TWI593970B - Testing device - Google Patents

Description

Test Fixture

This disclosure relates to test fixtures. More specifically, the present disclosure relates to test fixtures comprising a flexible substrate.

In a semiconductor process, when a semiconductor component (eg, a semiconductor package) is manufactured, it is usually tested to avoid shipping bad products to the customer. In a conventional manner, the workpiece to be tested is in contact with a conventional test fixture for testing. The conventional test fixture includes a support, a plurality of probes, and an electrode region. The first side (upper side) of the support has a plurality of first through holes, and the second side (lower side) thereof has a plurality of second through holes. The probes are bendable and elastic and are located within the support. Each probe has a first end (upper end) and a second end (lower side), and the first end of the probe can pass through the first through hole of the support body to extend the first of the support body Outside the side, the second end of the probe can extend beyond the second side of the support through the second through hole of the support. The electrode region is adjacent to the second side of the support and has a plurality of electrodes (metal pads) for contacting the second ends of the probes. The electrodes are electrically connected to a tester.

The conventional test method is as follows. First, a workpiece to be tested is provided, wherein the workpiece to be tested has a plurality of pads to be tested. Next, the workpiece to be tested is moved toward the first side of the test fixture (ie, moved downward) such that the waiting test pads contact the first ends of the probes. Then, the workpiece to be tested is moved down slightly to make the workpiece to be tested A pressure is applied to the probe, at which point the second ends of the probes move slightly downward to closely contact the corresponding electrodes of the electrode region and are tested. At this time, the body of each probe may be deformed to have an elastic force. After the test is completed, the workpiece to be tested is removed, and the probes are restored to their original shape. At this time, the second ends of the probes move slightly upward without closely contacting the electrodes or even contacting the electrodes. .

The disadvantages of the above conventional test methods are as follows. First, the electrodes (metal pads) of the electrode region are subjected to a forward pressure by the second end of the probes, so that depressions are easily generated, resulting in poor contact and increased contact resistance. Such depressions are not easy to detect and repair in time during the test, which is easy to cause misjudgment of good products. That is, direct pressurization of the probe onto the electrode results in rapid electrode loss. Second, the probes were made using conventional turning. When the size of the to-be-tested pad of the workpiece to be tested is smaller, the required probe diameter must also be relatively smaller. However, the traditional turning method has a large tolerance, and the small-size processing is limited by the capacity of the machine, the yield is poor, and the production cost is high. Third, the distribution design (or arrangement pattern) of the electrodes of the electrode region must be completely corresponding to the waiting test pad of the workpiece to be tested. That is, the distribution design of the electrodes of the electrode region is dedicated, and it is only applicable to the workpiece to be tested of a specific model. When the mass production cycle of the workpiece to be tested is finished, the conventional test fixture can no longer be used for other models. The workpiece to be tested.

Therefore, it is necessary to provide an improved test fixture to solve the above problems.

One aspect of the disclosure relates to a test fixture comprising a base and a flexible substrate. The flexible substrate has a first portion, a second portion, a plurality of test probes, and a plurality of test contacts, wherein the test probes are electrically connected to the test contacts, and the test probes are located The first portion of the flexible substrate is located above the pedestal, and the test contacts are located at a second portion of the flexible substrate and below the pedestal.

