve 162 is switched to the open state, and the ion air in the vicinity of the vacuum suction hole 45 of the suction unit 20 passes through the suction flow path 195 and the fourth port 93 (see P1 in FIGS. 5 and 11). It is evacuated. As a result, the substrate main surface 120 of the wiring substrate 110 is stably held by the suction surface 21 by the suction force by the Bernoulli effect and the suction force by vacuuming.

  Thereafter, the air chuck 181 of the transport head 11 is driven to separate the contact portion 184 from the wiring board 110. As a result, the engagement of the engagement recess 185 with respect to the corner of the wiring board 110 is released. Further, the suction table 20 is raised by driving the slide table 2 of the transport head 11.

  Then, the arm of the transfer articulated robot is driven to transfer the wiring board 110 to the inspection process line. When the wiring board 110 reaches the inspection process line, the wiring board 110 is released, and the wiring board 110 is placed on a support for the inspection process line. Specifically, the CPU 102 performs control for switching the electromagnetic valve 143 to the closed state, and blocks the first air flow path 140. As a result, the supply of ion air to the suction unit 20 is stopped, and the ejection of ion air from the ion air blowing hole 82 ends. At the same time, the CPU 102 performs control for switching the electromagnetic valve 152 to the closed state, thereby blocking the vacuum flow path 153. As a result, the suction of air from the dust collection hole 42 is completed. In addition, the arm of the transfer articulated robot is driven to lower the wiring board 110 together with the transfer head 11.

  Next, the CPU 102 performs control for switching the electromagnetic valve 232 to the closed state, and blocks the second air flow path 150. As a result, the supply of air to the suction unit 20 is stopped, and the ejection of air from the air blowing hole 81 is completed. At the same time, the CPU 102 performs control for switching the first electromagnetic valve 162 to the closed state, thereby blocking the vacuum flow path 153.

  Further, the CPU 102 outputs a drive signal to the second electromagnetic valve 168. As a result, the second electromagnetic valve 168 is switched to the open state, and the pressurized air sent from the air supply source 131 passes through the air supply flow path 130 and the third air flow path 160 and is guided to the vacuum break flow path 159. Then, the air is supplied to the connection flow path connecting the air filter 167 and the suction unit 20. And the vacuum breakage of the connection channel is performed, the degree of vacuum of the connection channel is weakened, and the force for sucking the wiring board 110 is weakened. As a result, evacuation of ion air from the vacuum suction hole 45 is completed. Thereafter, the CPU 102 performs control for switching the second electromagnetic valve 168 to the closed state, thereby blocking the third air flow path 160.

  Then, the arm of the transfer articulated robot is driven to raise the transfer head 11. As a result, the transport head 11 is separated from the wiring board 110, and the wiring board 110 is placed on a support for a line for an inspection process.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (1) In the non-contact conveyance device of the present embodiment, foreign matter on the substrate main surface 120 can be collected by sucking air from the dust collection holes 42 provided in the suction unit 20. As a result, the diffusion of foreign matter around the wiring substrate 110 is suppressed, and the adhesion of foreign matter to another wiring substrate 110 is suppressed. In addition, since the air that flows out of the recess 73 and flows substantially parallel to the substrate main surface 120 does not easily flow out of the projection 43, the dust collection hole 42 in the inner region of the projection 43 on the suction surface 21. If the air is sucked from the air, the diffusing foreign matter can be efficiently collected together with the air. As a result, compared to a configuration in which the annular convex portion 43 does not exist, the diffusion of foreign matters to the periphery of the wiring substrate 110 is more reliably suppressed, and the adhesion of foreign matters to another wiring substrate 110 is more reliably suppressed. Therefore, in the continuity inspection after conveyance, when a probe (not shown) is brought into contact with the solder bump 118 on the substrate main surface 120, foreign matter that does not conduct is caught between the probe and the solder bump 118. Is prevented. As a result, it is difficult to determine that the wiring board 110 is a defective product due to the presence of foreign matter, so that the yield of the wiring board 110 is improved.

