JP2011171648A - Substrate processing system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing system capable of utilizing mapping information. <P>SOLUTION: This substrate processing system capable of utilizing mapping information includes: a main control portion recognizing a carrier identifier of a pod with a plurality of wafers housed therein; a transport control portion for controlling an operation control portion for transporting the wafer according to an instruction from the main control portion; and a mapping device for detecting presence of the wafer in a slot of the pod; wherein the main control portion creates a carrier identifier-mapping information accumulation table 91 accumulating mapping information including detection results of the mapping device by being related to the carrier identifier. The mapping information can be utilized by extracting a specific carrier history file 92 based on the table 91. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a substrate processing system.
For example, the present invention relates to a device that is effective for production management of a semiconductor wafer (hereinafter referred to as a wafer) on which an IC is manufactured in a manufacturing factory of a semiconductor integrated circuit device (hereinafter referred to as an IC).

In an IC manufacturing factory, a plurality of wafers (usually 25) are stored and handled in a carrier having a substantially cubic box shape. The carrier is provided with a plurality of slots, and a plurality of wafers are accommodated in the carrier by inserting a wafer into each slot. For example, a pair of holding grooves are formed on the inner surfaces of the pair of side walls of the carrier so as to face each other, and one slot is constituted by the pair of holding grooves.
In general, a substrate processing apparatus that performs film formation or heat treatment on a wafer is provided with a mapping device that detects in which slot of the carrier the wafer is stored. For example, see Patent Document 1.

JP 2009-111404 A

  In the conventional substrate processing system, the detection result of the mapping apparatus is merely used as the presence / absence information of the wafer in each slot.

  The object of the present invention is to collect the detection results of the mapping device at the time of carrying in the carrier, accumulate the results for each carrier, and compare them with each other, thereby grasping the characteristics of the carrier and identifying the slot or carrier having a high error occurrence frequency. It is to provide a substrate processing system that can be specified.

Typical means for solving the problems are as follows.
A main control unit for acquiring a carrier identifier of a carrier containing a plurality of substrates;
A transport control unit that controls an operation control unit that transports the substrate in accordance with an instruction from the main control unit;
A mapping device for detecting the presence or absence of the substrate in the slot of the carrier;
With
The main control unit accumulates mapping information including a detection result of the mapping device in association with the carrier identifier, and stores the mapping information.

  According to the above means, it is possible to specify a carrier or a slot having a high error occurrence frequency, so that it can be used as a necessity determination for maintenance work such as carrier replacement. In addition, when errors in a predetermined slot frequently occur, carrier replacement or readjustment is necessary, so that it can be used for determining whether maintenance work or adjustment work is necessary.

It is a perspective view which shows the substrate processing apparatus with which the substrate processing system which is one Embodiment of this invention is mounted. 1 is a side sectional view showing a substrate processing apparatus on which a substrate processing system according to an embodiment of the present invention is mounted. 1 is a block diagram illustrating a substrate processing system according to an embodiment of the present invention. It is a block diagram which shows the management apparatus with which the some substrate processing apparatus was connected. It is a flowchart which shows a carrier ID-mapping information storage flow.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

1 to 5 show an embodiment of the present invention.
The substrate processing system according to the present embodiment is configured to control the substrate processing apparatus 1 shown in FIGS.

As shown in FIGS. 1 and 2, the substrate processing apparatus 1 includes a housing 2, and a front maintenance port serving as an opening provided in a lower portion of the front wall 3 of the housing 2 so that maintenance is possible. 4 is opened, and the front maintenance port 4 is opened and closed by the front maintenance door 5.
A pod loading / unloading port 6 is opened on the front wall 3 of the housing 2 so as to communicate with the inside and outside of the housing 2, and the pod loading / unloading port 6 is opened and closed by a front shutter (loading / unloading opening / closing mechanism) 7. . A load port (substrate transfer container delivery table) 8 is installed on the front front side of the pod loading / unloading port 6, and the load port 8 is configured to align the pod 9 as a carrier placed thereon. .
The pod 9 is a hermetically sealed substrate transfer container (carrier), and is loaded onto the load port 8 by an in-process transfer device (not shown) and unloaded from the load port 8.

