TW200402822A - Port structure of semiconductor processing apparatus - Google Patents
Port structure of semiconductor processing apparatus Download PDFInfo
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- TW200402822A TW200402822A TW092108580A TW92108580A TW200402822A TW 200402822 A TW200402822 A TW 200402822A TW 092108580 A TW092108580 A TW 092108580A TW 92108580 A TW92108580 A TW 92108580A TW 200402822 A TW200402822 A TW 200402822A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/07—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for semiconductor wafers Not used, see H01L21/677
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Abstract
Description
200402822 玫、發明說明： 【發明所屬之技術領域】 本發明係關於對於半導體處理裝置搬出入被處理基板之 埠構造。此外，此處所謂之半導體處理，係指於半導體晶 圓或LCD基板等被處理基板上，將半導體層、絕緣層、導 電層等以特定之圖案形成，藉此於該被處理基板上製造半 導體裝置、或包含與半導體裝置連接之配線、電極等構造 物而實施之各種處理。 【先前技術】 作為半導體處理裝置之一種，有所謂之對於多數半導體 晶圓以接片進行熱處理之縱型熱處理裝置。該縱型熱處理 裝置包含間隔壁，其係將裝置之外部側區域與内部側區域 區隔’同時具備可使晶圓通過之埠。典型上，外部側區域 係將收納複數枚晶圓之裝載容器，以自動搬運機器人或操 作員搬出入之大氣側之I/O區域。此外，内部側區域係將裝 载容器内之晶圓移載至作為基板保持具之晶圓埠，並進行 往熱處理爐載入及載出之裝載區域。 該種縱型熱處理裝置中，必須使裝載區域成為較1/〇區域 乾淨度更咼之環境，同時防止晶圓之自然氧化膜之產生。 此外，亦必須抑制晶圓之微塵污染。因此，希望將J/0區域 與裝載區域以間隔壁區隔，使裝載區域内成為以乾淨氣體 ，例如氮（N2)氣充滿之乾淨氣體環境。此外為搬運晶圓， 希望使用將前面之口邵（晶圓取出口）以蓋體密閉之密閉型 裝載容器（亦稱為封閉型裝載容器）。 81654 200402822 圖ίο係表示過去之縱型熱處理裝置中，將密閉型裝載容· 器配置於上述間隔壁之埠上之狀態。I/O區域S1與裝載區域 ， S2藉由間隔壁4而區隔。於間隔壁4形成埠11，且埠u藉由 閘門12而開關。I/O區域S1設置為載置裝載容器2之載置台 13。於閘門12設置將裝載容器2之蓋體21，對於裝載容器2 裝卸之裝卸裝置14。 於載置台13上載置裝載容器2時，使載置台13前進至裝載 容器2之前面緣部與埠11之周圍（亦即規定埠丨丨之間隔壁4 緣邵）抵接為止。其次於閘門12閉鎖之狀態下，藉由裝卸裝 _ 置14，取下裝載容器2之蓋體21。接下來使裝載容器2内藉 由置換手段（無圖示）以氮氣置換。其次使閘門12及蓋體21 由埠1‘1退避。藉此，可使裝載容器2内之晶圓w搬入裝載區 域S2側。依據如此之處理方法，由可抑制裝載區域S2内之 氧濃度上升之點視之為佳。該種技術已記載於特開平 11-274267號。 另一万面，由於晶圓之大口徑化而使得裝載容器内之容 積亦變大。因此，將裝載容器2内以氮氣置換時，希望為抑 · 制產能之降低而加大氮氣之供給流量。惟以大流量將氮氣 供給至裝載容器2内時，裝載容器内之内壓將上升，同時因 該衝擊將使得裝載容器2搖動。該情形下，裝載容器2底面 與載置台接觸之部位將由載置台浮起（震動），使得裝載容器 2間隔，4之氣密性變差。其結果將無法充分置換裝載容器2 内境，並流入裝載區域82内，影響裝載區域82内之環 境。認為例如氧、水分、有機物成分等將流入裝載區域Μ 81654 200402822 内。此外，因裳載容器2内之晶圓歡偏移， 搬運錯誤主因之虞。 风為<後 【發明内容】 本發明< 目的係對於半導體處理裝置搬出人被 之蟑構造中，確保裝載容器安定之載置狀[ 土板 '據本《明之觀點係提供—種蟑構造，其係#於半導體 處理裝置搬出人被處理基板者，其特徵在於包含：200402822 Description of the invention: [Technical field to which the invention belongs] The present invention relates to a port structure for carrying a semiconductor processing device in and out of a substrate to be processed. In addition, the semiconductor processing referred to here refers to forming a semiconductor layer, an insulating layer, and a conductive layer in a specific pattern on a substrate to be processed such as a semiconductor wafer or an LCD substrate, thereby manufacturing a semiconductor on the substrate to be processed. Various processes performed on the device or structures including wiring and electrodes connected to the semiconductor device. [Prior Art] As one type of semiconductor processing apparatus, there is a so-called vertical heat treatment apparatus that performs heat treatment on a plurality of semiconductor wafers by bonding. This vertical heat treatment apparatus includes a partition wall, which separates the outer side area and the inner side area of the device, and includes a port through which a wafer can pass. Typically, the external area is an atmospheric I / O area in which a plurality of wafers are loaded in a container for automatic robot or operator loading and unloading. In addition, the inner side area is a loading area where a wafer in a loading container is transferred to a wafer port as a substrate holder, and the wafer port is loaded and unloaded into a heat treatment furnace. In this type of vertical heat treatment device, it is necessary to make the loading area a cleaner environment than the 1/0 area, and at the same time prevent the generation of natural oxide films on the wafer. In addition, the dust pollution of the wafer must be suppressed. Therefore, it is desirable to separate the J / 0 area from the loading area with a partition wall so that the loading area becomes a clean gas environment filled with a clean gas, such as nitrogen (N2) gas. In addition, in order to transfer wafers, it is desirable to use a hermetically sealed loading container (also referred to as a closed loading container) that seals the front mouth (wafer take-out port) with a lid. 81654 200402822 The figure shows the state in which the closed type loading container was placed on the port of the partition wall in the conventional vertical heat treatment device. The I / O area S1 and the loading area S2 are separated by a partition wall 4. A port 11 is formed in the partition wall 4, and the port u is opened and closed by a gate 12. The I / O area S1 is provided as a mounting table 13 on which the loading container 2 is mounted. The gate 12 is provided with a cover 21 for loading the container 2 and a loading / unloading device 14 for loading and unloading the loading container 2. When loading the loading container 2 on the loading platform 13, the loading platform 13 is advanced until the front edge portion of the loading container 2 and the surrounding area of the port 11 (that is, the edge 4 of the partition wall 4 of the specified port 丨) abut. Next, in the state where the gate 12 is closed, the cover body 21 of the loading container 2 is removed by the loading and unloading device 14. Next, the inside of the loading container 2 is replaced with nitrogen by a replacement means (not shown). Next, the gate 12 and the cover 21 are retracted from the port 1′1. Thereby, the wafer w in the loading container 2 can be carried into the loading area S2 side. According to such a treatment method, it is preferable to suppress the increase in the oxygen concentration in the loading area S2. This technique has been described in Japanese Patent Application Laid-Open No. 11-274267. On the other hand, due to the large diameter of the wafer, the volume in the loading container also increases. Therefore, when replacing the inside of the loading container 2 with nitrogen, it is desirable to increase the supply flow rate of nitrogen in order to suppress the reduction of the production capacity. However, when nitrogen is supplied into the loading container 2 at a large flow rate, the internal