JP2006222286A - Equipment and method for mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide equipment for mounting a component in which the vicinity of the working region of a substrate is supported surely on a substrate stage and the substrate is held surely with high planarity for the substrate stage. <P>SOLUTION: The substrate stage 21B of component mounting equipment comprises a rigid portion 71 for mounting the lower surface side at the supporting part of a substrate in the vicinity of the mounting region and having a hole 73A for sucking the lower surface side of the substrate, and a flexible suction pad 31B for mounting the lower surface side at other supporting part of the substrate and sucking the lower surface side of the substrate. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a component mounting apparatus for mounting components including electronic components such as IC chips and various semiconductor devices on a substrate including a glass substrate such as a liquid crystal display substrate (LCD substrate) and a plasma display substrate (PDP substrate). And a component mounting method.

  Patent Document 1 discloses an example of a conventional component mounting apparatus. Referring to FIG. 20, reference numeral 1 denotes a substrate stage for holding the substrate 2. A suction hole (not shown) is formed in the rigid substrate stage 1, and the lower surface of the substrate 1 is held on the substrate stage 2 by a suction force acting on the suction hole. Reference numeral 3 denotes a substrate transport apparatus that transports the substrate 2 and delivers the substrate 2 to and from the substrate stage 1. The substrate transfer device 3 includes a pair of support arms 4A and 4B extending in a direction orthogonal to the transfer direction of the substrate 1 indicated by an arrow A1. These support arms 4 </ b> A and 4 </ b> B are provided with suction pads 5 for holding the lower surface of the substrate 2. The substrate stage 1 moves the substrate 1 transferred from the substrate transport apparatus 3 to the working unit (not shown) at the substrate delivery position shown (see arrow A2). In the working unit, various mounting operations such as supply of an adhesive, provisional pressure bonding of components, and main pressure bonding of components are performed on the substrate 2. Further, the substrate stage 1 moves from the working unit to the substrate delivery position, and places the substrate 2 on the substrate transfer device 3 (see arrow A3).

  In recent years, a substrate on which a mounting operation is performed with this type of component mounting apparatus tends to be large. For example, sizes of 13 to 15 inches for notebook PC displays, 17 to 21 inches for monitor displays, and 15 to 50 inches for television displays are common.

  In the component mounting apparatus described in Patent Document 1, since the suction holes are opened on the flat upper surface of the rigid substrate stage 1, particularly when the substrate 1 is large as described above, the substrate 2 is warped. Therefore, even if the substrate stage 1 is in contact with the lower surface of the substrate 2, the degree of adhesion between the two is low. For this reason, leakage occurs in the suction holes, and the substrate 2 cannot be reliably held with respect to the substrate stage 1. In addition, it is difficult for processing to make the entire large substrate stage 1 corresponding to a large substrate have high flatness, and the cost required for processing is also high.

  On the other hand, Patent Document 2 discloses a configuration in which a flexible suction pad is brought into contact with the lower surface of a substrate and the substrate is held on the substrate stage by a suction force acting on the suction pad. Since the suction pad is in close contact with the substrate, the above-described leakage can be eliminated and the substrate can be reliably held with a high suction force. However, in the suction pad having flexibility, a region (mounting region) of the substrate that is the target of the mounting operation described above is displaced and flatness is likely to be lowered. This reduction in flatness of the mounting area causes a reduction in work accuracy. For example, when the mounting area is displaced during the temporary pressure bonding and the flatness is lowered, the accuracy of the component mounting position is lowered. In particular, since the above-described large substrate is heavy, a decrease in flatness due to the displacement of the mounting region is remarkable.

Japanese Patent Application Laid-Open No. 2001-228452 International Publication No. WO01 / 58233

  An object of the present invention is to securely hold a substrate with respect to a substrate stage and hold the vicinity of the work area of the substrate with high flatness with corrected warpage.

  The first aspect of the present invention is a working unit (23A, 23B, 23C, 23D) for performing a mounting operation on the mounting region (12a, 12b) of the substrate (12), and a substrate for holding the lower surface side of the substrate. A stage (21A, 21B, 21C, 21D) and a substrate stage moving unit (22A, 22B, 22C, 22D) for moving the substrate stage so that the mounting area is positioned with respect to the working unit, The substrate stage is mounted on the lower surface side of the first portion (12b, 12c) of the substrate in the vicinity of the mounting area, and suction holes (73A, 73B, 73C) for sucking the lower surface side of the substrate are formed. The rigid body portion (71) and the lower surface side of the second portion (12e) of the substrate excluding the first portion are placed, and the flexible suction for sucking the lower surface side of the substrate Pack (31B, 31C, 31D) to provide a component mounting apparatus characterized by comprising a.

  As the working unit, for example, an adhesive supply unit that supplies an adhesive to the mounting region of the substrate, a temporary crimping unit that positions the component in the mounting region to which the adhesive has already been supplied, and temporarily crimps with a relatively small crimping force, In addition, there is a main crimping part for crimping and fixing the pre-crimped parts with a relatively large crimping force.

  The substrate is a glass substrate such as a liquid crystal display substrate or a plasma display substrate. The mounting area of the board is not limited to one place. For example, one long side and one short side of the rectangular substrate may be the mounting area.

  The rigid body portion is a portion having a rigidity that does not substantially deform when the substrate is placed.

  Flexibility with respect to the suction pad means that when the substrate is placed, the substrate is deformed to some extent in the vertical direction and can be restored to its original shape by removing the placed substrate.

  The lower surface side of the first portion of the substrate in the vicinity of the mounting area is placed on the rigid body portion and is held on the substrate stage by the suction force acting from the suction holes formed in the rigid body portion. Various operations such as supply of adhesive, provisional pressure bonding of components, and main pressure bonding of components are performed on the mounting area of the substrate. By securely supporting the lower surface side of the first portion of the substrate in the vicinity of the mounting area with the rigid rigid body portion, the mounting area can be held with a high flatness in which the warp has been corrected. As a result, the position of the mounting area can be maintained with high accuracy when working in the working unit, and the working accuracy is improved. For example, when the working part is a temporary pressure bonding part, it is possible to improve the position accuracy of the device position of the component with respect to the mounting region. In addition, when the working part is a main press-bonding part, it is possible to prevent a shift in the mounting position of the component during the main press-bonding.

  On the other hand, the lower surface side of the second part of the substrate other than the first part is placed on the suction pad, and the substrate is held on the substrate stage by the suction force acting from the suction pad. Since the second part of the substrate is away from the mounting region, it is less necessary to securely support the lower surface side in consideration of various operations by the working unit as compared with the first part. Since the suction pad is in close contact with the lower surface side of the second part of the substrate, no leakage occurs, and the substrate is securely held on the substrate stage by the suction force acting from the suction pad. Further, when a strong suction force acts on the lower surface of the substrate from the suction pad, the first portion of the substrate in the vicinity of the mounting region is strongly pressed against the rigid portion of the substrate stage, and the flatness of the mounting region is increased.

  As described above, the lower surface side of the substrate is sucked and held by the suction holes formed in the rigid portion at the first portion of the substrate in the vicinity of the mounting region, and the lower surface side of the substrate is held at the second portion excluding the first portion. By holding and holding with the suction pad, it is possible to achieve both improvement in work accuracy in the working part by supporting the mounting area with high flatness and firm holding of the substrate with respect to the substrate stage.

  Specifically, the component mounting apparatus includes a first vacuum suction mechanism (73A, 34B, 37B, 36B, 35B; 73B, 34D, 37D, 36D, which applies a suction force to the suction hole so as to be releasable. 35C; 73C, 34F, 37F, 36F, 35D) and a second vacuum suction mechanism (31B, 34C, 37C, 36C, 35B; 31C, 34E, 37E) that releasably acts on the suction pad. , 36E, 35C; 31D, 34G, 37G, 36G, 35D).

  By applying a suction force to the suction holes and suction pads with a separate vacuum suction mechanism, the mounting area is more reliably supported while maintaining a high degree of flatness, and the substrate is more securely attached to the substrate stage. Can hold.

  More specifically, the component mounting apparatus includes a first substrate transfer device (24A, 24B, 24C) that carries the substrate into the substrate stage, and the substrate from the first substrate transfer device to the substrate stage. The controller (28A) applies a vacuum suction force from the first vacuum suction mechanism to the suction hole after applying a suction force from the second vacuum suction mechanism to the suction pad. , 28B).

  When the substrate is carried into the substrate stage from the first substrate transport device, first, a suction force acts on the suction pad from the second vacuum suction mechanism. Since the suction pad is in close contact with the lower surface of the substrate, the lower surface side of the second portion of the substrate is securely held by the substrate stage. Next, a suction force acts on the suction hole from the first vacuum suction mechanism. By this suction force, the first portion of the substrate including the mounting region is supported by the rigid body portion with high flatness in which the warp of the first portion is corrected.

  More specifically, the component mounting apparatus further includes a second substrate transfer device (24A, 24B, 24C) for unloading the substrate from the substrate stage, and the control unit receives the second substrate from the substrate stage. When unloading the substrate to the substrate transfer apparatus, the vacuum suction force from the first vacuum suction mechanism to the suction hole is stopped, and then the vacuum suction from the second vacuum suction mechanism to the suction pad is performed. Stop power.

  According to a second aspect of the present invention, there is provided a component mounting method for performing a mounting operation on a mounting region (12a, 12b) of a substrate (12), the first part (12c, 12d) is disposed on the rigid portion (71) of the substrate stage (21B, 21C, 21D), and the lower surface of the second portion (12e) excluding the substrate mounting area is the suction pad (31B) of the substrate stage. , 31C, 31D), the substrate is placed on the substrate stage, and a vacuum suction force is applied to the suction pad to attract the second part of the substrate to the substrate stage. And holding a second part of the substrate by adsorbing the rigid part of the substrate stage by applying a vacuum suction force to the adsorption hole formed in the rigid part, and adsorbing and holding the substrate The substrate stage Instrumentation region is moved to be positioned to the working unit, to provide a component mounting method characterized by performing the mounting operation relative to the mounting region by the working portion.

  In the component mounting method, after the mounting operation by the working unit is completed, the substrate stage that sucks and holds the substrate is moved so that the mounting region is away from the operation, and the rigid body unit is formed on the rigid body unit. The vacuum suction force to the suction hole is stopped, the suction holding of the first part of the substrate to the substrate stage is released, the vacuum suction force to the suction pad is stopped, and the second suction of the substrate is stopped. The part is released from the suction and holding to the substrate stage, and the substrate is removed from the substrate stage.

  According to the present invention, the lower surface side of the substrate is sucked and held by the suction holes formed in the rigid portion of the substrate stage at the first portion of the substrate in the vicinity of the mounting region, and the substrate at the second portion excluding the first portion. Is sucked and held by a suction pad provided in the substrate stage. Therefore, the mounting area can be supported in a state having a high flatness in which the warp is corrected, so that the working accuracy in the working portion is improved and can be reliably held with respect to the substrate stage. In particular, even a large substrate can be reliably held on the substrate stage in a state where the mounting region has a high flatness in which the warp is corrected. Further, since the rigid body portion that requires flatness is provided only at a position corresponding to the vicinity of the mounting area of the substrate, the processing of the substrate stage is relatively easy, and the substrate stage can be manufactured at a relatively low cost.

  Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

  1 and 2 show a component mounting apparatus 11 according to an embodiment of the present invention. The component mounting apparatus 11 is an apparatus for mounting the component 13 on the board 12 shown in FIG.

  The substrate 12 will be described with reference to FIG. In the present embodiment, the substrate 12 is a liquid crystal display substrate (LCD substrate). However, the substrate 12 may be a glass substrate such as a plasma display substrate (PDP substrate) or a substrate other than the glass substrate. The substrate 12 has a rectangular shape in plan view. An elongated region extending along one of the pair of opposing long sides of the substrate 12 is a first mounting region 12a on which the component 13 is mounted. An elongated region extending along one of a pair of opposing short sides is also a second mounting region 12b on which the component 13 is mounted. Hereinafter, the part near the first mounting region 12a of the substrate 12 is referred to as a first supported part 12c. A portion of the substrate 12 near the second mounting region 12b is referred to as a second supported portion 12d. Further, a portion other than the first and second supported portions 12c and 12d of the substrate 12, that is, a portion including the vicinity of the center of the substrate 12 away from the first and second mounting regions 12a and 12b is a third supported portion. 12e.

  With reference to FIG.1 and FIG.2, the basic function and structure of the component mounting apparatus 11 are outlined. The component mounting apparatus 11 includes an ACF sticking device 15, a temporary crimping device 16, a first regular crimping device 17, and a second regular crimping device 18 (mounting work device). The ACF attaching device 15 attaches an anisotropic conductive tape (ACF tape) to the first and second mounting regions 12 a and 12 b of the substrate 12. The temporary crimping device 16 mounts or temporarily crimps the component 13 to the first and second mounting regions 12a and 12b with a predetermined crimping force. The first final crimping device 17 fixes or final crimps the component 13 temporarily crimped to the first mounting region 12 a with a greater crimping force than the temporary crimping device 16. The second final crimping device 18 fixes or final crimps the component 13 temporarily crimped to the second mounting region 12 b with a greater crimping force than the temporary crimping device 16.

  The ACF sticking device 15, the temporary crimping device 16, the first regular crimping device 17, and the second regular crimping device 18 move the substrate stages 21A, 21B, 21C, and 21D holding the substrate 12 and XYZθ that move the substrate stages 21A to 21D. Tables 22A, 22B, 22C, and 22D, and working units 23A, 23B, 23C, and 23D that execute processes of individual devices are provided. Further, the temporary crimping device 16, the first regular crimping device 17, and the second regular crimping device 18 include substrate transfer devices 24A, 24B, and 24C. Further, the temporary crimping device 16, the first regular crimping device 17, and the second regular crimping device 18 include warp correction devices 25A, 25B, and 25C. The structures of the XYZθ tables 22A to 22D are the same. Moreover, the structure of the board | substrate conveyance measures 24A-24C is also the same. Further, the structures of the warp correction devices 25A to 25C are the same.

  The ACF sticking device 15, the temporary crimping device 16, the first regular crimping device 17, and the second regular crimping device 18 are arranged on one virtual straight line (on a virtual straight line extending in the X-axis direction in the figure). . The substrate 12 carried into the component mounting apparatus 11 by the loader 26 shown in FIG. 2 is transferred from the ACF adhering apparatus 15 to the provisional pressure bonding apparatus 16 in the transport direction (+ X direction in the figure) indicated by the arrow C along the virtual straight line. The first and second crimping apparatuses 17 and 18 are sequentially conveyed to the outside of the component mounting apparatus 11 by the unloader 27 shown in FIG.

  First, the substrate 12 is transferred from the loader 26 to the substrate stage 21 </ b> A of the ACF sticking device 15. Subsequently, the substrate stage 21A moves to the working unit 23A. After the completion of the ACF attaching process to the substrate 12, the substrate stage 21A moves to the first substrate delivery position P1 in the ACF attaching apparatus 15. At the first substrate delivery position P1, the substrate 12 is transferred from the substrate stage A to the substrate transport apparatus 24A. The substrate 12 is transported from the first substrate delivery position P1 to the second substrate delivery position P2 in the temporary crimping device 16 by the substrate transport device 24A.

  At the second substrate delivery position P2, the substrate 12 is transferred from the substrate transport device 24A to the substrate stage 21B of the temporary pressure bonding device 16. Subsequently, the substrate stage 21B moves to the working unit 23B. After completion of the temporary press-bonding process for the substrate 12, the substrate stage 21B moves to the third substrate delivery position P3 in the temporary press-bonding device 16. At the third substrate delivery position P3, the substrate 12 is transferred from the substrate stage 21B to the substrate transport device 24B. The substrate 12 is transported from the third substrate delivery position P3 to the fourth substrate delivery position P4 in the first permanent crimping device 17 by the substrate transport device 24B.

  At the fourth substrate delivery position P4, the substrate 12 is transferred from the substrate transport device 24B to the substrate stage 21C of the first permanent crimping device 17. Subsequently, the substrate stage 21C moves to the working unit 23C. After completion of the main crimping process for the first mounting region 12 a of the substrate 12, the substrate stage 21 </ b> C moves to the fifth substrate delivery position P <b> 5 in the first permanent crimping device 17. At the fifth substrate delivery position P5, the substrate 12 is transferred from the substrate stage 21C to the substrate transport apparatus 24C. The substrate 12 is transported from the fifth substrate delivery position P5 to the sixth substrate delivery position P6 in the second final crimping device 18 by the substrate transport device 24C.

  At the sixth substrate delivery position P6, the substrate 12 is transferred from the substrate transport device 24C to the substrate stage 21D of the second final crimping device 18. Subsequently, the substrate stage 21D moves to the working unit 23D. After the completion of the main pressure bonding process for the second mounting region 12b of the substrate 12, the substrate is transferred from the substrate stage 21D to the unloader 27.

  When the substrate 12 is transferred from the substrate transport devices 24A to 24C to the substrate stages 21B to 21D at the second, fourth, and sixth substrate delivery positions P2, P4, and P6, the warp correction device 25A is used as necessary. The process of correcting the warp of the substrate 12 by ~ 25C is executed.

  As schematically shown in FIG. 2, a controller 28A for controlling the ACF sticking device 15 and the provisional pressure bonding device 16 is provided, and an operation panel 29A for an operator to input commands and the like is connected to the controller 28A. . Similarly, the first and second main crimping devices 17 and 18 are controlled by a common controller 28B, and an operation panel 29B is connected to the controller 28B. However, a controller and an operation panel may be provided in each of the ACF sticking device 15, the temporary crimping device 16, the first regular crimping device 17, and the second regular crimping device 18. Conversely, all of them may be provided with a single controller and operation panel.

  Next, the ACF sticking device 15, the temporary crimping device 16, the first regular crimping device 17, and the second regular crimping device 18 will be described in order.

  The ACF sticking device 15 will be described with reference to FIGS. 1, 2, and 4 to 7. As shown in FIGS. 1, 2, and 4, the ACF sticking device 15 includes a substrate stage 21A, an XYZθ table 22A, and a working unit 23A.

  The substrate 12 supplied from the loader 26 is placed on the substrate stage 21A. The substrate stage 21A sucks and holds the lower surface side of the placed substrate 12A. 6A and 6B, the substrate stage 21A has a rectangular shape in which the ratio of the length of the long side to the short side approximates that of the substrate 12 in plan view, and the dimensions of both the long side and the short side are the substrate. Shorter than 12. The first and second mounting regions 12a and 12b (see FIG. 3) of the substrate 12 placed on the substrate stage 21A are located outside the substrate stage 21A in plan view.

  A plurality of flexible suction pads 31A are arranged on the entire top surface of the substrate stage 21A. Each suction pad 31A is formed with a through hole 32 penetrating in the height direction. The lower end side of the through hole 32 is connected to a vacuum source 35A via a suction channel 34A including an internal channel 33A formed inside the substrate stage 21A. Further, a valve 36A and a vacuum pressure sensor 37A are interposed in the suction flow path 34A. When the valve 36A is opened, a suction force acts on the suction pad 31A from the vacuum source 35A via the suction flow path 34A, and the lower surface side of the substrate 12 is sucked and held on the substrate stage 21 by this suction force. On the other hand, when the valve 36A is closed, the suction flow path 34A is blocked, and the suction force of the vacuum source 35A does not act on the suction pad 31A.

  The substrate stage 21A is provided with four circular holes 38A penetrating in the thickness direction in order to reduce the weight without reducing the strength.

  The XYZθ table 22A is mechanically connected to the lower surface side of the substrate stage 21A, and linearly moves and rotates the substrate stage 21A within the ACF sticking device 15. Referring to FIG. 7, the XYZθ table 22A includes an X-axis drive mechanism 41 that moves the substrate stage 21A in the X-axis direction (+ X direction and −X direction), and the substrate stage 21A in the Y-axis direction (+ Y direction and −Y direction). A Y-axis drive mechanism 42 for moving the substrate stage 21, a Z-axis drive mechanism 43 for moving the substrate stage 21 A in the Z-axis direction (+ Z direction and −Z direction), and a θ-axis drive mechanism 44 for rotating the substrate stage 21 A about the Y-axis. Prepare.

  The X-axis drive mechanism 41 includes a pair of linear motion rails 45A and 45B extending in the X-axis direction, and a slider 46 that is guided by these linear motion rails 45A and 45B and is movable in the X-axis direction. The X-axis drive mechanism 41 includes a ball screw 47 extending in the X-axis direction in which a nut portion (not shown) of the slider 46 is screwed, and a motor 48 that rotationally drives the ball screw 47. When the ball screw 47 is moved by the motor 48, the slider 46 moves in the X-axis direction according to the rotation direction. The X-axis drive mechanism 41 is mounted on the Y-axis drive mechanism 42.

  The Y-axis drive mechanism 42 includes a pair of linear motion rails 51A and 51B extending in the Y-axis direction, and a slider 52 that is guided by the linear motion rails 51A and 51B and is movable in the Y-axis direction. The Y-axis drive mechanism 42 includes a ball screw 53 extending in the Y-axis direction in which a nut portion (not shown) of the slider 52 is screwed, and a motor 54 that rotationally drives the ball screw 53. When the ball screw 53 is moved by the motor 54, the slider 52 moves in the Y-axis direction according to the rotation direction. An X-axis drive mechanism 41 is mounted on the slider 52.

  The Z-axis drive mechanism 43 moves in the Z-axis direction by being guided by a pair of linear motion rails 55A and 55B provided in the slider 46 of the X-axis drive mechanism 41 and extending in the Z-axis direction, and these linear motion rails 55A and 55B. A possible slider 56 is provided. The substrate stage 21 </ b> A is attached to the slider 56 via the θ-axis drive mechanism 44. The rotation of the motor 59 is transmitted to the slider 56 as a linear motion through a transmission mechanism including pulleys 57A and 57B, a belt 58, and an eccentric cam mechanism (not shown). The slider 56 moves in the Z-axis direction according to the rotation direction of the motor 59.

  The θ-axis drive mechanism 44 is mounted on the slider 56 of the Z-axis drive mechanism 43. The θ-axis drive mechanism 44 includes a rotary shaft 62 that is driven to rotate by a motor 61 and extends in the Y-axis direction. The substrate stage 21 </ b> A is fixed to the rotating shaft 61.

  The working unit 23A includes various mechanisms necessary for executing the ACF attaching process on the substrate 12. Referring to FIG. 1, the working unit 23A corresponds to the length of the backup stage 63A that supports the first and second mounting regions 12a and 12b of the substrate 12 from the lower surface side, and the first and second mounting regions 12a and 12b. ACF supply unit 64 that sends out an amount of ACF tape, an ACF sticking head 65 that pushes and sticks the ACF tape sent out from the ACF supply unit 64 to the first and second mounting regions 12a and 12b, and a panel for alignment A setting device 66 and an under camera 67A are provided.

  Referring to FIG. 5, the controller 28A, based on the command input from the operation panel 29A and the detection values of the vacuum pressure sensor 37A and other sensors 68 (including the aforementioned under camera 67A), The operation of the XYZθ table 22A, the vacuum source 35A, the valve 36A, and the working unit 23A is controlled.

  The operation of the ACF sticking device 15 will be described. When the substrate 12 is placed on the substrate stage 21A from the loader 26, the valve 36A is opened, and the suction force of the vacuum source 35A acts on the lower surface side of the substrate 12 via the suction channel 34A and the suction pad 31A. With this suction force, the lower surface side of the substrate 12 is held by the substrate stage 21A. Since the suction pad 31A is in close contact with the lower surface of the substrate 12, air leakage does not occur, and the substrate 12 is securely held with respect to the substrate stage 21A. Further, a strong suction force acts on the lower surface of the substrate 12 from the suction pad 31A, so that the warp of the substrate 12 is corrected. Based on the detection value of the vacuum pressure sensor 37, it is inspected whether the substrate 12 is held with respect to the substrate stage 21A with a sufficient holding force.

  Next, the XYZθ table 22A moves the substrate stage 21A holding the substrate 12 to the working unit 23A. The working unit 23A affixes the ACF tape to the first and second mounting regions 12a and 12b of the substrate 12, respectively. For example, the first mounting area 12a of the substrate 12 is first positioned and placed on the backup stage 63A, and the ACF tape sent from the ACF supply unit 64 is pasted to the first mounting area 12a by the ACF pasting head 65. Next, the substrate stage 21 is rotated in the θ direction by 90 degrees by the XYZθ table 22, and the second mounting region 12b is positioned and placed on the backup stage 63A. Similarly, the ACF tape is attached to the second mounting region 12b.

  After the application of the ACF tape to the first and second mounting regions 12a and 12b is completed, the XYZθ table 22A moves the substrate stage 21A holding the substrate 12 to the first substrate delivery position P1. At the first substrate delivery position P1, the substrate 12 is transferred from the substrate stage 21A to the substrate transport apparatus 24A. The transfer of the substrate 12 will be described in detail later. After the substrate 12 is transferred, the XYZθ table 22A returns the substrate stage 21A to the substrate delivery position with the loader 26.

  Next, the temporary crimping apparatus 16 will be described with reference to FIGS. 1, 2, and 8 to 13. As shown in FIGS. 1, 2, and 8, the temporary pressure bonding device 16 includes a substrate stage 21B, an XYZθ table 22B, a substrate transport device 24A, a warp correction device 25A (not shown in FIG. 1), and a working unit 23B. Is provided.

  Referring to FIGS. 10A and 10B, the substrate stage 21B has a rectangular shape smaller than the substrate 12 in plan view, like the substrate stage 21A, and the first and second mountings of the substrate 12 placed on the substrate stage 21B. The regions 12a and 12b (see FIG. 3) are located outside the substrate stage 21B in plan view.

  Referring also to FIG. 3, the substrate stage 21 </ b> A has the first and second supported portions 12 c and 12 d of the substrate 12, that is, the lower surface side of the portions near the first and second mounting regions 12 a and 12 b of the substrate 12. The rigid body portion 71 is provided. The rigid body portion 71 has an L shape in plan view. Further, the rigid body portion 71 has such a rigidity that it does not substantially deform when the substrate 12 is placed. The substrate stage 21 </ b> A is formed with a recess 72 that faces the third supported portion 12 e of the substrate 12, that is, the central portion of the substrate 12 that is away from the first and second mounting regions 12 a and 12 b.

  A plurality of suction holes 73 </ b> A are formed in the rigid portion 71. On the other hand, a plurality of suction pads 31B having flexibility and having through holes are disposed in the recess 72. Further, four circular holes 38B penetrating in the thickness direction are provided at the bottom of the recess 72 to reduce the weight.

  The suction hole 73A is connected to the vacuum source 35B via a suction channel 34B including an internal channel 33B formed inside the substrate stage 21B. A valve 36B and a vacuum pressure sensor 37B are interposed in the suction flow path 34B. On the other hand, the suction pad 31B is also connected to the suction hole 73A and the common vacuum source 35B through another system suction channel 34C including the internal channel 33C formed inside the substrate stage 21B. The suction channel 34C is also provided with a valve 36C and a vacuum pressure sensor 37C.

  The structure of the XYZθ table 22B is the same as the XYZθ table 22A of the ACF sticking device 15 (see FIG. 7).

  Next, the substrate transfer device 24A will be described. Referring to FIG. 11, the substrate transfer device 24 </ b> A includes a pair of support structures 76 </ b> A and 76 </ b> B that extend upward in the vertical direction and have a lower end fixed to a base 75. These support structures 76A and 76B face each other in the Y-axis direction. Beam structures 77A and 77BB extending in the X-axis direction are supported on the upper ends of the support structures 76A and 76B. Linear motion rails 78A and 78B are fixed to the beam structures 77A and 77B, respectively.

  The linear motion rails 78A and 78B extend in the direction from the first substrate delivery position P1 to the second substrate delivery position P2, that is, in the transport direction C. The linear motion rails 78A and 78B are opposed to each other with a gap G1 in the Y-axis direction, that is, the direction orthogonal to the transport direction C.

  The substrate transfer device 24A includes substrate holding sliders 79A and 79B that are movable in the transfer direction C along the linear motion rails 78A and 78B, respectively. Each of the substrate holding sliders 79A and 79B includes slider bodies 81A and 81B that are movably supported by the linear motion rails 78A and 78B. Each of the substrate holding sliders 79A and 79B includes substrate mounting arms 82A and 82B at the tips of the slider main bodies 81A and 81B. Each substrate mounting arm 82A, 82B extends in the X-axis direction (transport direction C). Further, the substrate mounting arms 82A and 82B are opposed to each other with a gap G2 in the Y-axis direction (a direction orthogonal to the transport direction C). This gap G2 is set to be at least larger than the length LS of the short side of the substrate stage 21A (see FIGS. 6A and 10A) so that the substrate stages 21A and 21B can be disposed between the substrate mounting arms 82A and 82B. Has been.

  The substrate placement arms 82A and 82B of the substrate transfer device 24A face each other with a gap G2, so that the substrate stage 21A and 21B can be efficiently and quickly at the first and second substrate delivery positions P1 and P2. The substrate 12 can be transferred. More specifically, when the substrate stage 21A (see FIGS. 6A and 6B) approaches the first substrate delivery position P1 and leaves the first substrate delivery position P1, the substrate stage 21A simply moves in the transport direction C (X-axis direction). It is not necessary to be orthogonal to the transport direction C in order to avoid interference with the substrate mounting arms 82A and 82B. Similarly, when the substrate stage 21B (see FIGS. 10A and 10B) approaches the second substrate delivery position P2 and moves away from the first substrate delivery position P1, the substrate stage 21B simply moves in the transport direction C (X-axis direction). In order to avoid interference with the substrate mounting arms 82A and 82B, it is not necessary to be orthogonal to the transport direction C. As described above, since the substrate stages 21A and 21B can move in and out of the substrate delivery positions P1 and P2 only by moving in the transport direction C, the substrate 12 is transferred between the substrate transport device 24A and the substrate stages 21A and 21B. Can be done efficiently. Further, since the substrate stages 21A and 21B do not need to move in a direction orthogonal to the conveyance direction C in order to deliver the substrate 12 at the substrate delivery positions P1 and P2, the substrate stages 21A and 21B are conveyed by the ACF adhering device 15 and the temporary pressure bonding device 16. The dimension in the depth direction (Y-axis direction) orthogonal to the direction can be reduced. As a result, the component mounting apparatus 11 can be reduced in size. By downsizing the dimension of the component mounting apparatus 11 in the depth direction, the transport time of the substrate 12 in the component mounting apparatus 11 can be shortened and the maintainability can be improved. In particular, even with a large substrate 12, the substrate can be delivered efficiently, and the size of the component mounting apparatus 11 in the depth direction can be reduced. The remaining substrate transfer devices 24B and 24C have the same effect.

  A plurality of flexible suction pads 83 are attached to the substrate mounting arms 82A and 82B, respectively. These suction pads 83 are connected to a vacuum source 85 via a suction channel 84. Further, a valve 86 is interposed in the suction flow path 34D. When the valve 86D is opened, the suction force from the vacuum source 85 acts on the suction pad 83.

  One of the two sides facing each other in the X-axis direction of the substrate 12 is arranged on the substrate mounting arm 82A, and the other is placed on the substrate driving arm 82B. The substrate 12 is releasably held on the substrate mounting arms 82A and 82B by the suction force of the vacuum source 85 acting on the lower surface of the substrate 12 acting via the suction pad 83.

  The substrate transfer device 24 reciprocates the substrate holding sliders 79A and 79B between the first substrate transfer position P1 and the second substrate transfer position P2 while maintaining the relative position in the X-axis direction (transfer direction C). An X-axis drive mechanism 87 is provided. The X-axis drive mechanism 87 includes a motor 88 attached to the lower end side of the support structure 76A. Further, both ends of the drive shaft 89 are rotatably supported by the support structures 76A and 76B. The motor 88 and the drive shaft 89 are connected by a belt 91 and pulleys 92A and 92B. Further, a drive pulley 93 is fixed to each of the inner portions of the support structures 76A and 76B of the drive shaft 89 (in FIG. 11, only the drive pulley 93 on the one support structure 76B side appears). Further, a plurality of driven pulleys 94 are attached to the inside of each beam structure 77A, 77B, and a driving belt 95 is stretched between the driving pulley 93 and the driven pulley 94 (in FIG. 11, one beam structure 77B). Only the driven pulley 94 and the drive belt 95 on the side appear.) A part of the slider main bodies 81A and 81B of the substrate holding sliders 79A and 79B are fixed to the drive belts 95, respectively.

  The rotation of the motor 88 is transmitted to the drive belt 95 via the pulleys 92A and 92B, the belt 91, and the drive pulley 93, and the drive belt 95 moves in the direction indicated by the arrow D1 or the arrow D2 according to the rotation direction of the motor 88. To do. When the drive belt 95 moves in the direction of the arrow D1, the substrate holding sliders 79A and 79B move in the + X direction, that is, from the first substrate delivery position P1 toward the second substrate delivery position P2. When the drive belt 95 moves in the direction of the arrow D2, the substrate holding sliders 79A and 79B move in the −X direction, that is, from the second substrate delivery position P2 toward the first substrate delivery position P1.

  Limit switches 96A and 96B are disposed at positions corresponding to the first and second substrate delivery positions P1 and P2 of the beam structure 77A, respectively. By operating these limit switches 96A, 96B by the switch operating piece 97 on the substrate holding slider 79A side, it is detected that the substrate holding sliders 79A, 79B have reached the first and second substrate delivery positions P1, P2. The

  Next, the warp correction device 25A will be described. 8 and 12, at the second substrate delivery position P2, a support beam 101 extending in the Y-axis direction is disposed above the substrate transport device 24A. An air cylinder 103 is attached to the distal end of a support arm 102 having a proximal end connected to the support beam 101. The air cylinder 103 is attached to the support arm 102 in such a posture that the rod 103a faces downward in the vertical direction. Three buffer pads 105 having elasticity or flexibility are attached to the bracket 104 fixed to the lower end of the rod 103a.

  An air source 106 for driving the air cylinder 103 is connected to the air cylinder 103 via a valve 107. In a state where the valve 107 is closed and the air shilling 103 is shut off from the air source 106, the rod 103a of the air cylinder 103 is in the raised position HP1 indicated by a solid line in FIG. At the raised position HP1, the buffer pad 105 faces the substrate transfer device 24A and the substrate stage 21B with a space therebetween and does not contact the substrate 12. On the other hand, when the valve 107 is opened and the air source 106 is communicated with the air cylinder 103, the rod 103a of the air cylinder 103 moves to a lowered position HP2 indicated by a broken line in FIG. As will be described in detail later, the buffer pad 105 abuts on the upper surface of the substrate 12 held by the substrate stage 21B at this lowered position HP2, and presses the substrate 12 toward the substrate stage 21B.

  When the warp correcting device 25A is not used, the air cylinder 103 can be retracted from the second substrate delivery position P2 by rotating the support arm 102 as indicated by an arrow E. Specifically, the support arm 102 can be rotated around the bolt 108 on the support beam 101 side, and the posture shown in FIGS. The support arm 102 can be rotated around the bolt by loosening the nut 109 and pushing down the detent 110 so as to come out of the retaining hole 111. Reference numerals 112 </ b> A and 112 </ b> B are setting members that limit the rotation range of the support arm 102.

  As will be described in detail later, if the holding force of the substrate 12 by the substrate stage 21B is not sufficient when the substrate 12 is transferred at the substrate delivery position P2, the rod 103a of the air cylinder 103 is lowered to the lowered position HP2, and the buffer pad 105 Presses the substrate 12 against the substrate stage 21B. Therefore, the substrate 12 can be transferred to the substrate stage 21B in a state having an appropriate flatness with reduced warpage, and positional displacement of the substrate 12 during delivery due to warpage of the substrate 12 can be prevented. As a result, the precision of the temporary press-bonding process for the substrate 12 in the working unit 23B can be improved. Further, by correcting the warpage of the substrate 12, the holding force that the substrate stage 21B holds the substrate 12 by suction increases rapidly, so that the time required for delivery of the substrate can be shortened and the tact improvement can be achieved. . The other warp correction devices 25B and 25C have the same effect.

  The working unit 23 </ b> B includes various mechanisms that are necessary for performing the temporary crimping process on the substrate 12. Referring to FIG. 1, the working unit 23B includes a backup stage 63B that supports the first and second mounting regions 12a and 12b of the substrate 12 from the lower surface side. The working unit 23B includes a tape-type component supply device 115. The component reversing device 116 extracts the component 13 (see FIG. 3) from the component supply device 115, and the extracted component 13 is transferred to the component transfer device 117 that moves in the X-axis direction and the Y-axis direction. The component transfer device 117 is moved to another component transfer device 118 having a rotary stage, and the provisional pressure bonding head 119 picks up the component 13 from the component transfer device 118. Further, the working unit 23B includes an under camera 67B for recognizing the component 13 and the board 12.

  Referring to FIG. 9, the controller 28A generates a command input from the operation panel 29A and detection values of the vacuum pressure sensors 37B and 37C and other sensors 120 (including limit switches 96A and 96B and the under camera 67A). Based on this, the operations of the XYZθ table 22B, the vacuum source 35, the valve 36, the working unit 23B, the substrate transport device 24A, and the warp correction device 25A of the temporary pressure bonding device 16 are controlled.

  The operation of the temporary pressure bonding device 16 will be described. First, at the second substrate delivery position P2, the substrate 12 is placed on the substrate stage 21B from the substrate holding sliders 79A and 79B of the substrate transport apparatus 24A. At this time, the warp of the substrate 12 is corrected by the warp correction device 25A as necessary. The delivery of the substrate 12 will be described in detail later.

  In a state where the substrate 12 is held on the substrate stage 21B, both the valves 36B and 36C are open. The lower surface side of the substrate 12 is placed on the rigid portion 71 in the first and second supported portions 12c and 12d in the vicinity of the first and second mounting regions 12a and 12b. Further, the suction force of the vacuum source 35B acts on the first and second supported parts 12c and 12d via the suction channel 34B and the suction hole 73A, and the first and second supported parts 12c of the substrate 12 by this suction force. , 12d are attracted and held by the rigid portion 71. Since the first and second supported portions 12c and 12d are supported by the rigid rigid body portion 71, the mounting regions 12a and 12b are held in a state having high flatness in which the warp is corrected. On the other hand, the third supported portion 12e separated from the first and second mounting regions 12a and 12b is placed on the suction pad 31B provided in the recess 72 of the substrate stage 21B. The suction force of the vacuum source 35B acts on the lower surface side of the third supported part 12e of the substrate 12 via the suction channel 34C and the suction pad 31B. Since the suction pad 31B is in close contact with the lower surface of the substrate 12, no leakage occurs, and the substrate is securely held by the suction force acting from the suction pad 31B. Further, when a strong suction force acts on the lower surface of the substrate 12 from the suction pad 31B, the first and second supported portions 12c and 12d of the substrate 12 in the vicinity of the mounting regions 12a and 12b become rigid portions of the substrate stage 21B. Since it is strongly pressed against 71, the flatness of the mounting regions 12a and 12b is increased.

  Next, the XYZθ table 22B moves the substrate stage 21B holding the substrate 12 to the working unit 23B. In the working part 23B, the temporary pressure bonding head 119 temporarily pressure-bonds the component 13 to the first and second mounting regions 12a and 12b of the substrate 12, respectively. For example, the first mounting region 12a of the substrate 12 is first positioned and placed on the backup stage 63B, and the component 13 is temporarily crimped to a predetermined position by the temporary crimping head 119 based on the recognition result of the under camera 67B. Next, the substrate stage 21 is rotated in the θ direction by 90 degrees by the XYZθ table 22B, and the second mounting region 12b is positioned and placed on the second backup stage 63B. Similarly, the component 13 is temporarily bonded to the second mounting region 12b.

  As described above, the lower surface side of the first and second supported portions 12d of the substrate 12 in the vicinity of the first and second mounting regions 12a and 12b is reliably supported by the rigid rigid body portion 71, and has a high plane. Have a degree. Therefore, when the component is temporarily pressure-bonded in the working portion 23B, the first and second mounting regions 12a and 12b are not displaced, and the component can be temporarily pressure-bonded with high positional accuracy. On the other hand, the third supported portion 12e that is separated from the first and second mounting regions 12a and 12b has a higher flatness in consideration of the provisional pressure bonding in the working portion 23B as compared with the first and second supported portions. The necessity to do is low. In the present embodiment, the third supported portion 12e is securely held by the suction pad 31B instead of a rigid body. As described above, the vicinity of the first and second mounting regions 12a and 12b is sucked and held by the rigid portion 71, and the portion away from the first and second mounting regions 12a and 12b is sucked and held by the suction pad 31B. It is possible to achieve both the improvement of the working accuracy of the temporary press-bonding process in the working part 23B by increasing the degree and the firm holding of the substrate 12 with respect to the substrate stage 21B. When the substrate 12 is not sufficiently held by the substrate stage 21B when the substrate 12 is transferred at the substrate delivery position P2, the substrate 12 is pressed against the substrate stage 21B by the warp correction device 25A. Therefore, the substrate 12 is reliably held on the substrate stage 21B in a state where the first and second mounting regions 12a and 12b have high flatness and no positional deviation due to warpage. This also improves the working accuracy of the temporary crimping process.

  After provisional pressure bonding of components to the first and second mounting regions 12a and 12b, the XYZθ table 22B moves the substrate stage 21B holding the substrate 12 to the third substrate delivery position P3. At the third substrate delivery position P3, the substrate 12 is transferred from the substrate stage 21B to the substrate transport device 24B. The transfer of the substrate 12 will be described in detail later. After the substrate 12 is transferred, the XYZθ table 22B returns the substrate stage 21B to the second substrate delivery position P2.

  Next, with reference to FIG. 1, FIG. 2, FIG. 8, FIG. 9, FIG. 13A, and FIG. As shown in FIGS. 1, 2, and 8, the first book crimping device 17 includes a substrate stage 21 </ b> C, an XYZθ table 22 </ b> C, a substrate transport device 24 </ b> B, a warp correction device 25 </ b> B (not shown in FIG. 1), and work. A portion 23C is provided.

  Referring to FIGS. 13A and 13B, the substrate stage 21C has a rectangular shape smaller than the substrate 12 in plan view, like the substrate stages 21A and 21B, and the first and first substrates 12 placed on the substrate stage 21C are in the shape of a rectangle. The two mounting regions 12a and 12b are located outside the substrate stage 21C in plan view.

  Referring also to FIG. 3, the substrate stage 21 </ b> C has a straight band-like rigid body in a plan view in which the first supported portion 12 c of the substrate 12, that is, the lower surface side of the portion near the first mounting region 12 a of the substrate 12 is disposed. The unit 71 is provided. The rigid body portion 71 has a rigidity that does not substantially deform when the substrate 12 is placed. In addition, the substrate stage 21C is formed with a recess 72 that faces the portion other than the first supported portion 12c of the substrate 12, that is, the second supported portion 12d and the third supported portion 12e in the vicinity of the second mounting region 12b. Has been. A support portion 125A that is sufficiently shorter than the long side of the substrate stage 21C is formed at a position facing the rigid body portion 71 in plan view of the recess 72.

  A plurality of suction holes 73 </ b> B are formed in the rigid portion 71. On the other hand, a plurality of suction pads 31C having flexibility and having through holes are disposed in the recess 72. In addition, four circular holes 38C that penetrate in the thickness direction are provided at the bottom of the recess 72A to reduce the weight.

  The suction hole 73B is connected to a vacuum source 35C via a suction channel 34D including an internal channel 33D formed inside the substrate stage 21C. A valve 36D and a vacuum pressure sensor 37D are interposed in the suction flow path 34D. On the other hand, the suction pad 31C is also connected to a suction source 73C and a common vacuum source 35C through another system suction channel 34E including an internal channel 33E formed inside the substrate stage 21C. The suction channel 34C is also provided with a valve 36E and a vacuum pressure sensor 37E.

  The structure of the XYZθ table 22C of the first main crimping device 17 is the same as the XYZθ tables 22A and 22B of the ACF sticking device 15 and the temporary crimping device 16 (see FIG. 7). Moreover, the structure of the board | substrate conveyance apparatus 24B of the 1st main crimping | compression-bonding apparatus 17 is the same as the board | substrate conveyance apparatus 24A of the temporary crimping | compression-bonding apparatus 16 (refer FIG. 11). Furthermore, the structure of the warp correction device 25B of the first main crimping device 17 is the same as that of the warp correction device 25A of the temporary crimping device 16 (see FIG. 12).

  The working unit 23 </ b> C includes various mechanisms necessary for performing the main crimping process on the first mounting region 12 a of the substrate 12. Referring to FIG. 1, the working unit 23 </ b> C includes a backup stage 63 </ b> C that supports the first mounting region 12 a of the substrate 12 from the lower surface side. Further, the working unit 23C applies a plurality of final crimping heads 126 to the plurality of components 13 temporarily crimped to the first mounting region 12a by simultaneously applying a larger crimping force than the temporary crimping head 119. Prepare.

  The controller 28B determines the XYZθ table 22C, the vacuum source C, the valve of the first crimping device 17 based on the command input from the operation panel 29B and the detection values of the vacuum pressure sensors 37D and 37E and the other sensors 120. The operations of 36D and 36E, the working unit 23C, the substrate transfer device 24B, and the warp correction device 25B are controlled (see FIG. 9).

  The operation of the first book crimping device 17 will be described. First, at the fourth substrate delivery position P4, the substrate 12 is placed on the substrate stage 21C from the substrate holding sliders 79A and 79B of the substrate transport apparatus 24B. At this time, the warp of the substrate 12 is corrected by the warp correction device 25B as necessary. The delivery of the substrate 12 will be described in detail later.

  In a state where the substrate 12 is held on the substrate stage 21C, both the valves 36D and 36E are open. The lower surface side of the substrate 12 is placed on the rigid portion 71 in the first supported portion 12c in the vicinity of the first mounting region 12a. In addition, the suction force of the vacuum source 35C acts on the first supported portion 12c via the suction flow path 34D and the suction hole 73B, and the lower surface side of the first supported portion 12c of the substrate 12 is attracted to the rigid body portion 71 by this suction force. Retained. Since the first supported portion 12c is supported by the rigid body portion 71 having rigidity, the first mounting region 12a is held in a state having high flatness in which the warp is corrected. On the other hand, the second and third supported portions 12 d and 12 e that are separated from the first mounting region 12 a are placed on the suction pad 31 </ b> C provided in the recess 72 of the substrate stage 21. The suction force of the vacuum source 35C acts on the lower surface side of the second and third supported portions 12d and 12e of the substrate 12 via the suction flow path 34E and the suction pad 31C. Since the suction pad 31C is in close contact with the lower surface of the substrate 12, no leakage occurs, and the substrate is reliably held by the suction force acting from the suction pad 31C. Further, when a strong suction force acts on the lower surface of the substrate 12 from the suction pad 31E, the first supported portion 12c of the substrate 12 in the vicinity of the first mounting region 12a is strongly pressed against the rigid body portion 71 of the substrate stage 21C. Therefore, the flatness of the first mounting region 12a is increased.

  Next, the XYZθ table 22C moves the substrate stage 21C holding the substrate 12 to the working unit 23C, and positions the first mounting region 12a with respect to the working unit 23C. In the working unit 23 </ b> C, the main press bonding head 126 performs main press bonding of the component 13 to the first mounting region 12 a of the substrate 12.

  As described above, the lower surface side of the first supported portion 12c of the substrate 12 in the vicinity of the first mounting region 12a is reliably supported by the rigid rigid body portion 71 and has high flatness. Therefore, when the component 13 is finally press-bonded in the working portion 23C, the component 13 can be finally press-bonded to the first mounting region 12a with high accuracy without causing displacement of the component 13 due to the displacement of the first mounting region 12a. On the other hand, the second and third supported portions 12d and 12e that are separated from the first mounting region 12a are securely held by the suction pad 31C, not the rigid body. As described above, the vicinity of the first mounting region 12a is sucked and held by the rigid portion 71, and the portion away from the first mounting region 12a is sucked and held by the suction pad 31E, thereby increasing the flatness of the first working region 23C. It is possible to achieve both the improvement of the work accuracy of the main press bonding process for one mounting region 12a and the firm holding of the substrate 12 to the substrate stage 21C. When the substrate 12 is not sufficiently held by the substrate stage 21C when the substrate 12 is transferred at the substrate delivery position P4, the substrate 12 is pressed against the substrate stage 21B by the warp correction device 25B. Therefore, the substrate 12 is reliably held on the substrate stage 21C in a state in which the first mounting region 12a has high flatness and there is no positional deviation due to warpage. This also improves the working accuracy of the main crimping process.

  After the component 13 is finally crimped to the first mounting region 12a, the XYZθ table 22C moves the substrate stage 21C holding the substrate 12 to the fifth substrate delivery position P5. At the fifth substrate delivery position P5, the substrate 12 is transferred from the substrate stage 21C to the substrate transport apparatus 24C. The transfer of the substrate 12 will be described in detail later. After the substrate 12 is transferred, the XYZθ table 22C returns the substrate stage 21C to the fourth substrate delivery position P4.

  Next, with reference to FIG. 1, FIG. 2, FIG. 8, FIG. 9, FIG. 14A, and FIG. As shown in FIGS. 1, 2, and 8, the second crimping device 18 includes a substrate stage 21 </ b> D, an XYZθ table 22 </ b> D, a substrate transport device 24 </ b> C, a warp correction device 25 </ b> C (not shown in FIG. 1), and work. The unit 23D is provided.

  Referring to FIGS. 14A and 14B, the substrate stage 21D of the second book crimping apparatus 18 is a rectangular shape smaller than the substrate 12 in plan view, like the substrate stages 21A, 21B, and 21C, and is placed on the substrate stage 21C. The first and second mounting regions 12a and 12b of the substrate 12 thus positioned are located outside the substrate stage 21C in plan view.

  Referring also to FIG. 3, the substrate stage 21 </ b> D is a belt-like rigid body that is straight when viewed from above, in which the second supported portion 12 d of the substrate 12, that is, the lower surface side of the portion near the second mounting region 12 b of the substrate 12 is disposed. The unit 71 is provided. The rigid body portion 71 has a rigidity that does not substantially deform when the substrate 12 is placed. The substrate stage 21D is formed with a recess 72 that faces a portion other than the second supported portion 12d of the substrate 12, that is, the first supported portion 12c and the third supported portion 12e in the vicinity of the first mounting region 12a. Yes. A support portion 125B that is sufficiently shorter than the short side of the substrate stage 21C is formed at a position facing the rigid body portion 71 in plan view of the recess 72.

  A plurality of suction holes 73 </ b> C are formed in the rigid portion 71. On the other hand, a plurality of suction pads 31D having flexibility and having through holes are disposed in the recess 72. In addition, four circular holes 38D penetrating in the thickness direction are provided at the bottom of the recess 72 to reduce the weight.

  The suction hole 73C is connected to a vacuum source 35D through a suction channel 34F including an internal channel 33F formed inside the substrate stage 21D. A valve 36F and a vacuum pressure sensor 37F are interposed in the suction flow path 34F. On the other hand, the suction pad 31G is also connected to a suction source 73D and a common vacuum source 35D through another system suction channel 34G including an internal channel 33G formed inside the substrate stage 21D. The suction channel 34G is also provided with a valve 36G and a vacuum pressure sensor 37G.

  The structure of the XYZθ table 22D of the second permanent crimping device 18 is the same as that of the XYZθ tables 22A to 22C of the ACF sticking device 15, the temporary crimping device 16, and the first permanent crimping device 17 (see FIG. 7). Further, the structure of the substrate conveying device 24C of the first permanent crimping device 17 is the same as that of the temporary crimping device 16 and the substrate conveying devices 24A and 24B of the first permanent crimping device 17 (see FIG. 11). Furthermore, the structure of the warp correction device 25C of the second main crimping device 18 is the same as the warp correction devices 25A and 25B of the temporary crimping device 16 and the first main crimping device 17 (see FIG. 12).

  The working unit 23 </ b> D includes various mechanisms necessary for performing the main crimping process on the second mounting region 12 b of the substrate 12. Referring to FIG. 1, the working unit 23D includes a backup stage 63D that supports the second mounting region 12b of the substrate 12 from the lower surface side. Further, the working unit 23D applies a plurality of main crimping heads 127 to the plurality of components 13 temporarily crimped to the second mounting region 12b by simultaneously applying a larger crimping force than the temporary crimping head 119. Prepare.

  The controller 28B determines the XYZθ table 22D, the vacuum source D, the valve of the second crimping device 18 based on the command input from the operation panel 29B and the detection values of the vacuum pressure sensors 37F and 37G and the other sensors 120. The operations of 36F and 36G, the working unit 23D, the substrate transfer device 24C, and the warp correction device 25C are controlled (see FIG. 9).

  The operation of the second crimping device 18 will be described. First, at the sixth substrate delivery position P6, the substrate 12 is placed on the substrate stage 21D from the substrate holding sliders 79A and 79B of the substrate transport apparatus 24C. At this time, the warp of the substrate 12 is corrected by the warp correction device 25C as necessary. The delivery of the substrate 12 will be described in detail later.

  In a state where the substrate 12 is held on the substrate stage 21D, both the valves 36F and 36G are open. The lower surface side of the substrate 12 is placed on the rigid portion 71 in the second supported portion 12d in the vicinity of the second mounting region 12b. Further, the suction force of the vacuum source 35D acts on the second supported portion 12d via the suction flow path 34F and the suction hole 73C, and the lower surface side of the second supported portion 12d of the substrate 12 is rigid by this suction force. 71 is held by suction. Since the second supported portion 12d is supported by the rigid rigid body portion 71, the second mounting region 12b is held in a state having high flatness in which the warp is corrected. On the other hand, the first and third supported portions 12 c and 12 e that are separated from the second mounting region 12 b are placed on the suction pad 31 G provided in the recess 72 of the substrate stage 21. The suction force of the vacuum source 35D acts on the lower surface side of the first and third supported parts 12c and 12e of the substrate 12 via the suction flow path 34G and the suction pad 31D. Since the suction pad 31D is in close contact with the lower surface of the substrate 12, no leakage occurs, and the substrate is securely held by the suction force acting from the suction pad 31D. Further, when a strong suction force acts on the lower surface of the substrate 12 from the suction pad 31D, the second supported portion 12d of the substrate 12 in the vicinity of the second mounting region 12b is strongly pressed against the rigid body portion 71 of the substrate stage 21D. Therefore, the flatness of the second mounting region 12b is increased.

  Next, the XYZθ table 22D moves the substrate stage 21D holding the substrate 12 to the working unit 23D, and positions the second mounting region 12b with respect to the working unit 23D. In the working unit 23D, the main press-bonding head 127 performs main-compression bonding of the component 13 to the second mounting region 12b of the substrate 12.

  As described above, the lower surface side of the second supported portion 12d of the substrate 12 in the vicinity of the second mounting region 12b is reliably supported by the rigid rigid body portion 71 and has high flatness. Therefore, when the component 13 is finally press-bonded in the working portion 23D, the position of the component 13 is not shifted due to the displacement of the second mounting region 12b, and the component 13 is finally press-bonded to the first mounting region 12a with high accuracy. it can. On the other hand, the first and third supported portions 12c and 12e apart from the second mounting region 12b are not rigidly held by the suction pad 31D, thereby correcting the warp of the substrate 12 and increasing the flatness. Yes. In this manner, the vicinity of the second mounting region 12b is sucked and held by the rigid portion 71, and the portion away from the second mounting region 12b is sucked and held by the suction pad 31E, thereby increasing the flatness of the second working region 23D. It is possible to achieve both the improvement of the work accuracy of the main pressure bonding process for the two mounting regions 12b and the firm holding of the substrate 12 with respect to the substrate stage 21D. When the substrate 12 is not sufficiently held by the substrate stage 21D when the substrate 12 is transferred at the substrate delivery position P6, the substrate 12 is pressed against the substrate stage 21D by the warp correction device 25C. Therefore, the substrate 12 is reliably held on the substrate stage 21D in a state where the second mounting region 12b has a high flatness and there is no positional deviation caused by warpage. This also improves the working accuracy of the main crimping process.

  After the component 13 is finally press-bonded to the second mounting region 12b, the XYZθ table 22D moves the substrate stage 21D holding the substrate 12 to the substrate delivery position with the unloader 27. The substrate 12 is placed on the unloader 27 from the substrate stage 21 </ b> D and carried out of the component mounting apparatus 11. After the substrate 12 is transferred, the XYZθ table 22D returns the substrate stage 21D to the sixth substrate delivery position P6.

  Next, transfer of the substrate 12 between the substrate transfer apparatuses 24A to 24C and the substrate stages 21A to 21D will be described. Referring to FIG. 15, the substrate 12 is transferred from the substrate transfer device 24 </ b> A to the substrate stage 21 </ b> B of the temporary pressure bonding device 16 at the substrate delivery position P <b> 2. The substrate 12 held on the substrate stage 21B is transferred to the substrate transport device 24B at the substrate delivery position P3. The procedure for transferring the substrate 12 from the substrate transfer devices 21B, 21C to the substrate stages 21C, 21D of the first and second final pressure bonding devices 17, 18 at the fourth and sixth substrate delivery positions P4, P6 is the substrate delivery position P2. Is the same. Further, the procedure for transferring the substrate 12 from the substrate stages 21A, 21C of the ACF adhering device 15 and the first main crimping device 17 to the substrate transfer devices 24A, 24C at the first and fifth substrate delivery positions P1, P5 is also the substrate delivery. It is the same as position P3. Accordingly, the procedure for transferring the substrate 12 at the second and third substrate delivery positions P2 and P3 will be described below.

  First, the transfer of the substrate 12 from the substrate transfer device 24A to the substrate stage 21B of the temporary pressure bonding device 16 at the second substrate delivery position P2 will be described. In the following description, the flowchart of FIG. 16 and the schematic diagrams of FIGS. 17A to 17H are mainly referred to. For elements not shown in FIGS. 17A to 17H, refer to FIGS. 3 and 7 to 12. FIG.

  As shown in FIG. 17A, the substrate holding sliders 79A and 79B of the substrate transfer device 24A holding the substrate 12 have moved to the second substrate delivery position P2. The valve 86 is opened, and the substrate 12 is held on the substrate mounting arms 82A and 82B of the substrate holding sliders 79A and 79B by the suction force acting on the suction pad 83 from the vacuum source 85. On the other hand, the upper surface of the substrate stage 21B is located at a height position HS1 below the lower surface of the substrate 12 held by the substrate holding sliders 79A and 79B. Further, the valve 86 is opened.

  In step S16-1 of FIG. 16, the substrate stage 21B moves in the −X direction toward the second substrate delivery position P2. As shown in FIG. 17B, the substrate stage 21B moves to a gap G2 between the substrate holding sliders 79A and 79B. As a result, the substrate stage 21B is positioned below the substrate 12 held by the substrate holding sliders 79A and 79B.

  The substrate stage 21B can approach or move to the gap G2 between the substrate holding sliders 79A and 79B only by moving in the −X direction along the transport direction C. In other words, the substrate stage 21B does not need to move in a direction (Y-axis direction) orthogonal to the transport direction C in order to avoid interference with the substrate holding sliders 79A and 79B. Thereby, the substrate 12 can be efficiently transferred at the second substrate delivery position P2. Further, since it is not necessary for the substrate stage 21B to move in the direction orthogonal to the transport direction C for delivery of the substrate 12, the dimensions of the temporary pressure bonding device 16 in the direction orthogonal to the transport direction C can be reduced.

  Next, in step S16-2, the substrate stage 21B is raised. As shown in FIGS. 17B and 17C, the upper surface of the substrate stage 21B rises to a height position HS2 where the upper surface abuts on the lower surface of the substrate 12 held by the substrate holding sliders 79A and 79B.

  After the upper surface of the substrate stage 21B comes into contact with the lower surface of the substrate 12, the valve 36C interposed between the suction pad 31B of the substrate stage 21B and the vacuum source 35B is opened in step S16-3. As a result, the third supported part 12e of the substrate 12 (part away from the first and second mounting regions 12a and 12b) is attracted to the substrate stage 21B by the suction force of the vacuum source 35B acting via the suction pad 31B. Retained. Since the suction pad 31B is in close contact with the lower surface of the substrate 12, the lower surface side of the third supported portion 12e of the substrate 12 is securely held by the substrate stage 21B. Further, the first and second supported portions 12c and 12d are strongly pressed against the rigid body portion 17 to correct the warp.

  Next, in step S16-4, the detection value of the vacuum pressure sensor 37C interposed between the vacuum source 35B and the suction pad 31B is compared with a predetermined threshold value. If the detected value of the vacuum pressure sensor 37C is equal to or greater than the threshold value, that is, if the holding force of the substrate 12 by the suction pad 31B is sufficient, the process proceeds to step S16-5.

  In step S16-5, the valve 36B interposed between the suction hole 73A provided in the rigid portion 71 of the substrate stage 21B and the vacuum source 35B is opened. As a result, the first and second supported parts 12c and 12d (near the first and second mounting areas 12a and 12b) of the substrate 12 are brought into the substrate stage 21B by the suction force of the vacuum source 35B acting through the suction hole 73A. Is adsorbed and retained. Since the lower surface side of the first and second supported portions 12c and 12d of the substrate 12 is reliably supported by the rigid body portion, the first and second mounting regions 12a and 12b are in a state where the warpage is corrected and the flatness is high. Retained.

  After the suction by the suction pad 31B is started in step S16-4 described above, the suction by the suction hole 73A of the rigid body portion 71 is started in step S16-5, so that the substrate 12 is more preferably held on the substrate stage 21B. Can do. More specifically, when the substrate 12 is strongly sucked by the suction pad 31B that hardly causes air leakage, the first and second supported portions 12c and 12d in the vicinity of the first and second mounting regions 12a and 12b are formed on the upper surface of the rigid portion 71. Pressed. If suction by the suction hole 73A is started in this state, air leakage in the suction hole 73A can be prevented, and the lower surface side of the first and second supported parts 12c and 12d can be reliably held by the rigid part 71.

  In step S16-7, the detection value of the vacuum pressure sensor 37B interposed between the vacuum source 35B and the suction hole 73B is compared with a predetermined threshold value. If the detected value of the vacuum pressure sensor 37B is equal to or greater than the threshold value, that is, if the holding force of the substrate 12 by the suction hole 71 of the rigid portion 71 is sufficient, the process proceeds to step S16-8.

  In step S16-8, the valve 86 is closed. As a result, the holding of the substrate 12 by the substrate holding sliders 79A and 79B of the substrate transfer device 24A is released. From the state where the substrate 12 is held on the substrate holding sliders 79A and 79B of the substrate transfer device 24A by the operation of the valves 36B, 36C and 86 in steps S16-3, S16-5 and S16-8, the substrate is moved by the substrate stage 21B. The state is switched to the state where 12 is held.

  If the detection value of the vacuum pressure sensor 37C is less than the threshold value in step S16-4, that is, if the holding force of the substrate 12 by the suction pad 31B is insufficient, 12 warp correction steps by the warp correction device 25A in step S16-6. Execute. Similarly, when the detection value of the vacuum pressure sensor 37B is less than the threshold value in step S16-7, that is, when the holding force of the substrate 12 by the suction hole 73A of the rigid body portion 71 is insufficient, the warp correction process in step S16-9. Execute.

  In the warp correction step of steps S16-6 and S16-9, first, as shown in FIGS. 17C and 17D, the rod 103a of the air cylinder 103 of the warp correction device 25A is lowered from the raised position HP1 to the lowered position HP2. In the lowered position HP2, the buffer pad 105 contacts the upper surface of the substrate 12, and presses the substrate 12 downward against the upper surface of the substrate stage 21B. As a result, the substrate 12 is held on the substrate stage 21B in an appropriate flatness with reduced warpage. After pressing the substrate 12 with the buffer pad 105 for a predetermined time, as shown in FIG. 17E, the rod 103a of the air cylinder 103 returns from the lowered position HP2 to the raised position HP1. By executing the warp correction step, it is possible to prevent the positional deviation of the substrate 12 during delivery due to the warp of the substrate 12. As a result, the precision of the temporary press-bonding process for the substrate 12 in the working unit 23B can be improved. Further, since the leakage is reduced by correcting the warp of the substrate 12, the holding force for the suction pad 31B and the suction hole 73A to suck and hold the substrate 12 on the substrate stage 21B quickly increases. As a result, the time required for delivery of the substrate 12 can be shortened and tact improvement can be achieved.

  In the present embodiment, the warp correction process of steps S16-6 and 16-9 is repeated until the detection values of the vacuum pressure sensors 37B and 37C become equal to or greater than the threshold value in steps S16-4 and S16-7. However, if the detected values of the vacuum pressure sensors 37B and 37C do not exceed the threshold value even after one or more warp correction steps are executed, that is, even if the warp correction step is executed, the substrate 12 is sufficiently attached to the substrate stage 21B. If it cannot be held with a sufficient holding force, error processing such as stopping the operation of the apparatus may be executed.

  After the substrate 12 is held by the substrate stage 21B in step S16-8, the substrate stage 21B is raised in step S16-10 as shown in FIGS. 17E and 17F. The substrate stage 21B rises from the height position HS2 to a height position HS3 above the substrate holding sliders 79A and 79B. When the substrate stage 21B is raised to the height position HS3, the substrate 12 is lifted from the substrate holding sliders 79A and 79B.

  Finally, in step S16-11, the substrate stage 21B holding the substrate 12 moves from the second substrate delivery position P2 to the working unit 23B. Specifically, as shown in FIG. 17G, first, the substrate stage 21B moves in the + X direction (conveyance direction C) and moves away from the gap G2 between the substrate holding sliders 79A and 79B. At this time, the substrate stage 21B does not need to move in a direction (Y-axis direction) orthogonal to the transport direction C in order to avoid interference with the substrate holding sliders 79A and 79B. Next, the substrate stage 21B separated from the substrate delivery position P2 descends to the height position HS1 as shown in FIG. 17H and moves toward the working unit 23B. With the above operation, the transfer of the substrate 12 from the substrate transfer device 24A to the substrate stage 21B of the temporary pressure bonding device 16 at the second substrate delivery position P2 is completed.

  Next, transfer of the substrate 12 from the substrate stage 21B to the substrate transfer device 24B at the third substrate delivery position P3 will be described. In the following description, the flowchart of FIG. 18 and the schematic diagrams of FIGS. 19A to 19D are mainly referred to. For elements not shown in FIGS. 19A to 19D, refer to FIGS. 3 and 7 to 12. FIG.

  As shown in FIG. 19A, the substrate holding sliders 79A and 79B of the substrate transport apparatus 24B have moved to the third substrate delivery position P3. The valve 86B is closed. On the other hand, the valves 36B and 36C are open, and the substrate 12 is held on the substrate stage 21B by the suction force of the vacuum source 35B acting via the suction hole 73A and the suction pad 31B. The substrate stage 21B is located at the height position HS3.

  In step S18-1 of FIG. 18, the substrate stage 21B moves in the + X direction toward the third substrate delivery position P3. As shown in FIGS. 19A and 19B, the substrate stage 21B moves to a gap G2 between the substrate holding sliders 79A and 79B. As a result, the substrate stage 21B and the substrate 12 are positioned above the substrate holding sliders 79A and 79B.

  Next, in step S18-2, the substrate stage 21B is lowered. As shown in FIGS. 19B and 19C, the substrate stage 21B descends from the height position HS3 to the height position HS2. As a result, the lower surface of the substrate 12 held on the substrate stage 21B comes into contact with the upper surfaces of the substrate holding sliders 79A and 79B.

  After the lower surface of the substrate 12 comes into contact with the substrate holding sliders 79A and 79B, the valve 86 is opened in step S18-3. As a result, the suction force of the vacuum source 85 acts on the lower surface of the substrate 12 via the suction pad 83, and the substrate 12 is sucked and held by the substrate holding sliders 79A and 79B of the substrate transfer device 24B. Subsequently, in step S18-4, the valve 36B is closed. As a result, the holding of the first and second supported parts 12c and 12d of the substrate 12 by the suction holes 73A of the rigid part 71 (parts in the vicinity of the first and second mounting regions 12a and 12b) is released. Further, in step S18-5, the valve 36C is opened. As a result, the holding of the third supported part 12e (parts away from the first and second mounting regions 12a and 12b) of the substrate 12 by the suction pad 31B is released. By operating the valves 36B, 36C, 86 in steps S18-3, S18-4, S18-5, the substrate 12 is held on the substrate holding slider 79A, 79B of the substrate transport apparatus 24A from the state where the substrate 12 is held on the substrate stage 21B. The state is switched to the state where 12 is held.

  In step S18-6, the substrate stage 21B is lowered to the height position HS1, and the substrate stage 12 is separated from the lower surface of the substrate 12. Thereafter, in step S18-7, the substrate stage 21 moves in the −X direction and moves from the third substrate delivery position P3 to the second substrate delivery position P2. With the above operation, the transfer of the substrate 12 from the substrate stage 21B to the substrate transfer device 24B at the third substrate delivery position P3 is completed.

The perspective view of the component mounting apparatus which concerns on embodiment of this invention. 1 is a schematic plan view of a component mounting apparatus according to an embodiment of the present invention. The perspective view of a LCD panel. The fragmentary perspective view of an ACF sticking apparatus. The block diagram of an ACF sticking apparatus. The perspective view which shows the board | substrate stage of an ACF sticking apparatus. Typical sectional drawing in the VI-VI line of FIG. The perspective view of an XYZθ table. The perspective view of a temporary crimping | compression-bonding apparatus, a 1st regular crimping apparatus, and a 2nd regular crimping apparatus. The block diagram of a temporary crimping | compression-bonding apparatus, a 1st regular crimping apparatus, and a 2nd regular crimping apparatus. The perspective view which shows the board | substrate stage of a temporary crimping | compression-bonding apparatus. FIG. 11 is a schematic cross-sectional view taken along line XX in FIG. 10. The perspective view of a board | substrate conveyance apparatus. The perspective view of a curvature correction apparatus. The perspective view which shows the board | substrate stage of a 1st book crimping | compression-bonding apparatus. FIG. 14 is a schematic cross-sectional view taken along line XIII-XIII in FIG. 13. The perspective view which shows the substrate stage of a 2nd this crimping | compression-bonding apparatus. FIG. 15 is a schematic cross-sectional view taken along line XIV-XIV in FIG. 14. The disassembled perspective view which shows the board | substrate panel of a temporary crimping | compression-bonding apparatus, and two conveying apparatuses before and behind that. The flowchart for demonstrating the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The typical side view which shows the transfer procedure of the board | substrate from a board | substrate conveyance apparatus to a panel stage. The flowchart for demonstrating the transfer procedure of the board | substrate from a panel stage to a board | substrate conveyance apparatus. The typical side view which shows the transfer procedure of the board | substrate from a panel stage to a board | substrate conveyance apparatus. The typical side view which shows the transfer procedure of the board | substrate from a panel stage to a board | substrate conveyance apparatus. The typical side view which shows the transfer procedure of the board | substrate from a panel stage to a board | substrate conveyance apparatus. The typical side view which shows the transfer procedure of the board | substrate from a panel stage to a board | substrate conveyance apparatus. The fragmentary perspective view of the conventional component mounting apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Component mounting apparatus 12 Board | substrate 12a 1st mounting area | region 12b 2nd mounting area | region 12c 1st supported site | part 12d 2nd supported site | part 12e 3rd supported site | part 13 Components 15 ACF sticking apparatus 16 Temporary crimping apparatus 17 1st this crimping apparatus 18 2nd crimping device 21A, 21B, 21C, 21D Substrate stage 22A, 22B, 22C, 22D XYZθ table 23A, 23B, 23C, 23D Working part 24A, 24B, 24C Substrate transport device 25A, 25B, 25C Warp correction device 26 Loader 27 Unloader 28A, 28B Controller 29A, 29B Operation panel 31A, 31B, 31C, 31D Suction pad 35A, 35B, 35C, 35D Vacuum source 36A, 36B, 36C, 36D, 36E, 36F, 36G Valve 37A, 37B, 37C, 37D, 37E, 7F, 37G Vacuum pressure sensors 38A, 38B, 38C, 38D Circular hole 41 X-axis drive mechanism 42 Y-axis drive mechanism 43 Z-axis drive mechanism 44 θ-axis drive mechanism 45A, 45B Linear motion rail 46 Slider 47 Ball screw 48 Motor 51A, 51B linear motion rail 52 slider 53 ball screw 54 motor 55A, 55B linear motion rail 56 slider 57A, 57B pulley 58 belt 59 motor 61 motor 62 rotating shaft 63A, 63B, 63C, 63D backup stage 64 ACF supply portion 65 ACF sticking head 66 Panel setting device 67A, 67B Under camera 71 Rigid body portion 72 Recessed portion 73A, 73B, 73C Adsorption hole 75 Base 76A, 76B Support structure 77A, 77B Beam structure 78A, 78B Linear motion rail 79A, 79B Substrate holding slider 81A, 81B Slider body 82A, 82B Substrate mounting arm 83 Suction pad 84 Suction flow path 85 Vacuum source 86 Valve 87 X-axis drive mechanism 88 Motor 89 Drive shaft 91 Belt 92A, 92B Pulley 93 Drive pulley 94 Driven pulley 95 Drive bell and 96A, 96B Limit switch 97 Switch operation piece 101 Support beam 102 Support arm 103 Air cylinder 103a Rod 104 Bracket 105 Buffer pad 106 Air source 107 Valve 108 Bolt 109 Nut 110 Anti-rotation 111 Stop hole 112A, 112B Regulating member 115 Parts supply device 116 Reversing device 117, 118 Component transfer device 119 Temporary pressure bonding head 125A, 125B Support portion 126, 127 This pressure bonding head

Claims (6)

A working unit (23A, 23B, 23C, 23D) for performing a mounting operation on the mounting region (12a, 12b) of the substrate (12);
A substrate stage (21A, 21B, 21C, 21D) for holding the lower surface side of the substrate;
A substrate stage moving unit (22A, 22B, 22C, 22D) for moving the substrate stage so that the mounting area is positioned with respect to the working unit;
The substrate stage is mounted on the lower surface side of the first portion (12b, 12c) of the substrate in the vicinity of the mounting area, and suction holes (73A, 73B, 73C) for sucking the lower surface side of the substrate are formed. Rigid body portion (71),
A suction pad (31B, 31C, 31D) having a flexibility for placing the lower surface side of the second portion (12e) of the substrate excluding the first portion, and for sucking the lower surface side of the substrate; A component mounting apparatus comprising: A first vacuum suction mechanism (73A, 34B, 37B, 36B, 35B; 73B, 34D, 37D, 36D, 35C; 73C, 34F, 37F, 36F, 35D) that applies a suction force to the suction holes in a releasable manner )When,
A second vacuum suction mechanism (31B, 34C, 37C, 36C, 35B; 31C, 34E, 37E, 36E, 35C; 31D, 34G, 37G, 36G, 35D) that applies a suction force to the suction pad in a releasable manner The component mounting apparatus according to claim 1, further comprising: A first substrate transfer device (24A, 24B, 24C) for carrying the substrate into the substrate stage;
When the substrate is carried into the substrate stage from the first substrate transfer device, a suction force is applied to the suction pad from the second vacuum suction mechanism, and then from the first vacuum suction mechanism. The component mounting apparatus according to claim 2, further comprising: a control unit (28A, 28B) that applies a vacuum suction force to the suction hole. A second substrate transfer device (24A, 24B, 24C) for unloading the substrate from the substrate stage;
The controller stops the vacuum suction force from the first vacuum suction mechanism to the suction hole when unloading the substrate from the substrate stage to the second substrate transport apparatus, and then The component mounting apparatus according to claim 3, wherein a vacuum suction force from the vacuum suction mechanism to the suction pad is stopped. A component mounting method for performing a mounting operation on a mounting region (12a, 12b) of a substrate (12),
The lower surface side of the first part (12c, 12d) in the vicinity of the mounting area of the substrate is disposed on the rigid part (71) of the substrate stage (21B, 21C, 21D), and the second area excluding the mounting area of the substrate. The substrate is placed on the substrate stage such that the lower surface of the part (12e) is placed on the suction pads (31B, 31C, 31D) of the substrate stage,
A vacuum suction force is applied to the suction pad to suck and hold the second part of the substrate on the substrate stage,
A vacuum suction force is applied to the suction hole formed in the rigid body portion to attract and hold the second portion of the substrate to the rigid body portion of the substrate stage,
Moving the substrate stage holding the substrate by suction so that the mounting area is positioned with respect to the working unit;
The component mounting method comprising performing the mounting operation on the mounting region by the working unit. After completion of the mounting work by the working unit,
Move the substrate stage that sucks and holds the substrate so that the mounting area is away from the work,
Stop the vacuum suction force to the suction hole formed in the rigid body part, and release the suction holding to the substrate stage of the first part of the substrate,
Stop the vacuum suction force to the suction pad, release the suction holding of the second part of the substrate to the substrate stage,
The component mounting method according to claim 5, wherein the substrate is removed from the substrate stage.

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