CN1639857A - Port structure in semiconductor processing device - Google Patents
Port structure in semiconductor processing device Download PDFInfo
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- CN1639857A CN1639857A CNA03804921XA CN03804921A CN1639857A CN 1639857 A CN1639857 A CN 1639857A CN A03804921X A CNA03804921X A CN A03804921XA CN 03804921 A CN03804921 A CN 03804921A CN 1639857 A CN1639857 A CN 1639857A
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- carrying container
- port
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 238000005192 partition Methods 0.000 abstract 2
- 239000007789 gas Substances 0.000 description 30
- 235000012431 wafers Nutrition 0.000 description 29
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 230000007246 mechanism Effects 0.000 description 18
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 9
- 238000006073 displacement reaction Methods 0.000 description 5
- 238000003860 storage Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000137 annealing Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000008520 organization Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000009183 running Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002829 nitrogen Chemical class 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- High Energy & Nuclear Physics (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A semiconductor processing device has a port structure for carrying in and out a processing subject substrate (W). A partition wall (4) for separating the outer region (S1) and inner region (S2) of the device from each other is formed with a port (41) for passage of the processing subject substrate (W). The partition wall (4) is provided with a door (43) for opening and closing the port (41). A mount (61) is disposed within the outer region (S1) to face the port (41). Disposed above the mount (61) is a presser member (72). The presser member (72) presses a carrier vessel (2) for the processing subject substrate (W) from above onto the mount (61). The presser member (72) is moved between a lower position where it engages the carrier vessel (2) and an upper position where it does not interfere with the movement of the carrier vessel (2).
Description
Technical field
The present invention relates to processed substrate is moved into the port organization of taking out of in the semiconductor processing device.In addition, here said semiconductor processes is meant, by on processed substrates such as semiconductor wafer or LCD substrate, form semiconductor layer, insulating barrier, conductive layer etc. with compulsory figure, thereby on this processed substrate, carry out various processing, to make semiconductor device or to comprise assemblies such as the distribution that is connected with semiconductor device, electrode.
Background technology
As one in the semiconductor processing device, have a plurality of semiconductor wafers (Batch) vertical heat processing apparatus of heat-treating in batch.This vertical heat processing apparatus is that outer side zone and private side zone are separated, and simultaneously, comprises that also has the next door that can pass through the port of wafer.Its typical structure is, the outer side zone is the carrying container that holds some wafer is moved into the atmospheric side of taking out of by automatic carrying machine working device people or operator I/O zone.And the private side zone is that the wafer in the carrying container is moved on the brilliant boat that is loaded in as substrate fixture, the load area that is carried in heat-treatment furnace then and unloads from heat-treatment furnace.
In this vertical heat processing apparatus, load area is had than the high gas of I/O zone cleanliness factor, also to prevent the generation of wafer natural oxide film etc. simultaneously.Also to avoid wafer by particle contamination in addition.Therefore, the I/O zone is separated with load area, wish to become to be full of in the load area as nitrogen (N by the next door
2) the clean gas environment of such clean gas.In addition, in order to carry wafer, wish to use the oral area (wafer conveying end) of front by the airtight hermetic type carrying container of lid (also claiming the closed type carrying container).
Figure 10 is in existing vertical heat processing apparatus, and the state diagram of the carrying container of hermetic type is set on the port in above-mentioned next door.I/O region S 1 is separated by next door 4 with load area S2.Form port one 1 on the next door 4, port one 1 opens or closes by door 12.The mounting table 13 that puts carrying container 2 is set in the I/O region S 1.The lid 21 that makes carrying container 2 is set on the door 12 dismantles the dismounting device 14 of usefulness from carrying container 2.
If put carrying container 2 on the mounting table 13, then mounting table 13 advance to the edge part of carrying container 2 fronts and port one 1 around (being the edge part in the next door 4 of prescribed port 11) position contacting.Then, door 12 is in pent state, and by dismounting device 14, the lid 21 of carrying container 2 is removed.Afterwards, utilize nitrogen to replace by displacement apparatus (not shown) in the carrying container 2.Then, door 12 and lid 21 withdraw from from port one 1.Like this, the wafer W in the carrying container 2 just can be moved into load area S2 side.According to this method of operation, be desirable on the oxygen concentration rising this point in control load region S 2.This technology is documented in the spy and opens in flat 11-274267 number.