pressure in the loading container will rise, and the loading container 2 will be shaken due to the impact. In this case, the part of the bottom surface of the loading container 2 that is in contact with the mounting table will float (vibrate) from the mounting table, so that the gap between the loading containers 2 and the airtightness of 4 will be deteriorated. As a result, the interior of the loading container 2 cannot be fully replaced and flows into the loading area 82, which affects the environment in the loading area 82. It is considered that, for example, oxygen, moisture, organic components, etc., will flow into the loading area M 81654 200402822. In addition, because the wafers in the container 2 are shifted, the main cause of handling errors may be caused. The wind is the <post [contents of the invention] The purpose of the present invention is to ensure the stability of the loading container in the cockroach structure of the semiconductor processing device. [Soil plate] According to the "Viewpoint of Ming-a kind of cockroach structure" , Which is a person who removes a substrate to be processed from a semiconductor processing device, and is characterized by:
間隔壁，其係將前述裝置之外部側區域與内：側區域區 隔，同時具有可使前述被處理基板通過之埠； 閘門’其係為使前述埠開關而設置於前述間隔壁者； 載置:’其係於前述外部側區域内臨接前述埠而設置者 ^中前述載置部係將多層收納複數牧被處理基板之裝載 容器’於前述裝載容器之口部與前述埠於對向之狀 置地形成； 心戟 壓按構件，其係設置於前述載置部之上方者，其中前述Partition wall, which separates the outer side area and the inner side side of the device, and has a port through which the substrate to be processed can pass; a gate 'which is provided on the partition wall for the port switch; Set: 'It is set up in front of the above-mentioned port in the outer side area ^ In the above-mentioned loading section is a multi-layered storage container containing a plurality of substrates to be processed' at the mouth of the above-mentioned loading container opposite to the above-mentioned port The shape is formed on the ground; the halberd pressing member is arranged above the mounting portion, wherein the foregoing
壓按構件係由前述裝載容器之上’將前述裝載容器對於前 述載置部按壓者；及 、驅動部，其係使前述壓按構件，可於前述處理裝置扣合 《下側位置，及不干涉前述裝載容器移動之上側位置間移 動者。 前述埠構造，於前述裝载容器之前述口部配置在前述棒 之狀.¾下it #包含氣體供給部及排氣部，其係對於 前述裝載容器進行乾淨氣體之供給與排氣者。 、 前述崞構造可進-步具備控制前述閘門、前述氣體供給 81654 200402822 P及觔述排氣邵之控制邵，且前述控制部於前述閘門閉 鎖i狀鸿下，藉由前述氣體供給部與前述排氣部，將前述 裝載容器内以前述乾淨氣體置換。 【實施方式】 關於本發明之實施形態，參照圖式並於以下說明。此外 以下 < 說明中，關於具有大略相同功能及構成之構成要素 附以相同符號，且僅於必要時進行重複說明。 圖1係表示關於本發明實施形態之縱型熱處理裝置概觀 <全體圖。圖2及圖3分別係概略表示圖丨所圖示之縱型熱處 理裝置内邵之縱剖側面圖及橫剖平面圖。 如圖1至圖3所示，該縱型熱處理裝置之外廓係以框體3 开y成。於框體3内形成I/O區域（外部側區域）S1與裝載區域 (内崢側區域）S2。I/O區域S丨係使用於將收納複數枚晶圓 (被處理基板）之裝載容器2,以自動搬運機器人或操作員搬 出入。裝載區域S2係使用於將裝載容器2内之晶圓，移載至 作為基板保持具之㉟料92，並進行往減㈣91之載入 及載出。 ,1/0區域S1與裝載區域S2藉由間隔壁4而區隔。於間隔壁4 形成琿4卜且琿41藉由閘門43而開關。1/〇區域81係設定為 ^氣環境（無塵室内之環境）。裝載區域S2係設定為非活性 氣體環境’例如氮氣（N2)環境或乾淨乾燥氣體（微塵及有機 成刀少，且結露點為_ 6 〇。(3以下之办氣）。 圖4係表示閉型裝載容器—例之全體圖。裝載容器㈣如 由樹脂而成，且由前面口部（晶圓取出口）2〇以蓋體㈣關之 81654 200402822 密閉容器而成。於裝載容器2内The pressing member is a person who presses the loading container against the mounting portion from above the loading container; and a driving portion that enables the pressing member to be engaged with the lower position of the processing device and A mover that interferes with the movement of the loading container from the upper position. In the aforementioned port structure, the mouth portion of the loading container is arranged in the shape of the rod. ¾ lower it # includes a gas supply portion and an exhaust portion, which supply and exhaust clean gas to the loading container. The aforesaid structure can be further-equipped with control for controlling the gate, the gas supply 81654 200402822 P, and the exhaust valve, and the control section is under the lock of the gate, and the gas supply section and the The exhaust part replaces the inside of the loading container with the clean gas. [Embodiment] An embodiment of the present invention will be described below with reference to the drawings. In addition, in the following < description, components having substantially the same function and structure are given the same symbols, and repeated descriptions will be repeated only when necessary. Fig. 1 is a general view < an overall view showing a longitudinal heat treatment apparatus according to an embodiment of the present invention. Fig. 2 and Fig. 3 are a schematic side view and a cross-sectional plan view, respectively, of the interior of the longitudinal heat treatment apparatus shown in Fig. 丨. As shown in FIGS. 1 to 3, the outer profile of the vertical heat treatment apparatus is formed by a frame 3. An I / O area (outside area) S1 and a loading area (inside area) S2 are formed in the housing 3. The I / O area S 丨 is used for loading and unloading a container 2 containing a plurality of wafers (substrates to be processed) by an automatic transfer robot or an operator. The loading area S2 is used for transferring the wafers in the loading container 2 to the material 92 as a substrate holder, and loading and unloading to and from the substrate 91 are performed. The 1/0 area S1 and the loading area S2 are separated by a partition wall 4.珲 4 壁 is formed on the partition wall 4 and 珲 41 is opened and closed by the gate 43. The 1 / 〇 area 81 is set to the air environment (environment in a clean room). The loading area S2 is set to a non-reactive gas environment, such as a nitrogen (N2) environment or a clean and dry gas (less dust and organic knives, and the dew point is _ 6 〇. (3 or less). Figure 4 shows closed Type loading container-the whole picture of the example. The loading container is made of resin, and it is formed by the front mouth (wafer take-out port) 20 and the cover is closed by the closed body 81654 200402822. Inside the loading container 2
例如直徑300 mm之晶圓W 係複數.牧例如25牧 以棚狀排列而收納。於裝載容器2之上 面’四角形之凸緣部22與該上面具有空隙並固定。並於凸 緣部22之中央邵形成圓形之凹部23。For example, a wafer W with a diameter of 300 mm is a plural number. For example, 25 wafers are arranged in a shed shape and stored. A quadrangular flange portion 22 on the upper surface of the loading container 2 is fixed with a gap between the flange portion 22 and the upper surface. A circular concave portion 23 is formed in the center of the flange portion 22.
