JPH01109732A - Inspection device for lead - Google Patents

Abstract

PURPOSE:To execute visual examination regarding all leads by respectively image-sensing a lead group in an article to be inspected held to a rotary table in response to each lead row and deciding nondefective or defective each lead row on the basis of the image-sensing signals. CONSTITUTION:An article to be inspected 1, a plurality of leads of which are aligned and projected from the side face of a package 2, is held, and a rotary table 4 is turned so that lead rows are directed in the tangential direction in the package 2 while image-sensing devices 11, 21 are mounted, which conduct image-sensing one part of the lead rows in the article to be inspected 1 held to the rotary table 4. consequently, since image-sensing as materials for inspection is conducted at every lead row of the article to be inspected 1 with the revolution of the rotary table 4, the article to be inspected 1 need not be sent in one direction to the image-sensing devices 11, 21. Since visual examination regarding each lead is executed at every lead row, examination is executed even when the lead rows are projected to four corners. Accordingly, visual examination regarding all leads can be carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a lead inspection technique, and in particular to a technique for inspecting the appearance of a plurality of leads arranged and protruding from the side surface of a package. Semiconductor integrated circuit device (hereinafter referred to as QFP) equipped with a quad flat package
It is called IC. ) is useful for inspecting lead appearance.

[Conventional technology]

As a method for inspecting the appearance of leads in a semiconductor integrated circuit device (hereinafter referred to as IC), for example, Japanese Patent Laid-Open No. 57
As shown in Publication No. 91458, when an IC having multiple leads is transferred within a chute, the leads at tC are orthogonal to the transfer direction, and the base of the lead and the tip of the lead are respectively detected. There is a method of detecting lead bending by measuring the time taken for the tip of the lead to pass through the base of the lead.

[Problem that the invention seeks to solve]

In this type of lead inspection technology, it is necessary to transport the IC to be inspected in one direction, so surface-mounted QFP/ICs with lead rows protruding in all directions cannot be inspected. The inventor of the present invention has also revealed that there is a problem in that it is not possible to inspect variations in lead height.

SUMMARY OF THE INVENTION An object of the present invention is to provide a lead inspection device that can perform visual inspection on all leads. - The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

Measures for Solving Problems c] Representative inventions disclosed in this application will be summarized as follows.

In other words, there is a rotary table that holds an object to be inspected in which a plurality of leads are aligned and protrudes from the side of a pan cage, and rotates the package so that the lead rows are tangential, and a rotary table that holds an object to be inspected that has a plurality of aligned leads protruding from the side of the pan cage. The apparatus is provided with an imaging device that images at least a part of the lead array in the inspection object, and a 'P1 constant section that determines the quality of each lead array based on the imaging signal of the imaging device.

[Effect]

According to the above-described means, as the rotary table rotates,
Since an image, which is the inspection material, is captured for each lead row of the object to be inspected, there is no need to send the object to be inspected in one direction to the imaging device, and the visual inspection of each lead is performed for each lead row. Therefore, even if the lead row is protruding in all directions, the inspection can be performed. Furthermore, since the visual inspection is restarted for each lead row, it is easy to determine whether the height of each lead is good or bad.

[Embodiment 1] Fig. 1 is a schematic diagram showing a lead inspection device according to an embodiment of the present invention, and Fig. 2 (Ta) and crest) are plan views for explaining the operation.

In this embodiment, this lead inspection device is configured to be able to inspect the arrangement and height of a group of leads in QFPIG.

The QFP/ICI as an object to be inspected is equipped with a package 2 formed in a substantially square flat shape, and the four sides of this package 2 are formed into a bat wing shape, and some have multiple pieces 3 with tips. They are arranged in a horizontal row, and one end surface (hereinafter referred to as the back surface).

) protrudes toward the side.

In this embodiment, this lead inspection apparatus is equipped with a rotary table 4 which is disposed substantially horizontally and is rotatably supported, and the rotary table 4 is rotated by a suitable rotary drive device 5 such as a servo motor. is configured to be In addition, a suction port 6 connected to a negative pressure supply path 7 is provided on the top surface of the rotary table 4, and the rotary table 4 can adsorb the surface of the QFP/ICI package 2 using the vacuum suction force of the suction port 6. This makes it possible to position and hold the QFP-ICI.

Above the rotary table 4 is a television camera for lead array inspection (hereinafter referred to as a first TV camera) serving as an imaging device that captures terminal images of the lead array.

) 11 is arranged in a substantially vertical downward direction, and this first TV camera 11 is connected to a QFP IC held on a rotary table 4, as shown in the monitor image to be described later.
It is set so that a part of the end face image of three rows of I leads can be photographed. A first image processing device 12 is connected to the first TV camera 11, and this image processing device 12 monitors a desired image by transmitting an image signal to a first monitor 13 connected to one of its output terminals. It is configured to transmit a predetermined measurement signal to the first determination unit 14 connected to another output terminal. A first standard value setting section 15 in which standard values related to lead arrangement are set is connected to the determination section 14 as described later. If the current measured value deviates from the standard value, it is determined that there is a defect in the lead arrangement. It is configured to determine this and transmit the determination result to external device B (not shown).

On one side of the rotary table 4, there is a lead length inspection television camera (hereinafter referred to as a second TV camera) serving as an imaging device that captures side images of the lead rows.

) 21 is installed so as to face approximately horizontally inward, and this second TV camera 21 is equipped with a QFPiCl held on a rotary table 4, as shown in the monitor image to be described later.
It is set so that a part of the side view of three rows of leads can be photographed. The second TV camera 21 has the second i! An iuR processing device 5!22 is connected, and like the first image processing device 11, a second monitor 23 and a second determination section 24 are also connected to this LI image processing device E22. A second standard value setting unit 25 in which a standard value regarding the lead height is set is connected to the second determination unit 24, as described later. , is configured to determine whether the lead height is acceptable or not, and to transmit the determination result to an external device.

Next, the effect will be explained.

A suitable transfer device (not shown) such as a vacuum suction head, etc.
When the QFP-IC 1 as an object to be inspected is placed and positioned on the rotary table 4 with its surface facing downward, negative pressure is supplied to the suction port 6 from the negative pressure supply path 7, and the QFP-IC1 is placed with its surface facing downward.
P.'ICI is positioned and held on the rotary table 4.

When the QFP/ICI is positioned and held on the rotary table 4, the first TV camera 11 and the second TV camera 21 photograph a part of the row of leads 3 protruding from the side of the package 2, respectively. 11.2
The output signal of No. 1 is transmitted to the first image processing device 12 and the second image processing device 22, respectively.
．． At 22, predetermined signal processing is executed, and the M image is monitored on the first monitor 3 and the second monitor 23, depending on the situation.

Further, in the first iiiuR processing device I2, for example,
An image as shown on the first monitor 13! Based on the signals, a dimension Pl regarding the pitch P between adjacent leads 3.3 and a dimension S1 regarding the internal and external deviation S of the three rows of leads are each sequentially measured.

These measured dimensions P1 and Sl are measured by the first image processing device 12.
The 0 determination unit 14 sequentially transmits these measured dimensions P1 and sl to the determination unit 14, and the standard values Pa and So transmitted from the setting unit 15 in synchronization with this input.
are compared, Ps = Pos and 5l-
When it is 3o, “Ryoj and P1≠Po or S1
When ≠So, it is judged as “defective”, and
The pass/fail determination result is output to an external device.

On the other hand, in the second image processing device 22, for example, based on the image signal as shown on the second monitor 23,
A dimension HA regarding the height H of the lead 3 is sequentially measured.

This measured dimension H1 is sent from the second image processing device 12 to the determination unit 2.
4 will be sent sequentially.

In the determination unit 24, this measured value H1 is compared with the standard value Ho sent from the setting unit 25 in synchronization with this input, and when it is Hl-HO, it is judged as [good] and H1#Ho
If so, it is determined to be "defective" and the result of the determination of pass/fail is output to an external device.

By the way, when it is determined that the QFP-IC1 is defective, mark information corresponding to the "defective" is displayed on the external device, and the QFP-IC1 itself that is determined to be defective is displayed. By suitable means such as a vacuum suction head or the like, it is unloaded from the rotary table 4 and transferred to the defective product storage section.

By the way, one row of leads 3J11 on one side of the buff cage 2! If the processing for can be completed in a single field of view, the rotary table 4 is rotated by
The determination operation for one column is executed by rotating the column.

However, if three groups of leads for one row cannot fit in a single field of view, as shown in the second ffl (al, mountain), each time the rotary table 4 is rotated by a predetermined angle, 1
By sequentially capturing partial images of the three groups of leads in the column, the determination operation is repeated for each portion,
A test is completed for each column as a whole. Further, by rotating the rotary table 4 by 90 degrees or more, the inspection of the next row and subsequent rows will be carried out.

Here, for example, even if the field of view F in the initial state shown in FIG. 2 (al) changes to the field of view F2 in the rotated state shown in FIG. 2 (bl), the first TV camera 11 The image appears to show continuous lead rows within the same row.In this case, the image shown in the field of view F! in Fig. 2 (in Fig. 2) is shown in the field of view Fl in Fig. 2 (al). However, accurate determination can be ensured by performing appropriate signal processing using a method such as a linear near-value method during the determination operation.

Further, such a division determination operation will also be performed in the second TV camera 21, but since the focus of the second TV camera 21 is different before and after the rotation of the QFP-ICI, It is desirable to install a dedicated second TV camera 2121. In this case, each camera does not need to be installed in parallel at the same lateral position with respect to the QFP/ICI, but may be installed separately on different sides. By using such a method, it is possible to cope with an increase in the number of leads and an increase in the size of the package.

According to the embodiment described above, the following effects can be obtained.

+11 Visual inspection can be performed for each lead row by taking images of the lead group in the test object held on the rotary table in correspondence with each lead row, and determining the quality of each lead row based on the imaged signal. This makes it possible to inspect workpieces that cannot be fed in one direction, such as QFP-ICs, as well as to inspect variations in the height of each lead in a lead row. .

(2) By realizing inspection of the workpiece with leads protruding in all directions and the height of each lead in the lead row, it is possible to inspect the leads of ICs with surface mount type pancages such as QFP-ICs. Since accurate visual inspection can be ensured, the quality and reliability of these products can be improved, and the occurrence of mounting defects during surface mounting work can be prevented.

(3) By capturing images as inspection materials for each lead row of the object to be inspected, image resolution can be maintained as the number of leads increases and packages become larger. The desired inspection accuracy can be ensured while easily dealing with the increase in the number of packages and the increase in the size of the package.

[Example 2] FIG. 3 is a schematic diagram showing another embodiment of the present invention.

The second embodiment is different from the first embodiment in that rectangular plane mirrors 8 are fixedly attached to the four sides of the rotary table 4, and are arranged diagonally upward at an inclination angle of approximately 45 degrees. A dual-purpose TV camera 31 placed directly above the rotary table 4 is configured to image the lead row through this plane 118, and the side TV cameras are omitted.

In this embodiment 2, this lead inspection device has a lead 3A formed in a gull wing shape.
It is configured to be able to inspect QFP/ICIA that protrudes from the side.

By the way, in the surface mount type QFP/ICIA having the gull-wing shaped leads 3A, the lower surface of the leads 3A is reflow soldered to a land pad (not shown) during surface mounting work, so the monitor shown in FIG. 33, the pitch P between the leads and the vertical deviation A of the lower surface of the leads 3A are problematic.

Therefore, in the second embodiment, the image processing device 32 measures the dimension PI regarding the pitch P shown on the monitor 33 and the dimension A1 regarding the vertical deviation A of the lower surface of the lead 3A. These measured dimensions P
I and AI are transmitted to the determination unit 34, and the determination unit 34 compares these measured dimensions P1 and An with standard values Po and Ao transmitted from the setting unit 35 in synchronization with this input. And P1=Po, and A1
= AO, “Good”, P1#P, o, or
When A1≠Ao, it is determined to be "defective" and the result of the determination is output to an external device.

In this way, according to the second embodiment, a QFP having a gull-wing shaped lead 3A can be connected by a single system.
A lead visual inspection for ICIA can be completed.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, the specific configuration of the rotary table is not limited to the embodiment described above, and can be appropriately selected.

The imaging device is not limited to a TV camera, and other imaging devices may be used.

The pass/fail judgment unit based on the image captured by the imaging device is not limited to being configured so that the judgment is executed by comparing the measured value with a preset standard value, but it is also configured to perform the judgment by using a delay circuit, etc. The configuration may be such that the determination is executed by comparing the values.

The above description mainly focuses on the field of application to which the invention was made by the present inventor.

Although the case where the application is applied to lead inspection for QFP-ICs having J-bent and gull-wing type leads has been described, the present invention is not limited thereto, and is applicable to QFP-ICs having J-bent type leads, as well as If there is, it can be applied to general inspection techniques for inspecting leads of dair-in-line packaged ICs, as well as other electronic components or electronic equipment.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

A visual inspection is performed for each lead row by taking images of the lead group on the test object held on a rotary table in correspondence with each lead row, and determining the quality of each lead row based on the imaged signal. QF
It is possible to inspect objects to be processed, such as P-ICs, which cannot be fed in one direction, and it is also possible to inspect variations in the height of each lead in a lead row.

[Brief explanation of the drawing]

FIG. 1 is a schematic diagram showing a lead inspection device according to an embodiment of the present invention, and FIG. 2 is a plan view for explaining the operation. FIG. 3 is a schematic diagram showing another embodiment of the present invention. 1, IA...QFP・IC (tested object), 2.2A・
...Package, 3...Bat wing type lead,
3A...Gull wing type lead, 4...Rotary table, 5...Rotary drive device, 6...Suction port, 7...
- Negative pressure supply path, 8... plane mirror, 1121, 31...
TV camera (imaging device), 12.22.32... Image processing device, 13.23.33... Monitor, 14.24
．． 34... Judgment section, 15.25.35... Standard value setting section. Fig. 1 3・°・ba, yl-・jiin 2 lead. 3A... Gakore Wi 77'e Lead Wi... Te 1 Beast Day 11 6°°°tsu Lg10 +2.22.32・-A I L し gLzu [13,23,
33...Mo1 shift 1+, 24. ．． 34--・4 zu fixed press +5.25.35...Oglare 11 Sumire set 3? WE2 Figure (a) (b) Figure 3

Claims (1)

[Scope of Claims] 1. A rotary table that holds an object to be inspected in which a plurality of leads are arranged and protrudes from the side of the package, and rotates the package so that the lead rows are tangential.
The present invention is characterized by comprising: an imaging device that images at least a part of the lead rows in an object to be inspected held on a rotary table; and a determination unit that determines the quality of each lead row based on the imaging signal of the imaging device. Lead inspection equipment. 2. The lead inspection device according to claim 1, wherein the imaging device is configured to take images of an end surface and a side surface of the lead row, respectively. 3. The lead inspection device according to claim 1, wherein the imaging device is configured to take an image of the lead row through a mirror attached to a rotary table.