TWI593980B - Electronic components operating device and its application test classification equipment - Google Patents

Electronic components operating device and its application test classification equipment Download PDF

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Publication number
TWI593980B
TWI593980B TW105124150A TW105124150A TWI593980B TW I593980 B TWI593980 B TW I593980B TW 105124150 A TW105124150 A TW 105124150A TW 105124150 A TW105124150 A TW 105124150A TW I593980 B TWI593980 B TW I593980B
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Taiwan
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electronic component
transfer
carrier
working
displaced
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TW105124150A
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Chinese (zh)
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TW201804163A (en
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Zhi-Wei Liang
Chang-Xing Liu
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Description

電子元件作業裝置及其應用之測試分類設備 Electronic component operating device and its application test classification equipment

本發明係提供一種利用移載機構橫設於第一、二作業區之承架帶動第一、二移載具同步位移,使第一移載具於第一作業區之第一作業器及第一載台間移載電子元件,以及使第二移載具同步於第二作業區之第二作業器及第二載台間移載電子元件,不僅提升第一、二移載具之移載效能,並簡化移載用元件及利於空間配置,進而提升作業生產效能及節省成本之電子元件作業裝置。 The invention provides a first operator for moving the first and second transfer carriers by using a transfer mechanism transversely disposed on the first and second working areas, so that the first transfer carrier is in the first working area and the first working device Transferring the electronic components between the stages, and synchronizing the second transfer carrier with the second carrier and the second stage to transfer the electronic components, thereby not only enhancing the transfer of the first and second transfer carriers Efficient, and simplify the components for transfer and facilitate the space configuration, thereby improving the production efficiency and cost-saving electronic component operation device.

請參閱第1、2、3圖,係為習知作業裝置之示意圖,其係於機台上設有具測試電路板111及測試座112之測試機構11,該測試座112係設有朝上配置之複數支探針,用以接觸待測電子元件之電性接點,一輸送機構12係於測試機構11之一側設有作第一方向位移(如X方向)之入料載台121,用以載送待測之電子元件,並於測試機構11之另一側設有作第一方向位移之出料載台122,用以載送已測之電子元件,一移載機構13係配置於測試機構11之上方,並於機架131上設有第一馬達1321及第一傳動組1322,第一傳動組1322驅動一第一L型臂133作第二方向(如Z方向)位移,第一L型臂133係設有取放電子元件之第一取放件1331,另於機架131上設有第二馬達1341及第二傳動組1342,第二傳動組1342驅動一第二L型臂135作第二方向位移,該第二L型臂135係設有取放電子元件之第二取放件1351,又移載機構13為使第一取放件1331及第二取放件1351作第三方向(如Y方向)位移,而於測試機構11及輸送機構12間移載電子元件,移載機構13係於第一傳動組1322與第一L型臂133間設有相互配合且呈第三方向配置之第一滑軌1323與第一滑座1332,並於第一L型臂133之兩側與一第一移動座136間設有相互配合且呈第二方向配置之第二滑軌1333與第二滑座1361,再 以一第三馬達1371經第三傳動組1372驅動第一移動座136作第三方向位移,使第一移動座136帶動第一L型臂133及第一取放件1331作第三方向位移,另於第二傳動組1342與第二L型臂135間設有相互配合且呈第三方向配置之第三滑軌1343與第三滑座1352,並於第二L型臂135之兩側與一第二移動座138間設有相互配合且呈第二方向配置之第四滑軌1353與第四滑座1381,再以一第四馬達1391經第四傳動組1392驅動第二移動座138作第三方向位移,使第二移動座138帶動第二L型臂135及第二取放件1351作第三方向位移;以第一L型臂133移載電子元件為例,該第三馬達1371係利用第三傳動組1372驅動第一移動座136作第三方向位移,第一移動座136經由第二滑座1361及第二滑軌1333帶動第一L型臂133及第一取放件1331作第三方向位移,該第一L型臂133則利用第一滑座1332沿第一滑軌1323滑移而位於輸送機構12之入料載台121之上方,接著第一馬達1321係經由第一傳動組1322驅動第一L型臂133作第二方向位移,使第一取放件1331於入料載台121取出待測之電子元件,於取料後,該第三馬達1371再經由第三傳動組1372及第一移動座136帶動第一L型臂133及第一取放件1331作第三方向位移至測試機構11之測試座112上方,並以第一馬達1321經第一傳動組1322而驅動第一L型臂133作第二方向位移,使第一取放件1331將待測電子元件置入壓抵於測試座112內執行測試作業,於測試完畢後,移載機構13之第一L型臂133作第二、三方向位移將已測之電子元件移載置入於輸送機構12之出料載台122上以便輸出;惟,由於入、出料載台121、122係位於測試機構11之兩側,該移載機構13為了使第一、二取放件1331、1351作Y方向位移,必須配置第一移動座136、第三馬達1371、第三傳動組1372、第二移動座138、第四馬達1391及第四傳動組1392等移載用元件,不僅整體機構相當複雜,亦增加機構成本及不利於裝置空間配置;再者,當第二取放件135作Y方向位移將已測電子元件由測試座112移載至出料載台122後,又必須作Y方向反向位移橫越測試座112上方,方可位移至入料載台121處而接續取用下一待測之 電子元件,以致增加移載行程而耗費作業時間,造成無法提升測試產能之缺失。 Please refer to Figures 1, 2 and 3, which are schematic diagrams of a conventional working device, which is provided with a test mechanism 11 having a test circuit board 111 and a test socket 112 on the machine table, and the test seat 112 is provided with upward facing The plurality of probes are configured to contact the electrical contacts of the electronic component to be tested, and the transport mechanism 12 is disposed on one side of the testing mechanism 11 and is provided with a loading stage 121 for the first direction displacement (such as the X direction). For carrying the electronic component to be tested, and on the other side of the testing mechanism 11 is provided a discharge carrier 122 for the first direction displacement for carrying the measured electronic component, and a transfer mechanism 13 The first motor 1321 and the first transmission group 1322 are disposed on the frame 131, and the first transmission group 1322 drives a first L-shaped arm 133 to be displaced in the second direction (such as the Z direction). The first L-shaped arm 133 is provided with a first pick-and-place member 1331 for picking and placing electronic components, and the second motor 1341 and the second transmission group 1342 are disposed on the frame 131, and the second transmission group 1342 drives a second. The L-shaped arm 135 is displaced in the second direction, and the second L-shaped arm 135 is provided with the second pick-and-place member 1351 for taking and placing electronic components, and the transfer mechanism 13 The first pick-and-place member 1331 and the second pick-and-place member 1351 are displaced in the third direction (such as the Y direction), and the electronic components are transferred between the testing mechanism 11 and the transport mechanism 12, and the transfer mechanism 13 is attached to the first transmission group. A first slide rail 1323 and a first slide seat 1332 are disposed between the first L-shaped arm 133 and the first L-shaped arm 133, and a first movable seat 136 is disposed on the two sides of the first L-shaped arm 133. a second sliding rail 1333 and a second sliding seat 1361 which are arranged in a second direction and which are mutually matched, and then The first moving seat 136 is driven by the third driving unit 1372 to be displaced in the third direction by the third driving unit 1372, so that the first moving seat 136 drives the first L-shaped arm 133 and the first pick-and-place member 1331 to be displaced in the third direction. In addition, a third sliding rail 1343 and a third sliding gate 1352 are disposed between the second transmission group 1342 and the second L-shaped arm 135, and are disposed on the two sides of the second L-shaped arm 135. A fourth sliding rail 1353 and a fourth sliding seat 1381 disposed in a second direction are disposed between the second moving base 138, and the second moving base 138 is driven by the fourth driving unit 1392 via a fourth motor 1391. The displacement of the third direction causes the second movable seat 138 to drive the second L-shaped arm 135 and the second pick-and-place member 1351 to be displaced in the third direction; for example, the first L-shaped arm 133 transfers the electronic component, the third motor 1371 The third movement group 1372 is used to drive the first movement seat 136 for the third direction displacement. The first movement base 136 drives the first L-shaped arm 133 and the first pick-and-place member 1331 via the second sliding seat 1361 and the second sliding rail 1333. Displacement in the third direction, the first L-shaped arm 133 is slid along the first sliding rail 1323 by the first sliding seat 1332 and located at the conveying mechanism 12 Above the material stage 121, the first motor 1321 drives the first L-shaped arm 133 to be displaced in the second direction via the first transmission group 1322, so that the first pick-and-place unit 1331 takes out the electrons to be tested at the loading stage 121. After the retrieving, the third motor 1371 drives the first L-shaped arm 133 and the first pick-and-place member 1331 to be tested in the third direction to the testing mechanism 11 via the third transmission group 1372 and the first moving seat 136. The first L-shaped arm 133 is driven by the first motor 1322 to be displaced in the second direction by the first motor 1321, so that the first pick-and-place member 1331 presses the electronic component to be tested into the test socket 112. After the test is completed, after the test is completed, the first L-shaped arm 133 of the transfer mechanism 13 performs the second and third-direction displacement to transfer the measured electronic components to the discharge stage 122 of the transport mechanism 12 so as to be Output; however, since the loading and unloading stages 121, 122 are located on both sides of the testing mechanism 11, the transfer mechanism 13 must be configured to move the first movement in order to displace the first and second pick-and-place members 1331, 1351 in the Y direction. Seat 136, third motor 1371, third transmission group 1372, second moving seat 138, fourth motor 1391 And the fourth transmission group 1392 and other components for transfer, not only the overall mechanism is quite complicated, but also increases the mechanism cost and is not conducive to the device space configuration; further, when the second pick-and-place member 135 is displaced in the Y direction, the tested electronic components are tested. After the seat 112 is transferred to the discharge stage 122, it must be reversely displaced in the Y direction across the test seat 112 before being displaced to the loading stage 121 to continue to take the next test. The electronic components, so as to increase the transfer stroke and the operation time, can not improve the lack of test capacity.

