JP5633950B2 - Taping unit, electronic component accommodation method, and electronic component inspection apparatus - Google Patents

Description

  The present invention relates to a taping unit for storing electronic components, an electronic component storing method, and an electronic component inspection apparatus including the taping unit.

  Electronic components such as semiconductor elements are separated into individual pieces through various assembly processes such as dicing, mounting, bonding, and sealing, and then various processes such as inspection are performed. This process is generally performed by an electronic component inspection apparatus called a test handler. In this method, the main table is rotated, the electronic components of the transport unit are held by a holding means such as a suction nozzle, and transported to each inspection apparatus for inspection. The electronic component that has been inspected is accommodated in the pocket of the carrier tape in the taping unit.

  The carrier tape containing the electronic components is taken up by a take-up motor, but before that, an appearance inspection is performed. The appearance inspection is for detecting defects such as an electronic component not stored in the pocket in the correct direction, a scratch on the stored electronic component, or an empty pocket. As an inspection method, the carrier tape is intermittently transferred using a sprocket, and an imaging means for imaging the electronic component is arranged on the transfer path to image the electronic component. When a defect is detected from the captured image of the imaging unit, the electronic component is removed from the pocket using a removing unit such as a suction nozzle. Then, the carrier tape is transported in the direction opposite to the transport direction, and the empty pocket is returned to the electronic component housing position to accommodate a new electronic component (see, for example, Patent Document 1).

International Publication No. WO2010 / 089275

  In the taping unit, it is desirable to quickly detect and remove a defect in the electronic component and accommodate a new electronic component in the vacant pocket. Therefore, it is preferable to provide a defect detection position for detecting a defect by imaging an electronic component at a position close to the accommodation position on the downstream side in the transfer direction. If it becomes so, a removal means will be arrange | positioned further to a conveyance direction downstream from a defect detection position. In this case, in order to return the pocket to the accommodation position and accommodate a new electronic component, the carrier tape has to be largely returned in the direction opposite to the transport direction.

  On the other hand, Patent Document 1 discloses a configuration in which the main table is reversely rotated by 1/2 pitch to retract the holding means from the accommodation position, and the removal means is moved to the accommodation position to remove the electronic component. In this configuration, the distance for transferring the carrier tape in the reverse direction can be reduced, but it is necessary to reversely rotate the direct drive motor that drives the main table.

  That is, it is necessary to control the entire main table of the electronic component inspection apparatus for the operation of the taping unit which is one of the processing steps. Further, the movement of the main table in the ½ pitch minus direction complicates the control. Furthermore, due to the reverse rotation operation, there is a possibility that problems such as product dropping and positional deviation may occur in electronic components that are determined to be free in each step. Further, depending on the size of the apparatus and the number of holding means, the pitch of the holding means of the main table may be narrow. In this case, there is a possibility that a sufficient movable range of the removing means cannot be secured even if the holding means is shifted by 1/2 pitch.

  The present invention has been proposed to solve the above-described problems, and does not require reverse rotation or fine control of the main table for detecting and removing defects in electronic components, and also has a carrier tape transfer distance. It is an object of the present invention to provide a taping unit, an electronic component housing method, and an electronic component inspection apparatus which are reduced and work efficiency is improved.

The taping unit according to the present invention accommodates an electronic component on a carrier tape in which a plurality of accommodating portions are arranged in the longitudinal direction and transfers the electronic component on a transfer path, and includes the following.
(A) Transfer means for transferring the carrier tape in which the electronic component is accommodated in the accommodating portion at the first position on the transfer path along the transfer path. (B) By the transfer of the carrier tape, from the first position on the transfer path. Imaging means for imaging the electronic component transferred to the second position downstream in the transfer direction (c) Defect detection means for detecting a defect of the electronic component from the imaging result by the imaging means (d) Electron in which the defect is detected Removal means for removing the component from the carrier tape accommodating portion (e) A moving mechanism for moving the removal means relative to the carrier tape and positioning the removal means from the standby position to the second position.

  According to one aspect of the present invention, at least a part of the mechanism of the imaging unit may be arranged at the second position.

  According to one aspect of the present invention, the moving mechanism is provided so as to be movable in a direction orthogonal to the transfer direction, and at least a part of the mechanism of the imaging unit and the removing unit are arranged adjacent to each other in the direction orthogonal to the transfer direction. Then, it is connected to the moving mechanism, and at least a part of the mechanism of the imaging unit is retracted from the second position by moving the moving mechanism, and the removing unit is moved from the standby position to the second position. .

  According to an aspect of the present invention, the imaging unit may include a prism that refracts an image of the electronic component and guides it to the camera as a part of the mechanism, and this prism may be arranged at the second position.

  According to one aspect of the present invention, the removing unit may be configured by a blow nozzle that blows air to lift the electronic component from the bottom surface of the housing portion and a holding unit that holds the electronic component that is lifted from the bottom surface.

  Furthermore, an electronic component housing method corresponding to the taping unit and an electronic component inspection apparatus including the taping unit are also one aspect of the present invention.

