JP6031304B2 - Substrate processing apparatus and substrate processing method - Google Patents

Description

The present invention relates to a substrate processing apparatus for processing a substrate, and more particularly to a FOUP (Front Open Unified Pod) loader (substrate accommodation container lifting mechanism) in a substrate processing apparatus having a large substrate diameter.

In a batch-type substrate processing apparatus that heat-treats a large number of substrates (wafers) at a time, a plurality of wafers are usually transferred into the apparatus in a state of being stored in a FOUP, and then processed once (hereinafter referred to as one batch). )), Several tens to several hundreds of wafers are processed simultaneously.

  In such a batch type substrate processing apparatus, a storage shelf (hereinafter referred to as a FOUP shelf) is installed so that a FOUP storing a plurality of wafers can be sufficiently stocked in the apparatus.

Also, a FOUP opener that opens and closes the FOUP door is installed between the wafer transfer chamber.
In the substrate processing apparatus, the FOUP loader is for transferring the FOUP carried from the outside to the delivery stage to the FOUP shelf or the FOUP opener.

For example, the number of wafers processed per batch as a vertical substrate processing apparatus for 450 mm wafers (hereinafter referred to as 450 mm apparatus) is the same as that for a vertical substrate processing apparatus for 300 mm wafers (hereinafter referred to as 300 mm apparatus). The same. Therefore, the number of 450 mm wafer FOUPs required is the same as in the 300 mm apparatus.
However, as the wafer diameter increases from 300 mm to 450 mm, the size of the FOUP increases accordingly. Specifically, the loading pitch between wafers in the FOUP is 10 mm to 12 mm, and the height of the FOUP when storing 25 wafers in one FOUP is 50 mm or more higher than that of a 300 mm wafer. Become. In addition, the weight of the FOUP loaded with the wafer is three times or more than that of the 300 mm wafer.
For this reason, the height of the 450 mm apparatus is higher than that of the 300 mm apparatus, and the FOUP loader must access the FOUP mounting location arranged from the upper side to the lower side of the vertical substrate processing apparatus. Accordingly, the FOUP loader becomes larger and longer than that of the 300 mm apparatus. When the vertical substrate processing apparatus is transported by an aircraft or the like, there is a limit on the height. Therefore, the lengthened FOUP loader must be disassembled and transported in a state removed from the 450 mm apparatus. The disassembled FOUP loader needs to be assembled and adjusted again after the device is loaded.

JP 2008-270266 A

In the present invention, in view of such circumstances, even in the case of a substrate processing apparatus that is elongated due to the increase in the diameter of the substrate, the transfer apparatus can access each substrate storage container mounting location, and at the time of transportation. An object of the present invention is to provide a substrate processing apparatus equipped with a transport device for a multi-stage lifting system that can be stored below the height limit and can eliminate the steps of assembly and adjustment after loading.

  According to one aspect of the present invention, in a substrate processing apparatus for transporting a substrate storage container that stores a substrate, a base unit, a first drive unit disposed in the base unit, and the first drive unit operate. A first table that slides by moving the second table, a second drive unit disposed on the first table, and a second table that moves the substrate container when the second drive unit operates. And is connected to the transfer device for transferring the substrate container, the first drive unit and the second drive unit, and sends signals to the first drive unit and the second drive unit. It is possible to provide a substrate processing apparatus having a control unit that transmits and controls the first table and the second table to slide in synchronization with each other.

Further, according to another aspect of the present invention, in the transfer device for transferring the substrate container to the storage shelf for storing the substrate container provided in the housing of the substrate processing apparatus,
The transfer device is disposed on a base portion, a first driving portion disposed on the base portion, a first table that slides when the first driving portion is operated, and the first table. And a second table that moves the substrate container when the second driving unit is operated, and the first driving unit and the second driving unit. Can provide a transfer device that receives the control signal and slides the first table and the second table in synchronization.

According to another aspect of the present invention, a base unit, a first drive unit disposed on the base unit, a first table that slides when the first drive unit operates, and the first table A second driving unit disposed on one table and a second table for moving the substrate container by operating the second driving unit, and transporting the substrate container that accommodates the substrate; In a substrate processing method of a substrate processing apparatus comprising a transfer device and a control unit that controls the transfer device, the transfer device holds the substrate container, and the first drive unit and the second drive unit are Receiving a signal from the control unit, sliding the first table and the second table synchronously, and transporting the substrate container to a predetermined position; and from the transported substrate container A step of unloading the substrate; A step of processing a substrate that is able to provide a substrate processing method comprising the.

