KR100514040B1 - Marking apparatus - Google Patents

Abstract

The present invention relates to a marking apparatus that makes it possible to identify a defective printed circuit board by displaying a defect mark by detecting an opening, a short circuit and a leakage current of a wire during a semiconductor package process.

The marking device includes a strip printed circuit board; A storage unit for storing the water-soluble ink, an absorbing member for absorbing the water-soluble ink stored in the storage unit, a marking unit for contacting the strip printed circuit board to mark the water-soluble ink on the strip printed circuit board, and the A stamp for marking the water-soluble ink on the strip printed circuit board, including a capillary tube formed between a storage portion and the marking portion to supply the water-soluble ink uniformly supplied from the absorbing member to the marking portion; A stamp fixing part for fixing the stamp; And a driving part for raising and lowering the stamp fixing part to contact and separate the stamp from the strip printed circuit board.

By such a configuration, the present invention makes it possible to identify a defective printed circuit board by displaying a defective mark on the defective strip printed circuit board which is determined to be defective in a test apparatus.

Description

Marking Device {MARKING APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a marking apparatus, and more particularly, to a marking apparatus capable of identifying a defective printed circuit board by displaying a defect mark by detecting an opening, a short circuit and a leakage current of a wire during a semiconductor package process.

As technology advances, semiconductor chip manufacturing technology is also developing, and semiconductor packages are also developing in relation to the development of semiconductor chips. Accordingly, in accordance with the trend of miniaturization of various electric / electronic products, studies are being conducted to achieve a small size and high capacity by mounting a larger number of chips on a limited sized substrate.

In general, a semiconductor packaging process is a die cutting process for separating a unit semiconductor chip (hereinafter referred to as a “die”) from a wafer in which an integrated circuit is formed, and a die and strip printed circuit board (PCB) of the cut die. A wire bonding process for electrically connecting leads, a molding process for encapsulating a semiconductor chip and an electrically connected portion thereof with a molding resin, and a trim for molding an external lead into a predetermined shape so as to be suitable for mounting. It can be obtained by going through a trim / form process. Here, the strip PCB is a lead frame formed in a long rectangular shape to obtain a plurality of semiconductor packages at the same time through the process of die bonding, wire bonding, molding, marking, etc., It refers to a printed circuit board and circuit film. Such a strip PCB may have a form in which a plurality of units corresponding to one semiconductor package are connected in a row, or arranged in a matrix form in which the units have rows and columns. The die also has an upper metal layer that includes a connection pad that is typically used to form an interconnect with an external device.

Looking at the conventional semiconductor package process with reference to Figure 1 as follows.

First, the die on which a plurality of semiconductor chips are formed is cut with a diamond blade. (1S1)

The individualized die is vacuum adsorbed to bond the die onto the die pad of the strip PCB to which the adhesive is applied. (1S2) In other words, the die is bonded to the strip PCB in the die bonding process.

The bonding pads of the die and the inner leads of the strip PCB are wire bonded with conductive wires. (1S3) In other words, wire bonding connects the die to the internal leads of the strip PCB using wires.

After the wire bonding is completed, the conductive wire and the semiconductor chip are molded with a thermosetting resin to protect the external environment such as dust and foreign substances. (1S4)

Subsequently, the outer lead is cut into a predetermined shape and bent into a predetermined (trim / foam) shape to suit the mounting form. (1S5)

Once the trim / form is completed, it is individualized to complete a single semiconductor package, which is then tested and finalized before being commercialized.

In the conventional semiconductor package process, since the test process is performed after the die cutting process, the die bonding process, the wire bonding process, the molding process, and the trim / foam process are completed, various defects during the semiconductor package process, that is, damage to the die, Poor wire bonding state, poor lead shape, etc. are generated. In particular, defects caused by wire open, wire short, and leakage by the wire may cause individual abnormal operation. This failure can short the peripheral circuits on the actual circuit.

Such defects in the semiconductor package are marked on the semiconductor packaging so that an operator can identify the defect. Such a defect marking is displayed by manual labor, thereby increasing the processing time.

Accordingly, it is an object of the present invention to provide a marking apparatus which makes it possible to identify a defective printed circuit board by detecting a opening mark, a short circuit and a leakage current and displaying a defective mark during a semiconductor package process.