  According to the present invention, when the defect of the electronic component housed in the pocket is detected in the taping unit, the main table is rotated in the reverse direction by providing the moving mechanism that positions the removing means at the second position that is the defect detection position. Since the defective electronic component can be quickly removed only by moving the carrier tape over a small distance without making it, the working efficiency can be improved.

It is a figure which shows schematic structure of the taping unit which concerns on the 1st Embodiment of this invention. It is the perspective view which expanded the principal part of the taping unit. It is the front view which expanded the principal part of the taping unit. It is the side view which expanded the principal part of the taping unit and omitted the removal means. It is a flowchart which shows the effect | action of a taping unit. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S01 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S02 to S03 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S05 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S06 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. (D) shows the aspect of removal of the electronic component by the removing means. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S07 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. It is a schematic diagram which shows the effect | action of the taping unit corresponding to step S08 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. It is a schematic diagram which shows the effect | action of the taping unit after step S08 of FIG. (A) shows the state of the main table, (b) shows the state of the taping unit seen from the front, and (c) shows the state of the taping unit seen from the top. It is a schematic diagram which shows the structure of the taping unit which concerns on the 2nd Embodiment of this invention. (A) shows the state of detection of a defective electronic component, and (b) shows the state of removal of the defective electronic component. It is a schematic diagram which shows the structure of the taping unit which concerns on the 3rd Embodiment of this invention. (A) shows the state of detection of a defective electronic component, and (b) shows the state of removal of the defective electronic component. It is a schematic diagram which shows the structure of the taping unit which concerns on the 4th Embodiment of this invention. (A) shows the state of detection of a defective electronic component, and (b) shows the state of removal of the defective electronic component. It is a schematic diagram which shows the structure of the taping unit which concerns on the 5th Embodiment of this invention. It is a figure which shows the example of application to the electronic component inspection apparatus of the taping unit which concerns on embodiment of this invention. (A) is a top view of an electronic component inspection apparatus, and (b) is a side view thereof.

Hereinafter, an embodiment of a taping unit according to an embodiment of the present invention will be described in detail with reference to the drawings.
In the embodiment, for example, as shown in FIG. 2, three axes X, Y, and Z orthogonal to each other are set, the X axis is the apparatus longitudinal direction, the Y axis is the apparatus width direction, and the Z axis is the apparatus height. Description will be made assuming that the direction is indicated.

(First embodiment)
(1. Outline configuration of taping unit)
The overall configuration of the taping unit of the present embodiment will be described with reference to FIGS. 1 and 2.
The taping unit 1 is provided as a unit that performs one of various process processes in an electronic component inspection apparatus, and is a unit that packs an electronic component D that has undergone various inspection processes. The electronic component D is conveyed to the taping unit 1 by the suction nozzle 111 of the holding means provided on the main table of the electronic component inspection apparatus, and is accommodated in the carrier tape T. The electronic component D is a component used for an electrical product, and includes a semiconductor element. Examples of the semiconductor element include a transistor and an integrated circuit. The carrier tape T is obtained by embossing the tape to provide pockets U, and a plurality of pockets U that serve as receiving portions for the electronic components D are arranged in the longitudinal direction.

  The taping unit 1 includes transfer means 10 that intermittently transfers the electronic component D accommodated in the carrier tape T to the take-up motor by transferring it in the X-axis direction. The taping unit 1 further includes an imaging unit 20 that images the electronic component D accommodated in the pocket U of the carrier tape T, a defect detection unit 30 that detects a defect of the electronic component D from the imaging result of the imaging unit 20, and a defect is detected. The removal means 40 for removing the electronic component D from the pocket U, and the moving mechanism 50 for moving at least a part of the removal means 40 and the imaging means 20 in the Y-axis direction are provided.

(2. Configuration of each part)
Hereinafter, the structure of each part of the taping unit 1 will be described with reference to FIGS.
(2-1. Transfer means)
As shown in FIG. 2, the transfer means 10 includes a transfer path 12 provided on the main body 11 of the taping unit 1, a sprocket 13 provided at the end of the main body 11, and a motor 14 that drives the sprocket 13. Consists of

  The transfer path 12 extends on the main body 11 in the X-axis direction. The carrier tape T is transferred on the transfer path 12. The sprocket 13 has a rotating shaft of the motor 14 inserted through the center thereof, and rotates by driving the motor 14. Projections are provided on the peripheral surface of the sprocket 13 at equal intervals. A sprocket hole (not shown) is provided on the bottom surface of the carrier tape T. When the sprocket 13 is rotated, the carrier tape T is transferred by engaging the projection with the sprocket hole. Depending on the rotation direction of the sprocket 13, the carrier tape T is transferred in the direction from the right to the left on the X axis in FIG. 1, that is, the transfer direction, and from the left to the right on the X axis, that is, the direction opposite to the transfer direction. Is done. In the transfer of the carrier tape T, the distance corresponding to the length of the pocket U in the X-axis direction is one pitch.

