KR102114636B1 - Process device for semiconductor package - Google Patents

Abstract

The present invention relates to a processing apparatus for automatically replacing a semiconductor package. According to the present invention, the processing apparatus for automatically replacing a semiconductor package comprises: a first magazine loader unit (100); a second magazine loader unit (200); a tray loader unit (300); a first transfer unit (400); a second transfer unit (500); a package picker unit (600); a third transfer unit (700); a fourth transfer unit (800); a first magazine unloader unit (900); and a second magazine unloader unit (1000). According to the present invention, the productivity can be remarkably improved by reducing the process speed of a semiconductor package.

Description

Process device for automatic replacement of semiconductor package {Process device for semiconductor package}

In the present invention, a process for automatically replacing semiconductor packages in jigs, trays, and boats for each process in a semiconductor mass production process to be suitable for each process is automatically performed while reducing the process speed of the semiconductor packages to reduce productivity. It relates to a process device for the automatic replacement of the semiconductor package to significantly improve.

In general, a semiconductor package is for protecting a semiconductor chip such as a single element, an integrated circuit, etc. with electronic circuits and wiring, from external environmental factors such as dust, moisture, electrical or mechanical load, and optimizing and maximizing the performance of the semiconductor chip , A semiconductor package is manufactured by forming a circuit on a lead frame, a printed circuit board, etc., and sealing the resin with a sealing material while providing terminals for signal input / output.

In order to move between each process of mass production, these semiconductor packages are placed in a certain interval, and jigs, trays, boats, etc., are produced in shape, size, and material, respectively, in response to various production processes of the semiconductor package. As it is manufactured in various ways according to the process, there is a need for methods for quickly performing a task of replacing semiconductor packages with jigs, trays, and boats suitable for each process.

For example, referring to the conventional Korean Patent Publication No. 10-2016-014328, a tray loading unit having first and second loading spaces in which a plurality of first and second trays in which different types of semiconductor devices are mounted is loaded. ; The first tray is disposed between the first loading space and the test handler, and the first tray loaded in the first loading space is inserted into the test handler, or the first tray is loaded from the test handler into the first loading space. A first tray transfer part to make; And a second tray disposed between the second loading space and the test handler, and loading the second tray loaded in the second loading space into the test handler, or from the test handler to the second loading space in the second loading space. A replacement tray transport apparatus is provided, which includes a second tray transport section for loading.

However, in the related art, since the operator manually performs the replacement work for mounting the semiconductor package seated among the jigs, trays, and boats to one of the jigs, trays, and boats suitable for the production process, the working time for the replacement of the semiconductor package is long due to the nature of the manual work. There was a problem in that productivity was remarkably reduced because it was not suitable for mass production because it was cumbersome and cumbersome.

Korean Patent Publication No. 10-2016-014328 is proposed.

The present invention is to solve the problems of the prior art, so that the semiconductor package seated in the jig, tray, boat can be automatically replaced by an automated method of the replacement operation to seat any one of the jig, tray, boat suitable for the production process The purpose of this is to improve productivity by replacing a large number of semiconductor packages at the same time while greatly reducing the working time by automating the replacement of semiconductor packages.

The present invention to solve this object;

A first magazine loader unit selectively performing a process of sequentially supplying a jig or a boat on which a semiconductor package is seated, a bin jig or a bin boat on which a semiconductor package is mounted, sequentially using a magazine;

A second magazine loader unit selectively performing a process of sequentially supplying any one of a jig or a boat on which a semiconductor package is seated using a magazine;

After continuously supplying the tray in which the semiconductor package is seated, the empty tray in which the semiconductor package is emptied from the tray is continuously loaded, or the tray in which the semiconductor package is seated in the empty tray after continuously supplying the empty tray for mounting the semiconductor package A tray loader unit selectively performing a continuous loading process;

A first transfer unit unit selectively moving any one of a jig or a boat, a bin jig, or a bin boat supplied through the first magazine loader unit to a position of a package picker unit;

A second conveying unit part selectively moving any one of a jig or a boat selectively supplied through the second magazine loader part to a position of a package picker part;

After picking up the semiconductor package from any one of the jig, boat, or tray selectively moved through any one of the first transfer unit, the second transfer unit, and the tray loader, among the empty jigs, bin boats, and bin trays to be replaced A package picker unit which repeatedly performs a replacement operation for mounting and moving the semiconductor package picked up at any one;

A third transfer unit unit performing a process of moving any one of the jig, boat, bin jig, and bin boat supplied through the package picker unit replacement operation to a position of the first magazine unloader unit;

A fourth transfer unit unit selectively performing a process of moving the bin jig or bin boat supplied through the replacement operation of the package picker unit to the position of the second magazine unloader unit;

A first magazine unloader unit performing a process of loading any one of a jig, a boat, a bin jig, and a bin boat moved through the third transfer unit;

It provides a processing apparatus for the automatic replacement of the semiconductor package, characterized in that it comprises a second magazine unloader for selectively performing a process of loading a bin jig or bin boat moved through the fourth transfer unit.

According to the present invention, the replacement work in which the semiconductor package seated among the jigs, trays, and boats fits into one of the jigs, trays, and boats suitable for the production process is automatically replaced through the equipment of the automation method to automate the replacement of the semiconductor package By this, the working time is greatly reduced and a large number of semiconductor packages are simultaneously replaced by a mass production method, thereby improving productivity.

1 to 10 is a block diagram of a process apparatus for automatic replacement of a semiconductor package according to an embodiment of the present invention.
11 to 16 are flowcharts of operating states of a process apparatus for automatic replacement of a semiconductor package according to the present invention.

With reference to the accompanying drawings, a process apparatus for automatic replacement of a semiconductor package according to the present invention will be able to understand its features by embodiments described in detail below.

On the other hand, in describing the embodiments, detailed descriptions thereof will be omitted for components that are widely known and used in the technical field to which the present invention belongs or does not belong, and this will be omitted, as well as unnecessary descriptions. This is to convey the point more clearly.

The following will be described in detail with reference to FIGS. 1 to 9 for each configuration of a process apparatus for automatic replacement of a semiconductor package according to an embodiment as an example of the basic configuration of the present invention. 1 is a plan view of a process apparatus, FIG. 2 (a) is a first pusher, (b) is a second pusher, and FIG. 3 (a) is a first gripper, and (b) is a second gripper. 4 (a) is a third gripper, (b) is a configuration diagram of a fourth gripper, FIG. 5 (a) is a first transportation unit portion, (b) is a second transportation unit portion, 6 (a) is a third transfer unit portion, (b) is a fourth transfer unit portion, FIG. 7 (a) is a second transfer, (b) is a third transfer, and FIG. 8 is a tray 9 is a configuration diagram of a first transferer among tray loader portions, and FIG. 10 (a) is a first cover picker and (b) a second cover picker.

Looking at the process apparatus (1) for automatic replacement of the semiconductor package accordingly, a jig (J) or boat (B) on which the semiconductor package is mounted, an empty jig (eJ) or an empty boat (eB) on which the semiconductor package is mounted ) Using the magazine (M) to continuously supply a first magazine loader unit 100; A second magazine loader unit 200 for continuously supplying either a jig (J) or a boat (B) on which the semiconductor package is mounted using a magazine (M); Supply the tray (T) on which the semiconductor package is seated, and the empty tray (eT) in which the semiconductor package is emptied is loaded from the supplied tray (T), or the empty tray (eT) for supplying the semiconductor package is supplied and supplied A tray loader unit 300 that repeatedly performs a process in which a tray T on which a semiconductor package is mounted is loaded on an empty tray eT; The jig (J), the boat (B), the first jig (eJ), the first transfer unit 400 to move any one of the bin boat (eB) to the position of the package picker unit (600); A second transfer unit part 500 that moves either the jig J or the boat B to the position of the package picker part 600; A package picker unit 600 repeatedly performing a replacement operation of the semiconductor package; Any one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB), which has been replaced with the package picker unit 600, is moved to the position of the first magazine unloader 900 A third transfer unit 700 to make; A fourth transfer unit unit 800 that moves the bin jig eJ or bin boat eB, which performs the replacement operation of the package picker unit 600, to the position of the second magazine unloader unit 1000; The first magazine unloader unit for loading any one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) moved through the third transfer unit unit 700 into the magazine M (900); It is configured to include; a second magazine unloader (1000) for loading the bin jig (eJ) or bin boat (eB) moved through the fourth transfer unit 800 in the magazine (M).

Meanwhile, the first magazine loader unit 100; A second magazine loader unit 200; Tray loader unit 300; A first transfer unit part 400; A second transfer unit part 500; A package picker unit 600; A third transfer unit part 700; A fourth transfer unit part 800; A first magazine unloader unit 900; The second magazine unloader unit 1000 may be protected by a casing having an opening / closing door while being installed in a separately manufactured frame, and the frame includes an oil, pneumatic line, a motor for operating the process apparatus 1 of the present invention, Power devices such as a control panel, a sensing sensor, and the like may be provided.

