JP2006108348A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can transport the processed substrate to the substrate processing apparatus of the next step, without being exposed to external air, and prevents formation of an oxide film onto a processing surface and adhesion of particles. <P>SOLUTION: The substrate processing apparatus 19 comprises a processing chamber, in which a substrate 39 is retained by a substrate-retaining tool 35 for processing, a standby chamber 24 consecutively provided to the lower side of the processing chamber, an elevating means 34 for elevating the substrate retaining tool 35 between the processing chamber and the standby chamber, a substrate housing container 21 for housing the substrate, and a substrate transfer unit 37, which is disposed in the standby chamber for transporting the substrate between the substrate housing container and the substrate-retaining tool. A plurality of sets of the substrate processing apparatus are juxtaposed, and the standby chamber of the one substrate processing apparatus is interconnected with the standby chamber of the other substrate processing apparatus via a gate valve 125. In the substrate processing apparatus, the substrate transfer unit of one substrate processing apparatus can transfer the substrate from the substrate-retaining tool of the one substrate processing apparatus, to the substrate-retaining tool of the other substrate processing apparatus. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a substrate processing apparatus for performing processing such as generation of a thin film on a substrate such as a silicon wafer.

  As the substrate processing apparatus, there are a batch type substrate processing apparatus that processes a required number of sheets at once, or a single wafer type substrate processing apparatus that processes one or a plurality of sheets individually. For example, as a batch type substrate processing apparatus, there is a vertical type substrate processing apparatus provided with a vertical type reaction furnace.

  The substrate processing apparatus disclosed in Patent Document 1 will be briefly described with reference to FIGS.

  A standby chamber, that is, a load lock chamber 2 is hermetically connected to the lower side of the processing furnace 1 having a reaction chamber, and a gate valve 3 is provided between the load lock chamber 2 and the processing furnace 1. A gate valve 4 is also provided on the side surface of 2. A boat elevator (not shown) is accommodated in the load lock chamber 2, and the boat 5 is moved up and down by the boat elevator, and the boat 5 is loaded into and out of the processing furnace 1 from the load lock chamber 2. Loading).

  A boat exchange device 6 is provided adjacent to the load lock chamber 2.

  The boat exchanging device 6 has two sets of transfer tables 7 and 8 on which the boat 5 can be placed. The transfer tables 7 and 8 are placed on the base table 9 in the left-right direction (X direction) in FIG. It is slidably provided. The base table 9 is provided so as to be slidable in the vertical direction (Y direction) with respect to the paper surface of FIG.

  The transfer tables 7 and 8 can insert the boat 5 mounted through the gate valve 4 into the load lock chamber 2, and cooperate with the boat elevator to support the boat elevator and the transfer table. The boat 5 can be transferred between 7 and 8.

  A cassette shelf 11 is provided facing the boat exchange device 6, and a wafer transfer device 12 is provided between the cassette shelf 11 and the boat exchange device 6. The wafer transfer device 12 includes a transfer machine 13 and a transfer machine elevator 14 that can move forward and backward, and a cassette of the cassette shelf 11 in cooperation with the transfer machine elevator 14 and the transfer machine 13. 15 and the boat 5 on the transfer tables 7 and 8 transfer wafers.

  Exhaust pumps 16 and 17 are connected to the processing furnace 1 and the load lock chamber 2, respectively, and the inside is evacuated.

  The substrate processing in the above substrate processing apparatus will be described.

  An external conveyance device (not shown) or an operator conveys the cassette 15 and stores it in the cassette shelf 11. The wafer transfer device 12 transfers the wafers in the cassette 15 to the boat 5 on the boat exchange device 6. When one batch of unprocessed wafers is transferred to the boat 5, the gate valve 4 is opened, and the boat exchange device 6 transfers the boat 5 to a boat elevator (not shown). With the gate valve 3 and the gate valve 4 closed, the inside of the load lock chamber 2 is depressurized by the exhaust pump 17 to be the same pressure as the processing furnace 1.

  The gate valve 3 is opened, the boat 5 is loaded into the processing furnace 1 by a boat elevator, the reaction gas is introduced into the processing furnace 1 while the inside of the processing furnace 1 is heated, and the exhaust pump 16 The wafers evacuated and held on the boat 5 are subjected to necessary processing such as thin film formation, impurity diffusion, and etching.

  When the processing is completed, the boat 5 is lowered by the boat elevator, unloaded from the processing furnace 1, the gate valve 3 is closed, and the load lock chamber 2 is gas purged.

  During the substrate processing in the processing furnace 1, an unprocessed wafer is transferred to another boat 5 of the boat exchange device 6 by the wafer transfer device 12 and is on standby.

  After the same pressure as the outside, the gate valve 4 is opened. When the boat 5 holding processed wafers is taken out through the gate valve 4 by the boat changing device 6, the boat 5 holding unprocessed wafers is transferred to the boat elevator, and the gate valve 4 is closed. The wafer processing is repeated.

  When the processed wafer is cooled to a required temperature, the processed wafer is transferred from the boat 5 to the cassette 15 of the cassette shelf 11 by the wafer transfer device 12. Then, the cassette 15 storing the processed wafer is carried out to the outside.

  In recent years, as semiconductor devices have become increasingly finer, the generation of fine particles or natural oxide films has affected the quality of semiconductor devices, and the substrate transport space within the substrate processing apparatus has become airtight. Or an inert gas atmosphere to prevent the substrate from being contaminated by particles in the substrate processing apparatus and from generating a natural oxide film on the substrate.

