KR100872054B1 - Chip scale package jig separate system - Google Patents

Chip scale package jig separate system Download PDF

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Publication number
KR100872054B1
KR100872054B1 KR1020080045097A KR20080045097A KR100872054B1 KR 100872054 B1 KR100872054 B1 KR 100872054B1 KR 1020080045097 A KR1020080045097 A KR 1020080045097A KR 20080045097 A KR20080045097 A KR 20080045097A KR 100872054 B1 KR100872054 B1 KR 100872054B1
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South Korea
Prior art keywords
csp
jig
strip
magazine
unit
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KR1020080045097A
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Korean (ko)
Inventor
신계철
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신계철
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The chip scale package jig system is provided to reduce the cost and time by reducing the whole size of the semiconductor package processing method and semiconductor package working system. The CSP jig system for separating the chip scale package(CSP) strip jig(1124) comprises the loading unit, the separate unit, the vision part, the first unloader, the second unloader. The loading unit supplies the CSP jig. The separate unit separates the CSP strip and the CSP cover from the CSP jig. The vision part detects whether the chip scale package of the CSP strip seceded from the separate unit is the fault or not. The first unloader loads the jig seceded from the separate unit. The second unloader loads the CSP strip seceded from the separate unit.

Description

Chip scale package jig separation system {CHIP SCALE PACKAGE JIG SEPARATE SYSTEM}

The present invention relates to a chip scale package (CSP) jig separation system, and more particularly to a system for automatically separating chip scale package (CSP) strips and jigs.

In general, a semiconductor package strip is a lead frame formed in a long rectangular shape to obtain a plurality of semiconductor packages at the same time through die bonding, wire bonding, molding, and marking processes. , Printed circuit board, circuit film, and the like. Such a strip typically has a form in which a plurality of units corresponding to one semiconductor package are connected in a row or arranged in a matrix form in which the units have rows and columns.

On the other hand, most semiconductor package manufacturing equipment includes a loading unit for supplying strips, a transfer unit for transferring strips to a predetermined destination, a work unit for performing die bonding, wire bonding, molding and marking, and an unloading unit for storing the completed strips again. It consists of a loading part.

Recently, various semiconductor packages are used in various ways. For example, packages such as SD cards are used in mobile phones, digital cameras, and the like. By the way, such a package must be processed into a desired shape. To this end, generally, first, a strip formed of a plurality of packages is cut into respective packages, and further, each package must be processed into a predetermined shape.

An apparatus for processing such a semiconductor package, comprising: a package loading portion on which a tray containing a plurality of pre-processed packages cut into a unit size to be processed is placed; At least one processing jig in which the packages before processing conveyed from the package loading unit are seated; A vision inspector for vision inspecting the position of the pre-processing package seated on the processing jig; At least one package cutting machine for cutting the pre-processed packages seated on the processing jig into a predetermined shape by a wire saw method while moving relative to the at least one processing jig according to the vision inspection result value; A package unloading unit which accommodates packages processed in a predetermined form in a tray; Disclosed is a configuration including at least one package conveying unit for conveying a package before processing from the package loading section to a processing jig and conveying a package processed from the processing jig to a package unloading section. According to this invention, the packages can be cut into the desired shape quickly and accurately in a wire saw manner. (See "Package Processing Apparatus and Method of Hanmi Semiconductor Co., Ltd. (Patent Publication No. 2007-0112941)")

In addition, the loading and unloading unit for loading or unloading the semiconductor package; A transfer unit for transmitting the semiconductor package loaded by the loading unloading unit to a predetermined position for processing; A package fixing part fixed to a jig in which a plurality of slits are formed for cutting the semiconductor package carried by the transfer part; In addition, a semiconductor package processing system, which may be configured, includes a processing unit for processing a semiconductor package fixed to the jig. According to the semiconductor package processing system and the semiconductor package processing method according to the invention having such a configuration, the overall process is automatically performed, the overall size of the semiconductor package processing system and semiconductor package processing method is reduced, there is an effect that the cost and time is reduced. . (See Patent Publication No. 2008-0019534)