A rotary pod shelf (substrate transfer container storage shelf) 11 is installed at an upper portion of the housing 2 at a substantially central portion in the front-rear direction. The rotary pod shelf 11 stores a plurality of pods 9. It is configured. The rotary pod shelf 11 is a vertically-supported support column 12 that is erected vertically, and a plurality of shelf plates (substrate transfer container mounting shelves) 13 that are radially supported by the support column 12 at the upper, middle, and lower positions. The shelf board 13 is configured to store a plurality of pods 9 mounted thereon.
A pod opener (substrate transport container lid opening / closing mechanism) 14 is provided below the rotary pod shelf 11. The pod opener 14 has a configuration in which the pod 9 is placed and the lid of the pod 9 can be opened and closed.
A pod transfer device (container transfer device) 15 is installed between the load port 8 and the rotary pod shelf 11 and the pod opener 14. The pod transfer device 15 holds the pod 9 and can be moved up and down in the CZ axis direction and can be moved back and forth in the CX axis direction. The pod 9 can be moved between the load port 8, the rotary pod shelf 11 and the pod opener 14. It is comprised so that it may convey.

A sub-housing 16 is provided over the rear end of the lower portion of the substantially central portion in the front-rear direction in the housing 2. A pair of wafer loading / unloading ports (substrate loading / unloading ports) 19 for loading / unloading a wafer 18 as a substrate into / from the sub-casing 16 are arranged on the front wall 17 of the sub-casing 16 in two vertical stages. The pod openers 14 are provided for the upper and lower wafer loading / unloading ports 19, 19.
The pod opener 14 includes a mounting table 21 on which the pod 9 is mounted and an opening / closing mechanism 22 that opens and closes the lid of the pod 9. The pod opener 14 is configured to open and close the wafer entrance / exit of the pod 9 by opening and closing the lid of the pod 9 mounted on the mounting table 21 by the opening / closing mechanism 22.
The pod opener 14 is provided with a mapping device (not shown). The mapping device detects in which slot (not shown) of the pod 9 as a carrier the wafer 18 is stored, and outputs the detection result.

The sub-casing 16 constitutes a transfer chamber 23 that is airtight from the space (pod transport space) in which the pod transport device 15 and the rotary pod shelf 11 are disposed. A wafer transfer mechanism (substrate transfer mechanism) 24 is installed in the front region of the transfer chamber 23, and the wafer transfer mechanism 24 mounts a required number of wafers (5 in the drawing) on which the wafers 18 are mounted. A wafer mounting plate 25 is provided, and the wafer mounting plate 25 can move in the horizontal direction, rotate in the horizontal direction, and move up and down. The wafer transfer mechanism 24 is configured to load and unload the wafer 18 with respect to the boat (substrate holder) 26.
Further, the wafer transfer mechanism 24 has an axis for adjusting the operation of the wafer mounting plate 25 when the wafer mounting plate 25 holding the wafer 18 takes the wafer 18 from a predetermined location and places it at the predetermined location. A certain X axis, a Y axis which is an axis for adjusting an approach angle when the wafer mounting plate 25 transfers the wafer 18 to the boat 26, and a case where the wafer mounting plate 25 transfers the wafer 18 to the boat 26. Four parameters are set: a Z-axis, which is an axis for adjusting the height of entry, and a V-axis, which finely adjusts the Z-axis to adjust the insertion interval of the wafer 18 into the boat 26.

In the rear region of the transfer chamber 23, a standby unit 27 that accommodates and waits for the boat 26 is configured, and a vertical processing furnace 28 is provided above the standby unit 27. The processing furnace 28 has a processing chamber 29 formed therein, the lower end portion of the processing chamber 29 is a furnace port portion, and the furnace port portion is opened and closed by a furnace port shutter (furnace port opening / closing mechanism) 31. Yes.
A boat elevator (substrate holder lifting device) 32 for raising and lowering the boat 26 is installed between the right end of the housing 2 and the right end of the standby unit 27 of the sub housing 16. A seal cap 34 as a lid is horizontally attached to the arm 33 connected to the elevator platform of the boat elevator 32, and the seal cap 34 supports the boat 26 vertically and loads the boat 26 into the processing chamber 29. In this state, the furnace port can be hermetically closed.
The boat 26 is configured to hold a plurality of (for example, about 50 to 125) wafers 18 in a horizontal posture with the wafer 18 aligned in the center.

