JP2002246456A - Substrate transfer container, substrate transfer apparatus, and substrate transfer method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate transfer container, a substrate transfer apparatus and method which can transfer a substrate to a substrate processing apparatus without exposing the substrate to the open air. SOLUTION: A substrate transfer container 1 includes a container body 2 of a box shape opened in its one surface side and a lid member 3 to be evacuated and attracted to the main body, so as to close an opening 21 of the body 2. An opening edge of the body 2 is made into a form of a flange 22 which expands outwardly along its full periphery. When the surface of the flange 22 sucking the lid member 3 forms a flange surface 22a, the flange surface 22a is provided with an O-ring 24, which is provided along the full periphery of the lid member 3 in contacted with the lid member 3 and to be tightly contacted with the peripheral edge of the opening of a substrate transfer apparatus.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer container, a substrate transfer apparatus and a substrate transfer method, and more particularly, to a substrate transfer container for an electronic substrate, such as a semiconductor wafer or a liquid crystal substrate, requiring high cleanliness. Further, the present invention relates to a substrate transfer device and a substrate transfer method used for transferring an electronic substrate between the substrate transport container and the substrate processing device.

[0002]

2. Description of the Related Art Electronic devices using electronic substrates (hereinafter, referred to as substrates) such as semiconductor wafers, liquid crystal substrates, and magnetic disks are manufactured in a clean room free of dust. On the other hand, when transferring a substrate between the respective substrate processing apparatuses, the transfer is performed in a state where the substrate held in the cassette is stored in a portable and sealable local cleaning container (that is, a substrate transport container). This makes it possible to transport the substrate inside and outside the clean room without exposing the substrate to dust in the atmosphere. Such a substrate transport container includes a SMIF (Standard Mechanical Interface) pod having a bottom opening for a wafer having a diameter of 200 mm, and a FO having a side opening having a side opening for a wafer having a diameter of 300 mm.
It is marketed under the trade name UP (Front Opening Unified Pod).

FIG. 7 shows the configuration of a side-opening type substrate transport container. The substrate transport container 100 shown in FIG.
Includes a container body 101 and a lid 102.
The container body 101 has an opening 10 in a part of its side wall.
1a is formed, and a plurality of pairs of supports 101b for supporting the substrate W are provided at opposing positions on the inner side wall, and the plurality of substrates W are configured to be able to be stored in a multi-stage manner at predetermined intervals. I have. The lid 102 has a size to close the opening 101a of the container main body 101, and is fixed in a state of mechanically closing the opening 101a of the container main body 101 by a fixing chuck (not shown).
Further, as disclosed in Japanese Patent Application Laid-Open No. H11-150178, the container main body 101 and the lid 102 are sealed by vacuum suction between a flange surface of the container main body 101 having an opened opening edge and a peripheral surface of the lid 102. Some configurations are stopped.

A substrate transfer apparatus used for transferring a substrate between the substrate transport container 100 and the substrate processing apparatus is disclosed in Japanese Patent Laid-Open Nos. 10-321695 and 10-3.
21696. FIG. 8 is a diagram showing a configuration diagram of such a substrate transfer apparatus, and FIG. 9 is a top view thereof. The substrate transfer apparatus 2 shown in these figures is a load lock chamber 2 connected to a vacuum processing chamber 300 of the substrate processing apparatus.
01, a transfer arm 202 provided in the load lock chamber 201, a loader chamber 2 connected to the load lock chamber 201
03, a transfer chamber 204 connected to the loader chamber 203, a transfer arm 205 and a container opening / closing arm 206 provided in the transfer chamber 204 (shown only in FIG. 8). The atmosphere in the load lock chamber 201 is always kept at a reduced pressure in accordance with the inside of the vacuum processing chamber 300, and the atmosphere in the loader chamber 203 is switched between a reduced pressure atmosphere and a normal pressure atmosphere. Further, the atmosphere in the transfer chamber 204 is maintained at a normal pressure atmosphere.

