CN117802459A - Film forming apparatus - Google Patents

Abstract

The invention provides a film forming apparatus capable of simultaneously forming films on a plurality of film forming objects based on uniform film thickness distribution. The film forming apparatus according to the embodiment includes: a rotation/revolution unit configured to revolve the tray around the shaft portion and rotate the tray around a support shaft for supporting the tray as a center along with rotation of the shaft portion; a pusher unit that is provided so as to be capable of coming into contact with and separating from the revolving unit, separates the revolving unit from the carrier body by coming into contact with and applying a force to the revolving unit, and moves the revolving unit between a storage position in which the tray on which the work is mounted is stored in the film forming chamber, and a separation position in which the revolving unit is mounted on the carrier body and separated from the film forming chamber by being separated from the revolving unit; and a rotation unit that rotates the shaft portion in a state in which the tray on which the workpiece is mounted is housed in the film forming chamber, thereby rotating the tray while revolving.

Description

Film forming apparatus

Technical Field

The present invention relates to a film forming apparatus.

Background

As a device for forming a film on a surface of a film-forming object such as a substrate, a film-forming device by sputtering is widely used. Sputtering is a technique that utilizes the following operations: ions are generated by plasmatizing a gas introduced into the evacuated chamber, and the generated ions collide with the surface of a target material as a film-forming material, whereby the film-forming material flies out and adheres to the substrate.

In such a film forming apparatus, it is desirable to make the thickness of the film formed on the surface of the substrate uniform. In sputtering, for example, the following operations are performed: a plurality of targets are disposed so that the distribution of the film forming material on the substrate is nearly uniform. At this time, in order to further equalize the film thickness distribution, the following operations are performed: the in-plane uniformity of the film thickness is achieved by adjusting the power applied to each target, adjusting the distance or orientation between the target and the object to be film-formed, and the like.

[ Prior Art literature ]

[ patent literature ]

[ patent document 1] Japanese patent laid-open No. Hei 01-212756

Disclosure of Invention

[ problem to be solved by the invention ]

However, in the method, more target is required. Therefore, in the method of adjusting the applied power, the power control becomes complicated. In addition, even in the method of adjusting the distance between the target and the substrate, the target approaching the substrate shields particles of the film forming material flying from other targets, and therefore, there is a limit in approaching the substrate. That is, there are also the following cases: it is also difficult to achieve uniformity of film thickness by adjusting the power applied to the target or the distance between the target and the substrate.

In addition, there are cases where: by imparting an inclination angle to the target with respect to the substrate, the film thickness distribution can be improved. However, since other structural members such as a mechanism for holding the target, a mechanism for cooling the target, and a magnet for improving film formation efficiency are required to be disposed, an optimum inclination angle may not be selected, and it is difficult to optimize the film thickness.

To cope with the situation, the following operations are performed: the substrate is rotated so as to face the film formation target surface of the substrate sequentially toward different targets, thereby canceling out the variation in film formation rates of the targets (for example, patent document 1). Patent document 1 also describes that: further, the plurality of substrates are rotated (revolved) around a rotation shaft provided outside each substrate, and film formation is performed simultaneously. However, in this case, the distance from the target is not uniform and does not change by always passing through the same track at each portion of the surface of each substrate, and thus the deposition of the film forming material is unevenly distributed, and the film thickness distribution in each substrate is deviated. Therefore, in order to prevent the parts of the surfaces of the substrates from passing through the same orbit when revolving, it is considered that each substrate of the substrates is rotated (rotated) around a rotation axis provided inside the substrate in addition to revolving.

Here, there is a film forming apparatus in which a plurality of film forming chambers for forming films or processing chambers for performing film processing are disposed in the same chamber in order to perform film forming in one chamber, film processing for oxidizing or nitriding a film to be formed, or the like. In such a film forming apparatus, a substrate as a film forming target is placed on a carrier, the substrate is moved to a position opposed to a film forming chamber, the substrate is separated from the carrier by a pusher, film forming is performed in a state where the substrate is brought close to a target, and the substrate is placed on the carrier again and is moved to a subsequent film forming chamber or a processing chamber. In such a film forming apparatus, film formation is performed in a state where the substrate is lifted up by the pusher, but in order to cope with the problem, a mechanism for performing rotation and revolution of a plurality of substrates is also required in addition to the lifting mechanism of the pusher.

The present invention has been made to solve the above-described problems of the prior art, and an object of the present invention is to provide a film forming apparatus capable of simultaneously forming a film on a plurality of film forming objects with a uniform film thickness distribution.

[ means of solving the problems ]

In order to achieve the above object, a film forming apparatus according to an embodiment includes: a film forming section for forming a film on a workpiece mounted on a tray by sputtering in a film forming chamber having a target; a revolution unit that revolves the tray around a shaft portion and rotates the tray around a support shaft that supports the tray as a center as the shaft portion rotates; a transport body that transports the tray on which the workpiece is mounted together with the revolving unit to a position facing the film forming section; a pusher unit that is provided so as to be capable of contacting and separating with the revolving unit, separates the revolving unit from the conveyance body by contacting and applying a force to the revolving unit, and moves the revolving unit between a storage position in which the tray on which the workpiece is mounted is stored in the film forming chamber and a separation position in which the revolving unit is mounted on the conveyance body by being separated from the revolving unit, and separates the revolving unit from the film forming chamber; and a rotation unit configured to rotate the shaft portion in a state where the tray on which the workpiece is mounted is housed in the film forming chamber, thereby rotating the tray while revolving.

[ Effect of the invention ]

The present invention can provide a film forming apparatus capable of simultaneously forming a film on a plurality of film forming objects with a uniform film thickness distribution.

Drawings

Fig. 1 is a simplified plan view showing an embodiment.

Fig. 2A is an exploded perspective view showing a jig, fig. 2B is a perspective view showing a work, and fig. 2C is a sectional view of the arrow B-B of fig. 2B.

