JP5934919B2 - Tray replacement method and component mounting apparatus - Google Patents

Description

  The present invention relates to a tray replacement method and a component mounting apparatus for collecting empty trays held on a tray holding stage and newly supplying trays in a component mounting apparatus for mounting components housed in a tray on a substrate. is there.

  2. Description of the Related Art In a component mounting apparatus that mounts a component on a substrate such as a liquid crystal panel, a supply device that supplies a tray that stores the component is disposed at a component supply position where the component is taken out by a pickup head or the like. As a supply device, there is known a configuration in which one tray is supplied to a stage from a tray storage unit in which a plurality of trays are stacked and stored, and is moved to a component extraction position. In this type of supply device, when all of the components are taken out from the tray on the stage, the stage is moved to the tray collection unit to collect the empty tray, and then one tray is placed on the stage from the tray storage unit. Tray exchange newly supplied above is executed.

  In recent years, a component mounting apparatus has been proposed in which two supply devices including a tray storage unit, a tray collection unit, and a stage capable of simultaneously holding two trays are arranged from the viewpoint of improving productivity (for example, Patent Document 1). ). In the example shown in Patent Document 1, a stage of one supply device is moved to a component supply position, components are taken out from two trays held on this stage, and mounted on a substrate. When the two trays become empty, the stage of one supply device is retracted from the component supply position and the stage of the other supply device is moved to the component supply position. Then, while the mounting operation for the two trays held on the stage of the other supply device is being performed, the tray is exchanged by one supply device, and the apparatus waits at a predetermined position. Thereby, it is possible to improve the productivity by preventing the interruption of the mounting work due to the tray replacement.

Japanese Patent No. 4243646

  However, the above-described method cannot be used when different parts are supplied between one supply device and the other supply device. For this reason, when the two trays on the stage become empty, it is necessary to quickly replace the tray and return the stage to the component supply position so that the mounting operation is not interrupted. However, the tray replacement requires a certain time because the stage needs to be moved between the component supply position, the tray collection unit, and the tray storage unit. Therefore, a waiting time for tray replacement occurs, the mounting operation is interrupted, and the productivity is lowered.

  In addition, it is conceivable to replace the tray when one of the two trays held on the stage becomes empty. Even if the trays were replaced, the problem that the waiting time was generated and the mounting work was interrupted could not be solved.

  Therefore, an object of the present invention is to provide a tray replacement method and a component mounting apparatus that can replace a tray on a tray holding stage without interrupting a component mounting operation.

  The tray replacement method of the present invention includes a tray storage unit that stores a tray that stores components, a tray recovery unit that collects an empty tray after the components are removed, and a plurality of tray holders that can hold the tray. A tray holding stage having a portion, a component mounting means for mounting a component on the tray held by the tray holding stage on a substrate, a tray supply position to which the tray stored in the tray storage portion is supplied, and the component In a component mounting apparatus comprising: a component supply position for supplying a component to a mounting means; and a tray holding stage moving means for moving the tray holding stage to a tray collection position where an empty tray is collected by the tray collection unit. An empty tray held by one tray holding unit among the plurality of tray holding units is collected by the tray collection unit, and the tray holding unit receives the tray. A tray replacement method for replacing a tray on the tray holding stage by newly supplying a tray from a storage unit, wherein the one tray holding unit is at a first non-mounting timing when no component mounting operation is performed. A tray collecting step for collecting the empty tray held in the tray by the tray collecting unit, and taking out components from the tray held in the other tray holding unit in a state where the tray is not held in the one tray holding unit. A tray supply step of supplying the tray stored in the tray storage portion to the one tray holding portion at the second non-mounting timing after the operation of mounting on the tray is performed.

  The component mounting apparatus according to the present invention includes a tray storage unit that stores a tray that stores components, a tray recovery unit that recovers an empty tray after the components are removed, and a plurality of tray holders that can hold the tray. A tray holding stage having a portion, a component mounting means for mounting a component on the tray held by the tray holding stage on a substrate, a tray supply position to which the tray stored in the tray storage portion is supplied, and the component A component supply position for supplying components to the mounting means, a tray holding stage moving means for moving the tray holding stage to a tray collection position where an empty tray is collected by the tray collection unit, and a plurality of tray holding units The tray collection unit collects an empty tray held in one tray holding unit, and a new tray is supplied from the tray storage unit to the one tray holding unit. And a tray replacement control means for replacing the tray on the tray holding stage, wherein the tray replacement control means is a first non-mounting timing when the component mounting operation is not performed. The tray collecting unit collects the empty tray held in the one tray holding unit, and takes out the component from the tray held in the other tray holding unit in a state where the tray is not held in the one tray holding unit. Then, the tray stored in the tray storage unit is supplied to the one tray holding unit at the second non-mounting timing after the operation of mounting on the substrate is performed.

