KR20090092935A - Bonding method of probe - Google Patents

Abstract

A bonding method of a probe is provided to utilize data for the bonding process by separately managing data for the unusual condition of probe and probe. The probe(100) is formed with the vertical type or the cantilever type. The probe pad(210) is formed in the substrate(200). The circuit pattern and probe are mounted to the probe pad. The substrate is a space transformer of the multilayer ceramic substrate. The conductivity powder is coated on the probe pad. The probe is arranged on the probe pad to be bonded to the pad.

Description

Probe bonding method {BONDING METHOD OF PROBE}

The present invention relates to a probe bonding method, and more particularly, to a probe bonding method for bonding a probe to a substrate.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

Between the fabrication process and the assembly process, an inspection process is performed in which an electrical signal is applied to the contact pads formed on the wafer to inspect the electrical properties of the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

In recent years, as the demand for high integrated chips increases, circuit patterns formed on the wafer by the fabrication process and contact pads connected with the circuit patterns are highly integrated. That is, the spacing between neighboring contact pads is very narrow, and the size of the contact pad itself is also finely formed. As a result, since the probe of the probe card used in the inspection process must be in contact with the contact pad, the distance between neighboring probes corresponding to the contact pad must be formed very narrowly, and the size of the probe itself must also be finely formed.

Hereinafter, a method of manufacturing a conventional probe card will be described with reference to FIGS. 1 to 3.

1 to 3 are diagrams for explaining a conventional method of manufacturing a probe card.

First, as shown in FIG. 1, an opening 11 is formed in a sacrificial substrate 10 using photolithography technology, and a probe 20 is formed by filling a conductive material in the opening 11.

Next, as shown in FIG. 2, the probe 20 formed on the sacrificial substrate 10 is bonded to the probe pad 31 formed on the substrate 30.

Next, as shown in FIG. 3, the probe card is completed by separating the sacrificial substrate 10 from the probe 20.

Since the conventional method of manufacturing a probe card as described above uses a photolithography technique used to form a pattern of a semiconductor, the size of the probe 20 itself can be finely formed, and the spacing between neighboring probes 20 is very large. The printed circuit board 30 can be narrowly formed.

However, according to the conventional method of manufacturing a probe card, the plurality of probes 20 formed on the sacrificial substrate 10 are collectively bonded to the substrate 30, and thus, among the plurality of probes 20 formed on the sacrificial substrate 10. Even when some of the probes 20 are abnormal, there is a problem that the abnormal probe is bonded to the substrate 30 as it is. As a result, the inconvenience of having to replace the probe 20 having an abnormality with the probe 20 having no abnormality by an additional process. This increases the manufacturing period and manufacturing cost.

In addition, since the plurality of probes 20 are collectively bonded to the probe pads 31 formed on the substrate 30, a defect may occur in which some probes 20 are not aligned correctly on the probe pads 31. In this case, after bonding the plurality of probes 20 to the substrate 30, the alignment state of the plurality of probes 20 is inspected by an additional process to remove the probes 20 when the alignment state is poor. The problem arises in that the alignment must be correctly bonded again.

In addition, since the state of the probe pad 31 formed in the board | substrate 30 is not examined separately in the conventional method, when the some probe pad 31 formed in the board | substrate 30 has an abnormality, this probe pad 31 is carried out. If the probe 20 is bonded to each other, there is a problem that a defect occurs in which an electric signal is not energized.

In addition, in the conventional method, since data related to the abnormal state of the probe 20 and the probe pad 31 are not separately managed and utilized, it is difficult to identify the cause of the abnormality and reduce the number of abnormalities.

One embodiment of the present invention is to solve the above-described problems, a probe that can improve the reliability of the bonding process to verify the bonding state and the state of the probe and the probe pad when bonding the probe to the substrate It is an object to provide a bonding method.

Further, an object of the present invention is to provide a probe bonding method in which only a defective probe can be replaced when a defect occurs in the probe when the probe is bonded to a substrate.