In addition, Patent Publication No. 2006-0025640, "Semiconductor package image photographing apparatus," has a circumferential surface of a package insertion hole 100a; 100a 'of a reflective block 100; On the circumferential surface of the package seating portion 800a; 800a 'of the 800; 800', the mirrors 111, 112; 111 ', 112' and the diffusers 121, 122; 121 ', 122' are disposed to face each other. When the image of the semiconductor package P is taken, the illuminated light is dissipated by the diffusers 121 and 122 so that the diffusers 121 and 122 perform a backlight function, so that the side surface of the semiconductor package P may be more accurately without direct reflection of the illumination. An apparatus for image photographing a semiconductor package is disclosed to inspect whether a semiconductor package is defective in which reliability of defect inspection of the semiconductor package P is greatly improved as it can be photographed.

However, these package processing apparatuses do not have a component that can effectively check whether a chip in a package is defective, count the number, and count and rate the data.

In addition, Korean Laid-Open Patent Publication No. 2001-0096304 discloses a "position alignment device for strips for semiconductor packages". The present invention relates to a position alignment device for strips for semiconductor packages, and transfers strips for semiconductor packages through rails. In all semiconductor package manufacturing equipment that performs a predetermined operation, the strip for semiconductor package to improve the production yield of the semiconductor package by precisely aligning the strips located on the rail to a reference position and performing the predetermined operation A rail having continuous grooves formed at both sides thereof so that both ends of the grooves may be transported to one side and a predetermined operation may be performed, and one side of the groove may have a plurality of through holes formed from an upper side to a lower side; A cylinder installed at a lower portion of the rail having the through hole formed therein, the output shaft being located toward the groove; A lower end is connected to the output shaft of the cylinder, and an upper end extending from the lower end is located inside the through hole of the rail, and at the same time, the center is supported by a hinge so that when the cylinder stops operating, the upper end is in the through hole of the rail. It is characterized in that it comprises a pusher to move toward the groove in close contact with the strip toward the other groove of the rail.

 However, in the semiconductor chip separating apparatus, there is a problem that the location of the pins of the semiconductor chip jig and the holes of the CSP strip are narrower than the process gaps, which may cause mislocation. Also, if imperfect settlement occurs, there is no provision for jamming by sensing the lift.

In order to solve this problem, the applicant has filed a "CHIP SCALE PACKAGE JIG LOADING / MARKING SYSTEM}. A system for separating the

An object of the present invention can be carried out the process of loading, marking, inspection, loading, etc. accurately and quickly, and it is possible to quickly and accurately and easily search for defects of the semiconductor chip on the strip to count and rate the data, Provides a system for separating CSP strip and CSP cover from CSP jig produced by CSP strip, jig automatic loading / marking system which can greatly improve the accuracy, productivity and yield for CSP strip, jig loading and marking process will be.

The present invention for achieving the above object is as follows.

According to a first aspect of the present invention, there is provided a semiconductor device comprising: a loading unit supplying a chip scale package (CSP) jig; A separating part separating the CSP strip and the CSP cover from the CSP jig; A vision unit for inspecting whether the chip scale package of the CSP strip separated from the separation unit is defective; A first unloading part for loading a jig separated from the separating part; And a second unloading part for loading the separated CSP strip in the separating part. The chip scale package (CSP) jig separating system for automatically separating the CSP strip jig according to the present invention.

In accordance with a second aspect, the present invention provides a CSP jig separation system of a first aspect, comprising: a monitor for monitoring operation of the components; And a control unit for controlling the operation of the components through the monitor.

According to a third aspect of the present invention, there is provided a CSP jig separation system according to the first aspect, wherein the loading portion includes: a CSP jig magazine loaded with a plurality of CSP jig; A first conveyor for moving the CSP jig magazine; A first elevator for vertically moving the CSP jig magazine moved by the first conveyor to a pusher position at a predetermined interval; And a loading pusher for supplying the CSP jig in the CSP jig magazine moved by the first elevator to the rail one by one.

