WO2012073765A1 - Dispositif de fabrication de semi-conducteur - Google Patents

Dispositif de fabrication de semi-conducteur Download PDF

Info

Publication number
WO2012073765A1
WO2012073765A1 PCT/JP2011/076964 JP2011076964W WO2012073765A1 WO 2012073765 A1 WO2012073765 A1 WO 2012073765A1 JP 2011076964 W JP2011076964 W JP 2011076964W WO 2012073765 A1 WO2012073765 A1 WO 2012073765A1
Authority
WO
WIPO (PCT)
Prior art keywords
pod
transparent window
semiconductor manufacturing
manufacturing apparatus
wafer
Prior art date
Application number
PCT/JP2011/076964
Other languages
English (en)
Japanese (ja)
Inventor
聡 相澤
中嶋　誠世
朋之 山田
Original Assignee
株式会社日立国際電気
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社日立国際電気 filed Critical 株式会社日立国際電気
Publication of WO2012073765A1 publication Critical patent/WO2012073765A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers

Definitions

  • the present invention relates to a substrate processing technique, and more particularly, in a semiconductor manufacturing apparatus which is a manufacturing apparatus of a semiconductor integrated circuit device (IC), simultaneously processing a plurality of semiconductor substrates (for example, semiconductor wafers) on which a semiconductor integrated circuit is formed.
  • IC semiconductor integrated circuit device
  • the present invention relates to an effective vertical batch processing apparatus.
  • a vertical batch processing apparatus as one of the IC manufacturing apparatuses.
  • a substrate cassette conveyed from the outside of the apparatus is placed on a load port provided on the front surface of the apparatus, and is received and transferred to a cassette storage shelf inside the apparatus.
  • the substrate cassette is a substrate container that stores a plurality of substrates. Thereafter, the substrates are stacked in the vertical direction on the boat from the substrate cassette and mounted in multiple stages, and the boat on which the plurality of substrates are mounted is inserted into the processing furnace from below the processing furnace to perform heat treatment.
  • a display operation unit is provided on the front surface of the apparatus, and displays an operation state of the apparatus and accepts various operation instructions from an operator.
  • Patent Document 1 discloses a loading / unloading stage unit (load port) on which a substrate cassette descending from an overhead transfer machine located outside the semiconductor manufacturing apparatus can be placed, an operation status display of the semiconductor manufacturing apparatus, There is disclosed a semiconductor manufacturing apparatus in which a display operation unit that receives an operation command operation is provided on the front surface of the semiconductor manufacturing apparatus.
  • An object of the present invention is to provide a semiconductor manufacturing apparatus capable of visually confirming a transport state, a housing state, and the like of a substrate container inside the device.
  • a typical configuration of the semiconductor manufacturing apparatus of the present invention for solving the above-described problems is as follows. That is, A housing that forms an outline of the semiconductor manufacturing apparatus; A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus; A substrate container transport mechanism provided in the housing behind the load port; Substrate container storage shelf provided in the casing behind the substrate container transport mechanism; Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window; An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator; A semiconductor manufacturing apparatus comprising:
  • the operation part and the first transparent window part are provided at the front part of the semiconductor manufacturing apparatus, the operator visually confirms the substrate container transport mechanism and the like inside the apparatus through the first transparent window part.
  • the operation can be performed from the operation unit.
  • FIG. 1 is a perspective view of a semiconductor manufacturing apparatus according to an embodiment of the present invention. It is a perspective view which shows the vertical cross section of the semiconductor manufacturing apparatus which concerns on embodiment of this invention. It is a perspective view which shows the external appearance of the front surface of the semiconductor manufacturing apparatus which concerns on embodiment of this invention.
  • the semiconductor manufacturing apparatus is configured as a semiconductor manufacturing apparatus that performs processing steps in a method of manufacturing a semiconductor device (IC: IntegratedIntegrCircuit).
  • IC IntegratedIntegrCircuit
  • a batch type vertical semiconductor manufacturing apparatus hereinafter simply referred to as a processing apparatus
  • CVD Chemical Vapor Deposition
  • FIG. 1 is a perspective view of a processing apparatus to which the present invention is applied, and is shown as a perspective view.
