1270955 玖、發明說明： 【發明所屬之技術領域】 本發明係關於對於半導體處理裝置搬出入被處理基板之 埠構造。此外，此處所謂之半導體處理，係指於半導體晶 圓或LCD基板等被處理基板上，將半導體層、絕緣層、導 電層等以特定之圖案形成，藉此於該被處理基板上製造半 導體裝置、或包含與半導體裝置連接之配線、電極等構造 物而實施之各種處理。 【先前技術】 作為半導體處理裝置之一種，有所謂之對於多數半導體 晶圓以接片進行熱處理之縱型熱處理裝置。該縱型熱處理 裝置包含間隔壁，其係將裝置之外部側區域與内部側區域 區隔，同時具備可使晶圓通過之埠。典型上，外部側區域 係將收納複數牧晶圓之裝載容器，以自動搬運機器人或操 作員搬出入之大氣側之;[/〇區域。此外，内部側區域係將裝 載容器内之晶圓移載至作為基板保持具之晶圓埠，並進行 往熱處理爐載入及載出之裝載區域。 該種縱型熱處理裝置中，必須使裝載區域成為較1/〇區域 乾淨度更高之環境，同時防止晶圓之自然氧化膜之產生。 此外，亦必須抑制晶圓之微塵污染。因此，希望將ι/〇區域 與裝載區域以間隔壁區隔，使裝載區域内成為以乾淨氣體 ，例如氮（N2)氣充滿之乾淨氣體環境。此外為搬運晶圓， 希望使用將前面之口部（晶圓取出口）以蓋體密閉之密閉型 裝載容器（亦稱為封閉型裝載容器）。 81654 I27〇955 圖1 〇係表示過去之縱型熱處理裝置中，將密閉型裝載容 器配置於上述間隔壁之埠上之狀態。I/O區域S1與裝載區域 s2藉由間隔壁4而區隔。於間隔壁4形成埠11，且埠u藉由 問門12而開關。1/〇區域S1設置為載置裝載容器2之載置台 U。於閘門12設置將裝載容器2之蓋體21，對於裝載容器2 装卸之裝卸裝置14。 於載置台13上載置裝載容器2時，使載置台13前進至裝載 容器2之前面緣部與埠丨丨之周圍（亦即規定埠丨丨之間隔壁4 緣部）抵接為止。其次於閘門12閉鎖之狀態下，藉由裝卸裝 置14，取下裝載容器2之蓋體21。接下來使裝載容器2内藉 由置換手段（無圖示）以氮氣置換。其次使閘門12及蓋體21 由埠11退避。藉此，可使裝載容器2内之晶圓w搬入裝載區 域S2側。依據如此之處理方法，由可抑制裝載區域S2内之 氧濃度上升之點視之為佳。該種技術已記載於特開平 11_274267 號。 另一方面，由於晶圓之大口徑化而使得裝載容器内之容 積亦變大。因此， 將裝載谷為2内以氮氣置換時 ’希望為抑1270955 TECHNICAL FIELD OF THE INVENTION The present invention relates to a structure in which a semiconductor processing apparatus is carried into and out of a substrate to be processed. In the semiconductor processing, a semiconductor layer, an insulating layer, a conductive layer, or the like is formed in a specific pattern on a substrate to be processed such as a semiconductor wafer or an LCD substrate, thereby manufacturing a semiconductor on the substrate to be processed. The device or various processes including a structure such as a wiring or an electrode connected to the semiconductor device. [Prior Art] As one type of semiconductor processing apparatus, there is a so-called vertical heat treatment apparatus which heats a plurality of semiconductor wafers by a tab. The vertical heat treatment apparatus includes a partition wall that partitions the outer side region of the device from the inner side region while having a pass through which the wafer can pass. Typically, the external side area will accommodate the loading container of the plurality of wafers for automatic handling of the robot or the operator to move in and out of the atmosphere; [/ 〇 area. Further, the inner side region transfers the wafer in the loading container to the wafer cassette as the substrate holder, and carries the loading area loaded and unloaded into the heat treatment furnace. In such a vertical heat treatment apparatus, it is necessary to make the loading area an environment with a higher cleanliness than the 1/〇 area, and to prevent the generation of a natural oxide film of the wafer. In addition, it is also necessary to suppress dust pollution on the wafer. Therefore, it is desirable to separate the ι/〇 region from the loading region by a partition wall so that the loading region becomes a clean gas atmosphere filled with a clean gas such as nitrogen (N 2 ) gas. Further, in order to transport the wafer, it is desirable to use a sealed type storage container (also referred to as a closed type loading container) in which the front mouth portion (wafer take-out port) is sealed with a lid body. 81654 I27〇955 Fig. 1 shows a state in which a sealed type load container is placed on the top of the partition wall in the conventional vertical heat treatment apparatus. The I/O area S1 and the loading area s2 are separated by a partition wall 4. A crucible 11 is formed in the partition wall 4, and the crucible is opened and closed by the door 12. The 1/〇 area S1 is set as the mounting table U on which the loading container 2 is placed. A shutter 21 for loading the container 2 and a loading and unloading device 14 for loading and unloading the loading container 2 are provided in the shutter 12. When the loading container 2 is placed on the mounting table 13, the mounting table 13 is advanced until the edge portion of the loading container 2 abuts against the circumference of the crucible (that is, the edge portion of the partition wall 4 of the predetermined crucible). Next, in the state in which the shutter 12 is closed, the cover 21 of the loading container 2 is removed by the loading and unloading device 14. Next, the inside of the loading container 2 is replaced with nitrogen by a replacement means (not shown). Next, the shutter 12 and the lid 21 are retracted by the crucible 11. Thereby, the wafer w in the loading container 2 can be carried into the loading area S2 side. According to such a treatment method, it is preferable to suppress the increase in the oxygen concentration in the loading region S2. This technique has been described in Japanese Patent Laid-Open No. 11-274267. On the other hand, the volume of the inside of the loading container is also increased due to the large diameter of the wafer. Therefore, when the loading valley is replaced by nitrogen within 2, the hope is suppressed.