  Further, the cassette 15 is a hermetically sealed substrate storage container, and the substrate is stored in the cassette 15 for transporting the substrate in the atmosphere inside the substrate processing apparatus, storing the substrate, and further transporting the substrate outside the substrate processing apparatus. This prevents the substrate from being contaminated with particles.

  However, the sealed cassette 15 prevents the substrate from particle contamination. However, since the substrate is stored in an air atmosphere, the oxygen concentration and the water concentration are the same as the air atmosphere (for example, 23% oxygen and 1% water). It was not possible to prevent the formation of an oxide film on the substrate surface. In particular, when a substrate is processed by one substrate processing apparatus and then transferred to a substrate processing apparatus that performs the next process, a natural oxide film may be generated on the substrate surface after processing. Increased contact resistance adversely affects the quality of the semiconductor device.

Japanese Unexamined Patent Publication No. 2000-21798

  In view of such circumstances, the present invention allows a processed substrate to be transported to a substrate processing apparatus in the next process without being exposed to the outside air, and prevents the formation of an oxide film or the adhesion of particles to the processing surface. A substrate processing apparatus is provided.

  The present invention provides a processing chamber in which a substrate processing apparatus holds and processes a substrate on a substrate holder, a standby chamber provided below the processing chamber, and the processing chamber and the standby chamber. Elevating means for elevating and lowering the substrate holder, a substrate storage container for storing the substrate, a substrate transfer machine disposed in the standby chamber and transporting the substrate between the substrate storage container and the substrate holder, A plurality of the substrate processing apparatuses are arranged in parallel, the standby chamber of one substrate processing apparatus and the standby chamber of the other substrate processing apparatus are communicated via a gate valve, and the substrate transfer of one substrate processing apparatus is performed The apparatus relates to a substrate processing apparatus capable of transferring a substrate from a substrate holder of one substrate processing apparatus to a substrate holder of the other substrate processing apparatus.

  According to the present invention, the substrate processing apparatus holds the substrate on the substrate holder for processing, the standby chamber connected below the processing chamber, and between the processing chamber and the standby chamber. And a substrate transfer unit disposed in the standby chamber and transporting the substrate between the substrate storage container and the substrate holder. A plurality of the substrate processing apparatuses are arranged in parallel, the standby chamber of one substrate processing apparatus and the standby chamber of the other substrate processing apparatus are communicated via a gate valve, and the substrate of one substrate processing apparatus Since the transfer machine can transfer the substrate from the substrate holder of one substrate processing apparatus to the substrate holder of the other substrate processing apparatus, the processed substrate is cleaned without being exposed to the outside air outside the substrate processing apparatus. The substrate can be transferred to the substrate processing equipment for the next process in the atmosphere. It can suppress the growth of oxide film on the surface of the substrate, and exhibits excellent effects such can prevent adhesion of particles.

  The best mode for carrying out the present invention will be described below with reference to the drawings.

  The present invention is configured by connecting a plurality of substrate processing apparatuses.

  1 and 2 show a case where two sets of substrate processing apparatuses 19a and 19b are connected in series. Since the substrate processing apparatus 19a and the substrate processing apparatus 19b have the same configuration, the substrate processing apparatus 19a will be described below.

  A transfer stage 22 is provided on the front surface of the housing 20 forming a sealed space, and the transfer stage 22 can transfer a pod (hereinafter referred to as a cassette 21) which is a substrate storage container having a sealed structure. A cassette transfer space 23 is formed inside the casing 20 adjacent to the transfer stage 22, and a clean unit (not shown) provided in the casing 20 allows clean air to flow into the cassette transfer space 23. Is formed.

  A load lock chamber 24 that is an airtight standby chamber is connected to the rear lower portion of the housing 20, and the load lock chamber 24 communicates with the cassette transfer space 23 via an atmospheric gate valve 25.

  In the cassette transport space 23, a cassette transport machine 26 is provided facing the transfer stage 22, and a cassette receiving stand 27 is provided at a position facing the transfer stage 22 via the cassette transport machine 26, The cassette cradle 27 is provided with a pod opener 29 which is a cassette opening / closing means connected to the atmospheric gate valve 25. A cassette shelf 28 located above the cassette cradle 27 is provided on the upper surface of the load lock chamber 24.

  A furnace storage unit 31 is provided on the rear side of the cassette shelf 28, and a processing furnace 32 as a substrate processing chamber is stored in the furnace storage unit 31, and the processing furnace 32 is connected to the load via a furnace port gate valve 33. It communicates with the lock chamber 24. The load lock chamber 24 is provided with an exhaust pump (not shown) as shown in FIG. 11, and is connected to a gas supply line (not shown) for supplying an inert gas such as nitrogen gas.

  Inside the load lock chamber 24, a boat elevator 34, which is a substrate holder lifting / lowering means, is provided below the processing furnace 32, and the boat elevator 34 mounts a boat 35, which is a substrate holder, in a replaceable manner. The boat 35 can be moved up and down to load / unload the processing furnace 32. The boat 35 holds wafers 39 in a horizontal posture in multiple stages, and the wafers 39 are loaded into the furnace storage unit 31 while being held in the boat 35 and are subjected to a required process.

  A boat changer 30 which is a substrate holder exchanging means and a holder table 36 are provided on the side of the boat elevator 34, and a substrate which is a substrate transfer means is provided between the boat elevator 34 and the atmospheric gate valve 25. A transfer machine 37 is provided.

  The casing 20 is provided with a loading lock door 40 having an airtight structure at a position facing the unloaded boat 35, and maintenance work can be performed by opening the loading lock door 40.