According to a fourth aspect of the present invention, there is provided a CSP jig separation system of a first aspect, wherein the separation unit comprises: a sensor for sensing the CSP jig; A roller for moving the jig near the CSP separation position when the CSP jig is detected by the sensor; An inlet pusher for moving the CSP jig moved by the roller to a CSP separation position; And a picker separating the CSP strip and the CSP cover from the CSP jig.

According to a fifth aspect, the present invention provides a CSP jig separation system of the fourth aspect, wherein the separation unit comprises: a stack magazine for loading a CSP cover separated by the picker; A second conveyor for moving the CSP strip moved by the picker to a gripper index position; A belt for moving the separated jig to a pusher position; And a pusher for supplying the jig moved to the pusher position to the CSP jig magazine.

According to a sixth aspect of the present invention, in the CSP jig separation system of the fourth aspect, the picker moves the CSP strip moved by the conveyor to the vision position at regular intervals.

According to a seventh aspect of the present invention, in the CSP jig separation system of the fourth aspect, the picker includes a gripper for a strip picker and a gripper for a cover picker.

According to an eighth aspect of the present invention, in the CSP jig separation system of the fourth aspect, the picker is an air cylinder.

According to a ninth aspect of the present invention, in the CSP jig separation system of the fifth aspect, the second conveyor is composed of a servo motor.

According to a tenth aspect of the present invention, there is provided a CSP jig separation system according to a first aspect, wherein the first unloading unit includes: a second elevator loading the separated jig at a predetermined interval into a CSP jig magazine; And a slot magazine for loading the CSP strip separated by the picker.

According to an eleventh aspect of the present invention, there is provided a CSP jig separation system according to the first aspect, wherein the second unloading unit includes: a third elevator for loading the separated CSP strip into a CSP strip magazine while lowering the separated CSP strip at a predetermined interval; And a CSP jig magazine in which the separated jig is loaded.

In accordance with a twelfth aspect of the present invention, in the CSP jig separation system of the first aspect, the vision portion inspects whether the CSP strip is defective by inspecting a mark on the CSP strip.

According to a thirteenth aspect of the present invention, in the CSP jig separation system of the first aspect, the vision portion inspects the mark on the CSP strip while stepping the CSP strip by a servo motor.

In accordance with a fourteenth aspect of the present invention, in the CSP jig separation system of the twelfth or thirteenth aspect, the mark is a golden mark.

According to a fifteenth aspect of the present invention, in the CSP jig separation system of the fourteenth aspect, the golden mark is a golden dot.

In accordance with a sixteenth aspect of the present invention, in the CSP jig separation system of the fourteenth aspect, the golden mark on the CSP strip is inspected and judged to be defective when blackened.

According to a seventeenth aspect of the present invention, in the CSP jig separation system of the sixteenth aspect, after the determination, the total ratio is counted and dataed for one lot.

According to the present invention, the processes of loading, separating, inspecting, loading and the like can be executed quickly and accurately, and the defects of the semiconductor chips on the strip can be searched quickly and accurately and easily, and the ratios can be counted and dataized. It is possible to provide a system for automatic separation of CSP strips and CSP covers from CSP jig, which can greatly improve the accuracy, productivity and yield for the CSP strip jig separation process.

One preferred embodiment of the present invention is described in detail below with reference to the accompanying drawings.

1 is a CSP strip jig detachment system according to the present invention, FIG. 1A is a plan view of a CSP strip jig detachment system according to the present invention, FIG. 1B is a front view of a CSP strip jig detachment system according to the present invention, and FIG. 1 is a left side view of the CSP strip jig separation system according to the present invention, and FIG. 1D is a right side view of the CSP strip jig separation system according to the present invention.

A CSP strip jig 1124 according to the present invention is shown in FIG. 12, and an example of a magazine 1200 (cassette) with one such CSP strip jig 1124 is shown in FIG. 12.