Fig. 3A is a plan view showing the revolving unit, fig. 3B is a sectional view of C-C arrow of fig. 3A, and fig. 3C is a plan view showing the turntable and the revolving unit.

FIG. 4 is a sectional view taken along arrow A-A in FIG. 1 showing the film forming section and the workpiece rotating section in a standby state.

FIG. 5 is a sectional view taken from arrow a of FIG. 1 showing a film forming section and a workpiece rotating section during film forming.

Fig. 6 is an explanatory diagram showing the internal structures of the carry-in/out section and the chamber.

[ description of symbols ]

1: film forming apparatus

2: chamber chamber

2a: an opening

3: rotary table

3a: driving source

4: workpiece rotating part

10. 10A, 10B: target material

21: bottom plate

22: cover plate

23: chamber exhaust part

24: stand for stand

25: load lock chamber

31: shaft

32: an opening

33: support part

41: tray for holding food

41a: workpiece abutting surface

42: revolution unit

43: pusher unit

44: rotary unit

44a: motor with a motor housing

44b: rotary shaft

44c: connecting part

50: control device

100: film forming part

110: film forming chamber

111: an opening

112: spacing piece

113: cover body

120: sputtering source

121: backboard

122: electrode

130: power supply unit

140: sputtering gas introduction part

150: exhaust part

200: reversing part

300: carry-in/carry-out section

310: conveying part

311: arm

312: closure part

312a: sealing member

312b: holding part

320: load lock part

321: load lock chamber

322: pusher

322a: driving mechanism

322b: sealing member

323: exhaust line

324: ventilating pipeline

420: shaft portion

420a: connecting hole

421: rotating body

422: supporting shaft

423: conversion mechanism

423a: fixed gear

423b: planetary gear

424: fitting part

424a: fitting convex part

424b: fitting recess

431: cylinder

432: housing body

433: supporting cylinder

434: connecting plate

G: sputtering gas

J: clamp

Ju: upper clamp

Jd: lower clamp

Js: spacing piece

Jp: pin

Jm: magnet

S: substrate board

T: mounting table

W: workpiece

Detailed Description

An embodiment of the present invention (hereinafter, referred to as the present embodiment) will be specifically described with reference to the drawings. For easy understanding, the cross-sectional views of fig. 4 and 5 are, like fig. 3B, cross-sectional views in the vertical direction in which only the revolving unit 42 passes through the two support shafts 422.

Summary

As shown in fig. 1, the present embodiment is a film forming apparatus 1 for forming a film on a film formation target surface of a workpiece W, which is a film formation target, by plasma. The film deposition apparatus 1 of the present embodiment includes a turntable 3, and the turntable 3 holds a revolving unit 42 (see fig. 3A and 3B) in a vacuum-capable chamber 2 and intermittently rotates by 90 °, and the revolving unit 42 supports a tray 41 on which a workpiece W is mounted. The film forming apparatus 1 performs various processes on the workpiece W at three of four stop positions at which the turntable 3 stops. The film forming section 100, the reversing section 200, and the carry-in/out section 300 are allocated at three stop positions.

The film forming section 100 simultaneously forms films on a plurality of workpieces W by sputtering in a film forming chamber 110 having a target 10. That is, ions generated by plasmatizing the sputtering gas G are caused to collide with the target 10 (see fig. 4), and particles of the film forming material constituting the target 10 are attached to the film forming target surfaces of the plurality of workpieces W. The film forming section 100 of the present embodiment includes two targets 10A and 10B. In addition, in the case where the two targets 10A, 10B are not distinguished, they are simply referred to as targets 10.

In order to form a film on both surfaces of the workpiece W, the reversing section 200 reverses the workpiece W, which has been formed on one surface thereof in the film forming section 100, by a reversing mechanism within the reversing section 200, so that the film can be formed on the other surface thereof in the film forming section 100. The carry-in/out section 300 carries in the interior of the chamber 2 from the outside the revolving unit 42 supporting the tray 41 on which the unprocessed workpiece W is mounted, and carries out the revolving unit 42 supporting the tray 41 on which the processed workpiece W is mounted, to the outside of the chamber 2, while maintaining the vacuum in the interior of the chamber 2 via the load lock chamber 25.

[ film Forming object ]

In the present embodiment, a circular workpiece W is used as an example of a film formation object. The workpiece W is a member in which a substrate S and a jig J, which will be described later, are integrated. Further, the plurality of workpieces W are mounted on the pallet 41 of the revolving unit 42, and are conveyed by the turntable 3. The substrate S is circular, and is a quartz substrate used in quartz devices such as quartz oscillators and quartz oscillators. The substrate S forms Au layers as electrodes on both sides of a quartz substrate. A Cr layer as an adhesion layer for improving adhesion of the Au layer to the surface of the quartz substrate is formed between the surface of the quartz substrate and the Au layer. Therefore, two layers, a Cr layer as an adhesion layer and an Au layer as an electrode, are formed on both sides of the quartz substrate. The present invention is not limited to this, and may be a silicon (Si) wafer, a silicon carbide (SiC) wafer, a sapphire substrate, or a glass substrate.

The jig J is a member to which the substrate S is assembled. As shown in the exploded perspective view of fig. 2A, the perspective view of fig. 2B, and the cross-sectional view of fig. 2C (the arrow-B cross-sectional view of fig. 2B), the jig J of the present embodiment has an upper jig Ju, a lower jig Jd, spacers Js, and pins Jp. The upper and lower jigs Ju, jd are annular plate bodies having an inner diameter smaller than the outer diameter of the substrate S and an outer diameter larger than the outer diameter of the substrate S. The spacer Js is an annular plate body having an inner diameter larger than the outer diameter of the substrate S and an outer diameter equal to the upper and lower jigs Ju and Jd. The upper jig Ju, the lower jig Jd, and the spacers Js may be made of metal.

