JP2000249738A - Electric continuity checking device for tape-like object - Google Patents

Electric continuity checking device for tape-like object

Info

Publication number
JP2000249738A
JP2000249738A JP11051456A JP5145699A JP2000249738A JP 2000249738 A JP2000249738 A JP 2000249738A JP 11051456 A JP11051456 A JP 11051456A JP 5145699 A JP5145699 A JP 5145699A JP 2000249738 A JP2000249738 A JP 2000249738A
Authority
JP
Japan
Prior art keywords
tape
continuity
axis direction
electrode pattern
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11051456A
Other languages
Japanese (ja)
Inventor
Hisashi Yasota
寿 八十田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UHT Corp
Original Assignee
UHT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UHT Corp filed Critical UHT Corp
Priority to JP11051456A priority Critical patent/JP2000249738A/en
Publication of JP2000249738A publication Critical patent/JP2000249738A/en
Pending legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To inspect electric continuity of boards to be taken in large numbers in a later process while a tape-like object wound in a roll state is reeled out and reeled in. SOLUTION: In this electric continuity checking device for a tape-like object X, whenever the tape-like object X is intermittently reeled out by a prescribed length by a reeling-out mechanism 12 and reeled in by a reeled-in mechanism 22, cameras 3, 4 respectively pick up images of front and rear reference points marked in a board area to be obtained in a later process (i.e., a punching process) together with the board area, and the picked-up images are analyzed to calculate coordinate data of the respective reference paints. The board area is intermittently fed to right under and right above a pair of upper and lower electric continuity checkers 5, 5, the calculated coordinate data is compared with coordinate data of reference points on front and rear surfaces of the electric continuity checkers 5, 5 taught in a memory part of a image processor 6 to calculate corrected data, a control part 7 controls the respective electric continuity checkers 5, 5 according to the corrected data to move them (in the X-axis direction, the Y-axis direction and the θ direction) and to move in the Z direction, and electric continuity of an electrode pattern in each the board area is checked.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、TAB(Tape
Automated Bonding)用のテープ状
物の導通検査装置に関するものである。
TECHNICAL FIELD The present invention relates to a TAB (Tape)
The present invention relates to a continuity inspection device for a tape-shaped material for Automated Bonding.

【0002】[0002]

【従来の技術】表裏に電極パターンを有する基板の表面
に、回路形成されたICチップを電気的に接続し搭載し
た後に樹脂モールドまたは樹脂コートして形成されたP
・G・A(ピン・グリッド・アレイ)、B・G・A(ボ
ール・グリッド・アレイ)、C・S・P(チップ・サイ
ズ・パッケージ)等のICパッケージは、電子機器の小
形化に付与すべく更に小型化される傾向にあり、C・S
・P(チップ・サイズ・パッケージ)は、P・G・A
(ボール・グリッド・アレイ)よりも更に小型化させた
ものである。ICチップを基板に搭載させる前工程とし
て基板に印刷されている電極パターンの導通検査を必須
とする。
2. Description of the Related Art A circuit formed IC chip is electrically connected to a surface of a substrate having an electrode pattern on the front and back sides, mounted, and then formed by resin molding or resin coating.
・ IC packages such as GA (pin grid array), BGA (ball grid array), and CSP (chip size package) are provided for miniaturization of electronic devices. There is a tendency to be further miniaturized,
・ P (chip size package) is PGA
(Ball grid array). As a pre-process for mounting an IC chip on a substrate, a continuity test of an electrode pattern printed on the substrate is essential.

【0003】B・G・A、C・S・P等の基板の導通検
査装置としては例えば図7に示すようなものが挙げられ
る。この導通検査装置は、電極パターンを有する基板2
00を搬入・搬出する移送手段300を備えると共に、
基板200の表裏の電極に接触させるプローブ(導通素
子)を駒体(被取付体)に対して電極パターンに一致す
る配列パターンをもって植設状に備えた導通検査器40
0、400を、基板200を挟んでその上方及び下方に
配置し、該導通検査器400、400各々を、X軸線方
向・Y軸線方向・Z軸線方向・θ方向に制御動可能と
し、更に移送手段300を挟んでその上下の導通検査器
400、400間に出入り可能に設けられ所定角度回動
可能なミラー600を内装するカメラ500、500を
具備させて、構成してある。そして、移送手段300で
移送されてくる基板200の表裏の電極パターンを上下
の導通検査器400、400間に進入するカメラ50
0、500で個別に撮像して、基板の表裏に付されてい
る基準点の座標位置を画像解析(2値化画像の解析)で
算出し、それに基づいてX軸線方向・Y軸線方向・θ方
向の位置ズレデータ(補正データ)を算出し、その補正
データに基づいて導通検査器400、400を各々制御
動させて芯出しし、カメラ500を後退させた後、各々
の導通検査器400、400を基板200に向かってZ
動方向に制御動させ、プローブ(導通素子)を基板表裏
の電極に一括して短絡し、導通検査する。この先行技術
の基板は、平面視矩形状のワークから打抜き工程で多数
個取りされたものである。ところで、今日予め電極が所
定のパターンをもって基板エリア毎に印刷されているT
AB(Tape Automated Bonding)
用のテープ状物(フィルム材)が普及している。このテ
ープ状物の場合には導通検査した後、基板エリア毎に打
抜いて基板とする訳であるが、テープ状物のままで導通
検査する具体的な装置は未だ提案されていない。このテ
ープ状物にも後工程で打抜かれる基板エリアにはその表
裏面に、電極パターンと共にその基板エリアの対角線コ
ーナーに一対の基準点が高精度をもって付されている。
そして、その基板エリアは、テープ状物の長さ方向に横
一列をもって設けられていたり、テープ状物に縦横複数
列をもって多設けられている。
As an apparatus for inspecting the continuity of a substrate such as B, G, A, C, S, P, etc., for example, there is one as shown in FIG. This continuity inspection device includes a substrate 2 having an electrode pattern.
And a transfer means 300 for loading and unloading 00.
A continuity tester 40 in which probes (conductive elements) to be brought into contact with the electrodes on the front and back of the substrate 200 are planted with an array pattern corresponding to the electrode pattern on the piece (attached body).
0 and 400 are disposed above and below the substrate 200 with the continuity checkers 400 and 400 respectively controlled and movable in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ direction. Cameras 500, 500 provided with a mirror 600 which is provided so as to be able to enter and exit between the continuity checkers 400, 400 above and below the means 300 and which can rotate by a predetermined angle are provided. Then, the camera 50 which enters the electrode patterns on the front and back of the substrate 200 transferred by the transfer means 300 between the upper and lower continuity testers 400, 400.
The images are individually captured at 0 and 500, and the coordinate positions of the reference points attached to the front and back of the substrate are calculated by image analysis (analysis of the binarized image), and based on the calculated values, the X-axis direction, the Y-axis direction, θ The direction deviation data (correction data) in the direction is calculated, the continuity testers 400, 400 are respectively controlled and centered based on the correction data, and the cameras 500 are retracted. 400 toward the substrate 200
The probe (conducting element) is short-circuited to the electrodes on the front and back of the substrate at a time, and the conduction is inspected. This prior art substrate is obtained by cutting a large number of substrates from a rectangular work in a punching step. By the way, today, the electrodes are printed on each substrate area in a predetermined pattern in advance.
AB (Tape Automated Bonding)
Tape-like material (film material) is widely used. In the case of this tape-shaped object, after conducting the continuity test, the substrate is punched out for each substrate area to form a substrate. However, a specific device for conducting the continuity test with the tape-shaped object as it is has not yet been proposed. This tape-shaped material is provided with a pair of reference points with high precision at the diagonal corners of the substrate area together with the electrode pattern on the front and back surfaces of the substrate area to be punched in a later step.
The substrate area is provided in one row in the length direction of the tape-shaped object, or is provided in a plurality of rows and columns in the tape-shaped object.