The process of the CSP strip jig separation system according to the present invention consists of the following five processes.

First process: a loading process of supplying a CSP strip jig 1124 (FIG. 12);

Second process: a separation process of separating the CSP strip 1004 and the CSP cover 1002 from the CSP strip jig 1124;

Third step: an inspection step of inspecting whether the CSP of the CSP strip 1004 separated in the separation unit is defective;

4th process: the 1st unloading process which loads the jig 1016 isolate | separated from the separation part; And

5th process: The 2nd unloading process of loading the CSP strip 1004 isolate | separated from the said separation part.

In the above process, the first, fourth, and fifth processes are already known matters as described in the "background art", and thus the detailed description thereof will be omitted and briefly described.

First, with reference to the first process (loading process), a plurality of jigs 1016 for work in the state before the CSP strip 1004 is engaged are loaded in the magazine 1200 as shown in FIG. It is supplied by the jig magazine conveyor (FIG. 2) to the elevator 101 shown in the lower left of 1a. This conveyor is a device for supplying the slot magazine 114 of the loading and unloading unit, the slot magazine 114 loaded in the lower portion is moved to the first elevator 101 by the conveyor and to the sensor of the elevator 101 When the slot magazine 14 is sensed by the clamp, it is held by a clamp and lifted by the servo motor at regular intervals, and the finished empty magazine is stacked on the top by an air cylinder. The conveyor for the unloader's strip magazine and jig magazine loading process is also practically the same. An elevator apparatus for inputting or discharging a magazine containing the CSP strip 1004 is described in detail in JP-A-2002-0017484 of Dongyang Semiconductor Equipment Co., Ltd.

Although only one CSP jig 1016 is shown in FIG. 12, all of them are filled in the actual process. The CSP strip jig magazine 1200 loaded with the jig 1016 is lifted by the first elevator 101 of FIG. 1 so that the upper end of the CSP strip jig magazine 1200 has a first pusher 103 (FIG. 3) or a loading. The pusher (shown in detail in FIG. 5) is raised to the pusher position where it is located. The CSP strip jig magazine 1200 moved to the pusher position is moved up or stepped up at a predetermined interval by the first elevator 101 so that the CSP strip jig 1124 is used one by one by the first pusher 103 using the air cylinder. To feed the rails.

In the second process (separation process), when the CSP strip jig 1124 supplied by the first process is sensed by the sensor, the roller 104 clamps the CSP strip jig 1124 and moves to the separation position. Then, the moved CSP jig 1016 is moved to the detached position by the inlet pusher (FIG. 11). That is, the jig supplied to the rail is supplied by the inlet pusher or the first pusher 103 to a position where the roller 104 does not reach. P & P Transfer separates the CSP strip and cover 1002 from the CSP jig 1016 thus moved. That is, the CSP jig 1016 is fixed by the rail and the CSP strip 1004 and the cover 1002 are separated by the strip picker gripper 702 and the cover picker gripper 704 of FIG. 7. The separated CSP strip 1004 is loaded into the slot magazine 114 after the vision inspection and the CSP cover 1002 is loaded into the stack magazine 106 located forward.

A stack magazine elevator, which is a device for loading a separate CSP cover 1002, is shown in FIG. 6. When the CSP cover 1002 is lowered to the stack magazine elevator by the picker, when the pitch is made down by a pitch by the sensor, the new magazine is installed when the magazine is removed.

The gripper and up / down movements of the picker are driven by an air cylinder and movement is done by the server motor. In this example, a 74.00 mm picker assembly and a 62.00 mm picker assembly were used.

The jig 1016 in which the work is completed in the detached position is moved to the pusher position by the jig feeding rail (FIG. 8). Since the jig feeding rails are known in the art, detailed descriptions thereof will be omitted.

In the third process (inspection process), the aligned CSP strip 1004 is stepped by a servo motor to inspect the golden mark 1010 (Fig. 10) on the CSP strip. This golden mark 1010 is shown in FIG. 10 in a golden dot shape. In the third process, the area indicated by the camera is inspected through the vision unit as shown in FIG.

In the present embodiment, the semiconductor chip 1006 of FIG. 10 includes seven rows. For example, when the second semiconductor chip 1008 of the first column is defective, the chip is light green, for example. The semiconductor chip 1008 is marked and marked as defective on the seven golden dots on the right side of the CSP strip 1004 of FIG. The defective golden dot 1012 except for the good golden dot 1010 is blackened and displayed. This determination can be made through the vision monitor shown in FIG. 1B. In the vision section, this defective golden dot 1012 is determined as reject, and the total ratio is counted for one lot to be data. The data may be stored in the controller, and such data may be displayed to the driver through the main monitor (FIG. 1B). Although a semiconductor chip has been described herein as an example, a chip including a game chip, a mobile phone chip, a credit card chip, or the like may also be included in the present invention.

The fourth step (first unloading step) is performed in the opposite manner to the first step (loading step). That is, the CSP jig magazine 109 is moved to the second elevator 108 by the jig magazine conveyor substantially the same as the jig magazine conveyor of FIG. 2 (FIG. 2), and the sensor of the second elevator 108 is moved. When detected, it is held by the clamp and lowered by the servo motor at regular intervals. The CSP jig is loaded into the CSP jig magazine 109 and the jig magazine, which has been completed (all filled with the jig), is loaded on the top and is ready for the next process.

An outlet pusher 900 is shown in FIG. 9, which supplies a separate jig 902 to a magazine. This is done by air cylinder 904.

In the fifth process (second unloading process), the CSP strip 1004 having completed the vision inspection is loaded into the slot magazine 114. The CSP strip 1004 is loaded into the slot magazine 114 while descending at a predetermined interval by the third elevator 113. The slot magazine 114, which has been completed (filled with CSP strip 1004), is loaded on top and ready for the next process.

Referring to FIG. 2, the slot magazine 114 loaded at the bottom is moved to the third elevator 113 by the strip magazine conveyor, and the slot magazine 114 is moved to the sensor of the third elevator 113. When it is detected, it is held by the clamp and lowered by the server motor at regular intervals. The finished magazine (filled with CSP strip) is stacked below by the air cylinder and is ready for the next process.

Although the present invention has been described with reference to the above-described embodiments, those skilled in the art will appreciate that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. For example, although a golden dot is used as an indication for identifying a normal to a defect, a green or yellow mark may be used. In addition, although the CSP consists of seven rows in this embodiment, it may consist of four rows. Accordingly, the number of golden dots on the right side of the CSP strip 1004 of FIG. 10 may be four. Therefore, it should be understood that the above-described embodiments are merely examples and are not intended to be limiting.

The scope of the present invention is shown by the following claims, and it should be interpreted that all changes or modifications derived from the meaning and scope of the claims and their equivalents are included in the scope of the present invention.

1A is a plan view of a CSP strip jig separation system according to the present invention.

1B is a front view of a CSP strip jig separation system according to the present invention.

1C is a left side view of a CSP strip jig separation system in accordance with the present invention.

1D is a right side view of a CSP strip jig separation system in accordance with the present invention.

Figure 2 is a view showing a CSP strip (jig) magazine conveyor according to the present invention, Figures 2a, 2b, 2c, 2d is a plan view of the first and second floors of the CSP strip (jig) magazine conveyor, respectively, CSP A front view, a left side view, a right side view of a strip (jig) magazine conveyor, FIG. 2E shows an idler and a lower drawer, respectively, and FIG. 2F shows an elevator.

3 shows a CSP strip feeding rail according to the invention.

4 is a vision portion for inspecting a golden mark on a CSP strip according to the present invention, and FIGS. 4A, 4B and 4C are plan, front and side views, respectively.

5 shows an apparatus for supplying a CSP strip jig according to the present invention to a rail.

6 shows an apparatus for loading a separate CSP strip cover in a magazine according to the invention, and FIGS. 6A, 6B, 6C and 6D are a plan view, a front view and a side view, respectively.