A clean unit 35 is disposed at a position opposite to the boat elevator 32 side, and the clean unit 35 includes a supply fan and a dustproof filter so as to supply a clean atmosphere or clean air 36 that is an inert gas. . Between the wafer transfer mechanism 24 and the clean unit 35, a notch alignment device (not shown) is installed as a substrate alignment device that aligns the circumferential position of the wafer 18.
Clean air 36 blown out from the clean unit 35 is circulated through a notch aligner (not shown), the wafer transfer mechanism 24, and the boat 26, and then sucked in through a duct (not shown) and exhausted outside the housing 2. Or is blown out into the transfer chamber 23 by the clean unit 35.

  Next, the operation of the substrate processing apparatus 1 will be described.

When the pod 9 is supplied to the load port 8, the pod loading / unloading port 6 is opened by the front shutter 7. The pod 9 on the load port 8 is loaded into the housing 2 through the pod loading / unloading port 6 by the pod conveying device 15 and placed on the designated shelf plate 13 of the rotary pod rack 11. After the pod 9 is temporarily stored in the rotary pod shelf 11, the pod 9 is transferred from the shelf 13 to one of the pod openers 14 by the pod transfer device 15 and transferred to the mounting table 21, or the load port. 8 is directly transferred to the mounting table 21.
At this time, the wafer loading / unloading port 19 is closed by the opening / closing mechanism 22, and the transfer chamber 23 is filled with clean air 36. When the transfer chamber 23 is filled with nitrogen gas as clean air 36, for example, the oxygen concentration is set to 20 ppm or less, which is much lower than the oxygen concentration inside the housing 2 (atmosphere).

The pod 9 mounted on the mounting table 21 has its opening-side end face pressed against the opening edge of the wafer loading / unloading port 19 in the front wall 17 of the sub-housing 16, and the lid is removed by the opening / closing mechanism 22. The doorway is opened.
When the pod 9 is opened, the mapping device detects in which slot of the pod 9 the wafer 18 is stored, and outputs the detection result.
When mapping by the mapping apparatus is completed, the wafer 18 is taken out from the pod 9 by the wafer transfer mechanism 24, transferred to a notch aligner (not shown), aligned with the notch aligner, and then transferred to the wafer. The mechanism 24 loads the wafer 18 into the standby unit 27 behind the transfer chamber 23 and loads (charges) the boat 26.
The wafer transfer mechanism 24 that has transferred the wafer 18 to the boat 26 returns to the pod 9 and loads the next wafer 18 into the boat 26.

  During the operation of loading the wafer 18 into the boat 26 by the wafer transfer mechanism 24 in one (upper or lower) pod opener 14, the other (lower or upper) pod opener 14 receives another pod from the rotary pod shelf 11. 9 is transferred by the pod transfer device 15 and transferred, and the opening operation of the pod 9 by the other pod opener 14 is simultaneously performed.

When a predetermined number of wafers 18 are loaded into the boat 26, the furnace port portion of the processing furnace 28 closed by the furnace port shutter 31 is opened by the furnace port shutter 31.
Subsequently, the boat 26 is raised by the boat elevator 32 and loaded into the processing chamber 29.
After loading, the furnace port is hermetically closed by the seal cap 34.

The processing chamber 29 is evacuated to a desired pressure (degree of vacuum) by a gas exhaust mechanism (not shown). Further, the processing chamber 29 is heated to a predetermined temperature by a heater driving unit (not shown) so as to have a desired temperature distribution.
In addition, a process gas controlled to a predetermined flow rate is supplied by a gas supply mechanism (not shown), and the process gas is in contact with the surface of the wafer 18 in the course of flowing through the process chamber 29. A thin film is formed on the surface of the wafer 18 by the CVD reaction.
Further, the processed gas after the reaction is exhausted from the processing chamber 29 by the gas exhaust mechanism.