In order to achieve the above object, the marking device according to the present invention and the strip printed circuit board; A storage unit for storing the water-soluble ink, an absorbing member for absorbing the water-soluble ink stored in the storage unit, a marking unit for contacting the strip printed circuit board to mark the water-soluble ink on the strip printed circuit board, and the A stamp for marking the water-soluble ink on the strip printed circuit board, including a capillary tube formed between a storage portion and the marking portion to supply the water-soluble ink uniformly supplied from the absorbing member to the marking portion; A stamp fixing part for fixing the stamp; And a driving part for raising and lowering the stamp fixing part to contact and separate the stamp from the strip printed circuit board. The stamp includes first and second stamps for marking defect marks at different positions on the strip printed circuit board, each of which is driven individually or simultaneously by the drive unit. The drive unit includes a drive source, and a connection unit for connecting the drive source and the stamp fixing unit. The drive source is an air cylinder.

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Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

With reference to Figures 2 to 10 will be described a preferred embodiment of the present invention.

Referring to FIG. 2, in the semiconductor package process according to the first embodiment of the present invention, a die is first cut by cutting a wafer in which a plurality of semiconductor chips are formed with a diamond blade (2S1).

The die is vacuum-adsorbed to bond the die onto a die pad of a strip printed circuit board (SBS) to which an adhesive is applied (2S2). In other words, in a die bonding process, the die is bonded to a strip PCB. To the junction.

The lead of the die and the inner lead of the strip PCB are wire bonded with a conductive wire (2S3). In other words, in wire bonding, the die is connected to the inner lead of the strip PCB using a wire.

Voltage is applied to the wire-bonded die and strip PCB to test the wire open, wire short, and leakage currents between the wire and the die connected between the internal leads of the strip PCB (2S4). Here, the wire opening refers to the opening between the lead and the wire, and the wire shorting refers to the connection between adjacent wires. In addition, the wire leakage current refers to the finely adjacent so that the leakage current flows between the adjacent wires.

These short circuits, wire open and leakage currents are detected using voltage drops across the protection diodes or naturally occurring diodes at the input and output pins of the device.

For example, in the wire open, wire short, and leakage current test process (hereinafter referred to as the "OS test process"), all pins are brought low and current is applied to the pin's protection diode to measure the diode turn-on voltage. The diode turn-on voltage is used to determine whether the device is defective or good. In addition, the wire leakage current is performed on the strip PCB which is judged to be good as a result of the wire short circuit and wire open test. At this time, the wire leakage current is made to all the pins to the ground potential, and then the voltage is applied to measure the current value. The measured current value is compared with the current value when it is normal to determine that the measured current value is large or small.

In the OS test process, the wire connected between the conductive wire of the strip PCB and the die, which is judged as good, is molded with thermosetting resin to protect it from dust, foreign substances, etc. (2S5).

The outer lead of the molded strip PCB is cut into a predetermined shape and bent into a predetermined (trim / foam) shape to suit the mounting form. (2S6) Accordingly, the strip PCB is individualized into one chip and commercialized.

Then, the commercialized chip is subjected to a test process including electrical characteristics, function tests, and dynamic energization tests. (2S7) In this test process, circuit characteristics and circuits are performed. Chips which are judged to be good as a result of tests for defects and the like are finally manufactured.

As such, by performing the OS test process after wire bonding in the semiconductor package process, it is possible to easily and quickly detect defective devices and improve productivity.

Referring to FIG. 3, in the semiconductor package process according to the second embodiment of the present invention, a die is first cut by cutting a wafer on which a plurality of semiconductor chips are formed with a diamond blade (3S1).

The die is vacuum adsorbed to bond the die onto the die pad of the strip PCB to which the adhesive is applied (3S2), i.e., the die is bonded to the strip PCB in the die bonding process.

The pad of the die and the inner lead of the strip PCB are wire-bonded with a conductive wire (3S3). In other words, the wire is used to connect the die with the inner lead of the strip PCB.

After the wire bonding is completed, the wire connected between the conductive wire and the die is molded with a thermosetting resin to protect the external environment such as dust and foreign matters (3S4).

When the molding process is completed, solder balls are formed at the contacts formed on the back side of the strip PCB. Solder balls are soldered to the contacts on the strip PCB and used for contact when mounted in the system.

Voltages are applied to the die and strip PCB molded by the thermosetting resin to test the wire open, wire short and leakage currents on the inside of the die and the wires connected between the inner leads of the strip PCB (3S5).