  As shown in FIGS. 1 and 3, on the upstream side in the transfer direction on the transfer path 12, there is a storage position P <b> 1 for storing the electronic component D released from the suction nozzle 111 of the electronic component inspection apparatus by vacuum break in the pocket U. Is provided. Furthermore, a defect detection position P2 for detecting a defect of the electronic component accommodated in the pocket U is provided on the downstream side of the accommodation position by one pitch in the transfer direction.

(2-2. Imaging means)
As shown in FIG. 1, the imaging means 20 includes a camera 21 that images the electronic component D accommodated in the pocket U, and right-angle prisms 27 a and 27 b that guide the image of the electronic component D to the camera 21. In the present embodiment, the right-angle prism 27 a is disposed at the defect detection position P <b> 2 on the transfer path 12. The right angle prism 27b is arranged several pitches downstream from the right angle prism 27b, and the camera 21 is located immediately above the right angle prism 27b.

  The right-angle prisms 27a and 27b are housed integrally in a prism holder 28 extending in the X-axis direction. Although not shown, an entrance window is provided at the end of the prism holder 28 where the right-angle prism 27a is located, and an exit window is provided at the end where the right-angle prism 27b is located. The prism holder 28 is connected to a moving mechanism 50 described later, and is movable in the Y-axis direction.

  The lens 21a of the camera 21 extends downward and faces the exit window of the right-angle prism 27b. As shown in FIG. 2, the lens 21 a is clamped to the clamp 22. The clamp 22 is supported by a bracket 23 located rearward in the Y-axis direction. The bracket 23 is supported by a stand 25 located on the side. The stand 25 is erected on the main body 11.

  The clamp 22 and the bracket 23 are connected via a Y-axis direction adjusting slot 24a. Thereby, the position of the camera 21 can be adjusted in the Y-axis direction by the length of the long hole. The bracket 23 and the stand 25 are connected via a Z-axis direction adjusting slot 24b. Thereby, the position of the camera 21 can be adjusted in the Z-axis direction. The stand 25 is connected to the main body 11 through an X-axis direction adjustment slot not shown. Thereby, the position of the camera 21 can be adjusted in the X-axis direction by the length of the long hole.

(2-3. Defect detection unit 30)
As shown in FIG. 1, the imaging unit 20 is connected to a defect detection unit 30. An image captured by the camera 21 is transmitted to the defect detection unit 30. The defect detection unit 30 determines whether or not the electronic component D is defective from the captured image, and transmits a defect detection signal to a control device (not shown) when a defect is detected.

(2-4. Removal means 40)
The removing means 40 includes a vacuum pipe 41 that sucks and detaches the electronic component D by generating and breaking a vacuum, and a blow nozzle 42 that blows air against the pocket U and the electronic component D.

  As shown in FIG. 2, the vacuum pipe 41 and the blow nozzle 42 are provided so as to be adjacent to the right-angle prism 27a in a direction orthogonal to the transfer direction. In other words, it is provided at a position adjacent to the defect detection position P2 in the direction orthogonal to the transfer direction. The vacuum pipe 41 and the blow nozzle 42 are inserted into and held in the through hole of the pipe holder 43, and are provided so that their tip portions are located near the surface of the main body 11 of the tape unit 1. Since the pipe holder 43 is connected to a moving mechanism 50 described later, the vacuum pipe 41 and the blow nozzle 42 can move integrally in the Y-axis direction.

(2-5. Movement mechanism)
The moving mechanism 50 includes an air cylinder 51 that moves horizontally in the Y-axis direction. The air cylinder 51 is connected to the prism holder 28 positioned below the Z-axis direction and the vacuum pipe 41 and the blow nozzle 42 positioned on the upstream side in the transfer direction so that they can be moved integrally in the Y-axis direction. .

  The air cylinder 51 is provided in the upper part of the transfer path 12 on the downstream side in the transfer direction of the defect detection position P2. As shown in FIG. 4, the air cylinder 51 includes a fixed portion 51a and a movable portion 51b that can move in the Y-axis direction. The tip of the rod extending from the side surface of the fixed portion 51a is loosely fitted in the guide groove provided in the movable portion 51b. The upper surface of the fixed portion 51 a is connected to the plate 52. The plate 52 is fixed to the main body 11. The air cylinder 51 includes a joint 56 for supplying air, and the movable portion 51b is horizontally moved in the Y-axis direction by taking in and out air through the joint 56.

  A pipe holder 43 is connected to the bottom surface of the movable portion 51b. Specifically, as shown in FIG. 3, a part of the pipe holder 43 extends to the downstream side in the transfer direction as a connecting portion 43a. The connecting portion 43a is located between the air cylinder 51 and the prism holder 28, and is connected to the bottom surface of the movable portion 51b. As a result, the vacuum pipe 41 and the blow nozzle 42 held by the pipe holder 43 are moved integrally with the movable portion 51b in the Y-axis direction.