When a preset processing time has elapsed, an inert gas is supplied from an inert gas supply source (not shown) by the gas supply mechanism, the processing chamber 29 is replaced with the inert gas, and the pressure in the processing chamber 29 is increased. Is restored to normal pressure.
The boat 26 is lowered by the boat elevator 32 through the seal cap 34.

Regarding the unloading of the wafer 18 after the processing, the wafer 18 and the pod 9 are discharged to the outside of the housing 2 in the reverse procedure.
Further, unprocessed wafers 18 are loaded into the boat 26, and batch processing of the wafers 18 is repeated.

  A pod 9 containing a plurality of wafers 18 is transported between the load port 8, the rotary pod shelf 11, and the pod opener 14, and the wafers 18 in the pod 9 are transported to a boat 26, or to a processing furnace 28. A transport mechanism for transporting the boat 26, a gas supply mechanism for supplying a processing gas or the like to the processing furnace 28, a gas exhaust mechanism for exhausting the inside of the processing furnace 28, a heater driving unit for heating the processing furnace 28 to a predetermined temperature, and each transport mechanism, A control device 37 for controlling the gas supply mechanism, the gas exhaust mechanism, and the heater drive unit will be described with reference to FIG.

In FIG. 3, reference numeral 38 denotes a process control unit as a process system controller, 39 denotes a transfer control unit as a transfer system controller, and 41 denotes a main control unit. The process control unit 38 includes a storage unit 42, and the storage unit 42 stores a process execution program necessary for executing a process. The transfer control unit 39 includes a storage unit 43. The storage unit 43 includes a transfer program for executing transfer processing of the wafer 18, and three transfer mechanisms of the pod transfer device 15, the wafer transfer mechanism 24, and the boat elevator 32. An operation control program for controlling the operation is stored. The main control unit 41 includes data storage means 44, and the data storage means 44 is composed of an external storage device such as an HDD.
The process execution program, the transfer program, and the operation control program may be stored in the data storage unit 44.

45, 46 and 47 exemplify sub-controllers, for example, 45 is a first sub-controller for controlling the heating of the processing furnace 28, 46 controls the opening / closing of valves and the operation of a flow rate controller, etc. A second sub-controller 47 for controlling the supply flow rate of the processing gas to 28, and a third sub-controller 47 for controlling the exhaust of the gas from the processing furnace 28 or for controlling the pressure of the processing furnace 28 are shown.
Reference numerals 48, 49, and 51 exemplify actuators. For example, 48 is a heater (hereinafter referred to as a first process actuator) controlled by the first sub-controller 45, and 49 is controlled by the second sub-controller 46. A flow controller (hereinafter referred to as a second process actuator) 51 is a pressure control valve (hereinafter referred to as a third process actuator) controlled by the third sub-controller 47.
Reference numerals 52, 53, and 54 exemplify sensors that detect the state of the actuator and feed back the detection results to the first sub controller 45, the second sub controller 46, and the third sub controller 47. For example, 52 is a temperature detector. (Hereinafter referred to as a first process sensor), 53 is a flow rate detector (hereinafter referred to as a second process sensor), and 54 is a pressure sensor (hereinafter referred to as a third process sensor).

The transport control unit 39 controls various transport control modules, and the various transport control modules include a first operation control unit 55, a second operation control unit 56, and a third operation control unit 57 that control actuators described later.
58 indicates a motor (hereinafter referred to as a first operation actuator) for driving the pod transfer device 15 in the CX axis direction, 59 indicates a motor (hereinafter referred to as a first operation actuator) for driving the pod transfer device 15 in the CZ axis direction, Reference numeral 61 denotes a motor (hereinafter referred to as a second operation actuator) that drives the wafer transfer mechanism 24 in the X-axis direction. Reference numeral 62 denotes a motor (hereinafter referred to as a second operation actuator) that drives the wafer transfer mechanism 24 in the Y-axis direction. Reference numeral 63 denotes a motor (hereinafter referred to as a second operation actuator) that drives the wafer transfer mechanism 24 in the Z-axis direction, and reference numeral 64 denotes a motor (hereinafter referred to as a third operation actuator) that drives the boat elevator 32.