於裝載容器2之蓋體21，設置為將之保持於裝載容哭2之 口部20之閃鎖機構（無圖示）。蓋體21藉由使該問鎖機構以後 述之裝卸裝置而解除，可使口部2G打開。於蓋體21形成鍵 孔2U，藉由於鍵孔21a内差入裝卸裝置側之卡榫並以略9〇。 旋轉，可解除閃鎖機構。 I/O區域S1由裝置之正面側所視之，係包含位於前方之第 1區域5,及位於後方之第2區域6。於第i區域5，設置為分 別載置裝載容器2而配置於左右之第丨載置台51、52。於第工 載置台51、52<載置面，為決定裝載容器2之位置，與設置 於裝載容器2之底部之凹部嵌合之卡榫（位置決定構件）53， 例如設置於3處（參照圖丨）。A flash lock mechanism (not shown) is provided on the lid 21 of the loading container 2 to hold the lid 21 in the mouth 20 of the loading container 2. The lid body 21 can be opened by releasing the interrogation mechanism described later, and the mouth portion 2G can be opened. A key hole 2U is formed in the cover 21, and the keyhole 21a is inserted into the tenon on the side of the loading and unloading device due to the difference in the key hole 21a. Rotate to release the flash lock mechanism. The I / O area S1 is viewed from the front side of the device and includes a first area 5 located in the front and a second area 6 located in the rear. In the i-th area 5, the loading containers 2 are placed and placed on the left and right mounting platforms 51 and 52, respectively. In order to determine the position of the loading container 2 on the mounting surfaces 51, 52 < the mounting surface, a tenon (position determining member) 53 fitted into a recess provided at the bottom of the loading container 2 is provided, for example, at three places (see Figure 丨).
第1區域5之上方，亦即第！載置台51、52上方之空間，以 ^字^型之面板部54包圍。以面板部54所包圍之空間，係為使 〜典塵至内天井邵（無圖示）移動之自動搬運機器人，一面支 持對於第1載置台51、52搬出入之裝載容器2並一面通過而 準備。 万；I/O區域S1之第2區域6,配置第2載置台（載置部）61、62 万；第2載置台61、62之載置面，與設置於裝載容器2底部 义凹部嵌合之卡筍（位置決定構件）63,例如設置於3處（參照 圖丨）。裝載谷器2於第2載置台61(62)上以卡榫63決定位置之 81654 200402822 狀態下’裝載容器2之口部2〇係與間隔壁4之埠4ι對向且整合· ° * 圖5係表示圖1所圖示之縱型熱處理裝置中，間隔壁4之埠. 41及"周邊〈縱剖面圖。圖6係表示圖丨所圖示之縱型熱處 理裝置中，裝載容器2底部與設置於載置台61(62)之扣合 件之扣合模樣剖面圖。 口 如圖5所示，載置台61、62係於藉由後述之容器搬運裝置 而放置裝載容器2之位置’及裝載容器2與間隔壁4之和周 園抵接之位置間，藉由例如氣缸之驅動部.可於前後移動# 如圖6所不，於載置台61、62，設置與裝載容器2底部之 扣合凹部24扣合之鎖型扣合構件6〇。扣合構件6〇係藉由驅 動邵60a’於水平軸附近可旋動地構成，並朴合凹部μ之 扣合位置與解除該扣合之位置間旋動。 另一万面’於第2區域6之上侧，設置保管裝載容器2之保 管部60保管部64於該财係藉由行之棚而構成。於 ^區域6’設置將裝載容器2於第i載置台5卜52 ·第〕載置 口 61 62，及保官邵64之間搬運之容器搬運裝置μ。容器鲁 搬運裝置65包含：於水平延伸且可自由升降之導引部66、 及一=被導引部66導引並一面移動之移動部67。於移動部 女裝保持裝載容器2上面之凸緣部22,並將裝載容器2 於水平方向搬運之關節臂68。 圖8A、B係表示圖丨所圖示之縱型熱處理裝置中，裝載容 器叹置於間隔壁4之埠4 i上狀態之縱剖側面圖及橫剖平面 圖。 81654 200402822 前進之第2載置台61(62)上之裝載容器2，使其口部2〇與埠· 41整令地與間隔壁4抵接。因此，於該狀態取下裝載容器2 , <蓋體21時，裝載容器2内與裝載區域S2，通過間隔壁4之 埠41而連通。於I/O區域S1側之埠41緣部，設置為使裝載容 器2抵接（亦即與裝載容器2口部2〇之緣部抵接）之密封構件 42。密封構件42係有作為規定埠41開口之間隔壁4一部分之 功能。 於間隔壁4之裝載區域82側，設置可開關埠“之閘門43 。閘門43於裝載區域S2侧成為凹下之形狀，因此於裝載容籲 器2配置在埠41上之狀態下，於閘門“與裝載容器2之口部 2〇之間形成緩衝空間BS。緩衝空間68中，於閘門“設置使 裝載容器2之蓋體21，可對於裝載容器2裝卸之裝卸裝置料 。閘門43以閘門驅動部（無圖示）驅動，於開放時一面支持由 裝載谷态2取下之盍體21，一面至不會妨礙晶圓…搬運之位 置為止，沿間隔壁4退避至上方側或下方側。 於緩衝空間BS，連接對於裝載容器2進行乾淨氣體之供給 與排氣之氣體供給部GS及排氣部£3。具體上如圖5及圖8A 、；6所不，於間隔壁4之埠41之側緣部側，安裝連接氣體供 、、·。P GS之兩個多孔質遽片45，由濾、片45至緩衝空間内， 供…成為乾淨氣體之非活性氣體，例如氮氣。此外，於埠 41<下端部，形成可進行較小偏差排氣地，且由正面視之 為検長之排氣口 46，並將其連接排氣部ES。如後所述，氣 體供給部GS與排氣部£8於控制部之控制下，在將閘門43閉 鎖且取裝載容器2之蓋體21之狀態下動作，可將緩衝空間Bs 81654 -12- 200402822 及裝載容器2内以乾淨氣體置換。 於閃隔壁4之I/O區域81側，將分別按壓載置於第2載置台 61、62之裝載容器2上面之兩個壓按機構7，左右並列地設 置。圖7係表示圖1所圖示之縱型熱處理裝置之壓按機構7全 體圖。 壓按機構7包含：沿間隔壁4水平延伸地作為軸而支持之 旋轉轴71，及基端側固定於旋轉軸71之壓按構件7 2。壓按 構件72係由倒Y字型之平板73而成，其兩腳部73a、73b固定 於旋轉軸71。於平板73之頭部74，在水平姿勢時朝向下側 之面形成圓形突起部75。突起部75係當壓按構件72向前倒 並大致成為水平姿勢時，與設置於裝載容器2上面之凸緣部 22之圓形凹部23扣合地配置。 壓按構件7包含作為驅動源之氣缸81a、81b。氣缸81a、 8 lb於壓按構件72之上方及其兩側，使該等之活塞桿80a、 8〇b可垂直進退地安裝於間隔壁4上。活塞桿80a、80b之下 端側分別安裝軸支構件82a、82b。軸支構件82a、82b分別 作為軸而支持動作臂83a、83b之一端側。動作臂83a、83b 之他端側則可自由旋動地安裝於壓按構件72之兩側緣。 因此，壓按構件72藉由氣缸81a、81b而使得活塞桿80a、 80b拉起時，如虛線所示，沿間隔壁4成為站起之姿勢（上側 位置）。此外，壓按構件72當活塞桿8〇a、80b於下方側伸出 時，如實線所示’成為大致於水平倒下之姿勢（下側位置） 。於該下側位置，突起部75插入裝載容器2之凹部23，並使 裝載容器2對於載置台61(62)按壓。 81654 -13 - 200402822 閘門43、裝卸裝置44、第2載置台61(62)、壓按構件72、. 氣时斜心部GS、及排氣邵以等，依照儲存於控制部8(參照 圖5)之程式而操作。概略上控制部8測出於第]載置台 上載置裝載容器2’使裝載容器2至與間隔壁4之埠41周圍抵 接之位置為止地，使第2載置台61(62)前進。其次驅動壓按 機構7之氣缸81a、81b，以壓按構件72將裝載容器2對於第2 載置台61(62)按壓。接下來驅動裝卸裝置料，由裝載容器2 將蓋體21取下。其次於間門43閉鎖之下，驅動氣體供給部 GS與排氣部ES，將緩衝$間則及裝載容器2内以乾淨氣體 · 置換。其次將閘門43及蓋體21由埠41退避《藉此，裝載容 為2内之晶圓w可搬入至裝載區域S2側。 回到圖2及圖3，說明關於裝載區域S2内。於裝載區域 ，設置於下端具有可藉由蓋體94而開關之爐口之縱型熱處 理爐91。於縱型熱處理爐91之下方侧，將多數枚之晶圓w 以棚狀保持之作為保持具之晶圓埠92 ,載置於蓋體％上。 此外’蓋體94上之晶圓埠92與蓋體94之間，設置隔熱部93 。盍體94支持於升降機構95上，藉由升降機構95使晶圓埠 92對於熱處理爐91載入及載出。 於晶圓埠92與間隔壁4之埠41之間，設置晶圓搬運裝置％ 。晶圓搬運裝置96於晶圓埠92,與第2載置台61、62上之裝 載容器2之間搬運晶圓W。晶圓搬運裝置96包含移動體％， 其係沿往左右延伸之導引機構97移動之同時，於錯直轴附 近可旋動者。於移動體98，設置複數之例如5枚可自由進退 之臂99。 < 81654 -14- 200402822 其次說明關於上述實施形態之操作。此外，下述之操作 係依照儲存於控制部8(參照圖5)之程式而進行。 ”首先藉由沿無塵室之A井部移動之自動搬運機器人（無 固示）使裝載谷森2通過面板54之内部空間而下降，載置 於弟1載置台51(52)。其次，藉由容器搬運裝置65將裝載容 器2搬運至第2載置台61(62)。此外，亦有藉由容器搬運裝置 =使裝載容器2暫時保管於保管部64，之後搬運至第2載置 台61(62)之情形。裝載容器2載置於第2載置台61(62)時，首 先如圖6所示，使扣合構件6〇旋動並與裝載容器2底部之扣 合凹部24扣合。其次第2載置台61(62)移動至間隔壁4側，並 使裝載容器2 口部20之緣部，與間隔壁4之埠41周圍之密封 構件42氣密地抵接。 人藉由壓按機構7之氣缸8ia、81b，使活塞桿8〇a、8〇b 於下方側伸出，且動作臂83a、83b藉由壓按構件72一面被 規毛控制一面按壓下側。藉此，壓按構件72使得旋動軸7工 之周圍旋動’成為橫倒之狀態。其結果如圖8 A所示，壓按 構件72之突起部75插入裝載容器2之凸緣部22凹部23，並使 裝載容器2對於第2載置台61 (62)按下。其次裝卸裝置44之卡 筍（無圖示），插入裝載容器2之蓋體21之鍵孔21a(參照圖4) 並旋轉略90。，藉此使蓋體21由裝載容器2取下（圖8a、B之 狀態）。 其次由多孔質遽片45使例如氮氣之乾淨氣體，水平向裝 載谷器2内以例如流量50〜200 Ι/min吹出。該氮氣係沿晶圓w 之間及裝載容器2之内壁流動，回到口部20側並由下方側之 81654 -15- 200402822 排氣口 46排氣。