JP2008273555A - Taping device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a taping device capable of stably inspecting the state of each of chip components before an operation which packages the chip components in storage grooves, closes openings of the storage grooves by a cover tape, and winding up the cover tape to a storage reel. <P>SOLUTION: According to types of chip components A, illumination by a coaxial illuminating device 113 and a ring illuminating device 114 is adjusted. Light is emitted through the cover tape 3C to each of the chip components A in the storage grooves 3B of the storage tape 3 from below. Light reflected from each chip component A is taken into a component recognition camera 111 via a zoom lens 112. The state of each chip component A is imaged. Then, from the result of imaging, the state of the packaged chip component A, for example, the presence or absence of the chip component, and the degree of damage to the chip component A such as a flaw or scratch are inspected. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a taping device in which chip parts are sequentially loaded into each storage groove of a carrier tape sent by a feeding device, and the opening of the storage groove is closed with a cover tape, and then wound on a take-up storage reel. is there.

This kind of taping device is disclosed in, for example, Patent Document 1. Then, before the chip part is loaded into the storage groove and the opening of the storage groove is closed with the cover tape and wound on the take-up storage reel, the state of the chip part from the upper side through the cover tape, for example, the chip The presence or absence of parts, damage status, etc. were inspected with an inspection device such as a part recognition camera.
JP 2003-8287 A

  However, the back surface of the cover tape is rough, rough and cloudy in order to improve thermal welding with the carrier tape, and a space is formed between the chip part stored in the storage groove and the upper cover tape. Because the light hitting the chip component through the cover tape repeats diffuse reflection with the cover tape, when the chip component is irradiated obliquely, the shadow of the tape is created on the upper surface of the chip component. Stable inspection could not be performed.

  Therefore, the present invention provides a taping device that can stably inspect the state of a chip component before the chip component is loaded into the storage groove, the opening of the storage groove is closed with a cover tape, and wound on the take-up storage reel. The purpose is to provide.

  For this reason, the present invention provides a taping device in which chip parts are sequentially loaded into each storage groove of a carrier tape fed by a feeding device, the opening of the storage groove is closed with a cover tape, and then wound on a take-up storage reel. Before the chip part is loaded into the storage groove and the opening of the storage groove is closed with the cover tape and wound on the take-up storage reel, the state of the loaded chip part is passed through the cover tape. An inspection device for inspecting from below is provided.

  The present invention provides a taping device capable of stably inspecting the state of a chip part before the chip part is loaded in the storage groove, the opening of the storage groove is closed with a cover tape, and wound on the take-up storage reel. can do.

  Hereinafter, an embodiment of a taping device of the present invention will be described with reference to the drawings. First, the taping device will be described with reference to the plan view of the taping device in FIG. 1, the same front view in FIG. 2, and the right side view in FIG. Reference numeral 1 denotes a taping device main body, and a carrier tape supply reel 2 is rotatably locked to a pin (not shown) erected on a side wall portion of the main body 1. Then, the tips of the carrier tape (tape main body) 3A wound around the tape supply reel 2 are pulleys 4A to 4D, feed sprockets 5, 5 and carrier tape 3A for applying appropriate tension to the carrier tape 3A. It is fixed to a take-up and storage reel 9 via a transport rail 7 having a transport path.

  Reference numeral 10 denotes a cutting device having a cutting blade provided between the pulley 4C and the take-up storage reel 9, and always cuts the storage tape 3 at the same location. While the carrier tape 3A is sequentially conveyed by a predetermined amount in accordance with the rotation of the feed reels 5 and 5 by the feed drive motor 5A, the chip component A is inserted into the storage groove 3B of the carrier tape 3A, and further up to a predetermined position. The opening on the upper surface of the storage groove 3B is covered with the cover tape 3C supplied from the cover tape supply reel 20, and wound on the take-up storage reel 9 as described later.

  As described above, the storage tape 3 is formed by the carrier tape 3A provided with the storage grooves 3B with a predetermined interval and the cover tape (top tape) 3C thermally welded to the upper surface thereof. The teeth of the feed sprockets 5 and 5 are fitted into feed holes (not shown) opened at a predetermined interval so as to be transported. The carrier tape 3A and the cover tape (top tape) 3C are made of a synthetic resin material, and the back surface of the cover tape 3A is coated with an adhesive in order to improve the thermal welding with the carrier tape 3A. is doing.