  (2) In the present embodiment, the foreign substance is removed and the wiring board 110 is neutralized by continuing to eject air and ion air even while the wiring board 110 is being transported. That is, since the process of transporting the wiring board 110 and the process of removing foreign substances and removing charges can be performed simultaneously, the manufacturing efficiency of the wiring board 110 is improved.

  (3) For example, the substrate main surface 120 of the wiring substrate 110 is sucked and held on the suction surface 21 by evacuation from the vacuum suction hole 45, and at the same time, foreign matter on the substrate main surface 120 together with air sucked from the vacuum suction hole 45 It is conceivable to recover. However, when a foreign substance enters the vacuum suction path including the vacuum suction hole 45 and the suction flow path 195 communicating with the vacuum suction hole 45, there is a possibility that part or all of the vacuum suction path is blocked. As a result, the vacuum pulling force from the vacuum suction hole 45 becomes weak, and there is a possibility that the wiring board 110 cannot be stably held.

  Therefore, in the present embodiment, a dust collection hole 42 for collecting foreign matter is provided separately from the vacuum suction hole 45 for vacuuming. As a result, the evacuation path is not easily blocked by the intrusion of foreign matter, so that a vacuum is drawn even if foreign matter adheres on the main surface 120 of the substrate or foreign matter floats around the wiring substrate 110. The power is less likely to drop. Therefore, the wiring board 110 can be reliably sucked and held by the vacuuming force.

[Second Embodiment]
Hereinafter, a second embodiment of the present invention will be described with reference to the drawings. Here, it demonstrates centering on the part which is different from 1st Embodiment, and abbreviate | omits description instead of attaching | subjecting the same member number about a common part.

  In the present embodiment, the structure of the resin pad and the suction portion is different from that of the first embodiment. More specifically, the resin pad 300 shown in FIGS. 12 and 13 has a substantially rectangular annular projection in plan view that protrudes 1.0 mm from the suction surface 301 on the outer periphery of the suction surface 301 having a substantially rectangular shape. 302 is formed. The convex part 302 is a protrusion with a width of 1.0 mm that is provided so as to surround the suction surface 301. Note that the four corner portions 303 constituting the convex portion 302 have a substantially rectangular shape in a plan view of 4.5 mm long × 4.5 mm wide. Further, four vacuum suction holes 304 are arranged in the resin pad 300 so as to open at the respective corners 303. Each vacuum suction hole 304 is the same as the vacuum suction hole 45 of the first embodiment.

  In addition, a through hole 305 that exposes a recess (not shown) is provided at the center of the resin pad 300. The recess of this embodiment is the same as the recess 73 of the first embodiment, and the through hole 305 is the same as the through hole 41 of the first embodiment. Further, the resin pad 300 is provided with a long hole 306 (dust collection hole) for collecting foreign matter on the board main surface 120 (see FIG. 2) of the wiring board 110. The long holes 306 are arranged at four locations along the convex portion 302 so as to surround the concave portion. More specifically, each elongated hole 306 is disposed so as to open in an inner region of the convex portion 302 in the outer region of the concave portion (through hole 305), and extends along the convex portion 302. Each elongated hole 306 is arranged in parallel with each of the four sides constituting the suction surface 301. Furthermore, the distance between the long hole 306 and the convex portion 302 is shorter than the distance between the long hole 306 and the through hole 305. Therefore, the long hole 306 is disposed close to the convex portion 302 on the outer peripheral portion of the suction surface 301. The length of each long hole 306 is set to about 67% (specifically, 22 mm) of the length (33 mm) of one side constituting the suction surface 301. Further, the width of each elongated hole 306 is set larger than the width (1.0 mm) of the convex portion 302, and is set to 2.5 mm in the present embodiment.

