KR100439309B1 - Apparatus and method for testing wire-bonded chip - Google Patents

Abstract

The present invention relates to a wire bonded chip test apparatus and method for minimizing the defective rate of a final semiconductor package by detecting the opening, short circuit and leakage current of the wire during the semiconductor package process.

According to an embodiment of the present invention, a wire bonded chip test apparatus may include a strip printed circuit board having at least two alignment pinholes formed thereon and contacts formed on a rear surface thereof, a protection diode connected to the contacts to protect the contacts; A plurality of alignment pins inserted into the alignment pinhole to align the strip printed circuit board to be loaded, an alignment driver for driving the alignment pins, and a plurality of contacts in contact with the strip printed circuit board A socket including socket pins of a signal supply unit, a signal supply unit for applying a test test signal to the strip printed circuit board through the socket to detect a voltage between both ends of the protection diode to check a wire short circuit, a wire opening, and a wire leakage current; And a socket driving part for raising and lowering the socket. Gong.

With this configuration, the present invention can minimize the defective rate of the final completed semiconductor package by detecting the opening, short circuit and leakage current of the wire after die bonding or wire bonding on the strip PCB.

Description

Wire Bonded Chip Test Apparatus and Method {APPARATUS AND METHOD FOR TESTING WIRE-BONDED CHIP}

The present invention relates to a wire bonded chip test apparatus, and more particularly, to a wire bonded chip test apparatus and method for minimizing a defect rate of a final completed semiconductor package by detecting the opening, short circuit and leakage current of a wire during a semiconductor package process. will be.

As technology advances, semiconductor chip manufacturing technology is also developing, and semiconductor packages are also developing in relation to the development of semiconductor chips. Accordingly, in accordance with the trend of miniaturization of various electric / electronic products, studies are being conducted to achieve a small size and high capacity by mounting a larger number of chips on a limited sized substrate.

In general, a semiconductor packaging process is a die cutting process for separating a unit semiconductor chip (hereinafter referred to as a “die”) in a good state from a wafer on which an integrated circuit is formed, and the die is cut into a strip printed circuit board (PCB). Die bonding process for attaching to the wire, wire bonding process for electrically connecting the inner lead of die and strip PCB, wire bonding process for electrically connecting the inner lead of die and strip PCB, between die and strip PCB In order to protect the wires and dies, the molding process may be performed by encapsulating with a molding resin and a trim / form process of molding an external lead into a predetermined form suitable for the mounting form. . Here, the strip PCB is a lead frame formed in a long rectangular shape to obtain a plurality of semiconductor packages at the same time through the process of die bonding, wire bonding, molding, marking, etc., It refers to a printed circuit board and circuit film. Such a strip PCB may have a form in which a plurality of units corresponding to one semiconductor package are connected in a row, or may be arranged in a matrix form in which the units have rows and columns. The die also has an upper metal layer that includes a connection pad that is typically used to form an interconnect with an external device.

Looking at the conventional semiconductor package process with reference to Figure 1 as follows.

First, the die on which a plurality of semiconductor chips are formed is cut with a diamond blade. (1S1)

The individualized die is vacuum adsorbed to bond the die onto the die pad of the strip PCB to which the adhesive is applied. (1S2) In other words, the die is bonded to the strip PCB in the die bonding process.

The bonding pads of the die and the inner leads of the strip PCB are wire bonded with conductive wires. (1S3) In other words, wire bonding connects the die to the internal leads of the strip PCB using wires.

After the wire bonding is completed, the conductive wire and the semiconductor chip are molded with a thermosetting resin to protect the external environment such as dust and foreign substances. (1S4)

Subsequently, the outer lead is cut into a predetermined shape and bent into a predetermined (trim / foam) shape to suit the mounting form. (1S5)

Once the trim / form is completed, it is individualized to complete a single semiconductor package, which is then tested and finalized before being commercialized.

In the conventional semiconductor package process, the test process is performed after the die cutting process, the die bonding process, the wire bonding process, the molding process, and the trim / form process are completed. Poor bonding state, poor lead shape, etc. are generated. Among these, defects caused by wire open, wire short, and leakage by wires may cause abnormal operation of the completed semiconductor package. This failure can short the peripheral circuits on the actual circuit.

In addition, since the above-described defects generated during the packaging process after the semiconductor packaging is detected are detected, cost and time loss occur.

Accordingly, an object of the present invention is to provide a wire bonded chip test apparatus and method for minimizing the defective rate of a final semiconductor package by detecting the opening, short circuit and leakage current of the wire during the semiconductor package process.

1 is a step by step flowchart of a conventional semiconductor package process.

2 is a flowchart illustrating a semiconductor package process step by step according to a first embodiment of the present invention.

3 is a flowchart illustrating a semiconductor package process step by step according to a second embodiment of the present invention.

4 is a flowchart illustrating a semiconductor package process step by step according to a third embodiment of the present invention.

5 is a plan view and a rear view of a strip printed circuit board according to the present invention.

6 is a perspective view schematically showing a wire bonded chip test apparatus according to the present invention.

FIG. 7 is a perspective view of the test apparatus shown in FIG. 6; FIG.

8 is a perspective view showing the socket shown in FIG.

9 is a perspective view illustrating the socket group illustrated in FIG. 7.

FIG. 10 is an exploded perspective view showing the alignment unit shown in FIG. 6. FIG.

FIG. 11 is an exploded perspective view showing the socket board, the socket and the socket board driving unit shown in FIG. 6;

12 is a flow chart for testing a strip printed circuit board in small sections according to an embodiment of the present invention.

FIG. 13 is a flowchart illustrating a wire test of a strip printed circuit board according to an embodiment of the present invention. FIG.

<Description of Symbols for Main Parts of Drawings>

501: Strip PCB 502: Indexing Hole

504: alignment hole 506: die

508: contacts 510: unit

602: Magazine Conveyor 604: Strip PCB Pusher

608: magazine holder 609: loading elevator

610: loading device 640: test device

650: marking device 670: unloading device

680: reject rail 680: unloading transfer

660: Reject Magazine 686: Unloading Magazine

710: tester 712: socket board

714: socket 720: socket board driver

724: alignment unit 728: aligner

730: aligner drive unit 801, 921: servo motor

830, 948: LM guider 950, 951: alignment pin

In order to achieve the above object, a wire bonded chip test apparatus according to an embodiment of the present invention is a strip printed circuit board having at least two alignment pinholes and contacts formed on a rear surface thereof, and connected to the contacts. A protection diode for protecting the circuit board, alignment pins inserted into the alignment pinhole for aligning the strip printed circuit board to be loaded, an alignment driver for driving the alignment pins, and the strip printed circuit board A socket including a plurality of socket pins in contact with the contacts of the circuit board, and a test test signal is applied to the strip printed circuit board through the socket to detect a voltage between both ends of the protection diode to detect a wire short circuit, a wire opening, and a wire leakage current. A signal supply unit for inspecting a and a socket for raising and lowering the socket It characterized in that it comprises a socket driver.

A socket support for supporting the socket is further provided.

The alignment pins have at least two pins positioned diagonally to each other.

The alignment pins further include an elastic member for buffering contact with the strip printed circuit board.

The strip printed circuit board is characterized in that a plurality of single units are connected in series including a single die.

The socket has a plurality of pins contacting each of the contacts formed on the back side of the single unit.

The socket has a plurality of pins forming a plurality of groups to contact a plurality of contact groups formed on the back of the strip printed circuit board.

The pins have elastic members for buffering contact with the contacts of the strip printed circuit board.

The alignment driver includes a sensor for detecting a die of the strip printed circuit board.

The signal supply unit includes a contact selector for selecting the contacts of the strip printed circuit board so that the voltage is sequentially applied.

In accordance with another aspect of the present invention, a wire bonded chip test method includes loading a strip printed circuit board in which a single unit including a single die is connected in series, aligning a strip printed circuit board to be loaded, and Contacting a plurality of socket pins with a plurality of contacts having a protection diode formed on a rear surface of a printed circuit board, and applying a test test signal to the strip printed circuit board through the socket pins to provide a voltage between the protection diodes. And detecting the wire short and the wire open and the wire leakage current.

The determining of the wire short circuit and the wire opening and the wire leakage current may include determining the wire short circuit and the wire opening by applying the voltage to the strip printed circuit board, and determining the result of the determination of the wire short circuit and the wire opening. Determining a wire leakage current for the stripped printed circuit board.

The determining of the wire short circuit, the wire opening, and the wire leakage current may be based on a small section unit corresponding to the unit length of the strip printed circuit board.

The determining of the wire short circuit, the wire opening, and the wire leakage current may be performed in units of large sections corresponding to the length of the strip printed circuit board.

And detecting the presence or absence of the die of the strip printed circuit board.

Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

With reference to Figures 2 to 13 will be described a preferred embodiment of the present invention.

Referring to FIG. 2, in the semiconductor package process according to the first embodiment of the present invention, a die is first cut by cutting a wafer in which a plurality of semiconductor chips are formed with a diamond blade (2S1).

The die is vacuum-adsorbed to bond the die onto a die pad of a strip printed circuit board (SBS) to which an adhesive is applied (2S2). In other words, in a die bonding process, the die is bonded to a strip PCB. To the junction.

The lead of the die and the inner lead of the strip PCB are wire bonded with a conductive wire (2S3). In other words, in wire bonding, the die is connected to the inner lead of the strip PCB using a wire.

A test test signal is applied to the wire bonded die and strip PCB to test the wire open, wire short, and leakage currents between the wires and the die connected between the inner leads of the strip PCB. (2S4) Here, the wire opening refers to the opening between the lead and the wire, and the wire shorting refers to the connection between adjacent wires. In addition, the wire leakage current refers to the finely adjacent so that the leakage current flows between the adjacent wires.

These short circuits and wire open and leakage currents are detected using voltage drops across the protection diodes or naturally occurring diodes connected to the contacts (input and output pins) of the strip PCB.

For example, in the wire open, wire short, and leakage current test process (hereinafter referred to as the "OS test process"), all pins are pulled low and current is applied to the protection diodes connected to the input and output pins of the strip PCB. Apply it to measure the turn-on voltage of the protection diode. The turn-on voltage of the measured protection diode is used to determine whether the device is defective or good. In addition, the wire leakage current is performed on the strip PCB which is judged to be good as a result of the wire short circuit and wire open test. At this time, the wire leakage current makes all the pins at the ground potential, and then applies a voltage to measure the current value. The measured current value is compared with the current value when it is normal to determine that the measured current value is large or small.

In the OS test process, the wire connected between the conductive wire of the strip PCB and the die, which is judged as good, is molded with thermosetting resin to protect it from dust, foreign substances, etc. (2S5).

The outer lead of the molded strip PCB is cut into a predetermined shape and bent into a predetermined (trim / foam) shape to suit the mounting form. (2S6) Accordingly, the strip PCB is individualized into one chip and commercialized.

Then, the commercialized chip is subjected to a test process including electrical characteristics, function tests, and dynamic energization tests. (2S7) In this test process, circuit characteristics and circuits are performed. Chips which are judged to be good as a result of tests for defects and the like are finally manufactured.

As such, by performing the OS test process after wire bonding in the semiconductor package process, it is possible to easily and quickly detect defective devices and improve productivity.

Referring to FIG. 3, in the semiconductor package process according to the second embodiment of the present invention, a die is first cut by cutting a wafer on which a plurality of semiconductor chips are formed with a diamond blade (3S1).

The die is vacuum adsorbed to bond the die onto the die pad of the strip PCB to which the adhesive is applied (3S2), i.e., the die is bonded to the strip PCB in the die bonding process.

The pad of the die and the inner lead of the strip PCB are wire-bonded with a conductive wire (3S3). In other words, the wire is used to connect the die with the inner lead of the strip PCB.

After the wire bonding is completed, the wire connected between the conductive wire and the die is molded with a thermosetting resin to protect the external environment such as dust and foreign matters (3S4).

When the molding process is completed, solder balls are formed on the contacts formed on the back of the strip PCB. Solder balls are soldered to the contacts on the strip PCB and used for contact when mounted in the system.

The test inspection signal is applied to the die molded by the thermosetting resin and the strip PCB to test the wire opening, the wire short circuit and the leakage current described above for the wires and the die connected between the inner leads of the strip PCB. (3S5)

In the OS test process, when solder balls are formed on the back side of the strip PCB, test signals are applied through the solder balls. When solder balls are not formed on the back side of the strip PCB, the solder balls are formed on the back side of the strip PCB. The test is applied by applying a test test signal through the contacts.

In the OS test process, the external lead of the strip PCB, which is judged to be good, is cut into a predetermined shape and bent into a predetermined (trim / form) shape so as to be suitable for the mounting type. And become a product.

Then, the commercialized chip is subjected to a test process including electrical characteristics, function tests, and dynamic energization tests. (3S7) In this test process, circuit characteristics and circuits are performed. Chips which are judged to be good as a result of tests for defects and the like are finally manufactured.

As such, by performing the OS test process after molding in the semiconductor package process, it is possible to easily and quickly detect defective devices and improve productivity.

Referring to FIG. 4, in the semiconductor package process according to the third embodiment of the present invention, a die is first cut by cutting a wafer on which a plurality of semiconductor chips are formed with a diamond blade (4S1).

The die is vacuum-adsorbed to bond the die onto the die pad of the strip PCB to which the adhesive is applied (4S2). In other words, the die is bonded to the strip PCB in the die bonding process.

The bonding pad of the die and the inner lead of the strip PCB are wire-bonded with conductive wires (4S3). In other words, the wire bonding is used to connect the die with the inner lead of the strip PCB.

Then, the test test signal is applied to the die and the strip PCB by wire bonding to perform the first OS test on the inside of the die and the wires connected between the inner leads of the strip PCB as described above. (4S4)

The connected wire between the conductive wire of the strip PCB and the die which is judged to be good by the first OS test and the die is molded with a thermosetting resin so as to protect it from the external environment such as dust and foreign matter. (4S5)

When the molding process is completed, solder balls are formed on the contacts formed on the back of the strip PCB. Solder balls are soldered to the contacts on the strip PCB and used for contact when mounted in the system.

A test test signal is applied to the die molded by the thermosetting resin and the strip PCB to perform the second OS test on the inside of the wire and the die connected between the inner leads of the strip PCB as described above. (4S6)

In the second OS test, when solder balls are formed on the back side of the strip PCB, test signals are applied through the solder balls, and when solder balls are not formed on the back side of the strip PCB, the solder PCB is formed on the back side of the strip PCB. The test is performed by applying a test test signal through the formed contacts.

The external lead of the strip PCB, which is judged to be good by the second OS test, is cut into a predetermined shape and bent into a predetermined (trim / foam) shape to fit the mounting form. (4S7) Accordingly, the strip PCB is divided into one Individualized into chips and commercialized.

Then, the commercialized chip is subjected to a test process including electrical characteristics, function tests, and dynamic energization tests. (4S8) In this test process, circuit characteristics and circuits are performed. Chips which are judged to be good as a result of tests for defects and the like are finally manufactured.

As described above, the strip PCB 501 is manufactured by the semi-assembly package process according to the present invention.

Referring to FIG. 5, the strip PCB 501 has a plurality of units 510 connected in series with the internal wiring of the strip PCB 501 and the leads of the die 506 connected by wire bonding. In addition, the strip PCB 501 may include indexing holes 502 formed at one side of each unit 510, alignment holes 504 formed at corners of each unit 510, and each unit 510. It has a plurality of contacts 508 formed on the rear surface to expose each of the internal wiring of the outside.

Indexing holes 502 are used to transport strip PCB 501, and alignment holes 504 are used to align strip PCB 501. The contacts 508 are in electrical contact with the socket pins of the test apparatus described below to receive a test test signal.

As such, the wire bonded chip test apparatus for performing a wire test process on the completed strip PCB 501 is installed at one side of the support frame 600 as shown in FIG. A loading device 610 for loading, a test device 640 for determining good quality and defects by inspecting wire short circuits, wire openings, and wire leakage currents of the strip PCB 501 loaded from the loading device 610; The unloading device 670 for separating and unloading the strip PCB 501 according to the determination result of the test, and the strip PCB 501 installed between the test device 640 and the unloading device 670 and determined to be defective. And a marking device 650 for displaying the defect mark so as to be distinguishable.

The loading device 610 transfers the strip PCB 501 illustrated in FIG. 5 to a small section corresponding to the length of the unit, or to a large section corresponding to the length of the strip PCB 501 so as to test the device 640. Load in.

The test device 640 applies a first test test signal to the loaded strip PCB 501 to test the wire short circuit and the wire open. Then, the second test test signal is applied to the strip PCB 501 determined as a good result of the wire test to test the wire leakage current to determine a final good or bad.

The marking device 650 displays a defect mark so as to be distinguishable from the strip PCB 501 determined as defective in the test apparatus 640.

The unloading device 670 separates and unloads the strip PCB 501 having completed the wire test into good and bad.

The wire bonded chip test apparatus will be described in detail. First, the loading apparatus 610 of the wire bonded chip test apparatus includes a magazine conveyor 602 for storing magazines in which a plurality of strip PCBs 501 are stacked, and a magazine conveyor ( A magazine holder 608 for picking up a magazine housed in 602, a loading elevator 609 for raising and lowering the magazine holder 608, and a strip PCB 501 in a magazine picked up by the magazine holder 608. Strip PCB pusher 604 for withdrawing the strip PCB and strip PCB feeding device for transferring the strip PCB 501 drawn by the strip PCB pusher 604 to the test apparatus 640. 612.

The magazine conveyor 602 stores a number of magazines by a worker. A plurality of strip PCBs 501 are stacked on each of the plurality of magazines.

The magazine holder 608 serves to pick up a magazine in which the strip PCBs 501 are stacked in the magazine conveyor 602 in a vertical direction, and to unload an empty magazine in the magazine conveyor 602. The magazine holder 608 corresponds to the size of the magazine.

The loading elevator 609 is driven by a stepper motor. The loading elevator 609 lowers and raises the magazine holder 608 so that the magazine holder 608 can pick up the magazine, and raises the picked-up magazine by one step.

The strip PCB pusher 604 pushes the strip PCB 501 stacked on the magazine picked up in the magazine holder 608 one by one toward the strip PCB feeding device 612. That is, the strip PCB 501 stacked in the magazine is drawn out one by one by the strip PCB pusher 604 and loaded into the strip PCB feeding device 612.

The strip PCB feeding device 612 is a device for stably transferring the loaded strip PCB 501 to the test device 640. To this end, the strip PCB feeding device 612 is a material for transferring the transfer rail 614 on which the strip PCB 501 is seated, and the strip PCB 501 seated on the transport rail 614 to the test apparatus 640. It further comprises a first indexing unit 616 and a loading transfer 618 for driving the first indexing unit 616.

The transfer rail 614 is bent in an “L” shape to stably transport the strip PCB 501 loaded by the strip PCB pusher 604 and protects the strip PCB 501 from damage such as static electricity.

The transfer rail 614 further includes a rail variable device 620 for automatically changing the size of the transfer rail 614 to correspond to the size of the strip PCB 501.

The rail variable system 620 detects the size of the strip PCB 501 to be loaded and drives the step motor according to the detected signal to automatically change the size of the transfer rail 614.

The loading transfer 618 is provided with a first indexing unit 616. The loading transfer 618 serves to drive the first indexing unit 616 horizontally by a step motor. In addition, the loading transfer 618 is provided with safety devices (not shown) for protecting the strip PCB 501 when the first indexing unit 616 indexes the strip PCB 501.

The first indexing unit 616 adds a first indexing pin for indexing the strip PCB 501 seated on the transfer rail 614 and a servomotor for raising and lowering the first indexing pin. It is provided with.

The first indexing pin is lowered by the servo motor to index the strip PCB 501 seated on the transport rail 614 and transported along the transport rail 614. That is, the first indexing pin is lowered by the servo motor and indexed into the indexing hole 502 of the strip PCB 501.

The test apparatus 640 includes a tester 710 for inspecting wire open, wire short circuit and wire leakage current with respect to the strip PCB 501 loaded from the loading apparatus furnace 610 as shown in FIG. The socket 714 for applying the test signal supplied from the 710 to the strip PCB 501, the socket board 712 for supporting the socket 714, and the socket board 712 in the vertical direction A socket board driver 720 for transferring and an alignment unit 724 for aligning the strip PCB 501 seated on a rail (not shown) are provided.

The tester 710 controls a plurality of pincards 716 and pincards 716 for individually selecting the contacts formed on the back side of the strip PCB 501, while opening the wires, shorting the wires, and wire leakage currents. It is provided with a main board (not shown) for applying a test test signal to the strip PCB 501 to check the.

The pin card 716 individually selects the contacts formed on the rear surface of the strip PCB 501 to supply a test test signal from the main board to the strip PCB 501. At this time, the pin card 716 is provided with a plurality so as to correspond to the different contacts because the number of the contacts formed on the back side depends on the size of the strip PCB (501). This requires one pin card 716 if the contacts 508 of the strip PCB 501 are 128, and two pin cards 716 if the contacts 508 of the strip PCB 501 are 256. Because it requires.

The socket 714 has socket pins in electrical contact with each of the plurality of contacts 508 formed on the back side of the strip PCB 501. The socket pins are in contact with the contacts 508 of the strip PCB 501 as the socket board 712 is raised to apply a test test signal from the tester 710 to the strip PCB 501.

Meanwhile, as described above, the socket 714 has socket pins for electrically contacting the contacts 508 of the strip PCB 501. The number of the sockets 714 varies depending on a wire test method. That is, the wire test method of the test apparatus 640 includes a method of inspecting the unit 510 of the strip PCB 501 as shown in FIG. 5, and a strip PCB 501 having a plurality of units 510 connected in series. ) Can be distinguished in the way of checking the whole at once.

In the method of inspecting the unit of the strip PCB 501 by the unit 510, the socket 714 may be formed by the contacts formed on the rear surface of one unit 510 on the socket frame 901. The socket pins 902 are installed to correspond to the 508. These, socket pins 902 are sequentially in contact with each unit 510 connected in series on the strip PCB 501 during the wire test test.

In the manner of inspection in units of strip PCB 501, socket 714 is connected to contacts 508 of each unit 510 of strip PCB 501 on socket frame 910 as shown in FIG. 9. The socket pin group 902 is installed to correspond. The socket pin group 902 is in contact with each unit 510 connected in series on the strip PCB 501 during the wire test test.

The socket 712 is used by changing only the socket frame (901, 910) according to the wire test method.

The socket board 712 supports the socket 714 and also connects the tester 710 and the socket 714 to supply the test test signal from the tester 710 to the socket 714.

The socket board driver 720 transfers the socket board 712 in the vertical direction by using a servo motor.

The alignment unit 724 includes a die sensing unit 726 for detecting die bonding failure on the strip PCB 501, an aligner 728 for aligning the strip PCB 501 seated on the rail, An aligner driver 730 is further provided to drive the aligner 728.

The die sensing unit 726 detects the bonding of the die on the strip PCB 501 loaded in the test apparatus. In the case of the unit 510 without a die mounted on the strip PCB 501, the die sensing unit 726 detects this and performs a wire test on the unit 510 of the strip PCB 501 without the die mounted. Instead, the next unit 510 of the strip PCB is wire tested.

The aligner 728 has indexing pins for indexing the align holes 504 in the diagonal direction among the align holes 504 of the strip PCB 501 as shown in FIG. 5. Indexing pins are installed diagonally to align the strip PCB 501 on the rails.

The aligner driver 730 transfers the aligner 728 in the vertical direction so that the aligner 728 indexes the strip PCB 501 by using a servo motor.

Such a wire bonded chip test apparatus will be described in detail with reference to FIGS. 10 and 11 as follows.

First, in the test apparatus, the aligner driver 730 of the align unit 724 is assembled with the first and second sidewall frames 942 and 944 and the upper and lower frames 946 as shown in FIG. 10. A body frame, a fixed bracket 925 mounted on the first side wall frame 942, a second servomotor 921 mounted on the fixed bracket 925, and a second mounted horizontally on the fixed bracket 925. A servo motor bracket 926, a guide bracket 923 mounted perpendicular to the fixed bracket 925, and a second LM guider 948 provided on the guide bracket 923 are provided.

The fixing bracket 925 is coupled to the first side wall frame 942 by screws, and the guide bracket 923 is vertically coupled to the end of the fixing bracket 925. In addition, a second servomotor 921 is installed on the rear surface of the fixed bracket 925, and the second servomotor bracket 926 is inserted into the upper surface of the fixed bracket 925 so as not to flow and is coupled by screws.

The second servomotor 921 is installed on the second servomotor bracket 926 by screws to rotate the bearing and the second belt pulley 927.

The second LM guider 948 includes a second slider 924 in which the aligner 728 is installed, and an LM rail 922 for guiding the transfer of the second slider 924.

The LM rail 922 is installed in the guide bracket 923 by a screw, and a groove for guiding the transfer of the second slider 924 is formed. That is, the LM rail 922 is in the form of "I".

The second slider 924 is a protrusion bent at both ends is inserted into the groove of the guide bracket 923 is transferred in the vertical direction to raise and lower the aligner 728.

The guide bracket 923 is provided with sensors 962 for detecting rising and falling of the aligner 728. These sensors 962 are lowered excessively when the aligner 728 descends to prevent damage to the strip PCB 501.

The aligner 728 is spaced between the third and fourth servomotor brackets 918 and 932 and the third and fourth servomotor brackets 918 and 932 which are spaced vertically at a predetermined interval and installed in the guide bracket 923. An aligner in which a second ball screw 916 to be installed, a ball screw block 964 through which the second ball screw 916 passes, and first and second aligner pins 950 and 951 are installed in a diagonal direction. A bracket 952 is provided.

One end of the second ball screw 916 is coupled to the third belt pulley 930 through the flange bearing, the lock nut, the fourth servomotor bracket 932, the bearing and the lock nut, and the other end of the second ball screw 916. Silver is coupled to the third servomotor bracket 918 through a bearing.

In addition, the second ball screw 916 is provided with a second ball screw bracket 933. The second ball screw bracket 933 is installed to the ball screw block 964 by screws.

The ball screw block 964 is installed to the guide bracket 923 by screws. Also, an aligner bracket 952 is installed on the rear surface of the ball screw block 964 by screws.

The aligner bracket 952 is installed on the rear surface of the ball screw block 964 and includes first and second alignment pin holes into which the first and second alignment pins 950 and 951 are inserted.

First and second alignment pins 950 and 951 pass through the first and second alignment pin holes, respectively. In this case, one end of the first and second alignment pins 950 and 951 through which the second springs 956 and 957 and the pin bushes 958 and 959 pass, and the head through which the head bushes 954 and 955 pass through The other ends of the first and second alignment pins 950 and 951 are indexed into the first and second alignment pin holes.

The first and second alignment pins 950 and 951 inserted into the first and second alignment pin holes align the strip PCB 501 seated on the rail by the elastic force of the second springs 956 and 957. Done. At this time, when mis-indexing of the first and second alignment pins 950 and 951 occurs, the first and second alignment pins 950 and 951 are raised by the second springs 956 and 957. The strip PCB 501 is prevented from being damaged due to miss indexing of the first and second alignment pins 950 and 951.

In addition, sensors 960 and 961 for detecting a mis-indexing error of the strip PCB 501 by the first and second alignment pins 950 and 951 are installed in the aligner bracket 952. The sensors 960 and 961 notify the worker through a buzzer when miss indexing of the first and second alignment pins 950 and 951 occurs.

As the aligner driver 730 and the aligner 728 rotate the second servomotor 921, the rotational force of the second servomotor 921 is the third belt pulley 927 and the second belt 908. And it is transmitted to the fourth belt pulley 930 to the second ball screw 916 to rotate forward. As the second ball screw 916 rotates forward, the ball screw block 964 is lowered by the second ball screw bracket 933 installed in the ball screw block 964, and at the same time, the first and second alignment pins 950 are provided. , 951 is lowered and indexed into an alignment hole on the strip PCB 501 so that the strip PCB 501 is aligned on the rail.

On the contrary, when the second servomotor 921 is rotated in reverse, the second ball screw 916 is rotated in reverse to raise the ball screw block 964 and at the same time the first and second alignment pins 950, 951) is raised.

Meanwhile, as illustrated in FIG. 11, the socket board driver 720 of the test apparatus includes a vertical frame 800 in which the first servo motor 801 is installed, and a first servo motor 801 installed in the vertical frame 800. LM guider block 812 for converting the rotational motion of the linear motion into a linear motion, and a horizontal frame portion 820 mounted to the LM guider block 812 and supporting the socket board 712.

The vertical frame 800 is provided with a first servomotor bracket 802 for mounting the first servomotor 801. The first servomotor 801 is fixed to the first servomotor bracket 802 to rotate the first belt pulley 804. Accordingly, the rotational force of the first servomotor 801 is transmitted to the LM guider block 812 through the bearing, the first belt pulley 804 and the first belt 805.

The LM guide block 812 includes a drive shaft including a first ball screw 810 and a first ball screw bracket 832 to which the rotational force of the first servomotor 801 is transmitted, and the LM guide rail 808 and the first. A first LM guider 830 is mounted that includes a slider 809.

One end of the first ball screw 810 is installed in the first first ball screw bracket 831 through a bearing, and the other end is provided through a plurality of bearings and the first and second first ball screw brackets 807 and 831. 2 belt pulley 806 is installed.

The first ball screw bracket 807 screwed to the first ball screw 810 is installed and fixed to penetrate the LM guider block 812.

The first slider 809 of the first LM guider 830 has protrusions bent in the form of "L" at both ends and is installed at both ends of the LM guide block 812. The LM guide rail 808 has a groove for inserting the protrusion of the first slider 809 and guides the transfer of the first slider 809. In other words, the LM guide rail 808 has a "I" shape.

The horizontal frame portion 820 includes triangles 821, a plate plate 822, and sidewall plates 823 and 824. That is, the triangles 821 are coupled to both ends of the LM guider block 812 by screws, the plate plate 822 is horizontally coupled to the triangles 821 by screws, the socket board 712 The sidewall plates 823 and 824 to which the treads are mounted are coupled to both ends of the plate plate 822 by screws.

The socket board 712 includes a horizontal plate 850 on which the socket 714 is installed, a wiring plate 852 for electrically connecting the tester and the socket 714 of the wire bonded chip test apparatus, and a wiring plate 852. A support plate 854 coupled to the horizontal plate 850 to support the wiring plate 852, and a support plate buffer member 856 for buffering the support plate 854 when the support plate 854 is raised. .

The support plate buffer member 856 buffers the excessive rise of the socket board 712 by the socket board driver 720 to prevent damage to the strip PCB 501. To this end, the support plate buffer member 856 is located between the buffer plate plate 848 coupled to the support plate 854 by a plurality of screws 846, and the buffer plate plate 848 and the support plate 854 to provide a screw ( A ball bush 842 through which the ball 846 passes, and a first spring 840 positioned between the ball bush 842 and the support plate 854, through which the screw 846 passes.

The buffer plate 856 is coupled to the side wall plates 823 and 824 of the horizontal frame portion 820 by screws. In addition, the support plate 854 is coupled to the support plate 854 by a screw 846 that passes through the buffer plate 856, the ball bush 842, and the first spring 840 and is screwed into a screw hole formed in the support plate 854.

Accordingly, the buffer plate 856 is buffered to be excessively raised by the first spring 840 when the buffer plate 856 is raised by the first servomotor 801. That is, the socket pins of the socket 712 are raised by the first servomotor 801 for a predetermined period, and then contact the contacts of the strip PCB 501 by the elastic force of the first spring 840.

In this, the socket board driving unit 720 is a rotational force of the first servomotor 801 is transmitted to the first belt pulley 804, the first belt 805, the second belt pulley 807, the first ball screw 810 ) Will rotate forward. As the first ball screw 810 rotates forward, the LM guide block 812 is raised by the first ball screw bracket 832 installed in the LM guide block 812 and the socket board 712 is raised to raise the socket board. The socket pins of 712 are in electrical contact with the contacts 508 of the strip PCB 501 to perform a wire test by the method described above. In addition, as the first servomotor 801 reversely rotates after the wire test, the first ball screw 810 is reversely rotated so that the LM guider block 832 is provided by the first ball screw bracket 832 installed in the LM guider block 812. At the same time as the 812 is lowered, the socket board 712 is lowered.

Meanwhile, the wire bonded chip test apparatus according to the present invention has a step transfer 665 for transferring the wire-tested strip PCB 501 from the test apparatus 640 to the unloading apparatus 670 as shown in FIG. 6. It is further provided.

The step transfer 665 transfers the wire-tested strip PCB 501 in the test device 640 according to the wire test method of the test device 640. That is, the step transfer 665 transfers the strip PCB 501 in small sections or large sections.

To this end, the step transfer 665 is provided with a second indexing unit 667 for indexing and transporting the strip PCB 501. The second indexing unit 667 is driven by the step motor of the step transfer 665 to transfer the strip PCB 501 on the test device 640 to the marking device 650.

In this way, the strip PCB 501 determined as good in the test apparatus 640 is unloaded to the unloading apparatus 670 by the step transfer 665, while the strip PCB 501 determined as defective is the marking apparatus. The defect mark is marked by 650 on the strip PCB 501 and then unloaded into the unloading device 670. The marking unit 650 is driven by a host system that stores the wire test result in the wire test apparatus 512 and controls the marking unit 650 according to the stored wire test result.

As shown in FIG. 6, the unloading apparatus 670 includes a reject rail 680 for separating and unloading the strip PCB 501 according to a wire test result from the test apparatus 640, and a strip determined as good quality. Unloading transfer 684 for unloading the PCB 501, reject transfer 685 for unloading the PCB 501 determined to be defective, and a good strip conveyed from the unloading transfer 684. Unloading magazine 686 for stacking PCB 501, unloading elevator 688 for picking up one magazine from unloading magazine 686, and reject magazine for stacking bad strip PCB 501 ( 660).

The reject rail 542 moves horizontally toward the reject transfer 685 by a host system, not shown, only when the seated defective strip PCB 501 is transferred to the reject transfer 685.

The unloading transfer 684 stacks an unillustrated gripper for picking up the good strip PCB 501 on the reject rail 680 and a strip PCB 501 picked up by the gripper on the unloading magazine 686. It is further provided with a pusher not shown which pushes as much as possible.

The gripper picks up the strip PCB 501 on the reject rail 680 by a driving device (not shown) and then is transported close to the unloading magazine 686. As the strip PCB 501 approaches the unloading magazine 686, the pusher is positioned behind the strip PCB 501 as the gripper is raised and transported to the back of the strip PCB 501. A pusher located at the back of the strip PCB 501 pushes the strip PCB 501 to stack the strip PCB 501 in the magazine of the unloading magazine 686.

To this end, the unloading magazine 686 is provided with a magazine in which a plurality of strip PCBs 501 are pushed by the pusher. The unloading elevator 688 uses a magazine holder to raise and lower the magazine of the unloading magazine 686 so that the strip PCBs 501 can be stacked in the magazine.

The reject transfer 685 has a pusher for pushing the bad strip PCB 501 on the reject rail 680.

The pusher is driven by the first and second cylinders not shown. The first and second cylinders buffer the pushing force of the pusher to prevent excessively pushing the strip PCB 501 seated on the rail of the reject rail 680 toward the reject magazine 660.

The defective strip PCB 501 transferred to the reject transfer 685 is laminated to the magazine of the reject magazine 660 by a pusher installed in front of the reject rail 680.

12 is a flowchart illustrating a wire test in a unit unit of a strip PCB, that is, a small section unit, in a wire bonded chip test apparatus according to an exemplary embodiment of the present invention.

12 will be described with reference to FIG. 7. In the wire bonded chip test apparatus according to the embodiment of the present invention, the strip PCB 501 is first loaded into the test apparatus 640 by the loading apparatus 610. (12S1)

When the strip PCB 501 is loaded on the rail of the test apparatus 640, the first and second alignment pins 950 and 951 of the aligner 728 are moved by the alignment driver 730 illustrated in FIG. 11. Will descend. (12S2)

As the first and second alignment pins 950 and 951 descend, the strip PCB 501 loaded in the test device 501 is realigned on the rail. (12S3)

Subsequently, the socket board 712 is raised by the socket board driver 720 so that the socket pins 902 of the socket 714 are in electrical contact with the contacts 510 of the strip PCB 501. (12S4)

As the socket pins 902 come into contact with the contacts 510 of the strip PCB 501, a first test test signal is applied from the main board of the tester 710 to test the wire short circuit and the wire opening with respect to the strip PCB. . When the goodness of the wire test result of the strip PCB 501 is determined, a second test test signal is applied from the main board of the tester 710 to test the wire leakage current with respect to the strip PCB 501. (12S5)

As described above, when the test result of the wire short circuit, the wire opening, and the wire leakage current are all good for the strip PCB 501, the socket board 712 is lowered by the socket board driver 720. (12S6)

The aligner 728 is then lifted by the aligner driver 730. (12S7) Subsequently, the strip PCB 501 loaded on the test apparatus 640 is transferred one step by the step transfer 665 of the unloading apparatus 670 described later, and the next unit 510 is transferred to the test apparatus 640. Is loaded. (12S8)

The first and second align pins of the aligner 728 raised by the align driver 730 shown in FIG. 11 when the next unit 510 of the one step transferred strip PCB 501 is loaded into the test apparatus. 950 and 951 are lowered again. (12S2)

As the first and second align pins 950 and 951 descend, the strip PCB 501 loaded in the test device 640 is realigned on the rails. (12S3)

Subsequently, the socket board 712 is raised by the socket board driver 720 so that the socket pins 902 of the socket 714 are in electrical contact with the contacts 510 of the strip PCB 501. (12S4)

As the socket pins 902 come into contact with the contacts 510 of the strip PCB 501, a first test test signal is applied from the main board of the tester 710 to prevent wire shorting and wire opening with respect to the strip PCB 501. Will be tested. When the goodness of the wire test result of the strip PCB 501 is determined, a second test test signal is applied from the main board of the tester 710 to test the wire leakage current with respect to the strip PCB 501. (12S5)

As described above, when the test result of the wire short circuit, the wire opening, and the wire leakage current are all good for the strip PCB 501, the socket board 712 is lowered by the socket board driver 720. (12S6)

The aligner 728 is then lifted by the aligner driver 730. (12S7) Then, the strip PCB 501 loaded on the test apparatus 640 is transferred one step by the step transfer 665 of the unloading apparatus 670 so that the next unit 510 of the strip PCB 501 is tested. Loaded into device 640. (12S8)

When the wire test is completed for all units 510 of the strip PCB 501 by repeating the above-described process, the strip PCB 501 is unloaded to the unloading device 670 by the step transfer 665.

On the other hand, the defective strip PCB 501 which is determined to be defective in the test apparatus 640 is transferred to the marking unit 650 shown in FIG. 6 by the step transfer 665. The defective mark is displayed on the defective strip PCB transferred to the marking unit 650 by the marking unit 650. (12S11)

When the bad strip PCB 501 marked with a bad mark is transferred to the reject rail 680 shown in FIG. 6, the reject rail 680 is moved toward the reject transfer 685 under the control of the host system. When the reject rail 680 is finished moving towards the reject transfer 685, the pusher pushes and rejects the bad strip PCB 501 on the reject rail 680 as the first and second cylinders are driven. The rails of the transfer 685 are stacked in the magazine of the reject magazine. (12S12)

On the other hand, Figure 13 is a wire bonded chip test apparatus according to an embodiment of the present invention, a flow chart for a wire test of the strip PCB in units of a long section corresponding to the length of the strip PCB.

13 will be described with reference to FIG. 7. First, the strip PCB 501 is loaded into the test apparatus 640 by the loading apparatus 610. (13S1) When the strip PCB 501 is loaded on the rail of the test apparatus, the first and second alignment pins 950 and 951 of the aligner 728 are moved by the alignment driver 730 shown in FIG. 11. Will descend. (13S2)

As the first and second align pins 950 and 951 descend, the strip PCB 501 loaded in the test device 640 is realigned on the rails. (13S3)

Subsequently, the socket board 712 is raised by the socket board driver 720 so that the socket pins 902 of the socket 714 are in electrical contact with the contacts 510 of the strip PCB 501. (13S4)

As the socket pins 902 come into contact with the contacts 510 of the strip PCB 501, a first test test signal is applied from the main board of the tester 710 to prevent wire shorting and wire opening with respect to the strip PCB 501. Will be tested. When the goodness of the wire test result of the strip PCB 501 is determined, a second test test signal is applied from the main board of the tester 710 to test the wire leakage current with respect to the strip PCB 501. (13S5)

As described above, when the test result of the wire short circuit, the wire opening, and the wire leakage current are all good for the strip PCB 501, the socket board 712 is lowered by the socket board driver 720. (13S6)

The aligner 728 is then lifted by the aligner driver 730. (13S7) Subsequently, the good strip PCB 501 is unloaded to the step transfer 665 with the unloading device 670 and laminated to the magazine of the reject magazine. (13S8)

On the other hand, the defective strip PCB 501 which is determined to be defective in the test apparatus 640 is transferred to the marking unit 650 shown in FIG. 6 by the step transfer 665. The defect mark is displayed by the marking unit 650 on the defective strip PCB 501 transferred to the marking unit 650. (13S9)

When the bad strip PCB 501 marked with a bad mark is transferred to the reject rail 680 shown in FIG. 6, the reject rail 680 is moved toward the reject transfer 685 under the control of the host system. When the reject rail 680 is finished moving towards the reject transfer 685, the pusher pushes and rejects the bad strip PCB 501 on the reject rail 680 as the first and second cylinders are driven. The rails of the transfer 685 are stacked in the magazine of the reject magazine. (13S10)

As described above, the wire bonded chip test apparatus and method according to the present invention can minimize the defective rate of the final finished semiconductor package by detecting the opening, short circuit and leakage current of the wire after die bonding or wire bonding on the strip PCB. have.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (15)

A strip printed circuit board having at least two alignment pinholes formed thereon and having contacts formed on a rear surface thereof; A protection diode connected to the contacts to protect the contacts; Alignment pins inserted into the alignment pinhole to align the strip printed circuit board being loaded; An alignment driver for driving the alignment pins; A socket comprising a plurality of socket pins in contact with the contacts of the strip printed circuit board; A signal supply unit for applying a test test signal to the strip printed circuit board through the socket to detect a voltage between both ends of the protection diode to check wire short circuit, wire open, and wire leakage current; And a socket driver for raising and lowering the socket. The method of claim 1, And a socket support for supporting the socket. The method of claim 1, And the alignment pins include at least two pins positioned diagonally to each other. The method of claim 3, wherein And the alignment pins further include an elastic member for buffering contact with the strip printed circuit board. The method of claim 1, The strip printed circuit board is a wire bonded chip test apparatus, characterized in that a plurality of single units are connected in series including a single die. The method of claim 5, wherein And the socket has a plurality of pins in contact with each of the contacts formed on the back side of the single unit. The method of claim 5, wherein And the socket has a plurality of pins forming a plurality of groups to contact the plurality of contact groups formed on the rear surface of the strip printed circuit board. The method of claim 5, wherein And the pins are provided with an elastic member for buffering contact with the contacts of the strip printed circuit board. The method of claim 5, wherein And the alignment driver includes a sensor for detecting a die of the strip printed circuit board. The method of claim 1, And the signal supply unit includes a contact selector for selecting the contacts of the strip printed circuit board to sequentially apply the voltage. Loading a plurality of strip printed circuit boards connected in series by a single unit including a single die; Aligning the strip printed circuit board loaded; Contacting a plurality of socket pins with a plurality of contacts having a protection diode formed on a back side of the strip printed circuit board; And applying a test test signal to the strip printed circuit board through the socket pin to detect a voltage between the both ends of the protection diode to determine a wire short circuit, a wire open, and a wire leakage current. Testing method. The method of claim 11, Determining the wire short circuit and wire open and wire leakage current, Applying a test test signal to the strip printed circuit board to determine wire short and wire open; And determining a wire leakage current with respect to the strip printed circuit board which is determined to be good as a result of the wire short circuit and the wire open. The method of claim 11, Determining the wire short circuit and wire open and wire leakage current, The wire-bonded chip test method according to claim 1, characterized in that it is determined in units of small sections corresponding to the unit length of the strip printed circuit board. The method of claim 11, Determining the wire short circuit and wire open and wire leakage current, The wire bonded chip test method according to claim 1, characterized in that determined in units of large sections corresponding to the length of the strip printed circuit board. The method of claim 11, And detecting the presence or absence of said die of said strip printed circuit board.