  According to the present invention, an empty tray held in one tray holding unit is collected in the first tray holding unit at a first non-mounting timing when no component mounting operation is performed, and the tray is held in one tray holding unit. The tray stored in the tray storage portion at the second non-mounting timing after the operation of taking out the component from the tray held in the other tray holding portion and mounting it on the board in a state where the tray is not mounted is a single tray. Since the sheet is supplied to the holding unit, the tray on the tray holding stage can be exchanged without interrupting the component mounting operation.

The perspective view of the component mounting apparatus in Embodiment 1 of this invention (A) Top view of the component mounting apparatus in Embodiment 1 of this invention (b) Side view of the component mounting apparatus in Embodiment 1 of this invention (A) (b) (c) (d) Explanatory drawing of tray supply operation | movement in the tray storage part in Embodiment 1 of this invention. (A) (b) (c) (d) Explanatory drawing of tray collection | recovery operation | movement in the tray collection | recovery part in Embodiment 1 of this invention. (A) (b) (c) (d) Explanatory drawing of component mounting operation in Embodiment 1 of the present invention The block diagram which shows the structure of the control system of the component mounting apparatus in Embodiment 1 of this invention The flowchart figure which shows the operation | movement of tray replacement | exchange in Embodiment 1 of this invention. (A) (b) (c) (d) Explanatory drawing of tray exchange in Embodiment 1 of this invention (A) (b) Explanatory drawing of tray exchange in Embodiment 1 of this invention

(Embodiment 1)
First, a component mounting apparatus according to Embodiment 1 of the present invention will be described with reference to FIGS. The component mounting apparatus 1 has a function of mounting an electronic component 3 (hereinafter simply referred to as “component”) such as a bare IC on a substrate 2 such as a liquid crystal panel, and supplies a first component on a base 4a. 5A and a second component supply unit 5B, and a substrate carry-in unit 6, a substrate carry-out unit 7, a substrate positioning unit 8 and a component mounting unit 9 are provided on the base 4b. A plurality of component mounting positions 2a (FIG. 2A) are set along the edge on one long side and end side of the substrate 2, and the component 3 is mounted on the component mounting position 2a.

  The first component supply unit 5A and the second component supply unit 5B supply the component 3 stored in the tray 10 to the component mounting unit 9, and are arranged in parallel in the X direction, which is the conveyance direction of the substrate 2. It is arranged by. The tray 10 is formed with a plurality of recesses in a lattice shape, and the components 3 are accommodated in a posture in which the mounting surface on which the bumps, which are joints with the substrate 2, are formed faces upward. Each component supply unit has the same structure.

  1 and 2, the first component supply unit 5A and the second component supply unit 5B include a tray stocker 11 in which a plurality of trays 10 storing components 3 are stacked and stored. In FIG. 3 (a), a step portion 10a having a different upper surface height is formed on the outer edge portion of the tray 10, and when the trays 10 are stacked, a gap having a predetermined width ΔH is formed through the step portion 10a. It is formed.

  A pair of L-shaped tray chucks 12 is provided below the both sides of the tray stocker 11 so as to be movable in the X direction when viewed from the front. By driving the first motor 12a (FIG. 6), the pair of tray chucks 12 are moved in synchronism with the approaching direction and the separating direction. In a state in which both are brought close to each other, both sides of the tray 10 positioned at the lowermost stage are supported from below by a horizontal portion 12b extending in the horizontal direction. Moreover, in the state which moved both in the direction which leaves | separates, it remove | deviates from the downward direction of the lowermost tray 10, and the support is cancelled | released. The tray stocker 11 and the tray chuck 12 serve as a tray storage unit in which the tray 10 storing the components 3 is stored.

  In FIG. 1 and FIG. 2, an empty tray stocker 13 in which the tray 10 that has been emptied by taking out the component 3 is disposed at a position adjacent to the tray stocker 11 in the X direction. In FIG. 4 (a), a pair of L-shaped tray chucks 14 having the same structure as the tray chuck 12 described above are disposed at the lower positions on both sides of the empty tray stocker 13 when viewed from the front. It is provided so as to be movable in the X direction by driving (FIG. 6). The empty tray stocker 13 and the tray chuck 14 serve as a tray collection unit that collects the tray 10 that has been emptied after the component 3 is taken out.

  1 and 2, an X-axis movement table 15X extending in the X direction is disposed below the back side (left side of the sheet) of the tray stocker 11 and the empty tray stocker 13, and this X-axis movement table 15X is disposed. The Y-axis moving table 15Y extending in the Y direction orthogonal to the X direction in the horizontal plane is attached to be movable in the X direction. A flat tray holding stage 16 is mounted on the Y-axis moving table 15Y so as to be movable in the Y direction. By driving each moving table, the tray holding stage 16 can move horizontally in the XY direction. The X-axis moving table 15X and the Y-axis moving table 15Y constitute a tray holding stage moving mechanism 15.

