JP4054164B2 - Defect marking device for film carrier tape for electronic component mounting - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is a film carrier tape for mounting electronic components (TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, ASIC (Application Specific Integrated Circuit) tape, etc.) (hereinafter simply referred to as “electronic component mounting”). When conducting an electrical inspection of “film carrier tape”), a defect in the wiring pattern of the lead of the film carrier tape for mounting electronic components is detected, and defective marking is applied to a predetermined position of the film carrier tape for mounting electronic components. The present invention relates to a defective marking device for a film carrier tape for mounting electronic components.
[0002]
[Prior art]
With the development of the electronics industry, the demand for printed wiring boards for mounting electronic components such as ICs (integrated circuits) and LSIs (large-scale integrated circuits) is increasing rapidly. There is a demand for higher functionality, and recently, mounting methods using TAB tape, T-BGA tape, ASIC tape, etc. have been adopted as mounting methods for these electronic components, especially high definition such as personal computers. In the electronic industry that uses liquid crystal display elements (LCDs), which are required to be thinner and to reduce the frame area of liquid crystal screens, their importance is increasing.
[0003]
Conventionally, such a film carrier tape for mounting electronic components, for example, a TAB tape 200, as shown in FIG. 7, has a plurality of transfer sprockets continuously in the longitudinal direction at both end portions in the width direction. Holes 202 and 202 are arranged side by side, and a device hole 204 for mounting a device such as an IC is formed at a substantially central portion between the sprocket holes 202. A wiring pattern 210 including inner leads 206 and outer leads 208 of the device hole 204 is formed.
[0004]
By the way, in the TAB tape 200, the quality of the TAB tape 200 is inspected. However, the inspection is more efficient and accurate than the conventional visual inspection (transmitted light inspection) by a person. As a method that can perform this, a method has been proposed in which an electrical disconnection, short circuit, insulation resistance, or the like of the wiring pattern 210 is electrically inspected and defective marking is performed on a defective product by punching or the like. 174774).
[0005]
In such an inspection method, as shown in FIG. 7, a test pad 212 is formed on the TAB tape 200, and an electrical inspection contact probe is applied to the test pad 212 to cause a short circuit failure in the wiring pattern 210. In addition, a conductive pad of the size of the device hole is applied to the entire inner lead 206 of the device hole 204, and a disconnection inspection is performed, and defective products are automatically punched.
[0006]
However, recently, among film carrier tapes, as shown in FIG. 8, a hole 302 is formed in the film carrier tape 300 instead of an outer lead called a BGA (Ball Grid Array), and an IC 304 is formed through the hole 302. The film carrier tape that does not have a device hole for connecting the solder balls 306, the IC size called CSP (Chip Size Package), and the size of the film carrier tape package are the same. A film carrier tape which is the same as BGA is also used.
[0007]
[Problems to be solved by the invention]
By the way, in such BGA and CSP, since there is no test pad and all the wirings are connected by electrolytic plating leads, it is impossible to perform the above electrical inspection with a probe or the like.
For this reason, in the conventional BGA and CSP inspection methods, a defect inspection is performed by visual inspection by a person, and defect marking is also performed by applying ink, magic, etc. by a human hand.
[0008]
Therefore, in such an inspection method, manual defect inspection and defect marking must be performed, which requires complicated operations, is time consuming and expensive, and is not suitable for mass production. Oversight may also occur, and the quality inspection accuracy may be reduced.
In consideration of such a current situation, the present invention provides an electronic component mounting film carrier tape on the basis of the results of quality inspections such as disconnection, short circuit, chipping, and protrusion, which are defects of the electronic component mounting film carrier tape. An object of the present invention is to provide a defect marking device for a film carrier tape for mounting electronic components, which can automatically perform defect marking by inking.
[0009]
[Means for Solving the Problems]
  The present invention has been made in order to achieve the above-described problems and objects in the prior art, and the defective marking device for electronic component mounting film carrier tape of the present invention is an electronic component mounting film carrier tape. A defective marking device for marking defective inspection parts of
  Equipped with an ink marking device that marks with ink on the front or back of film carrier tape for mounting electronic components,
   The ink marking device includes a stamp member having a stamped surface in which a predetermined defect mark is engraved,
When the stamped surface portion of the stamp member comes into contact with the front or back surface of the defective portion of the film carrier tape for mounting electronic components, the defective mark engraved on the stamped surface due to ink oozing from the stamped surface portion is an electronic component. Constructed to mark the front or back of the defective part of the mounting film carrier tape,
The stamp member is reversed so that the stamped surface portion is positioned below in the standby state, and the stamped surface portion is positioned upward in the marking state, so that the defective portion of the film carrier tape for mounting electronic components The stamp part of the stamp member abuts on the front or back surface of the tape, and the defective mark is marked on the front or back surface of the defective part of the film carrier tape for mounting electronic components.It is characterized by.
[0010]
  Thereby, since it can automatically mark with the ink on the surface or back surface of the film carrier tape for electronic component mounting based on the detection result of the defect pattern detection device, the defect display can be surely performed..
[0011]
By configuring in this way, the defect mark engraved on the stamping surface due to ink oozing out from the marking surface part marks the front or back of the defective part of the film carrier tape for mounting electronic components. Therefore, it is possible to mark a defect mark engraved on the stamp surface on the front or back surface of the defective part of the electronic component mounting film carrier tape.
[0012]
  Therefore, the defective marking can be automatically and accurately applied to the front or back surface of the defective portion of the electronic component mounting film carrier tape supplied in large quantities..
[0013]
By doing so, the stamp surface of the stamp member is positioned below when the stamp member is in the standby state, so that the ink held in the stub member body always oozes out to the stamp surface portion due to the action of gravity and is in the standby state. Therefore, when the marking surface portion dries, as in the case where the marking surface portion is positioned above, and the defective mark is marked on the front or back surface of the defective part of the film carrier tape for mounting electronic components, the marking defect is It is possible to accurately mark a defect mark without being generated.
[0015]
Furthermore, the defective marking device for a film carrier tape for mounting electronic components according to the present invention is such that the stamp member is an ink held on the stamp member main body on the stamp surface so that the ink always oozes on the stamp surface and enters a standby state. A large number of minute holes communicating with the storage part are provided, and the ink is always oozed out to the surface of the printing face part by the capillary phenomenon.
[0016]
With this configuration, the ink can always rise to the surface of the stamping surface against the action of gravity by capillary action. As a result, no ink drying or the like occurs and a defective mark can be accurately marked.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments (examples) of the present invention will be described with reference to the drawings.
FIG. 1 is a front view of an inspection apparatus for a film carrier tape for mounting electronic components equipped with a marking device of the present invention, and FIG. 2 is an upper view of the inspection apparatus for a film carrier tape for mounting electronic components equipped with a marking apparatus of the present invention. 3 is a front view of the marking device of the present invention, FIG. 4 is a top view of the marking device of the present invention, and FIG. 5 is an enlarged side view of the ink marking device of the present invention.
[0018]
As shown in FIG. 1 to FIG. 3, reference numeral 10 denotes a film carrier tape inspection apparatus for electronic component mounting according to the present invention as a whole.
As shown in FIG. 1, the electronic component mounting film carrier tape inspection device 10 includes a feeding device 20, a defective pattern detection device 30, a marking device 40, and a winding device 50.
[0019]
The delivery device 20 includes, for example, a film carrier tape (hereinafter simply referred to as “TAB tape”) for mounting electronic components of the type such as CSP and BGA, and a TAB tape T whose manufacturing process is completed is a spacer. A reel R wound through S is mounted on the delivery drive shaft 22. Then, by driving a drive motor (not shown), the feed drive shaft 22 is rotated, and the TAB tape T is fed from the reel R together with the spacer S, and is supplied to the defective pattern detection device 30 via the guide roller 21. It is like that.
[0020]
When the TAB tape T supplied to the defective pattern detection device 30 passes between the back tension gear 32 and the drive gear 34 disposed in the defective pattern detection device 30 via the guide roller 31, the drive is performed. The drive of the gear 34 is temporarily stopped, the feeding of the TAB tape is stopped, and the TAB tape is accurately positioned at a predetermined position by the reverse rotation of the back tension gear 32 engaged with the sprocket hole of the TAB tape. . In this state, the reflected light projected from the reflected light irradiation device 36 disposed below the TAB tape T in the defective pattern detection device 30 is applied to the TAB tape T. The reflected light reflected on the TAB tape T is received by the CCD camera 38 disposed below the TAB tape T in the defective pattern detection device 30. In the present embodiment, pattern inspection using reflected light has been described. However, the present invention is not limited to this, and can be used for pattern inspection using transmitted light, for example.
[0021]
As a result, the lead wiring pattern recognized by the CCD camera 38 is input to the control device 80, and compared with a normal wiring pattern previously input to a storage unit such as a RAM in the control device 80, and determined to be defective. In this case, the position of the defective portion, that is, the position of the defective portion in the longitudinal direction and the position in the width direction is output to the control device 82 of the marking device 40 described later.
[0022]
Due to the defective pattern detection device 30 having such a configuration, even in a TAB tape in which no test pads such as BGA and CSP exist and all wirings are connected by plating leads, electrical disconnection of leads, Quality inspections such as short circuits and pattern defects can be performed automatically and accurately in a short time.
As shown in FIG. 1, the delivery device 20 is provided with three position sensors 28 in the vertical direction, and the lower position sensor detects the lower end T ′ of the slack portion of the TAB tape T. In this case, the drive motor of the delivery device 20 is stopped to prevent the TAB tape from being loosened and coming into contact with the floor and being damaged. Further, when the upper position sensor detects the lower end T ′ of the slack portion of the TAB tape T, the driving motor of the feeding device 20 is started to maintain a certain slack of the TAB tape. ing.
[0023]
On the other hand, the TAB tape T in which the defect of the wiring pattern is inspected by the defect pattern detection device 30 is then supplied to the marking device 40 via the guide rollers 33 and 41.
Then, the TAB tape T supplied to the marking device 40 passes through the guide roller 42 from the guide roller 41 as shown in FIGS. On the basis of the detection information, the defective portion is marked with ink.
[0024]
That is, the TAB tape T supplied to the marking device 40 is fed by the drive gear 43 and its support roller 43a, and thus passes through the back tension gear 44 and its support roller 44a, and in the first tape width direction. The position in the width direction is regulated by the guide member 46 and the second tape width direction guide member 48, passes through the guide roller 42, and is supplied to the next winding device 50.
[0025]
When the TAB tape T passes between the back tension gear 44 and the drive gear 43, the defect pattern detection device 30 detects the defect portion detection information input to the control device 82 and detected by the drive gear 43. The drive is temporarily stopped, the feeding of the TAB tape is stopped, and the reverse rotation of the back tension gear 44 that engages with the sprocket hole of the TAB tape causes the TAB tape to be accurately positioned at a predetermined position, that is, where the defective portion exists. The predetermined position of the electronic component mounting unit where the defective portion exists in the feeding direction of the TAB tape T, the position of the defective portion in the longitudinal direction of the tape, and the position in the width direction are accurately positioned in the ink marking device 90. Is positioned.
[0026]
In this state, the ink marking device 90 performs marking with ink at a predetermined position on the front surface or the back surface of the TAB tape T.
As shown in FIG. 5, the ink marking device 90 stands on a base 45 of the marking device 40 on a moving mechanism such as a guide rail (not shown) so as to be movable in the width direction and the longitudinal direction of the TAB tape T. A frame base 55 is provided.
[0027]
The frame base 52 includes a frame base main body 54 and an arch portion 56 provided above the frame base main body 54 and extending in the width direction of the TAB tape T. A marking receiving portion 58 is formed on the lower surface of the tip of the arch portion 56. As will be described later, when the marking surface portion 72 of the stamp member abuts on the front or back surface of the defective portion of the TAB tape, the marking receiving portion 58 is interposed between the marking surface portion 72 of the stamp member 70 and the TAB tape. This is because the TAB tape is supported so that marking with ink is surely performed and the TAB tape is not damaged. Therefore, it is desirable that the marking receiving portion 58 is made of a hard synthetic resin such as acrylic.
[0028]
A stamp unit 60 is rotatably mounted on the frame base body 54. That is, the drive motor 62 of the stamp unit 60 is fixed to the frame base body 54, and the stamp holding frame 66 is connected to the rotation shaft 64 of the drive motor 62.
A stamp holding member 61 is attached to the stamp holding frame 66 so as to be movable up and down via a guide shaft 68. The stamp holding member 61 holds the stamp member 70 so that the stamp member 70 can be freely attached and detached.
[0029]
The stamp member 70 has a marking surface portion 72 on which a predetermined defect mark B is engraved. When the stamp surface abuts on the front surface or the back surface of the defective portion of the TAB tape, the stamp member 70 is attached to the main body portion of the stamp member 70. The ink stored in the built-in ink reservoir (not shown) oozes out from the marking surface 72 so that the defect mark B engraved on the marking surface is marked on the front or back surface of the defective portion of the TAB tape. It has become.
Further, at the position below the stamp member 70, as shown by the dotted line in FIG. 5, in order to prevent the stamp surface portion 72 from drying when the stamp surface portion 72 of the stamp member 70 is positioned below, a stamp cap member is provided. 74 is fixed to the frame gantry body 54.
[0030]
The ink marking device 90 configured in this manner operates as shown in FIG.
That is, when the stamp member 70 is in the standby state, the stamp surface portion 72 is disposed so as to be positioned below.
Then, based on the defect location detection information detected by the defect pattern detection device 30 and input to the control device 82, the drive of the drive gear 43 is temporarily stopped, the feeding of the TAB tape T is stopped, and the TAB tape is stopped. The defective portion of T is positioned so as to be accurately positioned on the ink marking device 90.
[0031]
In this state, the frame base 52 is moved in the width direction and the longitudinal direction of the TAB tape T by a moving mechanism (not shown) based on the defect location detection information input to the control device 82, and the TAB tape T is defective. The stamp member 70 is moved to a position below the position to be marked.
Then, the drive motor 62 is driven and the rotation shaft 64 rotates to rotate the stamp unit 60 by 180 °, whereby the stamp member 70 held by the stamp holding member 61 of the stamp holding frame 66 rotates by 180 °. Then, the marking surface portion 72 is arranged upward, that is, the marking surface portion 72 is opposed to the portion to be marked on the front surface or the back surface of the TAB tape T.
[0032]
In this state, the stamp holding frame 66 is moved upward through the guide member 67 along the guide rail 65 formed in the vertical direction on the frame base body portion 54 by the moving mechanism 63 such as a piston cylinder. By moving the stamp holding member 61 upward through the guide shaft 68 and bringing the marking surface portion 72 into contact with the front or back surface of the defective portion of the TAB tape, the marking receiving portion 58 supports the TAB tape, while A defect mark B engraved on the surface portion 72 is marked on the front or back surface of the defective portion of the TAB tape.
[0033]
Then, after the marking is completed, the stamp holding frame 66 is moved downward through the guide member 67 along the guide rail 65 formed in the frame base body 54 in the vertical direction by the moving mechanism 63 such as a piston cylinder. As a result, the stamp holding member 61 is moved downward via the guide shaft 68 to separate the stamp member 70 from the front surface or the back surface of the TAB tape, and then the drive motor 62 is driven to rotate the rotary shaft 64. By rotating the stamp unit 60 by 180 °, the stamp member 70 is rotated by 180 ° so that the stamp surface portion 72 is positioned below and returns to the standby state again.
[0034]
Thereafter, the frame base 52 moves in the width direction and the longitudinal direction of the TAB tape T and moves to the initial state position.
In addition, when there are a plurality of places to be marked, the above operation is repeated.
Then, after all the marking is completed, the drive gear 43 is driven again and the feeding of the TAB tape T is started.
[0035]
As described above, according to the ink marking device 90, the defect mark engraved on the marking surface portion 72 by the ink oozing from the marking surface portion 72 marks the front surface or the back surface of the defective portion of the TAB tape. It is not necessary to apply to the surface portion, and a defect mark engraved on the stamp surface portion can be marked on the front or back surface of the defective portion of the TAB tape.
[0036]
Therefore, the defective marking can be automatically and accurately applied to the front or back surface of the defective portion of the TAB tape supplied in large quantities.
In addition, when the stamp member 70 is in the standby state, the stamp surface portion 72 is positioned below, so that the ink held in the stub member body always oozes out from the stamp surface portion due to the action of gravity and enters the standby state. When marking the mark on the front or back side of the defective part of the TAB tape, the marking surface part 72 is accurately dried without causing a marking defect. Defective marks can be marked.
[0037]
As described above, after the ink marking device 90 marks the defective position on the front surface or the back surface of the TAB tape T with the ink, the TAB tape T passes through the guide roller 42 to be wound next. To the take-off device 50. As shown in FIG. 1, the TAB tape T supplied to the take-up device 50 is taken up by a drive motor (not shown) via a guide roller 53 on a reel R mounted on the take-up drive shaft 52. As the shaft 52 rotates, the TAB tape T is wound up.
[0038]
At this time, the spacer S fed from the reel R of the feeding device 20 is supplied to the reel R of the take-up device 50 via the guide rollers 57 and 56 and the dancer roller 59, and is interposed between the TAB tapes. The tapes are in contact with each other so that the ink adheres to another portion and the TAB tape is protected from damage.
[0039]
As shown in FIG. 1, the take-up device 50 is provided with three position sensors 51 in the vertical direction as in the case of the delivery device 20, and the TAB tape T is loosened by the lower position sensor. When the lower end T ′ of the part is detected, the drive of the drive motor of the winding device 50 is stopped to prevent the TAB tape from being loosened and coming into contact with the floor and being damaged. When the lower position T ′ of the slack portion of the TAB tape T is detected by the upper position sensor, the drive motor of the winding device 50 is started to maintain a certain slack of the TAB tape. It has become.
[0040]
  FIG. 6 shows an ink marking device according to the present invention.It shows a reference exampleFIG. 6 is an enlarged side view similar to FIG. thisreferenceThe example is basically the same configuration as the ink marking apparatus shown in FIG. 5 described above, and the same reference numerals are assigned to the same components, and detailed description thereof is omitted.
[0041]
  thisreferenceIn the ink marking device 90 of the example, as in the ink marking device shown in FIG. 5, the stamp member 70 is not in the standby state in the standby state, but the stamp surface portion 72 is not positioned below. In this case, the stamp surface portion 72 of the stamp member 70 is always directed upward. For this reason, the drive motor 62 and the rotating shaft 64 of the ink marking apparatus shown in FIG. 5 are omitted.
[0042]
Further, the ink held on the stamp member main body is marked on the stamp surface portion 72 of the stamp member 70 when the ink on the stamp surface portion 72 dries and marks a defective mark on the front or back surface of the defective portion of the TAB tape. In order to prevent the occurrence of the above-described defect, although not shown in the drawing, a minute hole communicating with the ink storage portion held by the stamp member main body is formed in the marking surface portion 72 so that the ink oozes out to the marking surface portion 72 and enters a standby state. A large number of inks are provided, and the capillarity causes the ink to always rise to the surface of the marking surface portion 72 against the action of gravity. As a result, even if the stamp surface portion 72 is at the upper position, ink drying or the like does not occur, and a defective mark can be accurately marked.
[0043]
Further, in the ink marking device 90 having such a configuration, it is not necessary to rotate the stamp member 70 up and down like the ink marking device 90 of the embodiment of FIG. The inspection and marking time can be extremely shortened, and the apparatus can be made compact because there is no need to provide a drive motor.
[0044]
  The preferred embodiments of the present invention have been described above.ButThe present inventionThe embodiment shown in FIGS.For example, a plurality of stamp members 70 are juxtaposed in the width direction of the TAB tape, and this is selectively operated based on the information of the defective pattern detection device 30 for marking. Various modifications are possible without departing from the object of the present invention.
[0045]
【The invention's effect】
According to the present invention, a defect pattern detection device can automatically detect a defect in a lead wiring pattern, and based on this detection result, a marking device can automatically detect a defective portion of a film carrier tape for electronic component mounting. Marking can be applied.
[0046]
Therefore, complicated manual work is not required, it does not take time and cost, is suitable for mass production, has no oversight of inspection defects, and the accuracy of quality inspection is greatly improved. Further, according to the present invention, since the front or back surface of the electronic component mounting film carrier tape can be automatically marked with ink based on the detection result of the defect pattern detection device, the defect display can be reliably performed.
[0047]
Furthermore, according to the present invention, since the defect mark engraved on the marking surface portion by the oozing of the ink from the marking surface portion marks the front or back surface of the defective portion of the film carrier tape for mounting electronic components, the ink is printed on the marking surface portion. Therefore, it is possible to mark a defect mark engraved on the stamp surface on the front or back surface of the defective part of the electronic component mounting film carrier tape.
[0048]
Accordingly, the defective marking can be automatically and accurately applied to the front or back surface of the defective portion of the electronic component mounting film carrier tape supplied in large quantities.
Further, according to the present invention, when the stamp member is in the standby state, the marking surface portion is positioned below, so that the ink held in the stub member body always oozes out to the marking surface portion due to the action of gravity and stands by. Since the ink on the stamped surface dries like the case where the stamped surface portion is located above and marks the defective mark on the front or back surface of the defective part of the film carrier tape for mounting electronic components, the marking is defective. It is possible to accurately mark a defect mark without generating.
[0050]
Further, according to the present invention, the stamp member is provided with a number of minute holes communicating with the ink storage portion held by the stamp member body so that the ink always oozes out from the stamp surface portion and is in a standby state. Thus, since the ink is always oozed out to the surface of the marking surface by the capillary phenomenon, the ink can always rise to the surface of the marking surface against the action of gravity by the capillary phenomenon. This is an extremely excellent invention that exhibits a number of functions and effects such as the ability to accurately mark defective marks without causing ink drying.
[Brief description of the drawings]
FIG. 1 is a front view of an inspection device for a film carrier tape for mounting electronic components equipped with a marking device of the present invention.
FIG. 2 is a top view of an electronic component mounting film carrier tape inspection apparatus equipped with the marking device of the present invention.
FIG. 3 is a front view of the marking device of the present invention.
FIG. 4 is a top view of the marking device of the present invention.
FIG. 5 is an enlarged side view of the ink marking device of the present invention.
FIG. 6 shows an ink marking device according to the present invention.A reference example is shown.FIG. 6 is an enlarged side view similar to FIG. 5.
FIG. 7 is a schematic view of a conventional TAB tape.
FIG. 8 is a partially enlarged sectional view of a conventional BGA type TAB tape.
[Explanation of symbols]
10 Inspection equipment
20 Delivery device
21 Guide roller
22 Drive shaft
28 Position sensor
30 Defect pattern detection device
31 Guide roller
32 Back tension gear
33 Guide roller
34 Drive gear
36 Reflected light irradiation device
38 CCD camera
40 Marking equipment
41 Guide roller
42 Guide roller
43 Drive Gear
43a Support roller
44 Back tension gear
44a Support roller
45 base
46 Tape width direction guide member
48 Tape width direction guide member
50 Winding device
51 Position sensor
52 Drive shaft
53 Guide roller
54 Frame base body
55 frame mount
56 Arch
57 Guide roller
59 Dancer Laura
60 Stamp unit
61 Stamp holding member
62 Drive motor
64 Rotating shaft
66 Stamp holding frame
68 Guide shaft
70 Stum member
72 Mark face
74 Stamp cap member
80 controller
90 Ink marking device
B Defect mark
R reel
S spacer
T tape

Claims (2)

A defective marking device for marking defective inspection parts of a film carrier tape for mounting electronic components,
Equipped with an ink marking device for marking with ink on the front or back of film carrier tape for mounting electronic components ,
The ink marking device includes a stamp member having a stamped surface in which a predetermined defect mark is engraved,
When the stamped surface portion of the stamp member comes into contact with the front or back surface of the defective portion of the film carrier tape for mounting electronic components, the defective mark engraved on the stamped surface due to ink oozing from the stamped surface portion is an electronic component. Constructed to mark the front or back of the defective part of the mounting film carrier tape,
The stamp member is reversed so that the stamped surface portion is positioned below in the standby state, and the stamped surface portion is positioned upward in the marking state, so that the defective portion of the film carrier tape for mounting electronic components For mounting electronic components, wherein the stamp surface of the stamp member is in contact with the front or back surface of the tape, and the defective mark is marked on the front or back surface of the defective portion of the electronic component mounting film carrier tape Film carrier tape defect marking device. The stamp member is provided with a large number of minute holes communicating with the ink storage portion held by the stamp member body so that the ink always bleeds into the stamp surface and is in a standby state. 2. The defective marking device for a film carrier tape for mounting electronic components according to claim 1 , wherein the ink is always oozed out to the surface of the marking surface.

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