  As shown in FIG. 13, the suction head 310 constituting the suction portion has a structure in which a head main body 311 and a head tip portion 312 constituting the lower end portion of the suction head 310 are integrally formed. The head support 201 (see FIG. 5) according to one embodiment is attached. The head body 311 has a substantially rectangular parallelepiped shape with a length of 50 mm, a width of 50 mm, and a height of 8 mm, and the head tip 312 has a substantially rectangular parallelepiped shape with a length of 33 mm × width of 33 mm × height of 10 mm. The head tip 312 is provided with four dust collecting flow paths 313 communicating with the long holes 306. Each dust collecting flow path 313 is opened in the lower surface 314 (suction surface 301) and the side surface 315, and the central axis C3 is disposed in a state inclined by 60 ° with respect to the lower surface 314. Further, the central axis C3 of each dust collecting channel 313 is inclined toward the outer peripheral side (side 315 side) of the head tip 312 with respect to a straight line (perpendicular line) perpendicular to the lower surface 314. In other words, each dust collection channel 313 is inclined toward the outer peripheral side of the head tip portion 312 from the start end (opening on the lower surface 314 side) to the end (opening on the side surface 315 side). Each dust collecting channel 313 is a linear channel extending along the central axis C3. The length of each dust collection channel 313 is set to the same size as that of the long hole 306 (22 mm in this embodiment). Further, the width of each dust collecting channel 313 is set to about 3.0 mm. Each dust collecting channel 313 is connected to a dust collector (not shown) via a dust collecting tube (not shown) connected to the side surface 315 side opening of the dust collecting channel 313. The dust collector has a function as a vacuuming means for collecting foreign matter on the substrate main surface 120 by sucking (evacuating) air from the long hole 306. In the present embodiment, the total flow rate of air sucked from the long hole 306 is set to be larger than the total flow rate of air ejected to the inner area of the convex portion 302 in the suction surface 301.

  Therefore, according to the present embodiment, the following effects can be obtained.

  (4) In the non-contact conveyance device of the present embodiment, since the air that flows out of the recess and flows substantially parallel to the substrate main surface 120 does not easily flow out of the protrusion 302, the protrusion on the suction surface 301 If air is sucked from the long hole 306 in the inner region 302, the diffusing foreign matter can be efficiently collected together with the air. As a result, compared to a configuration in which the annular convex portion 302 does not exist, the diffusion of foreign matters to the periphery of the wiring substrate 110 is more reliably suppressed, and the adhesion of foreign matters to another wiring substrate 110 is more reliably suppressed. Therefore, in the continuity test, the probability that the wiring board 110 is determined to be defective due to the adhesion of foreign matter is further reduced, and the yield of the wiring board 110 is further improved.

  (5) In the present embodiment, the four long holes 306 are arranged close to the convex portion 302 on the outer peripheral portion of the suction surface 301. That is, each long hole 306 is arranged as close to the outer peripheral portion of the suction surface 301 as possible. As a result, since the long holes 306 can be separated from each other, the long holes 306 having a large cross-sectional area (length) can be easily formed. Moreover, since each long hole 306 is close to the convex portion 302, the air that has stopped flowing due to collision with the convex portion 302 can be immediately sucked from the long hole 306. Therefore, the collection efficiency of the foreign material by the long hole 306 becomes still higher.

  (6) When the dust collection hole is, for example, a circular hole, once the foreign matter enters, the dust collection hole is likely to be blocked. As a result, the total flow rate of air sucked from the dust collection hole is drastically reduced, so that the diffusing foreign matter cannot be efficiently collected together with the air. On the other hand, since the dust collection hole of the present embodiment is the long hole 306, for example, even if one end of the long hole 306 is blocked, there is a high possibility that the other end of the long hole 306 will continue to function without being blocked. As a result, the total flow rate of air sucked from the long hole 306 hardly decreases, so that the diffusing foreign matter can be reliably collected together with the air.

