KR102265176B1 - Film formation apparatus - Google Patents

Abstract

A film forming apparatus excellent in cooling efficiency of a workpiece is provided.
A carry-in/out unit 100 for moving the work W into and out of the chamber 2, and the susceptor S on which the work W is mounted, which is disposed inside the chamber 2, is transferred by rotation. The rotating body 3 and the work W introduced from the opening OP are disposed along the circumference about the rotational axis of the rotating body 3 and have an opening OP that communicates with the chamber 2 . A plurality of processing units PR to be processed, and a pusher 500 for pushing the susceptor S in a direction in which the workpiece W is separated from the rotating body 3 and introduced into the processing unit PR from the opening OP. The plurality of processing units PR includes a heating unit 200 for heating the work W, a film forming unit 300 for forming a film on the work W, and a cooling unit for cooling the work W ( 400 , the rotating body 3 holds the susceptor S conveyed by the rotating body 3 , and opens the susceptor S by being pushed by the pusher 500 . The part 33 is provided, and the sealing part 520 which introduces the workpiece|work W into the processing part PR and seals the opening OP is provided in the pusher 500.

Description

Film forming apparatus {FILM FORMATION APPARATUS}

The present invention relates to a film forming apparatus.

As an apparatus for forming a film on the surface of a work such as a substrate, a film forming apparatus by sputtering is widely used. Sputtering is a technique utilizing the fact that ions generated by converting a gas introduced into a chamber into a plasma collide with the plane of a target, which is a film forming material, so that the film forming material is splashed and adhered to the work.

Before forming a film on the surface of the work, there is a case where a degassing treatment is performed to remove moisture and air contained in the work in advance. This is effective for preventing oxidation, for example, when a ceramic substrate that easily contains air or moisture is used as the work, and when a material that is easily oxidized such as a metal film such as copper, titanium, or tungsten is used.

The degassing treatment is performed by raising the temperature of the work to about 300 degrees. However, if the temperature conditions are changed after the degassing treatment, for example, while the multilayer film composed of a plurality of layers is formed with a plurality of film forming materials, the internal stress of the multilayer film is fluctuated. Therefore, it is necessary to perform film-forming of each layer under the same temperature conditions as much as possible, and to keep the temperature conditions from changing after a degassing process.

The work is disposed on a susceptor disposed on a rotary table that rotates intermittently through a support plate and conveyed. That is, at the stop position of the intermittently rotating rotary table, a heating chamber for performing a degassing process and a film forming chamber for performing film formation with each film forming material are arranged. Then, the workpiece comes to the heating chamber by intermittent rotation of the rotary table, and is subjected to degassing, followed by sequential film-forming in the film-forming chamber.

These processing chambers, such as a heating chamber and a film-forming chamber, are provided in the vacuum chamber, and are conveyed in vacuum between the processing chambers. For this reason, the workpiece and the susceptor heated to about 300°C during the degassing process are not cooled and are maintained at about 300°C. Then, after the film forming process is finished, if it is taken out to the air space as it is, the film formed on the high-temperature work will be oxidized. Therefore, it is necessary to cool the work before conveying it to the atmosphere. For example, the temperature of the workpiece heated up to about 300°C is lowered to about 60°C, which is a temperature required for carrying out to the air space.

As a cooling mechanism for cooling a workpiece, there is a mechanism for accommodating and sealing the workpiece in a cooling chamber and cooling the workpiece by circulating a cooling medium in the cooling chamber (see Patent Document 1). In this mechanism, the susceptor is disposed on a rotary table and transported, and in a stop position corresponding to the processing chamber, the susceptor is pushed up by a push-up mechanism having a pusher, and the processing chamber is sealed by the susceptor.

Even in a cooling chamber equipped with a cooling mechanism, a cooling plate through which a cooling medium circulates is provided on the upper cover, and the workpiece pushed up together with the susceptor by a pusher is opposed to the cooling plate and cooled in the cooling chamber sealed by the susceptor By introducing the medium, the substrate is cooled.

Japanese Patent Publication No. 4653418

Here, in order to lower the temperature to about 60 degreeC required for carrying out the board|substrate which has been heated to about 300 degreeC to the atmosphere, cooling which performs a significant temperature drop of about 240 degreeC is required. However, for example, when continuous conveyance is performed so that a series of processing is performed for about 240 seconds per tact, if the cooling time is longer than this, the cooling processing becomes a rate-limiting processing, and the throughput is influenced.

However, since cooling is performed in a vacuum, cooling of the above-described cooling plate alone is not sufficient, and in order to increase cooling efficiency, it is necessary to supply a cooling gas into the cooling chamber. When the cooling gas is introduced, the pressure in the cooling chamber increases.

On the other hand, the chamber in which the rotary table is provided maintains a vacuum. Then, the susceptor that partitions the space between the cooling chamber and the chamber needs to be strong enough to withstand the pressure difference between the chamber and the cooling chamber. For example, the susceptor is formed of a thick plate made of metal such as copper. For this reason, the heat capacity of the susceptor becomes large. Since such a susceptor is continuously heated following the work, it is necessary to cool the susceptor with a large heat capacity even when cooling the work in the cooling chamber, and the cooling efficiency is not good.

The present invention has been proposed in order to solve the problems of the prior art as described above, and an object of the present invention is to provide a film forming apparatus having excellent cooling efficiency of a work.

In order to achieve the above object, the film forming apparatus of the embodiment includes a chamber capable of evacuating the interior by evacuation, and a susceptor disposed inside the chamber and carrying the workpiece by rotation. A rotating body and a plurality of processing units disposed along a circumference about the rotational axis of the rotating body, the plurality of processing units having an opening communicating in the chamber, and processing the work introduced from the opening, wherein the work is removed from the rotating body and a pusher for pushing the susceptor away from the opening in a direction introduced into the processing unit, wherein the plurality of processing units include: a heating unit for heating the work; a film forming unit for forming a film on the work; and a cooling unit for cooling the rotating body, and the rotating body is provided with a holding unit which holds the susceptor being conveyed by the rotating body, and releases the susceptor by being pushed by the pusher, the pusher has, A sealing portion for introducing the workpiece into the processing portion and sealing the opening is provided.

ADVANTAGE OF THE INVENTION According to this invention, the film-forming apparatus excellent in cooling efficiency of a workpiece|work can be provided.

