KR101182576B1 - Flip chip bonding method - Google Patents

Abstract

The present invention relates to a substrate transfer apparatus for flip chip bonding and a flip chip bonding method using the same, the substrate transfer apparatus used to bond a flip chip obtained by dividing a wafer onto a substrate, comprising: a frame; A first guide rail fixed to the frame; A second guide rail fixed to the frame at a lower side of the first guide rail; And a first suction unit for sucking and fixing the first substrate, and a first suction unit for applying suction pressure through suction holes penetrating through the first holder to fix and mount the first substrate on the first holder. A first station moving along the first guide rail to be positioned at a first position where a flip chip is bonded on the first substrate; And a second suction unit for sucking and fixing the second substrate and a second suction unit for applying suction pressure through the suction hole penetrated through the second holder to fix and mount the second substrate on the second holder. And a second station moving in the vertical direction and the second guide rail so as to be positioned in a second position where a flip chip is bonded on the second substrate. It is configured to provide a flip chip bonding substrate transfer apparatus and a flip chip bonding method using the same, which improves the efficiency of the process by performing the process of bonding the flip chip on the substrate more quickly.

Description

Flip Chip Bonding Method {FLIP CHIP BONDING METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip bonding method, and more particularly, to a flip chip bonding method in which a step of bonding a flip chip on a substrate is performed more quickly to improve the efficiency of the process.

In general, semiconductor devices include a fab process that forms a circuit including electrical elements on a semiconductor substrate, an electrical die sorting (EDS) process that inspects electrical characteristics of a semiconductor device manufactured in the fab process, and a fab process and an EDS test. Each of the completed semiconductor devices is manufactured through a package assembly process of encapsulating and individualizing epoxy resins. In this case, the package assembling process is performed by sawing or laser cutting and separating the substrate by flip chip unit, and then cutting the flip chip on a substrate called a strip or a boat. After bonding to the mounting (bonding) is made of a molding (molding) and cutting process. At this time, the substrate includes both the flip chip itself, which is placed on the material transport tray, and the semiconductor chip, the assembly of the electronic device, and the like, in which the flip chip is mounted and bonded.

At this time, the semiconductor package assembly apparatus seats a picker apparatus for picking up, flipping and transferring the flip chip dividedly cut from the wafer, and a transfer module for transferring the flip chip transferred by the picker device to the mounting part and the flip chip is mounted on the mounting part. And a bonding unit for bonding. Here, the picker device is used in a process requiring a pick and place process, such as the transfer and package of the flip chip, as well as the transfer and supply of the package, the handler and the handler for picking up the flip chip It consists of a drive unit for driving and movement of.

The flip chips held and transported by the picker device are bonded while being mounted on a substrate called a strip or a boat. The process in which the flip chip is divided from the wafer and mounted on the substrate and bonded is as follows.

As shown in FIG. 1A, when a substrate 10 such as a wafer is divided into a plurality of flip chips 20a, 20b, and 20c; 20, the picker apparatus for transferring a conventional flip chip shown in FIG. 30 is positioned above the one flip chip 20 to be moved and moved near the divided substrate 10. At this time, the flip chip 20 to be transferred among the many flip chips generated is separated from the neighboring flip chips by a force pushing up from the bottom to the upper portion 20d and protrudes upward slightly, and the picker device 30 ) Grips the flip chip 20 by applying suction pressure to the gripping portion 30a.

Then, the flip chip 20 flip-held by the picker device 30 is not shown in the figure, but the flux is buried on one surface and then transferred to the flux chip bonding substrate transfer device 50 shown in FIG. The flux chip 20 is bonded onto the substrate 70 by laying down the flip chip 20 on the substrate 70 prepared in the flip chip bonding substrate transfer apparatus 50 as shown in FIG. At this time, the gripper 30a of the picker device 30 may transfer the flip chip 20 and bond it directly onto the substrate 70. The picker device 30 may flip the chip onto a loading table (not shown). After depositing the flux chip 20 may be bonded to the substrate 70 by a separate transfer module 40.

Here, in the conventional flip chip bonding substrate transfer apparatus 50, as shown in FIGS. 1C and 2, the suction pressure 52p is used to fix the substrate during the bonding process in the area BA to which the flip chips 20 are bonded. The suction unit 52 is provided with a plurality of suction ports 53 acting, and is configured to transfer the substrate 70 to the conveyor belt 51 above the suction unit 52. At this time, the conveyor belt 51 is operated to advance by rotating the drive pulley 51p by the drive motor 51m, so that the substrate 70 supplied to the upper surface of the conveyor belt 51 of the suction unit 52 is removed. Move upward

Then, when the substrate 70 mounted on the conveyor belt 51 is transferred to the upper side of the suction unit 52 according to the movement of the conveyor belt 51 in the direction indicated by reference numeral 70d, the suction port of the suction unit 52 ( Suction pressure 52p acts on 52a). Accordingly, the substrate 70, which is the object of the bonding process, is fixed by the suction pressure 52p while the conveyor belt 51 moves downward. At this time, as shown in FIG. 3, the conveyor belt 51 is fixed. Since the posture of the substrate 70 to be sucked and fixed is rotated or moved in the direction indicated by 70r, the process of aligning the posture of the substrate 70 on the suction unit 52 was essentially accompanied.

Furthermore, when bonding the first flip chip and the second flip chip of different sizes or shapes to one substrate by using the conventional flip chip bonding substrate transfer apparatus 50 shown in FIG. Since the chips must be bonded on different conveyor belts 51, the process is delayed and the efficiency is lowered. In addition, in the process of bonding flip chips of different sizes to the substrate, posture alignment of the substrate is required each time the flip chips are bonded, thereby causing a problem in that the efficiency of the process is further reduced.

Accordingly, the process of bonding the flip chip 20 divided from the wafer 10 to various types of substrates 70 takes a long time, and thus, the efficiency of the process is degraded.

In order to solve the above problems, the present invention provides a flip chip bonding substrate transfer apparatus and a flip chip bonding method using the same to improve the efficiency of the process by performing a process of bonding the flip chip on the substrate more quickly. The purpose.

In addition, an object of the present invention is to enable a process of bonding different kinds of flip chips on a single substrate more quickly and efficiently.

Another object of the present invention is to provide a substrate transfer apparatus for flip chip bonding in a compact structure, which can perform two or more flip chip bonding processes at one time and takes up less space.

At the same time, an object of the present invention is to be able to bond two or more flip chips on a substrate at the same time, but to be able to manufacture a transfer module for supplying flip chips to the substrate as a single unified module without different configurations.

In order to achieve the object of the present invention as described above, the present invention is a substrate transfer apparatus used to bond a flip chip obtained by dividing a wafer onto a substrate, comprising: a frame; A first guide rail fixed to the frame; A second guide rail fixed to the frame at a lower side of the first guide rail; And a first suction unit for sucking and fixing the first substrate, and a first suction unit for applying suction pressure through suction holes penetrating through the first holder to fix and mount the first substrate on the first holder. A first station moving along the first guide rail to be positioned at a first position where a flip chip is bonded on the first substrate; And a second suction unit for sucking and fixing the second substrate and a second suction unit for applying suction pressure through the suction hole penetrated through the second holder to fix and mount the second substrate on the second holder. And a second station moving in the vertical direction and the second guide rail so as to be positioned in a second position where a flip chip is bonded on the second substrate. Provided is a substrate transfer apparatus for flip chip bonding, comprising a configuration.

In order to transfer the substrate to the first position and the second position where the bonding process of the flip chip is carried out, the first suction unit and the second suction unit capable of suction-fixing the substrate to the first station and the second station, respectively, are provided. It is provided to move the first position and the second position in a fixed state and the position of the substrate, the posture is shifted in the position fixing process of the substrate in the position to perform the bonding process to the substrate by transferring the substrate by the conveyor belt The problem is solved.

That is, even if the alignment process of the substrate is performed only once when placing the substrate in the station, the position and attitude of the substrate do not change when the bonding process is performed in the first position and / or the second position. Since the process of aligning the position and posture can be omitted, the efficiency of the bonding process of the flip chip can be improved and the time required for the bonding process can be shortened.

In addition, as the first guide rail and the second guide rail for guiding the movement of the first station and the second station as described above are spaced apart vertically, the first station and the second station where the bonding process of the flip chip is performed Advantageously, it is possible to implement a bonding process of two or more flip chips, including a compact structure, which takes up less space.

Furthermore, the second station is configured to move in the horizontal direction along a second guide rail located below the first guide rail for guiding the horizontal movement of the first station, while the second station reaches the first guide rail. Since it is configured to be movable up and down as much as possible, the first station can be located in both the first position and the second position, and the second station can also be located in both the first position and the second position, The substrates may be bonded by being supplied with different flip chips in different first and second positions, respectively.

In this process, the alignment of the substrate needs to be performed only when it is fixed to the station. After that, the substrate is moved in a fixed state to the cradle of the station, thereby eliminating the conventional alignment process in the first and second positions. Therefore, the process of bonding different types of flip chips to the substrate can achieve an advantageous effect that can be performed in a remarkably quick way as compared with the prior art.

At this time, the first drive unit for driving the first station to move along the first guide rail; A second driving unit which drives the second station to move along the second guide rail; A third driving unit for moving the second substrate fixed to the second station up and down is provided.

The second position is located at the same height as the first position, so that the transfer module for supplying the flip chip in the first position and the transfer module for supplying the flip chip in the second position may use the same specifications. This is because the transfer modules for bonding the flip chip to the substrate fixed on the station independently from each other at different positions allow the transfer modules of the same specification to be used, so as to design, manufacture, install and install the transfer modules. The driving program to control and the like can be unified, so that it is possible to reduce the cost and time required to operate the transfer module in the transfer device for flip chip bonding.

In addition, the second position is located on the movement path of the first station, so that the first station can also be located in the second position. As a result, the first substrate fixed to the first station may be moved to the second position, and the flip chip supplied by the transfer module operating in the second position may be bonded.

Similarly, the second guide rail is arranged such that the second station can be located in the first position. As a result, the second station can also be positioned in the first position in parallel with the horizontal movement and the upward movement, so that the second substrate fixed to the second station also moves to the first position to operate in the first position. Flip chips supplied by can be bonded.

The first guide rail and the second guide rail are preferably arranged in parallel with each other in order to effectively implement such a configuration and to implement a more compact substrate transfer apparatus for flip chip bonding.

In order for the first station to firmly hold the first substrate, a plurality of suction holes in which suction pressure is applied by the first suction unit are formed in the first cradle, and the second station firmly grips the second substrate. A plurality of suction holes in which the suction pressure acts by the second suction unit is formed in the second cradle.

The first station may move along the first guide rail by means of a lead screw, a linear drive actuator, or the like, but it is preferable to control the position accurately by reducing the number of parts and generating play. To this end, the rotor is made of a coil to which the first permanent magnet piece is alternately fixed to the N pole and the S pole, and a current is applied to the first station so as to face the first permanent magnet piece. In the first drive unit, the first station can move independently along the principle of the linear motor along the first guide rail. As a result, the first station can be precisely positioned in a compact structure.

Similarly, the second driving unit is also installed on a plurality of second permanent magnet pieces fixed to the second guide rail and the second moving body of the second station so as to face the second permanent magnet pieces, and a current is applied thereto. With a rotor made of coils, the second station is independently controlled to move on the principle of a linear motor along the second guide rail.

On the other hand, in order to transfer the second substrate in the vertical direction so that the second substrate seated on the second cradle of the second station can reach the first position located on the path of the first station, the second station A third moving body moving up and down with respect to the second moving body; And a third guide rail fixed to the second moving body to guide the vertical movement of the third moving body.

The third driving unit independently moves the third moving body by a pneumatic cylinder actuator so that the third moving body moves along the third guide rail. In order to prevent the third moving body from being shaken during the vertical movement, the third guide rail meshes with the third moving body with a precise dimension to assist the vertical moving reciprocating movement without shaking.

At least one of the first substrate and the second substrate may be a strip in which a plurality of identical flip chips are bonded. At least one of the first substrate and the second substrate may be a boat including a tray and a die fixed thereto. Here, when the substrate to which the flip chip is bonded is a boat, the flip chip is bonded to a plurality of dies fixed to the tray.

That is, the term 'substrate' described in the present specification and claims includes all forms in which flip chips are bonded, such as strips, boats, flip chips themselves placed on material transport trays, assembled semiconductor packages, and electric element substrates. do.

At this time, one flip chip may be seated on the die, but the first flip chip and the second flip chip having different sizes may be bonded. In this case, although both the first flip chip and the second flip chip may be bonded to the die in one position, changing the shape of the flip chip in the transfer module may hinder the process flow and reduce the time required for the bonding process. Since the first flip chip is bonded to the die at the first position in the first position, it is effective in terms of improving the efficiency of the process.

On the other hand, according to another field of the invention, the present invention, a method of bonding the flip chip to the first substrate and the second substrate, the first substrate is supplied to the first station by the suction pressure sucked from below the first base Fixing the first substrate; Moving the first station to a predetermined first position; Bonding a flip chip on the first substrate in the first position; Supplying a second substrate to a second station to fix the second substrate with a suction pressure sucked from under the second cradle; Moving the second station to a predetermined second position located at the same height as the first position and at a location reachable by the first station and the second station; Bonding a flip chip onto the second substrate in the second position; It provides a flip chip bonding method comprising a.

At this time, the first position and the second position are located at the same height, the transfer module for supplying the flip chip in the first position and the transfer module for supplying the flip chip in the second position to transfer the same specification By using the module, it is possible to reduce the cost and time required to install and operate the transfer module used in the flip chip bonding process.

The first station is driven to move horizontally, and the second station moves up and down so that the second station moves horizontally under the moving path of the first station to be positioned on the path of the first station. The efficiency of the flip chip bonding process can be improved in that the second station and the second station can be independently positioned in the first position and the second position, respectively.

On the other hand, the present invention is a method of bonding the flip chip to the first substrate of the first flip chip and the second flip chip of different sizes, the first substrate is supplied to the first station is sucked from below the first cradle Fixing the first substrate by suction pressure; Moving the first station to a predetermined first position; Bonding a first flip chip onto the first substrate in the first position; Moving the first station to a second predetermined position; Bonding a second flip chip onto the first substrate in the second position; It provides a flip chip bonding method comprising a.

As described above, in bonding the first flip chip and the second flip chip having different sizes or shapes onto one first substrate, the first substrate may be positioned in the first position after the first substrate is fixed to the first station. By bonding the flip chips and bonding the second flip chips in the second position, flip chips having different sizes or shapes can be quickly bonded to one substrate without impairing the efficiency of the process.

At this time, supplying a second substrate to the second station to fix the second substrate by the suction pressure sucked from below the second cradle; Bonding the flip chip at the second position by the second station while bonding the first substrate to the flip chip at the first position; It may further include. Similarly, supplying a second substrate to the second station to fix the second substrate to the suction pressure sucked from below the second cradle; Bonding the flip chip in the first position while the first substrate bonds the flip chip in the second position; It may further include.

Then, the first station is driven to move horizontally, and the second station acts to move horizontally below the movement path of the first station and to move up and down to be located in the path of the first station.

On the other hand, the present invention is a substrate transfer apparatus used to bond a flip chip obtained by dividing a wafer onto a substrate, comprising: a frame; A first guide rail fixed to the frame; A second guide rail fixed to the frame at a lower side of the first guide rail; A first station having a first mounting base to fix the first substrate, the first station moving along the first guide rail so as to be positioned in a first position where a process of bonding flip chips on the first substrate is performed; And a second cradle for sucking and fixing the second substrate, and moving the second guide rail and the vertical direction so that the second substrate can be positioned in a second position in which a flip chip is bonded on the second substrate. 2 stations; And a second station may be located in the first position, and the first station may be located in the second position.

At this time, the first position and the second position is preferably located at the same height.

In addition, the second position is effectively located on the movement path of the first station.

The first guide rail and the second guide rail may be arranged in parallel to each other to greatly improve the efficiency of the bonding process while minimizing the space occupied by the device.

As described above, in the present invention, in transferring a substrate to a first position and a second position where a flip chip bonding process is performed, a first substrate capable of suction-fixing the substrate to the first station and the second station, respectively; Since the suction unit and the second suction unit move to the first position and the second position with the position and posture of the substrate fixed, the first and second alignment steps are performed even when the substrate is aligned only once when the substrate is placed in the station. Since the position and posture of the substrate do not change when the bonding process is performed at the position and / or the second position, the process of aligning the position and posture at the position at which bonding is conventionally performed can be omitted, and thus, the bonding process of the flip chip is performed. An advantageous effect can be obtained that can improve the efficiency and shorten the time required for the bonding process.

That is, the present invention provides a flip chip bonding substrate transfer apparatus and a flip chip bonding method using the same, which improves the efficiency of the process by performing the process of bonding the flip chip on the substrate more quickly.

In addition, the present invention includes a first station and a second station in which the bonding process of the flip chip is performed as the first guide rail and the second guide rail guiding movement of the first station and the second station are vertically spaced apart from each other. Thus, the bonding process of two or more flip chips can be performed, and a compact structure that takes up less space can be implemented.

In addition, the present invention is configured to move the second station in the horizontal direction along the second guide rail located below the first guide rail for guiding the horizontal movement of the first station, and at the same time the second station is the first guide Because it is configured to move up and down enough to reach the rails, the first station can be located in both the first and second positions, and the second station can also be located in both the first and second positions. Thus, one substrate may be bonded by receiving different flip chips in different first and second positions, respectively.

In this process, the alignment of the substrate needs to be performed only when it is fixed to the station. After that, the substrate is moved in a fixed state to the cradle of the station, thereby eliminating the conventional alignment process in the first and second positions. Therefore, the process of bonding different types of flip chips to the substrate can achieve an advantageous effect that can be performed in a remarkably quick way as compared with the prior art.

That is, the present invention obtains an advantageous effect that the process of bonding different kinds of flip chips onto one substrate can be performed more quickly and efficiently.

In addition, the present invention is transferred to the first stage and the second stage so as to receive the flip chip in any one of the first position and the second position to perform the bonding process, while bonding the two or more flip chips on the substrate at once. In addition, it is possible to manufacture the transfer module for supplying the flip chip to the board as a single unified module, thereby reducing the cost of constructing the transfer module and sharing the control program of the transfer module with each other. This also benefits from ease of maintenance.

1A to 1C are schematic diagrams sequentially illustrating a configuration of bonding a flip chip to a substrate using a conventional picker apparatus.
FIG. 2 is a perspective view showing a configuration of an apparatus for transferring a flip chip bonding substrate of FIG. 1C
Figure 3 is a schematic diagram showing the phenomenon when the substrate adsorption of the substrate transfer device for flip chip bonding
Figure 4a is a perspective view showing the configuration of the substrate transfer apparatus for flip chip bonding according to an embodiment of the present invention
4B is a front view of FIG. 4A
4C is a top view of FIG. 4A
FIG. 5 is a perspective view showing a configuration excluding the substrate supply portion, the substrate ejection portion, and the substrate from the apparatus of FIG. 4A; FIG.
6 is an enlarged view of portion 'A' of FIG.
7 is an enlarged view of a portion 'B' of FIG.
8 is a partial cross-sectional view taken along the cutting line CC of FIG.
Figure 9 is a front view of Figure 5
10 is a right side view of FIG.
FIG. 11A illustrates a configuration in which a boat-shaped first substrate is seated in the first station of FIG. 4A.
FIG. 11B is a view showing another configuration in which a boat-shaped first substrate is seated in the first station of FIG. 4A
FIG. 11C is a view showing a configuration in which a strip-shaped second substrate is seated in the second station of FIG. 4A;
FIG. 11D illustrates a process of bonding flip chips to a strip substrate. FIG.
12 is a flowchart sequentially illustrating a flip chip bonding method according to the first embodiment of the present invention.
13A to 13D sequentially illustrate the configuration of the flip chip bonding method of FIG.
14 is a flowchart sequentially illustrating a flip chip bonding method according to a second embodiment of the present invention.
15A to 15D sequentially illustrate the configuration of the flip chip bonding method of FIG.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

However, the present invention is not limited or limited by the embodiments described below, and detailed descriptions of well-known functions or configurations will be omitted for clarity.

Figure 4a is a perspective view showing the configuration of a flip chip bonding substrate transfer apparatus according to an embodiment of the present invention, Figure 4b is a front view of Figure 4a, Figure 4c is a plan view of Figure 4a, Figure 5 is from the apparatus of Figure 4a FIG. 6 is an enlarged view of portion 'A' of FIG. 5, FIG. 7 is an enlarged view of portion 'B' of FIG. 5, and FIG. 8 is of FIG. 9 is a front sectional view of FIG. 5, FIG. 10 is a right side view of FIG. 9, and FIG. 11A is a view showing a configuration in which a boat-shaped first substrate is seated in the first station of FIG. FIG. 11B illustrates another configuration in which a boat-shaped first substrate is seated in the first station of FIG. 4A. FIG. 11C is a configuration in which a second substrate in strip form is seated in the second station of FIG. FIG. 11D illustrates a process of bonding flip chips to a strip-shaped substrate.

As shown in the figure, the substrate transfer apparatus 100 for flip chip bonding according to an embodiment of the present invention is installed on the frame 101, one end of the frame 101 is provided to the substrate (S1, S2 ..) The first guide rail 10R and two rows of first guide rails 10R arranged in the horizontal direction and fixed to the frame 101 and the first guide rail 10R are arranged in a horizontal direction. The second guide rails 20R arranged in the horizontal direction at the lower side and fixed to the frame 101 and the substrates S1, S2, ... are supplied and sucked from the substrate supply unit 102 to position and posture. The first station 110 to be transported along the first guide rail 10R while being fixed and the substrates S1, S2,... When bonding of the flip chip is completed on the second station 120 and the substrates S1, S2, .. fixed to the first station 110 and the second station 120 transferred along the guide rail 20R.It consists of a substrate discharging portion 103 for discharging the plates (S1, S2, ..).

The substrate supply unit 102 receives the substrates S1, S2,... To bond the flip chip 20 .. from the outside in the direction indicated by reference numeral Sd1, so that the flip chip 20 is disposed at the substrate mounting unit 102a. The substrate S1 ′ to be bonded is moved onto the first holder 111 of the first stage 110 and the second holder 121 of the second stage 120, and aligned in a predetermined posture and position. It is positioned on the first cradle 111 and the second cradle 121.

The first guide rails 10R are elongated in the horizontal direction, and two rows are installed on the left and right sides. As shown in FIG. 8, the first permanent magnet pieces 10M of the N pole and the S pole are alternately arranged in the first guide rail 10R along the length direction, and the first movement of the first station 110 is performed. The first rotor 113R made of a coil is installed on the body 113, and the first permanent magnet piece installed on the first guide rail 10R by applying a current to the first rotor 113R of the first station 110. The first station 110 is moved along the first guide rail 10R in the direction indicated by reference numeral 110d by the magnetic force interaction between the 10M and the first rotor 113R.

That is, the first driving unit which drives the first station 110 to move along the first guide rail 10R may face the first permanent magnet piece 10M arranged along the first guide rail 10R. The first rotor 113R provided in the first moving body 113, and a control unit for controlling the current applied to the first rotor 113R.

The second guide rail 20R is arranged to be elongated in the horizontal direction while being parallel to the first guide rail 10R, and the second station 120 may move horizontally at a position lower than the first guide rail 10R. Two rows are installed up and down at a position lower than one guide rail 10R. Similar to the first guide rail 10R, the second permanent magnet pieces 20M of the N pole and the S pole are alternately arranged along the length direction in the second guide rail 20R, and the second guide 120 of the second station 120 is arranged. The second moving body 124 is provided with a second rotor (not shown) made of a coil, and the second guide rail 20R by applying a current to the second rotor of the second station 120 through the current supply line 124a. The second station 120 is moved along the second guide rail 20R in the direction indicated by reference numeral 120d by the magnetic force interaction between the second permanent magnet piece 20M and the second rotor.

That is, the second driving unit which drives the second station 120 to move along the second guide rail 20R may face the second permanent magnet piece 20M arranged along the second guide rail 20R. A second rotor (not shown) installed in the second moving body 124, and a control unit for controlling the current applied to the second rotor.

As shown in FIG. 6, the first station 110 is mounted on the first cradle 111 and the first cradle 111 to suck and hold the substrate S1, S2,. A first suction unit 112 and a first suction unit 112 for applying suction pressure through a plurality of suction holes 111a formed through the first holder 111 to suck the substrates S1, S2,. And a first moving body 113 provided with a first rotor 113R to move along the first guide rail 10R and a current supply line 114 for applying current to the first rotor 113R. It is composed.

As shown in FIG. 8, the first suction unit 112 is connected to a suction pipe 112a to which the suction pressure 112p is applied from the outside, so that the space 112c between the first holder 111 is lower than atmospheric pressure. It is formed into a vacuum chamber in which negative pressure is formed. Therefore, when the substrates S1, S2,... Are supplied from the substrate supply unit 102 onto the first holder 111, the substrates S1, S2 .. .. on the first holder by the alignment means (not shown). .) After the position and posture are aligned, the suction pressure 112p is applied to the suction pipe 112a and directly passes through the substrates S1, S2, .. through the suction hole 111a formed in the first cradle 111. Pull out and fix it on the first holder 111.

As such, the substrates S1 and .. suction-fixed while aligned on the first holder 111 are attached to the first holder 111 until all the flip chips scheduled to the substrates S1 and. Since it is in a fixed suction state, even if bonding processes are performed in the first position 10B and the second position 20B where the bonding process of the flip chip 20 is performed, the alignment process of the additional substrates S1, .. Is not needed.

As shown in FIG. 7, the second station 120 is mounted on the second cradle 121 and the second cradle 121 for suction-fixing while the substrates S1, S2,. A second suction unit 122 and a second holder 121 for applying suction pressure through a plurality of suction holes 121a formed through the second holder 121 to suck the substrates S1, S2, .. And a third guide body 125 for guiding the third moving body 123 to move up and down with the second suction unit 122, and to move the third moving body 123 to the up and down direction 123d. And, together with these (121-123, 125) is composed of a second moving body 124 moving along the second guide rail (20R).

Here, the third guide rail 125 is integrally fixed to the second moving body 124 and moves in the horizontal direction 120d together with the second moving body 124. The third guide rail 125 is formed to have a size that corresponds to the hole of the third moving body 123 with precise dimensions so that the third moving body 123 can move up and down without swinging. In addition, although not shown in the drawing, the third moving body 123 is conveyed in the up and down direction indicated by reference numeral 123d along the third guide rail 125 by a high-precision pneumatic cylinder actuator.

In addition, similar to the action of the first suction unit 112, the second suction unit 122 has a suction pipe to which the suction pressure is applied from the outside, the negative pressure lower than the atmospheric pressure is formed in the space between the second cradle 121 It is formed into a vacuum chamber. Therefore, when the substrates S1, S2, ... are supplied from the substrate supply unit 102 to the second holder 121, the substrates S1, S2, .. .) After the position and posture are aligned, the suction pipe is applied to the suction pipe to directly pull the substrates S1, S2, .. through the suction hole 121a formed in the second holder 121. 121) and fixed on suction.

As such, the substrates S1 and .. sucked and fixed while being aligned on the second holder 121 may be attached to the second holder 121 until all the flip chips predetermined for the substrates S1 and. Since it is in a fixed suction state, even if bonding processes are performed in the first position 10B and the second position 20B where the bonding process of the flip chip 20 is performed, the alignment process of the additional substrates S1, .. Is not needed.

Meanwhile, in FIGS. 11A and 11B, a first board S1 having a boat shape formed of a tray S11 and a plurality of dies S12 is fixed to the first cradle 111 of the first station 110. 11C and 11D illustrate that the second substrate S2 in the form of a strip is fixed to the second cradle 121 of the second station 120, according to another embodiment of the present invention. The first substrate S1 in the form of a boat may be fixed to both the first station 110 and the second station 120, and strips may be applied to both the first station 110 and the second station 120. The second substrate (S2) of the form may be fixed, one of the first station 110 and the second station 120 is fixed to the boat-shaped first substrate (S1) and the other one of the strip form The second substrate S2 may be fixed. Therefore, the first substrate or the second substrate of the present invention does not refer to a boat-shaped substrate and a strip-shaped substrate, respectively, but may be any type of substrate.

Here, the boat-shaped substrate S1 refers to a substrate type in which a plurality of dies S12 to which the flip chip 20 is bonded are fixed to a tray-shaped tray S11. As shown in FIG. 11C, the same flip chip 20 is referred to as a substrate type prepared to be bonded at a previously partitioned position S21.

However, for convenience of explanation, hereinafter, the first substrate S1 having a boat shape is fixed to the first support base 111 of the first station 110, and the second support base 121 of the second station 120 is fixed thereto. In the following, an example in which the strip-shaped second substrate S2 is fixed by suction will be mainly described.

The first substrate S1, which is suction-fixed to the first cradle 111 of the first station 110, is transferred to the first position 10B where the transfer module 40 is supposed to be bonded with the flip chip 20 mounted thereon. The bonding process can take place in the positioned position. In addition, the second substrate S2, which is suction-fixed to the second cradle 121 of the second station 120, has a second position in which another transfer module 40 is bonded with the flip chip 20 mounted thereon. The bonding process may be performed in the state positioned at 20B.

At this time, the first position 10B and the second position 20B are effective in that the same transfer module 40 can be used at the same height. That is, although the first position 10B may be positioned higher than the second position 20B, in this case, the transfer module 40 and the second position that supply the flip chip 20 to the first position 10B Since the specifications of the transfer module 40 for supplying the flip chip 20 to 20B are different from each other, and the control of the arm for supplying the flip chip 20 must be made separately, it is very cumbersome and error-prone to operate the equipment. If it does, it becomes more difficult to recover. Therefore, in order to install the transfer module 40 at a lower cost and to more easily manage the transfer module 40, the first position 10B and the second position 20B may be positioned at the same height. To this end, as the second mounting base 121 of the second station 120 is manipulated to move in the up and down direction 123d, the second substrate 121 fixed to the second mounting base 121 The second position 20B which performs the bonding process of S2) can be located in the same height as the 1st position 10B.

More preferably, as shown in FIG. 10, the first and second cradles 111 and 121 arranged vertically are configured such that their centers coincide with each other. That is, when the center of the first cradle 111 and the center of the second cradle 121 are positioned on the vertical line 77, and the first cradle 111 moves along the first guide rail 10R, the second position is moved. 20B, the second support 121 may reach the first position 10B by moving upward along the second guide rail 20R. That is, the second position 20R is positioned on the path of the first guide rail 10R, and the first position 10R is positioned above the path of the second guide rail 20R.

Through this, the first cradle 111 of the first station 110 may be located in both the first position 10B and the second position 20B, and the second cradle 121 of the second station 120 may be located. Also, the first position 10B and the second position 20B may be positioned in both. Therefore, when two or more different types of flip chips 20x, 20y, ... 20 are to be bonded to one substrate S1, S2 ..., the substrates S1, S2, ... ) Station in one position, even if it does not undergo a long process of changing the setting to supply different flip chips 20x, 20y, ...; 20 supplied from the transfer module 40, The substrates fixed on the substrates are positioned at the first position 10B and the second position 20B, respectively, and different types of flip chips 20x, 20y, ... '20 are formed on one substrate S1, S2,. Bonding to ..) becomes possible.

Generally, strip-shaped substrates are bonded with one type of flip chip 20, but as shown in FIG. 11B, a boat-shaped substrate has two or more flip chips on each die S12. (20x, 20y) are sometimes bonded. When a bonding process of the type shown in Fig. 11B is required, an advantage can be remarkably reduced in time required for the process.

The substrate discharge part 103 is a substrate (S1, S2, ...) fixed in the first cradle 111 of the first station 110 and the second cradle 121 of the second station 120 When the flip chip 20 is bonded to any one or more of the first position 10B and the second position 20B by the transfer module 40, the bonded substrates S1, S2,... Collected by the collecting unit 103a, the collected substrates S1, S2, ... are transferred to the subsequent processes indicated by reference Sd2.

12 to 13D, a flip chip bonding method S100 according to the first embodiment of the present invention using the flip chip bonding substrate transfer apparatus 100 configured as described above will be described in detail.

Step 1 : The first station 110 of the substrate transfer device 100 for flip chip bonding is transferred to the substrate mounting unit 102a of the substrate supply unit 102 to transfer the flip chip 20 being prepared in the substrate mounting unit 102a. The first substrate S1 to be bonded is positioned on the first mounting base 111 of the first station 110. Then, after the first substrate (S1) is aligned so as to be in a predetermined position and posture on the first mounting base 111, the suction pressure 112p is applied to the first suction unit 112 to the upper surface of the first mounting base 111. Adsorption and fixation of the first substrate (S1) in a state where the position and posture are aligned (S110).

At this time, the second cradle 121 of the second station 120 is moved by the third driving unit so that the first station 110 does not interfere with the second station 120 in the process of reaching the substrate mounting unit 102a. It is kept moved downward.

Step 2 : Then, as shown in Fig. 13A, the first station 110 is moved in the direction indicated by reference numeral 110d, so that the first substrate S1 on the first mounting base 111 is in the first position 10B. To be located at (S120).

Step 3 : Then, as illustrated in FIG. 13B, the flip chip 20 generated by dividing the wafer 10 using the transfer module 40 installed in the first position 10B is first mounted. The substrate S1 is mounted at a predetermined position and bonded to the first substrate S1 (S130).

Step 4 : As soon as Step 2 is completed, the second station 120 of the flip chip bonding substrate transfer apparatus 100 moves the second support base 121 upward, and then the substrate mounting part 102a of the substrate supply part 102 is moved. Is transferred to. The second station 120 receives the second substrate S2 on which the flip chip 20 is ready to be supplied to the substrate mounting unit 102a, and is positioned on the second mounting base 121. Then, the second substrate (S2) is aligned so as to be in a predetermined position and posture on the second holder 121, and then applying a suction pressure to the second suction unit 122 to the second holder 121 on the second holder 121. The substrate S2 is fixed by suction in a state where the position and the posture are aligned (S140).

Step 5 : Then, as shown in Fig. 13B, the second station 120 is moved in the direction indicated by reference numeral 120a, so that the second substrate S2 on the second holder 121 is moved to the second position 20B. To be located at (S150). That is, steps 4 and 5 are all performed during the process in which step 3 is performed.

Step 6 : Then, as illustrated in FIG. 13C, the flip chip 20 generated by dividing the wafer 10 using the transfer module 40 installed in the second position 20B is subjected to the second operation. The substrate S2 is mounted at a predetermined position and bonded to the second substrate S2 (S160). Step 6 is performed while overlapping with the process in which step 3 takes place.

In this case, when the first substrate S1 in which the bonding process of the flip chip 20 is started first is finished before the bonding process for the second substrate S2 is completed, as shown in FIG. 13D, The first station 110 is transferred to the substrate collection unit 103a to transfer the first substrate S1 ″ in which the bonding process of the flip chip 20 is completed, to the subsequent process.

Then, the first station 110 is transferred to the substrate supply unit 102 as shown in FIG. 13A to receive a new substrate S1 ′ to bond the flip chip 20. In order to avoid interference with the second station 120 while the first station 110 passes the second position 20B, the second cradle 121 of the second station 120 moves downward and flips. The bonding process of 20 is stopped for a while. Then repeat steps 2 to 6.

The bonding method of the flip chip according to the first embodiment of the present invention configured as described above includes a first suction unit and a second suction unit capable of suction fixing the substrate to the first station and the second station, respectively, and thus the position of the substrate. And when the bonding process is performed in the first position and / or the second position even if the alignment process of the substrate is performed only once when the substrate is placed in the station by moving to the first position and the second position with the posture fixed. Since the position and posture of the substrate are not misaligned, the process of aligning the position and posture in the conventional bonding position can be omitted, thereby improving the efficiency of the flip chip bonding process and reducing the time required for the bonding process. Advantages are obtained.

Hereinafter, the present invention used to bond different flip chips 20x and 20y to one substrate using the flip chip bonding substrate transfer apparatus 100 configured as described above with reference to FIGS. 14 to 15D. Flip chip bonding method (S200) according to a second embodiment will be described in detail.

Step 1 : The second station 120 of the substrate transfer apparatus 100 for flip chip bonding is transferred to the substrate mounting unit 102a of the substrate supply unit 102, and the flip chip 20 being prepared for the substrate mounting unit 102a is transferred. The first substrate S101 to be bonded is positioned on the second cradle 121 of the second station 120. Then, the first substrate (S101) is aligned so as to be in a predetermined position and posture on the second mounting plate 121, and then applying the suction pressure 122p to the second suction unit 122, the second mounting plate 121 on the Adsorption and fixation of the first substrate (S101) in a state in which the position and attitude are aligned (S210).

Here, the first substrate S101 is a boat-shaped substrate in which two different flip chips 20x and 20y are to be bonded to each die S12, as shown in FIG. 11B. Can be.

Step 2 : Then, as shown in Fig. 15A, the second station 120 is moved in the direction indicated by reference numeral 120a, so that the first substrate S101 on the second holder 121 is connected to the substrates S101, S102, ...) is positioned in the second position 20B adjacent to the substrate mounting portion 102a (S220).

Step 3 : Then, as shown in Fig. 15B, the first flip chip 20x generated by dividing the wafer 10 is transferred using the transfer module 40 installed in the second position 20B. The first substrate S101 is mounted at a predetermined position and bonded to the first substrate S101 (S230). As a result, the die S12 fixed to the tray S11 of the first substrate S101 becomes a die in which only the first flip chip 20x is bonded in the second position 20B (S12 'in FIG. 11B). .

Step 4 : Then, as shown in Figs. 15C and 15D, the second station 120 of the substrate transfer apparatus 100 for flip chip bonding moves the second cradle 121 downward (135d '). Afterwards, the transfer to the first position (10B) in which the transfer module 40 for bonding the second flip chip (20y) is located (S240).

Step 5 : Simultaneously with Step 4, the first station 110 is transferred in the 110d 'direction toward the substrate mounting portion 102a of the substrate supplying portion 102 to bond the flip chip 20 being prepared to the substrate mounting portion 102a. The second substrate S102 to be positioned on the first mounting base 111 of the first station 110. Then, after the second substrate (S102) is aligned so as to be in a predetermined position and posture on the first support base 111, the suction pressure (112p) is applied to the first suction unit (112) on the first support base (111) The second substrate (S102) is adsorbed and fixed in a state where the position and attitude are aligned (S250).

Step 6 : Then, the first station 110 is transported in the direction indicated by 110d to be located in the second position 20B closer to the substrate collection part 103a while being further away from the substrate mounting part 102a (S260). ).

In this case, the second station 120 is transferred from the second position 20B to the first position 10B, and at the same time, the first station 110 is transferred from the first position 10B to the substrate mounting portion 102a. In this case, since the second station 120 is moved to the first position 10B while being moved downward 135d 'to a position lower than the first guide rail 10R, the first station 110 and the second station ( 120 does not interfere with each other even if they are transported in directions crossing each other.

Step 7 : Then, as shown in FIG. 15E, the second stage 120 fixing the first substrate S101 on which the bonding of the first flip chip 20x is completed is positioned at the first position 10B. Then, the second flip chip 20y is bonded to the first substrate S101 by the transfer module 40 (S270). Accordingly, the die S12 ′ fixed to the first substrate S101 becomes a die S12 ″ in which two different flip chips 20x and 20y are bonded at the same time in the second position 20B.

Step 8 : Simultaneously with Step 7, the first station 110 receives the new second substrate S102 from the substrate mounting unit 102a and is positioned in the second position 20B. One flip chip 20x is bonded on the second substrate S102 (S280). As a result, the die S12 fixed to the second substrate S102 becomes a die S12 'in which only the first flip chip 20x is bonded in the first position 10B.

Step 9 : Next, the first substrate S101 having completed the bonding process of the two different flip chips 20x and 20y in the first position 20B is transferred to the substrate collecting unit 103a and transferred to the subsequent process. .

The state in which step 9 is completed is the same as the state in which step 3 has been described above, and only the positions of the first station 110 and the second station 120 are inverted. Therefore, by repeating steps 4 to 9, it is possible to quickly and accurately bond different flip chips 20x and 20y onto the substrates S101, S102, ... that are sequentially supplied sequentially and sequentially. Will be.

The bonding method of the flip chip according to the second embodiment of the present invention configured as described above may not only obtain all the advantages of the first embodiment described above, but also the first station 110 and the second station 120 The first position 10B and the second position 20B are configured to be positioned at both the position 10B and the second position 20B, respectively, so that one substrate S101, S102, ... is different from each other. At the same time, different flip chips 20x and 20y may be supplied and bonded to each other. In this case, the alignment of the substrates S101, S102, ... may be performed by the stations 110, 120. Since it only needs to be carried out at the fixed position), it is not necessary to go through the conventional alignment process performed in the first position 10B and the second position 20B, so that flip chips 20x and 20y of different shapes are formed on the substrate S101. , S102, ...) can achieve an advantageous effect that can be performed rapidly and efficiently significantly compared to the conventional.

As described above, the present invention has been described by specific embodiments such as specific components and the like, but the embodiments and the drawings are provided only to help a more general understanding of the present invention, and the present invention is limited to the above-described embodiments. In other words, various modifications and variations are possible to those skilled in the art to which the present invention pertains.

For example, in the flip chip bonding method S200 according to the second embodiment of the present invention, different flip chips 20x and 20y are mounted while the first substrate S101 is mounted on the second station 120. Although the method of bonding at each position has been taken as an example, since the first station 110 and the second station 120 easily change positions with each other, the first substrate S101 is mounted on the first station 110 first. Then, different flip chips 20x and 20y may be configured to be bonded at each position.

In the flip chip bonding method S200 according to the second embodiment of the present invention, the first flip chip 20x is first bonded in the second position 20B adjacent to the substrate mounting part 102a, and then the substrate mounting part 102a is used. Although the configuration in which the second flip chip 20y is bonded in the first position 10B far from the above is described as an example, the present invention is not limited to the name of the first position 10B or the second position 20B. And bonding the first flip chip onto the substrate at a position proximate to the substrate mounting portion 102a, and then bonding the second flip chip onto the substrate at a position farther from the substrate mounting portion 102a.

On the other hand, in the embodiment of the present invention has been described an example configured to bond the flip chip first in the second position (20B) and later flip chip in the first position (10B), the present invention is the first position (10B) or Regardless of the name of the second position 20B, the first position may be set to the bonding position of the flip chip close to the substrate mounting portion.

In addition, the present invention is easy to change the position of the first station 110 and the second station 120, so within the scope of the claims, in the second position 20B close to the substrate mounting portion 102a The flip chip may be bonded first at the first position 10B farther from the substrate mounting portion 102a.

As such, the spirit of the present invention should not be limited to the above-described embodiments, and all of the equivalents and equivalents of the claims as well as the claims described below are within the scope of the present invention.

100: substrate transfer device for flip chip bonding 101: frame
102: substrate supply portion 102a: substrate mounting portion
103: base discharge portion 103a: substrate collection portion
10R: 1st guide rail 20R: 2nd guide rail
10M: First Permanent Magnet Edition 20M: Second Permanent Magnet Edition
110: first station 111: first cradle
112: first suction unit 113: first moving body
113R: Rotor 120: Second Station
121: second cradle 122: second suction unit
123: third moving body 124: second moving body
125: third guide rail 77: center line
S1: first substrate S11: tray
S12: die S2: second substrate
20x: first flip chip 20y: second flip chip

Claims (5)

A method of bonding a flip chip including a first flip chip and a second flip chip having different sizes to a first substrate,
Supplying a first substrate to the first station to apply suction pressure through the suction hole of the first cradle to fix the first substrate to the first cradle of the first station at a substrate mounting portion;
Moving the first station along the first guide rail from the substrate mounting part to move the first station to a first predetermined position;
Bonding the first flip chip to the first substrate fixed to the first holder in the first position;
After the first flip chip is bonded, moving the first station such that the first cradle is in a second position at a position spaced apart from the first position;
Bonding the second flip chip to the first substrate fixed to the first holder in the second position;
When the first cradle is out of the substrate mounting portion, a second station having a second cradle movable up and down along a third guide rail arranged up and down moves together with the second cradle to move the second cradle to the substrate. Positioning the second substrate on the second holder with a suction pressure sucked from a lower side of the second holder by receiving a second substrate from the substrate mounting part;
While bonding the second flip chip to the first substrate in the second position, the second station moves along the second guide rail so that the second cradle is positioned in the first position and is positioned on the second cradle. Bonding a first flip chip to the fixed second substrate;
Flip chip bonding method comprising a.
The method of claim 1,
And the first position is located closer to the position at which the first substrate is supplied than the second position.
The method of claim 1,
And the first position and the second position are located at the same height.
The method according to any one of claims 1 to 3,
And the first guide rail and the second guide rail extend in a horizontal direction and are vertically arranged in parallel with each other.
The method according to any one of claims 1 to 3, wherein the first substrate,
Trays;
A plurality of dies fixed to the tray;
And the first flip chip and the second flip chip are bonded to the die, respectively.

Images