KR101667686B1 - A map marking and map file forming device for semiconductor packaging - Google Patents

A map marking and map file forming device for semiconductor packaging Download PDF

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Publication number
KR101667686B1
KR101667686B1 KR1020160081437A KR20160081437A KR101667686B1 KR 101667686 B1 KR101667686 B1 KR 101667686B1 KR 1020160081437 A KR1020160081437 A KR 1020160081437A KR 20160081437 A KR20160081437 A KR 20160081437A KR 101667686 B1 KR101667686 B1 KR 101667686B1
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South Korea
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unit
magazine
marking
csp substrate
substrate
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KR1020160081437A
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Korean (ko)
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신계철
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에스에스오트론 주식회사
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Publication of KR101667686B1 publication Critical patent/KR101667686B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/682—Mask-wafer alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54413—Marks applied to semiconductor devices or parts comprising digital information, e.g. bar codes, data matrix

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Laser Beam Processing (AREA)

Abstract

The present invention provides identification information by marking and forming a map on a CSP substrate in a production process of a semiconductor package, reading the information by using a vision device, forming a map file on a computer, And more particularly, to a semiconductor package marking and map forming apparatus capable of automating a semiconductor package while sharing information on defective products in a process, thereby enhancing the reliability of the product.
According to an aspect of the present invention, A marking and map forming apparatus for a semiconductor package substrate, comprising: a body part (100); The CSP substrate 10 mounted on the magazine 20 is continuously fed to the first feeder 300 by using the substrate pusher 230 one by one while the magazine 20 on which the plurality of CSP substrates 10 are mounted is continuously transported, A magazine loader section 200 for supplying the magazine loader section 200; A first feeder unit 300 for picking up the CSP substrate 10 continuously supplied through the magazine loader unit 200 and supplying the picked up CSP substrate 10 to the table transfer unit 400; The CSP substrate 10 supplied through the first feeder unit 300 is sequentially transported to the first vision unit 510, the marking unit 520, the second vision unit 530, and the third vision unit 540 A table transfer unit 400 for transferring the image data; A first vision unit 510 for confirming whether or not the CSP substrate 10 to be transported through the table transfer unit 400 is properly loaded, a marking position of the 2D barcode, and marking of the 2D barcode; A marking unit 520 formed by laser marking a 2D bar code on the CSP substrate 10 having passed through the first vision unit 510; A second vision unit 530 for checking whether a 2D barcode formed on the CSP substrate 10 passed through the marking unit 520 is defective; A third vision unit 540 for reading the 2D barcode of the CSP substrate 10 that has passed through the second vision unit 530 and storing the read 2D barcode data as a map file in a computer database; A second feeder unit 600 for directly pushing the CSP substrate 10 having passed through the third vision unit 540 to be inserted into the magazine 20 of the empty slot of the magazine offloader unit 700; And a magazine offloader unit 700 for sequentially loading the CSP substrate 10 transferred through the second feeder unit 600 into the magazine 20 of the empty slot.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a marking and map forming apparatus,

The present invention provides identification information by marking and forming a map on a CSP substrate in a production process of a semiconductor package, reading the information by using a vision device, forming a map file on a computer, And more particularly, to a semiconductor package marking and map forming apparatus capable of automating a semiconductor package while sharing information on defective products in a process, thereby enhancing the reliability of the product.

In general, a strip of a semiconductor package is formed into a long rectangular shape so that a plurality of semiconductor packages can be simultaneously obtained through processes such as die bonding, wire bonding, molding, and marking. A lead frame, a printed circuit board, and the like. The strip has a form in which a plurality of units corresponding to one semiconductor package are arranged in a row, or arranged in a matrix form having rows and columns.

During the manufacturing process of the semiconductor package, the product is inspected and the reliability test is carried out. Then, the product is marked on the strip by separating the product into the good product and the defective product, and the map is formed by the marking operation, .

With respect to such a technique, in the conventional technique disclosed in Japanese Patent Application Laid-Open No. 10-2010-0071621, there is a wafer sorting step of aligning the arrangement of chips after the loading of the wafer so as to be parallel to the conveying direction of the XY stage, A wafer moving step of moving the wafer to an inspection initial position where the line scan camera and the illumination unit are positioned after the aligning step; and a step of moving the wafer by moving the wafer through the XY stage, A first scanning step of scanning the reflected light with a line scan camera; an image analyzing step of analyzing whether each chip is defective using the image scanned through the line scan camera after the scanning step; A bad chip map data generation step of generating an analysis result on the presence or absence of defects as map data after the analysis step; And a chip marking step of performing marking on a plurality of chips to be used as a reference position of the wafer after the step of generating a bad chip map data.

However, various semiconductor package marking methods and devices have been developed in the background of prior arts, but they are exposed to technical problems to be improved.

As a result, in the conventional semiconductor package marking process, in the marking and the map forming process for determining whether the strip is defective, the operator manually performs a variety of manual operations such as printing a dot on the surface of the strip using a lubricant pen or the like There is a problem that the reliability of the produced product is lowered because the operator neglects to find a defective product by carelessness in the marking process or misrepresents good and defective products, and it is troublesome to manually and troublesome work efficiency is remarkably deteriorated.

(Document 1) Korean Patent Publication No. 10-2010-0071621 (Filing Date: December 19, 2008).

The present invention provides an apparatus for automatically performing a marking and map forming process for determining whether a CSP substrate (PCB) is defective in a production process of a semiconductor package, It is possible to reduce the number of workers and reduce the cost and improve the productivity by using the automated equipment replacing the manual work, and it is possible to perform the accurate good and defective product indication by the machine operation, thereby improving the reliability of the product. have.

According to an aspect of the present invention,

An apparatus for marking and mapping a semiconductor package substrate,

A body portion;

A magazine loader unit for continuously feeding magazines on which a plurality of CSP substrates are mounted while continuously feeding the CSP substrates 10 mounted on the magazines to the first feeder unit one by one using a substrate pusher;

A first feeder unit for picking up a CSP substrate continuously supplied through the magazine loader unit and supplying the CSP substrate to the table transfer unit;

A table transfer unit for sequentially transferring the CSP substrate 10 supplied through the first feeder unit to the first vision unit, the marking unit, the second vision unit, and the third vision unit;

A first vision unit for confirming whether or not the CSP substrate transferred through the table transfer unit is properly loaded, a marking position of the 2D barcode, and marking of the 2D barcode;

A marking unit for laser marking the 2D bar code on the CSP substrate having passed through the first vision unit;

A second vision unit for checking whether a 2D bar code formed on the CSP substrate passed through the marking unit is defective;

A third vision unit for reading the 2D barcode of the CSP substrate that has passed through the second vision unit and storing the read 2D barcode data as a map file in a computer database;

A second feeder portion for directly pushing and feeding the CSP substrate passed through the third vision portion to be inserted into a magazine of an empty slot of the magazine offloader portion;

And a magazine offloader unit for sequentially loading the CSP substrate transferred through the second feeder unit to a magazine of an empty slot,
The magazine loader portion includes a first conveyance line for continuously conveying a plurality of magazines stacked with at least one CSP substrate to the first elevator;
A first elevator for performing a stepwise elevating operation such that the CSP substrates stacked on the top of the slots of the magazine are sequentially positioned on the substrate pusher while the first and second ends of the magazine being conveyed through the first conveying line are fixed by being held by the first clamp;
Further comprising a substrate pusher for directly pushing a CSP substrate positioned sequentially through the first elevator and extracting the CSP substrate from a slot of the magazine and continuously feeding the first feeder unit to the first feeder unit,
The first elevator includes a first rail for vertically moving the first clamp;
A fourth rail fixedly coupled to a lower end of the first rail and forwarding and retracting the first rail;
And a first clamp which is coupled to the first rail and is vertically transported, wherein the first clamp clamps the upper and lower ends of the magazine by performing a clamping operation or a spreading operation in a clamping manner by a cylinder operation .

According to the present invention, when a CSP substrate mounted on a magazine is sequentially supplied through a magazine loader portion, a predetermined position of the CSP substrate and the presence or absence of a 2D barcode are checked, and then a 2D barcode is formed by laser marking And the CSP substrate on which the marking and map forming process has been completed is loaded on the magazine of the empty slot while allowing the data of the 2D bar code thus formed to be confirmed and read to be stored in the database as a map file, Marking and map formation of defectiveness is performed by using automated equipment replacing existing manual work, and it is possible to reduce cost and improve productivity, and to accurately produce good and defective products by machine operation The reliability of the product is improved.

