TWI719762B - Film forming device - Google Patents

Abstract

The present invention provides a film forming device with excellent cooling efficiency of a workpiece. The film forming apparatus has: a carry-in and carry-out part (100) that allows the workpiece (W) to go in and out of the chamber (2); a rotating body (3), which is arranged inside the chamber (2), and is transported and mounted by rotating There is a base (S) for the workpiece (W); a plurality of processing parts (PR) are arranged along the circumference with the rotation axis of the rotating body (3) as the center, and have an opening ( ОP) to process the workpiece (W) that has been introduced from the opening (ОP); and the pusher (500) to disengage from the rotating body (3) toward the workpiece (W) and be introduced into the processing section from the opening (ОP) The direction in (PR) applies force to the susceptor (S); the plurality of processing sections (PR) include a heating section (200) for heating the workpiece (W), and a film forming section ( 300), and a cooling part (400) for cooling the workpiece (W). The rotating body (3) is provided with a holding part (33), and the holding part (33) holds the base on which the rotating body (3) is being transported. (S), and the base (S) is released by applying force by the pusher (500). The pusher (500) is provided with a sealing part (520), and the sealing part (520) introduces the workpiece (W) Treat the part (PR) and seal the opening (ОP).

Description

Film forming device

The present invention relates to a film forming device.

As an apparatus for forming a film on the surface of a workpiece such as a substrate, a film forming apparatus by sputtering is widely used. Sputtering is a technique in which ions generated by plasmaizing gas introduced into a chamber collide with the plane of a target as a film-forming material, whereby the film-forming material scatters and adheres to the workpiece.

In some cases, a degassing treatment to remove moisture or air contained in the workpiece is carried out before film formation on the surface of the workpiece. This is effective for oxidation resistance when, for example, a ceramic substrate that easily contains air or moisture is used as a workpiece, and when a material that is easily oxidized, such as a metal film of copper, titanium, and tungsten, is used as a workpiece.

The degassing treatment is performed by raising the temperature of the workpiece to approximately 300 degrees. However, after the degassing treatment, if, for example, the temperature condition changes during the formation of a multilayer film including a plurality of layers using a plurality of film forming materials, the internal stress of the multilayer film will fluctuate. Therefore, the film formation of each layer must be performed under the same temperature conditions as much as possible, and the temperature conditions should be kept unchanged after the degassing treatment.

The workpiece is transported by being placed on a susceptor via a receiving plate, and the susceptor is placed on a rotating table that rotates intermittently. That is, at the stop position of the turntable that performs intermittent rotation, a heating chamber for performing degassing treatment and a film forming chamber for performing film formation using each film forming material are arranged. In addition, after the workpiece is brought to the heating chamber by the intermittent rotation of the turntable and subjected to degassing treatment, the film forming process is sequentially performed in the film forming chamber.

These processing chambers, such as a heating chamber and a film forming chamber, are installed in a vacuum chamber, and the processing chambers are transported in a vacuum. Therefore, the workpiece and the susceptor that have been heated to about 300°C during the degassing process are not cooled, and are maintained at about 300°C. Therefore, if the film is directly carried out into the air space after the film forming process is completed, the film formed on the high-temperature workpiece will be oxidized. Therefore, the workpiece must be cooled before being transported into the atmosphere. For example, the temperature of the workpiece that has been raised to about 300°C is lowered to about 60°C, which is the temperature required for carrying it out into the air space.

As a cooling mechanism for cooling the workpiece, there is a mechanism in which the workpiece is housed in a cooling chamber and sealed, and a cooling medium is circulated in the cooling chamber to perform cooling (see Patent Document 1). In this mechanism, the susceptor is placed on a rotating table for transportation, and at a stop position corresponding to the processing chamber, the susceptor is pushed up by a pusher mechanism with a pusher, and the processing is carried out by the susceptor. The chamber is sealed.

In the cooling chamber including the cooling mechanism, the upper cover is also provided with a cooling plate for circulating the cooling medium, so that the workpiece that has been pushed up together with the base by the pusher faces the cooling plate, and the cooling medium is introduced into the sealed by the base. In the cooling chamber, the substrate is cooled by this. [Prior Art Literature]

[Patent Literature] [Patent Document 1] Japanese Patent No. 4653418

[The problem to be solved by the invention] Here, when the temperature of the substrate that has been raised to about 300°C is lowered to about 60°C, which is required to be carried out into the atmosphere, it is necessary to perform a drastically lowered cooling of about 240°C. However, for example, when continuous conveyance is performed in order to perform a series of processing at approximately 240 seconds per tick, if the cooling time is longer than this, the cooling processing becomes speed-limited processing, and the processing amount is affected.

However, since cooling is performed in a vacuum, cooling using only the cooling plate is not sufficient. In order to improve cooling efficiency, cooling gas must be supplied to the cooling chamber. If the cooling gas is introduced, the pressure in the cooling chamber becomes higher.

On the other hand, the chamber provided with the rotating table maintains a vacuum. Therefore, the base that separates the cooling chamber from the space of the chamber needs to be strong enough to withstand the pressure difference between the chamber and the cooling chamber. For example, the base is formed of a thick plate made of metal such as copper. Therefore, the heat capacity of the susceptor becomes larger. Such a susceptor is continuously heated following the workpiece. Therefore, when the workpiece is cooled in the cooling chamber, the susceptor with a large heat capacity must also be cooled, and the cooling efficiency is not good.

The present invention was proposed in order to solve the problems of the prior art as described above, and its object is to provide a film forming apparatus with excellent cooling efficiency of a workpiece. [Technical means to solve the problem]

In order to achieve the above-mentioned object, the film forming apparatus of the embodiment includes: a chamber, which can be exhausted to make the inside a vacuum; a rotating body, which is arranged inside the chamber, and rotates to transport the substrate on which the workpiece is mounted. A plurality of processing parts, arranged along the circumference with the rotation axis of the rotating body as the center, having an opening communicating with the chamber, and processing the workpiece that has been introduced from the opening; and A pusher that applies force to the susceptor in a direction in which the workpiece is separated from the rotating body and introduced into the processing part from the opening; the plurality of processing parts include heating for heating the workpiece Section, a film forming section for forming a film on the work, and a cooling section for cooling the work, a holding section is provided on the rotating body, and the holding section holds the base that is being transported by the rotating body. The base is released by applying force by the pusher, and a sealing part is provided on the pusher, and the sealing part guides the workpiece into the processing part and seals the opening. [Effects of the invention]

According to the present invention, it is possible to provide a film forming apparatus excellent in cooling efficiency of a workpiece.