The substrate S is mounted on the jig J by sandwiching the spacer Js between the upper jig Ju and the lower jig Jd and sandwiching the substrate S on the inner edge side of the spacer Js. Therefore, as shown in fig. 2C, the spacers Js are arranged outside the substrate S. As shown in fig. 2C, a magnet Jm is embedded in the outer edge of the lower jig Jd, and the upper jig Ju is attracted by a magnetic force, so that the spacer Js and the substrate S are sandwiched between the upper jig Ju and the lower jig Jd. Thereby, the substrate S can be prevented from being detached from the jig J. Further, the upper jig Ju, the lower jig Jd, and the spacers Js are formed with a plurality of through holes at positions corresponding to the respective jig Ju, the pins Jp are inserted into the through holes, and positional displacement can be prevented. In the following description, the jig J equipped with the substrate S is simply referred to as a workpiece W.

[ Chamber ]

The chamber 2 is a container in which the inside can be evacuated. The chamber 2 of the present embodiment has a rectangular parallelepiped box shape, and the installation surface side is a bottom plate 21, and the opposite side is a cover plate 22 (see fig. 4 and 5). The chamber 2 is provided on a box-shaped stand 24. The chamber 2 is provided with a chamber exhaust portion 23. The chamber exhaust portion 23 of the present embodiment includes a pipe connected to an opening formed in the bottom plate 21 of the chamber 2. The chamber exhaust unit 23 includes a pneumatic circuit, not shown, and can perform evacuation of the chamber 2 by exhaust treatment.

[ rotating stage ]

As shown in fig. 1, 3C, 4, and 5, the turntable 3 is a conveyance body that conveys a tray 41 on which a workpiece W is mounted, together with a rotation unit 42 described later, to a position facing the film forming section 100 in the chamber 2. The turntable 3 is a circular plate body and intermittently rotates around the shaft 31 by the drive source 3 a. The turntable 3 has a plurality of openings 32 as through holes. The plurality of openings 32 are provided at equal intervals in the circumferential direction at positions of the turntable 3 which are equally spaced from the rotation center. The openings 32 of the present embodiment are provided at intervals of 90 ° in correspondence with stop positions of intermittent rotation. Three of the positions are opposite to the film forming section 100, the reversing section 200, and the carry-in/out section 300. A support portion 33 for supporting the revolving unit 42 is provided at an upper edge portion of the opening 32. That is, the plurality of revolution units 42 are mounted at equal intervals in the circumferential direction at positions equidistant from the rotation center of the turntable 3. When the revolving unit 42 for mounting the workpiece W on the tray 41 is positioned at a position corresponding to the film forming chamber 110 by intermittent rotation of the turntable 3, a shaft 420 of a rotating body 421 described later is brought to a position facing the connection portion 44c of the rotating unit 44.

[ workpiece rotating portion ]

As shown in fig. 4 and 5, the workpiece rotating unit 4 revolves the workpiece W around the rotation axis in the film forming chamber 110, thereby making the film thickness distribution of each substrate S uniform. The workpiece rotating section 4 includes a tray 41, a revolving unit 42, a pusher unit 43, and a rotating unit 44.

The tray 41 is a member on which the workpiece W is mounted. The tray 41 is a circular plate body, and has an upper surface that is a workpiece contact surface 41a on which the workpiece W is mounted. The outer diameter of the workpiece abutment surface 41a is larger than the outer diameter of the workpiece W. A recess portion for accommodating the workpiece W is formed in the workpiece contact surface 41a at a position where the workpiece W is placed. In order to mount a plurality of workpieces W, a plurality of trays 41 are provided. The tray 41 of the present embodiment is provided with three.

The revolution unit 42 revolves the tray 41 around the shaft 420, and rotates the tray 41 around the support shaft 422 supporting the tray 41 as the shaft 420 rotates. The revolution unit 42 is provided so as to be capable of carrying in and out the workpiece W with respect to the turntable 3 in the chamber 2 in a state where the workpiece W is placed on the tray 41. The revolution unit 42 includes a shaft 420, a rotating body 421, a support shaft 422, and a conversion mechanism 423. The shaft portion 420 is a cylindrical member that is a shaft that revolves the workpiece W. The revolution described here means that the workpiece W moves around the shaft 420 along a circumferential locus centering on the shaft 420. A connection hole 420a is provided at the lower end of the shaft 420, and the connection hole 420a is connected to a connection portion 44c provided at the tip of a rotation shaft 44b described later. The rotating body 421 is a circular plate body provided coaxially with the shaft 420 at the upper end of the shaft 420 and rotatable with the shaft 420. The edge portion of the lower surface of the rotating body 421 is supported by the support portion 33 of the turntable 3.

The support shaft 422 supports the tray 41. The support shaft 422 is a member attached to the center of the lower surface of the tray 41 in the vertical direction, and is a rotation center of the workpiece W supported by the tray 41. The rotation described here means that the workpiece W rotates about its own center. Each support shaft 422 rotatably penetrates the rotary body 421 via a bearing provided to the rotary body 421 and extends downward. The revolution unit 42 revolves the plurality of trays 41 around the shaft 420, and rotates the trays 41 around the support shaft 422 supporting the trays 41 as the shaft 420 rotates.

The conversion mechanism 423 converts the rotation of the shaft 420 into the rotation of the support shaft 422. The conversion mechanism 423 includes: a transmission unit that transmits rotation of the shaft 420; and a rotation member that transmits rotation of the shaft 420 via the transmission unit to rotate the support shaft 422. The transmission part of the present embodiment is a fixed gear 423a, and the rotation member is a planetary gear 423b. The fixed gear 423a is a circular plate gear that is provided concentrically with the shaft 420, but is fixed to a support tube 433 that surrounds the outer periphery of the shaft 420, and does not rotate due to the rotation of the shaft 420. The planetary gears 423b are fixed to lower ends of the support shafts 422, and mesh with gear grooves of the outer circumference of the fixed gears 423 a. As shown in fig. 5, when the support shaft 422 revolves with the tray 41 with the rotation of the rotating body 421, the planetary gear 423b rotates while rotating around the fixed gear 423A, and therefore the tray 41 also rotates around the support shaft 422 (see fig. 3A). The revolution described here means that the tray 41, the support shaft 422, and the planetary gears 423b move around the shaft 420 in a circumferential locus centering on the shaft 420. The rotation described here means that the tray 41 and the planetary gear 423b rotate around the support shaft 422.