藉此 以氮氣置換裝載容器2内及裝載容器 因使氮氣以大流量導入 2與閘.門43間之緩衝空間bS。此時 裝載容益2内’裝載容器2内之内壓將上升，同時於氣體導 入時將對«容器2施加衝擊。惟裝載容器2藉由壓按構件 72由上方按壓，故將不產生位置之偏移。因此，使得裝載 容器2之口部20與密封構件42之氣密性將不發生妨堂。Above the first area 5 is the first! A space above the mounting tables 51 and 52 is surrounded by a panel portion 54 of a square shape. The space surrounded by the panel portion 54 is an automatic transfer robot that moves ~ Dianchen to the inner patio (not shown), while supporting the loading container 2 carried in and out of the first mounting tables 51 and 52 and passing through it. ready. The second area 6 of the I / O area S1 is provided with a second mounting table (mounting section) 610,000 and 620,000; the mounting surface of the second mounting table 61 and 62 is embedded with a recessed portion provided at the bottom of the loading container 2. The combined bamboo shoots (position determining member) 63 are installed at, for example, three places (see FIG. 丨). The loader 2 is mounted on the second mounting table 61 (62) with the tongue 63 to determine the position 81654 200402822. The mouth portion 20 of the load container 2 is opposite to the port 4m of the partition wall 4 and integrated. * * Figure 5 shows the port 41 of the partition wall 4 in the vertical heat treatment apparatus shown in FIG. 1 and the “peripheral cross-sectional view”. Fig. 6 is a sectional view showing the fastening pattern of the bottom of the loading container 2 and the fastening member provided on the placing table 61 (62) in the longitudinal heat treatment device shown in Fig. 丨. As shown in FIG. 5, the mounts 61 and 62 are placed between a position where the loading container 2 is placed by a container transporting device described later and a position where the loading container 2 and the partition wall 4 abut the circumference of the garden. The driving part of the air cylinder can be moved forward and backward # As shown in FIG. 6, on the mounting platforms 61 and 62, a lock-type fastening member 60 that is engaged with the fastening recess 24 at the bottom of the loading container 2 is provided. The engaging member 60 is rotatably constituted by driving the Shao 60a 'near the horizontal axis, and rotates between the engaging position of the engaging recessed portion µ and the position where the engaging is released. On the other side, on the upper side of the second area 6, a storage section 60 for storing and holding the container 2 is provided, and a storage section 64 is constituted by a shed in the financial department. A container transporting device μ is provided in the area 6 'to transport the loading container 2 between the i-th mounting table 5b, 52nd, and 61st, and the security officer Shao 64. The container handling device 65 includes a guide portion 66 that extends horizontally and can be raised and lowered freely, and a moving portion 67 that is guided by the guide portion 66 and moves while moving. In the moving part, the women's clothing holds the flange portion 22 on the upper surface of the loading container 2 and carries the loading arm 2 in a horizontal direction to the articulated arm 68. 8A and 8B are a longitudinal sectional side view and a cross-sectional plan view showing a state in which the loading container is placed on the port 4 i of the partition wall 4 in the longitudinal heat treatment apparatus shown in FIG. 81654 200402822 The loading container 2 on the forward second mounting table 61 (62) has its mouth 20 and port · 41 abutted against the partition wall 4 in an orderly manner. Therefore, when the loading container 2 is removed in this state, < the lid body 21, the inside of the loading container 2 and the loading area S2 are communicated through the port 41 of the partition wall 4. A sealing member 42 is provided on the edge portion of the port 41 on the I / O area S1 side so as to abut the load container 2 (that is, abut the edge portion of the load container 2 mouth portion 20). The sealing member 42 functions as a part of the partition wall 4 defining the opening of the port 41. On the side of the loading area 82 of the partition wall 4, a gate 43 capable of opening and closing the port is provided. The gate 43 has a concave shape on the side of the loading area S2. Therefore, when the loading container 2 is disposed on the port 41, "A buffer space BS is formed with the mouth portion 20 of the loading container 2. In the buffer space 68, a cover 21 for the loading container 2 is provided in the gate, and a loading device for loading and unloading the loading container 2 is provided. The gate 43 is driven by a gate driving unit (not shown), and supports the loading valley when it is opened. The body 21 removed from the state 2 is retracted to the upper side or the lower side along the partition wall 4 to a position where it will not interfere with the wafer ... conveyance. In the buffer space BS, connect the supply of clean gas to the loading container 2 