KR102582062B1 - Substrate unloading apparatus for flip chip bonding - Google Patents

Abstract

A substrate unloading device for flip chip bonding is disclosed, and the substrate unloading device for flip chip bonding according to an embodiment of the present application includes a first rail that moves an assembly including a lower jig, a substrate, and an upper jig forward. unit, a vacuum unit forming a downward suction pressure with respect to the assembly, a first picker unit separating and transporting the upper jig from the assembly while the assembly is supported by the vacuum unit, and the upper jig It may include a second picker unit that separates and transfers the substrate from the assembly in a separated state.

Description

Substrate unloading device for flip chip bonding {SUBSTRATE UNLOADING APPARATUS FOR FLIP CHIP BONDING}

This application relates to a substrate unloading device for flip chip bonding.

Flip Chip Bonding is a technology that flips a chip and attaches it to a board or other chip. Like wire bonding, it is an interconnection technology that electrically connects the chip and the board. The arrangement of metal pads on a chip used in wire bonding is one-dimensional, whereas flip chip bonding has the advantage that the arrangement of metal pads is two-dimensional, so the number of metal pads that can be connected to the substrate increases by the square power.

The flip chip bonding process generally consists of a process for forming under bump metallization (UBM) on the wafer, a bump formation process, a bonding process, and an underfill and curing process. Bonding process technology is divided into reflow process and thermocompression process based on bump pitch. The reflow process consists of flux application, device alignment and seating process on the substrate, reflow in a reflow oven, and flux residue cleaning process. The heat compression process is performed after applying NCP (Non Conductive Paste) to the substrate. After aligning and seating the device on the substrate, bonding is completed by applying heat and pressure.

Meanwhile, the substrate input for flip chip bonding may include all forms on which the flip chip is mounted and bonded, such as the flip chip itself placed on a material transfer tray, an assembled semiconductor package, and an electrical device substrate. Flip chip bonding The bonding equipment that performs this operates in conjunction with a wafer loading device that picks up, flips, and transfers a wafer containing a split cut flip chip, and a substrate loading device that inserts a substrate connected to the flip chip.

The technology behind this application is disclosed in Korean Patent Publication No. 10-1048427.

The present application is intended to solve the problems of the prior art described above, and provides a substrate unloading device for flip chip bonding that can separate the lower jig and upper jig before performing the bonding process on the structure on which the flip chip bonding process has been performed. The purpose is to provide

However, the technical challenges sought to be achieved by the embodiments of the present application are not limited to the technical challenges described above, and other technical challenges may exist.

As a technical means for achieving the above technical problem, the substrate unloading device for flip chip bonding according to an embodiment of the present application includes a first rail unit that moves the assembly including the lower jig, the substrate, and the upper jig forward. , a vacuum unit that forms a suction pressure in the downward direction with respect to the assembly, a first picker unit that separates and transports the upper jig from the assembly while the assembly is supported by the vacuum unit, and the upper jig is separated. It may include a second picker unit that separates and transfers the substrate from the assembly in its assembled state.

Additionally, a plurality of chips may be attached to the substrate.

In addition, the substrate unloading device for flip chip bonding according to an embodiment of the present application acquires a substrate image of the substrate separated from the assembly, and based on the substrate image, the front-back direction and direction of the plurality of chips It may include a vision unit that checks at least one of the left and right alignment state and the twist state.

Additionally, the substrate unloading device for flip chip bonding according to an embodiment of the present application may include a sensor unit that acquires information about the stacking height of the plurality of chips.

Additionally, the sensor unit may include a laser sensor.

Additionally, the sensor unit and the vision unit may be arranged relative to the second picker unit.

Additionally, the substrate unloading device for flip chip bonding according to an embodiment of the present application may include a cooling unit for lowering the temperature of the assembly supplied to the first rail unit.

Additionally, the cooling unit may be provided to spray compressed air from a lower side of the assembly toward the assembly.

Additionally, the lower jig may be accommodated in the first magazine by moving along the first rail unit after the upper jig and the substrate are separated.

Additionally, the substrate unloading device for flip chip bonding according to an embodiment of the present application may include a second rail unit that moves the substrate forward, which is transported by the second picker unit and placed on the upper side.

Additionally, the second picker unit may be arranged to reciprocate between the first rail unit and the second rail unit.

In addition, the substrate unloading device for flip chip bonding according to an embodiment of the present application may include a third rail unit that moves the upper jig forward, which is transported by the first picker unit and placed on the upper side. .

Additionally, the first picker unit may be arranged to reciprocate between the first rail unit and the third rail unit.

Additionally, the vision unit may obtain identification information of the substrate based on the substrate image.

The above-described means of solving the problem are merely illustrative and should not be construed as intended to limit the present application. In addition to the exemplary embodiments described above, additional embodiments may be present in the drawings and detailed description of the invention.

According to the means for solving the problem of the present application described above, a substrate unloading device for flip chip bonding that can separate the lower jig and the upper jig before performing the bonding process with respect to the structure on which the flip chip bonding process has been performed can be provided. .

However, the effects that can be obtained herein are not limited to the effects described above, and other effects may exist.