The pusher unit 43 is a mechanism for advancing and retreating the revolution unit 42 toward the film formation chamber 110. The pusher unit 43 is provided to be capable of contacting/separating with the revolution unit 42. The pusher unit 43 moves the revolving unit 42 away from the turntable 3 by bringing the revolving unit 42 into contact with the pusher unit and applying a force, between a storage position in which the tray 41 on which the work W is mounted is stored in the film forming chamber 110, and a separation position in which the revolving unit 42 is mounted on the turntable 3 away from the revolving unit 42 and separated from the film forming chamber 110. The storage position is also a processing position where the tray 41 on which the workpiece W is mounted is located in the film forming chamber 110 and film forming processing can be performed on the workpiece W. The leaving position is also a position where the revolution unit 42 leaves the film formation chamber 110. The pusher unit 43 is lowered from a position away from the revolving unit 42 to a standby position (initial position: between the bottom plate 21 of the chamber 2 and the turntable 3) where rotation of the turntable 3 is not hindered. The standby position is a position where a connection plate 434 described later approaches or contacts the bottom plate 21 of the chamber 2. The turntable 3 intermittently rotates with the pusher unit 43 at the standby position, and the revolving unit 42 stops at a position opposite to the storage position.

The pusher unit 43 has a cylinder (cylinder) 431, a housing 432, a support cylinder 433, and a connection plate 434. The cylinder 431 is a driving source for lifting and lowering the rotating body 421 and the tray 41, and is fixed to the bottom surface of the stand 24. The housing 432 is a cylindrical body supported by a drive shaft of the cylinder 431 and housing a rotary unit 44 described later.

The support cylinder 433 is a cylinder body into which the rotation shaft 44b is inserted. The lower end of the supporting cylinder 433 is fixed to the upper portion of the housing 432. The support tube 433 penetrates the bottom plate 21 of the chamber 2 so as to be able to slide up and down. The connection plate 434 is a plate body fixed to the upper end of the support tube 433. The connection plate 434 is provided to be capable of contacting/separating with the fixed gear 423 a. The connecting plate 434 and the fixed gear 423a have a fitting portion 424. The fitting portion 424 has a fitting protrusion 424a provided on the connection plate 434 and a fitting recess 424b provided on the fixed gear 423a, and the fixed gear 423a is fixed so as not to rotate by the fitting protrusion 424a and the fitting recess 424b fitting.

The rotation unit 44 is a mechanism that rotates the shaft 420. The rotation unit 44 includes a motor 44a, a rotation shaft 44b, and a connection portion 44c. The motor 44a is a drive source accommodated in the accommodating body 432. The shaft of the motor 44a is coupled to the lower end of the rotary shaft 44 b. Thereby, the rotation shaft 44b is rotated by the rotation of the motor 44 a. The upper end of the rotation shaft 44b rotatably penetrates through a bearing provided in the connection plate 434. The connection portion 44c is a protrusion protruding from the side surface of the upper end of the rotation shaft 44b, and the rotation of the rotation shaft 44b can be transmitted to the shaft 420 through the connection hole 420a fitted into the shaft 420. In a state where the pusher unit 43 is configured to place the revolution unit 42 at the storage position and store the tray 41 with the work W mounted thereon in the film forming chamber 110, the shaft 420 is rotated by the rotation unit 44, whereby the plurality of trays 41 revolve and the respective trays 41 rotate.

[ film Forming section ]

As shown in fig. 4 and 5, the film forming section 100 includes a film forming chamber 110, a sputtering source 120, a power supply section 130, a sputtering gas introduction section 140, and an exhaust section 150.

(film Forming Chamber)

The film forming chamber 110 is a space in which film formation is performed by sputtering. As shown in fig. 4 and 5, the film forming chamber 110 includes an opening 111, a spacer 112, and a lid 113. The opening 111 is a through hole provided in the cover plate 22 of the chamber 2. The spacer 112 is a square tube shaped member provided on the outer side of the cover plate 22 of the chamber 2 so as to surround the opening 111. The spacers 112 constitute the sidewalls of the film formation chamber 110. The cover 113 is a box-like body sealing the upper portion of the spacer 112. The cover plate 22, the spacer 112, and the cover 113 are sealed with a sealing material such as an O-ring.

(sputtering Source)

The sputtering source 120 is a supply source of a film forming material for depositing the film forming material on the workpiece W by sputtering and forming a film. The sputtering source 120 has a target 10, a back-plate 121, and an electrode 122.

In the present embodiment, as shown in fig. 1, there are two targets 10. The two targets 10, i.e., the target 10A and the target 10B are members formed of a film-forming material deposited on the workpiece W to form a film. The sputtering surfaces of the targets 10A and 10B, which are gradually cut by sputtering, are disposed at positions facing the workpiece W obliquely with respect to the workpiece W.

As the film forming material, cr, au, and the like are used, for example. However, as long as the film can be formed by sputtering, various materials can be applied. The target 10A and the target 10B may be made of a common material or may be made of different kinds of materials. For example, the targets 10A and 10B may each include the same Cr, or the targets 10A and 10B may each include the same Au. The target 10A is a target containing Cr, the target 10B is a target containing Au, and the target 10A and the target 10B are different targets.

The back-plate 121 is a holding member that individually holds each target 10A, 10B. The electrode 122 is a conductive member for individually applying electric power from the outside of the chamber 2 to the targets 10A and 10B. Although not shown, the sputtering source 120 includes a magnet, a cooling mechanism, and the like. That is, the film forming section 100 of the present embodiment is configured as a magnetron sputtering apparatus.

