TW200941563A - Plasma cleaning apparatus for semiconductor panel with cleaning chambers - Google Patents

Plasma cleaning apparatus for semiconductor panel with cleaning chambers Download PDF

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Publication number
TW200941563A
TW200941563A TW97120585A TW97120585A TW200941563A TW 200941563 A TW200941563 A TW 200941563A TW 97120585 A TW97120585 A TW 97120585A TW 97120585 A TW97120585 A TW 97120585A TW 200941563 A TW200941563 A TW 200941563A
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TW
Taiwan
Prior art keywords
cleaning
plasma
storage
chambers
chamber
Prior art date
Application number
TW97120585A
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Chinese (zh)
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TWI368266B (en
Inventor
Tong-Seob Yoon
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Visionsemicon Co Ltd
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Publication of TW200941563A publication Critical patent/TW200941563A/en
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Publication of TWI368266B publication Critical patent/TWI368266B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67069Apparatus for fluid treatment for etching for drying etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B08CLEANING
    • B08BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67213Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one ion or electron beam chamber
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781Batch transfer of wafers

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Optics & Photonics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Cleaning In General (AREA)
  • Drying Of Semiconductors (AREA)

Abstract

The present invention relates to plasma cleaning apparatuses for cleaning semiconductor components (a cleaning object or a PCB board) with plasma discharge in a semiconductor fabrication process. More specifically, the present invention relates to a semiconductor plasma cleaning apparatus with cleaning chambers for improving working efficiency by making continuous plasma cleaning of cleaning objects placed in magazines. The semiconductor plasma cleaning apparatus having a plurality of cleaning chambers, includes the plurality of cleaning chambers arranged in parallel vertically, an unloading unit movable in up/down direction according to a cleaning progress situation for transferring magazines having cleaning objects loaded thereon to front of each of the cleaning chambers in succession, a plurality of first pushers mounted to the unloading unit for pushing and discharging the cleaning object loaded in the magazine being transferred by the unloading unit toward the cleaning chamber one by one, a rotatable transfer unit for receiving an empty magazine having all the cleaning objects discharged therefrom from the unloading unit, rotating the empty magazine by 180 DEG horizontally, and transferring the empty magazine to rear of the plasma cleaning chamber, a loading unit for receiving the empty magazines from the rotatable transfer unit, and transferring the empty magazines to rear of each of the plasma cleaning chambers in succession while moving from an lower side to an upper side according to the cleaning progress situation, and a second pusher for pushing and loading the cleaning objects having cleaning thereof finished into the empty magazine at the loading unit.

Description

200941563 九、發明說明: 【發明所屬之技術領域】 • 明涉及在半導體製程中以電漿放電用於清潔半導體元 件(一清除物件或是一印刷電路板PBC)之電漿清除裝置。更精 . 確地’本發明涉及具有清除室之半導體電漿清除裝置,可藉由 持續性地以電漿清潔裝置於收納匣内之半導體元件來提升工作 效率。 【先前技術】 〇 ^ 一般來說,電漿清除裝置被用於半導體製程中,用於清潔 半導體兀件的裝置’如同以電漿放電來清理物件和PCB,使用 •在所有半導體製程中清潔半導體元件的表面(以下簡稱為一清 理物件)。 換3之’清理物件經過晶粒脫膜(stripping-die)、導線接合 (bonding-wire)、封裝接合(b〇nciing-package)以及覆膠打印 (molding-marking)之類的過程,這些過程取決於清理物件的種 類。由於清理物件的表面在每一處理程序中受到物理性及化學 性的汙染,所以在每一個程序中都需要多一個清除污染的步驟。 尤其’由於以電漿來清潔不只是用於清潔清理物件,同時 ϋ 亦用以清潔清理物件表面上經過晶粒接合(die bonding)及導線 接合(wire bonding)的銅,使免除在清理物件表面上鍍金或鍵銀 的程序’也由於具有使半導體生產成本降低和簡化半導體製程 的優點,最近電漿清除被廣範地使用。 參考圖1,一相關技術電漿清除裝置1具有可關式室1〇、 一暗盒20可裝收納匣60,每一收納匣60裝載複數個清理物件 L至室10内、一空氣抽吸元件3〇用以抽吸室1〇内裝載有收納 匿60之暗盒20的空氣’使得室1〇進入真空狀態、一氣體供應 元件40用以導入諸如氬氣、氙氣、氦氣及氖氣之類的氣體進入 真空室10、以及一電流產生元件5〇用以供應室1〇内氣體的一 7 200941563 電流以產生電漿。 參考圖2 ’暗盒20具有-上框21形成暗盒2〇之上側、一 下框22位於上框21之下用於放置收納匣6〇、複數個侧電極板 23位於上框21及下框22之間,置於下框22上收納匣6〇的兩 側’用以感生電漿放電。 f這個實财:複數個清理物一預定距離被層疊裝 ;納匣60中,導入梯級61位於收納匣6〇内兩侧,用以可 拖曳的型式放置清理物件L。 Ο 此湖技術半糧賴清_置丨由空錄批件3〇排空 =:褒置’氣體供應元件40導入氣體,於暗盒20之電極板上 ,,二電流用以離子化或活化清除裝置内之空氣,將活化的空 電子及陽離子’触電漿的潍來清潔收紐内的清理 物件L。 【發明内容】 &lt;技術問題&gt; τ’以上細麟之賴裝置1具有清潔清理物件 生產率不佳之問題,主要是由於以上相關技術之電 G 1需要一作業機制將裝載清理物件L之收納g 60 後二=2〇中,依次再將暗盒20置入室10,當清除程序完成 ^將暗盒20取出室10,再次置入待清潔之暗盒2〇,如此 進一出便無法連續地進行清除程序。 &lt;技術解決方案&gt; 此問題’本發明提供—目的係提供—附有複數個清 ϋ生ΐ導體電漿清除裝置’可連續性地從置人到取出收納盒 ^潔清理物件,大大提高清理物件的清雜率及生產率。 會她Ϊ達成這些目的和其他優點以及符合此發明之目的,在此 据番,、^體上之敘述,一附有複數個清除室之半導體電漿清除 ,匕含複數個清除室,被相互平行並直立設置;一卸匣元 8 200941563 件,依照清潔過程可上下移動,並可連續將裝載有清理物件之 收納匣移轉至每一清除室的前面;複數個第一推進器,鑲嵌於 却匣元件上,用以推進及卸除裝载於收納匣中被卸匣元件接連 著移轉至清除室的清理物件;一可旋轉輸送元件,用以從卸匣 元件處接收已卸除清理物件之空置的收納匣,將空置的收納匣 水平旋轉180度,並將空置的收納匣移轉至電漿清除室後端; 一裝匣元件,用以從可旋轉輸送元件接收空置的收納匣,並連 續地將空置的收納匣移轉至每一個電漿清除室後端,同時依照 清潔過程由下側移至上側;以及一第二推進器,用以在裝匣元 件處推進及裝填已清潔之清理物件至空置的收納匣中。 u 〈效益〉 . 本發明具有以下幾點效益: 該附有複數個清除室之半導體電漿清除裝置可顯著地提升 f生產力疋由於複數個直立方向的清除室位於中央以進行電漿 清除,同時前侧有著卸匣元件以利將收納匣中的清理物件卸至 清除室,後侧有著裝匣元件以利將已清潔之清理物件由清除室 裝填至卸匣元件產生之空置的收納匣中,使得上層清除室及下 層清除室得以交替持續地清潔清理物件。 除此之外,該附有複數個清除室之半導體電漿清除裝置可 〇 大幅縮小裝置體積,同時提高可使用性因為所需的作業機制為 導入空置的收納匣至卸匣元件並從裝匣元件接收收納匣。 【實施方式】 由以下的說明及圖示可以更為詳盡地揭露此發明,同時實 ,做為此發明申請的一部份,說明在此揭露之實施例用以描述 本發明的原理。 咬本發明將以一特定例子與附圖加以詳細說明。本發明之申 利範圍與說明書中的專有名詞及文字將以意義上與概念上 符合本發明之技術理念’並秉持發明者以最佳方式來定義其中 9 200941563 專有名问與概念用以闡述此發明之原則。 Ο200941563 IX. Description of the invention: [Technical field to which the invention pertains] • A plasma cleaning apparatus for cleaning a semiconductor element (a cleaning object or a printed circuit board PBC) by plasma discharge in a semiconductor process. More precisely. The present invention relates to a semiconductor plasma cleaning apparatus having a cleaning chamber which can be improved in efficiency by continuously cleaning the semiconductor element in the housing with a plasma cleaning device. [Prior Art] 〇^ Generally, a plasma cleaning device is used in a semiconductor process, and a device for cleaning a semiconductor device is used to clean an object and a PCB as a plasma discharge, and to use the semiconductor to clean the semiconductor in all semiconductor processes. The surface of the component (hereinafter referred to as a cleaning object). Change the 'cleaning object' through a stripping-die, bonding-wire, package bonding (b〇nciing-package) and glue-marking processes, these processes Depends on the type of object being cleaned. Since the surface of the cleaning object is physically and chemically contaminated in each process, an additional step of decontaminating is required in each program. In particular, since cleaning with plasma is not only used to clean and clean objects, but also to clean the surface of the object by die bonding and wire bonding, it is exempted from cleaning the surface of the object. The procedure of gold plating or silver bonding has also been widely used due to the advantages of lowering the cost of semiconductor production and simplifying the semiconductor process. Referring to Fig. 1, a related art plasma cleaning apparatus 1 has a closable chamber 1 〇, and a cassette 20 is accommodating accommodating 匣 60, each accommodating cassette 60 is loaded with a plurality of cleaning objects L into the chamber 10, and an air suction unit 3. The air used to carry the cassette 20 containing the storage 60 in the suction chamber 1 is such that the chamber 1 is in a vacuum state, and a gas supply member 40 is used to introduce such things as argon, helium, neon, and xenon. The gas enters the vacuum chamber 10, and a current generating element 5 is used to supply a current of 200941563 of the gas in the chamber 1 to generate plasma. Referring to FIG. 2, the cassette 20 has an upper frame 21 which forms an upper side of the cassette 2, a lower frame 22 which is located below the upper frame 21 for placing the storage cassette, and a plurality of side electrode sheets 23 located at the upper frame 21 and the lower frame 22. During the interval, the two sides of the 匣6〇 are placed on the lower frame 22 to induce plasma discharge. f This real money: a plurality of cleaning objects are stacked in a predetermined distance; in the nano-60, the introduction step 61 is located on both sides of the storage 匣6〇, and the cleaning object L is placed in a draggable type. Ο This lake technology semi-food 赖 _ 丨 丨 丨 丨 空 空 空 空 空 空 空 空 空 空 空 空 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体 气体Inside the air, the activated empty electrons and the cation 'electrical pick-up slurry are used to clean the cleaning object L in the collection. [Technical Problem] &lt;Technical Problem&gt; τ' The above-mentioned fine lining device 1 has a problem that the productivity of the cleaning and cleaning article is not good, mainly because the electric G 1 of the above related art requires a working mechanism to store the cleaning object L. 60 After two = 2 ,, the cassette 20 is placed into the chamber 10 in turn, when the cleaning process is completed ^ the cassette 20 is taken out of the chamber 10, and the cassette 2 to be cleaned is placed again, so that the cleaning process cannot be continuously performed after entering and exiting. . &lt;Technical Solution&gt; This problem is provided by the present invention - the purpose is to provide - a plurality of cleaning ΐ ΐ 电 电 电 ' ' ' 可 可 可 可 可 可 可 可 可 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Clean up the cleaning rate and productivity of the items. She will achieve these and other advantages and the purpose of the invention. Here, according to the description of the body, a semiconductor plasma cleaning with a plurality of cleaning chambers, including a plurality of cleaning chambers, is mutually Parallel and upright; a depalletizing unit 8 200941563, can move up and down according to the cleaning process, and can continuously transfer the storage cassette loaded with the cleaning object to the front of each cleaning chamber; a plurality of first propellers are embedded in But on the component, for lifting and unloading the cleaning object loaded in the storage magazine and being transferred to the cleaning chamber by the depalletizing element; a rotatable conveying element for receiving the dismounting from the depalletizing element The vacant storage raft of the object rotates the vacant storage raft horizontally by 180 degrees, and moves the vacant storage raft to the rear end of the plasma cleaning chamber; and a mounting element for receiving the vacant storage 从 from the rotatable conveying element And continuously shifting the vacant storage raft to the rear end of each plasma cleaning chamber while moving from the lower side to the upper side according to the cleaning process; and a second pusher for advancing at the mounting element Filling the cleaned object to clean up storage box in a vacant. u <Efficiency> The present invention has the following advantages: The semiconductor plasma cleaning device with a plurality of cleaning chambers can significantly improve the productivity of the f. Since a plurality of cleaning chambers in the upright direction are located in the center for plasma cleaning, The front side has a depalletizing element to facilitate the discharge of the cleaning object in the storage bowl to the cleaning chamber, and the rear side has a mounting element for loading the cleaned cleaning object from the cleaning chamber into the empty storage box generated by the depalletizing element. The upper cleaning chamber and the lower cleaning chamber are alternately and continuously cleaned and cleaned. In addition, the semiconductor plasma cleaning device with a plurality of cleaning chambers can greatly reduce the size of the device and improve the usability because the required working mechanism is to introduce the empty storage device to the depalletizing device and to mount the device. The component receives the storage cassette. The present invention will be described in more detail by the following description and drawings. The invention will be described in detail with a specific example and the accompanying drawings. The scope of the invention and the proper nouns and words in the specification will be in a sense and conceptually consistent with the technical concept of the invention 'and the inventor best defines the 9 200941563 proprietary name and concept to illustrate The principles of this invention. Ο