  The tray holding stage 16 is connected to a rotation mechanism 17 (FIG. 6). By driving this rotation mechanism 17, the rotation axis 17a (FIG. 2 (a)) penetrating the center portion up and down is rotated horizontally. To do. 1 and 2B, two tray holding table lifting mechanisms 18 are provided on the upper surface of the tray holding stage 16, and the tray 10 can be held at the upper end of each rod 18a protruding upward. A first tray holding table 19A as a first tray holding unit and a second tray holding table 19B as a second tray holding unit are coupled to each other. By driving the tray holding table raising / lowering mechanism 18, the rod 18a projects up and down, whereby the first tray holding table 19A and the second tray holding table 19B can be individually raised and lowered (moved in the Z direction). ing. Thus, the tray holding stage 16 has a plurality of tray holding portions.

  Next, a tray supply operation for supplying the tray 10 to the first tray holding table 19A and the second tray holding table 19B will be described with reference to FIG. Here, the description is limited to the first tray holding table 19A. First, as shown in FIG. 3A, the tray holding stage 16 is moved to align the first tray holding table 19 </ b> A below the tray stocker 11. Next, the first tray holding table 19A is raised (arrow a) and brought into contact with the lower surface of the lowermost tray 10. Next, as shown in FIG. 3B, the pair of tray chucks 12 are moved away from each other (arrows b1 and b2) to release the support of the tray 10 and to move the first tray holding table 19A by one tray. Lower (arrow c).

  Next, as shown in FIG. 3C, the pair of tray chucks 12 are brought close to each other (arrows d1, d2), and the horizontal portion 12b is inserted into the gap ΔH. As a result, the tray 10 that is one level higher than the lowermost tray 10 is supported from below. Next, as shown in FIG. 3D, the first tray holding table 19A is lowered (arrow e). Thereby, one tray 10 is supplied on the first tray holding table 19A. Thus, below the tray storage portion is a tray supply position P1 (FIG. 2A) to which the tray 10 is supplied, and the tray holding stage 16 can be moved to the tray supply position P1.

  Next, with reference to FIG. 4, a tray collecting operation for collecting the empty tray 10 held on the first tray holding table 19A will be described. First, as shown in FIG. 4A, the tray holding stage 16 is moved to align the first tray holding table 19 </ b> A below the empty tray stocker 13. Next, by raising the first tray holding table 19A (arrow f), the tray 10 held by itself is brought into contact with the lower surface of the lowermost tray 10 already collected. When the empty tray 10 does not exist in the empty tray stocker 13, the tray 10 on the first tray holding table 19A comes into contact with only the tray chuck 14 from below.

  Next, as shown in FIG. 4B, the pair of tray chucks 14 are moved away from each other (arrows g1 and g2), and the first tray holding table 19A is raised by one tray (arrow h). Next, as shown in FIG. 4C, the pair of tray chucks 14 are brought close to each other (arrows i1, i2), and the tray 10 on the first tray holding table 19A is supported from below by the horizontal portion 14b. Next, as shown in FIG. 4D, the first tray holding table 19A is lowered (arrow j). As a result, the empty tray 10 held on the first tray holding table 19A can be collected by the empty tray stocker 13. The same applies to the second tray holding table 19B. Thus, below the tray collection section is a tray collection position P2 (FIG. 2A) where the empty tray 10 is collected, and the tray holding stage 16 can be moved to this tray collection position P2. Yes. The tray holding stage moving mechanism 15 is a tray holding stage moving means for moving the tray holding stage 16 to the tray supply position P1 and the tray collection position P2.

  The tray 10 is exchanged by performing the above-described tray collection operation and tray supply operation on the tray holding table of either the first tray holding table 19A or the second tray holding table 19B. In other words, the tray replacement on the tray holding stage 16 is performed by causing the tray collection unit to collect the empty tray 10 held by one tray holding unit among the plurality of tray holding units, and allowing the one tray holding unit to store the tray storage unit. This is realized by newly supplying the tray 10 from the above.

  1 and 2, the substrate carry-in portion 6 and the substrate carry-out portion 7 are arranged in parallel in the X direction in the rear side (left side of the drawing) area on the base 4b. The substrate carry-in unit 6 includes a substrate carry-in mechanism 20 including a pair of carry-in paths 20a extending in the X direction, and a carry-in table 21 is provided in each carry-in path 20a so as to be movable in the X direction. The substrate 2 carried out from the upstream apparatus is transferred to the carry-in table 21 and is carried into the apparatus by driving the substrate carry-in mechanism 20.

  The substrate carry-out unit 7 includes a substrate carry-out mechanism 22 including a pair of carry-out paths 22a extending in the X direction, and a carry-out table 23 is provided in each carry-out path 22a so as to be movable in the X direction. The board 2 on which the component 3 is mounted is transferred to the carry-out table 23 and is carried out to the downstream apparatus by driving the board carry-out mechanism 22.

  The substrate positioning unit 8 is disposed in a region between the substrate carry-in unit 6 and the substrate carry-out unit 7 and includes a linear motion mechanism including an X-axis movement table 24X and a Y-axis movement table 24Y. The Y-axis movement table 24Y is attached to be movable in the X direction with respect to the X-axis movement table 24X. In FIG. 2B, a substrate holding table raising / lowering mechanism 25 is attached to the Y-axis moving table 24Y so as to be movable in the Y direction, and a substrate holding capable of holding the substrate 2 at the upper end of the rod 25a protruding upward. A table 26 is joined. By driving the X-axis movement table 24X and the Y-axis movement table 24Y, the substrate holding table 26 moves horizontally in the XY directions. The X-axis movement table 24X and the Y-axis movement table 24Y constitute a substrate holding table movement mechanism 24. Further, by driving the substrate holding table elevating mechanism 25, the rod 25a protrudes and retracts, and thereby the substrate holding table 26 moves up and down. The substrate holding table 26 can be rotated horizontally via a rotation mechanism (not shown).

  1 and 2, in the region on the front side (right side of the drawing) from the arrangement position of the X-axis movement table 24X and the Y-axis movement table 24Y, a portion where a substantially central portion of the gate-shaped frame member is cut out. A backup stage 27 is provided which is mounted with a transparent lower member 27a (FIG. 1). The backup stage 27 supports one edge of the substrate 2 on which the component mounting position 2a is set from below. In addition, a first camera 28 having an imaging field of view upward is provided below the lower receiving member 27a, and images an object located above via the lower receiving member 27a.

  1 and 2, the component mounting unit 9 mounts the component 3 supplied from the first component supply unit 5 </ b> A or the second component supply unit 5 </ b> B on the substrate 2, and includes a reversing head 29 and a mounting head 33. It has. The reversing head 29 has a suction nozzle 29a capable of sucking the component 3, and is attached to the plate member 30 so as to be able to be reversed up and down around the rotation shaft 29b (FIG. 2B) extending in the X direction. Has been. The reversing head 29 is reversed by driving a reversing mechanism 29c (FIG. 6), whereby the reversing head 29 has a component take-off posture (FIG. 5A) with the suction surface of the suction nozzle 29a facing downward, and the suction surface. Can be converted into a component delivery posture (FIG. 5B) with the facing upward.

  The plate member 30 is provided so as to be movable in the Y direction with respect to the Y-axis movement table 31Y, and the Y-axis movement table 31Y is provided so as to be movable in the X direction with respect to the X-axis movement table 31X. The X-axis moving table 31X and the Y-axis moving table 31Y constitute a reversing head moving mechanism 31, and the reversing head 29 moves horizontally in the XY direction by driving each moving table. In addition, a second camera 32 having an imaging field of view directed downward is disposed above the reversing head 29, and images the component 3 in the tray 10 aligned downward.

  The mounting head 33 has a suction nozzle 33a capable of sucking the component 3, and the suction nozzle 33a moves up and down by driving a nozzle lifting mechanism 33b (FIG. 6) built in the mounting head 33. The mounting head 33 is attached to the Y-axis moving table 35Y via the plate member 34 so as to be movable in the Y direction. By driving the Y-axis moving table 35Y, the mounting head 33 moves horizontally in the Y direction above the reversing head 29 and the backup stage 27.

  Next, a series of operations for mounting the component 3 on the board 2 will be described with reference to FIG. First, as shown in FIG. 5A, the tray holding stage 16 is moved to a position where the reversing head 29 can move above the tray 10 held by the first tray holding table 19A or the second tray holding table 19B. Let Next, the reversing head 29 is moved above the tray 10 and the desired part 3 is taken out in the part taking-out posture. The part 3 is taken out after the part 3 in the tray 10 is imaged by the second camera 32 and the position of the part 3 is recognized based on the acquired image data.

  Thus, the predetermined position within the moving area of the reversing head 29 below the reversing head 29 is the component supply position P3 (FIG. 2A) for supplying the components 3 stored in the tray 10 to the reversing head 29. The tray holding stage 16 can be moved to the component supply position P3 via the tray holding stage moving means. The component supply position P3 may be a position where the reversing head 29 can move above the tray 10 held on at least one of the first tray holding table 19A and the second tray holding table 19B.

  Next, as shown in FIG. 5B, the reversing head 29 is reversed to convert it into a component delivery posture (arrow k), and the component 3 held by the suction nozzle 29 a is directed to the second camera 32. In this state, the part 3 is imaged by the second camera 32, and the position of the part 3 is recognized by performing recognition processing on the acquired imaging data. Next, the reversing head 29 is moved downward in the moving area of the mounting head 33 with the component delivery posture (arrow l). Then, the mounting head 33 is positioned above the reversing head 29 based on the recognized position of the component 3. As a result, the suction nozzle 33a of the mounting head 33 and the suction nozzle 29a of the reversing head 29 are in a state where the suction surfaces face each other with the component 3 interposed therebetween.

  In this state, the suction nozzle 33 a of the mounting head 33 is moved up and down (arrow m), and the component 3 is transferred from the reversing head 29 to the mounting head 33. Next, as shown in FIG. 5C, the mounting head 33 is positioned above the lower receiving member 27a (backup stage 27) (arrow n). Next, the part 3 held on the suction nozzle 33a is imaged by the first camera 28, and the position of the part 3 is recognized based on the acquired image data and it is determined whether it is a defective part. When the component 3 is held by the suction nozzle 33a beyond the allowable range of misalignment or is a defective component, the component 3 is thrown into a discard box (not shown), and is renewed from the tray 10 by the reversing head 29. A retry operation for taking out the component 3 is executed.

  On the other hand, if the component 3 held by the suction nozzle 33a can be mounted, the board waiting at the standby position P4 (FIG. 2A) while being held in advance by the board holding table 26. 2. Align 2 That is, as shown in FIG. 5D, the board 2 is aligned so that one edge portion where the component mounting position 2a is set is received by the backup stage 27 (arrow o), and the component mounting position 2a The parts 3 held by the suction nozzle 33a are matched in the vertical direction. The alignment here is performed by imaging the substrate 2 with the first camera 28 and recognizing the acquired image data. After the alignment of the substrate 2, the suction nozzle 33a is lowered (arrow p), and the mounting surface of the component 3 is pressed against the component mounting position 2a. As a result, the component 3 is mounted on the substrate 2.

  As described above, the position where the board 2 is positioned so that one edge of the board 2 is received by the backup stage 27 is the mounting work position P5 (FIG. 2A) where the component 3 is mounted. ing. The reversing head 29 and the mounting head 33 are component mounting means for mounting the component 3 on the tray 10 held by the tray holding stage 16 on the substrate 2.

  The board 2 after mounting the components is retracted from the mounting work position P5, transferred from the board holding table 26 to the carry-out table 23, and carried out from the component mounting apparatus 1 to the downstream apparatus. After unloading the substrate 2, the substrate holding table 26 moves to a position adjacent to the loading table 21, and moves to the standby position P4 after receiving the substrate 2 from the loading table 21 at the position.

  As described above, the board carry-in unit 6 serves as a board carry-in means for carrying the board 2 into the component mounting apparatus 1, and the board positioning unit 8 is a mounting work position where the loaded board 2 is mounted on the component 3. It is a substrate positioning means for positioning to P5. The board carry-out unit 7 is a board carry-out means for carrying out the component-mounted board 2 evacuated from the mounting work position P5 to the outside of the component mounting apparatus 1.

  Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to FIG. The control unit 40 provided in the component mounting apparatus 1 includes a substrate transport positioning control unit 41, a mounting control unit 42, a component supply control unit 43, an imaging control unit 44, a recognition processing unit 45, a remaining component count unit 46, and a substrate transport. A timing detection unit 47 is provided. The controller 40 includes a first motor 12a, a second motor 14a, a tray holding stage moving mechanism 15, a rotating mechanism 17, a tray holding table lifting mechanism 18, a substrate carry-in mechanism 20, a substrate carry-out mechanism 22, and a substrate holding table move. The mechanism 24, the substrate holding table lifting mechanism 25, the first camera 28, the reversing mechanism 29c, the reversing head moving mechanism 31, the second camera 32, the nozzle lifting mechanism 33b, and the Y axis moving table 35Y are connected.

  The substrate transport positioning control unit 41 controls the substrate carry-in mechanism 20, the substrate carry-out mechanism 22, the substrate holding table moving mechanism 24, and the substrate holding table lifting mechanism 25, thereby bringing the substrate 2 into the component mounting apparatus 1. A carry-in operation and a board positioning operation for positioning the carried board 2 at the mounting work position P5 are executed. Further, a board unloading operation is performed in which the board 2 after mounting the components is retracted from the mounting work position P5 and carried out of the component mounting apparatus 1. In the present embodiment, the carrying-in and carrying-out of the substrate 2 are collectively referred to as “carrying”.

  The mounting control unit 42 controls the reversing mechanism 29c, the reversing head moving mechanism 31, the nozzle lifting / lowering mechanism 33b, and the Y-axis moving table 35Y, so that the reversing head 29 takes out the component 3 from the tray 10 and mounts the removed component 3 thereon. A component mounting operation (mounting operation of the component 3) for delivering to the head 33 and mounting on the substrate 2 is executed.