The detailed configuration of the process apparatus 1 for automatic replacement of a semiconductor package having such a configuration will be described in detail with reference to the accompanying drawings.

First, the first magazine loader unit 100;

For selectively performing the process of sequentially supplying a jig (J) or boat (B) on which a semiconductor package is seated, a bin jig (eJ) for mounting a semiconductor package or an empty boat (eB) sequentially using a magazine (M) will be.

For example, the first magazine loader unit 100; The jig (J) or boat (B) on which the semiconductor package is seated, or the magazine (M) in which any one of the bin jig (eJ) or the bin boat (eB) for mounting the semiconductor package is stacked, is continuously supplied and supplied, and the jig is supplied. (J), the boat (B), bin jig (eJ), the first transport unit 110 for recovering the magazine (M) is empty one of the empty boat (eB); Pick up the magazine (M) supplied through the first transfer unit 110, any of the jig (J), boat (B), bin jig (eJ), bin boat (eB) from the pickup magazine (M) When one is emptied, the first gripper 120 to recover the magazine M by returning it to the first transfer unit 110; And the first transfer unit 400 of any one of a jig (J), a boat (B), a bin jig (eJ), and a bin boat (eB) from the magazine (M) picked up through the first gripper 120. It further includes a first pusher 130 to be continuously pushed to the.

The first transport unit 110, the magazine (M) is sequentially fed to the conveyor of the first transport unit 110 in a state in which the conveyors providing the transport functions in opposite directions to each other are provided in the up and down direction. The upper conveyor of the first transfer unit 110 is a jig (J) or boat (B) with a semiconductor package seated, one of a bin jig (eJ) or a bin boat (eB) for mounting the semiconductor package is selectively a plurality The stacked magazine M is continuously supplied to the first gripper 120, and the lower conveyor of the first transport unit 110 is empty when the magazine M moved to the first gripper 120 is emptied. ) To provide a continuous movement function in the outward direction to recover.

At this time, the upper conveyor and the lower conveyor of the first transport unit 110 have been described by dividing them up and down for explanation of the invention, but the supply and recovery direction of the magazine M through the first transport unit 110 is the first transport unit ( 110).

The first gripper 120 is located on the supply side of the magazine M using the first transfer unit 110, wherein the first gripper 120 is the first pick-up plate 122 of the upper side of the magazine (M) ) The first cylinder 121, the second pick-up plate 123 provided as a lower portion of the first pick-up plate 122 is opened or closed in the form of forceps, and the first pick-up plate supports the lower end of the magazine M The magazine M can be picked up from the transfer unit 110, and the pick-up side provided with the first pick-up plate 122 and the second pick-up plate 123 is movable up and down by the first actuator 124, , It is possible to move back and forth through the first guide 125 to allow free pick-up and recovery of the empty magazine (M) after pick-up, and pick up the magazine (M) supplied through the first transfer unit (110) When the magazine (M) supplied to the first pusher 130 is emptied and moved to the position of the pusher 130, the process of causing it to be recovered back to the first transfer unit 110 is repeatedly performed.

At this time, the first actuator 124 may apply an electric actuator for a linear movement guide, and the first guide 125 transmits the power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide to move linearly. You can apply a rail to guide the.

The first pusher 130 is located in a direction capable of separating the object loaded in the magazine (M) to the side where the magazine (M) is supplied through the first gripper 120, the first pusher 130 ) Is provided with a first push bar 132 that moves forward and backward through a second cylinder 131, and the first push bar 132 is a magazine (M) supplied through the first gripper 120 during the forward operation process. ) Jig (J), boat (B), bin jig (eJ), stacked on any one of the bin boat (eB) sequentially pushed, the jig (J) pushed through the first push bar (132), boat Any one of (B), bin jig (eJ), and bin boat (eB) is input to the first transfer unit unit 400.

On the other hand, the first transport unit 110 repeatedly performs a supply process of the magazine M and the recovery process of the empty magazine M, and the first gripper 120 picks up the magazine M and emptys the magazine M To the first transport unit 110 repeatedly, the first pusher 130 in the magazine (M) jig (J), boat (B), bin jig (eJ), bin boat (eB) The process of pushing any one of them to the first transfer unit 400 is repeatedly performed.

Here, the first magazine unloader unit 900 may be selectively used according to diversification of a semiconductor package replacement process, and accordingly, the first magazine unloader unit 900 is supplied to the first transfer unit unit 400. The jig (J), the boat (B), the bin jig (eJ), and the bin boat (eB) can also be supplied by selecting any one of them.

In addition, the second magazine loader unit 200;

It is for selectively performing a process of sequentially supplying either a jig (J) or a boat (B) on which a semiconductor package is mounted using a magazine (M) sequentially.

For example, the second magazine loader unit 200; The jig (J) or the boat (B) stacked magazine (M) is continuously moved to supply, and the jig (J) or the boat (B) is a second transfer unit 210 for recovering the empty magazine (M); When the magazine (M) supplied through the second transfer unit 210 is picked up, and the jig (J) or boat (B) is emptied from the picked-up magazine (M), the magazine (M) is transferred to the second transfer unit (210). ) To return the second gripper 220 to be recovered; And a second pusher 230 that pushes the jig (J) or the boat (B) from the magazine (M) picked up through the second gripper (220) to the second transfer unit (500) for continuous input. do.

The second transport unit 210, the magazine (M) is sequentially fed to the conveyor of the second transport unit 210 in a state in which the conveyors providing the transport functions in opposite directions to each other are provided in the up and down direction. The upper conveyor of the second transfer unit 210 is supplied by continuously moving a magazine (M) in which a plurality of stacked jigs (J) or boats (B) on which a semiconductor package is mounted, toward the second gripper (220), and supplying the second The lower conveyor of the transfer unit 210 provides a continuous transfer function in an outward direction so as to recover the magazine M in which the jig J or the boat B is emptied.

At this time, the upper conveyor and the lower conveyor of the second conveying unit 210 were described by dividing them up and down for explanation of the invention, but the direction of supply and recovery of the magazine M through the second conveying unit 210 is the second conveying unit ( 210).

The second gripper 220 is located on the supply side of the magazine M in which the jig J or the boat B is stacked in the second transfer unit 210, and the second gripper 220 is the third pick-up. The fourth pick-up plate 223 provided as a lower portion of the third pick-up plate 222 while the plate 222 is opened or closed in the form of tongs through the third cylinder 221 and pinched at one side of the upper end of the magazine M Supporting the lower end of the magazine (M) to allow the magazine (M) to be picked up from the second transfer unit 210, the pickup side provided with the third pick-up plate 222 and the fourth pick-up plate 223 is the second It is possible to move up and down by the actuator 224, and it is possible to move back and forth through the second guide 225 to allow free pick-up and recovery of the empty magazine (M) after pick-up, and the second transfer part 210 The magazine (M) supplied through is picked up and moved to the position of the second pusher (230), and the magazine (M) with the jig (J) or boat (B) empty is recovered to the second transfer unit (210).

At this time, the second actuator 224 may apply an electric actuator for a linear movement guide, and the second guide 225 transmits the power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide to move linearly. You can apply a rail to guide the.

The second pusher 230 is located in a direction in which the jig (J) or the boat (B) can be separated from the magazine (M) to the side where the magazine (M) is supplied through the second gripper 220, the The second pusher 230 is provided with a second pusher 232 that moves forward and backward through the fourth cylinder 231, and the second pusher 232 is supplied through the second gripper 220 during the forward operation process. The jig (J) or the boat (B) of the magazine (M) can be pushed, and the jig (J) or the boat (B) pushed through the second push bar (232) is transferred to the second transfer unit (500). Will be put in.

On the other hand, the second transport unit 210 repeatedly performs a supply process of the magazine M and the recovery process of the empty magazine M, and the second gripper 220 picks up the magazine M and emptys the empty magazine ( The process of recovering M) to the second transfer unit 210 is repeatedly performed, and the second pusher 230 pushes the jig (J) or boat (B) from the magazine (M) to the second transfer unit unit 500 The process to be introduced is repeatedly performed.

Here, the second magazine loader unit 200 may be selectively used according to the diversification of the semiconductor package replacement process, and accordingly, the second magazine loader unit 200 may be either a jig (J) or a boat (B). Can be selected and supplied.

The first transport unit 110 repeatedly performs a supply process of the magazine M and a recovery process of the empty magazine M, and the first gripper 120 removes the magazine M and removes the empty magazine M. 1 The process of recovering to the transport unit 110 is repeatedly performed, and the first pusher 130 is a magazine (M) in the jig (J), boat (B), bin jig (eJ), bin boat (eB) any The process of pushing one into the first transfer unit 400 is repeatedly performed.