  • FIG. 2 is a side perspective view of the processing apparatus shown in FIG.
  • the processing apparatus 100 of the present embodiment includes a casing 111 that forms an outline of the processing apparatus 100.
  • a pod (substrate container) 110 is used as a wafer carrier that stores a wafer (substrate) 200 made of silicon or the like.
  • the casing 111 includes a front wall 111a of the processing apparatus 100, a front lower maintenance door 104 below the front wall 111a, a rear wall 111b, a ceiling wall 111c, a bottom wall 111d, a left side wall 111e, a right side wall 111f, and the like.
  • Most of the casing 111 is made of an opaque material such as stainless steel, for example, except for a first transparent window portion 32 described later.
  • the front surface of the processing apparatus 100 is the A side in FIG. 1, the rear surface is the B side, the left side wall 111e is the left side wall as viewed from the front, and the right side wall 111f is from the front. This is the right side wall as viewed.
  • the front wall 111a of the eaves casing 111 extends vertically so as to be bent 90 degrees downward from the ceiling wall 111c, and reaches the upper end of the pod loading / unloading port (substrate container loading / unloading port) 112.
  • a pod loading / unloading port 112 is opened below the front wall 111 a so as to communicate with the inside and outside of the housing 111.
  • the pod loading / unloading port 112 is opened and closed by a front shutter (substrate container loading / unloading port opening / closing mechanism) 113.
  • a load port (substrate container delivery table) 114 is installed in front of the pod loading / unloading port 112.
  • the load port 114 is a horizontal base on which the pod 110 is placed and aligned.
  • the load port 114 is provided at the front of the apparatus for delivering the pod 110 to and from the outside of the semiconductor manufacturing apparatus.
  • the pod 110 is vertically loaded onto the load port 114 from above by an in-process transfer device (not shown), and is also vertically unloaded from above the load port 114.
  • a front lower maintenance port 103 serving as an opening provided for maintenance is opened below the front side of the load port 114, and front lower maintenance doors 104 and 104 for opening and closing the front lower maintenance port 103 are respectively installed. It has been.
  • a rotating shelf (substrate container storage shelf) 105 is installed at the upper portion of the substantially central portion in the front-rear direction in the tub housing 111.
  • the rotating shelf 105 is configured to store a plurality of pods 110.
  • the rotating shelf 105 includes a support column 116 that is erected vertically and rotated in a horizontal plane, and a plurality of shelf plates 117 that are supported radially from the support column 116.
  • the plurality of shelf plates 117 are configured to hold a plurality of pods 110 in a state where a plurality of pods 110 are placed at each of the three positions above and below the column 116.
  • a pod transfer mechanism (substrate container transfer mechanism) 118 is installed between the load port 114 and the rotating shelf 105 in the casing 111.
  • the pod transport mechanism 118 includes a pod elevator (substrate container lifting mechanism) 118a that can be moved up and down while holding the pod 110, and a pod transporter (substrate container transporter) 118b as a horizontal transport mechanism.
  • the pod transport mechanism 118 moves the pod 110 between the load port 114, the rotary shelf 105, and a pod opener (substrate container lid opening / closing mechanism) 121 described later by continuous operation of the pod elevator 118a and the pod transporter 118b. It is comprised so that it may convey.
  • the pod transport mechanism 118 is provided behind the load port 114, and the rotating shelf 105 is provided behind the pod transport mechanism 118.
  • a sub-housing 119 is provided across the rear end of the apparatus 100 at a lower portion of the housing 111 at a substantially central portion in the front-rear direction.
  • a pair of wafer loading / unloading ports (substrate loading / unloading ports) 120 for loading / unloading the wafer 200 into / from the sub-casing 119 are arranged on the front wall 119a of the sub-casing 119 in two vertical stages.
  • a pair of pod openers 121 and 121 are installed at the upper and lower wafer loading / unloading ports 120 and 120, respectively.
  • the pod opener 121 includes mounting bases 122 and 122 on which the pod 110 is placed, and cap attaching / detaching mechanisms (lid attaching / detaching mechanisms) 123 and 123 that attach and detach caps (lids) of the pod 110.
  • the pod opener 121 is configured to open and close the wafer loading / unloading port of the pod 110 by attaching / detaching the cap of the pod 110 placed on the placing table 122 by the cap attaching / detaching mechanism 123.