1 is a simplified perspective plan view illustrating an embodiment.
It is sectional drawing along AA which shows at the time of sealing (a) of opening by the sealing part of FIG. 1, and opening (b).
It is a top view (a), a side view (b), and a bottom view (c) which show the susceptor used for embodiment.
It is a top view which shows the rotating body of embodiment.
Fig. 5 is a plan view (a), a front view (b) showing a susceptor holding state of the holding unit, a plan view (c) and a front view (d) showing a susceptor released state.
It is a perspective view which shows the sealing part of embodiment.
Fig. 7 is a partial cross-sectional view showing the opening of the cooling unit according to the embodiment.
8 is a partial cross-sectional view showing the middle of the operation of the sealing part in the cooling part of the embodiment.
It is a partial sectional drawing which shows the time of opening sealing in the cooling part of embodiment.
Fig. 10 is a cross-sectional view taken along line BB showing (a) and open (b) of the opening by the sealing portion of Fig. 1 .
Fig. 11 is a cross-sectional view taken along line CC showing (a) and (b) opening at the time of sealing the opening by the sealing part of Fig. 1 .
12 is a block diagram showing a control device according to an embodiment.

An embodiment of the present invention (hereinafter referred to as this embodiment) will be specifically described with reference to the drawings.

[summary]

As shown in the plan view of FIG. 1 and FIG. 2 (cross-sectional view taken along line A-A in FIG. 1 ), the film forming apparatus 1 of the present embodiment is an apparatus for forming a film on individual workpieces W using plasma. The film-forming apparatus 1 has a chamber 2, is arrange|positioned inside this chamber 2, and has the rotating body 3 which conveys the workpiece|work W mounted on the susceptor S. The chamber 2 has an opening OP which is arranged along the circumference about the rotational axis of the rotating body 3 and communicated in the chamber 2, and the workpiece W introduced from the opening OP is processed. A plurality of processing units PR are provided. The plurality of processing units PR includes a heating unit 200 for heating the work W, film forming units 300A, 300B, and 300C for forming a film on the work W, and a cooling unit for cooling the work W ( 400).

Further, the chamber 2 is provided with a pusher 500 that pushes the susceptor S in the direction in which the workpiece W is introduced into the processing unit PR through the opening OP. The rotating body 3 is provided with a holding part 33 which holds the susceptor S conveyed by the rotating body 3 and opens the susceptor S by being pushed by the pusher 500 . have. The pusher 500 is provided with a sealing part 520 that accommodates the workpiece W in each processing part PR and seals the opening OP. That is, instead of sealing each processing unit PR by the susceptor S, each processing unit PR is hermetically sealed by the sealing unit 520 moving together with the pusher 500 .

[work]

In the present embodiment, a flat ceramic substrate is used as an example of the work W to be formed into a film. The film forming apparatus 1 forms a circuit including a semiconductor and wiring by film forming on a ceramic substrate. However, the kind, shape, and material of the work W are not limited to a specific one. For example, as the work W, a curved substrate having a concave portion or a convex portion at the center may be used. Further, as the work W, one containing a conductive material such as metal or carbon, one containing an insulating material such as glass or rubber, or one containing a semiconductor such as silicon may be used.

[Susceptor]

The susceptor S is a member that mounts the work W and is conveyed by the rotating body 3 . The susceptor S of this embodiment is a circular thin plate as shown in the top view of FIG.3(a), the side view of FIG.3(b), and the bottom view of FIG.3(c). An accommodating part Sa is formed on the surface of the susceptor S, and a plurality of workpieces W are mounted side by side in the accommodating part Sa. The accommodating part Sa is a recessed part which can position the some workpiece|work W so that it does not overlap. The number of the workpieces W mounted on the susceptor S is the number that can be simultaneously formed in each of the film forming units 300 . In this embodiment, since the accommodating part Sa can arrange|position the workpiece|work W in 3 rows and 3 columns, the workpiece|work W of a total of 9 sheets can be formed into a film simultaneously. However, this number is not limited to a specific number. A leg portion Sb protruding in a ring shape is formed on the back surface of the susceptor S. Here, the susceptor S does not have the strength to withstand the pressure difference between the inside of the sealed processing unit PR and the inside of the chamber 2 .

[chamber]

The chamber 2 is a container which can make the inside into a vacuum, as shown in FIG.1 and FIG.2. The chamber 2 of this embodiment has a rectangular parallelepiped shape, and has a box-shaped container 21 on the installation surface side, and a plate-shaped cover body 22 whose opposite side seals the opening of the container 21 . The chamber 2 is provided with a chamber exhaust 23 . The chamber exhaust part 23 of this embodiment has piping connected to the opening formed in the container 21. As shown in FIG. The chamber exhaust part 23 is comprised including the pneumatic circuit (not shown), and enables the pressure reduction in the chamber 2 by exhaust processing.

[Rotating body]

The rotating body 3 is a rotating table which hold|maintains the susceptor S on which the workpiece|work W is mounted, and rotates intermittently every predetermined angle, as shown in FIG. The rotating body 3 of this embodiment is a circular plate-shaped body. The rotating body 3 intermittently rotates centering on the shaft 31 by a drive source (not shown) (refer FIG. 2). The rotating body 3 is provided with a space|gap part 32 through which the sealing part 520 cross|intersects the rotation plane. The space|gap part 32 is the part which cut out the edge part of the rotating body 3 in a partial circular shape at the circumferential equidistant position. As shown in FIG. 1, the space|gap part 32 is several processing part PR, ie, the carrying-in/out part 100, the heating part 200, the film-forming part 300A, the film-forming part 300B, and the film-forming part. (300C), corresponding to the cooling part 400, six are provided at intervals of 60 degrees. The air gap 32 is formed so that the size of its inner edge allows the sealing part 520 to pass therethrough. For example, the diameter of the partial circle parallel to the plane of rotation is larger than the diameter of the seal 520 .

[maintenance department]

As shown in FIG. 5 , the holding part 33 releases the holding state and the susceptor S for holding the susceptor S while the sealing part 520 passes through the gap 32 . is converted from a state of liberation. A pair of holding parts 33 are arrange|positioned at the position opposing the conveyance direction in the space|gap part 32. As shown in FIG. The holding part 33 has a base 331 , a conversion part 332 , an arm 333 , and a pressing member 334 .

The base 331 is a plate-shaped member attached to the inner edge of the cavity 32 . The converting unit 332 is a pair of members rotatably attached to the base 331 , and converts the operation of the sealing unit 520 into rotation in a direction parallel to the rotation plane of the rotating body 3 . A pair of conversion parts 332 are arranged side by side in the direction orthogonal to the rotation direction of the rotating body 3 . The conversion part 332 is provided with a roller 332a which is pushed in the direction away from the edge part of the susceptor S by the protrusion part 523 mentioned later formed in the sealing part 520. As shown in FIG. The rollers 332a of the pair of converting parts 332 are pressed against the protruding part 523, thereby rotating each of the converting parts 332 in opposite directions using the shaft 332b as a rotation axis.