  The connecting portion 43 a of the pipe holder 43 is connected to the prism holder 28. Specifically, as shown in FIG. 4, the connecting portion 43a has a connecting portion 43b extending downward from the end on the back side of the unit, and a linear guide 54 slidable in the X-axis direction is provided on the connecting portion 43b. It is attached. The prism holder 28 is connected to the linear guide 54. Furthermore, as shown in FIG. 3, the rod extends downward from the bottom surface of the end portion of the connecting portion 43a on the unit front side, and the tip portion of the rod and the engaging portion 28a provided on the prism holder 28 are connected to the X axis. It is connected via a tension spring 55 that can expand and contract in the direction.

  As described above, the prism holder 28 is connected to the air cylinder 51 through the pipe holder 43. Therefore, the right-angle prisms 27a and 27b accommodated in the prism holder 28 move together with the movable part 51b of the air cylinder 51 in the Y-axis direction together with the vacuum pipe 41 and the blow nozzle 42. Further, when the prism holder 28 is pulled, the tension spring 55 is extended and the linear guide 54 slides in the X-axis direction, so that only the prism holder 28 can be shifted in the X-axis direction. This is because the defective electronic component D can be manually removed depending on the situation.

  The transfer means 10, the imaging means 20, the defect detection unit 30, the removal means 40, and the moving mechanism 50 are each connected to a control device (not shown). The control device controls the transfer speed and stop / drive timing of the transfer means 10 and controls the imaging timing of the imaging means 20. Further, the moving mechanism 50 and the removing unit 40 are driven based on the defect detection signal transmitted from the defect detection unit 30.

(3. Action of taping unit)
The operation of the taping unit 1 of the present embodiment will be described along the flowchart of FIG. The operation of the taping unit 1 in each step will be described with reference to FIGS. 6 to 12 in association with the operation of the main table of the electronic component inspection apparatus. Furthermore, in the description of the operation of the taping unit 1, the carrier tape T transfer direction is defined as the + X axis direction, and the reverse direction of the transfer direction is defined as the −X axis direction. Furthermore, the direction from the back to the front of the taping unit 1 on the Y axis is defined as the + Y axis direction, and the direction from the front to the back is defined as the −Y axis direction.

(Step S01)
As shown in FIG. 6, the main table M turns and the electronic component D <b> 1 held by the suction nozzle 111 of the holding means provided on the outer periphery is conveyed to the accommodation position P <b> 1 of the taping unit 1. The electronic component D is separated from the suction nozzle 111 by vacuum break and is accommodated in the pocket U1 of the carrier tape T located at the accommodating position P1.

(Step S02)
As shown in FIG. 7, the carrier tape T is transferred in the 1 pitch + X-axis direction. As a result, the pocket U1 is located at the defect detection position P2. The main table M rotates by an interval corresponding to the holding means holding the next electronic component D2, that is, by one pitch. As a result, the next electronic component D2 is transported to the taping unit 1 and stored in the pocket U2 located at the storage position P1.
At this time, as shown in FIGS. 7B and 7C, the right-angle prism 27a is located at the defect detection position P2. On the other hand, the removing means 40 is adjacent to the defect detection position P2 in the −Y axis direction. That is, the removing means 40 is in a standby state at the standby position.

(Step S03)
Similarly, as shown in FIG. 7, the camera 21 images the electronic component D1 accommodated in the pocket U1 located at the defect detection position P2. The image of the electronic component D1 is refracted in the + X-axis direction by the right-angle prism 27a provided at the defect detection position P2, and is refracted upward in the Z-axis direction by the right-angle prism 27b provided a few pitches downstream. The light is incident on the camera 21 provided above and imaged.

  The imaging result is transmitted to the defect detection unit 30. The defect detection unit 30 detects a defect such that the electronic component D1 is not accommodated in the pocket U in the correct direction or the appearance of the electronic component D1 is scratched.

(Step S04)
In step S03, when the defect detection unit 30 does not detect a defect (step S03: No), the carrier tape T is transferred in the 1 pitch + X-axis direction, and the electronic component D2 is the next component positioned at the defect detection position P2. The imaging and the defect detection are performed.

(Step S05)
When a defect is detected in the electronic component D1 in step S03 (step S03: Yes), a defect detection signal is transmitted from the defect detection unit 30 to a control device (not shown). The control device stops the transfer of the carrier tape T. At the same time, the rotation of the main table M is also stopped. At the same time, the air cylinder 51 is driven horizontally in the + Y-axis direction. Since the prism holder 28 and the removing means 40 connected to the air cylinder 51 also move in the + Y-axis direction, each moves relative to the carrier tape T. As a result, as shown in FIG. 8, the right-angle prism 27a in the prism holder 28 retreats from the defect detection position P2 and moves to the adjacent position in the + Y-axis direction. The removing means 40 moves from the standby position to the defect detection position P2.

