JPH0226042A - Marking device - Google Patents

Abstract

PURPOSE:To enable the degree of 'conforming' and 'non-conforming' of a product to be judged easily with marking shape by having at least two cores for marking which can be printed independently and achieving marking with two or more dot patterns using these cores selectively. CONSTITUTION:A core for marking made by bundling a plurality of glass fibers, etc., are fitted to the lower edge of a plunger 10 and this core 8 is allowed to project from the lower edge for example through an ink pot 7. Also, a solenoid 6 can be operated independently from each signal line 13 and the operation of the solenoid 6 can be controlled by a control part 5. Thus, it is possible to mark various kinds of dot patterns by control of the control part 5. It allows the status of a pellet area to be easily grasped according to the inspection result by this dot pattern.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a technique that is effective when applied to a marking technique for recording the quality of each pellet area on a semiconductor wafer in the manufacturing process of semiconductor devices.

[Conventional technology]

An example of this type of technology described is "Electronic Materials Special Volume, VLSI Manufacturing and Testing Equipment Guidebook JP1, published by Kogyo Chosukaikai Co., Ltd., November 15, 1988.
There are 95 to 198.

The above documents describe probe inspection techniques for semiconductor wafers. In this type of probe inspection, for pellet areas determined to be defective,
A circular stamp was applied using water-soluble red ink, and the defective pellet on the semiconductor wafer was visible.

[Problem to be solved by the invention]

However, in the above technology, pellet areas that do not meet certain defect criteria are uniformly determined to be defective and stamped, so in order to reconfirm the defect content, it is necessary to re-inspect the records from the probe inspection. It was difficult to judge from the marking condition alone.

Furthermore, even if the pellet area is determined to be good in the above probe test, in order to know the degree of good product and the grade of the product, it is necessary to investigate the record of the probe test in the same way as above, and in the end, from the markings. could only know the quality of the product.

The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a technique that allows the quality of a product to be easily determined based on the shape of the marking.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, it is equipped with at least two or more marking cores that can be used to make marks independently, and by selectively using these marking cores, it is possible to make marks using two or more dot patterns.

[Effect]

According to the above-mentioned means, it is possible to classify the good/bad condition into multiple grades based on the inspection results for each bullet area, and to mark each bullet area with a different dot pattern for each grade. Therefore, this dot pattern makes it possible to understand the condition of the pellet area based on the inspection results very easily.

〔Example〕

Figures 1 (a), (c) right and (C) are front, side and bottom views showing a marking mechanism which is an embodiment of the present invention, respectively, and Figure 1 (6) is an enlarged view of the tip thereof. , second
The figure is an explanatory diagram showing the overall configuration of the marking device of this embodiment, and FIG. 3 is an explanatory diagram showing an example of a mark pattern on a semiconductor wafer.

As shown in FIG. 2, the marking device 1 of this embodiment includes an XY stage 3 on which a semiconductor wafer 2 that has undergone probe inspection is placed, and a semiconductor wafer placed on the XY stage 3 and placed on the XY stage 3. The marking mechanism 4 includes a marking mechanism 4 that performs marking on the wafer 2, and a control section 5 that controls the XY stage 3 and the marking mechanism 4.

The marking mechanism 4 includes a solenoid 6 and an ink bottle 7 fixed to a support member 15 as shown in FIG. It has a core 8.

The above-mentioned solenoid 6 has a plunger l that can be pivoted inside.
The plunger 10 has one end protruding from the end surface of the solenoid 6, and a large diameter portion 10a is provided on the upper end surface, and the large diameter portion 10a and the solenoid end surface are connected. A coiled spring 11 is interposed between them. Therefore, under normal conditions, the plunger 10 is urged upward as shown in FIGS. 1(a) and 1(b).

A marking core 8 made of a plurality of glass fibers or the like is attached to the other end of the plunger 10, that is, the lower end of the plunger 10 shown in the figure, and the marking core 8 extends downward in the figure. It passes through the ink 117 and protrudes from its lower end. This marking core 8 has a structure in which it comes into contact with a liquid ink material 12 filled in the ink bottle 7, and the ink material 12 is placed in a marking window 80.
The tip of the marking lead 8 is reached using capillary action. In this embodiment, the marking core 8 is shown in FIG. 1(C).
As shown in the figure, a total of nine wires, three vertically and three horizontally, are arranged in a matrix when viewed from the bottom direction.

Each of the solenoids 6 can be operated independently by a signal line 13, and the operation of the solenoid 6 is controlled by a control section 5. The control unit 5 includes a decoder, a driver circuit, etc. for generating operating signals for the solenoids 6, and supplies signals to each solenoid 6 based on the inspection results obtained from the probe inspection of the semiconductor wafer 2. It has a structure. Therefore, under the control of the control section 5, it is possible to mark various dot patterns as shown in FIG. In this example, 9
Since a dot pattern is formed by a combination of individual dots, it is theoretically possible to express patterns in 91 ways.

Next, the operation of this embodiment will be explained.

After the probe inspection of the semiconductor wafer 2 is completed, when the inspection results for each pellet area 14 are manually input to the control unit 5, the XY stage 3 is operated under the control of the control unit 5, and a predetermined position is placed directly under the marking mechanism 4. The position of semiconductor wafer 2 is corrected so that pellet region 14 is located.

In this state, when the control unit 5 reads the inspection results regarding the pellet area 14 located directly below the marking mechanism 4, it determines to which pre-standardized grade the condition of the pellet area 14 belongs, A signal based on the grade is generated and sent to the solenoid 6 via the signal line 13.

Solenoid 6 selectively turned on by the above signal
Now, the plunger 10 is moved downward in FIGS. 1(a) and 1(b) against the biasing force of the spring 11, and the marking lead 8 is moved downward by one minute compared to the other marking leads 8 in the OFF state. (Fig. 1(d)).

In this state, when the marking mechanism 4 is lowered in the direction of the XY stage 3 by an X-axis direction driving means (not shown),
The tip of the marking core 8 in the protruding state comes into contact with the pellet region 14 located directly below the pellet region 14 . Due to this contact, the ink material 12 filled at the tip of the marking core 8 is transferred to the surface of the pellet region 14, and a predetermined dot pattern is marked on the surface of the pellet region 14.

After the marking in the pellet area 14 is completed, when the marking mechanism 4 is raised in the X-axis direction, the XY stage 3 is moved by a predetermined amount and the next pellet area 14 is placed directly below the marking mechanism 4. Ru. By repeating the same operation as described above in the subsequent pellet region 14, markings are sequentially applied on the semiconductor wafer 2.

In this way, in this embodiment, the marking is not a simple circular one but is formed by a large number of dot patterns as shown in FIG. By marking in accordance with the above, it is possible to easily identify the type of defect just by visually observing the pellet area 14. In addition, by marking the good pellet area 14 by changing the dot pattern depending on the degree of good quality, that is, the grade,
By simply observing the semiconductor wafer 2, it is extremely easy to collect a good grade layer for each pellet region 14.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor.

For example, in the above embodiment, an example was described in which grades of pass/fail were classified based on a total of 9 dots, 3 dots each on the W and lateral sides. Numbers or symbols may be printed directly on 14.

In the above explanation, the invention made by the present inventor was mainly applied to a marking device using ink, which is the field of application of the invention, but the invention is not limited to this, and for example, it can be applied to a marking device using ink. It is also applicable to a marking device that uses light irradiation. In such a case, the same effect as in the above embodiment can be obtained by constructing the marking core with an optical fiber or the like and controlling the laser beam incident on each marking core for each marking core.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In other words, it is possible to classify good and bad conditions into multiple grades based on the inspection results for each pellet area on a semiconductor wafer, and to mark each pellet area with a different dot pattern for each grade. This dot pattern makes it possible to very easily understand the condition of the pellet area based on the inspection results.

[Brief explanation of the drawing]

Figures 1(a) and υ (C) are a front view, side view, and bottom view respectively showing a marking mechanism which is an embodiment of the present invention, and Figure 1(6) is an enlarged view showing the tip thereof. , FIG. 2 is an explanatory diagram showing the overall configuration of the marking device of the embodiment, and FIG. 3 is an explanatory diagram showing an example of a mark pattern on a semiconductor wafer using the embodiment. 1... Marking device, 2... Semiconductor wafer, 3.
...xY stage, 4...marking mechanism, 5...
Control unit, 6... Solenoid, 7... Ink bottle, 8.
...Marking lead, 10...Plunger, 10a.
...Large diameter part, 11...Spring, 12...Ink material, 1
3... Signal line, 14... Pellet area, 15...
Support member. ((f) 1Z:in7)λ 13:41! %, vague

Claims (1)

[Claims] 1. A marking device that performs marking on a plurality of pellet regions on a semiconductor wafer based on the results of a quality inspection in each of the pellet regions, the marking device being capable of marking at least two or more independently. 1. A marking device, characterized in that it is equipped with a marking core and is capable of marking points with two or more dot patterns by selectively using one or more marking cores. 2. The marking device according to claim 1, wherein the two or more marking cores are arranged in a dot matrix on the marking surface.