JP2001185587A - Defect marking apparatus for electronic components mounting film carrier tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a stamping member for putting a mark on a defect at a predetermined position of the film carrier, when an electric test is performed on a film carrier tape for mounting electronic components. SOLUTION: An ink marking device 90 is provided with a stamping member 70 having a printing section on which a predetermined defect mark is graved. The defect mark is printed by bleeding ink from the printing section on the surface or on the back of a defective portion in the film carrier tape based on the detection for defects of a wiring pattern, when the printing section of the stamping member is brought into contact with the defective portion. At the same time, a slit groove is provided to introduce ink bled from the printing section to all over the printing section.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film carrier tape (TAB (Tape Automate
g) Tape, T-BGA (Tape Ball Grid Array) tape,
CSP (Chip Size Package) tape, ASIC (Applica
When performing an electrical inspection of an electronic component mounting film carrier tape (hereinafter simply referred to as “electronic component mounting film carrier tape”), a defect marking is performed at a predetermined position of the electronic component mounting film carrier tape. And a stamp member therefor.

[0002]

2. Description of the Related Art With the development of the electronics industry,
The demand for printed wiring boards on which electronic components such as C (integrated circuits) and LSIs (large-scale integrated circuits) are mounted has been rapidly increasing, but there has been a demand for smaller, lighter, and more sophisticated electronic devices. Recently, TAB has been used as a mounting method for these electronic components.
A mounting method using a film carrier tape for mounting electronic components such as a tape, a T-BGA tape, and an ASIC tape has been adopted. In particular, the importance thereof is increasing in the electronic industry using a liquid crystal display device (LCD), such as a personal computer, which requires high definition, thinness, and a narrow frame area of a liquid crystal screen.

In such a film carrier tape for mounting electronic components, for example, as shown in FIG. 8, a TAB tape 200 has a plurality of transporting tapes at both ends in the width direction which are continuously continuous in the longitudinal direction. Sprocket holes 202, 20
2 are provided side by side, and a device hole 204 for mounting a device such as an IC is formed at a substantially central portion between the sprocket holes 202. Then, an inner lead 206 and an outer lead 208 of the device hole 204 are formed.
Is formed.

By the way, such a TAB tape 200
Has been implemented to inspect the quality of the TAB tape 200. As a method for performing a more efficient and accurate inspection as compared with a conventional visual inspection (transmitted light inspection) by a person, the wiring pattern 210 is used. A method has been proposed and implemented in which the electrical disconnection, short circuit, insulation resistance and the like of the above are electrically inspected and defective products are marked by punching or the like (see JP-A-6-174774).

In such an inspection method, as shown in FIG. 8, a test pad 212 is formed on a TAB tape 200, and a contact probe for electrical inspection is applied to the test pad 212 to form a wiring pattern 210. In addition, a short circuit defect is inspected, a conductive pad having a size of the device hole is applied to the entire inner lead 206 of the device hole 204, a disconnection inspection is performed, and a defective product is automatically punched.

However, recently, among TAB tapes, as shown in FIG. 9, BGA (Ball Grid Arra
A hole 302 is formed in the TAB tape 300 in place of the outer lead called y), and an IC is inserted through the hole 302.
TAB tape and CSP (ChipSi
The size of an IC called “ze Package” is the same as the size of a package of a TAB tape, and a TAB tape whose connection method is mainly the same as that of a BGA is also used.

[0007]

By the way, in such BGA and CSP, there is no test pad, and all the wirings are connected by plating leads. It is impossible to do. Therefore, in the conventional BGA and CSP inspection methods, at present, defect inspection is performed by visual inspection by a human, and defect marking is also performed by manual application of ink, magic, or the like.

[0008] Therefore, in such an inspection method, since a defect inspection and a defect marking must be performed manually, complicated work is required, and time and cost are required, which is not suitable for mass production. Insufficient inspection may occur, and the accuracy of quality inspection may be reduced. The present inventors, in order to solve such a problem, as a result of intensive research, based on the results of quality inspection such as electrical disconnection and short circuit of the electronic component mounting film carrier tape, by manual work. In place of the marking, a predetermined defective mark is engraved on the stamped surface portion, and the defective mark engraved on the stamped surface portion by the bleeding of the ink from the stamped surface portion is used as the defective portion of the electronic component mounting film carrier tape. It has been found that defective marking can be automatically performed by using a stamp member for marking on the front surface or the back surface.