  (7) For example, the substrate main surface 120 of the wiring substrate 110 is sucked and held on the suction surface 301 by evacuation from the vacuum suction hole 304, and at the same time, foreign matter on the substrate main surface 120 together with air sucked from the vacuum suction hole 304 It is conceivable to recover. However, there is a possibility that a part or the whole of the vacuum suction path may be blocked by foreign matter entering the vacuum suction path including the vacuum suction hole 304 and the suction flow path (not shown) communicating with the vacuum suction hole 304. is there. As a result, the vacuum pulling force from the vacuum suction hole 304 becomes weak, and thus there is a possibility that the wiring board 110 cannot be stably held.

  Therefore, in the present embodiment, a long hole 306 for collecting foreign matter is provided separately from the vacuum suction hole 304 for vacuuming. As a result, the evacuation path is not easily blocked by the intrusion of foreign matter, so that a vacuum is drawn even if foreign matter adheres on the main surface 120 of the substrate or foreign matter floats around the wiring substrate 110. The power is less likely to drop. Therefore, the wiring board 110 can be reliably sucked and held by the vacuuming force.

  (8) For example, it is conceivable that foreign matter on the substrate main surface 120 is removed by blowing off with air, and the blown-off foreign matter collides with a plate-like member and dropped to prevent the foreign matter from spreading. However, the foreign matter once dropped may be blown off again and diffused, and the diffused foreign matter may adhere to the wiring board 110. Therefore, in this embodiment, the foreign matter is collected by sucking ion air from the long hole 306 instead of dropping the foreign matter. Therefore, the collected foreign matter is prevented from diffusing again and adhering to the wiring board 110.

  In addition, you may change the said embodiment as follows.

  -Although the dust collection flow path 313 of the said 2nd Embodiment was connected to the dust collector, you may be connected to the dust collection unit 151 (refer FIG. 11) of the said 1st Embodiment, for example. In this case, the dust collection unit 151 has a function as a vacuum evacuation means.

  -Although the dust collection flow path 313 of the said 2nd Embodiment was a linear flow path extended along the central axis C3, a curved flow path may be sufficient. However, in consideration of ease of processing, the dust collecting flow path 313 is preferably a linear flow path.

  In the above embodiment, the vacuum suction holes 45 and 304 are omitted, and the foreign matter on the substrate main surface 120 is collected by sucking air from the dust collection holes 42 and 306, and at the same time, the vacuum from the dust collection holes 42 and 306 is collected. The substrate main surface 120 of the wiring substrate 110 may be sucked and held on the suction surface 21 by pulling.

  In the above embodiment, the protruding member 61 protrudes from the central portion of the lower surface 203 of the head support portion 201. That is, the protruding member 61 is integrally formed with the head support portion 201. However, the protruding member 61 may be separated from the head support 201. For example, the protruding member 61 may be screwed to the head support portion 201.

  In the first embodiment, the control of the air supply valve 132, the ionizer 141, the electromagnetic valve 143, the electromagnetic valve 152, the electromagnetic valve 232, the first electromagnetic valve 162, and the second electromagnetic valve 168 is controlled by one CPU 102. However, each control may be performed by a separate CPU.

  -Although the non-contact conveyance apparatus of the said embodiment was designed to convey the wiring board 110 of a single product, for example, a plurality of substrate forming regions that should become the wiring board 110 are arranged along the plane direction. You may make it convey the wiring board for individual picking.

  In the above embodiment, the wiring board 110 is transported using a multi-joint robot for transportation equipped with a suction part. However, even if the wiring board 110 is transported using a transportation means such as a conveyor equipped with a suction part. Good.

  Next, the technical ideas grasped by the embodiment described above are listed below.

  (1) In the said means 1, the said dust collection hole is a long hole extended along the said convex part, The width | variety of the said long hole is set to 2 mm or more, The non-contact conveyance of the wiring board characterized by the above-mentioned apparatus.

  (2) In the above means 1, a through-hole exposing the concave portion is provided in a central portion of the suction surface, and a distance between the dust collection hole and the convex portion is set between the dust collection hole and the through-hole. A non-contact transfer device for a wiring board, which is shorter than a distance.

  (3) In the above means 1, the suction part is provided with a dust collecting flow path communicating with the dust collecting hole, and the dust collecting hole is a long hole extending along the convex part, and the dust collecting flow The length of the path is set to the same size as the length of the long hole, and the wiring board non-contact transfer device.

  (4) In the technical idea (3), the central axis of the dust collecting flow path is inclined toward the side surface of the suction portion with respect to a straight line perpendicular to the suction surface. Non-contact transfer device.

  (5) In the technical idea (3) or (4), the dust collecting flow path is a linear flow path extending along a central axis, and the wiring board non-contact transfer device.

DESCRIPTION OF SYMBOLS 20 ... Suction part 21, 301 ... Suction surface 42 ... Dust collection hole 43, 302 ... Convex part 73,252,262,272 ... Concave part 81,253,263,273 ... Air blowing hole 110 ... Wiring board as a to-be-conveyed object DESCRIPTION OF SYMBOLS 116 ... Terminal pad 118 as a projection electrode ... Solder bump 119 as a projection electrode ... Electrode formation area 120 ... Substrate main surface 151 ... Dust collection unit 306 as a vacuum drawing means ... Long hole 313 as a dust collection hole ... Dust collection flow Path 315 ... Side surface C3 of suction part ... Center axis

Claims (8)

The suction surface is provided with a recess, and is provided with a suction portion provided with an air blowing hole that opens at the inner peripheral surface of the recess, and is generated by the air blown from the air blowing hole along the inner peripheral surface of the recess. In the non-contact transport device that transports the substrate main surface of the wiring substrate that is the object to be transported by sucking and holding the suction surface to the suction surface,
On the outer peripheral portion of the suction surface, an annular convex portion protruding so as to surround the suction surface is formed,
A dust collecting hole for collecting foreign matter on the main surface of the substrate is disposed in an outer region of the concave portion and an inner region of the convex portion on the suction surface ,
The suction part is provided with a linear dust collecting flow path communicating with the dust collecting hole,
The dust collection passage is opened at the suction surface and the side surface of the suction part, and the central axis is disposed in a state inclined at 15 ° or more and 60 ° or less with respect to the suction surface. A non-contact transfer device for a wiring board characterized by the above.   2. The wiring according to claim 1, wherein a total flow rate of air sucked from the dust collection holes is set to be larger than a total flow rate of air ejected to an inner region of the convex portion on the suction surface. Non-contact transfer device for substrates.   The non-contact transfer device for a wiring board according to claim 1, wherein the dust collection holes are disposed at a plurality of locations along the convex portion so as to surround the concave portion. The non-contact transfer device for a wiring board according to any one of claims 1 to 3 , wherein the dust collection hole is a long hole extending along the convex portion. The suction surface is a surface having a substantially rectangular shape, and the length of the long hole is set to 60% or more and 80% or less of the length of one side constituting the suction surface. The non-contact conveyance apparatus of the wiring board of 4 . The non-wiring board according to any one of claims 1 to 5 , further comprising a vacuuming means for collecting foreign matter on the main surface of the substrate by sucking the air from the dust collection hole. Contact transfer device. A non-contact transfer device according to any one of claims 1 to 6 is used to manufacture a wiring board by holding the main surface of the wiring board as a transfer object while sucking and holding the main surface of the wiring board on the suction surface. In the way to
By sucking the air from the dust collection holes disposed in the outer region of the concave portion and the inner region of the convex portion on the suction surface, the foreign matter on the substrate main surface is collected,
A method for manufacturing a wiring board, wherein a total flow rate of air sucked from the dust collection holes is set to be larger than a total flow rate of air ejected to an inner region of the convex portion on the suction surface. The method of manufacturing a wiring board according to claim 7 , wherein the wiring board is a resin wiring board having an electrode formation region on which a plurality of protruding electrodes are arranged on the main surface of the board.

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