  The component supply control unit 43 controls the tray holding stage moving mechanism 15, the rotating mechanism 17, and the tray holding table lifting mechanism 18 to move the tray holding stage 16 to the component supply position P3 and thereby the first tray holding table 19A. Alternatively, a component supply operation for supplying the components 3 in the tray 10 held on the second tray holding table 19B to the reversing head 29 is executed. That is, the component supply operation and the component mounting operation are executed as a unit. The component supply control unit 43 also executes a tray replacement operation for replacing the tray 10 on the tray holding stage 16. That is, the component supply control unit 43 is a tray replacement control unit that performs tray replacement including the tray collection operation and the tray supply operation described above.

  The imaging control unit 44 controls the first camera 28 to image the component 3 held by the mounting head 33 and the substrate 2 aligned with the backup stage 27. In addition, by controlling the second camera 32, the component 3 stored in the tray 10 is imaged. The recognition processing unit 45 recognizes the board 2 and the component 3 by detecting the acquired image data, and detects the position thereof. Further, a defective board and a defective part are also determined based on the recognition processing result.

  The component remaining number counting unit 46 counts the remaining number of components 3 stored in the tray 10 to be supplied. Specifically, every time the part 3 is taken out by the reversing head 29, the number of parts 3 in the tray 10 is counted by subtracting the number of parts 3. Further, the remaining number of parts 3 may be counted (detected) from the XY coordinates of the position where the parts 3 are taken out by the reversing head 29.

  The board conveyance timing detection unit 47 is configured based on the timing at which the component 3 is mounted at the component mounting position 2a and the suction nozzle 33a starts to rise, the elapsed time from the timing at which the board 2 is positioned at the mounting work position P5, etc. 2 is detected. In other words, the board conveyance timing detection unit 47 detects a non-mounting timing when the component mounting operation in the component mounting unit 9 is not executed.

  The component mounting apparatus 1 of the present invention is configured as described above. Next, tray replacement executed in the process of producing a mounting board will be described with reference to the flowchart of FIG. In the example shown below, the number of components 3 mounted on one substrate 2 by the component mounting apparatus 1 is one, and the mounting substrate is produced only by the first component supply unit 5A. The tray held on the first tray holding table 19A is referred to as “tray 10A (one tray)”, and the tray held on the second tray holding table 19B is referred to as “tray 10B (the other tray)”. 8 and 9, the illustration of the component mounting unit 9 is omitted for convenience.

  First, as shown in FIG. 8A, the tray holding stage 16 with the trays 10A and 10B held on the first tray holding table 19A and the second tray holding table 19B is moved to the component supply position P3. Thus, the component 3 stored in the tray 10A on the first tray holding table 19A is supplied to the reversing head 29 (ST1: first component supply step). The component 3 taken out by the reversing head 29 is mounted on the substrate 2 positioned at the mounting work position P5.

  Next, the remaining number of parts 3 in the tray 10A is counted to determine whether the remaining part number is zero (ST2: remaining part counting step). If the remaining number of parts is not zero, the process returns to (ST1) and the supply of the part 3, that is, the part mounting operation is continued. On the other hand, when the number of remaining parts becomes zero, the tray holding stage 16 is rotated 180 ° (arrow q) as shown in FIG. 8B, and the supply target is changed to the part 3 in the tray 10B. In this state, supply of the component 3 stored in the tray 10B is started (ST3: second component supply step). Thus, by rotating the tray holding stage 16 and changing the tray 10 to be supplied, the moving range of the reversing head 29 can be narrowed and the reversing head moving mechanism 31 can be made compact.

  Next, it is determined whether it is the timing at which the substrate 2 is transferred (ST4: first substrate transfer timing determination step). That is, when the mounting of the component 3 on the board 2 (referred to as “board 2A”) positioned at the mounting work position P5 is completed and carried out, or a new board 2 (referred to as “board 2B”) in the apparatus. 2 (c).) Is determined whether it is the timing of loading. Here, the conveyance and carry-in of the substrate 2 are executed at the same timing.

  When it is determined in (ST4) that the conveyance timing is reached, the tray holding stage 16 is moved to the tray collection position P2 as shown in FIG. 8C (arrow r), and the empty tray 10A on the first tray holding table 19A is moved. Is collected in the empty tray stocker 13. At this time, the board 2A is unloaded (arrow s) and a new board 2B is loaded (arrow t). During this board transfer operation, the component mounting operation by the component mounting unit 9 is temporarily interrupted. . That is, here, the empty tray 10A held in one tray holding portion is collected by the tray collection portion at the first non-mounting timing when the component mounting operation is not performed (ST5: tray collection step).