On the other hand, because the heavy caliberization of wafer, it is big that the volume in the carrying container also becomes thereupon.Therefore, when replacing in the carrying container 2, descend, wish to make the supply flow rate of nitrogen to increase for preventing disposal ability by nitrogen.But, if in carrying container 2, supply with the nitrogen of big flow, then in the carrying container in press liter, simultaneously, because the impact that its produces, carrying container 2 can shake.In this case, the position that carrying container 2 bottom surfaces contact with mounting table, from mounting table come-up (rocking), carrying container 2 reduces with the air-tightness in next door 4.So the gas in the carrying container 2 is not fully replaced just to be flowed in the load area S2, thereby influence the environment in the load area S2.For example can think that oxygen, moisture, organic components etc. flow in the load area S2.In addition, because deviation appears in the wafer W in the carrying container 2, the main cause of wrong transmission wafer after may becoming.
Summary of the invention
The objective of the invention is to, be used for that processed substrate is moved into the port configuration of taking out of semiconductor processing device, guarantee the state that puts that carrying container is stable.
According to viewpoint of the present invention, provide a kind of being used for that processed substrate is moved into the port configuration of taking out of semiconductor processing device, this port configuration comprises: the next door has the outer side zone that makes said apparatus and separates the port that above-mentioned processed substrate is passed through with the private side zone; Door is closed above-mentioned port and is arranged on the above-mentioned next door in order to open; And the released part that be provided with adjacent with above-mentioned port in territory, said external lateral areas, above-mentioned released part form under the oral area of above-mentioned carrying container and above-mentioned port are relative state, put the carrying container that the processed substrate multilayer of multi-disc is received and kept; Be arranged on above-mentioned released part top by giving as security member, above-mentionedly above-mentioned carrying container is given as security to above-mentioned released part by giving as security the top of member from above-mentioned carrying container; Drive division in the lower position that engages with above-mentioned carrying container and do not influence between the upper side position that above-mentioned carrying container moves, makes and above-mentionedly moves by giving as security member.
Above-mentioned port configuration can also have: under the above-mentioned oral area of above-mentioned carrying container is set at state on the above-mentioned port, supply with and discharge the gas supply part and the exhaust portion of clean gas to above-mentioned carrying container.
Above-mentioned port configuration can also have: the control part of controlling above-mentioned door, above-mentioned gas supply unit and above-mentioned exhaust portion, above-mentioned control part is under the state of closing above-mentioned door, by above-mentioned gas supply unit and above-mentioned exhaust portion, utilize above-mentioned clean gas to replace the interior gas of above-mentioned carrying container.
Description of drawings
Fig. 1 is the stereogram of vertical heat processing apparatus general survey in the embodiments of the present invention.
Fig. 2 is a vertical heat processing apparatus inside vertical disconnected side view roughly shown in Figure 1.
Fig. 3 is a vertical heat processing apparatus inside cross-sectional plan roughly shown in Figure 1.
Fig. 4 is the stereogram of a routine hermetic type carrying container.
Fig. 5 is the port of vertical heat processing apparatus median septum shown in Figure 1 and the skiagraph of periphery thereof.
Fig. 6 is in the expression vertical heat processing apparatus shown in Figure 1, the bottom of carrying container and the sectional drawing that is arranged on the situation that the engagement member on the mounting table is bonded together.
Fig. 7 be vertical heat processing apparatus shown in Figure 1 by the stereogram of giving as security mechanism.
Fig. 8 A, B are illustrated in the vertical heat processing apparatus shown in Figure 1, and the vertical disconnected side view and the cross-sectional plan of the state of carrying container is set on the port of next door.
Fig. 9 A, B are that other is by the key diagram of giving as security examples of mechanisms.