【0004】[0004]

【発明が解決しようとする課題】本発明は上記従来事情
に鑑みてなされたもので、その技術的課題は、ロール状
に巻回されたテープ状物を繰出し且つ巻き取る間に後工
程で多数個取りされる基板エリアの導通検査をすること
である。
SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional circumstances, and its technical problem is that a large number of post-processes are required during unwinding and winding of a tape-shaped material wound in a roll shape. The purpose is to conduct a continuity test on the substrate area to be singulated.

【0005】[0005]

【課題を解決するための手段】上記目的を解決するため
に講じた技術的手段は、請求項1は、ロール状に巻回さ
れたテープ状物を所定量間欠的に繰出す繰出し機構と、
そのテープ状物を巻き取る巻取り機構と、その繰出し機
構と巻取り機構との間でテープ状物を挟んで上方、下方
に対向して配置し、テープ状物から後工程で得られる基
板エリアの電極パターンを表裏から撮像するX軸線方
向、Y軸線方向に個別に制御動可能な上下一対のカメラ
と、そのカメラに連絡する画像処理装置と、前記カメラ
の下流においてテープ状物を挟んで上方、下方に対向し
て配設され、前記電極パターンと一致する配列パターン
のプローブを有するX軸線方向、Y軸線方向、Z軸線方
向、θ方向に個別に制御動可能な上下一対の導通検査器
と、制御部とを備え、前記画像処理装置は、撮像の画像
解析から前記基板エリアの表面、裏面に付されている基
準点の座標データを算出して、予めティーチングされて
いる上下一対の導通検査器表面内の基準点の座標データ
とその算出された基準点の座標データとで補正データを
演算し、前記制御部は、各基板エリアの電極パターンを
追跡し、上下一対の前記導通検査器間に各電極パターン
が間欠送りされる度にその電極パターン固有の補正デー
タを基に同前記導通検査器をX軸線方向、Y軸線方向に
個別に制御動し、Z動させて各電極パターンに導通検査
器のプローブを接触させることを要旨とする。そして、
請求項2は、請求項1記載の上下一対のカメラを、導通
検査器間まで個別にX軸線方向に水平往復動可能に構成
して、テープ状物が巻取り機構に掛け渡される前の上下
の導通検査器表面内の基準点の座標データを上下一対の
カメラによる撮像の画像解析から入手し、その座標デー
タを前記ティーチングデータとすることを要旨とする。
ここで、前記X軸線方向は、テープ状物の繰出し方向、
Y軸線方向は、テープ状物の直交する方向を指す。
The technical means taken for solving the above-mentioned object is as follows. Claim 1 is a feeding mechanism for intermittently feeding a predetermined amount of a tape-like material wound in a roll form,
A take-up mechanism for winding the tape-like material, and a substrate area obtained by placing the tape-like material between the feeding mechanism and the take-up mechanism so as to face the upper and lower sides of the tape-like material in a later process. A pair of upper and lower cameras that can be individually controlled in the X-axis direction and the Y-axis direction for imaging the electrode pattern from the front and back, an image processing device that communicates with the camera, and a tape-like object downstream from the camera A pair of upper and lower continuity testers which are individually arranged to be controlled in the X-axis direction, the Y-axis direction, the Z-axis direction, and the θ-direction, having probes arranged in an array pattern coinciding with the electrode pattern. A control unit, the image processing apparatus calculates coordinate data of a reference point attached to the front surface and the back surface of the substrate area from image analysis of imaging, and a pair of upper and lower conductive points that are previously taught. Compensation data is calculated with the coordinate data of the reference point in the surface of the inspector and the calculated coordinate data of the reference point, and the control unit tracks the electrode pattern of each substrate area, and a pair of upper and lower continuity testers. Each time the electrode pattern is intermittently fed, the continuity tester is individually controlled and moved in the X-axis direction and the Y-axis direction based on the correction data unique to the electrode pattern, and Z-moved to each electrode pattern. The gist is that the probe of the continuity tester is brought into contact. And
In a second aspect, the pair of upper and lower cameras according to the first aspect are configured to be capable of reciprocating horizontally in the X-axis direction individually between the continuity checkers, and the upper and lower cameras before the tape-like material is wound around the winding mechanism. The point is that coordinate data of a reference point in the surface of the continuity tester is obtained from image analysis of image pickup by a pair of upper and lower cameras, and the coordinate data is used as the teaching data.
Here, the X-axis direction is a feeding direction of the tape-shaped material,
The Y axis direction refers to a direction orthogonal to the tape-shaped object.

【0006】[0006]

【作用】(請求項1)本テープ状物の導通検査装置は、
繰出し機構でテープ状物を所定長さづつ間欠送りし巻取
り機構で巻き取る度に、カメラ各々で後工程である打抜
き工程で得られる基板エリア内に付されている表裏の基
準点を基板エリアと共に撮像し画像解析して各々の基準
点の座標データを算出する。尚、基板エリアがテープ状
物の長さ方向横一列に設けられている場合には、上下一
対のカメラは制御動させずに待機させて、間欠送りされ
る各基板エリアの電極パターンを真上から撮像する。 そして、画像処理装置の記憶部に予めティーチングされ
ている上下一対の導通検査器表面、裏面内の基準点の座
標データと、前記算出された座標データとを比較して電
極パターン毎の固有の補正データを演算し、各基板エリ
アを上下一対の導通検査器直下に間欠送りした後、その
補正データをもって制御部が上下一対の導通検査器を各
々制御動(X軸線方向、Y軸線方向、θ方向)し、更に
Z動させて、各基板エリア内の電極パターンの導通検査
を行う。尚、基板エリアの電極パターンは印刷の関係で
X軸方向、Y軸方向、θ方向等に微妙に位置ズレしてい
る場合がある。この電極パターンを導通検査器間に間欠
送りし、Z動して導通検査すると、検査ミスを起こして
しまう。これを未然に防止するために補正データを必要
とする。各基板エリア(電極パターン)の追跡は、上下
一対のカメラ間から上下一対の導通検査器間への間欠送
り数を設定カウント値として制御部に記憶し、各基板エ
リアが設定カウント値をもって間欠送りされた時に、前
記固有の補正データをもって上下一対の導通検査器を各
々制御動させる方式で行う。また、基板エリアがテープ
状物に縦横列(例えば縦横2列)に設けられている場合
には、テープ状物が間欠送りされる度に上下のカメラを
縦列方向、即ちY軸線方向に基板エリアが一画面に収ま
るように所定量制御動させて電極パターンを一個ずつ撮
像すれば良いものであるし、基板エリア(電極パター
ン)の追跡においても、前記と同様にカメラ間から導通
検査器間への間欠送り数を設定カウント値として制御部
を記憶し、各基板エリアを設定カウント値をもって間欠
送りした後、Y軸線方向に導通検査器を所定量制御動さ
せて各基板エリアと順次対向させる度に、その電極パタ
ーン固有の補正データをもって上下一対の導通検査器を
各々制御動させて導通検査を行う。尚、上下の導通検査
器での電極パターンの実質導通検査時間(上下の導通検
査器を制御動して電極パターンにプローブを接触させて
導通検査をしている実質的な時間)を利用して、上下の
カメラをX軸線方向やY軸線方向に各電極パターンに対
応するように制御動させ且つその撮像して複数個の電極
パターンの補正データを予め入手しておくことも可能で
ある。また、各基板エリアにシリアルナンバーを付して
おき、そのシリアルナンバーを画像処理装置で画像解析
して、そのデータを制御部にその都度記憶し、後工程で
ある打抜き工程でそのシリアルナンバーがカメラで撮像
された時に、ディスプレイやオペレータに伝達して廃棄
の一助にすることは自由である。 (請求項2)本テープ状物の導通検査装置は、上側のカ
メラ、下側のカメラを各々個別に導通検査器間まで水平
移動させて、上側の設置状態の導通検査器表面のプロー
ブと共にその基準点を下側のカメラで、また下側の設置
状態の導通検査器表面のプローブと共にその基準点を上
側のカメラで各々撮像し、画像処理装置で画像解析し
て、その基準点の座標データを前記ティーチングデータ
として入手する。
According to a first aspect of the present invention, there is provided a continuity inspection device for a tape-shaped object.
Each time the tape-like material is intermittently fed by a predetermined length by the feeding mechanism and wound by the winding mechanism, the front and back reference points attached to the board area obtained in the punching process, which is a subsequent process, by each camera, are set to the board area. At the same time, the image is taken and the image is analyzed to calculate the coordinate data of each reference point. When the substrate areas are provided in a row in the longitudinal direction of the tape-like material, the pair of upper and lower cameras are made to stand by without being controlled, and the electrode pattern of each intermittently fed substrate area is directly above. Image from. Then, the coordinate data of the reference point in the pair of upper and lower continuity testers, which has been previously taught in the storage unit of the image processing apparatus, and the calculated coordinate data are compared with the unique correction for each electrode pattern. After calculating the data and intermittently feeding each substrate area immediately below the pair of upper and lower continuity testers, the control unit controls the pair of upper and lower continuity testers based on the correction data (X-axis direction, Y-axis direction, θ direction). Then, the Z pattern is further moved to conduct a continuity test of the electrode pattern in each substrate area. Incidentally, the electrode pattern in the substrate area may be slightly displaced in the X-axis direction, the Y-axis direction, the θ direction, or the like due to printing. If this electrode pattern is intermittently fed between the continuity testers and Z-moved to perform a continuity test, a test error will occur. Correction data is required to prevent this. For tracking of each board area (electrode pattern), the number of intermittent feeds between a pair of upper and lower cameras and between a pair of upper and lower continuity testers is stored as a set count value in the control unit, and each board area is intermittently fed with the set count value. Then, the pair of upper and lower continuity testers are controlled and moved using the unique correction data. Further, when the substrate areas are provided in the tape-shaped object in a vertical and horizontal row (for example, two rows and columns), each time the tape-shaped object is intermittently fed, the upper and lower cameras are moved in the column direction, that is, in the Y axis direction. It is only necessary to take an image of each electrode pattern by controlling a predetermined amount so as to fit in one screen, and also in tracking the substrate area (electrode pattern) from the camera to the continuity tester in the same manner as described above. The control unit stores the number of intermittent feeds as a set count value, intermittently feeds each board area with the set count value, and then controls the continuity tester by a predetermined amount in the Y-axis direction to sequentially face each board area. Next, a pair of upper and lower continuity testers are controlled and moved based on the correction data unique to the electrode pattern to perform a continuity test. The actual continuity test time of the electrode pattern in the upper and lower continuity testers (substantial time for controlling the upper and lower continuity testers to bring the probe into contact with the electrode pattern and perform the continuity test) is used. Alternatively, the upper and lower cameras may be controlled to move in the X-axis direction or the Y-axis direction so as to correspond to each electrode pattern, and the images may be taken to obtain correction data for a plurality of electrode patterns in advance. In addition, a serial number is assigned to each board area, the serial number is image-analyzed by an image processing device, and the data is stored in the control unit each time. It is free to transmit to the display or the operator when the image is taken in to help the disposal. (Claim 2) The present continuity inspection device for a tape-like object horizontally moves the upper camera and the lower camera individually between the continuity inspection devices, and together with the probe on the surface of the continuity inspection device in the upper installation state. The reference point is picked up by the lower camera, and the reference point is picked up by the upper camera together with the probe on the surface of the continuity tester installed in the lower state, and the image is analyzed by an image processing device, and the coordinate data of the reference point is taken. Is obtained as the teaching data.

【0007】[0007]

【発明の実施の形態】次に、本発明の実施の形態を図面
に基づいて説明する。図1乃至図6は本発明のテープ状
物の導通検査装置を示している。
Next, an embodiment of the present invention will be described with reference to the drawings. 1 to 6 show a continuity inspection apparatus for a tape-shaped object according to the present invention.

【0008】この導通検査装置Aは、図1に示すように
機体1、テープ状物Xの供給部2、上下のカメラ3、
4、上下の導通検査器5、5、画像処理装置6、制御部
7、モニタ8等を備えている。
As shown in FIG. 1, the continuity inspection device A includes a machine body 1, a supply unit 2 for a tape-like material X, upper and lower cameras 3,
4, upper and lower continuity testers 5, 5, an image processing device 6, a control unit 7, a monitor 8, and the like.

【0009】この供給部2は、所定のパターンをもって
電極100が基板エリア101毎に印刷されているTA
B(Tape Automated Bonding)用
のテープ状物(フィルム材)を繰出し且つ巻き取るもの
であり、繰出し機構12と巻取り機構22とからなり、
繰出し機構12は、ロール原反の巻軸12aを回転可能
に設けると共に、その巻軸12aの下流側に方向変換ロ
ーラ12bを設けている。また、巻取り機構22は、巻
取り軸22aとを備えている。符号22bは巻取り軸2
2a上流の方向変換ローラである。前記巻軸12a、巻
取り軸22aは共にモータ(例えばサーボモータ)駆動
するようになっている。前記するテープ状物Xの間欠的
な繰出し量は、基板エリア101が丁度カメラ3、4の
視野に収まる所定量に設定してある。
The supply unit 2 is provided with a TA on which the electrodes 100 are printed for each substrate area 101 in a predetermined pattern.
A tape-like material (film material) for B (Tape Automated Bonding) is fed and wound up, and includes a feeding mechanism 12 and a winding mechanism 22.
The feeding mechanism 12 rotatably provides a roll 12a of a material roll, and has a direction changing roller 12b downstream of the roll 12a. Further, the winding mechanism 22 includes a winding shaft 22a. Reference numeral 22b is a winding shaft 2.
2a is a direction change roller upstream. The winding shaft 12a and the winding shaft 22a are both driven by a motor (for example, a servomotor). The intermittent feeding amount of the tape-shaped material X is set to a predetermined amount such that the substrate area 101 can be exactly included in the field of view of the cameras 3 and 4.

【0010】符号9は、繰出し機構12のすぐ下流側と
巻取り機構22のすぐ上流側各々に配備するスプロケッ
トホイールであり、テープ状物Xの長手縁に等間隔をお
いて開孔している係止孔19…にその係止突起を係止さ
せて前記巻軸12a、巻取り軸22aと同調して回転駆
動する。
Reference numeral 9 denotes a sprocket wheel provided immediately downstream of the feeding mechanism 12 and immediately upstream of the winding mechanism 22, respectively. The locking projections are locked in the locking holes 19 and are driven to rotate in synchronization with the winding shaft 12a and the winding shaft 22a.

【0011】この実施の形態では、基板エリア101が
テープ状物Xの長さ方向横一列に設けてあるタイプを示
している。
In this embodiment, a type in which the substrate areas 101 are provided in a row in the longitudinal direction of the tape-shaped material X is shown.

【0012】上下一対のカメラ3、4は、CCDカメラ
であり、テープ状物Xを挟んで上方、下方に対向して配
設され、個別にX軸線方向及びY軸線方向に制御動可能
になっている。X軸線方向、Y軸線方向の制御動は共に
サーボモータを駆動源とする周知のネジ機構とガイド等
からなるX軸線移動機構13、Y軸線移動機構14で行
うようにしている。この上下一対のカメラ3、4は、こ
の実施の形態に対応するように、前記のようにテープ状
物Xが基板エリア101を長さ方向に横一列に有するた
め、X軸線方向及びY軸線方向に制御動させずに間欠送
りされるテープ状物Xの幅方向中央部位真上に待機させ
て、間欠送りされる各基板エリアの電極パターンごとに
撮像するようにする。
The pair of upper and lower cameras 3 and 4 are CCD cameras, which are disposed so as to face upward and downward with the tape-shaped object X therebetween, and can be individually controlled and moved in the X-axis direction and the Y-axis direction. ing. The control movements in the X-axis direction and the Y-axis direction are both performed by an X-axis movement mechanism 13 and a Y-axis movement mechanism 14 including a well-known screw mechanism and a guide, which are driven by a servomotor. The pair of upper and lower cameras 3 and 4 correspond to this embodiment, and as described above, since the tape-shaped material X has the substrate areas 101 arranged in a row in the length direction as described above, the X-axis direction and the Y-axis direction In this manner, the apparatus is made to stand by immediately above the central portion in the width direction of the tape-shaped material X intermittently fed without being controlled, and to take an image for each electrode pattern of each substrate area intermittently fed.

【0013】導通検査器5、5は、プローブ(導通素
子)15を出没可能に支持する駒体(被取付体)25、
その駒体25が先端に取付けられる漏斗状支持体35、
コネクタ保持体45、ケース55等から構成されてい
る。
The continuity checkers 5 and 5 include a piece (attached body) 25 that supports the probe (conductive element) 15 so as to be able to protrude and retract.
A funnel-shaped support 35 to which the piece 25 is attached at the tip,
It comprises a connector holder 45, a case 55 and the like.

【0014】上側の導通検査器5について説明すると、
その駒体25は、前記基板エリア101の表面の電極パ
ターンPと一致するパターンをもって内端を圧縮バネ
(図示せず)で支持して多数のプローブ15を表面から
出没可能に備えてなり、同表面に基準点S1を付設して
いる(図2、図3、図5参照)。
The upper continuity checker 5 will be described.
The frame body 25 is provided with a pattern that matches the electrode pattern P on the surface of the substrate area 101 with its inner end supported by a compression spring (not shown) so that a number of probes 15 can protrude and retract from the surface. A reference point S1 is provided on the surface (see FIGS. 2, 3, and 5).

【0015】漏斗状支持体35は、下端の搾小開放端に
前記駒体25を取付け、上端の拡開開放端に取付鍔部3
5aを周設している。
The funnel-shaped support 35 has the piece 25 attached to the small open end at the lower end, and the mounting flange 3 attached to the open open end at the upper end.
5a is provided around.

【0016】ケース55は、下板部55a、側板部55
bに開口55cを有する箱状を呈してなり、このケース
55は、下板部55aの開口55c周縁内面に前記取付
鍔部35aをネジ止して漏斗状支持体35が取付けられ
ている。
The case 55 includes a lower plate portion 55a and a side plate portion 55.
The case 55 has a box-like shape having an opening 55c, and the case 55 has a funnel-shaped support 35 attached to the lower plate 55a by screwing the attachment flange 35a to the inner peripheral surface of the opening 55c.

【0017】コネクタ保持体45は、下板部45aに配
線ガイド口45bを開口した箱状を呈し、前記ケース5
5内に取付られている。このコネクタ保持体45は、側
板45c部分に、前記各プローブ15個々に一端が結線
されるコネクタ65が保持され、このコネクタ65に、
ケース55の側板部55bの開口55cを介して結線さ
れる電気コードWが導通検査装置(図示せず)に連絡さ
れるようになっている。
The connector holder 45 has a box shape in which a wiring guide opening 45b is opened in a lower plate portion 45a.
5. The connector holding body 45 holds a connector 65 having one end connected to each of the probes 15 on the side plate 45c.
The electric cord W connected through the opening 55c of the side plate 55b of the case 55 is connected to a continuity inspection device (not shown).

【0018】導通検査器5、5は、共にX軸線方向、Y
軸線方向、Z軸線方向、θ方向に個別に制御動可能にな
っている。その導通検査器5のY軸制御機構75、Z軸
制御機構85、X軸制御機構95、θ制御機構105を
前記上側の導通検査器5を図2、図3で説明する。
The continuity testers 5 and 5 are both in the X axis direction and Y direction.
It can be individually controlled in the axial direction, the Z-axis direction, and the θ direction. The Y-axis control mechanism 75, the Z-axis control mechanism 85, the X-axis control mechanism 95, and the θ control mechanism 105 of the continuity tester 5 will be described with reference to FIGS.

【0019】Y軸制御機構75は、L型片75aの水平
片部75bに開孔したY軸線方向に長い矩形状挿通孔7
5cを挟んで同水平片部75bの上面にYレール75d
を並設し、そのYレール75dにY移動板75e下面の
被案内体75fをY方向移動可能に係合し、Y移動体7
5e下面に設けた固定ナット部75gに、サーボモータ
75hに直結するネジ棒75iを螺合し、サーボモータ
75hの駆動でY移動板75eがY方向に制御動され、
それによって後述する吊持体115で吊持される導通検
査器5がY軸線方向に移動する仕組みである。
The Y-axis control mechanism 75 has a rectangular insertion hole 7 long in the Y-axis direction and opened in the horizontal piece 75b of the L-shaped piece 75a.
5c, the Y-rail 75d is placed on the upper surface of the horizontal piece 75b.
The guided member 75f on the lower surface of the Y moving plate 75e is movably engaged with the Y rail 75d so as to be movable in the Y direction.
A screw bar 75i directly connected to the servomotor 75h is screwed into a fixed nut portion 75g provided on the lower surface of the 5e, and the Y moving plate 75e is controlled and moved in the Y direction by driving the servomotor 75h.
Thereby, the continuity tester 5 hung by the hanger 115 described later moves in the Y-axis direction.

【0020】吊持体115は、前記矩形状挿通孔75c
を挿通する中間軸部115aの上端に吊持用鍔部115
bを、また下端に係合用鍔部115cを各々周設してお
り、係止用鍔部115cは、前記ケース55の上板部内
面に軸受けVを介して回転可能に支承され、吊持用鍔部
115bは、その下面に被案内体115dを備え、Y移
動体75e上面の後述するXレール95aにX軸線方向
に移動可能に係合させて、導通検査器5を吊持してい
る。
The hanging body 115 is provided with the rectangular insertion hole 75c.
Is provided on the upper end of the intermediate shaft portion 115a through which the
b and an engagement flange 115c at the lower end thereof. The engagement flange 115c is rotatably supported on the inner surface of the upper plate of the case 55 via a bearing V. The flange 115b has a guided member 115d on the lower surface thereof, and movably engages with an X rail 95a on the upper surface of the Y moving body 75e in the X-axis direction to suspend the continuity tester 5.

【0021】Z軸制御機構85は、L型片75aの立片
部75j背面に設けた被案内体85aを機体1の前板1
1に並設したZレール85bに昇降動可能に係合し、そ
の立片部75jに、前板11のガイド長孔21から背後
方向に突出する突部31を設け、その突部31にサーボ
モータ85bに直結するネジ棒85cを螺合し、サーボ
モータ85bを駆動すると、吊持体115で吊持されて
いる導通検査器5がZ動する仕組みになっている。
The Z-axis control mechanism 85 connects the guided member 85a provided on the back surface of the standing piece 75j of the L-shaped piece 75a to the front plate 1 of the machine body 1.
1 is movably engaged with the Z rail 85b arranged side by side, and a projection 31 projecting rearward from the guide long hole 21 of the front plate 11 is provided on a vertical piece 75j of the vertical piece 75j. When the screw rod 85c directly connected to the motor 85b is screwed and the servo motor 85b is driven, the continuity inspection device 5 suspended by the suspension body 115 moves Z.

【0022】X軸制御機構95は、前記Y移動体75e
の上面にXレール95aを並設し、そのXレール95a
に前記のように吊持体115の吊持用鍔部115b下面
の被案内体115dをX軸線方向に移動可能に係合して
構成され、符号95bが吊持板用鍔部115bをX軸線
方向に制御動させるサーボモータである。
The X-axis control mechanism 95 is connected to the Y moving body 75e.
X rails 95a are juxtaposed on the upper surface of the
As described above, the guide body 115d on the lower surface of the hanging flange 115b of the hanging body 115 is movably engaged in the X-axis direction, and the reference numeral 95b is attached to the hanging plate flange 115b by the X-axis. This is a servo motor that is controlled to move in the direction.

【0023】θ制御機構105は、吊持体115の中間
軸部115aに一端を固定した長尺棒105dの他端を
押動する楕円カム105eに直結するサーボモータ10
5fをケース55に装設して構成され、楕円カム105
eが回転することによってケース55を回転させる。図
3において符号Cは、一端をケース55の上板部上面に
止着し他端を長尺棒105dに止着して常時基準位置に
復帰させる引張りバネである。
The θ control mechanism 105 is a servo motor 10 directly connected to an elliptical cam 105e for pushing the other end of a long rod 105d having one end fixed to the intermediate shaft 115a of the hanging body 115.
5f is mounted on the case 55, and the elliptical cam 105
By rotating e, the case 55 is rotated. In FIG. 3, reference numeral C denotes a tension spring that has one end fixed to the upper surface of the upper plate portion of the case 55 and the other end fixed to the long rod 105 d and always returns to the reference position.

【0024】尚、下側の導通検査器5は、基本的には上
側の導通検査器5を逆様にした構成とするが、図2、図
3の2点鎖線で示す落下防止板10を吊持板115の中
間軸部115aに係止して、逆様にした時にもY軸制御
機構75の被案内体75fに対するYレール75d、X
軸制御機構95の被案内体115dに対するXレール9
5a各々の係合関係を維持する必要がある。
The lower continuity tester 5 is basically constructed by reversing the upper continuity tester 5, but the fall prevention plate 10 shown by a two-dot chain line in FIGS. The Y rails 75d, X with respect to the guided body 75f of the Y-axis control
X rail 9 for guided body 115d of axis control mechanism 95
5a, it is necessary to maintain the engagement relationship.

【0025】図4は、基板エリア101表面の電極パタ
ーンPと基準点Sとの関係を現す拡大平面図で、基板エ
リア101裏面の電極パターンと基準点位置の位置関係
は、基板エリアの表面の場合と同様である。また、図5
は基板エリア101の表面の電極パターンPと一致する
パターンのプローブ15を有する上側の導通検査器5表
面、即ち駒体25の頂面の拡大平面図であり、符号15
がプローブ、S1が基準点である。下側の導通検査器5
の表面、即ち駒体25の頂面は、具体的には示さない
が、基板エリアの裏面の電極パターンと一致するパター
ンのプローブと、更に基準点とを備えている。
FIG. 4 is an enlarged plan view showing the relationship between the electrode pattern P on the surface of the substrate area 101 and the reference point S. The positional relationship between the electrode pattern on the back surface of the substrate area 101 and the reference point position is shown in FIG. Same as in the case. FIG.
Is an enlarged plan view of the surface of the upper continuity tester 5 having the probe 15 having a pattern corresponding to the electrode pattern P on the surface of the substrate area 101, that is, the top surface of the piece 25;
Is a probe, and S1 is a reference point. Lower continuity tester 5
The top surface of the frame 25, which is not specifically shown, includes a probe having a pattern that matches the electrode pattern on the back surface of the substrate area, and further includes a reference point.

【0026】この前記導通検査器5は、前記上下一対の
カメラ3、4の下流で且つそのカメラ3、4に対して基
板エリア101の整数倍の間隔をおくテープ状物X上方
及び下方にプローブ15がテープ状物Xを挟んで対向す
るように設置されている。
The continuity tester 5 is provided with a probe on the upper and lower sides of the tape-like material X, which is downstream of the pair of upper and lower cameras 3 and 4 and spaced from the cameras 3 and 4 by an integral multiple of the substrate area 101. 15 are installed so as to face each other with the tape-shaped material X interposed therebetween.

【0027】画像処理装置6は、従来から周知なように
A/D変換器(図示せず)でディジタル信号に変換され
た映像信号を2値化等の演算処理をする画像処理回路
(図示せず)、その2値化データを記憶する画像メモ
リ、記憶部、演算部等を備えてなり、各電極パターンP
内のエリア対角線コーナーに施してある基準点Sの濃淡
画像信号を画像メモリに書き込み且つ走査して得られる
基準点Sのその座標データと、記憶部にティーチングさ
れている上下一対の導通検査器5表面内の基準点S1の
座標データとを演算部で比較演算して固有の補正データ
を得るようになっている。尚、ティーチングデータは、
上下一対の導通検査器5表面内の基準点S1の座標デー
タであり、キーボード等の入力手段で入力される。
The image processing device 6 is an image processing circuit (not shown) for performing arithmetic processing such as binarization on a video signal converted into a digital signal by an A / D converter (not shown), as is well known in the art. And an image memory for storing the binarized data, a storage unit, a calculation unit, and the like.
And the coordinate data of the reference point S obtained by writing and scanning the grayscale image signal of the reference point S applied to the diagonal corner of the area in the image memory, and the pair of upper and lower continuity testers 5 taught in the storage unit. The arithmetic unit compares the coordinate data of the reference point S1 on the surface with the coordinate data to obtain unique correction data. The teaching data is
It is coordinate data of the reference point S1 in the surface of the pair of upper and lower continuity testers 5, and is input by input means such as a keyboard.

【0028】制御部7は、RAM、ROM、CPU、I
NF(インターフェース)を備え、バスを介して相互に
連絡されている。RAMは、カメラ3、4間から導通検
査器5、5間への設定送り数、更にはCPUが実行する
ための各種フラグ、レジスタ等が予め記憶されている。
尚、各種データの変更は書き換えることで変更可能であ
る。ROMは、装置全体を統括制御するための制御プロ
グラムが格納されている。INFは、制御部と各機構部
との制御信号を相互に変換させて制御レベルを合せるも
ので、本発明の各機構部と直接的に相互に連絡する変換
器である。CPUは、ROMに格納された制御プログラ
ムを実行し、各データを演算処理して各機構部へ指令を
行い装置全体を統括制御するものである。
The control unit 7 includes a RAM, a ROM, a CPU, an I
An NF (interface) is provided, and they are interconnected via a bus. The RAM previously stores the set number of feeds from between the cameras 3 and 4 to the continuity checkers 5 and 5, and various flags and registers for the CPU to execute.
Incidentally, various data can be changed by rewriting. The ROM stores a control program for controlling the entire apparatus. The INF converts a control signal between the control unit and each mechanism unit to each other to adjust a control level, and is a converter that directly communicates with each mechanism unit of the present invention. The CPU executes a control program stored in the ROM, performs arithmetic processing on each data, issues a command to each mechanism unit, and performs overall control of the entire apparatus.

【0029】斯様に構成されているテープ状物の導通検
査装置は、テープ状物Xを所定量ずつ間欠送りする度に
上下のカメラ3、4で基板エリア101を表面側、裏面
側から個別に撮像し、画像処理装置6が画像メモリを走
査して基板エリア101表面、裏面内の基準点Sの座標
データを算出し、その座標データと、ティーチングされ
ている上下一対の導通検査器5表面内の基準点S1の座
標データとを演算部で比較演算して各基板エリア固有の
補正データを入手し、これを制御部7が記憶する。そし
て、各基板エリア101が上下一対の導通検査器5、5
間に送り動(間欠送り)される度に、各基板エリア10
1固有の補正データを基に、上下一対の導通検査器5、
5を独立してX軸線方向、Y軸線方向、θ方向に制御動
させ、更にZ動させてプローブ15を基板エリア101
表面、裏面の電極100に接触させ、連絡する導通検査
装置(図示せず)で導通検査を行う。
In the continuity inspection apparatus for a tape-shaped object thus configured, each time the tape-shaped object X is intermittently fed by a predetermined amount, the upper and lower cameras 3 and 4 individually separate the substrate area 101 from the front side and the back side. The image processing device 6 scans the image memory to calculate the coordinate data of the reference point S in the front and back surfaces of the substrate area 101, and the coordinate data and the surface of the pair of upper and lower continuity testers 5 being taught. The calculation unit compares the coordinate data of the reference point S1 in the calculation unit to obtain correction data unique to each substrate area, and the control unit 7 stores the correction data. Then, each substrate area 101 is a pair of upper and lower continuity testers 5, 5
Each time an intermittent feed is performed (intermittent feed), each substrate area 10
1, a pair of upper and lower continuity checkers 5 based on the unique correction data,
5 are independently controlled and moved in the X-axis direction, the Y-axis direction, and the θ direction, and further Z-moved to move the probe 15 to the substrate area 101.
The continuity test is performed by a continuity test device (not shown) that is brought into contact with the electrodes 100 on the front surface and the back surface and communicates therewith.

【0030】導通検査装置(図示せず)で導通不能を判
定すると、導通検査装置がディスプレイする。警告音を
発する。等適宜な伝達手段でオペレーターに伝達して、
廃棄の一助にする。等処置方法は自由である。
When the continuity tester (not shown) determines that conduction is impossible, the continuity tester displays. Emit a warning sound. Etc. to the operator using appropriate communication means,
Help with disposal. The treatment method is free.

【0031】また、上下のカメラ3、4を、導通検査器
5、5間まで個別にX軸線方向に水平往復動可能に構成
してあっても良いものである。この場合には、前記する
X軸線移動機構13、13各々を導通検査器5、5間ま
で延長すれば良いものである。その際、図示しないが上
側の導通検査器5とテープ状物X表面との間、下側の導
通検査器5とテープ状物X裏面との間に上側のカメラ
3、下側のカメラ4が進入する空間を確保しておく必要
がある。これによって、テープ状物Xを巻取り機構22
に掛け渡す前に上側の導通検査器5表面のプローブ15
と共に基準点S1を下側のカメラ4で、また下側の導通
検査器5表面のプローブ15と共に基準点S1を上側の
カメラ3で撮像し、画像処理装置6で画像解析して、両
基準点(S1、S1)、(S1、S1)の座標データを
前記ティーチングデータとして入手することができる。
Further, the upper and lower cameras 3 and 4 may be configured so as to be capable of reciprocating horizontally in the X-axis direction individually between the continuity testers 5 and 5. In this case, each of the X-axis moving mechanisms 13, 13 described above may be extended to between the continuity testers 5, 5. At this time, although not shown, the upper camera 3 and the lower camera 4 are located between the upper continuity tester 5 and the front surface of the tape-shaped object X, and between the lower continuity tester 5 and the back surface of the tape-shaped object X. It is necessary to secure a space to enter. As a result, the tape-shaped material X can be
Probe 15 on the surface of the continuity tester 5
At the same time, the reference point S1 is imaged by the lower camera 4 and the reference point S1 is imaged by the upper camera 3 together with the probe 15 on the surface of the lower continuity tester 5, and the image is analyzed by the image processing device 6, and both the reference points are obtained. The coordinate data of (S1, S1) and (S1, S1) can be obtained as the teaching data.

【0032】図6は、基板エリア101を縦横2列をも
って区分けしているテープ状物Xを示している。この実
施の形態の場合の導通検査方法を説明すると、図示しな
いが前記実施の形態のようにテープ状物Xを間欠送りす
る度に上下のカメラ3、4をテープ状物Xの幅方向、即
ちY軸線方向に基板エリア101が画面に収まるように
所定量ずつ個別に制御動させて電極パターンを一個ずつ
撮像する。そして、その基板エリア101がカメラ3、
4間から導通検査器5、5間へ設定カウント値をもって
間欠送りされると、上下一対の導通検査器5、5を前記
L型片75aの矩形状挿通孔75cを利用してY軸線方
向に所定量制御動させて各基板エリア101と順次対向
させる度に、制御部7が電極パターンP固有の補正デー
タをもって更に上下一対の導通検査器5、5を個別にX
軸線方向、Y軸線方向、θ方向に制御動し、Z動し、導
通検査する。
FIG. 6 shows a tape-shaped material X that divides the substrate area 101 into two rows and columns. The continuity inspection method in this embodiment will be described. Although not shown, the upper and lower cameras 3 and 4 are moved in the width direction of the tape-shaped object X each time the tape-shaped object X is intermittently fed as in the above-described embodiment. Each of the electrode patterns is imaged one by one by individually controlling and moving a predetermined amount so that the substrate area 101 fits on the screen in the Y-axis direction. Then, the substrate area 101 is the camera 3,
When the set count value is intermittently fed between the continuity testers 5 and 5 from between the four, the pair of upper and lower continuity testers 5 and 5 are moved in the Y-axis direction using the rectangular insertion holes 75c of the L-shaped piece 75a. Each time a predetermined amount of control is performed to sequentially oppose each substrate area 101, the control unit 7 further controls the pair of upper and lower continuity testers 5 and 5 individually with correction data unique to the electrode pattern P.
The control movement is performed in the axial direction, the Y-axis direction, and the θ direction, the Z movement is performed, and the continuity test is performed.

【0033】[0033]

【発明の効果】本発明は以上のように構成したので、T
AB(Tape AutomatedBonding)
用のテープ状物に区分けされている基板エリアの導通検
査を繰出し・巻取りながら行うことができる。しかも、
請求項2のように、上下のカメラ各々を別々に導通検査
器間に水平往復動可能に構成して、テープ状物が巻取り
機構に掛け渡される前段階の上側の導通検査器表面の基
準点を下側のカメラで、また下側の導通検査器表面の基
準点を上側のカメラで各々撮像し且つ画像解析して、こ
れをティーチングデータとして画像処理装置の記憶部に
記憶する場合には、設置されている導通検査器でその基
準点の座標データを入手でき、導通検査器の機械点基準
位置での高精度な据付けが敢えて不要となり、設置作業
性の簡略化、容易化を図ることが可能である。
Since the present invention has been constructed as described above, T
AB (Tape Automated Bonding)
The continuity inspection of the substrate area divided into the tape-shaped objects for use can be performed while feeding and winding. Moreover,
The upper and lower cameras are configured so as to be able to reciprocate horizontally between the continuity testers separately, and the reference of the upper surface of the continuity tester before the tape-like material is wound around the winding mechanism. In the case where the point is captured by the lower camera, and the reference point on the surface of the lower continuity tester is imaged and analyzed by the upper camera, and this is stored in the storage unit of the image processing apparatus as teaching data. The coordinate data of the reference point can be obtained from the installed continuity tester, and the continuity tester does not need to be installed at the mechanical point reference position with high accuracy, thereby simplifying and facilitating the installation work. Is possible.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本実施の形態テープ状物の導通検査装置の概略
を示す正面図。
FIG. 1 is a front view schematically showing a continuity inspection device for a tape-shaped object according to an embodiment.

【図2】導通検査器の正面断面図で拡大して示す。FIG. 2 is an enlarged front sectional view of the continuity tester.

【図3】導通検査器の側面断面図で拡大して示す。FIG. 3 is an enlarged side sectional view of the continuity tester.

【図4】テープ状物の拡大平面図。FIG. 4 is an enlarged plan view of a tape-shaped object.

【図5】上側の導通検査器の表面(駒体の表面)の拡大
平面図。
FIG. 5 is an enlarged plan view of the surface (the surface of the piece) of the upper continuity tester.

【図6】他の実施の形態のテープ状物の拡大平面図。FIG. 6 is an enlarged plan view of a tape-shaped object according to another embodiment.

【図7】従来の導通検査装置の正面図で一部切欠して示
す。
FIG. 7 is a partially cutaway front view of a conventional continuity inspection device.

【符号の説明】[Explanation of symbols]

12:繰出し機構 22:巻
取り機構 X:テープ状物 3、4:カメ
ラ 6:画像処理装置 101:基板
エリア 100:電極 15:
プローブ 5、5:導通検査器 7:
制御部 S:基板エリアの基準点 S1:導通
検査装置の基準点 P:電極パターン
12: Feeding mechanism 22: Winding mechanism X: Tape-shaped object 3, 4: Camera 6: Image processing device 101: Substrate area 100: Electrode 15:
Probe 5, 5: Continuity tester 7:
Control unit S: Reference point of substrate area S1: Reference point of continuity inspection device P: Electrode pattern

───────────────────────────────────────────────────── フロントページの続き Fターム(参考) 2F065 AA14 AA16 AA20 BB13 BB15 CC02 EE00 FF04 JJ03 JJ05 JJ09 JJ26 NN20 PP03 PP16 QQ04 QQ23 QQ24 QQ25 2G014 AA13 AB59 AC09 AC10 4M106 AA20 BA14 CA16 DH07 DH11 DJ03 DJ04 DJ05 DJ06 DJ07 DJ11 DJ18 DJ19  ──────────────────────────────────────────────────続 き Continued on the front page F term (reference) 2F065 AA14 AA16 AA20 BB13 BB15 CC02 EE00 FF04 JJ03 JJ05 JJ09 JJ26 NN20 PP03 PP16 QQ04 QQ23 QQ24 QQ25 2G014 AA13 AB59 AC09 AC10 4M106 AA20 DJ14 DJ11 DJ11 DJ07 DJ19

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】ロール状に巻回されたテープ状物を所定量
間欠的に繰出す繰出し機構と、そのテープ状物を巻き取
る巻取り機構と、 その繰出し機構と巻取り機構との間でテープ状物を挟ん
で上方、下方に対向して配置し、テープ状物から後工程
で得られる基板エリアの電極パターンを表裏から撮像す
るX軸線方向、Y軸線方向に個別に制御動可能な上下一
対のカメラと、 そのカメラに連絡する画像処理装置と、 前記カメラの下流においてテープ状物を挟んで上方、下
方に対向して配設され、前記電極パターンと一致する配
列パターンのプローブを有するX軸線方向、Y軸線方
向、Z軸線方向、θ方向に個別に制御動可能な上下一対
の導通検査器と、 制御部とを備え、 前記画像処理装置は、撮像の画像解析から前記基板エリ
アの表面、裏面に付されている基準点の座標データを算
出して、予めティーチングされている上下一対の導通検
査器表面内の基準点の座標データとその算出された基準
点の座標データとで補正データを演算し、 前記制御部は、各基板エリアの電極パターンを追跡し、
上下一対の前記導通検査器間に各電極パターンが間欠送
りされる度にその電極パターン固有の補正データを基に
同前記導通検査器をX軸線方向、Y軸線方向に個別に制
御動し、Z動させて各電極パターンに導通検査器のプロ
ーブを接触させることを特徴とするテープ状物の導通検
査装置。
A feeding mechanism for intermittently feeding a tape-shaped material wound in a roll by a predetermined amount; a winding mechanism for winding the tape-shaped material; and a winding mechanism for winding the tape-shaped material between the feeding mechanism and the winding mechanism. The upper and lower sides are arranged facing up and down with the tape-shaped object in between, and can be individually controlled and moved in the X-axis direction and the Y-axis direction to image the electrode pattern of the substrate area obtained from the tape-shaped object in a later process from the front and back. A pair of cameras, an image processing device that communicates with the cameras, and an X having a probe arranged in an array pattern that matches the electrode pattern and that is disposed to face the upper and lower sides of the tape-like object downstream of the cameras. A pair of upper and lower continuity testers that can be individually controlled and moved in the axial direction, the Y-axis direction, the Z-axis direction, and the θ direction; and a control unit. On the back Calculate the coordinate data of the reference point that is being calculated, and calculate the correction data with the coordinate data of the reference point in the surface of the pair of upper and lower continuity testers that are pre-teached and the coordinate data of the calculated reference point, The control unit tracks the electrode pattern of each substrate area,
Each time an electrode pattern is intermittently fed between a pair of upper and lower continuity testers, the continuity tester is individually controlled and moved in the X-axis direction and the Y-axis direction based on correction data unique to the electrode pattern. A continuity inspection device for a tape-shaped object, wherein the probe is moved to bring a probe of a continuity inspection device into contact with each electrode pattern.
【請求項2】前記上下一対のカメラを、導通検査器間ま
で個別にX軸線方向に水平往復動可能に構成して、テー
プ状物が巻取り機構に掛け渡される前の上下の導通検査
器表面内の基準点の座標データを上下一対のカメラによ
る撮像の画像解析から入手し、その座標データを前記テ
ィーチングデータとすることを特徴とする請求項1記載
のテープ状物の導通検査装置。
2. The upper and lower continuity tester before the tape-like material is wound around a winding mechanism, wherein the pair of upper and lower cameras are individually reciprocable in the X-axis direction between the continuity testers. 2. The continuity inspection device for a tape-shaped object according to claim 1, wherein coordinate data of a reference point on the surface is obtained from image analysis of an image taken by a pair of upper and lower cameras, and the coordinate data is used as the teaching data.
JP11051456A 1999-02-26 1999-02-26 Electric continuity checking device for tape-like object Pending JP2000249738A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11051456A JP2000249738A (en) 1999-02-26 1999-02-26 Electric continuity checking device for tape-like object

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11051456A JP2000249738A (en) 1999-02-26 1999-02-26 Electric continuity checking device for tape-like object

Publications (1)

Publication Number Publication Date
JP2000249738A true JP2000249738A (en) 2000-09-14

Family

ID=12887448

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11051456A Pending JP2000249738A (en) 1999-02-26 1999-02-26 Electric continuity checking device for tape-like object

Country Status (1)

Country Link
JP (1) JP2000249738A (en)

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Publication number Priority date Publication date Assignee Title
JP2008185467A (en) * 2007-01-30 2008-08-14 Brother Ind Ltd Plate inspection device and opening inspection method of plate using it
WO2008132934A1 (en) * 2007-04-19 2008-11-06 Advantest Corporation Tcp handling apparatus
JP2011227059A (en) * 2010-03-30 2011-11-10 Ngk Spark Plug Co Ltd Electric inspection jig and wiring board manufacturing method
CN102773878A (en) * 2012-07-24 2012-11-14 格兰达技术(深圳)有限公司 Detection method for fully-automatic IC (chip) tape and detection equipment thereof
KR101541861B1 (en) * 2014-04-04 2015-08-06 (주)에이티테크놀러지 Electric Inspection Apparatus for Conductive Film
JP2015184052A (en) * 2014-03-20 2015-10-22 日本電産リード株式会社 Flexible substrate inspection device
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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008185467A (en) * 2007-01-30 2008-08-14 Brother Ind Ltd Plate inspection device and opening inspection method of plate using it
WO2008132934A1 (en) * 2007-04-19 2008-11-06 Advantest Corporation Tcp handling apparatus
JPWO2008132934A1 (en) * 2007-04-19 2010-07-22 株式会社アドバンテスト TCP handling equipment
JP2011227059A (en) * 2010-03-30 2011-11-10 Ngk Spark Plug Co Ltd Electric inspection jig and wiring board manufacturing method
TWI453424B (en) * 2010-03-30 2014-09-21 Ngk Spark Plug Co Jig of electric detection and method for manufacturing a wiring substrate
CN102773878A (en) * 2012-07-24 2012-11-14 格兰达技术(深圳)有限公司 Detection method for fully-automatic IC (chip) tape and detection equipment thereof
CN102773878B (en) * 2012-07-24 2014-11-05 格兰达技术(深圳)有限公司 Detection method for fully-automatic IC (chip) tape and detection equipment thereof
JP2015184052A (en) * 2014-03-20 2015-10-22 日本電産リード株式会社 Flexible substrate inspection device
KR101541861B1 (en) * 2014-04-04 2015-08-06 (주)에이티테크놀러지 Electric Inspection Apparatus for Conductive Film
CN108387258A (en) * 2018-03-22 2018-08-10 京东方科技集团股份有限公司 Optical automatic detection device for flexible base board
CN108387258B (en) * 2018-03-22 2024-01-16 京东方科技集团股份有限公司 Optical automatic detection device for flexible substrate

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