  Next, as shown in FIG. 8D, the tray holding stage 16 is moved to the component supply position P3 while nothing is held on the first tray holding table 19A (arrow u). The substrate transfer operation is completed at almost the same timing as this movement, and the newly loaded substrate 2B moves to the standby position P4. Therefore, there is no waiting time for resuming the component mounting operation after the board transfer operation is completed. Then, the supply of the component 3 targeting the tray 10B on the second tray holding table 19B, that is, the component mounting operation by the component mounting unit 9 is executed again (ST6: third component supply step).

  Next, in the same manner as in (ST4) described above, it is determined whether it is the timing at which the board 2B on which the component 3 has been mounted is transferred from the mounting work position P5 (ST7: second board transfer timing determination step). If it is determined that it is the conveyance timing, the tray holding stage 16 is moved to the tray supply position P1 (arrow v) as shown in FIG. 9A, and the component 3 is stored on the first tray holding table 19A. A new tray 10A is supplied. At this time, the substrate 2B is unloaded (arrow w), and a new substrate 2 (referred to as “substrate 2C”) is loaded (arrow x).

  That is, the second operation after the operation of taking out the component 3 from the tray 10B held in the other tray holding portion and mounting it on the substrate 2 in a state where the tray 10A is not held in one tray holding portion. At a non-mounting timing, the tray 10 stored in the tray storage unit is supplied to one tray holding unit (ST8: tray supply step). Thereby, the tray replacement on the first tray holding table 19A is completed.

  Next, as shown in FIG. 9B, the tray holding stage 16 in a state where the new tray 10A is supplied to the first tray holding table 19A is moved to the component supply position P3 (arrow y). The substrate transfer operation is completed at almost the same timing as this movement, and the newly loaded substrate 2C moves to the standby position P4. Therefore, also at this time, there is no waiting time for restarting the component mounting operation after the board transfer operation is completed. In this state, the supply of the component 3 for the tray 10B on the second tray holding table 19B, that is, the component mounting operation is executed again (ST9: fourth component supply step). Thereafter, the tray on the tray holding stage 16 is exchanged based on the above-described operation.

  As described above, in the first embodiment, at the non-mounting timing at which the component mounting operation is interrupted, that is, at the board loading operation of loading the substrate 2 into the component mounting apparatus 1, the board 2 on which the component 3 is mounted is mounted on During the board unloading operation for unloading from the component mounting apparatus 1 from P5, the tray exchange including the tray collecting operation and the tray supplying operation is performed. The tray replacement is performed by dividing the tray collection operation and the tray supply operation into at least two non-mounting timings sandwiching the component mounting operation (part 3 supply). This prevents the “waiting for tray replacement” that occurs when the non-component mounting operation time such as the board carry-in operation and the board carry-out operation is shorter than the tray replacement time when the tray collection operation and the tray supply operation are continuously performed. Can do. By preventing this “waiting for tray replacement”, it is possible to prevent the productivity of the mounting board from being lowered.

(Embodiment 2)
Next, a second embodiment will be described. In the first embodiment, the tray collection operation and the tray supply operation are performed at the timing when the substrate carrying operation, that is, the loading and unloading of the substrate 2 is performed. A collection operation and a tray supply operation are executed.

  Specifically, in a situation where the tray 10A on the first tray holding table 19A is empty and the component 3 stored in the tray 10B on the second tray holding table 19B is a supply target, the mounting operation is performed. The tray collection operation and the tray supply operation are executed at the timing (non-component supply timing) after the last component 3 mounted on the substrate 2 positioned at the position P5 is taken out from the tray 10B by the reversing head 29.

  That is, if the last component 3 taken out by the reversing head 29 is mounted on the substrate 2, then the substrate carry-out operation and the substrate carry-in operation are executed. Therefore, the tray collection operation and the tray supply operation are executed ahead of time at the timing after the last component 3 mounted on the substrate 2 is taken out from the tray 10B, thereby making it possible to perform the tray collection operation compared to the case of the first embodiment. Therefore, a lot of time for the tray supply operation can be secured.

  However, since the tray holding stage 16 moves to the tray supply position P1 or the tray collection position P2 after the part 3 is taken out, in this example, when the part 3 held by the mounting head 33 is judged to be defective, There is a risk that the retry operation for newly taking out the component 3 from the tray 10B by the reversing head 29 cannot be performed quickly. Therefore, if the tray collection operation and the tray supply operation are executed after receiving the determination that the component 3 is not defective, the aforementioned risk can be avoided.

  The present invention is not limited to the first and second embodiments described above. For example, before the component mounting operation for the board 2 positioned at the mounting work position P5 is completed, the board 2 to be the next work target is loaded in advance into the component mounting apparatus 1 and waits on the loading table 21. It may be. In such a case, the tray collection operation and the tray supply operation are performed at the timing when the substrate carry-out operation is executed.

  Further, in a state where the tray holding stage 16 is moved to the component supply position P3, the moving mechanism of the reversing head 29 is enlarged, and the moving area of the reversing head 29 is set to the first tray holding table 19A and the second tray holding table 19B. The tray 10 may be spread over the tray 10 held by In such a case, the rotation mechanism 17 of the tray holding stage 16 can be omitted.

  Further, the present invention may be applied to a component mounting apparatus having a configuration in which the component 3 is directly taken out from the tray 10 by the mounting head 33 and mounted on the substrate 2 without providing the reversing head 29. In such a case, the component 3 needs to be stored in the tray 10 with the mounting surface facing downward. In addition, the number of tray holding units provided on the tray holding stage 16 may be two or more, and the number of component supply units may be one.

  According to the present invention, the tray on the tray holding stage can be exchanged without interrupting the component mounting operation, which is useful in the field of electronic component mounting.

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Board | substrate 3 Electronic component 6 Board | substrate carrying-in part (board | substrate positioning means)
7 Substrate unloading section (substrate unloading means)
8 Board positioning part (Board positioning means)
10 tray 11 tray stocker (tray storage section)
12 Tray chuck (tray storage part)
13 Empty tray stocker (tray collection section)
14 Tray chuck (tray collection part)
15X X-axis moving table (tray holding stage moving means)
15Y Y-axis moving table (tray holding stage moving means)
16 Tray holding stage 19A First tray holding table (first tray holding unit)
19B 2nd tray holding table (2nd tray holding part)
29 Reversing head (component mounting means)
33 Mounting head (component mounting means)
43 Parts supply control unit (tray replacement control means)
P1 Tray supply position P2 Tray collection position P3 Component supply position P5 Mounting work position

Claims (4)

A tray storage section in which a tray storing components is stored;
A tray collection unit that collects empty trays after parts are removed, and
A tray holding stage having a plurality of tray holding units capable of holding the tray;
Component mounting means for mounting components on the tray held by the tray holding stage on a substrate;
The tray is placed at a tray supply position to which a tray stored in the tray storage unit is supplied, a component supply position to supply a component to the component mounting means, and a tray recovery position at which an empty tray is recovered to the tray recovery unit. In a component mounting apparatus provided with a tray holding stage moving means for moving the holding stage,
The tray collection unit collects an empty tray held in one tray holding unit among the plurality of tray holding units, and the tray is newly supplied from the tray storage unit to the one tray holding unit. A tray replacement method for replacing a tray on a tray holding stage,
A tray collection step in which the tray collection unit collects an empty tray held in the one tray holding unit at the first non-mounting timing when the component mounting operation is not performed;
When the tray is not held by the one tray holding part, the tray is taken out at a second non-mounting timing after the operation of taking out the components from the trays held by the other tray holding parts and mounting them on the board is performed. A tray replacement method comprising a tray supply step of supplying a tray stored in a storage unit to the one tray holding unit.   The first non-mounting timing and the second non-mounting timing are the substrate unloading operation for loading the substrate into the component mounting apparatus and / or unloading the substrate on which the component is mounted from the mounting work position. 2. The tray replacement method according to claim 1, wherein the tray replacement method is in operation. A tray storage section in which a tray storing components is stored;
A tray collection unit that collects empty trays after parts are removed, and
A tray holding stage having a plurality of tray holding units capable of holding the tray;
Component mounting means for mounting components on the tray held by the tray holding stage on a substrate;
The tray is placed at a tray supply position to which a tray stored in the tray storage unit is supplied, a component supply position to supply a component to the component mounting means, and a tray recovery position at which an empty tray is recovered to the tray recovery unit. Tray holding stage moving means for moving the holding stage;
The tray collection unit collects an empty tray held in one tray holding unit among the plurality of tray holding units, and the tray is newly supplied from the tray storage unit to the one tray holding unit. A component mounting apparatus comprising a tray replacement control means for replacing a tray on a tray holding stage,
The tray replacement control unit causes the tray collection unit to collect an empty tray held by the one tray holding unit at a first non-mounting timing when no component mounting operation is performed, and causes the one tray holding unit to The tray stored in the tray storage section at the second non-mounting timing after the operation of taking out the component from the tray held in the other tray holding section and mounting it on the substrate in a state where the tray is not held is performed. Is supplied to the one tray holding part. Board loading means for loading the board into the component mounting apparatus; board positioning means for positioning the loaded board at a mounting work position where components are mounted; and a board after mounting the component retracted from the mounting work position. A board unloading means for unloading;
The first non-mounting timing and the second non-mounting timing are the board positioning operation for carrying the board into the component mounting apparatus by the board carrying means and / or positioning the board on which the component is mounted. 4. The component mounting apparatus according to claim 3, wherein the component mounting apparatus is in a board unloading operation of unloading from the mounting work position by the means and the board unloading means.

Images