TW200830456A - Processing apparatus and processing method - Google Patents
Processing apparatus and processing method Download PDFInfo
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- TW200830456A TW200830456A TW096132923A TW96132923A TW200830456A TW 200830456 A TW200830456 A TW 200830456A TW 096132923 A TW096132923 A TW 096132923A TW 96132923 A TW96132923 A TW 96132923A TW 200830456 A TW200830456 A TW 200830456A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
200830456 九、發明說明： 【發明所屬之技術領域】 本發明係關於一製程裝置及_ 一蓋子覆蓋之-容器取出—待方法，其用於從使用 物件經受一預定程序，例如一 处^ m M …、耘序。特定言之，本發 月係關於一種用於對著一分 ^ ^ ^ ^ ^ ^ π 4dt 土中之一開口按壓該容器並 將该w緊密地固持於適當位！的技術。 【先前技術】 Γ υ 作為半導體製造裝置之一者， 置，其熱處理若干半導體曰圓/子在一批次型熱製程裝 壯署勺扛 日日囫（下文稱”晶圓丨丨）。該熱製程 2…-载入區域，作為包含複數個晶圓之一容写之 一载體係藉由—自動傳送機器人或-操作者載人其中；以 及作為一運送區域之一裝 運送至作為-切之—日*其中㈣體中之晶圓係 從其卸載。 曰曰、’而§亥晶舟係裝载於一熱爐並 ^ 裝置中’為使該裝載區財之大氣比該載入 大氣：清潔並為防止一晶圓上產生一天然氧化物 、 土冬大氣側上的載入區域盘該 裝載區域彼此分離，且使用諸如一氮⑽氣之類的惰性氣 ，來填充該裝載區域之内部以形成一惰性氣體大氣。在此 »·月况下’為防止-晶圓之粒子污染，更佳的係採用一可穷 閉類型^載體（亦稱為F〇up:前開式晶圓盒），其—載^ 主體之-前表面中的晶圓出σ埠可藉由—蓋子加以密閉。 圖7(a)顯示—可密閉類型之載體與上述分隔㈣目接觸。 122563.doc 200830456 參考數字6描述將_載入^ ^ ^ ^ ^ ^ ^ ^ ^ ^ A &與裝载區域Sb彼此分離 的分隔壁。〜參考數字13描述形成於該分隔壁6中之一開 口。參考數子14描述用於開啟與關閉該開口 m門。在 將該載體3放置在置於該載入區域Sa中之-運送台⑷10上 之後，將該運送台1G向前移動使得該載體3之—前周邊部 分與該開口 13之一開口周邊 门遵口P刀相接觸，然後開啟蓋子 3b。在此情況下，從防也纺驻 孩裝载區域Sb中的氧氣密度增加200830456 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a process apparatus and a cover-receiving-to-receive method for subjecting a workpiece to a predetermined procedure, such as a m m ..., order. Specifically, this month is about pressing one of the openings in one of the ^ ^ ^ ^ ^ ^ π 4dt soils and holding the w tightly in place! Technology. [Prior Art] Γ υ As one of the semiconductor manufacturing apparatuses, it heat-processes a number of semiconductor rounds/sub-pieces in a batch-type hot-process process, which is called "wafer 丨丨". The thermal process 2...-loading area, as one of the carriers containing one of the plurality of wafers, is carried by the robot - or the operator is carried by the operator; and is transported as one of the transport areas to the The wafers in the body of the (four) body are unloaded from it. 曰曰, 'And the huic boat is loaded in a furnace and ^ in the device 'to make the loading area rich in the atmosphere than the loading atmosphere : cleaning and to prevent the generation of a natural oxide on a wafer, the loading area on the soil side of the soil, the loading area is separated from each other, and an inert gas such as a nitrogen (10) gas is used to fill the loading area. Internal to form an inert gas atmosphere. In this case, to prevent particle contamination of the wafer, it is better to use a stagnation type carrier (also known as F〇up: front open wafer cassette). ), which is the σ of the wafer in the front surface of the body It can be sealed by a lid. Figure 7(a) shows that the carrier of the sealable type is in contact with the above partition (4). 122563.doc 200830456 Reference numeral 6 describes loading _ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ ^ & partition wall separated from each other with the loading area Sb. Reference numeral 13 describes an opening formed in the partition wall 6. Reference numeral 14 describes a door for opening and closing the opening m. After being placed on the transport platform (4) 10 in the loading area Sa, the transport table 1G is moved forward such that the front peripheral portion of the carrier 3 and the open peripheral door of the opening 13 are in contact with each other. Then the lid 3b is opened. In this case, the density of oxygen in the anti-spinning child loading area Sb is increased.
ϋ 的觀點來看’進一步較佳的係以下程序1，當該門U係 關閉時D亥盍子3b係藉由一蓋子開啟/關閉機構開啟，接著 該載體3中之大氣係藉由—氮氣取代單元（未顯示）使用-氮 氣加以取代。然後，該門14與該蓋子扑係從該開口㈣ 回’並且該載體3巾之—晶圓讀裝載於該裝載區域Sb。 JP11-264267A中說明此一技術。 JP2004-6804A中說明一相關技術。 為=止粒子係從外部吸入該裝載區域Sb及該裝載區域讥 中虱氣密度的增加之目的，需要將該裝載區域讣之内部保 持於足夠尚於一大氣壓力之一壓力。然而，在該熱製程裝 置中，僅藉由具有一倒轉L形之一鎖定部分4〇的一固定機 構將該載體3固定於該運送台10上，該固定機構將該載體3 之底°卩部分鎖疋於该運送台10上。因而，如圖7(b)所 示§該分隔壁6之門14係開啟時（即，該載體3之蓋子3b 係開啟時），由於從該裝載區域Sb施加至該載體3之一壓 力"亥載體3之一上部部分朝向該載入區域sa傾斜而引起 以下缺點。即，該氮氣可從該裝載區域Sb向該載入區域以 122563.doc 200830456 茂漏而增加該裝載區域Sb中之一氧化密度。此外，可能需 要控制該裝載區域Sb中的麼力以防止該載體3之傾斜。此 外’ TAT係劣&。此外，該載體之蓋子儿的錯誤開啟與關 閉操作與該載體十晶圓的錯誤映射操作可能發生。 專利JP2004-6804A說明-技術，其用於在使該載體與該 分隔壁相接觸且-蓋子部件係開啟之後，當該載體中之大 氣係使用-情性氣體取代時，甚至在—惰性氣體之饋送速 率較高時仍穩定該載體之姿勢以便不破壞該分隔壁與該載 體之間的密封條件。即，JP20〇4_68〇4A說明在面對該載入 區域之一側上的分隔壁上置放一按壓部件，該按壓部件可 在該按壓部件站立之位置與該按壓部件平放之位置之間圍 繞一水平軸旋轉以按壓該載體之一上部表面。因而，在將 該載體放在該運送台上並與該分隔壁相接觸之後，該按壓 部件係旋轉以按壓該載體之上部表面。在此狀態下，該載 體之盍子部件係開啟，並且一惰性氣體係從一惰性氣體供 應管供應至該載體内。然而，此技術要求該運送台上的載 體之上有一足夠的空間用於安裝該按壓部件。當不確保此 安裝空間時，不可能採用此技術。 【發明内容】 已考慮上述情形而實施本發明。本發明之目的係提供一 製程裝置及一製程方法，其能夠藉由在一分隔壁之門係開 啟時從一載入區域之一側施加一壓力來防止一容器傾斜， 以便消除由遠容器之傾斜造成的各種缺點。 為實現上述目的，本發明之一製程裝置係包含以下元件 122563.doc -10- 200830456 t-製程裝置：一容器’其包含複數個待處理之物件，該 容器包括形成於其一前表面之一出口痒用於取出待處理: 物件與一蓋子用於密封該出口埠；一裝載區域，該容器係 ^載於其中；—運送區域，其大氣不同於該裝载區域^之 一大氣’·-分隔壁’其將該裝載區域與該運送區域彼此分 離並具有一開口； 一門，其用於開啟與關閉該分隔壁中之 開口’以及一台’其用於將該容器放置於該裝載區域中接 近該開口之一位置；其中在該容器之前表面之-側上的相 反側上提供待按壓之部分，且該分隔壁具有一按壓與固持 機構’其具有從一橫向登上該容器的待按壓之部分的—壓 輥以對著該分隔壁中之開口按壓該容器並將該容器緊密地 固持於適當位置。 在該製程裝置中，在將該容器放置於該台上之後，將該 容器與該開口相接觸。接著，開啟該門與該蓋子並將該容 益中待處理之物件從該裝載區域傳送至該運送區域。 在本心月之衣耘裝置中’較佳的係該按壓與固持機構包 —垂直i伸的轉軸’其係經由-托架可旋轉地支撐於 忒分隔壁上；一平坦彈簧部件，其係從該轉軸徑向延伸， 好坦彈簧部件於—遠端固持該_並向前按壓與推進該 症輥’以及一驅動部分，其用於旋轉該轉軸。 j本發明之製程裝置中’較佳的係將至少該對上部與下 ㈣輕透過該平坦彈簧部件來與該轉軸連接。 ^本發明之製程裝置中’較佳的係該運送區域中之一大 氣係—惰性氣體，且將該運送區域中之魔力設定為高於該 122563.doc 200830456 裝載區域中之壓力。 本發明之製程裝置進一步包含置放於該裝載區域之一側 上的分隔壁之-後表面上的—導引表面，該導引表面將定 位於一備用位置的按麗與固持機構之㈣導向該容 按壓之部分。 ' 本發明之製程裝置進一步包含從該轉軸沿該平扭彈箐部 件之一外部表面延伸之一限制部件，該限制部件在該壓輕 從-橫向登上該容器的待按屋之部分時從該外部表面之一 側支撐該平坦彈簧部件。 本發明之製程裝置進—步包含置放於該裝載區域之 =分隔壁之—後表面上的—㈣部件，該㈣部件在將 该谷器與該開口相接觸時密封該分隔壁與該容器之間的間From the point of view of ϋ, 'further preferred is the following procedure 1. When the door U is closed, the D haizi 3b is opened by a lid opening/closing mechanism, and then the atmosphere in the carrier 3 is nitrogen-cooled. Substitution units (not shown) were replaced with -nitrogen. Then, the door 14 and the cover are swept back from the opening (4) and the carrier 3 - wafer read is loaded on the loading area Sb. This technique is described in JP 11-264267A. A related art is described in JP2004-6804A. For the purpose of suppressing the increase in the density of helium in the loading zone Sb and the loading zone 外部 from the outside, it is necessary to maintain the inside of the loading zone 压力 at a pressure sufficient to be at one atmospheric pressure. However, in the thermal processing apparatus, the carrier 3 is fixed to the transport table 10 only by a fixing mechanism having an inverted L-shaped locking portion 4, which fixes the bottom of the carrier 3. Partially locked to the transport platform 10. Therefore, as shown in Fig. 7(b), when the door 