Here, the first magazine unloader unit 900 may be selectively used according to the diversification of the semiconductor package replacement process, and also supplied to the first transfer unit unit 400 through the first magazine unloader unit 900. The jig (J), the boat (B), the bin jig (eJ), and the bin boat (eB) can also be supplied by selecting any one of them.

And, the tray loader unit 300;

After continuously supplying the tray T in which the semiconductor package is seated, the empty tray eT in which the semiconductor package is emptied from the tray T is continuously loaded, or the empty tray eT for continuously mounting the semiconductor package is continuously supplied. After that, it is for selectively performing a process in which the tray T, on which the semiconductor package is mounted, is continuously loaded on the empty tray eT.

For example, the tray loader unit 300; A first tray stack 310 on which the tray T or the empty tray eT, on which the semiconductor package is mounted, is loaded; And a second trace stack 320.

The first trace stack 310 is provided at a position where the tray picker 340 can pick up. The first trace stack 310 is made of an elevator having a lift function, and the first trace stack 310 ), The tray (T) or the bin tray (eT) on which the semiconductor package is mounted is stacked in multiple layers. The tray (T) or the bin tray (eT) on which the semiconductor package is mounted is stacked on the first stack stack 310. When the stacked tray (T) or the empty tray (eT) is sequentially raised, the tray picker 340 can be supplied to the pick-up position for the replacement operation of the package picker part 600.

In this case, the first tray stack 310 is a tray (T) or a bin tray for replacing the package picker unit 600 using a magazine, a cassette, etc. in which multiple trays (T) or bin trays (eT) are stacked. (eT) was continuously supplied.

The second trace stack 320 is located on an adjacent side of the first trace stack 310, and the second trace stack 320 is also made of an elevator having a lift function, and the second trace stack ( In 320, the stacked tray T or the empty tray eT is sequentially lowered in a state in which multiple stacks of the tray T or the empty tray eT in which the semiconductor package is mounted are sequentially stacked, so that the package picker unit 600 is provided. Through this, it is possible to provide a space for continuously stacking the tray (T) or the empty tray (eT) that has undergone the replacement process of the semiconductor package.

In this case, when the tray T or the empty tray eT is completely stacked so that there is no space in the second tray stack 320, the tray T or the empty tray eT stacked on the second tray stack 320 is empty. To empty the tray (T) or empty tray (eT) can be stacked to form a space again.

In addition, the tray loader unit 300; The tray (T) or the empty tray (eT) supplied from the first tray stack 310 is seated on the first tray plate 311 and the second tray plate 312, respectively, so that the replacement process of the package picker part 600 is performed. Waiting for the pick-up position, the tray (T) or the empty tray (eT) through the operation process of the first tray plate 311 and the second tray plate 312 cross each other of the package picker portion (600) After performing the replacement process, it is moved to a subsequent process, and at the same time, for the replacement process of the package picker part 600, a first transfer to simultaneously perform a process in which the tray T or the empty tray eT is preliminarily moved. 330 is further included.

The first transfer 330 is provided between the package picker unit 600 and the first trace stack 310 and the second trace stack 320, wherein the first transfer 330 is the first trace stack 310 The first tray plate 311 and the second tray plate 312 that allow one of the trays (T) or the empty tray (eT) supplied from the vehicle to be alternately seated and waiting to be picked up are third actuators (315) for linear movement. ) Are provided in mutually symmetrical directions, and the first tray plate 311 moves up and down through a fifth cylinder 313, and the second tray plate 312 moves up and down through a sixth cylinder 314. It becomes possible.

At this time, while the first tray plate 311 and the second tray plate 312 are cross-moved through the third actuator 315 which is an electric actuator, the first tray plate 311 and the second in the cross movement process The fifth cylinder 313 and the sixth cylinder 314 raise the first tray plate 311 and the second tray plate 312 in opposite directions so that the tray plate 312 does not interfere with the linear movement of each other. And a descending avoidance movement, through which the tray (T) or the empty tray (eT) seated on the first tray plate (311) performs a replacement process of the package picker part (600). In the plate 312, a tray (T) or an empty tray (eT) for performing a replacement process is seated and waiting in advance, and through the operation process as described above, the first tray plate 311 and the second tray plate ( 312) while continuously cross-moving, it is possible to repeatedly perform the process of supplying the tray T or the empty tray eT for the replacement process of the package picker part 600 and the replacement process simultaneously.

In addition, the tray loader unit 300 picks up the tray T or the empty tray eT in which the package picker unit 600 is replaced in the first transfer unit 330, and then the second tray stack 320. A tray picker that repeatedly performs the process of loading and loading on the first tray stack 310 and then moving it to the first transferer 330 after picking up the tray T or the empty tray eT. 340).

The tray picker 340 is provided at a position that can reciprocate between the first transfer 330, the first trace stack 310, and the second trace stack 320. It has an adsorption section 341 capable of picking up objects by vacuum adsorption, and picks up the tray T or the empty tray eT of the first tray stack 310 through the pickup of the adsorption section 341. The transfer 330 can be moved and seated, and the first transfer 330 transfers the semiconductor package to the second tray stack 320 by picking up the tray T or the empty tray eT. The pickup process is performed repeatedly.

At this time, in the tray picker 340, the adsorption part 341 is connected to the fourth actuator 342, and the fourth actuator 342 includes a first transfer 330, a first trace stack 310, and a second. Provides the power to reciprocate the trace stack 320, the adsorption part 341 can be moved up and down through a pneumatic cylinder, the fourth actuator 342 is an electric actuator for guiding linear movement.

Then, the first transfer unit 400 is;

Selectively moving any one of the jig (J) or boat (B), bin jig (eJ), or bin boat (eB) supplied through the first magazine loader unit 100 to the location of the package picker unit 600 It is for.

For example, the first transfer unit 400 is; Pick up any one of the jig (J), boat (B), bin jig (eJ), bin boat (eB) supplied through the first magazine loader 100 to slide the first rail 420 1 feed gripper 410; And guiding one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) slided through the first transfer gripper 410 to the location of the package picker part 600. The first rail 420; further includes.

In the first transfer gripper 410, the first pusher 130 of the first magazine loader unit 100 is any one of a jig (J), a boat (B), a bin jig (eJ), and a bin boat (eB). It is provided in a position to push, the first transfer gripper 410 is the first gripping plate 412 and the second gripping plate 413 is opened or closed in the form of forceps through the first gripping cylinder 411 While picking up the upper and lower ends of any one of the jig (J), the boat (B), the bin jig (eJ), and the bin boat (eB) supplied through the first magazine loader unit 100 to the first rail 420 Jig (J), boat (B), bin jig (eJ), bin boat (JJ) inserted into the first rail 420 at the rear ends of the first grip plate 412 and the second grip plate 413 eB) is provided with a first hermetic plate 414 for sliding the slide by any one of the first grip plate 412, second grip plate 413, the first side of the pickup plate 414 is located, the first side It is possible to move back and forth along the first rail 420 through the grip guide 415 and to move up and down through the second grip cylinder 416.

At this time, the first grip guide 415 is a jig (J), boat (B), bin jig (eJ), bin boat (eB) through the first grip plate 412 and the second grip plate 413 Carrying out a moving process for picking up any one of the first rails 420; performing the jig (J), the boat (B), the empty jig (eJ), and the empty boat (1) inserted into the first rail 420 ( eB) iteratively performs a moving process for guiding any one of the slides; in this situation, the second grip cylinder 416 includes a first grip plate 412 and a second grip plate 413, and The first grip plate 412, the second grip plate 413, and the pick-up side provided with the first wheat plate 414 are jigs (J), boats (B), and empty jigs during the cross process of the 1 mill plate (414). (eJ), the first gripping plate 412, the second gripping plate 413, and the first sealing plate 414 are provided to alternately move the front and rear sides of any one of the empty boats (eB). It provides a repetitive lift movement function on the pickup side.

Likewise, the first grip guide 415 may apply a rail that guides linear movement by transmitting power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide.

The first rail 420 is provided in a direction in which the first transfer gripper 410 moves in a straight line. A pair of first fixed rails 421 and the first transfer gripper 410 are interposed therebetween. Jig (J), boat (B), bin on the first stepped 423 provided with the first variable rail 422 facing each other and provided above the first fixed rail 421 and the first variable rail 422 As either a jig (eJ) or an empty boat (eB) is seated, a space for moving the slide is provided.

Here, the first variable rail 422 may be moved back and forth toward the first fixed rail 421 through the first rail guide 422a, which provides power to move the first variable rail 422 back and forth. The first rail cylinder 422b is connected, and an interval between the first fixed rails 421 may be arbitrarily adjusted according to the front-rear movement of the first variable rail 422.

At this time, as the first variable rail 422 is moved back and forth, as the gap between the first fixed rails 421 is arbitrarily adjusted, the jig (J), boat (B), and empty jig (eJ) manufactured in various widths for each process are randomly adjusted. ), It is possible to correspond to any one of the empty boat (eB).