The arm 333 is a pair of elongated plates, and one end is fixed to the converter 332 . The other end of the arm 333 extends to the edge of the susceptor (S). At the other end of the arm 333, a gripping portion (S) that grips the susceptor (S) by being in contact with the edge of the susceptor (S), and opens the susceptor (S) by moving away from the edge of the susceptor (S). 333a) is provided. The gripping portion 333a includes a contact surface 333b to which an end surface of the susceptor S abuts when gripping the susceptor S, and a back surface of the susceptor S to bring the susceptor S into contact with the arm ( 333) has a holding surface 333c. The pair of arms 333 switch between a holding position in which the grip portion 333a grips the edge of the susceptor S and a retracted position in which the grip portion 333a opens the susceptor S. It is provided to be able to rotate with the part 332 . The state in which the grip part 333a is in the holding position is the holding state, and the state in which the grip part 333a is in the retracted position is the released state.

The pressing member 334 is a member that presses the converter 332 in a direction in which the gripping portion 333a comes into contact with the edge portion of the susceptor S. The pressing member 334 may be a spring provided between the base 331 and the converter 332 . For example, in this embodiment, a tension coil spring is used as the urging member 334 . The pressing member 334 spans between the plate material 334a fixed to the base 331 and the wave material 334b fixed to the converter 332 by floating from the base 331 .

The pair of arms 333 is held in a holding position in which the grip portion 333a grips the edge portion of the susceptor S by the pressing force of the pressing member 334 . In each stop position corresponding to the processing part PR, the roller 332a is pushed by the protrusion 523, and the arm 333 rotates together with the converting part 332, so that the holding part 333a is a susceptor. Move to the retracted position to open (S). When the pressing force of the roller 332a by the protrusion 523 is released, by the pressing force of the pressing member 334, the arm 333 has the gripping portion 333a gripping the edge of the susceptor S. return to the holding position. When the arm 333 is in the retracted position, the seal 520 may pass. That is, the gripping portion 333a of the arm 333 in the retracted position becomes a position in contact with an imaginary circle having a larger diameter than the maximum diameter of the sealing portion 520 including the protruding portion 523 .

[Pusher]

As shown in Figs. 2, 9 and 10 (cross-sectional view taken along line BB in Fig. 1), the carry-in/out unit 100, the heating unit 200, the film forming unit 300A, the film forming unit 300B, the film forming unit ( 300C) and corresponding to the cooling part 400, respectively, pushers 500A-500F are provided. Hereinafter, when the pushers 500A-500F are not distinguished, it demonstrates as the pusher 500. FIG.

The pusher 500 has a shaft 510 and a seal 520 . The shaft 510 is a cylindrical member as shown in FIG. 2, and moves along an axis by a drive source (not shown). As a drive source, an air cylinder, a motor, etc. can be used, for example.

The sealing part 520 is provided at the front end of the shaft 510 and is a member contacting/separating the opening OP. The sealing part 520 is a cylindrical member coaxial with the shaft 510, as shown in FIG. The seal 520 has a mounting table 521 , a seal 522 , and a protrusion 523 . The mounting table 521 is provided on the side facing the rotating body 3 and is a cylindrical part that pushes the susceptor S toward the opening OP. The surface of the mounting table 521 facing the susceptor S is a mounting surface having a diameter equal to or slightly smaller than the inner diameter of the leg portion Sb so as to fit inside the leg portion Sb of the susceptor S. 521a). The sealing body 522 is supported coaxially by the shaft 510 and is a cylindrical portion having a larger diameter than the mounting table 521 . The surface of the sealing body 522 facing the rotating body 3 is a sealing surface 522a formed in an annular shape around the mounting table 521 . A sealing material 522b such as an O-ring is provided on the sealing surface 522a.

As shown in FIG. 9, each processing part PR is sealed by the sealing surface 522a of the sealing body 522 contacting the edge part of the opening OP. The mounting table 521 has a smaller diameter than the opening OP because the susceptor S is arranged and accommodated in the processing unit PR. The sealing surface 522a of the sealing body 522 has a smaller diameter than the void 32 to pass through the void 32 , but has a larger diameter than the opening OP to seal the opening OP. .

In the present embodiment, the protrusion 523 is a rectangular parallelepiped-shaped portion that bulges out from the outer periphery of the sealing body 522 and extends in the axial direction of the shaft 510 . The end surface of the protrusion 523 on the sealing surface 522a side is an inclined surface 523a. The inclined surface 523a is a flat surface inclined so that the length in the axial direction of the protrusion 523 becomes shorter as it goes outward from the outer periphery of the sealing body 522 . The outer peripheral surface 523b of the protrusion 523 is a flat surface that is continuous to the inclined surface 523a and extends in the axial direction. As shown in FIG. 5, this inclined surface 523a and the outer peripheral surface 523b contact/separate the roller 332a of the holding part 33 according to the movement of the sealing part 520, and rotate the arm 333. make it For this reason, the cam mechanism which uses the inclined surface 523a and the outer peripheral surface 523b as a main cam and the roller 332a as a driven cam is comprised.

7 and 8, when the sealing portion 520 moves toward the opening OP and the inclined surface 523a pushes the roller 332a, the arm 333 moves to the retracted position as described above. As it rotates, the susceptor S is opened. Further, the mounting surface 521a of the mounting table 521 enters the inside of the leg portion Sb of the susceptor S. When the sealing part 520 passes through the gap part 32, as shown in FIG. 9, the sealing surface 522a comes in contact with the end of the opening OP through the sealing material 522b, and it seals. That is, the sealing unit 520 opens and closes the opening OP of the processing unit PR according to the movement of the pusher 500 . In addition, although the holding part 33 of FIGS. 7-11 abbreviate|omitted and illustrated some members, such as a press member, it has the structure similar to FIG.

The sealing part 520 of the pushers 500A-500F closes the opening OP of each chamber of the carry-in/out part 100, the heating part 200, the film-forming parts 300A-300C, and the cooling part 400, respectively. sealed Here, in the load lock chamber 121 configured in the carry-in/out unit 100 to be described later, the pressure difference between the atmospheric pressure inside the vacuum chamber 2 and the outside becomes large. In addition, the cooling chamber 410 constituting the cooling unit 400 has a pressure of 1000 Pa to less than atmospheric pressure which is almost close to atmospheric pressure at the time of introduction of the cooling gas, and the pressure difference with the inside of the vacuum chamber 2 becomes large. For this reason, the sealing part 520 is strong enough to withstand such a pressure difference.