14 of the partition wall 6 is opened (i.e., when the cover 3b of the carrier 3 is opened), due to the pressure applied from the loading area Sb to the carrier 3, " The upper portion of one of the sea carriers 3 is inclined toward the loading region sa to cause the following disadvantages. That is, the nitrogen gas may increase an oxidation density in the loading region Sb from the loading region Sb to the loading region by 122563.doc 200830456. In addition, it may be necessary to control the force in the loading area Sb to prevent the tilt of the carrier 3. In addition, 'TAT is bad & In addition, an erroneous opening and closing operation of the cover of the carrier and an erroneous mapping operation of the carrier ten wafer may occur. Patent JP2004-6804A describes a technique for contacting the carrier with the partition wall and after the lid member is opened, when the atmosphere in the carrier is replaced with an inert gas, even in the inert gas The posture of the carrier is stabilized even when the feed rate is high so as not to break the sealing condition between the partition wall and the carrier. That is, JP20〇4_68〇4A indicates that a pressing member is placed on the partition wall on the side facing one of the loading regions, and the pressing member can be positioned between the position where the pressing member stands and the position at which the pressing member is laid. Rotating about a horizontal axis to press an upper surface of the carrier. Thus, after the carrier is placed on the transport table and brought into contact with the partition wall, the pressing member is rotated to press the upper surface of the carrier. In this state, the tweezers of the carrier are opened, and an inert gas system is supplied from the inert gas supply pipe into the carrier. However, this technique requires a sufficient space above the carrier on the transport table for mounting the pressing member. This technique is not possible when this installation space is not secured. SUMMARY OF THE INVENTION The present invention has been made in consideration of the above circumstances. SUMMARY OF THE INVENTION It is an object of the present invention to provide a process apparatus and a process method for preventing a container from tilting by applying a pressure from one side of a loading area when a door of a partition wall is opened, thereby eliminating the need for a remote container. Various disadvantages caused by tilting. To achieve the above object, a process apparatus of the present invention comprises the following elements 122563.doc -10- 200830456 t-process apparatus: a container comprising a plurality of articles to be processed, the container comprising one of a front surface formed thereon The outlet itch is used for taking out the object to be treated: an object and a cover for sealing the outlet port; a loading area in which the container is carried; and a transporting area having an atmosphere different from the loading area ^. a partition wall that separates the loading area from the transport area and has an opening; a door for opening and closing the opening in the partition wall and a 'for placing the container in the loading area Adjacent to a position of the opening; wherein the portion to be pressed is provided on the opposite side on the side of the front surface of the container, and the partition wall has a pressing and holding mechanism 'which has a side to be pressed from a container to be pressed The portion of the pressure roller presses the container against the opening in the partition wall and holds the container in place tightly. In the process apparatus, after the container is placed on the stage, the container is brought into contact with the opening. Next, the door and the cover are opened and the item to be processed in the benefit is transferred from the loading area to the transport area. In the 耘 之 之 ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' ' Radially extending from the shaft, the spring member retains the _ at the distal end and presses and advances the sensation roller and a driving portion for rotating the shaft. Preferably, in the process apparatus of the present invention, at least the pair of upper and lower portions are lightly transmitted through the flat spring member to be coupled to the rotating shaft. In the process apparatus of the present invention, it is preferred that one of the transport regions is an inert gas, and the magic force in the transport region is set higher than the pressure in the load region of the 122563.doc 200830456. The process apparatus of the present invention further includes a guide surface disposed on a rear surface of the partition wall on one side of the loading area, the guide surface guiding the (4) of the retaining mechanism and the retaining mechanism positioned in a standby position The part that is pressed. The process apparatus of the present invention further includes a restricting member extending from the rotating shaft along an outer surface of one of the flat-twisted elastic members, the restricting member being from the portion of the container to be pressed from the lateral direction One of the outer surfaces side supports the flat spring member. The process apparatus of the present invention further comprises a (four) component disposed on the rear surface of the partition wall of the loading area, the (four) component sealing the partition wall and the container when the bar is in contact with the opening Between
隙。 J ，發明之製程裝置進—步包含置放於該分隔壁中之一产 性氣體引入通道，該惰性氣體引 月 ^ Ή八通道在该門係關閉同時Gap. J. The process unit of the invention comprises a production gas introduction channel disposed in the partition wall, wherein the inert gas is introduced into the channel while the door system is closed