  A Y table 24 that is driven by a Y-axis drive motor 22 and is guided by a guide 23 to move in the Y direction is provided on a fixed plate 21 that is fixed to the taping device main body 1. An X table 27 that is driven by an X-axis drive motor 25 and is guided by a guide 26 to move in the X direction is provided, and a mounting plate 19 on which the feed reels 5 and 5 and the transport rail 7 are provided is provided on the X table 27. Fixed. Accordingly, the X table 27 and the Y table 24 are moved by driving the X-axis drive motor 25 and the Y-axis drive motor 22, so that the carrier rail 7 and the carrier that moves along the carrier rail 7 through the mounting plate 19. The tape 3A and the like can move in the XY directions.

  A Y table 31 that can be moved in the Y direction by a Y axis drive motor 30 is provided on the taping device main body 1, and can be moved in the X direction by an X axis drive motor 32 on the Y table 31. A chip component supply table 34 is provided via the X moving body 33. A wafer affixed to the sheet is diced on the supply table 34 and is divided into individual dies (hereinafter referred to as “chip parts A”), and fixed with the surface having terminals as the upper surface. The chip component A is picked up and taken out by a suction pick-up nozzle 36 described later while being pushed up by a push-up pin (not shown) from the back surface.

  The upper mounting plate 35 fixed to the taping device main body 1 is provided with, for example, eight suction take-out nozzles 36 for taking out the chip parts A from the chip part supply table 34 at predetermined intervals on the peripheral edge. A first rotating disk 37 intermittently rotated by the cam unit 40 and eight suction loading nozzles 38 for loading the chip component A into the storage groove 3B are arranged at a predetermined interval on the peripheral portion, for example, eight indexing cams. A second turntable 39 that is intermittently rotated by the unit 41 is provided.

  Moreover, the first and second rotating disks 37 and 39 are individually rotated by the individual drive motors 40A and 41A via the indexing cam units 40 and 41. By associating the nozzles 36 and 38 with certainty, the chip component A can be reliably delivered. Further, by making the rotation radii of both the rotating disks the same, the rotation indexing accuracy (resolution) can be made the same.

  Next, the component take-out mechanism 45 will be described in detail with reference to FIG. For example, eight suction / extraction nozzles 36 are disposed at a peripheral portion of the first rotating disk 37 at a predetermined interval, and each suction / extraction nozzle 36 is provided so as to be vertically inverted by each reversing device 46. . That is, when the drive shaft 49 is rotated through the coupling 48 by the drive of the reverse drive motor 47, the attachment body 50 fixed to the drive shaft 49 is also rotated, and the take-out nozzle 36 is inverted upside down. Further, since the guide 52 can move up and down along the guide 51 provided on the mounting body 50, the take-out nozzle 36 attached to the nozzle mounting body 53 fixed to the guide 52 can move up and down. The upper body 50A of the mounting body 50 and the lower side 53A of the nozzle mounting body 53 are always urged upward by a spring 54, but the stopper 55 is locked to the upper side 50A of the mounting body 50. This limits the upper limit.

  Further, the suction take-out nozzle 36 can be lowered when the operating portion 58A of the operating body 58 that can be moved up and down by the guide 57 by driving the Z-axis drive motor 56 presses the head of the nozzle mounting body 53, For example, the chip part A on the chip part supply table 34 can be taken out.

  Next, the component loading mechanism 60 will be described in detail with reference to FIG. For example, eight suction loading nozzles 38 are arranged at a peripheral portion of the second rotary disk 39 at a predetermined interval, and the suction loading nozzles 38 are rotated about the axial direction by each rotating device 61. Provided possible. That is, a transmission belt 65 is stretched between a pulley 63 provided on the drive shaft of the θ-axis drive motor 62 and a pulley 64 provided around the suction loading nozzle 38, and the suction loading nozzle 38 and a hollow cylinder described later. The body 72 is rotatably provided on the second rotating disk 39 via a bearing 66.

  The suction loading nozzle 38 is guided by the guide 71 when the operating portion 69A of the operating body 69 that can be moved up and down by the guide 68 by driving the Z-axis drive motor 67 presses the projection 70A of the nozzle mounting body 70. The chip component A held by suction can be loaded into the storage groove 3B of the carrier tape 3A on the transport rail 7. That is, the suction loading nozzle 38 can move up and down in the hollow cylindrical body 72 and can rotate θ together with the hollow cylindrical body 72.