According to the present invention, even in a substrate processing apparatus that is elongated by adapting to a large-diameter substrate, the transfer apparatus can efficiently access each substrate storage container placement location, and the height during transportation is high. It can be stored below the limit, and the assembly / adjustment process after loading can be omitted.

It is a schematic perspective view of the substrate processing apparatus used suitably by embodiment of this invention. It is a schematic sectional side view of the substrate processing apparatus used suitably by embodiment of this invention. It is a figure which shows the structure of the controller of the substrate processing apparatus used suitably by embodiment of this invention. It is a schematic operation | movement figure of the conveying apparatus of the substrate storage container used suitably by embodiment of this invention. It is a schematic operation | movement figure of the conveying apparatus of the substrate storage container used suitably by embodiment of this invention. It is the schematic of the conveying apparatus of the substrate storage container used suitably by embodiment of this invention. It is the schematic of the conveying apparatus of the substrate storage container used suitably by embodiment of this invention. It is the schematic of the conveying apparatus of the substrate storage container in a general substrate processing apparatus.

Next, embodiments of the present invention will be described with reference to the drawings.
In an embodiment to which the present invention is applied, as an example, the substrate processing apparatus is configured as a semiconductor manufacturing apparatus that implements a processing apparatus in a method for manufacturing a semiconductor device (IC). In the following description, a case where a vertical apparatus (hereinafter simply referred to as a processing apparatus) that performs oxidation, diffusion processing, CVD processing, or the like is applied to the substrate as the substrate processing apparatus will be described.

FIG. 8 is a schematic diagram showing a mechanism of a FOUP loader as a substrate container transport device in a general vertical substrate processing apparatus. The FOUP loader includes a motor 81, a linear guide 82, a ball screw 83, a main body base 84, and a table 85. The ball screw 83 is rotated by the rotation of the motor 81. The ball screw 83 is connected to the table 85. Due to these cooperative relationships, it is possible to move the FOUP placed on the FOUP conveyance unit (not shown) installed on the table 85 in the vertical and horizontal directions.
However, as shown in FIG. 8, since only one motor 81 and one table 85 are provided, it takes time to move from the lowest position of the FOUP loader to the highest position. Furthermore, if the FOUP loader is lengthened so as to correspond to the 450 mm apparatus, there is a restriction on the height during transportation, and therefore it cannot be simply lengthened.

  FIG. 1 is a perspective view of a substrate processing apparatus to which the present invention is applied. 2 is a side perspective view of the substrate processing apparatus shown in FIG.

  As shown in FIGS. 1 and 2, a substrate processing in which a plurality of wafers (substrates) 200 made of silicon or the like are accommodated and a FOUP (hereinafter referred to as a pod) 110 is used as a wafer carrier used as an accommodation container. The apparatus 100 includes a housing 111 used as a substrate processing apparatus main body.

A front maintenance port 103 serving as an opening provided for maintenance is opened at the front front portion of the front wall 111a of the casing 111, and a front maintenance door 104 for opening and closing the front maintenance port 103 is installed. It has been.
A pod loading / unloading port 112 is opened on the front wall 111a of the housing 111 so as to communicate between the inside and the outside of the housing 111, and the pod loading / unloading port 112 is opened and closed by a front shutter 113.
A load port 114 used as a carry-in / carry-out unit is installed on the front front side of the pod carry-in / out port 112, and the load port 114 is configured so that the pod 110 is placed and aligned. The pod 110 is carried onto the load port 114 by an in-process carrying device (not shown), and is also carried out from the load port 114.

  A pod shelf (accommodating shelf) 105 is installed at an upper portion of the housing 111 at a substantially central portion in the front-rear direction. The pod shelf 105 includes a support unit 116 installed vertically and a plurality of mounting units 117 that are held so as to be independently movable in the vertical direction at each of the upper, middle, and lower stages with respect to the support unit 116. The pod shelf 105 is configured to hold a plurality of pods 110 placed on a plurality of stages of placement units 117. That is, the pod shelf 105 accommodates a plurality of pods 110 in a plurality of stages in the vertical direction by arranging, for example, two pods 110 in a straight line in the same direction.

  Between the load port 114 and the pod shelf 105 in the casing 111, a FOUP loader (storage container transport mechanism) 118 as a transport device for transporting the pod 110 is installed. The FOUP loader 118 includes a pod elevator 118a as a shaft portion that can be vertically moved while holding the pod 110, and a pod conveyance portion 118b as a conveyance portion that carries the pod 110 and conveys it in the horizontal direction. The FOUP loader 118 is configured to convey the pod 110 between the load port 114, the pod shelf 105, and the pod opener 121 by continuous operation of the pod elevator 118a and the pod conveyance unit 118b.