  The cassette 21 is carried into and out of the transfer stage 22 by an external transfer device (not shown) such as AGV or OHT. The cassette transporter 26 includes a cassette transport arm 38 that can traverse, move up and down, and can move back and forth. The cassette transport arm 38 can be moved from the transfer stage 22 to the cassette cradle 27 or The cassette 21 is transported between the cassette shelves 28 or between the cassette cradle 27 and the cassette shelves 28.

  The cassette shelf 28 has a plurality of rotatable shelves 41 (two in the figure), and a plurality of cassettes 21 can be placed on each shelf.

  The substrate transfer machine 37 will be described with reference to FIGS.

  A cylindrical drive unit support 42 is airtightly attached from the bottom of the load lock chamber 24, and a drive mechanism unit 43 of the substrate transfer machine 37 is attached to the drive unit support 42. A cylindrical support member 44 is attached to the lower surface of the drive unit support 42, an upper base 45 is attached to the lower end of the cylindrical support member 44, and a lower base 47 is attached to the upper base 45 via struts 46, 46. Screw shafts 48, 48 are rotatably provided between the upper base 45 and the lower base 47, and the screw shafts 48, 48 are connected by a timing belt 51 via gear boxes 49, 49, and a motor 50 Are synchronized with each other. An elevating base 52 is provided on the column 46 so as to be movable up and down, and the elevating base 52 is screwed to the screw shafts 48 and 48 via nut blocks (not shown). A double shaft 53 is erected on the elevating base 52, and a flange 55 is rotatably and airtightly provided on the upper end of the double shaft 53 via a magnetic seal portion 54. The flange 55 and the upper base 45 are provided. A bellows seal member 56 is airtightly attached therebetween, and the flange 55 can be moved up and down through the upper part of the drive support 42.

  A wafer transfer arm 57 is provided at the upper end of the double shaft 53, and the entire wafer transfer arm 57 is rotated by individually rotating an outer shaft and an inner shaft (not shown) of the double shaft 53. At the same time, the wafer transfer arm 57 expands and contracts.

  Accordingly, the sliding portion and the rotating portion of the column 46, the screw shaft 48, etc. are separated from the inside of the load lock chamber 24 by the bellows seal member 56, and the load lock chamber by the drive mechanism portion 43 is separated. 24 prevents contamination inside. Further, since the load lock chamber 24 is provided with the drive mechanism portion 43 outside, the volume of the load lock chamber 24 can be reduced, and steps such as decompression and decompression can be performed in a short time.

  Next, the boat elevator 34 will be described with reference to FIGS.

  An elevator lifting / lowering mechanism 59 is provided on the upper surface of the load lock chamber 24. The elevator lifting / lowering mechanism 59 includes a lifting / lowering block 62 that can be lifted / lowered on a guide shaft 61. The lifting / lowering block 62 includes a nut block ( The screw rod 64 is screwed through a not-shown screw, and the screw rod 64 is rotated by a lifting / lowering motor 63 via a speed reducer 60. The screw rod 64 is rotated by the lifting / lowering motor 63 so that the lifting / lowering is performed. The block 62 can be moved up and down.

  The lifting block 62 is provided with a lifting shaft 65 that extends through the ceiling of the load lock chamber 24 and extends into the load lock chamber 24. A bellows 66 is provided, and the penetrating portion of the elevating shaft 65 has an airtight structure. The bellows 66 has a sufficient amount of expansion / contraction that can accommodate the amount of elevation of the elevating block 62, and the inner diameter of the bellows 66 is sufficiently larger than the outer shape of the elevating shaft 65, so There is no contact.

  An elevator arm 67 is provided at the lower end of the lifting shaft 65, and a roller 68 is rotatably provided on the elevator arm 67. A guide rail 69 is attached to a portion of the inner wall surface of the load lock chamber 24 that faces the lifting shaft 65, and the roller 68 rolls on the guide rail 69.

  The elevator arm 67 is provided with a furnace port lid 71 capable of hermetically closing the furnace port part of the processing furnace 32. The furnace mouth lid 71 functions as a boat cradle, and the boat 35 is detachably mounted on the furnace mouth lid 71.

  Thus, by driving the lifting motor 63, the elevator arm 67 is lifted and lowered via the lifting shaft 65, and the boat 35 is loaded / unloaded to the processing furnace 32 by the lifting / lowering of the elevator arm 67. It has become. Further, since the elevator arm 67 is guided by the guide rail 69 via the roller 68, the bending of the lifting shaft 65 is suppressed, and the boat due to the bending of the lifting shaft 65 accompanying the lifting operation of the boat 35 is suppressed. 35 horizontal displacements are prevented.

  The elevator arm 67 has an airtight hollow structure, and a boat rotating means (not shown) is provided in the elevator arm 67. The boat rotating means is a boat rotating shaft (through the furnace port lid 71). (Not shown), and the boat 35 can be rotated via the boat rotation shaft.

  A power feeding cable and a drive control cable (not shown) for the boat rotating means are wired through the lifting shaft 65. Further, a cooling flow path (not shown) for cooling the seal of the furnace port lid 71 and the boat rotating means is formed, and a cooling water pipe (not shown) for circulating the cooling water through the cooling flow path. 2) is also piped through the elevating shaft 65. The cooling water pipe is made of a material such as metal that does not cause contamination such as metal contamination on the wafer.

  The boat changer 30 will be described with reference to FIGS.

  The drive mechanism portion 72 of the boat changer 30 is provided outside the load lock chamber 24, the drive mechanism portion 72 is provided through the bottom of the load lock chamber 24, and the through portion is hermetically sealed with a magnetic seal. ing.

  A bearing 73 having an airtight structure with a magnetic seal passes through the bottom of the load lock chamber 24 and is airtight. A double shaft 74 is magnetically sealed on the bearing 73 and is rotatably provided.

  An upper end portion of the outer shaft 75 of the double shaft 74 projects into the load lock chamber 24, and a lower end portion projects out of the load lock chamber 24. The upper end portion of the inner shaft 76 protrudes from the upper end of the outer shaft 75, and the lower end portion protrudes from the lower end of the outer shaft 75.

  A pulley, for example, a timing gear 77 is fitted to the lower end portion of the outer shaft 75, and the timing gear 77 is a timing gear 81 provided on the output shaft of the first motor 79 via a power transmission member, for example, a timing belt 78. It is connected with. A pulley, for example, a timing gear 82 is fitted to the lower end portion of the inner shaft 76, and the timing gear 82 is a timing provided on the output shaft of the second motor 84 via a power transmission member, for example, a timing belt 83. The gear 85 is connected. The first motor 79 and the second motor 84 are independently driven, and the outer shaft 75 and the inner shaft 76 are individually rotated.

  A first boat exchange arm 86 as a boat support is fixed to the upper end of the outer shaft 75, and a second boat exchange arm 87 as a boat support is fixed to the upper end of the inner shaft 76. The tip ends of the first boat exchange arm 86 and the second boat exchange arm 87 have semi-arc shaped boat placement portions 86a and 87a, respectively, and the inner edge portions of the boat placement portions 86a and 87a are concave. It is a step. The boat 35 is positioned and placed at the concave step, and is supported by the first boat exchange arm 86 and the second boat exchange arm 87, respectively. Further, the rotation of the outer shaft 75 and the inner shaft 76 causes the first boat exchange arm 86 and the second boat exchange arm 87 to rotate without interference.

  With reference to FIG. 9, the holder table 36 will be described.

  The drive mechanism 88 of the holder placing stand 36 is provided below the load lock chamber 24 and separated from the inside of the load lock chamber 24.

  A frame 89 is provided on the lower surface of the load lock chamber 24, a plurality of pillars (not shown) are attached to the frame 89 via an elevating base 95, and a plurality of screw shafts 91 and 91 are rotatably provided. The screw shafts 91 and 91 have the same structure as that of the drive mechanism unit 43, and are connected by a timing belt (not shown) via gear boxes 92 and 92. The gear boxes 92 and 92 are connected to a motor 94. Are synchronized with each other.

  The elevating base 95 is screwed onto the screw shafts 91 and 91 via nut blocks (not shown), and is moved up and down by the rotation of the screw shafts 91 and 91.

  A hollow column 96 is erected in an airtight manner on the elevating base 95, and the column 96 passes through the bottom of the load lock chamber 24 and the upper end protrudes into the load lock chamber 24. A rotary shaft (not shown) is rotatably provided in the boat, and a boat receiving flange 98 is attached to the upper end of the rotary shaft. The support portion of the rotating shaft is hermetically sealed by a magnetic seal or the like, and the lower end portion of the rotating shaft is connected to a rotary actuator 93 provided on the lower surface of the elevating base 95, such as a motor. Thus, the boat receiving flange 98 is rotated.

  The boat receiving flange 98 has an outer diameter smaller than the inner diameter of the boat mounting portions 86a and 87a, and can be lifted and lowered through the center of the boat mounting portions 86a and 87a.

  A bellows 97 is provided between the elevating base 95 and the lower surface of the load lock chamber 24. The bellows 97 is concentric with the support column 96 and is not in contact with it. In the bellows 97, the upper surface of the boat receiving flange 98 descends below the lower surface of the boat mounting portion 86a, and the lower surface of the boat receiving flange 98 extends above the upper surface of the second boat exchange arm 87. The amount of expansion and contraction is sufficient to rise.

  In addition, a tubular inert gas supply nozzle 99 (see FIG. 2) is provided adjacent to the holder table 36, and the inert gas supply nozzle 99 supplies an inert gas such as nitrogen gas (not shown). Connected to the source. An upper end of the inert gas supply nozzle 99 has a height at least up to the upper end of the boat 35 in a state where the boat 35 is mounted on the holder mounting table 36 and is required on a surface facing the boat 35. Gas discharge holes (not shown) formed at intervals are provided.

  The processing furnace 32 will be described with reference to FIG.

  A furnace port flange 101 is provided on the upper surface of the load lock chamber 24, and an outer tube 102 having a cylindrical shape is erected on the upper end of the furnace port flange 101, and a processing chamber is defined concentrically with the outer tube 102. An inner pipe 103 is disposed, the upper end of the inner pipe 103 is open, and the lower end is supported by the furnace port flange 101.

  A processing gas introduction nozzle 104 communicates with the furnace lid 71, and the processing gas introduction nozzle 104 is connected to a processing gas supply source (not shown) or an inert gas supply source such as nitrogen gas (not shown) via a gas supply line 105. (Not shown). An exhaust pipe 106 communicates with the furnace port flange 101 above the lower end of the inner pipe 103, and the exhaust pipe 106 is connected to an exhaust device (not shown).

  A cylindrical heater unit 107 is disposed concentrically with the outer tube 102, and the heater unit 107 is erected on the heater base 108.

  The elevator arm 67 of the boat elevator 34 is provided with the furnace port cover 71, and the furnace port cover 71 hermetically closes the lower end opening (furnace port) of the furnace port flange 101. A boat rotating device 109 is provided on the lower surface of the furnace port lid 71, and a rotating shaft 111 of the boat rotating device 109 penetrates the furnace port cover 71 in an airtight manner. The boat 35 is placed on a boat pedestal 112 provided at the upper end of the rotating shaft 111.

  The processing state of the wafer 39 processed in the processing furnace 32 is controlled by the main control unit 113. The main control unit 113 includes a temperature control unit 114 that controls the temperature in the furnace, a gas flow rate control unit 115 that controls the flow rate of the processing gas, a pressure control unit 116 that controls the pressure in the outer pipe 102, and the boat rotation. A drive control unit 117 that controls the device 109 is provided.

  A temperature detector 118 is provided between the inner tube 103 and the outer tube 102, the temperature detector 118 detects the temperature in the outer tube 102, and a temperature detection signal is sent to the temperature control unit 114. Entered. A gas flow rate controller 119 is provided in the gas supply line 105 and is controlled to a required gas flow rate by the gas flow rate control unit 115. The exhaust pipe 106 is provided with a pressure detector 121, the exhaust pipe 106 is connected to an exhaust device (not shown) through an exhaust line 122, and the exhaust line 122 is provided with a pressure control valve 123. A pressure detection signal of the exhaust pressure detected by the pressure detector 121 is input to the pressure control unit 116, and the pressure control unit 116 controls the pressure in the outer pipe 102 by controlling the pressure control valve 123. Do.

  Next, the relationship between the substrate processing apparatus 19a and the substrate processing apparatus 19b will be described. 2A and 2B, when distinguishing the components of the substrate processing apparatus 19a from the components of the substrate processing apparatus 19b, reference numerals of the respective components are used. Will be described with a and b attached thereto.

  As shown in FIGS. 2A and 2B, the substrate processing apparatus 19a and the substrate processing apparatus 19b are arranged side by side so that the load lock chamber 24a and the load lock chamber 24b are joined. A connecting gate valve 125 is provided on the joint wall between the load lock chamber 24a and the load lock chamber 24b. When the connecting gate valve 125 is closed, both the load lock chambers 24a and 24b are airtightly closed, When the communication gate valve 125 is opened, both the load lock chambers 24 a and 24 b communicate with each other through the communication gate valve 125. Further, the position of the connection gate valve 125 is such that one substrate transfer machine 37 can transfer the wafer 39 to the boat 35 mounted on the other holder mounting table 36 through the connection gate valve 125. It has become. For example, in FIG. 2, the substrate transfer device 37a of the substrate processing apparatus 19a passes through the communication gate valve 125 to transfer the wafer 39 to the boat 35 mounted on the holder mounting table 36b of the substrate processing apparatus 19b. Transfer is possible. When the substrate transfer device 37b of the substrate processing apparatus 19b performs transfer, the holder mounting table 36b directs the boat 35b toward the substrate transfer device 37b, and the substrate transfer device 37a. When the transfer is performed, the boat 35b is rotated via the boat receiving flange 98b so that the rotation actuator 93b directs the boat 35b toward the substrate transfer machine 37a.

  Hereinafter, an operation when the substrate processing apparatus 19a and the substrate processing apparatus 19b individually perform the same substrate processing or when both the substrate processing apparatuses 19a and 19b independently perform different substrate processing will be described.

  A predetermined number, for example, 25 unprocessed wafers are loaded in the cassette 21 and transferred to the transfer stage 22.

  A cassette 21 is transported to the cassette shelf 28 by the cassette transporter 26, and a required number of cassettes 21 are stored in the cassette shelf 28. The cassette transporter 26 transports the cassette 21 from the cassette shelf 28 or directly from the transfer stage 22 to the cassette cradle 27.

  In the state where the boat 35 is unloaded, the inside of the load lock chamber 24 is purged with an inert gas to be equal to the atmospheric pressure.

  The lid of the cassette 21 is opened by the pod opener 29.

  An empty boat 35 is placed on the boat elevator 34, and the wafers 39 in the cassette 21 on the cassette pedestal 27 are moved by the substrate transfer machine 37 to the boat 35 (hereinafter referred to as the boat 35) of the boat elevator 34. 1 boat 35 '). When the scheduled transfer number exceeds 25, the empty cassette 21 and the cassette 21 loaded with the wafer 39 are sequentially replaced, and the transfer is repeated. An empty boat 35 (hereinafter referred to as a second boat 35 ″) is placed on the holder placing table 36.

  When a predetermined number of wafers 39 are transferred to the first boat 35 ', the atmospheric gate valve 25 is closed, the inside of the load lock chamber 24 is depressurized, and a gas purge is performed with an inert gas. The chamber 24 is brought to the same pressure as the inside of the processing furnace 32, and the oxygen concentration and water concentration are maintained at 0.5 ppm or less.

  The furnace gate valve 33 is opened, and the boat elevator 34 loads the first boat 35 ′ into the processing furnace 32, so that the wafer 39 is processed as required.

  While the wafer 39 is being processed, the load lock chamber 24 is purged with gas and returned to atmospheric pressure. Even in this state, the oxygen concentration and the water concentration are maintained at 0.5 ppm or less in the load lock chamber 24.

  Unprocessed wafers 39 are transferred by the substrate transfer device 37 to the second boat 35 ″ mounted on the holder mounting table 36. When the required number of wafers 39 are transferred to the second boat 35 ″, the atmospheric gate valve 25 is closed, the load lock chamber 24 is evacuated and decompressed, and the same pressure as that in the processing furnace 32 is obtained. In addition, the oxygen concentration and water concentration are maintained at 0.5 ppm or less.

  When the processing in the processing furnace 32 is completed, the inside of the outer pipe 102 is purged with gas, the pressure in the load lock chamber 24 is made equal, and the first boat 35 ′ is unloaded by the boat elevator 34. At the time of unloading, the load lock chamber 24 is in a reduced-pressure inert gas atmosphere, so that a processed wafer that has become high temperature immediately after processing is prevented from being oxidized or contaminated with particles.

  The second boat exchanging arm 87 of the boat changer 30 rotates to the unloaded first boat 35 ′ to place and support the first boat 35 ′. The second boat exchange arm 87 rotates in the reverse direction to move the first boat 35 'to the standby position.

  The motor 94 is driven by the holder table 36, the boat receiving flange 98 is lowered, and the second boat 35 ″ loaded with unprocessed wafers is placed on the first boat exchange arm 86. The

  The first boat exchanging arm 86 moves the second boat 35 ″ onto the lowered furnace mouth cover 71. The furnace cover 71 is slightly raised, and the furnace cover 71 mounts the second boat 35 ″. The first boat exchange arm 86 rotates in the reverse direction and retracts. The second boat 35 ″ is loaded into the processing furnace 32 by the boat elevator 34, and the wafer 39 is processed.

  The second boat exchanging arm 87 is rotated to the holder mounting table 36, the boat receiving flange 98 is raised, and the first boat 35 'is mounted on the boat receiving flange 98. The second boat exchange arm 87 moves backward to the standby position.

  An inert gas such as nitrogen gas is supplied from the inert gas supply nozzle 99, and the inside of the load lock chamber 24 is purged to atmospheric pressure and is placed on the holder table 36 by the supplied inert gas. The processed wafer 39 of the first boat 35 'is cooled.

  When the processed wafer 39 is cooled to a predetermined temperature, the atmospheric gate valve 25 is opened and the lid of the cassette 21 is opened by the pod opener 29.

  The processed wafer 39 is transferred from the first boat 35 ′ to the empty cassette 21 by the substrate transfer device 37. The cassette 21 loaded with the processed wafer 39 is transported to the transfer stage 22 by the cassette transporter 26, and the empty cassette 21 is transported to the cassette cradle 27 by the cassette transporter 26.

  The transfer of the wafer 39 is repeated, and the processed wafer 39 is discharged. The first boat 35 ′ of the holding stand 36 becomes empty, and unprocessed wafers 39 are transferred to the first boat 35 ′ while the wafers 39 are being processed in the processing furnace 32. .

  Thus, the transfer and delivery of the wafer 39 to the boat 35, the loading and unloading of the boat 35 to the processing furnace 32 are repeated, and the processing of the wafer 39 is repeated.

  In the transfer and delivery of the wafer 39 to the boat 35, the loading and unloading of the boat 35 to the processing furnace 32, the wafer transfer operation by the substrate transfer device 37, and the loading of the boat 35 by the boat elevator 34. The unloading operation, the boat changer operation by the boat changer 30 and the lifting / lowering operation of the boat 35 by the holding stand 36 are performed. As described above, the drive mechanism 43 of the substrate transfer device 37 is the magnetic seal. The elevator 54 is separated from the load lock chamber 24 by the bellows 66 and the bellows seal member 56, and the elevator lift mechanism 59 of the boat elevator 34 is separated from the load lock chamber 24 by the bellows 66. The mechanism portion 72 is provided with the load by the magnetic seal of the bearing portion 73. Spaced apart from the click chamber 24, drive mechanism 88 of the retainer rests 36 are isolated from the load lock chamber 24 by the bellows 97. Therefore, organic contamination by the organic grease applied to the sliding portion is prevented, and contamination of the wafer 39 by the splash of grease generated during operation is prevented. In addition, contamination by particles generated during operation of the movable part is prevented.

  Next, processing of the wafer 39 in the processing furnace 32 will be described.

  While heating by the heater unit 107, the temperature in the outer tube 102 is set to a predetermined processing temperature. The temperature in the outer tube 102 is controlled by the temperature detector 118, and the heating state of the heater unit 107 is controlled by the temperature controller 114 so that the processing temperature is maintained.

  An inert gas is supplied to the outer pipe 102 through the gas supply line 105 with the supply amount controlled by the gas flow rate controller 119, and the outer pipe 102 has the same pressure as that in the load lock chamber 24. The When the pressure in the outer tube 102 is made the same as that in the load lock chamber 24, the furnace gate valve 33 is opened, and the first boat 35 ′ is loaded into the processing furnace 32 by the boat elevator 34. The

  The inside of the outer pipe 102 is exhausted from the exhaust line 122, the internal pressure is detected by the pressure detector 121, the pressure is reduced to the processing pressure, and the processing pressure is maintained by the pressure control unit 116.

  The boat rotating device 109 rotates the first boat 35 ′ via the rotating shaft 111, and simultaneously introduces processing gas from the gas supply line 105 via the processing gas introduction nozzle 104. The processing gas rises in the outer tube 102 and is uniformly supplied to the wafer 39.

  The inside of the outer tube 102 during the low pressure CVD process is exhausted through the exhaust line 122, and the pressure inside the outer tube 102 is controlled by the pressure control unit 116 based on the detection result from the pressure detector 121. By controlling the valve 123, the predetermined processing pressure is maintained.

  During the processing of the wafer 39, the inside of the load lock chamber 24 is evacuated. When the processing of the wafer 39 is completed, the inside of the outer tube 102 is evacuated, and the pressure inside the outer tube 102 and the load lock chamber 24 is equalized. The first boat 35 ′ is unloaded by the boat elevator 34.

  Hereinafter, the replacement of the boat 35, the delivery of the wafer 39, and the like are as described above.

  Note that various modes can be considered for the procedures of boat loading, unloading, evacuation of the load lock chamber 24, gas purge, and wafer transfer operation.

  For example, after the wafer processing in the processing furnace 32 is completed, the pressure in the outer tube 102 is made the same as that in the load lock chamber 24, and the first boat 35 'is unloaded. The unloaded first boat 35 ′ is temporarily retracted by the second boat exchange arm 87. In synchronism with the retreat, the atmospheric pressure return gas purge of the load lock chamber 24 is performed, and the first boat 35 ′ is cooled in parallel with the inert gas such as nitrogen gas purged at the retreated position. Is done.

  After the unloaded first boat 35 ′ is retracted, the empty second boat 35 ″ placed on the holder table 36 is lowered by the first boat exchange arm 86. It is transferred to the palate 71.

  When the return to atmospheric pressure of the load lock chamber 24 is completed, the atmospheric gate valve 25 is opened. A cassette 21 loaded with unprocessed wafers 39 is transported to the cassette holder 27, and the wafers 39 are transferred from the cassette 21 to the second boat 35 ″ by the substrate transfer device 37.

  When a predetermined number of wafers 39 have been transferred to the second boat 35 ″, the atmospheric gate valve 25 is closed and the second boat 35 ″ is loaded.

  The second boat exchanging arm 87 is rotated, and the first boat 35 ′ that has been retracted is transferred to the holder placing table 36. After the transfer, the second boat exchange arm 87 is returned to the standby position.

  An empty cassette 21 is transported to the cassette cradle 27, the atmospheric gate valve 25 is opened, and a processed wafer 39 is transferred from the first boat 35 'to the cassette 21 by the substrate transfer device 37. The

  The cassette 21 loaded with the processed wafer 39 is transported to the transfer stage 22 by the cassette transporter 26 and further unloaded by an external transport device (not shown).

  Further, various timings for returning the load lock chamber 24 to the atmospheric pressure are conceivable. For example, when the pressure in the outer tube 102 and the load lock chamber 24 is made equal, The same pressure may be used. Further, after unloading, the furnace gate valve 33 may be closed.

  Next, a description will be given of the case where the substrate processing is performed by the substrate processing apparatus 19b and then the substrate processing of the next process is performed by the substrate processing apparatus 19a. Whether the substrate is processed by the substrate processing apparatus 19b and then unloaded from the cassette 21 of the substrate processing apparatus 19b or the substrate processing of the next process is performed by the substrate processing apparatus 19a is input and selected by an operation unit (not shown). Is possible.

  The loading / unloading of the cassette 21 and the processing in the processing furnace 32 in the substrate processing apparatus 19a and the substrate processing apparatus 19b are the same as the respective substrate processing in the substrate processing apparatus 19a and the substrate processing apparatus 19b. The description is omitted.

  When the wafer 39 processed by the substrate processing apparatus 19b is cooled to a predetermined temperature, the communication gate valve 125 is opened. In addition, the inside of the load lock chamber 24a of the substrate processing apparatus 19a is purged with gas in advance, and the pressure is the same as that of the load lock chamber 24b, and the oxygen concentration and water concentration are maintained at 0.5 ppm or less. In addition, an empty boat 35a is previously placed on the holder placing stand 36a.

  The processed wafer 39 is transferred by the substrate transfer device 37a from the boat 35b of the holder holder 36b to the boat 35a of the holder holder 36a.

  When all the processed wafers 39 are transferred to the boat 35a, the communication gate valve 125 is closed, and the boat 35a is transferred to the boat elevator 34a by the first boat exchange arm 86a, and the boat elevator 34a. Thus, the boat 35a is loaded into the processing furnace 32a and processed.

  Therefore, the processed wafer 39 is not exposed to the outside air by the substrate processing apparatus 19a for performing the next process, and the atmosphere at the time of transfer is maintained at oxygen concentration and moisture concentration of 0.5 ppm or less. Therefore, a natural oxide film is not formed on the substrate.

  In addition to transferring from the boat 35b to the empty boat 35a in the holder mounting table 36a by the substrate transfer machine 37a, the substrate transfer machine 37a to the empty boat 35a in the boat elevator 34a. You may make it transfer from the boat 35b.

  When the load lock chamber 24a and the load lock chamber 24b are made to have the same pressure, the pressure is preferably reduced, and the pressure may be made particularly high vacuum.

  The wafer 39 that has been processed by the substrate processing apparatus 19a is lowered into the load lock chamber 24a by the boat elevator 34a, and further discharged to the cassette 21a by the substrate transfer device 37a. It is conveyed to the outside via the cassette conveyor 26a.

  In the above-described embodiment, the two substrate processing apparatuses 19a and 19b are illustrated as being connected in series. However, the number of connected apparatuses is not limited to two, and each load is not limited to two as described above. A communication gate valve may be provided between the lock chamber and the processed wafer may be transferred from one substrate processing apparatus to the other substrate processing apparatus through the connection gate valve.

(Appendix)
The present invention includes the following embodiments.

  (Supplementary Note 1) A processing chamber for processing a substrate while holding it on a substrate holder, a standby chamber adjacent to the lower side of the processing chamber, and a lift for raising and lowering the substrate holder between the processing chamber and the standby chamber A substrate processing apparatus comprising: means; a substrate storage container disposed in the standby chamber and configured to transport the substrate between the substrate holder and the substrate holder. When the plurality of substrates are arranged in parallel, after the substrate is supplied from the substrate storage container to one of the substrate processing apparatuses, the substrate processed by the one substrate processing apparatus is returned to the substrate storage container. Alternatively, the substrate processing apparatus can be selected to transfer directly to the other substrate processing apparatus without returning to the substrate storage container of the one substrate processing apparatus.

  (Appendix 2) A processing chamber for processing a substrate while holding it on a substrate holder, a standby chamber adjacent to the lower side of the processing chamber, and a lift for raising and lowering the substrate holder between the processing chamber and the standby chamber And a substrate processing apparatus disposed in the standby chamber and provided with a substrate storage container for supplying the substrate and a substrate transfer device for transferring the substrate between the substrate holder and the standby chamber adjacent to each other. A substrate processing system in which a plurality of units are arranged so as to be connected, and an opening is provided on a side surface of each of the standby chambers connected to each other, wherein the substrate is transferred to the opening by at least one of the substrate transfer machines. A substrate processing system, wherein the substrate processing system is configured to be able to transfer between the waiting chambers.

  (Appendix 3) A processing chamber for processing a substrate while holding the substrate on a substrate holder, a standby chamber adjacent to the lower side of the processing chamber, and a lift for raising and lowering the substrate holder between the processing chamber and the standby chamber And a substrate processing apparatus disposed in the standby chamber and provided with a substrate storage container for supplying the substrate and a substrate transfer device for transferring the substrate between the substrate holder and the standby chamber adjacent to each other. A substrate processing system in which a plurality of units are arranged so as to be connected to each other, and an opening is provided on a side surface of each of the standby chambers connected to each other, and the processing of one first substrate processing apparatus among the plurality of units The substrate processing system, wherein the substrate after processing in the chamber is directly transferred from the opening to a standby chamber of the adjacent substrate processing apparatus.

  (Additional remark 4) The substrate processing system of Additional remark 2 or Additional remark 3 provided with the opening-and-closing means which opens and closes the said opening part in either of the said substrate processing apparatuses.

  (Supplementary Note 5) A processing chamber for processing a substrate while holding the substrate on a substrate holder, a heating unit for heating the processing chamber, a gas supply unit for supplying a gas into the processing chamber, and an exhaust unit for exhausting the processing chamber And a standby chamber adjacent to the lower side of the processing chamber, lifting means for moving the substrate holder up and down between the processing chamber and the standby chamber, and a substrate storage that is disposed in the standby chamber and supplies the substrate In a substrate processing apparatus comprising a substrate transfer machine for transferring the substrate between a container and the substrate holder, when a plurality of the substrate processing apparatuses are arranged in parallel, one of the substrate processing apparatuses A substrate processing apparatus capable of transferring the substrate processed by the one substrate processing apparatus to the other substrate processing apparatus without returning the substrate to the substrate storage container after supplying the substrate from the substrate storage container Of semiconductor devices using A step of supplying the substrate from the substrate storage container to the one substrate processing apparatus; a step of transferring the substrate from the substrate storage container to the substrate holder by the substrate transfer machine; A step of transporting the substrate holder holding the substrate from the standby chamber to the processing chamber by the lifting means; a step of heating the processing chamber by the heating means; and the gas supply means in the processing chamber by the gas supply means. A step of supplying a gas; a step of exhausting the processing chamber by the exhaust means; a step of transporting the substrate holder holding the substrate from the processing chamber to the standby chamber by the lifting means; A step of transferring the substrate processed by the substrate processing apparatus to the other substrate processing apparatus without returning the substrate to the substrate storage container. Method.

It is a schematic side view which shows embodiment of this invention. BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic plan view which shows embodiment of this invention, (A) shows the case where 2 substrate processing apparatuses perform a substrate processing separately, (B) transfers a board | substrate between 2 substrate processing apparatuses. Shows the case to do. It is a sectional side view of the board | substrate transfer machine in embodiment of this invention. It is an AA arrow line view of FIG. 1 is a schematic side view of a boat elevator in an embodiment of the present invention. It is explanatory drawing of the elevator raising / lowering mechanism part of this boat elevator. It is a side view of the boat changer in embodiment of this invention. It is a top view of this boat changer. It is a side view of the holder mounting base in the embodiment of the present invention. It is a sectional side view of a processing furnace in an embodiment of the invention. It is a schematic side view of the conventional substrate processing apparatus. It is a perspective view of the boat exchange apparatus in the conventional substrate processing apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 Housing | casing 21 Cassette 24 Load lock chamber 25 Atmospheric gate valve 26 Cassette transfer machine 27 Cassette receiving stand 28 Cassette shelf 30 Boat changer 32 Processing furnace 34 Boat elevator 35 Boat 36 Holding stand 37 Substrate transfer machine 39 Wafer 43 Drive mechanism 54 Magnetic seal part 56 Bellows seal member 59 Elevator elevating mechanism part 66 Bellows 71 Furnace lid 73 Bearing part 86 First boat exchange arm 87 Second boat exchange arm 97 Bellows 98 Boat receiving flange 102 Outer pipe 113 Main control part 125 Connection Gate valve

Claims (1)

  A substrate processing apparatus holds the substrate holder between a processing chamber for holding and processing a substrate on a substrate holder, a standby chamber continuously provided below the processing chamber, and the processing chamber and the standby chamber. Elevating means for moving up and down, a substrate storage container for storing the substrate, and a substrate transfer device disposed in the standby chamber and transporting the substrate between the substrate storage container and the substrate holder, A plurality of substrate processing apparatuses are juxtaposed, the standby chamber of one substrate processing apparatus and the standby chamber of the other substrate processing apparatus are communicated via a gate valve, and the substrate transfer machine of one substrate processing apparatus is connected to one of the substrate processing apparatuses A substrate processing apparatus, wherein a substrate can be transferred from a substrate holder of the substrate processing apparatus to a substrate holder of the other substrate processing apparatus.

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