However, the electronic component mounting film carrier tape on which the wiring pattern is formed is coated with a solder resist, which is an insulating paint that serves as a protective layer of the circuit except for connection parts such as inner leads and solder ball terminals. Therefore, even if the stamp surface is brought into contact with the front or back surface of the defective portion of the electronic component mounting film carrier tape using such a stamp member, since the solder resist repels the ink, the ink is applied only to the outline. However, since no ink remains (does not spread) over the entire shadow, clear shadow marking cannot be performed. Therefore, the defective mark may not be detected by a defective mark detection device in a later process, for example, a transmitted light sensor, and a defective product may be determined as a non-defective product.

The present invention has been made in view of the above situation, and has been made in consideration of the electric disconnection of a film carrier tape for mounting electronic parts,
Based on the results of quality inspections such as short circuits, defect marking by inking is automatically and reliably performed on film carrier tapes for mounting electronic components. Defect marking of film carrier tapes for mounting electronic components is possible. It is an object to provide a device and a stamp member therefor.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in order to achieve the above-mentioned problems and objects in the prior art, and is intended to provide an apparatus for marking defects on a film carrier tape for mounting electronic parts according to the present invention. A defect marking device for marking a defective portion of a film carrier tape for mounting an electronic component, wherein the defect marking device includes a stamp member having a stamped surface portion on which a predetermined defect mark is engraved, Based on the detection result of the defect of the wiring pattern of the lead of the mounting film carrier tape, when the stamped surface portion of the stamp member contacts the front or back surface of the defective portion of the electronic component mounting film carrier tape, the mark is formed. Defective marks engraved on the stamped surface due to oozing of the ink from the surface are used as film carrier tapes for mounting electronic components. On the front or back surface of the defective portion, while being configured to be marked, the print face portion of the stamp member, characterized in that a slit groove for guiding the ink exuded from the seal face section to the entire print face portion.

Further, the stamp member of the present invention is a stamp member for a defect marking device for marking a defective portion of a film carrier tape for mounting electronic components, wherein the stamp surface on which a predetermined defect mark is engraved is formed. When the stamped portion of the stamp member comes into contact with the front or back surface of the defective portion of the electronic component mounting film carrier tape, a defect engraved on the stamped portion due to oozing of ink from the stamped portion. The mark is configured to be marked on the front surface or the back surface of the defective portion of the electronic component mounting film carrier tape, and the stamp surface of the stamp member is formed with a slit groove for guiding ink oozing from the stamp surface to the entire stamp surface. It is characterized by having done.

With this configuration, it is possible to automatically mark the front or back surface of the electronic component mounting film carrier tape with ink based on the detection result of the defective pattern detection device, so that the defective display can be reliably performed. It is necessary to apply ink to the stamped part because the defective mark engraved on the stamped part due to the bleeding of ink from the stamped part marks the front or back of the defective part of the film carrier tape for mounting electronic components. In addition, a defective mark engraved on the stamped surface can be marked on the front or back surface of the defective portion of the film carrier tape for mounting electronic components.

In addition, since the slit groove for guiding the ink oozing from the stamp surface to the entire stamp surface is formed in the stamp surface of the stamp member, the ink oozing from the stamp surface passes through the slit groove to the entire stamp surface. That is, the entire shadow is spread. Therefore, a clear shadow can be marked, and a defective product can be reliably determined by a defective mark detecting device such as a transmitted light sensor in a later process.

Therefore, the defect marking can be automatically and accurately applied to the front or back surface of the defective portion of the electronic component mounting film carrier tape supplied in a large amount. Further, in the present invention, the slit groove is:
The slit groove is formed radially from the center of the stamp face.

[0016] With this arrangement, the entire slit surface, that is, the entire shadow is spread through the radially formed slit groove, and a clear shadow can be marked. Further, the present invention is characterized in that the slit grooves are formed so that the central angles thereof are equiangular.