(Step S06)
As shown in FIG. 9, the electronic device D1 is removed from the pocket U1 using the removing means 40. FIG. 9D shows an example of a specific mode of removal. The removal is performed using the vacuum pipe 41 and the blow nozzle 42 of the removing means 40. First, as a preliminary operation, air is blown from the blow nozzle 42 toward the side surface of the pocket U. Thereby, since air enters between the electronic component D1 and the pocket U1, the electronic component D1 is easily detached. Thereafter, the electronic component D1 is sucked and removed from the pocket U1 by vacuum suction of the vacuum pipe 41.

(Step S07)
The air cylinder 51 is driven horizontally in the −Y axis direction. Since the prism holder 28 and the removing means 40 connected to the air cylinder 51 also move in the −Y axis direction, each moves relative to the carrier tape T. As a result, as shown in FIG. 10, the removing means 40 is retracted from the defect detection position P2 and moved to the standby position. The right-angle prism 27a in the prism holder 28 moves from the adjacent position in the + Y axis direction to the defect detection position P2. The camera 21 captures an image of the pocket U1 located at the defect detection position P2, and confirms whether the electronic component D1 has been properly removed. The defective electronic component D1 is discharged from the vacuum pipe 41 to a defective product discharge unit (not shown).

(Step S08)
The carrier tape T is transferred in the 1 pitch-X axis direction. As a result, as shown in FIG. 11, the empty pocket U1 returns to the accommodation position P1. At the same time, the main table M is rotated by one pitch, and a new electronic component D3 is conveyed to the taping unit 1.

  Thereafter, the taping unit 1 repeats the operation from step S02. That is, as shown in FIG. 12, a new electronic component D3 is accommodated in the pocket U1. Next, the carrier tape T is transported in the + X-axis direction, and defect detection is performed by imaging at the defect detection position P2. The same processing is performed for the electronic components sequentially accommodated after the electronic component D3. Since the electronic component D2 is already accommodated in the pocket U2 subsequent to the pocket U1, the main table M stops until the empty pocket U3 is located at the accommodation position P1. Thus, the carrier tape T containing the electronic component D is transported in the transport direction and is wound by a winding motor (not shown).

(effect)
(1) In the present embodiment, the taping unit 1 accommodates the electronic component D in the pocket U of the carrier tape T at the accommodation position P1 on the transfer path 12. The carrier tape T is transferred by the transfer means 10. The electronic component D is imaged by the imaging means 20 at the defect detection position P2 on the downstream side in the transfer direction from the accommodation position P1. A defect of the electronic component D is detected by the defect detection unit 30 from the imaging result obtained by the imaging unit 20. When a defect is detected in the electronic component D, the moving unit 50 moves the removing unit 40 from the standby position to the defect detection position P2. The electronic component D is removed by the removing means 40.

  Thus, by providing the moving mechanism 50 that positions the removing means 40 at the defect detection position P2, the electronic component D can be detected and removed at the same position on the transfer path 12. Therefore, even when the accommodation position P1 and the defect detection position P2 are close to each other, it is not necessary to provide the removing means 40 downstream in the transfer direction, and the transfer direction of the carrier tape T and the transfer distance to the reverse walking can be reduced. . Alternatively, it is not necessary to reversely rotate the main table M of the electronic component inspection apparatus by ½ pitch in order to temporarily arrange the removing means 40 at the storage position P1. Therefore, removal of defective electronic components can be almost completed only by controlling the operation of the taping unit 1. The main table M does not require complicated operations, and only the rotation and stop timings need be controlled. Since the removing means 40 is located at the defect detection position P2, it is possible to ensure a sufficient movable range without being affected by the configuration of the main table M. Further, it is possible to prevent a problem that may occur due to the reverse rotation of the main table M as described above.

  As described above, the work efficiency of the taping process in the taping unit 1 can be improved by the configuration that can efficiently remove the electronic component D in which a defect is detected.

(2) In the present embodiment, the right-angle prism 27a, which is a part of the imaging unit 20, is arranged at the defect detection position P2. The camera 21 that captures an image of the electronic component D guided from the right-angle prisms 27a and 27b is disposed on the downstream side in the transport direction from the defect detection position P2. As a result, the camera itself that requires a large space can be arranged at another position while securing the defect detection position P2 at a position close to the accommodation position P1.

(3) Furthermore, in this embodiment, the air cylinder 51 that can move in the Y-axis direction is disposed as the moving mechanism 50. The vacuum pipe 41 and the blow nozzle 42 that are the removing means 40 and the right-angle prism 27a that is a part of the imaging means 20 are arranged so as to be adjacent to each other in the Y-axis direction. Then, a prism holder 28 that accommodates the vacuum pipe 41, the blow nozzle 42, and the right-angle prism 27 a is connected to the air cylinder 51. With this configuration, when detecting a defect in the electronic component D, the prism holder 28 is retracted from the defect detection position P2 by driving the air cylinder 51 in the Y-axis direction, and the vacuum pipe 41 and the blow nozzle 42 are detected from the standby position. It can be moved to position P2. That is, it is not necessary to separately provide a moving mechanism for each of the imaging unit 20 and the removing unit 40, and the control for detecting and removing the electronic component D is simplified.