  • the mounting table 122 is a transfer shelf on which the pod 110 is mounted when the wafer 200 is transferred. As described above, the mounting table 122 serving as a substrate container mounting table is for mounting the pod 110 when the wafer 200 is transferred to the boat 217, and is located behind the pod transfer mechanism 118 and on the rotating shelf 105. Is provided below.
  • the sub housing 119 constitutes a transfer chamber 124 that is isolated from the atmosphere of the installation space of the pod transport mechanism 118 and the rotating shelf 105.
  • a wafer transfer mechanism (substrate transfer mechanism) 125 is installed in the front region in the transfer chamber 124.
  • the wafer transfer mechanism 125 includes a wafer transfer machine (substrate transfer machine) 125a capable of rotating or linearly moving the wafer 200 in the horizontal direction, and a wafer transfer machine elevator (substrate transfer machine) for raising and lowering the wafer transfer machine 125a.
  • Mounting mechanism elevating mechanism) 125b mounting mechanism elevating mechanism
  • the tweezer (substrate holding body) 125c of the wafer transfer machine 125a is used as a mounting portion for the wafer 200 with respect to the boat (substrate holding tool) 217.
  • the wafer 200 is loaded (charged) and unloaded (discharged).
  • a clean unit composed of a supply fan and a dustproof filter is supplied to the left end of the transfer chamber 124 so as to supply a clean atmosphere 133 that is a cleaned atmosphere or an inert gas.
  • 134 is installed. That is, the clean unit 134 is installed on the side opposite to the wafer transfer machine elevator 125b side.
  • a notch alignment device 135 (not shown) is installed as a substrate alignment device for aligning the circumferential position of the wafer.
  • the clean air 133 blown out from the clean unit 134 is circulated through the notch alignment device 135 and the wafer transfer device 125a, and then sucked in by a duct (not shown) to be exhausted to the outside of the casing 111 or clean.
  • the unit 134 is circulated to the primary side (supply side) which is the suction side, and is again blown into the transfer chamber 124 by the clean unit 134.
  • a pressure-resistant housing 140 having a confidential performance capable of maintaining a pressure lower than atmospheric pressure (hereinafter referred to as a negative pressure) is installed in a rear region in the transfer chamber 124.
  • the body 140 forms a load lock chamber 141 (not shown) which is a load lock type standby chamber having a capacity capable of accommodating the boat 217.
  • a wafer loading / unloading opening (substrate loading / unloading opening) 142 (not illustrated) is provided in the front wall 140a (not illustrated) of the pressure-resistant housing 140, and the wafer loading / unloading opening 142 is configured by a gate valve (substrate loading / unloading outlet). It is opened and closed by an opening / closing mechanism 143 (not shown).
  • a gas supply pipe 144 (not shown) for supplying nitrogen gas to the load lock chamber 141 and an exhaust pipe 145 for exhausting the load lock chamber 141 to a negative pressure are provided on a pair of side walls of the pressure-resistant housing 140. (Not shown) are connected to each other.
  • a processing furnace 202 is provided above the load lock chamber 141 in the housing 111 and behind the rotating shelf 105.
  • the processing furnace 202 has a substantially cylindrical shape in which the upper end is closed and the lower end is opened.
  • a heater for heat-treating the wafer accommodated in the processing furnace 202 is provided on the side wall of the processing furnace 202.
  • the lower end portion of the processing furnace 202 is configured to be opened and closed by a furnace port gate valve (furnace port opening / closing mechanism) 147.
  • a furnace port gate valve cover 149 (not shown) that houses the furnace port gate valve 147 when the lower end portion of the processing furnace 202 is opened is attached to the upper end portion of the front wall 140 a of the pressure-resistant housing 140.
  • a boat elevator (substrate holder lifting mechanism) 115 for raising and lowering the boat 217 is installed in the pressure-resistant housing 140.
  • a seal cap 219 serving as a lid is horizontally installed on an arm 128 serving as a coupling tool coupled to the boat elevator 115.
  • the seal cap 219 is configured to support the boat 217 vertically and to close the lower end portion of the processing furnace 202.
  • the boat 217 includes a plurality of holding members, and holds a plurality of (for example, about 50 to 125) wafers 200 horizontally, with their centers aligned and vertically aligned. It is configured as follows.
  • the pod loading / unloading port 112 is opened by the front shutter 113.
  • the pod 110 is carried into the housing 111 from the pod carry-in / out port 112 by the pod carrying mechanism 118.
  • the loaded pod 110 is automatically conveyed and delivered to the designated shelf plate 117 of the rotating shelf 105 by the pod conveying mechanism 118.