In the OS test process, when solder balls are formed on the back side of the strip PCB, voltage is applied through the solder balls. When solder balls are not formed on the back side of the strip PCB, the contacts formed on the back side of the strip PCB are applied. The test is applied by applying a voltage.

In the OS test process, the external lead of the strip PCB, which is judged to be good, is cut into a predetermined shape and bent into a predetermined (trim / form) shape so as to be suitable for the mounting type. And become a product.

Then, a test process including electrical characteristics, function tests, and dynamic energization tests is performed on the commercialized chips. (3S7) In the test process, the chips determined to be satisfactory as a result of the test on circuit characteristics and circuit defects. Is finally productized.

As such, by performing the OS test process after molding in the semiconductor package process, it is possible to easily and quickly detect defective devices and improve productivity.

Referring to FIG. 4, in the semiconductor package process according to the third embodiment of the present invention, a die is first cut by cutting a wafer on which a plurality of semiconductor chips are formed with a diamond blade (4S1).

The individualized die is vacuum adsorbed to bond the die onto the die pad of the strip PCB to which the adhesive is applied (4S2), i.e., the die is bonded to the strip PCB in the die bonding process.

The bonding pad of the die and the inner lead of the strip PCB are wire-bonded with conductive wires (4S3). In other words, the wire bonding is used to connect the die with the inner lead of the strip PCB.

By applying voltage to the die and the strip PCB by wire bonding, the first OS test is performed on the inside of the die and the wire connected between the inner leads of the strip PCB as described above. (4S4)

The connected wire between the conductive wire of the strip PCB and the die which is judged to be good by the first OS test and the die is molded with a thermosetting resin so as to protect it from the external environment such as dust and foreign matter. (4S5)

When the molding process is completed, solder balls are formed at the contacts formed on the back side of the strip PCB. Solder balls are soldered to the contacts on the strip PCB and used for contact when mounted in the system.

The second OS test is performed on the inside of the die and the wire connected between the die and the strip PCB molded by the thermosetting resin and the inside lead of the strip PCB as described above. (4S6)

In the second OS test, when solder balls are formed on the back side of the strip PCB, the test is applied by applying a voltage through the solder balls. If no solder balls are formed on the back side of the strip PCB, the contacts are formed on the back side of the strip PCB. The test is performed by applying a voltage through them.

The external lead of the strip PCB, which is judged to be good by the second OS test, is cut into a predetermined shape and bent into a predetermined (trim / foam) shape to fit the mounting form. (4S7) Accordingly, the strip PCB is divided into one Individualized into chips and commercialized.

Then, a test process including electrical characteristics, function tests, and dynamic energization tests is performed on the commercialized chips. (4S8) In the test process, the chips determined to be good as a result of the test on circuit characteristics and circuit defects are performed. Is finally productized.

As described above, the strip PCB 501 is manufactured by the semiconductor package process according to the present invention.

Referring to FIG. 5, the strip PCB 501 has a plurality of units 510 connected in series with the internal wiring of the strip PCB 501 and the pads of the die 506 connected by wire bonding. In addition, the strip PCB 501 may include indexing holes 502 formed at one side of each unit 510, alignment holes 504 formed at corners of each unit 510, and each unit 510. It has a plurality of contacts 508 formed on the rear surface to expose each of the internal wiring of the outside.

Indexing holes 502 are used when transferring the strip PCB 501, and alignment holes 504 are used when aligning the strip PCB 501. The contacts 508 are electrically contacted with the socket pins of the test apparatus described later to receive a test test signal.

As such, a wire test apparatus for performing a wire test process on the strip PCB 501 is installed on one side of the support frame 600 as shown in FIG. 6 to load the strip PCB 501. And a test apparatus 640 for inspecting a short circuit, a wire opening, and a wire leakage current of the strip PCB 501 loaded from the loading apparatus 610 to determine good quality and defects, and according to the determination result of the wire test. The unloading device 670 for separating and unloading the strip PCB 501 and the unloading device 670 installed between the test device 640 and the unloading device 670 are defective so as to be distinguished from the strip PCB 501 which is determined to be bad. A marking device 650 for displaying a mark is provided.

The loading device 610 transfers the strip PCB 501 shown in FIG. 5 to a small section unit corresponding to the length of the unit or to a large section unit corresponding to the length of the strip PCB 501. ).