1 is a schematic configuration diagram of a flip chip bonding system according to an embodiment of the present application.
Figure 2 is a plan view showing a schematic configuration of a substrate loading device for flip chip bonding according to an embodiment of the present application.
FIG. 3 is a diagram showing a first rail unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.
FIG. 4 is a diagram showing a second rail unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.
Figure 5 is a diagram showing a third rail unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.
FIG. 6 is a diagram illustrating a first picker unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.
FIG. 7 is a diagram showing a second picker unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.
Figure 8 is a plan view showing a schematic configuration of a substrate unloading device for flip chip bonding according to an embodiment of the present application.
Figure 9 is a diagram showing a cooling unit of a substrate unloading device for flip chip bonding according to an embodiment of the present application.
FIG. 10 is a diagram showing a first picker unit of a substrate unloading device for flip chip bonding according to an embodiment of the present application.
FIG. 11 is a diagram illustrating a second picker unit of a substrate unloading device for flip chip bonding according to an embodiment of the present application.
Figure 12 is a diagram showing a magazine provided to accommodate the upper jig, the substrate, and the lower jig of the substrate unloading device for flip chip bonding according to an embodiment of the present application.
Figure 13 is a diagram showing the schematic configuration of a wafer loading device for flip chip bonding according to an embodiment of the present application.
FIG. 14 is a diagram showing a schematic configuration of a transfer unit of a wafer loading device for flip chip bonding according to an embodiment of the present application.

Below, with reference to the attached drawings, embodiments of the present application will be described in detail so that those skilled in the art can easily implement them. However, the present application may be implemented in various different forms and is not limited to the embodiments described herein. In order to clearly explain the present application in the drawings, parts that are not related to the description are omitted, and similar reference numerals are assigned to similar parts throughout the specification.

Throughout this specification, when a part is said to be “connected” to another part, this means not only “directly connected” but also “electrically connected” or “indirectly connected” with another element in between. "Includes cases where it is.

Throughout this specification, when a member is said to be located “on”, “above”, “at the top”, “below”, “at the bottom”, or “at the bottom” of another member, this means that a member is located on another member. This includes not only cases where they are in contact, but also cases where another member exists between two members.

Throughout the specification of the present application, when a part "includes" a certain component, this means that it may further include other components rather than excluding other components unless specifically stated to the contrary.

For reference, in the description of the embodiments of the present application, terms related to direction or position (front, rear, front-to-back direction, left-right direction, etc.) are explained based on the arrangement of each component shown in the drawings. For example, when viewed in Figure 2, the front-back direction may be from 12 o'clock to 6 o'clock, the left-right direction may be from 3 o'clock to 9 o'clock, and the up-and-down direction may be the normal direction of the drawing.

However, this direction setting may vary depending on the arrangement of the original device. For example, if necessary, the present device may be arranged so that the upward direction based on FIG. 2 is directed in the horizontal direction (left and right direction), and as another example, the present device may be arranged so that the upward direction based on FIG. 2 is directed in an oblique direction. .

This application relates to a substrate unloading device for flip chip bonding.

1 is a schematic configuration diagram of a flip chip bonding system according to an embodiment of the present application.

Referring to FIG. 1, the flip chip bonding system 10 according to an embodiment of the present application includes a substrate loading device 100 for flip chip bonding (hereinafter referred to as “substrate loading device 100”) according to an embodiment of the present application. ), a substrate unloading device 200 for flip chip bonding according to an embodiment of the present application (hereinafter referred to as 'substrate unloading device 200'), a flip chip according to an embodiment of the present application It may include a wafer loading device 300 for bonding (hereinafter referred to as 'wafer loading device 300'), bonding equipment 400, and EFEM (Equipment Front End Module, 600).

The substrate loading device 100, the substrate unloading device 200, the wafer loading device 300, the bonding equipment 400, and the EFEM 600 may communicate with each other through a network (not shown). A network (not shown) refers to a connection structure that allows information exchange between nodes such as terminals and servers. Examples of such networks (not shown) include the 3rd Generation Partnership Project (3GPP) network and LTE. (Long Term Evolution) network, 5G network, WIMAX (World Interoperability for Microwave Access) network, Internet, LAN (Local Area Network), Wireless LAN (Wireless Local Area Network), WAN (Wide Area Network), PAN ( Personal Area Network), wifi network, Bluetooth network, satellite broadcasting network, analog broadcasting network, DMB (Digital Multimedia Broadcasting) network, etc. are included, but are not limited thereto.

In the description of the embodiment of the present application, the bonding equipment 400 includes a substrate member input from the substrate loading device 100 and a split cut chip member (e.g., flip) included in the wafer input from the wafer loading device 300. It may refer to main processing equipment that performs interconnection to electrically connect a chip member and a substrate member using a chip, etc. For example, the bonding equipment 400 may be equipment that performs a reflow process using a substrate member and a chip member included in a wafer, but is not limited thereto.

Meanwhile, in the case of the flip chip bonding system 10 disclosed herein, the substrate member used in the flip chip bonding process is placed on the lower and upper sides of the substrate 2, respectively, using the substrate loading device 100. and the upper jig 3 may be inputted into the bonding equipment 400 in the form of a combined assembly structure, and the chip included in the wafer 4 loaded by the wafer loading device 300 into the substrate member inputted in the form of an assembled structure. After performing the main process of connecting (connecting) the members using the bonding equipment 400, the lower jig 1 and the upper jig 3 are placed on the substrate to which the chip members are bonded using the substrate unloading device 200. It can be operated to separate from (2).