  Here, a control block diagram of the taping device will be described with reference to FIG. 9. 101 is a CPU as a control device that performs overall control of the operation related to the loading of the chip component A of the taping device, and 102 is for each type of chip component A. The RAM (Random Access Memory) and 103 are ROM (Read Only Memory) for storing the thickness data of each, the height level data for each of the suction extraction nozzles 36, and the like. Based on the data stored in the RAM 102, the CPU 101 controls the operation related to the loading of the chip part A of the taping device in accordance with the program stored in the ROM 103. That is, the CPU 101 controls driving of each driving motor via the driving circuit 104 and the interface 105.

  A recognition processing device 106 is connected to the CPU 101 via the interface 105. The recognition processing device 106 performs recognition processing of an image captured by each recognition camera. Is sent out. That is, the CPU 101 outputs an instruction to the recognition processing device 106 so as to perform recognition processing (such as calculation of a displacement amount) on the image captured by each recognition camera, and receives a recognition processing result from the recognition processing device 106. is there.

  Next, as shown in FIGS. 6 and 7, the station located at 12:00 of the first turntable 37 is a suction extraction station where the suction extraction nozzle 36 sucks and extracts the chip component A from the chip component supply table 34. is there. In this suction take-out station, a chip part A to be taken out next on the chip part supply table 34 is picked up by the part recognition camera 73 while the first turntable 37 is swung, and the position of the chip part A is recognized. A recognition process is performed at 106, and the Y-axis drive motor 30 and the X-axis drive motor 32 are driven so that the CPU 101 is positioned immediately below the suction extraction nozzle 36 that moves the chip component A to be extracted, thereby supplying the chip component. The table 34 is moved, and the chip component A on the chip component supply table 34 is driven by the Z-axis drive motor 56 at this suction / take-out station so that the suction loading nozzle 38 is lowered and sucked out.

  Next, the CPU 101 issues a drive command to the drive motors 40A and 41A via the drive circuit 104, and the second rotating disk 39 is intermittently rotated clockwise by the indexing cam unit 41 by driving the drive motors 40A and 41A. The first rotating disk 37 is intermittently rotated counterclockwise simultaneously by the indexing cam unit 40. The station of the first rotating plate 37 that rotates intermittently in the counterclockwise direction and stops is the reversing station that vertically flips the chip part A held by the suction take-out nozzle 36 by the reversing device 46, and the next is the next. This is a recognition station in which the position of the inverted chip component A is imaged by the component recognition camera 75 and recognized by the recognition processing device 106.

  Next, a printing station which is reversed by the reversing device 46 and prints by the printing device 76 on the chip part A having the printing surface as the upper surface and the surface having the terminals as the lower surface will be described below with reference to FIG. An X table 80 that is movable in the X direction via a guide 79 is provided by an X axis drive motor 78 fixed to the mounting plate 77, and further on the X table 80 via a guide 82 by a Y axis drive motor 81. A Y table 83 that is movable in the Y direction is provided. An ink jet printing unit 88 is provided on the Z moving body 87 that moves in the Z direction via a guide 86 provided on the fixed plate 85 on the lower surface of the Y table 83 by the Z axis drive motor 84.

  That is, the printing unit 88 is movable in the XY direction and the Z direction, and the CPU 101 performs the X-axis drive motor 78 and the Y-axis drive motor 81 based on the position recognition result of the chip component A by the recognition processing device 106 in the recognition station. In a state where the XY direction is corrected during the turning movement of the first rotary disk 37 from the recognition station, the chip component is moved by the printing unit 88 lowered by the Z-axis drive motor 84 at the next printing station. A serial number etc. is printed on A.

  The next curing station is a station that dries the ink printed by the printing unit 88 with warm air from a warm air device (not shown).

  The delivery station is the sixth rotated counterclockwise with the suction take-out station as the first, and the chip component A of the suction take-out nozzle 36 turned upside down by the reversing device 46 is replaced with the suction loading nozzle of the second turntable 39. Pass to 38. In other words, the transfer is performed at the transfer station of the second turntable 39, and the second turntable 39 rotates in the clockwise direction so that the loading station and the recovery loading station (the transfer station is the first and the sixth and seventh). The rotary disks 37 and 39 are disposed so that the suction loading nozzle 38 is positioned above the carrier tape 3 </ b> A of the tape 3.