本發明之目的一,係提供一種電子元件作業裝置,其係於機台之第一、二作業區配置作業機構及輸送機構,該作業機構係於第一、二作業區設有相對應之第一、二作業器,以對電子元件執行預設作業,該輸送機構係於第一、二作業區設有承載電子元件之第一、二載台,一移載機構係設有驅動器,並以驅動器帶動一橫跨第一、二作業區之承架位移,承架之兩側配置可移載電子元件之第一、二移載具;藉此,移載機構利用承架帶動第一、二移載具同步作X方向位移,使第一移載具於第一作業區之第一作業器及第一載台間移載電子元件,以及使第二移載具同步於第二作業區之第二作業器及第二載台間移載電子元件,不僅提升第一、二移載具之移載效能,並簡化移載用元件及利於空間配置,達到提升作業生產效能及節省成本之實用效益。 An object of the present invention is to provide an electronic component working device which is arranged in an operating mechanism and a transporting mechanism in the first and second working areas of the machine, and the working mechanism is provided in the first and second working areas. The first and second operators perform preset operations on the electronic components. The transport mechanism is provided with first and second stages for carrying electronic components in the first and second working areas, and a transfer mechanism is provided with a driver, and The driver drives a carrier displacement across the first and second working areas, and the first and second transfer carriers of the transferable electronic component are disposed on both sides of the carrier; thereby, the transfer mechanism utilizes the carrier to drive the first and second The transfer carrier synchronously shifts in the X direction, so that the first transfer carrier transfers the electronic component between the first operator and the first carrier in the first working area, and synchronizes the second transfer carrier to the second working area. The transfer of electronic components between the second operator and the second carrier not only improves the transfer efficiency of the first and second transfer carriers, but also simplifies the components for transfer and facilitates space configuration, thereby improving the practical production efficiency and saving cost. benefit.

本發明之目的二,係提供一種電子元件作業裝置,其中,該移載機構係於第一作業區及第二作業區之上方分別設有第一限位塊及第二限位塊,並於承架之兩側設有第一頂抵器及第二頂抵器,當承架一側之第一移載具承受電子元件之向上反作用力時,可利用第一頂抵器頂抵第一限位塊,而使第一頂抵器承受一向下反作用力,藉以防止承架裝配第一移載具之該側發生翹曲之情形,進而確保第一移載具壓抵電子元件於第一作業器有效執行預設作業,達到提升作業品質之實用效益。 An object of the present invention is to provide an electronic component working device, wherein the transfer mechanism is provided with a first limiting block and a second limiting block respectively above the first working area and the second working area, and The first abutting device and the second abutting device are disposed on both sides of the frame. When the first moving carrier on one side of the receiving frame receives the upward reaction force of the electronic component, the first abutting device can be used to abut the first The limiting block is subjected to a downward reaction force to prevent the side of the carrier from being warped on the side of the first transfer carrier, thereby ensuring that the first transfer member is pressed against the electronic component in the first The operator effectively performs the preset work to achieve the practical benefit of improving the quality of the work.

本發明之目的三,係提供一種應用電子元件作業裝置之測試分類設備,該測試分類設備包含機台、供料裝置、收料裝置、作業裝置、移料裝置及中央控制裝置,該供料裝置係裝配於機台上,並設有至少一容納待測電子元件之供料承置器;該收料裝置係裝配於機台上,並設有至少一容納已測電子元件之收料承置器;該作業裝置係裝配於機台上,並設有第一、二作業區及作業機構、輸送機構、移載機構,以移載電子元件及對電子元件執行預設作業;該移料裝置係裝配於機台上,並設有至少一移料器,以於供、收料裝置及作業裝置間移載電子元件;該中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業生產 效能之實用效益。 A third object of the present invention is to provide a test classification device for applying an electronic component working device, the test classification device comprising a machine table, a feeding device, a receiving device, a working device, a material moving device and a central control device, the feeding device Mounted on the machine table and provided with at least one feeding device for accommodating the electronic components to be tested; the receiving device is mounted on the machine table and provided with at least one receiving device for accommodating the tested electronic components The working device is mounted on the machine table, and is provided with first and second working areas and an operating mechanism, a conveying mechanism and a transfer mechanism for transferring electronic components and performing preset operations on the electronic components; the moving device Mounted on the machine table and provided with at least one feeder for transferring electronic components between the supply and receiving device and the working device; the central control device is used for controlling and integrating the devices to perform automation operations To achieve improved production Practical benefits of performance.