Figure 10 is illustrated in the existing vertical heat processing apparatus, and the vertical disconnected side view of the state of carrying container is set on the port of next door.
Embodiment
With reference to the accompanying drawings, embodiments of the present invention are described.In addition, in the following description,, mark identical symbol, only carry out repeat specification where necessary for function and the identical substantially component parts of structure.
Fig. 1 is in the embodiments of the present invention, the stereogram of vertical heat processing apparatus general survey.Fig. 2 and Fig. 3 are respectively vertical heat processing apparatus inside vertical disconnected side view and cross-sectional plans roughly shown in Figure 1.
As shown in Figure 1 to Figure 3, the gabarit of this vertical heat processing apparatus is formed by basket 3.Form I/O zone (outer side zone) S1 and load area (private side zone) S2 in the basket 3.I/O region S 1 is used for automatic carrying machine working device people or operator and moves into and take out of the carrying container 2 that holds some wafer (processed substrate).And load area S2 is used for the wafers in the carrying container 2 are transferred load in the brilliant boat 92 as substrate fixture, and loads and be offloaded on the heat-treatment furnace 91.
I/O region S 1 is separated by next door 4 with load area S2.Form port 41 on the next door 4, port 41 is opened or closed by door 43.I/O region S 1 is set to atmospheric environment (environment in the clean room).Load area S2 is set to inert gas environment, for example nitrogen (N
2) environment or clean dried gas (particle and organic principle little and dew point at the air below-60 ℃).
Fig. 4 is the stereogram of a routine hermetic type carrying container.Carrying container 2 is formed from a resin, and is made of by the hermetic type container that lid 21 is opened or closed oral area (the wafer conveying end) 20 of its front.In carrying container 2, for example diameter is some wafer W of 300mm, for example 25, is aligned to shelf type and is contained in wherein.On carrying container 2, tetragonal flange part 22 is by being fixed with the slit above this.Central portion at flange part 22 forms circular recess 23.
Bolt lock mechanism (not shown) is being set on the lid 21 of carrying container 2, and it is used for lid 21 is fixed on the oral area 20 of carrying container 2.Remove this bolt lock mechanism by dismounting device described later, lid 21 is taken off from oral area 20.Form lockhole 21a on the lid 21, the key of dismounting device-side is inserted in the lockhole 21a, half-twist roughly, and like this, bolt lock mechanism just is disengaged.
Watch from front one side of device, I/O region S 1 is formed with the 2nd zone 6 that is positioned at the inboard in the 1st zone 5 of a side in front by being positioned at it.In the 1st zone 5, about it, be provided with the 1st mounting table 51,52 in order to put carrying container 2 respectively.On the putting surface of the 1st mounting table 51,52, for carrying container 2 is positioned, as disposing at three places and the chimeric pin (align member) 53 (with reference to Fig. 1) of recess that is arranged on carrying container 2 bottoms.
The top in the 1st zone 5, promptly the superjacent air space of the 1st mounting table 51,52 is surrounded by the tool face board 54 of U font.The space that is surrounded by tool face board 54, the ceiling portion (not shown) in the clean room and the automatic carrying machine working device people that moves, Yi Bian supporting to move into the carrying container 2 of taking out of to the 1st mounting table 51,52, Yi Bian for by preparing.
Configuration the 2nd mounting table (released part) 61,62 in the 2nd zone 6 of I/O region S 1.In the putting surface of the 2nd mounting table 61,62, as disposing at three places and the chimeric pin (align member) 63 (with reference to Fig. 1) of recess that is arranged on carrying container 2 bottoms.Carrying container 2 is under the state of being located by pin 63 on the 2nd mounting table 61 (62), the oral area 20 of carrying container 2 and the port in next door 4 41 relative and mutual couplings.
Fig. 5 is the port 41 of vertical heat processing apparatus median septum 4 shown in Figure 1 and the skiagraph of periphery thereof.Fig. 6 is in the vertical heat processing apparatus shown in Figure 1, the bottom of carrying container 2 be arranged on the sectional drawing that the engagement member on the mounting table 61 (62) is bonded together.