  • the pod pod 110 is transported from the shelf plate 117 to one pod opener 121 by the pod transport mechanism 118 and transferred to the mounting table 122.
  • the pod 110 is directly transferred from the load port 114 to the pod opener 121 and transferred to the mounting table 122.
  • the wafer loading / unloading port 120 of the pod opener 121 is closed by the cap attaching / detaching mechanism 123, and the transfer chamber 124 is filled with clean air 133.
  • the transfer chamber 124 is filled with nitrogen gas as the clean air 133, so that the oxygen concentration in the transfer chamber 124 is 20 ppm or less outside the transfer chamber 124. It is set much lower than the oxygen concentration inside 111 (atmospheric atmosphere).
  • the pod 110 mounted on the mounting table 122 has its opening-side end surface pressed against the opening edge of the wafer loading / unloading port 120 in the front wall 119 a of the sub-casing 119 and its cap. Is removed by the cap attaching / detaching mechanism 123, and the wafer loading / unloading port 110a of the pod 110 is opened. Further, when the wafer loading / unloading opening 142 of the load lock chamber 141 whose interior is previously set to the atmospheric pressure state is opened by the operation of the gate valve 143, the wafer 200 is moved from the pod 110 to the tweezer 125 c of the wafer transfer machine 125 a.
  • the wafer is picked up through the wafer loading / unloading port 110a, aligned with the notch aligner 135, then loaded into the load lock chamber 141 through the wafer loading / unloading opening 142, transferred to the boat 217 and loaded (wafer charging).
  • the wafer transfer device 125 a that has transferred the wafer 200 to the boat 217 returns to the pod 110 and loads the next wafer 110 into the boat 217.
  • the other (lower or upper) pod opener 121 includes the rotating shelf 105 or the load port 114.
  • the other pod 110 is transported by the pod transport mechanism 118, and the pod opener 121 is simultaneously opened by the pod opener 121.
  • the wafer loading / unloading opening 142 is closed by the gate valve 143, and the load lock chamber 141 is evacuated by being evacuated from the exhaust pipe 145.
  • the load lock chamber 141 is reduced to the same pressure as that in the processing furnace 202, the lower end portion of the processing furnace 202 is opened by the furnace port gate valve 147.
  • the furnace port gate valve 147 is carried into and stored in the furnace port gate valve cover 149.
  • the seal cap 219 is raised by the boat elevator 115, and the boat 217 supported by the seal cap 219 is loaded into the processing furnace 202.
  • FIG. 3 is a perspective view showing the appearance of the front surface of the semiconductor manufacturing apparatus according to the embodiment of the present invention, and mainly shows the front portion of the housing 111.
  • a front upper maintenance port 35 is provided on the front wall 111 a of the housing 111 and above the load port 114.
  • the front upper maintenance port 35 is for maintaining the vicinity of the upper front surface in the processing apparatus 100.
  • the front upper maintenance port 35 is provided with a front upper maintenance door 36 that can be opened and closed.
  • the front upper maintenance door 36 is provided with a transparent window 31a having a transparent window. This transparent window is made of a transparent acrylic plate extending in the vertical direction.
  • the transparent window is indicated by hatching, and a portion of the casing 111 that is not indicated by hatching is opaque.
  • a transparent window 31b having a transparent window is provided to the upper end of the pod loading / unloading port 112 below the front wall 111a so as to be continuous with the transparent window 31a.
  • This transparent window is also composed of a transparent acrylic plate extending in the vertical direction, like the transparent window of the transparent window portion 31a.
  • the 1st transparent window part 31 is comprised from the transparent window part 31a and the transparent window part 31b.
  • the 1st transparent window part 31 comprises a part of front surface of the housing
  • the size of the transparent window portion 31a is 590 mm in length and 905 mm in width
  • the size of the transparent window portion 31 b is 590 mm in length and 905 mm in width.
  • An operator or the like of the processing apparatus 100 passes through the transparent first transparent window 31 to the state of the pod transfer mechanism 118 and the rotary shelf 105 inside the casing 111 and to the pod 110 and the rotary shelf 105 being transferred by the pod transfer mechanism 118. It is possible to visually check the pod storage state and the pod transport state, such as the state of the pod 110 being placed. Therefore, safety and operability can be improved when the pod is transported by manual operation using the operation unit 34 described later. For example, when a transport error has occurred in the pod 110, the fact that a transport error has occurred can be seen from the error display on the operation unit 34, but the actual trouble in the transport area cannot be determined by the operation unit 34 alone. Confirmation by is required. If the front upper maintenance door 36 is not transparent, the front upper maintenance door 36 must be opened and maintenance personnel must enter the device to confirm the location and status of the trouble. The operability is inferior to the form, and another countermeasure for safety is required.
  • an operation panel 33 to which an operation unit 34 for receiving various instructions from an operator is attached is provided in front of the front wall 111a of the housing 111 with a space from the front wall 111a. It has been.
  • the space between the operation panel 33 and the front wall 111a is a space for passing the pod 110 vertically from the top to the bottom when the pod 110 is loaded onto the load port 114 from above by the in-process transfer device.
  • the operation panel 33 is supported by the casing 111 on its side surface.
  • the operation panel 33 includes a vertical portion 33a having a plane substantially along the vertical direction, and an inclined portion 33b having a plane that forms a predetermined angle with the plane of the vertical portion 33a.
  • An operation unit 34 including a display unit such as an LCD is provided in the vertical portion 33 a of the heel operation panel 33.
  • the operation unit 34 is configured with, for example, a touch panel. From the operation unit 34, various instructions to the processing apparatus 100, for example, an instruction to execute a film forming process by automatic operation, an instruction to change a processing recipe manually, or a manual operation to move the pod 110 from the rotating shelf 105 or the mounting table 122.
  • An instruction to carry out to the load port 114 is instructed to a control unit (not shown) of the processing apparatus 100.
  • the height of the operation unit 34 is set near the position of the operator's eyes, and is set, for example, at a position of about 1650 mm from the floor. As described above, the operation unit 34 is provided above and in front of the load port 114.
  • An inclined portion 33b is provided above the vertical portion 33a of the operation panel 33 so as to be continuous with the vertical portion 33a.
  • the angle formed by the inclined surface of the inclined portion 33b and the vertical direction is 15 degrees.
  • a second transparent window 32 having a horizontally long and rectangular transparent window is provided on the upper portion of the inclined portion 33b.
  • the transparent window is made of a transparent acrylic plate.
  • the size of the second transparent window portion 32 is 118 mm in length and 800 mm in width.
  • the second transparent window portion 32 is provided in front of the first transparent window portion 31 so as to be separated from the first transparent window portion 31 in the front-rear direction. As shown in FIG.
  • the second transparent window portion 32 is provided at the upper end of the inclined portion 33 b of the operation panel 33. That is, the upper end of the inclined portion 33b is cut into a horizontally long rectangle, and a transparent window is formed in the cut portion.
  • the image viewed through the second transparent window portion 32 and the image viewed through the first transparent window portion 31 from the operator can be viewed continuously without any breaks, so that the second transparent window portion 32 is placed at the upper end of the inclined portion 33b. Visibility can be improved compared with the case where it provides in the center part.
  • acrylic is not provided in the second transparent window portion 32 and the state is not cut into a horizontally long rectangle, for example, the operator's hand can easily enter the back side of the operation panel 33. It is necessary to deal with safety.
  • An operator or the like of the processing apparatus 100 passes through the transparent second transparent window portion 32 and the first transparent window portion 31 and is in the state of the pod transfer mechanism 118 and the rotating shelf 105 inside the casing 111 and is being transferred by the pod transfer mechanism 118.
  • the pod storage state and the pod conveyance state such as the state of the pod 110 and the pod 110 placed on the rotating shelf 105 can be visually confirmed. Therefore, safety and operability can be improved.
  • the operator of the processing apparatus 100 can also check the state of the pod 110 mounted on the mounting table 122 of the pod opener 121 through the transparent second transparent window portion 32 and the first transparent window portion 31. It can be confirmed visually.
  • the inside of the processing apparatus 100 can be visually confirmed in a wider range.
  • the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.