FIG. 1 to FIG. 5 are diagrams showing constituent parts of the marking and map forming apparatus of the semiconductor package according to the first embodiment of the present invention. FIG.
FIG. 6 through FIG. 8 are operational states of the marking and map forming apparatus of the semiconductor package according to the present invention. FIG.
FIG. 9 is a block diagram of a marking and map forming apparatus for a semiconductor package according to a second embodiment of the present invention; FIG.

The marking and map forming apparatus of the semiconductor package according to the present invention will be understood from the following detailed description with reference to the accompanying drawings.

In the following description of the exemplary embodiments of the present invention, a detailed description of components that are widely known and used in the art to which the present invention belongs is omitted, and unnecessary explanations thereof are omitted. It is to communicate the point more clearly.

1 to 9 are views illustrating a marking and map forming apparatus for a semiconductor package according to each embodiment of the present invention.

The magazine loader unit 200 continuously supplies the CSP substrate 10 to the first feeder unit 300. The marking and map forming apparatus 1 includes a main body 100, A first feeder unit 300 for picking up the CSP substrate 10 and transporting the CSP substrate 10 to be positioned at the table transfer unit 400 and a second feeder unit 300 for feeding the CSP substrate 10 to the first vision unit 510, the marking unit 520, 530 and the third vision unit 540 and a first vision unit 510 for confirming the correct position of the CSP substrate 10, the 2D barcode marking position, and the marking margin of the 2D barcode 540 A second vision unit 530 for confirming whether the 2D barcode is defective, a third vision unit 530 for storing the 2D barcode data in a map database in a computer database, A second feeder unit 600 for inserting the CSP substrate 10 into the magazine 20 of the empty slot of the magazine offloader unit 700, It is configured to include a magazine Offload unit 700 to be sequentially stacked in a (10).

Hereinafter, as an embodiment of the basic structure of the present invention, the structure of the marking and map forming apparatus of the semiconductor package according to the first embodiment will be described in detail with reference to Figs. 1 to 5. Fig. Fig. 1 is a front view of the marking and map forming apparatus according to the first embodiment, Fig. 2 is a plan view of the marking and map forming apparatus according to the first embodiment, and Fig. 3 is a plan view of the marking and map forming apparatus according to the first embodiment FIG. 4 is a view showing a first transfer line and a second transfer line of the marking and mapping apparatus according to the first embodiment, and FIG. 5 is a view showing the first and second transfer lines according to the first embodiment. And the first and second feeder portions of the marking and map forming apparatus, respectively.

First, the main body 100 includes:

The magazine loader unit 200, the first feeder unit 300, the first vision unit 510, the marking unit 520, the second feeder unit 300, The third vision unit 540, the second feeder unit 600, and the magazine offloader unit 700, respectively.

The main body 100 includes a top plate 110 at the top in the form of a square table and includes a magazine loader unit 200, a first feeder unit 300, a first vision unit 510, a marking unit A hydraulic pump and various sensors for controlling the operation of the magazine offloader unit 700 while operating the second vision unit 520, the second vision unit 530, the third vision unit 540, the second feeder unit 600, An electric / electronic part can be provided.

The magazine loader unit 200 includes:

The CSP substrate 10 mounted on the magazine 20 is continuously fed to the first feeder 300 by using the substrate pusher 230 one by one while the magazine 20 on which the plurality of CSP substrates 10 are mounted is continuously transported, .

The magazine loader unit 200 according to the basic embodiment of the present invention includes: A first transfer line 210, a first elevator 220, and a substrate pusher 230.

For example, the magazine loader unit 200 may include: And a first conveyance line 210 for continuously conveying a plurality of magazines 20 stacked with one or more CSP substrates 10 to the first elevator 220. [

The first transfer line 210 is installed on the upper side of the upper plate 110 on the left side of the main body 100 and a plurality of magazines 20 in which the CSP substrate 10 is stacked is prepared by an operator.

Here, the first transfer line 210 includes: And a plurality of first conveyors 211 are vertically installed in multiple stages to perform the supply or recovery of the magazines 20, respectively.

The first conveyor 211 transfers the magazine 20, which is continuously rotated in the form of an endless track by the power of the motor, and is mounted on the belt by the rotation operation of the belt.