Lj 開啟該容器之蓋子時將—惰性氣體引人該μ。 月之製程裝置中’較佳的係該等待按麼之部分由 :亥…一前表面在相反方向上突出的凸緣部分形成。 r 1乂仏的係該等待按壓之部分由 该谷器之前表面之一側上的相e加山如 刀田 惻上的相反側中提供的凹陷形成。 在本發明之製程裝置中’較佳的係該平坦彈簧部件由不 ’材料製成’且該壓輥由一氟碳樹脂製成。 2:::之一製程方法係使用一製程裝置之-製程方法， 0亥氣私裝置包含：一交哭 甘 、 σ /、匕έ複數個待處理之物件， 122563.do< -12 - 200830456 忒谷益包細彡成料—前表面之 之物件與-蓋子用於密封該“埠；一：：出待處理 係裝載於其中；一琿、关甘 凌载區域，該容器 之一大氣.、大氣不同於該裝載區域中 大札，-分隔壁，其將該裝載區域與該 分離並具有一開口；一 、&成彼此 之開口；以… F1 -用於開啟與關閉該分隔壁中 σ，其用於將該容器放置於 接近該開口之一位署.甘士七 置於及波載區域中 相反“ =容器之前表面之-側上的 奴仏存裕壓之部分，且該分隔壁具有— =機構’其具有從一橫向登上該容器的待按壓之部分的一 J輥以對著該分隔壁中之開σ㈣該容器 地固持於適當位置；該製程方法包含以下步驟··將= 放置於S亥台上；將放置於該台上 ° ^ m ^ x j令杰與違開口相接觸； 上置：：Γ隔壁上的按壓與固持機構之壓報從-橫向登 上置放於该容器之前表面之_側上的相反側上的待按屬之 部分，以對著該分隔壁中之開口按壓該容器 j 密地固持於適當位詈· LV β 4㈣ “位置，以及開啟該門與該蓋子並將該容器 中之-待處理之物件從該裝載區域傳送至該運送區域。 八tr月使得7以防止該容器之傾斜（其可藉由在開啟該 刀u之門時5亥運送區域之一麼力引起）使得可以消除由 該容器之傾斜造成的各種缺點。 【實施方式】 =下參考附圖詳細說明實施本發明之模式。圖1係顯示 將本發明應用於-垂直型熱製程裝置之一具體實施例的縱 向斷面圖。圖2係示意性顯示-主要部分之透視圖。圖3係 122563.doc •13- 200830456 不思性顯不該主要部分之側視圖。圖4係示意性顯示該主 要部分之平面圖。圖5係該主要部分之一放大圖。 在圖1中，參考數字1描述位於一無塵室中之一垂直型熱 製程裝置（製程裝置）。該熱製程裝置丨具有定義其一輪廓之 外罩2。该外罩2之内部藉由一分隔壁ό分成載入一載體3 的載入區域Sa與作為一運送區域之一裝載區域sb,其中When Lj opens the lid of the container, the inert gas is introduced into the μ. In the process device of the month, the portion of the waiting portion is preferably formed by a flange portion in which the front surface protrudes in the opposite direction. The portion of the r 1 等待 which is to be pressed is formed by the depression provided in the opposite side of the phase on the side of the front surface of the granulator, such as the turf. In the process apparatus of the present invention, it is preferable that the flat spring member is made of a material and the press roller is made of a fluorocarbon resin. 2::: One of the process methods uses a process-process method, and the 0-Hai private device contains: a crying, σ /, 匕έ a plurality of objects to be processed, 122563.do< -12 - 200830456忒谷益包细彡料—The object on the front surface and the lid are used to seal the “埠; one: the system to be treated is loaded in it; one 珲, Guan Ganling area, one of the containers of the atmosphere. Different from the large area in the loading area, the dividing wall, which separates the loading area from the opening and has an opening; a & opening to each other; F1 - for opening and closing the σ in the dividing wall, It is used to place the container in a position close to one of the openings. The Ganss 7 is placed in the wave-loading area and the opposite is "the portion of the surface of the front surface of the container that is overburdened, and the partition has - = mechanism 'having a J roller that is mounted from the side of the container to be pressed laterally to hold the container in place against the opening σ (4) in the partition wall; the process method comprises the following steps: Placed on the S table; will be placed on the table ° ^ m ^ xj Lingjie is in contact with the opening; upper:: the pressing on the partition wall and the pressure of the holding mechanism from the laterally mounted portion on the opposite side of the surface on the front side of the container, Pressing the container j against the opening in the partition wall to securely hold the position in the appropriate position LV θ 4 (4), and opening the door and the cover and transferring the object to be processed in the container from the loading area Up to the transport area. The eight tr month makes 7 to prevent the tilt of the container (which can be caused by one of the 5 ha transport areas when the door of the knife is opened) so that various kinds of tilt caused by the tilt of the container can be eliminated. [Embodiment] The mode for carrying out the invention will be described in detail below with reference to the accompanying drawings. Fig. 1 is a longitudinal sectional view showing a specific embodiment of the present invention applied to a vertical type thermal processing apparatus. Fig. 2 is a schematic view. A perspective view of the main part of the display. Fig. 3 is a view of the main part of the main part. Fig. 4 is a plan view schematically showing the main part. Fig. 5 is one of the main parts. Enlarged view. In Figure 1 Reference numeral 1 describes a vertical type thermal process device (process device) located in a clean room. The heat process device has a profile outer cover 2 defined. The inside of the cover 2 is divided by a partition wall. Loading into a loading area Sa of the carrier 3 and loading the area sb as one of the transport areas, wherein
一晶圓w係從該載體3取出並運送至一晶舟4，而該晶舟4係 裝載於一熱爐5與從其卸载。 口亥載體3係一所謂的可關閉載體（亦稱為ρ〇υρ)(例如具有 蓋子之塑膠谷裔），其能夠包含複數個（例如大約25個） 待處理之物件（例如—預定直徑（例如300 mm直徑）之晶圓 w)使得該等晶圓w係水平配置並於其間具有—預定垂直間 隙。該載體3具有-可分開蓋子％，丨用於密封形成於該 載體3之一前表面中的一出口埠3&。該蓋子扑具有一閃鎖 機構(未顯示)，其用於將該蓋子扑固持於該載體3之出口埠 h上。藉由釋放該閃鎖機構，該蓋子扑係從該載體3之出 口埠3a分開。 在該外罩2之一後表面中 形成 〜 在戟/卸載埠7，該載 體3係透過其裝載與卸载。 …少一…㈣纟裝載/卸载操作期間放置該 载 ° 8係置放於該裝载/卸载蟑7外部的外罩 表面之—側上。在該載人區扣之— 卜罩2之後 分與-後部分上，相對地置放儲存加9:"刀中的-前部 且從碎孖架9用於暫眭 數個載體3。在該載入區域Sa之一 夺儲存该複 -側上’置放-運送台丨。作為放置該二的分隔壁6之 3用於運送晶圓 122563.doc 200830456 之一台。 该載入區域Sa包括：-移動機構^，其係置放於該台8 上用於透過該裝載/卸載埠7送進與取出該載體3 ;以及— 傳送機構（載體傳送機構）12,其用於在該儲存架9與該運送 台1〇之間傳送該載體3。該傳送機構12主要包含：一升降 機構12a ’其係置放於該载入區域仏之一側上；一升降臂 12b，其係藉由該升降機構12a而垂直移動；以及一傳送臂 12c，其係置放於該升降臂12b上用於支撐該載體3之—底 部部分或一頂部部分以水平傳送該載體3。 該載入區域Sa透過該裝載/卸載埠7與該無塵室連通。該 載入區域Sa中之大氣係空氣，其壓力與大氣壓力相同。為 抑制或防止該晶圓w之一表面上的一天然氧化膜之形成， 在操作該熱製程裝置1時該裝載區域Sb之内部係一惰性氣 體大氣。例如，將一 N2(氮氣）氣體用作一惰性氣體。然 而’可使用除該A氣體以外的氣體（例如Ar氣體、He氣體 等）作為一惰性氣體。該裝載區域Sb係氣密式密封，且該 惰性氣體之壓力係保持於足夠高於大氣壓力之一預定壓 力。例如，該預定壓力之值係大氣壓力加上1〇至1〇〇〇 pa。 該熱製程裝置1包括一壓力控制機構，其用於將該裝載區 域Sb中的惰性氣體之壓力保持於一預定值。根據現有裝置 之一模型，壓力值係控制以在大氣壓力加上1〇 Pa與大氣 壓力加上1000 Pa之間的範圍内加以調整。在熱之影塑 下，存在壓力暫時超過1000 Pa之可能性。在壓力值偏離 可控制範圍之此狀態下，該裝載區域在一全開狀態下係抽 122563.doc -15- 200830456 工。將一空氣；^ >糸器置放於該裝載區域s b中以便充分地保 持該裝載區域Sb之内部比該無塵室之内部清潔。 該分隔壁6具有能夠係開啟與關閉之一開口丨3與一門 14。當將放置於該運送台1〇上之載體3從該載入區域“之 侧與該開口 13相接觸時，該開口丨3使該載體3之内部與該 裝載區域Sb之内部連通。該門14從該裝載區域讥之側關閉 該開口 13。該開口 13之孔與該載體3之出口埠“之孔實質 上相同’從而可將晶圓w透過該開口 13取出與送入該載體 3 〇 該門14具有：一未顯示的附著/分開機構，其用於附著 (關閉）與分開（開啟）該載體3之蓋子3b ;以及一未顯示的門 開啟/關閉機構，其用於從該裝載區域讥之側開啟與關閉 該門14。藉由該門開啟/關閉機構將該門14與該蓋子孙開 啟至該裝載區域Sb之側。接著，向上或向下移動（縮回）該 門14與該蓋子3b以便不干擾要運送之晶圓w。在該運送台 10下面，置放一凹口對準器15用於對準形成於該等晶圓w 之各晶圓之圓周部分中的凹口（切除部分）以對準一晶體方 向0 將能夠藉由一升降機構（未顯示）垂直移動之一蓋子部件 16置放於該裝載區域Sb之—上後部分。藉由垂直㈣該蓋 ^部件16(其上放置由（例如）石英製成之—晶舟4作為一托 架用於固持若干（例如大約⑽個）半導體晶圓使得該等晶圓 係以一層狀方式配置且其間具有一預定的垂直間隙），將 該晶舟4载入該熱爐5或從其卸载，並且開啟或關閉一喉部 122563.doc •16- 200830456 5a。將能夠水平移動以開啟與關閉該喉部化之一擋門η置 放於凜候。卩5 a附近。當該蓋子部件丨6係開啟且該熱處理的 晶舟4係卸載時該擋門17遮蔽該喉部5a。 Γ 一運送機構18係置放於該裝載區域Sb中，用於在該運送 台10上之载體3與該晶舟4之間運送晶圓w。明確地說，該 運达機構18在該運送台10上之載體3與該凹口對準器15之 ]/凹口對準器15與該晶舟4之間及該熱處理的晶舟4與 、C 口 1 0上之空載體3之間運送晶圓w。該運送機構1 8包 括·一基底台18a，#可垂直移動並可水平旋II ;以及-又18b，其具有複數個（例如五個）薄板狀 豆 台心之一縱向方向（徑向方向）上移動。例如 可獨立移動單一叉與四個複數叉。可垂直改變該複數 又之間的間距，續輩_ 7在 里 4早又係配置於一中間高度位置作為一 準則。 儘管該運送台1G可以係經組態用以僅在其上放置該載體 4運运台10可以係經組態如下。即，如圖3所示，例 如，该運送台10由固定於該分隔壁6上之一框與一座 10c形成’該座係透過—線性導執⑽置放在該框…之上 Γ更垂直於該分隔壁6之—方向上的—小範圍内滑 複數個(例如三個)定位接針19係突出地置放於該座w 二:Γ等定位接針19與形成於該載體3之底部部分中 1槿Γ)接合以便定位該載體3。該框10a具有：-固 =構其:用於將該載體3固定於該座1〇e上;以及一移動 於與5亥座1〇C—起從一遠端位置（其中該載體3 122563.doc •17- 200830456 遠離該分隔壁6)移動至—接觸位置（其中該載體3之前表面 與忒7刀隔壁6接觸）’反之亦然（解說省略）。 待按塵之部分20係置放於該載體3之前表面的相反側 ^。在圖2所示之一範例中，在該載體3之前相反側上形成 ‘ ㈣突出的凸緣部分3C，而該等凸緣部分3c之後表面提供 • ' 2 [之邛刀2〇。在圖4與5所不之—範例中，在該載體3 =前相反側中形成凹陷21以形成凸緣部分&，而該等凸緣 冑分&之後表面提供待按壓之部分20。該分隔壁6係配備 -按壓與固持機構23,其具有一壓輥22從橫向登上待按壓 之部分20並對著該開口 13(即，該分隔壁6之開口 13之一周 邊部分）按壓該載體3以便將該載體3緊密地固持於適當位 置5亥對按壓與固持機構23係配置於對應該運送台〗〇上之 载體3之相反侧的位置。 忒按壓與固持機構23包括··一垂直轉軸25，其係經由一 托架24可旋轉地支撐於該分隔壁6上；一平坦彈簧部件 1, 26，其係從該轉軸25徑向延伸以向前按壓與推進該壓輥 22，其係固持於該平坦彈簧部件％之一遠端上，·以及一氣 缸27，其用作一驅動部分用於旋轉該轉軸25。該平坦彈簧 部件26較佳的係由（例如）不鏽材料製成，而該壓輥22較佳 的係由（例如）一氟碳樹脂製成。如圖2與3所示，該托架24 由下列組成：一垂直伸長的附著板24b，其係藉由一螺絲 2乜固定於該分隔壁6上；以及該對上部與下部支撐臂 2釺，其係置放於該附著板2仆上。