Hereinafter, specific functions and operations of the substrate loading device 100 will be described with reference to FIGS. 2 to 7 .

Figure 2 is a plan view showing a schematic configuration of a substrate loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 2, the substrate loading device 100 includes a first rail unit 111, a second rail unit 112, a third rail unit 113, a first picker unit 121, and a second picker unit ( 122) and a cleaning unit 140. In addition, referring to FIG. 2, the substrate loading device 100 includes a first magazine 161 and a second rail unit 112 that accommodate a plurality of lower jigs 1 that are input into the first rail unit 111. It may include a second magazine 162 accommodating a plurality of substrates 2 being input and a third magazine 163 accommodating a plurality of upper jigs 3 being input into the third rail unit 113.

FIG. 3 is a diagram showing a first rail unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 3, the first rail unit 111 can move the lower jig 1 mounted on the upper side forward. For example, the first rail unit 111 is inserted from the first magazine 161 located at the rear of the first rail unit 111 and uses the lower jig 1 seated on the upper surface of the first rail unit 111. It may be in the form of a conveyor belt that transports it to a predetermined location in the front. In this regard, in the description of the embodiment of the present application, the predetermined position reached by inserting the lower jig 1 along the first rail unit 111 is determined by the first picker unit 121 as described later. 2) is transferred and the substrate 2 is placed on the upper part of the lower jig 1, and the upper jig 3 is transferred by the second picker unit 122 to place the upper jig 3 on the upper part of the substrate 2. ) may refer to a location including at least a portion of the first rail unit 111 where the process of seating the rail unit 111 is performed.

Meanwhile, in the description of the substrate loading device 100 according to an embodiment of the present application, the front includes the lower jig (1), the substrate (2), the upper jig (3), the lower jig (1), the substrate (2), and the upper jig. At least one of the assemblies of (3) may refer to the direction in which it moves along the rail units 111, 112, and 113. For example, in FIG. 2, the front may be at 12 o'clock, and the rear may be at 6 o'clock.

Additionally, referring to FIG. 3, the first rail unit 111 has a lower jig 3 mounted on the upper side of the first rail unit 111 that moves in the front-back direction in response to the front-back movement of the first rail unit 111. In addition to moving, a mobile robot 1111 may be disposed to further move the lower jig 3 in the front-back direction as needed. For example, the substrate loading device 100 disclosed herein is a position (the above-mentioned predetermined position) for performing at least one of the process of assembling the substrate 2 and/or the process of assembling the upper jig 3. In order to move the lower jig (1), the lower jig (1) is inserted from the first magazine (161) and moves along the first rail unit (111) while being seated on the first rail unit (111). It can be moved quickly using the mobile robot 1111.

In addition, according to an embodiment of the present application, the substrate loading device 100 includes a first vacuum unit (not shown) that forms a suction pressure in the downward direction with respect to the lower jig 1 introduced along the first rail unit 111. Poetry) may be included. More specifically, the first vacuum unit (not shown) moves forward and backward along the first rail unit 111, and the lower jig 1 mounted on the upper side of the first rail unit 111 is stably supported. It may be disposed below the seating position of the lower jig (1) to provide downward suction pressure to the lower jig (1) to move it. In addition, according to an embodiment of the present application, the first vacuum unit (not shown) performs the process of placing the substrate 2 and the upper jig 3 on the upper side of the lower jig 1. ), a force is provided to pull the lower jig (1) downward to prevent upward lifting in the outer area of ), so that the lower jig (1) is flat when combined with the substrate (2) and the upper jig (3). By maintaining , the lower jig 1, the substrate 2, and the upper jig 3 can be coupled to each other in a close contact state.

FIG. 4 is a diagram showing a second rail unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 4, the second rail unit 112 can move the substrate 2 mounted on the upper side forward. For example, the second rail unit 112 is input from the second magazine 162 located at the rear of the second rail unit 112 and moves the substrate 2 seated on the upper surface of the second rail unit 112 to the front. It may be in the form of a conveyor belt that transports to. Meanwhile, in the description of the embodiment of the present application, the substrate 2 may be, for example, a printed circuit board.

In addition, according to an embodiment of the present application, the substrate loading device 100 includes a second vacuum unit (not shown) that forms suction pressure in the downward direction with respect to the substrate 2 introduced along the second rail unit 112. ) may include. More specifically, the second vacuum unit (not shown) moves in the front-back direction along the second rail unit 112, and the substrate 2 seated on the upper side of the second rail unit 112 moves while being stably supported. It may be disposed below the seating position of the substrate 2 to provide suction pressure to the substrate 2 in a downward direction. In addition, according to an embodiment of the present application, when performing the process of placing the upper jig 3 on the upper side of the substrate 2, the second vacuum unit (not shown) moves upward to the outer area of the substrate 2. To prevent lifting of the substrate, a force is provided to pull the substrate (2) downward so that the substrate (2) remains flat when combined with the upper jig (3), thereby maintaining the lower jig (1) and substrate (2). and the upper jig 3 can be coupled to each other in a close contact state.

Meanwhile, according to an embodiment of the present application, the substrate loading device 100 loads each rail unit ( A pusher unit (not shown) may be provided at the rear end of 111, 112, and 113) to insert the lower jig 1, the substrate 2, and the upper jig 3, respectively.