and Exhaust gas supply unit GS and exhaust unit £ 3. Specifically, as shown in Figs. 5 and 8A, 6; on the side edge portion of the port 41 of the partition wall 4, a gas supply, ... is installed. The two porous diaphragms 45 of GS, from the filter and the diaphragm 45 to the buffer space, supply inactive gases, such as nitrogen, which are clean gases. In addition, at the lower end of port 41, a small deviation can be formed for exhaustion. Ground, and viewed from the front as the long exhaust port 46, and connect it to the exhaust section ES. As described later, the gas supply section GS and the exhaust section £ 8 are controlled by the control section, and the gate 43 is locked and moved under the state of the cover 21 of the loading container 2, which can reduce the The space Bs 81654 -12- 200402822 and the loading container 2 are replaced with clean gas. On the side of the I / O area 81 of the flash partition wall 4, press the two above the loading containers 2 on the second mounting tables 61 and 62, respectively. The pressing mechanism 7 is arranged side by side. Fig. 7 is an overall view of the pressing mechanism 7 of the vertical heat treatment device shown in Fig. 1. The pressing mechanism 7 includes a horizontally extending support along the partition wall 4 as an axis to support it. The rotating shaft 71 and the pressing member 72 whose base end is fixed to the rotating shaft 71. The pressing member 72 is formed by an inverted Y-shaped flat plate 73, and its two leg portions 73a and 73b are fixed to the rotating shaft 71. The head 74 of the flat plate 73 forms a circular protrusion 75 on the side facing the lower side in the horizontal posture. The protrusion 75 is the same as that provided on the loading container 2 when the pressing member 72 falls forward and becomes substantially horizontal. The circular recessed portions 23 of the flange portion 22 are arranged to be snap-fitted. The pressing member 7 includes air cylinders 81a and 81b as driving sources. The air cylinders 81a and 8 lb are above and on both sides of the pressing member 72 so that the pistons The rods 80a and 80b can be mounted vertically on the partition wall 4. Below the piston rods 80a and 80b Shaft support members 82a, 82b are respectively mounted on the sides. The shaft support members 82a, 82b serve as shafts, respectively, supporting one end of the action arms 83a, 83b. The other ends of the action arms 83a, 83b are rotatably mounted on the pressing members. Both sides of 72. Therefore, when the pressing member 72 pulls up the piston rods 80a and 80b by the cylinders 81a and 81b, as shown by a dotted line, the pressing member 72 stands up along the partition wall 4 (upper position). When the pressing members 72 extend toward the lower sides of the piston rods 80a and 80b, as shown by a solid line, the pressing member 72 is in a posture of falling substantially horizontally (lower position). At this lower position, the protruding portion 75 is inserted into the recessed portion 23 of the loading container 2, and the loading container 2 is pressed against the mounting table 61 (62). 81654 -13-200402822 Gate 43, loading and unloading device 44, second mounting table 61 (62), pressing member 72, gas-phase oblique center GS, and exhaust shaft, etc., are stored in the control unit 8 (refer to the figure) 5). In summary, the control unit 8 measures the second placing table 61 (62) so that the second placing table 61 (62) is placed on the second placing table to place the placing container 2 'around the port 41 of the partition wall 4 on the second placing table. Next, the air cylinders 81a and 81b of the pressing mechanism 7 are driven, and the holding container 2 is pressed against the second mounting table 61 (62) by the pressing member 72. Next, the loading and unloading device is driven, and the lid 21 is removed by the loading container 2. Next, when the compartment door 43 is closed, the gas supply part GS and the exhaust part ES are driven, and the buffer compartment and the inside of the loading container 2 are replaced with clean gas ·. Next, the gate 43 and the cover 21 are retracted from the port 41. As a result, the wafer w with the loading capacity 2 can be carried to the loading area S2. Referring back to FIGS. 2 and 3, the inside of the loading area S2 will be described. In the loading area, a vertical-type heat treatment furnace 91 having a furnace opening that can be opened and closed by a cover 94 is provided at the lower end. On the lower side of the vertical heat treatment furnace 91, a plurality of wafers w are held in a shed shape as a wafer port 92 as a holder, and are placed on the cover%. In addition, a heat-shielding portion 93 is provided between the wafer port 92 on the cover body 94 and the cover body 94. The carcass 94 is supported on the lifting mechanism 95, and the wafer port 92 is loaded and unloaded into the heat treatment furnace 