Meanwhile, as the first rail guide 422a, an LM guide provided in the direction of the first fixed rail 421 may be applied to the lower end of the first variable rail 422, and the first rail cylinder 422b may be made of One variable rail 422 is provided at the rear end of the front-rear moving direction to selectively provide power for front-rear moving.

And, the second transfer unit 500 is;

To selectively move either the jig (J) or the boat (B) selectively supplied through the second magazine loader unit 200 to the position of the package picker unit 600.

For example, the second transfer unit 500 is; A second transfer gripper 510 for picking up either the jig J or the boat B supplied through the second magazine loader unit 200 and sliding the second rail 520; And a second rail 520 for guiding the jig (J) or boat (B), which slides through the second transfer gripper 510, to the position of the package picker part (600).

The second transfer gripper 510 is provided at a position where the second pusher 230 of the second magazine loader 200 pushes and supplies the jig (J) or boat (B), the second transfer gripper ( 510) picks up the upper and lower sides of the jig (J) or boat (B) while the third grip plate 512 and the fourth grip plate 513 are opened or closed in the form of forceps through the third grip cylinder 511 While being inserted into the first rail 420, the jig (J) or boat (B) inserted into the second rail 520 is pushed to the rear ends of the third grip plate 512 and the fourth grip plate 513. A second sealing plate 514 for moving the slide is provided, and the pick-up side on which the third gripping plate 512, the fourth gripping plate 513, and the second sealing plate 514 is located is via the second gripping guide 515. It is possible to move back and forth along the second rail 520, and it is possible to move up and down through the fourth grip cylinder 516.

At this time, the second grip guide 515 picks up the jig (J) or boat (B) through the third grip plate (512) and the fourth grip plate (513) to the second rail (520). The moving process for; performing, and the moving process for guiding the jig (J) or the boat (B) inserted into the second rail (520) so that the second mill plate (514) slides; iteratively performs crossing, in this situation In the fourth grip cylinder 516, the third grip plate 512, the fourth grip plate 512, the fourth grip plate 513, and the second grip plate 514 during the cross-processing process (513), the third gripping plate 514, the third gripping plate 512, the fourth gripping plate so that the pick-up side provided with the second sealing plate 514 can alternately move over the front and rear sides of the jig (J) or the boat (B) (513), a second lift plate 514 is provided with a repetitive lifting movement function of the pickup side.

Likewise, the second grip guide 515 may also apply a rail that guides linear movement by transmitting power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide.

The second rail 520 is provided in a direction in which the second transfer gripper 510 moves in a straight line. A pair of second fixed rails 521 and the second transfer gripper 510 are interposed therebetween. Two variable rails 522 are provided facing each other, and a jig (J) or boat (B) is seated on the second stepped rail (523) provided above the second fixed rail (521) and the second variable rail (522). While providing space for slide movement.

Here, the second variable rail 522 may be moved back and forth toward the second fixed rail 521 through the second rail guide 522a, which provides power to move the second variable rail 522 back and forth. The second rail cylinder 522b is connected, and an interval between the second fixed rails 521 may be arbitrarily adjusted according to the front-rear movement of the second variable rail 522.

At this time, as the second variable rail 522 is moved back and forth, as the gap between the second fixed rails 521 is arbitrarily adjusted, it can correspond to the width of the jig (J) or boat (B) manufactured in various widths for each process. There will be.

On the other hand, the second rail guide 522a may be applied to the LM guide provided in the direction of the second fixed rail 521 at the lower end of the second variable rail 522, the second rail cylinder 522b is the second It is provided at the rear end of the variable rail 522 in the front-rear moving direction to selectively provide power for front-rear movement.

Here, the first transfer unit unit 400 and the second transfer unit unit 500 is provided to the side, the jig (J) through the first transfer unit unit 400 or the second transfer unit unit 500 is a package pick The first step of repeating the process of moving and loading the cover of the jig (J) covered with the jig (J) to be separated from the jig (J) before being moved to the cover 600, the first cover stack (2200) Cover picker 2000; And a first cover stack 2200 positioned on the moving side of the first cover picker 2000 and providing a space for loading the cover of the jig J picked up through the first cover picker 2000. It includes more.

The first cover picker 2000 is provided with a twelfth actuator 224 coupled at right angles to the transfer directions of the first transfer unit unit 400 and the second transfer unit unit 500, wherein the first cover picker (2000) is a fifth picker 2100 having the function of picking up the object by vacuum adsorption by pneumatics is connected to the twelfth actuator 224 through the thirteenth actuator 315, and the twelfth actuator 224 Is to make the fifth picker 2100 linearly reciprocate between the first transfer unit part 400 or the second transfer unit part and the first cover stack 2200, and the thirteenth actuator 315 is the fifth picker. (2100) for the pick-up operation.

At this time, the twelfth actuator 224 and the thirteenth actuator 315 may apply an electric actuator, and the fifth picker 2100 may include a first transfer unit 400 or a second transfer unit 500. The cover is picked up from the jig (J) that is moved through the slide, and the cover picked up through the fifth picker (2100) is moved to the first cover stack (2200).

The first cover stack 2200 is provided at a position where the first cover picker 2000 can pick up and load the cover of the jig J, and the first cover stack 2200 is a lift having a lift function It is made of, and the cover of the jig (J) picked up through the first cover picker (2000) is stacked, and the cover of the stacked jig (J) is sequentially lowered one by one to continuously load the jig (J) cover. Provide space.

At this time, if a plurality of jig (J) covers are stacked on the first cover stack 2200 and there is no space, the cover of the jig J stacked on the first cover stack 2200 is emptied to form a stack space again. do.

And, the package picker unit 600;

Any one of the jig (J), boat (B), or tray (T) selectively moved through one of the first transfer unit unit 400, the second transfer unit unit 500, and the tray loader unit 300 After the semiconductor package is picked up, it is intended to repeatedly perform a replacement operation for mounting and moving the semiconductor package picked up in any one of the replacement target bin jig (eJ), bin boat (eB), and bin tray (eT).

For example, the package picker unit 600; Any one of the jig (J), the boat (B), the empty jig (eJ), and the empty boat (eB) moved through the first transfer unit unit 400, the first jig plate 611 and the second jig plate ( 612), each of which is placed in the replacement process using the first picker 630 and the second picker 640, and the first jig plate 611 and the second jig plate 612 cross-move each other. Through the process, any one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) seated on either of the first jig plate 611 or the second jig plate 612 is a semiconductor At the same time, the package replacement process is performed, and at the same time, any one of the jig (J), the boat (B), the bin jig (eJ), and the bin boat (eB) seated on the other side waits to move in advance for the replacement process of the semiconductor package. It further includes a second transfer 610 to allow the process to be performed simultaneously.

The second transfer 610 is provided at a supply position of a jig (J), a boat (B), a bin jig (eJ), and a bin boat (eB) moved through the first transfer unit 400. 2 The transfer 610 is a jig (J), boat (B), the empty jig (eJ), the first jig plate 611 that allows any one of the empty boats (eB) to slide continuously alternately, respectively And the second jig plate 612 is provided in the mutually opposite directions to the fifth actuator 613 for linear movement, the first jig plate 611 is elevated through the seventh cylinder 614, the second The jig plate 612 may be elevated through the eighth cylinder 615.

At this time, while the first jig plate 611 and the second jig plate 612 cross each other through the fifth actuator 613 which is an electric actuator, the first jig plate 611 and the second during the movement process The seventh cylinder 614 and the eighth cylinder 615 raise or lower the first jig plate 611 and the second jig plate 612, respectively, in opposite directions so that the jig plate 612 does not interfere with each other. As the avoidance movement is performed, one of the first jig plate 611 or the second jig plate 612 seated on the jig (J), boat (B), bin jig (eJ), or bin boat (eB) Any one performs a process of replacing a semiconductor package using the first picker 630 and the second picker 640, and at the same time, the jig (J), the boat (B), the empty jig (eJ) seated on the other side, Any one of the empty boats (eB) simultaneously performs a process of waiting for movement for the replacement process of the semiconductor package, and the first and second jig plates 611 and 612 repeat crossing and avoiding movements. In doing so, the semiconductor package replacement process is continuously performed.

In addition, the package picker unit 600; The jig (J) or boat (B) moved through the second transfer unit 500 is seated on the third jig plate 621 and the fourth jig plate 622, respectively, and the first picker 630 and the second Waiting to the replacement process position using the picker 640, the third jig plate 621 and the fourth jig plate 622 through the operation process to cross each other through the third jig plate 621 or the fourth jig plate The jig (J) or boat (B) seated on either side of the (622) performs a replacement process of the semiconductor package, and at the same time, the jig (J) or boat (B) seated on the other side replaces the semiconductor package. In order to further include a third transfer 620 to simultaneously perform the process of waiting to move.