[Import and export department]

As shown in FIG. 2 , the carry-in/out unit 100 transfers the unprocessed workpiece W from the outside while maintaining the vacuum inside the chamber 2 through the transfer unit 110 and the load lock chamber 121 . It is carried in to the inside of the chamber 2, and the processed workpiece|work W is carried out to the outside of the chamber 2.

As shown in Figs. 1 and 2 , the conveying unit 110 is a conveying mechanism TR such as a conveyor which conveys the susceptor S on which the work W is mounted, from the previous step to the subsequent step. An unprocessed workpiece W is picked up from the , and delivered to a load lock chamber 121 to be described later. Moreover, the conveyance part 110 receives the processed workpiece|work W from the load lock chamber 121, and delivers it to the conveyance mechanism TR.

The carrying unit 110 has an arm 111 and a holding body 112 . The arm 111 is a long member provided between the conveyance mechanism TR and the chamber 2 in the direction parallel to the plane of the rotation body 3 . The arm 111 is provided so as to be able to rotate intermittently by 180 degrees about an axis parallel to the rotation axis of the rotating body 3 and to be movable along this axis by a drive mechanism (not shown).

The holding body 112 is provided at both ends of the arm 111 and is a member for holding the work W. As shown in FIG. The holding body 112 holds the workpiece W by a holding mechanism such as a vacuum chuck, an electrostatic chuck, or a mechanical chuck. The holding body 112 also functions as a cover body for opening and closing the load lock chamber 121 . That is, the holding body 112 is provided with a sealing material such as an O ring for sealing the load lock chamber 121 . Further, the conveying mechanism TR includes a pusher that moves the susceptor S on which the workpiece W is mounted between the conveying mechanism TR and the holder 112 by moving by a driving mechanism not shown. is provided.

The load lock chamber 121 enables the susceptor S to be carried in and out while the vacuum in the chamber 2 is maintained. The load lock chamber 121 is surrounded by the inner surface of the through hole formed in the cover body 22 of the chamber 2 , and is a space capable of accommodating and sealing the work W held by the holder 112 . In the load lock chamber 121 , the end of the chamber 2 on the outer side has an opening 121a and is sealed by the holding body 112 . Further, in the load lock chamber 121 , the inner end of the chamber 2 is an opening 121b. This opening 121b corresponds to the opening OP sealed by the sealing part 520 .

Further, although not shown in the drawings, the load lock chamber 121 is connected to a pneumatic circuit and is connected to an exhaust line, a valve, or the like, which is a path for depressurizing the sealed load lock chamber 121 , to perform vacuum break of the load lock chamber 121 There is a vent line for this.

[Heating part]

As shown in FIG. 10 (cross-sectional view taken along line B-B in FIG. 1), the heating unit 200 performs a degassing process for discharging moisture and air contained in the work W by heating. The heating unit 200 includes a heating chamber 210 and a heater 220 . The heating chamber 210 is an interior space of a vessel having an opening 210a facing into the chamber 2 . As described above, the end of the opening 210a is sealed by the sealing surface 522a of the sealing body 522, and the workpiece W disposed on the susceptor S is accommodated in the heating chamber 210 ( 10(b) state). This opening 210a corresponds to the opening OP sealed by the sealing part 520 .

The heater 220 is a device in which a heating element that generates heat by energization is incorporated in a disk-shaped member disposed in a direction parallel to the rotational plane of the rotating body 3 inside the heating chamber 210 . The diameter of the heater 220 is preferably equal to or slightly larger than that of the work W in order to uniformly heat the work W. The heater 220 faces the work W accommodated in the heating chamber 210 in a non-contact manner. In addition, although not illustrated, a power source for generating heat by applying electric power is connected to the heat generating element of the heater 220 . Considering that the work W is a ceramic substrate, in order to effectively perform the degassing process, the heating temperature by the heater 220 is preferably set to about 300° C., but is not limited thereto.

[The Tabernacle Department]

The film forming units 300A, 300B, and 300C form a film on the work W by sputtering. In the following description, when the film-forming parts 300A, 300B, and 300C are not distinguished, it demonstrates as the film-forming part 300. FIG. The film-forming part 300 has the film-forming chamber 310 and the target 320, as shown to FIG. 2, FIG. 10, and FIG. 11 (C-C sectional drawing of FIG. 1). The film formation chamber 310 is an internal space of a container having an opening 310a facing into the chamber 2 , and, as described above, an end of the opening 310a by the sealing surface 522a of the sealing body 522 . is sealed, and the work W disposed on the susceptor S is accommodated in the deposition chamber 310 (state in Fig. 10(b)).

The target 320 is a member formed of a film-forming material that is deposited on the work W by sputtering and becomes a film. The target 320 is hold|maintained by the backing plate (not shown), and is connected to the power supply via an electrode. As a film-forming material, silicon, niobium, tantalum, titanium, aluminum, etc. are used, for example. However, as long as it is a material formed into a film by sputtering, various materials can be applied. In this embodiment, although the target 320 of a different film-forming material is used in film-forming part 300A, 300B, 300C, you may use the target 320 of a common film-forming material.

Although not shown, the film forming unit 300 is provided with a sputtering gas introduction unit for introducing sputtering gas into the film forming chamber 310 and an exhaust unit for discharging the sputtering gas. As the sputtering gas, for example, an inert gas such as argon gas can be used. The sputtering gas introduction unit includes a gas supply circuit, and makes it possible to introduce the sputtering gas from the supply source into the deposition chamber 310 . The exhaust section includes a pneumatic circuit, and enables pressure reduction in the film formation chamber 310 by exhaust treatment. In the film forming unit 300 , by applying electric power to the target 320 by a power source, the sputtering gas introduced into the film forming chamber 310 can be turned into plasma, and the film forming material can be deposited on the work W.

[Cooling part]

The cooling unit 400 cools the work W before being discharged to the atmosphere to a temperature that can prevent the film from being oxidized in the air. 7 and 11 , the cooling unit 400 includes a cooling chamber 410 and a first cooling mechanism 420 . The cooling chamber 410 is the interior space of the vessel having an opening 410a facing into the chamber 2 . As described above, the end of the opening 410a is sealed by the sealing surface 522a of the sealing body 522 , and the work W disposed on the susceptor S is accommodated in the cooling chamber 410 . This opening 410a corresponds to the opening OP sealed by the sealing part 520 .

The first cooling mechanism 420 has a cooler 421 and a cooling gas inlet 422 . The cooler 421 is a device in which the cooling liquid circulation path 423 is incorporated in a cylindrical member disposed in a direction parallel to the rotation plane of the rotating body 3 inside the cooling chamber 410 . The cooling liquid circulation path 423 is formed in the cooler 421 and includes a threaded portion coaxial with the cooler 421 , and is a passage through which the cooling liquid can circulate. The cooling liquid circulation path 423 is connected to a cooling liquid supply source (not shown), and is connected to a pipe for circulating and supplying the cooling liquid into the cooling liquid passage.

The cooling gas introduction unit 422 has a pipe through which the cooling gas G is introduced. For example, an inert gas such as nitrogen can be used as the cooling gas G. In particular, when high-purity nitrogen containing no moisture is used, oxidation of the formed film can be prevented. The cooling gas introduction unit 422 includes a gas supply circuit (not shown), and makes it possible to introduce the cooling gas G from the supply source into the cooling chamber 410 .

In addition, the sealing part 520 provided in the pusher 500F corresponding to the cooling part 400 functions as the second cooling mechanism 430 . The second cooling mechanism 430 includes a cooling liquid circulation path 431 and a cooling liquid supply unit 432 . The cooling liquid circulation path 431 is formed in the sealing part 520 and includes a threaded portion coaxial with the sealing part 520 , and is a passage through which the cooling liquid can circulate. The cooling liquid supply unit 432 has a pipe through which the cooling liquid is introduced. The cooling liquid supply unit 432 is connected to a cooling liquid supply source (not shown), and circulates and supplies the cooling liquid into the cooling liquid circulation path 431 .

As described above, in order to set the temperature at which the film formed is prevented from being oxidized when taken out to the air space, the cooling temperature by the cooler 421 and the cooling gas G is preferably set to be about 60 ° C. , but not limited thereto.

Furthermore, the cooling unit 400 has a cooling chamber exhaust unit 424 for adjusting the internal pressure of the cooling chamber 410 . The cooling chamber exhaust part 424 of the present embodiment has a pipe connected to an opening formed in the cooling chamber 410 . The cooling chamber exhaust unit 424 includes a pneumatic circuit (not shown), and enables pressure reduction in the cooling chamber 410 by exhaust treatment. Moreover, the cooling part 400 is provided with the pressure sensor (not shown) which detects the internal pressure of the cooling chamber 410, and the temperature sensor (not shown) which detects the temperature inside the cooling chamber 410. FIG. The pressure sensor constitutes a pressure monitor for monitoring the internal pressure of the cooling chamber 410 together with a control device 70 and an output device 79 which will be described later. The temperature sensor, together with the control device 70 and the output device 79 , constitutes a temperature monitor that monitors the temperature inside the cooling chamber 410 .

[controller]

The control device 70 is a device that controls each unit of the film forming device 1 as shown in FIG. 12 . The control device 70 can be configured by, for example, a dedicated electronic circuit or a computer operating with a predetermined program. Control contents of the carry-in/out unit 100, the heating unit 200, the film forming units 300A to 300C, and the cooling unit 400 are programmed and executed by a processing device such as a PLC or a CPU.

The control device 70 functions as shown in the block diagram of FIG. 12 by the above program. That is, the control device 70 includes the mechanism control unit 71 , the heating control unit 72 , the film forming control unit 73 , the cooling control unit 74 , the storage unit 75 , the setting unit 76 , and the input/output control unit 77 . has

The mechanism control unit 71 controls a driving source, a valve, a power supply, and the like of each unit. The heating control unit 72 controls the heating temperature by controlling the power of the heater 220 . The film-forming control part 73 controls the film-forming amount by controlling the introduction amount of the power applied to the target 320, and sputtering gas. The cooling control unit 74 controls the cooling temperature by controlling the temperature of the cooling liquid of the first cooling mechanism 420 and the second cooling mechanism 430 , and the supply amount of the cooling gas G . The storage unit 75 stores information necessary for the control of the present embodiment. The setting unit 76 sets information input from the outside in the storage unit 75 . For example, the setting unit 76 sets the heating temperature of the heating unit 200 corresponding to the target temperature for heating, the cooling temperature of the cooling unit 400 corresponding to the target temperature for cooling, and the exhaust of the cooling chamber 410 . A predetermined temperature, a predetermined pressure, a predetermined time, etc. for controlling are set.

The input/output control unit 77 is an interface that controls signal conversion and input/output between each unit to be controlled. In addition, an input device 78 and an output device 79 are connected to the control device 70 . The input device 78 is an input means such as a switch, a touch panel, a keyboard, and a mouse for the operator to operate the film forming apparatus 1 via the control device 70 .

The output device 79 is an output means, such as a display, a lamp, a meter, which makes the information for confirming the state of an apparatus into a state which an operator can visually recognize. For example, the output device 79 may display an input screen of information from the input device 78 . For example, by displaying the pressure and temperature inside the cooling chamber 410, the operator can monitor it.

[action]

The process of forming a film on the workpiece|work W by the film-forming apparatus 1 by the above-mentioned this embodiment is demonstrated with reference to said drawing. In addition, each processing part PR in the film-forming apparatus 1 can carry out the processing with respect to each workpiece|work W in parallel while simultaneously conveying the some susceptor S, but in the following description, one Pay attention to the work (W) arranged on the susceptor (S) of the description.

(Bringing in of work)

First, the operation|movement of carrying in the workpiece|work W to be film-formed by the carrying-in/out part 100 into the chamber 2 is demonstrated. As shown in Fig. 2(a), the gap portion 32 of the rotating body 3 is positioned at a position opposite to the opening 121b of the carry-in/out portion 100, and is attached to the pusher 500A. The opening 121b is sealed by the sealing body 522 of the sealing part 520 pushed by the In addition, the inside of the chamber 2 is made into a vacuum by the exhaust process of a pneumatic circuit.

In this state, as shown in FIG. 1 , the susceptor S on which the unprocessed workpiece W being conveyed by the conveying mechanism TR is mounted is pushed by a pusher (not shown), and the conveying unit ( It is held by the holder 112 of the 110). When the arm 111 rotates, the susceptor S on which the unprocessed workpiece W is mounted comes to a position facing the opening 121a. The arm 111 moves in a direction approaching the opening 121a so that the holding body 112 seals the opening 121b, thereby sealing the load lock chamber 121 .

By evacuating from the exhaust line by the pneumatic circuit, the load lock chamber 121 is depressurized until it becomes equal to the inside of the chamber 2 . When the holding body 112 releases the holding of the work W, the work W is placed on the arrangement surface 521a of the sealing portion 520 sealing the load lock chamber 121 . At this time, as shown in FIG.5(c), (d), the roller 332a is pushed by the protrusion part 523, and the holding|gripping tool 333a exists in a retracted position. And, as shown in FIG.2(b), FIG.5(a), (b), when the pusher 500A passes through the space|gap part 32 of the rotating body 3, the roller 332a is a protrusion part. Falls from (523). Then, the arm 333 rotates, and the holding part 333a grasps the susceptor S on which the workpiece|work W was mounted.