A sub-housing 119 is constructed across the rear end of the lower portion of the housing 111 at a substantially central portion in the front-rear direction. Wafer carrying port 120 for loading and unloading the wafer 200 to the sub-chassis 119 in the front wall 119 a of the sub-housing 119 a pair are opened are arranged in the vertical direction in upper and lower stages, A pair of pod openers 121 and 121 are installed at the upper and lower wafer loading / unloading ports 120 and 120, respectively. The pod opener 121 includes mounting bases 122 and 122 for mounting the pod 110 and cap attaching / detaching mechanisms 123 and 123 for attaching and detaching the cap of the pod 110 used as a sealing member. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.

  The sub-housing 119 constitutes a transfer chamber 124 that is fluidly isolated from the installation space of the FOUP loader 118 and the pod shelf 105. A wafer transfer mechanism 125 is installed in a front region of the transfer chamber 124. The wafer transfer mechanism 125 is configured to be capable of rotating or linearly moving the wafer 200 in a horizontal direction and a wafer transfer device 125a. It is comprised with the wafer transfer apparatus elevator 125b for raising / lowering. As schematically shown in FIG. 1, the wafer transfer device elevator 125 b is installed between the right end of the pressure-resistant casing 111 and the right end of the front area of the transfer chamber 124 of the sub casing 119. By the continuous operation of the wafer transfer device elevator 125b and the wafer transfer device 125a, the tweezer (substrate holder) 125c of the wafer transfer device 125a is used as a placement portion for the wafer 200 with respect to the boat (substrate holder) 217. The wafer 200 is loaded (charged) and unloaded (discharged).

  In the rear region of the transfer chamber 124, a standby unit 126 that houses and waits for the boat 217 is configured. A processing furnace 202 used as a processing chamber is provided above the standby unit 126. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port shutter 147.

As schematically shown in FIG. 1, a boat elevator 115 for raising and lowering the boat 217 is installed between the right end portion of the pressure-resistant housing 111 and the right end portion of the standby portion 126 of the sub housing 119. Yes. A seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a connecting tool connected to a lifting platform of the boat elevator 115, and the seal cap 219 supports the boat 217 vertically, and a lower end of the processing furnace 202. It is comprised so that a part can be obstruct | occluded.
The boat 217 includes a plurality of holding members, and is configured to hold a plurality of (for example, about 50 to 125) wafers 200 horizontally in a state where the centers are aligned in the vertical direction. Has been.

As schematically shown in FIG. 1, the left end of the transfer chamber 124 opposite to the wafer transfer device elevator 125b side and the boat elevator 115 side is a cleaned atmosphere or an inert gas. A clean unit 134 composed of a supply fan and a dust-proof filter is installed so as to supply clean air 133. Between the wafer transfer device 125a and the clean unit 134, although not shown, the circumferential direction of the wafer A notch aligning device is installed as a substrate aligning device for aligning the positions.
The clean air 133 blown out from the clean unit 134 is circulated to the notch aligner / wafer transfer device 125 a and the boat 217 in the standby unit 126, and then sucked in through a duct (not shown) and exhausted outside the housing 111. Or is circulated to the primary side (supply side) that is the suction side of the clean unit 134 and is again blown out into the transfer chamber 124 by the clean unit 134.

Next, the operation of the substrate processing apparatus 100 will be described.
In the following description, the operation of each part constituting the substrate processing apparatus 100 is controlled by the controller 240.
FIG. 3 shows the configuration of the controller 240. The controller 240 controls the FOUP loader 118, the pod shelf 105, the wafer transfer mechanism 125, the motor 1, the motor 2, the first pod table, the second pod table, and the like via the input / output device 241.
The controller 240 is connected to a temperature control unit that controls a temperature sensor and a heater (not shown), a gas flow rate control unit that controls a valve and an MFC, and a pressure control unit that controls an APC valve and a pressure sensor. It is configured.
As shown in FIGS. 1 and 2, when the pod 110 is supplied to the load port 114, the pod loading / unloading port 112 is opened by the front shutter 113, and the pod 110 above the load port 114 is moved to the FOUP loader 118. Is carried into the housing 111 from the pod loading / unloading port 112.
The loaded pod 110 is automatically transported and delivered by the FOUP loader 118 to the designated placement unit 117 of the pod shelf 105, temporarily stored, and then one pod opener 121 from the pod shelf 105. And transferred to the pod opener 121 and transferred to the mounting table 122 or directly transferred to the pod opener 121 and mounted on the mounting table. 122. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133. For example, the transfer chamber 124 is filled with nitrogen gas as clean air 133, so that the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the casing 111 (atmosphere).