The third transferer 620 is provided at a supply position of a jig (J) or a boat (B) moved through the second transfer unit 500, the third transferer 620 is a supplied jig (J) Alternatively, the third jig plate 621 and the fourth jig plate 622, which allow the boat B to alternately slide while being alternately moved, are respectively provided in opposite directions to the fifth actuator 613 for linear movement. , The third jig plate 621 may be elevated through the ninth cylinder 624, and the fourth jig plate 622 may be elevated through the tenth cylinder 625.

At this time, while the third jig plate 621 and the fourth jig plate 622 cross each other through the sixth actuator 623 which is an electric actuator, the third jig plate 621 and the fourth in the movement process The ninth cylinder 624 and the tenth cylinder 625 raise or lower the third jig plate 621 and the fourth jig plate 622, respectively, in opposite directions so that the jig plate 622 does not interfere with each other. As the avoidance movement is performed, the jig (J) or the boat (B) seated on either of the third jig plate 621 or the fourth jig plate 622 includes a first picker 630 and a second picker 640 ) To perform the process of replacing the semiconductor package, and at the same time, either the jig (J) or the boat (B) seated on the other side simultaneously performs a process of waiting for movement for the process of replacing the semiconductor package, and The third jig plate 621 and the fourth jig plate 622 repeat the crossing movement and the avoiding movement, so that the semiconductor package replacement process is continuously performed.

In addition, the package picker unit 600; In any one of the jig (J), the boat (B), the tray (T) selectively moved through any one of the first transfer unit unit 400, the second transfer unit unit 500, the tray loader unit 300 After picking up the semiconductor package, the first picker 630 and the second picker that repeatedly perform the replacement work to be seated by moving to any one of the replacement target bin jig (eJ), bin boat (eB), and bin tray (eT) ( 640).

The first picker 630 and the second picker 640 are provided at positions where the second transferer 610 and the third transferer 620 can reciprocate, the first picker 630 and the second picker ( 640) has an adsorption structure capable of picking up objects by vacuum adsorption by pneumatic, and the first picker 630 and the second picker 640 each have four adsorption structures, and simultaneously pick up eight semiconductor packages A jig waiting on any one of the first transferer 330, the second transferer 610, and the third transferer 620 through pickup of the first picker 630 and the second picker 640 (J), a boat (B), a tray (T) picks up a semiconductor package from any one of the replacement target bin jig (eJ), bin boat (eB), bin tray (eT) of the replacement work Makes it possible to perform iteratively.

At this time, the first picker 630 and the second picker 640 having the four adsorption structures are provided with separate pneumatic cylinders for each adsorption structure, thereby enabling the lifting movement.

Meanwhile, the first picker 630 is connected to the seventh actuator 651, and the second picker 640 is connected to the eighth actuator 652 provided in the symmetrical direction of the first picker 630, The seventh actuator 651 and the eighth actuator 652 include a first picker 630 and a second picker 640, respectively, a first transfer 330, a second transfer 610, and a third transfer 620. It is possible to reciprocate to the position of.

At this time, the seventh actuator 651 and the eighth actuator 652 are respectively connected to the first and second ends 630 and the second picker 640, while one end is connected to both sides of the ninth actuator 653 at right angles, respectively. It is possible to move back and forth in opposite directions, and for picking up the first picker 630 and the second picker 640 through the seventh actuator 651, the eighth actuator 652, and the ninth actuator 653 It allows free movement.

Likewise, the seventh actuator 651, the eighth actuator 652, and the ninth actuator 653 may also apply an electric actuator to guide linear movement.

Here, the package picker unit 600; No. 1 for picking up the semiconductor package from the tray T supplied through the tray loader 300 and then picking up the semiconductor package picked up on the empty boat eB supplied through the first transfer unit 400 fair;

Alternatively, after picking up the semiconductor package from the boat B supplied through the second transfer unit 500, the semiconductor package picked up by the empty jig eJ supplied through the first transfer unit 400 Step 2 to move and settle;

Alternatively, after picking up the semiconductor package from the jig (J) supplied through the first transfer unit 400, the semiconductor package picked up by moving to the empty tray (eT) supplied through the tray loader 300 Seating process 3;

Alternatively, after picking up the semiconductor package from the tray (T) supplied through the tray loader unit 300 and moving the semiconductor package picked up to the empty jig (eJ) supplied through the first transfer unit 400 Seating process 4;

Alternatively, after picking up the semiconductor package from the jig (J) supplied through the second transfer unit 500, the semiconductor package picked up on the empty boat (eB) supplied through the first transfer unit 400 Step 5 to settle by moving;

Alternatively, after picking up the semiconductor package from the boat (B) supplied through the first transfer unit 400, and then moving the semiconductor package picked up on the empty tray (eT) supplied through the tray loader unit 300 Seating process 6; It further comprises selectively performing any one of.

Meanwhile, the package picker unit 600 may selectively perform any one of the first process, the second process, the third process, the fourth process, the fifth process, and the sixth process, and the package picker part According to the optional process of 600, the first magazine loader unit 100, the second magazine loader unit 200, the first transfer unit unit 400, the second transfer unit unit 500 and the third transfer unit unit ( 700), the fourth transfer unit 800, the first magazine unloader 900, and the second magazine unloader 1000 correspondingly operate selectively.

Then, the third transfer unit 700 is;

The location of the first magazine unloader unit 900 of any one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) supplied through the replacement operation of the package picker unit 600 It is intended to perform the process of moving to.

For example, the third transfer unit unit 700; A third transfer gripper that picks up any one of the jig (J), boat, bin jig (eJ), and bin boat (eB) that has been replaced by the package picker unit 600 and slides it on the third rail 720 710; And one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) slided through the third feed gripper 710 to the first magazine unloader unit 900 The third rail 720 to be further included.

The third transfer gripper 710 can pick up any one of a jig (J), a boat, a bin jig (eJ), or a bin boat (eB) that has completed the replacement of the semiconductor package in the package picker unit 600. It is provided in the position, the third feed gripper 710 is the fifth gripping plate 712 and the sixth gripping plate 713 is spread through the fifth gripping cylinder 711 or pinched jig (J) ), A boat, a bin jig (eJ), a bin boat (eB), pick up one of the upper and lower sides to be picked up and put into the third rail 720, the fifth grip plate 712 and the sixth grip plate ( At the rear end of 713), a third sealing plate 714 is provided to slide the jig (J), boat, bin jig (eJ), or bin boat (eB), which is inserted into the third rail 720, The pick-up side on which the fifth grip plate 712, the sixth grip plate 713, and the third hermetic plate 714 are located can be moved back and forth along the third rail 720 through the third grip guide 715, During this process, it is possible to move up and down through the sixth grip cylinder 716.

At this time, the third grip guide 715 is a jig (J), boat (B), bin jig (eJ), bin boat (eB) through the fifth grip plate 712 and the sixth grip plate 713 Carrying out a pick-up process for picking up any one of the rails 720, the jig (J), the boat (B), the empty jig (eJ), and the empty boat (3) inserted into the third rail (720) eB) iteratively performs a moving process for guiding one of the slides; in this situation, the sixth grip cylinder 716 includes a fifth grip plate 712 and a sixth grip plate 713, and During the cross process of the three-mill plate 714, the pick-up side provided with the fifth grip plate 712, the sixth grip plate 713, and the third wheat plate 714 is a jig (J), a boat (B), an empty jig (eJ), a pick-up equipped with a fifth gripping plate 712, a sixth gripping plate 713, and a third sealing plate 714 to alternately move over the front and rear sides of any one of the empty boats (eB) It provides the function of repetitive lifting movement of the side.

Similarly, the third grip guide 715 may also apply a rail that guides linear movement by transmitting power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide.

The third rail 720 is provided in a direction in which the third transport gripper 710 moves in a straight line, and the third transport gripper 710 is interposed between the pair of third fixed rails 721 and the third rail 720. A jig (J), a boat (B), and a bin are provided on the third stepped rail (723) provided with the three variable rails (722) facing each other, and provided on top of the third fixed rail (721) and the third variable rail (722). A jig (e), a boat (b), a jig (eJ) moved through the third rail 720 by providing a space for slide movement while one of the jig (eJ) and the empty boat (eB) is seated , One of the empty boat (eB) is to be supplied to the first magazine unloader (900).

Here, the third variable rail 722 may be moved back and forth to the third fixed rail 721 through the third rail guide 722a, and provide power to move the third variable rail 722 back and forth. The third rail cylinder 722b is connected, and an interval between the third fixed rails 721 may be arbitrarily adjusted according to the front-rear movement of the third variable rail 722.

At this time, as the gap between the third fixed rails 721 is arbitrarily adjusted as the third variable rails 722 are moved back and forth, the jigs (J), boats (B), and empty jigs (eJs) are manufactured in various widths for each process. ), And can respond to the empty boat (eB).

Meanwhile, the third rail guide 722a is provided in the form of an LM guide in the direction of the third fixed rail 721 at a lower end of the third variable rail 722, and the third rail cylinder 722b is a third variable rail It is provided at the rear end of the forward-backward movement direction of 722 to selectively provide power for forward-backward movement.

Then, the fourth transfer unit unit 800;

It is for selectively performing a process of moving the empty jig (eJ) or the empty boat (eB) from which the semiconductor package is emptied to the position of the second magazine unloader unit 1000 through the replacement operation of the package picker unit 600.

For example, the fourth transfer unit unit 800; A fourth transfer gripper 810 that picks up the empty jig (eJ) or the empty boat (eB) that has been replaced in the package picker unit 600 and slides it on the fourth rail 820; And a fourth rail 820 for guiding the empty jig (eJ) or the empty boat (eB) slided through the fourth transfer gripper 810 to the second magazine unloader unit 1000.

The fourth transfer gripper 810 is provided at a location where a package picker unit 600 can pick up an empty jig (eJ) or empty boat (eB) that has been replaced with a semiconductor package. The gripper 810 has upper and lower ends of the empty jig (eJ) or empty boat (eB) while the seventh grip plate 712 and the eighth grip plate 813 are opened or closed in the form of forceps through the seventh grip cylinder 811. Pick up one side to be picked up to be inserted into the fourth rail 820, and the empty ends of the seventh grip plate 712 and the eighth grip plate 813 are inserted into the fourth rail 820 or the empty jig (eJ) or bin A fourth sealing plate 814 for sliding the slide of the boat eB is provided, and the pick-up side on which the seventh grip plate 712, the eighth grip plate 813, and the fourth wheat plate 814 is located is the fourth grip. It is possible to move back and forth along the fourth rail 820 through the guide 815, and it is possible to move up and down through the eighth grip cylinder 816 in this process.

At this time, the fourth grip guide 815 allows the empty jig (eJ) or the empty boat (eB) to be input to the fourth rail 820 through the seventh grip plate 712 and the eighth grip plate 813. A moving process for pick-up; performing, and repeatedly moving the moving process for guiding the empty jig (eJ) or the empty boat (eB) inserted in the fourth rail 820; in this situation, the eighth Grip cylinder 816 is the seventh grip plate 712, the eighth grip plate 813, and the fourth grip plate 814 during the cross-processing of the seventh grip plate 712, eighth grip plate 813, the The seventh grip plate 712, the eighth grip plate 813, so that the pick-up side provided with the four sealing plate 814 can alternately move over the front and rear sides of the bin jig (eJ) or the bin boat (eB), It provides a repetitive lifting movement function of the pickup side provided with the fourth sealing plate 814.

Similarly, the fourth grip guide 815 may also apply a rail that guides linear movement by transmitting power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide.

The fourth rail 820 is provided in a direction in which the fourth transfer gripper 810 moves in a straight line. A pair of fourth fixed rails 821 and a fourth transfer gripper 810 are interposed therebetween. The four variable rails 822 are provided facing each other, and the fourth fixed rail 821 and the fourth stepped rail 823 provided as upper portions of the fourth variable rails 822 are empty jigs (eJ) or empty boats (eB). As it is seated, it provides a space for moving the slide so that the empty jig (eJ) or empty boat (eB) moved through the fourth rail 820 is supplied to the second magazine unloader 1000.

Here, the fourth variable rail 822 may be moved back and forth to the fourth fixed rail 821 through the fourth rail guide 822a, and provide power to move the fourth variable rail 822 back and forth. The fourth rail cylinder 822b is connected, and an interval between the fourth fixed rails 821 may be arbitrarily adjusted according to the front-rear movement of the fourth variable rail 822.

At this time, as the fourth variable rail 822 is moved back and forth, as the gap between the fourth fixed rails 821 is arbitrarily adjusted, it can correspond to a bin jig (eJ) or a bin boat (eB) manufactured in various widths for each process. There will be.

Meanwhile, the fourth rail guide 822a is provided in the form of an LM guide in the direction of the fourth fixed rail 821 at the lower end of the fourth variable rail 822, and the fourth rail cylinder 822b is a fourth variable rail It is provided at the rear end of the forward-backward movement direction of 822 to selectively provide power for forward-backward movement.

Here, the third transfer unit portion 700 and the fourth transfer unit portion 800 is provided to the side, the jig (J), the semiconductor package is seated through the package picker portion 600, the third transfer unit portion 700 Or in the process of being moved through the fourth transfer unit 800, the cover of the jig (J) loaded on the second cover stack (3200) to the jig (J) is picked up and moved to repeat the covering process. Cover picker 3000; And a second cover stack 3200 positioned on the moving side of the second cover picker 3000 and providing a space on which the cover which can be covered by the jig J is loaded while the second cover picker 3000 is picked up. ; Further includes.

The second cover picker 3000 is provided with a fourteenth actuator 342 coupled at right angles to the transfer direction of the third transfer unit 700 and the fourth transfer unit 800, the second cover picker (3000) is a sixth picker 3100 having the function of picking up a target by vacuum adsorption by pneumatics is connected to the fourteenth actuator 342 through the fifteenth actuator 613, and the fourteenth actuator 342 Is to make the sixth picker 3100 linearly reciprocate between the third transfer unit part 700 and the fourth transfer unit part 800 and the second cover stack 3200, and the fifteenth actuator 613 6 to be moved up and down to pick up the picker (3100).

At this time, the 14th actuator 342 and the 15th actuator 613 may apply an electric actuator, and the sixth picker 3100 covers the cover of the jig J loaded on the second cover stack 3200. In the picked-up state, the cover picked up is covered with a jig (J) that slides through the third transfer unit unit 700 or the fourth transfer unit unit 800 to automatically perform the assembly process of the cover.

The second cover tack 3200 is provided at a position where the second cover picker 3000 can pick up the cover of the jig J, and the second cover tack 3200 is made of a lift having a lift function. The second cover picker 3000 allows the cover of the jig J that can be picked up to be stacked, and the cover of the loaded jig J is sequentially raised one by one so that the jig J is continuously picked up. Allow supply of the cover to be performed.

At this time, when the plurality of jig (J) covers are all picked up and empty in the second cover stack 3200, the plurality of jig (J) covers are reloaded and filled in the second cover stack 3200.

And, the first magazine unloader unit 900;

For carrying out the process of loading any one of the jig (J), boat (B), bin jig (eJ), bin boat (eB) moved through the third transfer unit 700 to the magazine (M) will be.

For example, the first magazine unloader unit 900; The empty space magazine (M) in the third transfer unit unit 700, the jig (J), the boat (B), empty jig (eJ), one of the empty boats (eB) to wait on the side to move, the When any one of the jig (J), the boat (B), the empty jig (eJ), and the empty boat (eB) is loaded and filled in the magazine M in the standby state, it is moved to the third transfer unit 920 to be recovered. At the same time, the third gripper 910 repeating the process of re-supplying the empty space magazine M; And the third gripper 910 is continuously supplied by moving the empty space magazine M, and through the third gripper 910, a jig (J), a boat (B), an empty jig (eJ), an empty boat It further includes; (eB) a third transfer unit 920 for recovering any one of the magazine (M) is loaded.

The third gripper 910 has a magazine (M) on the side where the jig (J), the boat (B), the empty jig (eJ), and the empty boat (eB) are moved and supplied from the third transfer unit unit 700. The third gripper 910 picks up the upper side of the magazine M while the fifth pick-up plate 912 is opened or closed in the form of tongs through the eleventh cylinder 911. The sixth pickup plate 913 provided as a lower portion of the fifth pickup plate 912 supports the lower end of the magazine M so that the magazine M can be picked up from the third transfer unit 920, and the fifth pickup plate The pick-up side equipped with the 912 and the sixth pick-up plate 913 can move up and down by the tenth actuator 914, and at the same time, move back and forth through the third guide 915 to freely pick up and pick up the jig after pick-up (J), the boat (B), bin jig (eJ), it is possible to recover the magazine (M) filled with any one of the empty boat (eB), the magazine (M) supplied through the third transfer unit (920) ), And the third transfer unit 700 waits on the side to which one of the jig (J), the boat (B), the empty jig (eJ), or the empty boat (eB) is supplied, and the jig (J), The boat (B), the empty jig (eJ), the empty boat (eB) is filled with any one of the magazine (M) has a function to return to the third transfer unit 920.

At this time, the tenth actuator 914 may apply an electric actuator for a linear movement guide, and the third guide 915 transfers the power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide to move linearly. You can apply a rail to guide the.

The third transfer unit 920, the magazine (M) is sequentially input and transferred to the conveyor of the third transfer unit 920 in a state in which the conveyors providing transfer functions in opposite directions to each other are provided in the up and down direction. The upper conveyor of the third transfer unit 920 is sequentially fed to the pick-up side of the third gripper 910 by sequentially inputting an empty magazine M having an insertion space, and the lower conveyor of the third transfer unit 920 is a jig ( J), a boat (B), a bin jig (eJ), a magazine (M) filled with any one of the provides a continuous movement function in the outer direction to be recovered.