[0017] As a result, the ink is widely spread over the entire stamp surface portion, that is, the entire shadow through the slit grooves radially formed so as to be conformal, so that a clearer shadow can be marked. Can be.
Further, in the present invention, the slit groove is a slit groove formed in a mesh shape on a stamp face portion.

As a result, the entire marking surface, that is, the entire shadow is spread through the slit grooves formed in a mesh shape, so that a clear shadow can be marked. Further, in the present invention, the slit grooves are formed so as to be equidistant from each other.

[0019] As a result, the entire stamp surface, that is, the entire shadow is widely spread through the slit grooves formed at equal intervals, so that a clearer shadow can be marked. Further, the defect marking device for a film carrier tape for mounting electronic components of the present invention,
When the stamp member is in a standby state, its stamped portion is positioned downward, and in a marking state, the stamped portion is inverted so that the stamped portion is located upward, and a defective portion of the film carrier tape for mounting electronic components. The stamp surface of the stamp member abuts on the front or back surface of the electronic component mounting film carrier tape, and the defective mark is marked on the front or back surface of the defective portion of the electronic component mounting film carrier tape.

In this manner, the stamp member is located at a lower position when the stamp member is in a standby state, so that the ink held by the stub member body always seeps into the stamp surface by the action of gravity. Will be in a standby state,
When the ink on the stamp surface is dried as in the case where the stamp surface portion is located above, and when marking a defective mark on the front surface or the back surface of the defective portion of the film carrier tape for electronic component mounting, the marking defect does not occur. Thus, the defective mark can be accurately marked.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings. FIG. 1 is a front view of an inspection device for a film carrier tape for electronic component mounting using the defect marking device for a film carrier tape for electronic component mounting of the present invention, FIG. 2 is a top view of FIG. 1, and FIG. FIG. 4 is a front view of the defect marking device for the electronic component mounting film carrier tape of the present invention, FIG. 4 is a top view of the defect marking device for the electronic component mounting film carrier tape of the present invention, and FIG. FIG. 6 is an enlarged side view of a defect marking device for a film carrier tape, FIG. 6 is a plan view of a stamp face of a stamp member of the present invention, and FIG.
FIG. 7 is a plan view showing another embodiment of the stamp member of the present invention.

As shown in FIGS. 1 to 3, reference numeral 10 denotes an inspection apparatus for a film carrier tape for mounting electronic parts according to the present invention. As shown in FIG. 1, the inspection device 10 for a film carrier tape for mounting electronic components includes a feeding device 20, a defective pattern detection device 30, a marking device 40, and a winding device 50.

The delivery device 20 includes, for example, a CSP,
A reel R on which a TAB tape T, which is a film carrier tape for mounting electronic components of a type such as BGA (hereinafter, simply referred to as a “TAB tape”) and whose manufacturing process has been completed, is wound via a spacer S, Is the feed drive shaft 2
2 is attached. Then, by driving a drive motor (not shown), the delivery drive shaft 22 is rotated, and the TAB tape T is fed out from the reel R together with the spacer S.
0 is supplied.

When the TAB tape T supplied to the defective pattern detecting device 30 passes between the back tension gear 32 and the drive gear 34 provided in the defective pattern detecting device 30 via the guide roller 31. At the same time, the drive of the drive gear 34 is temporarily stopped, the feeding of the TAB tape is stopped, and the reverse rotation of the back tension gear 32 engaging with the sprocket hole of the TAB tape causes the TAB tape to be accurately positioned at a predetermined position. Positioned. In this state, the TAB in the defective pattern detection device 30
The reflected light projected from the reflected light irradiation device 36 disposed below the tape T is applied to the TAB tape T. Then, the reflected light reflected on the TAB tape T is applied to the C pattern disposed below the TAB tape T in the defective pattern detection device 30.
The light is received by the CD camera 38.
In this embodiment, the pattern inspection using the reflected light has been described. However, the present invention is not limited to this, and can be used for a pattern inspection using transmitted light, for example.