  That is, when the second rotating disk 39 is disposed so that the two suction loading nozzles 38 are positioned above the carrier tape 3A of the tape 3, the two rotating disks 37 and 39 rotate intermittently in 8 divisions. The angle formed by the center of the second turntable 39 in the station, the line connected to the suction loading nozzle 38 and the travel line of the tape 3 is 67.5 degrees, and the delivery station and the second turn of the first turntable 37 Both rotary disks 37 and 39 are arranged so as to be shifted by 22.5 degrees from the transfer station of the board 39.

  The next station after the transfer station of the second turntable 39 is a first inspection station that inspects the characteristics of the chip component by a characteristic inspection device (not shown). For example, the current value flowing through the chip component is inspected. Then, it is checked whether or not the current value is within a predetermined range stored in the RAM 102. Here, if it is not within the predetermined range, the CPU 101 controls not to load the carrier tape 3A but to store it in a dedicated tray (not shown) described later.

  The next station after the first inspection station is a second inspection station that inspects the characteristics of the chip component by a characteristic inspection device (not shown), for example, a station that conducts a continuity inspection to check whether a current flows through the chip component. Here, if it is inspected that the current does not flow by the characteristic inspection device, the CPU 101 controls so as not to load the carrier tape 3A but to store it in the dedicated tray.

  At the next recognition station, a loaded component recognition camera 93 is disposed. The chip component A sucked and held by the suction loading nozzle 38 is imaged by the loaded component recognition camera 93 and the recognition processing device 106 uses the nozzle for the chip component A. And the appearance inspection (whether there are a predetermined number of bumps, etc.). If a defective chip component is determined by this appearance inspection, the CPU 101 controls to be stored in the dedicated tray without being loaded on the carrier tape 3A.

  As shown in FIG. 2, the next loading station is provided with a loading position recognition camera 94 for recognizing the position of the storage groove 3 </ b> B of the carrier tape 3 </ b> A on the transport rail 7. The storage groove 3B to be loaded inside is imaged, and the recognition processing device 106 recognizes the position.

  Accordingly, after the chip part A is imaged by the loading part recognition camera 93 and the storage groove 3B is imaged by the loading position recognition camera 94, the position of the chip part A sucked and held by the suction loading nozzle 38 by the recognition processing device 106 is recognized. Based on the result, the CPU 101 corrects and controls the Y-axis drive motor 22 and the X-axis drive motor 25 in the XY direction, and the θ direction, that is, the plane direction. The θ-axis drive motor 62 is corrected and controlled for the angle at.

  For this reason, the chip component A can be loaded into the appropriate position in the storage groove 3 </ b> B by the suction loading nozzle 38 that is lowered by the drive of the Z-axis drive motor 67.

  Further, a print inspection camera 95 is provided in the next recovery loading station, and the chip component A in the storage groove 3B located in this station is imaged during the turning movement of the second rotary disk 39, and the recognition processing device 106 The chip part A loaded on the tape 3 is subjected to the recognition process, and the presence or absence of printing and the printing direction are inspected.

  If the CPU 101 determines that the recognition processing unit 106 recognizes a failure, the suction loading nozzle 38 that has finished loading at the loading station removes the chip part A from the storage groove 3B located at the recovery loading station. At this time, the suction loading nozzle 38 to be loaded at the loading station is controlled to stand by without being loaded.

  In this state, the CPU 101 intermittently rotates the second rotating disk 39 without moving the carrier tape 3A, and the next suction loading nozzle 38 is held in the storage groove 3B which has been taken out and emptied as described above. Control is performed so as to load the chip part A which has been performed, and the defective chip part is stored in an XY movable dedicated tray (not shown) at the next station.

  Then, after the chip component A is inserted into the storage groove 3B of the carrier tape 3A by the component loading mechanism 60, the carrier tape 3A and the cover tape 3C are crimped and thermally welded by the tape crimping mechanism 96, and then wound. It will be wound on the take-up and storage reel 9.

  That is, the suction extraction nozzle 36 of the first rotating disk 37 sucks and extracts the chip component A from the chip component supply table 34 at the suction extraction station, and the chip held on the suction extraction nozzle 36 by the reversing device 46 at the reversal station. The part A is turned upside down, the chip part A of the suction take-out nozzle 36 turned upside down by the turning device 46 at the delivery station is delivered to the suction loading nozzle 38 of the second turntable 39, and the second turntable 39 rotates. Then, after the chip part A is inserted into the storage groove 3B of the carrier tape 3A by the suction loading nozzle 38 at the loading station (see FIG. 10), the carrier tape 3A and the cover tape 3C are crimped by the tape crimping mechanism 96. Then, it is wound on the winding storage reel 9.

  After the chip part A is inserted into the storage groove 3B, it is crimped, and the storage tape 3 after this crimping is fed by one pitch by the rotation of the feed sprockets 5 and 5 driven by the feed drive motor 5A. At this time, the CPU 101 rotates the storage drive motor 9 </ b> A to rotate the winding storage reel 9 to wind the storage tape 3.

  And while going from the left sprocket 5 to the pulley 4B, the carrier tape 3A of the storage tape 3 is positioned upward and the cover tape 3C is positioned downward. Accordingly, as shown in FIG. 11, before the storage tape 3 having the chip part A loaded in the storage groove 3B and the opening of the storage groove 3B closed with the cover tape 3C is wound on the take-up storage reel 9. The inspection device 110 inspects the state of the loaded chip part A from below through the cover tape 3C located on the lower side when the storage tape 3 is in a substantially horizontal state.

  That is, the state of the chip component A loaded in the storage groove 3B and on the cover tape 3C, for example, the presence / absence of the chip component in the storage groove 3B, the breakage state such as chipping or scratching of the chip component A, The printing direction (loading direction in the storage groove 3B) and the like are inspected by the inspection device 110. As shown in FIG. 12, the inspection device 110 includes a component recognition camera 111, a zoom lens 112, a coaxial illumination device 113 including a plurality of light sources 113A, and a hollow cylindrical ring illumination device 114 including a plurality of light sources 114A. Composed.

  Accordingly, the coaxial illumination device 113 that easily inspects scratches and characters is used. However, depending on the type of the chip component A, the illumination by the coaxial illumination device 113 and the ring illumination device 114 is adjusted, and the light is stored in the storage tape 3. The chip component A loaded in the groove 3B is irradiated through the cover tape 3C, and the reflected light is captured by the component recognition camera 111 through the zoom lens 112, and the state of the chip component A is imaged. Then, based on the imaging result, the state of the loaded chip part A is judged. If there is no problem, the inspection of the next chip part A is continued as it is. If there is a problem, the operation of the taping device is immediately performed. To stop. Then, a mark may be attached to a predetermined portion of the storage tape 3 so that it can be understood that there is a problem.

  Conventionally, since the state of the chip component was inspected from above through the cover tape, the back surface of the cover tape was rough and rough to make good thermal welding with the carrier tape, and the cover tape was clouded. Since the light hitting the chip part also has a gap between the chip part and the cover tape, it repeatedly diffuses between the cover tape and the shadow of the tape can be made into the chip part, and stable inspection could not be performed. Since the state of the chip component A loaded with the device 110 is inspected from below through the cover tape 3C positioned below, the chip component is placed on the cover tape, and the gap between the cover tape and the chip component is slightly suppressed, The irregular reflection and the formation of the shadow of the tape on the chip component surface can be avoided as much as possible, and as a result, a stable inspection can be performed.

  The storage tape 3 of this embodiment is an embossed tape in which the carrier tape 3A and the cover tape 3C are made of a synthetic resin material. However, the present invention is not limited to this, and the carrier tape is made of paper and the cover tape 3C is a synthetic resin. The same applies to paper tape made of material.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various alternatives described above without departing from the spirit of the present invention. It includes modifications or variations.

It is a top view of a taping device. It is a front view of a taping device. It is a right view of a taping device. It is a figure for demonstrating a components extraction mechanism. It is a figure for demonstrating a component loading mechanism. It is a top view of the stop state of the 1st and 2nd turntable. It is a top view during the turning movement of the 1st and 2nd turntable. It is a side view of a printing mechanism. It is a control block diagram of this taping apparatus. It is a longitudinal cross-sectional view of a conveyance rail. FIG. 3 is an enlarged view of a main part of FIG. 2. It is a figure showing the concept of an inspection apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Taping apparatus main body 3 Storage tape 3A Carrier tape 3B Storage groove 9 Winding storage reel 101 CPU
110 Inspection device 111 Component recognition camera

Claims (1)

  In a taping device in which chip parts are sequentially loaded into each storage groove of a carrier tape fed by a feeding device, the opening of the storage groove is closed with a cover tape, and then wound on a take-up storage reel, An inspection device for inspecting the state of the loaded chip component from below through the cover tape before loading the chip component and closing the opening of the storage groove with the cover tape and winding it on the take-up storage reel. A taping device characterized by comprising: