JP2008060513A - Treating device and treating method - Google Patents

Treating device and treating method Download PDF

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JP2008060513A
JP2008060513A JP2006239045A JP2006239045A JP2008060513A JP 2008060513 A JP2008060513 A JP 2008060513A JP 2006239045 A JP2006239045 A JP 2006239045A JP 2006239045 A JP2006239045 A JP 2006239045A JP 2008060513 A JP2008060513 A JP 2008060513A
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opening
carrier
storage container
area
door
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Kiichi Takahashi
喜一 高橋
Katsuhiko Koyama
勝彦 小山
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Priority to JP2006239045A priority Critical patent/JP2008060513A/en
Priority to US11/896,458 priority patent/US20080056861A1/en
Priority to KR1020070088872A priority patent/KR20080021563A/en
Priority to CNA2007101491392A priority patent/CN101140893A/en
Priority to TW096132923A priority patent/TW200830456A/en
Publication of JP2008060513A publication Critical patent/JP2008060513A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67775—Docking arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To prevent the inclination of an accommodating container caused by a pressure on a transfer region side when the door of a partition is released to prevent a defect caused by the inclination of the accommodating container. <P>SOLUTION: A treating device 1 including a bring-in region Sa in which the accommodating container 3 where a plurality of treated bodies w are accommodated and a fetching port 3a at a front is closed with a lid 3b, a transfer region Sb that is kept in an atmosphere different from that of the bring-in region Sa, a partition 6 that partitions both regions Sa, Sb, an opening 13 formed on the partition 6 the door 14 that opens/closes the opening 13, and a loading section 10 that loads the accommodating container 3 in the vicinity of the opening 13 in the bring-in region Sa, the accommodating container 3 is allowed to contact a rear opening 13 loaded on a loading section 10 and the treated body w in the accommodating container 3 is brought in the transfer region Sb side and is treated therein by opening the door 14 and the lid 3b, wherein a pressed section 20 is each provided at a backside section on both sides at the front side of the accommodating container 3, and a press retaining mechanism 23 having a pressing roller 22 that keeps the accommodating container 3 pressed against the opening 13 by being stranded over the pressing section 20 laterally on the partition 6. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、蓋により塞がれた収納容器内から被処理体を取出して所定の処理例えば熱処理を行う処理装置及び処理方法に係り、特に収納容器を隔壁の開口部に対して押圧保持する技術に関するものである。   The present invention relates to a processing apparatus and a processing method for taking out an object to be processed from a storage container closed by a lid and performing a predetermined process such as a heat treatment, and in particular, a technique for holding the storage container against an opening of a partition wall. It is about.

半導体製造装置の一つとして、多数の半導体ウエハ（以下ウエハという）に対してバッチで熱処理を行う熱処理装置がある。この熱処理装置は、複数枚のウエハを収納した収納容器であるキャリアが自動搬送ロボットまたはオペレータにより搬入される搬入領域と、キャリア内のウエハを保持具であるボートに移載して熱処理炉への搬入搬出を行う移載領域であるローディングエリアとを備えている。   As one of semiconductor manufacturing apparatuses, there is a heat treatment apparatus for performing heat treatment in batch on a large number of semiconductor wafers (hereinafter referred to as wafers). In this heat treatment apparatus, a carrier, which is a storage container storing a plurality of wafers, is loaded into a loading area where an automatic transfer robot or an operator loads the wafer, and the wafers in the carrier are transferred to a boat, which is a holder, and transferred to a heat treatment furnace. And a loading area which is a transfer area for carrying in and out.

このような熱処理装置においては、ローディングエリアを搬入領域よりもクリーン度の高い雰囲気にすると共にウエハの自然酸化膜の発生などを防止するために、大気側の搬入領域とローディングエリアとを隔壁で仕切り、ローディングエリア内を不活性ガス例えば窒素（Ｎ2）ガスで満たした不活性ガス雰囲気とすることが好ましい。また、この場合、ウエハのパーティクル汚染を抑えるために、キャリア本体の前面のウエハ取出口が蓋で密閉されている密閉型のキャリア（フープ：Front Opening Unified Podともいう。）を適用することが更に好ましい。 In such a heat treatment apparatus, the loading area on the atmosphere side and the loading area are partitioned by a partition wall in order to make the loading area a cleaner atmosphere than the loading area and to prevent the generation of a natural oxide film on the wafer. The loading area is preferably an inert gas atmosphere filled with an inert gas such as nitrogen (N 2 ) gas. Further, in this case, in order to suppress particle contamination of the wafer, it is further possible to apply a sealed carrier (also referred to as a front opening unified pod) in which the wafer outlet on the front surface of the carrier body is sealed with a lid. preferable.

図７（ａ）は、密閉型のキャリアを上述の隔壁に当接させた状態を示している。６は搬入領域ＳａとローディングエリアＳｂとを仕切る隔壁、１３はこの隔壁６に形成された開口部、１４はこの開口部１３を開閉する扉である。キャリア３は、搬入領域Ｓａに設けられた移載台（載置部）１０に載置された後、移載台１０が前進して前面側の周縁部が開口部１３の開口縁部に当接し、その後、蓋３ｂが開かれる。この場合、扉１４を閉じたまま蓋開閉機構により蓋３ｂを開き、キャリア３内を図示しない窒素ガス置換手段により窒素ガスで置換した後、扉１４及び蓋３ｂを開口部１３から退避させ、キャリア３内のウエハｗをローディングエリアＳｂ側に搬入することが、ローディングエリアＳｂ内の酸素濃度の上昇を抑えることができる点で一層好ましく、このような技術は特許文献１に記載されている。   FIG. 7A shows a state in which a hermetically sealed carrier is brought into contact with the above-described partition wall. Reference numeral 6 denotes a partition that partitions the carry-in area Sa and the loading area Sb, 13 denotes an opening formed in the partition 6, and 14 denotes a door that opens and closes the opening 13. After the carrier 3 is placed on the transfer table (mounting unit) 10 provided in the carry-in area Sa, the transfer table 10 moves forward so that the peripheral edge on the front side contacts the opening edge of the opening 13. Then, the lid 3b is opened. In this case, the lid 3b is opened by the lid opening / closing mechanism while the door 14 is closed, and the inside of the carrier 3 is replaced with nitrogen gas by a nitrogen gas replacement means (not shown), and then the door 14 and the lid 3b are retracted from the opening 13 and the carrier It is more preferable to carry the wafer w in 3 to the loading area Sb side in terms of suppressing an increase in the oxygen concentration in the loading area Sb. Such a technique is described in Patent Document 1.

なお、関連する技術としては、特許文献２に記載されたものもある。
特開平１１−２６４２６７号公報 特開２００４−６８０４号公報 As a related technique, there is one described in Patent Document 2.
JP 11-264267 A Japanese Patent Laid-Open No. 2004-6804

ところで、外部からローディングエリアＳｂ内へのパーティクルの吸い込みを防止すると共に、ローディングエリアＳｂ内の酸素濃度の上昇を押えるために、ローディングエリアＳｂ内を大気圧よりも充分に高い圧力に維持しておくことが望ましい。しかしながら、前記熱処理装置においては、前記移載台１０においてキャリア３を固定する構造が、キャリア３の底部を逆Ｌ字状の係止部４０を有する固定機構により係止してキャリア３を固定するようになっているに過ぎなかったため、隔壁６の扉１４を開けた時（すなわちキャリア３の蓋３ｂを開けた時）に、図７(ｂ)に示すようにローディングエリアＳｂ側の圧力を受けてキャリア３の上側が搬入領域Ｓａ側に傾き、これによりローディングエリアＳｂ内から窒素ガスが搬入領域Ｓａ側へ漏出してローディングエリアＳｂ内の酸素濃度の上昇を招いたり、キャリア３の傾きを抑制するためのローディングエリアＳｂ内の圧力制御が必要になったり、ＴＡＴの悪化を招いたり、キャリアに対する蓋の開閉ミスやキャリア内のウエハのマッピングミスを招いたりする不具合が発生することが考えられる。   Incidentally, the inside of the loading area Sb is maintained at a pressure sufficiently higher than the atmospheric pressure in order to prevent the suction of particles from the outside into the loading area Sb and to suppress the increase in the oxygen concentration in the loading area Sb. It is desirable. However, in the heat treatment apparatus, the structure for fixing the carrier 3 on the transfer table 10 is to fix the carrier 3 by locking the bottom of the carrier 3 with a fixing mechanism having an inverted L-shaped locking portion 40. As shown in FIG. 7B, when the door 14 of the partition wall 6 is opened (that is, when the lid 3b of the carrier 3 is opened), the pressure on the loading area Sb side is received. As a result, the upper side of the carrier 3 is inclined toward the loading area Sa, whereby nitrogen gas leaks from the loading area Sb to the loading area Sa, leading to an increase in the oxygen concentration in the loading area Sb or suppressing the inclination of the carrier 3. To control the pressure in the loading area Sb, cause deterioration of TAT, open / close of the lid with respect to the carrier, and mapping of the wafer in the carrier. Failure to or invited Ngumisu is considered to occur.

なお、キャリアを隔壁に密接させて蓋体を開いた後キャリア内を不活性ガスで置換する場合に、不活性ガスの供給流量が多くてもキャリアの姿勢を安定化させ、隔壁とキャリアとの気密状態を破らないようにする技術としては、特許文献２に記載されているように、隔壁における搬入領域側に、起立した姿勢とキャリアの上面を押えるように倒れた姿勢との間で水平な軸の回りに回動する押え部材を設け、キャリアが移載台に載置されて隔壁に密接した後、押え部材を回動させてキャリアの上面を押え、この状態でキャリアの蓋体を開き、不活性ガス供給管からキャリア内に不活性ガスを供給するようにしたものもあるが、この技術の場合、移載台上のキャリアの上方に押え部材を設置するための充分なスペースを確保する必要があり、この設置スペースを確保できない場合にはこの技術を採用することはできない。   In addition, when the inside of the carrier is replaced with an inert gas after the carrier is brought into close contact with the partition wall and the inside of the carrier is replaced with an inert gas, the posture of the carrier is stabilized even if the supply flow rate of the inert gas is large. As a technique for preventing the airtight state from being broken, as described in Patent Document 2, a horizontal state between a standing posture and a posture that is tilted so as to press the upper surface of the carrier is provided on the side of the loading area in the partition wall. A presser member that rotates around the shaft is provided. After the carrier is placed on the transfer table and in close contact with the partition wall, the presser member is rotated to press the top surface of the carrier, and in this state, the carrier lid is opened. In some cases, an inert gas is supplied into the carrier from the inert gas supply pipe, but in this technology, sufficient space is secured to install the pressing member above the carrier on the transfer table. This should be It is not possible to adopt this technology if you can not secure a location space.

本発明は、上記事情を考慮してなされたものであり、隔壁の扉開放時における移載領域側の圧力による収納容器の傾きを防止することができ、収納容器の傾きに起因する各種の不具合を防止することができる処理装置及び処理方法を提供することを目的とする。   The present invention has been made in consideration of the above circumstances, and can prevent the storage container from being inclined due to the pressure on the transfer area side when the partition door is opened, and various problems caused by the inclination of the storage container. It is an object of the present invention to provide a processing apparatus and a processing method that can prevent the above-described problem.

前記目的を達成するために、本発明のうち、請求項１に係る発明は、複数の被処理体が収納され前面の取出口が蓋により密閉された収納容器を搬入する搬入領域と、該搬入領域とは異なる雰囲気に維持された移載領域と、これら両領域を仕切る隔壁と、該隔壁に形成された開口部と、この開口部を開閉する扉と、前記収納容器を搬入領域の前記開口部近傍に載置する載置部と、を備え、前記収納容器を載置部に載置させた後開口部に当接させ、前記扉及び蓋を開いて収納容器内の被処理体を移載領域側に搬送して処理する処理装置において、
前記収納容器の前面両側背面部に被押圧部を設け、前記隔壁に、前記被押圧部に側方から乗り上げて収納容器を開口部に押圧させた状態に保持する押圧ローラを有する押圧保持機構を設けたことを特徴とする。 In order to achieve the above object, the invention according to claim 1 of the present invention includes a carry-in area for carrying a storage container in which a plurality of objects to be processed are stored and a front outlet is sealed with a lid; A transfer region maintained in an atmosphere different from the region, a partition partitioning both regions, an opening formed in the partition, a door for opening and closing the opening, and the opening in the loading region for the storage container A placement part placed in the vicinity of the part, and after the storage container is placed on the placement part, it is brought into contact with the opening, the door and the lid are opened, and the object to be processed in the storage container is transferred. In a processing apparatus that transports and processes to the loading area side,
A pressing holding mechanism having a pressing roller that is provided with pressed portions on both front and back sides of the storage container, and that holds the storage container in a state of pressing the receiving container against the opening by riding on the pressed portion from the side; It is provided.

請求項２に係る発明は、請求項１記載の処理装置において、前記押圧保持機構は、前記隔壁にブラケットを介して回動自在に支持された垂直の回動軸と、該回動軸からその半径方向に延出され先端に保持した押圧ローラを前方へ押圧付勢する板バネ部材と、前記回動軸を回動する駆動部と、を有していることを特徴とする。   According to a second aspect of the present invention, in the processing apparatus according to the first aspect, the pressing and holding mechanism includes a vertical rotation shaft that is rotatably supported by the partition wall via a bracket, and the rotation shaft. It has a leaf | plate spring member which presses and urges | biass the pressing roller extended in the radial direction and hold | maintained at the front-end | tip, and the drive part which rotates the said rotating shaft, It is characterized by the above-mentioned.

請求項３に係る発明は、請求項２記載の処理装置において、前記回動軸には、それぞれ板バネ部材を介して前記押圧ローラが少なくとも上下一対設けられていることを特徴とする。   According to a third aspect of the present invention, in the processing apparatus according to the second aspect of the present invention, at least a pair of upper and lower pressing rollers are provided on the rotating shafts via leaf spring members.

請求項４に係る発明は、請求項１ないし３のいずれかに記載の処理装置において、前記移載領域の雰囲気は、不活性ガスであり、且つ搬入領域の圧力よりも高い圧力に設定されていることを特徴とする。   The invention according to claim 4 is the processing apparatus according to any one of claims 1 to 3, wherein the atmosphere in the transfer area is an inert gas and is set to a pressure higher than the pressure in the carry-in area. It is characterized by being.

請求項５に係る発明は、複数の被処理体が収納され前面の取出口が蓋により密閉された収納容器を搬入する搬入領域と、該搬入領域とは異なる雰囲気に維持された移載領域と、これら両領域を仕切る隔壁と、該隔壁に形成された開口部と、この開口部を開閉する扉と、前記収納容器を搬入領域の前記開口部近傍に載置する載置部と、を備え、前記収納容器を載置部に載置させた後開口部に当接させ、前記扉及び蓋を開いて収納容器内の被処理体を移載領域側に搬送して処理する処理方法において、
前記収納容器の前面両側背面部に被押圧部を設け、該被押圧部に側方から押圧ローラを乗り上げさせて収納容器を開口部に押圧させた状態に保持することを特徴とする。 The invention according to claim 5 includes a carry-in area for carrying a storage container in which a plurality of objects to be processed are stored and a front outlet is sealed by a lid, and a transfer area maintained in an atmosphere different from the carry-in area. A partition that partitions the two regions, an opening formed in the partition, a door that opens and closes the opening, and a mounting unit that mounts the storage container in the vicinity of the opening of the loading region. In the processing method of bringing the storage container into contact with the opening after placing the storage container on the mounting portion, opening the door and lid, and transporting the object to be processed in the storage container to the transfer area side for processing.
A pressed portion is provided on both sides of the front surface of the storage container, and a pressing roller rides on the pressed portion from the side to hold the storage container in a state of being pressed against the opening.