(Power supply unit)

The power supply 130 is a component for applying power to the targets 10A and 10B. By applying electric power to the target 10 through the power supply unit 130, a sputtering gas G, which will be described later, can be plasmatized, and a film-forming material can be deposited on the workpiece W. The power applied to each target 10A, 10B may be varied individually. In the present embodiment, the power supply unit 130 is, for example, a Radio Frequency (RF) power supply to which a high-frequency voltage is applied. In addition, a Direct Current (DC) power supply may be used.

(sputtering gas introduction portion)

In the plasma treatment of the present embodiment, a sputtering gas G can be used. The sputtering gas G is a gas for causing generated ions to collide with the targets 10A and 10B by the plasma generated by the application of electric power, and causing the materials of the targets 10A and 10B to be deposited on the surface of the substrate S. For example, an inert gas such as argon gas may be used as the sputtering gas G.

The sputtering gas introduction unit 140 includes a pipe for introducing the sputtering gas G. The sputtering gas introduction unit 140 includes a gas supply circuit, not shown, and can introduce the sputtering gas G from the supply source into the film formation chamber 110.

(exhaust part)

The exhaust portion 150 has a pipe connected to an opening formed in the spacer 112. The exhaust unit 150 includes an exhaust circuit, not shown, and can evacuate the film forming chamber 110 by performing an exhaust process.

[ inversion section ]

The reversing section 200 has a reversing mechanism, not shown, to reverse the workpiece W. The reversing mechanism of the present embodiment individually grips and lifts three workpieces W, which are at the separation position by the pusher unit 43, from the revolving unit 42, rotates them by 180 °, and then lowers them to place the workpieces W on the revolving unit 42.

[ carry-in/carry-out section ]

The carry-in/carry-out section 300 is a device for carrying in/out the revolving unit 42 on which the workpiece W is mounted, with respect to the chamber 2. As shown in fig. 6, the carry-in/out section 300 includes a carrying section 310 and a mounting table T. The rotation unit 42 on which the workpiece W before film formation is mounted on the mounting table T from the outside of the film forming apparatus 1 by the mounting apparatus. The carrying section 310 picks up the revolving unit 42 on which the workpiece W before film formation is mounted on the mounting table T, and carries it into the load lock chamber 25 configured as the chamber 2. The loading device is a device that conveys the revolving unit 42 on which the workpiece W is placed to the carry-in/out section 300 from the outside. The conveyor 310 receives the revolving unit 42 on which the film-formed workpiece W is mounted from the loadlock chamber 25, and is mounted on the mounting table T. The mounting device conveys the revolving unit 42 on which the film-formed workpiece W is mounted on the mounting table T to the outside of the film forming device 1.

The conveying section 310 includes an arm 311 and a closing section 312. The arm 311 is an elongated member provided between the mounting table T and the chamber 2 in parallel with the plane of the turntable 3. The arm 311 is provided so as to be intermittently rotatable about an axis parallel to the axis 31 of the turntable 3 by 180 ° by a driving mechanism not shown, and is movable along the axis. The closing portions 312 are members provided at both ends of the arm 311 and seal the opening 2a provided in the chamber 2. The opening 2a is an opening of the cover plate 22 provided on the upper surface of the chamber 2 to connect the inside of the chamber 2 to the outside, and is an end portion on the outside side of the load lock chamber 25. The sealing portion 312 is provided with a sealing member 312a such as an O-ring.

The closing portion 312 is provided with a holding portion 312b. The holding portion 312b is a member that holds the revolving unit 42. The holding portion 312b holds the revolving unit 42 by a holding mechanism such as a mechanical chuck. The stage T is provided with a pusher P that moves by a driving mechanism, not shown, and moves the revolving unit 42 on which the workpiece W is mounted between the stage T and the holding portion 312b.

The load lock 320 includes a load lock chamber 321, a pusher 322, an exhaust line 323, and a vent line 324. The load lock chamber 321 is a space surrounded by the inner surface of the opening 2a, which is a through hole formed in the lid plate 22 of the chamber 2, and can house the revolving unit 42 held by the holding portion 312b and seal the space. At the opening 2a of the load lock chamber 321, an end portion on the outside side of the chamber 2 is sealed by a closing portion 312.

The pusher 322 is a member that drives the support portion 33 by the driving mechanism 322 a. The pusher 322 moves the support portion 33 between the opening 32 of the turntable 3 and the load lock chamber 321 in a direction contacting/separating from an end of the load lock chamber 321 opposite to the outer side of the opening 2 a. The pusher 322 is provided with a sealing member 322b such as an O-ring to seal the space between the pusher and the support portion 33. The support portion 33 biased by the pusher 322 seals an end portion of the load lock chamber 321 opposite to the outside side of the opening 2a together with the pusher 322. In this way, the load lock chamber 321 is formed by sealing with the closing portion 312, the supporting portion 33, and the pusher 322.

The exhaust line 323 is connected to a pneumatic circuit (not shown) and configured to depressurize the sealed load lock chamber 321. The vent line 324 is connected to a valve or the like, not shown, and is used to break the vacuum in the load lock 321.

The revolving unit 42 held by the holding portion 312b is transferred to the support portion 33 in the load lock chamber 321 in which the opening 2a is sealed by the closing portion 312 and evacuated via the exhaust line 323. The rotation unit 42 is discharged from the load lock chamber 321 by the pusher 322 being lowered, and is placed on the opening 32 of the turntable 3 together with the support portion 33. The pusher 322 is further lowered and retracted from the turntable 3. The pusher 322 pushes up the revolving unit 42 on which the film-formed workpiece W is placed together with the support 33 to seal the load lock chamber 25, and transfers the revolving unit 42 to the holding portion 312b of the closing portion 312. The closing portion 312 that receives the revolving unit 42 is raised after the load lock chamber 321 is opened to the atmosphere via the vent line 324, and discharges the revolving unit 42.

[ control device ]

As shown in fig. 1, the control device 50 controls each part of the film forming apparatus 1. The control device 50 may include, for example, a dedicated circuit or a computer running a predetermined program. That is, the control of the exhaust of the chamber 2, the control of the introduction and exhaust of the sputtering gas G to the film forming chamber 110, the control of the power supply 130, the control of the rotation of the turntable 3, the control of the reversing mechanism of the reversing unit 200, the control of the carry-in/carry-out unit 300, the drive control of the pusher unit 43, the rotation control of the rotation unit 44, and the like are programmed, and the control is executed by a processing device such as a programmable logic controller (programmable logic controller, PLC) or a central processing unit (central processing unit, CPU), and the like, and can be applied to various types of film forming processing.

As an object of specific control, there can be mentioned: the timing of intermittent operation of the drive source 3a of the turntable 3, the initial exhaust pressure of the film forming apparatus 1, the power applied to the target 10, the flow rate, type, introduction time and exhaust time of the sputtering gas G, the time of the surface treatment and the film forming treatment, and the like.

In particular, in the present embodiment, the control device 50 controls the film formation rate by controlling the power applied to the targets 10A and 10B and the supply amount of the sputtering gas G by the sputtering gas introduction unit 140. The control device 50 controls the operation of the cylinder 431 of the pusher unit 43 to raise and lower the revolving unit 42. The control device 50 controls the motor 44a of the rotation unit 44 to rotate the shaft 420 connected to the rotation shaft 44b, thereby revolving the plurality of trays 41 and rotating each tray 41.

Further, an input device and an output device, not shown, are connected to the control device 50. The input device is an input means such as a switch, a touch panel, a keyboard, and a mouse for allowing an operator to operate the film forming apparatus 1 via the control device 50. The output device is an output means such as a display, a lamp, or a meter that uses information for confirming the state of the device and is visually recognizable to an operator.

[ film Forming treatment ]

A process of forming a film on a workpiece W by the film forming apparatus 1 according to the present embodiment as described above will be described.

First, the revolving unit 42 on which three workpieces W are mounted is carried into the chamber 2 by the carry-in/out section 300, and is placed in the opening 32 of the turntable 3. Then, as shown in fig. 4, the turntable 3 intermittently rotates to position the revolving unit 42 directly below the opening 111 of the film forming chamber 110.

Next, as shown in fig. 5, the cylinder 431 of the pusher unit 43 is operated to raise the connection plate 434 and the rotation shaft 44b, thereby fitting the fitting protrusion 424a of the connection plate 434 into the fitting recess 424b of the fixed gear 423 a. Thereby, the connection portion 44c of the rotation shaft 44b is fitted into the connection hole 420a of the shaft portion 420. Further, the connection plate 434 and the rotation shaft 44b are lifted, and the revolving unit 42 is lifted from the separated position to the storage position away from the support portion 33 of the turntable 3. Thereby, the workpiece W on the tray 41 is accommodated in the film forming chamber 110.

In this state, the sputtering gas G is introduced into the film forming chamber 110 by the sputtering gas introduction unit 140, and is exhausted by the exhaust unit 150, whereby the pressure is controlled to a predetermined pressure optimal for the film forming process. Then, the motor 44a of the rotation unit 44 is operated to rotate the rotation shaft 44b, whereby the rotation body 421 is rotated together with the shaft 420. The rotation body 421 rotates around the fixed gear 423a by rotating around the planetary gear 423b, and rotates the tray 41 around the support shaft 422. Thereby, the workpieces W on the three trays 41 rotate while revolving. The rotary body 421 is rotated at a predetermined rotational speed (rotational speed per unit time) for a predetermined rotational time. Further, since film formation is performed during the rotation, the rotation time is substantially the same as the film formation time. The rotation speed, rotation time, and the like of the rotating body 421 are set to the optimal rotation speed and rotation time obtained in advance by experiments or the like.

The power supply 130 applies electric power to the targets 10A and 10B. Then, ions generated by plasmatizing the sputtering gas G collide with the targets 10A and 10B. The film-forming materials constituting the targets 10A and 10B are ejected from the targets 10A and 10B by ions. Then, the film is deposited on the film formation target surface of the workpiece W rotating while revolving by the tray 41.

After the film formation process for a predetermined time, the application of electric power to the target 10 is stopped. Then, the sputtering gas G is exhausted from the film forming chamber 110 by the exhaust from the exhaust section 150, and the pressure of the film forming chamber 110 is equalized with that of the chamber 2. Then, the motor 44a is stopped so that the orientation of the revolving unit 42 (the positions of the three works W) is positioned in the initial state, and when the connecting plate 434 and the rotation shaft 44b are lowered by the cylinder 431, as shown in fig. 4, the revolving unit 42 returns to the separated position and is supported by the support portion 33 of the turntable 3. Further, the fitting convex portion 424a of the connection plate 434 is disengaged from the fitting concave portion 424b of the fixed gear 423a, and the connection portion 44c of the rotation shaft 44b is disengaged from the connection hole 420a of the shaft portion 420. In addition, the connection plate 434 moves below the opening 2a of the turntable 3, descends to the standby position (home position), and stops.

The rotation table 3 is intermittently rotated to move and reverse the rotation unit 42 to the reversing unit 200. The rotation table 3 is intermittently rotated to move the revolution unit 42 to the film forming section 100 again, thereby forming a film on the other film forming target surface of the workpiece W in the same manner as described above. The orientation of the revolution unit 42 (the positions of the three works W) is positioned in the initial state. Then, the revolving unit 42 on which the film-formed workpiece W is mounted is moved to a position immediately below the opening 2a by intermittent rotation of the turntable 3, and is carried out of the chamber 2 by the carry-in/carry-out unit 300.

[ Effect ]

(1) The film forming apparatus 1 according to the present embodiment as described above includes: a film forming unit 100 for forming a film on a workpiece W placed on a tray 41 by sputtering in a film forming chamber 110 having a target 10; a revolution unit 42 that revolves the tray 41 around the shaft 420 and rotates the tray 41 around a support shaft 422 that supports the tray 41 as a center as the shaft 420 rotates; and a conveyor that conveys the pallet 41 on which the workpiece W is mounted, together with the revolving unit 42, to a position facing the film forming section 100.