An embodiment of the present invention (hereinafter referred to as this embodiment) will be described in detail with reference to the drawings. [summary] As shown in the plan view of Fig. 1 and Figs. 2(A) and 2(B) (cross-sectional view taken along line AA in Fig. 1), the film forming apparatus 1 of the present embodiment is an apparatus for forming a film on each workpiece W using plasma . The film forming apparatus 1 has a chamber 2 and a rotating body 3 which is arranged inside the chamber 2 and transports the workpiece W mounted on the base S. The chamber 2 is provided with a plurality of treatment parts PR, the plurality of treatment parts PR are arranged along the circumference with the rotation axis of the rotating body 3 as the center, and have an opening ОP communicating with the inside of the chamber 2. The workpiece W introduced through the opening ОP is processed. The plurality of processing units PR include a heating unit 200 that heats the work W, a film formation unit 300A that forms a film on the work W, a film formation unit 300B, a film formation unit 300C, and a cooling unit 400 that cools the work W.

In addition, the chamber 2 is provided with a pusher 500 that urges the susceptor S in a direction in which the workpiece W is introduced into the processing part PR via the opening ОP. The rotating body 3 is provided with a holding portion 33 that holds the base S that the rotating body 3 is transporting, and releases the base S by applying force by the pusher 500. The pusher 500 is provided with a sealing part 520 which accommodates the workpiece W in each processing part PR and seals the opening ОP. That is, each treatment part PR is not sealed by the base S, but each treatment part PR is hermetically sealed by the sealing part 520 that moves together with the pusher 500.

[Workpiece] In this embodiment, a flat ceramic substrate is used as an example of the workpiece W that is the target of film formation. The film forming apparatus 1 forms a circuit including a semiconductor and wiring on a ceramic substrate by forming a film. However, the type, shape, and material of the workpiece W are not limited to specific ones. For example, as the workpiece W, a curved substrate having a concave portion or a convex portion in the center may also be used. In addition, those containing conductive materials such as metal and carbon, those containing insulators such as glass or rubber, and those containing semiconductors such as silicon may be used as the workpiece W.

[Base] The base S is a member that mounts the workpiece W and is transported by the rotating body 3. As shown in the plan view of FIG. 3(A), the side view of FIG. 3(B), and the bottom view of FIG. 3(C), the base S of this embodiment is a circular thin plate. A housing portion Sa is formed on the surface of the base S, and a plurality of workpieces W are mounted side by side in the housing portion Sa. The accommodating part Sa is a recessed part which can position a some workpiece|work W without overlapping. The number of workpieces W mounted on the susceptor S is the number of simultaneous film formation in each film formation section 300. In the present embodiment, the accommodating portion Sa can place the workpieces W in three rows and three columns, so that a total of nine workpieces W can be film-formed at the same time. However, the number is not limited to a specific number. On the back surface of the base S, a leg part Sb protruding in a ring shape is formed. In addition, the susceptor S does not have the strength to withstand the air pressure difference between the sealed processing part PR and the chamber 2.

[Chamber] As shown in FIGS. 1 and 2(A) and 2(B), the chamber 2 is a container that can make the inside a vacuum. The chamber 2 of the present embodiment has a rectangular parallelepiped shape, and the installation surface side becomes a box-shaped housing body 21, and the opposite side becomes a flat plate-shaped cover body 22 that seals the opening of the housing body 21. A chamber exhaust part 23 is provided in the chamber 2. The chamber exhaust portion 23 of the present embodiment has a pipe connected to the opening formed in the container 21. The chamber exhaust unit 23 is configured to include a pneumatic circuit not shown, and can perform decompression in the chamber 2 by exhaust treatment.

[Rotating body] As shown in FIG. 4, the rotating body 3 is a rotating table which holds the base S on which the workpiece|work W is mounted, and rotates a predetermined angle every time. The rotating body 3 of this embodiment is a circular plate-shaped body. The rotating body 3 is intermittently rotated around the transmission shaft 31 by a drive source not shown (refer to FIGS. 2(A) and 2(B)). The rotating body 3 is provided with a gap portion 32 through which the sealing portion 520 passes in a direction crossing the rotation plane. The gap portion 32 is a portion in which the edge portion of the rotating body 3 is cut into a partial circular shape at a circumferential equidistant position. As shown in FIG. 1, the void portion 32 corresponds to a plurality of processing portions PR, namely, the carry-in/unload portion 100, the heating portion 200, the film forming portion 300A, the film forming portion 300B, the film forming portion 300C, and the cooling portion 400, and are spaced at 60° intervals. There are six settings. The size of the inner edge of the gap portion 32 is formed in such a way that the sealing portion 520 can pass through. For example, the diameter of the partial circle parallel to the rotation plane is larger than the diameter of the sealing portion 520.

[Holding Department] As shown in FIGS. 5(A) to 5(D), during the process of the sealing portion 520 passing through the gap portion 32, the holding portion 33 is switched between the holding state of holding the base S and the releasing state of releasing the base S. The pair of holding portions 33 are arranged at positions facing the conveying direction of the gap portion 32. The holding part 33 has a base 331, a conversion part 332, an arm 333, and an urging member 334.

The base 331 is a plate-shaped member attached to the inner edge of the cavity 32. The conversion part 332 is a pair of members rotatably mounted on the base 331 and converts the movement of the sealing part 520 into rotation in a direction parallel to the rotation plane of the rotating body 3. The pair of conversion parts 332 are juxtaposed in a direction orthogonal to the rotation direction of the rotating body 3. The conversion portion 332 is provided with a roller 332a that is biased in a direction away from the edge portion of the base S by a protrusion 523 provided in the sealing portion 520, which will be described later. The rollers 332a of the pair of conversion parts 332 are urged by the protruding part 523, whereby the shaft 332b is used as a rotation axis, and each conversion part 332 is rotated in the opposite direction.

The arms 333 are a pair of elongated plates, one end of which is fixed to the conversion part 332. The other end of the arm 333 extends toward the edge of the base S. A grip portion 333a is provided at the other end of the arm 333. The grip portion 333a grips the base S by contacting the edge of the base S, and releases the base S by separating from the edge of the base S. . The grip portion 333a has a contact surface 333b for contacting the end surface of the base S when the base S is gripped, and a holding surface 333c for contacting the back surface of the base S to place the base S on the arm 333 . The pair of arms 333 are configured to be rotatable together with the conversion portion 332 between the holding position where the grip portion 333 a grips the edge of the base S and the retreat position where the grip portion 333 a releases the base S. The state in which the grip portion 333a is located at the holding position is the holding state, and the state in which the grip portion 333a is located at the retracted position is the released state.

The urging member 334 is a member that urges the conversion portion 332 in a direction in which the grip portion 333a contacts the edge portion of the base S. The urging member 334 may be a spring provided between the base 331 and the conversion part 332. For example, in this embodiment, as the urging member 334, a tension coil spring is used. The urging member 334 is erected between the plate 334 a and the plate 334 b, the plate 334 a is fixed to the base 331, and the plate 334 b floats from the base 331 and is fixed to the conversion part 332.