境。認為例如氧、水分、 其結果將無法充分置換裝載容器2 域S2内，影響裝載區域μ内之環 有機物成分等將流入裝載區域S2 81654 1270955 内,。此外’因裝載容器2内之晶圓〜之偏移，亦有成為之後 搬運錯誤主因之虞。 【發明内容】 、本發明（目的係對於半導體處理裝置搬出人被處理基板 〈埠構k中’確保裝載容器安定之載置狀態。 衣據本發月之觀點係提供—種埠構造，其係_於半導體 處理裝置搬出人被處理基板者，其特徵在於包含： 一 ^ '、係將别述裝置之外部側區域與内部側區域區 隔’同時具有可使前述被處理基板通過之埠； 閘門，其係為使前述埠開關而設置於前述間隔壁者； 載置邵’其係於前述外部側區域内臨接前述埠而設置者 j中則述載置部係將多層收納複數牧被處理基板之裝載 谷-於則述裝載容器之口部與前述埠於對向之狀態下載 、[‘構件，其係設置於前述載置部之上方者，其中前述 壓按構件係由前述裝載容器之上，將前述裝載容器對於前 述載置部按壓者；及 ^其係使則述壓按構件，可於前述處理裝置扣合 足下側位置，及不干涉前述裝載容器移動之上側位置間移 則边=構造’於前述裝载容器之前述口部配置在前述蜂 二、' 、^下，進步包含氣體供給部及排氣部，其係對於territory. It is considered that, for example, oxygen and moisture, as a result, the inside of the loading container 2 region S2 cannot be sufficiently replaced, and the ring-like organic component or the like which affects the loading region μ flows into the loading region S2 81654 1270955. In addition, due to the offset of the wafers in the loading container 2, there is also a main cause of subsequent handling errors. SUMMARY OF THE INVENTION The present invention is directed to a substrate in which a semiconductor processing apparatus is carried out by a substrate to be processed (in the structure k) to ensure a stable mounting state of the loading container. The clothing is provided in accordance with the view of the present month. The semiconductor processing apparatus carries out the substrate to be processed by the semiconductor processing apparatus, and is characterized in that: the outer side area of the device is separated from the inner side area, and the substrate to be processed is passed through; In the case where the 埠 switch is provided in the partition wall, the mounting sho is placed in the outer side region, and the keeper is placed in the arranging device. a loading valley of the substrate, wherein the mouth portion of the loading container is downloaded from the opposite side of the loading container, and the member is disposed above the loading portion, wherein the pressing member is from the loading container In the above, the loading container is pressed against the mounting portion; and the pressing member is configured to engage the processing device to engage the lower position of the foot and not interfere with the movement of the loading container. The upper side position is shifted, and the side = structure is disposed in the mouth portion of the loading container, and the gas supply portion and the exhaust portion are included in the advancement.
Wj裝載容器進行乾淨氣體之供給與排氣者。 則边埠構造可進-步具備控制前述閘門、前述氣體供給 81654 1270955 " 及則述排氣部之控制部，且前述控.制部於前述閘門閉 tjJL· 、 .怨下’藉由前述氣體供給部與前述排氣部，將前述 裝載容器内以前述乾淨氣體置換。 【實施方式】 關万、本發明之實施形態，參照圖式並於以下說明。此外 乂下 < 說明中，關於具有大略相同功能及構成之構成要素 附以相同符5虎，且僅於必要時進行重複說明。 、圖1係表7F關於本發明實施形態之縱型熱處理裝置概觀 之王圖。圖2及圖3分別係概略表示圖1所圖甲之縱型熱處 理裝置内邵之縱剖側面圖及橫剖平面圖。 /如圖1 土圖3所示，該縱型熱處理裝置之外廓係以框體3 形成。於框體3内形成PO區域（外部側區域）S1與裝載區域 (内4側區域）S2。I/O區域s丨係使用於將收納複數枚晶圓 (被處理基板）〈裝載容器2，以自動搬運機器人或操作員搬 出入。裝載區域S2係使用於將裝載容器2内之晶圓，移載至 作為基板保持具之晶圓埠92，並進行往熱處理爐91之載入 及載出。 UO區域S1與裝載區域S2藉由間隔壁4而區隔。於間隔壁4 形成璋41 ’且埠41藉由閘⑽而開關。I/O區域S1係設定為 大氣衣境（我塵皇内之環境）。裝載區域§2係設定為非活性 孔版％境，例如氮氣（N2)環境或乾淨乾燥氣體（微塵及有機 成分少，且結露點為_6(rc以下之空氣）。 圖4係表示閉型裝載容器一例之全體圖。裝載容器2例如 由Μ月曰而A JL由别面口部（晶圓取出卩）以蓋體2工開關之 81654 1270955 密閉容器而成。於裝載容器2内，例如直徑3〇〇mm之晶圓w 係複數.枚例如25枚，以棚狀排列而收納。於裝載容器2之上 面，四角形之凸緣部22與該上面具有空隙並固定。並於凸 緣部22之中央部形成圓形之凹部23。 於裝載容器2之蓋體21，設置為將之保持於裝載容器2之 口部2 0之閂鎖機構（無圖示）。蓋體2丨藉由使該閂鎖機構以後 述之裝卸裝置而解除，可使口部20打開。於蓋體21形成鍵 孔21a，藉由於键孔21a内差入裝卸裝置側之卡榫並以略9〇。 旋轉，可解除問鎖機構。 I/O區域S1由裝置之正面側所視之，係包含位於前方之第 1區域5，及位於後方之第2區域6。於第丨區域5，設置為分 別載置裝載容器2而配置於左右之第1載置台51、52。於第丄 載置台51、52之載置面，為決定裝載容器2之位置，與設置 於裝載容器2之底部之凹部嵌合之卡榫（位置決定構件）53， 例如設置於3處（參照圖1)。 第1區域5之上方，亦即第1載置台51、52上方之空間，以 U字型之面板部54包圍。以面板部54所包圍之空間，係為使 沿無塵室内天井部（無圖示）移動之自動搬運機器人，一面支 持對於第1載置台51、52搬出入之裝載容器2並一面通過而 準備。 於I/O區域S1之第2區域6,配置第2載置台（載置部）61、62 。於第2載置台61、62之載置面，與設置於裝載容器2底部 之凹部嵌合之卡筍（位置決定構件）6 3，例如設置於3處（參照 圖！）。裝載容器2於第2載置台61(62)上以卡榫63決定位置之 81654 -10 - 1270955 狀態下，裝載容器2之口部2〇係與間隔壁4之#41對向且整合 圖5係表示圖1所圖示之縱型熱處理裝置中，間隔壁4之埠 及其周邊之縱剖面圖。圖6係表示^所圖示之縱型熱處 理裝置中，|載容器2底部與設置於載置台61⑽之扣合構 件之扣合模樣剖面圖。 扣合位置與解除該扣合之位置間旋動。 另一万面，於第2區域6之上側，設置保管裝載容器2之保 管部64。保管部64於該財㈣由_行之棚而構成。於 =2區域6，設置將裝載容器2於第1載置台51、52;第2載置 台61、62;及保管部64之間搬運之容器搬運裝置65。容器 如圖5所不，載置台6卜62係於藉由後述之容器搬運裝置 而放置裝載容器2之位置，及裝載容器2與間隔壁4之璋“周 圍抵接之位置間，藉由例如氣缸之驅動部—可於前後移動 °如圖6所示’於載置台61、62 ’設置與裝載容器2底部之 扣合凹部24扣合之鎖型扣合構件⑼。扣合構件⑼係藉由驅 動邵術’於水平軸附近可旋動地構成，並於扣合凹部24之 搬運裝置65包含：於水平延伸且可自由升降之導引部66、 及面被導引邵66導引並一面移動之移動部Ο。於移動部 7女裝保持裝載容器2上面之凸緣部22,並將裝載容器2 於水平方向搬運之關節臂68。 固8A B係表示圖1所圖示之縱型熱處理裝置中，裝載容 器2設置於間隔壁4之埠41上狀態之縱剖側面圖及橫剖平面 圖0 81654 -11 - 1270955 前進之第2載置台61(62)上之裝載容器2，使其口部2〇與璋 41整令地與間隔壁4抵接。因此，於該狀態取下裝载容器2 之蓋體21時，裝載容器2内與裝載區域S2，通過間隔壁*之 埠41而連通。於I/O區域S1側之埠41緣部，設置為使装載容 器2抵接（亦即與裝載容器2口部2〇之緣部抵接）之密封構件 42。密封構件42係有作為規定琿41開口之間隔壁4一部分之 功能。 於間隔壁裝載區域82側，設置可開關埠41之閘門Μ 。閘門43於裝載區域S2側成為凹下之形狀，因此於裝載容 器2配置在埠41上之狀態下，於閘H43與裝載容器2之口部 2〇之間形成緩衝空間BS。緩衝空間則中，於閘⑽設置使 裝載容器2之蓋體21，可對於裝載容器2裝卸之裝卸裝置44 。閘門43以閘門驅動部（無圖示）驅動，於開放時一面支持由 裝載合器2取下之盍體21，一面至不會妨礙晶圓w搬運之位 置為止，沿間隔壁4退避至上方側或下方側。 