1‧‧‧Test fixture

1a‧‧‧Test fixture

1b‧‧‧Test fixture

1c‧‧‧Test fixture

1d‧‧‧Test fixture

2‧‧‧buffer structure

2d‧‧‧buffer structure

10‧‧‧ Pedestal

14‧‧‧Flexible substrate

14a‧‧‧Flexible substrate

14b‧‧‧Flexible substrate

14c‧‧‧Flexible substrate

14d‧‧‧Flexible substrate

14e‧‧‧Flexible substrate

20‧‧‧ screws

21‧‧‧Flexible structure

21b‧‧‧Flexible structure

22‧‧‧electrode bearing body

23‧‧‧ socket

23d‧‧‧ socket

24‧‧‧ electrodes

25‧‧ Air Room

30‧‧‧Workpieces to be tested

32‧‧‧ core layer

34‧‧‧First conductive layer

36‧‧‧Second conductive layer

38‧‧‧ conductive path

40‧‧‧First metal layer

42‧‧‧through holes

44‧‧‧Electroplated metal layer

46‧‧‧First carrier

48‧‧‧First photoresist layer

50‧‧‧second carrier

52‧‧‧Adhesive layer

54‧‧‧second photoresist layer

56‧‧‧Second metal layer

58‧‧‧ Third photoresist layer

60‧‧‧fourth photoresist layer

101‧‧‧The first surface of the pedestal

102‧‧‧Second surface of the pedestal

103‧‧‧through groove

104‧‧‧Fixed holes

105‧‧‧Central Department

141‧‧‧The first surface of the flexible substrate

142‧‧‧The second surface of the flexible substrate

143‧‧‧Part 1

144‧‧‧Part II

145‧‧‧Test probe

146‧‧‧Test contacts

147‧‧‧Part III

148‧‧‧ conductive traces

149‧‧‧Indirect pad

211‧‧‧Upper board

212‧‧‧ Lower board

213‧‧ ‧ spring

214‧‧‧Limited cylinder

215‧‧‧First elastic polymer material

231‧‧‧Second elastic polymer material

241‧‧‧Metal pad

301‧‧‧Testing pads

391‧‧‧First insulation

392‧‧‧Second insulation

481‧‧‧ openings

541‧‧‧ openings

581‧‧‧ openings

601‧‧‧ openings

1451‧‧‧ head

1461‧‧‧ bottom

1462‧‧‧ Coverage

2111‧‧‧through holes

2141‧‧‧ Body Department

2142‧‧‧Abutment

3911‧‧‧ openings

1 shows a schematic cross-sectional view of a test fixture in accordance with an embodiment of the present disclosure.

Figure 2 shows a top plan view of the base of the test fixture of Figure 1.

3 is a top plan view showing a flexible substrate of the test fixture of FIG. 1.

4 is a partially enlarged schematic cross-sectional view showing a flexible substrate of the test fixture of FIG. 1.

FIG. 5 is a partially enlarged cross-sectional view showing a flexible substrate according to an embodiment of the present disclosure.

FIG. 6 is a partially enlarged cross-sectional view showing a flexible substrate according to an embodiment of the present disclosure.

FIG. 7 is a partially enlarged cross-sectional view showing a flexible substrate according to an embodiment of the present disclosure.

FIG. 8 is a partially enlarged cross-sectional view showing a flexible substrate according to an embodiment of the present disclosure.

FIG. 9 is a partially enlarged cross-sectional view showing a flexible substrate according to an embodiment of the present disclosure.

FIG. 10 is a schematic diagram showing a test manner of a test fixture according to an embodiment of the present disclosure.

FIG. 11 is a cross-sectional view showing a test fixture according to an embodiment of the present disclosure.

FIG. 12 is a cross-sectional view showing a test fixture according to an embodiment of the present disclosure.

FIG. 13 is a cross-sectional view showing a test fixture according to an embodiment of the present disclosure.

FIG. 14 is a cross-sectional view showing a test fixture according to an embodiment of the present disclosure.

15 to 27 are schematic views showing a method of manufacturing a flexible substrate according to an embodiment of the present disclosure.

FIG. 1 shows a schematic cross-sectional view of a test fixture 1 in accordance with an embodiment of the present disclosure. The test fixture 1 includes a base 10, a buffer structure 2, and a flexible substrate 14. The base 10 has a first surface 101, a second surface 102, at least one through-groove 103, and a plurality of Fixed holes 104. The second surface 102 is opposite the first surface 101. The through trench 103 extends through the susceptor 10 for the flexible substrate 14 to pass through. The fixing holes 104 are located around the outside of the base 10 for the plurality of screws 20 to pass through, and the base 10 is fixed to an electrode carrying body 22. It can be understood that in other embodiments, the susceptor 10 can be fixed to the electrode carrier body 22 by other means.

The buffer structure 2 is located on the first surface 101 of the susceptor 10. In the embodiment, the buffer structure 2 is fixed to the first surface 101 of the base 10 and includes a receiving seat 23 and an elastic structure 21 . The resilient structure 21 is located on the base 10 for providing cushioning. In this embodiment, the elastic structure 21 includes an upper plate 211, a lower plate 212, a plurality of springs 213, and at least one limiting cylinder 214. The lower plate 212 is fixed to the first surface 101 of the base 10 . The springs 213 are located between the upper plate 211 and the lower plate 212. That is, one end of each of the springs 213 is connected to the upper plate 211, and the other end is connected to the lower plate 212. The limiting cylinder 214 has a body portion 2141 and a top abutting portion 2142. The top abutting portion 2142 is located at the upper end of the body portion 2141 such that the limiting cylinder 214 has a substantially T-shaped cross section. The body portion 2141 passes through one of the through holes 2111 of the upper plate 211 (the size of the through hole 2111 is smaller than the size of the top abutting portion 2142), and the lower end of the body portion 2141 is fixed (eg, locked) to the Lower plate 212. Therefore, when the upper plate 211 is subjected to a downward pressure, it will move downward along the body portion 2141 of the limiting cylinder 214 to compress the springs 213; when the downward pressure is removed, due to the springs 213 The upper plate 211 is pushed up and moved up along the body portion 2141 of the limiting cylinder 214 until it abuts against the abutting portion 2142. One end of the receiving seat 23 is connected to the elastic structure 21, and one of the upper ends of the receiving seat 23 is for receiving a portion of the flexible substrate 14.

The electrode carrier body 22 is disposed adjacent to the second surface 102 of the base 10 and has a plurality of electrodes 24 . The upper end of each of the electrodes 24 is exposed on the upper surface of the electrode carrier body 22 to form a metal pad 241 for electrically connecting the flexible substrate 14. The lower end of each of the electrodes 24 is electrically connected to a tester (not shown).

The flexible substrate 14 has a first surface 141, a second surface 142, a first portion 143, at least a second portion 144, a plurality of test probes 145, and a plurality of test contacts 146 and at least a third portion. 147. The test probes 145 are electrically connected to the test contacts 146. The test probes 145 are located on the first portion 143 of the flexible substrate 14 and above the base 10 (ie, above the first surface 101 of the base 10) for contacting a workpiece 30 to be tested ( For example, a wafer) of a plurality of pads 301 to be tested. The test contacts 146 are located in the second portion 144 of the flexible substrate 14 and below the base 10 (ie, below the second surface 102 of the base 10) for contacting the electrode carrier body 22 The metal pads 241. The third portion 147 connects the first portion 143 and the second portion 144.

In the embodiment shown in FIG. 1 , the flexible substrate 14 passes through the through trench 103 of the susceptor 10 , wherein a portion of the flexible substrate 14 ( the first portion 143 ) is located at the pedestal 10 . The upper end of the receiving base 23 is attached (eg, adhered) to the upper end of the receiving base 23 of the buffer structure 2, that is, the upper end of the receiving base 23 is used to receive the first portion 143 of the flexible substrate 14. In addition, another portion of the flexible substrate 14 (the second portion 144) is located below the susceptor 10 and is attached (eg, adhered) to the second surface 102 of the susceptor 10, that is, the The second surface 102 of the base 10 is configured to receive the second portion 144 of the flexible substrate 14.

In the embodiment shown in FIG. 1 , in the first portion 143 , the test probes 145 are disposed adjacent to the first surface 141 of the flexible substrate 14 , and the second surface 142 of the flexible substrate 14 . Attached (eg, adhered) to the upper end of the socket 23. In the second portion 144, the test contacts 146 are disposed adjacent to the second surface 142 of the flexible substrate 14, and the first surface 141 of the flexible substrate 14 is attached (eg, adhered) to the base The second surface 102 of the seat 10. Therefore, the test contacts 146 are not located directly below the test probes 145. In addition, in other embodiments, the test contacts 146 may be adjacent to the first surface 141 of the flexible substrate 14 and the second surface 141 of the flexible substrate 14 in the second portion 144. Attached (eg, adhered) to the second surface 102 of the base 10.

Figure 2 shows a top plan view of the base 10 of the test fixture 1 according to Figure 1. In the present embodiment, the base 10 has four through grooves 103. The through grooves 103 are not in communication with each other and surround a central portion 105. The central portion 105 is for the buffer structure 2 (Fig. 1) to be located thereon. In this embodiment, the lower plate 212 of the elastic structure 21 of the buffer structure 2 is fixed to the central portion 105.

3 shows a top plan view of the flexible substrate 14 of the test fixture 1 of FIG. In the present embodiment, the flexible substrate 14 has a first portion 143, four second portions 144, and four third portions 147. The four third portions 147 are extended from the first portion 143 outwardly in four directions and connected to the corresponding four second portions 144, thereby making the flexible substrate 14 a similar cross-shaped appearance. As shown in FIG. 3, the test probes 145 are arranged in an array in the first portion 143. However, in other embodiments, the test probes 145 may be arranged in other manners. It is to be noted that the arrangement pattern of the test probes 145 is an arrangement pattern of the pads 301 to be tested of the workpiece 30 to be tested. The test contacts 146 are disposed adjacent to the second surface 142 of the flexible substrate 14 and are also arranged in a special pattern. It should be noted that the arrangement pattern of the test contacts 146 is an arrangement pattern of the metal pads 241 of the electrodes 24 of the electrode carrying body 22. The test probes 145 are electrically connected to the test contacts 146 by conductive traces 148 of the conductive layers located in the third portion 147, wherein the test probes 145 are between the test contacts 146 The correspondence may be one-to-one, one-to-many or many-to-one.

4 is a partially enlarged schematic cross-sectional view showing the flexible substrate 14 of the test fixture 1 of FIG. In this embodiment, the flexible substrate 14 further includes a core layer 32, a first conductive layer 34, a second conductive layer 36, a plurality of conductive vias 38, a first insulating layer 391, and a second insulating layer. Layer 392. The first conductive layer 34 is a patterned metal layer made of copper or other suitable material and located on a second surface 322 of the core layer 32. The second conductive layer 36 is a patterned metal layer made of copper or other suitable material and located at the core. One of the first surfaces 321 of the layer 32. The conductive vias 38 extend through the core layer 32 and are electrically connected to the first conductive layer 34 and the second conductive layer 36. In the present embodiment, the conductive vias 38 are the plated metal layers 44 on the inner sidewalls of the through holes 42 of the core layer 32. In one embodiment, the conductive vias 38 extend through the first conductive layer 34 , and the plated metal layer 44 is further located on the first surface 321 of the core layer 32 and the lower surface of the first conductive layer 34 .

The first insulating layer 391 covers the first conductive layer 34 and has a plurality of openings 3911. In the embodiment, the first insulating layer 391 extends into the conductive via 38. The test contacts 146 are located in the openings 3911 and electrically connected to the first conductive layer 34. Each of the test contacts 146 includes a bottom portion 1461 and a cover portion 1462. The bottom portion 1461 is made of copper or nickel, and the cover portion 1462 is made of nickel, palladium, and/or gold.

The second insulating layer 392 covers the second conductive layer 36 and a portion of the first surface 321 of the core layer 32. The test probes 145 are electrically connected to the second conductive layer 36 and protrude from the second insulating layer. 392. In this embodiment, a plurality of intermediate indirect pads 149 are located on the second conductive layer 36, and the test probes 145 are located on the corresponding intermediate pads 149. The material of the intermediate indirect pads 149 is made of copper or other suitable material. However, it will be appreciated that the intermediate indirect pads 149 may be omitted. That is, the test probes 145 can be directly on the second conductive layer 36.

The material of the test probes 145 may be copper, nickel or nickel tungsten alloy. In this embodiment, the material of the core layer 32 is Polyimide (PI), and the materials of the first insulating layer 391 and the second insulating layer 392 are all cured by a photosensitive resin type. to make. The photosensitive resin type includes a polyimide (PI) resin, a photoinitiator, a coupling agent, and a solvent (Solvent). In other embodiments, the core layer 32, the first insulating layer 391, and the second insulating layer 392 may be made of different materials and other suitable materials. In this embodiment, the end of each of the test probes 145 is a plane, that is, the profile of each of the test probes 145 is substantially rectangle.

FIG. 5 is a partially enlarged cross-sectional view showing a flexible substrate 14a according to an embodiment of the present disclosure. The flexible substrate 14a of the present embodiment is substantially the same as the flexible substrate 14 shown in FIG. 4, and the differences are as follows. In the flexible substrate 14a, a portion of the second insulating layer 392 is located on a sidewall of each of the test probes 145 to protect the test probes 145 around the cladding, and only the test probes 145 The end is exposed outside the second insulating layer 392.

FIG. 6 is a partially enlarged cross-sectional view showing a flexible substrate 14b according to an embodiment of the present disclosure. The flexible substrate 14b of the present embodiment is substantially the same as the flexible substrate 14 shown in FIG. 4, and the differences are as follows. In the flexible substrate 14b, the end of each of the test probes 145 has a pointed shape with a chamfered surface, that is, the cross-section of each of the test probes 145 is substantially trapezoidal.

FIG. 7 is a partially enlarged cross-sectional view showing a flexible substrate 14c according to an embodiment of the present disclosure. The flexible substrate 14c of the present embodiment is substantially the same as the flexible substrate 14 shown in FIG. 4, and the differences are as follows. In the flexible substrate 14c, the end of each of the test probes 145 is a conical shape having a chamfered surface around the central axis; or, the end of each of the test probes 145 may be A wedge-shaped appearance with two chamfered faces. In this embodiment, each of the test probes 145 has a cross-section that is substantially a pentagon.

FIG. 8 is a partially enlarged cross-sectional view showing a flexible substrate 14d according to an embodiment of the present disclosure. The flexible substrate 14d of the present embodiment is substantially the same as the flexible substrate 14 shown in FIG. 4, and the differences are as follows. In the flexible substrate 14d, the end of each of the test probes 145 is in the form of a bolt having a larger head 1451. In an embodiment, the top surface of the head 1451 is a curved surface.

FIG. 9 is a partially enlarged cross-sectional view showing a flexible substrate 14e according to an embodiment of the present disclosure. The flexible substrate 14e of the present embodiment is substantially similar to the flexible substrate 14 shown in FIG. Again, the differences are as follows. In the flexible substrate 14e, the ends of each of the test probes 145 are in a zigzag shape.

FIG. 10 is a schematic diagram showing a test manner of a test fixture 1 according to an embodiment of the present disclosure. The test method of this embodiment is as follows. First, the first portion 143 of the flexible substrate 14 is attached to the upper end of the receiving seat 23 of the buffer structure 2, and the second portion 144 of the flexible substrate 14 is attached to the second surface of the base 10. 102. Next, the susceptor 10 is fixed to the electrode carrier body 22 such that the test contacts 146 contact the metal pads 241 of the electrode carrier body 22. Then, the workpiece 30 to be tested is moved toward the test fixture 1 such that the to-be-tested pad 301 of the workpiece 30 to be tested contacts the test probes 145. Next, the workpiece 30 to be tested is moved slightly downward, so that the waiting test pad 301 is in close contact with the test probes 145 and tested. At this time, the upper plate 211 is subjected to a downward pressure, which moves downward along the body portion 2141 of the limiting cylinder 214 to compress the springs 213. That is, the equal spring 213 can provide cushioning. After the test is completed, the workpiece 30 to be tested is removed. At this time, the downward pressure is removed. Due to the elastic force of the springs 213, the upper plate 211 is pushed up and moved up along the body portion 2141 of the limiting cylinder 214 until the top abuts against the abutting portion 2142. And restore the state shown in Figure 1.

In the above test mode, first, since the metal pads 241 of the electrode carrying body 22 are not subjected to the reciprocating positive pressure (that is, the pressing or removing of the workpiece 30 to be tested does not affect the metal at all. Pad 241) can avoid the destruction of the metal pads 241, which is not only difficult to cause good misjudgment, but also can prolong the service life. Furthermore, the test probes 145 of the flexible substrate 14 can be fabricated by a yellow light process or a 3D printing method (the pitch between the test probes 145 can be 50 micrometers or less). In response to the trend of miniaturization of products, the flexibility of product production is enhanced, and the yield of the process is easy to monitor. In addition, the arrangement pattern of the metal pads 241 of the electrode carrier body 22 can be standardized. When the workpieces 30 to be tested are to be tested, only the corresponding flexible substrate 14 can be replaced, that is, the electrode carrier The metal pads 241 of the body 22 can continue to be used for different workpieces 30 to be tested, without It is limited to the workpiece 30 to be tested of a specific model. In other words, the arrangement pattern of the metal pads 241 of the electrode carrying body 22 may not correspond to the arrangement pattern of the pads 301 to be tested of the workpiece 30 to be tested.

FIG. 11 is a cross-sectional view showing a test fixture 1a according to an embodiment of the present disclosure. The test fixture 1a of the present embodiment is substantially the same as the test fixture 1 shown in Fig. 1, and the differences are as follows. In the test fixture 1a, in the second portion 144 of the flexible substrate 14, the test contacts 146 are disposed adjacent to the first surface 141 of the flexible substrate 14, and the flexible substrate 14 is disposed. The second surface 141 is attached to the second surface 102 of the central portion 105 of the base 10. At this time, the test contacts 146 and the test probes 145 are both located on the first surface 141 of the flexible substrate 14 , and the test contacts 146 are located directly below the test probes 145 .

FIG. 12 shows a schematic cross-sectional view of a test fixture 1b according to an embodiment of the present disclosure. The test fixture 1b of the present embodiment is substantially the same as the test fixture 1 shown in Fig. 1, and the differences are as follows. In the test fixture 1b, the elastic structure 21b includes at least one first elastic polymer material 215 sandwiched between the upper plate 211 and the lower plate 212 for providing cushioning. That is, the elastic structure 21b does not have the springs 213 and the limiting cylinders 214. In addition, a second elastic polymer material 231 is also interposed in the middle of the receiving seat 23b for providing cushioning.

FIG. 13 is a cross-sectional view showing a test fixture 1c according to an embodiment of the present disclosure. The test jig 1c of the present embodiment is substantially the same as the test jig 1b shown in FIG. 12, and the differences are as follows. In the test fixture 1c, in the second portion 144 of the flexible substrate 14, the test contacts 146 are disposed adjacent to the first surface 141 of the flexible substrate 14, and the flexible substrate 14 is disposed. The second surface 141 is attached to the second surface 102 of the central portion 105 of the base 10. At this time, the test contacts 146 and the test probes 145 are both located on the first surface 141 of the flexible substrate 14 , and the test contacts 146 are located directly below the test probes 145 .

FIG. 14 is a cross-sectional view showing a test fixture 1d according to an embodiment of the present disclosure. The test fixture 1d of the present embodiment is substantially the same as the test fixture 1 shown in Fig. 1, and the differences are as follows. In the test fixture 1d, the buffer structure 2d includes a receiving seat 23d and an air chamber 25. The air chamber 25 is located on the first surface 101 of the base 10. The lower end of the receiving seat 23d is located in the air chamber 25, and an enclosed space is formed in the air chamber 25. Therefore, the lower end of the receiving seat 23d is movable within the air chamber 25 to provide cushioning. The upper end of the receiving seat 23d is for receiving the first portion 143 of the flexible substrate 14.

15 to 27 are schematic views showing a method of manufacturing a flexible substrate according to an embodiment of the present disclosure. Referring to Figure 15, a core layer 32 and a first metal layer 40 are provided. The material of the core layer 32 is Polyimide (PI) or other suitable material, and has a first surface 321 and a second surface 322. The first metal layer 40 is made of copper or other suitable material and is attached to the second surface 322 of the core layer 32. Next, a plurality of through holes 42 are formed to penetrate the core layer 32 and the first metal layer 40. In the present embodiment, the through holes 42 are formed by laser drilling. In another embodiment, the material of the core layer 32 is a photosensitive polyimide (PSPI), and the through holes 42 are formed by exposure and development. The thickness of the core layer 32 is less than about 12.5 micrometers (μm), the thickness of the first metal layer 40 is about 9 micrometers or less, and the inner diameter of each of the through holes 42 is about 5 to 100 micrometers. It should be noted that the right side of the figure corresponds to the first portion 143 of the flexible substrate 14 of FIG. 4, and the left side of the figure corresponds to the second portion 144 of the flexible substrate 14 of FIG.

Referring to FIG. 16, an electroplated metal layer 44 is formed on the first surface 321 of the core layer 32, the lower surface of the first metal layer 40, and the inner sidewalls of the through holes 42. In this embodiment, the material of the plated metal layer 44 is made of copper or other suitable material, and is formed by electroless plating. The thickness of the plated metal layer 44 is about 1 to 5 microns. At this time, the plated metal layer 44 located on the inner side wall of the through holes 42 forms the conductive path 38.

Referring to FIG. 17, a first carrier 46 is attached to the plated metal layer 44 of the first surface 321 of the core layer 32. In this embodiment, the first carrier 46 is a tape. Next, a first photoresist layer 48 is formed on the plating metal layer 44 on the lower surface of the first metal layer 40. Next, a plurality of openings 481 are formed in the first photoresist layer 48 by exposure and development. Then, a portion of the plated metal layer 44 and a portion of the first metal layer 40 are removed by etching according to the opening 481 of the first photoresist layer 48. At this time, the first metal layer 40 forms the patterned first conductive layer 34.

Referring to FIG. 18, the first photoresist layer 48 is removed, and a first insulating layer 391 is formed to cover the first conductive layer 34 and the plated metal layer 44. In this embodiment, the first insulating layer 391 extends to and fills the conductive via 38 and contacts the first carrier 46. The first insulating layer 391 is formed by curing a photosensitive resin type. The photosensitive resin type includes a polyimide (PI) resin, a photoinitiator, a coupling agent, and a solvent (Solvent). Next, a plurality of openings 3911 are formed in the first insulating layer 391 to expose the plated metal layer 44. It is to be noted that the positions of the openings 3911 correspond to the second portion 144 of the flexible substrate 14 of FIG. The first insulating layer 391 has a thickness of about 3 to 5 microns.

Referring to FIG. 19, a plurality of test contacts 146 are formed in the openings 3911, wherein the test contacts 146 are in contact with the plated metal layer 44 to electrically connect the first conductive layer 34. Each of the test contacts 146 includes a bottom portion 1461 and a cover portion 1462. The bottom portion 1461 is made of copper or nickel, and the cover portion 1462 is made of nickel, palladium, and/or gold. In the present embodiment, the test contacts 146 are made using an electroless nickel-plated (Electroless Nickel/Electroless Palladium/Immersion Gold, ENEPIG) process. The test contact 146 has a thickness of about 4 to 6 microns.

Referring to FIG. 20, a second carrier 50 is attached to the first insulating layer 391. In the present embodiment, the second carrier 50 is attached to the first insulating layer 391 by an adhesive layer 52. Next, the first carrier 46 is removed.

Referring to FIG. 21, a second photoresist layer 54 is formed on the plated metal layer 44 of the first surface 321 of the core layer 32. Next, a plurality of openings 541 are formed in the second photoresist layer 54 by exposure and development to expose a portion of the plated metal layer 44.

Referring to FIG. 22, a second metal layer 56 is formed (eg, electroplated) in the openings 541 of the second photoresist layer 54 to fill the openings 541 and contact the plated metal layer 44. At this time, the second metal layer 56 forms the patterned second conductive layer 36.

Referring to FIG. 23, a third photoresist layer 58 is formed on the second photoresist layer 54 and the second conductive layer 36. Next, a plurality of openings 581 are formed in the third photoresist layer 58 by exposure and development to expose a portion of the second conductive layer 36. It is noted that the locations of the openings 581 correspond to the first portion 143 of the flexible substrate 14 of FIG. The material of the third photoresist layer 58 and the second photoresist layer 54 are the same or different.

Referring to FIG. 24, a third metal layer is formed (eg, electroplated) in the openings 581 of the third photoresist layer 58 to fill the openings 581 and contact the second conductive layer 36. At this time, the third metal layer forms the intermediate indirect pads 149. The material of the intermediate indirect pads 149 is made of copper or other suitable material. However, it will be appreciated that the intermediate indirect pads 149 may be omitted.

Referring to FIG. 25, a fourth photoresist layer 60 is formed on the third photoresist layer 58 and the intermediate pads 149. Next, a plurality of openings 601 are formed in the fourth photoresist layer 60 by exposure and development to expose the intermediate indirect pads 149. In one embodiment, a middle indirect pad 149 can correspond to a plurality of openings 601. Next, a fourth metal layer is formed (eg, electroplated) in the openings 601 of the fourth photoresist layer 60 to fill the openings 601 and contact the intermediate pads 149. At this time, the fourth metal layer forms the test probes 145. That is, the test probes 145 are located on the corresponding intermediate pads 149, and one of the intermediate pads 149 may have one or more test probes 145. The material of the test probes 145 may be copper, nickel or nickel tungsten alloy. In other embodiments, if the intermediate indirect pads 149 are omitted, the test probes 145 are directly on the second conductive layer 36. In this reality In the embodiment, the end of each of the test probes 145 (ie, the end point of the workpiece 30 to be tested in contact with the test pad 301 to be tested) is a plane, that is, a profile of each of the test probes 145. The system is roughly rectangular. However, in other embodiments, the end of each of the test probes 145 may have a pointed shape (as shown in FIG. 6), a wedge-shaped appearance (as shown in FIG. 7), and a bolt shape (as shown in FIG. 8). Shown, a zigzag (as shown in FIG. 8) or other shape that facilitates good contact with the pad 301 to be tested.

Referring to FIG. 26, the fourth photoresist layer 60, the third photoresist layer 58 and the second photoresist layer 54 and a portion of the plated metal layer 44 are removed (ie, the plating is not covered by the second conductive layer 36). Metal layer 44).

Referring to FIG. 27, a second insulating layer 392 is formed to cover the second conductive layer 36, the plated metal layer 44, and a portion of the first surface 321 of the core layer 32, and surrounds the intermediate pads 149. The test probes 145 protrude from the second insulating layer 392. In this embodiment, the material of the second insulating layer 392 is cured by a photosensitive resin type. The photosensitive resin type includes a polyimide (PI) resin, a photoinitiator, a coupling agent, and a solvent (Solvent). In other embodiments, the core layer 32, the first insulating layer 391, and the second insulating layer 392 may be made of different materials and other suitable materials.

Next, the second carrier 50 and the adhesive layer 52 are removed to obtain the flexible substrate 14 as shown in FIGS. 1, 3 and 4.

In other embodiments, a portion of the second insulating layer 392 in FIG. 27 extends to the sidewall of each of the test probes 145 to surround and protect the test probes 145, and only such The end of the test probe 145 is exposed outside the second insulating layer 392. Therefore, after the second carrier 50 and the adhesive layer 52 are removed, the flexible substrate 14a as shown in FIG. 5 can be obtained.