The pod 110 mounted on the mounting table 122 has its opening-side end face pressed against the opening edge of the wafer loading / unloading port 120 on the front wall 119a of the sub-housing 119, and the cap is removed by the cap attaching / detaching mechanism 123. The wafer loading / unloading port is opened.
When the pod 110 is opened by the pod opener 121, the wafer 200 is picked up from the pod 110 by the tweezer 125c of the wafer transfer device 125a through the wafer loading / unloading port, aligned with the notch alignment device 135 (not shown), and then transferred. It is carried into the standby section 126 behind the chamber 124 and loaded (charged) into the boat 217. The wafer transfer device 125 a that has transferred the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 200 into the boat 217.

  During the loading operation of the wafer into the boat 217 by the wafer transfer mechanism 125 in the one (upper or lower) pod opener 121, another pod 110 from the pod shelf 105 is placed in the other (lower or upper) pod opener 121. It is transported and transferred by the FOUP loader 118, and the opening operation of the pod 110 by the pod opener 121 is simultaneously performed.

  When a predetermined number of wafers 200 are loaded into the boat 217, the lower end portion of the processing furnace 202 closed by the furnace port shutter 147 is opened by the furnace port shutter 147. Subsequently, the boat 217 holding the wafers 200 is loaded into the processing furnace 202 when the seal cap 219 is lifted by the boat elevator 115.

After loading, arbitrary processing is performed on the wafer 200 in the processing furnace 202.
After the processing, the wafer 200 and the pod 110 are discharged to the outside of the casing in the reverse order of the above-described procedure, except for the wafer alignment process in the notch alignment device 135 (not shown).

  Next, the FOUP loader 118 in the first embodiment according to the present invention will be described in detail with reference to FIGS.

As shown in FIGS. 4A and 4B, the FOUP loader 118 includes a main body base 93 that extends in the longitudinal direction in which the FOUP moves, and a drive source ( driver) as the first motor 91, the guide rails 94 as guide mechanism of the first table 96, a ball screw 92 as a power transmission mechanism, connecting mechanism 1 0 between the ball screw 92 and the first table 96 is located The first table 96 can be slid up and down (lifted) on the main body base 93 via the guide rail 94. Here, the main body base 93 may be installed such that the longitudinal direction is the vertical direction, or may be installed in the horizontal direction, and can be appropriately changed according to the installation space. The ball screw 92 and the first table 96 may be directly connected without using the connection mechanism 10.

Further, the first table 96 includes a second motor 95 as a drive source (drive unit), a second guide rail 97 as a guide mechanism, a second ball screw 98 as a power transmission mechanism, and a second ball screw 98. And a second connection mechanism 11 for connecting the second table 99 to each other, and a transport unit 118b for transporting the FOUP is connected to the second connection mechanism 11, and the second table 99 is moved up and down on the first table 96. The FOUP can be transported by sliding (or raising and lowering) left or right. The ball screw 98 and the second table 99 may be directly connected without using the connection mechanism 11.

The configurations of the first table, the second table, and the main body base described above are provided side by side as shown in the cross-sectional view of FIG. 6 or FIG. 7 described later, and control the first table 96 and the second table 99. Thus, the expansion and contraction of the FOUP loader 118 can be performed in two stages of up / down (or left / right) movement of the first table 96 and up / down (or left / right) movement of the second table 99.

The FOUP loader 118 for a large diameter wafer processing apparatus has to lift and lower the FOUP (pod) 110 of about 25 kg containing the wafer 200, and the main body base 93 and the first table 96 are required to have strength. Further, the second table 99 needs to be able to reduce the load applied to the main body base 93 and the first table 96 as much as possible. Therefore, the stroke (sliding length) of the first table 96 on the main body base 93 having strength is lengthened, and the stroke of the second table 99 which is lighter than the first table 96 is the first table 96. It is better to make it shorter than the stroke. Therefore, the overall length of the main body base 93 should be longer than the overall length of the first table 96. Similarly, the total length of the first table 96 should be longer than the total length of the second table 99.

In FIG. 4, as an example, the stroke n of the first table 96 is 2 and the stroke m of the second table 99 is 1. (N: m in FIG. 4B is set to 2: 1.)
In order to synchronize and extend these two first table 96 and second table 99, the lead ratio of the ball screw 92 and the ball screw 98 is set to 2: 1, and the two motors 91 and 95 are respectively operated at the same rotational speed. I do. Thereby, both the 1st table 96 and the 2nd table 99 can be raised / lowered smoothly all the strokes. Here, operating the two motors 91 and 95 at the same rotational speed means that one control signal can be supplied to each motor.
By using the above means, it is possible to control a plurality of motors with a single control signal for commands from the host controller to the motors 91 and 95.
By using one command from the host controller, the synchronous operation of the table (work) can be greatly facilitated using two or more motors.

A case where individual control signals are used for a plurality of motors will be described with reference to FIGS. 5 (a) and 5 (b). In FIG. 5A, the first motor 91 is controlled to raise the first table 96 by the distance A. Further, as shown in FIG. 5B, the second motor 99 is controlled to raise the second table 99 by the distance B. As a result, the second table 99 rises by A + B. Controlling the operation by sending separate control signals to the respective motors 91 and 95 as in this example can perform fine position adjustment, while there are innumerable combinations of the positions of the tables 96 and 99. For this reason, not only does the operator vary, but also the teaching of position adjustment takes time.
If the target of table position control is a non-moving (fixed) FOUP shelf as in the present invention, a plurality of motors are operated with one control signal as described above. However, there is an advantage that the position can be easily adjusted.
Thus, performing position control of the tables 96 and 99 with a single control signal for a plurality of motors means that whenever one table is moving, the other table is also moved in synchronization. .

As a second embodiment, even if the lead ratio between the ball screw 92 and the ball screw 98 is 1: 1, the ratio of the electronic gears in each motor is set to 2: 1. 99 smooth operations can be satisfied. Here, it goes without saying that the gear ratio of each motor is not limited to 2: 1 and can be freely selected as appropriate.

FIG. 6 shows an example in which the FOUP loader 118 is configured by shifting two motors in the lateral direction (in the depth direction of the apparatus in the case of the apparatus of FIG. 2). By arranging the two motors 91 and 95 side by side in this manner, the thickness of the FOUP loader 118 can be reduced.

FIG. 7 shows an example in which two motors are arranged side by side in the height direction (the height direction of the apparatus of FIG. 2). According to this example, the width of the FOUP loader 118 is reduced, and the space in the apparatus can be used effectively.

As described above, with the FOUP loader according to the present invention, a substrate processing apparatus that processes a substrate having a large diameter can have the same substrate processing efficiency as the conventional apparatus with the same height as the conventional apparatus. In addition, the FOUP loader can access each FOUP placement location, and can be stored below the height limit during transportation, eliminating the assembly and adjustment process after loading. There is.

Further, the above is only a preferred embodiment of the present invention, and the present invention is not limited to the above embodiment, and various modifications can be made without departing from the scope of the present invention.

As mentioned above, although this invention has been demonstrated along embodiment, the main aspect of this invention is added here.

(Appendix 1)
In the substrate processing apparatus for transporting the substrate container for housing the substrate,
A base part;
A first drive unit disposed on the base unit;
A first table that slides as the first driving unit operates;
A second driving unit disposed on the first table;
A second table that moves the substrate container by operating the second driving unit, and a transport device that transports the substrate container;
It is connected to the first drive unit and the second drive unit, and transmits a signal to the first drive unit and the second drive unit, and the first table and the second table are synchronized. And a control unit that controls to slide the substrate processing apparatus.

(Appendix 2)
The first sliding length on which the first table slides and the second sliding length on which the second table slides are such that the first sliding length is the second sliding length. The substrate processing apparatus according to appendix 1, wherein the substrate processing apparatus is set longer than the moving length.

(Appendix 3)
The substrate processing apparatus according to appendix 1 or 2, wherein the first table and the second table are provided side by side and slide in the same direction.

(Appendix 4)
The first driving unit and the second driving unit are constituted by a motor having an electronic gear,
4. The substrate processing apparatus according to any one of appendices 1 to 3, wherein a ratio of electronic gears of the first drive unit and the second drive unit is 2: 1.