垂直橋接該等上部與下 W支撐件24c的轉軸25係藉由軸承24d支撐以可圍繞其一旋 122563.doc 18 200830456 轉軸旋轉。 該氣缸27之一端係耦合至置放於該轉軸乃之—下部端上 的一槓桿28,而該氣缸27之另一端係耦合至該運送台⑺之 框l〇a之側。當藉由該氣缸27拉動該槓桿28時，該^軸乃 係逆時針旋轉以透過該平坦彈簧部件26滚動該壓輥U，使 侍忒壓輥22從接近該分隔壁6之一備用位置〗移向該載體3 的待按壓之部分20並騎上該待按壓之部分2〇。另一方面， 當藉由該氣缸27推動該槓桿28時，該轉軸乃係順時針旋轉 以透過該平坦彈簧部件26滾動該壓輥22，使得該壓輥U從 該载體3的待按壓之部分2〇返回接近該&隔壁6之備用位置 至少該對上部與下部壓輥22分別透過該等平坦彈簧部件 26與該轉轴25連接。㈣平㈣簧部件％與該等壓二叫系 以右左方向對稱配置，因而該載體3之凸緣部分&係藉由 總共四個平坦彈簧部件26之彈簧力（推進力）來對著該分隔 〇 壁6受到按Μ。當該裝載區域外中之壓力係咖pa時，因 為一II·2 kgf(109.8N)之壓力係施加至該載體3，故每—平 坦彈簧部件26必須施加一 2·8 kgf(27 4 N)之推力（按壓幻。 因而，使用具有此一推力的平坦彈簧部件26。 為該平坦彈簧部件26可施加此按壓力，將該平坦彈者 件26事先對著該彈箐力f曲至該備用位。因為該等 :旦彈簧部件26與該等壓輥22在右左方向上對稱，故更_ 說明右邊的部件。如圖5所示，該平坦彈簧部件^之― (近端）係藉由-螺絲29固定於該轉軸25之—側表面上， 122563.doc -19- 200830456 5亥平坦彈黃部件26之另一端（遠端或自由端）係向前延伸。 將該壓輥22經由一軸承部件3〇置放於該平坦彈簧部件％之 遠端上使得該壓親22可圍繞—垂直軸旋轉。在此情況下， 因為該轉軸25係配置於-向右位置上以便不干擾該載體 3 ’故該平坦彈簧部件26之遠端側係向前延伸以向左傾斜 地弓曲’而違壓輥22騎上待按麼之部分2〇並從該 橫向側按壓該部分。A wafer w is taken out from the carrier 3 and transported to a wafer boat 4, and the wafer boat 4 is loaded and unloaded from a furnace 5. The mouth carrier 3 is a so-called closable carrier (also known as ρ〇υρ) (for example, a plastic grain with a lid) capable of containing a plurality (for example, about 25) of items to be processed (for example, a predetermined diameter ( For example, a 300 mm diameter wafer w) is such that the wafers w are horizontally arranged with a predetermined vertical gap therebetween. The carrier 3 has a separable cover % for sealing an outlet port 3& formed in a front surface of one of the carriers 3. The cover has a flash lock mechanism (not shown) for holding the cover to the outlet 埠 h of the carrier 3. By releasing the flash lock mechanism, the cover is detached from the outlet port 3a of the carrier 3. In the rear surface of one of the outer covers 2, a 〜/unloading raft 7 is formed, through which the carrier 3 is loaded and unloaded. ... less one... (4) Place the load during the loading/unloading operation. The system is placed on the side of the outer surface of the outer surface of the loading/unloading cassette 7. In the manned area, after the cover 2 and the rear part, the storage plus 9:" front portion of the knife is placed and used to temporarily hold the plurality of carriers 3 from the crushing truss 9. One of the loading areas Sa is stored on the complex side. As the partition wall 6 for placing the two, 3 is used to transport one of the wafers 122563.doc 200830456. The loading area Sa includes: a moving mechanism ^ which is placed on the table 8 for feeding in and taking out the carrier 3 through the loading/unloading cassette 7; and a transport mechanism (carrier transport mechanism) 12 It is used to transport the carrier 3 between the storage rack 9 and the transport table 1A. The transport mechanism 12 mainly includes: a lifting mechanism 12a' is placed on one side of the loading area ;; a lifting arm 12b is vertically moved by the lifting mechanism 12a; and a transfer arm 12c, It is placed on the lifting arm 12b for supporting the bottom portion or a top portion of the carrier 3 to convey the carrier 3 horizontally. The loading area Sa is in communication with the clean room through the loading/unloading cassette 7. The atmospheric air in the loading area Sa has the same pressure as the atmospheric pressure. In order to suppress or prevent the formation of a natural oxide film on the surface of one of the wafers w, the inside of the loading region Sb is an inert gas atmosphere when the thermal processing apparatus 1 is operated. For example, an N2 (nitrogen) gas is used as an inert gas. However, a gas other than the A gas (e.g., Ar gas, He gas, etc.) can be used as an inert gas. The loading zone Sb is hermetically sealed and the pressure of the inert gas is maintained at a predetermined pressure sufficiently above one of atmospheric pressure. For example, the value of the predetermined pressure is atmospheric pressure plus 1 〇 to 1 〇〇〇 pa. The thermal processing apparatus 1 includes a pressure control mechanism for maintaining the pressure of the inert gas in the loading area Sb at a predetermined value. According to one of the existing devices, the pressure value is controlled to be adjusted within a range between atmospheric pressure plus 1 〇 Pa and atmospheric pressure plus 1000 Pa. Under the influence of heat, there is a possibility that the pressure temporarily exceeds 1000 Pa. In the state where the pressure value deviates from the controllable range, the loading area is pumped in a fully open state by 122563.doc -15-200830456. An air; ^ > damper is placed in the loading area s b to sufficiently maintain the interior of the loading area Sb cleaner than the interior of the clean room. The partition wall 6 has an opening 丨3 and a door 14 that can open and close. When the carrier 3 placed on the transport table 1 is brought into contact with the opening 13 from the side of the loading area, the opening 3 causes the inside of the carrier 3 to communicate with the inside of the loading area Sb. 14 is closed from the side of the loading area 讥. The opening 13 has a hole which is substantially the same as the opening of the carrier 3 so that the wafer w can be taken out through the opening 13 and fed into the carrier 3 〇 The door 14 has an unattached attachment/separation mechanism for attaching (closing) and separating (opening) the cover 3b of the carrier 3; and an unillustrated door opening/closing mechanism for loading from the door The side of the area 开启 opens and closes the door 14. The door 14 and the cover are opened to the side of the loading area Sb by the door opening/closing mechanism. Next, the door 14 and the cover 3b are moved up or down (retracted) so as not to interfere with the wafer w to be transported. Under the transport table 10, a notch aligner 15 is disposed for aligning the notches (cutting portions) formed in the circumferential portions of the wafers of the wafers w to align a crystal direction 0. A cover member 16 can be placed in the upper rear portion of the loading area Sb by a vertical movement of a lifting mechanism (not shown). By vertically (four) the cover member 16 (on which is placed, for example, of quartz - the boat 4 is used as a bracket for holding a plurality of (for example, about (10)) semiconductor wafers so that the wafers are The layered manner is configured with a predetermined vertical gap therebetween, the wafer boat 4 is loaded into or unloaded from the furnace 5, and a throat 122563.doc • 16-200830456 5a is opened or closed. A door η that will be able to move horizontally to open and close the throat is placed at the waiting time.