The test apparatus 640 applies a first voltage to the loaded strip PCB 501 to test wire shorting and wire opening. Then, a second voltage is applied to the strip PCB 501, which is determined to be good, as a result of the wire test, to test the wire leakage current to determine a final good or bad.

The marking device 650 displays a defect mark so as to be distinguishable from the strip PCB 501 determined as defective in the test apparatus 640. The unloading device 670 separates and unloads the strip PCB 501 having completed the wire test into good and bad.

The loading device 610 includes a magazine conveyor 602 for storing magazines in which a plurality of strip PCBs 501 are stacked, a magazine holder 608 for picking up a magazine stored in the magazine conveyor 602, and the magazine holder. A loading elevator 609 for raising and lowering 608, a strip PCB pusher 604 for withdrawing strip PCB 501 from a magazine picked up in magazine holder 608, and a strip PCB pusher A strip PCB feeding device 612 for transferring the strip PCB 501 drawn by the sheer 604 to the test device 640.

The magazine conveyor 602 stores a number of magazines by a worker. A plurality of strip PCBs 501 are stacked on each of the plurality of magazines.

The magazine holder 608 serves to pick up a magazine in which the strip PCBs 501 are stacked in the magazine conveyor 602 in a vertical direction, and to unload an empty magazine in the magazine conveyor 602. The magazine holder 608 corresponds to the size of the magazine.

The loading elevator 609 is driven by a stepper motor. The loading elevator 609 lowers and raises the magazine holder 608 so that the magazine holder 608 can pick up the magazine, and raises the picked-up magazine by one step.

The strip PCB pusher 604 pushes the strip PCB 501 stacked on the magazine picked up in the magazine holder 608 one by one toward the strip PCB feeding device 612. That is, the strip PCB 501 stacked in the magazine is drawn out one by one by the strip PCB pusher 604 and loaded into the strip PCB feeding device 612.

The strip PCB feeding device 612 is a device for stably transferring the loaded strip PCB 501 to the test device 640. To this end, the strip PCB feeding device 612 is a material for transferring the transfer rail 614 on which the strip PCB 501 is seated, and the strip PCB 501 seated on the transport rail 614 to the test apparatus 640. It further comprises a first indexing unit 616 and a loading transfer 618 for driving the first indexing unit 616.

The transfer rail 614 is bent in an “L” shape to stably transport the strip PCB 501 loaded by the strip PCB pusher 604 and protects the strip PCB 501 from damage such as static electricity.

The transfer rail 614 further includes a rail variable device 620 for automatically changing the size of the transfer rail 614 to correspond to the size of the strip PCB 501.

The rail variable system 620 detects the size of the strip PCB 501 to be loaded and drives the step motor according to the detected signal to automatically change the size of the transfer rail 614.

The loading transfer 618 is provided with a first indexing unit 616. The loading transfer 618 serves to drive the first indexing unit 616 horizontally by a step motor. In addition, the loading transfer 618 is provided with safety devices (not shown) for protecting the strip PCB 501 when the first indexing unit 616 indexes the strip PCB 501.

The first indexing unit 616 adds a first indexing pin for indexing the strip PCB 501 seated on the transfer rail 614 and a servomotor for raising and lowering the first indexing pin. It is provided with.

The first indexing pin is lowered by the servo motor to index the strip PCB 501 seated on the transport rail 614 and transported along the transport rail 614. That is, the first indexing pin is lowered by the servomotor and indexed into the indexing hole 502 of the strip PCB 501.

The test apparatus 640 tests the strip PCB 501 loaded from the loading apparatus 600 in small sections corresponding to the length of the unit 510 shown in FIG. 5 or corresponds to the length of the strip PCB 501. Will be tested in units of units.

To this end, the test apparatus 640 detects the tester 715 for wire testing the loaded strip PCB 501 and the presence of a die bonded on the strip PCB 501 loaded in the tester 715. Adds a die sensing unit (not shown), a second indexing unit 667 for transferring the wire-tested strip PCB 501, and a step transfer 665 for driving the second indexing unit 667. It is provided with.

The tester 715 controls a plurality of pincards 716 and pincards 716 for individually selecting the contacts formed on the back surface of the strip PCB 501, and also controls wire opening, wire shorting and wire leakage current. A main board, not shown, is applied to the strip PCB 501 for inspection.

The pin card 716 individually selects the contacts formed on the back side of the strip PCB 501 to supply a voltage from the main board to the strip PCB 501. At this time, the pin card 716 is provided with a plurality so as to correspond to the different contacts because the number of contacts formed on the back side varies depending on the size of the strip PCB (501). This is because if there are 128 contacts of the strip PCB 501, one pin card 716 is required, and if there are 256 contacts of the strip PCB 501, two pin cards 716 are required.

The socket has a plurality of pin groups so as to correspond to the number of units 510 shown in FIG. 5 on the strip PCB 501 when the wire test is performed in the unit of the strip PCB 501, and the unit 510 of the strip PCB 501. In case of wire test by unit, pins are provided to correspond to the contacts of the unit 510. Each of the pins of the socket is provided with a spring having an elastic force to cushion the pins excessively applied to the strip PCB (501).

The die sensing unit detects whether the die 506 is bonded on the strip PCB 501 loaded in the test apparatus 640. In the case of the unit 510 in which the die 506 is not mounted on the strip PCB 501, the die sensing unit detects this and treats the entire strip PCB 501 as defective.

As such, the strip PCB 501 wire-tested by the test apparatus 640 is transferred to the step transfer 665.

The strip PCB 501 seated on the step transfer 665 is transferred to the strip PCB 501 unit by the second indexing unit 667 or to the unit 510 unit. That is, the second indexing unit 667 transfers the strip PCB 501 in a small section corresponding to the length of the unit or in a large section corresponding to the length of the strip PCB 501.

To this end, the second indexing unit 667 further includes a second indexing pin for indexing the strip PCB 501 seated on the step transfer 665 and a cylinder for raising and lowering the second indexing pin. do.

The second indexing pin is lowered by the cylinder and indexes the strip PCB 501 seated on the step transfer 665 to be transferred to the marking device 650. That is, the second indexing pin is lowered by the cylinder to insert the indexing hole 502 of the strip PCB 501 shown in FIG.

The marking device 650 according to an embodiment of the present invention serves to display a defect mark on the strip PCB 501 determined as a result of a wire test in the test apparatus 640. That is, the marking device 650 is displayed on the first part on the strip PCB 501 when the wire is open, and on the second part on the strip PCB 501 when the wire is shorted, and when a leakage current occurs. The third portion on the strip PCB 501 is marked for identification.

Such a marking device 650 will be described in detail with reference to FIGS. 7 and 8 as follows.

The marking device 650 is raised and lowered by the first and second double acting cylinders 702 and 704 facing each other with the transfer rail 614 interposed therebetween, and the first and second double acting cylinders 702 and 704 respectively. The strip PCB is provided with first and second stamp portions 732 and 742 for marking a short circuit of the wire and a defect mark of the wire opening and the wire leakage current.

The first double-acting cylinder 702 is raised and lowered by the first and second inlets 705 and 706 to which hydraulic or pneumatic pressure is injected, and the hydraulic or pneumatic pressure injected from the first and second inlets 705 and 706. The 1st cylinder rod 710 and the 1st stamp mounting part 714 with which the 1st stamp part 750 is provided are provided.

Hydraulic or pneumatic pressure injected into either one of the first and second inlets 705 and 706 raises the first cylinder rod 710, and hydraulic or pneumatic pressure injected into the other lowers the first cylinder rod 710. Let's do it. At this time, the hydraulic pressure or air pressure injected into the first and second injection ports 705 and 706 is injected by a compressor (not shown), which is controlled by a host system that stores the wire test results in the test apparatus.

The first cylinder rod 710 is inserted into the first double acting cylinder 702 and raised and lowered by hydraulic or pneumatic pressure injected from the first and second injection holes 705 and 706.

In order to transfer the vertical movement of the first cylinder rod 710 to the first stamp portion 750, a first cylinder bracket 711 is installed at the end of the first cylinder rod 710. In addition, a first play plate 712 is installed between the first cylinder bracket 711 and the first stamp mounting portion 714. By screwing the screw (not shown) to the first cylinder bracket 711 through the first stamp mounting portion 714 and the first play plate 712, the first stamp mounting portion 714 is connected to the first cylinder bracket 711. It is fixed and raised and lowered by the first cylinder rod 710.

The first stamp part 750 includes a first link 734 fixed to the first stamp mounting part 714, a first stamp 732 fixed through the first link 734, and a first link 734. And a first nut 736 for securing the first stamp 732 penetrated through the back of the) to the first link 734.

The first link 734 is fixed to the first stamp mount 714 by a screw 716, and the first stamp 732 penetrates the first link 734 to the first by the first nut 736. Secured to link 734.

As shown in FIG. 9, the first stamp 732 includes a first storage unit 770 through which the inside is penetrated to store the viscous ink, a first marking unit 772 on which the viscous ink is leaked and marked, and a first stamp 732. The first capillary 774 for uniformly supplying the viscous ink of the storage 770 to the first marking part 772 and the viscous ink stored in the first storage 770 are absorbed to form a first amount. A first sponge 776 for supplying the capillary 774 is provided.

The viscous ink stored in the first reservoir 770 is preferably water-soluble ink so that it can be erased after being marked on the strip PCB. After the viscous ink is injected into the first reservoir 770, the upper end of the first reservoir 770 is sealed by the first cam 730.

The first capillary tube 774 supplies viscous ink stored in the first storage unit 770 to the first marking unit 772 by a predetermined amount. At this time, the viscous ink supplied to the first marking portion 772 is absorbed by the first sponge 776 and supplied in a constant amount.

The first marking portion 772 contacts the surface of the strip PCB by the first double-acting cylinder 702 at the time of lowering and is raised after marking the viscous ink supplied from the first capillary 774 on the strip PCB. The first marking part 772 is normally inserted into the first holder 738 to prevent damage from the outside.

As described above, the first double-acting cylinder 702 is for displaying a defect of a wire short circuit as a result of a test of a wire short circuit in the test apparatus, and the first double-acting cylinder is loaded when the defective short strip PCB is loaded on the marking apparatus 650. As air pressure or hydraulic pressure is injected into the first injection hole 705 of the cylinder 702 and the first cylinder rod 710 descends, the first stamp part 750 descends and the wire to which the first marking part 772 is loaded. A defective mark indicating a short circuit of wires is displayed on one side of the shorted defective strip PCB.

Then, air pressure or hydraulic pressure is injected into the second injection hole 706 of the first double-acting cylinder 702 to raise the first cylinder rod 710.

The second double-acting cylinder 704 is raised and lowered by the third and fourth inlets 707 and 708 to which hydraulic or pneumatic pressure is injected, and the hydraulic or pneumatic pressure injected from the third and fourth inlets 707 and 708. The 2nd cylinder rod 720 and the 2nd stamp mounting part 724 with which the 2nd stamp part 760 is provided are provided.

Hydraulic or pneumatic pressure injected into one of the third and fourth inlets 707 and 708 raises the second cylinder rod 720, and hydraulic or pneumatic pressure injected into the other lowers the second cylinder rod 720. Let's do it. At this time, the hydraulic pressure or air pressure injected into the third and fourth injection ports 707 and 708 is injected by a compressor (not shown), which is controlled by a host system that stores wire test results in a test apparatus.

The second cylinder rod 720 is inserted into the second double acting cylinder 704 and raised and lowered by hydraulic or pneumatic pressure injected from the third and fourth injection holes 707 and 708.

In order to transfer the vertical movement of the second cylinder rod 720 to the second stamp portion 760, a second cylinder bracket 721 is installed at the end of the second cylinder rod 720. In addition, a second play plate 722 is installed between the second cylinder bracket 721 and the second stamp mounting portion 724. By screwing the screw (not shown) to the second cylinder bracket 721 through the second stamp mounting portion 724 and the second play plate 722, the second stamp mounting portion 724 is attached to the second cylinder bracket 721. It is fixed and raised and lowered by the second cylinder rod 720.

The second stamp portion 760 includes a second link 744 fixed to the second stamp mounting portion 724, a second stamp 742 fixed through the second link 744, and a second link 744. And a second nut 746 for securing the second stamp 742 penetrated to the second link 744 through the back side of the).

The second link 744 is fixed to the second stamp mount 724 by screws 726, and the second stamp 742 penetrates through the second link 744 to form a second by the second nut 746. Secured to link 744.

As shown in FIG. 9, the second stamp 742 may include a second storage part 780 through which the inside of the viscous ink is stored, a second marking part 782 through which the viscous ink is leaked and marked, and a second stamp 742. The second capillary tube 784 for uniformly supplying the viscous ink of the storage unit 780 to the second marking unit 782 and the viscous ink stored in the second storage unit 780 are absorbed in the second amount in a constant amount. A second sponge 786 for supplying the capillary 784.

The viscous ink stored in the second reservoir 780 is preferably water-soluble ink so that it can be erased after being marked on the strip PCB. After the viscous ink is injected into the second reservoir 780, the upper end of the second reservoir 780 is sealed by the second cam 740.

The second capillary tube 784 supplies viscous ink stored in the second storage unit 780 to the second marking unit 782 by a predetermined amount. At this time, the viscous ink supplied to the second marking portion 782 is absorbed by the second sponge 786 and supplied in a constant amount.

The second marking portion 782 is raised by marking on the strip PCB the viscous ink supplied from the second capillary 784 in contact with the surface of the strip PCB by the second double-acting cylinder 704 when lowered. The second marking portion 782 is usually inserted into the second holder 748 to prevent damage from the outside.

As described above, the second double acting cylinder 704 is for indicating a defective wire opening as a result of the test of the wire opening in the test apparatus, and the second double acting cylinder is loaded when the defective strip PCB is opened on the marking apparatus 650. As the air pressure or hydraulic pressure is injected into the third injection hole 707 of the cylinder 704 and the second cylinder rod 720 descends, the second stamp portion 760 descends and the wire to which the second marking portion 782 is loaded. On the opposite side of the open defective strip PCB, a defect mark indicating the wire opening is displayed.

Then, air pressure or hydraulic pressure is injected into the fourth injection hole 707 of the second double acting cylinder 704 to raise the second cylinder rod 720.

On the other hand, in the case of the defective strip PCB which is determined to be defective due to the wire leakage current occurring in the test apparatus, the first and second double acting cylinders 702 and 704 are simultaneously driven as described above, so that the first and second stamps 732 and 742 ), Two defective marks indicating the wire leakage current are displayed on the defective strip PCB in which the wire leakage current is generated.

In other words, when the defect mark is displayed on one side of the defective strip PCB by the first stamp 732, a wire short circuit is shown, and the defect mark is displayed on the opposite side of the one side by the second stamp 742. Indicates wire open. In addition, when the first and second stamps 732 and 742 display the defect marks on one side and the opposite side of the defective strip PCB, the wire leakage current is indicated.

As shown in FIG. 6, the unloading apparatus 670 unloads the reject rail 680 for separating and unloading the strip PCB according to the wire test result from the test apparatus 640, and the strip PCB determined as good. Unloading to stack the unloading transfer 684 for loading, the reject transfer 685 for unloading the strip PCB determined to be defective, and the good strip PCB 501 conveyed from the unloading transfer 684. A magazine 686, an unloading elevator 688 for picking up one magazine from the unloading magazine 686, and a reject magazine 660 for stacking the defective strip PCB 501.

The reject rail 680 is horizontally moved towards the reject transfer 685 by a host system, not shown, only when the seated defective strip PCB 501 is transferred to the reject transfer 685.

The unloading transfer 684 stacks an unillustrated gripper for picking up the good strip PCB 501 on the reject rail 680 and a strip PCB 501 picked up by the gripper on the unloading magazine 686. It is further provided with a pusher not shown which pushes as much as possible.

The gripper is transported in proximity to the unloading magazine 686 after picking the strip PCB 501 on the reject rail 680 by a drive not shown. As the strip PCB 501 approaches the unloading magazine 686, the pusher is positioned behind the strip PCB 501 as the gripper is raised and transported to the back of the strip PCB 501. A pusher located behind the strip PCB 501 pushes the strip PCB 501 to stack the strip PCB 501 in the magazine of the unloading magazine 686.

To this end, the unloading magazine 686 is provided with a magazine in which a plurality of strip PCBs 501 are pushed by the pusher. The unloading elevator 688 uses a magazine holder to raise and lower the magazine of the unloading magazine 686 so that the strip PCBs 501 can be stacked in the magazine.

The reject transfer 685 has a pusher for pushing the bad strip PCB 501 on the reject rail 680.

The pusher is driven by the first and second cylinders not shown. The first and second cylinders buffer the pushing force of the pusher to prevent excessively pushing the strip PCB 501 seated on the rail of the reject rail 680 toward the reject magazine 660.

The defective strip PCB 501 transferred to the reject transfer 685 is laminated to the magazine of the reject magazine 660 by a pusher installed in front of the reject rail 680.

The driving of the marking apparatus according to the exemplary embodiment of the present invention will be described with reference to FIG. 10 as follows.

The strip PCB is loaded into the test apparatus 640 by the loading apparatus shown in FIG. (10S1)

The strip PCB loaded in the test apparatus 640 tests the wire short circuit and the wire opening by the voltage applied from the tester 715, and then tests the wire leakage current against the strip PCB which is determined to be good as a result of the wire test. (10S2)

The good strip PCB, which is determined to be good by the wire test result in the test apparatus 640, is transferred to the unloading magazine by the unloading apparatus and stacked on the magazine picked up by the unloading elevator. (10S3, 10S4)

However, the defective strip PCB that is determined to be defective in the test apparatus 640 is transferred to the marking apparatus 650 by the step transfer 665. When the defective strip PCB is transferred to the marking device 650, the first and second double acting cylinders 702 and 704 shown in FIG. 8 are driven. At this time, the first and second double acting cylinders 702 and 704 are driven in accordance with the wire short circuit and the wire opening and the wire leakage current which are determined to be defective in the test apparatus 640 as a result of the wire test. That is, in the case of a wire short circuit, the first double acting cylinder 702 is driven, and in the case of wire open, the second double acting cylinder 704 is driven. In the case of a wire leakage current, both the first and second double acting cylinders 702 and 704 are driven.

As the first and second double acting cylinders 702 and 704 are driven, the first and second stamps 732 and 742 are lowered. (10S6)

As the first and second stamps 732 and 742 are lowered, the viscous ink of the first and second stamps 732 and 742 is marked on the defective strip PCB. (10S7)

The first and second stamps 732 and 742 are raised by the first and second double acting cylinders 702 and 704 after marking the defect mark on the defective strip PCB. (10S8)

Then, the defective strip PCB marked with the defect mark is transferred onto the reject rail by the unloading device (10S9).

The defective strip PCB transferred on the reject rail is laminated to the magazine of the reject magazine (10S10).

As described above, the marking apparatus according to the present invention makes it possible to identify the defective printed circuit board by displaying the defective mark on the defective strip printed circuit board which is determined to be defective in the test apparatus.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

1 is a step by step flowchart of a conventional semiconductor package process.

2 is a flowchart illustrating a semiconductor package process step by step according to a first embodiment of the present invention.

3 is a flowchart illustrating a semiconductor package process step by step according to a second embodiment of the present invention.

4 is a flowchart illustrating a semiconductor package process step by step according to a third embodiment of the present invention.

5 is a plan view and a rear view of a strip printed circuit board according to the present invention.

Figure 6 is a perspective view schematically showing a wire test apparatus according to the present invention.

7 is a perspective view showing a marking apparatus according to an embodiment of the present invention shown in FIG.

8 is an exploded perspective view showing a marking apparatus according to an embodiment of the present invention shown in FIG.

9 is a cross-sectional view showing a stamp of the marking device shown in FIG.

10 is a flowchart illustrating driving of a marking apparatus according to an exemplary embodiment of the present invention.

<Description of Symbols for Main Parts of Drawings>

501: Strip PCB 502: Indexing Hole

504: alignment hole 506: die

508: contacts 510: unit

602: Magazine Conveyor 604: Strip PCB Pusher

608: magazine holder 609: loading elevator

610: loading device 640: testing device

650: marking device 670: unloading device

680: reject rail 680: unloading transfer

660: Reject Magazine 686: Unloading Magazine

702, 704: Double acting cylinders 710, 720: Cylinder rod

732, 742: stamp

Claims (5)

A strip printed circuit board; A storage unit for storing the water-soluble ink, an absorbing member for absorbing the water-soluble ink stored in the storage unit, a marking unit for contacting the strip printed circuit board to mark the water-soluble ink on the strip printed circuit board, and the A stamp for marking the water-soluble ink on the strip printed circuit board, including a capillary tube formed between a storage portion and the marking portion to supply the water-soluble ink uniformly supplied from the absorbing member to the marking portion; A stamp fixing part for fixing the stamp; A driving part for raising and lowering the stamp fixing part to contact and separate the stamp from the strip printed circuit board, The stamp includes first and second stamps for marking defect marks at different positions on the strip printed circuit board, each of the first and second stamps being individually or simultaneously driven by the driving unit. Marking device. delete delete The method of claim 1, The driving unit, Drive source, Marking device characterized in that it comprises a connection for connecting the drive source and the stamp fixing portion. The method of claim 4, wherein Marking device, characterized in that the drive source is an air cylinder.