91 by the lifting mechanism 95. Between the wafer port 92 and the port 41 of the partition wall 4, a wafer handling device% is provided. The wafer transfer device 96 transfers the wafer W between the wafer port 92 and the loading container 2 on the second mounting tables 61 and 62. The wafer conveying device 96 includes a moving body%, which is rotated around a staggered axis while moving along a guide mechanism 97 extending to the left and right. The moving body 98 is provided with a plurality of, for example, five arms 99 that can move forward and backward freely. < 81654 -14- 200402822 The operation of the above embodiment will be described next. The operations described below are performed in accordance with a program stored in the control unit 8 (see FIG. 5). Firstly, the loading Gusen 2 is lowered through the internal space of the panel 54 by an automatic handling robot (not shown) that moves along the A part of the clean room, and is placed on the first stage 51 (52). Secondly, The loading container 2 is transferred to the second mounting table 61 (62) by the container transfer device 65. In addition, the loading container 2 may be temporarily stored in the storage unit 64 by the container transfer device =, and then transferred to the second mounting table 61 ( 62). When the loading container 2 is placed on the second mounting table 61 (62), first, as shown in FIG. 6, the fastening member 60 is rotated and engaged with the fastening recess 24 at the bottom of the loading container 2. Next, the second mounting table 61 (62) is moved to the partition wall 4 side, and the edge portion of the mouth portion 20 of the loading container 2 is brought into air-tight contact with the sealing member 42 around the port 41 of the partition wall 4. Press the cylinders 8ia and 81b of the mechanism 7 so that the piston rods 80a and 80b protrude from the lower side, and the actuating arms 83a and 83b press the lower side while being controlled by the regulation hairs by the pressing member 72. Thus, Pressing the member 72 causes the rotation of the rotating shaft 7 to a horizontal state. As a result, as shown in FIG. 8A, the protrusion of the pressing member 72 is pressed. The portion 75 is inserted into the recessed portion 23 of the flange portion 22 of the loading container 2 and presses the loading container 2 against the second mounting table 61 (62). Next, the card (not shown) of the loading and unloading device 44 is inserted into the cover of the loading container 2 The key hole 21a of the body 21 (refer to FIG. 4) is rotated by 90 °, so that the cover 21 is removed from the loading container 2 (the state of FIGS. 8a and B). Next, the porous diaphragm 45 is used to clean, for example, nitrogen. The gas is blown out horizontally into the load valleyr 2 at a flow rate of 50 to 200 Ι / min. The nitrogen gas flows along the wafer w and the inner wall of the load container 2 and returns to the mouth 20 side and from the lower side of 81654- 15- 200402822 Exhaust port 46 exhausts. This replaces the inside of the loading container 2 with nitrogen and the loading container causes nitrogen to be introduced into the buffer space bS between 2 and the gate 43 at a large flow rate. At this time, the loading capacity 2 is loaded. The internal pressure in the container 2 will increase, and an impact will be applied to the «container 2 when the gas is introduced. However, the loading container 2 is pressed from above by the pressing member 72, so there will be no positional shift. Therefore, the loading container is made The airtightness of the mouth portion 20 and the sealing member 42 of 2 will not be disturbed.
其次，問門43、裝卸裝置44、及蓋_，例如上升並由 蟑41退避’可使裝載容器2内與裝載區域§2成為連通之狀態 。其次藉由晶圓搬運裝置96,冑裝載容器2内之晶_依序 取出，並移載至晶圓埠92。裝载容器2内之晶圓臂空時， 以與上述相反之動作使裝载容器2之蓋體21關閉。 壓按機構7解除按壓之時點，亦即本實施形態中，壓按機 構^回復為站起狀態之時點，係例如裝載容器2之口部Μ藉 由蓋體21關閉之後，其次1 2載置台61(62)後退並使裝載 容器2由肖隔壁4離開。接下來，裝載容器2藉由容器搬運裝 置65搬運至保管部64暫時保管。Next, asking the door 43, the loading and unloading device 44, and the cover _, for example, to raise and retreat from the cock 41 'can make the inside of the loading container 2 and the loading area § 2 communicate with each other. Next, the wafers in the loading container 2 are sequentially taken out by the wafer handling device 96, and transferred to the wafer port 92. When the wafer arm in the loading container 2 is empty, the lid 21 of the loading container 2 is closed by the operation opposite to the above. The time when the pressing mechanism 7 releases the pressing, that is, the time when the pressing mechanism ^ returns to the stand-up state in this embodiment, for example, after the mouth portion M of the loading container 2 is closed by the cover 21, the next stage is 12 61 (62) retreats and leaves the loading container 2 from the Xiao partition wall 4. Next, the loading container 2 is transported to the storage unit 64 by the container transporting device 65 for temporary storage.