At this time, the first conveyor 211 is installed in multiple stages using a first support frame 212 fixedly coupled to the upper plate 110 of the main body 100 at an arbitrary interval, And the spacing distance of the first support frame 212 corresponds to the height of the magazine 20.

Further, the magazine loader unit 200 includes: The CSP substrate 10 stacked on the uppermost end of the magazine 20 in the state where the first and second clamps 223 and 223 hold the upper and the lower ends of the magazine 20 transferred through the first transfer line 210 sequentially Further comprising a first elevator (220) that performs a stepped lift operation positioned on the substrate pusher (230).

Here, the first elevator 220 includes: A first rail 221 which vertically feeds the first clamp 223 and a second rail 222 which is fixedly connected to the lower end of the first rail 221 and feeds the first rail 221 back and forth .

The first rail 221 and the second rail 222 have a moving guide formed by a linear actuator and linearly reciprocating and the second rail 222 is mounted on the upper plate The first rail 221 is fixed to the moving guide of the second rail 222 by bolts perpendicularly and is fixed to the first rail 222 by bolts. (221) can be transported back and forth.

Also, the first elevator 220 includes: And a first clamp 223 coupled to the first rail 221 and vertically conveyed by a cylinder operation to pinch or fix the upper and lower ends of the magazine 20 do.

The first clamp 223 is fixedly coupled to the upper and lower moving guides of the first rail 221 by bolts and the first and second clamps 223 and 223 are fixed by a cylinder provided in the first clamp 223, The clamp 223 is pivoted or unfolded.

Further, the magazine loader unit 200 includes: And a substrate pusher 230 for directly feeding the CSP substrate 10 sequentially positioned through the first elevator 220 to the first feeder unit 300 after extracting the CSP substrate 10 from the slots of the magazine 20 while directly pushing the CSP substrate.

The substrate pusher 230 is installed on the upper side of the first conveyance line 210 adjacent to the upper side of the first elevator 220 and is disposed on the upper side of the first conveyance line 210, A pusher cylinder 232 for supplying power to the magazine 20 and a pushing cylinder 231 for pushing and feeding the CSP substrate 10 of the magazine 20 directly forward and backward when the pusher cylinder 232 is connected to the pusher cylinder 232 .

The pusher cylinder 232 is a pneumatic actuator. The pusher 231 is manufactured in the form of a rod and is coupled to a rod that reciprocates forward and backward of the pusher cylinder 232, thereby operating the pusher cylinder 232 back and forth.

The first feeder unit 300 includes:

And the CSP substrate 10 continuously supplied through the magazine loader unit 200 is picked up and supplied to the table transfer unit 400.

The first feeder 300 is horizontally coupled with the conveying direction of the CSP substrate 10 fed through the magazine loader unit 200 and is connected to the fifth rail 300 for reciprocating the picker 320 And a picker 320 coupled to the fifth rail 310 to reciprocate forward and backward and to feed the CSP substrate 10 supplied through the magazine loader 200 to the table transfer unit 400 .

The fifth rail 310 has a moving guide that is made of a linear actuator and linearly reciprocates. The fifth rail 310 has a magazine loader portion 200 and a table transfer portion The fifth rail 310 is installed in parallel to the conveying direction of the CSP substrate 10.

The picker 320 is moved up or down by the operation of the cylinder so that the rod of the metal material provided in the upper and lower grippers is moved or unfolded to directly hold the CSP substrate 10 supplied through the magazine loader unit 200 And the picker 320 is fixedly coupled to the moving guide of the fifth rail 310 by bolts so that the magazine loader unit 200 and the table transfer (400). ≪ / RTI >

The table transfer unit 400 includes:

The CSP substrate 10 supplied through the first feeder unit 300 is sequentially transported to the first vision unit 510, the marking unit 520, the second vision unit 530, and the third vision unit 540 .

The table transfer unit 400 is installed in the lower side of the main body 100 in a linear direction in which the picker 320 of the first feeder unit 300 reciprocates, A transfer rail 410 horizontally coupled to the inside of the lower portion of the main body 100 between the first and second feeder portions 300 and 600 and sequentially transferring the vacuum table 420, The CSP substrate 10 supplied through the first feeder unit 300 is moved up and down by the first vision unit 510 and the marking unit 500 according to the operation of the transfer rail 410. [ The second vision unit 530, and the third vision unit 540. The vacuum table 420 includes a vacuum table 420,

The transfer rail 410 has a moving guide that is linearly reciprocated by a linear actuator and the transfer rail 410 is disposed between the first feeder 300 and the second feeder 600 The marking unit 520, and the second vision unit 530 in the horizontal direction.