(4) Further, the removing means 40 is composed of a blow nozzle 42 that blows air to lift the electronic component D from the bottom surface of the pocket U, and a vacuum pipe 41 that holds the electronic component that floats from the bottom surface. By preliminarily spraying with the blow nozzle 42, the electronic component D can be more reliably removed from the pocket U.

(Second Embodiment)
In the first embodiment, the prism holder 28 and the removing means 40 are connected to the air cylinder 51 and moved in the Y-axis direction. In the second embodiment, a mechanism for moving the carrier tape T in the Y-axis direction is provided instead of the air cylinder 51. As an example, as shown in FIG. 13, a rail 120 is provided on a gantry, and a main body 11 on which a carrier tape T is mounted is slidably installed. When a defect is detected at the defect detection position P2, the motor 121 provided in the main body 11 is driven to move the carrier tape T in the -Y axis direction, and the pocket U located under the right-angle prism 27a. Is moved under the removing means 40. After removing the electronic component D from the pocket U using the removing means 40, the motor 121 is driven again to move the carrier tape T in the + Y-axis direction and return to the original position.

  Thus, in the second embodiment, the carrier tape T is moved in the Y-axis direction by the rail 120 and the motor 121, and the defective electronic component D is moved from below the prism 27a to below the removing means 40. In other words, as in the first embodiment, there is provided a moving mechanism that moves the removing means 40 relative to the carrier tape T and positions the removing means 40 at the defect detection position P2 on the transfer path 12. Yes. With such a configuration, the defect detection and removal of the electronic component D can be performed at the same position on the transfer path 12, so that the work efficiency can be improved.

  In the first embodiment, the prism holder 28 and the removing means 40 are connected to the air cylinder 51 so as to move integrally. However, in this embodiment, the carrier tape T itself moves, so the prism holder Since it is sufficient that 28 and the removing means 40 are adjacent to each other in the Y-axis direction, it is not necessary to connect them. Since the configuration of other parts is the same as that of the first embodiment, description thereof is omitted.

(Third embodiment)
In the first embodiment, the air cylinder 51 that moves the right-angle prism 27a and the removing means 40 horizontally is used. In the third embodiment, instead of the air cylinder 51, a member that moves the right-angle prism 27a and the removing means 40 in the circumferential direction may be used. Specifically, as shown in FIG. 14, the right-angle prism 27 a and the removing unit 40 are arranged on the circumference of the disk member 130 with a space therebetween. The disk member 130 is arranged so that the vertical line passing from the center of the circle is located at the defect detection position P2. When imaging the electronic component D, the right-angle prism 27a is positioned directly above the defect detection position P2. When a defect is detected, the disk member 250 rotates by an angle that is the distance between the right-angle prism 27a and the removing means 40. As a result, the removing means 40 is positioned at the defect detection position P2.

As described above, in the third embodiment, the removing unit 40 is moved with respect to the carrier tape T by the disk member 130, and the removing unit 40 is positioned at the defect detection position P <b> 2 on the transfer path 12. Thereby, since the defect detection and removal of the electronic component D can be performed at the same position on the transfer path 12 as in the first embodiment, work efficiency can be improved.
Since the configuration of other parts is the same as that of the first embodiment, description thereof is omitted.

(Fourth embodiment)
In the first embodiment, the prism holder 28 is provided at a position close to the surface of the transfer path 12. However, the prism holder 28 is located at a high position away from the surface of the transfer path 12 as long as the image from the electronic component can be reached. May be provided. In that case, as shown in FIG. 15, the right-angle prism 27b may be arranged so as to refract the image downward in the Z-axis direction. Further, the camera 21 may be installed with the lens 21a facing upward so that the image from the right-angle prism 27b is incident. The prism holder 28 is not connected to the air cylinder 51, but only the removing means 40 is connected. When a defect is detected, the removing means 40 moves in the + Y-axis direction and is positioned below the right-angle prism 27a.

  As described above, according to the fourth embodiment, the defect detection and removal of the electronic component D can be performed on the transfer path 12 as in the first embodiment without retracting the prism holder 28 from the defect detection position P2. It can be done in the same position. Since the configuration of other parts is the same as that of the first embodiment, description thereof is omitted.

(Fifth embodiment)
In the first embodiment, the vacuum pipe 41 and the blow nozzle 42 are integrally held by a pipe holder 43, and the blow nozzle 42 blows air against the pocket U from above. However, depending on the type of carrier tape, there is one in which a hole is provided on the bottom surface of the pocket. When this type of carrier tape is used, a blow nozzle 42 may be provided below the transfer path 12 at the storage position P2, as shown in FIG. In this case, since air can be blown to the bottom surface of the pocket U using the blow nozzle 42, the electronic component D can be lifted from the pocket U, and suction and retention by the vacuum pipe 41 can be ensured.