The device also comprises: the pusher unit 43 is provided so as to be able to contact with and separate from the revolving unit 42, and separates the revolving unit 42 from the carrier body by contact with and application of force to the revolving unit 42, and moves the revolving unit 42 between a storage position in which the tray 41 on which the work W is mounted is stored in the film forming chamber 110, and a separation position in which the revolving unit 42 is mounted on the carrier body by being separated from the revolving unit 42, and separated from the film forming chamber 110; and a rotation unit 44 that rotates the shaft 420 in a state where the tray 41 on which the workpiece W is mounted is housed in the film forming chamber 110, thereby rotating the tray 41 while revolving.

Therefore, since the workpieces W revolve around the axis while rotating during film formation, the positions of the plurality of workpieces W relative to the target 10 change due to the revolution, and the positions of the respective workpieces W relative to the target 10 also change due to the rotation, and thus uneven distribution of deposition of the film forming material can be prevented, and the film thickness distribution among the plurality of workpieces W and within the respective workpieces W can be made uniform.

In the present embodiment, since the plurality of workpieces W revolve while rotating during film formation, the positions of the plurality of workpieces W relative to the target 10 change due to revolution, and the positions of the respective workpieces W relative to the target 10 also change due to rotation, so that uneven distribution of deposition of the film forming material can be prevented, and the film thickness distribution among the plurality of workpieces W and within the respective workpieces W can be made uniform.

(2) The revolution unit 42 has a conversion mechanism 423, and the conversion mechanism 423 converts the rotation of the shaft 420 into the rotation of the support shaft 422. Therefore, the rotation of the shaft 420 allows the revolution and rotation of the workpiece W, and a drive source for directly rotating the support shaft 422 is not required. That is, since the shaft portion 420 is responsible for the rotation driving source of the support shaft 422, the support shaft 422 can be rotated by rotating the shaft portion 420. This can simplify the device, and a driving source such as a motor for rotating the support shaft 422 is not required, so that the weight of the conversion mechanism 423 itself can be reduced, and the load on the shaft 420 for rotating the rotary body 421 can be reduced.

(3) The conveyance body has a turntable 3, and the turntable 3 is provided so as to be rotatable intermittently in a state where the revolving unit 42 is mounted thereon, and is stopped when the revolving unit 42 is positioned at the storage position. In the turntable 3, the plurality of revolution units 42 are mounted at equal intervals in the circumferential direction at equal intervals from the rotation center. Therefore, even with the relatively heavy-weight revolution unit 42, the rotation table 3 can be balanced, and the posture and rotation of the turntable 3 can be stabilized. Further, in the present embodiment, the revolution unit 42 is separated from the pusher unit 43 and the rotation unit 44. In particular, since only the pusher unit 43 and the rotating unit 44 are provided on the film forming apparatus 1 side, the structure is not complicated. As is clear from fig. 4 and 5, since only the support tube 433 and the rotation shaft 44b are moved up and down below the turntable 3, a space for providing the revolving unit 42 does not need to be formed in the space between the turntable 3 and the bottom plate 21 of the chamber 2, and the space itself can be reduced. This eliminates the need to expand the entire space in the chamber 2, and thus reduces the influence of pressure adjustment or the like (time for reducing the pressure to a predetermined pressure, maintaining the predetermined pressure, or the like) in the chamber 2.

Modification example

The present embodiment is not limited to the above-described embodiment, and includes modifications as described below.

(1) The number of targets 10 in the film forming section 100 is not limited to the number exemplified in the embodiment. The target 10 may be provided in the singular or three or more. By increasing the number of targets 10, the film formation rate can be increased.

The plurality of targets 10 may be a common film-forming material or may be different kinds of film-forming materials. By using a common film-forming material, the film-forming rate can be increased. By using different kinds of film-forming materials to form films simultaneously or sequentially, films including layers of a plurality of film-forming materials can also be formed.

(2) The number of the film forming sections 100 may be plural. That is, the film forming section 100 may be provided at a plurality of stop positions of the carrier. The film formation rate can be increased by increasing the number of film formation portions 100 using a common film formation material. By forming films simultaneously or sequentially using different types of film forming materials in the plurality of film forming portions 100, a film including a layer of the plurality of film forming materials can be formed. The structure for generating plasma in the film forming section 100 is not limited to a specific type.

(3) In addition to the film forming section 100, a processing section that performs plasma etching, ashing, other surface modification, cleaning, formation of a compound film, and the like may be provided at any stop position. The structure for generating plasma in the processing section is not limited to a specific type.

(4) The shape of the object to be film-formed is not limited to the shape shown in the above embodiment. Although the film formation target is optimal for a film formation target whose film formation target surface is flat, even for a film formation target surface that is not flat, the film formation material can be uniformly deposited in the film formation region.

(5) The jig J is illustrated as a circular ring having a shape capable of fitting the substrate S, but is not limited to a circular shape, and may be a rectangular or polygonal ring. The substrate S may be a plate body having a shape capable of being placed thereon. In addition, a recess for accommodating the substrate S may be formed at the mounting position of the substrate S. The number of workpieces W (substrates S mounted on the jigs J) that can be mounted on the revolving unit 42 is not limited to the above-described configuration. The substrate S may not be mounted on the jig J. That is, the jig J may not be used. In this case, the workpiece W is only the substrate S as a film formation target, and the workpiece contact surface 41a contacts the back surface of the substrate S. In addition, the materials of the upper jig Ju, the lower jig Jd, and the spacers Js may be appropriately selected. For example, a part or all of the upper jig Ju, the lower jig Jd, and the spacers Js may be made of a magnetic material. When a part of these members is a magnetic material, a part of the region facing the region where the magnet Jm is provided may be a magnetic material, and the other region may be a metal that is a non-magnetic material.