(Heating of the work piece)

Next, the process of heating the workpiece|work W carried in into the chamber 2 is demonstrated. In the heating unit 200, it is assumed that the heater 220 is previously heated to a set temperature. As shown in FIG. 10( a ), when the rotating body 3 rotates intermittently, the susceptor S moves directly below the opening 210a of the heating chamber 210 of the heating unit 200 . Then, the pusher 500b is moved in a direction approaching the opening 210a. Then, as the pusher 500b passes through the gap portion 32 of the rotating body 3, the roller 332a is pushed by the protrusion 523, the arm 333 rotates, and the gripping portion 333a is Retracted from the susceptor (S), the susceptor (S) is disposed on the placement surface (521a). Further, when the pusher 500b moves in the direction approaching the opening 210a, the sealing surface 522a of the sealing body 522 hermetically seals the end surface of the opening 210a. Thereby, as shown in FIG.10(b), the workpiece|work W is accommodated in the heating chamber 210 together with the susceptor S.

Since the work W opposes at a position close to the heater 220 , the work W is heated to a set temperature by the heated heater 220 . After the workpiece W is heated, by moving the pusher 500b in a direction away from the opening 210a, the opening 210a is opened and the workpiece W mounted on the susceptor S of the placement surface 521a. ) is discharged from the heating chamber 210 . In the process in which the pusher 500b passes through the void 32 of the rotating body 3, as described above, the arm 333 of the holding part 33 rotates, and the holding part 333a becomes the susceptor ( S) is gripped, and the mounting surface 521a is separated from the susceptor S.

(film forming process)

With respect to the workpiece W subjected to the heat treatment as described above, a process for forming a film in the film forming unit 300A, the film forming unit 300B, and the film forming unit 300C will be described. In addition, since the processes in the film-forming part 300A, the film-forming part 300B, and the film-forming part 300C are common, the process in the film-forming part 300A is mainly demonstrated.

As shown to Fig.11 (a), the workpiece|work W is moved to the position opposing the opening 310a of 300A of film-forming part 300A by rotating the rotating body 3 intermittently. And, similarly to the above, by moving the pusher 500c in a direction approaching the opening 310a, the work W moves together with the susceptor S into the film forming chamber 310 . Then, as shown in FIG.11(b), the sealing surface 522a of the sealing body 522 hermetically seals the edge part of the opening 310a. Accordingly, the deposition chamber 310 is sealed.

In this state, sputtering gas is introduced into the deposition chamber 310 , and electric power is applied to the target 320 by a power supply. Then, ions generated by the sputtering gas become plasma collide with the target 320 . The film-forming material constituting the target 320 is beaten by ions and deposited on the work W.

After the film-forming material is deposited on the work W, the sputtering gas is discharged from the film-forming chamber 310 to make the pressure of the film-forming chamber 310 equal to that of the chamber 2 . Then, when the pusher 500 is moved in a direction away from the opening 310a, as described above, the opening 310a of the deposition chamber 310 is opened, and the workpiece W is formed together with the susceptor S. discharged from the seal 310 . In addition, when the pusher 500 moves, the susceptor S is held by the holding part 33 and the mounting surface 521a is separated from the susceptor S.

By intermittently rotating the rotating body 3, as shown in FIG.2(b), the workpiece|work W is moved just below the opening 310a of the film-forming part 300B together with the susceptor S. Then, the film forming process as described above is also performed in the film forming unit 300B. By intermittently rotating the rotating body 3 after film formation in the film forming unit 300B, as shown in FIG. 10 , the workpiece is directly below the opening 310a of the film forming unit 300C together with the susceptor S. W) is moved. Then, the film forming process as described above is also performed in the film forming unit 300C.

(workpiece cooling)

The process of cooling the workpiece|work W in which the film-forming process was made as mentioned above is demonstrated. Moreover, the cooling liquid is circulating in the cooler 421 of the 1st cooling mechanism 420 in advance, and it is cooled to the set temperature. In addition, the cooling liquid circulates also in the cooling liquid circulation path 431 of the second cooling mechanism 430 , and is cooled to a set temperature.

As shown in FIGS. 7 and 11( a ), the work W on which the film has been formed is moved together with the susceptor S under the opening 410a of the cooling chamber 410 of the cooling unit 400 . Similarly to the above, as shown in Fig. 8, the pusher 500F is moved in the direction approaching the opening 410a, and together with the susceptor S as shown in Figs. 9 and 11(B). The work W is accommodated in the cooling chamber 410 and the end of the opening 410a is hermetically sealed by the sealing surface 522a of the sealing body 522 . Accordingly, the cooling chamber 410 is sealed.

In this state, the cooling gas G is introduced into the deposition chamber 310 by the cooling gas introduction unit 422 . At this time, the internal pressure of the cooling chamber 410 reaches a pressure of 1000 Pa to less than atmospheric pressure, which is almost close to atmospheric pressure. Then, the work W disposed in the susceptor S is cooled at high speed by the cooler 421 and the cooling gas G of the first cooling mechanism 420 and the second cooling mechanism 430 . When the temperature of the cooling chamber 410 detected by the temperature sensor reaches a predetermined temperature, the atmosphere in the cooling chamber 410 is exhausted by the cooling chamber exhaust unit 424 . When the internal pressure of the cooling chamber 410 detected by the pressure sensor becomes the same as that of the chamber 2 , exhaust by the cooling chamber exhaust unit 424 is stopped. By such an exhaust operation, the internal pressure of the cooling chamber 410 raised by introducing the cooling gas G into the sealed cooling chamber 410 returns to the same pressure as the chamber 2 .

After that, when the pusher 500F is moved in a direction away from the opening 410a, the opening 410a of the cooling chamber 410 is opened, and the work W is discharged from the cooling chamber 410 as described above. and the susceptor S is held by the holding part 33, so that the mounting surface 521a is separated from the susceptor S.

(removing work)

In addition, the operation of carrying out the work W cooled after film formation by the carrying-in/out unit 100 out of the chamber 2 will be described. By intermittently rotating the rotating body 3, as shown in Fig. 2(b) , the work W is moved together with the susceptor S directly below the opening 121b of the load lock chamber 121 .

As shown in FIG. 2( a ), by moving the pusher 500A in a direction approaching the opening 121b , the work W moves together with the susceptor S into the load lock chamber 121 . Then, the sealing surface 522a of the sealing body 522 hermetically seals the end of the opening 121b. Accordingly, the load lock chamber 121 is sealed. The susceptor S on which the processed workpiece W is placed is held by the holding body 112 sealing the opening 121a of the load lock chamber 121 . Then, the vacuum in the load lock chamber 121 is broken by supplying the vent gas through the vent line. By moving the arm 111 in a direction away from the opening 121a , the holding body 112 is moved to open the load lock chamber 121 .