Each operation actuator is provided with state detection sensors 65, 66, 67, 68, 69, 71 for detecting the state for each axis. The state detection sensors 65, 66, 67, 68, 69, 71 detect the state of each operation actuator and feed back the detection results to the first operation control unit 55, the second operation control unit 56, and the third operation control unit 57. It has a function to do. The first operation control unit 55, the second operation control unit 56, and the third operation control unit 57 have a memory, and can temporarily store the fed back data (detection result).
The first operation control unit 55 drives and controls the pod transfer device 15 that transfers the pod 9 from the load port 8 to the mounting table 21, and the second operation control unit 56 takes out the wafer 18 from the pod 9 and loads it into the boat 26. The wafer transfer mechanism 24 is driven and controlled, and the third operation control unit 57 drives and controls the boat elevator 32 that carries the boat 26 loaded with the wafers 18 into the processing furnace 28.

Reference numeral 72 denotes an input device such as a keyboard, a mouse, an operation panel, 73 denotes a monitor, and 70 denotes an operation unit for inputting various instructions from the monitor 73 using the input device 72.
The first sub-controller 45, the second sub-controller 46, and the third sub-controller 47 receive a set value instruction or a command signal according to the processing sequence from the process control unit 38, and the process control unit 38 receives the first process. Based on the detection results detected by the sensor 52, the second process sensor 53, and the third process sensor 54, the first sub controller 45, the second sub controller 46, and the third sub controller 47 are collectively controlled.

  The process control unit 38 executes substrate processing according to a command from the operation unit 70 via the main control unit 41. Substrate processing is performed independently of other control systems by the process control unit 38 according to a program stored in the storage unit 42. Therefore, even if a problem occurs in the transfer control unit 39 and the main control unit 41, the substrate processing is completed without interruption.

  The first motion control unit 55 controls the motion actuators 58 and 59 based on the detection results detected by the state detection sensors 65 and 66. The second motion control unit 56 controls the motion actuators 61, 62, and 63 based on the detection results detected by the state detection sensors 67, 68, and 69. The third motion control unit 57 controls each motion actuator corresponding to each state detection sensor, such as controlling the motion actuator 64 based on the detection result detected by the state detection sensor 71. The conveyance control unit 39 executes a conveyance process according to an instruction from the operation unit 70. The pod 9 and the wafer 18 are transferred independently from other control systems by the transfer control unit 39 according to the transfer program and operation control program stored in the storage unit 43. Therefore, even if a problem occurs in the process control unit 38 and the main control unit 41, the transfer of the wafer 18 is completed without interruption.

  Substrate processing in which data storage means 44 stores setting information such as a program for controlling the progress of substrate processing, a processing content, a setting program for setting processing conditions, heating of processing furnace 28, supply of processing gas, and exhaust. Various programs such as a recipe, a communication program, an alarm information display program, and a parameter editing program are stored as files.

  When carrying the wafer 18, a setting value such as a target position, speed, acceleration, deceleration, direction in which torque control is performed, torque limit value when torque control is performed, and the like are input from the operation unit 70. By inputting a process execution instruction, the operation control program is executed in accordance with the transfer program stored in the storage unit 43 and the instruction from the transfer program.

  When the transfer program is executed, the transfer control unit 39 performs the pod transfer device 15, the wafer transfer mechanism 24, and the boat elevator 32 via the first operation control unit 55, the second operation control unit 56, and the third operation control unit 57. Each of the transport mechanisms is driven and controlled.