本発明によれば、隔壁の扉開放時における移載領域側の圧力による収納容器の傾きを防止することができ、収納容器の傾きに起因する各種の不具合を防止することができる。   ADVANTAGE OF THE INVENTION According to this invention, the inclination of a storage container by the pressure by the side of the transfer area | region at the time of the door opening of a partition can be prevented, and the various malfunction resulting from the inclination of a storage container can be prevented.

以下に、本発明を実施するための最良の形態について、添付図面を基に詳述する。図１は本発明を縦型熱処理装置に適用した実施の形態を示す縦断面図、図２は要部を概略的に示す斜視図、図３は同要部を概略的に示す側面図、図４は同要部の概略的に示す平面図、図５は同要部の拡大図である。   The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. 1 is a longitudinal sectional view showing an embodiment in which the present invention is applied to a vertical heat treatment apparatus, FIG. 2 is a perspective view schematically showing the main part, and FIG. 3 is a side view schematically showing the main part. 4 is a plan view schematically showing the main part, and FIG. 5 is an enlarged view of the main part.

図１において、１はクリーンルーム内に設置された縦型熱処理装置（処理装置）であり、その外郭を形成する筐体２を備えている。この筐体２内は、キャリア３を搬入する搬入領域Ｓａと、キャリア３内からウエハｗを取出してボート４への移載、熱処理炉５へのボート４の搬入搬出を行う移載領域であるローディングエリアＳｂとに隔壁６により仕切られている。   In FIG. 1, reference numeral 1 denotes a vertical heat treatment apparatus (treatment apparatus) installed in a clean room, and includes a housing 2 that forms an outline thereof. The inside of the housing 2 is a loading area Sa for loading the carrier 3, and a loading area for taking out the wafer w from the carrier 3 and transferring it to the boat 4 and loading / unloading the boat 4 to / from the heat treatment furnace 5. It is partitioned by a partition wall 6 from the loading area Sb.

前記キャリア３は、所定口径例えば直径３００ｍｍの被処理体例えばウエハｗを水平状態で上下方向に所定間隔で複数例えば２５枚程度収納可能なプラスチック製の蓋付き収納容器、いわゆるクローズ型キャリア（フープともいう。）であり、その前面部の取出口３ａにこれを密封状態に塞ぐための蓋３ｂを脱着可能に備えている。この蓋３ｂには、これをキャリア３の取出口３ａに保持するための図示しないラッチ機構が設けられ、このラッチ機構の解除によりキャリア３の取出口３ａから蓋３ｂが取外せるようになっている。   The carrier 3 is a so-called closed carrier (also called a hoop), which is a container with a plastic lid capable of storing a plurality of, for example, about 25 wafers w, for example, in a horizontal state at a predetermined interval in a vertical direction. And a lid 3b for sealing it in a sealed state is provided at the front outlet 3a so as to be detachable. The lid 3b is provided with a latch mechanism (not shown) for holding the lid 3b at the outlet 3a of the carrier 3, and the lid 3b can be removed from the outlet 3a of the carrier 3 by releasing the latch mechanism. .

前記筐体２の前面部には、キャリア３を搬入搬出するための搬出入口７が設けられ、この搬出入口７の外側である筐体２の前面部には搬入搬出時にキャリア３を載置するための載置台８が設けられている。前記搬入領域Ｓａには、上方の前部と後部に複数個のキャリア３を一時的に保管しておくための保管棚９が対向して設けられていると共に、下方の隔壁６側にウエハ移載を行うためにキャリア３を載置するための載置部である移載台１０が設けられている。   A carry-in / out port 7 for loading / unloading the carrier 3 is provided on the front surface of the housing 2, and the carrier 3 is placed on the front surface of the housing 2 outside the carry-in / out port 7 during loading / unloading. A mounting table 8 is provided. In the carry-in area Sa, storage shelves 9 for temporarily storing a plurality of carriers 3 at the upper front and rear are provided opposite to each other, and the wafer transfer is performed on the lower partition 6 side. A transfer table 10 is provided as a mounting unit for mounting the carrier 3 for mounting.

また、搬入領域Ｓａには、前記載置台８上に設けられ搬出入口７からキャリア３の出し入れをする移動機構１１と、保管棚９と、移載台１０との間でキャリア３の搬送を行うための搬送機構（キャリア搬送機構）１２が設けられている。この搬送機構１２は、搬入領域Ｓａの一側部に設けられた昇降機構１２ａにより昇降移動される昇降アーム１２ｂと、この昇降アーム１２ｂに設けられ、キャリア３の底部または上部を支持して水平方向に搬送する搬送アーム１２ｃとから主に構成されている。   Further, in the carry-in area Sa, the carrier 3 is transported between the moving mechanism 11 provided on the mounting table 8 and taking in and out the carrier 3 from the carry-in / out port 7, the storage shelf 9, and the transfer table 10. For this purpose, a transport mechanism (carrier transport mechanism) 12 is provided. The transport mechanism 12 includes a lift arm 12b that is moved up and down by a lift mechanism 12a provided on one side of the carry-in area Sa, and is provided in the lift arm 12b to support the bottom or top of the carrier 3 in the horizontal direction. It is mainly comprised from the conveyance arm 12c conveyed to.

搬入領域Ｓａは、搬出入口７を通ってクリーンルーム内と連通されている。搬入領域Ｓａ内の雰囲気は、空気で、大気圧である。熱処理装置１の稼動時には、ローディングエリアＳｂは、ウエハ表面の自然酸化膜の形成を抑制ないし防止するために、不活性ガス雰囲気とされている。不活性ガスとしては、例えばＮ2（窒素）ガスが用いられている。なお、不活性ガスとしては、Ｎ2ガス以外（例えばＡｒガス、Ｈｅガス等）であってもよい。また、ローディングエリアＳｂは、気密に形成されていると共に、不活性ガスの圧力が大気圧よりも充分に高い所定の圧力例えば大気圧＋１０〜１０００Ｐａ程度に維持されている。熱処理装置１は、ローディングエリアＳｂ内の不活性ガスの圧力を所定の圧力に維持するための圧力制御機構を備えている。現状の装置では型式により異なるが、大気圧＋１０〜１０００Ｐａの範囲内で調整コントロールされている。一時的に熱影響で１０００Ｐａを超えることもある。制御範囲を超えた状態では、ローディングエリアの排気はフルオープンの状態になる。また、ローディングエリアＳｂ内には、空気清浄装置が設けられ、クリーンルーム内よりも充分に清浄度が高く維持されている。 The carry-in area Sa communicates with the inside of the clean room through the carry-in / out entrance 7. The atmosphere in the carry-in area Sa is air and atmospheric pressure. When the heat treatment apparatus 1 is in operation, the loading area Sb is an inert gas atmosphere in order to suppress or prevent the formation of a natural oxide film on the wafer surface. For example, N 2 (nitrogen) gas is used as the inert gas. The inert gas may be other than N 2 gas (for example, Ar gas, He gas, etc.). Further, the loading area Sb is formed in an airtight manner, and is maintained at a predetermined pressure at which the pressure of the inert gas is sufficiently higher than the atmospheric pressure, for example, about atmospheric pressure +10 to 1000 Pa. The heat treatment apparatus 1 includes a pressure control mechanism for maintaining the pressure of the inert gas in the loading area Sb at a predetermined pressure. In the current apparatus, the pressure is regulated and controlled within the range of atmospheric pressure +10 to 1000 Pa, although it varies depending on the model. It may temporarily exceed 1000 Pa due to thermal effects. When the control range is exceeded, the loading area exhaust is in a fully open state. Further, an air purifier is provided in the loading area Sb, and the cleanliness is maintained sufficiently higher than in the clean room.

前記隔壁６には、移載台１０に載置されたキャリア３を搬入領域Ｓａ側から当接させてキャリア３内とローディングエリアＳｂ内を連通するための開口部１３が設けられていると共に、開口部１３をローディングエリアＳｂ側から閉鎖する扉１４が開閉可能に設けられている。開口部１３は、キャリア３の取出口３ａとほぼ同口径に形成されており、開口部１３からキャリア３内のウエハｗの出し入れが可能になっている。   The partition wall 6 is provided with an opening 13 for bringing the carrier 3 placed on the transfer table 10 into contact with the inside of the loading area Sa and communicating the inside of the carrier 3 and the loading area Sb. A door 14 that closes the opening 13 from the loading area Sb side is provided to be openable and closable. The opening 13 is formed to have substantially the same diameter as the outlet 3 a of the carrier 3, and the wafer w in the carrier 3 can be taken in and out from the opening 13.

前記扉１４には、キャリア３の蓋３ｂを脱着（開閉）する図示しない脱着機構及び扉１４をローディングエリアＳｂ側から開閉する図示しない扉開閉機構が設けられ、この扉開閉機構により扉１４及び蓋３ｂがローディングエリアＳｂ側に開放移動され、更にウエハｗの移載の邪魔にならないように上方または下方へ移動（退避）されるようになっている。前記移載台１０の下方には、結晶方向を揃えるためにウエハｗの周縁部に設けられているノッチ（切欠部）を一方向に整列させるためのノッチ整列機構１５が設けられている。   The door 14 is provided with a detachment mechanism (not shown) for detaching (opening / closing) the lid 3b of the carrier 3 and a door opening / closing mechanism (not shown) for opening and closing the door 14 from the loading area Sb side. 3b is moved to the loading area Sb side and moved (retracted) upward or downward so as not to obstruct the transfer of the wafer w. Below the transfer table 10, a notch alignment mechanism 15 is provided for aligning notches (notches) provided in the peripheral edge of the wafer w in one direction in order to align the crystal direction.

ローディングエリアＳｂの奥部上方には、多数例えば１００枚程度の半導体ウエハｗを上下方向に所定間隔で多段に保持する保持具である例えば石英製のボート４を載置して熱処理炉５内への搬入搬出及び炉口５ａの開閉を行う蓋体１６が図示しない昇降機構により昇降可能に設けられている。炉口５ａの近傍には、蓋体１６が開放されて熱処理後のボート４が搬出された際に炉口５ａを遮蔽するためのシャッター１７が水平方向に開閉移動可能に設けられている。   Above the loading area Sb, for example, a boat 4 made of quartz, which is a holding tool for holding a large number of, for example, about 100 semiconductor wafers w in multiple stages at predetermined intervals in the vertical direction, is placed into the heat treatment furnace 5. A lid body 16 that carries in and out the door and opens and closes the furnace port 5a is provided so as to be lifted and lowered by a lifting mechanism (not shown). In the vicinity of the furnace port 5a, a shutter 17 for shielding the furnace port 5a when the cover 16 is opened and the boat 4 after heat treatment is carried out is provided so as to be movable in the horizontal direction.

ローディングエリアＳｂには、移載台１０上のキャリア３とボート４との間、具体的には移載台１０上のキャリア３とノッチ整列機構１５との間、ノッチ整列機構１５とボート４との間、熱処理後のボート４と移載台１０上の空のキャリア３との間でウエハｗの移載を行う移載機構１８が設けられている。この移載機構１８は、昇降可能及び水平回動可能に設けられた基台１８ａと、この基台１８ａの長手方向（半径方向）に進退移動可能に設けられ複数例えば５枚の薄板状のフォーク１８ｂとを備えている。フォーク１８ｂは、例えば、独立して進退移動可能な一枚の枚葉フォークと、４枚の複数フォークとからなり、複数フォークはその高さ方向中間位置に配置される枚葉フォークを基準として上下方向にピッチ変換可能に構成されている。   In the loading area Sb, between the carrier 3 on the transfer table 10 and the boat 4, specifically between the carrier 3 and the notch alignment mechanism 15 on the transfer table 10, the notch alignment mechanism 15 and the boat 4 In the meantime, a transfer mechanism 18 for transferring the wafer w between the boat 4 after heat treatment and the empty carrier 3 on the transfer table 10 is provided. The transfer mechanism 18 includes a base 18a that can be moved up and down and horizontally rotatable, and a plurality of, for example, five thin plate-like forks that are provided to be movable back and forth in the longitudinal direction (radial direction) of the base 18a. 18b. The fork 18b is composed of, for example, a single sheet fork that can move forward and backward independently and four multiple forks, and the multiple forks are vertically moved with respect to a single sheet fork arranged at an intermediate position in the height direction. The pitch can be changed in the direction.

前記移載台１０は、単にキャリア３を載置し得るように構成されていてもよいが、次のように構成されていてもよい。移載台１０は、例えば図３に示すように隔壁６に固定された台枠１０ａと、該台枠１０ａの上部に隔壁６に対して直交する方向にリニアガイド１０ｂを介して小範囲でスライド可能に設けられた台座１０ｃとから構成され、台座１０ｃ上にはキャリア３の底部に形成された図示しない孔部に係合してキャリア３を位置決めする複数例えば３本の位置決めピン１９が立設されている。台枠１０ａには、台座１０ｃにキャリア３を固定する固定機構と、キャリア３を隔壁６から離間した離間位置からキャリアの前面部が隔壁６に当接する当接位置にまたはその逆に台座１０ｃごと移動する移動機構とが設けられている（図示省略）。   The transfer table 10 may be configured to simply mount the carrier 3, but may be configured as follows. For example, as shown in FIG. 3, the transfer table 10 has a frame 10a fixed to the partition wall 6 and slides in a small range via a linear guide 10b in the direction perpendicular to the partition wall 6 at the upper part of the frame 10a. A plurality of, for example, three positioning pins 19 for positioning the carrier 3 by engaging with a hole (not shown) formed in the bottom of the carrier 3 are provided upright on the base 10c. Has been. The frame 10a includes a fixing mechanism for fixing the carrier 3 to the pedestal 10c, and a position where the carrier 3 is separated from the partition wall 6 from a position where the front surface of the carrier contacts the partition wall 6 or vice versa. And a moving mechanism that moves (not shown).

前記キャリア３の前面両側背面部には被押圧部２０が設けられている。図２の図示例では、キャリア３の前面両側部には側方に突出したフランジ部３ｃが形成され、該フランジ部３ｃの背面部が被押圧部２０とされている。図４ないし図５の図示例では、キャリア３の前面両側部には凹部２１を設けることによりフランジ部３ｃが形成され、該フランジ部３ｃの背面部が被押圧部２０とされている。そして、前記隔壁６には、前記被押圧部２０に側方から乗り上げてキャリア３を隔壁６の開口部１３すなわち開口縁部に押圧させた状態に保持する押圧ローラ２２を有する押圧保持機構２３が設けられている。押圧保持機構２３は、移載台１０上のキャリア３の両側に位置するように一対設けられている。   Pressed portions 20 are provided on both front and back sides of the carrier 3. In the illustrated example of FIG. 2, flange portions 3 c projecting sideways are formed on both sides of the front surface of the carrier 3, and the back portion of the flange portion 3 c is a pressed portion 20. In the illustrated example of FIGS. 4 to 5, the flange portion 3 c is formed by providing the concave portions 21 on both sides of the front surface of the carrier 3, and the back portion of the flange portion 3 c is the pressed portion 20. The partition wall 6 has a pressing holding mechanism 23 having a pressing roller 22 that rides on the pressed portion 20 from the side and holds the carrier 3 in a state of pressing the carrier 3 against the opening 13 of the partition wall 6, that is, the opening edge. Is provided. A pair of pressing and holding mechanisms 23 are provided so as to be positioned on both sides of the carrier 3 on the transfer table 10.

前記押圧保持機構２３は、前記隔壁６にブラケット２４を介して回動自在に支持された垂直の回動軸２５と、該回動軸２０からその半径方向に延出され先端に保持した押圧ローラ２２を前方へ押圧付勢する板バネ部材２６と、前記回動軸２５を回動する駆動部であるエアシリンダ２７と、を有している。板バネ部材２６は例えばステンレス製であることが好ましく、押圧ローラ２２は例えばフッ素樹脂製であることが好ましい。ブラケット２４は、隔壁６にネジ２４ａで固定される上下に長い取付基板２４ｂと、該取付基板２４ｂに設けられた上下一対の支持腕２４ｃとからなり、上下の支持片２４ｃに回動軸２５が上下方向に掛け渡された状態で軸受２４ｄを介してその軸回りに回動自在に支持されている。   The pressing and holding mechanism 23 includes a vertical rotating shaft 25 that is rotatably supported by the partition wall 6 via a bracket 24, and a pressing roller that extends from the rotating shaft 20 in the radial direction and is held at the tip. A plate spring member 26 that presses and urges 22 forward, and an air cylinder 27 that is a drive unit that rotates the rotating shaft 25. The leaf spring member 26 is preferably made of, for example, stainless steel, and the pressing roller 22 is preferably made of, for example, a fluororesin. The bracket 24 includes a vertically long mounting board 24b fixed to the partition wall 6 with screws 24a, and a pair of upper and lower support arms 24c provided on the mounting board 24b, and a rotating shaft 25 is provided on the upper and lower support pieces 24c. It is supported so as to be rotatable about its axis via a bearing 24d in a state of being stretched in the vertical direction.

前記エアシリンダ２７の一端が回動軸２５の下端部に設けられたレバー２８に連結され、エアシリンダ２７の他端が移載台１０の台枠１０ａ側に連結されている。エアシリンダ２７によりレバー２８を手前に引っ張ることにより回動軸２５が反時計方向に回動し、板バネ部材２６を介して押圧ローラ２２が隔壁６側の待機位置イからキャリア３の被押圧部２０の位置まで転動して乗り上げるようになっている。逆に、エアシリンダ２７によりレバー２８を押すことにより回動軸２５が時計方向に回動し、板バネ部材２６を介して押圧ローラ２２がキャリア３の被押圧部２０から隔壁６側の待機位置イまで転動して戻される。   One end of the air cylinder 27 is connected to a lever 28 provided at the lower end of the rotating shaft 25, and the other end of the air cylinder 27 is connected to the frame 10 a side of the transfer table 10. By pulling the lever 28 forward by the air cylinder 27, the rotating shaft 25 rotates counterclockwise, and the pressing roller 22 is moved from the standby position a on the partition wall 6 side through the leaf spring member 26 to the pressed portion of the carrier 3. It rolls up to the 20th position. Conversely, when the lever 28 is pushed by the air cylinder 27, the pivot shaft 25 pivots clockwise, and the pressing roller 22 is moved from the pressed portion 20 of the carrier 3 to the standby position on the partition wall 6 via the leaf spring member 26. Rolled back to i and returned.

前記回動軸２５には、それぞれ板バネ部材２６を介して前記押圧ローラ２２が少なくとも上下に一対設けられている。板バネ部材２６及び押圧ローラ２２は左右対称に配置され、計４つの板バネ部材２６のバネ力（付勢力）でキャリア３のフランジ部３ｃを隔壁６に対して押圧するようになっている。ここで、ローディングエリアＳｂの圧力が１０００Ｐａの場合、キャリア３には１１．２ｋｇｆ（１０９．８Ｎ）の圧力がかかるため、板バネ部材１箇所当り２．８ｋｇｆ（２７．４Ｎ）の押付力（押圧力）が必要となり、このため、このような押付力を有する板バネ部材２６が用いられている。   The rotating shaft 25 is provided with at least a pair of the pressing rollers 22 above and below via a leaf spring member 26, respectively. The plate spring member 26 and the pressing roller 22 are arranged symmetrically so as to press the flange portion 3c of the carrier 3 against the partition wall 6 by the spring force (biasing force) of the four plate spring members 26 in total. Here, when the pressure in the loading area Sb is 1000 Pa, a pressure of 11.2 kgf (109.8 N) is applied to the carrier 3, so that a pressing force (pushing force of 2.8 kgf (27.4 N) per place of the leaf spring member is applied. For this reason, the leaf spring member 26 having such a pressing force is used.

板バネ部材２６はこのような押圧力を発揮し得るように待機位置イにおいてもバネ力に抗して予め湾曲されている。板バネ部材２６及び押圧ローラ２２は左右対称であるため、右側のものについて更に詳述すると、図５に示すように、板バネ部材２６の一端（基端）が回動軸２５の側面にネジ２９で固定され、この板バネ部材２６の他端（先端ないし自由端）は前方へ延出されており、板バネ部材２６の先端には押圧ローラ２２が軸受部材３０を介して垂直軸回りに回転自在に取付けられている。この場合、回動軸２５はキャリア３と干渉しない右側位置にあるため、板バネ部材２６の先端側は前方斜め左方に湾曲して延出されており、押圧ローラ２２がキャリア３の側方から被押圧部２０に乗り上げてこれを押圧するようになっている。   The leaf spring member 26 is curved in advance against the spring force even at the standby position A so as to exert such a pressing force. Since the leaf spring member 26 and the pressing roller 22 are symmetrical, the right side member will be described in more detail. As shown in FIG. 5, one end (base end) of the leaf spring member 26 is screwed to the side surface of the rotating shaft 25. 29, the other end (tip or free end) of the leaf spring member 26 extends forward, and a pressure roller 22 is provided around the vertical axis via a bearing member 30 at the tip of the leaf spring member 26. It is rotatably mounted. In this case, since the rotation shaft 25 is located on the right side so as not to interfere with the carrier 3, the distal end side of the leaf spring member 26 is curved and extended obliquely leftward forward, and the pressing roller 22 is located on the side of the carrier 3. Then, it rides on the pressed part 20 and presses it.

待機位置イとキャリア３の被押圧部２０との間には段差があるため、押圧ローラ２２を円滑に移動させるために、待機位置イとキャリア３の被押圧部２０との間にはこれらを結ぶべく傾斜した案内面３１が設けられていることが好ましい。この案内面３１は、隔壁６または取付基板２４ｂに設けられている。なお、押圧ローラ２２が案内面３１を登るときの抵抗により板バネ部材２６の湾曲部２６ｃが反対側に湾曲するのを防止するために回動軸２５には板バネ部材２６の湾曲部２６ｃの外面に沿って延出された規制部材３２が設けられていることが好ましい。なお、図５において、３３はキャリア３の前面部を隔壁６に押し当てたときに、隔壁６とキャリア３の前面周縁部との間を封止する封止部材である。また、隔壁に６は、扉１４を閉めた状態で蓋３ｂを開けたときにキャリア３内に不活性ガス（例えばＮ2ガス）を導入して置換するための不活性ガス導入通路３４が設けられている。 Since there is a step between the standby position A and the pressed part 20 of the carrier 3, these are placed between the standby position A and the pressed part 20 of the carrier 3 in order to move the pressing roller 22 smoothly. It is preferable that a guide surface 31 that is inclined to be connected is provided. The guide surface 31 is provided on the partition wall 6 or the mounting substrate 24b. In order to prevent the bending portion 26c of the leaf spring member 26 from bending to the opposite side due to the resistance when the pressing roller 22 climbs the guide surface 31, the rotating shaft 25 has the bending portion 26c of the leaf spring member 26. It is preferable that a regulating member 32 extending along the outer surface is provided. In FIG. 5, reference numeral 33 denotes a sealing member that seals between the partition wall 6 and the front peripheral edge of the carrier 3 when the front surface portion of the carrier 3 is pressed against the partition wall 6. The partition wall 6 is provided with an inert gas introduction passage 34 for introducing and replacing an inert gas (for example, N 2 gas) into the carrier 3 when the lid 3b is opened with the door 14 closed. It has been.

以上の構成からなる縦型熱処理装置（処理装置）の作用ないし処理方法を述べる。キャリア３が作業員または搬送ロボットにより載置台８上に載置されると、移動機構１１によりキャリア３が搬出入口７を通って搬入領域Ｓａの受渡位置ロに移動され、そのキャリア３は受渡位置ロから搬送機構１２により移載台１０または保管棚９に搬送される。搬入領域Ｓａには、熱処理に必要な個数のキャリア３が順次搬入され、保管棚９に保管されることになる。   The operation or processing method of the vertical heat treatment apparatus (processing apparatus) having the above configuration will be described. When the carrier 3 is placed on the placing table 8 by an operator or a transfer robot, the carrier 3 is moved by the moving mechanism 11 through the carry-in / out port 7 to the delivery position B in the carry-in area Sa, and the carrier 3 is moved to the delivery position. (B) is transferred to the transfer table 10 or the storage shelf 9 by the transfer mechanism 12. The number of carriers 3 required for the heat treatment is sequentially carried into the carry-in area Sa and stored in the storage shelf 9.

移載台１０上にキャリア３が搬送されて載置されると、例えば移載台１０上に設けられた図示しないセンサによりキャリア３が載置されたことが検知され、押圧保持機構２３が作動を開始する。なお、前述した固定機構や移動機構を有する場合には、台座１０ｃに対するキャリア３の固定や隔壁６に対するキャリア３の台座１０ｃごとの移動を予め行うことになる。   When the carrier 3 is transported and placed on the transfer table 10, for example, it is detected that the carrier 3 is placed by a sensor (not shown) provided on the transfer table 10, and the press holding mechanism 23 is activated. To start. When the fixing mechanism and the moving mechanism described above are provided, the carrier 3 is fixed to the pedestal 10c and the carrier 3 is moved relative to the partition wall 6 for each pedestal 10c in advance.

次に、押圧保持機構２３の作動について説明する。エアシリンダ２７の駆動によりレバー２８を介して回動軸２５が所定角度回動され（右側の回動軸は反時計方向、左側の回動軸は時計方向）、板バネ部材２６を介して押圧ローラ２２が側方の待機位置イからキャリア３のフランジ部３ｃの背面部である被押圧部２０に向って転動移動される。これにより、キャリア３の被押圧部２０には側方から押圧ローラ２２が乗り上げられ、計４個の押圧ローラ２２を押圧する板バネ部材２６のバネ力によりキャリア３が隔壁６の開口部１３（すなわちキャリアの前面周縁部が隔壁の開口部の周縁部）に押圧された状態に保持される。従って、隔壁６の扉開放時にローディングエリア側の不活性ガスの圧力がキャリア３に加わったとしても、その圧力でキャリア３が傾くのを防止することができ、キャリア３の傾きに起因する各種の不具合すなわちローディングエリアＳｂ内から不活性ガスが搬入領域Ｓａ側へ漏出してローディングエリアＳｂ内の酸素濃度の上昇を招いたり、キャリア３の傾きを抑制するためのローディングエリアＳｂ内の圧力制御が必要になったり、ＴＡＴの悪化を招いたり、キャリアに対する蓋３ｂの開閉ミスやキャリア内のウエハのマッピングミスを招いたりする不具合を防止することができる。なお、押圧保持力を解除するときは、エアシリンダ２７の駆動により回動軸２５を前記とは逆の方向に回動させて、押圧ローラ２２を被押圧部２０から離脱させて待機位置イに戻せばよい。   Next, the operation of the press holding mechanism 23 will be described. By driving the air cylinder 27, the rotation shaft 25 is rotated by a predetermined angle via the lever 28 (the right rotation shaft is counterclockwise and the left rotation shaft is clockwise) and is pressed via the leaf spring member 26. The roller 22 rolls from the side standby position a toward the pressed portion 20 that is the back surface of the flange portion 3 c of the carrier 3. As a result, the pressing roller 22 rides on the pressed portion 20 of the carrier 3 from the side, and the carrier 3 is pressed by the spring force of the leaf spring member 26 that presses the four pressing rollers 22 in total. That is, the front peripheral edge of the carrier is held in a pressed state by the peripheral edge of the opening of the partition wall. Therefore, even when the pressure of the inert gas on the loading area side is applied to the carrier 3 when the partition 6 is opened, the carrier 3 can be prevented from being inclined by the pressure, and various kinds of causes caused by the inclination of the carrier 3 can be prevented. In other words, the inert gas leaks from the loading area Sb to the loading area Sa, leading to an increase in the oxygen concentration in the loading area Sb, or pressure control in the loading area Sb to suppress the inclination of the carrier 3 is necessary. Such as inconveniences, deterioration of TAT, mistakes in opening / closing the lid 3b with respect to the carrier, and mistakes in mapping of the wafer in the carrier can be prevented. When releasing the pressing force, the rotary shaft 25 is rotated in the direction opposite to the above by driving the air cylinder 27, and the pressing roller 22 is separated from the pressed portion 20 to the standby position a. Return it.

また、前記押圧保持機構２３においては、待機位置イと被押圧部２０との間に傾斜した案内面３１が設けられているため、待機位置イと被押圧部２０との間に段差があったとしても押圧ローラ２２を円滑に容易に移動させることができる。また、回動軸２５には規制部材３２が設けられているため、板バネ部材２６の曲面部２６ｃが反対側に屈曲するのを防止することができる。   Further, in the pressing and holding mechanism 23, the inclined guide surface 31 is provided between the standby position A and the pressed part 20, so that there is a step between the standby position A and the pressed part 20. As a result, the pressing roller 22 can be moved smoothly and easily. Further, since the restricting member 32 is provided on the rotating shaft 25, the curved surface portion 26c of the leaf spring member 26 can be prevented from bending to the opposite side.

キャリア３の蓋３ｂ及び扉１４が開放されると、ウエハｗの移載作業が開始される。この移載作業は、移載機構１８がキャリア３内からウエハｗを取出し、ノッチ整列機構１５を経由してボート４に順次搭載することにより行われる。移載作業が終了すると、ボート４を熱処理炉５内に搬入してウエハｗに所定の熱処理を施した後、ボート４をローディングエリアＳｂに搬出し、移載機構１８によりボート４から移載台１０上の空のキャリア３に処理後のウエハｗが戻され、キャリア３は搬送機構１２及び移動機構１１を介して載置台８上まで搬出される。   When the lid 3b and the door 14 of the carrier 3 are opened, the transfer operation of the wafer w is started. This transfer operation is performed by the transfer mechanism 18 taking out the wafers w from the carrier 3 and sequentially mounting them on the boat 4 via the notch alignment mechanism 15. When the transfer operation is completed, the boat 4 is loaded into the heat treatment furnace 5 and the wafer w is subjected to a predetermined heat treatment, and then the boat 4 is unloaded to the loading area Sb and transferred from the boat 4 by the transfer mechanism 18. The processed wafer w is returned to the empty carrier 3 on the substrate 10, and the carrier 3 is unloaded onto the mounting table 8 via the transfer mechanism 12 and the moving mechanism 11.

以上のように処理装置ないし処理方法によれば、キャリア３の前面両側背面部の被押圧部２０に側方から押圧保持機構２３の押圧ローラ２２を乗り上げさせてキャリア３を開口部１３に押圧させた状態に保持するため、隔壁６の扉開放時におけるローディングエリアＳｂ側の圧力によるキャリア３の傾きを防止することができ、キャリア３の傾きに起因する各種の不具合を解消することができ、更にキャリア３内の不活性ガス置換特性の改善が見込まれる。   As described above, according to the processing apparatus or the processing method, the pressing roller 22 of the pressing holding mechanism 23 rides on the pressed parts 20 on the both sides of the front surface of the carrier 3 from the side to press the carrier 3 against the opening 13. Therefore, the carrier 3 can be prevented from tilting due to the pressure on the loading area Sb side when the door of the partition wall 6 is opened, and various problems caused by the tilt of the carrier 3 can be eliminated. Improvement of the inert gas replacement characteristics in the carrier 3 is expected.

前記押圧保持機構２３は、前記隔壁６にブラケット２４を介して回動自在に支持された垂直の回動軸２５と、該回動軸２５からその半径方向に延出され先端に保持した押圧ローラ２２を前方へ押圧付勢する板バネ部材２６と、前記回動軸２５を回動する駆動部であるエアシリンダ２７と、を有しているので、簡単な構造で、充分な押圧保持力を発揮することができ、小型化及びコストの低減が図れる。   The pressing and holding mechanism 23 includes a vertical rotating shaft 25 rotatably supported on the partition wall 6 via a bracket 24, and a pressing roller extending from the rotating shaft 25 in the radial direction and held at the tip. Since the plate spring member 26 that presses and urges 22 forward and the air cylinder 27 that is a drive unit that rotates the rotating shaft 25 are provided, a sufficient pressure holding force can be obtained with a simple structure. This can be achieved, and miniaturization and cost reduction can be achieved.

前記回動軸２５には、それぞれ板バネ部材２６を介して前記押圧ローラ２２が少なくとも上下一対設けられているため、少なくとも計４つの板バネ部材２６のバネ力によりローディングエリアＳｂ側の不活性ガスの圧力に充分に耐えることができる。前記ローディングエリアＳｂの雰囲気は、不活性ガスであり、且つ搬入領域Ｓａの圧力よりも高い圧力に設定されているため、気密性に優れ、外部からのパーティクルの浸入を防止することができると共に大気から不活性ガスへの置換時間を短縮することができ、酸素濃度の上昇を抑え、ウエハ表面の自然酸化膜の形成を防止することができる。前記押圧保持機構は、隔壁におけるキャリアの両側に設置されるため、キャリアの上方に設置される特許文献２の押え部材と異なり、設置スペースを容易に確保することができる。   Since the rotation shaft 25 is provided with at least a pair of upper and lower pressing rollers 22 via leaf spring members 26, the inert gas on the loading area Sb side is caused by the spring force of at least four leaf spring members 26 in total. Can sufficiently withstand the pressure of Since the atmosphere of the loading area Sb is an inert gas and is set to a pressure higher than the pressure of the loading area Sa, it is excellent in air tightness and can prevent the entry of particles from the outside and the atmosphere. It is possible to shorten the replacement time from the inert gas to the inert gas, suppress an increase in oxygen concentration, and prevent the formation of a natural oxide film on the wafer surface. Since the press holding mechanism is installed on both sides of the carrier in the partition wall, unlike the press member of Patent Document 2 installed above the carrier, an installation space can be easily secured.

図６は本発明の他の実施の形態の要部を概略的に示す斜視図である。本実施の形態において、前記実施の形態と同一部分は同一符号を付して説明を省略する。本実施の形態における押圧保持機構２３は、取付基板２４ｂにリニアガイド３５を介して左右方向にスライド自在に設けられた水平移動部材３６と、該水平移動部材３６に板バネ部材２６を介して設けられた押圧ローラ２２と、水平移動部材３６を水平方向に進退移動させる駆動部であるエアシリンダ２７とから主に構成されている。前記水平移動部材３６は上下に一対間隔をおいて設けられ、上下の水平移動部材３６は連結部材３７を介して互いに連結されている。   FIG. 6 is a perspective view schematically showing a main part of another embodiment of the present invention. In the present embodiment, the same parts as those of the above embodiment are denoted by the same reference numerals and description thereof is omitted. The pressing and holding mechanism 23 in the present embodiment is provided with a horizontal moving member 36 that is slidable in the left-right direction via a linear guide 35 on the mounting substrate 24b, and a plate spring member 26 that is provided on the horizontal moving member 36. The pressure roller 22 and the air cylinder 27, which is a drive unit for moving the horizontal moving member 36 forward and backward in the horizontal direction, are mainly configured. The horizontal moving members 36 are provided at a pair above and below at an interval, and the upper and lower horizontal moving members 36 are connected to each other via a connecting member 37.

エアシリンダ２７の駆動により水平移動部材３６をキャリア側にスライド移動させると、水平移動部材３６の前進方向に板バネ部材２６を介して設けられた押圧ローラ２２がキャリア３の側方からフランジ部３ｃの被押圧部２０に接近して該被押圧部２０に乗り上げ、板バネ部材２６のバネ力で被押圧部２０を押圧保持するように構成されている。本実施の形態の板バネ部材２６は、湾曲されておらず、直線状に形成されている。本実施の形態によっても前記実施の形態と同様の効果を奏することができる。   When the horizontal movement member 36 is slid to the carrier side by driving the air cylinder 27, the pressing roller 22 provided via the leaf spring member 26 in the forward movement direction of the horizontal movement member 36 is moved from the side of the carrier 3 to the flange portion 3c. The pressed portion 20 approaches the pressed portion 20 and is pushed and held by the spring force of the leaf spring member 26. The leaf spring member 26 of the present embodiment is not curved and is formed in a straight line. According to the present embodiment, the same effects as those of the above embodiment can be obtained.

以上、本発明の実施の形態を図面により詳述してきたが、本発明は前記実施の形態に限定されるものではなく、本発明の要旨を逸脱しない範囲での種々の設計変更等が可能である。例えば、ローディングエリアには不活性ガスまたは清浄乾燥空気がウエハの処理工程に応じて選択的に供給可能に構成されていてもよい。また、前記駆動部としては、モータであってもよい。   Although the embodiments of the present invention have been described in detail with reference to the drawings, the present invention is not limited to the above-described embodiments, and various design changes and the like can be made without departing from the scope of the present invention. is there. For example, the loading area may be configured so that an inert gas or clean dry air can be selectively supplied according to a wafer processing step. Further, the drive unit may be a motor.

本発明を縦型熱処理装置に適用した実施の形態を示す縦断面図である。It is a longitudinal cross-sectional view which shows embodiment which applied this invention to the vertical heat processing apparatus. 要部を概略的に示す斜視図である。It is a perspective view which shows the principal part roughly. 同要部を概略的に示す側面図である。It is a side view which shows the principal part roughly. 同要部の概略的に示す平面図である。It is a top view which shows schematically the principal part. 同要部の拡大図である。It is an enlarged view of the principal part. 本発明の他の実施の形態の要部を概略的に示す斜視図である。It is a perspective view which shows roughly the principal part of other embodiment of this invention. 従来の処理装置の要部を概略的に示す説明図である。It is explanatory drawing which shows the principal part of the conventional processing apparatus roughly.

符号の説明Explanation of symbols

１ 縦型熱処理装置（処理装置）
３ キャリア（収納容器）
Ｓａ 搬入領域
Ｓｂ ローディングエリア（移載領域）
ｗ 半導体ウエハ（被処理体）
６ 隔壁
１０ 移載台（載置部）
１３ 開口部
１４ 扉
２０ 被押圧部
２２ 押圧ローラ
２３ 押圧保持機構
２５ 回動軸
２６ 板バネ部材
２７ エアシリンダ（駆動部）
1 Vertical heat treatment equipment (treatment equipment)
3 Carrier (storage container)
Sa carry-in area Sb loading area (transfer area)
w Semiconductor wafer (object to be processed)
6 Bulkhead 10 Transfer table (mounting part)
DESCRIPTION OF SYMBOLS 13 Opening part 14 Door 20 Pressed part 22 Press roller 23 Press holding mechanism 25 Rotating shaft 26 Leaf spring member 27 Air cylinder (drive part)

Claims (5)

複数の被処理体が収納され前面の取出口が蓋により密閉された収納容器を搬入する搬入領域と、該搬入領域とは異なる雰囲気に維持された移載領域と、これら両領域を仕切る隔壁と、該隔壁に形成された開口部と、この開口部を開閉する扉と、前記収納容器を搬入領域の前記開口部近傍に載置する載置部と、を備え、前記収納容器を載置部に載置させた後開口部に当接させ、前記扉及び蓋を開いて収納容器内の被処理体を移載領域側に搬送して処理する処理装置において、
前記収納容器の前面両側背面部に被押圧部を設け、前記隔壁に、前記被押圧部に側方から乗り上げて収納容器を開口部に押圧させた状態に保持する押圧ローラを有する押圧保持機構を設けたことを特徴とする処理装置。 A carry-in area for carrying a storage container in which a plurality of objects to be processed are stored and a front outlet is sealed with a lid; a transfer area maintained in an atmosphere different from the carry-in area; and a partition wall that partitions both the areas An opening formed in the partition wall, a door that opens and closes the opening, and a mounting unit that mounts the storage container in the vicinity of the opening in the carry-in area. In the processing apparatus for bringing the object to be processed in the storage container into the transfer region side for processing by bringing the object into contact with the opening after being placed on the door and opening the door and lid,
A pressing holding mechanism having a pressing roller that is provided with pressed portions on both front and back sides of the storage container, and that holds the storage container in a state of pressing the receiving container against the opening by riding on the pressed portion from the side; A processing apparatus characterized by being provided. 前記押圧保持機構は、前記隔壁にブラケットを介して回動自在に支持された垂直の回動軸と、該回動軸からその半径方向に延出され先端に保持した押圧ローラを前方へ押圧付勢する板バネ部材と、前記回動軸を回動する駆動部と、を有していることを特徴とする請求項１記載の処理装置。   The pressing and holding mechanism presses a vertical rotating shaft that is rotatably supported by the partition wall via a bracket, and a pressing roller that extends from the rotating shaft in the radial direction and is held at the tip. The processing apparatus according to claim 1, further comprising a leaf spring member that urges and a drive unit that rotates the rotation shaft. 前記回動軸には、それぞれ板バネ部材を介して前記押圧ローラが少なくとも上下一対設けられていることを特徴とする請求項２記載の処理装置。   The processing apparatus according to claim 2, wherein at least one pair of the upper and lower pressing rollers is provided on each of the rotating shafts via a leaf spring member. 前記移載領域の雰囲気は、不活性ガスであり、且つ搬入領域の圧力よりも高い圧力に設定されていることを特徴とする請求項１ないし３のいずれかに記載の処理装置。   The processing apparatus according to claim 1, wherein the atmosphere in the transfer area is an inert gas and is set to a pressure higher than the pressure in the carry-in area. 複数の被処理体が収納され前面の取出口が蓋により密閉された収納容器を搬入する搬入領域と、該搬入領域とは異なる雰囲気に維持された移載領域と、これら両領域を仕切る隔壁と、該隔壁に形成された開口部と、この開口部を開閉する扉と、前記収納容器を搬入領域の前記開口部近傍に載置する載置部と、を備え、前記収納容器を載置部に載置させた後開口部に当接させ、前記扉及び蓋を開いて収納容器内の被処理体を移載領域側に搬送して処理する処理方法において、
前記収納容器の前面両側背面部に被押圧部を設け、該被押圧部に側方から押圧ローラを乗り上げさせて収納容器を開口部に押圧させた状態に保持することを特徴とする処理方法。
A carry-in area for carrying a storage container in which a plurality of objects to be processed are stored and a front outlet is sealed with a lid; a transfer area maintained in an atmosphere different from the carry-in area; and a partition wall that partitions both the areas An opening formed in the partition wall, a door that opens and closes the opening, and a mounting unit that mounts the storage container in the vicinity of the opening in the carry-in area. In the processing method for bringing the object to be processed in the storage container into the transfer area side and processing by bringing it into contact with the opening after being placed on, opening the door and lid, and processing
A processing method comprising: providing a pressed portion on both front and back surfaces of the storage container; and holding a pressure roller on the pressed portion from the side to hold the storage container pressed against the opening.
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098121A (en) * 2008-10-16 2010-04-30 Tokyo Electron Ltd Processing apparatus and processing method
JP2015159185A (en) * 2014-02-24 2015-09-03 東京エレクトロン株式会社 Substrate processing device and substrate processing method
JP2019062104A (en) * 2017-09-27 2019-04-18 Tdk株式会社 Load port device and driving method of load port device
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007711B1 (en) * 2008-05-19 2011-01-13 주식회사 에스에프에이 Plasma processing apparatus
EP2522028B1 (en) * 2010-01-08 2018-03-28 KLA-Tencor Corporation Dual tray carrier unit
JP7428959B2 (en) * 2019-10-07 2024-02-07 Tdk株式会社 Load port device and method of driving the load port device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5443348A (en) * 1993-07-16 1995-08-22 Semiconductor Systems, Inc. Cassette input/output unit for semiconductor processing system
FR2747111B1 (en) * 1996-04-03 1998-04-30 Commissariat Energie Atomique COUPLING SYSTEM FOR CONFINED TRANSFER OF A FLAT OBJECT FROM A CONTAINMENT BOX TO AN OBJECT PROCESSING UNIT
US5980195A (en) * 1996-04-24 1999-11-09 Tokyo Electron, Ltd. Positioning apparatus for substrates to be processed
US6501070B1 (en) * 1998-07-13 2002-12-31 Newport Corporation Pod load interface equipment adapted for implementation in a fims system
JP2987148B1 (en) * 1999-01-26 1999-12-06 国際電気株式会社 Substrate processing equipment
US7140512B2 (en) * 2004-01-20 2006-11-28 Taiwan Semiconductor Manufacturing Co. Interlocking lid for wet bench
CN101044074B (en) * 2004-08-19 2014-04-02 布鲁克斯自动化公司 Reduced capacity carrier and method of use
FR2874744B1 (en) * 2004-08-30 2006-11-24 Cit Alcatel VACUUM INTERFACE BETWEEN A MINI-ENVIRONMENT BOX AND EQUIPMENT

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010098121A (en) * 2008-10-16 2010-04-30 Tokyo Electron Ltd Processing apparatus and processing method
US8414242B2 (en) 2008-10-16 2013-04-09 Tokyo Electron Limited Processing apparatus and processing method
JP2015159185A (en) * 2014-02-24 2015-09-03 東京エレクトロン株式会社 Substrate processing device and substrate processing method
US9666464B2 (en) 2014-02-24 2017-05-30 Tokyo Electron Limited Substrate processing apparatus and substrate processing method
JP2021068919A (en) * 2015-08-04 2021-04-30 シンフォニアテクノロジー株式会社 Load port
JP7193748B2 (en) 2015-08-04 2022-12-21 シンフォニアテクノロジー株式会社 load port
JP2019062104A (en) * 2017-09-27 2019-04-18 Tdk株式会社 Load port device and driving method of load port device

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