And, the second magazine unloader unit 1000;

It is for selectively performing a process of loading the empty jig (eJ) or the empty boat (eB) moved through the fourth transfer unit 800 in the magazine (M).

For example, the second magazine unloader unit 1000; The empty space magazine (M) is waited on the side where the empty jig (eJ) or empty boat (eB) is moved in the fourth transfer unit unit 800, and the boat (B) is placed in the magazine (M) in the standby state. When loaded and filled, the fourth gripper 1100 repeats the process of supplying the magazine M in which the space is emptied while moving it to the fourth transport unit 1200 to be recovered; And a magazine (M) in which space is emptied and continuously supplied to the fourth gripper 1100, and the empty jig (eJ) or the empty boat (eB) is loaded through the fourth gripper 1100. It further includes a; fourth transfer unit 1200 for recovering.

The fourth gripper 1100 is positioned to allow the magazine M to wait on the side where the empty jig eJ or the empty boat eB is moved and supplied in the fourth transfer unit 800. The gripper 1100 picks up the upper one side of the magazine M while the seventh pick-up plate 1120 is closed or opened in the form of forceps through the twelfth cylinder 1110, and is provided as a lower portion of the seventh pick-up plate 1120 The eighth pickup plate 1130 supports the lower end of the magazine M so that the magazine M can be picked up from the fourth transport unit 1200, and the seventh pickup plate 1120 and the eighth pickup plate 1130 ) Is provided, the side can be moved up and down by the eleventh actuator 1140, and at the same time, it is possible to move back and forth through the fourth guide 1150, allowing free pick-up and recovery of the magazine M after pick-up. The magazine (M) supplied through the fourth transfer unit 1200 is picked up and placed on the supply side of the fourth transfer unit 800, and an empty jig (eJ) or an empty boat (eB) is placed in the waiting magazine (M). When is filled it is to be recovered in the fourth transfer unit 1200.

At this time, the eleventh actuator 1140 may apply an electric actuator for guiding a linear movement, and the fourth guide 1150 transmits the power of a pneumatic cylinder or an electric cylinder to a slide guide such as an LM guide to move linearly. You can apply a rail to guide the.

The fourth transfer unit 1200, the magazine (M) is sequentially fed to the conveyor of the fourth transfer unit 1200 in a state in which the conveyors providing the transfer functions in opposite directions to each other are provided in the up and down direction. The upper conveyor of the fourth transfer unit 1200 is sequentially fed to the pick-up side of the fourth gripper 1100 by sequentially inputting an empty magazine M having an insertion space, and the lower conveyor of the fourth transfer unit 1200 is an empty jig. (eJ) or the empty boat (eB) is filled with a magazine (M) to provide a continuous movement function in the outer direction to be recovered.

Hereinafter, as an embodiment of the operating state of the present invention, a process apparatus for automatic replacement of a semiconductor package will be described with reference to FIGS. 11 to 16. FIG. 11 is a flow chart of process 1 of the process equipment, FIG. 12 is a flow chart of process 2 of the process equipment, FIG. 13 is a flow chart of process 3 of the process equipment, FIG. 14 is a flow chart of process 4 of the process equipment, FIG. 15 Is a flowchart of process 5 of the process equipment, and FIG. 16 is a flowchart of process 6 of the process equipment.

According to this, the process apparatus 1 having the above-described structure is the first, second, third, fourth, fifth, and sixth processes in the package picker part 600 according to various replacement targets of the semiconductor package. Any one of the steps can be selectively performed, the first magazine loader unit 100, the second magazine loader unit 200, the tray loader unit 300, the first transfer unit unit 400 according to the process to be performed ), The second transport unit 500, the first magazine unloader 900, and the second magazine unloader 1000 are selectively operated.

On the other hand, in the first step, the tray → boat replacement process, the tray T supplied through the tray loader unit 300 is mounted on the first transfer unit 330, and through the first transfer unit unit 400. The supplied empty boat (eB) is seated on the second transferer 610, and in this state, the first picker 630 and the second picker 640 are placed in the tray T seated on the first transferer 330. After the semiconductor package is picked up, the process of replacing the semiconductor package is continuously performed while repeating the process of seating the picked-up semiconductor package on the empty boat eB while moving to the second transfer 610.

At this time, when performing the first process, the empty boat (eB) supplied through the first magazine loader unit 100 moves to the package picker unit 600 through the first transfer unit unit 400, and the The boat B performing the replacement process and performing the replacement process of the semiconductor package moves to the first magazine unloader unit 900 through the third transfer unit unit 700 and is sequentially loaded into the magazine M. In this process, the tray loader unit 300 continuously supplies a tray T in which a plurality of semiconductor packages are seated for the semiconductor package replacement process of the package picker unit 600.

In the second process, the boat → jig replacement process, the boat B supplied through the second transfer unit 500 is seated on the third transfer unit 620, and through the first transfer unit 400 The supplied bin jig (eJ) is seated on the second transferer 610, and in this state, the first picker 630 and the second picker 640 are on the boat B seated on the third transferer 620. After the semiconductor package is picked up, the process of mounting the semiconductor package picked up in the empty jig eJ while moving to the second transferer 610 is repeated, so that the semiconductor package replacement process is continuously performed.

In this case, when performing the second process, the boat B on which the plurality of semiconductor packages supplied through the second magazine loader unit 200 is seated is package picker unit 600 through the second transfer unit unit 500. At the same time, it moves to the package picker unit 600 through the first jig unit (400), the empty jig (eJ) supplied through the first magazine loader unit 100, and performs a replacement process of the semiconductor package. The jig (J) that performed the replacement process of the semiconductor package is moved to the first magazine unloader (900) through the third transfer unit (700) and sequentially loaded into the magazine (M) while the empty boat (eB) is It moves to the second magazine unloader 1000 through the fourth transfer unit 800, and is sequentially loaded into the magazine M.

In the third process, the jig-to-tray replacement process, the jig (J) supplied through the first transfer unit 400 is seated on the second transferer 610, and is supplied through the tray loader unit 300. The empty tray (eT) is seated on the first transferer 330, and in this state, the first picker 630 and the second picker 640 are semiconductor packages in a jig J seated on the second transferer 610. After repeating the process of seating the picked-up semiconductor package on the empty tray eT while moving to the first transfer 330 after picking up, the replacement process of the semiconductor package is continuously performed.

At this time, when performing the third process, the plurality of semiconductor packages supplied through the first magazine loader unit 100 is seated jig (J) is a package picker unit 600 through the first transfer unit 400 At the same time, the empty tray (eT) supplied through the tray loader unit 300 waits at the replacement process position of the package picker unit 600, and the tray T performing the replacement process of the semiconductor package is the tray loader. As it is recovered back to the unit 300 and sequentially loaded, the empty jig eJ is moved to the first magazine unloader 900 through the third transfer unit unit 700 and sequentially loaded into the magazine M.

In the fourth process, the tray → jig replacement process, the tray T supplied through the tray loader unit 300 is seated on the first transfer unit 330 and supplied through the first transfer unit unit 400. The bin jig (eJ) is seated on the second transferer 610, and in this state, the first picker 630 and the second picker 640 are semiconductor packages in a tray T seated on the first transferer 330. After repeating the process of seating the picked-up semiconductor package on the empty jig eJ while moving to the second transfer 610 after picking up, the replacement process of the semiconductor package is continuously performed.

At this time, when performing the above process 4, the tray T on which the plurality of semiconductor packages supplied through the tray loader unit 300 is seated waits at the position of the replacement process of the package picker unit 600 and at the same time the first magazine loader The bin jig (eJ) supplied through the unit 100 moves to the package picker unit 600 through the first transfer unit unit 400 to perform a semiconductor package replacement process, and performs the semiconductor package replacement process. One jig (J) is moved to the first magazine unloader (900) through the third transfer unit (700) and is sequentially loaded into the magazine (M), and the empty tray (eT) that performs the replacement process of the semiconductor package Is recovered to the tray loader unit 300 and sequentially loaded.

In the fifth step, the jig-to-boat replacement process, the jig J supplied through the second transfer unit 500 is seated on the third transfer unit 620, through the first transfer unit 400 The supplied empty boat (eB) is seated on the second transferer 610, and in this state, the first picker 630 and the second picker 640 are placed in the jig J seated on the third transferer 620. After the semiconductor package is picked up, the process of replacing the semiconductor package is continuously performed while repeating the process of seating the picked-up semiconductor package on the empty boat eB while moving to the second transferer 610.

At this time, when performing the fifth process, the jig (J) in which a plurality of semiconductor packages supplied through the second magazine loader unit 200 is seated is package picker unit 600 through the second transfer unit unit 500 At the same time, the empty boat (eB) supplied through the first magazine loader unit 100 is moved to the package picker unit 600 through the first transfer unit unit 400 to perform a semiconductor package replacement process, The boat B performing the process of replacing the semiconductor package is moved to the first magazine unloader 900 through the third transfer unit 700 and sequentially loaded into the magazine M, and the process of replacing the semiconductor package The bin jig (eJ) that has been performed is moved to the second magazine unloader 1000 through the fourth transfer unit 800, and is sequentially loaded into the magazine M.