As a result, the lead wiring pattern recognized by the CCD camera 38 is input to the control device 80 and compared with a normal wiring pattern previously input to a storage unit such as a RAM in the control device 80. When the determination is made, the position of the defective portion, that is, the position of the defective portion in the longitudinal direction and the width direction of the tape is output to the control device 82 of the marking device 40 described later.

The defective pattern detecting device 3 having the above configuration
0 means that there is no test pad such as BGA, CSP, etc., and quality inspection such as electrical disconnection, short circuit, pattern failure etc. of leads can be performed even for TAB tapes of the type where all wiring is connected by plated leads. It can be performed automatically and accurately in a short time. In addition, as shown in FIG. 1, the feed device 20 is provided with three position sensors 28 in the vertical direction, and the lower position sensor detects the lower end T ′ of the slack portion of the TAB tape T. In such a case, the drive of the drive motor of the delivery device 20 is stopped to prevent the TAB tape from being excessively slack and coming into contact with the floor and being damaged. When the lower position T 'of the slack portion of the TAB tape T is detected by the upper position sensor, the drive of the drive motor of the feeding device 20 is started to maintain a constant slack of the TAB tape. ing.

On the other hand, the TAB tape T for which the defect of the wiring pattern has been inspected by the defect pattern detecting device 30
Is supplied to the marking device 40 via the guide rollers 33 and 41. Then, the TAB tape T supplied to the marking device 40 is as shown in FIG.
As shown in FIG. 5, while passing from the guide roller 41 to the guide roller 42, the defective portion is marked with ink based on the detection information of the defective portion detected by the defective pattern detection device 30. It has become.

That is, the TAB tape T supplied to the marking device 40 is fed by the drive gear 43 and its supporting roller 43a, passes through the back tension gear 44 and its supporting roller 44a, and
The position in the width direction is regulated by the tape width direction guide member 46 and the second tape width direction guide member 48, and is supplied to the next winding device 50 after passing through the guide roller 42. .

When the TAB tape T passes between the back tension gear 44 and the drive gear 43, it is detected by the defective pattern detecting device 30 and is supplied to the control device 82 based on the detection information of the defective portion. Gear 43
Is temporarily stopped, the feeding of the TAB tape is stopped, and the reverse rotation of the back tension gear 44 that engages with the sprocket hole of the TAB tape causes the TAB tape to accurately move to a predetermined position where a defective portion exists. That is, the predetermined position of the electronic component mounting unit where the defective portion exists in the feeding direction of the TAB tape T, the position of the defective portion in the longitudinal direction of the tape, and the position in the width direction are accurately located on the ink marking device 90. Is positioned as follows.

In such a state that the positioning is accurate,
The ink marking device 90 performs marking with ink on a predetermined position on the front surface or the back surface of the TAB tape T. As shown in FIG. 5, the ink marking device 90 stands on a base 45 of the marking device 40 on a moving mechanism such as a guide rail (not shown) so as to be movable in the width direction and the longitudinal direction of the TAB tape T. The frame base 55 is provided.

The frame gantry 52 has a frame gantry body 54 and an arch 56 provided above and extending in the width direction of the TAB tape T. A marking receiving portion 58 is formed on the lower surface of the tip of the arch portion 56. As will be described later, when the stamped surface 72 of the stamp member 70 comes into contact with the front or back surface of the defective portion of the TAB tape, the marking receiving portion 58 is disposed between the stamped surface 72 of the stamp member 70 and the TAB tape. TAB
This is because the tape is supported so that marking with ink is reliably performed and the TAB tape is not damaged. Therefore, the marking receiving portion 58
Is preferably made of a hard synthetic resin such as acrylic.

A stamp unit 60 is rotatably mounted on the frame base body 54. That is, the stamp unit 6
The drive motor 62 is fixedly attached, and a stamp holding frame 66 is connected to a rotation shaft 64 of the drive motor 62. A stamp holding member 61 is attached to the stamp holding frame 66 so as to be movable up and down via guide shafts 68 arranged vertically. This stamp holding member 61
, The stamp member 70 is detachably held so that it can be replaced.