卩 5 a nearby. The shutter 17 shields the throat portion 5a when the cover member 6 is opened and the heat-treated boat 4 is unloaded. A transport mechanism 18 is placed in the loading area Sb for transporting the wafer w between the carrier 3 on the transport platform 10 and the wafer boat 4. Specifically, the delivery mechanism 18 is between the carrier 3 on the transport table 10 and the recess aligner 15/the recess aligner 15 and the wafer boat 4 and the heat treated boat 4 The wafer w is transported between the empty carriers 3 on the C port 10. The transport mechanism 18 includes a base table 18a, # vertically movable and horizontally twistable II; and - 18b having a longitudinal direction (radial direction) of a plurality of (for example, five) thin plate-like bean cores Move on. For example, a single fork and four complex forks can be moved independently. The spacing between the complex numbers can be changed vertically, and the continuation _ 7 is set in a middle height position as a criterion. Although the transport station 1G can be configured to place the carrier only thereon, the transport platform 10 can be configured as follows. That is, as shown in FIG. 3, for example, the transport table 10 is formed by a frame fixed to the partition wall 6 and the base 10c forming a 'transmission-linear guide (10) placed on the frame. A plurality of (for example, three) positioning pins 19 are protruded in the small area of the partition wall 6 in a small range, and are placed on the seat w 2: a positioning pin 19 such as a crucible and the carrier 3 The bottom portion is joined to position the carrier 3. The frame 10a has: - solid = configured to: fix the carrier 3 to the seat 1 〇 e; and a movement from the 5 座 seat to a remote position (where the carrier 3 122563 .doc • 17- 200830456 Move away from the partition wall 6) to the contact position (where the front surface of the carrier 3 is in contact with the 忒7 knife partition 6) and vice versa (illustration omitted). The portion 20 to be dusted is placed on the opposite side of the front surface of the carrier 3. In an example shown in Fig. 2, a '(four) protruding flange portion 3C is formed on the opposite side of the carrier 3, and the rear surface of the flange portion 3c is provided with a ''2' knives 2'. In the examples of Figs. 4 and 5, the recesses 21 are formed in the front side of the carrier 3 = to form the flange portions & and the flanges are disposed & the surface afterwards provides the portion 20 to be pressed. The partition wall 6 is provided with a pressing and holding mechanism 23 having a pressing roller 22 that presses the portion 20 to be pressed from the lateral direction and presses against the opening 13 (i.e., a peripheral portion of the opening 13 of the partition wall 6). The carrier 3 is configured such that the carrier 3 is closely held at an appropriate position and is placed at a position opposite to the carrier 3 on which the pressing and holding mechanism 23 is disposed on the corresponding transport table. The 忒 pressing and holding mechanism 23 includes a vertical rotating shaft 25 rotatably supported on the partition wall 6 via a bracket 24; a flat spring member 1, 26 extending radially from the rotating shaft 25 The pressure roller 22 is pressed forward and advanced, which is held on one of the distal ends of the flat spring member %, and a cylinder 27 serving as a driving portion for rotating the rotary shaft 25. The flat spring member 26 is preferably made of, for example, a stainless material, and the press roller 22 is preferably made of, for example, a fluorocarbon resin. As shown in Figures 2 and 3, the bracket 24 is composed of a vertically elongated attachment plate 24b which is fixed to the partition wall 6 by a screw 2; and the pair of upper and lower support arms 2 It is placed on the attachment plate 2 servant. The shaft 25 that vertically bridges the upper and lower W supports 24c is supported by a bearing 24d for rotation about its axis of rotation 122563.doc 18 200830456. One end of the cylinder 27 is coupled to a lever 28 placed on the lower end of the shaft, and the other end of the cylinder 27 is coupled to the side of the frame l〇a of the transport table (7). When the lever 28 is pulled by the cylinder 27, the shaft rotates counterclockwise to roll the pressure roller U through the flat spring member 26, so that the service roller 22 is in a standby position close to the partition wall 6. Move to the portion 20 of the carrier 3 to be pressed and ride the portion 2 to be pressed. On the other hand, when the lever 28 is pushed by the cylinder 27, the shaft is rotated clockwise to roll the pressure roller 22 through the flat spring member 26, so that the pressure roller U is pressed from the carrier 3. The portion 2〇 returns to a standby position adjacent to the & partition 6 at least the pair of upper and lower pressure rollers 22 are coupled to the shaft 25 via the flat spring members 26, respectively. (4) The flat (four) spring member % and the equal pressure two are symmetrically arranged in the right-left direction, and thus the flange portion & of the carrier 3 is opposed to by the spring force (propulsion force) of a total of four flat spring members 26 The partition wall 6 is pressed by the button. When the pressure in the outside of the loading area is Pa, since a pressure of II·2 kgf (109.8 N) is applied to the carrier 3, each flat spring member 26 must be applied with a 2·8 kgf (27 4 N). Thrust (pressing illusion. Thus, a flat spring member 26 having such a thrust is used. This pressing force can be applied to the flat spring member 26, and the flat member 26 is biased against the spring force to the Since the spring member 26 and the equal pressure roller 22 are symmetrical in the right-left direction, the component on the right side is further explained. As shown in Fig. 5, the (close-end) of the flat spring member is borrowed. The other end (distal end or free end) of the flat elastic yellow member 26 is extended forward by the - screw 29 on the side surface of the rotating shaft 25. The pressure roller 22 is passed forward. A bearing member 3 is placed on the distal end of the flat spring member % such that the pressing member 22 is rotatable about the vertical axis. In this case, since the rotating shaft 25 is disposed in the rightward position so as not to interfere with the Carrier 3' such that the distal side of the flat spring member 26 extends forward to tilt to the left The bower's the counter-pressure roller 22 rides on the portion 2 to be pressed and presses the portion from the lateral side.
一階’故較佳的係提供—斜㈣表面31以使該備用位置【 與該载體3的待㈣之部分2〇彼此連接，從而在盆間平滑 =㈣_22。在該分隔壁6或該附著板鳩上提供該導 二：面3卜為在其在該導引表面31上之—攸升移動期間， I坦弹貫部件26之一彎曲部分2心不藉由對該堡輕以 阻力而相反地·零曲，輕往的备 Αβ八％ _ ^的係轉軸25可藉由沿該彎曲 圖二I:外部表面延伸的一限制部件32加以支撐。在 圖中，參考數字33係一密封部件，其用於 壁6按壓該載體3之前表 D刀隔 — 于*封8亥分隔壁6與該载體3之 口通道34二用Γ間隙。該分隔壁6包括一惰性氣體人 時，將一产性在接門14係關閉同時該蓋子外係開啟 、月，軋體（例如乂氣體）引入該载體3以使 體取代其中的大氣。 ㈣3以使用该乳 :下成明藉由如上構造的垂直型熱 產生的效果及其一製程方法。 ^置（W裝置） 送機器人將該載體3放置於該台8上。者或一傳 得者’猎由該移動機 122563.doc -20· 200830456 構1⑽'亥载體3移過該裝载/卸載埠7以達到該载入區域Sa ▲中之傳遞位置^。隨後，藉由該傳送機構⑵字該載體3從 該傳遞位置II值译$ # 、 、 1傳达至该運迗台10或該儲存架9(參見圖1)。 以此方式，按順序將複數個要熱處理之載體3帶入該載入 • 區域以並將其儲存於該儲存架9中。 • 纟將该載體3傳送至該運送台1〇並放置於其上之後，例 如，置放於該運送台10上之一未顯示感測器㈣到該載體 3已放置於該運送台10上。然後，該按壓與固持機構_ 始其操作。當提供上述固定機構與移動機構時，事先將該 載體3固定於該座10c上並相對於該分隔壁“與該座1〇二 起移動。 接下來，說明該按壓與固持機構23之操作。藉由該氣缸 27透過以一預定角度旋轉該槓桿28來驅動該轉軸乃（逆時 針旋轉右轉軸而順時針旋轉左轉軸），使得該壓輥22透過 該平坦彈簧部件26從該橫向側上之備用位置Σ滾向作為該 I 载體3之凸緣部分3c之後表面的待按壓之部分2〇。接著， 该壓輥22從其橫向登上該載體3的待按壓之部分2〇，使得 該載體3係對著該開口 13受到按壓（即，對著該分隔壁6 = •的開口 13之周邊部分按壓該載體3之前周邊部分）並藉由各 自按壓該壓輥22的總共四個平坦彈簧部件％之彈簧力而緊 密地固持於適當位置。因而，當開啟該分隔壁6之門使得 該裝載區域中的惰性氣體之壓力係施加至該載體3時，2 於該壓力所致而防止該載體3係傾斜，其消除由該載體3之 傾斜造成的各種缺點。即，該惰性氣體不可能可從該裝載 122563.doc -21 - 200830456 區域Sb向该載入區域以洩漏以增加該裝載區域％中之一氧 化山度此外，不必控制該裝載區域Sb中的壓力來防止該 載體3之傾斜。此外，可防止TAT之劣化。此外，可防止該 載體之蓋子3b的錯誤開啟與關閉操作與該載體中晶圓的錯 • 誤映射操作。為釋放該按壓與固持力，藉由該氣缸27來驅 • 動忒轉軸25來在相反方向上旋轉。接著，將該壓輥22從待 知:壓之部分20脫離並返回該備用位置I。 (% 將"亥傾斜^引表面3 1放置於該備用位置I與待按壓之部 刀〇之間因而，即使當該備用位置I與該待按壓之部分 20之間存在（I皆時’仍可平滑且容易地移動該壓輥22。此 外，因為可藉由該限制部件32來支撐該轉軸25，故可防止 該平坦彈簧部件26之彎曲部分26c係相對地彎曲。 在開啟該載體3之蓋子3b與該門14之後，開始該等晶圓w 之一運送操作。藉由該運送機構18來執行此運送操作，其 將該等晶圓w從該載體3取出並將該等晶圓w經由該凹口對 〇 ’1115來按順序帶人該晶舟4。在該運賴作完成之後， ，即將該晶舟4裝載於該熱爐5，其中該等晶圓讀受一預 定熱程序。然後，將該晶舟4卸載至該裝載區域％上，並 猎由該運送機構18將該等處理的晶圓讀該晶舟4返回至該 運送台上的空載體3。然後，經由傳送機構㈣移動機 構11來將該載體3卸載至該台8上。 如上所述，依據本製程裝置與製程方法，該等按昼與固 持機構23之壓輕22從其橫向登上該載體3之前表面之相反 側上提供的待按壓之部分2〇，使得該載體3係對著該開口 122563.doc -22- 200830456 1 3按壓並緊密地 6之門時，可！適當位置。㈣，當開啟該分隔壁 精由邊袁载區域Sb中之壓力防止 斜。因此，可喵叭+ 々止这戴體3係傾 外，可箱^ 該載體3之傾斜造成的各種缺點。此 σ、相載體3 t的惰性氣體取代特性之改良。The first order 'bend is preferably provided by the oblique (four) surface 31 such that the alternate position [with the portion 2 of the carrier 3 to be (4)" is connected to each other to smooth between the basins = (four) _22. Providing the guide 2 on the partition wall 6 or the attachment plate: the surface 3 is in the movement of the guide surface 31. During the soaring movement, the curved portion 2 of the I-tank member 26 is not borrowed. By the fact that the fort is lightly resisted and oppositely zero-curved, the lightly-driven Α8 8% of the fulcrum shaft 25 can be supported by a restricting member 32 extending along the curved surface I: outer surface. In the figure, reference numeral 33 is a sealing member for the wall D before the wall 6 presses the carrier 3, and the gap between the partition wall 6 and the port 34 of the carrier 3 is used for the gap. When the partition wall 6 includes an inert gas, the product is closed at the door 14 while the cover is opened, and a rolling body (e.g., helium gas) is introduced into the carrier 3 to replace the atmosphere therein. (4) 3 to use the milk: The effect produced by the vertical heat generated by the above-mentioned lacquer and its process method. ^Set (W device) The sending robot places the carrier 3 on the table 8. Or the passer's hunted by the mobile machine 122563.doc -20· 200830456 1 (10) 'Hai carrier 3 moved over the loading/unloading 埠 7 to reach the transfer position ^ in the loading area Sa ▲. Subsequently, the carrier 3 is conveyed from the transfer position II by the transfer mechanism (2) to the transfer table 10 or the storage rack 9 (see Fig. 1). In this way, a plurality of carriers 3 to be heat-treated are brought into the loading area in order and stored in the storage rack 9. • After the carrier 3 is transported to the transport table 1 and placed thereon, for example, one of the sensors placed on the transport table 10 does not display the sensor (4) until the carrier 3 has been placed on the transport table 10 . Then, the pressing and holding mechanism _ starts its operation. When the above-described fixing mechanism and moving mechanism are provided, the carrier 3 is fixed to the seat 10c in advance and moved with respect to the partition wall. Next, the operation of the pressing and holding mechanism 23 will be described. The rotation of the shaft is performed by rotating the lever 28 at a predetermined angle by the cylinder 27 (rotating the right shaft counterclockwise and rotating the left shaft clockwise) such that the pressure roller 22 passes through the flat spring member 26 from the lateral side. The upper standby position is rolled toward the portion to be pressed 2 which is the surface of the rear surface of the flange portion 3c of the I carrier 3. Then, the pressure roller 22 is laterally mounted from the side thereof to the portion to be pressed 2 of the carrier 3, The carrier 3 is caused to be pressed against the opening 13 (i.e., the peripheral portion of the opening 13 opposite the opening 13 of the partition wall 6 is pressed) and by pressing a total of four of the pressure rollers 22, respectively. The spring force of the flat spring member is tightly held in place. Thus, when the door of the partition wall 6 is opened such that the pressure of the inert gas in the loading region is applied to the carrier 3, 2 is caused by the pressure Prevent the load The 3 series is inclined, which eliminates various disadvantages caused by the inclination of the carrier 3. That is, it is impossible for the inert gas to leak from the load 122563.doc -21 - 200830456 region Sb to the loading region to increase the loading region % In addition, it is not necessary to control the pressure in the loading region Sb to prevent the inclination of the carrier 3. Further, deterioration of the TAT can be prevented. Further, the erroneous opening and closing operation of the cover 3b of the carrier can be prevented and The mis-mapping operation of the wafer in the carrier. To release the pressing and holding force, the cylinder 27 is used to drive the rotating shaft 25 to rotate in the opposite direction. Then, the pressing roller 22 is known from the pressure: The portion 20 is detached and returned to the standby position I. (% will be placed between the alternate position I and the portion to be pressed, thus even when the standby position I and the to-be-pressed There is a portion (between I and I) that the pressure roller 22 can be moved smoothly and easily. Further, since the rotation shaft 25 can be supported by the restriction member 32, the curved portion of the flat spring member 26 can be prevented. 26c relative After the cover 3b of the carrier 3 and the door 14 are opened, a transport operation of the wafers w is started. The transport operation is performed by the transport mechanism 18, and the wafers w are from the carrier 3. Taking out and bringing the wafers w to the wafer boat 4 in sequence via the notch '1115. After the operation is completed, the wafer boat 4 is loaded into the furnace 5, wherein The wafer is subjected to a predetermined thermal program. Then, the wafer boat 4 is unloaded onto the loading area %, and the processed wafers are read by the transport mechanism 18 to return the wafer boat 4 to the transport platform. The empty carrier 3. Then, the carrier 3 is unloaded onto the table 8 via a transport mechanism (4) moving mechanism 11. As described above, according to the process apparatus and the manufacturing method, the pressing light 22 of the pressing and holding mechanism 23 is mounted from the side thereof to the opposite side of the front surface of the carrier 3 to be pressed, so that the carrier 3 series is pressed against the opening 122563.doc -22- 200830456 1 3 and close to the door of 6! The right place. (4) When the partition wall is opened, the pressure in the side load region Sb is prevented from being inclined. Therefore, it is possible to prevent the wearer 3 from tilting out, and to prevent the various disadvantages caused by the tilt of the carrier 3. This σ, the phase carrier 3 t has an improvement in the inert gas substitution characteristics.
該按壓與固持嬙、M 托加24^ 構3包括··該垂直轉軸25，其係經由該 木」轉地支撐於該分隔壁6上；該平坦彈簧部件 ，、係攸忒轉軸25徑向延伸以向前按壓與推進該壓 …其係固持於該平坦彈菁部㈣之一遠端上；以及該氣 缸27，其用作一驅動部分用於旋轉該轉軸25。因而，此一 簡單機構之按壓與固持機構23可施加一充分的㈣與固持 力，以及可實現尺寸與成本的減低。 至少該對上部與下部壓輥22分別透過該等平坦彈簧部件 26與該轉轴25連接。因而，可藉由至少總共四個平坦彈菁 部件26來提供能夠充分耐受該裝載區域外中的惰性氣體之 壓力的彈黃力。該裝載區域Sb^大氣係惰性氣體，且該裝 載區域sb之壓力係設定為高於該載入區域Sa之壓力。因 而，該裝載區域Sb具有極佳的氣密性，其防止來自外部的 粒子侵入並允許使用一惰性氣體取代大氣空氣所要求之一 時間週期受到減低。因此，可限制氧化密度之增加，從而 可防止一晶圓之一表面上的天然氧化物膜之形成。該等按 壓與固持機構23係配置於該分隔壁6上對應於該載體3之相 反側的位置。因而，不同於JP2004-6804A中揭示的按壓部 件，可容易地確保該等按壓與固持機構23之一安裝空間。 圖6係示意性地顯示本發明之另一具體實施例之一主要 122563.doc •23- 200830456The pressing and holding 嫱, M 托 24 3 3 includes the vertical rotating shaft 25, which is rotatably supported on the partition wall 6 via the wood; the flat spring member, the yoke shaft 25 radial Extending to press forward and advance the pressure... it is held on the distal end of one of the flat elastic portions (4); and the cylinder 27 serves as a driving portion for rotating the rotating shaft 25. Thus, the pressing and holding mechanism 23 of this simple mechanism can apply a sufficient (four) and holding force, and can achieve a reduction in size and cost. At least the pair of upper and lower pressure rollers 22 are coupled to the rotating shaft 25 via the flat spring members 26, respectively. Thus, the yellowing force capable of sufficiently withstanding the pressure of the inert gas in the outside of the loading region can be provided by at least a total of four flat elastic crest members 26. The loading region Sb is atmospheric inert gas, and the pressure of the loading region sb is set to be higher than the pressure of the loading region Sa. Therefore, the loading region Sb has excellent airtightness, which prevents the intrusion of particles from the outside and allows one of the time periods required to replace the atmospheric air with an inert gas to be reduced. Therefore, an increase in the oxidation density can be restricted, thereby preventing the formation of a natural oxide film on the surface of one of the wafers. The pressing and holding mechanism 23 is disposed on the partition wall 6 at a position corresponding to the opposite side of the carrier 3. Therefore, unlike the pressing member disclosed in JP2004-6804A, it is possible to easily secure the installation space of one of the pressing and holding mechanisms 23. Figure 6 is a schematic representation of one of the other specific embodiments of the present invention. 122563.doc • 23- 200830456
L) 部分的透視圖。在此具體實施例中，藉由相同參考數字顯 示與上述具體實施例中之該些部分相同的部分，並省略其 說明。在此具體實施例中，—按壓與固持機構23主要包 含··-水平移動部件36，其係經由可在右左方向上滑動之 -線性導執35而置放於一附著板24b上；一壓輥以，其係 透過:平坦彈簧部件26而置放於該水平移動部件％上；以 及-乳缸27 ’其作為_驅動部分用於水平移動該水平移動 部件36。置放該對上部與下部水平移動部件％使其間具有 距離it且透過-連接部件37來彼此連接該等上部與下 部水平移動部件3 6。 畜藉由該氣缸27驅動該等水平移動部件％之各水平移動 部件而滑向一載體時，該壓輥22(其係透過該平坦彈簧部 件26在該部件之一向前移動方向上置放於該水平移動部件 36上）從其一橫向側接近該載體3之一凸緣部分几的待按壓 之部分20，使得該待按壓之部分2〇係藉由該平坦彈簧部件 一彈簧力而按壓與固持。在此具體實施例中，該平坦 彈黃部件26並非彎曲的而係線性的。而且在此具體實施例 中可產生與上述具體實施例中之效果相同的效果。 儘管已參考圖式詳細說明本發明之具體實施例，本發明 並不限於此並且可進行各種設計改變而不脫離本發明之範 可例如，可對應於一晶圓之一程序步驟選擇性地將一惰 性礼體或一清潔乾燥的空氣供應至一裝載區域。此外，該 驅動部分可以係一馬達。 【圖式簡單說明】 122563.doc -24- 200830456 圖i係顯示將本發明應用於一垂直型熱製程裝置之一罝 體實施例的縱向斷面圖； 具 圖2係示意性顯示一主要部分之透視圖； 圖3係示意性顯示該主要部分之側視圖； 圖4係示意性顯示該主要部分之平面圖； 圖5係該主要部分之一放大圖； 圖6係示意性地顯示本發明之另—具體實施例之一 部分的透視圖；以及 Γ 圖7(a)、（b)係示意性顯示 的解說圖。 一傳統製程裝置 之一主要部分 u 【主要元件符號說明】 1 垂直型熱處理裝置 2 外罩 3 容器/載體 3a 出口埠 3b 蓋子 3c 凸緣部分 4 晶舟 5 熱爐 5a 喉部 6 分隔壁 7 裝載/卸载埠 8 台 9 儲存架 122563.doc -25- 200830456L) A perspective view of the part. In this embodiment, the same portions as those in the above-described specific embodiments are denoted by the same reference numerals, and the description thereof will be omitted. In this embodiment, the pressing and holding mechanism 23 mainly includes a horizontal moving member 36 which is placed on an attachment plate 24b via a linear guide 35 slidable in the right-left direction; The roller is placed on the horizontal moving member % through the flat spring member 26; and the -cylinder 27' serves as a driving portion for horizontally moving the horizontal moving member 36. The pair of upper and lower horizontal moving members % are placed with a distance between them and the transmission-connection member 37 connects the upper and lower horizontal moving members 36 to each other. When the