As shown in Figure 5, around the port 41 in position that carrying container 2 is placed by container handling device described later and carrying container 2 and next door 4 between the position contacting, mounting table 61,62 can move forward and backward by drive division 63a, for example cylinder.As shown in Figure 6, on mounting table 61,62, the lock engagement member 60 that engages with the coupling recess 24 of carrying container 2 bottoms is being set.Engagement member 60 can constitute by drive division 60a around horizontal rotational shaft, in the position that engages with coupling recess 24 and engage between the position that is disengaged and rotate.
On the other hand, the upside in the 2nd zone 6 is provided with the Storage Department 64 of keeping carrying container 2.In this example, Storage Department 64 is made of the shelf of 2 layer of 2 row.In the 2nd zone 6 container handling device 65 is being set, it carries carrying container 2 between the 1st mounting table 51,52 and the 2nd mounting table 61,62 and Storage Department 64.Container handling device 65 has, the guide portion 66 of horizontal-extending and lifting freely and when being directed to guide portion 66 and mobile moving part 67.Multi-joint arm 68 is installed on the moving part 67, and it catches the flange part 22 above the carrying container 2, along horizontal direction carrying carrying container 2.
Fig. 8 A, B are in the vertical heat processing apparatus shown in Figure 1, vertical disconnected side view and cross-sectional plan when on the port 41 of next door 4 carrying container 2 being set.
Carrying container 2 on the 2nd mounting table 61 (62) that has moved forward contacts with next door 4 in the mode of its oral area 20 with port 41 couplings.Therefore, under this state,, then be interconnected by the port 41 in next door 4 with load area S2 in the carrying container 2 if take off the lid 21 of carrying container 2.On the edge part of the port 41 of I/O region S 1 one sides, be provided with the containment member 42 that makes carrying container 2 contact (edge part that is the oral area 20 of carrying container 2 contacts with it) with it.Containment member 42 is to work as the part in the next door 4 of the opening of prescribed port 41.
Load area S2 one side in next door 4 is being provided with the door of opening with close port 41 43.Door 43 is concave shape in load area S2 one side, and therefore, carrying container 2 is under the state that is configured on the port 41, formation cushion space BS between the oral area 20 of door 43 and carrying container 2.In cushion space BS, on the door 43 the dismounting device 44 that the lid 21 that makes carrying container 2 is installed on the carrying container 2 or unloads from it is being set.Door 43 is driven by drive division (not shown), when opening, the lid 21 that its supporting is taken off from carrying container 2, simultaneously along the next door 4 upward side or lower side keep out of the way, until not influencing the position of carrying wafer W.
In the cushion space BS, the supply of carrying out pure air is connected with carrying container 2 with the gas supply part GS and the exhaust portion ES of discharge.Its concrete condition is, shown in Fig. 5 and Fig. 8 A, B, 2 porous filters 45 that are connected with gas supply part GS are installed on the side edge part side in the port 41 in next door 4, to cushion space BS, supply with for example inert gas of nitrogen as clean gas from filter 45.In addition, the bottom of port 41 forms an exhaust outlet 46 of seeing the shape of growing crosswise from the front, and it is connected with exhaust portion ES, does not have big deviation when guaranteeing to carry out exhaust.As described later, gas supply part GS and exhaust portion ES under the control of control part, close door 43 and move under the state of the lid 21 that takes off carrying container 2, by the gas in clean gas displacement cushion space BS and the carrying container 2.
In I/O region S 1 one sides in next door 4, the left and right sides is being set up in parallel 2 by giving as security mechanism 7, is used for respectively putting above the carrying container 2 on the 2nd mounting table 61,62 by signature.Fig. 7 is the stereogram by the equipment of signature of vertical heat processing apparatus shown in Figure 1.
By give as security mechanism 7 have along the next door 4 horizontally extending by axle fixing rotating shaft 71, cardinal extremity one sides be fixed on the rotating shaft 71 by giving as security member 72.Constitute by falling the flat board 73 of Y-shaped by giving as security member 72, two 73a of foot, 73b are fixed on the rotating shaft 71.On dull and stereotyped 73 head 74, on the surface of downside, form circular jut 75 during flat-hand position.When dumping forward when roughly being flat-hand position by giving as security member 72, the circular depressions 23 of the lip portions 22 that jut 75 is top with being arranged on carrying container 2 engages.