另一方面，於晶圓埠92搭載特定枚數之晶圓~時，晶圓 車92載入至熱處理爐91内。其次於熱處理爐9 !内，對於晶 料92上之晶(DW進行例如⑽、退火處理、及氧化處: 寺熱處理。熱處理終了 Η寺，以與上述相反之動作，使晶圓 W回到裝載容器2内。 、依據上述之實施形態，藉由壓按構件72，將載置於第2 载置台61(62)並與間隔壁4抵接之裝載容器2由上方按壓。因 此，將裝載容器2内之環境以乾淨氣體置換時，即使因增大 81654 -16- 200402822 乾淨氣體流量之氣體吹出，對於裝載容器2之衝擊增大，裝 載容E2將不震動地以該姿勢安定。此外，即裝載容器2之 蓋體21開關時之衝擊增大，藉由使裝載容器2由上方按壓， 可使裝載容器2之姿勢安定。 因此，不破壞裝載容器2與間隔壁4之氣密狀態，故可防 止由大氣侧之I/O區域S1側流入至裝載區域82側。此外，因 不產生晶圓W之位置偏移或突出，故之後的藉由晶圓搬運 裝置96而進行之晶gjw之取出操作亦無妨害。此外，因可 增大供給至裝載容器2内之乾淨氣體流量，故可縮短以乾淨 氣體置換所需要之時間，可提升產能。 壓按機構7之壓按構件72，係於沿間隔壁站起之狀態（上 側位置）與成為橫倒之狀態（下侧位置）間旋動。因此，於解 除裝載容器2之按壓時，壓按構件72將不妨礙裝載容器2之 搬運。此外，可使壓按機構7全體設為簡單之構造。 上述之實施形態中，僅舉出將裝載容器2由上方按壓之壓 按機構之-例。亦可將其取代，壓按機構設為裝載容器粕 檢万向按壓者。H9A、B係表示壓按機構其他例之說明圖。 圖9A所圖示之壓按機構包含壓按構件92,其係將載置於 第2載置台6购之裝載容器2,由背面侧對於間隔壁4按壓 並固足者。壓按構件92 ’例如可於前後移動，且例如可下 降至較第2載置台61(62)之載置面更為下側為止。 圖9B所圖示之壓按機構包含—對壓按構㈣、.並係 :載置於第2載置台華)之裝載容器2，由兩側央住並固定 者。孩情形下’藉由壓按機構使得裝載容器靖於第2載置 81654 17 200402822 台61(62)111定之時點’即使於裝载容器2與間隔壁抵接之前 亦可。 此外，本發明並非限定於上述之實施形態，於不跳脫本 發明要旨之範圍内，可進行各種之設計變更等。例如裝載 區域S2之環境，並不限於非活性錢，乾淨乾燥空氣亦可 。該情形下，裝載容器2與間隔壁3抵接後， 氣供給至裝載容器2内，並置換裝載容器2内=;;: 此外，本發明對於搬運裝載容器區域與〇區域設置於個 別場所之裝置，亦可適用。此外，本發明並非限定於縱型 熱處理裝置，亦可適用於例如枚葉式熱處理裝置、進行阻 柷劑之塗布及顯像之裝置、離子佈植裝置等其他型式之半 導體處理裝置。 【圖式簡單說明】 圖1係表不關於本發明實施形態之縱型熱處理裝置概觀 之全體圖。 圖2係概略表示圖1所圖示之縱型熱處理裝置内部之縱剖 側面圖。 圖3係概略表示圖1所圖示之縱型熱處理裝置内部之橫剖 平面圖。 圖4係表不密閉型裝載容器一例之全體圖。 圖5係表示圖1所圖示之縱型熱處理裝置中，間隔壁之埠 及其周邊之縱剖面圖。 圖6係表示圖1所圖示之縱型熱處理裝置中，裝載容器底 部與設置於載置台之扣合構件之扣合模樣剖面圖。 81654 -18 - 200402822 圖7係表7F圖1所圖示之縱型熱處理裝置之壓按機構全體 圖。 圖8A、B係表示圖1所圖示之縱型熱處理裝置中，裝載容 态設置於間隔壁之埠上狀態之縱剖側面圖及橫剖平面圖。 圖9Α、Β係表示壓按機構其他例之說明圖。 —圖1 0係表不過去縱型^處理裝置中，$冑容器設置於間 隔壁之埠上之狀態之縱剖側面圖。 【圖式代表符號說明】 S1 外部側區域 S2 内部側區域 W 被處理基板 BS 緩衝空間 GS 氣體供給部 ES 排氣部 2 裝載容器 4 間隔壁 5 第1區域 6 第2區域 7 壓按機構 8 控制部 11，41 埠 12, 43 閘門 13, 51，52， 61，62 載置台On the other hand, when a specific number of wafers are mounted on the wafer port 92, the wafer cart 92 is loaded into the heat treatment furnace 91. Next, in the heat treatment furnace 9, the crystals (DW) on the crystal material 92 are subjected to, for example, sintering, annealing, and oxidation. The heat treatment ends the temples, and the wafer W is loaded back in the opposite operation to that described above. In the container 2. According to the above-mentioned embodiment, by pressing the member 72, the loading container 2 placed on the second mounting table 61 (62) and abutting the partition wall 4 is pressed from above. Therefore, the loading container is pressed. When the environment inside 2 is replaced by clean gas, even if the gas blown out by increasing the clean gas flow rate of 81654 -16- 200402822, the impact on the loading container 2 is increased, and the loading capacity E2 will be stable in this posture without vibration. In addition, that is, The impact when the lid 21 of the loading container 2 is opened is increased, and the posture of the loading container 2 can be stabilized by pressing the loading container 2 from above. Therefore, the airtight state of the loading container 2 and the partition wall 4 is not destroyed, so It is possible to prevent the flow from the I / O area S1 side of the atmospheric side to the loading area 82 side. In addition, since the position or protrusion of the wafer W does not occur, the crystal gjw by the wafer transfer device 96 afterwards The removal operation is also not harmful. This Since the flow rate of clean gas supplied into the loading container 2 can be increased, the time required for replacement with clean gas can be shortened, and the productivity can be improved. The pressing member 72 of the pressing mechanism 7 is arranged to stand along the partition wall. Rotate between the state (upper position) and the state of falling down (lower position). Therefore, when the load container 2 is released from pressing, the pressing member 72 will not hinder the conveyance of the load container 2. In addition, it can be pressed The entire mechanism 7 has a simple structure. In the above-mentioned embodiment, only an example of a pressing mechanism for pressing the loading container 2 from above is provided. Alternatively, the pressing mechanism may be set as a loading container meal inspection universal. Pressers. H9A and B are explanatory diagrams showing other examples of the pressing mechanism. The pressing mechanism shown in FIG. 9A includes a pressing member 92, which is a loading container 2 that is placed on the second mounting table 6 and is provided by The back side presses and holds the partition wall 4. The pressing member 92 'can be moved forward and backward, for example, and can be lowered to a lower side than the mounting surface of the second mounting table 61 (62), for example. The pressing mechanism shown in the figure contains- : The loading container 2 placed on the second placing Taihua) is held by two sides and fixed. In some cases, ‘the loading container is set to the second placement 81654 17 200402822 stage 61 (62) 111 by the pressing mechanism’ even before the loading container 2 comes into contact with the partition wall. In addition, the present invention is not limited to the above-mentioned embodiments, and various design changes and the like can be made without departing from the gist of the present invention. For example, the environment of the loading area S2 is not limited to inactive money, and clean and dry air is also acceptable. In this case, after the loading container 2 comes into contact with the partition wall 3, the gas is supplied into the loading container 2 and replaces the inside of the loading container 2; In addition, the present invention sets the loading container area and the zone 0 in separate places. Device is also applicable. In addition, the present invention is not limited to a vertical type heat treatment device, but can also be applied to other types of semiconductor treatment devices such as a leaf-type heat treatment device, a device for applying and developing an anti-foam agent, and an ion implantation device. [Brief Description of the Drawings] FIG. 1 is an overall view showing an overview of a vertical heat treatment apparatus according to an embodiment of the present invention. Fig. 2 is a longitudinal sectional side view schematically showing the interior of the longitudinal heat treatment apparatus shown in Fig. 1. Fig. 3 is a cross-sectional plan view schematically showing the interior of the vertical heat treatment apparatus shown in Fig. 1. FIG. 4 is an overall view showing an example of a sealed container of a closed type. Fig. 5 is a longitudinal cross-sectional view of a partition wall and its surroundings in the longitudinal heat treatment apparatus shown in Fig. 1. Fig. 6 is a sectional view showing a fastening pattern of a bottom portion of a loading container and a fastening member provided on a placing table in the longitudinal heat treatment apparatus shown in Fig. 1; 81654 -18-200402822 Fig. 7 is an overall view of the pressing mechanism of the vertical heat treatment device shown in Table 7F and Fig. 1. 8A and 8B are a longitudinal cross-sectional side view and a cross-sectional plan view showing a state in which a loading capacity is disposed on a port of a partition wall in the longitudinal heat treatment apparatus illustrated in FIG. 1. 9A and 9B are explanatory diagrams showing other examples of the pressing mechanism. —Figure 10 is a longitudinal sectional side view showing a state where the $ 胄 container is set on the port next door in the vertical type ^ processing device. [Illustration of representative symbols] S1 Outside area S2 Inside area W To-be-processed substrate BS Buffer space GS Gas supply section ES Exhaust section 2 Loading container 4 Partition wall 5 First region 6 Second region 7 Pressing mechanism 8 Control Part 11, 41 Port 12, 43 Gate 13, 51, 52, 61, 62 Mounting table
81654 -19- 200402822 14, 44 裝卸裝置 20 口部 21，94 蓋體 21a 鍵孔 22 凸緣部 23 凹部 24 扣合凹部 42 密封構件 45 濾片 46 排氣口 53, 63 位置決定構件 54 面板部 60 扣合構件 63a 驅動部 64 保管部 65 容器搬運裝置 66 導引部 67 移動部 68 多關節臂 71 旋轉軸 72 壓按構件 73 平板 73a，73b 腳部 74 頭部 -20- 81654 200402822 75 突起部 80a，80b 氣缸 81a，81b 活塞桿 82a，82b 軸支構件 83a，83b 動作臂 91 熱處理爐 92 晶圓蜂 93 隔熱部 95 升降機構 96 晶圓搬運裝置 97 導引機構 98 移動體 99 臂 -21 8165481654 -19- 200402822 14, 44 Loading and unloading device 20 Mouth 21, 94 Cover 21a Key hole 22 Flange 23 Recess 24 Recessed recess 42 Seal member 45 Filter 46 Exhaust port 53, 63 Position determining member 54 Panel section 60 Fastening member 63a Drive section 64 Storage section 65 Container handling device 66 Guide section 67 Moving section 68 Multi-joint arm 71 Rotary shaft 72 Pressing member 73 Flat plate 73a, 73b Foot 74 Head-20- 81654 200402822 75 Protruding portion 80a, 80b Cylinder 81a, 81b Piston rod 82a, 82b Shaft support member 83a, 83b Action arm 91 Heat treatment furnace 92 Wafer bee 93 Insulation part 95 Lifting mechanism 96 Wafer handling device 97 Guiding mechanism 98 Moving body 99 Arm-21 81654
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| JP2002111114 | 2002-04-12 |
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| TWI270955B TWI270955B (en) | 2007-01-11 |
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| TW092108580A TWI270955B (en) | 2002-04-12 | 2003-04-11 | Port structure of semiconductor processing apparatus |
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| KR (1) | KR100922051B1 (en) |
| CN (2) | CN1307706C (en) |
| TW (1) | TWI270955B (en) |
| WO (1) | WO2003088351A1 (en) |
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| JP4778546B2 (en) * | 2007-11-30 | 2011-09-21 | 東京エレクトロン株式会社 | Earthquake damage diffusion reduction method and earthquake damage diffusion reduction system in semiconductor manufacturing equipment |
| JP5134495B2 (en) | 2008-10-16 | 2013-01-30 | 東京エレクトロン株式会社 | Processing apparatus and processing method |
| KR101258350B1 (en) * | 2010-06-07 | 2013-04-30 | 도쿄엘렉트론가부시키가이샤 | Substrate processing apparatus |
| KR101283312B1 (en) * | 2011-12-29 | 2013-07-09 | 로체 시스템즈(주) | Auto loading system for front opening shipping box |
| JP6204226B2 (en) * | 2014-02-24 | 2017-09-27 | 東京エレクトロン株式会社 | Substrate processing apparatus and substrate processing method |
| JP7422577B2 (en) * | 2020-03-23 | 2024-01-26 | 平田機工株式会社 | Load port and control method |
| KR102372513B1 (en) * | 2021-05-10 | 2022-03-10 | 주식회사 위존 | FIMS system |
| KR102372514B1 (en) * | 2021-05-10 | 2022-03-10 | 주식회사 위존 | Foup fixing device for fims system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH0821610B2 (en) * | 1990-11-20 | 1996-03-04 | 株式会社荏原製作所 | Method and device for storing and taking out contents of carrier box |
| JP3500455B2 (en) * | 1993-12-10 | 2004-02-23 | 東京エレクトロン株式会社 | Processing equipment |
| JP2850279B2 (en) * | 1994-02-22 | 1999-01-27 | ティーディーケイ株式会社 | Clean transfer method and device |
| US6447232B1 (en) * | 1994-04-28 | 2002-09-10 | Semitool, Inc. | Semiconductor wafer processing apparatus having improved wafer input/output handling system |
| JPH0846005A (en) * | 1994-07-26 | 1996-02-16 | Takenaka Komuten Co Ltd | Wafer transfer apparatus |
| JP3656701B2 (en) * | 1998-03-23 | 2005-06-08 | 東京エレクトロン株式会社 | Processing equipment |
| US6501070B1 (en) * | 1998-07-13 | 2002-12-31 | Newport Corporation | Pod load interface equipment adapted for implementation in a fims system |
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2003
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- 2003-03-28 KR KR1020047010060A patent/KR100922051B1/en active IP Right Grant
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| KR100922051B1 (en) | 2009-10-19 |
| CN1639857A (en) | 2005-07-13 |
| CN1307706C (en) | 2007-03-28 |
| CN2795158Y (en) | 2006-07-12 |
| TWI270955B (en) | 2007-01-11 |
| WO2003088351A1 (en) | 2003-10-23 |
| KR20040099260A (en) | 2004-11-26 |
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