The stub 70 has a predetermined defect mark B
Are stamped on the back surface of the defective portion of the electronic component mounting film carrier tape, and when the stamp surface comes into contact with the back surface of the defective portion, the ink storing portion ( (Not shown) is applied to the porous stamp surface 7
2. The defective mark B oozing out from No. 2 and engraved on the stamp face portion is
Marking is performed on the front or back surface of the defective portion of the electronic component mounting film carrier tape.

By the way, the film carrier tape for mounting electronic parts on which the wiring pattern is formed is coated with a solder resist, which is an insulating paint that serves as a protective layer of the circuit except for connection parts such as inner leads and solder ball terminals. Therefore, even if the stamp surface is brought into contact with the front or back surface of the defective portion of the electronic component mounting film carrier tape using such a stamp member, since the solder resist repels the ink, the ink is applied only to the outline. However, since no ink remains (does not spread) over the entire shadow, clear shadow marking cannot be performed. Therefore,
In some cases, the defective mark cannot be detected by a defective mark detection device in a subsequent process, for example, a transmitted light sensor, and a defective product is determined as a non-defective product.

For this reason, slit grooves 90 and 92 are formed in the stamp face portion 72 as shown in FIGS. In FIGS. 6 and 7, the shading portion 91 is circular, but the shape is not particularly limited, and a square, a triangle, a shading of a defective character, or the like can be appropriately selected. As described above, since the slit grooves 90 and 92 are formed in the stamp surface portion 72 of the stamp member 70 to guide the ink oozing from the stamp surface portion 72 to the entire stamp surface portion, the ink oozing from the stamp surface portion is formed by the slit grooves 90 and 92. , A sufficient amount of ink is spread over the entire stamp surface, that is, the entire shadow. Therefore, a clear shadow can be marked, and a defective product can be reliably determined by a defective mark detecting device such as a transmitted light sensor in a later process. Therefore, the defect marking can be automatically and accurately applied to the front surface or the back surface of the defective portion of the electronic component mounting film carrier tape supplied in a large amount.

That is, specifically, in the embodiment shown in FIG. 6, a plurality of slit grooves 90 are formed radially from the center O of the stamp face portion 72. As a result, a sufficient amount of ink is spread over the entire stamp surface, that is, the entire shadow through the radially formed slit grooves 90, and it is possible to perform clear shadow marking. In this case, as shown in FIG.
However, it is desirable that the ink be formed so as to be equiangular because the ink spreads over the entire stamp surface portion 72, that is, over the entire shadow, and is used for marking a clearer shadow.

In this case, the size of the central angle α of the slit groove 90 radially formed from the center O of the stamp surface portion 72, that is, the number of the slit grooves 90 is not particularly limited. The larger the number is, the more preferable it is. For example, when the size of the stamp face portion 72 is 2.0 to 3.0 mmφ, the number is preferably 8 to 10. On the other hand, in the embodiment shown in FIG. 7, a plurality of slit grooves 92 formed in a mesh shape are formed in the stamp face 72. Thereby, it is formed in a mesh shape and through the slit groove 92,
A sufficient amount of ink is spread over the entire stamp surface, that is, the entire shadow, and a clear shadow can be marked.

In this case, as shown in FIG. 7, the distance L between the slit grooves 92 is formed so as to be equidistant, so that the ink spreads over the entire stamp surface 72, that is, over the entire shade. A sufficient amount of ink will be spread out, which is desirable for making clearer shadow markings. Further, in this case, the size of the distance L between the slit grooves 92 formed in a mesh shape of the stamp face portion 72, that is,
The number of the slit grooves 92 is not particularly limited, but is preferably as large as possible.
When the size of 2 is 2.0 to 3.0 mmφ, 8
It is desirable to use 10 to 10.

Further, in this embodiment, the vertical and horizontal slit grooves 92 are arranged so as to intersect vertically, but the intersection angle can be variously changed, for example, intersect at 60 °. Furthermore, these slit grooves 90,
The groove depth of 92 can be changed as appropriate, depending on the viscosity of the ink, in consideration of the effect (spreading effect) of the ink spreading over the entire stamp surface via the slit groove.