(6) The conveyance device is not limited to the turntable 3. The support portion or the revolution unit 42 may be a rotating body that rotates while being held by arms extending radially from a rotation center. The number of the revolution units 42 on which the workpieces W conveyed by the conveyor and simultaneously processed are mounted and the number of the supporting portions for supporting the same are not limited to the above-described configuration.

(7) The film forming section 100 may be located on the installation surface side of the chamber 2, on the opposite side, or on the side surface side. The direction in which the rotation unit 42 is moved into and out of the film formation chamber 110 and the processing chamber may be from the installation surface side of the film formation chamber 110, from the opposite side, or from the side surface.

(8) In the above embodiment, the direction corresponding to the gravity is set to the lower side, and the direction against the gravity is set to the upper side. The lifting at this time is an up-down motion. However, the arrangement direction of the film forming apparatus 1 is not limited to this, and for example, the vertical relationship between the turntable 3 and the film forming chamber 110 may be reversed. The turntable 3 is not limited to the horizontal one, and may be arranged vertically or obliquely. The deposition apparatus 1 may be provided with a floor surface, a ceiling surface, or a side wall surface.

(9) The film formation by the film formation section 100 may be performed on only one surface of the workpiece W. That is, the inversion unit 200 may not be used, and the apparatus may be provided without the inversion unit 200.

(10) The conversion mechanism 423 is not limited to the above-described configuration. For example, a pair of rollers (for example, fluorine-based resin) having flat surfaces at the portions contacting each other may be used as the transmission portion and the rotation member. The fixed transmission portion may be a flange, and the rotating member that rotates may be a pulley having a groove that contacts the outer periphery of the flange. The transmission unit may include a timing belt for transmitting rotation to the rotation member, and may synchronize rotation of the shaft 420 and the support shaft 422 via the timing belt. The transmission portion is not limited to a fixed portion, and may be rotatable together with the shaft portion 420.

(11) In this embodiment, the revolution unit 42 is provided so as to be capable of mounting a plurality of workpieces W, and the rotation unit 44 rotates the shaft 420 in a state where the plurality of workpieces W are accommodated in the film formation chamber 110, thereby revolving the plurality of trays 41 and rotating the respective trays 41. That is, in the above-described embodiment, a plurality of workpieces W are deposited while being rotated by the rotation unit 42, and a single workpiece W may be deposited by being mounted by the rotation unit 42. The revolution unit 42 may be a device capable of carrying only one workpiece W and forming a film while revolving the workpiece W. Even in this case, the effect of uniform film thickness due to the revolution can be obtained.

(12) The mounting device may supply and discharge the workpiece W to and from the revolving unit 42 mounted on the mounting table T. For example, the mounting device may sequentially or simultaneously mount the workpieces W on the tray 41 of the revolving unit 42 on the mounting table T. The loading device may sequentially or simultaneously carry out the work W from the tray 41 of the revolving unit 42 on the loading table T. This suppresses the number and movement amount of the revolution units 42 having a large weight and size. The workpiece W is placed on the jig J by another unit not shown, and is supplied to the mounting device. A stocker for accommodating a plurality of workpieces W may be provided. Instead of another unit (place) for placing the workpiece W, a stocker may be used.

The substrate S may be placed on the lower jig Jd and the spacer Js remaining on the tray 41 of the revolving unit 42 on the mounting table T sequentially or simultaneously, or the upper jig Ju may be placed on the substrate S sequentially or simultaneously. The upper jigs on the tray 41 of the revolving unit 42 on the mounting table T may be sequentially or simultaneously taken out, or the substrate S may be sequentially or simultaneously taken out from the lower jigs Jd and the spacers Js. There may be a plurality of jigs J and a stocker for the substrate S.

Other embodiments

The present invention is not limited to the above-described embodiments, and structural elements may be modified and embodied in an implementation stage within a range not departing from the gist thereof. In addition, various inventions can be formed by appropriate combinations of the plurality of constituent elements disclosed in the above embodiments. For example, some of the constituent elements may be deleted from all the constituent elements shown in the embodiment modes. Further, the constituent elements in the different embodiments may be appropriately combined.

Claims (5)

1. A film forming apparatus includes:

a film forming section for forming a film on a workpiece mounted on a tray by sputtering in a film forming chamber having a target;

a revolution unit that revolves the tray around a shaft portion and rotates the tray around a support shaft that supports the tray as a center as the shaft portion rotates;

a transport body that transports the tray on which the workpiece is mounted together with the revolving unit to a position facing the film forming section;

a pusher unit that is provided so as to be capable of contacting and separating with the revolving unit, separates the revolving unit from the conveyance body by contacting and applying a force to the revolving unit, and moves the revolving unit between a storage position in which the tray on which the workpiece is mounted is stored in the film forming chamber and a separation position in which the revolving unit is mounted on the conveyance body by being separated from the revolving unit, and separates the revolving unit from the film forming chamber; and

And a rotation unit configured to rotate the shaft portion in a state where the tray on which the workpiece is mounted is housed in the film forming chamber, thereby rotating the tray while revolving.

2. The film forming apparatus according to claim 1, wherein,

the revolution unit has a switching mechanism,

the conversion mechanism converts rotation of the shaft portion into rotation of the support shaft.

3. The film forming apparatus according to claim 2, wherein,

the conversion mechanism includes:

a transmission unit that transmits rotation of the shaft unit; and

and a rotation member that transmits rotation of the shaft portion via the transmission portion to rotate the support shaft.

4. The film forming apparatus according to claim 1, wherein,

the revolution unit is provided to be capable of mounting a plurality of the trays,

the rotation unit rotates the shaft portion in a state where the plurality of trays are accommodated in the film forming chamber, thereby revolving the plurality of trays and rotating the respective trays.

5. The film forming apparatus according to claim 1, wherein,

the revolution unit is provided so as to be capable of carrying in and out the workpiece with respect to the carrier in a state in which the workpiece is placed on the pallet.