In addition, another object of the present invention is to provide a probe bonding method that can be used in a process of bonding data by separately managing data regarding abnormal states of a probe and a probe pad.

As a technical means for achieving the above technical problem, the first aspect of the present invention is a method for bonding a probe to a substrate, (a) providing a probe, (b) a probe pad is formed on the surface Preparing the substrate; (c) inspecting the state of the probe; (d) aligning the probe on the probe pad; and (e) bonding the probe on the probe pad. It provides a probe bonding method.

The step (c) may include determining whether there is an abnormality of the probe, and moving the probe to a predetermined place when it is determined that there is an abnormality in the probe.

The step (c) may further comprise the step of storing the probe data on the presence or absence of the probe.

The method may further include checking a state of the probe pad.

The checking of the state of the probe pad may include determining an abnormality of the probe pad and moving the substrate to a predetermined place when it is determined that the probe pad has an abnormality.

The checking of the state of the probe pad may further include storing substrate data regarding whether the probe pad is abnormal.

The step (e) may be performed using a laser or heat.

In addition, a second aspect of the present invention provides a method of bonding a probe to a substrate, the method comprising the steps of: (a) providing a probe, (b) providing a substrate having a probe pad formed on a surface thereof, (c) Inspecting the state of the probe pad, (d) aligning the probe on the probe pad, and (e) bonding the probe on the probe pad.

The step (c) may include determining an abnormality of the probe pad, and moving the substrate to a predetermined place when it is determined that there is an abnormality in the probe pad.

The step (c) may further comprise the step of storing the substrate data relating to the abnormality of the probe pad.

Step (e) may be performed using a laser or heat.

Further, a third aspect of the present invention provides a method of bonding the probe to the substrate in the manufacture of a probe card having a substrate and a probe for inspecting a semiconductor die, the method comprising: (a) providing a plurality of probes; (C) inspecting a state of the plurality of probes, (d) arranging the plurality of probes on the plurality of probe pads; And (e) bonding the plurality of probes onto the plurality of probe pads.

At least one of the steps (c), (d) and (e) may be performed by one process.

The plurality of probes may be equal to the number of contact pads on each of the semiconductor dies.

Step (c) is a step of determining whether there is an abnormality of at least one probe of the plurality of probes, and if it is determined that the at least one probe is abnormal, moving the at least one probe to a predetermined place It may include.

The step (c) may further comprise the step of storing the probe data on the presence or absence of the probe.

The method may further include checking a state of the plurality of probe pads.

The checking of the state of the plurality of probe pads may include determining whether at least one probe pad is abnormal among the plurality of probe pads, and when it is determined that the at least one probe pad has an abnormality, the substrate may be read. The method may include moving to a set place.

The checking of the state of the plurality of probe pads may further include storing substrate data regarding abnormality of the probe pads.

The step (e) may be performed using a laser or heat.

According to one of the problem solving means of the present invention described above, by bonding the probe to the substrate by inspecting the alignment state of the probe and the state of the probe and the probe pad, there is an effect of improving the reliability of the bonding process.

In addition, if a defect occurs in the probe when the probe is bonded to the substrate, only the probe in which the defect occurs may be replaced.

In addition, there is an effect that can be used in the process of bonding the data by separately managing the data on the abnormal state of the probe and the probe pad.

1 to 3 are views for explaining a conventional method of manufacturing a probe card,

4 is a flowchart illustrating a procedure of a probe bonding method according to a first embodiment of the present invention.

5 is a perspective view showing a probe and a substrate manufactured according to the probe bonding method according to the first embodiment of the present invention,

6 is a flowchart illustrating a procedure of inspecting a state of a probe pad in the probe bonding method according to the first embodiment of the present invention.

7 is a flowchart illustrating a procedure of checking a probe state in the probe bonding method according to the first embodiment of the present invention.

8 is a view for explaining a method of aligning and bonding a probe to a substrate in the probe bonding method according to the first embodiment of the present invention.