As shown in FIG. 1 , when the arm 111 rotates, the holding body 112 holding the susceptor S comes to a position facing the conveying mechanism TR and approaches the holding body 112 . The pusher moved in the direction supports the susceptor (S), and the holding body 112 releases the holding of the susceptor (S). And after the pusher arrange|positions the susceptor S to the conveyance mechanism TR and retreats, the conveyance mechanism TR conveys the processed workpiece|work W to a subsequent process.

[effect]

The film forming apparatus 1 of the present embodiment includes a chamber 2 capable of evacuating the inside by evacuation, and a workpiece W inside the chamber 2 while maintaining the vacuum in the chamber 2 . A carry-in/out unit 100 for loading and unloading, a rotating body 3 disposed inside the chamber 2 and carrying a susceptor S on which a workpiece W is mounted by rotation, and a rotating body 3 A plurality of processing units PR disposed along a circumference about the axis of rotation of the chamber 2 and having an opening OP communicated in the chamber 2 for processing the workpiece W introduced from the opening OP; W) has a pusher 500 that pushes the susceptor S in a direction in which it is detached from the rotating body 3 and introduced into the processing unit PR from the opening OP. The plurality of processing units PR includes a heating unit 200 for heating the work W, a film forming unit 300 for forming a film on the work W, and a cooling unit 400 for cooling the work W. ), the rotating body 3 holds the susceptor S conveyed by the rotating body 3, and a holding part that opens the susceptor S by being pushed by the pusher 500. 33 is provided, and the pusher 500 is provided with the sealing part 520 which introduces the workpiece|work W into the processing part PR and seals the opening OP.

In this embodiment, the sealing part 520 which seals the opening OP moves together with the workpiece|work W, and is separated from the susceptor S which is continuously heated in the heating chamber 210 and the film-forming chamber 310. Since they are separate, the sealing part 520 is not heated continuously and becomes high temperature. In addition, the susceptor S is not required to be strong enough to withstand the pressure difference with the inside of the cooling unit 400, and since the thickness and material can be selected, the heat capacity can be reduced. For this reason, cooling of the workpiece|work W in the cooling part 400 can be performed efficiently in a short time. Therefore, the throughput is improved without being constrained by the cooling process.

The sealing part 520 has a second cooling mechanism 430 that cools the work W. For this reason, since it can cool by the cooling part 400, and the 2nd cooling mechanism 430 of the sealing part 520 can cool the workpiece|work W from both surfaces of a front surface and a back surface, it can cool at high speed. . Since the sealing part 520 is not conveyed together with the work W by the rotating body 3, it is manufactured with a simple structure separated from the conveying mechanism of the susceptor S by the rotating body 3 2 cooling mechanism 430 can be installed.

The rotating body 3 is a circular plate-shaped body, and the rotating body 3 is provided with a void 32 through which the sealing part 520 passes in a direction intersecting the rotational plane of the rotating body 3, and the void is formed. In the process of passing through the part 32, it has the holding|maintenance part 33 which switches from the holding state which holds the susceptor S and the released state which releases the susceptor S. For this reason, the sealing part 520 fixed to the pusher 500 is moved between the opening OP side of the rotating body 3 and the opposite side, and sealing and opening of the opening OP, and the holding part 33 are moved. ) can be switched between holding and releasing the susceptor (S). That is, it is possible to simply perform the holding/release operation of the susceptor S by mechanically synchronizing with the sealing/opening operation of the sealing part 520 .

The work W is a ceramic substrate, and in the heating unit 200 , a degassing process is performed on the ceramic substrate by heating, and a plurality of film forming units 300 are provided, and by the plurality of film forming units 300 , A multilayer film made of a different material is formed by sputtering. For this reason, after heating by the heating unit 200 , the susceptor S and the workpiece W are cooled at a high speed by the cooling unit 400 even when the plurality of film forming units 300 are continuously heated. can do.

[Variation]

This embodiment is not limited to an above-mentioned aspect, The following modification is also included.

(1) In the susceptor S, a conductive member having a heat capacity equal to or less than that of the susceptor S may be disposed on a surface interposed between the susceptor S and the work W. Accordingly, in the cooling unit 400, it is possible to easily push the heat of the work (W) through the susceptor (S). For example, the susceptor S and the conductive member are preferably made of metal such as copper, but are not limited thereto.

(2) The processing unit PR may include a reforming unit together with the film forming unit 300 . The reforming unit is a processing unit PR that modifies the surface of the work W and improves film adhesion by making the work W collide with active species such as electrons, ions, and radicals generated by converting the process gas into plasma.

(3) The load lock chamber 121 may be provided with a cooling device for cooling the susceptor S and the work W that are discharged from the chamber 2 through the load lock chamber 121 . For example, a cooling mechanism such as the cooling unit 400 is provided in the sealing unit 520 corresponding to the load lock chamber 121 . Thereby, cooling before discharge|emission of the susceptor S and the workpiece|work W can be accelerated|stimulated. In this case, the cooling in the cooling chamber 410 may be stopped before reaching the target temperature, which is a temperature at which the film can be prevented from being oxidized in the air, and the remaining cooling may be performed in the load lock chamber 121 . Thereby, the cooling time for setting the workpiece W to the target temperature can be divided into the cooling time in the cooling chamber 410 and the cooling time in the load lock chamber 121 . Therefore, the processing rate can be decreased without stopping the workpiece W in the cooling chamber 410 for a long time, and the throughput is improved. For example, as shown in FIG. 1 , when a plurality of susceptors S on which a workpiece W is mounted are sequentially introduced into the rotating body 3 , intermittently rotated and transported to each processing unit PR for processing, one If the workpiece W is stopped for a long time in the processing unit PR, the workpiece W mounted on another susceptor S located downstream of the conveyance cannot move to the next processing unit PR, resulting in processing waiting time. do. By distributing the cooling time and reducing the cooling time in the cooling chamber 410 , the waiting time for processing the workpiece W mounted on the other susceptor S can be reduced, and the throughput is improved.

(4) The number of the film forming units 300 is not limited to three, and may be two or less or four or more. By increasing the number of the film forming units 300 , the film forming rate can be improved. In addition, a sputtering apparatus using the target 320 may be sufficient as the film-forming part 300 . However, the configuration for generating plasma in the film forming unit 300 and the reforming unit is not limited to a specific type.