In addition, according to an embodiment of the present application, the substrate loading device 100 acquires a substrate image by photographing the lower surface of the substrate 2, and loads the substrate along the second rail unit 112 based on the substrate image ( 2) may include a lower vision unit (not shown) that checks the alignment status in the front-back and left-right directions. In addition, according to an embodiment of the present application, the lower vision unit (not shown) may be arranged in a structure coupled to the second rail unit 112 to move in the front and rear direction along the second rail unit 112, The lower vision unit (not shown) is a camera located below the substrate 2 moving along the second rail unit 112, and having a shooting direction facing the lower surface of the substrate 2 located relatively above. Modules can be provided. For reference, in the lower vision unit (not shown), the substrate 2 input along the second rail unit 112 is twisted and oriented along the X-axis (left and right directions) before being transferred by the first picker unit 121. -This may be to check whether a preset input form based on the Y-axis (front-back direction) is satisfied.

Figure 5 is a diagram showing a third rail unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 5, the third rail unit 113 can move the upper jig 3 seated on the upper side forward. For example, the third rail unit 113 is inserted from the third magazine 163 located at the rear of the third rail unit 113 and uses the upper jig 3 seated on the upper surface of the third rail unit 113. It may be in the form of a conveyor belt that transports forward. Meanwhile, in the description of the embodiment of the present application, the upper jig 3 may be disposed in an area excluding the bonding area of the chip member bonded to the substrate 2 by the bonding equipment 400. For example, the upper jig 3 may be a net-shaped or net-shaped member that covers the outside of the joining area of the chip member, but is not limited thereto.

FIG. 6 is a diagram illustrating a first picker unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 6, the first picker unit 121 reciprocates between the first rail unit 111 and the second rail unit 112 and places the substrate 2 on the upper part of the lower jig 1. (2) can be transferred. In addition, referring to FIG. 6, the first picker unit 121 is provided with a vacuum forming module 1210 that generates suction pressure in the upward direction with respect to the substrate 2, thereby transporting the substrate 2 in a supported state. It may correspond to a vacuum picker type, but is not limited to this.

In addition, referring to FIG. 6, the first picker unit 121 is a reference image taken of at least one of the lower jig 1, the substrate 2, and the upper jig 3 from the upper side of the first rail unit 111. Acquire, and based on the acquired reference image, the alignment state of the lower jig (1) in the front-back and left-right directions, the seated state of the substrate (2) on the lower jig (1), and the substrate of the upper jig (3) It may include an upper vision unit 132 that confirms at least one of the seating conditions for (2).

In this regard, the upper vision unit 132 is located at a predetermined location on the first rail unit 111 where a process of mutually coupling (assembling) at least one of the lower jig 1, the substrate 2, and the upper jig 3 is performed. Align the front-to-back and left-right directions of the lower jig (1) using the reference image of the upper surface of the lower jig (1), substrate (2), or upper jig (3), which is moved to the position of and photographed in the downward direction. It may be operated to check at least one of the state, the state in which the substrate 2 is seated on the lower jig 1, and the state in which the upper jig 3 is seated on the substrate 2.

In addition, according to an embodiment of the present application, the upper vision unit 132 is operated in a state in which the lower jig 1 is disposed at a predetermined position on the first rail unit 111 (in other words, the substrate 2 and the upper jig ( For the lower jig (1) in the state (before 3) is combined, the number of identified hole areas, the number of holes, from the reference image taken of the upper surface of the lower jig (1) including the hole area formed in the lower jig (1) It can be operated to determine the alignment state of the lower jig 1 by determining the identification position of the area, etc.

In addition, according to an embodiment of the present application, the upper vision unit 132 is operated in a state in which the substrate 2 is transported and seated at a predetermined position on the first rail unit 111 (in other words, the upper jig 3 is coupled to the substrate 2). Formed on the substrate 2 from a reference image taken of the upper surface of the substrate 2 to show the bonding state of the hole area formed in the substrate 2 and the lower jig 1 with respect to the substrate 2 in the state before being formed. It can be operated to determine the seated state of the substrate 2 on the lower jig 1 by determining whether the pin member is correctly inserted into the hole area of the lower jig 1.

In addition, according to an embodiment of the present application, the upper vision unit 132 is in a state in which the upper jig 3 is transported and seated at a predetermined position on the first rail unit 111 (in other words, up to the upper jig 3). It can be operated to determine the seating state of the upper jig 3 on the substrate 2 through analysis of a reference image taken of the upper surface of the upper jig 3 in a combined (assembled) state.

Meanwhile, according to an embodiment of the present application, the upper vision unit 132 provides identification information of the substrate 2 (for example, a device inserted into the upper surface of the substrate 2) based on a reference image of the substrate 2. 2-dimensional identification code, etc.) can be obtained. In addition, the flip chip bonding system 10 disclosed herein performs substrate loading by matching the identification information of the substrate 2 identified by the upper vision unit 132 and the above-described judgment information of the upper vision unit 132. Alignment state of the lower jig (1), the substrate (2), or the upper jig (3) among the assembly of a plurality of lower jigs (1), substrates (2), and upper jigs (3) combined using the device 100. , the seating state of the substrate 2 or the upper jig 3 may be operated to identify assemblies that do not meet preset standards for good quality products, and to secure information about the identified assemblies.

In addition, according to an embodiment of the present application, the upper vision unit 132 reads the two-dimensional identification information (2D Code) inserted for each of the lower jig 1, the substrate 2, and the upper jig 3. By transmitting it to an external server, etc., information on the object on which work is being performed by the substrate loading device 100 can be confirmed.

FIG. 7 is a diagram showing a second picker unit of a substrate loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 7, the second picker unit 122 reciprocates between the first rail unit 111 and the third rail unit 113 and is placed on the upper part of the substrate 2 mounted on the upper side of the lower jig 1. The upper jig (3) can be transferred to seat the upper jig (3). In addition, referring to FIG. 7, the second picker unit 122 supports the upper jig 3 by providing a vacuum forming module (not shown) that forms suction pressure in the upward direction with respect to the upper jig 3. It may correspond to a vacuum picker type that transfers in a state, but is not limited to this, and as another example, depending on the implementation of the present application, it may correspond to a gripper picker type that grips and transfers the outer area of the upper jig (3). there is.

Additionally, the cleaning unit 140 may supply air to remove foreign substances remaining in the assembly of the lower jig 1, the substrate 2, and the upper jig 3. In addition, according to an embodiment of the present application, the cleaning unit 140 is installed at a predetermined location on the first rail unit 111 where the assembly (combining) process of the lower jig 1, the substrate 2, and the upper jig 3 is performed. It can be placed in front of the position so that the assembly that has completed the assembly (combination) process can pass through. For example, the cleaning unit 140 may be disposed above the first rail unit 111 with respect to the front end of the first rail unit 111. In addition, in relation to this, the assembly of the lower jig 1, the substrate 2, and the upper jig 3 may move along the first rail unit 111 and be input into the bonding equipment 400. Before being introduced into 400, it passes through the lower side of the cleaning unit 140 and any remaining foreign matter on the upper surface is removed, allowing the bonding equipment 400 to bond the chip member or die in a clean state.

Hereinafter, specific functions and operations of the substrate unloading device 200 will be described with reference to FIGS. 8 to 12.

Figure 8 is a plan view showing a schematic configuration of a substrate unloading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 8, the substrate unloading device 200 includes a first rail unit 211, a second rail unit 212, a third rail unit 213, a vacuum unit 220, and a first picker unit 231. ), a second picker unit 232, and a cooling unit 260. In addition, referring to FIG. 8, the substrate unloading device 100 includes a first magazine 251 that accommodates the lower jig 1 input from the first rail unit 211, and a first magazine 251 that accommodates the lower jig 1 input from the first rail unit 211. It may include a second magazine 252 accommodating the substrate 2 and a third magazine 253 accommodating the upper jig 3 introduced into the third rail unit 213.

The first rail unit 211 can move the assembly including the lower jig 1, the substrate 2, and the upper jig 3 forward. Meanwhile, in the description of the substrate unloading device 200 according to an embodiment of the present application, the front includes the lower jig (1), the substrate (2), the upper jig (3), the lower jig (1), the substrate (2), and the upper jig (3). It may refer to the direction in which at least one of the assemblies of the jig 3 moves along the rail units 211, 212, and 213. For example, in FIG. 8, the front may be at 6 o'clock, and the rear may be at 12 o'clock.

Meanwhile, the assembly including the lower jig 1, the substrate 2, and the upper jig 3 transported through the first rail unit 211 is formed by forming a plurality of chips on the substrate 2 by the bonding equipment 400. This may be an assembly in an attached state. In other words, the first rail unit 211 is a rail unit that receives and transfers the assembly obtained as the flip chip bonding process of electrically interconnecting the chip and the substrate is performed in the bonding equipment 400. It can be.

Figure 9 is a diagram showing a cooling unit of a substrate unloading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 9 , the cooling unit 260 may be disposed at a position corresponding to the rear end of the first rail unit 211 to lower the temperature of the assembly supplied to the first rail unit 211. In this regard, after the reflow process, etc. is performed by the bonding equipment 400, the assembly is input into the substrate unloading device 200 at a temperature as high as 80 to 100 degrees. The substrate unloading device 200 is provided with a cooling unit 260 through which the assembly passes prior to transporting the assembly using the first rail unit 211, thereby lowering at least part of the temperature of the assembly and then performing a subsequent process (the upper part described later). A separation process of the jig 3, the substrate 2, and the lower jig 1) can be performed.

Additionally, referring to FIG. 9, the cooling unit 260 transports the assembly through the roller unit 261 and sprays compressed air toward the assembly from the lower side of the assembly transported through the roller unit 261 to lower the temperature of the assembly. It can be provided to lower .

The vacuum unit 220 may generate suction pressure in a downward direction with respect to the assembly introduced along the first rail unit 211. For example, the vacuum unit 220 moves in the front-back direction along the first rail unit 211, and the assembly mounted on the upper side of the first rail unit 211 is stably supported by the upper jig 3 at the top. It may be arranged to fix the assembly downward so that the separation operation for and the separation operation for the substrate 2 are performed continuously. Additionally, the vacuum unit 220 may be coupled to the first rail unit 211 and disposed below the seating position of the assembly to provide suction pressure in a downward direction to the assembly.

FIG. 10 is a diagram showing a first picker unit of a substrate unloading device for flip chip bonding according to an embodiment of the present application.

Referring to FIGS. 8 and 10, the first picker unit 231 separates the upper jig 3 from the assembly while the assembly is supported on the upper side of the first rail unit 211 by the vacuum unit 220. It can be transported. In this regard, the third rail unit 213 may be separated from the assembly by the first picker unit 231 and then transported to move the upper jig 3 seated on the upper side forward. That is, the first picker unit 231 may be arranged to move back and forth between the first rail unit 211 and the third rail unit 213.

FIG. 11 is a diagram illustrating a second picker unit of a substrate unloading device for flip chip bonding according to an embodiment of the present application.

Referring to Figures 8 and 11, the second picker unit 232 can separate and transfer the substrate 2 from the assembly in which the upper jig 3 is separated by the first picker unit 231. In this regard, the second rail unit 212 may be separated from the assembly by the second picker unit 232 and then transported to move the substrate 2 placed on the upper side forward. That is, the second picker unit 232 may be arranged to move back and forth between the first rail unit 211 and the second rail unit 212.

Meanwhile, in the description of the substrate unloading device 200 disclosed herein, the first rail unit 211 to the third rail unit 213 are the first rail unit 111 provided in the substrate loading device 100 described above. ) to the third rail unit 113, but in the case where the input direction of the object seated on the upper side is the substrate loading device 100, from the magazines 161, 162, 163 to the lower jig 1 and the substrate 2 ) and the direction toward a predetermined position where the assembly including the upper jig 3 is coupled, and in the case of the substrate unloading device 200, the lower jig separated from the insertion position of the assembly from the bonding equipment 400 ( 1), the directions can be distinguished as being directed toward the magazines 251, 252, and 253 that accommodate the substrate 2 and the upper jig 3, respectively.

In addition, according to an embodiment of the present application, in the case of the substrate loading device 100, the transfer robot 1111 is disposed with respect to the first rail unit 111 for transferring the lower jig 1, while unloading the substrate The transfer robot (not shown) of the device 200 may be disposed with respect to the second rail unit 212 for transferring the substrate 2 separated from the assembly. In other words, the substrate 2 mounted on the upper side of the second rail unit 212 is moved to the second rail unit 212 of the substrate unloading device 200 in response to the forward and backward movement of the second rail unit 212. In addition to moving in the front-to-back direction, a mobile robot (not shown) may be disposed to further move the substrate 2 in the front-to-back direction as needed.

In addition, according to an embodiment of the present application, the second picker unit 232 acquires a substrate image of the substrate 2 separated from the assembly, and attaches (combines) the substrate 2 based on the acquired substrate image. ) may be provided with a vision unit (not shown) that checks at least one of the alignment state and twist state of the plurality of chips in the front-back and left-right directions.

In addition, according to an embodiment of the present application, the second picker unit 232 may be provided with a sensor unit (not shown) that obtains information about the stacking height of a plurality of chips attached to (combined with) the substrate 2. there is. More specifically, the sensor unit (not shown) may be a laser sensor type. For example, a sensor unit (not shown) measures the height information of a chip attached (coupled) to the substrate 2, and places the chip on the top of the substrate 2 based on the measured height information and the standard information for each chip. It is determined whether the number of layers (stages) has been bonded, and if it is determined that fewer layers (stages) of chips have been bonded compared to the preset number of layers (stages), the bonding equipment 400 may attach some of the chips. You can detect what is missing.

Meanwhile, the vision unit (not shown) of the second picker unit 232 provides identification information (for example, information inserted on the upper surface of the substrate 2) of the substrate 2 based on the reference image taken of the substrate 2. 2-dimensional identification code, etc.) can be obtained. In addition, the flip chip bonding system 10 disclosed herein matches the identification information of the substrate 2 identified by the vision unit (not shown) and the judgment information of the vision unit (not shown) described above. Using the loading device 200, identify substrates 2 whose alignment state, chip attachment state, etc. do not meet preset standards for good quality, and secure information about the identified substrate 2 It can operate to do so.

Figure 12 is a diagram showing a magazine provided to accommodate the upper jig, the substrate, and the lower jig of the substrate unloading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 12, the substrate unloading device 200 includes a first magazine 251 to a third magazine 253 that each accommodate the lower jig 1, the substrate 2, and the upper jig 3 separated from the assembly. ) can be provided. Specifically, after the upper jig 3 and the substrate 2 are separated, the lower jig 1 moves along the first rail unit 211 and is accommodated in the first magazine 251, and the substrate 2 is After being separated from the assembly by the 2 picker unit 232 and transferred to the second rail unit 212, it moves along the second rail unit 212 and is accommodated in the second magazine 252, and the upper jig (3) may be separated from the assembly by the first picker unit 231, transferred to the third rail unit 213, and then moved along the third rail unit 213 and accommodated in the third magazine 253.

In addition, referring to FIG. 12, the substrate unloading device 200 includes a pair of first magazines 251, a pair of second magazines 252, and a pair of third magazines 253, respectively, as rail units ( 211, 212, 213) can be placed (loaded). In this regard, one magazine of the pair of magazines is used to perform the task of accommodating the lower jig (1), the substrate (2), the upper jig (3), etc., and the other magazine of the pair of magazines may be intended to serve as a buffer. In addition, the substrate unloading device 200 can use Overhead Transfer (OHT) to supply a magazine from the upper area of the substrate unloading device 200, and similarly, the magazine can be used to unload substrates using Overhead Transfer (OHT). It can be lifted to the upper area of the loading device 200.

In addition, although not shown in the drawing, the arrangement method for the pair of magazines, the vertical movement method using the OHT of the magazine, etc. are similar to the first magazine 161 and the second magazine (161) of the above-described substrate loading device 100. 162) and the third magazine 163 can be applied in the same way.

In addition, according to an embodiment of the present application, the substrate unloading device 200 moves each of the first magazine 251, the second magazine 252, and the third magazine 253 in the left-right direction (X-axis direction) and the front-back direction. It can be moved along the (Y-axis direction) and up and down directions (Z-axis direction), and the It can be adjusted using an air cylinder, etc.

Meanwhile, according to an embodiment of the present application, the substrate unloading device 200 reads (acquires) information from an identification tag (e.g., RFID Tag) attached to the magazine and interlocks with the substrate unloading device 200. Information on the substrate 2 being worked on using the substrate unloading device 200 can be confirmed by transmitting the information of the read identification tag to an external server, etc.

In addition, according to an embodiment of the present application, the first magazine 251 to the third magazine 253 of the substrate unloading device 200 includes a lower jig accommodated inside each magazine (for example, placed in a slot). (1), a sensor module (not shown) may be provided to implement a function (mapping process) to check the positions of the substrate (2), upper jig (3), etc. More specifically, the substrate unloading device 200 loads the magazine, performs a mapping process using the sensing results of a sensor module (not shown), and then unloads the lower jig (1), substrate (2), and upper jig (3). etc. can be assigned to each task.

In addition, although not shown in the drawing, the alignment adjustment method for the magazine, the mechanism for transmitting the identification tag attached to the magazine, the sensor-based mapping function, etc. are used in the first magazine 161 of the substrate loading device 100 described above. ), can be applied in the same way to the second magazine 162 and the third magazine 163.

Meanwhile, according to an embodiment of the present application, the substrate unloading device 200 moves the lower jig 1, the substrate 2, and the upper jig 3 to the front ends of the rail units 211, 212, and 213, respectively. Each magazine (251, 252, 253) may be provided with a pusher unit (not shown) that is inserted into the inside.

Hereinafter, specific functions and operations of the wafer loading device 300 will be described with reference to FIGS. 13 and 14.

Figure 13 is a diagram showing the schematic configuration of a wafer loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 13 , the wafer loading device 300 may include a wafer picker unit 310, a rotation unit 320, a transfer unit 330, and a lift unit 340.

The wafer picker unit 310 can support the wafer 4 input from the Equipment Front End Module (EFEM, 600). More specifically, the wafer picker unit 310 may be a gripper type picker that grips the ring frame area formed on the outside of the wafer 4, but is not limited to this.

The rotation unit 320 may rotate the wafer 4 input from the Equipment Front End Module (EFEM) 600 to correspond to a predetermined direction for performing flip chip bonding. Here, the predetermined direction of progress for performing flip chip bonding is the structure including the lower jig 1, the substrate 2, and the upper jig 3 introduced from the substrate loading device 100 in the bonding equipment 400. It may specifically mean the direction in which the wafer 4 is input into the preset bonding equipment 400 required to perform a flip chip bonding process using the wafer 4 input from the assembly and wafer loading device 300.

In this regard, the rotation unit 320 supports the wafer 4 so that the wafer 4 faces the direction required by the bonding equipment 400 from the input direction from the EFEM (Equipment Front End Module, 600). It may be rotating the wafer picker unit 310. For example, in the case of the flip chip bonding system 10 in which the wafer loading device 300, bonding equipment 400, and EFEM 600 are each arranged so that the above-described input direction and progress direction are perpendicular, the rotation unit 320 may operate to rotate the wafer picker unit 310 by 90 degrees.

In addition, according to an embodiment of the present application, the rotation unit 320 detects that the wafer 4 is fixed (supported) on the wafer picker unit 310 and the wafer picker unit 310 picks up the wafer 4. An operation of rotating the wafer picker unit 310 may be initiated so that the wafer picker unit 310 is directed from the input direction toward the bonding equipment 400 . In this regard, the wafer picker unit 310 may be provided with a first sensor unit (not shown) that can detect the state in which the wafer 4 is fixed (supported) by the wafer picker unit 310. For example, the first sensor unit (not shown) may be of a type such as a vision sensor, pressure sensor, photo sensor, or proximity sensor, but is not limited thereto.

The lift unit 340 may drive the wafer picker unit 310 in the vertical direction so that the wafer picker unit 310 can transfer the wafer 4 to the transfer unit 330 . More specifically, the lift unit 340 may move the wafer picker unit 310 in the vertical direction while the wafer 4 is rotated to face the direction of travel.

FIG. 14 is a diagram showing a schematic configuration of a transfer unit of a wafer loading device for flip chip bonding according to an embodiment of the present application.

Referring to FIG. 14, the transfer unit 330 may input the wafer 4 delivered from the wafer picker unit 310 into the bonding equipment 400 that performs flip chip bonding.

Specifically, referring to FIGS. 13 and 14 , the transfer unit 330 includes a gripping unit ( 331) and a transfer unit 332 that moves the grip unit 331 along the traveling direction.

Illustratively, the gripper 331 may be provided with a fork-shaped plate on which the wafer 4 transported from the upper side through the wafer picker unit 310 and the lift unit 340 is contacted and seated. It is not limited.