  Furthermore, the blow nozzle 42 may be a nozzle capable of both blowing up and sucking, and this nozzle may be provided not only at the defect detection position P2 but also below the transfer path 12 at intervals of one pitch or several pitches. These nozzles perform suction during normal transfer. Since the electronic component D is attracted to the bottom surface of the pocket U through the hole on the bottom surface of the pocket U, the displacement of the electronic component D that occurs during transfer can be prevented.

(Sixth embodiment)
An application example of the taping unit 1 shown in the first to fifth embodiments to an electronic component inspection apparatus will be described. 17A is a top view of the electronic component inspection apparatus, and FIG. 17B is a side view of the electronic component inspection apparatus.

The electronic component inspection apparatus 100 includes a transport mechanism and various process processing mechanisms. The transport mechanism includes a main table M. The center of the main table M is supported by the drive shaft of the direct drive motor 101 disposed below. The main table M rotates intermittently at a predetermined angle as the direct drive motor 101 is driven.

  A plurality of holding means 110 for holding the electronic component D are attached to the outer peripheral end of the main table M at regular intervals along the outer periphery of the main table M. By rotating the main table M, the electronic component D is conveyed in the outer circumferential direction. The arrangement interval of the holding means 110 is equal to the rotation angle of one pitch of the main table M.

  The holding unit 110 includes a suction nozzle 111 that sucks and removes the electronic component D. The suction nozzle 111 is supported by a support portion 112 attached to the outer peripheral portion of the main table M so that the lower end protrudes from the lower surface of the main table M.

  A nozzle driving unit 113 is disposed at each stop position L of the holding unit 110. The nozzle driving unit 113 is specifically a motor, and moves the operation rod 114 up and down. The operation rod 114 abuts on the suction nozzle 111 and applies a pressing force to push the suction nozzle 111 downward.

  Such an electronic component transport apparatus 100 includes a transport control unit (not shown), and sends an electrical signal to the direct drive motor 101, the nozzle drive unit 113 that moves the suction nozzle 111 up and down, the vacuum generator, and various process processing units. Thus, these operation timings are controlled. That is, the conveyance control unit includes a ROM, a CPU, and a driver that store a control program, and outputs an operation signal at each timing to each drive mechanism through an interface according to the control program. In addition, this conveyance control part may be the same control part as the control part of the taping unit, or may be a separate control part capable of transmitting and receiving with the control part.

Various process processing mechanisms surround the main table M and are arranged at equal intervals in the outer circumferential direction. The arrangement interval is the same as or equal to an integral multiple of the rotation angle of one pitch of the main table M. As various process processing mechanisms, in order in the rotation direction of the main table M, for example,
A parts feeder 102, a marking unit 103, an appearance inspection unit 104, a test contact unit 105, a forming unit 106, a sorting / sorting unit 107, and a taping unit 1 are arranged.

  In the electronic component inspection apparatus 100 as described above, the accommodation position P1 of the taping unit 1 is at the stop position L of the holding means 110. At the stop position L, the electronic component D detached from the suction nozzle 111 of the holding means 110 by vacuum breakage is accommodated in the pocket U located at the accommodation position P1. Then, as described in the above embodiment, the presence or absence of a defect is inspected at the defect detection position P2, and then sent to the winding motor.

(Other embodiments)
(1) In the above-described embodiment, the right-angle prisms 27a and 27b are integrally stored in the prism holder 28, but may be stored in separate holders provided with windows for forming an optical path. Thereby, at the time of defect detection, only the right-angle prism 27a of the imaging means 20 can be moved.

(2) In the above-described embodiment, the right angle prism 27a is provided at the defect detection position P2, and the camera 21 is provided at another position. However, it is also possible to provide the camera 21 itself at the defect detection position P2 by using a microminiature camera.

(3) In the above-described embodiment, the defect detection position P2 is provided one pitch downstream with respect to the accommodation position P1, but the defect detection position P2 may be provided more than two pitches downstream depending on the size of the pocket U. good. In that case, it is preferable to provide the defect detection position P2 in a range where the transfer of the carrier tape T in the reverse direction does not become too large.

(4) In the above-described embodiment, the removing unit 40 is disposed at a position close to the defect detection position P2. However, depending on the configuration of the moving mechanism 50, the removing unit 40 is positioned at a distance from the defect detection position P2. You may arrange in.

(5) In the above-described embodiment, the vacuum pipe 41 is used as the removing means 40. However, an electrostatic adsorption method, a Bernoulli chuck method, or a holding mechanism of a chuck mechanism that mechanically clamps the electronic component D may be used.

(6) In the above-described embodiment, the right-angle prisms 27a and 27b are provided as a mechanism for guiding the image of the electronic component D to the camera 21, but a mirror may be used instead of the right-angle prism. Moreover, you may combine both a prism and a mirror.

(7) The present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. In addition, various inventions can be formed by appropriately combining a plurality of components disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, constituent elements over different embodiments may be appropriately combined.