The pair of arms 333 are held at the holding position where the grip 333 a grips the edge of the base S by the force applied by the urging member 334. At each stop position corresponding to the treatment portion PR, the roller 332a is urged by the protrusion 523, and the arm 333 rotates together with the conversion portion 332, whereby the grip portion 333a moves to the retracted position where the base S is released. When the urging force of the protruding portion 523 on the roller 332a is released, the arm 333 returns to the holding position where the holding portion 333a grasps the edge of the base S by the force applied by the urging member 334. When the arm 333 is in the retracted position, the sealing portion 520 can pass through. That is, the grip portion 333a of the arm 333 located at the retracted position becomes a position where the contact diameter is larger than the maximum diameter of the sealing portion 520 including the protrusion 523 in a virtual circle.

[Pusher] As shown in Figure 2 (A) and Figure 2 (B), Figure 9 and Figure 10 (A) and Figure 10 (B) (the BB line cross-sectional view of Figure 1), corresponding to the loading and unloading unit 100, heating unit 200, The film forming section 300A, the film forming section 300B, the film forming section 300C, and the cooling section 400 are provided with pushers 500A to 500F, respectively. Hereinafter, when the pusher 500A to the pusher 500F are not distinguished, they will be described as the pusher 500.

The pusher 500 has a transmission shaft 510 and a sealing part 520. As shown in FIG. 2(A) and FIG. 2(B), the transmission shaft 510 is a cylindrical member, and is moved along the shaft by a drive source not shown. As the driving source, for example, an air cylinder, a motor, or the like can be used.

The sealing portion 520 is a member that is provided at the front end of the transmission shaft 510 and is in contact with/separated from the opening OP. As shown in FIG. 6, the sealing part 520 is a cylindrical member coaxial with the transmission shaft 510. The sealing part 520 has a mounting table 521, a sealing body 522 and a protruding part 523. The mounting table 521 is a cylindrical portion that is provided on the side facing the rotating body 3 and urges the base S toward the opening OP. The surface of the mounting table 521 facing the base S is a mounting surface 521a having the same or slightly smaller diameter as the inner diameter of the foot Sb so as to be fitted into the inside of the foot Sb of the base S. The sealing body 522 is a cylindrical part that is coaxially supported by the transmission shaft 510 and has a larger diameter than the mounting table 521. The surface of the sealing body 522 facing the rotating body 3 becomes a sealing surface 522 a formed in a ring shape around the mounting table 521. A sealing material 522b such as an O-ring is provided on the sealing surface 522a.

As shown in FIG. 9, the sealing surface 522a of the sealing body 522 contacts the end part of the opening OP, and each process part PR is sealed by this. The mounting table 521 has a diameter smaller than the opening ОP in order to mount the base S and to be housed in the processing part PR. The sealing surface 522a of the sealing body 522 has a diameter smaller than that of the gap 32 in order to pass through the gap 32, but has a larger diameter than the opening ОP in order to seal the opening ОP.

In this embodiment, the protruding portion 523 is a rectangular parallelepiped portion that bulges from the outer periphery of the sealing body 522 and extends in the axial direction of the transmission shaft 510. The end surface of the protruding portion 523 on the sealing surface 522a side becomes an inclined surface 523a. The inclined surface 523a is a flat surface that is inclined so that the length of the protruding portion 523 in the axial direction becomes shorter from the outer periphery of the sealing body 522 toward the outside. The outer peripheral surface 523b of the protruding portion 523 is a flat surface that is continuous with the inclined surface 523a and extends in the axial direction. As shown in FIG. 5(A) to FIG. 5(D), the inclined surface 523 a and the outer peripheral surface 523 b come into contact with/separate from the roller 332 a of the holding portion 33 along with the movement of the sealing portion 520 to rotate the arm 333. Therefore, a cam mechanism having the inclined surface 523a and the outer peripheral surface 523b as the driving cam and the roller 332a as the driven cam is configured.

As shown in FIGS. 7 and 8, when the sealing portion 520 moves toward the opening OP and the inclined surface 523a urges the roller 332a, as described above, the arm 333 rotates toward the retracted position, and therefore the base S is released. In addition, the placement surface 521a of the placement table 521 enters the inner side of the leg portion Sb of the base S. If the sealing part 520 penetrates the gap part 32, as shown in FIG. 9, the sealing surface 522a will contact the end part of the opening OP via the sealing material 522b, and will seal. That is, the sealing part 520 opens and closes the opening OP of the treatment part PR in accordance with the movement of the pusher 500. In addition, although the holding part 33 of FIGS. 7-11(B) abbreviate|omits some members, such as a urging member, it has the same structure as FIG. 5(A) to FIG. 5(D).

The sealing parts 520 of the pusher 500A to the pusher 500F seal the openings OP of the respective chambers of the carry-in/out part 100, the heating part 200, the film forming part 300A to the film forming part 300C, and the cooling part 400, respectively. Here, the pressure difference between the load-lock chamber 121 constituting the load-in/out unit 100 described later and the atmospheric pressure inside and outside the vacuum chamber 2 becomes large. In addition, the cooling chamber 410 constituting the cooling unit 400 becomes a pressure of 1000 Pa which is substantially close to the atmospheric pressure to less than the atmospheric pressure when the cooling gas is introduced, and the pressure difference with the vacuum chamber 2 becomes large. Therefore, the sealing portion 520 becomes strong enough to withstand such a pressure difference.

[Move in and out department] As shown in Figures 2(A) and 2(B), while maintaining the vacuum inside the chamber 2, the carry-in and carry-out unit 100 is moved from the outside to the chamber 2 via the transport unit 110 and the load lock chamber 121 The unprocessed work W is carried in inside, and the processed work W is carried out to the outside of the chamber 2.

As shown in FIGS. 1 and 2(A) and 2(B), the conveying unit 110 picks up the unprocessed workpiece W from a conveying mechanism TR such as a conveyor that conveys the base S on which the workpiece W is mounted from the previous step to the latter step. , And delivered to the load lock chamber 121 described later. In addition, the transport unit 110 receives the processed workpiece W from the load lock chamber 121 and delivers it to the transport mechanism TR.

The conveying unit 110 has an arm 111 and a holding body 112. The arm 111 is a long member provided in a direction parallel to the plane of the rotating body 3 between the transport mechanism TR and the chamber 2. The arm 111 is provided to be capable of intermittently rotating 180° at a time around an axis parallel to the rotation axis of the rotating body 3 by a drive mechanism not shown, and being movable along the axis.