  When at least one of the operation actuators 58, 59, 61, 62, 63, 64 stops, the cause of the stop of the corresponding operation actuator (detection result by the state detection sensor) is notified to the main control unit 41 as an alarm signal. At this time, an alarm signal including at least the data at the time of stop is notified among the data (detection result of the state detection sensor) temporarily stored in the operation control unit corresponding to the stopped operation actuator. When the alarm signal is notified, the alarm information display program is started and the alarm information is displayed on the monitor 73. At this time, the alarm information includes at least one alarm signal.

  When at least one of the operation actuators 58, 59, 61, 62, 63, 64 is stopped and an alarm signal is notified to the main control unit 41, a command to interrupt the transfer process of the wafer 18 is issued to the transfer control unit 39. Then, when all the operation actuators that have not stopped are stopped, the transfer process of the wafer 18 is interrupted, and the process ends.

  As shown in FIG. 4, the substrate processing apparatus 1 is remotely operated by connecting the control device 37 of the substrate processing apparatus 1 to a host computer which is a management apparatus 90 via a communication means such as a LAN. That is, in the present embodiment, the management apparatus 90 has a function of setting various transport mechanisms displayed on the monitor 73 connected to the main control unit 41 of the substrate processing apparatus 1 to apply the present invention. be able to. Further, by connecting a plurality of substrate processing apparatuses 1 to the host computer, it is possible to compare parameters between the substrate processing apparatuses 1 and to manage parameters easily.

  Hereinafter, a flow showing an embodiment of the present invention will be described with reference to FIG.

When the pod 9 as a carrier is carried into the load port 8, the main control unit 41 of the control device 37 uses the identifier of the pod 9 to be carried in (hereinafter referred to as carrier ID) from the in-process carrying device or the management device 90. Acquired and stored in the data storage means 44 as shown in FIG.
When the wafer 18 is loaded into the standby unit 27, the mapping apparatus detects in which slot of the pod 9 the wafer 18 is stored, and includes information including at least the result of the mapping apparatus detecting each slot of each carrier ( Detection information) is transmitted to the conveyance control unit 39 of the control device 37. The transport control unit 39 creates mapping information for each carrier based on the detection information and transmits it to the main control unit 41. The main control unit 41 stores the mapping information in the data storage means 44 as shown in FIG. Here, the mapping information is information including position information of the load port 8 and detection information from the mapping device of each slot.
At this time, since the mapping device transmits the detection information of the detection position A and the detection position B corresponding to the upper and lower pod openers 14, the main control unit 41 receives the detection information of the detection position A and the detection information of the detection position B. Store separately.

The main control unit 41 creates a carrier ID-mapping information accumulation table (hereinafter referred to as a table) 91 in FIG. 5 in which mapping information is associated with a carrier ID.
In the table 91 shown in FIG. 5, the pod 9 with the carrier ID “0001” is mapped at the detection position A for the first time, and the wafer 18 “exists from the first slot 1 to the X slot X of the pod 9. The second time is mapped at the detection position B, and the wafer 18 is detected as “present” from the first slot 1 to the Xth slot X of the pod 9.
The pod 9 with the carrier ID “0002” is first mapped at the detection position B, detected as “error” in the second slot 2 of the pod 9, and detected as “none” in the Xth slot X.

An example of how to use the table 91 created in this way will be described with reference to FIG.
For example, the operator inputs the carrier ID of the desired pod 9 using the input device 72, thereby extracting the specific carrier history file 92 shown in FIG. 5 from the table 91 stored in the data storage unit 44.
According to the specific carrier history file 92 shown in FIG. 5, the operator can determine a history in which “NG” continues in the fifth slot 5. Based on this determination, the operator instructs the use prohibition or replacement of the pod 9 or instructs the analysis of the cause of occurrence of “NG”.

By setting the carrier ID to be automatically executed, the specific carrier history file 92 regarding all the pods 9 can be automatically extracted from the table 91 stored in the data storage means 44. On the other hand, if the threshold value of the occurrence frequency of “NG” is set in advance, the carrier ID of the pod 9 exceeding the threshold value can be automatically extracted from all the extracted specific carrier history files 92.
By extracting a carrier ID that exceeds this threshold, it is possible to automatically warn a pod that is prohibited to use or to be replaced, or to automatically warn the cause analysis of “NG”.

