WO2012073765A1 - Semiconductor manufacturing apparatus - Google Patents

Semiconductor manufacturing apparatus Download PDF

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Publication number
WO2012073765A1
WO2012073765A1 PCT/JP2011/076964 JP2011076964W WO2012073765A1 WO 2012073765 A1 WO2012073765 A1 WO 2012073765A1 JP 2011076964 W JP2011076964 W JP 2011076964W WO 2012073765 A1 WO2012073765 A1 WO 2012073765A1
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WO
WIPO (PCT)
Prior art keywords
pod
transparent window
semiconductor manufacturing
manufacturing apparatus
wafer
Prior art date
Application number
PCT/JP2011/076964
Other languages
French (fr)
Japanese (ja)
Inventor
聡 相澤
中嶋　誠世
朋之 山田
Original Assignee
株式会社日立国際電気
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Publication of WO2012073765A1 publication Critical patent/WO2012073765A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to a substrate processing technique, and more particularly, in a semiconductor manufacturing apparatus which is a manufacturing apparatus of a semiconductor integrated circuit device (IC), simultaneously processing a plurality of semiconductor substrates (for example, semiconductor wafers) on which a semiconductor integrated circuit is formed.
  • IC semiconductor integrated circuit device
  • the present invention relates to an effective vertical batch processing apparatus.
  • a vertical batch processing apparatus as one of the IC manufacturing apparatuses.
  • a substrate cassette conveyed from the outside of the apparatus is placed on a load port provided on the front surface of the apparatus, and is received and transferred to a cassette storage shelf inside the apparatus.
  • the substrate cassette is a substrate container that stores a plurality of substrates. Thereafter, the substrates are stacked in the vertical direction on the boat from the substrate cassette and mounted in multiple stages, and the boat on which the plurality of substrates are mounted is inserted into the processing furnace from below the processing furnace to perform heat treatment.
  • a display operation unit is provided on the front surface of the apparatus, and displays an operation state of the apparatus and accepts various operation instructions from an operator.
  • Patent Document 1 discloses a loading / unloading stage unit (load port) on which a substrate cassette descending from an overhead transfer machine located outside the semiconductor manufacturing apparatus can be placed, an operation status display of the semiconductor manufacturing apparatus, There is disclosed a semiconductor manufacturing apparatus in which a display operation unit that receives an operation command operation is provided on the front surface of the semiconductor manufacturing apparatus.
  • An object of the present invention is to provide a semiconductor manufacturing apparatus capable of visually confirming a transport state, a housing state, and the like of a substrate container inside the device.
  • a typical configuration of the semiconductor manufacturing apparatus of the present invention for solving the above-described problems is as follows. That is, A housing that forms an outline of the semiconductor manufacturing apparatus; A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus; A substrate container transport mechanism provided in the housing behind the load port; Substrate container storage shelf provided in the casing behind the substrate container transport mechanism; Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window; An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator; A semiconductor manufacturing apparatus comprising:
  • the operation part and the first transparent window part are provided at the front part of the semiconductor manufacturing apparatus, the operator visually confirms the substrate container transport mechanism and the like inside the apparatus through the first transparent window part.
  • the operation can be performed from the operation unit.
  • FIG. 1 is a perspective view of a semiconductor manufacturing apparatus according to an embodiment of the present invention. It is a perspective view which shows the vertical cross section of the semiconductor manufacturing apparatus which concerns on embodiment of this invention. It is a perspective view which shows the external appearance of the front surface of the semiconductor manufacturing apparatus which concerns on embodiment of this invention.
  • the semiconductor manufacturing apparatus is configured as a semiconductor manufacturing apparatus that performs processing steps in a method of manufacturing a semiconductor device (IC: IntegratedIntegrCircuit).
  • IC IntegratedIntegrCircuit
  • a batch type vertical semiconductor manufacturing apparatus hereinafter simply referred to as a processing apparatus
  • CVD Chemical Vapor Deposition
  • FIG. 1 is a perspective view of a processing apparatus to which the present invention is applied, and is shown as a perspective view.
  • FIG. 2 is a side perspective view of the processing apparatus shown in FIG.
  • the processing apparatus 100 of the present embodiment includes a casing 111 that forms an outline of the processing apparatus 100.
  • a pod (substrate container) 110 is used as a wafer carrier that stores a wafer (substrate) 200 made of silicon or the like.
  • the casing 111 includes a front wall 111a of the processing apparatus 100, a front lower maintenance door 104 below the front wall 111a, a rear wall 111b, a ceiling wall 111c, a bottom wall 111d, a left side wall 111e, a right side wall 111f, and the like.
  • Most of the casing 111 is made of an opaque material such as stainless steel, for example, except for a first transparent window portion 32 described later.
  • the front surface of the processing apparatus 100 is the A side in FIG. 1, the rear surface is the B side, the left side wall 111e is the left side wall as viewed from the front, and the right side wall 111f is from the front. This is the right side wall as viewed.
  • the front wall 111a of the eaves casing 111 extends vertically so as to be bent 90 degrees downward from the ceiling wall 111c, and reaches the upper end of the pod loading / unloading port (substrate container loading / unloading port) 112.
  • a pod loading / unloading port 112 is opened below the front wall 111 a so as to communicate with the inside and outside of the housing 111.
  • the pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113.
  • a load port (substrate container delivery table) 114 is installed in front of the pod loading / unloading port 112.
  • the load port 114 is a horizontal base on which the pod 110 is placed and aligned.
  • the load port 114 is provided at the front of the apparatus for delivering the pod 110 to and from the outside of the semiconductor manufacturing apparatus.
  • the pod 110 is vertically loaded onto the load port 114 from above by an in-process transfer device (not shown), and is also vertically unloaded from above the load port 114.
  • a front lower maintenance port 103 serving as an opening provided for maintenance is opened below the front side of the load port 114, and front lower maintenance doors 104 and 104 for opening and closing the front lower maintenance port 103 are respectively installed. It has been.
  • a rotating shelf (substrate container storage shelf) 105 is installed at the upper portion of the substantially central portion in the front-rear direction in the tub housing 111.
  • the rotating shelf 105 is configured to store a plurality of pods 110.
  • the rotating shelf 105 includes a support column 116 that is erected vertically and rotated in a horizontal plane, and a plurality of shelf plates 117 that are supported radially from the support column 116.
  • the plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where a plurality of pods 110 are placed at each of the three positions above and below the column 116.
  • a pod transfer mechanism (substrate container transfer mechanism) 118 is installed between the load port 114 and the rotating shelf 105 in the casing 111.
  • the pod transport mechanism 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transporter (substrate container transporter) 118b as a horizontal transport mechanism.
  • the pod transport mechanism 118 moves the pod 110 between the load port 114, the rotary shelf 105, and a pod opener (substrate container lid opening / closing mechanism) 121 described later by continuous operation of the pod elevator 118a and the pod transporter 118b. It is comprised so that it may convey.
  • the pod transport mechanism 118 is provided behind the load port 114, and the rotating shelf 105 is provided behind the pod transport mechanism 118.
  • a sub-housing 119 is provided across the rear end of the apparatus 100 at a lower portion of the housing 111 at a substantially central portion in the front-rear direction.
  • a pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 for loading / unloading the wafer 200 into / from the sub-casing 119 are arranged on the front wall 119a of the sub-casing 119 in two vertical stages.
  • a pair of pod openers 121 and 121 are installed at the upper and lower wafer loading / unloading ports 120 and 120, respectively.
  • the pod opener 121 includes mounting bases 122 and 122 on which the pod 110 is placed, and cap attaching / detaching mechanisms (lid attaching / detaching mechanisms) 123 and 123 that attach and detach caps (lids) of the pod 110.
  • the pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.
  • the mounting table 122 is a transfer shelf on which the pod 110 is mounted when the wafer 200 is transferred. As described above, the mounting table 122 serving as a substrate container mounting table is for mounting the pod 110 when the wafer 200 is transferred to the boat 217, and is located behind the pod transfer mechanism 118 and on the rotating shelf 105. Is provided below.
  • the sub housing 119 constitutes a transfer chamber 124 that is isolated from the atmosphere of the installation space of the pod transport mechanism 118 and the rotating shelf 105.
  • a wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region in the transfer chamber 124.
  • the wafer transfer mechanism 125 includes a wafer transfer machine (substrate transfer machine) 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction, and a wafer transfer machine elevator (substrate transfer machine) for raising and lowering the wafer transfer machine 125a.
  • Mounting mechanism elevating mechanism) 125b mounting mechanism elevating mechanism
  • the tweezer (substrate holding body) 125c of the wafer transfer machine 125a is used as a mounting portion for the wafer 200 with respect to the boat (substrate holding tool) 217.
  • the wafer 200 is loaded (charged) and unloaded (discharged).
  • a clean unit composed of a supply fan and a dustproof filter is supplied to the left end of the transfer chamber 124 so as to supply a clean atmosphere 133 that is a cleaned atmosphere or an inert gas.
  • 134 is installed. That is, the clean unit 134 is installed on the side opposite to the wafer transfer machine elevator 125b side.
  • a notch alignment device 135 (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer.
  • the clean air 133 blown out from the clean unit 134 is circulated through the notch alignment device 135 and the wafer transfer device 125a, and then sucked in by a duct (not shown) to be exhausted to the outside of the casing 111 or clean.
