JPH09237757A - Semiconductor producing apparatus - Google Patents
Semiconductor producing apparatusInfo
- Publication number
- JPH09237757A JPH09237757A JP8067467A JP6746796A JPH09237757A JP H09237757 A JPH09237757 A JP H09237757A JP 8067467 A JP8067467 A JP 8067467A JP 6746796 A JP6746796 A JP 6746796A JP H09237757 A JPH09237757 A JP H09237757A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor manufacturing
- stop
- output
- sensor
- exposure apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、露光装置等の半導
体製造装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus such as an exposure apparatus.
【０００２】[0002]
【従来の技術】露光装置をはじめ半導体製造装置は空圧
を利用したいわゆるサーボマウントなどで支持されてい
る。また、近年になって、空圧や油圧、またはボイスコ
イルモータ、圧電素子などの電気的アクチュエータを用
いたアクティブマウント上に設置されることも多くなっ
てきている。このような半導体製造装置のマウントは装
置内部で発生する振動を抑制し、また床振動などの外乱
に対しても有効な遮断特性を持っている。2. Description of the Related Art A semiconductor manufacturing apparatus such as an exposure apparatus is supported by a so-called servo mount which utilizes air pressure. Further, in recent years, it is often installed on an active mount using pneumatic or hydraulic pressure, or an electric actuator such as a voice coil motor or a piezoelectric element. Such a mount for a semiconductor manufacturing apparatus suppresses vibration generated inside the apparatus and has an effective blocking characteristic against external disturbance such as floor vibration.
【０００３】[0003]
【発明が解決しようとする課題】しかしながら装置の可
動部分の異常振動や、地震などの極度の床振動に対して
は十分な振動抑制ができず、露光装置においては、装置
の位置合せ性能や焼付け性能、露光性能などに重大な影
響を及ぼしている。However, it is not possible to sufficiently suppress vibrations due to abnormal vibrations of movable parts of the apparatus or extreme floor vibrations such as earthquakes. The performance and exposure performance are seriously affected.
【０００４】そこで、本発明の目的は、異常振動や床振
動に起因する悪影響を防止することにある。Therefore, an object of the present invention is to prevent adverse effects caused by abnormal vibration or floor vibration.
【０００５】[0005]
【課題を解決するための手段】この目的を達成するため
本発明の半導体製造装置は、装置各部の振動を検知する
検知手段と、この検知手段の出力に基づいて装置を停止
させるべき旨の停止信号を出力する停止制御手段と具備
することを特徴とする。装置の動作シーケンスを制御す
るシーケンス制御手段は、前記停止信号に応じて装置の
動作を停止させる。また、前記停止制御手段は、装置に
接続されている周辺装置にも前記停止信号を出力する。In order to achieve this object, a semiconductor manufacturing apparatus of the present invention has a detection means for detecting the vibration of each part of the apparatus, and a stop to stop the apparatus based on the output of the detection means. It is characterized by comprising stop control means for outputting a signal. The sequence control means for controlling the operation sequence of the device stops the operation of the device in response to the stop signal. Further, the stop control means also outputs the stop signal to the peripheral device connected to the device.
【０００６】前記検知手段としては、例えば加速度検知
器を、装置内部や装置外に設置して用いることができ
る。また、変位センサを用いることもでき、この場合、
変位センサにより、装置と床あるいは床に固定された設
置物との変位を検知したり、装置と周辺装置との間の変
位を検知する。As the detecting means, for example, an acceleration detector may be installed inside or outside the apparatus and used. A displacement sensor can also be used, in which case
The displacement sensor detects a displacement between the device and the floor or an installation fixed to the floor, or a displacement between the device and a peripheral device.
【０００７】[0007]
［実施形態１］図１は本発明の第１の実施形態に係る露
光装置を示し、本発明の特徴を最もよく表す図面であ
る。同図において、１は露光装置本体、２はマウント、
３ａは露光装置本体１上に設置され、露光装置本体１の
振動を検知する加速度センサ、６は加速度センサ３ａの
出力に基づいて装置を停止すべき旨の停止信号を出力す
る停止制御部、７は露光装置本体１を制御する本体制御
部、８は本体制御部７の一部であって、露光装置の露光
シーケンスや位置合せシーケンスなどのシーケンスを制
御するシーケンス制御部、９はレチクル交換装置やコー
ターデベロッパなどの周辺装置、９ａはその制御部であ
る。[Embodiment 1] FIG. 1 shows an exposure apparatus according to a first embodiment of the present invention, and is a drawing that best represents the features of the present invention. In the figure, 1 is an exposure apparatus main body, 2 is a mount,
Reference numeral 3a denotes an acceleration sensor installed on the exposure apparatus main body 1 for detecting the vibration of the exposure apparatus main body 1, 6 denotes a stop control unit for outputting a stop signal indicating that the apparatus should be stopped based on the output of the acceleration sensor 3a, 7 Is a main body control unit for controlling the exposure apparatus main body 1, 8 is a part of the main body control unit 7, and is a sequence control unit for controlling sequences such as an exposure sequence and a positioning sequence of the exposure apparatus, 9 is a reticle exchange apparatus, A peripheral device such as a coater / developer, 9a is a control unit thereof.