(5) The gap portion 32 of the rotating body 3 may be a through hole formed in a circular plate-like body. In addition, the rotating body 3 is not limited to a rotating table. The rotating body 3 which rotates by holding the support part and the workpiece|work W on the arm extending radially from the rotation center may be sufficient. The number of the workpieces W conveyed by the rotating body 3 and processed simultaneously, and the number of the holding parts 33 holding them are not limited to the number shown in the above-described aspect. If the holding part 33 is also of a configuration in which the holding state holding the susceptor S and the releasing state of releasing the susceptor S are switched in the process of the sealing part 520 passing through the gap part 32 , and is not limited to the above-described aspect.

(6) The processing unit PR may be on the installation surface side of the chamber 2, on the opposite side to this, or on the side surface side. The direction in which the workpiece|work W is put in and out of the processing part PR may also be sufficient from the installation surface side of the processing part PR, and may be sufficient as it, from the opposite side to this, and may be sufficient from the side. In the case where the side subject to gravity is down and the opposite side is up, in the above-described aspect, each processing unit PR is disposed on the rotating body 3 , but each processing unit PR is disposed below the rotating body 3 . may be placed. In addition, the rotating body 3 is not limited to a horizontal arrangement, A vertical arrangement|positioning or an inclined arrangement|positioning may be sufficient as it. Moreover, the installation surface of the film forming apparatus 1 may be a floor surface, a ceiling, or a side wall surface may be sufficient as it. The mounting of the workpiece W on the susceptor S may be performed by mechanical holding, adhesion, adsorption, or the like. That is, the fact that the work W is mounted on the susceptor S is not limited to the case where the work W is mounted on the horizontal susceptor S, and it depends on what angle the susceptor S is. Regardless, it means that it is in a state where it can be moved together with the work W.

(7) A pressure sensor or a temperature sensor provided in the cooling chamber 410 may be appropriately omitted. When the temperature sensor is omitted, the start of exhaust after cooling in the cooling chamber 410 is made at a time point when a predetermined cooling time obtained in advance from the start of cooling has elapsed. Further, in the case of omitting the pressure sensor, the stop of the exhaust is made when a predetermined time previously obtained from the start of the exhaust has elapsed.

(8) The cooling gas introduction part 422 introduces the cooling gas G from the surface opposite to the workpiece W to be cooled in the cooling chamber 410 in the examples shown in FIGS. 7 and 11 . , the introduction direction of the cooling gas G is not limited to this. For example, an opening may be formed in the side wall of the cooling chamber 410 to introduce the cooling gas G in a direction along the workpiece W of the cooling gas introduction part 422 .

(9) As mentioned above, although embodiment of this invention and the modified example of each part were described, this embodiment and the modified example of each part are shown as an example, and limiting the scope of the invention is not intended. These novel embodiments described above can be implemented in other various forms, and various omissions, substitutions, and changes can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and summary of the invention, and are included in the invention described in the claims.

DESCRIPTION OF SYMBOLS 1: film-forming apparatus, 2: chamber, 3: rotating body, 21: receptor, 22: lid, 23: chamber exhaust, 31: shaft, 32: void, 33: holding part, 70: control device, 71: Mechanism control unit, 72 heating control unit, 73 film forming control unit, 74 cooling control unit, 75 storage unit, 76 setting unit, 77 input/output control unit, 78 input device, 79 output device, 100 carry-in/out unit, 110 DESCRIPTION OF SYMBOLS Carrier part, 111: arm, 112: holding body, 121: load lock chamber, 121a: opening, 121b: opening, 200: heating part, 210: heating chamber, 210a: opening, 220: heater, 300, 300A-300C: Film-forming part 310: film-forming chamber, 310a: opening, 320: target, 331: base, 332: transforming part, 332a: roller, 332b: shaft, 333: arm, 333a: gripping part, 333b: contact surface, 333c: holding surface , 334: pressing member, 334a, 334b: plate, 400: cooling unit, 410: cooling chamber, 410a: opening, 420: first cooling mechanism, 421: cooler, 422: cooling gas introduction unit, 423: cooling liquid circulation path, 424: Cooling chamber exhaust part, 430: second cooling mechanism, 431: coolant circulation path, 432: cooling liquid supply part, 500, 500A-500F: pusher, 510: shaft, 520: sealing part, 521: mounting table, 521a: mounting surface, 522 : sealing body, 522a: sealing surface, 522b: sealing material, 523: protrusion, 523a: inclined surface, 523b: outer peripheral surface, G: cooling gas, OP: opening, PR: processing part, S: susceptor, TR: conveying mechanism, Sa: Receiver, Sb: Leg, W: Work

Claims (6)

A film forming apparatus comprising:
A chamber capable of evacuating the interior by exhaust;
a rotating body disposed inside the chamber and conveying the susceptor on which the work is mounted by rotation;
a plurality of processing units disposed along a circumference about the rotational axis of the rotating body, the plurality of processing units having an opening communicating with the chamber, and processing the workpiece introduced from the opening;
and a pusher for pushing the susceptor in a direction in which the workpiece is separated from the rotating body and introduced into the processing unit from the opening,
The plurality of processing units include a heating unit for heating the work, a film forming unit for forming a film on the work, and a cooling unit for cooling the work,
The rotating body is provided with a holding part which holds the susceptor being conveyed by the rotating body and releases the susceptor by being pushed by the pusher,
The film forming apparatus according to claim 1, wherein the pusher is provided with a sealing portion for introducing the workpiece into the processing portion and sealing the opening. The film forming apparatus according to claim 1, wherein the sealing portion has a cooling mechanism for cooling the work. According to claim 1 or 2, wherein the rotating body is a circular plate-shaped body,
In the rotating body, a void portion through which the sealing unit passes in a direction intersecting the rotational plane of the rotating body is formed,
The film forming apparatus according to claim 1, wherein the holding portion is switched between a holding state for holding the susceptor and a released state for releasing the susceptor while the sealing portion passes through the gap portion. The film forming apparatus according to claim 1, wherein, in the susceptor, a conductive member having a heat capacity equal to or less than that of the susceptor is disposed on a surface interposed between the susceptor and the workpiece. The method according to claim 1, further comprising: a load lock chamber that enables loading and unloading of the susceptor and the workpiece while maintaining a vacuum in the chamber;
A film forming apparatus according to claim 1, wherein the load lock chamber is provided with a cooling device for cooling the susceptor and the work carried out from the chamber through the load lock chamber. According to claim 1, wherein the work is a ceramic substrate,
In the heating unit, degassing is performed on the ceramic substrate by heating,
The film forming part is provided in plurality,
A film forming apparatus characterized in that a multilayer film made of a different material is formed by sputtering by the plurality of film forming units.

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