DESCRIPTION OF SYMBOLS 1 Taping unit 10 Transfer means 11 Main-body part 12 Transfer path 13 Sprocket 14 Motor 20 Imaging means 21 Camera 22 Clamp 23 Bracket 24a Y-axis direction adjustment long hole 24b Z-axis direction adjustment long hole 25 Stand 27a, 27b Right angle prism 28 Prism Holder 28a Engagement section 30 Defect detection section 40 Removal means 41 Vacuum pipe 42 Blow nozzle 43 Pipe holder 43a Connection section 43b Connection section 50 Moving mechanism 51 Air cylinder 51a Fixed section 51b Movable section 52 Plate 54 Linear guide 55 Tension spring 56 Joint 100 Electronic component inspection apparatus 101 Direct drive motor 102 Parts feeder 103 Marking unit 104 Appearance inspection unit 105 Test contact unit 106 Forming unit 107 Sorting and sorting Knit 110 Holding means 111 Suction nozzle 112 Support section 113 Nozzle drive section 114 Operation rod 120 Rail 121 Motor 130 Disk member D, D1, D2, D3 Electronic component M Main table P1 Housing position P2 Defect detection position T Carrier tape U, U1, U2, U3 pocket

Claims (7)

A taping unit that accommodates an electronic component in a carrier tape in which a plurality of accommodating portions are arranged in the longitudinal direction and moves on a transfer path,
Transfer means for transferring the carrier tape in which the electronic component is stored in the storage portion at a first position on the transfer path, along the transfer path;
Imaging means for imaging the electronic component transferred to the second position downstream in the transfer direction from the first position on the transfer path by the transfer of the carrier tape;
A defect detecting means for detecting a defect of the electronic component from an imaging result by the imaging means;
Removing means for removing the electronic component in which a defect has been detected from within the housing portion of the carrier tape , and
At least a part of the mechanism of the imaging unit is located at the second position during imaging of the electronic component, and retracts from the second position when a defect of the electronic component is detected,
It said removal means taping unit, characterized that you move to the second position from the standby position when the electronic component failure is detected. A moving mechanism provided to be movable in a direction perpendicular to the transfer direction and connected to the removing means;
The moving mechanism is connected so that at least a part of the mechanism of the imaging unit is adjacent to the removing unit in a direction orthogonal to the transfer direction ,
When the electronic component failure is detected, the by the movement of the moving mechanism, retracts from at least a portion of mechanism the second position of said imaging means, said removing means from said waiting position the second The taping unit according to claim 1 , wherein the taping unit moves to a position. The imaging means includes a prism that refracts an image of the electronic component and guides it to a camera as a part of the mechanism,
The taping unit according to claim 1 or 2, wherein the prism is arranged at the second position. 2. The removing means includes a blow nozzle that blows air to raise the electronic component from the bottom surface of the housing portion, and a holding mechanism that holds the electronic component that floats from the bottom surface. The taping unit as described in any one of -3 . An electronic component inspection apparatus that performs various process processes while conveying electronic components,
A transport path for various processes of the electronic component;
Holding means for holding the electronic component and intermittently moving along the conveyance path;
A taping unit that is provided at one of the holding positions of the holding means and that transports the electronic components held on the holding means on a transfer path by storing the electronic components in a carrier tape in which a plurality of receiving portions are arranged in the longitudinal direction. And comprising
The taping unit is
Transfer means for transferring the carrier tape in which the electronic component is stored in the storage portion at a first position on the transfer path, along the transfer path;
Imaging means for imaging the electronic component transferred to the second position downstream in the transfer direction from the first position on the transfer path by the transfer of the carrier tape;
A defect detecting means for detecting a defect of the electronic component from an imaging result by the imaging means;
Removing means for removing the electronic component in which a defect has been detected from within the housing portion of the carrier tape , and
At least a part of the mechanism of the imaging unit is located at the second position during imaging of the electronic component, and retracts from the second position when a defect of the electronic component is detected,
It said removal means electronic component inspection apparatus characterized that you move to the second position from the standby position when the electronic component failure is detected. An electronic component housing method for housing an electronic component in a carrier tape in which a plurality of housing portions are arranged in the longitudinal direction and transporting it on a transport path,
Accommodating an electronic component in the carrier tape accommodating portion at a first position on the transfer path; and
Transferring to a second position downstream of the first position on the transfer path by a transfer of the carrier tape; and
Imaging the electronic component transferred to the second position by an imaging means in which at least a part of the mechanism is located at the second position ;
Detecting a defect of the electronic component from an imaging result;
At least a part of the mechanism of the imaging unit is retracted from the second position , a removing unit is positioned from the standby position to the second position, and the electronic component in which a defect is detected is placed in the housing portion of the carrier tape. Removing from
An electronic component housing method comprising the steps of: A step of transporting the carrier tape in a direction opposite to the transport direction, positioning the housing portion from which the electronic component has been removed at the first position, and housing a new electronic component in the housing portion; The electronic component housing method according to claim 6, further comprising :

Images