【０００８】上記構成において、露光装置本体１の振動
は、加速度センサ３ａにより検知され、その出力が停止
制御部６に入力されている。ここで、露光装置自身の駆
動系の異常による過大な振動や、地震などによる過大な
床振動によって露光装置本体１が異常に振動するなどし
て、加速度センサ３ａからの出力が一定値を越えたと
き、停止制御部６はシーケンス制御部８に停止信号を出
力する。停止制御部６からの停止信号を受け取ると、シ
ーケンス制御部８は露光装置本体１に対して停止制御を
行ない、その動作を停止させる。これと同時に停止制御
部６は、周辺装置９の制御部９ａに対しても停止信号を
出力する。In the above structure, the vibration of the exposure apparatus main body 1 is detected by the acceleration sensor 3a, and its output is input to the stop control unit 6. Here, the exposure apparatus main body 1 abnormally vibrates due to excessive vibration due to an abnormality in the drive system of the exposure apparatus itself, excessive floor vibration due to an earthquake, etc., and the output from the acceleration sensor 3a exceeds a certain value. At this time, the stop control unit 6 outputs a stop signal to the sequence control unit 8. Upon receiving the stop signal from the stop control unit 6, the sequence control unit 8 performs stop control on the exposure apparatus main body 1 to stop its operation. At the same time, the stop control unit 6 also outputs a stop signal to the control unit 9a of the peripheral device 9.
【０００９】［実施形態２］図２は本発明の第２の実施
形態を示す。各部の構成および動作は第１の実施形態と
同様であるが、加速度センサ３ａの代わりに加速度セン
サ３ｂが床に設置されている。この場合は、主に地震な
どによる異常な床振動を検知して、露光装置の動作を停
止するようにしている。[Second Embodiment] FIG. 2 shows a second embodiment of the present invention. The configuration and operation of each unit are the same as in the first embodiment, but an acceleration sensor 3b is installed on the floor instead of the acceleration sensor 3a. In this case, the operation of the exposure apparatus is stopped mainly by detecting an abnormal floor vibration due to an earthquake or the like.
【００１０】［実施形態３］図３は本発明の第３の実施
形態を示す。同図において、１は露光装置本体、２はマ
ウント、５ａはセンサターゲット、４ａは露光装置本体
１上に設置され、センサターゲット５ａに対する露光装
置本体１の変位を計測するためのセンサヘッド、１０は
床に設置され、センサターゲット５ａを支持する支持
台、６は変位センサのセンサヘッド４ａの出力に基づい
て装置を停止する旨の停止信号に変換する停止制御部、
７は露光装置本体１を制御する本体制御部、８は本体制
御部７の一部であり、露光装置の露光シーケンスや位置
合せシーケンスなどのシーケンスを制御するシーケンス
制御部、９はレチクル交換装置やコーターデベロッパな
どの周辺装置、９ａはその制御部である。[Third Embodiment] FIG. 3 shows a third embodiment of the present invention. In the figure, 1 is an exposure apparatus main body, 2 is a mount, 5a is a sensor target, 4a is installed on the exposure apparatus main body 1, and a sensor head 10 for measuring the displacement of the exposure apparatus main body 1 with respect to the sensor target 5a is shown. A support table installed on the floor for supporting the sensor target 5a, a stop control unit 6 for converting into a stop signal for stopping the apparatus based on the output of the sensor head 4a of the displacement sensor,
Reference numeral 7 is a main body control unit that controls the exposure apparatus main body 1, 8 is a part of the main body control unit 7, and a sequence control unit that controls a sequence such as an exposure sequence and a positioning sequence of the exposure apparatus, 9 is a reticle exchange apparatus, A peripheral device such as a coater / developer, 9a is a control unit thereof.
【００１１】上記構成において、露光装置本体１に設置
された変位センサのセンサヘッド４ａと床に設置された
支持台１０上のセンサターゲット５ａ間の変位が検出さ
れ、その出力が停止制御部６に入力されいる。ここで、
地震などによる過大な床振動によって露光装置本体１が
異常に振動して前記変位が大きくなると、すなわち変位
センサのセンサヘッド４ａからの出力が一定値を越える
と、停止制御部６はシーケンス制御部８に停止信号を出
力する。停止制御部６から停止信号が出力されると、シ
ーケンス制御部８は露光装置本体１に対して停止制御を
行ない、その動作を停止させる。これと同時に停止制御
部６は、周辺装置９の制御部９ａに対しても停止信号を
出力する。In the above structure, the displacement between the sensor head 4a of the displacement sensor installed in the exposure apparatus main body 1 and the sensor target 5a on the support table 10 installed on the floor is detected, and the output is sent to the stop control unit 6. Has been entered. here,
When the exposure apparatus main body 1 abnormally vibrates due to an excessive floor vibration due to an earthquake or the like and the displacement becomes large, that is, when the output from the sensor head 4a of the displacement sensor exceeds a certain value, the stop control unit 6 causes the sequence control unit 8 to operate. The stop signal is output to. When the stop signal is output from the stop controller 6, the sequence controller 8 controls the exposure apparatus main body 1 to stop the operation. At the same time, the stop control unit 6 also outputs a stop signal to the control unit 9a of the peripheral device 9.
【００１２】［実施形態４］図４は本発明の第４の実施
形態を示す。変位センサの配置を除き、各部の構成およ
び動作は第３の実施形態と同様である。変位センサは露
光装置本体１に設置されたセンサヘッド４ｂと、周辺装
置９上のセンサターゲット５ｂを有し、センサヘッド４
ｂによりセンサヘッド４ｂとセンサターゲット５ｂとの
間の変位を計測するようになっている。この場合は、露
光装置の異常振動や地震などによって露光装置本体１各
部と周辺装置９間に変位が発生することを検知して、露
光装置の動作を停止するようにしている。[Fourth Embodiment] FIG. 4 shows a fourth embodiment of the present invention. The configuration and operation of each unit are the same as those in the third embodiment except the placement of the displacement sensor. The displacement sensor has a sensor head 4b installed on the exposure apparatus main body 1 and a sensor target 5b on the peripheral device 9.
With b, the displacement between the sensor head 4b and the sensor target 5b is measured. In this case, the operation of the exposure apparatus is stopped by detecting that a displacement occurs between each part of the exposure apparatus main body 1 and the peripheral device 9 due to an abnormal vibration of the exposure apparatus or an earthquake.
【００１３】[0013]
【発明の効果】以上説明したように、本発明によれば、
装置の異常や地震などによる異常な振動が発生した場合
において、その振動を検知し、その検知出力に基づいて
停止信号を出力するようにしたため、この停止信号に基
づいて装置や周辺装置の動作を停止させることができ
る。したがって、位置合せ性能、焼付け性能、露光性能
などの劣化を防止することができる。また、異常振動に
よる露光装置各部と周辺装置との干渉を未然に防止する
ことができる。As described above, according to the present invention,
When abnormal vibration occurs due to device abnormality or earthquake, the vibration is detected and a stop signal is output based on the detection output.Therefore, the operation of the device and peripheral devices can be performed based on this stop signal. It can be stopped. Therefore, it is possible to prevent deterioration of alignment performance, printing performance, exposure performance, and the like. Further, it is possible to prevent interference between each part of the exposure apparatus and peripheral devices due to abnormal vibration.
【図１】 本発明の第１の実施形態に係る露光装置を示
すブロック図である。FIG. 1 is a block diagram showing an exposure apparatus according to a first embodiment of the present invention.
【図２】 本発明の第２の実施形態に係る露光装置を示
すブロック図である。FIG. 2 is a block diagram showing an exposure apparatus according to a second embodiment of the present invention.
【図３】 本発明の第３の実施形態に係る露光装置を示
すブロック図である。FIG. 3 is a block diagram showing an exposure apparatus according to a third embodiment of the present invention.
【図４】 本発明の第４の実施形態に係る露光装置を示
すブロック図である。FIG. 4 is a block diagram showing an exposure apparatus according to a fourth embodiment of the present invention.
１：露光装置本体、２：マウント、３ａ，３ｂ：加速度
センサ、４ａ，４ｂ：変位センサのセンサヘッド、５
ａ，５ｂ：センサターゲット、６：停止制御部、７：本
体制御部、８：シーケンス制御部、９：周辺装置、９
ａ：周辺装置の制御部、１０：支持台。1: exposure apparatus main body, 2: mount, 3a, 3b: acceleration sensor, 4a, 4b: sensor head of displacement sensor, 5
a, 5b: sensor target, 6: stop control unit, 7: main body control unit, 8: sequence control unit, 9: peripheral device, 9
a: control unit of peripheral device, 10: support base.
Claims (9)
この検知手段の出力に基づいて装置を停止させるべき旨
の停止信号を出力する停止制御手段と具備することを特
徴とする半導体製造装置。1. A detection means for detecting vibration of each part of the apparatus,
A semiconductor manufacturing apparatus, comprising: stop control means for outputting a stop signal indicating that the apparatus should be stopped based on the output of the detection means.
ンス制御手段を有し、このシーケンス制御手段は、前記
停止信号に応じて装置の動作を停止させるものであるこ
とを特徴とする請求項１記載の半導体製造装置。2. The apparatus according to claim 1, further comprising sequence control means for controlling an operation sequence of the device, the sequence control means stopping the operation of the device in response to the stop signal. Semiconductor manufacturing equipment.
停止制御手段は、前記周辺装置に前記停止信号を出力す
るものであることを特徴とする請求項１記載の半導体製
造装置。3. The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor device can be connected to various peripheral devices, and the stop control means outputs the stop signal to the peripheral device.
とを特徴とする請求項１〜３記載の半導体製造装置。4. The semiconductor manufacturing apparatus according to claim 1, wherein the detection means is an acceleration detector.
ていることを特徴とする請求項４記載の半導体製造装
置。5. The semiconductor manufacturing apparatus according to claim 4, wherein the acceleration detector is installed inside the apparatus.
いることを特徴とする請求項４記載の半導体製造装置。6. The semiconductor manufacturing apparatus according to claim 4, wherein the acceleration detector is installed outside the apparatus.
を特徴とする請求項１〜３記載の半導体製造装置。7. The semiconductor manufacturing apparatus according to claim 1, wherein the detection means is a displacement sensor.
に固定された設置物との変位を検知するものであること
を特徴とする請求項７記載の半導体製造装置。8. The semiconductor manufacturing apparatus according to claim 7, wherein the displacement sensor detects a displacement between the apparatus and a floor or an installation fixed to the floor.
との間の変位を検知するものであることを特徴とする請
求項７記載の半導体製造装置。9. The semiconductor manufacturing apparatus according to claim 7, wherein the displacement sensor detects a displacement between a device and the peripheral device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8067467A JPH09237757A (en) | 1996-02-29 | 1996-02-29 | Semiconductor producing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8067467A JPH09237757A (en) | 1996-02-29 | 1996-02-29 | Semiconductor producing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09237757A true JPH09237757A (en) | 1997-09-09 |
Family
ID=13345798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8067467A Pending JPH09237757A (en) | 1996-02-29 | 1996-02-29 | Semiconductor producing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09237757A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008192941A (en) * | 2007-02-07 | 2008-08-21 | Canon Inc | Processor |
| JP2009152549A (en) * | 2007-11-30 | 2009-07-09 | Tokyo Electron Ltd | Method for reducing expansion of earthquake damage and system for reducing expansion of earthquake damage for use in semiconductor manufacturing apparatus |
| DE112009001777T5 (en) | 2008-07-24 | 2011-05-26 | ULVAC, Inc., Chigasaki-shi | Operating monitoring system for processing device |
| JP2014022739A (en) * | 2012-07-17 | 2014-02-03 | Carl Zeiss Smt Gmbh | Lithography apparatus and method |
| JP2019209466A (en) * | 2018-06-08 | 2019-12-12 | Dmg森精機株式会社 | Measurement system, method and program |
| JP2020163490A (en) * | 2019-03-28 | 2020-10-08 | ブラザー工業株式会社 | Machine tool, information processing method, and computer program |
-
1996
- 1996-02-29 JP JP8067467A patent/JPH09237757A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008192941A (en) * | 2007-02-07 | 2008-08-21 | Canon Inc | Processor |
| JP2009152549A (en) * | 2007-11-30 | 2009-07-09 | Tokyo Electron Ltd | Method for reducing expansion of earthquake damage and system for reducing expansion of earthquake damage for use in semiconductor manufacturing apparatus |
| DE112009001777T5 (en) | 2008-07-24 | 2011-05-26 | ULVAC, Inc., Chigasaki-shi | Operating monitoring system for processing device |
| JP5373793B2 (en) * | 2008-07-24 | 2013-12-18 | 株式会社アルバック | Operation monitoring system for processing equipment |
| US8688246B2 (en) | 2008-07-24 | 2014-04-01 | Ulvac, Inc. | Operation monitoring system for processing apparatus |
| JP2014022739A (en) * | 2012-07-17 | 2014-02-03 | Carl Zeiss Smt Gmbh | Lithography apparatus and method |
| JP2014232889A (en) * | 2012-07-17 | 2014-12-11 | カール・ツァイス・エスエムティー・ゲーエムベーハー | Lithography device and method |
| JP2019209466A (en) * | 2018-06-08 | 2019-12-12 | Dmg森精機株式会社 | Measurement system, method and program |
| JP2020163490A (en) * | 2019-03-28 | 2020-10-08 | ブラザー工業株式会社 | Machine tool, information processing method, and computer program |
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