KR20170092827A - In-line Auto FOF/FOG Common Bonding Apparatus - Google Patents

In-line Auto FOF/FOG Common Bonding Apparatus Download PDF

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KR20170092827A
KR20170092827A KR1020160013989A KR20160013989A KR20170092827A KR 20170092827 A KR20170092827 A KR 20170092827A KR 1020160013989 A KR1020160013989 A KR 1020160013989A KR 20160013989 A KR20160013989 A KR 20160013989A KR 20170092827 A KR20170092827 A KR 20170092827A
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South Korea
Prior art keywords
unit
fpc
film
bonding
panel
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KR1020160013989A
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Korean (ko)
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KR101776859B1 (en
Inventor
김성민
김광우
홍두선
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주식회사 파인텍
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • H01L51/56—

Abstract

The present invention relates to an FPC (Film on Flex) bonding method and a FOG (film on glass) bonding method in which a FPC (Film on Flex) bonding method and an FOG An FPC supply unit for supplying the FPC; A panel ACF bonding portion for selectively attaching an anisotropic conductive film on one surface of a flexible or rigid type panel loaded in a previous process; A pre-bonding unit for bonding the FPC film to the panel transferred from the FPC supply unit via the panel ACF bonding unit to pre-mount the FPC film; A main bonding part for finally bonding the FPC film to the panel supplied with the FPC film pre-mounted from the pre-bonding part; A panel-ACF bonding part, a pre-bonding part, and a main bonding part, the panel being provided with a panel for feeding the panel sequentially; An inverting unit which is provided to supply the panel during the conveying path of the conveying unit and rotates the panel by 180 °; A drive control signal is applied to the FPC supply unit, the panel ACF bonding unit, the pre-bonding unit, the main bonding unit, the panel transfer unit, and the inverting unit to drive and control the FPC process, And a control unit for applying a control signal selectively to the ACF bonding unit, the panel feeding unit, and the inverting unit. The inline automatic FOF / FOG common bonding apparatus includes:

Description

Technical Field [0001] The present invention relates to an in-line automatic FOF / FOG common bonding apparatus,

The present invention relates to an in-line automatic FOF / FOG common bonding apparatus, and more particularly, to a bonding apparatus capable of selectively carrying out a process for bonding an FPC film to a flexible type or rigid type panel. To an in-line automatic FOF / FOG common bonding apparatus capable of jointly using a film on flex (FOF) bonding method and a film on glass (FOG) bonding method and efficiently bonding an FPC film to different types of panels .

2. Description of the Related Art Generally, various types of flexible printed circuit boards (FPCBs) are mounted in a portable electronic device such as a mobile phone, a notebook computer, a PDA, and a navigation system to drive a display screen and realize low voltage driving, low power consumption, Board) is applied.

As a technique for manufacturing a display module to which a flexible circuit board is applied to a panel, an anisotropic conductive film is attached to an electrode of a panel, an FPC film is disposed on the anisotropic conductive film of the panel, A film on flex (FOF) bonding method and a film on glass (FOG) bonding method, which are implemented so as to be in contact with each other.

In the FOG method, a rigid-type panel (glass) is used to perform the bonding process in which the panel to be bonded for mounting the FPC film is rigid but does not bend well. On the other hand, the FOF method is thinner and lighter And the development of a flexible component is required. As a developed technique, a flexible panel having flexible characteristics for bending the panel to be bonded with the FPC film is applied to the bonding process.

As a conventional technique disclosed in relation to the above-mentioned FOG bonding apparatus, Korean Patent Registration No. 632378 (Sep. 28, 2006) discloses a loading unit comprising a conveyor of a width division variable type in which a glass is loaded, A main body for automatically attaching an ACF on the glass supplied from the glass, centering the FPC, feeding the FPC onto the glass by a rotary method, aligning the glass by the rotary bonding, performing main bonding, An unloading unit including a conveyor for discharging the glass having the FPC mounted thereon to the outside, and a control unit for controlling the loading unit, the main body unit, and the unloading unit, thereby shortening the working time due to the automatic progress of the process An inline automatic FOG bonding apparatus capable of improving the working efficiency is known.

The FOF bonding apparatus includes a loading section for supplying the panel and the FPC film respectively, an ACF bonding section for attaching the anisotropic conductive film to the pattern area of the panel, a main bonding section for bonding the FPC film to the anisotropic conductive film of the panel, And a loading unit.

However, since both the FOG bonding apparatus and the FOF bonding apparatus supply the FPC film and bond it to the panel, the panels to be mounted are applied to different types and the mounting faces for bonding the FPC film are opposite to each other. The FOG bonding apparatus and the FOF bonding apparatus are incompatible with each other. Thus, there is a problem in that it is necessary to provide all the individual apparatuses, thereby requiring a large cost for constructing the facility.

Further, in the case of the conventional FOF bonding apparatus, since the anisotropic conductive film is attached to the panel and main bonding is performed immediately, there is a problem that the precision in the process is lowered due to the absence of the preliminary bonding process.

KR Patent Registration No. 10-0632378 (September 28, 2006)

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and it is an object of the present invention to provide a FOG bonding method and a FOG bonding method in which a bonding method can be selectively controlled for each process according to a type of a flexible type or a rigid type, It is an object of the present invention to provide an in-line automatic FOF / FOG common bonding apparatus capable of minimizing the cost and improving the operation efficiency of the equipment.

The present invention also provides an in-line automatic FOF / FOG common bonding apparatus which can increase the precision in the process of FOF bonding because it can be pre-bonded before main bonding in the FOF bonding process.

The inline automatic FOF / FOG common bonding apparatus proposed by the present invention includes an FPC supplier for supplying an FPC film to be mounted on a panel; A panel ACF bonding unit configured to selectively attach an anisotropic conductive film to one surface of a flexible type or rigid type panel loaded in a previous step; A pre-bonding unit for bonding the FPC film to the panel transferred from the FPC supply unit via the panel ACF bonding unit to pre-mount the FPC film; A main bonding part for finally bonding the FPC film to the panel supplied with the FPC film pre-mounted from the pre-bonding part; A panel-ACF bonding part, a pre-bonding part, and a main bonding part, the panel being provided with a panel for feeding the panel sequentially; An inverting unit which is provided to supply the panel during the conveying path of the conveying unit and rotates the panel by 180 °; A drive control signal is applied to the FPC supply unit, the panel ACF bonding unit, the pre-bonding unit, the main bonding unit, the panel transfer unit, and the inverting unit to drive and control the FPC process, And a control unit for applying a control signal selectively to the ACF bonding unit, the panel feeding unit, and the inverting unit.

The FPC supply unit includes an FPC loading unit for loading an FPC film, a film ACF bonding unit for attaching an anisotropic conductive film to the FPC film supplied from the FPC loading unit, An FPC buffer unit for supplying the FPC film fed from the FPC loading unit to the pre-bonding unit; and an FPC buffer unit for picking up the FPC film and capable of supplying the FPC film to the film ACF bonding unit and the FPC buffer unit from the FPC loading unit And an FPC transfer unit.

The FPC loading unit includes a package lift that supports a plurality of FPC film packages vertically and vertically so as to be vertically movable up and down, and an FPC film that can pick up individual FPC films corresponding to the upper side of the package lift, And a second pick-up conveying means for linearly moving the first pick-up conveying means and the second pick-up conveying means for linearly moving toward the left and right X-axis directions, The FPC loading buffer means supporting the FPC film loaded from the means.

Wherein the film ACF bonding unit comprises a film ACF adhesive unit having a film reel for winding an anisotropic conductive film and a plurality of rollers and having an attachment head capable of vertical vertical reciprocating motion so as to attach an anisotropic conductive film to the FPC film, A film ACF stage which supports the FPC film, which is positioned in correspondence with the ACF bonding unit and supports the FPC film supplied from the FPC transfer unit, for supporting the process of attaching the anisotropic conductive film by supplying the FPC film to a working position by the attachment head of the film ACF bonding unit, And a film ACF inspection unit for inspecting the attachment state of the anisotropic conductive film corresponding to the upper side of the film ACF stage unit.

The film ACF stage unit includes a film stage for supporting the FPC film, a film elevating means for driving the film stage so as to reciprocate upward and downward, and an FPC film capable of linearly reciprocating forward and backward in correspondence with the film ACF adhering unit And a film correction driving means for driving the FPC film in a supported state on the film stage to align the twist angle of the FPC film.

The FPC buffer unit may include an FPC transfer loader for transferring the FPC film so as to be capable of being supplied from the FPC supply unit to the prebonding unit so as to be able to supply the FPC film to the prebonding unit and a FPC transferring unit for picking up the FPC film transferred between the FPC transfer unit and the FPC transferring unit, Thereby constituting an FPC transfer buffer for supplying the FPC transfer loader to the FPC transfer loader.

The FPC transfer loader includes a mounting plate movably mounted on an upper portion of the FPC film, loader elevating means for elevating and lowering the mounting plate in the vertical Z-axis direction, support means for supporting the lower portion of the loader elevating means, And is configured so as to be capable of reciprocating linearly so as to move in the forward and backward Y-axis directions.

The FPC transfer buffer includes film pick-up means for picking up the FPC film so as to pick up the FPC film, buffer up / down means for supporting the film pick up means so as to be able to move up and down in the Z-axis direction, And a buffer transfer means for transferring and driving in the Y-axis direction so as to be transferred to the FPC transfer loader.

The FPC transfer unit may include a first transfer unit for picking up the FPC film from the FPC loading unit and transferring the FPC film to the film ACF bonding unit to supply the FPC film to the film ACF bonding unit, And a second transfer unit for transferring the film to be fed, and the second transfer unit is rotatably driven at 180 ° so as to invert the vertical direction of the FPC film being picked up.

Wherein the panel ACF bonding unit comprises a panel ACF adhesive unit having a film reel for winding an anisotropic conductive film and a plurality of rollers and having an attachment head capable of vertically reciprocating motion so as to attach an anisotropic conductive film to the panel, A panel ACF stage unit which is positioned corresponding to the adhesive unit and supports the panel supplied from the panel feeding section and supports the panel to the working position by the attachment head of the panel ACF adhesive unit to support the process of attaching the anisotropic conductive film; And a panel ACF inspection unit for inspecting the attachment state of the anisotropic conductive film corresponding to the upper side of the panel ACF stage unit.

The panel ACF stage unit includes a panel stage for supporting the panel, a panel elevating means for driving the panel stage so as to reciprocate vertically, and a panel which is provided so as to reciprocate linearly forward and backward in correspondence with the panel ACF adhering unit. And a panel correction drive means for driving the supply and conveyance means and the panel to support the twist angle of the panel supported on the panel stage.

The pre-bonding unit includes a pre-bonding stage unit for supporting the panel in an adsorbed state on the upper part thereof, and a pre-bonding unit for press-bonding the FPC film supplied from the FPC supply unit onto the panel.

Wherein the pre-bonding stage unit comprises: an adsorption stage for adsorbing and supporting a panel; Z-axis transfer means for driving the transfer stage to vertically reciprocate upward and downward to adjust the height of the adsorption stage; A Y-axis moving means for moving the suction stage in a linear reciprocating motion, an X-axis moving means for moving the position of the suction stage so as to move to the left and right, and an X-axis moving means for moving the twist angle of the panel, axis drive means for driving the lens barrel to align.

The pre-bonding unit includes a bonding support member positioned corresponding to the pre-bonding stage unit and supporting one end of the panel, a pre-bonding head for picking up the FPC film from the FPC supply unit and pressing the FPC film toward the panel positioned on the bonding support member, A head driving unit that supports the pre-bonding head and feeds the pre-bonding head in the X, Y, and Z axial directions; a first vision unit that recognizes a mounting position and an alignment state of the panel on the lower side of the bonding support member; And recognizes the alignment state of the FPC film. The second vision unit recognizes the alignment state of the FPC film.

The pre-bonding head constitutes film aligning means provided to align the twist angle of the picked up FPC film at the lower end in the? -Axis direction.

The head driving means includes an X-axis driving means having a stationary frame and a flow frame rotatable in the X-axis direction on the stationary frame, the X-axis drive means moving the flow frame in the left and right X-axis directions, A Y-axis driving means for reciprocally moving the pre-bonding head in the forward and backward Y-axis directions from the FPC supply unit to the position of the bonding support member, and a support bracket for fixing and supporting the pre-bonding head on the Y- And Z-axis driving means for reciprocating the support bracket in the vertical Z-axis direction.

The main bonding unit includes a main bonding stage for supporting a panel in which the FPC film is preliminarily mounted on the pre-bonding unit and being provided so as to be reciprocally movable in the front and back Y-axis directions, A main bonding head mounted on the main bonding head for reciprocating movement and having a bonding tip capable of thermo-compression bonding an FPC film at a lower end thereof; and a sheet feeding part for driving the Teflon sheet to be supplied between the main bonding head and the main bonding stage.

The inverting unit includes a first inverting unit disposed between the FPC supply unit and the panel ACF bonding unit to invert the vertical direction of the panel, and a second inverting unit disposed between the pre-bonding unit and the main bonding unit, 2 inversion section.

The first reversing unit includes first adsorption means provided to be capable of picking up the panel and capable of picking up the first adsorption means, first reverse rotation means provided to support the first adsorption means and rotatably driven at 180 °, And a first elevating means extending in the vertical direction to drive the panel to move up and down.

The second reversing unit includes a buffer stage which supports the panel and moves and supplies the reversed position to the reversing position, and is movable in the X-axis direction and the Z-axis direction, and a second adsorption unit A second lifting means for driving the second adsorption means so as to linearly move the lifting means in the vertical direction and a second lifting means for lifting the second lifting means, Axis direction in the left and right X-axis directions.

According to the in-line automatic FOF / FOG common bonding apparatus according to the present invention, since the FOF bonding method or the FOG bonding method is mutually compatible by selectively controlling the bonding method for each process according to the type of the panel (flexible type or rigid type) It is possible to greatly reduce the facility construction cost and the maintenance cost and to improve the functional operation efficiency of the equipment.

In addition, since the inline automatic FOF / FOG common bonding apparatus according to the present invention is configured to pre-bond the FPC film in the process of the FOF bonding method for bonding the FPC film to the flexible type panel, the accuracy of the bonding process is improved, There is an effect that can be improved.

Further, since the inline automatic FOF / FOG common bonding apparatus according to the present invention is capable of collectively inspecting the bonding state while bonding the anisotropic conductive film to the panel and the FPC film, it is possible to shorten the tact time of the process while reducing the size of the equipment So that the productivity can be improved.

1 is a block diagram schematically illustrating an embodiment according to the present invention;
2 is a plan view schematically showing an embodiment according to the present invention.
3 is a side view showing an FPC loading unit according to an embodiment of the present invention;
Figure 4 is a front view of an FPC loading buffer means in an embodiment according to the present invention;
5 is a side view showing a panel ACF bonding part and a film ACF bonding part in an embodiment according to the present invention.
6 is a front view showing a film ACF adhesive unit in an embodiment according to the present invention.
FIG. 7 is a front view of an FPC buffer unit according to an embodiment of the present invention; FIG.
8 is a front view showing a panel ACF adhesive unit in an embodiment according to the present invention.
9 is a plan view showing a pre-bonding portion in an embodiment according to the present invention.
10 is a front view showing a pre-bonding unit in an embodiment according to the present invention;
11 is a side view showing a main bonding part in an embodiment according to the present invention.
FIG. 12 is a plan view showing a panel sending part according to an embodiment of the present invention; FIG.
13 is a front view showing a first inverting unit in an embodiment according to the present invention;
14 is a side view showing a second inverting unit in an embodiment according to the present invention.

The present invention relates to an FPC feeder for feeding an FPC film to be mounted on a panel; A panel ACF bonding unit configured to selectively attach an anisotropic conductive film to one surface of a flexible type or rigid type panel loaded in a previous step; A pre-bonding unit for bonding the FPC film to the panel transferred from the FPC supply unit via the panel ACF bonding unit to pre-mount the FPC film; A main bonding part for finally bonding the FPC film to the panel supplied with the FPC film pre-mounted from the pre-bonding part; A panel-ACF bonding part, a pre-bonding part, and a main bonding part, the panel being provided with a panel for feeding the panel sequentially; An inverting unit which is provided to supply the panel during the conveying path of the conveying unit and rotates the panel by 180 °; A drive control signal is applied to the FPC supply unit, the panel ACF bonding unit, the pre-bonding unit, the main bonding unit, the panel transfer unit, and the inverting unit to drive and control the FPC process, And a controller for applying an optional control signal to the ACF bonding part, the panel sending part, and the inverting part.

Next, a preferred embodiment of an in-line automatic FOF / FOG common bonding apparatus according to the present invention will be described in detail with reference to the drawings.

However, the embodiments of the present invention can be modified into various forms, and the scope of the present invention is not construed as being limited to the embodiments described below. The embodiments of the present invention are provided so that those skilled in the art can understand the present invention and the shapes and the like of elements shown in the drawings are exemplarily shown to emphasize a clearer description.

1 and 2, an in-line automatic FOF / FOG common bonding apparatus according to the present invention includes an FPC supply unit 100, a pre-bonding unit 300, a main bonding unit 400, A panel transfer unit 500, an inverting unit 600, and a control unit 700. [

The FPC supply unit 100 supplies the FPC film F to be mounted on the panel P toward the pre-bonding unit 300.

2, the FPC supplying unit 100 includes an FPC loading unit 110 for loading an individual FPC film F, a film ACF bonding unit 120 for attaching an anisotropic conductive film to the FPC film F, An FPC buffer unit 130 for feeding the FPC film F to the pre-bonding unit 300; and an FPC transfer unit 140 for picking up and transferring the FPC film F.

3, the FPC loading unit 110 includes a package lift 111 for supporting a plurality of FPC film packages, and a loading / unloading unit 111 for picking up and loading individual FPC films F from the package lift 111 And loading pick-up means 113.

The package lift 111 supports the FPC film package mounted on the upper and lower vertical direction and drives the FPC film package so that the FPC film package can be lifted up and down so as to be upwardly transported to a position where the FPC film package can be picked up by the loading pick- .

Since the upper part of the package lift 111 is provided with supporting means (not shown in the drawing) contacting both side ends toward one FPC film package located on the upper side, the picking operation at the correct position according to the loading pick- It is preferable to configure it so as to be able to plan.

The loading pick-up means 113 is configured to drive the individual FPC films F so as to be picked up corresponding to the upper side of the package lift 111. [ That is, the loading pick-up means 113 picks up the FPC film F by vacuum suction, and forms the FPC film F so that the FPC film F can be maintained in a continuously adsorbed state.

The loading pick-up means 113 is configured to be movable toward the X-axis direction and the Y-axis direction so as to move to the pick-up position of the FPC film F or to be supplied to the outside. That is, the loading pick-up means 113 includes first pick-up conveying means 113a for linearly moving toward the front and rear Y-axis directions, and second pick-up conveying means 113b for linearly moving toward the left and right X- .

An FPC loading buffer unit 115 is provided on one side of the FPC loading unit 110 so as to support the FPC film F loaded from the loading pick-up unit 113.

4, the FPC loading buffer unit 115 is provided between the FPC loading unit 110 and the film ACF bonding unit 120 to support the FPC film F. As shown in FIG.

The FPC loading buffer unit 115 is configured to be linearly reciprocally movable in the front and rear Y-axis direction and the up-down Z-axis direction so that the FPC film F can be positioned at a position where the FPC film F can be smoothly picked up from the FPC transfer unit 140 desirable.

The film ACF bonding unit 120 attaches an anisotropic conductive film to one surface of the FPC film F supplied from the FPC loading unit 110.

5, the film ACF bonding unit 120 includes a film ACF bonding unit 121 for driving the FPC film F so as to attach an anisotropic conductive film to the FPC film F, A film ACF stage unit 123 for feeding an FPC film F toward the film ACF adhering unit 121 at an attachable position and an adhesion checking unit 123 for checking the adhesion state of the anisotropic conductive film adhered on the FPC film F Film ACF inspection unit 125 as shown in FIG.

6, the film ACF adhering unit 121 is provided with a film reel 121b for winding an anisotropic conductive film to a position where it can be attached to the FPC film F, and a plurality of rollers 121c, So that the anisotropic conductive film can maintain a predetermined tensile force in a state in which it can be attached to the FPC film (F).

The film ACF adhering unit 121 constitutes an attaching head 121a which is vertically and vertically reciprocatingly movable in correspondence with the FPC film (F). That is, the attaching head 121a is lowered so that the anisotropic conductive film touches the FPC film F positioned in a fixed state on the film ACF stage unit 123, thereby attaching the anisotropic conductive film to the FPC film (F).

In the attaching head 121a, heat and pressure are applied to the anisotropic conductive film in order to generate a predetermined heat.

The film ACF stage unit 123 is positioned in front of the film ACF adhering unit 121.

The film ACF stage unit 123 supports the FPC film F supplied from the FPC transfer unit 140 on the upper side and attaches the FPC film F to the mounting operation position by the attaching head 121a of the film ACF adhering unit 121. [ (F) is supplied, and the step of adhering the anisotropic conductive film is supported on the FPC film (F).

The film ACF stage unit 123 includes a film stage 123a for supporting the FPC film F on the upper part thereof and a film stage 123a for supporting the film stage 123a from the FPC transfer part 140 by supporting the film stage 123a in an upward / The FPC film F provided at the lower portion of the film elevating means 123b is moved in the forward and backward directions in correspondence with the film ACF adhering unit 121, A film feed drive means 123c provided so as to be capable of reciprocating motion and a film correction drive means 123d for driving the FPC film F in the θ-axis direction so as to align the twist angle of the FPC film F in a supported state on the film stage 123a ).

The film ACF inspecting unit 125 detects the attachment state of the anisotropic conductive film adhered on the FPC film F from the film ACF adhering unit 121 corresponding to the upper side of the film ACF stage unit 123 , Degree of alignment, attachment length, etc.).

In the film ACF inspection unit 125, the photographed image information is transmitted to the controller 700 and the monitor to determine whether the film is bad or not, and the controller 700 can compare the measured image information with the set value, .

The film ACF bonding unit 120 moves in the left and right X axis directions toward the film ACF bonding unit 121 to constitute cutting means for cutting the anisotropic conductive film adhered on the FPC film.

The film ACF bonding unit 120 is driven in accordance with a control signal of the controller 700, but is driven only during a work according to the FOF bonding method. That is, the film ACF bonding unit 120 is configured to maintain the driving stop state during the operation according to the FOG bonding method.

For example, in the operation of the FOF bonding method, the film ACF bonding section 120 is driven to attach an anisotropic conductive film to the FPC film F supplied from the FPC loading section 110, whereas the FOG bonding operation The FPC film F supplied from the FPC loading unit 110 can be smoothly transported to the FPC buffer unit 130 and the film ACF bonding unit 120 is maintained in a stopped state.

7, the FPC buffer unit 130 supplies the FPC film F fed and fed from the FPC loading unit 110 or the film ACF bonding unit 120 to the pre-bonding unit 300 An FPC transferring loader 133 for transferring the FPC film F from the FPC supplying unit 100 toward the pre-bonding unit 300 so as to be capable of being supplied to the pre-bonding unit 300; And an FPC transfer buffer 135 for picking up the FPC film F and supplying the picked up FPC film F to the FPC transfer loader 133.

The FPC transfer loader 133 is extended in the Y-axis direction so as to transfer the FPC film F to a position where the FPC film F can be picked up from the pre-bonding unit 300.

The FPC transfer loader 133 includes a mounting plate 133a mounted on the FPC film F so as to be movable back and forth and a loader lifting means 133b for lifting the mounting plate 133a in the vertical Z- And a loader driving means 133c that supports the lower portion of the loader lifting means 133b and is capable of linear reciprocating motion so as to move the mounting plate 133a in the forward and backward Y-axis directions.

The FPC transfer buffer 135 includes film pick-up means 135a having a plurality of suction nozzles N1 for picking up the FPC film F so as to pick up the FPC film F and an FPC film F for picking up the FPC film F from the film pickup means 135a. A buffer lifting means 135b for supporting the buffer lifting means 135b so that the FPC film F can be lifted up and down in the Z-axis direction while being adsorbed; And buffer transfer means 135c for linearly driving in the Y-axis direction.

The FPC transfer unit 140 picks up the FPC film F to configure an overall process path for supplying the FPC film F. [

The FPC transferring unit 140 is configured to have a plurality of suction nozzles (not shown) for vacuum-sucking the FPC film F to be capable of picking up the FPC film F, and the FPC loading unit 110 Axis direction so as to supply the FPC film F to the film ACF bonding unit 120 and the FPC buffer unit 130 from the film ACF bonding unit 120 and the FPC buffer unit 130, respectively.

The FPC transfer unit 140 includes a first transfer unit 140a for picking up the FPC film F from the FPC loading unit 110 and transferring the FPC film F to the film ACF bonding unit 120, And a second transfer unit 140b for picking up the FPC film F from the film ACF bonding unit 120 and transferring the FPC film F to the FPC buffer unit 130 to supply the FPC film F. [

The second transfer unit 140b is rotatably driven by 180 ° so that the FPC film F picked up in the film ACF bonding unit 120 can be inverted in the vertical direction.

The inversion driving of the second transfer unit 140b drives the FPC film F so that the FPC film F is reversed in the vertical direction only in the case of the FOF bonding method.

The panel ACF bonding unit 200 functions to attach an anisotropic conductive film to one side of the panel P loaded in the previous process.

The flexible panel type or the rigid type panel P is loaded on the panel P loaded in the panel ACF bonding part 200 according to the setting signal of the controller 700. [

As shown in FIG. 5, the panel ACF bonding unit 200 is configured to have a symmetrical structure with respect to the film ACF bonding unit 120, and a panel ACF bonding that drives the panel P to attach an anisotropic conductive film A panel ACF stage unit 220 for supplying a panel P toward the panel ACF adhering unit 210 at a position where an anisotropic conductive film can be attached to the panel P; And a panel ACF inspection unit 230 for inspecting the attachment state of the anisotropic conductive film attached to the panel ACF.

8, the panel ACF bonding unit 210 includes a film reel 213 and a plurality of rollers 215 for winding an anisotropic conductive film so that the anisotropic conductive film can be attached to the panel P Provided with a constant tension maintained.

The film ACF adhering unit 121 constitutes an attaching head 211 which is vertically and vertically reciprocatingly movable corresponding to the panel P. That is, the attachment head 211 is lowered to contact the anisotropic conductive film toward the panel P, which is fixed on the panel ACF stage unit 220, to attach the anisotropic conductive film to the panel P.

In the attaching head 211, an anisotropic conductive film is attached by heat and pressure as a heat ray is generated to generate a predetermined heat.

The panel ACF stage unit 220 corresponds to the front of the panel ACF adhesive unit 210. [

The panel ACF stage unit 220 supports the panel P fed from the sending unit 500 on the upper side and moves the panel P to the working position by the attaching head 211 of the panel ACF bonding unit 210 And the panel P is configured to support the process of attaching the anisotropic conductive film.

The panel ACF stage unit 220 includes a panel stage 221 for supporting a panel P at an upper portion thereof and a panel stage 221 for supporting the panel stage 221 so as to reciprocate vertically, A panel elevating means 223 provided below the panel elevating means 223 for driving the panel P to move forward and backward in a linear reciprocating motion corresponding to the panel ACF adhering unit 210, And a panel correction driving means 227 for driving the panel P in a θ-axis direction so as to align the twist angle of the panel P in a supported state on the panel stage 221 do.

The panel ACF inspecting unit 230 detects the attachment state of the anisotropic conductive film attached on the panel P from the panel ACF adhesive unit 210 corresponding to the upper side of the panel ACF stage unit 220 Alignment degree, attachment length, etc.) is photographed and inspected.

In the panel ACF inspection unit 230, the photographed image information is transmitted to the controller 700 and the monitor to determine whether it is bad or not, and the controller 700 can compare the measured image information with the set value or discriminate it by the operator, .

The panel ACF bonding unit 200 forms cutting means for cutting the anisotropic conductive film adhered on the panel P by moving in the left and right X axis direction toward the panel ACF bonding unit 210.

The panel ACF bonding unit 200 is driven in accordance with a control signal of the controller 700, and can be selectively attached and operated according to the operation method. That is, the panel ACF bonding part is driven only when working according to the FOG bonding method, and is configured to maintain the driving stop state when working according to the FOF bonding method.

For example, in the operation of the FOG bonding method, the panel ACF bonding unit 200 is driven to attach an anisotropic conductive film to an externally loaded panel P, whereas in the FOF bonding type operation, P to be smoothly conveyed to the pre-bonding unit 300, and the panel ACF bonding unit 200 maintains the driving stop state.

The prebonding unit 300 is configured to preliminarily mount the FPC film F on the panel P fed with the FPC film F from the FPC supply unit 100 and transferred through the panel ACF bonding unit 200, And performs a bonding function.

9, the pre-bonding unit 300 includes a pre-bonding stage unit 310 for supporting the panel P, a pre-bonding unit (not shown) for press-bonding the FPC film F on the panel P 320).

The pre-bonding stage unit 310 is positioned in front of the pre-bonding unit 320 and is connected to the panel ACF bonding unit 200 through the panel bonding unit 200, .

The pre-bonding stage unit 310 includes an adsorption stage 311 for adsorbing and supporting the panel P and a Z axis for driving the adsorption stage 311 so as to vertically reciprocate upward and downward to adjust the height of the adsorption stage 311. [ Y-axis conveying means 315 for driving the panel P on the adsorption stage 311 so as to linearly reciprocate forward and backward in correspondence with the pre-bonding unit 320; 31) for driving the position of the panel (P) in a state of being adsorbed on the adsorption stage (311) so as to align the twist angle of the panel (P) And the driving means 319 are provided.

10, the pre-bonding unit 320 applies the FPC film F supplied from the FPC feeding loader 133 of the FPC feeding unit 100 to the panel (not shown) supplied from the pre-bonding stage unit 310 P and includes a bonding support member 321 and a pre-bonding head 323, a head driving means 325, a first vision portion 327 and a second vision portion 329 .

The bonding support member 321 is positioned corresponding to the pre-bonding stage unit 310 and supports the FPC film F at one end of the panel P so that the FPC film F can be bonded.

The FPC film F is mounted on the panel P so as to be mountable on the panel P corresponding to the upper side of the bonding support member 321. The FPC film F is supplied from the FPC supply unit 100, And the FPC film F is formed so as to be able to be pressed toward the panel P located on the bonding support member 321. [

The pre-bonding head 323 is provided with film aligning means 324 which can be driven to adjust in the? -Axis direction. The pre-bonding head 323 holds the FPC film F at the lower end thereof while the film aligning means 324 holds the FPC film F in a state in which the pre-bonding head 323 ) In the? -Axis direction.

The head driving means 325 supports the pre-bonding head 323 and is driven to move in the X, Y and Z axis directions. The head driving means 325 includes a fixed frame 325a and a flow frame 325b, A driving means 325c, a Y-axis driving means 325d, and a Z-axis driving means 325e.

The stationary frame 325a is provided with a rail member for linear movement of the flow frame 325b and the flow frame 325b is reciprocally movable in the X axis direction on the rail member of the stationary frame 325a Respectively.

The X-axis driving means 325c is installed on the flow frame 325b to apply power to move the flow frame 325b in the left and right X-axis directions.

The Y-axis driving means 325d is provided on the flow frame 325b to be capable of supporting the pre-bonding head 323 and is capable of picking up the FPC film F from the FPC supplying unit 100 To move the pre-bonding head 323 back and forth in the Y-axis direction to the position of the bonding support member 321.

The Z-axis driving means 325e includes a supporting bracket for fixing and supporting the pre-bonding head 323 on the Y-axis driving means 325d. The Z-axis driving means 325e drives the supporting bracket so as to reciprocate in the Z- So that the pre-bonding head 323 can be moved up and down.

The first vision unit 327 captures the panel P from below the bonding support member 321 to recognize the mounting position and the alignment state of the panel P. [

The image recognition signal photographed from the first vision unit 327 is transmitted to the control unit 700 and applies a control signal to the θ-axis driving unit 319 of the pre-bonding stage unit 310, So that the twist angle can be aligned.

The second vision unit 329 is disposed so as to photograph the FPC film F corresponding to the upper side of the supply path of the FPC film F from the FPC supply unit 100, that is, the upper side of the FPC transfer loader 133 So that the alignment state of the FPC film (F) can be recognized.

The image recognition signal photographed from the second vision unit 329 is transmitted to the controller 700 and applies a control signal to the film aligning unit 324 so that the FPC film F is read from the pre- Axis direction of the FPC film F after being picked up.

The second vision unit 329 includes a vision driving means 328 which is driven to reciprocate in the left and right X-axis directions according to the photographing position and the photographing region of the FPC film F. [

Since the pre-bonding unit 320 includes the illumination unit 326 that can illuminate the first vision unit 327 and the second vision unit 329, it is possible to improve the image sharpness .

The main bonding part 400 performs a function of finally bonding the FPC film F onto the panel P supplied with the FPC film F preliminarily mounted thereon from the prebonding part 300 do.

11, the main bonding unit 400 includes a main bonding stage 410 for supplying a panel P transferred to the pre-bonding unit 300 to a bonding position, A main bonding head 420 for bonding the FPC film F in the bonding state again and a sheet feeding part 430 for feeding the Teflon sheet toward the bonding point along the main bonding head 420.

The main bonding stage 410 can receive the panel P having the FPC film F preliminarily mounted thereon in the prebonding part 300 from the panel transfer part 500 and support the panel P on the upper part.

The main bonding stage 410 is positioned to correspond to the main bonding head 420 and is reciprocally movable in the front and rear Y-axis directions to feed the panel P from the main bonding head 420 to a bonding position .

The main bonding head 420 is installed so as to reciprocate vertically corresponding to the upper side of the main bonding stage 410.

The main bonding head 420 is provided with a bonding tip 425 for thermocompression bonding the FPC film F at the lower end thereof.

The sheet feeding unit 430 may continuously supply the Teflon sheet between the main bonding head 420 and the main bonding stage 410 so that the anisotropic conductive film on the panel P or the FPC film F It is possible to prevent cracking of the balls and to prevent foreign matter or gas.

The panel transfer unit 500 is disposed between the panel ACF bonding unit 200, the pre-bonding unit 300, and the main bonding unit 400 to sequentially supply panels.

12, the panel transfer unit 500 is configured to be capable of picking up and transferring the panel P, and includes a conveyance guide member 510 as a conveyance path, And a panel pick-up means 530 which can be picked up by picking up the panel P. The panel pick-

The conveyance guide member 510 extends in the X axis direction from the position for loading the panel P to the panel ACF bonding part 200 to the position of the main bonding part 400, ), The left and right are divided into two parts.

The panel transfer means 520 is provided on the transfer guide member 510 so as to reciprocate in the X axis direction and the panel pickup means 530 transfers the panel P onto the panel transfer means 520 And is adsorbed.

Since the panel pickup means 530 is provided with a plurality of suction nozzles N2 for generating a vacuum suction force, the panel P can be safely picked up.

It is preferable that the position of the suction nozzle N2 is adjusted to an appropriate position according to the size and shape of the panel P. [

The inverting unit 600 functions to feed the panel P during the feeding path of the feeding unit 500 and to rotate the panel P by 180 degrees to invert the upper and lower surfaces of the panel.

The inverting unit 600 is driven to invert the panel only when the process according to the FOF bonding method is performed.

The inverting unit 600 includes a first inverting unit 610 disposed between the FPC supplying unit 100 and the panel ACF bonding unit 200 to invert the vertical direction of the panel P, And a second inverting unit 620 disposed between the main bonding unit 300 and the main bonding unit 400 to invert the vertical direction of the panel P. [

13, the first inverting unit 610 includes a first suction unit 611 that is capable of picking up the panel P, and a second inverting unit 610 that supports the first suction unit 611, A first inversion rotating means 613 rotatably driven by the first rotating means 613 to move the panel P up and down in a vertical direction and supporting the first inversion rotating means 613, And an elevating means 615.

The first inverting unit 610 is driven to be inverted according to the status of the panel loaded in the previous process (OLB bonding process). That is, when the mounting surface (upper surface or lower surface) of the COF electrode pattern attached on the panel P is located on the lower surface, the panel is inverted.

14, the second inverting unit 620 includes a buffer stage 621 for supporting the panel P supplied from the transmitting unit 500 through the pre-bonding unit 300, A second adsorption means 623 provided to adsorb the panel P in correspondence with the buffer stage 621 and a second inversion rotating means 625 rotatably driving the second adsorption means 623, A second elevating means 627 for driving the second adsorption means 623 to linearly move in the vertical direction and a second elevating means 627 for supporting the second elevating means 627 in a linear reciprocating motion in the left and right X- The reverse transfer means 629 is driven.

The buffer stage 621 moves the panel P to the inverted position, that is, the position where the panel P can be attracted from the second suction means 623 to supply the panel P, and is movable in the left and right X- .

The second inversion / rotation unit 625 is rotated to invert the panel P adsorbed by the second adsorption unit 623, and is driven with a turning radius of 180 °.

The control unit 700 is connected to the FPC supplier 100, the panel ACF bonding unit 200, the pre-bonding unit 300, the main bonding unit 400, the panel transfer unit 500, The control signal is applied to drive control.

The control unit 700 sets a process type in the FOF process or the FOG process and outputs a control signal selectively to the FPC supplier 100 and the panel ACF bonding unit 200, the panel transfer unit 500, . In other words, the control unit 700 controls the FOF process or the FOG process to drive only the necessary configuration according to the process type, so that the productivity can be improved by accelerating the process.

For example, when the FOF bonding process is set to the process type in the controller 700, a control signal is applied to bypass the work according to the panel ACF bonding unit 200, and the FOG bonding process is performed to the control unit 700 When the process type is set, a control signal is applied to bypass the work of the film ACF bonding part 120 and the inverting part 600 of the FPC supplying part 100 to drive and control.

The operation for performing the FOF process in the inline automatic FOF / FOG common bonding apparatus according to the present invention will now be described. First, the FPC film F is loaded from the FPC loading unit 110 of the FPC supply unit 100 The first transfer unit 140a of the FPC transfer unit 140 picks up the film and transfers it to the film ACF bonding unit 120 to attach the anisotropic conductive film to the FPC film F The second transfer unit 140b of the FPC transfer unit 140 picks up and transfers the FPC film F but inverts the vertical direction of the FPC film F and supplies the inverted FPC film F to the FPC buffer unit 130, And the FPC film F is fed and supplied in the Y-axis direction toward the pre-bonding part 300 in the Y direction. On the other hand, in the case of the panel P which has been loaded in the previous process, the mounting surface of the COF electrode pattern is inverted through the first inverting unit 610 so as to be located on the upper side, The FPC film F supplied from the FPC supplying unit 100 is supplied to the pre-bonding unit 300 through the pre-bonding unit 300 to the panel P, To be preliminarily mounted. When the panel P is inverted from the second inverting unit 620 and then supplied to the main bonding unit 400, the FPC film F is finally mounted on the panel P by the main bonding unit 400, The process is completed, and the panel is unloaded.

The FPC loading unit 110 of the FPC supply unit 100 loads the FPC film F to the FPC loading unit 110. The in-line automatic FOF / FOG common bonding apparatus according to the present invention includes a FPC loading unit 110, When the FPC transfer unit 140 is picked up by the FPC transfer unit 140, the FPC transfer unit 140 passes through the film ACF bonding unit 120, and the process of attaching the FPC transfer unit 140 to the film ACF bonding unit is bypassed, And the FPC film F is fed and supplied in the Y-axis direction toward the pre-bonding unit 300 in the buffer unit 130. On the other hand, in the case of the panel P loaded in the previous process, the panel P is supplied to the panel ACF bonding unit 200 to attach the anisotropic conductive film to the panel P and then supplied to the prebonding unit 300, The FPC film F supplied from the FPC supplying unit 100 is bonded to the panel P in a preliminary mounting manner. When the panel P is supplied to the main bonding part 400 while bypassing the second inverting part 620, the FPC film F is finally bonded to the panel P in the main bonding part 400 The bonding process is completed, and the panel P is unloaded.

That is, according to the inline automatic FOF / FOG common bonding apparatus of the present invention configured as described above, the bonding method can be selectively controlled according to the type of the panel (flexible type or rigid type) and FOF bonding method or FOG bonding method So that it is possible to greatly reduce the construction cost and maintenance cost of the common equipment and improve the functional operation efficiency of the equipment.

In addition, since the present invention is configured to pre-bond the FPC film in the FOF bonding process for bonding an FPC film to a panel of a flexible type, it is possible to improve the quality of production by increasing the precision of the bonding process.

Although the preferred embodiments of the in-line automatic FOF / FOG common bonding apparatus according to the present invention have been described above, the present invention is not limited thereto, and various modifications may be made within the scope of the claims, And is also within the scope of the present invention.

100: FPC supply unit 110: FPC loading unit
111: package lift 113: loading pick-up means 113a: first pick-up conveying means
113b: second pickup transfer means 115: FPC loading buffer means 120: film ACF bonding portion
121: Film ACF bonding unit 123: Film ACF stage unit
123a: Film stage 123b: Film elevating means
123c: Film feeding means 123d: Film compensation drive means
125: Film ACF inspection unit 130: FPC buffer unit 133: FPC transfer loader
133a: Mounting plate 133b: Loader lifting means 133c: Loader driving means
135: FPC transfer buffer 135a: Film pick-up means
135b: buffer lift means 135c: buffer transfer means
140: FPC transfer unit 140a: first transfer unit 140b: second transfer unit
200: panel ACF bonding part 210: panel ACF bonding unit
220: panel ACF stage unit 221: support stage
223: panel lifting means 225: panel feeding and conveying means
227: panel correction driving means 230: panel ACF inspection unit
300: pre-bonding unit 310: pre-bonding stage unit
311: absorption stage 313: Z-axis feed means 315: Y-axis feed means
317: X-axis feed means 319: θ-axis driving means 320: pre-bonding unit
321: bonding support member 323: pre-bonding head 324: chip aligning means
325: head driving means 325a: fixed frame 325b:
325c: X-axis driving means 325d: Y-axis driving means 325e: Z-axis driving means
427: first vision unit 428: vision driving means 429: second vision unit
400: main bonding portion 410: main bonding stage 420: main bonding head
425: bonding tip 430: sheet feeding part 500:
510: conveying guide member 520: panel conveying means 530: panel pick-up means
600: inverting portion 610: first inverting portion 611: first absorbing means
613: first inversion rotating means 615: first elevating means 620: second inversion portion
621: buffer stage 623: second absorption means 625: second reverse rotation means
627: second elevating means 629: reversing conveying means 700:
700: Control part P: Panel F: FPC film

Claims (20)

An FPC supply unit for supplying the FPC film to be mounted on the panel;
A panel ACF bonding unit configured to selectively attach an anisotropic conductive film to one surface of a flexible type or rigid type panel loaded in a previous step;
A pre-bonding unit for bonding the FPC film to the panel transferred from the FPC supply unit via the panel ACF bonding unit to pre-mount the FPC film;
A main bonding part for finally bonding the FPC film to the panel supplied with the FPC film pre-mounted from the pre-bonding part;
A panel-ACF bonding part, a pre-bonding part, and a main bonding part, the panel being provided with a panel for feeding the panel sequentially;
An inverting unit which is provided to supply the panel during the conveying path of the conveying unit and rotates the panel by 180 °;
A drive control signal is applied to the FPC supply unit, the panel ACF bonding unit, the pre-bonding unit, the main bonding unit, the panel transfer unit, and the inverting unit to drive and control the FPC process, And a control unit for applying a control signal selectively to the ACF bonding unit, the panel feeding unit, and the inverting unit.
The method according to claim 1,
The FPC supply unit includes an FPC loading unit for loading an individual FPC film, a film ACF bonding unit for attaching an anisotropic conductive film to the FPC film supplied from the FPC loading unit, An FPC buffer unit for supplying the FPC film fed from the bonding unit to the pre-bonding unit; and an FPC film feeder for feeding the FPC film from the FPC loading unit to the film ACF bonding unit and the FPC buffer unit And an FPC transferring unit provided on the FOF / FOG common bonding apparatus.
The method of claim 2,
The FPC loading unit includes: a package lift that supports a plurality of FPC film packages stacked vertically and vertically so that the FPC film packages can be lifted up and down; and an FPC film that can pick up individual FPC films corresponding to the upper side of the package lift, And a second pick-up conveying means for linearly moving the first pick-up conveying means and the second pick-up conveying means toward the left and right X-axis directions,
And an FPC loading buffer unit provided between the FPC loading unit and the film ACF bonding unit and supporting the FPC film loaded from the loading pick up unit.
The method of claim 2,
Wherein the film ACF bonding unit comprises a film ACF adhesive unit having a film reel for winding an anisotropic conductive film and a plurality of rollers and having an attachment head capable of vertical vertical reciprocating motion so as to attach an anisotropic conductive film to the FPC film, A film ACF which supports the FPC film, which is positioned in correspondence with the film ACF adhering unit and supports the FPC film supplied from the FPC transferring unit, and which supports the adhering process of the anisotropic conductive film by supplying the FPC film to the working position by the attaching head of the film ACF adhering unit, And a film ACF inspection unit for inspecting an attachment state of the anisotropic conductive film on the upper side of the film ACF stage unit.
The method of claim 4,
The film ACF stage unit includes a film stage for supporting the FPC film, a film elevating means for driving the film stage so as to reciprocate upward and downward, and an FPC film capable of linearly reciprocating forward and backward in correspondence with the film ACF adhering unit And a film correcting drive means for driving the film feed and feed means so that the twist angle of the FPC film supported on the film stage is aligned.
The method of claim 2,
The FPC buffer unit may include an FPC transfer loader for transferring the FPC film so as to be capable of being supplied from the FPC supply unit to the prebonding unit so as to be able to supply the FPC film to the prebonding unit and a FPC transferring unit for picking up the FPC film transferred between the FPC transfer unit and the FPC transferring unit, And an FPC transfer buffer for supplying the FPC transfer loader to the FPC transfer loader.
The method of claim 6,
The FPC transfer loader includes: a mounting plate movably mounted on an upper portion of the FPC film; loader elevating means for moving the mounting plate upward and downward in the Z-axis direction; And a loader drive means provided to be capable of reciprocating linearly so as to move in the Y-axis direction in the forward and backward directions.
The method of claim 6,
The FPC transfer buffer includes film pick-up means for picking up the FPC film so as to be picked up, buffer up-and-down means for supporting the film pick-up means so as to be able to move up and down in the Z-axis direction, And buffer transfer means for transferring and driving the FOF / FOG transferring device in the Y-axis direction to be transferred to the FPC transfer loader.
The method of claim 2,
The FPC transferring unit may include a first transfer unit for picking up the FPC film from the FPC loading unit and transferring the FPC film to the film ACF bonding unit so as to supply the FPC film to the film ACF bonding unit, And a second transfer unit for transferring the FPC film to be supplied,
And the second transfer unit is rotatably driven at 180 ° so as to invert the vertical direction of the FPC film picked up.

The method according to claim 1,
The panel ACF bonding unit includes a panel ACF adhesive unit having a film reel for winding an anisotropic conductive film and a plurality of rollers and having an attachment head capable of vertically reciprocating motion so as to attach an anisotropic conductive film to the panel, A panel ACF stage unit which is positioned corresponding to the ACF bonding unit and supports the panel supplied from the panel feeding part and supports the process of attaching the anisotropic conductive film by supplying the panel to the working position by the attachment head of the panel ACF bonding unit, And a panel ACF inspection unit for inspecting the attachment state of the anisotropic conductive film in correspondence with the upper side of the panel ACF stage unit.
The method of claim 10,
The panel ACF stage unit includes a panel stage for supporting the panel, a panel elevating means for driving the panel stage so as to reciprocate upward and downward, And a panel correction driving means for driving the panel to move the twist angle of the panel in the supported state on the panel stage.
The method according to claim 1,
The pre-bonding unit includes an in-line automatic FOF / FOG common bonding apparatus comprising a pre-bonding stage unit for supporting the panel in an adsorbed state on the upper side, and a pre-bonding unit for bonding the FPC film supplied from the FPC supply unit onto the panel. .
The method of claim 12,
The pre-bonding stage unit includes a suction stage for suctioning and supporting a panel, a Z-axis transfer means for driving the transfer stage so as to vertically reciprocate upward and downward to adjust the height of the suction stage, Y-axis moving means for moving the suction stage in a reciprocating manner in the forward and backward directions, X-axis moving means for moving the position of the suction stage so as to move left and right, axis driving means for driving the FOF / FOG common bonding unit to align the FOF / FOG common bonding unit.
The method of claim 12,
The pre-bonding unit includes: a bonding support member that is positioned corresponding to the pre-bonding stage unit and supports one end of the panel; and a pre-bonding head that picks up the FPC film from the FPC supply unit and presses the FPC film toward the panel positioned on the bonding support member. A head driving unit that supports the pre-bonding head and feeds the pre-bonding head in the X, Y, and Z axial directions; a first vision unit that recognizes a mounting position and an alignment state of the panel below the bonding support member; And a second vision unit disposed above the supply path of the FPC film transferred from the supply unit and recognizing the alignment state of the FPC film.
15. The method of claim 14,
Wherein the pre-bonding head includes film aligning means for aligning the twist angle of the picked up FPC film at the lower end in the? -Axis direction.
15. The method of claim 14,
Wherein the head driving means comprises: a fixed frame; an X-axis driving means having a movable frame capable of reciprocating in the X-axis direction on the fixed frame and moving the movable frame in left and right X-axis directions; A Y-axis drive means for reciprocally moving the pre-bonding head in the forward and backward Y-axis directions from the FPC supply section to the position of the bonding support member, and a support bracket for fixing and supporting the pre-bonding head on the Y- And Z-axis driving means for reciprocating the support bracket in the vertical Z-axis direction.
The method according to claim 1,
The main bonding unit includes a main bonding stage for supporting a panel in which the FPC film is preliminarily mounted on the pre-bonding unit and being provided so as to be reciprocally movable in the Y-axis direction forward and backward, A main bonding head provided at a lower end thereof with a bonding tip capable of thermo-compressing the FPC film, and a sheet supplying unit for driving the Teflon sheet to be supplied between the main bonding head and the main bonding stage In-line automatic FOF / FOG common bonding device.
The method according to claim 1,
The inverting unit may include a first inverting unit disposed between the FPC supplying unit and the panel ACF bonding unit to invert the vertical direction of the panel, and a second inverting unit disposed between the pre-bonding unit and the main bonding unit, And a second inversion unit. The inline automatic FOF / FOG common bonding apparatus includes:
19. The method of claim 18,
The first reversing unit includes first adsorption means provided to be capable of picking up the panel and capable of picking up the first adsorption means, first reverse rotation means provided to support the first adsorption means and rotatably driven at 180 degrees, And a first elevating means for supporting the means and extending vertically and vertically so as to move the panel vertically movably.
19. The method of claim 18,
The second reversing unit includes a buffer stage which supports the panel and moves and supplies the reversed position to the reversing position, and is movable in the X-axis direction and the Z-axis direction, and a second adsorption unit A second lifting means for driving the second adsorption means so as to linearly move the lifting means in the vertical direction and a second lifting means for lifting the second lifting means, And an inverting feeding means for supporting the FOF / FOG feeder so as to be linearly reciprocated in the left and right X-axis directions.
KR1020160013989A 2016-02-04 2016-02-04 In-line Auto FOF/FOG Common Bonding Apparatus KR101776859B1 (en)

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