The sixth process is a boat-to-tray replacement process, in which the boat B supplied through the first transfer unit 400 is seated on the second transferer 610, and supplied through the tray loader unit 300. The empty tray (eT) is seated on the first transferer 330, and in this state, the first picker 630 and the second picker 640 are semiconductor packages in the boat B seated on the second transferer 610. After repeating the process of seating the picked-up semiconductor package on the empty tray eT while moving to the first transfer 330 after picking up, the replacement process of the semiconductor package is continuously performed.

In this case, when performing the process 6, the boat B on which the plurality of semiconductor packages supplied through the first magazine unloader 900 is seated is package picker 600 through the first transfer unit 400. ), While the empty tray (eT) supplied through the tray loader unit 300 is supplied to the replacement process location of the package picker unit 600, performs a semiconductor package replacement process, and replaces the semiconductor package replacement process. The performed tray (T) is sequentially loaded while being recovered by the tray loader unit (300), and the empty boat (eB) performing the replacement process of the semiconductor package is the first magazine unloader unit through the third transfer unit unit (700). Go to (900) and are sequentially loaded into the magazine (M).

Meanwhile, a vision capable of performing a vision inspection may be provided based on data taken of a target during the process of replacing the semiconductor package as described above, and material information may be recognized by photographing a target supplied before performing the process of replacing the semiconductor package. It is possible to check whether there is an abnormality with respect to the position of the semiconductor package picked up during the process of replacing the semiconductor package, and to check whether there is an abnormality with respect to the alignment position where the semiconductor package is seated after performing the replacement process of the semiconductor package. Can be.

In addition, marking printing may be performed on a target that has undergone the replacement process of the semiconductor package as necessary.

As described above. The present invention has been described with a description and drawings exemplifying certain preferred embodiments, but the terms used herein are for easy description of the present invention, limiting the meaning of these terms or limiting the scope described in the claims Not for the sake of

The present invention is capable of various changes, modifications, modifications, and the like by those skilled in the art to which the present invention pertains without departing from the spirit and scope of the invention indicated by the claims according to the above-described embodiments. Anyone can easily see.

One; Processing equipment 100; 1st magazine loader section
110; A first transfer unit 120; 1st gripper
130; First pusher 200; 2nd magazine loader section
210; A second transfer unit 220; 2nd gripper
230; A second pusher 300; Tray loader section
310; A first trace stack 320; 2nd trace stack
330; A first transfer 340; Tray picker
400; A first transfer unit section 410; 1st transfer gripper
420; First rail 500; Second transfer unit
510; A second transfer gripper 520; Rail 2
600; A package picker unit 610; 2nd transfer
620; Third transfer 630; 1st picker
640; Second picker 700; 3rd transfer unit part
710; Third transfer gripper 720; Rail 3
800; A fourth transfer unit portion 810; 4th transfer gripper
820; 4th rail 900; 1st magazine unloader section
910; Third gripper 920; Third transfer department
1000; A second magazine unloader unit 1100; 4th gripper
1200; 4th transfer unit

Claims (5)

It is a product that selectively performs a process of sequentially supplying a jig (J) or boat (B) on which a semiconductor package is seated, and a sequential continuous supply of a bin jig (eJ) or a bin boat (eB) for mounting a semiconductor package using a magazine (M). 1, the magazine loader unit 100;
A second magazine loader unit 200 for selectively performing a process of sequentially supplying either a jig (J) or a boat (B) on which the semiconductor package is seated using a magazine (M);
After continuously supplying the tray T in which the semiconductor package is seated, the empty tray eT in which the semiconductor package is emptied from the tray T is continuously loaded, or the empty tray eT in which the semiconductor package is seated is continuously supplied. A tray loader unit 300 for selectively performing a process in which the tray T on which the semiconductor package is mounted is continuously loaded on the empty tray eT;
Optionally moving any one of the jig (J) or boat (B), bin jig (eJ) or bin boat (eB) supplied through the first magazine loader unit 100 to the location of the package picker unit 600 A first transfer unit part 400;
A second transfer unit unit 500 for selectively moving either a jig J or a boat B selectively supplied through the second magazine loader unit 200 to a position of the package picker unit 600;
Any one of the jig (J), boat (B), or tray (T) selectively moved through one of the first transfer unit unit 400, the second transfer unit unit 500, and the tray loader unit 300 After picking up the semiconductor package from the package picker unit (600) that repeatedly performs the replacement operation of moving the semiconductor package picked up in any one of the replacement target bin jig (eJ), bin boat (eB), bin tray (eT) )Wow;
The location of the first magazine unloader unit 900 of any one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) supplied through the replacement operation of the package picker unit 600 And a third transfer unit 700 performing a process of moving to;
A fourth transfer unit unit for selectively performing a process of moving the empty jig (eJ) or the empty boat (eB) supplied through the replacement operation of the package picker unit 600 to the position of the second magazine unloader unit 1000 (800);
A process for loading any one of the jig (J), the boat (B), the empty jig (eJ), and the empty boat (eB) moved through the third transfer unit 700 into a magazine (M) 1 magazine unloader unit 900;
Consists of a second magazine unloader (1000) to selectively perform the process of loading the empty jig (eJ) or bin boat (eB) moved to the magazine (M) moved through the fourth transfer unit 800 Process equipment for the automatic replacement of the semiconductor package, characterized in that. According to claim 1,
The package picker part 600 picks up the semiconductor package from the tray T supplied through the tray loader part 300 and then picks it up to the empty boat eB supplied through the first transfer unit part 400. Step 1 of moving a semiconductor package to settle;
Alternatively, after picking up the semiconductor package from the boat B supplied through the second transfer unit 500, the semiconductor package picked up by the empty jig eJ supplied through the first transfer unit 400 Step 2 to move and settle;
Alternatively, after picking up the semiconductor package from the jig (J) supplied through the first transfer unit 400, the semiconductor package picked up by moving to the empty tray (eT) supplied through the tray loader 300 Seating process 3;
Alternatively, after picking up the semiconductor package from the tray (T) supplied through the tray loader unit 300 and moving the semiconductor package picked up to the empty jig (eJ) supplied through the first transfer unit 400 Seating process 4;
Alternatively, after picking up the semiconductor package from the jig (J) supplied through the second transfer unit 500, the semiconductor package picked up on the empty boat (eB) supplied through the first transfer unit 400 Step 5 to settle by moving;
Alternatively, after picking up the semiconductor package from the boat (B) supplied through the first transfer unit 400, and then moving the semiconductor package picked up on the empty tray (eT) supplied through the tray loader unit 300 Process equipment for the automatic replacement of semiconductor packages, which further includes selectively performing any one of the six replacement processes. According to claim 1,
The first magazine loader unit 100 is a magazine in which any one of a jig (J) or boat (B) on which a semiconductor package is mounted, a bin jig (eJ) or a bin boat (eB) for mounting a semiconductor package is stacked ( A first transfer unit 110 for continuously supplying M) to supply, and recovering a magazine M in which any one of a jig (J), a boat (B), an empty jig (eJ), and an empty boat (eB) is emptied;
Pick up the magazine (M) supplied through the first transfer unit 110, and any of the jig (J), boat (B), bin jig (eJ), bin boat (eB) from the pickup magazine (M) When one is emptied, the first gripper 120 to return the magazine M to the first transport unit 110 to be recovered;
From the magazine (M) picked up through the first gripper 120, any one of the jig (J), boat (B), bin jig (eJ), and bin boat (eB) to the first transfer unit 400 Process unit for automatic replacement of the semiconductor package further comprises a first pusher 130 to be pushed continuously. According to claim 1,
The second magazine loader unit 200 continuously moves and supplies the magazine M in which the jig J or the boat B is stacked, and recovers the magazine M in which the jig J or the boat B is empty. The second transfer unit 210;
When the magazine (M) supplied through the second transfer unit 210 is picked up, and the jig (J) or boat (B) is emptied from the picked-up magazine (M), the magazine (M) is transferred to the second transfer unit (210). ) To return the second gripper 220 to be recovered;
The second pusher 230 to push the jig (J) or the boat (B) from the magazine (M) picked up through the second gripper 220 to the second transfer unit 500 to be continuously input; Process equipment for automatic replacement of semiconductor packages. According to claim 1,
The package picker part 600 includes a jig (J), a boat (B), which is selectively moved through one of the first transfer unit part 400, the second transfer unit part 500, and the tray loader part 300, The first picker that repeatedly picks up the semiconductor package from any one of the trays (T) and moves it to any one of the bins (eJ), bin boats (eB), and bin trays (eT) to be replaced. Process device for automatic replacement of the semiconductor package further comprising a (630) and a second picker (640).

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