請參閱圖3及圖4,本發明中附有複數個清除室之半導體 電漿清除裝置包括複數個直立的清除室1〇〇; 一卸匣元件2〇〇, 用以連續轉移裝載清理物件之收納匣;一第一推進器250,鑲 彼於却匣元件上用以推進收納匣内之清理物件至清除室1〇〇,· 一可旋轉輸送元件300 ’由卸匣元件200處接收已卸除清理物 件之空置的收納匣,將空置的收納匣水平旋轉18〇度,並將空 置的收納匣移轉至電漿清除室100後端;一装匣元件4〇〇,從 可轉動移轉元件300接收空置的收納匣,並連續地將空置的收 納匣移轉至電漿清除室100後端;以及一第二推進器5〇〇,用 以在裝匣元件400處推進及裝填已清潔之清理物件至空置的收 納匣中。 &lt;電漿清除室&gt; ,农佳實施例以一對直立式清除室1〇〇來做說明。 母一個清除室1〇〇均包括一下板η〇,用以靜置來自卸匣 元件400處的清理物件;以及一上板12〇,位於下板11〇的正 上方’可上下活動選擇性地與下板110接合,當上板120與下 板110接合時的空間可用於產生電漿。 、 了對靜置構件111牢固地固定在下板110上,利於支撑由 卸E兀件200送到清除t 100中的清理物件的兩侧,並使該清 理物件可穩m靜置於下板11G之上驗離所述下板11〇 一空 間。清理物件靜置於下s 11G之上而距離所述下板11() 一空間 件直接接觸所述下板110,使得電漿無法徹 底接觸所如理物件’造成清潔清除物件的效果不彰。 使μ同!圖中未示,上板12G具有—氣體供應管連接於 體’例如氯氣、m氣及氛氣,至清除 11G*有—個空氣疏散孔連接至空氣抽吸元 室中的氣體…電流生產元件鑲後於清除室 &gt; ^氣體供應f 114供應一電流至供應給清除室中的 200941563 氣體以產生電漿。 請參閱圖5到圖7 ’每個清除室1〇〇的下板110之上均有一 個加熱元件115,用於利用加熱所述清除室1〇〇内循環的空氣 或冷卻所述清除室100内循環的空氣來將清理物件的溫度調^ • 至合適的温度。 在下板110之下有一空氣循環管112,用以導入加熱空氣 或冷卻空氣至加熱元件115。空氣循環管ι12具有一内管U2a 及一外管112b。 加熱,件115係由表面上置有靜置構件m的一上陶板 115a、一蓋板115b、一加熱板115c、以及一下陶板usd層層 Ό 堆疊所組成。 — 加熱板115(;具有一空氣線路110均勻地覆蓋其整個表面, 且所述空氣線路的兩末端均與空氣循環管m相連接。為此, 下陶板115d具有通孔(圖中未示)而使空氣線路的兩末端116&amp; 和116b可與空氣循環管112相連接。 在開始清除前於經内管112a供應高溫度空氣時,加熱空氣 通過下陶板115d的通孔後被導入至加熱板I〗5c並於所述加熱 板上115c循環,以在經外管112b排出之前加熱所述加熱板 115c。 * 〇 一旦加熱板115(:經加熱後,同時加熱上陶板115a,使得位 於上陶板115a上的清理物件可被加熱至適當的溫度,因而使電 漿清除達到最大功效。 同時,當清除室100内之溫度高於所需溫度,冷卻空氣導 入空氣循環f 112的内管112a,在加熱板115c上的空氣線路 116中循環並冷卻所述加熱板ii5c。 曰所述清除室100並未因經常性的溫度變化而變形毀壞,原 因是由於上陶板115a與下陶板usd係由陶瓷原料(ceramic mafial)製成;j司時只有清除室110的下板110由加熱板ll5c 感嗳到流度升咼,這可將熱散(heat dissipation)對清除室1〇〇周 11 200941563 遭元件的影響減到最低。 除室1〇0之前端,均有-具有複數個橫 二i# Λ 一ί置7^ 130 ’用以靜置由推進器250從收 ^理物件,㈣絲個職電料除室100 之後端,均有-具有複數侧向導板142 用以,置從電漿清除室_推出已清潔之清理物^置70件 母第一導板132均有一送件器η〗鑲嵌於上,每一第二 ΪΠΐ有:f牛器141驗於上’所述送件器131及送件 裔141將清理物件移至靜置處。Referring to FIG. 3 and FIG. 4, the semiconductor plasma cleaning device with a plurality of cleaning chambers in the present invention includes a plurality of upright cleaning chambers 1; a depalletizing device 2〇〇 for continuously transferring and loading the cleaning objects. a first pusher 250 is mounted on the squeegee member for advancing the cleaning object in the accommodating chamber to the cleaning chamber 1 ·, and a rotatable conveying member 300 ′ is received by the squeegee member 200 In addition to cleaning the vacant storage compartment of the object, the vacant storage raft is horizontally rotated by 18 degrees, and the vacant storage raft is transferred to the rear end of the plasma cleaning chamber 100; a mounting element 4 〇〇 is rotated from the rotatably The component 300 receives the empty storage magazine and continuously transfers the empty storage magazine to the rear end of the plasma cleaning chamber 100; and a second pusher 5〇〇 for pushing and loading the cleaning at the mounting member 400 Clean the object into the vacant storage compartment. &lt;plasma scavenging chamber&gt;, the Nongjia embodiment will be described by a pair of upright cleaning chambers. Each of the cleaning chambers 1 包括 includes a lower plate η 〇 for resting the cleaning object from the tamper-removing element 400; and an upper plate 12 〇 located directly above the lower plate 11 ' 'is movable up and down selectively In engagement with the lower plate 110, the space when the upper plate 120 is engaged with the lower plate 110 can be used to generate plasma. The stationary member 111 is firmly fixed on the lower plate 110 to facilitate supporting the two sides of the cleaning object sent from the unloading e-clamp 200 to the cleaning t 100, and the cleaning object can be stably placed on the lower plate 11G. The space above the lower plate 11 is examined. The cleaning object is placed on the lower s 11G and the space member directly contacts the lower plate 110 from the lower plate 11 (), so that the plasma cannot be completely contacted with the object member, causing the cleaning object to be ineffective. The same as shown in the figure, the upper plate 12G has a gas supply pipe connected to the body 'e.g., chlorine gas, m gas and atmosphere, to remove 11G*, an air evacuation hole is connected to the gas in the air suction chamber. ...the current production component is mounted in the purge chamber&gt; ^The gas supply f 114 supplies a current to the 200941563 gas supplied to the purge chamber to produce plasma. Please refer to FIG. 5 to FIG. 7 'a heating element 115 is disposed above the lower plate 110 of each cleaning chamber 1 for heating the air circulating in the cleaning chamber 1 or cooling the cleaning chamber 100. The inner circulating air is used to adjust the temperature of the cleaning object to a suitable temperature. Below the lower plate 110 is an air circulation duct 112 for introducing heated air or cooling air to the heating element 115. The air circulation pipe ι12 has an inner tube U2a and an outer tube 112b. The heating member 115 is composed of an upper ceramic plate 115a on which a resting member m is placed, a cover plate 115b, a heating plate 115c, and a lower ceramic plate usd layer stack. - a heating plate 115 (having an air line 110 uniformly covering the entire surface thereof, and both ends of the air line are connected to the air circulation pipe m. For this purpose, the lower ceramic plate 115d has a through hole (not shown) The two ends 116 &amp; and 116b of the air line can be connected to the air circulation pipe 112. When the high temperature air is supplied through the inner pipe 112a before the cleaning is started, the heated air is introduced into the heating plate through the through hole of the lower ceramic plate 115d. I 〗 5c and circulate on the heating plate 115c to heat the heating plate 115c before being discharged through the outer tube 112b. * 〇 Once the heating plate 115 is heated (heated, the upper ceramic plate 115a is simultaneously heated, so that it is located above The cleaning article on the ceramic plate 115a can be heated to a suitable temperature, thereby maximizing the plasma removal. Meanwhile, when the temperature in the cleaning chamber 100 is higher than the desired temperature, the cooling air is introduced into the inner tube 112a of the air circulation f 112, The heating plate ii5c is circulated and cooled in the air line 116 on the heating plate 115c. The cleaning chamber 100 is not deformed by frequent temperature changes due to the upper ceramic plate 115a and the lower pottery. The usd is made of ceramic mafial; only the lower plate 110 of the cleaning chamber 110 is sensed by the heating plate ll5c to increase the fluidity, which can heat the heat to the cleaning chamber. Week 11 200941563 The influence of the components is minimized. Except for the front end of the room 1〇0, there are - there are a plurality of horizontal two i# Λ ί 置 7 ^ 130 ' used to stand by the thruster 250 from the receiving object , (4) wire occupational material in addition to the chamber 100 rear end, there are - with a plurality of side guide plates 142 for setting, from the plasma cleaning chamber _ pushing out the cleaned cleaning material ^ 70 pieces of the mother first guide plate 132 have a The feeder η is mounted on the top, and each second ΪΠΐ has: f 器 141 in the upper 'the feeder 131 and the delivery 141 to move the cleaning object to the resting place.