The holding body 112 is a member that is provided at both ends of the arm 111 and holds the workpiece W. The holding body 112 uses a holding mechanism such as a vacuum chuck, an electrostatic chuck, and a mechanical chuck to hold the workpiece W. The holding body 112 also functions as a cover for opening and closing the load lock chamber 121. That is, a sealing material such as an O-ring for sealing the load lock chamber 121 is provided in the holding body 112. In addition, the transport mechanism TR is provided with a pusher, and the pusher is moved by a driving mechanism (not shown), whereby the base S on which the workpiece W is mounted is moved between the transport mechanism TR and the holding body 112.

The load lock chamber 121 can carry in and out of the susceptor S while maintaining the vacuum in the chamber 2. The load lock chamber 121 is a space that is enclosed by the inner surface of the through hole formed in the lid 22 of the chamber 2 and accommodates the workpiece W held by the holder 112 and can be sealed. In the load lock chamber 121, the end portion on the outer side of the chamber 2 has an opening 121 a and is sealed by the holder 112. In addition, in the load lock chamber 121, the inner end of the chamber 2 is an opening 121b. The opening 121b corresponds to the opening OP sealed by the sealing portion 520.

In addition, although not shown, the load lock chamber 121 is provided with an exhaust pipe and a vent pipe. The exhaust pipe is connected to a pneumatic circuit and is used to depressurize the sealed load lock chamber 121. , The vent pipe is connected with a valve and the like, and is used for vacuum destruction of the load lock chamber 121.

[Heating Department] As shown in FIG. 10(A) and FIG. 10(B) (cross-sectional view taken along the line B-B in FIG. 1 ), the heating unit 200 performs a degassing process for exhausting moisture or air contained in the work W by heating. The heating unit 200 has a heating chamber 210 and a heater 220. The heating chamber 210 is an internal space of a container having an opening 210a facing the inside of the chamber 2. As described above, the end of the opening 210a is sealed by the sealing surface 522a of the sealing body 522, and the workpiece W placed on the base S is accommodated in the heating chamber 210 (the state of FIG. 10(B)). The opening 210a corresponds to the opening OP sealed by the sealing portion 520.

The heater 220 is a device in which a heating element that generates heat by energization is built into the following member in the shape of a circular plate arranged in a direction parallel to the rotation plane of the rotating body 3 inside the heating chamber 210的Components. In order to uniformly heat the workpiece W, the diameter of the heater 220 is preferably equal to or slightly larger than the workpiece W. The heater 220 faces the workpiece W stored in the heating chamber 210 without contacting it. In addition, although not shown, the heating element of the heater 220 is connected to a power source that generates heat by applying electric power. Considering that the workpiece W is a ceramic substrate, in order to effectively perform the degassing treatment, it is preferable to set the heating temperature of the heater 220 to about 300° C., but it is not limited to this.

[Film Formation Department] The film forming section 300A, the film forming section 300B, and the film forming section 300C form a film on the workpiece W by sputtering. In the following description, when the film-forming part 300A, the film-forming part 300B, and the film-forming part 300C are not distinguished, they will be described as the film-forming part 300. As shown in Fig. 2(A) and Fig. 2(B), Fig. 10(A) and Fig. 10(B) and Fig. 11(A) and Fig. 11(B) (the cross-sectional view of line CC in Fig. 1), the film is formed The part 300 has a film forming chamber 310 and a target 320. The film forming chamber 310 is the internal space of the container having an opening 310a facing the inside of the chamber 2. As described above, the end of the opening 310a is sealed by the sealing surface 522a of the sealing body 522, and the workpiece W placed on the base S is It is housed in the film formation chamber 310 (the state of FIG. 10(B)).

The target 320 is a member formed of a film-forming material that is deposited on the workpiece W by sputtering and becomes a film. The target 320 is held by a support plate (not shown), and is connected to a power source via electrodes. As the film-forming material, for example, silicon, niobium, tantalum, titanium, aluminum, etc. are used. However, as long as it is a material that forms a film by sputtering, various materials can be applied. In this embodiment, the target 320 of different film forming materials is used for the film forming part 300A, the film forming part 300B, and the film forming part 300C, but the target 320 of the same film forming material may be used.

In addition, although not shown, the film forming section 300 is provided with a sputtering gas introduction section for introducing the sputtering gas into the film forming chamber 310 and an exhaust section for exhausting the sputtering gas. As the sputtering gas, for example, an inert gas such as argon gas can be used. The sputtering gas introduction unit is configured to include a gas supply circuit, and can introduce the sputtering gas from the supply source into the film forming chamber 310. The exhaust part is constituted by including a pneumatic circuit, and can perform decompression in the film formation chamber 310 by exhaust treatment. In the film forming section 300, power is applied to the target 320 by a power source, whereby the sputtering gas introduced into the film forming chamber 310 can be plasma-ized, and the film forming material can be deposited on the workpiece W.

[Cooling Department] The cooling unit 400 cools the workpiece W before being discharged into the atmosphere to a temperature that can prevent the film from being oxidized in the atmosphere. As shown in FIGS. 7, 11 (A), and 11 (B), the cooling unit 400 includes a cooling chamber 410 and a first cooling mechanism 420. The cooling chamber 410 is an internal space of a container having an opening 410a facing the inside of the chamber 2. As described above, the end of the opening 410a is sealed by the sealing surface 522a of the sealing body 522, and the workpiece W placed on the base S is accommodated in the cooling chamber 410. The opening 410a corresponds to the opening OP sealed by the sealing portion 520.

The first cooling mechanism 420 has a cooler 421 and a cooling gas introduction part 422. The cooler 421 is a device in which the cooling liquid circulation pipe 423 is built in the following member, which is a disk-shaped member arranged in the cooling chamber 410 in a direction parallel to the rotation plane of the rotating body 3 . The cooling liquid circulation pipe 423 is formed inside the cooler 421 and includes a spiral part coaxial with the cooler 421, and a passage through which the cooling liquid can circulate. The cooling liquid circulation pipe 423 is connected to a cooling liquid supply source not shown, and is connected to a pipe that circulates and supplies the cooling liquid into the cooling liquid flow path.

The cooling gas introduction part 422 has a piping into which the cooling gas G is introduced. For example, an inert gas such as nitrogen can be used as the cooling gas G. In particular, if it is made of high-purity nitrogen that does not contain moisture, it is possible to prevent the oxidation of the film that has been formed. The cooling gas introduction part 422 is configured to include a gas supply circuit not shown, and can introduce the cooling gas G from the supply source into the cooling chamber 410.

In addition, the sealing part 520 provided in the pusher 500F corresponding to the cooling part 400 functions as the second cooling mechanism 430. The second cooling mechanism 430 has a cooling liquid circulation pipe 431 and a cooling liquid supply part 432. The cooling liquid circulation duct 431 is formed inside the sealing portion 520 and including a spiral part coaxial with the sealing portion 520, and a passage through which the cooling liquid can circulate. The cooling liquid supply unit 432 has a pipe for introducing the cooling liquid. The cooling liquid supply unit 432 is connected to a cooling liquid supply source not shown, and circulates and supplies the cooling liquid into the cooling liquid circulation pipe 431.