  • the unit 134 is circulated to the primary side (supply side) which is the suction side, and is again blown into the transfer chamber 124 by the clean unit 134.
  • a pressure-resistant housing 140 having a confidential performance capable of maintaining a pressure lower than atmospheric pressure (hereinafter referred to as a negative pressure) is installed in a rear region in the transfer chamber 124.
  • the body 140 forms a load lock chamber 141 (not shown) which is a load lock type standby chamber having a capacity capable of accommodating the boat 217.
  • a wafer loading / unloading opening (substrate loading / unloading opening) 142 (not illustrated) is provided in the front wall 140a (not illustrated) of the pressure-resistant housing 140, and the wafer loading / unloading opening 142 is configured by a gate valve (substrate loading / unloading outlet). It is opened and closed by an opening / closing mechanism 143 (not shown).
  • a gas supply pipe 144 (not shown) for supplying nitrogen gas to the load lock chamber 141 and an exhaust pipe 145 for exhausting the load lock chamber 141 to a negative pressure are provided on a pair of side walls of the pressure-resistant housing 140. (Not shown) are connected to each other.
  • a processing furnace 202 is provided above the load lock chamber 141 in the housing 111 and behind the rotating shelf 105.
  • the processing furnace 202 has a substantially cylindrical shape in which the upper end is closed and the lower end is opened.
  • a heater for heat-treating the wafer accommodated in the processing furnace 202 is provided on the side wall of the processing furnace 202.
  • the lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port gate valve (furnace port opening / closing mechanism) 147.
  • a furnace port gate valve cover 149 (not shown) that houses the furnace port gate valve 147 when the lower end portion of the processing furnace 202 is opened is attached to the upper end portion of the front wall 140 a of the pressure-resistant housing 140.
  • a boat elevator (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is installed in the pressure-resistant housing 140.
  • a seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a coupling tool coupled to the boat elevator 115.
  • the seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.
  • the boat 217 includes a plurality of holding members, and holds a plurality of (for example, about 50 to 125) wafers 200 horizontally, with their centers aligned and vertically aligned. It is configured as follows.
  • the pod loading / unloading port 112 is opened by the front shutter 113.
  • the pod 110 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying mechanism 118.
  • the loaded pod 110 is automatically conveyed and delivered to the designated shelf plate 117 of the rotating shelf 105 by the pod conveying mechanism 118.
  • the pod pod 110 is transported from the shelf plate 117 to one pod opener 121 by the pod transport mechanism 118 and transferred to the mounting table 122.
  • the pod 110 is directly transferred from the load port 114 to the pod opener 121 and transferred to the mounting table 122.
  • the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133.
  • the transfer chamber 124 is filled with nitrogen gas as the clean air 133, so that the oxygen concentration in the transfer chamber 124 is 20 ppm or less outside the transfer chamber 124. It is set much lower than the oxygen concentration inside 111 (atmospheric atmosphere).
  • the pod 110 mounted on the mounting table 122 has its opening-side end surface pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119 a of the sub-casing 119 and its cap. Is removed by the cap attaching / detaching mechanism 123, and the wafer loading / unloading port 110a of the pod 110 is opened. Further, when the wafer loading / unloading opening 142 of the load lock chamber 141 whose interior is previously set to the atmospheric pressure state is opened by the operation of the gate valve 143, the wafer 200 is moved from the pod 110 to the tweezer 125 c of the wafer transfer machine 125 a.
  • the wafer is picked up through the wafer loading / unloading port 110a, aligned with the notch aligner 135, then loaded into the load lock chamber 141 through the wafer loading / unloading opening 142, transferred to the boat 217 and loaded (wafer charging).
  • the wafer transfer device 125 a that has transferred the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 110 into the boat 217.
  • the other (lower or upper) pod opener 121 includes the rotating shelf 105 or the load port 114.
  • the other pod 110 is transported by the pod transport mechanism 118, and the pod opener 121 is simultaneously opened by the pod opener 121.
  • the wafer loading / unloading opening 142 is closed by the gate valve 143, and the load lock chamber 141 is evacuated by being evacuated from the exhaust pipe 145.
  • the load lock chamber 141 is reduced to the same pressure as that in the processing furnace 202, the lower end portion of the processing furnace 202 is opened by the furnace port gate valve 147.
  • the furnace port gate valve 147 is carried into and stored in the furnace port gate valve cover 149.
  • the seal cap 219 is raised by the boat elevator 115, and the boat 217 supported by the seal cap 219 is loaded into the processing furnace 202.
  • FIG. 3 is a perspective view showing the appearance of the front surface of the semiconductor manufacturing apparatus according to the embodiment of the present invention, and mainly shows the front portion of the housing 111.
  • a front upper maintenance port 35 is provided on the front wall 111 a of the housing 111 and above the load port 114.
  • the front upper maintenance port 35 is for maintaining the vicinity of the upper front surface in the processing apparatus 100.
  • the front upper maintenance port 35 is provided with a front upper maintenance door 36 that can be opened and closed.
  • the front upper maintenance door 36 is provided with a transparent window 31a having a transparent window. This transparent window is made of a transparent acrylic plate extending in the vertical direction.
  • the transparent window is indicated by hatching, and a portion of the casing 111 that is not indicated by hatching is opaque.
  • a transparent window 31b having a transparent window is provided to the upper end of the pod loading / unloading port 112 below the front wall 111a so as to be continuous with the transparent window 31a.
  • This transparent window is also composed of a transparent acrylic plate extending in the vertical direction, like the transparent window of the transparent window portion 31a.
  • the 1st transparent window part 31 is comprised from the transparent window part 31a and the transparent window part 31b.
  • the 1st transparent window part 31 comprises a part of front surface of the housing
  • the size of the transparent window portion 31a is 590 mm in length and 905 mm in width
  • the size of the transparent window portion 31 b is 590 mm in length and 905 mm in width.
  • An operator or the like of the processing apparatus 100 passes through the transparent first transparent window 31 to the state of the pod transfer mechanism 118 and the rotary shelf 105 inside the casing 111 and to the pod 110 and the rotary shelf 105 being transferred by the pod transfer mechanism 118. It is possible to visually check the pod storage state and the pod transport state, such as the state of the pod 110 being placed. Therefore, safety and operability can be improved when the pod is transported by manual operation using the operation unit 34 described later. For example, when a transport error has occurred in the pod 110, the fact that a transport error has occurred can be seen from the error display on the operation unit 34, but the actual trouble in the transport area cannot be determined by the operation unit 34 alone. Confirmation by is required. If the front upper maintenance door 36 is not transparent, the front upper maintenance door 36 must be opened and maintenance personnel must enter the device to confirm the location and status of the trouble. The operability is inferior to the form, and another countermeasure for safety is required.
  • an operation panel 33 to which an operation unit 34 for receiving various instructions from an operator is attached is provided in front of the front wall 111a of the housing 111 with a space from the front wall 111a. It has been.
  • the space between the operation panel 33 and the front wall 111a is a space for passing the pod 110 vertically from the top to the bottom when the pod 110 is loaded onto the load port 114 from above by the in-process transfer device.
  • the operation panel 33 is supported by the casing 111 on its side surface.
  • the operation panel 33 includes a vertical portion 33a having a plane substantially along the vertical direction, and an inclined portion 33b having a plane that forms a predetermined angle with the plane of the vertical portion 33a.
  • An operation unit 34 including a display unit such as an LCD is provided in the vertical portion 33 a of the heel operation panel 33.
  • the operation unit 34 is configured with, for example, a touch panel. From the operation unit 34, various instructions to the processing apparatus 100, for example, an instruction to execute a film forming process by automatic operation, an instruction to change a processing recipe manually, or a manual operation to move the pod 110 from the rotating shelf 105 or the mounting table 122.
  • An instruction to carry out to the load port 114 is instructed to a control unit (not shown) of the processing apparatus 100.
  • the height of the operation unit 34 is set near the position of the operator's eyes, and is set, for example, at a position of about 1650 mm from the floor. As described above, the operation unit 34 is provided above and in front of the load port 114.
  • An inclined portion 33b is provided above the vertical portion 33a of the operation panel 33 so as to be continuous with the vertical portion 33a.
  • the angle formed by the inclined surface of the inclined portion 33b and the vertical direction is 15 degrees.
  • a second transparent window 32 having a horizontally long and rectangular transparent window is provided on the upper portion of the inclined portion 33b.
  • the transparent window is made of a transparent acrylic plate.
  • the size of the second transparent window portion 32 is 118 mm in length and 800 mm in width.
  • the second transparent window portion 32 is provided in front of the first transparent window portion 31 so as to be separated from the first transparent window portion 31 in the front-rear direction. As shown in FIG.
  • the second transparent window portion 32 is provided at the upper end of the inclined portion 33 b of the operation panel 33. That is, the upper end of the inclined portion 33b is cut into a horizontally long rectangle, and a transparent window is formed in the cut portion.
  • the image viewed through the second transparent window portion 32 and the image viewed through the first transparent window portion 31 from the operator can be viewed continuously without any breaks, so that the second transparent window portion 32 is placed at the upper end of the inclined portion 33b. Visibility can be improved compared with the case where it provides in the center part.
  • acrylic is not provided in the second transparent window portion 32 and the state is not cut into a horizontally long rectangle, for example, the operator's hand can easily enter the back side of the operation panel 33. It is necessary to deal with safety.