於緩衝空間BS，連接對於裝載容器2進行乾淨氣體之供給 與排氣之氣體供給部GS及排氣部別。具體上如圖5及圖8八 认輯不，於間隔壁4之埠41之緣部側，安裝連接氣體供 給邵GS之兩個多孔質濾片45,由濾片45至緩衝空間BS内，The Wj loading container carries the supply and exhaust of clean gas. The edge structure can further control the gate, the gas supply 81654 1270955 " and the control unit of the exhaust unit, and the control unit is closed at the gate tjJL·, The gas supply unit and the exhaust unit replace the inside of the loading container with the clean gas. [Embodiment] An embodiment of the present invention will be described below with reference to the drawings. In addition, in the following description, the components having substantially the same functions and configurations are denoted by the same symbol, and the description will be repeated only when necessary. Fig. 1 is a view showing an overview of a vertical heat treatment apparatus according to an embodiment of the present invention. 2 and 3 are schematic longitudinal cross-sectional side views and a cross-sectional plan view, respectively, of the vertical heat treatment apparatus of Fig. 1. / As shown in Fig. 1 of Fig. 1, the outline of the vertical heat treatment apparatus is formed by the frame 3. A PO region (outer side region) S1 and a loading region (inner 4 side region) S2 are formed in the casing 3. The I/O area is used to store a plurality of wafers (substrate to be processed) in the loading container 2, and to move them in by the automatic transfer robot or the operator. The loading area S2 is used to transfer the wafer in the loading container 2 to the wafer cassette 92 as a substrate holder, and to load and load the heat treatment furnace 91. The UO area S1 and the loading area S2 are separated by a partition wall 4. A dam 41' is formed in the partition wall 4 and the 埠41 is opened and closed by the gate (10). The I/O area S1 is set to the atmospheric environment (the environment inside the dust king). Loading area § 2 is set to inactive stencil%, such as nitrogen (N2) environment or clean dry gas (light dust and organic components are small, and the dew point is _6 (air below rc). Figure 4 shows closed loading A general view of an example of a container. The loading container 2 is made of, for example, a Μ月曰 and A JL is sealed by a lid of a cover 2, which is sealed by a lid 2, and is sealed in a container 2, for example, a diameter. The wafers of 3 mm are used in a plurality of sheets, for example, 25 pieces, and are housed in a shed shape. On the upper surface of the loading container 2, the square flange portion 22 has a gap and is fixed to the upper surface. The central portion forms a circular recess 23. The lid body 21 of the loading container 2 is provided with a latch mechanism (not shown) for holding the mouth portion 20 of the loading container 2. The lid body 2 is made by The latch mechanism is released by a later-described attaching and detaching device, and the mouth portion 20 can be opened. The keyhole 21a is formed in the lid body 21, and the latch hole 21a is inserted into the loading and unloading device side by a slight 〇. The lock mechanism can be unlocked. The I/O area S1 is viewed from the front side of the device and is included. The first region 5 in the front and the second region 6 in the rear are provided in the second region 5, and the first mounting tables 51 and 52 are disposed on the right and left mounting shelves 2, respectively. In order to determine the position of the loading container 2, the mounting surface of the loading container 2 is provided with a cassette (position determining member) 53 fitted to the concave portion provided at the bottom of the loading container 2, for example, at three places (see Fig. 1). Above the area 5, that is, the space above the first mounting tables 51, 52 is surrounded by the U-shaped panel portion 54. The space surrounded by the panel portion 54 is such that the space is cleaned along the clean room (not shown) The moving automatic transfer robot is prepared to support the loading container 2 that is carried in and out of the first mounting tables 51 and 52. The second mounting table (the mounting portion) is disposed in the second region 6 of the I/O area S1. 61, 62. On the mounting surface of the second mounting tables 61 and 62, the card shooter (position determining member) 63 that is fitted to the recessed portion provided at the bottom of the loading container 2 is provided, for example, at three locations (see figure!). The loading container 2 is in the shape of 81654 -10 - 1270955 which is determined by the cassette 63 on the second mounting table 61 (62). In the vertical heat treatment device shown in FIG. Fig. 6 is a cross-sectional view showing the fastening pattern of the bottom portion of the carrier container 2 and the fastening member provided on the mounting table 61 (10) in the vertical heat treatment apparatus shown in Fig. 6. The fastening position and the position at which the fastening is released On the other side, on the upper side of the second area 6, a storage unit 64 for storing the loading container 2 is provided. The storage unit 64 is configured by the shed of the bank in the fourth (fourth). 2 is a container conveying device 65 that is transported between the first mounting tables 51 and 52, the second mounting tables 61 and 62, and the storage unit 64. As shown in Fig. 5, the container 6 is placed at a position where the loading container 2 is placed by a container conveying device to be described later, and between the loading container 2 and the space where the partition wall 4 abuts, for example, by The driving portion of the cylinder can be moved forward and backward. As shown in Fig. 6, a locking type engaging member (9) that is engaged with the engaging recess 24 at the bottom of the loading container 2 is provided on the mounting table 61, 62'. The fastening member (9) is borrowed. The driving device 65 is configured to be rotatable in the vicinity of the horizontal axis, and the guiding device 65 of the fastening recess 24 includes: a guiding portion 66 extending horizontally and freely movable, and the surface is guided by the guiding guide 66 The moving portion 移动 is moved. The moving portion 7 holds the flange portion 22 on the upper surface of the loading container 2, and the joint arm 68 that carries the loading container 2 in the horizontal direction. The solid 8A B system represents the longitudinal direction shown in FIG. In the heat treatment apparatus, the loading container 2 is placed on the dam 41 of the partition wall 4, and the loading container 2 on the second mounting table 61 (62) which is advanced from 0 81654 -11 - 1270955 is made. The mouth portion 2〇 and the 璋41 are completely in contact with the partition wall 4. Therefore, in this state When the lid body 21 of the container 2 is loaded, the inside of the loading container 2 and the loading area S2 are communicated by the partition 41 of the partition wall 4. The edge portion of the crucible 41 on the I/O area S1 side is provided so that the loading container 2 is placed. The sealing member 42 abuts (that is, abuts against the edge of the mouth 2 of the loading container 2). The sealing member 42 has a function as a part of the partition wall 4 defining the opening of the crucible 41. On the side of the partition wall loading region 82, The gate Μ of the switchable switch 41 is provided. The shutter 43 has a concave shape on the side of the loading area S2, so that the loading container 2 is disposed on the crucible 41, between the gate H43 and the mouth portion 2 of the loading container 2. A buffer space BS is formed. In the buffer space, a cover 21 for loading the container 2 is provided in the gate (10), and the loading and unloading device 44 can be attached to and detached from the loading container 2. The shutter 43 is driven by a gate driving unit (not shown), and is opened at the time of opening. The support body 21 is supported by the loading and unloading device 2, and is retracted to the upper side or the lower side along the partition wall 4 without hindering the position where the wafer w is transported. The connection to the loading container 2 is performed in the buffer space BS. Gas supply and supply GS for clean gas supply and exhaust Specifically, as shown in FIG. 5 and FIG. 8 , the two porous filters 45 connected to the gas supply GS are mounted on the edge of the rim 41 of the partition wall 4, and the filter 45 is attached thereto. Buffer space BS,
供、了成為乾淨氣體之非活性氣體，例如t氣。此外，於埠 414下端部，形成可進行較小偏差排氣地，且由正面視之 2橫=之排氣口 46,並將其連接排氣部ES。如後所述，氣 。沣GS與排氣邵Es於控制部之控制下，在將閘門閉 鎖且取裝載容器2之蓋體2丨之狀態下動作，可將緩衝空間BS 81654 -12- 1270955 及裝載容器2内以乾淨氣體置換。 於閃隔壁4之I/O區域S1側，將分別按壓載置於第2載置台 61、62之裝載容器2上面之兩個壓按機構7，左右並列地設 置。圖7係表示圖1所圖示之縱型熱處理裝置之壓按機構7全 體圖。 壓按機構7包含：沿間隔壁4水平延伸地作為軸而支持之 旋轉軸71 ;及基端側固定於旋轉軸71之壓按構件72。壓按 構件72係由倒Y字型之平板73而成，其兩腳部73a、73b固定 於旋轉軸71。於平板73之頭部74，在水平姿勢時朝向下側 之面形成圓形突起部75。突起部75係當壓按構件72向前倒 並大致成為水平姿勢時，與設置於裝載容器2上面之凸緣部 22之圓形凹部23扣合地配置。 壓按構件7包含作為驅動源之氣缸81 a、81 b。氣缸81 a、 81b於壓按構件72之上方及其兩側，使該等之活塞桿8〇a、 80b可垂直進退地安裝於間隔壁4上。活塞桿8〇&、8013之下 端側分別安裝軸支構件82a、82b。軸支構件82a、82b分別 作為軸而支持動作臂83a、83b之一端側。動作臂83a、83b 之他端側則可自由旋動地安裝於壓按構件72之兩側緣。 因此’壓按構件72藉由氣缸81a、81b而使得活塞桿80a、 80b拉起時，如虛線所示，沿間隔壁4成為站起之姿勢（上側 位置）。此外，壓按構件72當活塞桿8〇a、80b於下方側伸出 時’如貫線所示’成為大致於水平倒下之姿勢（下侧位置） 。於該下側位置，突起部75插入裝載容器2之凹部23，並使 裝載容器2對於載置台61(62)按壓。 81654 -13- 1270955 尸閘門43裝卸裝置44、第2載置台6ι(62)、壓按構件μ、 氣體供給部GS、及排氣部辦，依照错存於控制侧參照 圖5)之程式而操作。概略上控制心測出於第2載置台6卿 、、置裝載谷益2’使裝載谷益2至與間隔壁4之埠41周圍抵 接之位置為止地，使第2載置台61(62)前進。其次驅動壓按 機構7之氣缸81a、81b，以壓按構件72將裝載容器2對於第2 載f台61(62)按壓。接下來驅動裝卸裝置44,由裝載容器2 將蓋體21取下。其次於閘門43閉鎖之下，驅動氣體供給部 GS與排氣部Es，將緩衝空間BS及裝載容器2内以乾淨氣體 置換。其次將閘門43及蓋體21由埠41退避。藉此，裝載容 器2内之晶圓W可搬入至裝載區域S2側。 回到圖2及圖3，說明關於裝載區域82内。於裝載區域S2 ，設置於下端具有可藉由蓋體94而開關之爐口之縱型熱處 理爐91。於縱型熱處理爐91之下方側，將多數牧之晶圓w 以棚狀保持之作為保持具之晶圓埠92，載置於蓋體94上。 此外，蓋體94上之晶圓埠92與蓋體94之間，設置隔熱部93 。蓋體94支持於升降機構95上，藉由升降機構95使晶圓埠 92對於熱處理爐91載入及載出。 於晶圓埠92與間隔壁4之埠41之間，設置晶圓搬運裝置％ 。晶圓搬運裝置96於晶圓埠92，與第2載置台61、62上之裝 載容咨2之間搬運晶圓w。晶圓搬運裝置96包含移動體98， 其係沿往左右延伸之導引機構97移動之同時，於錯直轴附 近可旋動者。於移動體98，設置複數之例如5枚可自由進退 之臂99。 81654 -14- 1270955 其次說明關於上述實施形態之操作。此外，下述之操作 係依照儲存於控制部8(參照圖5)之程式而進行。 、先藉由/;口操塵室之天井邵移動之自動搬運機器人（無 圖示），使裝載容器2通過面板54之内部空間而下降，載置 万、第1載置口 51(52)。其次，藉由容器搬運裝置65將裝載容 咨2搬運至第2載置台61(62)。此外，亦有藉由容器搬運裝置 ^使裝載容器2暫時保管於保管部64，之後搬運至第2載置 台61(62)之情形。裝載容器2載置於第2載置台61(62)時，首 先如圖6所示，使扣合構件6〇旋動並與裝載容器2底部之扣 口凹邵24扣合。其次第2載置台61(62)移動至間隔壁4側，並 使裝載谷為2 口邵20之緣邵，與間隔壁4之埠41周圍之密封 構件42氣密地抵接。 其次藉由壓按機構7之氣缸81a、81b，使活塞桿8〇a、8〇b 於下方側伸出，且動作臂83a、83b藉由壓按構件72一面被 規足控制一面按壓下側。藉此，壓按構件72使得旋動軸71 之周圍旋動’成為橫倒之狀態。其結果如圖8A所示，壓按 構件72<突起部乃插入裝載容器2之凸緣部22凹部23，並使 裝載容器2對於第2載置台61 (62)按下。其次裝卸裝置44之卡 苟（無圖示），插入裝載容器2之蓋體21之键孔21a(參照圖4) 並旋轉峰90°，藉此使蓋體21由裝載容器2取下（圖8A、B之 狀態）。 其次由多孔質濾片45使例如氮氣之乾淨氣體，水平向裝 载容器2内以例如流量5〇〜2〇〇 1/min吹出。該氮氣係沿晶圓w 之間及裝載容器2之内壁流動，回到口部20側並由下方側之 81654 -15- 1270955 排氣口 46排氣。藉此，以氮氣 伙装載容器2内及裝載容器 2與閘·門43間之緩衝空間Bs。此 抽斗—抑〇二 因使氮氣以大流量導入 裝載谷态2内，裝載容器2内之 土將上升，同時於氣體導 入時將對裝載容器2施加衝擊。惟樂&、 孔目旦學 f隹裝载容器2藉由壓按構件 72由上万按壓，故將不產生 置 < 偏移。因此，使得裝載 容器2之口部20與密封構件 再忏42炙乳贫性將不發生妨害。 其次’閘門43、裝卸裝置44、 触 、 久观'組21，例如上升並由 埠41退避，可使裝載容器2内盎举 ^ 内/、裝載區域S2成為連通之狀態 。其次藉由晶圓搬運裝置96，腺世#、 /衣直％將裝载容器2内之晶依序 取出’並移載至晶圓埠92。裝恭六卩 平 裝載谷态2内之晶圓w變空時， 以與上述相反之動作使裝載容器2之蓋體21關閉。 壓按機構7解除按壓之時點，亦即本實施形態中，壓按機 構72回復為站起狀態之時點，係例如裝載容器2之口部別藉 由蓋體21關閉之後，其次’第2載置台61(62)後退並使裝載 容器2由間隔壁4離開。接下來’裝載容器2藉由容器搬運裝 置65搬運至保管部64暫時保管。 另一方面，於晶圓璋92搭載特定牧數之晶圓冒時，晶圓 埠92載入至熱處理爐91内。其次於熱處理爐91内，對於晶 圓埠92上之晶® W進行例如CVD、退火處理、及氧化處理 等熱處理。熱處理終了#，以與上述相反之動作，使晶圓 W回到裝載容器2内。 依據上述之實施形態，藉由壓按構件72 ,將載置於第2 載置台61(62)並與間隔壁4抵接之裝載容器2由上方按壓。因 此，將裝載容器2内之環境以乾淨氣體置換時，即使因增大 81654 -16- 1270955 乾淨氣體流量之氣體吹出，對於裝載容器2之衝擊增大，裝 載容琴2將不震動地以該姿勢安定。此外，即裝載容器2之 蓋體21開關時之衝擊增大，藉由使裝載容器2由上方按壓， 可使裝載容器2之姿勢安定。 因此，不破壞裝载容器2與間隔壁4之氣密狀態，故可防 止由大氣側之I/O區域S1侧流入至裝載區域82側❶此外，因 不產生晶圓W之位置偏移或突出，故之後的藉由晶圓搬運 裝置96而進行之晶gjw之取出操作亦無妨#。此外，因可 a大供、’σ至裝載备益2内之乾淨氣體流量，故可縮短以乾淨 氣體置換所需要之時間，可提升產能。 壓按機構7之恩按構件72，係於沿間隔壁站起之狀態（上 側位置）與成為橫倒之狀態（下側位置）間旋動。因此，於解 除裝載容器2之按壓時，壓按構件72將不妨礙裝載容器：之 搬運。此外，可使壓按機構7全體設為簡單之構造。 上述之實施形態中，僅舉出將裝載容器2由上方按恩之壓 =機例。亦可將其取代，壓按機構設為裝載容器2由 只万4廢者。圖9Α、Β係表示壓按機構其他例之說明圖。 圖9Α所圖示之壓按機構包含 第域置台6购之裝載容哭2，由1構件92，其係將載置於 " 由月面侧對於間隔壁4按壓 並固足者。壓按構件92，例如 則後移動，且例如可下 降較弟2載置台61(62)之載置面更為下側為止。 以壓按機構包含—龍按構件Μ、％ 將载置於第2載置台61(62)之裝載容哭 、、/…、 者。該情形下，藉由壓㈣構使 ，側爽住並固疋 件裝載谷咨2對於第2載置 81654 1270955 台61(62)固定之時點 亦可。 即使於裝載容器2與間隔壁抵接之前 此外纟發明並非限定於上述之實施形態，於不跳脫本 發明要旨之範園内，可進行各種之設計變更等。例如裝載 區域S2〈環境，並不㈣非活性氣體，乾淨乾燥空氣亦可 °孩情形下’裝載容器2與間隔壁3抵接後，將乾淨乾燥空 氣供給至裝載容器2内，並置換裝載容器2内之環境亦可。 此外，本發明對^搬運裝載容器2之I區域與〇區域設置於個 別場所之裝置，村適用。此外，本發明並非㈣於縱型 熱處理裝置’亦可適用於例如牧葉式熱處理裝置、進行阻It is an inert gas that becomes a clean gas, such as t gas. Further, at the lower end portion of the 埠 414, an exhaust port 46 which can perform a small deviation of the exhaust gas and which is viewed from the front side is connected to the exhaust portion ES. As described later, gas.沣GS and exhaust Shao Es under the control of the control unit, in the state of locking the gate and taking the cover 2 of the loading container 2, the buffer space BS 81654 -12- 1270955 and the loading container 2 can be cleaned. Gas replacement. On the I/O area S1 side of the flash partition 4, the two pressing mechanisms 7 placed on the upper surface of the loading container 2 of the second mounting tables 61 and 62 are respectively pressed and arranged side by side. Fig. 7 is a perspective view showing the pressing mechanism 7 of the vertical heat treatment apparatus shown in Fig. 1. The pressing mechanism 7 includes a rotating shaft 71 supported as a shaft extending horizontally along the partition wall 4, and a pressing member 72 whose base end side is fixed to the rotating shaft 71. The pressing member 72 is formed by an inverted Y-shaped flat plate 73, and the leg portions 73a and 73b are fixed to the rotating shaft 71. The head portion 74 of the flat plate 73 forms a circular projection 75 toward the lower side in the horizontal posture. The projection portion 75 is disposed in engagement with the circular recessed portion 23 of the flange portion 22 provided on the upper surface of the loading container 2 when the pressing member 72 is tilted forward and is substantially in a horizontal posture. The pressing member 7 includes cylinders 81a, 81b as driving sources. The cylinders 81a, 81b are above and on both sides of the pressing member 72, so that the piston rods 8a, 80b can be attached to the partition wall 4 in a vertically movable manner. Shaft members 82a, 82b are attached to the lower end sides of the piston rods 8A & 8013, respectively. The shaft supporting members 82a and 82b support one end side of the operating arms 83a and 83b as shafts, respectively. The other end sides of the operating arms 83a, 83b are rotatably attached to both side edges of the pressing member 72. Therefore, when the pressing members 72 pull the piston rods 80a and 80b by the air cylinders 81a and 81b, they are in a standing position (upper position) along the partition wall 4 as indicated by a broken line. Further, when the piston rods 8a, 80b are extended on the lower side, the pressing member 72 becomes a posture which is substantially horizontally lowered (lower side position) as indicated by the line. At the lower position, the projection 75 is inserted into the recess 23 of the loading container 2, and the loading container 2 is pressed against the mounting table 61 (62). 81654 -13- 1270955 The gantry gate 43 loading and unloading device 44, the second mounting table 6i (62), the pressing member μ, the gas supply unit GS, and the exhaust unit are arranged in accordance with the program stored in the control side with reference to Fig. 5). operating. The second mounting table 61 (62) is provided so that the second mounting table 6 is placed on the second mounting table 6 and the loading platform 2 is placed so as to be in contact with the periphery of the crucible 41 of the partition wall 4. )go ahead. Next, the cylinders 81a and 81b of the pressing mechanism 7 are driven, and the loading container 2 is pressed against the second carrier f 61 (62) by the pressing member 72. Next, the loading and unloading device 44 is driven, and the lid body 21 is removed by the loading container 2. Next, when the shutter 43 is closed, the gas supply unit GS and the exhaust unit Es are driven to replace the inside of the buffer space BS and the loading container 2 with clean gas. Next, the shutter 43 and the lid 21 are retracted by the crucible 41. Thereby, the wafer W in the loading container 2 can be carried to the loading area S2 side. Referring back to Figures 2 and 3, the description will be made regarding the loading area 82. In the loading area S2, a vertical heat treatment furnace 91 having a mouth opening switchable by a lid 94 is provided at the lower end. On the lower side of the vertical heat treatment furnace 91, the wafer cassette 92, which is a holder of the majority of the wafers w, is placed on the lid 94. Further, a heat insulating portion 93 is provided between the wafer cassette 92 on the lid body 94 and the lid body 94. The lid body 94 is supported by the elevating mechanism 95, and the wafer cassette 92 is loaded and ejected to the heat treatment furnace 91 by the elevating mechanism 95. A wafer transfer device % is provided between the wafer cassette 92 and the port 41 of the partition wall 4. The wafer transfer device 96 transports the wafer w between the wafer cassette 92 and the loading container 2 on the second mounting tables 61 and 62. The wafer transfer device 96 includes a moving body 98 which is rotatable near the wrong axis while moving along the guide mechanism 97 extending left and right. In the moving body 98, for example, a plurality of arms 99 which are freely retractable are provided. 81654 - 14 - 1270955 Next, the operation of the above embodiment will be described. Further, the following operations are performed in accordance with the program stored in the control unit 8 (see Fig. 5). First, the loading container 2 is lowered by the internal space of the panel 54 by the automatic transport robot (not shown) of the patio of the dust chamber, and the first loading port 51 (52) is placed. . Next, the loading/reassing unit 2 is transported to the second placing table 61 (62) by the container conveying device 65. Further, the container container 2 is temporarily stored in the storage unit 64 by the container transport device, and then transported to the second stage 61 (62). When the loading container 2 is placed on the second placing table 61 (62), first, as shown in Fig. 6, the engaging member 6 is rotated and engaged with the buckle recess 24 at the bottom of the loading container 2. Then, the second stage 61 (62) is moved to the side of the partition wall 4, and the load valley is the edge of the two ports 20, and the sealing member 42 around the dam 41 of the partition wall 4 is hermetically contacted. Next, the piston rods 8a and 8b are extended on the lower side by the cylinders 81a and 81b of the pressing mechanism 7, and the operating arms 83a and 83b are pressed by the pressing member 72 while being pressed by the pressing member 72. . Thereby, the pressing member 72 causes the rotation around the rotary shaft 71 to be in a state of being slanted. As a result, as shown in Fig. 8A, the pressing member 72 < the projection is inserted into the recess 23 of the flange portion 22 of the loading container 2, and the loading container 2 is pressed against the second mounting table 61 (62). Next, the cassette (not shown) of the loading and unloading device 44 is inserted into the keyhole 21a (see FIG. 4) of the lid 21 of the loading container 2 and rotated by a peak of 90°, whereby the lid body 21 is removed from the loading container 2 (Fig. 8A, B state). Next, a clean gas such as nitrogen is blown horizontally into the loading container 2 by the porous filter 45, for example, at a flow rate of 5 〇 2 〇〇 1 / min. This nitrogen gas flows along the inner wall of the wafer w and the loading container 2, returns to the side of the mouth portion 20, and is exhausted by the 81654-15-1270955 exhaust port 46 on the lower side. Thereby, the buffer space Bs in the container 2 and between the loading container 2 and the gate/gate 43 is loaded by the nitrogen gas. This bucket---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- However, the loading container 2 is pressed by the pressing member 72 by tens of thousands, so that no offset is generated. Therefore, the mouth portion 20 of the loading container 2 and the sealing member are prevented from being impaired. Then, the "gate 34, the loading and unloading device 44, the contact, and the long-view" group 21 are raised, for example, and are retracted by the crucible 41, so that the inside of the loading container 2 can be connected to the loading area S2. Next, the crystals in the loading container 2 are sequentially taken out by the wafer transfer device 96, and the transfer is carried out to the wafer cassette 92. When the wafer w in the loading state 2 is emptied, the lid 21 of the loading container 2 is closed in the opposite operation to the above. When the pressing mechanism 7 releases the pressing, that is, in the present embodiment, when the pressing mechanism 72 returns to the standing state, for example, the mouth portion of the loading container 2 is closed by the lid 21, and then the second load is carried out. The table 61 (62) is retracted and the loading container 2 is separated by the partition wall 4. Next, the loading container 2 is transported to the storage unit 64 for temporary storage by the container transporting device 65. On the other hand, when the wafer cassette 92 is loaded with a specific number of wafers, the wafer cassette 92 is loaded into the heat treatment furnace 91. Next, in the heat treatment furnace 91, heat treatment such as CVD, annealing treatment, and oxidation treatment is performed on the crystal layer W on the wafer 92. At the end of the heat treatment, the wafer W is returned to the loading container 2 in the opposite operation to the above. According to the above-described embodiment, the loading container 72 placed on the second mounting table 61 (62) and abutting against the partition wall 4 is pressed upward by the pressing member 72. Therefore, when the environment in the loading container 2 is replaced with a clean gas, even if the gas of the clean gas flow rate of 81654 -16 - 1270955 is blown out, the impact on the loading container 2 is increased, and the loading accompaniment 2 will not vibrate. Stable posture. Further, when the lid 21 of the loading container 2 is opened and closed, the impact is increased, and by pressing the loading container 2 from above, the posture of the loading container 2 can be stabilized. Therefore, the airtight state of the loading container 2 and the partition wall 4 is not broken, so that it is prevented from flowing into the loading area 82 side from the I/O area S1 side on the atmospheric side, and the positional deviation of the wafer W is not generated or Therefore, the subsequent extraction operation of the crystal gjw by the wafer transfer device 96 is also possible. In addition, since the flow rate of clean gas in the large supply, 'σ to loading allowance 2 can be reduced, the time required for replacement with clean gas can be shortened, and the production capacity can be increased. The pressing member 7 of the pressing mechanism 7 is rotated between a state in which it stands in the partition wall (upper position) and a state in which it is slanted (lower position). Therefore, when the pressing of the loading container 2 is released, the pressing member 72 will not interfere with the handling of the loading container. Further, the entire pressing mechanism 7 can be made simple. In the above-described embodiment, only the example in which the loading container 2 is pressed from above is described. It can also be replaced, and the pressing mechanism is set as the loading container 2, which is only 10,000. Fig. 9 is a diagram showing the other examples of the pressing mechanism. The pressing mechanism illustrated in Fig. 9A includes a loading pocket 2 purchased by the first stage mounting unit 6, which is carried by a member 92 which is placed on the side of the lunar surface and pressed against the partition wall 4. The pressing member 92 is, for example, moved backward, and can be lowered, for example, lower than the mounting surface of the second mounting table 61 (62). The pressing mechanism includes a dragon pressing member Μ, and a load placed on the second mounting table 61 (62) is crying, /, . In this case, by the pressure (four) configuration, the side is cooled and the solid member is loaded, and the second mounting 81654 1270955 unit 61 (62) is fixed. Even before the loading container 2 comes into contact with the partition wall, the invention is not limited to the above-described embodiment, and various design changes and the like can be made without departing from the gist of the present invention. For example, the loading area S2 <environment, not (four) inert gas, clean dry air can also be used in the case of the child, after the loading container 2 abuts the partition wall 3, the clean dry air is supplied into the loading container 2, and the loading container is replaced. The environment within 2 is also available. Further, the present invention is applicable to a device in which the I area and the sputum area of the transport container 2 are disposed in separate places. Further, the present invention is not (4) for the vertical heat treatment apparatus', and may be applied to, for example, a grazing type heat treatment apparatus.
Ud:布及顯像之裝置、離子佈植裝置等其他型式之半 導體處理裝置。 【圖式簡單說明】 圖系表丁關於本發明實施形態之縱型熱處理裝置概觀 之全體圖。 圖2係概略表不圖1所圖示之縱型熱處理裝置内部之縱剖 側面圖。 圖3係概略表示圖1所圖示之縱型熱處理裝置内部之橫剖 平面圖。 圖4係表示密閉型裝載容器一例之全體圖。 圖5係表7^圖1所圖示之縱型熱處理裝置中，間隔壁之埠 及其周邊之縱剖面圖。 圖6係表不圖1所圖示之縱型熱處理裝置中，裝載容器底 4 U於載置台之扣合構件之扣合模樣剖面圖。 81654 -18- 1270955 圖7係表示圖1所圖示之縱型熱處理裝置之壓按機構全體 圖。 圖8A ' B係表示圖丨所圖示之縱型熱處理裝置中，裝載容 咨設置於間隔壁之埠上狀態之縱剖側面圖及橫剖平面圖。 圖9A、B係表示壓按機構其他例之說明圖。 圖1〇係表示過去縱型熱處理裝置中，裝載容器設置於間 隔壁之埠上之狀態之縱剖側面圖。 圖式代表符號說明】 S1 外部側區域 S2 内部側區域 W 被處理基板 BS 緩衝空間 GS 氣體供給部 ES 排氣部 2 裝載容器 4 間隔壁 5 第1區域 6 弟2區域 7 壓按機構 8 控制部 Π，41 埠 12, 43 閘門 13, 51，52， 61，62 載置台Ud: Other types of semiconductor processing devices such as cloth and imaging devices, ion implant devices. BRIEF DESCRIPTION OF THE DRAWINGS The drawings are a general view of an outline of a vertical heat treatment apparatus according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional side view showing the inside of a vertical heat treatment apparatus shown in Fig. 1. Fig. 3 is a cross-sectional plan view schematically showing the inside of the vertical heat treatment apparatus shown in Fig. 1. Fig. 4 is a view showing an entire view of an example of a sealed type storage container. Fig. 5 is a longitudinal sectional view showing the rim of the partition wall and its periphery in the vertical heat treatment apparatus shown in Fig. 1 and Fig. 1. Fig. 6 is a cross-sectional view showing the fastening pattern of the fastening member for loading the bottom 4U of the container to the mounting table in the vertical heat treatment apparatus shown in Fig. 1. 81654 -18- 1270955 Fig. 7 is a view showing the entire pressing mechanism of the vertical heat treatment apparatus shown in Fig. 1. Fig. 8A'B is a longitudinal sectional side view and a cross-sectional plan view showing a state in which the loading is placed on the upper side of the partition wall in the vertical heat treatment apparatus shown in Fig. 8; 9A and 9B are explanatory views showing other examples of the pressing mechanism. Fig. 1 is a longitudinal sectional side view showing a state in which a loading container is placed on a weir of a partition wall in a conventional vertical heat treatment apparatus. Schematic representation of the symbol] S1 External side area S2 Internal side area W Processed substrate BS Buffer space GS Gas supply part ES Exhaust part 2 Loading container 4 Partition wall 5 First area 6 Brother 2 Area 7 Pressing mechanism 8 Control part Π,41 埠12, 43 gate 13, 51,52, 61,62 mounting table
81654 -19- 1270955 14, 44 裝卸裝置 20 口部 21，94 蓋體 21a 键孔 22 凸緣部 23 凹部 24 扣合凹部 42 密封構件 45 滤片 46 排氣口 53, 63 位置決定構件 54 面板部 60 扣合構件 63a 驅動部 64 保管部 65 容器搬運裝置 66 導引部 67 移動部 68 多關節臂 71 旋轉軸 72 壓按構件 73 平板 73a，73b 腳部 74 頭部 -20- 81654 1270955 75 突起部 80a， 80b 氣缸 81a， 81b 活塞桿 82a， 82b 軸支構件 83a， 83b 動作臂 91 熱處理爐 92 晶圓淳 93 隔熱部 95 升降機構 96 晶圓搬運裝置 97 導引機構 98 移動體 99 臂 81654 -2181654 -19- 1270955 14, 44 loading and unloading device 20 mouth 21, 94 cover 21a keyhole 22 flange portion 23 recess 24 snap recess 42 sealing member 45 filter 46 exhaust port 53, 63 position determining member 54 panel portion 60 fastening member 63a driving portion 64 storage portion 65 container conveying device 66 guiding portion 67 moving portion 68 multi-joint arm 71 rotating shaft 72 pressing member 73 flat plate 73a, 73b foot portion 74 head -20- 81654 1270955 75 projection 80a, 80b Cylinders 81a, 81b Piston rods 82a, 82b Shaft support members 83a, 83b Acting arms 91 Heat treatment furnace 92 Wafer 淳 93 Thermal insulation 95 Lifting mechanism 96 Wafer handling device 97 Guide mechanism 98 Moving body 99 Arm 81654 - twenty one