In addition, according to an embodiment of the present application, the transfer unit 320 inserts the wafer 4 along the direction of movement of the transfer unit 332 according to the result of detecting that the wafer 4 is seated on the gripper 311. You can initiate the desired action. In this regard, the gripper 311 may be provided with a second sensor unit (not shown) capable of detecting the state in which the wafer 4 is seated. For example, the second sensor unit (not shown) may be of a type such as a vision sensor, weight sensor, pressure sensor, photo sensor, or proximity sensor, but is not limited thereto.

In addition, referring to FIG. 14, the transfer unit 332 is disposed side by side on the upper side of the first transfer unit 3321 and the first transfer unit 3321, which moves to correspond to the first movable range along the travel direction, and moves in the travel direction. Accordingly, it may include a second transfer unit 3322 that operates to correspond to the second movable range. More specifically, the first transfer unit 3321 has a rail unit corresponding to the first movable range and a motor unit that provides driving force to move along the rail unit, and the second transfer unit 3322 has a rail unit corresponding to the second movable range. It may be provided with a motor part that provides driving force to move along the part and the rail part.

In addition, according to an embodiment of the present application, the transfer unit 332 moves the second transfer unit 3321 in a state in which the first transfer unit 3321 transfers the gripping unit 331 and the second transfer unit 3322 along the direction of travel by the first movable range. The transfer unit 3322 may transfer the grip unit 331 along the travel direction as much as the second movable range. That is, in the wafer loading device 300 disclosed herein, the spatial range in which the transfer unit 330 is disposed is relatively narrow based on the direction in which the wafer 4 is introduced toward the bonding equipment 400. Even in this case, it is designed to have a two-stage structure that allows the movable range (stroke) in the direction of movement of the transfer unit 332 to be relatively long so that the wafer 4 can be efficiently fed into the bonding equipment 400. It may be.

The description of the present application described above is for illustrative purposes, and those skilled in the art will understand that the present application can be easily modified into other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive. For example, each component described as unitary may be implemented in a distributed manner, and similarly, components described as distributed may also be implemented in a combined form.

The scope of the present application is indicated by the claims described below rather than the detailed description above, and all changes or modified forms derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present application.

10: Flip chip bonding system
100: Substrate loading device for flip chip bonding
111: First rail unit
1111: Transfer robot
112: Second rail unit
113: Third rail unit
121: First picker unit
122: Second picker unit
132: Upper vision unit
140: cleaning unit
161: 1st Magazine
162: 2nd Magazine
163: The 3rd Magazine
1: Lower jig
2: Substrate
3: Upper jig
200: Substrate unloading device for flip chip bonding
211: 1st rail unit
212: Second rail unit
213: Third rail unit
220: Vacuum unit
231: First picker unit
232: Second picker unit
251: First Magazine
252: 2nd Magazine
253: The 3rd Magazine
260: cooling unit
261: roller unit
300: Wafer loading device for flip chip bonding
310: wafer picker unit
320: rotation unit
330: transfer unit
331: gripping part
332: Transfer unit
3321: First transfer unit
3322: Second transfer unit
340: lift unit
4: wafer
400: Bonding equipment
600: Equipment Front End Module (EFEM)

Claims (11)

In the substrate unloading device for flip chip bonding,
a first rail unit that moves the assembly including the lower jig, the substrate, and the upper jig forward;
a vacuum unit that creates downward suction pressure with respect to the assembly;
a first picker unit that separates and transports the upper jig from the assembly while the assembly is supported by the vacuum unit; and
A second picker unit that separates and transports the substrate from the assembly with the upper jig separated,
Including,
A plurality of chips are attached to the substrate,
A sensor unit that acquires height information about the stacking height of the plurality of chips,
Including more,
The sensor unit is,
Based on the height information and the standard information for each of the plurality of chips, the number of layers of the chip coupled to the upper part of the substrate is determined, and if it is determined that a relatively small number of layers of chips are coupled to the substrate compared to the preset number of layers. , the bonding equipment detects that attachment to at least some of the chips is missing,
The substrate unloading device,
A vision unit that acquires a substrate image of the substrate separated from the assembly and confirms at least one of alignment and twisting states of the plurality of chips in the front-back and left-right directions based on the substrate image;
It further includes,
The sensor unit and the vision unit are disposed on the second picker unit. delete delete According to paragraph 1,
Unloading device, wherein the sensor unit includes a laser sensor. delete According to paragraph 1,
A cooling unit for lowering the temperature of the assembly supplied to the first rail unit,
An unloading device further comprising: According to clause 6,
The cooling unit is,
An unloading device provided to spray compressed air from a lower side of the assembly toward the assembly. According to paragraph 1,
The lower jig moves along the first rail unit and is accommodated in the first magazine after the upper jig and the substrate are separated. According to clause 8,
A second rail unit that is transported by the second picker unit and moves the substrate placed on the upper side forward,
It further includes,
The second picker unit,
An unloading device arranged to reciprocate the first rail unit and the second rail unit. According to clause 8,
A third rail unit that is transported by the first picker unit and moves the upper jig seated on the upper side forward,
It further includes,
The first picker unit,
An unloading device arranged to reciprocate the first rail unit and the third rail unit. According to paragraph 1,
The vision unit is,
An unloading device that obtains identification information of the substrate based on the substrate image.