  • An operator or the like of the processing apparatus 100 passes through the transparent second transparent window portion 32 and the first transparent window portion 31 and is in the state of the pod transfer mechanism 118 and the rotating shelf 105 inside the casing 111 and is being transferred by the pod transfer mechanism 118.
  • the pod storage state and the pod conveyance state such as the state of the pod 110 and the pod 110 placed on the rotating shelf 105 can be visually confirmed. Therefore, safety and operability can be improved.
  • the operator of the processing apparatus 100 can also check the state of the pod 110 mounted on the mounting table 122 of the pod opener 121 through the transparent second transparent window portion 32 and the first transparent window portion 31. It can be confirmed visually.
  • the inside of the processing apparatus 100 can be visually confirmed in a wider range.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.
  • the transparent window portion is not completely transparent, but includes a portion that is translucent, that is, the inside can be seen at all.
  • the present invention can be applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD manufacturing apparatus and other semiconductor manufacturing apparatuses.
  • the processing content of the substrate processing may be not only film formation processing for forming CVD, PVD, oxide film, nitride film, metal-containing film, etc., but also exposure processing, lithography, coating processing, and the like.
  • the present specification includes at least the following configuration relating to the semiconductor manufacturing apparatus. That is, the first configuration is A housing that forms an outline of the semiconductor manufacturing apparatus; A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus; A substrate container transport mechanism provided in the housing behind the load port; Substrate container storage shelf provided in the casing behind the substrate container transport mechanism; Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window; An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator; A semiconductor manufacturing apparatus comprising: In this way, since there is an operation part and a first transparent window part at the front part of the semiconductor manufacturing apparatus, the operation from the operation part can be performed while visually confirming the substrate container transport mechanism inside the apparatus through the first transparent window part. It can be carried out.
  • the second configuration is the semiconductor manufacturing apparatus of the first configuration,
  • the operation unit is provided above and in front of the load port,
  • a semiconductor manufacturing apparatus including a second transparent window having a transparent window, which is provided above the operation unit and spaced apart from the first transparent window in the front-rear direction.
  • the substrate inside the apparatus is accommodated from the second transparent window portion through the first transparent window portion. It becomes easy to visually check the container transport mechanism.
  • the third configuration is the semiconductor manufacturing apparatus of the second configuration
  • the second transparent window portion is a semiconductor manufacturing apparatus provided at an upper end of an operation panel to which the operation portion is attached. If it does in this way, when operating from the operation part provided above and ahead of a load port, it will become easy to see the inside of an apparatus further from the 2nd transparent window part through the 1st transparent window part.
  • a fourth configuration is the semiconductor manufacturing apparatus of the second configuration or the third configuration, Provided in the housing behind the substrate container transfer mechanism and below the substrate container storage shelf, and includes a substrate container mounting table on which the substrate container is mounted when the substrate is transferred to the boat. Semiconductor manufacturing equipment. If it does in this way, when operating from the operation part provided above and ahead of the load port, it becomes easy to see the substrate container mounting table inside the apparatus from the second transparent window part through the first transparent window part.

Abstract

A semiconductor manufacturing apparatus is configured so as to comprise: a frame that forms an outer shell of the semiconductor manufacturing apparatus; a load port disposed at the front of the apparatus in order to exchange a substrate container with the exterior of the semiconductor manufacturing apparatus; a substrate container conveyance mechanism disposed in the frame behind the load port; a substrate container storage shelf disposed in the frame and behind the substrate container conveyance mechanism; a first transparent window that constitutes a portion of the front surface of the frame, that is disposed above the load port, and that has a transparent window; and an operation unit that is disposed at the front of the semiconductor manufacturing system and is operated by an operator.

Description

半導体製造装置Semiconductor manufacturing equipment
  本発明は、基板処理技術に関し、特に、半導体集積回路装置（ＩＣ）の製造装置である半導体製造装置において、半導体集積回路が作り込まれる半導体基板（例えば、半導体ウェハ）を複数、同時に処理するうえで有効な縦型バッチ式処理装置に関する。 The present invention relates to a substrate processing technique, and more particularly, in a semiconductor manufacturing apparatus which is a manufacturing apparatus of a semiconductor integrated circuit device (IC), simultaneously processing a plurality of semiconductor substrates (for example, semiconductor wafers) on which a semiconductor integrated circuit is formed. The present invention relates to an effective vertical batch processing apparatus.
  ＩＣの製造装置の１つに、縦型バッチ式処理装置がある。縦型バッチ式処理装置においては、例えば、装置外部から搬送されてくる基板カセットを、装置の前面に設けられたロードポートに載置して受取り、装置内部のカセット収容棚に移送して収容する。基板カセットは、複数の基板を収容する基板収容器である。その後、基板カセットから基板をボート上に垂直方向に積層して多段に搭載し、複数の基板を搭載したボートを処理炉の下方から処理炉内へ挿入し、熱処理を行う。また、装置の前面には、表示操作部が設けられており、装置の稼働状態を表示するとともに、操作者からの各種の運用指示を受け付けるようになっている。 There is a vertical batch processing apparatus as one of the IC manufacturing apparatuses. In a vertical batch type processing apparatus, for example, a substrate cassette conveyed from the outside of the apparatus is placed on a load port provided on the front surface of the apparatus, and is received and transferred to a cassette storage shelf inside the apparatus. . The substrate cassette is a substrate container that stores a plurality of substrates. Thereafter, the substrates are stacked in the vertical direction on the boat from the substrate cassette and mounted in multiple stages, and the boat on which the plurality of substrates are mounted is inserted into the processing furnace from below the processing furnace to perform heat treatment. In addition, a display operation unit is provided on the front surface of the apparatus, and displays an operation state of the apparatus and accepts various operation instructions from an operator.
  下記の特許文献１には、半導体製造装置外部上方にある頭上搬送機から降下してくる基板カセットを載置可能な搬入/搬出ステージ部（ロードポート）と、該半導体製造装置の稼動状況表示および稼動命令操作を受け付ける表示操作部とを、前記半導体製造装置の前面に設けた半導体製造装置が開示されている。 The following Patent Document 1 discloses a loading / unloading stage unit (load port) on which a substrate cassette descending from an overhead transfer machine located outside the semiconductor manufacturing apparatus can be placed, an operation status display of the semiconductor manufacturing apparatus, There is disclosed a semiconductor manufacturing apparatus in which a display operation unit that receives an operation command operation is provided on the front surface of the semiconductor manufacturing apparatus.
特開２００８-２１１２４４公報JP 2008-211244 A
  例えば従来の縦型バッチ式処理装置においては、装置筐体のほぼ全てを金属で構成しているため、装置内部におけるカセット等の基板収容器の搬送状態や収容状態等を目視で確認することが困難であった。
  本発明の目的は、装置内部における基板収容器の搬送状態や収容状態等を目視で確認することのできる半導体製造装置を提供することにある。 For example, in a conventional vertical batch type processing apparatus, since almost all of the apparatus casing is made of metal, it is possible to visually confirm the conveyance state and accommodation state of a substrate container such as a cassette inside the apparatus. It was difficult.
An object of the present invention is to provide a semiconductor manufacturing apparatus capable of visually confirming a transport state, a housing state, and the like of a substrate container inside the device.
  前記課題を解決するための、本発明の半導体製造装置の代表的な構成は、次のとおりである。すなわち、
  半導体製造装置の外郭を形成する筐体と、
  前記半導体製造装置外部との間で基板収容器を受渡すために該装置前部に設けられたロードポートと、
  前記ロードポートの後方であって前記筐体内に設けられた基板収容器搬送機構と、
  前記基板収容器搬送機構の後方であって前記筐体内に設けられた基板収容器保管棚と、
  前記筐体の前面の一部を構成するとともに、前記ロードポートの上方に設けられ、透明窓を有する第１透明窓部と、
  前記半導体製造装置の前部に設けられ、操作員からの操作を受け付ける操作部と、
  を備える半導体製造装置。 A typical configuration of the semiconductor manufacturing apparatus of the present invention for solving the above-described problems is as follows. That is,
A housing that forms an outline of the semiconductor manufacturing apparatus;
A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus;
A substrate container transport mechanism provided in the housing behind the load port;
Substrate container storage shelf provided in the casing behind the substrate container transport mechanism;
Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window;
An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator;
A semiconductor manufacturing apparatus comprising:
  上記の構成によれば、半導体製造装置の前部に操作部と第１透明窓部があるので、操作員が、第１透明窓部を通して装置内部の基板収容器搬送機構などを目視確認しつつ、操作部から操作を行うことができる。 According to the above configuration, since the operation part and the first transparent window part are provided at the front part of the semiconductor manufacturing apparatus, the operator visually confirms the substrate container transport mechanism and the like inside the apparatus through the first transparent window part. The operation can be performed from the operation unit.
本発明の実施形態に係る半導体製造装置の斜透視図である。1 is a perspective view of a semiconductor manufacturing apparatus according to an embodiment of the present invention. 本発明の実施形態に係る半導体製造装置の垂直断面を示す透視図である。It is a perspective view which shows the vertical cross section of the semiconductor manufacturing apparatus which concerns on embodiment of this invention. 本発明の実施形態に係る半導体製造装置の前面の外観を示す斜視図である。It is a perspective view which shows the external appearance of the front surface of the semiconductor manufacturing apparatus which concerns on embodiment of this invention.