9 is a flowchart illustrating a procedure of a probe bonding method according to a second embodiment of the present invention.

10 is a flowchart illustrating a procedure of inspecting a state of a probe pad in a probe bonding method according to a second exemplary embodiment of the present invention.

11 is a flowchart illustrating a procedure of checking a probe state in a probe bonding method according to a second embodiment of the present invention.

12 is a view for explaining a method of aligning and bonding a probe to a substrate in the probe bonding method according to the second embodiment of the present invention.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a part is located "on" with another part, this includes not only when a part is in contact with another part, but also when there is another part between the two parts. In addition, when a part is said to "include" a certain component, which means that it may further include other components, except to exclude other components unless otherwise stated.

Hereinafter, a probe bonding method according to a first embodiment of the present invention will be described with reference to FIGS. 4 to 8.

4 is a flowchart illustrating a procedure of a probe bonding method according to a first embodiment of the present invention, FIG. 5 is a perspective view illustrating a probe and a substrate manufactured according to the probe bonding method according to the first embodiment of the present invention. 6 is a flowchart illustrating a procedure of inspecting a state of a probe pad in a probe bonding method according to a first embodiment of the present invention, and FIG. 7 is a sequence of inspecting a probe state in a probe bonding method according to a first embodiment of the present invention. 8 is a flowchart illustrating a method of aligning and bonding a probe to a substrate in the probe bonding method according to the first embodiment of the present invention.

First, as shown in FIGS. 4 and 5, the probe 100 is provided (S110).

The probe 100 may be manufactured finely using photolithography technology, or the like, or may be manufactured on a sacrificial substrate or by etching the conductive material itself. For example, the probe 100 may be formed in a vertical type or a cantilever type.

Next, a substrate 200 on which the probe pad 210 is formed is prepared (S120).

Probe pads 210 on which the circuit pattern and the probe 100 may be mounted are formed on the substrate 200.

In addition, the substrate 200 may be an insulating substrate made of ceramic or the like. For example, the substrate 200 may be a printed circuit board (PCB) or a multi-layer ceramic substrate (MLC) as a space transformer.

Next, as shown in FIG. 6, the state of the probe pad 210 is inspected (S130).

First, it is determined whether the probe pad 210 is abnormal (S131). The probe pad 210 formed on the surface of the substrate 200 is photographed to compare the photographed probe pad 210 with a probe pad having a predetermined standard to determine whether the probe pad 210 is abnormal. For example, it is determined whether the surface of the probe pad 210 is severely oxidized or the alignment state of the probe pad 210 is correct.

When it is determined that there is an abnormality in the probe pad 210, the substrate 200 is moved to a predetermined place (S132).

When it is determined that there is no abnormality in the probe pad 210, the substrate 200 is prepared (S133). Here, the preparation of the substrate 200 refers to using the substrate 200 on which the probe pad 210 is formed in the next process.

Next, the substrate data regarding the abnormality of the probe pad 210 is stored in a predetermined database (S134). The substrate data stored in the database may be used to prepare statistics such as a defective state or the number of times of the substrate 200 according to the supply of the substrate 200.

As described above, the abnormality determination of the probe pad 210 may be performed using a robot or the like in which a program related to the abnormality determination of the probe pad 210 is stored.

Next, as shown in FIG. 7, the state of the probe 100 is inspected (S140).

First, it is determined whether or not the probe 100 is abnormal (S141). The probe 100 may be photographed to compare the photographed probe 100 with a preset standard probe to determine whether the probe 100 is abnormal. For example, it is determined whether a crack has occurred in the probe 100 itself or if the surface of the probe 100 is severely oxidized.

If it is determined that there is an abnormality in the probe 100, the probe 100 is moved to a predetermined place (S142).

When it is determined that there is no abnormality in the probe 100, the probe 100 is prepared (S143). Here, the preparation of the probe 100 refers to the use of the probe 100 in the next process.