When the substrate W is to be transferred between the vacuum processing chamber 300 and the substrate transport container 100, the substrate transport container 100 is first connected to the opening of the transfer chamber 204, and the substrate W Lid 10 of transport container 100
The fixed chuck 2 is operated by the opening / closing arm 206 to open the lid 102, and then the substrate transfer container 100
One substrate W is unloaded from the inside and loaded into the loader chamber 203. Then, the substrate W in the loader chamber 203 is carried into the vacuum processing chamber 300 by the operation of the transfer arm 202 in the load lock chamber 201.

[0006]

In recent years, in the production of high value-added, highly integrated devices, molecular adsorption contamination on the substrate surface adversely affects device and process characteristics. Therefore, when a substrate such as a semiconductor wafer that requires particularly high cleanliness is transported, the substrate W
The interior of the substrate transport container 1 in which is stored argon (A
r) or an inert gas such as nitrogen gas (N ₂ ) (hereinafter referred to as an inert gas) to adsorb and contaminate molecules of organic substances, boron, phosphorus, etc. on the substrate, and naturally oxidize the surface of the substrate W Prevents film formation.

However, in the substrate transfer apparatus and the substrate transfer method using the same, the load lock chamber 201 connected to the vacuum processing chamber is always kept at a reduced pressure. The transfer chamber 204 is maintained at normal pressure. For this reason, even if the substrate W is kept in an inert gas atmosphere or a vacuum atmosphere in the substrate transport container 100, the substrate W is exposed to the air when passing through the transfer chamber 204, and organic substances and moisture adhere to the substrate W. As a result, a natural oxide film grows.

In order to prevent this, it is necessary to maintain the inside of the transfer chamber 204 under reduced pressure or an inert gas atmosphere. However, the transfer chamber 204 contains a container opening / closing arm and a transfer arm inside. Therefore, it is not easy to replace the internal atmosphere with a large volume.

In order to transfer a substrate W between the substrate transport container 100 and the vacuum processing chamber 300, it is necessary to sequentially pass the load lock chamber 201, the loader chamber 203, and the transfer chamber 204. The transfer of the substrate W is troublesome. In particular, in the loader chamber 203, every time one substrate W is transferred, it is necessary to switch from normal pressure to reduced pressure or vice versa.
This is a factor that lowers AT.

Accordingly, the present invention provides a substrate transfer container, a substrate transfer apparatus, and a device for enabling transfer of a substrate efficiently between a substrate transfer container and a vacuum processing chamber while preventing contamination. An object of the present invention is to provide a method of transferring a substrate using the method.

[0011]

According to a first aspect of the present invention, there is provided a substrate transport container comprising: a container body having a box shape having an opening on one side; and a container body having the opening closed. And a cover which is adsorbed under reduced pressure, especially when the cover is adsorbed and decompressed to the container main body at the opening edge of the container main body, and the substrate is transferred over the entire outer periphery of the lid. The apparatus is characterized in that a flange surface portion is provided which is in close contact with the peripheral edge of the opening of the device.

According to such a substrate transport container, since the entire periphery of the flange surface portion of the container body in which the lid is decompressed and adsorbed is brought into close contact with the peripheral edge of the opening of the substrate transfer device, the container body is mounted on the substrate body. It functions as a cover for closing the transfer device inside confidentially. Therefore, by detaching the lid of the container main body inside the substrate transfer apparatus in a state where the opening of the substrate transfer apparatus is secretly closed by the container main body, the inside of the substrate transfer apparatus and the inside of the container main body are separated. It can communicate with the outside in a confidentially closed state.

Further, the substrate transfer apparatus of the present invention is a substrate transfer apparatus used for transferring a substrate between the substrate transport container having such a configuration and the processing chamber of the substrate processing apparatus. The substrate transfer apparatus includes a load lock chamber having an opening connected to the opening of the processing chamber and having an inside maintained in a reduced pressure state. An opening to be connected is provided. The opening has an opening shape into which the lid of the substrate transport container is fitted, and in a state where the lid is fitted, the opening edge of the container body in the substrate transport container extends over the entire circumference of the load lock chamber. It is closely attached to the outer peripheral wall. In addition, a door that hermetically closes the opening in a state where the substrate transport container is connected to the opening of the load lock chamber, and between the door and the substrate transport container connected to the opening of the load lock chamber. An exhaust pump for reducing pressure is provided. Also, on the door,
An opening / closing mechanism that supports the lid of the substrate transport container body and that freely attaches and detaches the door and the lid from the opening of the load lock chamber to the inside of the load lock chamber is provided. Further, a transfer arm for transferring a substrate between the substrate transfer container connected to the opening of the load lock chamber and the processing chamber of the substrate processing apparatus is provided in the load lock chamber.

The substrate transfer method of the present invention using the transfer apparatus having such a configuration is performed in the following procedure. First, the opening of the load lock chamber connected to the processing chamber is air-tightly closed by a door, and the inside is depressurized. Next, the opening of the substrate transport container and the opening of the load lock chamber are connected to each other in a state where the lid that has been decompressed and adsorbed to the container body of the substrate transport container is fitted into the opening of the load lock chamber. In this state, by decompressing the space between the door of the load lock chamber and the substrate transport container, the peripheral edge of the opening edge of the container body is depressurized and adsorbed to the outer peripheral wall of the opening of the load lock chamber, and Is released from the pressure-reducing state of the lid. Thereafter, the closed state of the load lock chamber by the door is released, and the lid is housed in the load lock chamber together with the door to allow the container body and the load lock chamber to communicate with each other. Then, the substrate is transferred between the inside of the container body and the processing chamber connected to the load lock chamber.

In such a transfer apparatus and a transfer method using the same, the opening edge of the container body is brought into close contact with the outer peripheral wall of the opening of the load lock chamber by decompression suction, so that the load lock chamber is closed by the container body. Closed confidentially. Further, since the pressure-reduced suction state of the lid with respect to the container body is thereby released, the door is housed together with the lid in the load lock chamber, so that the load lock chamber in the depressurized state can be kept secret from the outside. The container body is communicated. Therefore, when the substrate is transferred between the container main body and the processing chamber while keeping a state of being secretly closed to the external atmosphere and the inside of the container main body is depressurized, the substrate is depressurized. The transfer will be carried out while keeping the.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments of the present invention will be described below in the order of a substrate transfer container, a substrate transfer device for the substrate transfer container, and a substrate transfer method using the same.

<Substrate Transport Container> FIG. 1 is a schematic configuration diagram showing an example of the substrate transport container of the present invention, and FIG. 2 is a schematic sectional view of the substrate transport container and a transfer device for the substrate transport container. .

The substrate transport container 1 shown in these figures is
This is a vacuum-sealed substrate transport container, which includes a container body 2 for storing a plurality of substrates (for example, semiconductor wafers) W, and a lid 3 for closing an opening 21 of the container body 2.

The container body 2 is for storing a plurality of substrates W, and has an opening 21 for taking in and out the substrates W on a side surface. The periphery of the opening 21 is formed as a flange 22 whose entire periphery is widened outward. When the opening 21 is covered with the lid 3 from the outside and the surface on which the peripheral edge of the lid 3 is brought into contact is the flange surface 22 a, the flange surface 22 a is parallel to the surface defined by the opening 21. A flat surface. On the flange surface 22a, double O-rings 23 and 24 are laid over the entire periphery of the opening 21 so as to be fitted in O-ring grooves (not shown). Here, the O-ring 23 laid inside is brought into close contact with the peripheral edge of the lid 3 when the opening 21 is closed by the lid 3. The outer O-ring 24 is in close contact with the outer peripheral wall of the opening 51 of the load lock chamber 5 in the substrate transfer device 4 described below.

Further, a plurality of pairs of supports 25 for supporting the substrates W are provided on the inner side wall of the container main body 2 at opposing positions thereof, and the plurality of substrates W are arranged in a multi-stage manner at predetermined intervals. It is configured to be stowable.

On the other hand, the lid 3 has its peripheral portion abutting against the flange surface 22a of the container body 2 so that the container body 2
The container 21 is depressurized and adsorbed while closing the opening 21 of the container. In a state where the opening 21 of the container body 2 is closed by the lid 3, the peripheral portion of the lid 3 is in close contact with the inner O-ring 23 laid on the flange surface 22 a of the container body 2.

The pressure-reducing suction of the lid 3 with respect to the container body 2 is performed, for example, by reducing the pressure inside the container body 2. In this case, the reduced pressure inside the container body 2 is such that a natural oxide film is not formed on the substrate W accommodated therein, and that the lid 3 is reliably sucked under reduced pressure. And

The O-ring 23 laid on the flange surface 22a is for keeping the lid 3 in close contact with the container body 2 and for hermetically closing the inside of the container body 2. It may be provided at a position where the peripheral edge of the lid 3 contacts the flange surface 22 a of the container body 2. Also,
The reduced pressure suction of the lid 3 with respect to the container body 2 may be based on the reduced pressure in the suction groove formed over the entire periphery of the lid 3. In this case, the inside of the container body 2 can be maintained in an inert atmosphere such as a nitrogen gas or an argon gas, and the substrate W can be stored in the inside.

Further, a distal end of a holding mechanism of the substrate transfer device 4 described below is inserted into the outer surface 31 of the cover 3 (the surface opposite to the surface abutting on the container body 2). A plurality of recesses 32 for holding the lid 3 are provided.

Here, the container body 2 and the lid 3 can secure mechanical pressure resistance against the pressure difference between the inside and the outside, and can be configured without being deformed by the weight and own weight of the substrate W housed inside. It has been done. For this reason, while being made of a material having a sufficient thickness, for example, as shown in FIG. 1, a U-shaped side plate is curved between a top plate and a bottom plate which are arranged with the opening 21 interposed therebetween. As in the configuration provided, it is preferable that the wall surface is formed of a curved surface. In addition, as shown in FIG. 3, the shape of the wall surface is a curved surface, and the shape of the container body 2 is a columnar shape having a flat side plate disposed opposite to the lid 3 as a bottom surface. Is also good.
By configuring the container body 2 using a large number of curved surfaces in this manner, the thickness of the material can be reduced, the weight of the material can be reduced, and deformation due to this can be suppressed.

Further, the container body 2 and the lid 3 are required to secure pressure resistance against the above-described pressure difference between the inside and outside, and to prevent deformation of the substrate W housed therein due to its weight and its own weight. Tensile strength 100N / mm ² -200N /
mm ² and a material having a flexural modulus of elasticity of 1 kN / mm ² or more. Such materials include glass fiber reinforced plastic materials (Glass Fiber Reinforced Plast
ic) or carbon fiber reinforced plastic (Carbon Fiber
Reinforced Plastic), for example, glass fiber unsaturated polyester, epoxy resin, phenol resin, nylon, polyacetal (POM), polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and modified polyphenylene oxide (PPO) There is a material reinforced by adding fibers to resin such as.

It is preferable that the container body 2 and the lid 3 are made of a material having a low water absorption in order to eliminate the influence on the substrate W housed in the decompressed state. Among them, as a material having a water absorption of 0.1% or less, a material obtained by adding fibers to a resin such as unsaturated polyester, PET, PBT, and modified PPO can be used. Container body 2
And the lid 3 is preferably configured.

In the substrate transport container 1 having such a configuration, the entire periphery of the flange surface 22 a of the container body 2 to which the lid 3 is sucked under reduced pressure is in close contact with the outer peripheral wall of the opening 5 of the substrate transfer device 4. Therefore, the container body 2 functions as a lid for closing the inside of the substrate transfer device 4 in a confidential manner. Therefore, the lid 3 of the container main body 2 is detached to the inside of the substrate transfer device 4 in a state where the inside of the substrate transfer device 4 is secretly closed by the container main body 2, so that the inside of the substrate transfer device 4 can be removed. The inside of the container body 2 can be communicated with the outside in a secretly closed state.

By forming the container body 2 and the lid 3 from a material having a tensile strength of 100 N / mm ^{2 to} 200 N / mm ² and a flexural modulus of 1 kN / mm ² or more, the substrate W
Container body 2 to the extent that no natural oxide film is formed on the surface
It is possible to keep the inside in a reduced pressure state. Furthermore, by constituting the container body 2 and the lid 3 with a material having a water absorption of 0.1% or less among these materials, the release of moisture into the container body 2 kept in a reduced pressure state is prevented, It is also possible to prevent the adsorption of moisture on the surface of the substrate W.

<Substrate Transfer Apparatus> Next, the structure of the substrate transfer apparatus 4 for transferring the substrate W between the substrate transport container 1 having the above-described structure and the processing chamber of the substrate processing apparatus will be described. , FIG. 2 and FIG. 4 which is a plan view of FIG.

The substrate transfer apparatus 4 operates the substrate W under reduced pressure.
The apparatus includes a load lock chamber 5, a transfer arm 6, and an exhaust pump 7 (illustrated only in FIG. 2) which are connected to a processing chamber 300 of the substrate processing apparatus. Note that the substrate transfer apparatus 4 may be a multi-chamber in which a plurality of processing chambers 300 communicate with one load lock chamber 5.

The load lock chamber 5 is connected to the processing chamber 300 of the substrate processing apparatus via an open / close valve (not shown), and communicates by opening the open / close valve. Note that the opening of the communication portion has a shape that allows the substrate W to be loaded and unloaded. In addition, since the inside of the load lock chamber 5 is normally kept at the same reduced pressure as the inside of the processing chamber 300,
An exhaust pump 7 is connected.

The load lock chamber 5 is provided with an opening 51 connected to the opening 21 of the container body 2 of the substrate transport container 1 described above. The opening 51 is located on the first wall located on the outer wall of the load lock chamber 5.
The opening 51a and the second opening 51b located inside the opening 51a
A door 53 is disposed between the first opening 51a and the second opening 51b, and is closed under pressure by the second opening 51b to securely close the inside of the load lock chamber 5. In addition, an opening / closing chamber 55 serving as a door pocket for storing the door 53 is provided as a front chamber of the load lock chamber 5.

The first opening 51a has an opening shape in which the lid 3 of the substrate transport container 1 is fitted and the outer O-ring 24 laid on the flange surface 23a of the container body 2.
Of the first opening 51a is formed into a shape that abuts the outer peripheral wall of the first opening 51a.

The close contact of the container body 2 with the load lock chamber 5 of the substrate transfer device 4 is ensured on the flange surface 22a of the container body 2 in the substrate transport container 1, and the inside of the load lock chamber 5 is airtightly closed. An outer O-ring 24 is provided for forming the container main body 2 on the outer peripheral wall of the first opening 51a.
May be laid at a position in contact with the flange surface 22a.

On the other hand, the door 53 is pressed against the second opening 51b from the outside thereof, which also causes the load lock chamber 5 to move.
Is closed. Then, on the outer peripheral edge of the second opening 51b,
An O-ring 56 is laid around the entire circumference, and the second opening 51b is provided.
The inside of the load lock chamber 5 is airtightly closed by the reduced pressure adsorption of the door 53 to the door.

As shown in FIG. 5, on the outer surface of the door 53, the lid 3 is fixed to the door 53 by being fitted into a concave portion 32 formed on the outer wall of the lid 3 of the substrate carrying container body 1. A lid holding mechanism 57 for holding is provided. The lid holding mechanism 57 is connected to the outer surface of the door 53 (the load lock chamber 5).
The cover 3 is fixed to the door 53 by being provided so as to protrude freely from a surface facing the upward slope value side and rotatable at its tip. Hold. The door 53 has a first opening 5.
A drive mechanism (not shown) for freely moving the door 53 holding the lid 3 is provided between a position sandwiched between the first opening 1a and the second opening 51b and a lower portion thereof. The door 53 and the lid 3 are moved by the lid holding mechanism 57 and the driving mechanism.
Opening / closing mechanism is configured.

An exhaust pump 7 is connected to an opening / closing chamber 55 in which a door 53 between the first opening 51a and the second opening 51b is stored. By operating the exhaust pump 7 in a state where the second opening 51b is closed by the door 53, the pressure in the open / close chamber 55 between the substrate transport container 1 connected to the first opening 51a and the door 53 is reduced. You.

The transfer arm 6 is for transferring the substrate W between the substrate transfer container 1 connected to the first opening 51a of the load lock chamber 5 and the processing chamber 300 of the substrate processing apparatus. And is provided in the load lock chamber 5. The transfer arm 6 holds the substrate W because it is necessary to unload the substrates W stored in the container main body 2 in multiple stages from the container main body 2 and store the substrates W in multiple stages in the container main body 2. It has an indexer function that can move the tip of the arm up and down.

<Substrate Transfer Method> Next, an embodiment of a substrate transfer method using the above-configured substrate transfer apparatus will be described with reference to FIG.

Here, it is assumed that the substrate W to be processed next by the substrate processing apparatus is housed in the substrate transport container 1 in a reduced pressure state as shown in FIG. In this state, the lid 3 of the substrate transport container 1 is adsorbed to the container body 2 under reduced pressure. On the other hand, the load lock chamber 5 of the substrate transfer apparatus 4 is connected to the processing chamber 300 of the substrate processing apparatus in a standby state. The load lock chamber 5 is maintained at the same reduced pressure state as the processing chamber 300 by the operation of the exhaust pump 7, and the door 53 contacting the outer peripheral edge of the second opening 51 b is depressurized and adsorbed to the load lock chamber 5. As a result, the inside of the load lock chamber 5 is confidentially closed.

First, as shown in FIG. 6 (2), the lid 3 of the substrate transport container 1 is fitted into the first opening 51a of the load lock chamber 5 so as to be provided on the flange surface 22a of the container body 2. The O-ring 24 is inserted into the first opening 51.
a, and the opening 21 of the container body 2 and the first opening 51 a of the load lock chamber 5 are connected to each other. Further, thereby, the opening / closing chamber 55 between the first opening 51a and the second opening 51b is closed by the substrate transport container 1.

Next, in this state, the tip of the lid holding mechanism 57 provided on the door 53 is connected to the lid 3 of the substrate transport container 1.
And the lid 3 is fixedly held. Next, the exhaust pump 7 is operated, and the inside of the open / close chamber 55,
The pressure between the substrate transport container 1 and the substrate transport container 1 is reduced, whereby the substrate transport container 1 (container main body 2) is adsorbed to the load lock chamber 5 (opening / closing chamber 55) under reduced pressure, and the opening / closing chamber 55 is airtightly closed. Further, by this, the inside and outside of the container body 2 are brought into the same reduced pressure state with the lid 3 interposed therebetween, and the reduced pressure suction state of the cover 3 with respect to the container body 2 is released. Release the reduced pressure adsorption state.

Next, as shown in FIG. 6 (3), the lid 3 is pulled toward the door 53 by the operation of the lid holding mechanism 57.
The lid 3 is detached from the container body 2. Here, when the reduced pressure adsorption of the lid 3 to the container main body 2 is caused by the reduced pressure in the suction groove formed in the lid 3, the lid 3 is detached from the container main body 2 so that the gas in the container main body 2 is removed. (Inert gas such as nitrogen gas) leaks into the opening / closing chamber 55, and this gas is exhausted by the exhaust pump 7.

Thereafter, as shown in FIG.
At the same time, the lid 3 is moved from the position sandwiched between the first opening 51a and the second opening 51b to a lower portion thereof, and the inside of the container body 2 and the inside of the load lock chamber 5 are moved between the first opening 51a and the second opening 51b. To communicate through In this state, the inside of the load lock chamber 5 is closed confidentially by the reduced pressure suction of the container body 2.

Then, the load lock chamber 5 and the processing chamber 300
The opening / closing valve (not shown) is opened, and the transfer arm 6 is operated to transfer the substrate W in the container body 2 into the processing chamber 300. Next, the on-off valve between the load lock chamber 5 and the processing chamber 300 is closed, and the processing of the substrate W is performed in the processing chamber 300. Thereafter, the load lock chamber 5 and the processing chamber 300
The substrate W that has been processed by opening the on-off valve between the substrate W is returned into the container body 2. By repeating this, the plurality of substrates W stored in the container body 2 are sequentially processed in the same procedure.

After the processing of all (or a predetermined number of) substrates W stored in the container body 2 is completed by the above procedure, as shown in FIG. The door 53 holding the fixed 3 is raised between the first opening 51a and the second opening 51b. Then, the second opening 51b is closed by the door 53. Next, as shown in FIG. 6 (2), the lid 3 is pressed against the opening 21 of the container body 2 by the operation of the lid holding mechanism 57, and in this state, gas is leaked into the opening / closing chamber 55, and the opening / closing chamber 55 is opened. The reduced pressure state in 55 is released. As a result, the lid 3 is adsorbed to the container body 2 under reduced pressure, and the inside of the container body 2 is closed confidentially. Further, the door 53 is suctioned to the load lock chamber 5 under reduced pressure, and the inside of the load lock chamber 5 is closed confidentially. Further, the depressurized suction state of the container main body 2 with respect to the substrate transfer device 4 is released.

After the above, as shown in FIG. 6A, the substrate transport container 1 is separated from the load lock chamber 5 and transported to the next processing apparatus.

In the above-described substrate transfer apparatus and the transfer method using the same, the load lock is achieved by bringing the flange surface 22a of the container body 2 into close contact with the outer peripheral wall of the opening 51 of the load lock chamber 5 by vacuum suction. The inside of the chamber 5 is closed confidentially by the container body 2. In addition, since the depressurized suction state of the lid 3 with respect to the container body 2 is thereby released, the door 53 is accommodated in the load lock chamber 5 together with the lid 3 so that the load lock chamber 5 in the depressurized state can be removed. Thus, it is possible to keep the container body 2 in communication with the outside while keeping confidentiality with the outside. Therefore, it is possible to transfer the substrate W between the container main body 2 and the processing chamber 300 while keeping a state of being confidentially closed to the external atmosphere, and the contamination of the substrate W is almost completely reduced. It becomes possible to prevent in a state.

In the conventional substrate transfer apparatus described with reference to FIGS. 8 and 9, the number of rooms up to the processing chamber 300 is three, whereas the substrate processing apparatus according to the embodiment has a load lock chamber 5. And the opening / closing room 55, which is the whole of the two rooms, and it is possible to greatly reduce the labor for transferring the substrate W between these rooms. Moreover, since the container body 2 is adsorbed to the substrate transfer device under reduced pressure, the interface between the container body 2 and the load lock chamber 5 (ie, the interface portion between the container body 2 and the load lock chamber 5 until the processing of all the substrates W in the container body 2 is completed). It is not necessary to release the reduced pressure state of the opening / closing chamber 55). Further, this interface portion is a portion serving as a door pocket of the door 53 and the lid 3 and has an extremely small volume, so that the pressure can be reduced in a short time. As a result, it is possible to improve the throughput of the substrate processing. In addition, only one transfer arm 6 needs to be provided as compared with the conventional one, and the number of rooms is small, and the number of switching of the exhaust at the interface part can be small. It is possible to reduce the cost and the area occupied by the device.

In the above embodiment, the configuration of the side-opening type substrate transport container and the configuration of the corresponding substrate transport apparatus have been described. However, the substrate transport container can also be applied to the bottom-opening type. In this case, the opening 5 of the substrate transfer device
1 is formed in the upper part of the load lock chamber 5.

[0052]

As described above, according to the substrate transfer container, the substrate transfer apparatus and the substrate transfer method using the same according to the present invention, the substrate body is adsorbed to the substrate transfer apparatus under reduced pressure, whereby the substrate is transferred. The inside of the transfer device and the inside of the container body can be confidentially closed to the outside in a closed state.
Therefore, it is possible to transfer the substrate between the container main body and the substrate processing apparatus in a state where the substrate is completely shielded from the outside air, and store the substrate in the container main body. As a result, it is possible to maintain the quality of the substrate and improve the yield.
Further, in particular, in the substrate transfer apparatus of the present invention, the container main body is depressurized and adsorbed to the load lock chamber connected to the processing chamber without passing through the loader chamber or the transfer chamber. This makes it possible to simplify the substrate transfer process between the main body and the processing chamber. As a result, the throughput of the substrate processing can be improved, and the cost of the device and the area occupied by the device can be reduced.

[Brief description of the drawings]

FIG. 1 is a perspective view of a substrate transport container according to an embodiment.

FIG. 2 is a configuration diagram of a substrate transport container and a substrate transfer device according to the embodiment.

FIG. 3 is a perspective view showing another example of the substrate transport container in the embodiment.

FIG. 4 is a top view of the substrate transfer device according to the embodiment.

FIG. 5 is a diagram illustrating a configuration of a door in the substrate transfer device according to the embodiment.

FIG. 6 is a process diagram illustrating a substrate transfer method according to the embodiment.

FIG. 7 is a configuration diagram of a conventional substrate transport container.

FIG. 8 is a configuration diagram of a conventional substrate transfer device.

FIG. 9 is a top view of a conventional substrate transfer device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Board transport container, 2 ... Container body, 3 ... Lid,
4 substrate transfer device, 5 load lock chamber, 6 transfer arm, 7 exhaust pump, 21 opening (container body),
22a: flange surface, 51: opening (load lock chamber), 53: door, 57: opening / closing mechanism, 300: processing chamber

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B65G 49/07 B65D 85/38 R F-term (Reference) 3E096 BA15 BB03 CA02 DA17 DC02 GA07 5F031 CA02 CA05 DA08 EA02 EA03 EA12 EA14 EA18 FA01 FA02 FA07 FA11 GA02 GA49 MA04 MA13 MA17 NA04 NA05 NA09 NA10 PA23

Claims (4)

[Claims] 1. A substrate transport container comprising: a container body having a box shape with one side opened; and a lid which is decompressed and adsorbed to the container body in a state where the opening is closed. The opening edge is provided with a flange surface portion that is in close contact with the opening edge of the substrate transfer device over the entire outer periphery of the lid in a state where the lid is depressurized and adsorbed to the container body. A substrate transport container. 2. The substrate transport container according to claim 1, wherein the lid is depressurized and adsorbed to the container main body by depressurizing the inside of the container main body. 3. A method for transferring a substrate between a substrate transport container in which a lid is decompressed and adsorbed to the container main body while closing an opening of the container main body and a processing chamber of the substrate processing apparatus. A load lock chamber provided with an opening connected to an opening of the processing chamber, the inside of which is maintained in a reduced pressure state; and a substrate transfer container provided on a wall of the load lock chamber. Opening having the opening shape into which the lid is fitted, and the opening edge of the container body in the substrate transport container being tightly connected to the outer peripheral wall over the entire circumference in a state where the lid is fitted. A door that hermetically closes the opening in a state where the substrate transport container is connected to the opening of the load lock chamber; and the substrate connected to the door and the opening of the load lock chamber. Conveyor container An exhaust pump for reducing the pressure between the load lock chamber and the door, the lid supporting the lid of the substrate transport container main body, and the load lock being connected to the lid and the lid through an opening of the load lock chamber. An opening / closing mechanism that can be freely attached to and detached from the inside of the chamber; and a substrate that is provided in the load lock chamber and that moves the substrate between the substrate transport container connected to the opening of the load lock chamber and the processing chamber of the substrate processing apparatus. A substrate transfer device, comprising: a transfer arm on which the substrate is mounted. 4. A substrate transfer method for transferring a substrate between a processing chamber of a substrate processing apparatus and a substrate transport container, wherein an opening of a load lock chamber connected to the processing chamber of the substrate processing apparatus. The inside of the substrate transport container is depressurized by closing it airtightly by a door provided on the inside thereof, and the lid is sucked into the container body of the substrate transport container under reduced pressure, and is fitted into the opening of the load lock chamber. By connecting the opening of the substrate transport container and the opening of the load lock chamber, and reducing the pressure between the door of the load lock chamber and the substrate transport container, the peripheral edge of the opening edge of the container body is subjected to the load lock. A pressure-reducing suction is applied to the outer peripheral wall of the opening of the chamber, the pressure-reducing suction state of the lid with respect to the container body is released, and the closed state of the load lock chamber by the door is released,
The lid is housed in the load lock chamber together with the door, and the container body and the load lock chamber are communicated with each other. The substrate between the inside of the container body and the processing chamber connected to the load lock chamber is provided. A substrate transfer method characterized by performing transfer.