〔習知〕 [study]

11‧‧‧測試機構 11‧‧‧Test institutions

111‧‧‧測試電路板 111‧‧‧Test circuit board

112‧‧‧測試座 112‧‧‧ test seat

12‧‧‧輸送機構 12‧‧‧Transportation agencies

121‧‧‧入料載台 121‧‧‧Feeding platform

122‧‧‧出料載台 122‧‧‧Output loading platform

13‧‧‧移載機構 13‧‧‧Transportation agency

131‧‧‧機架 131‧‧‧Rack

1321‧‧‧第一馬達 1321‧‧‧First motor

1322‧‧‧第一傳動組 1322‧‧‧First Transmission Group

1323‧‧‧第一滑軌 1323‧‧‧First slide rail

133‧‧‧第一L型臂 133‧‧‧First L-arm

1331‧‧‧第一取放件 1331‧‧‧First pick and place

1332‧‧‧第一滑座 1332‧‧‧First slide

1333‧‧‧第二滑軌 1333‧‧‧Second rail

1341‧‧‧第二馬達 1341‧‧‧second motor

1342‧‧‧第二傳動組 1342‧‧‧Second gear set

1343‧‧‧第三滑軌 1343‧‧‧ third slide

135‧‧‧第二L型臂 135‧‧‧Second L-arm

1351‧‧‧第二取放件 1351‧‧‧Second pick and place

1352‧‧‧第三滑座 1352‧‧‧ Third slide

1353‧‧‧第四滑軌 1353‧‧‧fourth rail

136‧‧‧第一移動座 136‧‧‧First mobile seat

1361‧‧‧第二滑座 1361‧‧‧Second slide

1371‧‧‧第三馬達 1371‧‧‧third motor

1372‧‧‧第三傳動組 1372‧‧‧ Third transmission set

138‧‧‧第二移動座 138‧‧‧Second mobile seat

1381‧‧‧第四滑座 1381‧‧‧fourth slide

1391‧‧‧第四馬達 1391‧‧‧fourth motor

1392‧‧‧第四傳動組 1392‧‧‧Fourth drive set

〔本發明〕 〔this invention〕

20‧‧‧作業裝置 20‧‧‧Working device

211‧‧‧第一作業區 211‧‧‧First operation area

212‧‧‧第二作業區 212‧‧‧Second working area

22‧‧‧作業機構 22‧‧‧ operating agencies

221‧‧‧第一電路板 221‧‧‧First board

222、222A、222B、222C、222D‧‧‧第一測試座 222, 222A, 222B, 222C, 222D‧‧‧ first test seat

223‧‧‧第二電路板 223‧‧‧second circuit board

224、224A、224B、224C、224D‧‧‧第二測試座 224, 224A, 224B, 224C, 224D‧‧‧ second test seat

225A、225B、225C、225D‧‧‧第一下壓器 225A, 225B, 225C, 225D‧‧‧ first pressure reducer

226A、226B、226C、226D‧‧‧第二下壓器 226A, 226B, 226C, 226D‧‧‧ second pressure reducer

23‧‧‧輸送機構 23‧‧‧Transportation agencies

231‧‧‧第一載台 231‧‧‧First stage

2311‧‧‧第一容置槽 2311‧‧‧First accommodating slot

232‧‧‧第二載台 232‧‧‧Second stage

2321‧‧‧第二容置槽 2321‧‧‧Second accommodating slot

24‧‧‧移載機構 24‧‧‧Transportation agency

241‧‧‧第一驅動器 241‧‧‧First drive

242‧‧‧第二驅動器 242‧‧‧Second drive

243‧‧‧承架 243‧‧‧ Shelf

244‧‧‧第一移載具 244‧‧‧First Transfer Vehicle

245‧‧‧第二移載具 245‧‧‧Second transfer vehicle

246‧‧‧第一限位塊 246‧‧‧First Limit Block

247‧‧‧第二限位塊 247‧‧‧second limit block

248‧‧‧第一頂抵器 248‧‧‧First topping device

2481‧‧‧第一頂塊 2481‧‧‧First top block

249‧‧‧第二頂抵器 249‧‧‧Second topper

2491‧‧‧第二頂塊 2491‧‧‧second top block

250‧‧‧第三驅動器 250‧‧‧ third drive

31、32、33、34、35、36、37、38‧‧‧電子元件 31, 32, 33, 34, 35, 36, 37, 38‧‧‧ Electronic components

40‧‧‧機台 40‧‧‧ machine

50‧‧‧供料裝置 50‧‧‧Feeding device

51‧‧‧供料承置器 51‧‧‧Feeder

60‧‧‧收料裝置 60‧‧‧ receiving device

61‧‧‧收料承置器 61‧‧‧Receipt receiver

70‧‧‧移料裝置 70‧‧‧Transfer device

71‧‧‧移料器 71‧‧‧Transfer

第1圖:習知電子元件作業裝置之各機構配置示意圖(一)。 Fig. 1 is a schematic view showing the arrangement of various mechanisms of a conventional electronic component operating device (1).

第2圖:習知電子元件作業裝置之各機構配置示意圖(二)。 Figure 2: Schematic diagram of the configuration of each mechanism of the conventional electronic component operating device (2).

第3圖:習知電子元件作業裝置之移載機構示意圖。 Figure 3: Schematic diagram of the transfer mechanism of the conventional electronic component operating device.

第4圖:本發明作業裝置第一實施例之示意圖。 Figure 4 is a schematic view showing a first embodiment of the working device of the present invention.

第5圖:本發明作業裝置第一實施例之使用示意圖(一)。 Fig. 5 is a schematic view (1) showing the use of the first embodiment of the working device of the present invention.

第6圖:本發明作業裝置第一實施例之使用示意圖(二)。 Figure 6 is a schematic view showing the use of the first embodiment of the working device of the present invention (2).

第7圖:本發明作業裝置第一實施例之使用示意圖(三)。 Figure 7 is a schematic view showing the use of the first embodiment of the working device of the present invention (3).

第8圖:本發明作業裝置第一實施例之使用示意圖(四)。 Figure 8 is a schematic view showing the use of the first embodiment of the working device of the present invention (4).

第9圖:本發明作業裝置第一實施例之使用示意圖(五)。 Figure 9 is a schematic view showing the use of the first embodiment of the working device of the present invention (5).

第10圖:本發明作業裝置第二實施例之俯視圖。 Figure 10 is a plan view showing a second embodiment of the working device of the present invention.

第11圖:本發明作業裝置第二實施例之前視圖。 Figure 11 is a front elevational view of a second embodiment of the working device of the present invention.

第12圖:本發明作業裝置第二實施例之使用示意圖(一)。 Figure 12 is a schematic view showing the use of the second embodiment of the working device of the present invention (I).

第13圖:本發明作業裝置第二實施例之使用示意圖(二)。 Figure 13 is a schematic view showing the use of the second embodiment of the working device of the present invention (2).

第14圖:本發明作業裝置第二實施例之使用示意圖(三)。 Figure 14 is a schematic view showing the use of the second embodiment of the working device of the present invention (3).

第15圖:本發明作業裝置第二實施例之使用示意圖(四)。 Figure 15 is a schematic view showing the use of the second embodiment of the working device of the present invention (4).

第16圖:本發明作業裝置應用於測試分類設備之示意圖。 Figure 16 is a schematic view showing the application of the working device of the present invention to a test sorting device.

為使 貴審查委員對本發明作更進一步之瞭解,茲舉一較佳實施例並配合圖式,詳述如後:請參閱第4圖,本發明作業裝置20係於機台上配置有第一作業區211、第二作業區212、作業機構22、輸送機構23及移載機構24,該第一作業區211及第二作業區212係作相對應配置,該作業機構22係於第一作業區211設有至少一對電子元件執行預設作業之第一作業器,以及於第二作業區212設有至少另一對電子元件執行預設作業之第二作業器,更進一步,該第一、二作業器可為檢知器或測試器等,該預設作業可為外觀檢知作業或電性測試作業等,於本實施例中,該第一作業器係為測試器,並具有電性連接之第一電路板221及第一測試 座222,用以測試電子元件,該第二作業器亦為測試器,並具有電性連接之第二電路板223及第二測試座224,用以測試電子元件;該輸送機構23係於機台設有至少一承載電子元件之載台,更進一步,係於第一作業區211設有至少一承載電子元件之第一載台231,並於第二作業區212設有至少一承載電子元件之第二載台232,該第一、二載台231、232可為固定式或活動式,以承載待測電子元件或已測電子元件,或承置待測電子元件與已測電子元件,於本實施例中,輸送機構23係於第一作業區211之第一測試座222一側設有作第三方向(如Y方向)位移之第一載台231,該第一載台231具有承置待測電子元件或已測電子元件之第一容置槽2311,另於第二作業區212之第二測試座224另一側設有作Y方向位移之第二載台232,該第二載台232具有承置待測電子元件或已測電子元件之第二容置槽2321;該移載機構24係設於第一作業區211及第二作業區212之間,並設有至少一於第一、二作業區211、212之間位移的承架,於本實施例中,該移載機構24係於機台上設有呈第二方向(如Z方向)配置之第一驅動器241,以帶動一呈第一方向(如X方向)配置之第二驅動器242作較大行程之Z方向位移,該第二驅動器242上係設有一呈X方向配置且橫跨第一、二作業區211、212上方之承架243,使承架243可作Z-X方向位移,另該承架243係於對應第一作業區211之位置裝配有至少一第一移載具244,並於對應該第二作業區212之位置裝配有至少一第二移載具245,而以該承架243帶動第一移載具244及第二移載具245同步位移,該第一移載具244係於該第一作業器及該載台之間移載該電子元件,該第二移載具245於該載台及該第二作業器之間移載另一電子元件,亦即使第一移載具244於第一作業器及第一載台231間移載電子元件,並使第二移載具245於第二載台232及第二作業器移載另一電子元件,進而使第一、二移載具244、245同步迅速移動,並有效縮減移載用元件而節省成本及利於空間配置,更進一步,該第一、二移載具244、245可為單純移載電子元件之移載具,或為可移載及下壓電子元件之壓取具,於本實施例中,該第一移載具244係為壓取具且可作較小行程之Z方向位移,而於第一測試座222及第一載台231 間移載電子元件,並將電子元件壓抵於第一測試座222內而執行測試作業,該第二移載具245亦為壓取具且可作較小行程之Z方向位移,以於第二測試座224及第二載台232間移載電子元件,並將電子元件壓抵於第二測試座224內而執行測試作業,又該移載機構24係於第一作業區211及第二作業區212之上方分別設有第一限位塊246及第二限位塊247,並於承架243一側設有至少一可頂抵第一限位塊246之第一頂抵器248,以及於承架243之另一側設有至少一可頂抵第二限位塊247之第二頂抵器249,於本實施例中,該第一頂抵器248係為壓缸,並具有作Z方向位移之第一頂塊2481,以頂抵第一限位塊246,該第二頂抵器249亦為壓缸,並具有作Z方向位移之第二頂塊2491,以頂抵第二限位塊247。 In order to make the present invention further understand the present invention, a preferred embodiment will be described in conjunction with the drawings, which will be described in detail later. Referring to FIG. 4, the working device 20 of the present invention is first configured on the machine. The work area 211, the second work area 212, the work mechanism 22, the transport mechanism 23, and the transfer mechanism 24, the first work area 211 and the second work area 212 are arranged correspondingly, and the work mechanism 22 is tied to the first work. The area 211 is provided with a first operator that performs at least one pair of electronic components to perform a preset operation, and a second operator that is provided with at least another pair of electronic components to perform a preset operation in the second work area 212, and further, the first The second operator can be a detector or a tester. The preset operation can be an appearance inspection operation or an electrical test operation. In this embodiment, the first operator is a tester and has electricity. First connection board 221 and first test a 222 for testing the electronic component, the second operator is also a tester, and has a second circuit board 223 and a second test socket 224 electrically connected for testing the electronic component; the transport mechanism 23 is attached to the machine The stage is provided with at least one carrying platform for carrying electronic components, and further, at least one first loading stage 231 for carrying electronic components is disposed in the first working area 211, and at least one carrying electronic component is disposed in the second working area 212. The second stage 232, the first and second stages 231, 232 can be fixed or movable to carry the electronic component to be tested or the tested electronic component, or to carry the electronic component to be tested and the tested electronic component. In the embodiment, the transport mechanism 23 is disposed on the first test seat 222 side of the first working area 211 with a first stage 231 displaced in a third direction (such as the Y direction). The first stage 231 has The first receiving slot 2311 of the electronic component or the tested electronic component is mounted, and the second loading block 232 is disposed on the other side of the second testing block 224 of the second working area 212 for the Y direction. The second stage 232 has a second receiving slot 2321 for mounting the electronic component to be tested or the tested electronic component. The transfer mechanism 24 is disposed between the first working area 211 and the second working area 212, and is provided with at least one rack displaced between the first and second working areas 211, 212. In this embodiment, The transfer mechanism 24 is provided with a first driver 241 disposed in a second direction (such as the Z direction) on the machine table to drive a second driver 242 disposed in a first direction (eg, the X direction) to be larger. The Z-direction displacement of the stroke, the second driver 242 is provided with a frame 243 disposed in the X direction and spanning the first and second working areas 211, 212, so that the frame 243 can be displaced in the ZX direction, and the bearing The frame 243 is equipped with at least one first transfer carrier 244 at a position corresponding to the first working area 211, and at least one second transfer carrier 245 is assembled at a position corresponding to the second working area 212, and the carrier is 243 driving the first transfer carrier 244 and the second transfer carrier 245 to synchronously shift, the first transfer carrier 244 is to transfer the electronic component between the first operator and the carrier, the second transfer carrier 245 transferring another electronic component between the stage and the second operator, even if the first transfer carrier 244 is in the first operator and the first carrier 231 transfer electronic components, and the second transfer carrier 245 transfers the other electronic components to the second stage 232 and the second operator, thereby causing the first and second transfer carriers 244, 245 to move synchronously and rapidly. The utility model can effectively reduce the cost of the transfer component and facilitate the space arrangement. Further, the first and second transfer carriers 244 and 245 can be a transfer device for simply transferring electronic components, or can be used for transferring and depressing electronic components. In the embodiment, the first transfer carrier 244 is a press tool and can be displaced in the Z direction of a small stroke, and is in the first test seat 222 and the first stage 231. The electronic component is transferred and the electronic component is pressed into the first test socket 222 to perform a test operation. The second transfer carrier 245 is also a press tool and can be displaced in the Z direction of a small stroke. The test device 224 and the second stage 232 transfer electronic components, and the electronic components are pressed into the second test socket 224 to perform a test operation, and the transfer mechanism 24 is coupled to the first work area 211 and the second A first limiting block 246 and a second limiting block 247 are respectively disposed on the upper side of the working area 212, and at least one first topping device 248 is disposed on the side of the receiving frame 243 to abut the first limiting block 246. And at least one second abutment 249 occupies the second limiting block 247 on the other side of the frame 243. In the embodiment, the first abutting device 248 is a pressure cylinder and has The first top block 2481 is displaced in the Z direction to abut against the first limiting block 246. The second topping device 249 is also a pressure cylinder and has a second top block 2491 for displacement in the Z direction. Two limit blocks 247.

請參閱第5、6圖,由於第一作業區211處之第一測試座222內已預先置入待測之電子元件32,該移載機構24可利用第一驅動器241帶動承架243及第一、二移載具244、245同步作較大行程之Z方向向下位移,該第一移載具244即作較小行程之Z方向向下位移壓抵第一測試座222內之待測電子元件32執行測試作業,然因第一移載具244會承受待測電子元件32之向上反作用力,為避免承架243裝配有第一移載具244之該一側發生彎曲變形,因此於第一移載具244下壓待測之電子元件32時,該移載機構24利用第一頂抵器248驅動第一頂塊2481作Z方向向上位移頂抵於第一限位塊246,令第一頂抵器248承受第一限位塊246之向下反作用力,並利用此一向下反作用力而可防止承架243之一側向上彎曲變形,使得位於承架243一側之第一移載具244確實下壓待測之電子元件32於第一測試座222內有效地執行測試作業,另由於該第二移載具245已取出第二測試座224內之已測電子元件31,該輸送機構23之第二載台232即可作Y方向位移至第二移載具245之下方,以供第二移載具245作較小行程之Z方向向下位移將已測電子元件31移入第二載台232,並反向位移復位;由於第一移載具244仍保持下壓待測之電子元件32於第一測試座222內有效地執行測試作業,該輸送機構23之第二載台232作Y方向位移載出已測之電子元件31,再承載下一待測之電子元件33 至第二移載具245之下方,第二移載具245即作Z方向向下位移於第二載台232取出下一待測之電子元件33,並反向位移復位;因此,該第二移載具245可於第一移載具244下壓待測電子元件32之測試作業期間同步執行取放料作業,進而縮減作業時間以提升測試產能。 Referring to FIG. 5 and FIG. 6 , since the electronic component 32 to be tested is pre-positioned in the first test socket 222 at the first working area 211, the transfer mechanism 24 can drive the carrier 243 and the first by using the first driver 241. The first and second transfer carriers 244 and 245 are synchronously shifted downward in the Z direction of the larger stroke, and the first transfer carrier 244 is pressed downward in the Z direction of the smaller stroke to be pressed into the first test socket 222 to be tested. The electronic component 32 performs the test operation. However, since the first transfer carrier 244 is subjected to the upward reaction force of the electronic component 32 to be tested, in order to prevent the carrier 243 from being bent and deformed on the side of the first transfer carrier 244, When the first transfer carrier 244 presses down the electronic component 32 to be tested, the transfer mechanism 24 drives the first top block 2481 to the Z-direction upward displacement against the first limit block 246 by using the first topping device 248. The first abutting device 248 receives the downward reaction force of the first limiting block 246, and utilizes this downward reaction force to prevent one side of the bracket 243 from being bent and deformed laterally, so that the first shift on the side of the bracket 243 is performed. The carrier 244 does depress the electronic component 32 to be tested and performs the test effectively in the first test socket 222. In addition, since the second transfer carrier 245 has taken out the tested electronic component 31 in the second test socket 224, the second carrier 232 of the transport mechanism 23 can be displaced in the Y direction to the second transfer carrier 245. Below, the Z-direction downward displacement of the second transfer carrier 245 for a smaller stroke moves the measured electronic component 31 into the second stage 232 and is reverse-displaced to reset; since the first transfer carrier 244 remains pressed down The electronic component 32 to be tested effectively performs a test operation in the first test socket 222. The second stage 232 of the transport mechanism 23 is displaced in the Y direction to carry out the measured electronic component 31, and then carries the next electronic component to be tested. Element 33 Below the second transfer carrier 245, the second transfer carrier 245 is displaced downward in the Z direction to the second stage 232 to take out the next electronic component 33 to be tested, and is reversely displaced and reset; therefore, the second The transfer tool 245 can synchronously perform the pick and place operation during the test operation of pressing the electronic component 32 to be tested by the first transfer carrier 244, thereby reducing the working time to increase the test throughput.

請參閱第7圖,於第一測試座222內之電子元件32測試完畢後,移載機構24之第一移載具244係作較小行程之Z方向向上位移取出已測之電子元件32,並令第一頂抵器248驅動第一頂塊2481作Z方向向下位移脫離第一限位塊246,接著移載機構24係以第一驅動器241帶動承架243及第一、二移載具244、245同步作較大行程之Z方向向上位移復位,再利用第二驅動器242帶動承架243及第一、二移載具244、245同步作X方向位移,使具有已測電子元件32之第一移載具244由第一測試座222位移至第一載台231之上方,以及使具有待測電子元件33之第二移載具245由第二載台232位移至第二測試座224之上方。 Referring to FIG. 7, after the electronic component 32 in the first test socket 222 is tested, the first transfer carrier 244 of the transfer mechanism 24 is displaced upward in the Z direction of the smaller stroke to take out the measured electronic component 32. And the first topping device 248 drives the first top block 2481 to be displaced downward in the Z direction from the first limiting block 246, and then the transfer mechanism 24 drives the carrier 243 and the first and second transfer by the first driver 241. The 244 and 245 are synchronously shifted in the Z direction for a large stroke, and then the second actuator 242 drives the carrier 243 and the first and second transfer carriers 244 and 245 to be synchronously displaced in the X direction so that the electronic component 32 is tested. The first transfer carrier 244 is displaced from the first test seat 222 to above the first stage 231, and the second transfer carrier 245 having the electronic component 33 to be tested is displaced from the second stage 232 to the second test stand. Above 224.

請參閱第8、9圖,該移載機構24係以第一驅動器241帶動承架243及第一、二移載具244、245同步作較大行程之Z方向向下位移至預設位置,該第二移載具245即作較小行程之Z方向向下位移將待測之電子元件33移入壓抵於第二測試座224內執行測試作業,由於第二移載具245會承受待測電子元件33之向上反作用力,為避免承架243裝配第二移載具245之該另一側發生彎曲變形,因此於第二移載具245下壓待測之電子元件33時,該第二頂抵器249係驅動第二頂塊2491作Z方向向上位移頂抵第二限位塊247,令第二頂抵器249承受第二限位塊247之向下反作用力,利用此一向下反作用力而可防止承架243之另一側向上彎曲變形,使得位於承架243另一側之第二移載具245確實下壓待測之電子元件33於第二測試座224內有效地執行測試作業,另由於該第一移載具244已取出第一測試座222內之已測電子元件32,該輸送機構23之第一載台231即可作Y方向位移至第一移載具244之下方,以供第一移載具244作較小行程之Z方向向下位移將已測電子元件32移入第一載台231,並反向位移復位;然由於第二移載具245仍保持下壓待測之電子元件33於第二測 試座224內有效地執行測試作業,該輸送機構23之第一載台231係作Y方向位移載出已測之電子元件32,再承載下一待測之電子元件34至第一移載具244之下方,第一移載具244即作Z方向向下位移於第一載台231取出下一待測之電子元件34,並反向位移復位;因此,該第一移載具244可於第二移載具245下壓待測電子元件33之測試作業期間同步執行取放料作業,進而縮減作業時間以提升測試產能。 Referring to FIGS. 8 and 9, the transfer mechanism 24 is configured such that the first driver 241 drives the carrier 243 and the first and second transfer carriers 244 and 245 are simultaneously displaced in the Z direction of the larger stroke to the preset position. The second transfer carrier 245 is moved downward in the Z direction of the smaller stroke, and the electronic component 33 to be tested is moved into the second test socket 224 to perform the test operation, because the second transfer carrier 245 is subjected to the test. The upward reaction force of the electronic component 33 is to prevent the bracket 243 from being bent and deformed on the other side of the second transfer carrier 245. Therefore, when the second transfer carrier 245 presses down the electronic component 33 to be tested, the second The abutting device 249 drives the second top block 2491 to be displaced upward in the Z direction against the second limiting block 247, so that the second abutting device 249 is subjected to the downward reaction force of the second limiting block 247, and the downward reaction is utilized. The force prevents the other side of the frame 243 from being bent upwardly, so that the second transfer carrier 245 located on the other side of the frame 243 does press down the electronic component 33 to be tested in the second test socket 224 to effectively perform the test. The operation, and since the first transfer carrier 244 has taken out the measured electronic element in the first test socket 222 The first stage 231 of the transport mechanism 23 can be displaced in the Y direction below the first transfer carrier 244, so that the first transfer carrier 244 is displaced downward in the Z direction of the smaller stroke. The electronic component 32 is moved into the first stage 231 and is reversely displaced and reset; however, since the second transfer carrier 245 still keeps pressing down the electronic component 33 to be tested in the second measurement The test 224 effectively performs the test operation. The first stage 231 of the transport mechanism 23 is configured to shift the electronic component 32 to be tested in the Y direction, and then carry the next electronic component 34 to be tested to the first transfer carrier. Below the 244, the first transfer carrier 244 is displaced in the Z direction downwardly from the first stage 231 to take out the next electronic component 34 to be tested, and is reversely displaced and reset; therefore, the first transfer carrier 244 can be When the second transfer carrier 245 presses down the electronic component 33 to be tested, the pick-and-place operation is simultaneously performed during the test operation, thereby reducing the operation time to increase the test throughput.

請參閱第10、11圖,係本發明作業裝置20之第二實施例,其與第一實施例之差異在於該作業機構22係於第一作業區211設有複數個第一作業器及複數個壓抵電子元件之第一下壓器,由於第一下壓器係為習知技術,故在此不予贅述,於本實施例中,係於第一作業區211設有複數個第一測試座222A、222B、222C、222D,並於複數個第一測試座222A、222B、222C、222D處設有複數個作Z方向位移且可壓抵電子元件之第一下壓器225A、225B、225C、225D,另於第二作業區212相對應複數個第一作業器之位置設有複數個第二作業器,並於複數個第二作業器處設有複數個壓抵電子元件之第二下壓器,於本實施例中,第二作業區212設有複數個第二測試座224A、224B、224C、224D,並於複數個第二測試座224A、224B、224C、224D處設有複數個作Z方向位移且可壓抵電子元件之第二下壓器226A、226B、226C、226D;該輸送機構23之第一載台231係於複數個第一測試座222A、222B、222C、222D之側方作Y方向位移,而第二載台232則於複數個第二測試座224A、224B、224C、224D之另一側方作Y方向位移;該移載機構24係設有至少一驅動該第一驅動器241作Y方向位移之第三驅動器250,以帶動第一驅動器241、第二驅動器242、承架243、第一移載具244及第二移載具245同步作Y方向位移,使第一移載具244及第二移載具245位移至複數個第一測試座222A、222B、222C、222D及複數個第二測試座224A、224B、224C、224D,又由於作業機構22已配置有獨立之下壓器,該移載機構24之第一移載具244及第二移載具245可為單純之移載具,並可視作業需求而縮減第一、二限位塊及第一、二頂 抵器之配置。 Referring to FIGS. 10 and 11, a second embodiment of the working device 20 of the present invention differs from the first embodiment in that the working mechanism 22 is provided with a plurality of first working devices and plural numbers in the first working area 211. The first depressor that is pressed against the electronic component is not described here because the first depressor is a conventional technique. In the present embodiment, the first depressor is provided with a plurality of first The test sockets 222A, 222B, 222C, and 222D are provided with a plurality of first pressure reducers 225A, 225B that are displaced in the Z direction and can be pressed against the electronic components at the plurality of first test sockets 222A, 222B, 222C, and 222D. 225C, 225D, further comprising a plurality of second operators at positions corresponding to the plurality of first operators in the second working area 212, and a plurality of second pressing electronic components at the plurality of second working devices In the present embodiment, the second working area 212 is provided with a plurality of second test sockets 224A, 224B, 224C, and 224D, and is provided at a plurality of second test sockets 224A, 224B, 224C, and 224D. a second depressor 226A, 226B, 226C, 226D that is displaced in the Z direction and can be pressed against the electronic component; The first stage 231 of the transport mechanism 23 is displaced in the Y direction on the side of the plurality of first test sockets 222A, 222B, 222C, and 222D, and the second stage 232 is in the plurality of second test sockets 224A, 224B. The other side of the 224C, 224D is displaced in the Y direction; the transfer mechanism 24 is provided with at least one third driver 250 for driving the first driver 241 to be displaced in the Y direction to drive the first driver 241 and the second driver 242, the carrier 243, the first transfer carrier 244 and the second transfer carrier 245 are synchronously displaced in the Y direction, and the first transfer carrier 244 and the second transfer carrier 245 are displaced to the plurality of first test sockets 222A, 222B. 222C, 222D and a plurality of second test sockets 224A, 224B, 224C, 224D, and since the operating mechanism 22 has been configured with an independent downLoader, the first transfer carrier 244 and the second transfer of the transfer mechanism 24 245 can be a simple transfer vehicle, and can reduce the first and second limit blocks and the first and second tops depending on the operation requirements. The configuration of the device.

請參閱第12、13圖,於使用時,該移載機構24係以第三驅動器250帶動第一驅動器241、第二驅動器242、承架243、第一移載具244及第二移載具245同步作Y方向位移,令第一移載具244及第二移載具245分別位於第一測試座222A及第二測試座224A之側方,並利用第二驅動器242帶動承架243、第一移載具244及第二移載具245同步作X方向位移,使第一移載具244位於第一測試座222A之上方,並使第二移載具245位於第二載台232之上方,再以第一驅動器241帶動第二驅動器242、承架243、第一移載具244及第二移載具245同步作較大行程之Z方向位移至預設位置,接著第一移載具244即作較小行程之Z方向位移將預先取用之待測電子元件35移入第一測試座222A,此時,該第二移載具245亦作較小行程之Z方向位移於第二載台232上取出下一待測之電子元件36;接著該移載機構24利用第二驅動器242帶動承架243、第一移載具244及第二移載具245作X方向位移,使第一移載具244對應於第一載台231且作Z方向位移而取出下一待測之電子元件37,以及使第二移載具245對應於第二測試座224A且作Z方向位移而將待測電子元件36移入第二測試座224A,又由於第一移載具244已離開第一測試座222A之上方,該作業機構22即利用第一下壓器225A作Z方向位移而壓抵第一測試座222A內之待測電子元件35執行測試作業。 Referring to Figures 12 and 13, in use, the transfer mechanism 24 drives the first driver 241, the second driver 242, the carrier 243, the first transfer carrier 244, and the second transfer carrier with the third driver 250. 245 is synchronously displaced in the Y direction, so that the first transfer carrier 244 and the second transfer carrier 245 are respectively located on the side of the first test socket 222A and the second test socket 224A, and the second driver 242 is used to drive the carrier 243, the first The one-shift carrier 244 and the second transfer carrier 245 are synchronously displaced in the X direction such that the first transfer carrier 244 is located above the first test socket 222A and the second transfer carrier 245 is located above the second carrier 232. Then, the first driver 241 drives the second driver 242, the carrier 243, the first transfer carrier 244 and the second transfer carrier 245 to shift to the preset position in the Z direction of the larger stroke, and then the first transfer carrier 244 is the Z-direction displacement of the smaller stroke, and the pre-fetched electronic component 35 to be tested is moved into the first test seat 222A. At this time, the second transfer carrier 245 is also displaced in the Z direction of the smaller stroke to the second load. The next electronic component 36 to be tested is taken out from the stage 232; then the transfer mechanism 24 drives the carrier 2 by using the second driver 242. 43. The first transfer carrier 244 and the second transfer carrier 245 are displaced in the X direction, so that the first transfer carrier 244 is corresponding to the first stage 231 and is displaced in the Z direction to take out the next electronic component 37 to be tested. And moving the second electronic component 36 to the second test socket 224A corresponding to the second test carrier 224A and shifting in the Z direction, and the first transfer carrier 244 has left the first test socket 222A. Above, the working mechanism 22 performs the test operation by pressing the first pressure reducer 225A in the Z direction and pressing the electronic component 35 to be tested in the first test socket 222A.

請參閱第14、15圖,於第一下壓器225A及第二下壓器226A分別壓抵第一測試座222A及第二測試座224A內之電子元件35及電子元件36執行測試作業時,該移載機構24係以第三驅動器250帶動第一驅動器241、承架243、第一移載具244及第二移載具245同步作Y方向位移,使第一移載具244及第二移載具245位移至第一測試座222B及第二測試座224B之側方,由於第一移載具244已吸附下一待測之電子元件37,該移載機構24利用第二驅動器242帶動承架243、第一移載具244及第二移載具245同步作X方向位移,使第一移載具244位於第一測試座222B之上方,並 使第二移載具245位於第二載台232之上方,令第一移載具244作Z方向位移將待測之電子元件37移入第一測試座222B,以及令第二移載具245於第二載台232取出待測之電子元件38,使第一、二移載具244、245同步進行取放料作業,達到提升移載效能之使用效益。 Referring to FIGS. 14 and 15 , when the first voltage lowering device 225A and the second voltage reducing device 226A are respectively pressed against the electronic component 35 and the electronic component 36 in the first test socket 222A and the second test socket 224A, the test operation is performed. The transfer mechanism 24 drives the first driver 241, the carrier 243, the first transfer carrier 244 and the second transfer carrier 245 to simultaneously shift in the Y direction, so that the first transfer carrier 244 and the second carrier are driven by the third driver 250. The transfer carrier 245 is displaced to the side of the first test socket 222B and the second test socket 224B. Since the first transfer carrier 244 has adsorbed the next electronic component 37 to be tested, the transfer mechanism 24 is driven by the second driver 242. The carrier 243, the first transfer carrier 244 and the second transfer carrier 245 are synchronously displaced in the X direction, so that the first transfer carrier 244 is located above the first test socket 222B, and The second transfer carrier 245 is positioned above the second stage 232, so that the first transfer carrier 244 is displaced in the Z direction to move the electronic component 37 to be tested into the first test socket 222B, and the second transfer carrier 245 is The second stage 232 takes out the electronic component 38 to be tested, so that the first and second transfer carriers 244 and 245 perform the picking and discharging operations simultaneously, thereby achieving the use efficiency of improving the transfer efficiency.

請參閱第4、16圖,本發明之作業裝置20應用於測試分類設備為例,包含機台40、供料裝置50、收料裝置60、作業裝置20、移料裝置70及中央控制裝置(圖未示出),該供料裝置50係配置於機台40上,並設有至少一容納待測電子元件之供料承置器51;該收料裝置60係配置於機台40上,並設有至少一容納已測電子元件之收料承置器61;本發明之作業裝置20係配置於機台40上,並設有作業機構22、輸送機構23及移載機構24;該移料裝置70係裝配於機台40上,並設有至少一移料器,用以於供料裝置50、收料裝置60及作業裝置20間移載電子元件,於本實施例中,係以移料器71將供料裝置50之供料承置器51上待測的電子元件移載至移載機構23之第一載台231或第二載台232上,第一載台231或第二載台232係分別將待測之電子元件載送至作業機構22處,該移載機構24之第一移載具244或第二移載具245即於第一載台231或第二載台232上取出待測之電子元件,並利用第二驅動器242帶動承架243、第一移載具244及第二移載具245同步作X方向位移,使第一移載具244或第二移載具245將待測之電子元件移入第一測試座222或第二測試座224而執行測試作業,以及將第一測試座222或第二測試座224內之已測電子元件移載至第一載台231或第二載台232,由第一載台231或第二載台232載出已測電子元件,以供移料裝置70之移料器71取出已測之電子元件,並依據測試結果,將已測之電子元件輸送至收料裝置60之收料承置器61分類放置,中央控制裝置係用以控制及整合各裝置作動,以執行自動化作業,達到提升作業效能之實用效益。 Referring to Figures 4 and 16, the working device 20 of the present invention is applied to a test sorting device as an example, and includes a machine table 40, a feeding device 50, a receiving device 60, a working device 20, a moving device 70, and a central control device ( The feeding device 50 is disposed on the machine table 40, and is provided with at least one feeding device 51 for accommodating electronic components to be tested; the receiving device 60 is disposed on the machine table 40, And at least one receiving device 61 for accommodating the tested electronic components; the working device 20 of the present invention is disposed on the machine 40, and is provided with the working mechanism 22, the conveying mechanism 23 and the transfer mechanism 24; The material device 70 is mounted on the machine table 40, and is provided with at least one feeder for transferring electronic components between the feeding device 50, the receiving device 60 and the working device 20. In this embodiment, The feeder 71 transfers the electronic component to be tested on the supply receiver 51 of the feeding device 50 to the first stage 231 or the second stage 232 of the transfer mechanism 23, the first stage 231 or the first stage The two stages 232 respectively carry the electronic components to be tested to the working mechanism 22, and the first transfer carrier 244 or the second transfer of the transfer mechanism 24 245 is to take out the electronic component to be tested on the first stage 231 or the second stage 232, and use the second driver 242 to drive the frame 243, the first transfer carrier 244 and the second transfer carrier 245 to synchronize X. The directional displacement causes the first transfer carrier 244 or the second transfer carrier 245 to move the electronic component to be tested into the first test socket 222 or the second test socket 224 to perform a test operation, and the first test socket 222 or the second The tested electronic components in the test socket 224 are transferred to the first stage 231 or the second stage 232, and the tested electronic components are carried by the first stage 231 or the second stage 232 for the loading device 70. The loader 71 takes out the measured electronic components, and according to the test result, the measured electronic components are transported to the receiving and receiving device 61 of the receiving device 60 for sorting, and the central control device is used for controlling and integrating the devices. In order to perform automated operations, the practical benefits of improving operational efficiency are achieved.

20‧‧‧作業裝置 20‧‧‧Working device

211‧‧‧第一作業區 211‧‧‧First operation area

212‧‧‧第二作業區 212‧‧‧Second working area

22‧‧‧作業機構 22‧‧‧ operating agencies

221‧‧‧第一電路板 221‧‧‧First board

222‧‧‧第一測試座 222‧‧‧First test seat

223‧‧‧第二電路板 223‧‧‧second circuit board

224‧‧‧第二測試座 224‧‧‧Second test seat

23‧‧‧輸送機構 23‧‧‧Transportation agencies

231‧‧‧第一載台 231‧‧‧First stage

2311‧‧‧第一容置槽 2311‧‧‧First accommodating slot

232‧‧‧第二載台 232‧‧‧Second stage

2321‧‧‧第二容置槽 2321‧‧‧Second accommodating slot

24‧‧‧移載機構 24‧‧‧Transportation agency

241‧‧‧第一驅動器 241‧‧‧First drive

242‧‧‧第二驅動器 242‧‧‧Second drive

243‧‧‧承架 243‧‧‧ Shelf

244‧‧‧第一移載具 244‧‧‧First Transfer Vehicle

245‧‧‧第二移載具 245‧‧‧Second transfer vehicle

246‧‧‧第一限位塊 246‧‧‧First Limit Block

247‧‧‧第二限位塊 247‧‧‧second limit block

248‧‧‧第一頂抵器 248‧‧‧First topping device

2481‧‧‧第一頂塊 2481‧‧‧First top block

249‧‧‧第二頂抵器 249‧‧‧Second topper

2491‧‧‧第二頂塊 2491‧‧‧second top block

Claims (9)

一種電子元件作業裝置,包含:機台:係設有第一作業區及第二作業區;作業機構:係於該機台之第一作業區設有至少一對電子元件執行預設作業之第一作業器,以及於該機台之第二作業區設有至少一對電子元件執行預設作業之第二作業器;輸送機構:係於該機台設有至少一承載電子元件之載台;移載機構:係設有第二驅動器,並以該第二驅動器帶動一承架於該第一、二作業區之間作第二方向位移,該承架之一側係裝配至少一作Z方向位移之第一移載具,並於另一側裝配至少一作Z方向位移之第二移載具,該第一移載具係於該第一作業器及該載台之間移載該電子元件,該第二移載具於該載台及該第二作業器之間移載另一電子元件。 An electronic component working device includes: a machine: a first working area and a second working area; and an operating mechanism: at least one pair of electronic components in the first working area of the machine performs a preset operation An operator, and a second operator in the second work area of the machine is provided with at least one pair of electronic components to perform a preset operation; and a transport mechanism is provided with at least one carrier carrying the electronic components; The transfer mechanism is provided with a second driver, and the second driver drives a frame to be displaced between the first and second working areas in a second direction, and one side of the frame is assembled with at least one displacement in the Z direction. First shifting the carrier, and assembling at least one second transfer carrier in the Z direction on the other side, the first transfer carrier transferring the electronic component between the first operator and the stage, The second transfer carrier transfers another electronic component between the stage and the second operator. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該輸送機構係於該機台之第一作業區設有至少一承載電子元件之第一載台,以及於該機台之第二作業區設有至少一承載電子元件之第二載台。 The electronic component working device according to claim 1, wherein the conveying mechanism is provided with at least one first carrier carrying the electronic component in the first working area of the machine, and the first stage of the machine The second working area is provided with at least one second stage carrying electronic components. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該移載機構係設有呈Z方向配置之第一驅動器,以帶動該第二驅動器作Z方向位移。 The electronic component working device according to claim 1, wherein the transfer mechanism is provided with a first actuator arranged in the Z direction to drive the second actuator to be displaced in the Z direction. 依申請專利範圍第3項所述之電子元件作業裝置,其中,該移載機構係設有呈Y方向配置之第三驅動器,以帶動該第一驅動器及該承架作Y方向位移。 The electronic component working device according to claim 3, wherein the transfer mechanism is provided with a third driver disposed in the Y direction to drive the first driver and the carrier to be displaced in the Y direction. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該移載機構之第一移載具及該第二移載具係為單純移載電子元件之移載具,或為移載及下壓電子元件之壓取具。 The electronic component working device according to claim 1, wherein the first transfer carrier and the second transfer carrier of the transfer mechanism are transfer carriers for simply transferring electronic components, or are transferable And pressing the electronic component. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該移載機構係於該第一作業器及該第二作業器之上方分別設有第一限位塊及第二限位塊,並於該承架一側相對應該第一限位塊之位置設有至少一第一頂抵器,該承架之另一側相對應該第二限位塊之位置設有至少一第二 頂抵器。 The electronic component working device according to claim 1, wherein the transfer mechanism is provided with a first limiting block and a second limiting block respectively above the first working device and the second working device. And at least one first abutting device is disposed at a position corresponding to the first limiting block on the side of the receiving frame, and the other side of the receiving frame is provided with at least one second corresponding to the position of the second limiting block Topping. 依申請專利範圍第6項所述之電子元件作業裝置,其中,該第一頂抵器及該第二頂抵器係為壓缸。 The electronic component working device according to claim 6, wherein the first abutting device and the second abutting device are pressure cylinders. 依申請專利範圍第1項所述之電子元件作業裝置,其中,該作業機構係於該第一作業區設有複數個該第一作業器及複數個第一下壓器,以及於該第二作業區設有複數個該第二作業器及複數個第二下壓器,該輸送機構之載台係作Y方向位移。 The electronic component working device according to claim 1, wherein the operating mechanism is provided with the plurality of the first working device and the plurality of first depressors in the first working area, and the second The working area is provided with a plurality of the second working device and a plurality of second pressing devices, and the carrier of the conveying mechanism is displaced in the Y direction. 一種應用電子元件作業裝置之測試分類設備,包含:機台;供料裝置:係配置於該機台上,並設有至少一供料承置器,用以容納至少一待測之電子元件;收料裝置:係配置於該機台上,並設有至少一收料承置器,用以容納至少一已測之電子元件;至少一依申請專利範圍第1項所述之電子元件作業裝置:係配置於該機台上,用以測試及移載電子元件;移料裝置:係裝配於該機台上,用以於該供料裝置、收料裝置及該作業裝置之間移載電子元件;中央控制裝置;係用以控制及整合各裝置作動,以執行自動化作業。 A test classification device for applying an electronic component working device, comprising: a machine table; a feeding device: disposed on the machine table, and provided with at least one feeding device for accommodating at least one electronic component to be tested; Receiving device: disposed on the machine, and provided with at least one receiving device for accommodating at least one tested electronic component; at least one electronic component working device according to claim 1 : being disposed on the machine for testing and transferring electronic components; and a loading device: being mounted on the machine for transferring electrons between the feeding device, the receiving device and the working device Components; central control unit; used to control and integrate the various devices to perform automated operations.
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