JP2004132861A - Wiring test machine, wiring test method and wiring test system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring test machine, wiring test method and wiring test system which are for conducting electric inspection of products with a large variety and small quantity, high fineness and low price, at low running cost and quick inspection speed. <P>SOLUTION: The wiring test machine 300 is constituted of a first test stage 100 for testing open/short by using conductive rubber, a second test stage 200 for testing open/short by using a flying probe, a transfer means 30 for routing, and a measuring apparatus 50. The wiring test system is constituted of a test object casting means 60, a marker reading means 70, a wiring test machine 300, a test result printing means 80, a test object receiving means 90 and a control station 400. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a wiring inspection machine used for electrical inspection of printed wiring boards and various semiconductor package substrates.
[0002]
[Prior art]
Wiring inspection machines used for electrical inspection of printed wiring boards and various semiconductor package substrates are equipped with an inspection jig typified by an inspection jig using a spring probe, and an inspection called a flying prober. Some do not have a jig.
[0003]
The wiring inspection machine equipped with the inspection jig has the advantages of high inspection speed and high reliability of the inspection result, but has a high cost (running cost) for manufacturing the inspection jig and a minimum pitch between probes of about 120 μm. There is a disadvantage that it can only be handled up to
[0004]
A flying prober without an inspection jig has the advantages of low running costs and a sufficient minimum probe pitch of 120 μm or less, but the inspection speed is slow and the reliability of the inspection results is high. There is a disadvantage that it is slightly lower than a line inspection machine.
[0005]
One trend of current printed wiring boards and substrates for various semiconductor packages is to reduce the number of products of various types, to increase the definition, and to reduce the cost.
[0006]
When inspecting such a product, it is a major problem that a wiring inspection machine equipped with an inspection jig has a high running cost, and a flying prober has a low inspection speed.
[0007]
FIG. 4 shows a conventional standard inspection method in which an inspection object 40 having a single-sided BGA (ball grid array) and a single-sided FC (flip chip) is subjected to an electrical inspection using a wiring inspection machine having an inspection jig. It is. Reference numeral 40 denotes an object to be inspected, reference numeral 42 denotes an FC pad, reference numeral 43 denotes a BGA pad, reference numeral 10b denotes an FC-side inspection jig, reference numeral 12 denotes an FC-side inspection jig inspection probe, reference numeral 10a denotes a BGA-side inspection jig, and reference numeral 11 denotes a BGA-side inspection jig. Inspection probe.
[0008]
Normally, the BGA pads 43 have a pad diameter of 0.2 to 0.3 mmφ and a pad pitch of 0.5 to 1.0 mm and are arranged in a lattice. The number of pads is about 500 to 1,000, and the cost required to manufacture the BGA side inspection jig 10a is about 200,000 to 800,000 yen. is there.
[0009]
The FC pads 42 have a pad diameter of 0.1 to 0.15 mmφ and a pad pitch of 0.15 to 0.25 mm, and are arranged in a grid like the BGA pads 43. The number is about 1,000 to 2,000, and the cost for manufacturing the FC side inspection jig 10b is very expensive, about 1.5 to 6 million yen. It is practically impossible to do.
[0010]
The flying prober does not require an inspection jig, so the running cost is very low, but the inspection speed is slow, except when the number of production is extremely small such as several hundred pieces per time, It is not possible to perform an inspection with a flying prober alone.
[0011]
[Problems to be solved by the invention]
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems in a wiring inspection machine for inspecting electrical defects of wiring of a printed wiring board and various semiconductor package substrates (TAB, BGA, CSP, etc.). An object of the present invention is to provide a wiring inspection machine, a wiring inspection method, and a wiring inspection system for performing electrical inspection of a small quantity, high definition, and low-cost product at a low running cost and a high inspection speed.
[0012]
[Means for Solving the Problems]
In order to solve the above-mentioned problems in the present invention, first, in claim 1, there is provided a wiring inspection machine for inspecting electrical defects of wiring of a printed wiring board and various semiconductor package substrates (BGA, CSP, TAB, etc.). In addition, the present invention provides a wiring inspection machine including a first inspection stage 100 for inspecting open / short using conductive rubber and a second inspection stage 200 using a flying prober.
[0013]
According to a second aspect of the present invention, there is provided the wiring inspection apparatus according to the first aspect, wherein a relay conveyance unit 30 is provided between the first inspection stage 100 and the second inspection stage 200. Things.
[0014]
According to a third aspect of the present invention, the first inspection stage 100 inspects open / short using conductive rubber, and the second inspection stage 200 inspects open / short using a flying prober. This is the wiring inspection method.
[0015]
Still further, in claim 4, it is provided that at least the inspection object input means 60, the marker reading means 70, the wiring inspection machine 300, the inspection result printing means 80, the inspection object receiving means 90, and the management station 400 are provided. This is a featured wiring inspection system.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a configuration diagram showing one embodiment of a wiring inspection machine and a wiring inspection system of the present invention.
The wiring inspection machine 300 according to claims 1 and 2 includes a first inspection stage 100 for inspecting open and short using a conductive rubber, a second inspection stage 200 for inspecting open and short using a flying prober, A relay transport unit 30 and a measuring device 50 are provided between the first inspection stage 100 and the second inspection stage 200.
The relay conveying means 30 is for adjusting the inspection speed between the first inspection stage 100 and the second inspection stage 200, and is adjusted by moving the dancer roll 31 up and down.
The measuring device 50 reads data measured by the first inspection stage 100 and the second inspection stage 200, and the measurement data is sent to a management station 400 described later.
[0017]
A method for inspecting the inspection object 40 with the wiring inspection machine 300 will be described together with the wiring inspection method according to claim 3.
FIGS. 2A to 2C show an example of an inspection method for inspecting whether or not the inspection object 40 is open or short using the conductive rubber 20 in the first inspection stage 100.
An FC pad 42 is formed on one surface of the device under test 40 and a BGA pad 43 is formed on the other surface using the conductive rubber 20 and the BGA-side inspection jig 10 a having the inspection probe 11. This is an example of inspecting the device under test 40 to which the pad 43 is connected by the wiring 44, and (a) shows a state before the inspection. As shown in (b), the conductive rubber 20 is brought into contact with the FC pad 42 to perform a continuity test, and then, as shown in (c), the conductive rubber 20 is separated from the FC pad 42 and an insulation test is performed.
[0018]
3A to 3C show the types of wiring of the device under test 40. FIG. 3A shows the device under test 40 in which the FC pad 42 and the BGA pad 43 are connected by the wiring 44. FIG. 3 (b) shows the test object 40a which once enters the inner layer from one BGA pad 43 and is connected to another BGA pad 43 by the wiring 44a, and FIG. 3 (c) shows the test object 40a from one FC pad 42 to the outer layer. The test object 40b connected to another FC pad 42 by a wiring 44b is shown in FIG. 1, and the test object 40 and the test object 40a are connected to each other using a conductive rubber in the first test stage 100 and are connected to each other. An insulation test is performed. The continuity and insulation inspection of the wiring of the device under test 40b are performed at the second inspection stage 200 using a flying prober.
[0019]
The wiring inspection system according to the fourth aspect includes an inspection object input unit 60, a marker reading unit 70, a wiring inspection machine 300, an inspection result printing unit 80, an inspection object receiving unit 90, and a management station 400. (See FIG. 1).
The appearance inspection of the inspection object 40 is performed by the pattern inspection machine 61 in the previous process, and the quality of the inspection is marked at a predetermined position of the inspection object, wound up in a roll shape, and set on the inspection object input means 60. You. Further, the inspection object 40 sent out from the inspection object input means 60 is read by the marker reading means 70 to determine whether or not the appearance inspection is good, and the inspection object 40 having a good appearance inspection is determined by the first inspection stage 100 and the second inspection stage 200. A predetermined open / short wiring inspection is carried out at, the quality of the wiring inspection result is printed by the inspection result printing means 80 (ink jet printing device or the like), and the inspection object receiving means 90 forms a roll. It is wound up.
[0020]
The management station 400 prepares inspection data of the pattern inspection machine 61, the first inspection stage 100, and the second inspection stage 200 in the preceding process according to the type of wiring from the CAD data, and inspects the BGA side of the first inspection stage 100 for inspection. The drive / position control and inspection control of the tool and the probe of the second inspection stage 200 are performed.
Further, the inspection data of the first inspection stage 100 and the second inspection stage 200 is taken into the management station 400 from the measuring device 50, and the pass / fail judgment is performed. Is printed at a predetermined position.
[0021]
【The invention's effect】
In the wiring inspection machine and the wiring inspection system according to the present invention, the control for the inspection data creation and management is performed mainly by the management station, the first inspection stage having a high inspection speed including the pattern inspection in the previous process, and the running cost. By performing the wiring inspection at the second inspection stage having a lower wiring level and allocating the wiring inspection according to the type of wiring, the wiring inspection can be performed at an efficient wiring inspection speed and low running cost as a whole.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing one embodiment of a wiring inspection machine and a wiring inspection system of the present invention.
FIGS. 2A to 2C are explanatory diagrams illustrating an example of an inspection method in a first inspection stage.
FIGS. 3A to 3C are explanatory diagrams showing types of wiring of a device under test.
FIG. 4 is a configuration diagram showing an example of a conventional wiring inspection machine using an inspection jig.
[Explanation of symbols]
10a BGA-side inspection jig 10b FC-side inspection jig 11, 12 Inspection probe 20 Conductive rubber 30 Relay carrier 31 Dancer roll 40, 40a, 40b Inspection object 42 FC pad 43 BGA Pad 44 Wiring 50 Measurement device 60 Inspection object input means 61 Pattern inspection machine 70 Marker reading means 80 Inspection result printing means 90 Inspection object receiving means 100 First inspection stage 200 Second inspection stage 300 Wiring inspection machine 400 Management station

Claims (4)

This is a wiring inspection machine for inspecting electrical failure of wiring of printed wiring boards and various semiconductor package substrates (BGA, CSP, TAB, etc.), and a first inspection stage (inspection of open and short using conductive rubber) 100) and a second inspection stage (200) using a flying prober. 2. The wiring inspection machine according to claim 1, wherein a relay conveyance unit (30) is provided between the first inspection stage (100) and the second inspection stage (200). 3. A wiring inspection method, wherein the first inspection stage (100) inspects open / short using a conductive rubber, and the second inspection stage (200) inspects open / short using a flying prober. . At least an inspection object input means (60), a marker reading means (70), a wiring inspection machine (300), an inspection result printing means (80), an inspection object receiving means (90), and a management station (400) are provided. Wiring inspection system characterized by the following.

Images