As described above, in order to change the temperature to prevent the film formed from being oxidized when it has been carried out into the air space, the cooling temperature of the cooler 421 and the cooling gas G is preferably set to be about 60°C, but it is not limited. Here.

Furthermore, the cooling part 400 has a cooling chamber exhaust part 424 which adjusts the internal pressure of the cooling chamber 410. The cooling chamber exhaust portion 424 of the present embodiment has a pipe connected to the opening formed in the cooling chamber 410. The cooling chamber exhaust unit 424 is configured to include an unshown pneumatic circuit, and can perform decompression in the cooling chamber 410 by exhaust treatment. In addition, the cooling unit 400 is provided with a pressure sensor (not shown) that detects the internal pressure of the cooling chamber 410 and a temperature sensor (not shown) that detects the temperature in the cooling chamber 410. The pressure sensor constitutes a pressure monitor that monitors the internal pressure of the cooling chamber 410 together with the control device 70 and the output device 79 described later. The temperature sensor, the control device 70 and the output device 79 constitute a temperature monitor that monitors the temperature in the cooling chamber 410.

[Control device] As shown in FIG. 12, the control device 70 is a device that controls each part of the film forming apparatus 1. The control device 70 may include, for example, a dedicated electronic circuit, a computer that runs with a predetermined program, or the like. The control contents of the carry-in and carry-out section 100, the heating section 200, the film forming section 300A to the film forming section 300C, and the cooling section 400 are programmed through a programmable logic controller (Programmable Logic Controller, PLC) or a central processing unit (Central Processing Unit, CPU) and other processing devices to execute.

The control device 70 uses the above-mentioned program to function as shown in the block diagram of FIG. 12. That is, the control device 70 has a mechanism control unit 71, a heating control unit 72, a film formation control unit 73, a cooling control unit 74, a storage unit 75, a setting unit 76, and an input/output control unit 77.

The mechanism control unit 71 controls the drive source, valve, power source, etc. of each unit. The heating control unit 72 controls the power supply of the heater 220, thereby controlling the heating temperature. The film formation control unit 73 controls the power applied to the target 320 and the amount of sputtering gas introduced, thereby controlling the amount of film formation. The cooling control unit 74 controls the temperature of the cooling liquid of the first cooling mechanism 420 and the second cooling mechanism 430 and the supply amount of the cooling gas G, thereby controlling the cooling temperature. The storage unit 75 stores information necessary for the control of this embodiment. The setting unit 76 sets the information input from the outside in the storage unit 75. For example, the setting unit 76 sets the heating temperature of the heating unit 200 corresponding to the target temperature for heating, and the cooling temperature of the cooling unit 400 corresponding to the target temperature for cooling, to control a predetermined amount of exhaust gas from the cooling chamber 410 Temperature, prescribed pressure, prescribed time, etc.

The input/output control unit 77 is an interface that controls the conversion or input/output of signals with each unit to be controlled. Furthermore, the control device 70 is connected to the input device 78 and the output device 79. The input device 78 is an input component such as a switch, a touch screen, a keyboard, and a mouse for the operator to operate the film forming apparatus 1 via the control device 70.

The output device 79 is an output part such as a display, a lamp, a meter, and the like for confirming that the information of the state of the device becomes a state that can be recognized by the operator. For example, the output device 79 may display an input screen of information from the input device 78. For example, the pressure and temperature inside the cooling chamber 410 are displayed and the operator can monitor them.

[action] With reference to the drawings, the process of forming a film on the workpiece W using the film forming apparatus 1 of the present embodiment as described above will be described. In addition, each processing unit PR of the film forming apparatus 1 can simultaneously transport a plurality of pedestals S while simultaneously processing each workpiece W. However, in the following description, focus on those that have been placed on one pedestal S. The work W will be explained.

(Loading of workpieces) First, the operation of carrying the workpiece W to be subjected to the film forming process into the chamber 2 by the carry-in and carry-out unit 100 will be described. As shown in FIG. 2(A), the gap portion 32 of the rotating body 3 is positioned at a position opposite to the opening 121b of the carry-in and carry-out portion 100, and the opening is closed by the sealing body 522 of the sealing portion 520 that has been energized by the pusher 500A. 121b sealed. In addition, the inside of the chamber 2 is evacuated by the exhaust process of the pneumatic circuit.

In this state, as shown in FIG. 1, the base S carrying the unprocessed workpiece W transported by the transport mechanism TR is urged by a pusher (not shown) and held by the holder 112 of the transport unit 110. As the arm 111 rotates, the base S on which the unprocessed work W is mounted comes to a position facing the opening 121a. The arm 111 moves in a direction approaching the opening 121a, and the holding body 112 seals the opening 121b, thereby sealing the load lock chamber 121.

The pressure of the load lock chamber 121 is decompressed until the load lock chamber 121 becomes the same as the inside of the chamber 2 by exhausting air from the exhaust pipe through the pneumatic circuit. The holding body 112 releases the holding of the workpiece W, whereby the workpiece W is placed on the placing surface 521 a of the sealing portion 520 of the sealed load lock chamber 121. At this time, as shown in FIG. 5(C) and FIG. 5(D), the roller 332a is urged by the protrusion 523, and the grip portion 333a is located at the retracted position. And, as shown in FIG. 2(B), FIG. 5(A), and FIG. 5(B), the pusher 500A passes through the gap portion 32 of the rotating body 3, whereby the roller 332a is separated from the protrusion portion 523. Then, the arm 333 rotates, and the grip part 333a grips the base S on which the workpiece W is mounted.

(Heating of workpiece) Next, the process of heating the workpiece W that has been carried into the chamber 2 will be described. In the heating unit 200, the heater 220 is heated to a set temperature in advance. As shown in FIG. 10(A), the rotating body 3 performs intermittent rotation, whereby the susceptor S moves to just below the opening 210 a of the heating chamber 210 of the heating unit 200. Then, the pusher 500B is moved in a direction approaching the opening 210a. Then, the pusher 500B passes through the gap portion 32 of the rotating body 3, whereby the roller 332a is urged by the protrusion 523, the arm 333 rotates, the grip portion 333a is retracted from the base S, and the base S is placed on the carrier.置面521a. Furthermore, when the pusher 500B moves in a direction approaching the opening 210a, the sealing surface 522a of the sealing body 522 hermetically seals the end surface of the opening 210a. Thereby, as shown in FIG. 10(B), the workpiece W is housed in the heating chamber 210 together with the base S.

The work W faces the heater 220 at a position close to the heater 220, and therefore the work W is heated to the set temperature by the heated heater 220. After the workpiece W is heated, the pusher 500B is moved in a direction separating from the opening 210a, whereby the opening 210a is opened, and the workpiece W mounted on the susceptor S of the mounting surface 521a is discharged from the heating chamber 210. When the pusher 500B passes through the gap portion 32 of the rotating body 3, as described above, the arm 333 of the holding portion 33 rotates, the grip portion 333a grips the base S, and the placing surface 521a separates from the base S .

(Film forming process) A description will be given of the following processing: in the film forming section 300A, the film forming section 300B, and the film forming section 300C, a film is formed on the workpiece W that has been heat-treated as described above. In addition, since the processes of the film forming part 300A, the film forming part 300B, and the film forming part 300C are the same, the process of the film forming part 300A will be mainly described.

As shown in FIG. 11(A), by intermittently rotating the rotating body 3, the workpiece W is moved to a position facing the opening 310a of the film forming section 300A. Then, as described above, by moving the pusher 500C in a direction approaching the opening 310a, the workpiece W is moved into the film forming chamber 310 together with the base S. Then, as shown in FIG. 11(B), the sealing surface 522a of the sealing body 522 hermetically seals the end of the opening 310a. Thereby, the film forming chamber 310 is hermetically sealed.

In this state, the sputtering gas is introduced into the film forming chamber 310, and power is applied to the target 320 by the power supply. Then, the ions generated by the plasmaization of the sputtering gas collide with the target 320. The film-forming material constituting the target 320 is ejected by ions, and is deposited on the workpiece W.

After the film-forming material is deposited on the workpiece W, the sputtering gas is discharged from the film-forming chamber 310 and the pressure of the film-forming chamber 310 is made the same as that of the chamber 2. Then, when the pusher 500 is moved in the direction separating from the opening 310a, the opening 310a of the film formation chamber 310 is opened as described above, and the workpiece W is discharged from the film formation chamber 310 together with the susceptor S. Furthermore, when the pusher 500 moves, the base S is held by the holding portion 33, and the mounting surface 521a is separated from the base S.

By intermittently rotating the rotating body 3, as shown in FIG. 2(B), the workpiece W is moved together with the base S to just below the opening 310a of the film forming part 300B. Then, the same film forming process as described above is also performed in the film forming section 300B. After the film formation of the film formation section 300B, the rotating body 3 is intermittently rotated, whereby as shown in FIG. 10(A), the workpiece W is moved together with the base S to just below the opening 310 a of the film formation section 300C. Then, the same film-forming process as described above is also performed in the film-forming part 300C.

(Cooling of the workpiece) The process of cooling the workpiece W that has been subjected to the film formation process as described above will be described. In addition, the cooling liquid is circulated in the cooler 421 of the first cooling mechanism 420 in advance to be cooled to a set temperature. In addition, the cooling liquid is also circulated in the cooling liquid circulation pipe 431 of the second cooling mechanism 430 to be cooled to a set temperature.

As shown in FIGS. 7 and 11(A), the film-formed workpiece W is moved together with the susceptor S to just below the opening 410 a of the cooling chamber 410 of the cooling unit 400. As described above, as shown in FIG. 8, the pusher 500F is moved in the direction approaching the opening 410a, and as shown in FIGS. 9 and 11(B), the workpiece W is housed in the cooling chamber 410 together with the base S , And the end of the opening 410a is hermetically sealed by the sealing surface 522a of the sealing body 522. Thereby, the cooling chamber 410 is hermetically sealed.

In this state, the cooling gas G is introduced into the cooling chamber 410 through the cooling gas introduction part 422. At this time, the internal pressure of the cooling chamber 410 reaches a pressure of 1000 Pa which is approximately close to the atmospheric pressure to a pressure of less than the atmospheric pressure. Then, the work W placed on the base S is cooled at high speed by the cooler 421 and the cooling gas G of the first cooling mechanism 420, and the second cooling mechanism 430. When the temperature of the cooling chamber 410 detected by the temperature sensor reaches a predetermined temperature, the air in the cooling chamber 410 is exhausted by the cooling chamber exhaust unit 424. If the internal pressure of the cooling chamber 410 detected by the pressure sensor becomes the same pressure as that of the chamber 2, the exhaust of the cooling chamber exhaust unit 424 is stopped. Through this exhaust operation, the internal pressure of the cooling chamber 410 raised by introducing the cooling gas G into the sealed cooling chamber 410 returns to the same pressure as the chamber 2.

After that, if the pusher 500F is moved in the direction separating from the opening 410a, as described above, the opening 410a of the cooling chamber 410 is opened, the workpiece W is discharged from the cooling chamber 410, and the base S is held by the holding portion 33, As a result, the mounting surface 521a is separated from the base S.

(Move out the work piece) Furthermore, the operation of carrying out the work W cooled after film formation to the outside of the chamber 2 by the carrying-in and carrying-out unit 100 will be described. By intermittently rotating the rotating body 3, as shown in FIG. 2(B), the workpiece W is moved together with the base S to just below the opening 121 b of the load lock chamber 121.

As shown in FIG. 2(A), the pusher 500A is moved in a direction approaching the opening 121b, whereby the workpiece W and the base S are moved into the load lock chamber 121 together. Then, the sealing surface 522a of the sealing body 522 hermetically seals the end of the opening 121b. Thereby, the load lock chamber 121 is hermetically sealed. The base S on which the processed workpiece W is placed is held by the holder 112 that seals the opening 121 a of the load lock chamber 121. Then, vent gas is supplied through the vent pipe, thereby performing the vacuum break in the load lock chamber 121. The arm 111 is moved in the direction separating from the opening 121a, thereby moving the holding body 112, and opening the load lock chamber 121.

As shown in FIG. 1, the arm 111 rotates, whereby the holding body 112 holding the base S comes to a position facing the conveying mechanism TR, the pusher that has moved in the direction approaching the holding body 112 supports the base S, and The holding body 112 releases the holding of the base S. Then, after the pusher places the base S on the transport mechanism TR and retreats, the transport mechanism TR transports the processed work W toward the subsequent step.

[effect] The film forming apparatus 1 of this embodiment has: a chamber 2 that can be evacuated to make the inside a vacuum; and the carry-in/unload unit 100 keeps the workpiece W inside the chamber 2 while maintaining the vacuum in the chamber 2 In and out; the rotating body 3 is arranged inside the chamber 2 and is rotated to transport the base S on which the workpiece W is mounted; a plurality of processing parts PR are arranged along a circumference centered on the rotation axis of the rotating body 3, having The opening ОP communicating with the chamber 2 processes the workpiece W that has been introduced from the opening ОP; and the pusher 500 is directed toward the direction in which the workpiece W is detached from the rotating body 3 and introduced into the processing part PR from the opening ОP The base S applies force. Furthermore, the plurality of processing units PR include a heating unit 200 for heating the workpiece W, a film forming unit 300 for forming a film on the workpiece W, and a cooling unit 400 for cooling the workpiece W, and a holding unit 33 is provided on the rotating body 3 The holding part 33 holds the base S that the rotating body 3 is transporting, and releases the base S by applying a force by the pusher 500. The pusher 500 is provided with a sealing part 520 that holds the workpiece W The processing part PR is introduced, and the opening ОP is sealed.

In this embodiment, the sealing part 520 that seals the opening ОP becomes a different object from the susceptor S that moves with the workpiece W and is continuously heated in the heating chamber 210 or the film forming chamber 310, so there is no sealing part 520. When it is heated continuously and becomes high temperature. In addition, the base S is not required to have a strength that can withstand the pressure difference with the inside of the cooling part 400, and the thickness and material can be selected, so the heat capacity can be reduced. Therefore, the workpiece W of the cooling part 400 can be cooled efficiently in a short time. Therefore, the cooling processing speed is not limited, and the processing volume is increased.

The sealing part 520 has a second cooling mechanism 430 that cools the workpiece W. Therefore, the cooling part 400 can be used for cooling, and the second cooling mechanism 430 of the sealing part 520 can be used to cool the workpiece W from both the front surface and the back surface, so that the cooling can be performed at a high speed. Since the sealing part 520 is not conveyed by the rotating body 3 together with the work W, the second cooling mechanism 430 can be provided in a simple structure separate from the conveying mechanism using the base S of the rotating body 3.

The rotating body 3 is a circular plate-shaped body. The rotating body 3 is provided with a gap portion 32 through which the sealing portion 520 passes in a direction intersecting the rotation plane of the rotating body 3, and has a holding portion 33. In the process of the sealing portion 520 passing through the gap portion 32, the holding state of the holding base S and the released state of releasing the base S are switched. Therefore, the sealing part 520 fixed to the pusher 500 can be moved between the opening ОP side of the rotating body 3 and the opposite side, and the sealing and opening of the opening ОP can be switched, and the holding and releasing of the base S by the holding part 33 can be switched. . That is, the holding and releasing actions of the base S can be easily performed mechanically in synchronization with the sealing and opening actions of the sealing portion 520.

The workpiece W is a ceramic substrate. In the heating section 200, the ceramic substrate is degassed by heating. There are multiple film forming sections 300, and the multiple film forming sections 300 are formed by sputtering using different materials.的multilayer film. Therefore, even in the case where heating is continued by the plurality of film forming parts 300 after the heating by the heating part 200, the susceptor S and the workpiece W can be cooled by the cooling part 400 at a high speed.

[Modifications] This embodiment is not limited to the above-mentioned examples, and also includes the following modifications. (1) A conductive member having a heat capacity equal to or lower than the heat capacity of the base S may be arranged on the surface between the base S and the workpiece W. Thereby, in the cooling part 400, the heat of the work W can easily escape via the base S. For example, as the base S and the conductive member, it is suitable to use a metal such as copper, but it is not limited to this.

(2) As the processing part PR, the film forming part 300 and the reforming part may be included together. The reforming part is a processing part PR that causes active species such as electrons, ions, and free radicals generated by plasmating the process gas to collide with the workpiece W, thereby reforming the surface of the workpiece W and improving the adhesion of the film .

(3) The load lock chamber 121 may be provided with a cooling device that cools the susceptor S and the workpiece W carried out from the chamber 2 via the load lock chamber 121. For example, the sealing part 520 corresponding to the load lock chamber 121 is provided with the same cooling mechanism as the cooling part 400. Thereby, cooling of the susceptor S and the workpiece W before discharge can be promoted. In this case, the cooling of the cooling chamber 410 may be stopped before reaching the target temperature that can prevent the film from being oxidized in the atmosphere, and the remaining cooling may be performed in the load lock chamber 121. Thereby, the cooling time for bringing the workpiece W to the target temperature can be divided into the cooling time of the cooling chamber 410 and the cooling time of the load lock chamber 121. Therefore, the workpiece W does not stay in the cooling chamber 410 for a long time, the processing speed limit can be reduced, and the processing volume can be increased. For example, in the case where a plurality of bases S on which the workpiece W is mounted is sequentially put into the rotating body 3 as shown in FIG. 1, and the rotating body 3 is rotated intermittently to be transported to each processing unit PR for processing, if the workpiece W is made long If the time stays in one processing part PR, the workpiece W mounted on the other base S located downstream of the conveyance cannot be moved to the next processing part PR, resulting in waiting processing time. By dispersing the cooling time and reducing the cooling time of the cooling chamber 410, the waiting time of the workpiece W mounted on the other base S can be reduced, and the processing amount can be increased.

(4) The number of film forming parts 300 is not limited to three, and may be two or less or four or more. By increasing the number of film forming parts 300, the film forming rate can be improved. In addition, the film forming section 300 may be a sputtering device using the target 320. However, the configuration for generating plasma in the film forming part 300 and the reforming part is not limited to a specific type.

(5) The void portion 32 of the rotating body 3 may be a through hole formed in a circular plate-shaped body. In addition, the rotating body 3 is not limited to a rotating table. The rotating body 3 that rotates while holding the support portion or the workpiece W on an arm extending radially from the center of rotation may also be used. The number of workpieces W conveyed by the rotating body 3 and processed at the same time, and the number of holding parts 33 holding them are not limited to the number shown in the above-mentioned embodiment. The holding portion 33 may be configured to switch between the holding state of the holding base S and the released state of the released base S during the process of the sealing portion 520 passing through the gap portion 32, and it is not limited to the above-mentioned embodiment. .

(6) The treatment part PR may be located on the installation surface side of the chamber 2 or on the opposite side thereof, or on the side surface. The direction in which the workpiece W enters and exits the processing portion PR may be from the installation surface side of the processing portion PR, may be from the side opposite thereto, or may be from the side surface side. When the side that obeys gravity is set to the lower side and the side that resists gravity is set to the upper side, in the above-mentioned embodiment, the processing parts PR are arranged above the rotating body 3. However, the processing parts PR may also be arranged at Below the rotating body 3. In addition, the rotating body 3 is not limited to being horizontal, and may be a vertical arrangement or an inclined arrangement. Furthermore, the installation surface of the film forming apparatus 1 may be a floor, a ceiling, or a side wall surface. Mounting of the workpiece W on the base S can also be performed by mechanical holding, bonding, suction, or the like. That is, the mounting of the workpiece W on the base S means that it can move together with the workpiece W regardless of the angle of the base S, and is not limited to the case where the workpiece W is mounted on a horizontal base S.

(7) The pressure sensor or temperature sensor provided in the cooling chamber 410 may also be omitted as appropriate. When the temperature sensor is omitted, at a time point when the predetermined cooling time determined in advance has elapsed from the start of cooling, the cooled exhaust of the cooling chamber 410 is started. In addition, when the pressure sensor is omitted, when the predetermined time determined in advance has passed from the start of the exhaust, the exhaust is stopped.

(8) In the example shown in FIGS. 7, 11(A) and 11(B), the cooling gas introduction part 422 introduces the cooling gas G from the surface of the cooling chamber 410 facing the workpiece W to be cooled, but The introduction direction of the cooling gas G is not limited to this. For example, an opening may be provided in the side wall of the cooling chamber 410, and the cooling gas G may be introduced in the direction along the workpiece W of the cooling gas introduction portion 422.

(9) As mentioned above, the embodiment of the present invention and the modification of each part have been described, but the embodiment or the modification of each part is presented as an example and is not intended to limit the scope of the invention. The novel embodiments described above can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments or their modifications are included in the scope or spirit of the invention, and are included in the invention described in the scope of patent application.

1: Film forming device 2: chamber 3: Rotating body 21: Containment 22: Lid 23: Chamber exhaust 31, 510: drive shaft 32: Gap 33: holding part 70: control device 71: Institutional Control Department 72: Heating Control Department 73: Film Formation Control Department 74: Cooling Control Department 75: Memory Department 76: Setting section 77: Input and output control unit 78: input device 79: output device 100: Move in and out department 110: Transport Department 111, 333: Arm 112: keep body 121: Load Interlock Room 121a, 121b, 210a, 310a, 410a, OP: opening 200: heating section 210: heating chamber 220: heater 300, 300A～300C: Film forming part 310: Film forming chamber 320: target 331: Abutment 332: Conversion Department 332a: Roll 332b: axis 333a: Grip 333b: abutment surface 333c: keep noodles 334: force component 334a, 334b: plates 400: Cooling part 410: Cooling Room 420: The first cooling mechanism 421: Cooler 422: Cooling gas introduction part 423, 431: Coolant circulation pipeline 424: Cooling Chamber Exhaust 430: second cooling mechanism 432: Coolant Supply 500, 500A～500F: Pusher 520: Sealing part 521: Placing Table 521a: Mounting surface 522: Seal 522a: sealing surface 522b: Sealing material 523: protruding part 523a: Inclined surface 523b: outer peripheral surface G: Cooling gas PR: Processing Department S: Pedestal TR: transfer mechanism Sa: Containment Department Sb: feet W: Workpiece

Fig. 1 is a simplified perspective plan view showing the embodiment. 2(A) to 2(B) are cross-sectional views taken along the line A-A showing the time of sealing (FIG. 2(A)) and the time of opening (FIG. 2(B)) with the opening of the sealing portion of FIG. 1. 3(A) to 3(C) are a plan view (FIG. 3(A)), a side view (FIG. 3(B)), and a bottom view (FIG. 3(C)) of the base used in the embodiment . Fig. 4 is a plan view showing the rotating body of the embodiment. Figures 5(A) to 5(D) are a plan view (Figure 5(A)) and a front view (Figure 5(B)) showing the holding state of the base of the holding portion, and a plan view showing the released state of the base (Figure 5) (C)), the front view (Figure 5 (D)). Fig. 6 is a perspective view showing a sealing portion of the embodiment. Fig. 7 is a partial cross-sectional view showing the opening of the cooling unit according to the embodiment at the time of opening. Fig. 8 is a partial cross-sectional view showing the operation of the sealing part of the cooling part according to the embodiment. Fig. 9 is a partial cross-sectional view showing the sealing of the opening of the cooling unit according to the embodiment. 10(A) to 10(B) are cross-sectional views taken along the line B-B when sealing (FIG. 10(A)) and opening (FIG. 10(B)) with the opening of the sealing portion of FIG. 1. Figs. 11(A) to 11(B) are cross-sectional views taken along the line C-C when sealing (Fig. 11(A)) and opening (Fig. 11(B)) using the opening of the sealing portion of Fig. 1. Fig. 12 is a block diagram showing the control device of the embodiment.

2: chamber

3: Rotating body

21: Containment

22: Lid

510: drive shaft

33: holding part

333: Arm

410a, OP: opening

332: Conversion Department

332a: Roll

400: Cooling part

410: Cooling Room

420: The first cooling mechanism

421: Cooler

422: Cooling gas introduction part

423, 431: Coolant circulation pipeline

424: Cooling Chamber Exhaust

430: second cooling mechanism

432: Coolant Supply

500, 500F: Pusher

520: Sealing part

522: Seal

522a: sealing surface

522b: Sealing material

523: protruding part

G: Cooling gas

PR: Processing Department

Sb: feet

Claims (6)

A film forming apparatus, characterized by comprising: a chamber capable of turning the inside into a vacuum by exhausting; a rotating body arranged in the chamber and rotating to transport a susceptor on which a workpiece is mounted; and multiple processes Part, arranged along the circumference with the rotation axis of the rotating body as the center, having an opening communicating with the chamber, and processing the workpiece that has been introduced from the opening; and a pusher facing the The workpiece is separated from the rotating body and is introduced into the processing portion from the opening to apply force to the susceptor; the plurality of processing portions include a heating portion that heats the workpiece, and A film forming part where a workpiece is formed, and a cooling part having a cooling mechanism for cooling the workpiece, and a holding part is provided on the rotating body, and the holding part holds the rotating body while it is being transported. The base is released by applying a force by the pusher, and a sealing portion is provided on the pusher, and the sealing portion is detached from the rotating body and mounted on the base The above workpiece is introduced into the processing part, and the opening is sealed. The film forming apparatus according to claim 1, wherein the sealing portion has a cooling mechanism for cooling the workpiece. The film forming apparatus described in item 1 or item 2 of the scope of patent application, wherein the rotating body is a circular plate-shaped body, The rotating body is provided with a gap portion through which the sealing portion passes in a direction intersecting the rotation plane of the rotating body, and during the process of the sealing portion passing through the gap portion, the holding portion Switching between a holding state where the base is maintained and a released state where the base is released. The film forming apparatus according to the first or second claim of the patent application, wherein, in the susceptor, a heat capacity equal to or less than the heat capacity of the susceptor is arranged on the surface between the susceptor and the workpiece. Conduction member. The film forming apparatus according to the first or second item of the scope of patent application, which includes a load-lock chamber, and the load-lock chamber can perform the susceptor while maintaining the vacuum in the chamber. And the loading and unloading of the workpiece, and the load lock chamber is provided with a cooling device that cools the base and the workpiece that are carried out from the chamber through the load lock chamber. The film forming apparatus according to claim 1 or 2, wherein the workpiece is a ceramic substrate, and in the heating section, the ceramic substrate is degassed by heating, and the forming A plurality of film portions are provided, and a multi-layer film using different materials is formed by sputtering through a plurality of the film forming portions.

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