Have cylinder 81a, 81b by giving as security mechanism 7 as drive source.Cylinder 81a, 81b are installed on the next door 4, make these piston rods 80a, 80b by give as security member 72 above and its both sides vertically advance and retreat.Lower end one side of piston rod 80a, 80b is installation shaft fixed component 82a, 82b respectively.The end of the last axle respectively of axle fixed component 82a, 82b operation arm 83a, 83b.The other end of operation arm 83a, 83b is installed in by the both sides of the edge of giving as security member 72 in the mode of rotation freely.
Therefore, shown in dotted line during by cylinder 81a, 81b pulling piston rod 80a, 80b, 4 be and erect posture (upper side position) along the next door by giving as security member 72.In addition, as piston rod 80a, 80b when a side is stretched out downwards, shown in solid line, by giving as security the posture (lower position) that member 72 roughly falls down in horizontal direction.In this lower position, jut 75 is inserted in the recess 23 of carrying container 2, carrying container 2 is given as security be placed on the mounting table 61 (62).
Return Fig. 2 and Fig. 3, the situation in the load area S2 is described.In load area S2, vertical heat treatment furnace 91 is set, the lower end has by lid 94 opens the fire door of closing.Below one side of vertical heat treatment furnace 91 is as some wafer W are put on lid 94 with the brilliant boat 92 of the anchor clamps of shelf fixed in shape.In addition, above the lid 94, between brilliant boat 92 and lid 94, insulation part 93 is set.Lid 94 be fixed on lowering or hoisting gear 95 above, by lowering or hoisting gear 95 make brilliant boat 92 be loaded on the heat-treatment furnace 91 or from it the dismounting.
Be provided with Waffer transport device 96 between the port 41 in brilliant boat 92 and next door 4.Waffer transport device 96 is carried wafer W between the carrying container 2 on brilliant boat the 92, the 2nd mounting table 61,62.Waffer transport device 96 has moving body 98, it can along about the guiding device 97 that extends move, simultaneously around the vertical axis rotation.That moving body 98 is provided with is some, 5 arms 99 that can stretch freely for example.
Below, the operation of above-mentioned execution mode is described.In addition, following operation is carried out according to the program that is stored in the control part 8 (with reference to Fig. 5).
At first, utilize the automatic carrying machine working device people (not shown) who moves along the ceiling portion of clean room, carrying container 2 is put on the 1st mounting table 51 (52) through the inner space decline and the quilt of tool face board 54.Then, by container handling device 65, carrying container 2 is carried on the 2nd mounting table 61 (62).In addition, sometimes by container handling device 65, carrying container 2 is temporarily taken care of by Storage Department 64, is carried to afterwards on the 2nd mounting table 61 (62) again.If carrying container 2 is carried on the mounting table 61 (62), at first, engagement member 60 rotations shown in Figure 6 engage with the coupling recess 24 of carrying container 2 bottoms.Then, the 2nd mounting table 61 (62) moves to next door 4 one sides, and the edge part of the oral area of carrying container 2 contacts airtightly with port 41 containment member 42 on every side in next door 4.
Then, by cylinder 81a, 81b by signature mechanism 7, piston rod 80a, 80b a side downwards stretch out, and operation arm 83a, 83b are limited and give as security downwards by giving as security member 72.Like this, around rotating shaft 71, rotate by giving as security member 72, thus the state that the formation level is fallen down.Its result is inserted into by the jut 75 of giving as security member 72 in the recess 23 of lip portions 22 of carrying container 2, thereby the 2nd mounting table 61 (62) is gone in carrying container 2 signatures shown in Fig. 8 A.Afterwards, the key (not shown) of dismounting device 44 is inserted into the keyhole 21a interior (with reference to Fig. 4) of the lid 21 of carrying container 2, about half-twist, and lid 21 just takes off (with reference to the state of Fig. 8 A, B) from carrying container 2.