(Appendix 5)
In a transfer apparatus for transferring the substrate container to a storage shelf for storing a substrate container provided in a housing of the substrate processing apparatus,
The transfer device includes a base portion,
A first drive unit disposed on the base unit;
A first table that slides as the first driving unit operates;
A second driving unit disposed on the first table;
A second table for moving the substrate container by operating the second drive unit;
Have
The first driving unit and the second driving unit receive a control signal and slide the first table and the second table synchronously.

(Appendix 6)
The first sliding length on which the first table slides and the second sliding length on which the second table slides are such that the first sliding length is the second sliding length. 4. The transfer device according to appendix 3, which is set longer than the moving length.

(Appendix 7)
A base unit, a first driving unit disposed on the base unit, a first table that slides by operating the first driving unit, and a second driving unit disposed on the first table; A second table that moves the substrate container when the second drive unit operates, a transport device that transports the substrate container that houses the substrate, and a control unit that controls the transport device; In a substrate processing method of a substrate processing apparatus comprising:
The transfer device holds the substrate container, and the first driving unit and the second driving unit receive a signal from the control unit and synchronize the first table and the second table. Sliding the substrate container to a predetermined position; and
A step of unloading the substrate from the transported substrate container;
Processing the unloaded substrate;
A substrate processing method.

(Appendix 8)
In a substrate processing apparatus for transporting a substrate container,
Body base,
A first motor disposed on the main body base;
A first ball screw connected to the first motor;
A first table connected to the first ball screw;
A second motor disposed on the first table;
A second ball screw connected to the second motor;
A second table connected to the second ball screw;
With
A substrate processing apparatus comprising: a control unit that transmits the same signal to the first motor and the second motor.

91... First motor 93... Main body 95... Second motor 96... First table 99. 118 ... FOUP loader

Claims (3)

A transfer device for transferring a substrate container,
A main body base portion extending and installed in the moving direction of the substrate container;
A first drive unit disposed on the main body base unit;
A first power transmission mechanism connected to the first drive unit for transmitting power;
A first table that slides when power generated by the operation of the first drive unit is transmitted through the first power transmission mechanism ;
A second driving unit disposed on the first table;
A second power transmission mechanism connected to the second drive unit for transmitting power;
A second table that moves the substrate container by transmitting the power generated by the operation of the second drive unit via the second power transmission mechanism ;
The stroke ratio between the first table and the second table is configured to be the same as the lead ratio between the first power transmission mechanism and the second power transmission mechanism,
Wherein the first driving portion and the second driving unit includes a transport device for synchronizing operation of said first table and said second table by receiving a control signal to operate at the same speed. A processing chamber for processing the substrate;
A main body base portion that is installed to extend in a direction in which the substrate housing container that accommodates the substrate moves, a first driving portion that is disposed on the main body base portion, and a first driving portion connected to the first driving portion. A first power transmission mechanism that transmits power; a first table that slides when power generated by the operation of the first drive unit is transmitted through the first power transmission mechanism ; It is generated by operating the second drive unit disposed on the first table, the second power transmission mechanism connected to the second drive unit for transmitting power, and the second drive unit. A second table that moves the substrate container by transmitting power through the second power transmission mechanism, and a transport device that transports the substrate container;
Possess a control unit for controlling the second driving portion and the first driving member,
The stroke ratio between the first table and the second table is configured to be the same as the lead ratio between the first power transmission mechanism and the second power transmission mechanism,
Wherein, the substrate processing is supplied to the first and the second driving unit of the same control signal to operate said first driving portion and the and the driving portion and the second driving unit at the same rotational speed apparatus. A processing chamber for processing a substrate, and a body base portion in which the substrate storage container for accommodating the substrate is placed to extend in the direction of movement, a first drive portion disposed on the body base portion, the first A first power transmission mechanism that is connected to the first drive unit and transmits power, and the power generated by the operation of the first drive unit is transmitted through the first power transmission mechanism to slide. A first table that moves, a second drive unit disposed on the first table, a second power transmission mechanism connected to the second drive unit for transmitting power, and the second table And a second table that moves the substrate container by transmitting power generated by the operation of the driving unit via the second power transmission mechanism, and transports the substrate container. device and, with the first driving portion and the second driving unit Possess a control unit for controlling the stroke ratio between the said first table and said second table, the same as the lead ratio of the first power transmission mechanism and the second power transmission mechanism And the control unit sends the same control signal to the first drive unit and the second drive so as to operate the first drive unit and the second drive unit at the same rotational speed. Preparing a supply substrate processing apparatus in a part ;
Transporting the substrate container to the processing chamber;
Processing the substrate transported to the processing chamber;
A method for manufacturing a semiconductor device comprising:

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