Next, probe data regarding the abnormality of the probe 100 is stored in a predetermined database (S144). The probe data stored in the database may be used to prepare statistics such as a defective state or the number of times of the probe 100 according to the supply of the probe 100.

As described above, the abnormality determination of the probe 100 may be performed using a robot or the like in which a program related to the abnormality determination of the probe 100 is stored.

Next, as shown in FIG. 8, the probe 100 is aligned on the probe pad 210 (S150).

Each probe 100 is sequentially aligned on the probe pad 210. When aligning the probe 100, the tip portion of the probe 100 that aligns with the tip portion of the neighboring probe 100 is aligned on the alignment line A. When the probe 100 is aligned on the probe pad 210, since the distance between neighboring probes is very narrow, it is preferable to use a robot or the like in which a program related to the alignment of the probe 100 is stored.

In addition, before the probe 100 is aligned on the probe pad 210, it is preferable to apply conductive powder on the probe pad 210 to perform bonding of the probe 100 and the probe pad 210. desirable.

Next, the probe 100 is bonded on the probe pad 210 (S160).

The probe 100 in contact with the probe pad 210 is bonded to the probe pad 210 using a laser or the like.

In addition, when the conductive powder is coated on the probe pad 210, the conductive powder may be melted by applying heat to bond the probe 100 to the probe pad 210.

Since the probe 100 and the probe pad 210 manufactured using the photolithography technique are very fine, a program related to the bonding of the probe 100 and the probe pad 210 is stored and a bonding tool such as a laser irradiation apparatus. It is preferable to use a robot or the like having a.

In addition, after bonding the probe 100 to the probe pad 210, it is preferable to check the alignment of the neighboring probe (100).

By the above method, the probe used for a probe card can be bonded to a board | substrate.

As described above, the state of the probe 100 itself, the state of the probe pad 210 itself, and the alignment state between neighboring probes 100 may be checked when the probe 100 is bonded to the probe pad 210. This improves the reliability of the process of bonding the probe 100 to the substrate 200.

In addition, since the probe data regarding the state of the probe 100 and the substrate data regarding the state of the probe pad 210 formed on the surface of the substrate 200 can be stored in the database, the probe 100 and the substrate 200 will be stored later. Statistics of the defective state of the supply yield of the can be prepared and utilized in the manufacturing process.

In addition, when a defect occurs in the probe 100 during a manufacturing process or an inspection process, the probe 100 having the defect is separated from the substrate 200, and then a new probe 100 is attached to the position to detect the defect. Only 100 can be replaced.

In addition, since each probe 100 is bonded to the substrate 200, the probe 100 may be bonded to the substrate 200 regardless of the size of the substrate 200. That is, the size of the wafer and the number of contact pads in contact with the probe 100 may be elastically corresponding.

Hereinafter, a probe bonding method according to a second exemplary embodiment of the present invention will be described with reference to FIGS. 9 and 12.

9 is a flowchart illustrating a procedure of a probe bonding method according to a second embodiment of the present invention, and FIG. 10 is a flowchart illustrating a procedure of inspecting a state of a probe pad in a probe bonding method according to a second embodiment of the present invention. 11 is a flowchart illustrating a procedure of inspecting probe states in a probe bonding method according to a second embodiment of the present invention, and FIG. 12 illustrates alignment of probes to a substrate in a probe bonding method according to a second embodiment of the present invention. It is a figure for demonstrating the bonding method.

Hereinafter, only the characteristic parts distinguished from the first embodiment will be described and described, and the description thereof will be omitted according to the first embodiment. In addition, in the second embodiment of the present invention, for the convenience of description, the same components will be described using the same reference numerals.

First, as shown in FIG. 9, a plurality of probes 100 are provided (S210).

The probe 100 may be finely manufactured by using a photolithography technique, or may be manufactured on a sacrificial substrate, or a plurality of probes 100 may be manufactured by a single process by etching the conductive material itself. The number of probes 100 may be equal to the number of contact pads formed on each of the semiconductor dies in contact with the probes 100 in the inspection process using the probe card.

Next, a substrate 200 on which a plurality of probe pads 210 are formed is prepared (S220).

A plurality of probe pads 210 on which the circuit pattern and the plurality of probes 100 are mounted may be formed on the substrate 200.

The number of probe pads 210 may be equal to the number of contact pads formed on each of the semiconductor die contacting the probe 100 in the inspection process using the probe card.

Next, as shown in FIG. 10, the state of the plurality of probe pads 210 is inspected (S230).

First, it is determined whether the plurality of probe pads 210 are abnormal (S231). A plurality of probe pads 210 formed on the surface of the substrate 200 are photographed to compare a plurality of photographed probe pads 210 with probe pads of a predetermined standard to check whether the plurality of probe pads 210 is abnormal. do. In the process of inspecting a state of the plurality of probe pads 210, the entire substrate 200 may be captured at a time to inspect the plurality of probe pads 210 at once.

If it is determined that at least one of the plurality of probe pads 210 is abnormal, the substrate 200 is moved to a predetermined place (S232).

When it is determined that there are no abnormalities in the plurality of probe pads 210, the substrate 200 is prepared (S233). Here, the preparation of the substrate 200 refers to the use of the substrate 200 on which the plurality of probe pads 210 is formed in the next process.

Next, the substrate data regarding the abnormality of the probe pad 210 is stored in a predetermined database (S234).

As described above, the abnormality determination of the plurality of probe pads 210 may be performed using a robot or the like in which a program related to the abnormality determination of the plurality of probe pads 210 is stored.

Next, as shown in FIG. 11, the state of the plurality of probes 100 is inspected (S240).

First, it is determined whether the plurality of probes 100 are abnormal (S241). The plurality of probes 100 are photographed to compare the photographed probes 100 with a preset standard probe to determine whether the plurality of probes 100 is abnormal. In the process of inspecting the states of the plurality of probes 100, the plurality of probes 100 may be inspected at once by capturing the entirety of the plurality of probes 100 at a time.

If it is determined that at least one of the plurality of probes 100 is abnormal, the at least one probe 100 having the abnormality is moved to a predetermined place, and the new probe 100 having no abnormality is moved to the position ( S242).

When it is determined that there are no abnormalities in the plurality of probes 100, the plurality of probes 100 are prepared (S243). Here, the preparation of the plurality of probes 100 refers to the use of the plurality of probes 100 in the next process, and also a jig in which a plurality of openings in which the plurality of probes 100 can be located are formed. It can be said to be located in the robot or the like is provided.

Next, probe data relating to the abnormality of the probe 100 is stored in a predetermined database (S244).

As described above, the abnormality determination of the plurality of probes 100 may be performed using a robot or the like in which a program related to the abnormality determination of the plurality of probes 100 is stored.

Next, as shown in FIG. 12, the plurality of probes 100 are aligned on the plurality of probe pads 210 (S250).

The plurality of probes 100 are aligned on the plurality of probe pads 210 through one process. When aligning the plurality of probes 100, a jig having a plurality of openings in which the plurality of probes 100 can be positioned is provided, and a robot in which a program related to the alignment of the plurality of probes 100 is stored. It is preferable to use.

In addition, before the plurality of probes 100 are aligned on the plurality of probe pads 210, conductive powders capable of bonding the probes 100 and the probe pads 210 may be provided with a plurality of probe pads 210. It is preferable to apply on).

Next, the plurality of probes 100 are bonded to the plurality of probe pads 210 (S260).

The plurality of probes 100 contacting the plurality of probe pads 210 are bonded to the plurality of probe pads 210 using a laser or the like. The process of bonding the plurality of probes 100 to the plurality of probe pads 210 may be performed through one process.

In addition, when the conductive powder is coated on the plurality of probe pads 210, the conductive powders disposed between the plurality of probes 100 and the plurality of probe pads 210 are melted by applying heat to the plurality of probes 100 and The plurality of probe pads 210 may be bonded to each other.

Since the plurality of probes 100 and the plurality of probe pads 210 manufactured using photolithography techniques are very fine, programs related to bonding of the plurality of probes 100 and the plurality of probe pads 210 may be stored. It is preferable to use a robot having a bonding tool such as a plurality of laser irradiation apparatuses.

In addition, after bonding the plurality of probes 100 to the plurality of probe pads 210, it is preferable to check the alignment of the neighboring probes 100.

By the above method, the probe used for a probe card can be bonded to a board | substrate.

As described above, the probe bonding method according to the second exemplary embodiment of the present invention may be performed in a single process using a plurality of probes 100, a plurality of probe pads 210, and a plurality of probes 100. One or more of the alignment and bonding the plurality of probes 100 to the plurality of probe pads 210 may be performed, thereby reducing manufacturing time and reducing manufacturing costs.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

Claims (20)

In the method of bonding the probe to the substrate, (a) preparing a probe, (b) providing a substrate having a probe pad formed on a surface thereof, (c) examining the state of the probe, (d) aligning the probe on the probe pad, and (e) bonding the probe on the probe pad Probe bonding method comprising a. The method of claim 1, Step (c) is, Determining the abnormality of the probe and If it is determined that the probe has an abnormality, moving the probe to a preset location Probe bonding method comprising a. The method of claim 2, Step (c) is, Probe bonding method further comprising the step of storing the probe data on the presence or absence of the probe. The method of claim 1, And inspecting a state of the probe pad. The method of claim 4, wherein Examining the state of the probe pad, Determining an abnormality of the probe pad; and If it is determined that the probe pad has an abnormality, moving the substrate to a preset location Probe bonding method comprising a. The method of claim 5, wherein Examining the state of the probe pad, And storing substrate data relating to abnormality of the probe pad. The method of claim 1, In step (e), A probe bonding method performed by using a laser or heat. In the method of bonding the probe to the substrate, (a) preparing a probe, (b) providing a substrate having a probe pad formed on a surface thereof, (c) inspecting a state of the probe pad; (d) aligning the probe on the probe pad, and (e) bonding the probe on the probe pad Probe bonding method comprising a. The method of claim 8, Step (c) is, Determining an abnormality of the probe pad; and If it is determined that the probe pad has an abnormality, moving the substrate to a preset location Probe bonding method comprising a. The method of claim 9, Step (c) is, And storing substrate data relating to abnormality of the probe pad. The method of claim 8, In step (e), A probe bonding method performed by using a laser or heat. In the manufacture of a probe card having a substrate and a probe and inspecting a semiconductor die, the method of bonding the probe to the substrate, (a) preparing a plurality of probes, (b) providing a substrate having a plurality of probe pads formed on a surface thereof, (c) inspecting a state of the plurality of probes, (d) aligning the plurality of probes on the plurality of probe pads; and (e) bonding the plurality of probes on the plurality of probe pads Probe bonding method comprising a. The method of claim 12, At least one of the steps (c), (d) and (e), A probe bonding method that is performed due to one process. The method of claim 12, Wherein the plurality of probes is equal to the number of contact pads on each of the semiconductor dies. The method of claim 12, Step (c) is, Determining whether at least one probe is abnormal among the plurality of probes; and If it is determined that the at least one probe is abnormal, moving the at least one probe to a preset location. Probe bonding method comprising a. The method of claim 15, Step (c) is, Probe bonding method further comprising the step of storing the probe data on the presence or absence of the probe. The method of claim 12, And inspecting a state of the plurality of probe pads. The method of claim 17, Examining the state of the plurality of probe pads, Determining an abnormality of at least one probe pad among the plurality of probe pads; and Moving the substrate to a predetermined place when it is determined that the at least one probe pad is abnormal. Probe bonding method comprising a. The method of claim 18, Examining the state of the plurality of probe pads, And storing substrate data relating to abnormality of the probe pad. The method of claim 12, In step (e), A probe bonding method performed by using a laser or heat.