7 is a view showing an apparatus for separating the CSP strip and the cover in the jig according to the present invention, Figures 7a, 7b, 7c is a plan view, front view, side view, respectively, Figure 7d is a 74mm picker assembly, FIG. 7E shows each of the 62 mm picker assemblies. FIG.

8 is a view showing a jig feeding rail for transporting a jig according to the present invention.

9 is an apparatus for supplying a jig according to the present invention to a magazine, and FIGS. 9A, 9B, and 9C are a plan view, a front view, and a side view thereof, respectively.

10 is an exploded view of a CSP strip jig according to the present invention.

Figure 11a is a view showing a CSP strip jig with the strip, jig and cover of the CSP strip jig according to the present invention.

FIG. 11B is an enlarged view of the dotted line portion “A” in FIG. 11A.

12 is a view showing a magazine loaded with one CSP strip jig according to the present invention.

-Description of the major symbols in the drawings

101: first elevator

103: first pusher

104: roller

106: CSP Cover Stack Magazine

107: belt

108: second elevator

109: CSP Jig Magazine

110: first vacuum picker

111: gripper

112: Vision Division

113: third elevator

114: (CSP Strip) Slot Magazine

116: main monitor

118: vision monitor

1002: CSP Cover

1004: CSP strip

1006: semiconductor chip (normal)

1008: semiconductor chip (bad)

1010: golden dot (normal)

1012: black coated golden dots (bad)

1014: Character

1016: CSP jig

1018: hole (hole of the CSP cover)

1020: hole (hole of the CSP)

1022: pin

1124: CSP strip jig

1200: CSP Strip Jig Magazine

Claims (17)

CSP jig separation system for automatically separating chip scale package (CSP) strip jig, A loading unit for supplying a CSP jig; A separating part separating the CSP strip and the CSP cover from the CSP jig; A vision unit for inspecting whether the chip scale package of the CSP strip separated from the separation unit is defective; A first unloading part for loading a jig separated from the separating part; And CSP jig separation system comprising a; second unloading unit for loading the separated CSP strip in the separation unit. The monitor of claim 1, further comprising: a monitor configured to monitor an operation of at least one of the loading unit, the separating unit, the vision unit, the first unloading unit, and the second unloading unit; And And a control unit for controlling the at least one operation through the monitor. The method of claim 1, wherein the loading unit, CSP jig magazine with a large number of CSP jig; A first conveyor for moving the CSP jig magazine; A first elevator for vertically moving the CSP jig magazine moved by the first conveyor to a pusher position at a predetermined interval; And And a loading pusher for supplying CSP jigs in the CSP jig magazine moved by the first elevator to the rails one by one. The method of claim 1, wherein the separation unit, A sensor for detecting the CSP jig; A roller for moving the jig near the CSP separation position when the CSP jig is detected by the sensor; An inlet pusher for moving the CSP jig moved by the roller to a CSP separation position; And And a picker for separating the CSP strip and the CSP cover from the CSP jig. The method of claim 4, wherein the separation unit, A stack magazine for loading a CSP cover separated by the picker; A second conveyor for moving the CSP strip moved by the picker to a gripper index position; A belt for moving the separated jig to a pusher position; And The pusher for supplying the jig moved to the pusher position to the CSP jig magazine; CSP jig separation system further comprises. The system of claim 4, wherein the picker moves the CSP strip moved by the conveyor to the vision position at regular intervals. 5. The CSP jig separation system according to claim 4, wherein the picker comprises a gripper for a strip picker and a gripper for a cover picker. 5. The CSP jig separation system according to claim 4, wherein the picker is an air cylinder. 6. The CSP jig separation system according to claim 5, wherein the second conveyor is composed of a servo motor. According to claim 1, The first unloading unit A second elevator for loading in the CSP jig magazine while lowering the separated jig at a predetermined interval; And a slot magazine for loading the CSP strip separated by the picker. The apparatus of claim 1, wherein the second unloading unit comprises: a third elevator loading the separated CSP strips into the CSP strip magazine while lowering the separated CSP strips at a predetermined interval; And a CSP jig magazine loaded with the separated jig. 2. The CSP jig separation system according to claim 1, wherein the vision unit inspects whether the CSP strip is defective by inspecting a mark on the CSP strip. The system of claim 1, wherein the vision unit inspects a mark on the CSP strip while stepping the CSP strip by a servo motor. 14. The CSP jig separation system according to claim 12 or 13, wherein the mark is a golden mark. 15. The CSP jig separation system according to claim 14, wherein the golden mark is a golden dot. 15. The CSP jig separation system according to claim 14, wherein the golden mark on the CSP strip is inspected and judged to be defective when blackened. 17. The CSP jig separation system according to claim 16, wherein after the determination, the total ratio is counted and dataed for one lot.
KR1020080045097A 2008-05-15 2008-05-15 Chip scale package jig separate system KR100872054B1 (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102324610A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 Aluminum nitride ceramic substrate 10W patch load film
CN102324605A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 Aluminum nitride ceramic substrate 20W loading plate with impedance of 50 omega
CN102324607A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 Aluminum nitride ceramic substrate 100W patch load film
CN102324609A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 High-power aluminum nitride ceramic substrate 150W loading plate with narrow side grounded
KR20150087938A (en) * 2014-01-23 2015-07-31 아메스산업(주) Separation and transfer apparatus of soldered assembly substrate
KR101690152B1 (en) 2016-06-29 2016-12-27 에스에스오트론 주식회사 Automatic Change Apparatus for Semiconductor fixed cover
KR102582062B1 (en) * 2022-08-05 2023-09-22 제너셈(주) Substrate unloading apparatus for flip chip bonding
KR102655076B1 (en) * 2023-05-17 2024-04-08 아메스산업(주) Board assembly method for manufacturing semiconductor

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990059041A (en) * 1997-12-30 1999-07-26 김규현 Marking device for manufacturing semiconductor package
KR20010055922A (en) * 1999-12-13 2001-07-04 마이클 디. 오브라이언 Method for marking reject of semiconductor
KR100632259B1 (en) 2005-01-28 2006-10-12 (주)포틱스테크놀로지 Automatic inspection apparatus of substrate for semiconductor package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19990059041A (en) * 1997-12-30 1999-07-26 김규현 Marking device for manufacturing semiconductor package
KR20010055922A (en) * 1999-12-13 2001-07-04 마이클 디. 오브라이언 Method for marking reject of semiconductor
KR100632259B1 (en) 2005-01-28 2006-10-12 (주)포틱스테크놀로지 Automatic inspection apparatus of substrate for semiconductor package

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102324610A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 Aluminum nitride ceramic substrate 10W patch load film
CN102324605A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 Aluminum nitride ceramic substrate 20W loading plate with impedance of 50 omega
CN102324607A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 Aluminum nitride ceramic substrate 100W patch load film
CN102324609A (en) * 2011-09-01 2012-01-18 苏州市新诚氏电子有限公司 High-power aluminum nitride ceramic substrate 150W loading plate with narrow side grounded
KR20150087938A (en) * 2014-01-23 2015-07-31 아메스산업(주) Separation and transfer apparatus of soldered assembly substrate
KR101577027B1 (en) * 2014-01-23 2015-12-21 아메스산업(주) Separation and transfer apparatus of soldered assembly substrate
KR101690152B1 (en) 2016-06-29 2016-12-27 에스에스오트론 주식회사 Automatic Change Apparatus for Semiconductor fixed cover
KR102582062B1 (en) * 2022-08-05 2023-09-22 제너셈(주) Substrate unloading apparatus for flip chip bonding
KR102655076B1 (en) * 2023-05-17 2024-04-08 아메스산업(주) Board assembly method for manufacturing semiconductor
KR102657648B1 (en) * 2023-05-17 2024-04-23 아메스산업(주) Board assembly system for manufacturing semiconductor

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