The cross-sectional shape of the slit grooves 90 and 92 is not particularly limited. For example, if the effect of spreading ink over the entire stamp surface via the slit grooves (excessive effect) is taken into consideration, for example, A rectangular shape or a U shape is desirable. Also, at a position below the stub member 70,
As shown by the dotted line in FIG. 5, when the stamp face 72 of the stub member 70 is located below, the stamp cap member 74 is fixed to the frame base body 54 in order to prevent the stamp face 72 from drying. .

The ink marking device 50 thus configured operates as shown in FIG. That is,
When the stamp member 70 is in the standby state, its stamp face 7
2 are arranged so as to be located below. Then, the drive gear 43 is detected based on the detection information of the defective portion detected by the defective pattern detection device 30 and input to the control device 82.
Is temporarily stopped, the feeding of the TAB tape T is stopped, and the defective portion of the TAB tape T is positioned so as to be accurately positioned on the ink marking device 50.

In this state, the frame base 52 is moved in the width direction and the longitudinal direction of the TAB tape T by a moving mechanism (not shown) based on the detection information of the defective portion inputted to the control device 82, and the TAB tape The stamp member 70 is moved so as to be located at a lower position where a defective portion of T should be marked. Then, the drive motor 62 is driven, and the rotating shaft 64 is rotated, so that the stamp unit 60
Is rotated by 180 °, the stamp member 70 held by the stamp holding member 61 of the stamp holding frame 66 is rotated by 180 °, and the stamped surface 72 is upward, that is, the stamped surface 72 is It is arranged so as to face a portion to be marked as a defective portion on the front surface or the back surface.

In this state, the stamp holding member 61 is moved upward by the moving mechanism (not shown) via the guide shaft 68, and the stamp face 72 is brought into contact with the front surface or the back surface of the defective portion of the TAB tape. While the TAB tape is supported by the marking receiving portion 58, the stamp surface portion 7
The defect mark B engraved on the surface 2 is marked on the front surface or the back surface of the defective portion of the TAB tape.

After the marking is completed, the guide shaft 6
8, the stamp holding member 61 is moved downward,
After the stamp member 70 is separated from the front or back surface of the TAB tape, the drive motor 62 is driven and the rotating shaft 64
By rotating the stamp unit section 60 by 180 °, the stamp member 70 is rotated by 180 ° so that the stamp face section 72 is positioned below, and returns to the standby state again.

Thereafter, the frame base 52 moves in the width direction and the longitudinal direction of the TAB tape T, and moves to its initial state position. When there are a plurality of places to be marked, the above operation is repeated. Then, after all the marking is completed, the drive gear 43 is driven again, and the feeding of the TAB tape T is started.

As described above, according to the ink marking device 50, the ink bleeding from the printing surface 72 causes the printing of the printing surface 7.
Since the defective mark engraved on the mark 2 marks the front or back of the defective portion of the electronic component mounting film carrier tape, it is not necessary to apply ink to the stamped surface portion, and the defective portion of the electronic component mounting film carrier tape is not required. A defect mark engraved on the stamped surface can be marked on the front surface or the back surface.

Therefore, the defect marking can be automatically and accurately applied to the front or back surface of the defective portion of the electronic component mounting film carrier tape supplied in large quantities. Further, when the stamp member 70 is in the standby state, the stamped surface portion 72 is located below, so that the ink held by the stub member main body always oozes out to the stamped surface portion by the action of gravity to be in the standby state. The ink on the stamp face portion dries as in the case where the stamp face portion 72 is located above,
When marking a defective mark on the front surface or the back surface of the defective portion of the film carrier tape for mounting electronic components, it is possible to accurately mark the defective mark without causing a marking defect.

As described above, after the ink marking device 50 performs marking with ink on a predetermined position of a defective portion on the front surface or the back surface of the TAB tape T,
The B tape T passes through the guide roller 42 and is supplied to the next winding device 50. As shown in FIG. 1, the TAB tape T supplied to the take-up device 50 is taken up on a reel R mounted on a take-up drive shaft 52 by a drive motor (not shown) via a guide roller 53. Axis 5
As the 2 rotates, the TAB tape T is wound up.