animal is driven by the cylinder 27 to drive the horizontal moving members of the horizontal moving parts % to a carrier, the pressing roller 22 is placed through the flat spring member 26 in the forward moving direction of one of the members. The horizontal moving member 36 is close to a portion of the flange portion of the carrier 3 to be pressed from a lateral side thereof such that the portion 2 to be pressed is pressed by the spring force of the flat spring member. Hold. In this particular embodiment, the flattened yellow member 26 is not curved and linear. Also, the same effects as those in the above specific embodiment can be produced in this embodiment. Although the specific embodiments of the present invention have been described in detail with reference to the drawings, the present invention is not limited thereto, and various design changes can be made without departing from the scope of the invention. For example, one of the program steps corresponding to a wafer can be selectively An inert body or a clean, dry air is supplied to a loading area. In addition, the drive portion can be a motor. BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention applied to a vertical type thermal processing apparatus; FIG. 2 is a schematic view showing a main part Figure 3 is a side view schematically showing the main portion; Figure 4 is a plan view schematically showing the main portion; Figure 5 is an enlarged view of one of the main portions; Figure 6 is a schematic view showing the present invention Another perspective view of a portion of a specific embodiment; and Fig. 7(a), (b) are schematic diagrams schematically shown. One of the main parts of a conventional process unit u [Main component symbol description] 1 Vertical heat treatment device 2 Cover 3 Container/carrier 3a Exit b 3b Cover 3c Flange portion 4 Crystal boat 5 Heat furnace 5a Throat 6 Partition wall 7 Loading / Unloading 埠8 sets of 9 storage racks 122563.doc -25- 200830456
10 台/運送台 10a 框 10b 線性導軌 10c 座 11 移動機構 12 載體傳送機構 12a 升降機構 12b 升降臂 12c 傳送臂 13 開口 14 門 15 凹口對準器 16 蓋子部件 17 擋門 18 運送機構 18a 基底台 18b 叉 19 定位接針 20 待按壓之部分 21 凹陷 22 壓輥 23 按壓與固持機構 24 托架 24a 螺絲 122563.doc -26- 20083045610/transport table 10a frame 10b linear guide 10c seat 11 moving mechanism 12 carrier transport mechanism 12a lift mechanism 12b lift arm 12c transfer arm 13 opening 14 door 15 notch aligner 16 cover member 17 shutter 18 transport mechanism 18a base table 18b fork 19 positioning pin 20 part to be pressed 21 recess 22 pressure roller 23 pressing and holding mechanism 24 bracket 24a screw 122563.doc -26- 200830456
24b 附著板 24c 支撐臂 24d 軸承 25 垂直轉軸 26 平坦彈簧部件 26c 彎曲部分 27 氣缸 28 槓桿 29 螺絲 30 轴承部件 31 導引表面 32 限制部件 33 密封部件 34 惰性氣體入口通道 35 線性導執 36 水平移動部件 37 連接部件 40 鎖定部分 w 待處理之物件/晶圓 122563.doc -27-24b attachment plate 24c support arm 24d bearing 25 vertical shaft 26 flat spring member 26c curved portion 27 cylinder 28 lever 29 screw 30 bearing member 31 guide surface 32 restriction member 33 sealing member 34 inert gas inlet passage 35 linear guide 36 horizontal moving member 37 Connecting part 40 Locking part w Objects to be processed/wafer 122563.doc -27-
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006239045A JP2008060513A (en) | 2006-09-04 | 2006-09-04 | Treating device and treating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200830456A true TW200830456A (en) | 2008-07-16 |
Family
ID=39151772
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096132923A TW200830456A (en) | 2006-09-04 | 2007-09-04 | Processing apparatus and processing method |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20080056861A1 (en) |
| JP (1) | JP2008060513A (en) |
| KR (1) | KR20080021563A (en) |
| CN (1) | CN101140893A (en) |
| TW (1) | TW200830456A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101007711B1 (en) * | 2008-05-19 | 2011-01-13 | 주식회사 에스에프에이 | Plasma processing apparatus |
| JP5134495B2 (en) * | 2008-10-16 | 2013-01-30 | 東京エレクトロン株式会社 | Processing apparatus and processing method |
| SG181807A1 (en) * | 2010-01-08 | 2012-07-30 | Kla Tencor Corp | Dual tray carrier unit |
| JP6204226B2 (en) * | 2014-02-24 | 2017-09-27 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| TWI681915B (en) * | 2015-08-04 | 2020-01-11 | 日商昕芙旎雅股份有限公司 | Loading port |
| JP6939335B2 (en) * | 2017-09-27 | 2021-09-22 | Tdk株式会社 | Load port device, how to drive the load port device |
| JP7428959B2 (en) * | 2019-10-07 | 2024-02-07 | Tdk株式会社 | Load port device and method of driving the load port device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5443348A (en) * | 1993-07-16 | 1995-08-22 | Semiconductor Systems, Inc. | Cassette input/output unit for semiconductor processing system |
| FR2747111B1 (en) * | 1996-04-03 | 1998-04-30 | Commissariat Energie Atomique | COUPLING SYSTEM FOR CONFINED TRANSFER OF A FLAT OBJECT FROM A CONTAINMENT BOX TO AN OBJECT PROCESSING UNIT |
| US5980195A (en) * | 1996-04-24 | 1999-11-09 | Tokyo Electron, Ltd. | Positioning apparatus for substrates to be processed |
| US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
| JP2987148B1 (en) * | 1999-01-26 | 1999-12-06 | 国際電気株式会社 | Substrate processing equipment |
| US7140512B2 (en) * | 2004-01-20 | 2006-11-28 | Taiwan Semiconductor Manufacturing Co. | Interlocking lid for wet bench |
| CN101044074B (en) * | 2004-08-19 | 2014-04-02 | 布鲁克斯自动化公司 | Reduced capacity carrier and method of use |
| FR2874744B1 (en) * | 2004-08-30 | 2006-11-24 | Cit Alcatel | VACUUM INTERFACE BETWEEN A MINI-ENVIRONMENT BOX AND EQUIPMENT |
-
2006
- 2006-09-04 JP JP2006239045A patent/JP2008060513A/en active Pending
-
2007
- 2007-08-31 US US11/896,458 patent/US20080056861A1/en not_active Abandoned
- 2007-09-03 KR KR1020070088872A patent/KR20080021563A/en not_active Application Discontinuation
- 2007-09-04 TW TW096132923A patent/TW200830456A/en unknown
- 2007-09-04 CN CNA2007101491392A patent/CN101140893A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN101140893A (en) | 2008-03-12 |
| KR20080021563A (en) | 2008-03-07 |
| JP2008060513A (en) | 2008-03-13 |
| US20080056861A1 (en) | 2008-03-06 |
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