  According to this embodiment, the following effects can be obtained.

(1) By storing the carrier ID and the mapping information, the mapping information that is only used for the wafer presence / absence information in the conventional substrate processing system can be utilized.

(2) Since a specific carrier history file is extracted from the carrier ID-mapping information accumulation table, a pod having a slot with a high “NG” frequency can be determined. , The analysis of the cause of occurrence of “NG” can be instructed.

(3) By setting a threshold value for the occurrence frequency of “NG” in advance, it is possible to automatically extract pods exceeding the threshold value, so that pods that are prohibited or need replacement are automatically warned. Or the cause analysis of the occurrence of “NG” can be automatically alarmed.

(4) Further, by extracting the history based on the detection position, it becomes possible to analyze the cause of the occurrence of “NG” without limiting the pod, and the necessity of readjustment of the detection sensor and the mechanical position can be examined.

The present invention is not limited to the above-described embodiments, and it goes without saying that various modifications can be made without departing from the scope of the invention.
For example, in the case of a wafer that is repeatedly used, such as a dummy wafer, the deformation of the wafer itself can be captured based on the change in the history data from the first use of the pod.

  When the carrier ID and the wafer ID can be associated by connecting to the host computer which is the management apparatus 90, the history of the wafer itself can be referred to when analyzing the cause of occurrence of “NG”.

  When an optical carrier ID reader is installed in the pod port or pod opener, the carrier ID may be acquired by the reader.

  The substrate processing apparatus is not limited to a batch type, a single wafer type, a vertical type, or a horizontal type, and the present invention can be applied to all substrate processing systems in which a manufacturing process is performed by one or a plurality of substrate processing apparatuses. .

  Further, the substrate processing apparatus is not limited to the one that performs thermal treatment such as CVD, oxidation, diffusion, and annealing, and may be a substrate processing apparatus such as an exposure apparatus, a lithography apparatus, and a coating apparatus.

  In the above embodiment, the substrate processing system of the substrate processing apparatus in the IC manufacturing factory has been described. However, the present invention is not limited to this, and can be applied to the substrate processing system of the LCD manufacturing apparatus in the LCD manufacturing factory. .

Preferred embodiments of the present invention will be additionally described.
(1) a main control unit for acquiring a carrier identifier of a carrier storing a plurality of substrates;
A transport control unit that controls an operation control unit that transports the substrate in accordance with an instruction from the main control unit;
A mapping device for detecting the presence or absence of the substrate in the slot of the carrier;
With
The main control unit accumulates mapping information including a detection result of the mapping device in association with the carrier identifier, and stores the mapping information.
(2) The substrate processing system according to (1), wherein the main control unit outputs a history of the carrier or the mapping information selected corresponding to the selection of the carrier identifier.
(3) The substrate processing system according to (2), wherein a threshold value of an NG occurrence frequency is preset and an alarm is generated when the NG occurrence frequency in the history exceeds the threshold value.

1 Substrate processing equipment 9 Pod (carrier)
15 Pod transfer device 18 Wafer (substrate)
24 Wafer Transfer Mechanism 32 Boat Elevator 39 Transfer Control Unit 41 Main Control Unit 44 Data Storage Means 55 First Operation Control Unit 56 Second Operation Control Unit 57 Third Operation Control Unit 58 First Operation Actuator 59 First Operation Actuator 61- 63 Second operation actuator 64 Third operation actuator 65-69 State detection sensor 70 Operation unit 71 State detection sensor 72 Input device 73 Monitor 90 Management device 91 Carrier ID-mapping information accumulation table 92 Specific carrier history file

Claims (1)

A main control unit for acquiring a carrier identifier of a carrier containing a plurality of substrates;
A transport control unit that controls an operation control unit that transports the substrate in accordance with an instruction from the main control unit;
A mapping device for detecting the presence or absence of the substrate in the slot of the carrier;
With
The main control unit accumulates mapping information including a detection result of the mapping device in association with the carrier identifier, and stores the mapping information.

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