  以下、図面を参照して、本発明の実施形態における半導体製造装置を説明する。本実施形態において、半導体製造装置は、一例として、半導体装置（ＩＣ：Integrated Circuit）の製造方法における処理工程を実施する半導体製造装置として構成されている。なお、以下の説明では、半導体製造装置として基板に酸化、拡散処理やＣＶＤ（Chemical Vapor Deposition）処理などを行うバッチ式縦型半導体製造装置（以下、単に処理装置という）を適用した場合について述べる。図１は、本発明が適用される処理装置の透視図であり、斜視図として示されている。また、図２は図１に示す処理装置の側面透視図である。 Hereinafter, a semiconductor manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the present embodiment, as an example, the semiconductor manufacturing apparatus is configured as a semiconductor manufacturing apparatus that performs processing steps in a method of manufacturing a semiconductor device (IC: IntegratedIntegrCircuit). In the following description, a case where a batch type vertical semiconductor manufacturing apparatus (hereinafter simply referred to as a processing apparatus) that performs oxidation, diffusion processing, CVD (Chemical Vapor Deposition) processing, etc., is applied to a substrate as a semiconductor manufacturing apparatus will be described. FIG. 1 is a perspective view of a processing apparatus to which the present invention is applied, and is shown as a perspective view. FIG. 2 is a side perspective view of the processing apparatus shown in FIG.
  図２に示されているように、本実施形態の処理装置１００は、処理装置１００の外郭を形成する筐体１１１を備えている。この処理装置１００では、シリコン等からなるウエハ（基板）２００を収納したウエハキャリアとして、ポッド（基板収容器）１１０が使用されている。筐体１１１は、処理装置１００の前面壁１１１ａ、前面壁１１１ａの下方の前面下部メンテナンス扉１０４、後面壁１１１ｂ、天井壁１１１ｃ、底壁１１１ｄ、左側面壁１１１ｅ、右側面壁１１１ｆ等から構成されている。筐体１１１は、後述する第１透明窓部３２を除き、その大部分が、例えばステンレス等の不透明な材料で構成されている。なお、処理装置１００の前面とは、図１のＡ側であり、後面とはＢ側であり、左側面壁１１１ｅとは、前面から見て左側の側壁であり、右側面壁１１１ｆとは、前面から見て右側の側壁である。 As shown in FIG. 2, the processing apparatus 100 of the present embodiment includes a casing 111 that forms an outline of the processing apparatus 100. In the processing apparatus 100, a pod (substrate container) 110 is used as a wafer carrier that stores a wafer (substrate) 200 made of silicon or the like. The casing 111 includes a front wall 111a of the processing apparatus 100, a front lower maintenance door 104 below the front wall 111a, a rear wall 111b, a ceiling wall 111c, a bottom wall 111d, a left side wall 111e, a right side wall 111f, and the like. . Most of the casing 111 is made of an opaque material such as stainless steel, for example, except for a first transparent window portion 32 described later. The front surface of the processing apparatus 100 is the A side in FIG. 1, the rear surface is the B side, the left side wall 111e is the left side wall as viewed from the front, and the right side wall 111f is from the front. This is the right side wall as viewed.
  筐体１１１の前面壁１１１ａは、天井壁１１１ｃから９０度下方に屈曲するように垂直に延び、ポッド搬入搬出口（基板収容器搬入搬出口）１１２の上端に達している。前面壁１１１ａの下方には、ポッド搬入搬出口１１２が、筐体１１１の内外を連通するように開設されている。ポッド搬入搬出口１１２は、フロントシャッタ（基板収容器搬入搬出口開閉機構）１１３によって開閉されるようになっている。ポッド搬入搬出口１１２の前方には、ロードポート（基板収容器受渡し台）１１４が設置されている。ロードポート１１４は、水平な台であり、その上にポッド１１０が載置されて位置合わせされる。ロードポート１１４は、半導体製造装置外部との間でポッド１１０を受渡すために該装置前部に設けられている。ポッド１１０は、工程内搬送装置（図示せず）によって、ロードポート１１４上に上方から垂直に搬入され、かつまた、ロードポート１１４上から上方へ垂直に搬出されるようになっている。 The front wall 111a of the eaves casing 111 extends vertically so as to be bent 90 degrees downward from the ceiling wall 111c, and reaches the upper end of the pod loading / unloading port (substrate container loading / unloading port) 112. A pod loading / unloading port 112 is opened below the front wall 111 a so as to communicate with the inside and outside of the housing 111. The pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113. A load port (substrate container delivery table) 114 is installed in front of the pod loading / unloading port 112. The load port 114 is a horizontal base on which the pod 110 is placed and aligned. The load port 114 is provided at the front of the apparatus for delivering the pod 110 to and from the outside of the semiconductor manufacturing apparatus. The pod 110 is vertically loaded onto the load port 114 from above by an in-process transfer device (not shown), and is also vertically unloaded from above the load port 114.
  ロードポート１１４の前側下方には、メンテナンス可能なように設けられた開口部としての前面下部メンテナンス口１０３が開設され、この前面下部メンテナンス口１０３を開閉する前面下部メンテナンス扉１０４、１０４がそれぞれ建て付けられている。 A front lower maintenance port 103 serving as an opening provided for maintenance is opened below the front side of the load port 114, and front lower maintenance doors 104 and 104 for opening and closing the front lower maintenance port 103 are respectively installed. It has been.
  筐体１１１内の前後方向の略中央部における上部には、回転棚（基板収容器保管棚）１０５が設置されている。回転棚１０５は、複数個のポッド１１０を保管するように構成されている。回転棚１０５は、垂直に立設されて水平面内で回転される支柱１１６と、支柱１１６から放射状に支持された複数枚の棚板１１７とを備えている。複数枚の棚板１１７は、支柱１１６の上下３段の各位置において、それぞれポッド１１０を複数個載置した状態で保持するように構成されている。 A rotating shelf (substrate container storage shelf) 105 is installed at the upper portion of the substantially central portion in the front-rear direction in the tub housing 111. The rotating shelf 105 is configured to store a plurality of pods 110. The rotating shelf 105 includes a support column 116 that is erected vertically and rotated in a horizontal plane, and a plurality of shelf plates 117 that are supported radially from the support column 116. The plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where a plurality of pods 110 are placed at each of the three positions above and below the column 116.
  図２に示すように、筐体１１１内におけるロードポート１１４と回転棚１０５との間には、ポッド搬送機構（基板収容器搬送機構）１１８が設置されている。ポッド搬送機構１１８は、ポッド１１０を保持したまま昇降可能なポッドエレベータ（基板収容器昇降機構）１１８ａと、水平搬送機構としてのポッド搬送機（基板収容器搬送機）１１８ｂとで構成されており、ポッド搬送機構１１８は、ポッドエレベータ１１８ａとポッド搬送機１１８ｂとの連続動作により、ロードポート１１４、回転棚１０５、後述するポッドオープナ（基板収容器蓋体開閉機構）１２１との間で、ポッド１１０を搬送するように構成されている。
  このように、ポッド搬送機構１１８はロードポート１１４の後方に設けられ、回転棚１０５はポッド搬送機構１１８の後方に設けられている。 As shown in FIG. 2, a pod transfer mechanism (substrate container transfer mechanism) 118 is installed between the load port 114 and the rotating shelf 105 in the casing 111. The pod transport mechanism 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transporter (substrate container transporter) 118b as a horizontal transport mechanism. The pod transport mechanism 118 moves the pod 110 between the load port 114, the rotary shelf 105, and a pod opener (substrate container lid opening / closing mechanism) 121 described later by continuous operation of the pod elevator 118a and the pod transporter 118b. It is comprised so that it may convey.
As described above, the pod transport mechanism 118 is provided behind the load port 114, and the rotating shelf 105 is provided behind the pod transport mechanism 118.
  図２に示すように、筐体１１１内の前後方向の略中央部における下部には、サブ筐体１１９が装置１００の後端にわたって設けられている。サブ筐体１１９の前面壁１１９ａには、ウエハ２００をサブ筐体１１９内に対して搬入搬出するためのウエハ搬入搬出口（基板搬入搬出口）１２０が１対、垂直方向に上下２段に並べられて開設されている。上下段のウエハ搬入搬出口１２０、１２０には、１対のポッドオープナ１２１、１２１がそれぞれ設置されている。 As shown in FIG. 2, a sub-housing 119 is provided across the rear end of the apparatus 100 at a lower portion of the housing 111 at a substantially central portion in the front-rear direction. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 for loading / unloading the wafer 200 into / from the sub-casing 119 are arranged on the front wall 119a of the sub-casing 119 in two vertical stages. Has been established. A pair of pod openers 121 and 121 are installed at the upper and lower wafer loading / unloading ports 120 and 120, respectively.
  ポッドオープナ１２１は、ポッド１１０を載置する載置台１２２、１２２と、ポッド１１０のキャップ（蓋体）を着脱するキャップ着脱機構（蓋体着脱機構）１２３、１２３とを備えている。ポッドオープナ１２１は、載置台１２２に載置されたポッド１１０のキャップをキャップ着脱機構１２３によって着脱することにより、ポッド１１０のウエハ出し入れ口を開閉するように構成されている。載置台１２２は、ウエハ２００を移載する際にポッド１１０が載置される移載棚である。
  このように、基板収容器載置台である載置台１２２は、ウエハ２００をボート２１７へ移載する際にポッド１１０を載置するものであり、ポッド搬送機構１１８の後方であって、回転棚１０５の下方に設けられている。 The pod opener 121 includes mounting bases 122 and 122 on which the pod 110 is placed, and cap attaching / detaching mechanisms (lid attaching / detaching mechanisms) 123 and 123 that attach and detach caps (lids) of the pod 110. The pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123. The mounting table 122 is a transfer shelf on which the pod 110 is mounted when the wafer 200 is transferred.
As described above, the mounting table 122 serving as a substrate container mounting table is for mounting the pod 110 when the wafer 200 is transferred to the boat 217, and is located behind the pod transfer mechanism 118 and on the rotating shelf 105. Is provided below.
  図２に示すように、サブ筐体１１９は、ポッド搬送機構１１８や回転棚１０５の設置空間の雰囲気と隔絶された移載室１２４を構成している。移載室１２４内の前側領域には、ウエハ移載機構（基板移載機構）１２５が設置されている。ウエハ移載機構１２５は、ウエハ２００を水平方向に回転ないし直動可能なウエハ移載機（基板移載機）１２５ａ、およびウエハ移載機１２５ａを昇降させるためのウエハ移載機エレベータ（基板移載機昇降機構）１２５ｂとで構成されている。これら、ウエハ移載機エレベータ１２５ｂおよびウエハ移載機１２５ａの連続動作により、ウエハ移載機１２５ａのツイーザ（基板保持体）１２５ｃをウエハ２００の載置部として、ボート（基板保持具）２１７に対して、ウエハ２００を装填（チャージング）および脱装（ディスチャージング）するように構成されている。 As shown in FIG. 2, the sub housing 119 constitutes a transfer chamber 124 that is isolated from the atmosphere of the installation space of the pod transport mechanism 118 and the rotating shelf 105. A wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region in the transfer chamber 124. The wafer transfer mechanism 125 includes a wafer transfer machine (substrate transfer machine) 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction, and a wafer transfer machine elevator (substrate transfer machine) for raising and lowering the wafer transfer machine 125a. Mounting mechanism elevating mechanism) 125b. By the continuous operation of the wafer transfer machine elevator 125b and the wafer transfer machine 125a, the tweezer (substrate holding body) 125c of the wafer transfer machine 125a is used as a mounting portion for the wafer 200 with respect to the boat (substrate holding tool) 217. The wafer 200 is loaded (charged) and unloaded (discharged).
  図１に示されているように、移載室１２４の左側端部には、清浄化した雰囲気もしくは不活性ガスであるクリーンエア１３３を供給するよう、供給フアンおよび防塵フィルタで構成されたクリーンユニット１３４が設置されている。つまり、クリーンユニット１３４は、ウエハ移載機エレベータ１２５ｂ側と反対側に設置されている。ウエハ移載機１２５ａとクリーンユニット１３４との間には、ウエハの円周方向の位置を整合させる基板整合装置としてのノッチ合わせ装置１３５（不図示）が設置されている。
  クリーンユニット１３４から吹き出されたクリーンエア１３３は、ノッチ合わせ装置１３５およびウエハ移載機１２５ａに流通された後に、図示しないダクトにより吸い込まれて、筐体１１１の外部に排気がなされるか、もしくはクリーンユニット１３４の吸い込み側である一次側（供給側）にまで循環され、再びクリーンユニット１３４によって、移載室１２４内に吹き出されるように構成されている。 As shown in FIG. 1, a clean unit composed of a supply fan and a dustproof filter is supplied to the left end of the transfer chamber 124 so as to supply a clean atmosphere 133 that is a cleaned atmosphere or an inert gas. 134 is installed. That is, the clean unit 134 is installed on the side opposite to the wafer transfer machine elevator 125b side. Between the wafer transfer device 125a and the clean unit 134, a notch alignment device 135 (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer.
The clean air 133 blown out from the clean unit 134 is circulated through the notch alignment device 135 and the wafer transfer device 125a, and then sucked in by a duct (not shown) to be exhausted to the outside of the casing 111 or clean. The unit 134 is circulated to the primary side (supply side) which is the suction side, and is again blown into the transfer chamber 124 by the clean unit 134.
  移載室１２４内の後側領域には、大気圧未満の圧力（以下、負圧という。）を維持可能な機密性能を有する耐圧筐体１４０（不図示）が設置されており、この耐圧筐体１４０により、ボート２１７を収容可能な容積を有するロードロック方式の待機室であるロードロック室１４１（不図示）が形成されている。
  耐圧筐体１４０の前面壁１４０ａ（不図示）には、ウエハ搬入搬出開口（基板搬入搬出開口）１４２（不図示）が開設されており、ウエハ搬入搬出開口１４２は、ゲートバルブ（基板搬入搬出口開閉機構）１４３（不図示）によって開閉されるようになっている。耐圧筐体１４０の１対の側壁には、ロードロック室１４１へ窒素ガスを給気するためのガス供給管１４４（不図示）と、ロードロック室１４１を負圧に排気するための排気管１４５（不図示）とが、それぞれ接続されている。 A pressure-resistant housing 140 (not shown) having a confidential performance capable of maintaining a pressure lower than atmospheric pressure (hereinafter referred to as a negative pressure) is installed in a rear region in the transfer chamber 124. The body 140 forms a load lock chamber 141 (not shown) which is a load lock type standby chamber having a capacity capable of accommodating the boat 217.
A wafer loading / unloading opening (substrate loading / unloading opening) 142 (not illustrated) is provided in the front wall 140a (not illustrated) of the pressure-resistant housing 140, and the wafer loading / unloading opening 142 is configured by a gate valve (substrate loading / unloading outlet). It is opened and closed by an opening / closing mechanism 143 (not shown). A gas supply pipe 144 (not shown) for supplying nitrogen gas to the load lock chamber 141 and an exhaust pipe 145 for exhausting the load lock chamber 141 to a negative pressure are provided on a pair of side walls of the pressure-resistant housing 140. (Not shown) are connected to each other.
  図２に示すように、筐体１１１内におけるロードロック室１４１の上方であって回転棚１０５の後方には、処理炉２０２が設けられている。処理炉２０２は、上端部が閉塞され、下端部が開放された略円筒形状である。処理炉２０２の側壁には、処理炉２０２内に収容されたウエハを加熱処理するためのヒータが設けられている。処理炉２０２の下端部は、炉口ゲートバルブ（炉口開閉機構）１４７により開閉されるように構成されている。耐圧筐体１４０の前面壁１４０ａの上端部には、炉口ゲートバルブ１４７を処理炉２０２の下端部の開放時に収容する炉口ゲートバルブカバー１４９（不図示）が取り付けられている。 As shown in FIG. 2, a processing furnace 202 is provided above the load lock chamber 141 in the housing 111 and behind the rotating shelf 105. The processing furnace 202 has a substantially cylindrical shape in which the upper end is closed and the lower end is opened. On the side wall of the processing furnace 202, a heater for heat-treating the wafer accommodated in the processing furnace 202 is provided. The lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port gate valve (furnace port opening / closing mechanism) 147. A furnace port gate valve cover 149 (not shown) that houses the furnace port gate valve 147 when the lower end portion of the processing furnace 202 is opened is attached to the upper end portion of the front wall 140 a of the pressure-resistant housing 140.
  図１に示されているように、耐圧筐体１４０内には、ボート２１７を昇降させるためのボートエレベータ（基板保持具昇降機構）１１５が設置されている。ボートエレベータ１１５に連結された連結具としてのアーム１２８には、蓋体としてのシールキャップ２１９が水平に据え付けられている。シールキャップ２１９は、ボート２１７を垂直に支持し、処理炉２０２の下端部を閉塞可能なように構成されている。
  ボート２１７は、複数本の保持部材を備えており、複数枚（例えば、５０枚～１２５枚程度）のウエハ２００を、その中心を揃えて垂直方向に整列させた状態で、それぞれ水平に保持するように構成されている。 As shown in FIG. 1, a boat elevator (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is installed in the pressure-resistant housing 140. A seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a coupling tool coupled to the boat elevator 115. The seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.
The boat 217 includes a plurality of holding members, and holds a plurality of (for example, about 50 to 125) wafers 200 horizontally, with their centers aligned and vertically aligned. It is configured as follows.
  次に、本実施形態の処理装置の動作について説明する。
  図１、図２に示されているように、ポッド１１０が上方からロードポート１１４に供給されると、ポッド搬入搬出口１１２がフロントシャッタ１１３によって開放される。ポッド１１０は、ポッド搬送機構１１８により、ポッド搬入搬出口１１２から筐体１１１内へ搬入される。
  搬入されたポッド１１０は、回転棚１０５の指定された棚板１１７へ、ポッド搬送機構１１８によって、自動的に搬送されて受け渡される。 Next, the operation of the processing apparatus of this embodiment will be described.
As shown in FIGS. 1 and 2, when the pod 110 is supplied to the load port 114 from above, the pod loading / unloading port 112 is opened by the front shutter 113. The pod 110 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying mechanism 118.
The loaded pod 110 is automatically conveyed and delivered to the designated shelf plate 117 of the rotating shelf 105 by the pod conveying mechanism 118.