As used herein and without additional definitions, the terms "substantially", "substantially" and "about" are used to describe and consider minor variations. When used in conjunction with an event or situation, the technique A language may refer to a situation in which an event or situation clearly occurs and in which the event or situation is closely approximated. For example, the term can mean less than or equal to ±10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1 %, less than or equal to ±0.5%, less than or equal to ±0.1% or less than or equal to ±0.05%.

In addition, quantities, ratios, and other values are sometimes presented in a range format herein. It is to be understood that the scope of the present invention is to be construed as a limitation of the scope of the Each value and sub-range are explicitly specified.

The present invention has been described and illustrated with reference to the particular embodiments of the invention. It will be understood by those skilled in the art that various changes can be made and substituted by equivalents without departing from the true spirit and scope of the invention as defined by the appended claims. The illustrations may not necessarily be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the artistic representations of the present invention and actual devices. There may be other embodiments of the invention that are not specifically described. The description and drawings are to be regarded as illustrative rather Modifications may be made to adapt a particular situation, material, material composition, method or process to the object, spirit and scope of the invention. All such modifications are intended to fall within the scope of the patent application. Although the methods disclosed herein have been described with reference to the specific operations performed in a particular order, it is understood that these operations can be combined, sub-divided or re-ordered to form an equivalent method without departing from the teachings of the invention. Therefore, the order of operations and groupings are not limiting of the invention unless specifically indicated herein.

1‧‧‧Test fixture

2‧‧‧buffer structure

10‧‧‧ Pedestal

14‧‧‧Flexible substrate

20‧‧‧ screws

21‧‧‧Flexible structure

22‧‧‧electrode bearing body

23‧‧‧ socket

24‧‧‧ electrodes

30‧‧‧Workpieces to be tested

101‧‧‧The first surface of the pedestal

102‧‧‧Second surface of the pedestal

103‧‧‧through groove

104‧‧‧Fixed holes

105‧‧‧Central Department

141‧‧‧The first surface of the flexible substrate

142‧‧‧The second surface of the flexible substrate

143‧‧‧Part 1

144‧‧‧Part II

145‧‧‧Test probe

146‧‧‧Test contacts

147‧‧‧Part III

211‧‧‧Upper board

212‧‧‧ Lower board

213‧‧ ‧ spring

214‧‧‧Limited cylinder

241‧‧‧Metal pad

301‧‧‧Testing pads

2111‧‧‧through holes

2141‧‧‧ Body Department

2142‧‧‧Abutment

Claims (10)

A test fixture includes: a base; and a flexible substrate having a first portion, a second portion, a plurality of test probes, and a plurality of test contacts, wherein the test probes are electrically connected The test probes are located on the first portion of the flexible substrate and above the base, and the test contacts are located on the second portion of the flexible substrate and are located on the base Below it. The test fixture of claim 1, wherein the base has at least one through groove through which the flexible substrate passes. The test fixture of claim 1, wherein the flexible substrate further has a first surface and a second surface, the test probes are adjacent to the first surface of the flexible substrate, and the tests The contact is adjacent to the first surface or the second surface of the flexible substrate. The test fixture of claim 1, wherein the flexible substrate further comprises a core layer, a first conductive layer, a second conductive layer and a plurality of conductive channels, the first conductive layer being located in the core layer a second surface, the second conductive layer is located on a first surface of the core layer, the conductive channels are through the core layer and electrically connected to the first conductive layer and the second conductive layer, the test contacts The first conductive layer is electrically connected, and the test probes are electrically connected to the second conductive layer. The test fixture of claim 4, wherein the flexible substrate further comprises a second insulating layer covering the second conductive layer and a portion of the first surface of the core layer, wherein the test probes are electrically connected to the first Two conductive layers protruding from the second insulating layer. The test fixture of claim 5, wherein a portion of the second insulating layer is located on a sidewall of each of the test probes to protect the test probes around the cladding. The test fixture of claim 1, wherein each of the test probes has a flat end, a pointed shape, a wedge-shaped appearance, a bolt shape or a zigzag shape. The test fixture of claim 1, further comprising a buffer structure on a first surface of the base, the first portion of the flexible substrate being attached to the buffer structure, and the second portion of the flexible substrate Attached to a second surface of the base. The test fixture of claim 8, wherein the buffer structure comprises a receiving seat and an elastic structure, the elastic structure is located on the base for providing a buffer; and a lower end of the receiving seat is coupled to the elastic structure, One of the upper ends of the socket is for receiving the first portion of the flexible substrate. The test fixture of claim 8, wherein the buffer structure comprises a receiving seat and an air chamber, the air chamber is located on the base; and a lower end of the receiving seat is movable in the air chamber. One of the upper ends of the socket is for receiving the first portion of the flexible substrate.