請^_ 8,第一靜置元件13〇的送件器131包括一轉轴 過所有的導板132 ; 一驅動馬達13lb,用以提供轉動 力至轉軸131a ;-送件帶i31c ’該送件帶mc欲於每一個導 板132上並接收來自轉軸131a的轉動力,以運送進入的清理物 件至導板132的後端及一送件滾輪131d,用以將送件帶mc 上的清理物件壓下。 在送件g 131 #前端附有一感應器131e,用以感應清理物 件是否接近。若所述感應器131e感應清理物件接近,驅動 達131b則開始運轉。 第二靜置元件140上的送件器14ι與第一靜置元件13〇上 的送件器131完全相同。 請參閱圖9’第一靜置元件13〇包括清理物件傳送工具 150,將清理物件由第一靜置元件13〇傳送到電漿清除室1〇〇, 或者將已清潔之清理物件傳送到第二靜置元件14〇。 清理物件傳送工具150包含一 LM導引器151,用於在第 —靜置元件130和電漿清除室1〇〇間來回移動;一轉指臂152, ,LM導引器151同步移動;以及複數個轉指153,以可上下 旋轉的方式鑲喪於轉指臂152上,當所述轉指153轉向下方, 可選擇性地將清理物件由第一靜置元件13〇推至恰當的電漿清 除室100 ’或者將已清潔之清理物件推至第二靜置元件14〇。 12 200941563 文中未釋的符號Μ為收納匣。 &lt;卸匣元件&gt; 卸度元件200鑲嵌於清除室1〇〇之前端。 ,參閱圖10,所述卸匣元件200包含一傳送帶21〇,用以 . 接收每一個裝載有清理物件之收納Ε,同時將間隔相等的收納 £由卸Ε元件200外傳送至夾取位置;一爽鉗22(),用以爽取 由傳送帶210傳送至夾取位置的收納匣;一升降器,鑲喪 有所述夾鉗220,以利垂直地將收納匣夾取至第一推進器; 以及一水平移動機器裝置240,用以逐步地移動升降器23〇,使 夾钳220知以連續地置於第一靜置元件130的每一個導板132 ^ 的前端。 所述卸匣元件200藉由水平移動機器裝置24〇,依照清潔 過程從下側移置上側,藉以將裝載有清理物件之收納匣,間隔 - 相等地移至所述每一個電漿清除室1〇〇之前端。 所述傳送帶210包括一傳送帶體211,用以將收納匣由圖 中之左側傳送至右側;一上裝載器212,位於傳送帶體211之 後端,用以靜置經傳送帶體211所傳送的收納匣,並且將靜置 的收納匣上移至夾取位置;以及一第一收納匣感應器213,用 以感應收納匣是否靜置於所述上裝載器212上,並且傳遞一夾 〇 取信號給夾钳220。 凊參閱圖10及圖11,所述夾钳220具有一炎钳滑車221, 該央甜滑車221固定於所述升降器230上;一夾钳圓柱222, 位於所述夾鉗滑車221的下方,·一對鉗子223和223,相連於 夾鉗圓柱的兩側,依照夾鉗圓柱222的活動而改變兩鉗中間的 距離;一彈性壓板224,經央鉗圓柱222水平鑲複於一對鉗子 223和223之間,用以彈性地下壓鉗子223和223間的收納匣 上側,以及一第三收納匣感應器225,位於一對甜子223和223 的其中一側,藉著感應彈性壓板224的位置來檢測收納匣所接 近合適的夾取位置,並且傳遞一夾取信號給夾钳圓柱222。 13 200941563 所述升降器230,- LM導引器可垂直移動至第-推進器 ^包含一垂直導引器231以及一垂直螺旋桿232,該垂直 螺旋桿232㈣端與垂直導引器231銜接;以及-伺服電動機 233 ’用以正/反方向旋轉垂直螺旋桿232。直螺旋桿232上具一 . 通過其職轉轴之史钳滑車221。因此,-旦飼服電動機233 開始運轉,垂直螺旋桿232便會朝著一方向旋轉以將在垂直螺 旋桿232上的夾鉗滑車221上移或下移。 ’、 所述f平移動機器裝置240,一 LM導引器鑲嵌於升降器 230之後端’包含一水平導引器241,固定於升降器23〇之後端, 0 用以導引升降器230在水平面上的左右移動;一水平螺旋桿 242 ’該水平螺旋桿242的兩端與水平導引器241銜接;以及一 伺服電動機243,用以正/反方向旋轉水平螺旋桿242。 ^為使所述升降器230能穩定地水平移動,所述水平移動機 器裝置240鎮嵌於升降器230之中間,並且只有水平導引器241 鑲嵌於升降器230之下側。 &lt;可旋轉輸送元件&gt; 可方疋轉輸送元件300包含一輸送帶310,具有從卸匣元件 200至電漿清除室100後端的裝匣元件4〇〇的傳送區;一輸送 裝置320 ’用以靜置已卸除清理物件之空置的收納匣;以及一 〇 轉盤330 ’位於輸送裝置320下側,用以將所述輸送裝置水平 旋轉180度。 所述可旋轉輸送元件3〇〇從卸匣元件2〇〇接收已卸除清理 物件之空置的收納匣,藉由轉盤330將已卸除清理物件之空置 的收納ϋ水平旋轉180度,以及藉由所述輸送帶31〇將該空置 的收納匣輸送至電漿清除室100之後端。 ,所述空置的收納匣可水平旋轉180度是由於在收納匣的前 後兩端各具有一個防脫裝置Α。該防脫裝置Α包含一可轉動構 件A1位於所述收納匣的上侧,以及一擋桿^與可轉動構件 A1相結合,該擋桿八2跨越所述收納匣的上下兩端,所以當使 200941563 轉動構件A卜擋桿M即依照可轉動構件A 轉動的方向來敞開或阻擋收納匣的一端。 τ _因此’請參賴12,由於所述清理物件防脫裝置阻擔所述 ,巧的前端,同時所述防脫裝置敞開所述收、紐的後端,以 利穩疋地在卸絲態卸騎述清理物件,必須鼓置的收 水平旋轉180度如圖14所示’才得以順暢地連續將清之 理物件裝載人空置的收_中。 ㈣將一深% 圖12至圖14為轉盤330由初始狀態旋轉18〇度之連續步 驟圖組。 &lt;第一推進器&gt; 複數個第一推進器250以相等於電漿清除室1〇〇的數量, 鑲嵌於卸匣元件200上。 請參閱圖ίο ’所述第一推進器250包含:一推進片251固 疋於升降器230上;一推進圓柱252固定於推進月251上;以 及一推進圓柱頂253位於所述推進圓柱252頂端,用於一個接 連一個地推進和卸除經由卸除元件2〇〇移動至電漿清除室夏㈨ 之收納匣中的清除物件。 &lt;裝匣元件&gt;Please _8, the feeder 131 of the first stationary component 13A includes a rotating shaft passing through all the guide plates 132; a driving motor 13lb for providing a rotational force to the rotating shaft 131a; - a sending belt i31c' A piece of belt mc is intended to be received on each of the guide plates 132 and receives the rotational force from the rotating shaft 131a to carry the incoming cleaning object to the rear end of the guide plate 132 and a feed roller 131d for cleaning the delivery belt mc. The object is pressed down. A sensor 131e is attached to the front end of the delivery member g 131 to sense whether the cleaning object is in close proximity. If the sensor 131e senses that the cleaning object is approaching, the driving up to 131b starts to operate. The feeder 14i on the second resting member 140 is identical to the feeder 131 on the first stationary member 13''. Referring to FIG. 9 'the first stationary component 13 〇 includes a cleaning object transporting tool 150 for transporting the cleaning object from the first stationary component 13 到 to the plasma cleaning chamber 1 〇〇 or the cleaned cleaning object to the first Two stationary elements 14 〇. The cleaning article transporting tool 150 includes an LM guide 151 for moving back and forth between the first rest element 130 and the plasma cleaning chamber 1; a finger arm 152, and the LM guide 151 are moved synchronously; A plurality of fingers 153 are mounted on the finger arm 152 so as to be rotatable up and down. When the finger 153 is turned downward, the cleaning object can be selectively pushed from the first rest component 13 to the appropriate power. The slurry removal chamber 100' or the cleaned cleaning article is pushed to the second stationary element 14'. 12 200941563 The unrecognized symbols in the text are included. &lt;Unloading element&gt; The unloading element 200 is set in the front end of the cleaning chamber 1〇〇. Referring to Figure 10, the depalletizing element 200 includes a conveyor belt 21 for receiving each storage magazine loaded with the cleaning object, and simultaneously transporting the equally spaced storage pockets from the exterior of the depalletizing element 200 to the gripping position; a cooling tong 22 () for accommodating the storage raft conveyed by the conveyor belt 210 to the gripping position; a hoisting device for inserting the tongs 220 to vertically clamp the storage raft to the first thruster And a horizontal moving machine device 240 for gradually moving the lifter 23A so that the clamp 220 is continuously placed at the front end of each of the guide plates 132^ of the first stationary member 130. The depalletizing element 200 moves the upper side from the lower side according to the cleaning process by the horizontal moving machine device 24, thereby moving the storage cassette loaded with the cleaning object to the plasma cleaning chamber 1 equally. The front end. The conveyor belt 210 includes a conveyor belt 211 for conveying the storage cassette to the right side from the left side in the drawing, and an upper loader 212 at the rear end of the conveyor belt body 211 for resting the storage conveyed by the conveyor belt body 211. And moving the stationary storage cassette to the gripping position; and a first receiving cassette sensor 213 for sensing whether the storage cassette is resting on the upper loader 212 and transmitting a clip capture signal to Clamp 220. Referring to FIG. 10 and FIG. 11 , the clamp 220 has an squeegee block 221 fixed to the lifter 230 ; a clamp cylinder 222 located below the clamp block 221 . A pair of pliers 223 and 223 are connected to both sides of the clamp cylinder, and the distance between the two clamps is changed according to the movement of the clamp cylinder 222; an elastic pressure plate 224 is horizontally fitted to the pair of pliers 223 via the central clamp cylinder 222 Between the 223 and 223, the upper side of the storage raft between the elastic pressure tongs 223 and 223, and a third accommodating 匣 sensor 225 are located on one side of the pair of sweeteners 223 and 223, by the elastic spring platen 224 The position is to detect a suitable gripping position of the storage cassette and a gripping signal is transmitted to the clamp cylinder 222. 13 200941563 The lifter 230, the LM guide can be vertically moved to the first thruster ^, including a vertical guide 231 and a vertical auger 232, the vertical auger 232 (four) end is engaged with the vertical guide 231; And - the servo motor 233' rotates the vertical auger 232 in the forward/reverse direction. The straight auger 232 has a caliper 221 through its position. Therefore, when the feeding motor 233 starts to operate, the vertical auger 232 is rotated in one direction to move the clamp block 221 on the vertical screw 232 up or down. ', the flat moving machine device 240, an LM guide is mounted on the rear end of the lifter 230' includes a horizontal guide 241 fixed to the rear end of the lifter 23, 0 for guiding the lifter 230 at Left and right movement on the horizontal plane; a horizontal auger 242 'the two ends of the horizontal auger 242 are engaged with the horizontal guide 241; and a servo motor 243 for rotating the horizontal auger 242 in the forward/reverse direction. In order to enable the lifter 230 to move stably horizontally, the horizontal moving machine device 240 is embedded in the middle of the lifter 230, and only the horizontal guide 241 is fitted to the lower side of the lifter 230. &lt;Rotatable Conveying Element&gt; The translatable conveying member 300 includes a conveyor belt 310 having a conveying area from the depalletizing element 200 to the mounting member 4〇〇 at the rear end of the plasma cleaning chamber 100; a conveying device 320' A storage compartment for vacating the detached cleaning article; and a turntable 330' located on the underside of the conveying device 320 for horizontally rotating the conveying device by 180 degrees. The rotatable conveying element 3 receives the vacant storage hopper from which the cleaning object has been removed from the tamper-removing element 2, and rotates the vacant storage hopper that has been detached from the cleaning object by 180 degrees, and borrows The vacant storage magazine is transported by the conveyor belt 31 to the rear end of the plasma cleaning chamber 100. The vacant storage cassette can be rotated 180 degrees horizontally because each of the front and rear ends of the housing cassette has an anti-off device Α. The anti-off device Α includes a rotatable member A1 on an upper side of the accommodating cymbal, and a damper rod is combined with the rotatable member A1, and the damper rod 8 spans the upper and lower ends of the accommodating cymbal, so The 200941563 rotating member A is blocked to open or block one end of the housing 依照 in accordance with the direction in which the rotatable member A rotates. τ _ therefore 'please refer to 12, because the cleaning object anti-off device blocks the smart front end, while the anti-off device opens the rear end of the receiving and closing, so as to facilitate the unloading When the state is unloaded and the object is cleaned, the drum must be rotated 180 degrees horizontally as shown in Fig. 14 to be able to smoothly and smoothly remove the object from the empty object. (D) A deep % Fig. 12 to Fig. 14 are successive step diagrams in which the turntable 330 is rotated by an initial state of 18 degrees. &lt;First Propeller&gt; A plurality of first propellers 250 are mounted on the depalletizing element 200 in an amount equal to the plasma cleaning chamber 1〇〇. Referring to the drawings, the first pusher 250 includes: a pusher piece 251 fixed to the lifter 230; a pusher cylinder 252 fixed to the advancement month 251; and a pusher cylinder top 253 at the top of the pusher cylinder 252 For successively advancing and unloading the cleaning items moving through the unloading element 2 to the storage bowl of the plasma cleaning chamber (9). &lt;mounting element&gt;