  ポッド１１０は、回転棚１０５で一時的に保管された後、ポッド搬送機構１１８によって、棚板１１７から一方のポッドオープナ１２１に搬送されて載置台１２２に移載される。もしくは、ポッド１１０は、ロードポート１１４から直接、ポッドオープナ１２１に搬送されて、載置台１２２に移載される。このとき、ポッドオープナ１２１のウエハ搬入搬出口１２０は、キャップ着脱機構１２３によって閉じられており、移載室１２４にはクリーンエア１３３が流通され、充満されている。例えば、移載室１２４内が、クリーンエア１３３としての窒素ガスが充満されることにより、移載室１２４内の酸素濃度は、２０ｐｐｍ以下になるよう、移載室１２４の外部であって筐体１１１の内部（大気雰囲気）の酸素濃度よりも遥かに低く設定されている。 After the pod 110 is temporarily stored on the rotary shelf 105, the pod pod 110 is transported from the shelf plate 117 to one pod opener 121 by the pod transport mechanism 118 and transferred to the mounting table 122. Alternatively, the pod 110 is directly transferred from the load port 114 to the pod opener 121 and transferred to the mounting table 122. At this time, the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133. For example, the transfer chamber 124 is filled with nitrogen gas as the clean air 133, so that the oxygen concentration in the transfer chamber 124 is 20 ppm or less outside the transfer chamber 124. It is set much lower than the oxygen concentration inside 111 (atmospheric atmosphere).
  図２に示すように、載置台１２２に載置されたポッド１１０は、その開口側端面が、サブ筐体１１９の前面壁１１９ａにおけるウエハ搬入搬出口１２０の開口縁辺部に押し付けられるとともに、そのキャップが、キャップ着脱機構１２３によって取り外され、ポッド１１０のウエハ出し入れ口１１０ａが開放される。また、予め内部が大気圧状態とされていたロードロック室１４１のウエハ搬入搬出開口１４２が、ゲートバルブ１４３の動作により開放されると、ウエハ２００は、ポッド１１０からウエハ移載機１２５ａのツイーザ１２５ｃによって、ウエハ出し入れ口１１０ａを通じてピックアップされ、ノッチ合わせ装置１３５にてウエハを整合した後、ウエハ搬入搬出開口１４２を通じてロードロック室１４１に搬入され、ボート２１７へ移載されて装填（ウエハチャージング）される。ボート２１７にウエハ２００を受け渡したウエハ移載機１２５ａは、ポッド１１０に戻り、次のウエハ１１０をボート２１７に装填する。 As shown in FIG. 2, the pod 110 mounted on the mounting table 122 has its opening-side end surface pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119 a of the sub-casing 119 and its cap. Is removed by the cap attaching / detaching mechanism 123, and the wafer loading / unloading port 110a of the pod 110 is opened. Further, when the wafer loading / unloading opening 142 of the load lock chamber 141 whose interior is previously set to the atmospheric pressure state is opened by the operation of the gate valve 143, the wafer 200 is moved from the pod 110 to the tweezer 125 c of the wafer transfer machine 125 a. The wafer is picked up through the wafer loading / unloading port 110a, aligned with the notch aligner 135, then loaded into the load lock chamber 141 through the wafer loading / unloading opening 142, transferred to the boat 217 and loaded (wafer charging). The The wafer transfer device 125 a that has transferred the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 110 into the boat 217.
  この一方（上段または下段）のポッドオープナ１２１におけるウエハ移載機１２５によるウエハ２００のボート２１７への装填作業中に、他方（下段または上段）のポッドオープナ１２１には、回転棚１０５ないしロードポート１１４から別のポッド１１０がポッド搬送機構１１８によって搬送され、ポッドオープナ１２１によるポッド１１０の開放作業が同時進行される。 During the loading operation of the wafer 200 to the boat 217 by the wafer transfer device 125 in the one (upper or lower) pod opener 121, the other (lower or upper) pod opener 121 includes the rotating shelf 105 or the load port 114. The other pod 110 is transported by the pod transport mechanism 118, and the pod opener 121 is simultaneously opened by the pod opener 121.
  予め指定された枚数のウエハ２００がボート２１７に装填されると、ウエハ搬入搬出開口１４２がゲートバルブ１４３によって閉じられ、ロードロック室１４１は排気管１４５から真空引きされることにより、減圧される。
  ロードロック室１４１が処理炉２０２内の圧力と同圧に減圧されると、処理炉２０２の下端部が炉口ゲートバルブ１４７によって開放される。このとき、炉口ゲートバルブ１４７は炉口ゲートバルブカバー１４９の内部に搬入されて収容される。
  続いて、シールキャップ２１９がボートエレベータ１１５によって上昇されて、シールキャップ２１９に支持されたボート２１７が、処理炉２０２内へ搬入（ローディング）されて行く。 When a predetermined number of wafers 200 are loaded into the boat 217, the wafer loading / unloading opening 142 is closed by the gate valve 143, and the load lock chamber 141 is evacuated by being evacuated from the exhaust pipe 145.
When the load lock chamber 141 is reduced to the same pressure as that in the processing furnace 202, the lower end portion of the processing furnace 202 is opened by the furnace port gate valve 147. At this time, the furnace port gate valve 147 is carried into and stored in the furnace port gate valve cover 149.
Subsequently, the seal cap 219 is raised by the boat elevator 115, and the boat 217 supported by the seal cap 219 is loaded into the processing furnace 202.
  ローディング後は、処理炉２０２にてウエハ２００に任意の熱処理が実施される。処理後は、ボートエレベータ１１５によりボート２１７が引き出され、更に、ロードロック室１４０内部を大気圧に復圧させた後にゲートバルブ１４３が開かれる。その後は、ノッチ合わせ装置１３５でのウエハの整合工程を除き、概略上述の逆の手順で、ウエハ２００およびポッド１１０は筐体１１１の外部へ払出される。 After the soot loading, an arbitrary heat treatment is performed on the wafer 200 in the processing furnace 202. After the processing, the boat 217 is pulled out by the boat elevator 115, and the gate valve 143 is opened after the inside of the load lock chamber 140 is restored to atmospheric pressure. After that, the wafer 200 and the pod 110 are discharged to the outside of the casing 111 in the reverse procedure described above except for the wafer alignment process in the notch alignment device 135.
  次に、図３を参照して、本実施形態の特徴的部分について説明する。図３は、本発明の実施形態に係る半導体製造装置の前面の外観を示す斜視図であり、主に筐体１１１の前部を示している。
  図３に示されるように、本実施形態においては、筐体１１１の前面壁１１１ａであってロードポート１１４の上方には、前面上部メンテナンス口３５が設けられている。前面上部メンテナンス口３５は、処理装置１００内の前面上部付近をメンテナンスするためのものである。前面上部メンテナンス口３５には、開閉可能な前面上部メンテナンス扉３６が設置され、前面上部メンテナンス扉３６には、透明窓を有する透明窓部３１ａが設けられている。この透明窓は、鉛直方向に延びる透明なアクリル製の板で構成されている。図３において、透明窓はハッチングで示され、筐体１１１のうち、ハッチングで示されていない部分は不透明である。 Next, characteristic parts of the present embodiment will be described with reference to FIG. FIG. 3 is a perspective view showing the appearance of the front surface of the semiconductor manufacturing apparatus according to the embodiment of the present invention, and mainly shows the front portion of the housing 111.
As shown in FIG. 3, in the present embodiment, a front upper maintenance port 35 is provided on the front wall 111 a of the housing 111 and above the load port 114. The front upper maintenance port 35 is for maintaining the vicinity of the upper front surface in the processing apparatus 100. The front upper maintenance port 35 is provided with a front upper maintenance door 36 that can be opened and closed. The front upper maintenance door 36 is provided with a transparent window 31a having a transparent window. This transparent window is made of a transparent acrylic plate extending in the vertical direction. In FIG. 3, the transparent window is indicated by hatching, and a portion of the casing 111 that is not indicated by hatching is opaque.
  透明窓部３１ａの下方には、透明窓部３１ａに連続するように、透明窓を有する透明窓部３１ｂが、前面壁１１１ａ下方のポッド搬入搬出口１１２の上端まで設けられている。この透明窓も、透明窓部３１ａの透明窓と同様に、鉛直方向に延びる透明なアクリル製の板で構成されている。透明窓部３１ａと透明窓部３１ｂから第１透明窓部３１が構成される。このように、第１透明窓部３１は、筐体１１１の前面の一部を構成し、前面壁１１１ａの上部から前面壁１１１ａ下方のポッド搬入搬出口１１２の上端まで設けられている。本例では、透明窓部３１ａの大きさは、縦５９０ｍｍ、横９０５ｍｍであり、透明窓部３１ｂの大きさは、縦５９０ｍｍ、横９０５ｍｍである。なお、透明窓部３１ａと透明窓部３１ｂのいずれか一方だけで、第１透明窓部３１を構成することも可能である。つまり、第１透明窓部３１のうち、透明窓部３１ａのみを透明にする、又は透明窓部３１ｂのみを透明にする構成も可能である。 Under the transparent window 31a, a transparent window 31b having a transparent window is provided to the upper end of the pod loading / unloading port 112 below the front wall 111a so as to be continuous with the transparent window 31a. This transparent window is also composed of a transparent acrylic plate extending in the vertical direction, like the transparent window of the transparent window portion 31a. The 1st transparent window part 31 is comprised from the transparent window part 31a and the transparent window part 31b. Thus, the 1st transparent window part 31 comprises a part of front surface of the housing | casing 111, and is provided from the upper part of the front wall 111a to the upper end of the pod carrying in / out port 112 below the front wall 111a. In this example, the size of the transparent window portion 31a is 590 mm in length and 905 mm in width, and the size of the transparent window portion 31 b is 590 mm in length and 905 mm in width. In addition, it is also possible to comprise the 1st transparent window part 31 only by any one of the transparent window part 31a and the transparent window part 31b. That is, the structure which makes only the transparent window part 31a transparent among the 1st transparent window parts 31 or transparent only the transparent window part 31b is also possible.