  • the transparent window portion is not completely transparent, but includes a portion that is translucent, that is, the inside can be seen at all.
  • the present invention can be applied not only to a semiconductor manufacturing apparatus but also to an apparatus for processing a glass substrate such as an LCD manufacturing apparatus and other semiconductor manufacturing apparatuses.
  • the processing content of the substrate processing may be not only film formation processing for forming CVD, PVD, oxide film, nitride film, metal-containing film, etc., but also exposure processing, lithography, coating processing, and the like.
  • the present specification includes at least the following configuration relating to the semiconductor manufacturing apparatus. That is, the first configuration is A housing that forms an outline of the semiconductor manufacturing apparatus; A load port provided at the front of the apparatus for transferring the substrate container to and from the outside of the semiconductor manufacturing apparatus; A substrate container transport mechanism provided in the housing behind the load port; Substrate container storage shelf provided in the casing behind the substrate container transport mechanism; Forming a part of the front surface of the housing, provided above the load port, a first transparent window portion having a transparent window; An operation unit that is provided at a front portion of the semiconductor manufacturing apparatus and receives an operation from an operator; A semiconductor manufacturing apparatus comprising: In this way, since there is an operation part and a first transparent window part at the front part of the semiconductor manufacturing apparatus, the operation from the operation part can be performed while visually confirming the substrate container transport mechanism inside the apparatus through the first transparent window part. It can be carried out.
  • the second configuration is the semiconductor manufacturing apparatus of the first configuration,
  • the operation unit is provided above and in front of the load port,
  • a semiconductor manufacturing apparatus including a second transparent window having a transparent window, which is provided above the operation unit and spaced apart from the first transparent window in the front-rear direction.
  • the substrate inside the apparatus is accommodated from the second transparent window portion through the first transparent window portion. It becomes easy to visually check the container transport mechanism.
  • the third configuration is the semiconductor manufacturing apparatus of the second configuration
  • the second transparent window portion is a semiconductor manufacturing apparatus provided at an upper end of an operation panel to which the operation portion is attached. If it does in this way, when operating from the operation part provided above and ahead of a load port, it will become easy to see the inside of an apparatus further from the 2nd transparent window part through the 1st transparent window part.
  • a fourth configuration is the semiconductor manufacturing apparatus of the second configuration or the third configuration, Provided in the housing behind the substrate container transfer mechanism and below the substrate container storage shelf, and includes a substrate container mounting table on which the substrate container is mounted when the substrate is transferred to the boat. Semiconductor manufacturing equipment. If it does in this way, when operating from the operation part provided above and ahead of the load port, it becomes easy to see the substrate container mounting table inside the apparatus from the second transparent window part through the first transparent window part.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de fabrication de semi-conducteur qui est équipé : d'un boîtier formant l'extérieur du dispositif de fabrication de semi-conducteur; d'un port de charge agencé dans la partie avant du dispositif de l'invention afin d'assurer le transfert d'un réceptacle de substrat avec la partie externe dudit dispositif de fabrication de semi-conducteur; d'un mécanisme de transport de réceptacle de substrat agencé à l'intérieur dudit boîtier vers l'arrière dudit port de charge; d'un rayonnage de stockage pour réceptacle de substrat agencé à l'intérieur dudit boîtier vers l'arrière dudit mécanisme de transport de réceptacle de substrat; d'une première partie fenêtre transparente qui configure une partie de la face avant dudit boîtier, qui est agencée au-dessus dudit port de charge, et qui possède une fenêtre transparente; et d'une partie opération qui est agencée sur la partie avant dudit dispositif de fabrication de semi-conducteur, et qui reçoit les opérations effectuées par un opérateur.
PCT/JP2011/076964 2010-11-29 2011-11-22 Dispositif de fabrication de semi-conducteur WO2012073765A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010264806A JP2014029891A (ja) 2010-11-29 2010-11-29 半導体製造装置
JP2010-264806 2010-11-29