Then, clean gas, for example nitrogen is from porous mass filter 45 along continuous straight runs, is blown in the carrying container 2 with the flow of 50～200l/min.This nitrogen flows along the inwall that reaches carrying container 2 between the wafer W, returns oral area 20 1 sides and exhaust outlet 46 discharges of one side from the below.Like this, the cushion space BS that reaches in the carrying container 2 between carrying container 2 and the door 43 is replaced by nitrogen.At this moment,, press liter in the carrying container 2, when gas imports simultaneously carrying container 2 produced and impact because the nitrogen of big flow is imported in the carrying container 2.But, because carrying container 2 is by giving as security from pressing by giving as security member 72, so can not produce position deviation.Therefore, can not influence the oral area 20 of carrying container 2 and the air-tightness between the containment member 42.
Afterwards, door 43, dismounting device 44 and lid 21 for example rise and withdraw from from port 41, are in connected state with load area S2 in the carrying container 2.Then, be removed successively, and be moved and be loaded on the brilliant boat 92 by the wafer W in Waffer transport device 96 carrying containers 2.If the wafer W in the carrying container 2 are all taken out, by with above-mentioned opposite operation, the lid 21 of carrying container 2 is closed.
Removing time of pressure of giving as security down, promptly in the present embodiment by giving as security mechanism 7, return time of the state of erecting by giving as security member 72, is for example after the oral area 20 of carrying container 2 is closed by lid 21.Then, the 2nd mounting table 61 (62) is stepped back, so carrying container 24 separation from the next door.Afterwards, carrying container 2 is carried to Storage Department 64 by container handling device 65 and temporary transient keeping.
On the other hand, if the wafer W of defined amount is loaded on the brilliant boat 92, then brilliant boat 92 is loaded in the heat-treatment furnace 91.Then, in heat-treatment furnace 91, the wafer W on the brilliant boat 92 is heat-treated, for example CVD, annealing in process, oxidation processes processing etc.If heat treatment finishes, then according to above-mentioned opposite operation, wafer W is returned in the carrying container 2.
If according to above-mentioned execution mode, then put on the 2nd mounting table 61 (62), and the carrying container 2 that contacts with next door 4, by being given as security from pressing by giving as security member 72.Therefore, during by the gas in the clean gas displacement carrying container 2, increase the flow of clean gas, even if because blow gas increases the impact that carrying container 2 produces, carrying container 2 also can keep its firm position after dismount and not rock.In addition, even if the impact when opening or closing the lid 21 of carrying container 2 increases, by carrying a container 2 from last by escorting, the posture of carrying container 2 is also stable.
Therefore, because that the airtight conditions between carrying container 2 and the next door 4 does not have is destroyed, so can prevent I/O region S 1 one side inflow load area S2 one side from atmospheric side.In addition owing to can not produce the position deviation of wafer W or extrude, therefore, after can not break down in the operation by Waffer transport device 96 taking-up wafer W yet.In addition, because therefore the flow of clean gas in the carrying container 2 of can increasing supply, not only can shorten by clean gas and replace the required time, can also improve disposal ability.
By give as security mechanism 7 by giving as security member 72, between the state (lower position) that state that erects along the next door (upper side position) and level are fallen down, rotate.Therefore, when pressing of releasing carrying container 2 given as security, can not influence the carrying of carrying container 2 by giving as security member 72.Can make whole in addition by the simple structureization of giving as security mechanism 7.
In the above-described embodiment, enumerated from the top by escorting the example that carries container 2 by the signature member.In addition, can also be by giving as security mechanism from laterally carrying container 2 by escorting.Fig. 9 A, B are by the key diagram of giving as security other example of mechanism.
Having by giving as security member 92 by giving as security mechanism shown in Fig. 9 A, it puts the carrying container 2 on the 2nd mounting table 61 (62) and it is fixed on the next door 4 by signature from the back side one side.For example can move forward and backward by giving as security member 92, and for example can reduce to the following downside of putting surface of the 2nd mounting table 61 (62).
Having by signature mechanism shown in Fig. 9 B is a pair of by giving as security member 95,96, and it clips from both sides and puts the carrying container 2 on the 2nd mounting table 61 (62) and it is fixed.In this case, by making carrying container 2 be fixed on time of the 2nd mounting table 61 (62), also can be with before the next door contacts at carrying container 2 by giving as security mechanism.
In addition, the present invention is defined in above-mentioned execution mode, as long as within the scope that does not break away from main points of the present invention, other various design alterations etc. all are fine.For example, the gas of load area S2 is not limited to inert gas, and it also can be the air of clean dried.At this moment, can in carrying container 2, supply with clean dry air at carrying container 2 with after next door 3 contacts, the air in the displacement carrying container 2.In addition, the present invention can be applicable to that also the I zone of moving into carrying container 2 and O zone are set at the device of diverse location.In addition, the present invention is not limited to vertical heat processing apparatus, and it also goes for for example semiconductor processing device of chip annealing device, coating resist and developing apparatus, ion implantation apparatus and other type.
Claims (11)
1. one kind is used for processed substrate is moved into the port configuration of taking out of semiconductor processing device, it is characterized in that, comprising:
The next door has the outer side zone that makes described device and separates the port that described processed substrate is passed through with the private side zone;
Door is closed described port and is arranged on the described next door in order to open;
And the released part that be provided with adjacent with described port in described outer side zone, described released part form under the oral area of described carrying container and described port are relative state, put the carrying container that the processed substrate multilayer of multi-disc is received and kept;
Be arranged on described released part top by giving as security member, describedly described carrying container is given as security to described released part by giving as security the top of member from described carrying container;
Drive division in the lower position that engages with described carrying container and do not influence between the upper side position that described carrying container moves, makes and describedly moves by giving as security member.
2. port configuration according to claim 1 is characterized in that,
Described by making by giving as security member around horizontal rotational shaft, described drive division is moved between described lower position and described upper side position.
3. port configuration according to claim 1 is characterized in that,
At described upper side position, describedly erect along described next door by giving as security member.
4. port configuration according to claim 1 is characterized in that,
Described carrying container has the recess of portion formed thereon, and describedly has the protuberance that engages with described recess by giving as security member.
5. port configuration according to claim 1 is characterized in that,
Described released part is provided with align member, and it engages with described carrying container and described carrying container is positioned.
6. port configuration according to claim 1 is characterized in that,
Described carrying container has the coupling recess that is formed at the bottom, and described released part is provided with engagement member, and it is by moving to described released part, and optionally engages with described coupling recess.
7. port configuration according to claim 1 is characterized in that,
It also has described oral area at described carrying container and is set under the state on the described port, supplies with the gas supply part and the exhaust portion of clean gas and exhaust to described carrying container.
8. port configuration according to claim 7 is characterized in that,
Described next door and described door are set to, and under the described oral area of described carrying container is set at state on the described port, form cushion space between described door and described oral area, and described cushion space is connecting described gas supply part and described exhaust portion.
9. port configuration according to claim 7 is characterized in that,
It also has the control part of the described door of control, described gas supply part and described exhaust portion, described control part is under the state of closing described door, by described gas supply part and described exhaust portion, utilize described clean gas to replace the interior gas of described carrying container.
10. port configuration according to claim 9 is characterized in that,
Described carrying container also has opens the lid of closing described oral area, described door has the dismounting device, under the state of dividing described outer side zone and described private side zone with air tight manner, it makes described lid be installed on the described carrying container or disassembles from it.
11. port configuration according to claim 10 is characterized in that,
Described dismounting device is controlled by described control part with described door, described gas supply part and described exhaust portion.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002111114 | 2002-04-12 | ||
| JP111114/2002 | 2002-04-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1639857A true CN1639857A (en) | 2005-07-13 |
| CN1307706C CN1307706C (en) | 2007-03-28 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB03804921XA Expired - Fee Related CN1307706C (en) | 2002-04-12 | 2003-03-28 | Port structure in semiconductor processing device |
| CNU03243278XU Expired - Fee Related CN2795158Y (en) | 2002-04-12 | 2003-04-14 | Port structure in semiconductor processing device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU03243278XU Expired - Fee Related CN2795158Y (en) | 2002-04-12 | 2003-04-14 | Port structure in semiconductor processing device |
Country Status (4)
| Country | Link |
|---|---|
| KR (1) | KR100922051B1 (en) |
| CN (2) | CN1307706C (en) |
| TW (1) | TWI270955B (en) |
| WO (1) | WO2003088351A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101728238A (en) * | 2008-10-16 | 2010-06-09 | 东京毅力科创株式会社 | Processing apparatus and processing method |
| CN101447404B (en) * | 2007-11-30 | 2011-03-23 | 东京毅力科创株式会社 | Method for limiting expansion of earthquake damage and system for limiting expansion of earthquake damage for use in semiconductor manufacturing apparatus |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101258350B1 (en) * | 2010-06-07 | 2013-04-30 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus |
| KR101283312B1 (en) * | 2011-12-29 | 2013-07-09 | 로체 시스템즈(주) | Auto loading system for front opening shipping box |
| JP6204226B2 (en) * | 2014-02-24 | 2017-09-27 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP7422577B2 (en) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | Load port and control method |
| KR102372514B1 (en) * | 2021-05-10 | 2022-03-10 | 주식회사 위존 | Foup fixing device for fims system |
| KR102372513B1 (en) * | 2021-05-10 | 2022-03-10 | 주식회사 위존 | FIMS system |
| KR20230021382A (en) | 2021-08-05 | 2023-02-14 | 삼성전자주식회사 | Transfer apparatus having link arms and stockers having the same |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0821610B2 (en) * | 1990-11-20 | 1996-03-04 | 株式会社荏原製作所 | Method and device for storing and taking out contents of carrier box |
| JP3500455B2 (en) * | 1993-12-10 | 2004-02-23 | 東京エレクトロン株式会社 | Processing equipment |
| JP2850279B2 (en) * | 1994-02-22 | 1999-01-27 | ティーディーケイ株式会社 | Clean transfer method and device |
| US6447232B1 (en) * | 1994-04-28 | 2002-09-10 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
| JPH0846005A (en) * | 1994-07-26 | 1996-02-16 | Takenaka Komuten Co Ltd | Wafer transfer apparatus |
| JP3656701B2 (en) * | 1998-03-23 | 2005-06-08 | 東京エレクトロン株式会社 | Processing equipment |
| US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
-
2003
- 2003-03-28 KR KR1020047010060A patent/KR100922051B1/en active IP Right Grant
- 2003-03-28 WO PCT/JP2003/003997 patent/WO2003088351A1/en active Application Filing
- 2003-03-28 CN CNB03804921XA patent/CN1307706C/en not_active Expired - Fee Related
- 2003-04-11 TW TW092108580A patent/TWI270955B/en not_active IP Right Cessation
- 2003-04-14 CN CNU03243278XU patent/CN2795158Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101447404B (en) * | 2007-11-30 | 2011-03-23 | 东京毅力科创株式会社 | Method for limiting expansion of earthquake damage and system for limiting expansion of earthquake damage for use in semiconductor manufacturing apparatus |
| CN101728238A (en) * | 2008-10-16 | 2010-06-09 | 东京毅力科创株式会社 | Processing apparatus and processing method |
| US8414242B2 (en) | 2008-10-16 | 2013-04-09 | Tokyo Electron Limited | Processing apparatus and processing method |
| CN101728238B (en) * | 2008-10-16 | 2013-04-10 | 东京毅力科创株式会社 | Processing apparatus and processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100922051B1 (en) | 2009-10-19 |
| KR20040099260A (en) | 2004-11-26 |
| CN2795158Y (en) | 2006-07-12 |
| TWI270955B (en) | 2007-01-11 |
| CN1307706C (en) | 2007-03-28 |
| TW200402822A (en) | 2004-02-16 |
| WO2003088351A1 (en) | 2003-10-23 |
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