、一裝匣元件400包含:一個夾钳41〇,用以夾取來自可旋轉輸 送疋件300之空置的收納匣;一升降器42〇,其上鑲嵌有夾鉗 410以利將夾取之空置的收納匣垂直傳送至第二推進器5⑻;一 水平f動機器裝置430,用以逐步地移動升降器420,使夾鉗 410得以連續地置於第二靜置元件14〇的每一個導板142的前 端if及一傳送帶440 ’用以從升降器處接收空置的收納匣, 並當第二推進器5〇〇全數推進已清潔的清理物件至收納匣中 時’將空置的收納匣推至電漿清除裝置之外侧。 所述裝匣元件400經夾鉗410接收夾於可旋轉輸送元件 3〇t上之空置的收納匿’並且當所述裝£元件400藉由所述升 降器420上下移動時,依照清潔過程連續地經由水平移動機器 15 200941563 裝置430輸送空置的收納Ε至每一個賴清除室之後 含一傳送帶體441; 一下裝載器442位 於傳送帶體441之後端,用於靜置來自所述升降器的收納 Ε,同時將靜置的收納Ε向下移至傳送帶體441 ;以及二 收納g感應器443,用以感應收納g是否靜置於所述下 442上,並且傳遞一向下傳送的信號給下裝載器442。 同時,由於所述夾鉗410相同與卸匣元^ 2〇〇 220,則在此不贅述夾鉗41〇。 上Ί死甜 &lt;第二推進器&gt; Ο Ο 位於第二靜置元件140的第二推進器5〇〇,用以在裝匣元 件400處推進及裝填已清潔之清理物件至空置的收納匣中。 請參閱圖15,第二推進器500包含:一導引軌道51〇,與 j置το件140平行;-推桿52〇,於導引軌道別之固定區 ί Ϊ —推進圓柱530,用以來回推動所述推桿520 ;以 」复數個推指540,以可上下旋轉的方式鑲嵌於推桿52〇上, 备所述推指540轉向下方,可選擇性地連續將靜 元物上的清理物件推靡元件4⑽處空置 145如验m關巾,最佳的設置為將-第时峨感應器 =裝置於裝E元件400❺一側、第二靜置元件14〇上每一個 ίΪ142之一端。該第四收納S感應器145傳遞感應到空置的 偏^域給第二推進器5GG ’使轉指153執行裝載清理物 二Ξ動!!。為此,第二推進器500處的每一個轉指153均具有 ,應器55〇’用以感應由第喊納昆感應器⑷傳遞來的空 的信號,僅向下轉動洽當的轉# 153,以便各轉指153 獨立執行清理物件裝载的程序。 夕個ί發明附有複數個清除室之半導體電漿清除裝置交替進行 ί至:上下方向執行卸匣程序’連續地將裝清理物件輸 ⑽;—電漿清除程序,在接收清理物件的 ’月矛、至中進行;以及一裝匣程序,在裝匣元件400處連續地 16 200941563 ^已,之清理物件裝載人來自每—個清除室⑽之空置的收 納序Φ。 &lt;卸匣程序&gt; 當作業機制將裝載有清理物件的收納匣輸送至卸匣元件 200的傳送帶體211上時,收納£被向上傳送至傳送帶體211 收触被向上傳送至上裝載器212後便靜 置於该上裝載裔212上,上裝載器犯處的第—收納£感應器 可感應收納匣是否妥當地靜置於上裝載器212,僅當收納匣The mounting member 400 includes: a clamp 41 〇 for gripping the vacant storage cymbal from the rotatable transport element 300; a lifter 42 镶嵌 on which the clamp 410 is mounted for facilitating the gripping The vacant receiving cassette is vertically conveyed to the second pusher 5 (8); a horizontal f-moving machine 430 for moving the lifter 420 stepwise so that the clamp 410 is continuously placed in each of the second stationary elements 14A The front end if of the plate 142 and a conveyor belt 440' are used to receive the vacant storage raft from the lifter, and when the second pusher 5 pushes the cleaned cleaning object all the way into the storage raft, the vacant storage 匣 is pushed To the outside of the plasma removal unit. The mounting member 400 receives the vacant storage member clamped on the rotatable conveying member 3〇t via the clamp 410 and continues to follow the cleaning process when the loading member 400 is moved up and down by the lifter 420 The horizontally-moving machine 15 200941563 device 430 transports the empty storage cassette to each of the cleaning chambers to include a conveyor belt 441; the lower loader 442 is located at the rear end of the conveyor belt 441 for resting the storage unit from the elevator At the same time, the stationary storage cassette is moved down to the conveyor belt body 441; and the second storage g sensor 443 is used to sense whether the storage g is statically placed on the lower portion 442, and transmits a downward transmission signal to the lower loader. 442. At the same time, since the clamp 410 is the same as the unloading element 220, the clamp 41〇 will not be described here. The upper pusher &lt;second pusher&gt; Ο 第二 is located in the second pusher 5〇〇 of the second rest element 140 for advancing and loading the cleaned cleaning object to the vacant storage at the mounting component 400 In the middle. Referring to FIG. 15, the second pusher 500 includes: a guiding track 51〇, which is parallel to the j-position θ 件 member 140; and a push rod 52 〇 in the fixed area of the guiding track ί 推进 to advance the cylinder 530 Pushing the push rod 520 back; the plurality of push fingers 540 are mounted on the push rod 52〇 so as to be rotatable up and down, and the push finger 540 is turned downward to selectively continuously move the static element Cleaning the object pushing member 4 (10) at the empty position 145, such as the inspection m towel, the best setting is - the first time sensor = device on the side of the E element 400, the second stationary element 14 is on each of the Ϊ 142 . The fourth housing S sensor 145 transmits a sense of the vacant bias to the second actuator 5GG' to cause the finger 153 to perform the loading of the cleaning device. To this end, each of the fingers 153 at the second pusher 500 has a signal 55 〇 'to sense the empty signal transmitted by the first call sensor (4), and only rotates downwards. 153, so that each of the fingers 153 independently performs the procedure of cleaning the object loading.夕 ί Invented the semiconductor plasma cleaning device with a plurality of cleaning chambers alternately: performing the depalletizing process in the up and down direction 'continuously loading the cleaning object (10); - the plasma cleaning program, receiving the cleaning object 'month The spear, the middle is performed; and a mounting procedure is continuously performed at the mounting member 400. The cleaning object loader is from the vacant storage sequence Φ of each of the cleaning chambers (10). &lt;Depalletizing Procedure&gt; When the working mechanism transports the storage cassette loaded with the cleaning object onto the conveyor body 211 of the depalletizing element 200, the storage £ is conveyed upward to the conveyor body 211, and the pickup is conveyed upward to the upper loader 212. Then, it is placed on the upper loader 212, and the first storage sensor of the upper loader can sense whether the storage 妥 is properly placed on the upper loader 212, and only when it is stored.

疋,當地靜置於上裝載器212上時,則所述上裝載器212傳遞 一夾取信號給夾鉗220。 〇若夾鉗22〇收到第一收納匣感應器213所傳遞的夾取信 號,則升降器230將夾鉗220向下移動,以利夾取靜置於上^ 載器212的收納匣。在此情況下,夾鉗22〇上的彈性壓板224 吸收夾鉗滑車221碰撞收納匣的衝擊,以當夾鉗22〇 時保護收納Ε。 田 若夾鉗220向下移動’位於一對鉗子223和223其中一側 的第二收納匣感應器225,藉由感應彈性壓板224的位置來判 斷收納匣是否位於適當的夾位,並且,若判斷收納匣位於適當 的夾位時’傳遞一夾取信號給夾甜圓柱222。若夾钳圓柱222 因應該信號而啟動,則一對鉗子223和223之間的距離會縮小 進而夾取收納匣。 當夾取收納匣的動作完成,升降器230向上移動,在升降 器230的下側將夾起的收納匣輸送至第一推進器250。當收納 匣被輸送至第一推進器250時’第一推進器250的推進圓柱252 啟動,將位於推進圓柱頂253的清理物件由收納厘推進位於第 一推進器250之下的電漿清除室1〇〇中。每當卸匣元件2〇〇之 水平移動機器裝置240連續地逐步移動升降器230至第一靜置 元件130的每一個導板132處時,所述第一推進器25〇便會執 行上述動作。所述清理物件則被第一推進器250推至電漿清除 17 200941563 室100的第一靜置元件130處。 根據卸除清理物件的卸匣程序完成,升降器230向上移 動,將收納匣移至清除室100上侧。之後,上述卸除清理物件 的卸匣程序在清除室100上侧反覆進行。 ❹ 〇 請參閱圖3,當卸除清理物件的卸匣程序在清除室1〇〇上 =進行時’清除室100的下側打開’第一靜置元件13〇的送件 器131運轉,將靜置於導板132上的清理物件移至清除室 1打開側。在此情況下,送件器131的送件滚輪131d受到送件 器131的感應器I31e的感應,而向下滾動至送件滾輪 距離接,到靜置於導板132上清理物件的上側。據此,當清理 送件帶131c被送至後端時,清理物件被確實地送入清 在這一段時間中’在清理物件被送件器131送至清除室1〇〇 時,清理物件傳送工具15〇被同時啟動。 ,於清理物件傳送工具15〇的LM導引器⑸,輸送轉指 彳153置於清理物件的射,並雜指臂152 Γ當轉指臂152前移則轉指⑸上轉, &lt;清除曰程序〉、術曰153可從清理物件的前方推進。 理物件藉由清理物件傳送工具15〇被裝載至清除室 m與清除室下側進行時,送件器 清理;件裝W動,用以將 打開igg现成,清除請再次 推出並卸除至清除官^ 〃 150運轉將清理物件從清除室100 理物件便靜置於第-德罢i。被卸除至清除室100之外的清 靜置70件14G的導板142。當清理物件靜 18 200941563 置於導板142的同時,送件器141便啟動將清理物件送至導板 142的後端。 Ο Ο 同時,當清理物件從清除室1〇〇的下側被卸除並靜置於第 二靜置元件140時,清除室100的上侧進行電漿清除程序。'在 此同一時間,已卸除清理物件的空置的收納匣,藉由卸匣元件 200被送至可旋轉輸送元件300的輸送帶31〇。如同圖12所 示,一旦空置的收納匣被放置於輸送裝置32〇上,轉盤33〇便 如同圖14所示旋轉180度,之後該輸送裝置便運轉。據此,空 置的收納匣被從輸送裝置320輸送至輸送帶310,並且在被送 至輸送帶310之後整批送至裝匣元件4⑻處。 一旦空置的收納匣被輸送至裝匣元件,襄匣元件4⑽ 的夾鉗410便夾取空置的收納匣,並且升降器42〇以及水平移 動機器裝置430啟動,連續地將收納匣移至清除室1〇〇下側的 第二靜置元件140的每一個導板142的後端。 &lt;裝匣程序&gt; ,一旦當收納匣移至第二靜置元件140的每一個導板142的 後巧,位於裝匣元件400 —侧、導板142末端的第四收納匣感 應,145感應到空置的收納匣,並且傳遞一空置收納匣信號給 第二推進器500。空置收納匣信號被傳遞給位於第二推進器5〇〇 上連接於轉指153的感應器550。若感應器550傳遞一清理物 件,匣程序開始信號給洽當的推指54〇,轉指153則同時下轉, 將第二推進器500移至裝匣元件400處以利將清理物件一個接 一個地裝載入空置的收納匣内。之後,第二推進器500盥推指 54〇回到原處,準備下一次的程序。 /、 於裝匣元件400處,靜置於第二靜置元件14〇的清理物件 ^程序是重覆進行的,並且,若#清除室丨⑽下側的裝匿程 成,裝匣元件400便將收納匣移至清除室1〇〇上側以利進 =裝S程序’並且將收納!£放至清除室上側、第 件H0的導板142的後端。 静置70 19 200941563 同時’當在清除室100下侧的電漿清除程序進行時, 除室100上侧的電聚清除程序已完成,並且已清潔之清理: ,清理物件傳送工具150傳送至清除室1〇〇之外。被送出清除 室100之外的已清潔之清理物件靜置於第二靜置元件14〇 板142處。在清理物件靜置於導板142的同一時間,送件器⑷ 運轉以將已清潔之清理物件整批送至導板142的後端。 Ο ❹ 被送至導板142後端的已清潔之清理物件,在清除室1〇〇 上側被連續地裝载入上移的收納匣内。每一個清理物件的 程序與清除室1GG下侧之裝g程序完全_並且重覆進行。、 一在清除室100上側清潔的清理物件全數裝载入收納匣, =元,400的升降器420將收納匣靜置於下裝载器4沿上,且 若第二收納匣感應器443感應到靜置的收納匣,第二收 應器443便傳遞一向下傳送的信號給下裝載器糾2。下 442接收到從第二收納g感應器443傳遞來的向下傳送的信^ ί便向下移動’跟隨著下裝載器4似下移的收納匿在傳送帶44〇 之後被推出清除裝置之外。 本發明附有複數個清除室之半導體電襞清除裝置可以上述 -週期連續反覆進行。前文係針對本發明之較佳實施例 ^發明之碰繼進行類之制,唯熟悉此項技術之人士 虽可在不脫離本發明之精神與原則下對本發明進行變更與修 變更與修改,皆應涵蓋於如下申請專利範圍所界定 之範,中。 【圖式簡單說明】 圖1為一實施中相關技術電漿清除装置部份說明圖; =為相隨術電黯除裝置憎麵暗盒愤鐘之組合透 視圖; 圖3為本發明之最佳實施例之電漿清除 圖4為圖3中電漿清除裝置之正面圖;1賴圃 20 200941563 圖5為本發明之最佳實施例之電漿清除裝置的清除室下板部份 說明圖; =為本發日狀最佳實侧之電料除裝置崎除室底部透視 圖, 圖7為本發明之最佳實施例之電漿清除裝置的清除室加熱 面圖; ‘、、' 丁 圖8為本發明之最佳實施例之電漿清除裝置中第一推進器透 圖; 11 第一靜置元件之That is, when the local static is placed on the upper loader 212, the upper loader 212 transmits a gripping signal to the clamp 220. If the clamp 22 receives the gripping signal transmitted by the first storage port sensor 213, the lifter 230 moves the clamp 220 downward to facilitate the gripping of the storage cassette that is statically placed on the upper loader 212. In this case, the elastic pressure plate 224 on the clamp 22 吸收 absorbs the impact of the clamp pulley 221 against the storage pocket to protect the storage pocket when the clamp 22 is closed. The Tianruo clamp 220 moves downwards to the second storage jaw sensor 225 located on one of the pair of pliers 223 and 223, and determines whether the storage cassette is in the proper clamping position by sensing the position of the elastic pressing plate 224, and if When it is judged that the storage cassette is in the proper clamping position, a picking signal is transmitted to the clip sweet cylinder 222. If the clamp cylinder 222 is activated by the signal, the distance between the pair of pliers 223 and 223 is reduced to grip the storage pocket. When the action of gripping the storage cassette is completed, the lifter 230 is moved upward, and the pinched storage cassette is conveyed to the first pusher 250 on the lower side of the lifter 230. When the storage cassette is conveyed to the first pusher 250, the advancement cylinder 252 of the first pusher 250 is activated, and the cleaning object located at the top of the push cylinder 253 is advanced by the storage centimeter to the plasma cleaning chamber located below the first pusher 250. 1 〇〇. Whenever the horizontal moving machine device 240 of the depalletizing element 2 continuously moves the lifter 230 to each of the guide plates 132 of the first stationary member 130, the first pusher 25 performs the above action. . The cleaning article is then pushed by the first pusher 250 to the first stationary component 130 of the plasma purge 17 200941563 chamber 100. Upon completion of the unloading procedure for removing the cleaning article, the lifter 230 is moved upward to move the storage magazine to the upper side of the cleaning chamber 100. Thereafter, the above-described unloading procedure for removing the cleaning article is repeated on the upper side of the cleaning chamber 100. ❹ 〇 〇 图 〇 〇 〇 , , , , , , , , , , , , , , , 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸 卸The cleaning object resting on the guide plate 132 is moved to the open side of the cleaning chamber 1. In this case, the feed roller 131d of the feeder 131 is sensed by the sensor I31e of the feeder 131, and is rolled down to the distance of the feed roller to the upper side of the guide 132 which is placed on the guide 132. According to this, when the cleaning feed belt 131c is sent to the rear end, the cleaning object is surely fed into the clearing during this period of time 'When the cleaning object is sent to the cleaning chamber 1 by the feeder 131, the cleaning object is conveyed. The tool 15 is started at the same time. , in the LM guide (5) for cleaning the object transporting tool 15〇, the transporting finger 彳153 is placed on the cleaning object, and the miscellaneous arm 152 is turned forward when the finger 152 is moved forward, and the finger (5) is turned up, &lt;clear曰 Program>, 曰 153 can advance from the front of the cleaning object. When the object is loaded into the cleaning chamber m and the lower side of the cleaning chamber by the cleaning object conveying tool 15 , the feeder is cleaned; the device is loaded with W to open the igg ready to be cleaned, please re-launch and remove to clear The official ^ 〃 150 operation will clean the object from the clearing room 100 and the object will be placed in the first German. The guide 142 of the 70 piece 14G is quietly placed outside the cleaning chamber 100. While the cleaning object is still placed on the guide 142, the feeder 141 initiates delivery of the cleaning object to the rear end of the guide 142. Ο Ο At the same time, when the cleaning object is removed from the lower side of the cleaning chamber 1 并 and is placed in the second stationary member 140, the upper side of the cleaning chamber 100 is subjected to a plasma cleaning process. At the same time, the empty storage magazine from which the cleaning object has been removed is sent to the conveyor belt 31 of the rotatable conveying member 300 by the depalletizing element 200. As shown in Fig. 12, once the vacant storage magazine is placed on the transport unit 32, the turntable 33 is rotated 180 degrees as shown in Fig. 14, after which the transport unit is operated. Accordingly, the empty storage cassettes are transported from the transport unit 320 to the transport belt 310, and are sent to the mounting member 4 (8) in batches after being sent to the conveyor belt 310. Once the empty storage cassette is transported to the mounting element, the clamp 410 of the click element 4 (10) grips the empty storage cassette, and the lifter 42 and the horizontal moving machine 430 are activated to continuously move the storage cassette to the cleaning chamber. The rear end of each of the guide plates 142 of the second stationary member 140 on the lower side. &lt;Installation procedure&gt; Once the storage cassette is moved to each of the guide plates 142 of the second stationary member 140, the fourth housing cassette is located on the side of the mounting member 400 and the end of the guide plate 142, 145 An empty storage cassette is sensed and an empty storage cassette signal is transmitted to the second pusher 500. The vacant receiving cassette signal is transmitted to the sensor 550 located on the second pusher 5A and connected to the finger 153. If the sensor 550 transmits a cleaning object, the program start signal is sent to the directional finger 54 〇, the finger 153 is simultaneously turned down, and the second pusher 500 is moved to the mounting member 400 to facilitate cleaning the objects one by one. The ground is loaded into a vacant storage compartment. Thereafter, the second pusher 500 pushes the finger 54 to return to the original position to prepare for the next procedure. /, at the mounting member 400, the cleaning object that is placed in the second stationary member 14A is repeated, and if the cleaning process on the lower side of the cleaning chamber (10) is completed, the mounting member 400 Move the storage raft to the upper side of the cleaning room 1 to facilitate the installation of the S program 'and will be stored! £ is placed on the upper side of the purge chamber, the rear end of the guide 142 of the first piece H0. Resting 70 19 200941563 At the same time 'When the plasma cleaning program on the lower side of the cleaning chamber 100 is performed, the cleaning cleaning program on the upper side of the chamber 100 is completed, and the cleaning is cleaned: the cleaning object conveying tool 150 is sent to the cleaning Outside the room. The cleaned cleaning items sent out of the cleaning chamber 100 are placed at the second resting member 14 slab 142. At the same time that the cleaning object is placed at the guide 142, the feeder (4) operates to deliver the cleaned cleaning items in a batch to the rear end of the guide 142.已 已 The cleaned cleaning object sent to the rear end of the guide 142 is continuously loaded into the upper storage magazine on the upper side of the cleaning chamber 1 . The procedure for cleaning each object is completely and continually repeated with the g-installation procedure on the lower side of the cleaning chamber 1GG. The cleaning object that is cleaned on the upper side of the cleaning chamber 100 is all loaded into the storage cassette, and the lifter 420 of the 400 is placed on the lower loader 4 edge, and if the second storage cassette sensor 443 is inductive After the stationary storage cassette, the second receiver 443 transmits a downward transmission signal to the lower loader to correct 2. The lower 442 receives the downwardly transmitted message transmitted from the second storage g sensor 443 and moves downward. 'The storage that follows the lower loader 4 like the downward movement is hidden behind the conveyor belt 44〇 and is pushed out of the cleaning device. . The semiconductor electric pick-up device of the present invention with a plurality of cleaning chambers can be continuously repeated as described above. The foregoing is a description of the preferred embodiments of the invention, and the invention may be modified and modified without departing from the spirit and scope of the invention. It should be covered by the scope defined in the following patent application. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a partial explanatory view of a plasma cleaning device of a related art in an implementation; FIG. 3 is a combined perspective view of an innocent clock of a blank box in accordance with an electrosurgical device; FIG. FIG. 4 is a front view of the plasma cleaning device of FIG. 3; FIG. 5 is an explanatory view of a lower portion of a cleaning chamber of a plasma cleaning device according to a preferred embodiment of the present invention; = bottom view of the bottom of the electric material removing device of the present invention, FIG. 7 is a heating surface view of the cleaning chamber of the plasma removing device of the preferred embodiment of the present invention; ',, ' 8 is a first propeller through a plasma cleaning device in accordance with a preferred embodiment of the present invention; 11 a first stationary component

圖9為本發明之最佳實施例之電漿清除裝置中 送件器透視圖; ,10為本侧之最佳實關之賴清除裝置中紐元件透視 圖, 圖11為本發明之最佳實施例之電漿清除裝置中裝匣元件的夾 鉗侧面圖; 圖12至圖14為依序說明本發明之最佳實施例之電漿清除裝置 中的可旋轉輪送元件,·以及 圖15為本發明之最佳實施例之電漿清除裝置中第一推進器透 視圖。 【主要元件符號說明】 1 電漿清除裝置 10 室 20 暗盒 21 上框 22 下框 23 側電極板 30 空氣抽吸元件 40 氣體供應元件 50 電流生產元件 21 200941563 收納匣 導入梯級 清除室 下板 靜置構件 空氣循環管 内管 外管 Ο 氣體供應管 加熱元件 上陶板 蓋板 加熱板 下陶板 空氣線路 空氣線路末端 空氣線路末端 上板 第一靜置元件 送件器 轉轴 驅動馬達 送件帶 送件滚輪 感應器 導板 第二靜置元件 送件器 導板 22 200941563Figure 9 is a perspective view of the feeder in the plasma cleaning apparatus of the preferred embodiment of the present invention; 10 is a perspective view of the button in the best-performing cleaning device of the present invention, and Figure 11 is the best of the present invention. FIG. 12 to FIG. 14 are sequential side views of the rotatable wheeling device in the plasma cleaning apparatus of the preferred embodiment of the present invention, and FIG. 15 A perspective view of a first pusher in a plasma removal device in accordance with a preferred embodiment of the present invention. [Main component symbol description] 1 Plasma cleaning device 10 Room 20 Cassette 21 Upper frame 22 Lower frame 23 Side electrode plate 30 Air suction element 40 Gas supply element 50 Current production element 21 200941563 Storage 匣 Import step clearance chamber Lower plate standing Component air circulation pipe inner pipe outer pipe 气体 gas supply pipe heating element upper ceramic plate cover heating plate lower ceramic plate air line air line end air line end upper plate first stationary component feeder rotating shaft drive motor delivery piece with delivery roller induction Guide plate second stationary component feeder guide 22 200941563

145 第四收納匣感應器 150 清理物件傳送工具 151 LM導引器 152 轉指臂 153 轉指 200 卸匣元件 210 傳送帶 211 傳送帶體 212 上裝載器 213 第一收納匣感應器 220 夾钳 221 夾钳滑車 222 夾钳圓柱 223 钳子 224 彈性壓板 225 第三收納匣感應器 230 升降器 231 垂直導引器 232 垂直螺旋桿 233 伺服電動機 240 水平移動機器裝置 241 水平導引器 242 水平螺旋桿 243 伺服電動機 250 第一推進器 251 推進片 252 推進圓柱 253 推進圓柱頂 300 可旋轉輸送元件 23 200941563 310 輸送帶 320 輸送裝置 330 轉盤 400 裝匣元件 410 夾钳 420 升降器 430 水平移動機器裝置 440 傳送帶 441 傳送帶體 442 下裝載器 〇 443 第二收納匣感應器 500 第二推進器 510 導引軌道 520 推桿 530 推進圓柱 540 推指 550 感應器 A 防脫裝置 A1 可轉動構件 Q A2 擋桿 L 清理物件 Μ 收納匣 24145 Fourth Storage 匣 Sensor 150 Cleaning Object Transfer Tool 151 LM Guide 152 Transfer Finger 153 Turn Finger 200 Unloading Element 210 Conveyor Belt 211 Conveyor Body 212 Upper Loader 213 First Storage 匣 Sensor 220 Clamp 221 Clamp Block 222 Clamp cylinder 223 Pliers 224 Elastic platen 225 Third storage 匣 sensor 230 Lifter 231 Vertical guide 232 Vertical auger 233 Servo motor 240 Horizontal movement machine 241 Horizontal guide 242 Horizontal auger 243 Servo motor 250 First pusher 251 pusher plate 252 pusher cylinder 253 pusher cylinder top 300 rotatable transport element 23 200941563 310 conveyor belt 320 conveyor 330 turntable 400 mounting element 410 clamp 420 lifter 430 horizontal movement machine 440 conveyor belt 441 conveyor belt body 442 Lower loader 〇 443 second storage 匣 sensor 500 second pusher 510 guide rail 520 push rod 530 push cylinder 540 push finger 550 sensor A anti-off device A1 rotatable member Q A2 stop lever L cleaning object 匣 storage 匣twenty four

Claims (1)

200941563 、申請專利範園: 1.200941563, application for patent garden: 1. 一種附有複數個清除室之半導體電漿清除裝置,包括: 複數個置放為平行並直立的清除室; -卸,,件’可依照清潔過程上τ移動以連續將裝載有清理 ,物件之收納匣移轉至每一清除室的前面; 複數個鑲嵌於卸匿元件上的第一推進器,用以推進及卸除置 於收納Ε中被卸g元件接連著移轉至清除室的清理 件; 一可旋轉輸送元件’狀從卸E元倾接此練清理物件 之空置的收納匣,將空置的收納匣水平旋轉18〇度,並 一將空置的收納匣移轉至電漿清除室後端; 一裝匣元件,用以從可旋轉輸送元件接收空置的收納匣,並 連續地將空置的收納匣移轉至每一個電漿清除室後 端,同時依照清潔過程由下侧移至上侧;以及 -第二推進肋在裝s元件處推進及裝填已清潔之清理 物件至空置的收納匣中。 2. 〇 申請專利範圍第i項所述之附有複數個清除室之半 電漿清除裝置,進一步包括: —第-靜?元件,位於每—個電漿清除室之前端,並且所述 第一靜置元件具有複數個橫向導板用以靜置由第一推 進器連續推入的清理物件; —第二靜5元件,位於每一個電漿清除室之後端,並且所述 第二靜置元件具有複數個橫向導板用以靜置從電漿清 除室推出已清潔之清理物件; -送件器,職於第—靜置元件及第二靜置元件上,用以向 生後輸送清理物件至靜置位置;以及 清理物,傳送工具,提供給第一靜置元件,用以將靜置於第 一靜置元件上的清理物件送到洽當的電漿清除室,或者 25 200941563 將已清潔之清理物件傳送到第二靜置元件。 3_依據申請專利範圍第2項所述之附有複數個清除室之 電漿清除裝置,所述送件器包括: 一轉軸’穿過所有該送件器之導板; 一驅動馬達,用以提供轉動力至該轉轴; 一送件帶’鑲嵌於每一個該送件器之導板上,使往每一個導 板移動的清理物件接收來自轉軸的轉動力,以運 的清理物件至導板的後端;以及 Ο 4. 送件/袞輪,用以將送件帶上的清理物件壓下。 =申細第+2獅述謂有毅赠除室之半導體 冤泵^除裝置,所述清理物件傳送工具包括: 二3 ’在第—靜置元件和電漿清除間來回移動; ,才曰臂與LM導引器同步移動;以及 轉指丄以可上下旋轉的方式鑲嵌於轉指臂上,當所述轉指轉 向下方’選擇性地將清理物件由第一靜置元件推至 的】漿清除室,或者將已清潔之清理物件推至第二^ 7L件。A semiconductor plasma cleaning device with a plurality of cleaning chambers, comprising: a plurality of cleaning chambers placed in parallel and upright; - unloading, the piece 'can be moved according to the τ in the cleaning process to continuously carry the cleaning, the object The storage cassette is moved to the front of each cleaning chamber; a plurality of first propellers are mounted on the unloading elements for propelling and removing the cleaning of the unloading g elements placed in the storage cassette and moving to the cleaning chamber a rotatable conveying element's shape from the unloading E-element to the empty storage compartment of the cleaning object, and the vacant storage raft is horizontally rotated by 18 degrees, and the vacant storage raft is moved to the plasma cleaning chamber a rear end member; a mounting member for receiving an empty storage magazine from the rotatable conveying member, and continuously transferring the empty storage cassette to the rear end of each of the plasma cleaning chambers while moving from the lower side to the upper side according to the cleaning process And the second push rib advances and loads the cleaned cleaning object into the vacant storage pocket at the s component. 2. The semi-plasma removal device with a plurality of purge chambers as described in item i of the patent application scope further includes: a first-static element located at a front end of each of the plasma cleaning chambers, and said A rest element has a plurality of lateral guides for resting the cleaning items continuously pushed in by the first pusher; a second static 5 element located at the rear end of each of the plasma cleaning chambers, and the second stationary The component has a plurality of lateral guides for restoring the cleaned cleaning object from the plasma cleaning chamber; - a feeder for the first stationary component and the second stationary component for conveying the cleaning object to the living To the rest position; and the cleaning object, the conveying tool is provided to the first stationary component for feeding the cleaning object resting on the first stationary component to the plasma cleaning chamber, or 25 200941563 The cleaned cleaning article is transferred to the second stationary component. 3_ According to the plasma cleaning device with a plurality of cleaning chambers according to the scope of claim 2, the feeder comprises: a rotating shaft 'passing through all the guides of the feeder; a driving motor, To provide a rotational force to the rotating shaft; a feeding member belt 'inlaid on each of the guide plates of the feeder, so that the cleaning object moving to each of the guiding plates receives the rotational force from the rotating shaft to clean the object to The rear end of the guide; and Ο 4. The feed/clip wheel is used to press the cleaning object on the delivery belt. =Shenzhen +2 lion said that there is a semiconductor 冤 pump ^ removal device in addition to the room, the cleaning object transfer tool includes: two 3 ' move between the first - stationary component and the plasma clearing; The arm moves synchronously with the LM guide; and the index finger is mounted on the finger arm in an up-and-down rotation manner, and when the finger is turned downward, 'selectively pushes the cleaning object from the first rest element to the bottom] The slurry removal chamber, or the cleaned cleaning item is pushed to the second piece. 5. 翻第2項輯之财魏個絲室之半導體 电策β除裝置,所述卸匣元件包括: 一傳以接收每—個裝載有清理物件之收納£,同時 -^ ^等的收紐由卸Ε元件外傳送至魏位置; -^哭夾取由傳送帶傳送至夾取位置的收納匿; 甜镶嵌於該升降器上’以利垂直地將收納 比处取至第一推進器;以及 水置,用以逐步地移動升降器,使夾钳得以 連續地置於第-靜置元件的每一個導板的前端。 26 200941563 6.5. Turning on the second semiconductor device of the second section of the Weiwei silk room, the depalletizing device includes: a pass to receive each storage item with the cleaning object, and at the same time - ^ ^ The button is transferred from the outside of the depalletizing element to the Wei position; - the crying clip is taken by the conveyor belt to the gripping position; the sweet inlay is mounted on the lifter to facilitate the vertical storage of the storage ratio to the first propeller; And a water setting for gradually moving the lifter so that the clamp is continuously placed at the front end of each of the guide plates of the first stationary member. 26 200941563 6. 利細第5項所述之附有複數個清除室之半導體 電漿清除裝置,所麟送帶包括: 千等體 一傳送帶體; 一上^載器,位於傳送帶體之後端,用赠置經傳送帶 傳送的收納匣,並且將靜置的收納匣上移至夾取位置; 以及 一第一彳f納匣感應器’用以感應收納匣是否靜置於所述上裝 載态上’並且傳遞一夾取信號給夾钳。 依據申請專補圍第2撕狀附有複數個雜室之丰 體電漿清除裝置,所述裝匣元件包括: 一個夾鉗,用以夾取來自可旋轉輸送元件之空置的收納匣; 一升降器’其上鑲嵌有夾鉗以利將夾取之空置的收納匣垂亩 傳送至第二推進器; 一水平移動機器裝置,用以逐步地移動升降器,使夾钳得以 連續地置於第二靜置元件的每一個導板的前端;以及 一傳送帶’用以從升降器處接收空置的收納匣,並當第二推 進器全數推進已清潔的清理物件至收納昆中時,將空置 的收納匣推至電漿清除裝置之外側。 工 8·依據申請專利範圍第7項所述之附有複數個清除室之半導體 電漿清除裝置,所述傳送帶包括: 一傳送帶體; 下裝载器’位於傳送帶體之後端’用於靜置來自所述升降 器的收納匣,同時將靜置的收納匣向下移至傳送帶體; 以及 ^ 一第二收納匣感應器,用以感應收納匣是否靜置於所述下裝 載器上,並且傳遞一向下傳送的信號給下裝載器。&amp; 27 200941563 9 5項或第7項所述之附有複數個清除室 之牛導體電漿*除裝置,所述夾钳包括: • 一夾钳滑車,固定於所述升降器上; 二爽甜圓柱,位於所述夾鉗滑車的下方; 中柱的兩側’依照夾鉗圓柱的活動而 一彈巧板,,經夾_柱水平鑲嵌於—對钳子之間,用以彈 彳_地下壓鉗子之間的收納匣上側;以及 -第5收触感絲,位於—對鉗子的其中—側,藉著 雜&gt;1㈣位置來探敝紐所接近合適触取位 置,並且傳遞一夾取信號給夾钳圓柱。 1〇· 附有複數個清除室之半導 瓶电漿/月除裝置,所述可紅轉輸送元件包括: 一輸送具從卸H元件至電漿清除錢端驗元件的傳 區; 一輸送裝置,用以靜置已卸除清理物件之空置的收納匣. ❹ 以及 , 一轉盤,位於輸送裝置下側,用以將所述輸送裝置水平 轉180度。 U·依據申請專利範圍第2項所述之附有複數個清除室之 體電漿清除裝置,所述第二推進器包括: —導引軌道,與第二靜置元件平行; —推桿,於導引軌道之固定區段來回移動; —推進圓柱,用以來回推動所述推桿;以及 多個推指,以可上下旋轉的方式鑲嵌於推桿上,當所述推 28 200941563 指轉向下方,可選擇性地連續將靜置於第二靜置元件 上的清理物件推至裝匣元件處空置的收納中。 12.依據申請專利範圍第2項所述之附有複數個清除室之车 體電漿清除裝置,進一步包括一第四收納 置於裝匣元的一侧、第二靜置元件上每一個導板之一端, 用以感應是否有空置的收納匣,並且傳遞感應到空置的收 納匣之信號’使轉指執行裝載清理物件的動作。 ❹ 13·依據申請專利範圍第1項所述之附有複數個清除室之半 體電漿清除裝置’所述清除室包括: 一下板,用以靜置來自卸匣元件處的清理物件; 以及 一上板,位於下板的正上方,可上下活動選擇性地與下板 接合,當上板與下板接合時的空間可用於產生電漿; -對f置構件,牢固地固定在下板上,利於支撐由卸匿元 件,清除室中的清理物件的兩側,並使該清理物件 可U靜置於下板之上而距離所述下板一空間; ❹ 八中ίΪΐ板具有一加熱元件鑲嵌於其上,藉由加熱所述 广、^内循環的空氣或冷卻所必青除室内循環的空 氣、將,月理物件的溫度力口熱至合適的溫度。 14. 項所述之附有複數個清除室之半導 =ί ?=一上陶板、-蓋板、-加熱板、以及-下 32個;:ΐ熱ί的表面上,有-空氣線路均勻地覆 以猶壤由外而來的加熱空氣或冷卻空氣。 29The semiconductor plasma cleaning device with a plurality of cleaning chambers as described in Item 5 includes: a kilo-body-conveyor belt; an upper carrier, located at the rear end of the conveyor belt, with a gift a storage cassette conveyed by the conveyor belt, and moving the stationary storage cassette to the gripping position; and a first detecting sensor 'to sense whether the storage cassette is statically placed on the upper loading state' and transmitting a Clip the signal to the clamp. According to the application, the second body is provided with a plurality of auxiliary chambers, and the mounting member comprises: a clamp for gripping the vacant storage raft from the rotatable conveying member; The lifter is provided with a clamp to facilitate the transfer of the vacant storage hopper to the second pusher; a horizontal moving machine for gradually moving the lifter so that the clamp is continuously placed a front end of each of the second stationary elements; and a conveyor belt 'for receiving an empty storage cassette from the lifter, and vacant when the second pusher advances the cleaned cleaning object all the way to the storage compartment The storage raft is pushed to the outside of the plasma cleaning device. The semiconductor plasma cleaning device with a plurality of cleaning chambers according to claim 7 of the patent application scope, the conveyor belt comprising: a conveyor belt body; the lower loader 'located at the rear end of the conveyor belt body' for standing The storage cassette from the lifter simultaneously moves the stationary storage cassette downward to the conveyor belt body; and a second storage cassette sensor for sensing whether the storage cassette is resting on the lower loader, and Pass a downward transmitted signal to the lower loader. &amp; 27 200941563 9 5 or 7 of the cattle conductor plasma* removal device with a plurality of cleaning chambers, the clamp comprising: • a clamp block fixed to the lifter; Sleek sweet cylinder, located under the clamp block; the two sides of the middle column are in accordance with the movement of the clamp cylinder, and a telescopic plate is inserted horizontally between the pliers and used for the magazine _ The upper side of the storage raft between the pliers; and the 5th touch-sensitive wire, located on the - side of the pliers, by the miscellaneous &gt; 1 (four) position to find the appropriate touch position, and pass a clip Signal to the clamp cylinder. 1〇· a semi-conductive bottle plasma/month removal device with a plurality of cleaning chambers, the red-transportable conveying element comprising: a conveying device from the unloading H component to the plasma clearing money inspection component; And a device for resting the vacant storage container that has been removed from the cleaning object. ❹ and a turntable located on the lower side of the conveying device for horizontally rotating the conveying device by 180 degrees. U. The bulk plasma cleaning device with a plurality of cleaning chambers according to item 2 of the patent application scope, the second thruster comprising: - a guiding track parallel to the second stationary element; - a push rod, Moving back and forth in a fixed section of the guiding track; - advancing the cylinder for pushing the push rod back and forth; and a plurality of pushing fingers mounted on the push rod in a rotatable manner, when the push 28 200941563 refers to steering Below, the cleaning object resting on the second resting element can be selectively pushed continuously into the vacant storage at the mounting element. 12. The vehicle body plasma cleaning device with a plurality of cleaning chambers according to claim 2, further comprising a fourth storage unit disposed on one side of the mounting member and each of the second stationary members. One end of the plate is used to sense whether there is a vacant storage port, and transmits a signal that senses the vacant storage port to cause the finger to perform the action of loading the cleaning object. ❹ 13. The cleaning chamber of the half body plasma cleaning device with a plurality of cleaning chambers according to the scope of claim 1 includes: a lower plate for resting the cleaning object from the depalletizing element; An upper plate, located directly above the lower plate, is selectively movable up and down to engage the lower plate, and the space when the upper plate is joined to the lower plate can be used to generate plasma; - the member for f is firmly fixed on the lower plate Advantageously, supporting the unloading element, clearing both sides of the cleaning object in the chamber, and allowing the cleaning object to be statically placed on the lower plate and away from the space of the lower plate; ❹ 八中 Ϊΐ plate has a heating element Inlaid thereon, by heating the air circulating in the air or cooling, the air circulating in the room is removed, and the temperature of the moon object is heated to a suitable temperature. 14. The semi-conducting with a plurality of cleaning chambers as described in the item = ί == an upper ceramic plate, a cover plate, a heating plate, and a lower 32; on the surface of the heat, the air line is evenly distributed The ground is covered with heated air or cooling air from the outside. 29
TW097120585A 2008-03-27 2008-06-03 Plasma cleaning apparatus for semiconductor panel with cleaning chambers TWI368266B (en)

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JP2011519471A (en) 2011-07-07
CN101980798B (en) 2012-11-21
WO2009119937A1 (en) 2009-10-01
CN101980798A (en) 2011-02-23
TWI368266B (en) 2012-07-11
JP5214017B2 (en) 2013-06-19

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