The vacuum table 420 is coupled to a moving guide of the transfer rail 410 in the form of a rectangular plate, and a function of a cylinder is applied to a side to which the vacuum table 420 is coupled, And the left and right reciprocating operation is performed through the transfer rail 410 while operating.

The first vision unit 510 includes:

The orientation of the CSP substrate 10 to be fed through the table transfer unit 400, the marking position of the 2D barcode, and the marking of the 2D barcode.

The first vision unit 510 is a camera that converts image information into a data signal to be connected to a computer and transmits and receives image information. The first vision unit 510 can convert image information of the supplied CSP substrate 10 into data, Whether or not the CSP substrate 10 fed through the transfer unit 400 has been supplied to the correct position is compared with the computer recorded image to continue the operation, It is confirmed whether or not the 2D barcode of the supplied CSP substrate 10 is marked and whether or not the 2D barcode is already marked. Then, only for the normal CSP substrate 10, So that the work can proceed.

At this time, even if the supply position of the CSP substrate 10 is slightly deviated from the original correct position, the first vision unit 510 can transfer the CSP substrate 10 to the computer and perform laser marking as much as the off- The position of the CSP substrate 10 can be corrected to form the 2D barcode, thereby reducing errors in the 2D barcode reading of the CSP substrate 10 in the subsequent process.

The marking unit 520 includes:

And laser marking the 2D bar code on the CSP substrate 10 which has passed through the first vision part 510. [

The marking unit 520 applies a CO2 laser unit to imprint an identification code, an arbitrary character, a QR code, etc. of the CSP substrate 10 with a laser, and passes through the first vision unit 510 So that laser marking can be performed on a normal CSP substrate 10.

The second vision unit 530 includes:

And to check whether the 2D bar code formed on the CSP substrate 10 having passed through the marking unit 520 is defective.

The second vision unit 530 is a camera that is connected to a computer and converts image information into a data signal so as to transmit and receive image information. The 2D bar code is transmitted to the CSP substrate 10 through the marking unit 520, If the marking state of the 2D bar code is different from the predetermined marking image information already stored in the computer, the computer checks whether the marking state of the 2D bar code is defective or not by referring to the second vision unit 530. If the marking state of the 2D bar code is different from the predetermined marking image information already stored in the computer, Signal to inform the CSP substrate 10 that the CSP substrate 10 is defective.

The third vision unit 540 includes:

The 2D barcode data of the CSP substrate 10 that has passed through the second vision unit 530 is read and the read 2D barcode data is stored in the computer database as a map file.

The second vision unit 530 is a camera that is connected to a computer and converts image information into a data signal so as to transmit and receive image information. The second vision unit 530 is a camera that converts the image information of the CSP substrate 10, which has passed through the second vision unit 530, The image information signal is transmitted to the CSP substrate 10 by the computer. The CSP substrate 10 is sorted into good and bad parts, and is formed into a map file. Since the map file is a file formed by a computer, It is possible to perform the defect selection on the specific CSP substrate 10 without any separate process or manual operation and to easily utilize it in the next process.

The second feeder unit 600 includes:

The CSP substrate 10 having passed through the third vision unit 540 is directly pushed and inserted to be inserted into the magazine 20 of the empty slot of the magazine offloader unit 700. [

The second feeder unit 600 is connected horizontally in parallel with the conveyance direction of the CSP substrate 10 that has passed through the third vision unit 540 and is horizontally coupled to the sixth rail 600, And a magazine offloader unit 700 which is coupled to the sixth rail 610 and is reciprocated forward and rearward to directly push the CSP substrate 10 to be transferred through the vacuum table 420 of the table transfer unit 400, And a supply stand 620 for continuously inserting the CSP substrate 10 into an empty slot of the magazine 20 of the magazine 20.

The sixth rail 610 has a moving guide made of a linear actuator and reciprocating linearly. The sixth rail 610 has a magazine offloader part 700 and a table transfer part 700 on a top plate 110 of the main part 100, (400) in parallel to the conveying direction of the CSP substrate (10).

The supply rail 620 is fixed to the moving guide of the sixth rail 610 by bolts and is fixed to the rail 610 in a state of a bar made of a metal material. In response to the reciprocating operation of the fifth rail 310, The CSP substrate 10 continuously fed between the table transfer part 400 and the magazine offloader part 700 while being reciprocated is inserted into the magazine 20 of the magazine offloader part 700.

The magazine offloader unit 700 includes:

And the CSP substrate 10 transferred through the second feeder unit 600 is sequentially stacked on the magazine 20 of the empty slot.

The magazine offloader unit 700 according to the basic embodiment of the present invention includes: A second transfer line 710, and a second elevator 720.

For example, the magazine offloader unit 700 includes: And a second conveyance line 710 to which the magazine 20 of the empty slot is supplied and the magazine 20 to be fed is continuously conveyed to the second elevator 720.

The second transfer line 710 is installed on the upper side of the upper plate 110 to the right of the main body 100 and is prepared by inserting the magazine 20 of the empty slot.

Here, the second transfer line 710 includes: And a plurality of second conveyors 711 are vertically installed in multiple stages to perform the supply or recovery of the magazines 20, respectively.

The second conveyor 711 is driven by the motor to continuously rotate the belt in the form of an endless track so that the magazine 20, which is mounted on the belt, is conveyed by the rotation of the belt.

At this time, the second conveyor 711 is installed in multiple stages using a second support frame 712 which is fixedly coupled to the upper plate 110 of the main body 100 at an arbitrary interval. Preferably, And the spacing distance of the second support frame 712 corresponds to the height of the magazine 20.

Further, the magazine offloader unit 700 includes: The magazine 20 is transported through the second transport line 710 and the magazine 20 is transported to the conveying side of the CSP substrate 10 of the second feeder unit 600 while the second clamp 723 is held and fixed ) To raise and stack the plurality of CSP boards 10 successively in the magazine 20 of the empty slot.

Here, the second elevator 720 includes: A third rail 721 that vertically feeds the second clamp 723 and a fourth rail 722 that is fixedly coupled to the lower end of the third rail 721 and feeds the third rail 721 forward and backward .

The third rail 721 and the fourth rail 722 have a moving guide made of a linear actuator and linearly reciprocating and the fourth rail 722 is fixed to the upper plate The third rail 721 is fixed to the moving guide of the fourth rail 722 by bolts perpendicularly and fixed to the third rail 722 by the fourth rail 722, (721) can be transported back and forth.

Also, the second elevator 720 includes: And further includes a second clamp 723 which is coupled to the third rail 721 so as to vertically convey the magazine 20 to the upper and lower ends of the magazine 20 by clamping or unfolding the magazine 20 by a cylinder operation do.

The second clamp 723 is fixedly coupled to the up and down moving guides of the third rail 721 by bolts and the second clamp 723 is fixed to the second The clamp 723 is pivoted or unfolded.

6 to 8 illustrate operation states of the marking and map forming apparatus of the semiconductor package according to the present invention.

6, the marking and map forming apparatus 1 having the above-described structure includes a plurality of magazines (not shown) in which a plurality of CSP substrates 10 are stacked on a first transfer line 210 of the magazine loader unit 200, The magazine 20 is inserted and the magazine 20 of the empty slot is inserted into the magazine offloader unit 700 to prepare for marking and map formation.

The plurality of magazines 20 thus inserted are continuously conveyed to the first elevator 220 side through the first conveyance line 210. The magazine 20 conveyed to the first elevator 220 side is conveyed to the second elevator 720, The CSP substrate 10 stacked on the top of the slot of the magazine 20 is sequentially positioned on the substrate pusher 230 while the first clamp 223 of the substrate pusher 230 is held and fixed, When the CSP substrate 10 is positioned, the pusher 231 directly pushes the CSP substrate 10 toward the first feeder 300. The first feeder 300 picks up the supplied CSP substrate 10, And is continuously supplied to the transfer unit 400.

7, when the CSP substrate 10 is continuously supplied to the table transfer unit 400 through the first feeder unit 300, the vacuum table 420 of the table transfer unit 400 is transferred to the transferring unit 400, The CSP substrate 10 on the side of the first feeder 300 is seated on the vacuum table 420 while being transported to the first feeder 300 side through the first feeder unit 410.

At this time, the CSP substrate 10 mounted on the vacuum table 420 is moved by the first rail 510, the marking unit 520, the second vision unit 530, The first vision unit 510 confirms whether the CSP substrate 10 is properly positioned, whether the 2D barcode is marked or not, and whether the 2D barcode is marked or not, The marking unit 520 is formed by laser marking a 2D barcode on the CSP substrate 10 and the second vision unit 530 checks whether the 2D barcode formed on the CSP substrate 10 is defective or not, Unit 540 reads the 2D barcode of the CSP substrate 10 and stores the read 2D barcode data as a map file in the computer database.

When the CSP substrate 10 passes through the third vision unit 540 through the table transfer unit 400, the CSP substrate 10 is transferred to the second feeder unit 600, and the second feeder unit 600 Feeds the CSP substrate 10 mounted on the vacuum table 420 and inserts the CSP substrate 10 into the empty slot of the magazine 20 of the magazine offloader unit 700 to be transported.

8, when the CSP substrate 10 is conveyed through the second feeder unit 600, the magazine 20 conveyed through the second conveyance line 710 of the magazine offloader unit 700 The magazine 20 is raised and lowered stepwise to the feeding side of the CSP substrate 10 of the second feeder portion 600 while the second clamp 723 is held and fixed, Thereby allowing the CSP substrate 10 to be inserted through the substrate 600 to be laminated.

When a plurality of CSP substrates 10 are stacked on the entire magazine 20 of the empty slot through the second elevator 720, the magazine 20 is moved to the second conveying line 710 by the second elevator 720, And the process is completed repeatedly by using the marking and map forming apparatus 1. The process shown in FIG.

As another embodiment of the present invention, the arrangement of the marking and map forming apparatus of the semiconductor package according to the second embodiment will be described in detail with reference to FIG. 9 is a view showing a magazine conveyor among the marking and map forming apparatuses according to the second embodiment.

The main body 100 of the marking and map forming apparatus 1 having the above structure is configured such that the magazine 20 of the empty slot in which the CSP substrate 10 is extracted and stored in the magazine loader unit 200 And a magazine conveyor 120 for continuously feeding the magazine conveyor 120 to the magazine offloader unit 700.

The magazine conveyor 120 is horizontally disposed between the first elevator 220 and the second elevator 720 to the inside of the lower portion of the main body 100 and the magazine conveyor 120 is connected to the power of the motor So that the magazine 20, which is continuously rotated in the form of an endless track, is placed on the belt.

When the CSP substrate 10 stacked on the magazine 20 of the magazine loader unit 200 is supplied to the magazine conveyor 120 and the magazine 20 of the empty slot is stored in the first transfer line 210 The magazine 20 of the empty slot is held by the first elevator 220 and lowered while the magazine 20 is mounted on the magazine conveyor 120 and the magazine 20 of the empty slot, And the magazine 20 of the empty slot conveyed to the magazine offloader unit 700 is mounted on the second conveyance line 710 while the second elevator 720 catches the magazine 20 upward.

Accordingly, the magazine 20 of the empty slot can be automatically mounted on the magazine offloader unit 700 through the magazine conveyor 120, thereby providing complete automation.

As described above. While the present invention has been particularly shown and described with reference to certain preferred embodiments thereof, it is to be understood that the terminology used herein is for the purpose of describing the present invention only and is not intended to limit the scope of the claims. But is not intended to,

It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. It will be easy for anyone to know.

100; A main body 200; The magazine loader section
300; A first feeder unit 400; Table transfer part
510; A first vision unit 520; The marking portion
530; A second vision unit 540; Third Vision Division
600; A second feeder unit 700; The magazine off-

Claims (5)

An apparatus for marking and mapping a semiconductor package substrate,
A main body 100;
The CSP substrate 10 mounted on the magazine 20 is continuously fed to the first feeder 300 by using the substrate pusher 230 one by one while the magazine 20 on which the plurality of CSP substrates 10 are mounted is continuously transported, A magazine loader section 200 for supplying the magazine loader section 200;
A first feeder unit 300 for picking up the CSP substrate 10 continuously supplied through the magazine loader unit 200 and supplying the picked up CSP substrate 10 to the table transfer unit 400;
The CSP substrate 10 supplied through the first feeder unit 300 is sequentially transported to the first vision unit 510, the marking unit 520, the second vision unit 530, and the third vision unit 540 A table transfer unit 400 for transferring the image data;
A first vision unit 510 for confirming whether or not the CSP substrate 10 to be transported through the table transfer unit 400 is properly loaded, a marking position of the 2D barcode, and marking of the 2D barcode;
A marking unit 520 formed by laser marking a 2D bar code on the CSP substrate 10 having passed through the first vision unit 510;
A second vision unit 530 for checking whether a 2D barcode formed on the CSP substrate 10 passed through the marking unit 520 is defective;
A third vision unit 540 for reading the 2D barcode of the CSP substrate 10 that has passed through the second vision unit 530 and storing the read 2D barcode data as a map file in a computer database;
A second feeder unit 600 for directly pushing the CSP substrate 10 having passed through the third vision unit 540 to be inserted into the magazine 20 of the empty slot of the magazine offloader unit 700;
And a magazine offloader unit 700 for sequentially loading the CSP substrate 10 transferred through the second feeder unit 600 into the magazine 20 of the empty slot,
The magazine loader unit 200 includes a first conveyance line 210 for continuously conveying a plurality of magazines 20 stacked with at least one CSP substrate 10 to the first elevator 220;
The CSP substrate 10 stacked on the uppermost end of the magazine 20 in the state where the first and second clamps 223 and 223 hold the upper and the lower ends of the magazine 20 transferred through the first transfer line 210 sequentially A first elevator 220 for stepping up and down the substrate pusher 230;
Further comprising a substrate pusher 230 for directly feeding the CSP substrate 10 sequentially positioned through the first elevator 220 to the first feeder unit 300 after extracting the CSP substrate 10 from a slot of the magazine 20,
The first elevator 220 includes a first rail 221 for vertically moving the first clamp 223;
A fourth rail 722 fixedly coupled to the lower end of the first rail 221 for transferring the first rail 221 back and forth;
And a first clamp 223 coupled to the first rail 221 and vertically conveyed by a cylinder operation to pinch or fix the upper and lower ends of the magazine 20 Gt; a < / RTI > delete The method according to claim 1,
The magazine offloader unit 700 includes a second conveyance line 710 to which the magazine 20 of an empty slot is supplied and continuously feeds the magazine 20 to the second elevator 720;
The magazine 20 is transported through the second transport line 710 and the magazine 20 is transported to the conveying side of the CSP substrate 10 of the second feeder unit 600 while the second clamp 723 is held and fixed Further comprising a second elevator (720) for stepping up the CSP substrate (10) so that a plurality of CSP boards (10) are continuously stacked inside the empty slot magazine (20). delete The method of claim 3,
The second elevator 720 includes a third rail 721 for vertically moving the second clamp 723;
A fourth rail 722 fixedly coupled to the lower end of the third rail 721 for transferring the third rail 721 back and forth;
And further includes a second clamp 723 which is coupled to the third rail 721 so as to vertically convey the magazine 20 to the upper and lower ends of the magazine 20 by clamping or unfolding the magazine 20 by a cylinder operation Gt; a < / RTI >
KR1020160081437A 2016-06-29 2016-06-29 A map marking and map file forming device for semiconductor packaging KR101667686B1 (en)

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KR102064193B1 (en) * 2018-03-06 2020-01-09 주식회사 에스에프에이 Split and merge apparatus for goods
KR102147798B1 (en) * 2020-04-13 2020-08-25 (주)이노하이텍 System for inspecting and dispensing soft magnetic powder paste for inductor
KR102194786B1 (en) * 2020-09-16 2020-12-23 에스에스오트론 주식회사 PCB automatic subdivision device of semiconductor package
WO2021201393A1 (en) * 2020-04-01 2021-10-07 (주)인텍플러스 System and method for confirming mounted state of picker mounts

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KR102064193B1 (en) * 2018-03-06 2020-01-09 주식회사 에스에프에이 Split and merge apparatus for goods
WO2021201393A1 (en) * 2020-04-01 2021-10-07 (주)인텍플러스 System and method for confirming mounted state of picker mounts
KR102147798B1 (en) * 2020-04-13 2020-08-25 (주)이노하이텍 System for inspecting and dispensing soft magnetic powder paste for inductor
KR102194786B1 (en) * 2020-09-16 2020-12-23 에스에스오트론 주식회사 PCB automatic subdivision device of semiconductor package

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