  処理装置１００の操作者等は、透明な第１透明窓部３１を通して、筐体１１１内部のポッド搬送機構１１８や回転棚１０５の状態、ポッド搬送機構１１８で搬送中のポッド１１０や回転棚１０５に載置しているポッド１１０の状態等の、ポッド収納状態やポッド搬送状態を、目視により確認することができる。したがって、後述する操作部３４を用いて手動操作によりポッド搬送する際の、安全性や操作性を向上することができる。
  例えば、ポッド１１０の搬送エラーが発生したとき、搬送エラーが発生したことは操作部３４のエラー表示でわかるが、実際に搬送領域のどこでトラブルがおきているかは操作部３４だけではわからず、目視による確認が必要となる。もし、前面上部メンテナンス扉３６が透明でない場合は、前面上部メンテナンス扉３６をあけて、保守員が装置内に入り、トラブルがおきている場所の特定と状態を確認しなければならず、本実施形態よりも操作性が劣り、また、安全性に関する別の対応が必要となる。 An operator or the like of the processing apparatus 100 passes through the transparent first transparent window 31 to the state of the pod transfer mechanism 118 and the rotary shelf 105 inside the casing 111 and to the pod 110 and the rotary shelf 105 being transferred by the pod transfer mechanism 118. It is possible to visually check the pod storage state and the pod transport state, such as the state of the pod 110 being placed. Therefore, safety and operability can be improved when the pod is transported by manual operation using the operation unit 34 described later.
For example, when a transport error has occurred in the pod 110, the fact that a transport error has occurred can be seen from the error display on the operation unit 34, but the actual trouble in the transport area cannot be determined by the operation unit 34 alone. Confirmation by is required. If the front upper maintenance door 36 is not transparent, the front upper maintenance door 36 must be opened and maintenance personnel must enter the device to confirm the location and status of the trouble. The operability is inferior to the form, and another countermeasure for safety is required.
  また、図３に示されるように、操作者からの各種指示を受け付ける操作部３４が取り付けられた操作パネル３３が、筐体１１１の前面壁１１１ａの前方に、前面壁１１１ａと間隔を空けて設けられている。操作パネル３３と前面壁１１１ａの間の空間は、ポッド１１０が工程内搬送装置によって上方からロードポート１１４上に搬入されるときに、上から下へ垂直方向に通過するための空間である。操作パネル３３は、その側面を筐体１１１によって支持されている。
  操作パネル３３は、ほぼ垂直方向に沿った平面を有する垂直部３３ａと、垂直部３３ａの平面と所定の角度をなす平面を有する傾斜部３３ｂから構成される。 Further, as shown in FIG. 3, an operation panel 33 to which an operation unit 34 for receiving various instructions from an operator is attached is provided in front of the front wall 111a of the housing 111 with a space from the front wall 111a. It has been. The space between the operation panel 33 and the front wall 111a is a space for passing the pod 110 vertically from the top to the bottom when the pod 110 is loaded onto the load port 114 from above by the in-process transfer device. The operation panel 33 is supported by the casing 111 on its side surface.
The operation panel 33 includes a vertical portion 33a having a plane substantially along the vertical direction, and an inclined portion 33b having a plane that forms a predetermined angle with the plane of the vertical portion 33a.
  操作パネル３３の垂直部３３ａには、ＬＣＤ等の表示部を含む操作部３４が設けられている。操作部３４は、例えば、タッチパネル等で構成される。操作部３４からは、処理装置１００に対する各種指示、例えば自動運転により成膜処理を実行する指示や、手動により処理レシピを変更する指示や、手動操作によりポッド１１０を回転棚１０５や載置台１２２からロードポート１１４へ搬出する指示等が、処理装置１００の制御部（不図示）に対して指示される。操作部３４の高さは、操作者の目の位置付近に設定され、例えば床から約１６５０ｍｍの位置に設定される。このように、操作部３４は、ロードポート１１４の上方かつ前方に設けられている。 An operation unit 34 including a display unit such as an LCD is provided in the vertical portion 33 a of the heel operation panel 33. The operation unit 34 is configured with, for example, a touch panel. From the operation unit 34, various instructions to the processing apparatus 100, for example, an instruction to execute a film forming process by automatic operation, an instruction to change a processing recipe manually, or a manual operation to move the pod 110 from the rotating shelf 105 or the mounting table 122. An instruction to carry out to the load port 114 is instructed to a control unit (not shown) of the processing apparatus 100. The height of the operation unit 34 is set near the position of the operator's eyes, and is set, for example, at a position of about 1650 mm from the floor. As described above, the operation unit 34 is provided above and in front of the load port 114.
  操作パネル３３の垂直部３３ａの上方には、垂直部３３ａと連続するように、傾斜部３３ｂが設けられている。傾斜部３３ｂの傾斜面が鉛直方向となす角度は、本例では１５度である。傾斜部３３ｂの上部には、横長で長方形の透明窓を有する第２透明窓部３２が設けられている。この透明窓は、透明なアクリル製の板で構成される。本例では、第２透明窓部３２の大きさは、縦１１８ｍｍ、横８００ｍｍである。このように、第２透明窓部３２は、第１透明窓部３１の前方に、第１透明窓部３１と前後方向に離間して設けられている。
  図３に示すように、第２透明窓部３２は、操作パネル３３の傾斜部３３ｂの上端に設けられている。すなわち、傾斜部３３ｂの上端は、横長の長方形に切り欠かれ、該切り欠き部に透明窓が形成されている。これにより、操作者から第２透明窓部３２を通して見た像と第１透明窓部３１を通して見た像が、切れ目なく連続して見えるので、第２透明窓部３２を傾斜部３３ｂの上端でなく中央部に設けた場合と比べ、視認性を向上することができる。また、もし、第２透明窓部３２にアクリルを設けず、横長の長方形に切り欠かれたままの状態とした場合は、例えば操作者の手が操作パネル３３の裏側に入りやすくなり、別途、安全性に関する対応が必要となる。 An inclined portion 33b is provided above the vertical portion 33a of the operation panel 33 so as to be continuous with the vertical portion 33a. In this example, the angle formed by the inclined surface of the inclined portion 33b and the vertical direction is 15 degrees. A second transparent window 32 having a horizontally long and rectangular transparent window is provided on the upper portion of the inclined portion 33b. The transparent window is made of a transparent acrylic plate. In the present example, the size of the second transparent window portion 32 is 118 mm in length and 800 mm in width. As described above, the second transparent window portion 32 is provided in front of the first transparent window portion 31 so as to be separated from the first transparent window portion 31 in the front-rear direction.
As shown in FIG. 3, the second transparent window portion 32 is provided at the upper end of the inclined portion 33 b of the operation panel 33. That is, the upper end of the inclined portion 33b is cut into a horizontally long rectangle, and a transparent window is formed in the cut portion. As a result, the image viewed through the second transparent window portion 32 and the image viewed through the first transparent window portion 31 from the operator can be viewed continuously without any breaks, so that the second transparent window portion 32 is placed at the upper end of the inclined portion 33b. Visibility can be improved compared with the case where it provides in the center part. Also, if acrylic is not provided in the second transparent window portion 32 and the state is not cut into a horizontally long rectangle, for example, the operator's hand can easily enter the back side of the operation panel 33. It is necessary to deal with safety.
  処理装置１００の操作者等は、透明な第２透明窓部３２と第１透明窓部３１を通して、筐体１１１内部のポッド搬送機構１１８や回転棚１０５の状態、ポッド搬送機構１１８で搬送中のポッド１１０や回転棚１０５に載置しているポッド１１０の状態等の、ポッド収納状態やポッド搬送状態を、目視により確認することができる。したがって、安全性や操作性を向上することができる。
  また、処理装置１００の操作者等は、本例では、透明な第２透明窓部３２と第１透明窓部３１を通して、ポッドオープナ１２１の載置台１２２に載置されたポッド１１０の状態等も、目視により確認することが可能である。
  このように、第２透明窓部３２を設けることにより、第１透明窓部３１だけを設ける場合に比べ、処理装置１００内を、より広範囲に目視により確認することができる。 An operator or the like of the processing apparatus 100 passes through the transparent second transparent window portion 32 and the first transparent window portion 31 and is in the state of the pod transfer mechanism 118 and the rotating shelf 105 inside the casing 111 and is being transferred by the pod transfer mechanism 118. The pod storage state and the pod conveyance state such as the state of the pod 110 and the pod 110 placed on the rotating shelf 105 can be visually confirmed. Therefore, safety and operability can be improved.
Further, in this example, the operator of the processing apparatus 100 can also check the state of the pod 110 mounted on the mounting table 122 of the pod opener 121 through the transparent second transparent window portion 32 and the first transparent window portion 31. It can be confirmed visually.
Thus, by providing the 2nd transparent window part 32, compared with the case where only the 1st transparent window part 31 is provided, the inside of the processing apparatus 100 can be visually confirmed in a wider range.
  なお、本発明は、前記実施形態に限定されるものではなく、その要旨を逸脱しない範囲で種々に変更が可能であることはいうまでもない。例えば、透明窓部は、完全に透明ではなく半透明、すなわち内部が少しでも見えるものも含む。また、本発明は、半導体製造装置だけでなく、ＬＣＤ製造装置のようなガラス基板を処理する装置や、他の半導体製造装置にも適用できる。基板処理の処理内容は、ＣＶＤ、ＰＶＤ、酸化膜、窒化膜、金属含有膜等を形成する成膜処理だけでなく、露光処理、リソグラフィ、塗布処理等であってもよい。 Needless to say, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, the transparent window portion is not completely transparent, but includes a portion that is translucent, that is, the inside can be seen at all. Further, the present invention can be applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD manufacturing apparatus and other semiconductor manufacturing apparatuses. The processing content of the substrate processing may be not only film formation processing for forming CVD, PVD, oxide film, nitride film, metal-containing film, etc., but also exposure processing, lithography, coating processing, and the like.
  本明細書には、半導体製造装置に関する少なくとも次の構成が含まれる。すなわち、第１の構成は、
  半導体製造装置の外郭を形成する筐体と、
  前記半導体製造装置外部との間で基板収容器を受渡すために該装置前部に設けられたロードポートと、
  前記ロードポートの後方であって前記筐体内に設けられた基板収容器搬送機構と、
  前記基板収容器搬送機構の後方であって前記筐体内に設けられた基板収容器保管棚と、
  前記筐体の前面の一部を構成するとともに、前記ロードポートの上方に設けられ、透明窓を有する第１透明窓部と、
  前記半導体製造装置の前部に設けられ、操作員からの操作を受け付ける操作部と、
  を備える半導体製造装置。
  このようにすると、半導体製造装置の前部に操作部と第１透明窓部があるので、第１透明窓部を通して装置内部の基板収容器搬送機構などを目視確認しつつ、操作部から操作を行うことができる。 The present specification includes at least the following configuration relating to the semiconductor manufacturing apparatus. That is, the first configuration is
A housing that forms an outline of the semiconductor manufacturing apparatus;
A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus;
A substrate container transport mechanism provided in the housing behind the load port;
Substrate container storage shelf provided in the casing behind the substrate container transport mechanism;
Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window;
An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator;
A semiconductor manufacturing apparatus comprising:
In this way, since there is an operation part and a first transparent window part at the front part of the semiconductor manufacturing apparatus, the operation from the operation part can be performed while visually confirming the substrate container transport mechanism inside the apparatus through the first transparent window part. It can be carried out.
  第２の構成は、前記第１の構成の半導体製造装置であって、
  前記操作部は、前記ロードポートの上方かつ前方に設けられており、
  前記操作部の上方に、前記第１透明窓部と前後方向に離間して設けられ、透明窓を有する第２透明窓部を備える半導体製造装置。
  このようにすると、第２透明窓部があるので、ロードポートの上方かつ前方に設けられた操作部から操作を行う際に、第２透明窓部から第１透明窓部を通して装置内部の基板収容器搬送機構などを目視し易くなる。 The second configuration is the semiconductor manufacturing apparatus of the first configuration,
The operation unit is provided above and in front of the load port,
A semiconductor manufacturing apparatus including a second transparent window having a transparent window, which is provided above the operation unit and spaced apart from the first transparent window in the front-rear direction.
In this case, since there is the second transparent window portion, when the operation is performed from the operation portion provided above and in front of the load port, the substrate inside the apparatus is accommodated from the second transparent window portion through the first transparent window portion. It becomes easy to visually check the container transport mechanism.
  第３の構成は、前記第２の構成の半導体製造装置であって、
  前記第２透明窓部は、前記操作部が取り付けられている操作パネルの上端に設けられている半導体製造装置。
  このようにすると、ロードポートの上方かつ前方に設けられた操作部から操作を行う際に、さらに、第２透明窓部から第１透明窓部を通して装置内部を目視し易くなる。 The third configuration is the semiconductor manufacturing apparatus of the second configuration,
The second transparent window portion is a semiconductor manufacturing apparatus provided at an upper end of an operation panel to which the operation portion is attached.
If it does in this way, when operating from the operation part provided above and ahead of a load port, it will become easy to see the inside of an apparatus further from the 2nd transparent window part through the 1st transparent window part.
  第４の構成は、前記第２の構成又は第３の構成の半導体製造装置であって、
  前記基板収容器搬送機構の後方かつ前記基板収容器保管棚の下方であって前記筐体内に設けられ、基板をボートへ移載する際に基板収容器を載置する基板収容器載置台を備える半導体製造装置。
  このようにすると、ロードポートの上方かつ前方に設けられた操作部から操作を行う際に、第２透明窓部から第１透明窓部を通して装置内部の基板収容器載置台を目視し易くなる。 A fourth configuration is the semiconductor manufacturing apparatus of the second configuration or the third configuration,
Provided in the housing behind the substrate container transfer mechanism and below the substrate container storage shelf, and includes a substrate container mounting table on which the substrate container is mounted when the substrate is transferred to the boat. Semiconductor manufacturing equipment.
If it does in this way, when operating from the operation part provided above and ahead of the load port, it becomes easy to see the substrate container mounting table inside the apparatus from the second transparent window part through the first transparent window part.
  ３１…第１透明窓部、３２…第２透明窓部、３３…操作パネル、３４…操作部、３５…前面上部メンテナンス口、３６…前面上部メンテナンス扉、１００…処理装置、１０３…前面下部メンテナンス口、１０４…前面下部メンテナンス扉、１０５…回転棚、１１０…ポッド、１１０ａ…ウエハ出し入れ口、１１１…筐体、１１１ａ…前面壁、１１１ｂ…後面壁、１１１ｃ…天井壁、１１１ｄ…底壁、１１１ｅ…左側面壁、１１１ｆ…右側面壁、１１２…ポッド搬入搬出口、１１３…フロントシャッタ、１１４…ロードポート、１１５…ボートエレベータ、１１６…支柱、１１７…棚板、１１８…ポッド搬送機構、１１８ａ…ポッドエレベータ、１１８ｂ…ポッド搬送機、１１９…サブ筐体、１２０…ウエハ搬入搬出口、１２１…ポッドオープナ、１２２…載置台、１２３…キャップ着脱機構、１２４…移載室、１２５…ウエハ移載機構、１２８…アーム、１３３…クリーンエア、１３４…クリーンユニット、１４０…耐圧筐体、１４１…ロードロック室、１４２…ウエハ搬入搬出開口、１４７…炉口ゲートバルブ、１４９…炉口ゲートバルブカバー、２００…ウエハ、２０２…処理炉、２１７…ボート、２１９…シールキャップ。 DESCRIPTION OF SYMBOLS 31 ... 1st transparent window part, 32 ... 2nd transparent window part, 33 ... Operation panel, 34 ... Operation part, 35 ... Front upper maintenance port, 36 ... Front upper maintenance door, 100 ... Processing apparatus, 103 ... Lower front maintenance Mouth, 104 ... lower front maintenance door, 105 ... rotating shelf, 110 ... pod, 110a ... wafer inlet / outlet, 111 ... casing, 111a ... front wall, 111b ... rear wall, 111c ... ceiling wall, 111d ... bottom wall, 111e ... left side wall, 111f ... right side wall, 112 ... pod loading / unloading port, 113 ... front shutter, 114 ... load port, 115 ... boat elevator, 116 ... column, 117 ... shelf board, 118 ... pod transport mechanism, 118a ... pod elevator 118b ... Pod carrier, 119 ... Sub housing, 120 ... Wafer loading / unloading port, 121 ... Pod-o Puna, 122 ... mounting table, 123 ... cap attaching / detaching mechanism, 124 ... transfer chamber, 125 ... wafer transfer mechanism, 128 ... arm, 133 ... clean air, 134 ... clean unit, 140 ... pressure-resistant housing, 141 ... load lock Chamber, 142 ... Wafer loading / unloading opening, 147 ... Furnace gate valve, 149 ... Furnace gate valve cover, 200 ... Wafer, 202 ... Processing furnace, 217 ... Boat, 219 ... Seal cap.

Claims (1)

  1.   半導体製造装置の外郭を形成する筐体と、
      前記半導体製造装置外部との間で基板収容器を受渡すために該装置前部に設けられたロードポートと、
      前記ロードポートの後方であって前記筐体内に設けられた基板収容器搬送機構と、
      前記基板収容器搬送機構の後方であって前記筐体内に設けられた基板収容器保管棚と、
      前記筐体の前面の一部を構成するとともに、前記ロードポートの上方に設けられ、透明窓を有する第１透明窓部と、
      前記半導体製造装置の前部に設けられ、操作員からの操作を受け付ける操作部と、
      を備える半導体製造装置。     A housing that forms an outline of the semiconductor manufacturing apparatus;
    A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus;
    A substrate container transport mechanism provided in the housing behind the load port;
    Substrate container storage shelf provided in the casing behind the substrate container transport mechanism;
    Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window;
    An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator;
    A semiconductor manufacturing apparatus comprising:
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