At this time, the spacer S fed from the reel R of the feeding device 20 is supplied to the reel R of the winding device 50 via the guide rollers 57 and 56 and the dancer roller 58, and is supplied to the film carrier tape for mounting electronic components. The electronic component mounting film carrier tapes are interposed between them so as to protect the electronic component mounting film carrier tape from being in contact with each other so that ink does not adhere to another portion or the electronic component mounting film carrier tape is damaged.

As shown in FIG. 1, the winding device 50 is provided with three position sensors 51 in the vertical direction, similarly to the feeding device 20, and a TAB tape is provided by the lower position sensor. When the lower end T 'of the slack portion of T is detected, the driving of the drive motor of the winding device 50 is stopped to prevent the electronic component mounting film carrier tape from being too loose and coming into contact with the floor and being damaged. To prevent it. In addition, the upper position sensor
When the lower end T 'of the slack portion of the B tape T is detected,
The drive of the drive motor of the winding device 50 is started to maintain a constant slack in the electronic component mounting film carrier tape.

Although the preferred embodiment of the present invention has been described above, the present invention is not limited to this. For example, a plurality of stamp members 70 may be provided in the width direction of the film carrier tape for mounting electronic components. Various changes can be made without departing from the object of the present invention. For example, it is also possible to perform the marking by selectively operating them based on the information of the defective pattern detecting device 30 in parallel.

[0052]

According to the present invention, the result of detecting a defect in a lead wiring pattern can be automatically carried out by a defect pattern detecting device, and based on this detection result, a film carrier for mounting electronic parts can be obtained by a defect marking device. Marking can be automatically performed on defective portions of the tape.

Therefore, a complicated manual operation is not required.
It saves time and cost, is suitable for mass production, has no oversight of inspection failure, and greatly improves the accuracy of quality inspection. Further, according to the present invention, the front surface or the back surface of the electronic component mounting film carrier tape can be automatically marked with ink based on the detection result of the defective pattern detection device, so that the defective display can be reliably performed.

Further, according to the present invention, the defective mark engraved on the stamped surface due to the oozing of the ink from the stamped surface marks the front or back surface of the defective portion of the electronic component mounting film carrier tape. Need not be applied to the stamped surface, and a defective mark engraved on the stamped surface can be marked on the front or back surface of the defective portion of the film carrier tape for mounting electronic components.

Further, since a slit groove is formed in the stamp surface of the stamp member to guide the ink oozing out of the stamp surface to the entire stamp surface, the ink oozing out of the stamp surface passes through the slit groove to form the entire stamp surface. That is, the entire shadow is spread. Therefore, a clear shadow can be marked, and a defective product can be reliably determined by a defective mark detecting device such as a transmitted light sensor in a later process.

Further, in the present invention, since the slit groove is a slit groove formed radially from the center of the stamp face or a slit groove formed in a mesh shape, ink is printed through these slit grooves. The entire surface, that is, the entire shadow is widely spread, so that a clearer shadow can be marked. Therefore, the defect marking can be automatically and accurately applied to the front surface or the back surface of the defective portion of the electronic component mounting film carrier tape supplied in a large amount.

Further, according to the present invention, the stamp member is
In the standby state, the stamp face portion is located below, so that the ink held by the stub member main body always oozes out to the stamp face portion by the action of gravity to be in the standby state, so that the stamp face portion is located above. As in the case where the ink on the stamp surface dries and marks the defective mark on the front or back of the defective part of the film carrier tape for mounting electronic components, the defective mark is accurately marked without causing a marking defect. This is an extremely excellent invention that has many functions and effects, such as being able to perform.

[Brief description of the drawings]

FIG. 1 is a front view of an inspection device for a film carrier tape for mounting electronic components using a defect marking device for a film carrier tape for mounting electronic components of the present invention.

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a front view of a defect marking device for a film carrier tape for mounting electronic components according to the present invention.

FIG. 4 is a top view of a defect marking device for a film carrier tape for mounting electronic components according to the present invention.

FIG. 5 is an enlarged side view of a defect marking device for a film carrier tape for mounting electronic components according to the present invention.

FIG. 6 is a plan view of a stamp face of the stamp member of the present invention.

FIG. 7 is a plan view showing another embodiment of the stamp member of the present invention.

FIG. 8 is a schematic view of a conventional film carrier tape for mounting electronic components.

FIG. 9 is a partially enlarged cross-sectional view of a conventional film carrier tape for mounting a BGA type electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Inspection device 20 Sending device 21 Guide roller 22 Drive shaft 24 Drive motor 28 Position sensor 30 Ink marking device 30a Punching device 30b Laser marking device 30 Faulty pattern detection device 31 Guide roller 32 Back tension gear 33 Guide roller 34 Drive gear 36 Transmitted light Irradiation device 38 CCD camera 40 Marking device 41 Guide roller 42 Guide roller 43 Drive gear 43a Support roller 44 Back tension gear 44a Support roller 45 Base 46 Tape width direction guide member 48 Tape width direction guide member 50 Ink marking device 51 Position sensor 52 Drive shaft 52 Axis 53 Guide roller 54 Frame gantry body 55 Frame gantry 56 Arch 57 Guide roller 58 Dancer roller 60 Star Stamp unit 61 Stamp holding member 62 Drive motor 64 Rotating shaft 66 Stamp holding frame 68 Guide shaft 70 Stam member 72 Stamped surface 74 Ink recovery member 80 Control device 90 Slit groove 91 Shaded portion 92 Slit groove B Bad mark R Reel S Spacer T tape

Continued on the front page (72) Inventor Yuki Nishiguchi 1-1-1 Nishiyamacho, Hikoshima, Shimonoseki-shi, Yamaguchi FMC Term FMC (Reference) 5F044 MM41 MM49

Claims (11)

[Claims] 1. A defect marking device for marking a defective portion of a film carrier tape for mounting electronic components, the defect marking device comprising a stamp member having a stamped surface portion on which a predetermined defect mark is engraved, Based on the detection result of the failure of the wiring pattern of the lead of the electronic component mounting film carrier tape, when the stamped surface portion of the stamp member abuts on the front or back surface of the defective portion of the electronic component mounting film carrier tape. The stamp member is configured such that a defective mark engraved on the stamp surface portion by leaching of ink from the stamp surface portion is marked on the front surface or the back surface of the defective portion of the film carrier tape for mounting electronic components. Characterized in that a slit groove for guiding ink oozing from the stamp surface to the entire stamp surface is formed in the stamp surface of Defect marking device for film carrier tape for mounting electronic components. 2. The defective marking device according to claim 1, wherein the slit groove is a slit groove formed radially from the center of the stamp surface. 3. The defective marking device according to claim 2, wherein a center angle of the slit groove is formed to be equal. 4. The defective marking device according to claim 1, wherein the slit groove is a slit groove formed in a stamp surface portion in a mesh shape. 5. The defective marking device according to claim 4, wherein the slit grooves are formed so as to be equidistant from each other. 6. A film for mounting an electronic component, wherein the stamp member is turned upside down so that the stamped portion is positioned downward in a standby state, and the stamped portion is positioned upward in a marking state. The stamped portion of the stamp member abuts on the front or back surface of the defective portion of the carrier tape, and the defect mark is marked on the front or back surface of the defective portion of the electronic component mounting film carrier tape. The defective marking device according to claim 1. 7. A stamp member for a defect marking device for marking a defective portion of a film carrier tape for mounting electronic components, the stamp member having a stamped surface portion on which a predetermined defect mark is engraved. When the stamped portion of the stamp member comes into contact with the front or back surface of the defective portion of the film carrier tape for use, a defective mark engraved on the stamped portion due to bleeding of ink from the stamped portion is used for mounting electronic components. A stamp configured to be marked on the front surface or the back surface of the defective portion of the film carrier tape, wherein a slit groove is formed in the stamp surface of the stamp member to guide ink oozing from the stamp surface to the entire stamp surface. Element. 8. The stamp member according to claim 7, wherein the slit groove is a slit groove radially formed from the center of the stamp face. 9. The stamp member according to claim 8, wherein a center angle of the slit groove is formed to be equal. 10. The stamp member according to claim 7, wherein the slit groove is a slit groove formed in a mesh shape on a stamp face portion. 11. The stamp member according to claim 10, wherein the slit grooves are formed so as to be equidistant from each other.