Publications (1)

Publication Number Publication Date
WO2012073765A1 true WO2012073765A1 (fr) 2012-06-07

Family

ID=46171707

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2011/076964 WO2012073765A1 (fr) 2010-11-29 2011-11-22 Dispositif de fabrication de semi-conducteur

Country Status (2)

Country Link
JP (1) JP2014029891A (fr)
WO (1) WO2012073765A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3573093A4 (fr) * 2017-01-23 2020-11-04 Murata Machinery, Ltd. Dispositif de relais d'article et dispositif de stockage

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7352667B2 (ja) * 2022-01-12 2023-09-28 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法およびプログラム

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04112787U (ja) * 1991-03-14 1992-09-30 株式会社安川電機 マスタ・スレーブ ロボツト
JP2001351963A (ja) * 2000-06-09 2001-12-21 Hitachi Kokusai Electric Inc 基板処理装置
JP2002110758A (ja) * 2000-09-22 2002-04-12 Applied Materials Inc オープンカセット用ロードポート
JP2003021662A (ja) * 2001-07-09 2003-01-24 Canon Inc Ｃｄｍ試験装置
JP2004031901A (ja) * 2002-02-25 2004-01-29 Asm Internatl Nv センサボックスを備えたウエハ処理装置
JP2004207687A (ja) * 2002-12-10 2004-07-22 Sharp Corp 半導体製造装置とそれを用いた半導体製造方法
JP2005521926A (ja) * 2002-02-06 2005-07-21 サイバーオプティクス セミコンダクタ インコーポレイテッド ワイヤレス基板状センサ
JP2005313253A (ja) * 2004-04-27 2005-11-10 Disco Abrasive Syst Ltd 切削装置
JP2006093204A (ja) * 2004-09-21 2006-04-06 Hitachi Kokusai Electric Inc 半導体装置の製造方法
JP2006247760A (ja) * 2005-03-08 2006-09-21 Disco Abrasive Syst Ltd 加工装置
JP2008211244A (ja) * 2008-04-24 2008-09-11 Hitachi Kokusai Electric Inc 半導体製造装置、半導体製造装置の操作方法および半導体デバイスの製造方法

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04112787U (ja) * 1991-03-14 1992-09-30 株式会社安川電機 マスタ・スレーブ ロボツト
JP2001351963A (ja) * 2000-06-09 2001-12-21 Hitachi Kokusai Electric Inc 基板処理装置
JP2002110758A (ja) * 2000-09-22 2002-04-12 Applied Materials Inc オープンカセット用ロードポート
JP2003021662A (ja) * 2001-07-09 2003-01-24 Canon Inc Ｃｄｍ試験装置
JP2005521926A (ja) * 2002-02-06 2005-07-21 サイバーオプティクス セミコンダクタ インコーポレイテッド ワイヤレス基板状センサ
JP2004031901A (ja) * 2002-02-25 2004-01-29 Asm Internatl Nv センサボックスを備えたウエハ処理装置
JP2004207687A (ja) * 2002-12-10 2004-07-22 Sharp Corp 半導体製造装置とそれを用いた半導体製造方法
JP2005313253A (ja) * 2004-04-27 2005-11-10 Disco Abrasive Syst Ltd 切削装置
JP2006093204A (ja) * 2004-09-21 2006-04-06 Hitachi Kokusai Electric Inc 半導体装置の製造方法
JP2006247760A (ja) * 2005-03-08 2006-09-21 Disco Abrasive Syst Ltd 加工装置
JP2008211244A (ja) * 2008-04-24 2008-09-11 Hitachi Kokusai Electric Inc 半導体製造装置、半導体製造装置の操作方法および半導体デバイスの製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3573093A4 (fr) * 2017-01-23 2020-11-04 Murata Machinery, Ltd. Dispositif de relais d'article et dispositif de stockage

Also Published As

Publication number Publication date
JP2014029891A (ja) 2014-02-13

Similar Documents

Publication Publication Date Title
KR100932961B1 (ko) 기판 처리 장치 및 반도체 장치의 제조 방법
US8128333B2 (en) Substrate processing apparatus and manufacturing method for semiconductor devices
KR100831933B1 (ko) 기판처리장치 및 반도체장치의 제조방법
JP4642619B2 (ja) 基板処理システム及び方法
JP2009010009A (ja) 基板処理装置及び半導体装置の製造方法
WO2018051921A1 (fr) Main de transport de substrat, robot de transport de substrat et dispositif de transfert de substrat
JP6871384B2 (ja) 半導体装置の製造方法、基板処理装置及びプログラム
JPH07297257A (ja) 処理装置
WO2015046062A1 (fr) Dispositif de traitement de substrat, procédé de fabrication pour dispositif à semi-conducteurs et support d'enregistrement
US20100280653A1 (en) Substrate processing apparatus and semiconductor device manufacturing method
KR101004031B1 (ko) 기판 처리 장치 및 반도체 장치의 제조 방법
JP5164416B2 (ja) 基板処理装置、収納容器の搬送方法および半導体装置の製造方法
JP2012054392A (ja) 基板処理装置及び半導体装置の製造方法
WO2012073765A1 (fr) Dispositif de fabrication de semi-conducteur
JP4048074B2 (ja) 処理装置
JP2011243677A (ja) 基板処理装置
JP2014060338A (ja) 基板処理装置
JP2005277049A (ja) 熱処理システム及び熱処理方法
JP2014067797A (ja) 基板処理装置、基板処理方法及び半導体装置の製造方法
CN110047791B (zh) 基板处理装置、半导体器件的制造方法以及记录介质
KR102298425B1 (ko) 기판 처리 장치, 반도체 장치의 제조 방법, 및 기록매체
JP2014060337A (ja) 基板処理装置及び基板処理方法
JP2002246436A (ja) 基板処理装置
JP2010225617A (ja) 基板処理システム
JP2011204865A (ja) 基板処理装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11844202

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 11844202

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP