JP4778546B2 - Earthquake damage diffusion reduction method and earthquake damage diffusion reduction system in semiconductor manufacturing equipment - Google Patents

Description

  The present invention relates to an earthquake damage diffusion reduction method and an earthquake damage diffusion reduction system in a semiconductor manufacturing apparatus.

  In the manufacture of semiconductor devices, there are processes for subjecting a semiconductor wafer as an object to be processed to various processes such as an oxidation process and a film forming process. As an apparatus for performing such a process, for example, a plurality of wafers are batch-processed. A processable semiconductor manufacturing apparatus (also referred to as a vertical heat treatment apparatus) is used (for example, see Patent Document 1).

  In this semiconductor manufacturing apparatus, a FOUP (Front Opening Unify Pod, also referred to as a carrier), which is a storage container storing a plurality of wafers, is loaded from a load port (loading / unloading unit) to a storage shelf or transfer unit. Or a wafer counter (detection mechanism) for detecting the position of the wafer in the hoop by removing a removable cover from the front portion of the hoop carried into the load port, A hoop catcher (delivery mechanism) that delivers a hoop from the transport mechanism to the transfer unit, and a lid that opens and closes the furnace port provided in a loading area (working area) formed below the furnace port of the heat treatment furnace A lifting / lowering mechanism that supports a boat (holding tool) loaded with a plurality of wafers at predetermined intervals in the vertical direction and carries it in and out of the heat treatment furnace, and the transfer area and loading area are provided. A door mechanism that opens and closes an opening provided in the partition wall together with a hoop lid on the transfer portion, and a wafer that receives the wafer from the loading area side and has a mark such as a notch (notch) on its circumference. And a notch aligner (alignment mechanism) for aligning the positions.

  By the way, the wafer is expensive, and the manufacturing cost increases as the processing steps progress. Therefore, the handling must be careful.

JP 2000-150400 A

  By the way, in the batch type semiconductor manufacturing apparatus described above, there are various restrictions in terms of hardware and software due to the configuration of the apparatus, and it is difficult to provide an earthquake resistant structure or an earthquake resistant function, and sufficient earthquake resistance measures are not taken. is the current situation. For this reason, when an earthquake occurs and the apparatus is greatly shaken, damage such as collapse of the boat, breakage of the wafer from the boat, and leakage of gas may occur. When such damage occurs, it takes a long time to restore the apparatus until the operation is resumed, and the damage becomes enormous. Therefore, in order to solve such a problem, the present applicant has applied for an earthquake damage diffusion reduction method and an earthquake damage diffusion reduction system in a semiconductor manufacturing apparatus (Japanese Patent Application No. 2007-208863, unpublished).

  However, the invention according to the above application is not sufficient to cover the entire semiconductor manufacturing apparatus. For example, in a load port or transfer section, the hoop lid may be removed and become open, and in this case, if a large shake is caused by an earthquake, the wafer jumped out of the hoop or jumped out. The wafer may fall and be damaged.

  Further, if a large shake due to an earthquake is received while the hoop is being transported by the transport mechanism, the hoop may drop and the wafer in the hoop may be damaged. Further, when the hoop is placed on the transfer portion by the hoop catcher, an earthquake may occur, the hoop may fall from the placement portion, and the wafer in the hoop may be damaged.

  Furthermore, if an earthquake occurs while the boat is unloaded (unloaded) from the heat treatment furnace after the heat treatment, the wafer may jump out of the boat or fall and be damaged. If the wafer breaks and scatters in the loading area, there is a possibility that fine debris may be caught in various driving units.

  In the semiconductor manufacturing apparatus, a heater (heating device) for heating the heat treatment furnace to a high temperature, a pump system for exhausting or depressurizing the heat treatment furnace, a processing gas containing dangerous gas in the heat treatment furnace, Since it is equipped with a gas system that supplies inert gas, it is desirable to balance safety and early recovery when reducing the spread of damage including human damage caused by earthquakes.

  The present invention has been made in view of the above circumstances, and predicts the occurrence of an earthquake from the storage container being opened, the object being ejected from the open storage container, the storage container being dropped during transportation, An object of the present invention is to provide an earthquake damage diffusion reduction method and an earthquake damage diffusion reduction system in a semiconductor manufacturing apparatus capable of preventing the target object from being ejected, minimizing damage and shortening the recovery time. To do.

In order to achieve the above object, among the present inventions, the invention according to claim 1 is that the storage container storing a plurality of objects to be processed is transferred from the loading / unloading section to the storage shelf section or the transfer section. On the other hand, a plurality of objects to be processed are arranged in a vertical direction on a lid that is provided in a conveyance area having a conveyance mechanism for conveying the gas and a work area formed below the furnace port of the heat treatment furnace and opens and closes the furnace port. An elevating mechanism that supports the holders mounted at intervals and carries them in and out of the heat treatment furnace, and opens and closes the opening provided in the partition partitioning the transfer area and work area together with the lid of the storage container on the transfer section In a semiconductor manufacturing apparatus equipped with a door mechanism that receives emergency earthquake information based on initial tremor distributed via a communication line or directly detects initial tremor, and received emergency earthquake information or detected initial Based on the fine movement of the semiconductor manufacturing equipment A first step of stopping the rotation, in parallel with the first step, a second step of closing operation of the door mechanism when the door mechanism is in the open state, the heat treatment furnace, a heater, vacuum A pump and a valve for supplying a processing gas or an inert gas, and the first step turns off the heater and the decompression pump when the predicted seismic intensity is equal to or higher than a predetermined value. When the gas valve is closed and the predicted seismic intensity is less than the predetermined value, the heater and the vacuum pump are kept on, the inert gas valve is kept open, and the processing gas valve is closed. It is characterized by including .
The invention according to claim 10 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit that executes a second step of closing the door mechanism when the door mechanism is in an open state in order to prevent the workpiece from popping out. The heat treatment furnace includes a heater, a decompression pump And a valve for supplying a processing gas or an inert gas, and when the predicted seismic intensity is equal to or higher than a predetermined value, the first step turns off the heater and the decompression pump, and the processing gas and the inert gas. When the predicted seismic intensity is less than a predetermined value, the heater and the pressure reducing pump are left on, the inert gas valve is left open, and the processing gas valve is closed. It is characterized by including.

The invention according to claim 2 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A step of receiving emergency earthquake information based on initial tremor distributed over a line or directly detecting initial tremor, and a step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor One step and the same as the first step To, and a second step of closing operation of the door mechanism when the door mechanism is in the open state, the upper Symbol heat treatment furnace comprises a heater, and a valve for supplying the processing gas or an inert gas, the first step above SL, when the prediction seismic intensity is a predetermined value or more, off the upper Symbol heater motor, the valve of the upper Symbol processing gas及beauty inert gas in the closed, when the prediction seismic intensity is less than the predetermined value to, leave the upper Symbol heating data on, and leave the valve of the upper Symbol inert gas open, the valve of the upper Symbol treatment gas, characterized in that it comprises closed.
According to an eleventh aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf unit or a transfer unit, or vice versa, and a heat treatment. A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit that performs a second step of closing the door mechanism when the door mechanism is in an open state in order to prevent the workpiece from popping out. The heat treatment furnace includes a heater, a processing gas, And a valve for supplying an inert gas. When the predicted seismic intensity is equal to or higher than a predetermined value, the first step is to turn off the heater, close the process gas and inert gas valves, and The heater is turned on, the inert gas valve is left open, and the processing gas valve is closed when the value is less than a predetermined value.

According to a third aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf unit or a transfer unit, or vice versa, and a heat treatment. A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A step of receiving emergency earthquake information based on initial tremor distributed over a line or directly detecting initial tremor, and a step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor One step and the same as the first step To, the door mechanism when the door mechanism is in the open state together with and a second step of closing operation, the container to remove the detachable lid from the front of the container which is carried into the carry-out section a detection mechanism for detecting the position of the object in the inner, the second step, when the detecting mechanism is in operation is characterized in that it comprises a closing lid back a detection mechanism to an initial state .
The invention according to claim 12 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit that performs a second step of closing the door mechanism when the door mechanism is in an open state in order to prevent the object to be processed from popping out, and a front of the storage container loaded into the loading / unloading unit. And a detection mechanism for detecting the position of the object to be processed in the storage container by removing the detachable lid, and the second step returns the detection mechanism to the initial state when the detection mechanism is in operation. And closing the lid.

According to a fourth aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf unit or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A step of receiving emergency earthquake information based on initial tremor distributed over a line or directly detecting initial tremor, and a step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor One step and the same as the first step To, the door mechanism when the door mechanism is in the open state together with and a second step of closing operation, alignment for aligning the position of the landmarks on its circumference to accommodate the object to be processed from the working region side a mechanism, the second step is characterized in that it comprises restraining the object to be processed by operating the center alignment mechanism provided in the alignment mechanism.
According to a thirteenth aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf unit or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit that executes a second step of closing the door mechanism when the door mechanism is in an open state in order to prevent the target object from popping out; An alignment mechanism for aligning the positions of the marks on the circumference, and the second step includes operating a center alignment mechanism provided in the alignment mechanism to restrain the object to be processed. To do.

The invention according to claim 5 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting and lowering mechanism for carrying in and out, and a door mechanism for opening and closing an opening provided in a partition partitioning the transfer area and the work area together with a lid of a storage container on the transfer section, The process of receiving emergency earthquake information based on initial tremor distributed via a communication line or directly detecting initial tremor, and stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor The first step, and the first step On the line, and a second step of the door mechanism is closing operation when the door mechanism is in the open state, the second step, the lowest position of the conveying mechanism when the transport mechanism is in the elevating operation It is moved to, characterized in that it comprises a stopping by.
According to the fourteenth aspect of the present invention, there is provided a conveyance region having a conveyance mechanism for conveying a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit that executes a second step of closing the door mechanism when the door mechanism is in an open state in order to prevent the workpiece from popping out. It includes moving the transport mechanism to the lowest lowered position and stopping it during the lifting operation.

The invention according to claim 6 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit to a storage shelf or a transfer unit, or vice versa, and a heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting and lowering mechanism for carrying in and out, and a door mechanism for opening and closing an opening provided in a partition partitioning the transfer area and the work area together with a lid of a storage container on the transfer section, The process of receiving emergency earthquake information based on initial tremor distributed via a communication line or directly detecting initial tremor, and stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor The first step, and the first step On the line, and a second step of the door mechanism is closing operation when the door mechanism is in the open state, the second step, the storage shelf part container the transport mechanism by stretching the transfer arm when taken out from the time or storage shelf placed, characterized in that it comprises holding the state of being stretched a transfer arm.
According to the fifteenth aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a loading / unloading section to a storage shelf section or a transfer section or vice versa, and a heat treatment. A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit that executes a second step of closing the door mechanism when the door mechanism is in an open state in order to prevent the workpiece from popping out. When the storage arm is placed on the storage shelf by extending the transfer arm or taken out from the storage shelf, the transfer arm is held in an extended state.

The invention according to claim 7 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A step of receiving emergency earthquake information based on initial tremor distributed over a line or directly detecting initial tremor, and a step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor One step and the same as the first step And provided with a second step of the door mechanism is closing operation when the door mechanism is in the open state, it comprises a transfer mechanism for transferring the container into the transfer unit from the transfer mechanism, the second step , when the delivery mechanism hands over the container into the transfer unit is characterized in that it includes holding a state where the delivery mechanism grips the container.
According to the sixteenth aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a loading / unloading section to a storage shelf section or a transfer section or vice versa, and a heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping In addition, in order to prevent the object to be processed from popping out, when the door mechanism is in the open state, a control unit that executes a second step of closing the door mechanism and a transfer container from the transport mechanism are received by the transfer unit. A delivery mechanism, and the second step includes holding the storage container in a gripped state when the delivery mechanism delivers the storage container to the transfer section.

According to an eighth aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf unit or a transfer unit, or vice versa, and a heat treatment. A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A step of receiving emergency earthquake information based on initial tremor distributed over a line or directly detecting initial tremor, and a step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor One step and the same as the first step To, and a second step of closing operation of the door mechanism when the door mechanism is in the open state, the second step, the holding when the lifting mechanism is being unloaded retainer from the heat treatment furnace characterized in that it includes again loading the ingredients into the heat treatment furnace.
According to the seventeenth aspect of the present invention, there is provided a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping Beauty, in order to prevent jumping out of the specimen, when the door mechanism is in the open state and a control unit for executing the second step of the closing operation of the door mechanism, the second step, the lifting mechanism When the holder is being carried out of the heat treatment furnace, the holder is again carried into the heat treatment furnace.

The invention according to claim 9 includes a transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A step of receiving emergency earthquake information based on initial tremor distributed over a line or directly detecting initial tremor, and a step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial tremor One step and the same as the first step To, the door mechanism when the door mechanism is in the open state together with and a second step of closing operation, and the holder mounting table for mounting the holder to carry out the transfer of the object to be processed, A lock mechanism that locks the holder placed on the holder placing table, and the second step is configured such that the lock mechanism holds the holder when the holder is placed on the holder placing table. characterized in that it comprises locking the tool.
According to an eighteenth aspect of the present invention, there is provided a transport region having a transport mechanism for transporting a storage container storing a plurality of objects to be processed from a carry-in / carry-out unit to a storage shelf or a transfer unit, or vice versa, and heat treatment A heat treatment furnace is provided in a heat treatment furnace that supports a holder in which a plurality of objects to be processed are mounted at predetermined intervals in a vertical direction on a lid that opens and closes the furnace opening provided in a work area formed below the furnace opening of the furnace. In a semiconductor manufacturing apparatus comprising a lifting / lowering mechanism for loading / unloading and a door mechanism for opening / closing an opening provided in a partition partitioning the transfer area and work area together with a lid of a storage container on the transfer section. A receiving unit that receives emergency earthquake information based on initial tremors distributed over a line or an initial tremor detecting unit that directly detects initial tremors, and operation of semiconductor manufacturing equipment based on received emergency earthquake information or detected initial tremors A first step of stopping And a control unit for performing a second step of closing the door mechanism when the door mechanism is in an open state, and a holding unit for transferring the object to be processed in order to prevent the object to be processed from popping out. A holder mounting table for mounting the tool, and a lock mechanism for locking the holder mounted on the holder mounting table. In the second step, the holding tool is mounted on the holder mounting table. The locking mechanism includes locking the holding tool when placed.

  According to the present invention, the initial tremor (P wave) is detected 10 seconds before the main motion (S wave) and distributed via the communication line, or the initial tremor is detected directly. While the operation of the semiconductor manufacturing apparatus is stopped, in parallel with this, the door mechanism is closed when the door mechanism is open. Can be prevented, damage can be minimized, and recovery time can be shortened.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 schematically shows an earthquake damage diffusion reduction system in a semiconductor manufacturing apparatus as an example of an embodiment of the present invention, FIG. 2 is a cross-sectional view of the semiconductor manufacturing apparatus in FIG. 1, and FIG. It is explanatory drawing explaining the opening / closing operation | movement of the cover of a hoop.

  In these drawings, reference numeral 1 denotes a semiconductor manufacturing apparatus installed in a clean room, for example, a vertical heat treatment apparatus, and the heat treatment apparatus 1 includes a housing 2 that forms an outline of the apparatus. In the housing 2, a hoop 3, which is a storage container storing a plurality of objects to be processed, for example, semiconductor wafers w, is loaded from a load port (loading / unloading section) 7 to a storage shelf section 11 and a transfer stage (transfer section) 12. In addition, a transfer area Sa for transferring, or a boat (holder) 4 on which a large number of, for example, about 100 to 150 wafers w are mounted at a predetermined pitch in the vertical direction, and a hoop 3 on the transfer stage 12 A loading area (working area) Sb for transferring the wafer w and loading / unloading the boat 4 to / from the heat treatment furnace 5 is provided. The conveyance area Sa and the loading area Sb are partitioned by a partition wall 6.

  The hoop 3 is a plastic container that can accommodate and carry a plurality of wafers having a predetermined diameter, for example, 300 mm in a horizontal state at a predetermined interval in the vertical direction, for example, about 13 to 25 wafers. A lid 3a for airtightly closing the wafer outlet is provided in a removable manner. A keyhole of a lock mechanism provided on the lid 3a is provided on the front surface of the lid 3a (not shown). As an apparatus for unlocking the lid 3a by inserting a key member into the keyhole and turning it, and attaching / detaching the lid to / from the hoop, for example, a lid described in JP-A-2002-353289 An attaching / detaching device is used, and this lid attaching / detaching device is provided in the load port 7 and the door mechanism 15.

  The load port (loading / unloading unit) 7 for loading / unloading the hoop 3 by an operator or a transfer robot is provided at the front of the casing 2. The load port 7 is provided at a front portion in the housing for placing the hoop 3 and an opening formed on the front surface of the housing 2 for taking the hoop 3 in and out. Part 9. It is preferable that a door 10 that can be raised and lowered is attached to the opening 9.

  A detection mechanism 32 for detecting the position and the number of wafers W by opening the lid 3a of the hoop 3 is provided at the rear part of the mounting table 8 of the load port 7. This detection mechanism 32 has the lid attaching / detaching device described above. Further, as shown in FIG. 3, the detection mechanism 32 determines whether or not the light beam 32 c stretched between the outgoing light portion 32 a and the incident light portion 32 b opposed to each other at the left and right is blocked by the wafer w in the hoop 3. A detection head 32x that detects the presence / absence of the wafer w and a drive unit (not shown) that moves the detection head 32x up and down and back and forth through an operation rod 32y are provided.

  A transfer stage 12 for mounting the FOUP 3 is provided on the partition wall 6 side in the transfer area Sa in order to transfer the wafer, and above the transfer stage 12 and above the mounting table 8. A storage shelf 11 for storing a plurality of hoops 3 is provided above.

  The transport mechanism 13 includes a lift arm 13b that is moved up and down by a lift mechanism 13a provided on one side of the transport area Sa, and a transport arm 13b that is provided on the lift arm 13b and supports the bottom of the hoop 3 and transports it horizontally. The transfer arm 13c is mainly configured.

The conveyance area Sa is an air atmosphere cleaned by an air cleaner (fan / filter unit) (not shown). The loading area Sb is also cleaned by an air purifier (fan / filter unit) 14 provided on one side thereof, and is set to a positive pressure atmospheric atmosphere or an inert gas (for example, N ₂ gas) atmosphere. In the transport area Sa, a hoop catcher (delivery mechanism) 33 for delivering the hoop 3 from the transport mechanism 13 to the transfer stage 12 is provided. As shown in FIGS. 2 and 9, the hoop catcher 33 includes an elevating arm 33 b that is moved up and down by an elevating mechanism 33 a provided on one side of the transport area Sa, and an upper portion of the hoop 3 provided on the elevating arm 33 b. It is mainly composed of a gripping mechanism 33c that grips the support portion 3x. The hoop catcher 33 receives the hoop 3 from the transport mechanism 13 and stands by, while the transport mechanism 13 transports the hoop 3 from the transfer stage 12 to the storage shelf 11 or the mounting table 8 of the load port 7. The next hoop 3 is placed on the transfer stage 12 to improve the efficiency of the transport operation.

  As shown in FIG. 4, the partition wall 6 is brought into contact with the front surface of the hoop 3 placed on the transfer stage 12 from the transport area Sa side so as to communicate the inside of the hoop 3 and the loading area Sb. An opening 34 is provided, and a door mechanism 15 having a door 15a for closing the opening 34 from the loading area Sb side is provided. The opening 34 is formed to have substantially the same diameter as the front opening (wafer outlet) of the FOUP 3, and the wafer w in the FOUP 3 can be taken in and out from the opening 34. The door mechanism 15 is configured to open and close the opening 34 by sliding the door 15a in the left-right direction. The above-described lid attaching / detaching device is incorporated in the door 15a. The transfer stage 12 is provided with a pressing mechanism (not shown) for pressing the front surface of the hoop 3 so as to contact the peripheral edge of the opening 34.

  Below the transfer stage 12, there is a notch aligner (alignment mechanism) 16 for aligning notches (notches), which are marks provided on the periphery of the wafer w in order to align the crystal direction, in one direction. Is provided. The notch aligner 16 is opened facing the loading area Sb, and is configured to align notches of the wafer w transferred from the hoop 3 on the transfer stage 12 by a transfer mechanism 24 described later. Yes.

  As shown in FIGS. 5 to 6, the notch aligner 16 has a support 35 composed of four blocks in a plan view for supporting a plurality of, for example, five wafers in the vertical direction at a peripheral portion at a predetermined interval. An alignment mechanism 36, a rotation mechanism 37 that rotates the wafers horizontally by lifting the lower surface center portion of each wafer w supported by the support 35, and a sensor 38 that detects the notch of each wafer. . When the sensor 38 detects the notch, the rotation of the wafer by the rotation mechanism 37 is stopped and the notch is aligned. The support 35 includes a plurality of, for example, five support pieces 39 having an L-shaped cross section at predetermined intervals in the vertical direction. The support 35 receives the lower surface of the peripheral edge of the wafer w on the horizontal surface 39a of the support piece 39 and The surface 39b regulates the position of the peripheral edge of the wafer.

  As shown in FIG. 6B, the center alignment mechanism 36 moves the support 35 in the direction in which the support 35 approaches each other so that the center of the wafer w is positioned. The center alignment mechanism 36 is used to restrain the wafer from popping out by restraining the wafer when an earthquake occurs, as will be described later. 6A is a diagram in a state where the wafer is placed on the support piece of the support, FIG. 6B is a diagram in which the support is brought close to each other, and the wafer is centered, and FIG. 6C is a rotation. The figure of the state which raised the mechanism and supported the wafer, (d) is a figure of the state which spaced apart support bodies and rotated a wafer by a rotation mechanism.

  On the other hand, a vertical heat treatment furnace 5 having a furnace port 5a at the lower part is installed above the loading area Sb, and a large number of wafers w, for example, about 100 to 150 wafers are placed in the vertical direction in the loading area Sb. For example, a quartz boat 4 mounted at a predetermined interval is mounted on the upper portion of the lid body 17 to carry in and out of the heat treatment furnace 5 and to raise and lower the lid body 17 for opening and closing the furnace port 5a. It has been. A heat insulating cylinder (heat insulating body) 19 that suppresses heat radiation from the furnace port 5 a when the cover 17 is closed is placed on the top of the lid body 17, and the boat 4 is placed on the heat insulating cylinder 19. The lid 17 is provided with a rotating mechanism 20 that rotates the boat 4 via a heat insulating cylinder 19. In the vicinity of the furnace port 5a, a shutter 21 for shielding the furnace port 5a when the cover 17 is opened and the heat-treated boat 4 is carried out is provided so as to be openable and closable (turnable) in the horizontal direction. ing. The shutter 21 has a shutter drive mechanism (not shown) that opens and closes by rotating the shutter 21 in the horizontal direction.

  On one side of the loading area Sb, that is, on the air purifier 14 side, there is a boat mounting table (also referred to as a holder mounting table or a boat stage) 22 on which the boat 4 is mounted for transferring wafers w or the like. Is provided. The number of the boat mounting table 22 may be one, but as shown in FIG. 2, the first mounting table (charge stage) 22 a and the second mounting table (standby stage) 22 b that are arranged forward and backward along the air cleaner 14. It is preferable that it consists of two.

  Below the loading area Sb, between the transfer stage 12 and the heat treatment furnace 5, between the boat mounting table 22 and the lid 17, specifically, the first mounting table 22 a of the boat mounting table 22. Or the boat conveyance mechanism 23 which conveys the boat 4 between the 2nd mounting base 22b and the lid | cover 17 lowered | lowered and between the 1st mounting base 22a and the 2nd mounting base 22b is provided. Further, above the boat transport mechanism 23, between the hoop 3 on the transfer stage 12 and the boat 4 on the boat mounting table 22, specifically, the hoop 3 on the transfer stage 12 and the notch alignment mechanism 16. Between the notch alignment mechanism 16 and the boat 4 on the first mounting table 22a of the boat mounting table 22, and the boat 4 after the heat treatment on the first mounting table 22a and the empty hoop 3 on the transfer stage 12. A transfer mechanism 24 is provided for transferring the wafer w between the two.

  As shown in FIG. 11 (a), the boat 4 has a plurality of, for example, four columns 4c interposed between the top plate 4a and the bottom plate 4b, and the bottom plate 4b is formed in a plane annular shape. A reduced diameter portion 4d having a diameter smaller than that of the bottom plate 4b is provided at the lower portion. The boat transport mechanism 23 transports the boat 4 while holding the reduced diameter portion 4d of the bottom plate 4b of the boat 4 by a plane C-shaped holding portion 23a (see FIG. 2). Grooves (not shown) for holding the wafer in the vertical direction at predetermined intervals are formed in the support columns 4c. The space between the left and right support columns 4d on the front side is widened to take in and out the wafer.

  The first mounting table 22a is provided with a lock mechanism 65 that locks the boat 4 on the first mounting table 22a. The lock mechanism 65 projects from the top of the first mounting table 22a and is positioned inside the opening 4e of the bottom plate 4b of the boat 4 and moves the rollers 45a away from or close to each other. Thus, a drive unit, for example, an air cylinder 45b, is provided which is locked or unlocked by being pressed or separated from the inner periphery of the opening 4e of the bottom plate 4b. The lock mechanism 45 is configured to be controlled by the control unit 29 in the second step.

  The transfer mechanism 24 is provided with a plurality of, for example, five thin plate-like transfer arms 24b on which a semiconductor wafer is mounted on a horizontally rotatable base 24a so as to be capable of moving forward and backward. In order to avoid the interference, the work position A indicated by the phantom line in FIG. 2 can be retracted in the lateral direction from the work position A indicated by the solid line via the swing arm 25. As the transfer arm 24b, one transfer arm for transferring the central sheet of the five sheets and the other four transfer arms can be moved forward and backward independently on the base 24a. It is preferable that the other four transfer arms are configured to be capable of pitch conversion in the vertical direction with the central transfer arm as a reference. The base side of the swivel arm 25 is connected to a lifting mechanism (not shown) provided on the other side of the loading area Sb, so that the transfer mechanism 24 can be lifted and lowered.

As shown in FIG. 1, the heat treatment furnace 5 is installed so as to cover, for example, a cylindrical quartz glass processing vessel (reaction tube) 50 whose upper end is closed and whose lower end is opened, and the periphery of the processing vessel 50. The heater 51 is provided. A cylindrical manifold 52 having a gas introduction pipe section and an exhaust pipe section for supplying a processing gas and an inert gas (for example, N ₂ gas) is connected to the lower end portion of the processing container 50. Are connected to gas supply pipes 53a and 53b for supplying a processing gas and an inert gas, and an exhaust pipe 54 is connected to the exhaust pipe portion.

The gas supply pipes 53a and 53b are provided with valves 55a and 55b for opening and closing. A main valve 56 for opening and closing, a pressure control valve 57, an exhaust trap 58, a decompression pump 59, and the like are connected to the exhaust pipe 54 in this order. In a vertical processing apparatus of a type in which the loading area Sb is an inert gas (for example, N ₂ gas) atmosphere, a gas supply pipe 61 that supplies an inert gas to the loading area Sb is connected. 61 is provided with a valve 62.

  In order to protect the vertical heat treatment apparatus 1 configured in this way from an earthquake, the earthquake damage diffusion reduction method in the vertical heat treatment apparatus 1 is an emergency earthquake based on initial microtremors (P waves) distributed via the communication line 26. A step of receiving information, a first step of stopping the operation of the vertical heat treatment apparatus 1 based on the emergency earthquake information, and the door in order to prevent the wafer w from jumping out in parallel with the first step. A second step of closing the door mechanism 15 when the mechanism 15 is in an open state. The earthquake damage diffusion reduction system 27 that executes this method is obtained by the receiving unit 28 that receives emergency earthquake information based on the initial tremor (P wave) distributed via the communication line 26, and the receiving unit 28. The first step of stopping the operation of the vertical heat treatment apparatus 1 based on the emergency earthquake information, and the door mechanism 15 is closed when the door mechanism 15 is in an open state in order to prevent the wafer w from jumping out. And a control unit 29 that executes the second step.

  As the emergency earthquake information, an emergency earthquake bulletin provided by the Japan Meteorological Agency, an emergency earthquake detection system provided by a third party, or the like can be used. The earthquake is a longitudinal tremor (7k-8km per second) with a small initial tremor consisting of a P wave (Primary), and a transverse wave with a slow velocity (3k-4km per second) and a large shaking consisting of a S wave (Secondary). It consists of main movements. The P wave data collected by a large number of seismometers 30 installed throughout the country is processed to calculate the epicenter, seismic intensity, and arrival time of the S wave, and this earthquake information is transmitted from the distribution unit 31 to the wired line and satellite line 26. The earthquake information is received by the receiving unit 28. As a result, it is possible to know the seismic intensity expected several seconds to 10 seconds before the mainshock that shakes greatly and prepare for the mainshock in advance. The control unit 29 is preferably configured to execute a seismic damage diffusion reduction method when a predetermined threshold value (for example, predicted seismic intensity 5) is set and the threshold value is exceeded. The threshold value can be arbitrarily set on the user side in consideration of the seismic strength of the building and the like. In the avoidance operation of the pump system and gas system, the predicted seismic intensity level, for example, the predicted seismic intensity is large (greater than the predetermined seismic intensity), for example, the seismic intensity is 5 or higher, and the predicted seismic intensity is small in order to balance emphasis on safety and early recovery. (If the seismic intensity is less than the specified seismic intensity, for example, less than seismic intensity 5 or less, if the predicted seismic intensity is greater than the predetermined value, stop the equipment (semiconductor manufacturing equipment) that emphasizes safety to minimize human and physical damage, and predict When the seismic intensity is less than a predetermined value, it is preferable to stop the apparatus on the premise of early recovery.

  Basically, in the first step, the power source (main power source) and the gas line of the heat treatment apparatus 1 are shut off. The main power source may be kept alive until just before the mainshock (S wave). When the main power is turned off in the first step (P wave), the detection mechanism 32 including the lid attaching / detaching device that is driven to prevent the wafer from jumping out, the door mechanism 15, the notch aligner 16, the lifting mechanism 18, and the hoop 3 are dropped. An auxiliary power source needs to be secured for the transport mechanism 13 and the hoop catcher 33 that are driven to prevent them.

  Specifically, in the first step, when the predicted seismic intensity is greater than or equal to a predetermined value, the heater 51 and the pressure reducing pump are stopped in order to stop the apparatus with an emphasis on safety to minimize human and property damage. 59 is turned off, and the processing gas (actual gas) and inert gas valves 55a and 55b are closed. The main valve 56 is also preferably closed.

When the predicted seismic intensity is less than the predetermined value, the heater 51 and the pressure reducing pump 59 are kept on, the inert gas valve 55b is kept open, and the apparatus is stopped on the premise of early recovery. The processing gas valve 55a is closed. The main valve 56 of the exhaust pipe 54 is preferably left open. Here, keeping the heater 51 on means that the power of the heater 51 is kept on and the temperature of the heater 51 is maintained at a set temperature. In addition, the inert gas valve 55b is left open, for example, cycle purge (repeating supply / stop of N ₂ and evacuation in order to keep the oxygen concentration in the processing container below a certain level in a short time) ), Dilution exhaust (when exhausting the processing gas in the processing vessel, exhausting while diluting with N ₂ ), or continuing the supply of N ₂ into the loading area. The control unit 29 controls the opening / closing of the valves 55a, 55b, 62 including the main valve 56 and the on / off control of the heater 51 and the decompression pump 59 based on the predicted seismic intensity.

  On the other hand, in the present embodiment, in the second step, when the door mechanism 15 is in the open state (see (a)) by the control unit 29, the door mechanism 15 is closed (see (b)). It is configured.

  According to the earthquake damage diffusion reducing method or the earthquake damage diffusion reducing system 27 having the above-described configuration, the initial fine movement (P) detected and distributed via the communication line 26 from several seconds to 10 several seconds before the main movement (S wave). 4), the operation of the vertical heat treatment apparatus 1 is stopped while the door mechanism 15 is in an open state [see (a)] as shown in FIG. In some cases, the door mechanism 15 is closed (see (b)). Therefore, physical damage such as breakage of the wafer w due to the jumping of the wafer w from the hoop 3 on the transfer stage 12 due to an earthquake, and the time for restoring the apparatus. It is possible to prevent the loss from increasing.

  In particular, the heat treatment furnace 5 includes a heater 51, a decompression pump 59, and valves 55a and 55b for supplying a processing gas and an inert gas, and the first step is performed when the predicted seismic intensity is a predetermined value or more. The heater 51 and the decompression pump 59 are turned off, the processing gas and inert gas valves 55a and 55b are closed, and the heater 51 and the decompression pump 59 are turned on when the predicted seismic intensity is less than a predetermined value. The inert gas valve 55b is left open, and the process gas valve 55a is closed. It becomes possible.

  When the power is turned on again to restore the apparatus, the operator confirms the state of the apparatus, the state of the wafer, and the state of the boat. The operator determines whether or not the operation of the apparatus can be continued. If it is not possible, factors that prevent the continuation (for example, wafer lot-out, wafer breakage or misalignment, boat breakage or misalignment, gas leak, water leak, current leak) After confirming that the conditions for starting up the apparatus (for example, the operation of the valves of the processing gas system, the operation of the decompression pump, the operation of the transfer system) are completed, the apparatus is started up.

  In the second step, as shown in FIG. 3, the lid 3a of the hoop 3 is opened (see (b) and (e)), and the detection head 32x of the detection mechanism 32 is brought close to the wafer w in the hoop 3. The detection [see (c), (d)] is stopped halfway, the detection head 32x is returned to the original position (home position) HPa below, and the lid 3a of the hoop 3 is closed [(a), (d It is preferable to include When the detection mechanism 32 is in operation, the detection mechanism 32 is returned to the initial state and the lid 3a is closed, so that physical damage such as breakage of the wafer w due to the jumping of the wafer w from the hoop 3 due to an earthquake and restoration of the apparatus. It is possible to prevent an increase in time loss. Further, since the detection head 32x of the detection mechanism 32 is returned to the home position HPa, the semiconductor manufacturing apparatus 1 can be returned quickly.

  Further, in the second step, as shown in FIGS. 5 and 6B to 6C, the center alignment mechanism 36 provided in the notch aligner 16 is operated to restrain the wafer w. preferable. As a result, it is possible to prevent physical damage such as breakage of the wafer w due to the jumping of the wafer w from the notch aligner 16 due to an earthquake, and an increase in time loss in apparatus restoration.

  In the second step, as shown in FIGS. 7A and 7B, when the transport mechanism 13 is moving up and down, the transport mechanism 13 is moved to the lowest position, that is, the home position HPb and stopped. It is preferable to include. Thereby, it is possible to prevent the hoop 3 from dropping from the transfer arm 13c of the transfer mechanism 13 at a high position due to an earthquake, and it is possible to prevent physical damage such as breakage of the wafer w due to the drop of the hoop 3. When the transport mechanism 13 is not in the up-and-down operation, for example, as shown in FIG. 8, when the transport arm 3 c is extended and the hoop 3 is placed on the storage shelf 11 or taken out from the storage shelf 11, the second Control for lowering the transport mechanism 13 to the lowest position in the process is not performed, and the transport arm 13c is held in an extended state.

  In the second step, as shown in FIGS. 9A and 9B, when the hoop catcher 33 delivers the hoop 3 to the transfer stage 12, the gripping mechanism 33c of the hoop catcher 33 opens and the hoop is removed. Even when released, it is preferable to close the gripping mechanism 33c again and hold the hoop 3 in a gripped state. As a result, the hoop 3 can be prevented from dropping from the transfer stage 12, and physical damage such as breakage of the wafer w due to the drop of the hoop 3 can be prevented.

  Further, in the second step, as shown in FIGS. 10A and 10B, when the lifting mechanism 18 is carrying the boat 4 out of the heat treatment furnace 5, the boat 4 is moved into the heat treatment furnace 5. It is preferable to include carrying in again. As a result, when the boat 4 is unloaded from the heat treatment furnace 5, it is possible to prevent the wafer from jumping out of the boat 4 due to an earthquake, and to increase the physical damage such as damage of the wafer due to the wafer jumping out and the time loss of equipment restoration. Can be prevented.

  In the second step, as shown in FIG. 11, the lock mechanism 45 locks the boat 4 when the boat 4 is mounted on the first mounting table 22 a that is the boat mounting table. It is preferable to contain. As a result, the boat 4 on the first mounting table 22a can be prevented from falling.

  FIG. 12 is a diagram schematically showing an example of an earthquake damage diffusion reduction system in a semiconductor manufacturing apparatus according to another embodiment of the present invention. In the embodiment of FIG. 12, the same parts as those of the embodiment of FIG. The vertical heat treatment apparatus 1 of the present embodiment includes a seismometer 60 that is an initial fine movement detection unit that directly detects initial fine movement, and a first step of stopping the operation of the vertical heat treatment apparatus 1 based on the detected initial fine movement, And a control unit 29 that executes a second step of closing the door mechanism 15 when the door mechanism 15 is in the open state. The seismometer 60 is preferably installed in the housing 2, but may be installed in a factory site. According to the present embodiment, initial tremor can be detected without receiving emergency earthquake information, and the occurrence of an earthquake can be predicted to prevent the wafer from jumping out of the hoop and damage to the wafer caused by the jump. Can be prevented, and damage can be minimized.

  As mentioned above, although embodiment of this invention was explained in full detail with drawing, this invention is not limited to the said embodiment, Various design changes in the range which does not deviate from the summary of this invention are possible. . For example, an earthquake damage diffusion reduction system in a semiconductor manufacturing apparatus according to the present invention includes a receiving unit that receives emergency earthquake information based on initial tremor distributed via a communication line, and an initial tremor detecting unit that directly detects initial tremor. And may be configured to be selectively switched for use.

  In the above embodiment, a heat treatment apparatus (for example, a CVD apparatus) having a reduced pressure pump is illustrated, but the present invention is also applicable to a heat treatment apparatus (for example, a diffusion apparatus) that does not have a reduced pressure pump. For example, a factory exhaust system is used as an exhaust means for the heat treatment furnace.

It is a figure which shows roughly the earthquake damage diffusion reduction system in the semiconductor manufacturing apparatus which is embodiment of this invention. It is a cross-sectional view of the semiconductor manufacturing apparatus of FIG. It is explanatory drawing explaining the opening / closing operation | movement of the cover of the hoop in a load port part. It is explanatory drawing explaining the opening / closing operation | movement of the door mechanism which opens and closes the cover of a hoop in a wafer transfer part. It is a perspective view showing an example of a notch aligner roughly. It is explanatory drawing explaining the action | operation of a notch aligner. It is explanatory drawing explaining the raising / lowering operation | movement of a hoop conveyance mechanism. It is a figure which shows the state at the time of the arm expansion | extension of a hoop conveyance mechanism. It is explanatory drawing explaining operation | movement of the hoop catcher at the time of the earthquake in a wafer transfer part. It is explanatory drawing explaining the operation | movement at the time of the earthquake during the unloading of the boat from a heat treatment furnace. It is a figure which shows the boat on a 1st mounting base schematically, (a) is a perspective view, (b) is an enlarged plan view of the state which abbreviate | omitted the top plate and support | pillar of the boat, (c) is c of (b) FIG. It is a figure which shows schematically the earthquake damage diffusion reduction system in the semiconductor manufacturing apparatus which is other embodiment of this invention.

Explanation of symbols

1 Vertical heat treatment equipment (semiconductor manufacturing equipment)
w Semiconductor wafer (object to be processed)
3 Hoop (storage container)
3a Lid 4 Boat (holding tool)
5 Heat treatment furnace 6 Bulkhead 7 Load port (loading / unloading section)
Sa transfer area Sb loading area (transfer area)
13 Transport Mechanism 15 Door Mechanism 16 Notch Aligner (Alignment Device)
17 Lid 18 Lifting mechanism 22a First mounting table (holding device mounting table)
24 Transfer Mechanism 26 Communication Line 27 Earthquake Damage Diffusion Reduction System 28 Receiver 29 Control Unit 32 Detection Mechanism 36 Center Alignment Mechanism 51 Heater 55a, 55b Valve 59 Depressurization Pump 60 Seismometer (Initial Micro Motion Detection Unit)
62 Valve 65 Lock mechanism

Claims (18)

A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism With the door mechanism when in the state and a second step of closing operation, the heat treatment furnace, a heater, a vacuum pump, a valve for supplying a process gas or an inert gas, the first step, When the predicted seismic intensity is equal to or higher than a predetermined value, the heater and the vacuum pump are turned off, the processing gas and inert gas valves are closed, and when the predicted seismic intensity is lower than the predetermined value, the heater and the vacuum pump A method for reducing the spread of earthquake damage in a semiconductor manufacturing apparatus , comprising: turning on a valve, leaving the inert gas valve open, and closing the process gas valve . A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism With the door mechanism when in the state and a second step of closing operation, the upper Symbol heat treatment furnace, a heater, a valve for supplying the processing gas or an inert gas, the first step above SL is predicted oN when seismic intensity is equal to or greater than a predetermined value, it turns off the upper Symbol heater motor, the valve of the upper Symbol processing gas及beauty inert gas in the closed, when the predicted seismic intensity is less than the predetermined value, the upper Symbol heater motor leave, and upward Symbol the valve of the inert gas leave open, upper Symbol processing earthquake damage spread reducing method in the semi-conductor manufacturing apparatus you characterized in that it comprises gas valve to closed. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism A second step of closing the door mechanism when it is in a state, and removing the detachable lid from the front of the storage container carried into the carry-in / out part to position the object to be processed in the storage container. a detection mechanism for detecting that said second step, earthquake damage in a semi-conductor manufacturing apparatus you comprising closing the lid back a detection mechanism to an initial state when the detecting mechanism is in operation Diffusion reduction method. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism A second step of closing the door mechanism when it is in a state, and an alignment mechanism for accommodating the objects to be processed from the work area side and aligning the positions of the marks on the circumference thereof, the second step is earthquake damage spread reducing method in the semiconductor manufacturing device you characterized in that it comprises restraining the object to be processed by operating the center alignment mechanism provided in the alignment mechanism. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism With the door mechanism when in the state and a second step of closing operation, the second step, the Rukoto stops to move to the lowest position of the conveying mechanism when the transport mechanism is in the elevating operation earthquake damage spread reducing method in the semiconductor manufacturing device you comprising. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism A second step of closing the door mechanism when it is in a state, wherein the second step is when the transfer mechanism extends the transfer arm and places the storage container on the storage shelf or from the storage shelf. earthquake damage spread reducing method in the semiconductor manufacturing device comprising that you hold in a state of being stretched a transfer arm when taking out. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism And a second step of closing the door mechanism when it is in a state, and a delivery mechanism for delivering the storage container from the transport mechanism to the transfer unit, wherein the delivery mechanism is configured to move the storage container. earthquake damage spread reducing method in the semiconductor manufacturing device characterized in that it includes holding a state where the delivery mechanism grips the container when hands over the transfer section. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism And a second step of the door mechanism is closing operation when in the state, the second step is again carried into the heat treatment furnace the retainer when the lifting mechanism is being unloaded retainer from the heat treatment furnace earthquake damage spread reducing method in the semiconductor manufacturing device characterized in that it comprises. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A step of receiving emergency earthquake information based on microtremors or directly detecting initial microtremors, a first step of stopping operation of a semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and the first step In parallel with the door mechanism A second step of closing the door mechanism when it is in a state, a holder mounting table for mounting the holder to transfer the object to be processed, and a holder mounting table on the holder mounting table A locking mechanism that locks the placed holding tool, and the second step includes that the locking mechanism locks the holding tool when the holding tool is placed on the holding tool placing table. earthquake damage spread reducing method in the semiconductor manufacturing device you characterized. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent this, the heat treatment furnace includes a control unit that executes a second step of closing the door mechanism when the door mechanism is open. The heat treatment furnace includes a heater, a decompression pump, a process gas, and an inert gas. And when the predicted seismic intensity is equal to or higher than a predetermined value, the first step turns off the heater and the decompression pump, closes the processing gas and inert gas valves, and predicts the predicted seismic intensity. when There is less than a predetermined value, and remains on the heater and vacuum pump, the valve of the inert gas leave open, you characterized in that the valve of the processing gas comprises a closed earthquake damage spread reducing system in the semi-conductor manufacturing equipment. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent, when the door mechanism is in the open state and a control unit for executing the second step of the closing operation of the door mechanism, the heat treatment furnace, and supplies a heater, a process gas or an inert gas valve And when the predicted seismic intensity is greater than or equal to a predetermined value, the heater is turned off, the processing gas and inert gas valves are closed, and the predicted seismic intensity is less than the predetermined value. was left on the heater, the valve of the inert gas leave open, earthquake damage spread reducing system in the semi-conductor manufacturing apparatus you characterized in that it comprises a valve of the processing gas in the closed. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent this, when the door mechanism is in an open state, the controller that executes the second step of closing the door mechanism and the removable lid from the front of the storage container carried into the carry-in / carry-out part are removed. and a detection mechanism for detecting the position of the object in storage container Te, the second step, when the detecting mechanism is in operation comprises Rukoto close the lid back a detection mechanism to an initial state earthquake damage spread reducing system in the semi-conductor manufacturing apparatus you wherein a. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent this, when the door mechanism is in an open state, a control unit that performs a second step of closing the door mechanism, and a position of a mark on the circumference of the object to be processed from the work area side. and a alignment mechanism for aligning the earthquake in the second step, characterized in that it comprises restraining the object to be processed by operating the center alignment mechanism provided in the alignment mechanism semiconductors manufacturing apparatus Damage spread reduction system. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent, when the door mechanism is in the open state and a control unit for executing the second step of the closing operation of the door mechanism, the second step, the conveyance when the conveyor mechanism is in the vertical movement earthquake damage spread reducing system in the semi-conductor manufacturing apparatus you comprising a Rukoto is stopped to move the mechanism to the lowest position. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent, when the door mechanism is in the open state and a control unit for executing the second step of the closing operation of the door mechanism, the second step includes a receiving container above the transport mechanism by stretching the transfer arm earthquake damage spread reducing system in a semiconductor manufacturing device you characterized in that it comprises holding the state of being stretched a transfer arm when taking out from the time or the storage shelf unit is placed on the storage shelf part. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent, when the door mechanism is in the open state and a control unit for executing the second step of the closing operation of the door mechanism, a transfer mechanism for transferring the container into the transfer unit from the conveying mechanism, the the second step, earthquake damage spread reduction in semiconductor manufacturing device you comprising that you held in the delivery mechanism grips the container when the delivery mechanism hands over the container into the transfer unit system. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent, when the door mechanism is in the open state and a control unit for executing the second step of the closing operation of the door mechanism, carried out from the second step, the lifting mechanism is a heat treatment furnace the retainer earthquake damage spread reducing system in the semi-conductor manufacturing apparatus characterized in that it comprises carrying again the retainer into the heat treatment furnace when it is in. A transfer region having a transfer mechanism for transferring a storage container storing a plurality of objects to be processed from a loading / unloading unit for loading / unloading to a storage shelf or a transfer unit, or vice versa, and below a furnace port of a heat treatment furnace An elevating mechanism that supports a holder in which a plurality of objects to be processed are mounted in a vertical direction on a lid body that opens and closes the furnace port provided in the formed work area, and carries in and out of the heat treatment furnace, and In a semiconductor manufacturing apparatus including a door mechanism that opens and closes an opening provided in a partition partitioning a transfer area and a work area together with a lid of a storage container on the transfer section, an initial distribution is performed via a communication line. A receiving unit that receives emergency earthquake information based on microtremors or an initial microtremors detecting unit that directly detects initial microtremors, a first step of stopping operation of the semiconductor manufacturing apparatus based on the received emergency earthquake information or detected initial microtremors, and , Popping out the object In order to prevent this, when the door mechanism is in an open state, a control unit that performs a second step of closing the door mechanism and a holder mounting for mounting the holder to transfer the object to be processed are performed. And a lock mechanism that locks the holder placed on the holder placing table, and the second step includes the locking mechanism when the holder is placed on the holder placing base. There earthquake damage spread reducing system in the semi-conductor manufacturing apparatus you characterized in that it comprises locking the retainer.

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