JP2016092019A - Calibration method in component mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a calibration method in a component mounting device that can correct a recognition error with high precision by a simple method in a construction of moving a camera and a board holder and perform board recognition at plural positions.SOLUTION: In a construction that a board holder is movable between a first position and a second position, in an imaging unit moving mechanism calibration step for determining a recognition error caused by an imaging unit moving mechanism, recognition correction data are determined on the basis of an imaging result obtained by imaging a tool board which is individually located at a first position and a second position respectively, and a positional displacement detection result in an overlap range of the tool boards located at the first position and the second position, and in a board holder moving mechanism calibration step for determining a recognition error caused by a board holder moving mechanism, a recognition error caused by the board holder moving mechanism 4 is determined on the basis of an imaging result obtained by imaging the tool board every time the tool board is moved at plural times by the board holder moving mechanism.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a calibration method for obtaining a recognition error inherent in a recognition area in advance for recognition correction in a component mounting apparatus used in a component mounting line.

  A component mounting line that manufactures a mounting board by mounting components on a board includes component mounting devices such as a screen printing device that prints solder on the substrate and a component mounting device that mounts electronic components on the printed board. Used. In these component mounting apparatuses, for the purpose of ensuring the printing position accuracy and the mounting position accuracy, optical position recognition for detecting the position of the substrate or the like by recognizing the imaging result by the camera is frequently used. .

  In this position recognition, since a plurality of positions on the substrate are to be recognized, the camera is moved with respect to the substrate by the camera moving mechanism. If there is a mechanism error in the camera moving mechanism, the camera An error occurs in the recognition result depending on the moving position. In order to suppress such errors and improve recognition accuracy, calibration for correcting recognition errors caused by camera movement has been conventionally performed (see Patent Document 1). In the prior art shown in this patent document example, the recognition correction data is obtained by measuring the positional deviation of the reference mark on the recognition screen of the camera using a jig substrate in which the reference mark having a predetermined position accuracy is formed in a lattice shape. Like to get.

JP 2000-353899 A

  By the way, depending on the configuration of the component mounting apparatus, not only the camera is moved with respect to the board held at the fixed position as in the above-described prior art example, but also the board held by the movable board holding unit is moved. May be In such a configuration, it is necessary to correct a recognition error caused by moving the substrate holder. However, the above-described prior art has not disclosed a method for correcting a complex recognition error caused by the movement of both the camera and the substrate holding unit with a simple method with high accuracy.

  Accordingly, the present invention provides a calibration method in a component mounting apparatus capable of correcting a recognition error with high accuracy by a simple method in a configuration in which a substrate is recognized at a plurality of positions by moving a camera and a substrate holder. For the purpose.

  The calibration method in the component mounting apparatus according to the present invention includes a substrate holding unit that holds a substrate carried in the substrate carry-in direction, and a first position and a second position set in a direction orthogonal to the substrate carry-in direction. A substrate holding unit moving mechanism that allows the substrate holding unit to move, an imaging unit that images the substrate held by the substrate holding unit, and an image acquired by the imaging unit A recognition processing unit for recognizing the position of the substrate, an imaging unit moving mechanism that allows the imaging unit to move within a range including a recognition area that is a target of the position recognition, and a predetermined amount with respect to the substrate A component mounting apparatus comprising: a work mechanism that executes a work operation for component mounting; and a component mounting apparatus that obtains in advance a recognition error specific to the position recognition in the recognition area as recognition correction data. An imaging unit moving mechanism calibration step for obtaining the recognition error caused by the imaging unit moving mechanism, and a substrate holding unit moving mechanism calibration for obtaining the recognition error caused by the substrate holding unit moving mechanism. A first imaging that images a grid-like mark formed on a jig substrate held by the substrate holding unit at the first position. A second imaging step of imaging a grid-like mark formed on the jig substrate held by the substrate holding unit at the second position, the first imaging step, and the second imaging step. A shift acquisition step of acquiring a shift amount of the imaging result in the overlapping imaging range in the imaging step, and the imaging result in the first imaging step and the second imaging step The recognition error caused by the imaging unit moving mechanism is obtained based on the imaging result obtained and the deviation amount in the deviation acquisition step, and the substrate holding unit moving mechanism calibration step performs the correction held by the substrate holding unit. A jig substrate moving step of moving the tool substrate a plurality of times by the substrate holding portion moving mechanism, and the imaging unit moved by the imaging portion moving mechanism that corrects the error and fixed at a predetermined position in the jig substrate moving step And a third imaging step of imaging the lattice-shaped marks formed on the jig substrate each time the movement is performed, and based on the imaging result in the third imaging step, the substrate holding unit moving mechanism The recognition error resulting from is obtained.

  According to the present invention, the recognition error can be corrected with high accuracy by a simple method in the configuration in which the substrate is recognized at a plurality of positions by moving the camera and the substrate holder.

1 is a side sectional view of a screen printing apparatus according to an embodiment of the present invention. The top view of the screen printing apparatus of one embodiment of this invention Functional explanatory diagram of a screen printing apparatus according to an embodiment of the present invention The block diagram which shows the structure of the control system of the screen printing apparatus of one embodiment of this invention FIG. 4 is a flowchart of calibration processing in the screen printing apparatus according to the embodiment of the present invention. Process explanatory drawing of the calibration process in the screen printing apparatus of one embodiment of this invention Process explanatory drawing of the calibration process in the screen printing apparatus of one embodiment of this invention Process explanatory drawing of the calibration process in the screen printing apparatus of one embodiment of this invention Operation explanatory diagram of a screen printing apparatus according to an embodiment of the present invention Operation explanatory diagram of a screen printing apparatus according to an embodiment of the present invention Operation explanatory diagram of a screen printing apparatus according to an embodiment of the present invention Operation explanatory diagram of a screen printing apparatus according to an embodiment of the present invention

  Next, embodiments of the present invention will be described with reference to the drawings. First, the structure and function of a screen printing apparatus 1 as a component mounting apparatus will be described with reference to FIGS. The screen printing apparatus 1 has a function of executing a screen printing operation, which is a work operation for mounting a predetermined component on a substrate, in a component mounting line that mounts electronic components on the substrate to produce a mounting substrate. .

  In FIG. 1, the screen printing apparatus 1 includes a substrate holding unit 3 that holds a substrate 2 that is loaded in the X direction (the direction perpendicular to the paper in FIG. 1), which is a substrate loading direction, and the substrate holding unit 3 is a substrate holding unit. It can be moved by the moving mechanism 4. The substrate holding unit moving mechanism 4 has an X-axis table 11b and a θ-axis table 11c stacked on a Y-axis table 11a disposed on the base 1a, and a moving base unit 11d is coupled to the upper surface of the θ-axis table 11c. It has a configuration. By driving the substrate holding part moving mechanism 4, the substrate holding part 3 can move horizontally in the X direction and the Y direction, and can be rotated in the θ direction.

  Here, the stroke in the Y direction orthogonal to the X direction is set to be the largest among the movement strokes by the substrate holding part moving mechanism 4, and the substrate holding part moving mechanism 4 is configured as shown in FIGS. The holding part 3 can be moved between the first position [P1] and the second position [P2] (see arrows a and b). As shown in FIG. 3, the first position [P1] is set to a position overlapping the screen mask 20 in plan view below the screen mask 20 of the mask unit 6, and the second position [P2] is The first position [P1] is separated from the first position [P1] in the Y direction, and is set to a position that does not overlap the screen mask 20 in plan view.

  The configuration of the substrate holding unit 3 will be described. A first elevating plate 12 that can be moved up and down by a linear motion mechanism using the first elevating motor 13 as a drive source is disposed on the upper surface side of the moving base portion 11d. On the side, a second elevating plate 15 that can be moved up and down by a linear motion mechanism using the second elevating motor 14 as a drive source is disposed. A pair of frame members 16 are disposed in the X direction on the upper surface of the first elevating plate 12, and the frame members 16 hold a substrate transport mechanism 17 that transports the substrate 2 in the substrate holder 3.

  At the upper end of the frame member 16, a clamp member 18 for clamping and fixing the substrate 2 that has been carried in is disposed. By driving a clamp opening / closing mechanism 18a provided on the frame member 16 on one side, The loaded board 2 can be sandwiched and fixed from both sides by a pair of clamp members 18. The substrate 2 to be printed is carried into the substrate carry-in conveyor 27 from the upstream side (left side in FIG. 2), and delivered to the substrate carrying mechanism 17 located at the first position [P1]. Then, the printed substrate 2 is transferred from the substrate transport mechanism 17 to the substrate carry-out conveyor 28 and carried out downstream (right side in FIG. 2).

  A substrate lower part 19 is disposed on the upper surface of the second lift plate 15, and the substrate 2 is lifted by raising the second lift plate 15 with the substrate 2 being carried in by the substrate transport mechanism 17. It is received from the lower surface side by the lower receiving portion 19. Then, by operating the clamp member 18 in this state, the substrate 2 is fixedly held by the substrate holding unit 3. As shown in FIG. 2, the substrate 2 is formed with an electrode portion 2 a to be printed and a recognition mark 2 m for recognizing the position of the substrate 2.

  A screen printing mechanism 5 for executing a screen printing operation is disposed above the substrate holding unit 3. The screen printing mechanism 5 moves the squeegee head 7 in the Y direction, which is the squeezing direction, on the upper surface of the screen mask 20 of the mask unit 6 by the squeegee driving mechanism 8 having a linear motion mechanism including a squeegee driving motor 8a and a feed screw 8b. It is configured to reciprocate horizontally. As shown in FIG. 2, a pattern hole 20 a is formed in the screen mask 20 corresponding to the pattern of the electrode part 2 a formed on the substrate 2. Furthermore, a recognition mark 20m is formed at a position corresponding to the recognition mark 2m. When aligning the substrate 2 with respect to the screen mask 20, the substrate holding part moving mechanism 4 is driven based on the result of imaging and recognizing the recognition mark 2m and the recognition mark 20m.

  The screen printing apparatus 1 includes an imaging unit 9 that images the substrate 2 held by the substrate holding unit 3. The imaging unit 9 has a configuration in which a substrate recognition camera 9a and a mask recognition camera 9b, which are arranged in postures in which the imaging directions are downward and upward, are integrated. Imaging of the recognition mark 2m and the recognition mark 20m is performed by moving the imaging unit 9 in the X direction and the Y direction by the imaging unit moving mechanism 25. As shown in FIG. 2, the imaging unit moving mechanism 25 is configured to move the X-axis beam 25X, on which the imaging unit 9 is mounted so as to be movable in the X direction, by the Y-axis beam 25Y. In the present embodiment, the moving range of the imaging unit 9 by the imaging unit moving mechanism 25 is set so as to include the first position [P1] and the second position [P2].

  As a result, the imaging of the substrate 2 can be performed at either the first position [P1] or the second position [P2]. That is, as shown in FIG. 3, the imaging unit 9 is placed between the substrate 2 and the screen mask 20 with the substrate holding unit 3 holding the substrate 2 positioned at the first position [P1] below the mask unit 6. By advancing in between, position recognition for the substrate 2 and the screen mask 20 can be performed in parallel by the substrate recognition camera 9a and the mask recognition camera 9b, respectively.

  Further, the substrate recognition camera 9a targets the substrate 2 by moving the imaging unit 9 above the substrate 2 with the substrate holding unit 3 holding the substrate 2 positioned at the second position [P2]. Position recognition can be performed. That is, the imaging unit moving mechanism 25 is configured to be able to move the imaging unit 9 within a range including a recognition area that is a position recognition target for the substrate 2.

  The squeegee head 7 includes a pair of squeegees 22 that protrude from the lower surface of the moving block 21 that horizontally moves along the feed screw 8 b, and drives a squeegee lifting mechanism 23 provided on the upper surface of the moving block 21. The squeegee 22 is raised and lowered individually. In the screen printing operation by the screen printing mechanism 5, one squeegee 22 is brought into sliding contact with the upper surface of the screen mask 20 supplied with the paste 24.

  Then, by moving the squeegee head 7 in the squeezing direction in this state, the paste 24 is screen-printed on the substrate 2 through the pattern holes 20 a formed in the screen mask 20. Therefore, the screen printing mechanism 5 including the mask unit 6, the squeegee head 7, and the squeegee driving mechanism 8 is a work mechanism that executes a screen printing operation that is a work operation for mounting a predetermined component on the board 2.

  The lower surface of the screen mask 20 after screen printing is cleaned by the cleaning unit 10 in order to remove stains such as bleeding during printing. As shown in FIGS. 1 and 2, the cleaning unit 10 is disposed at a height position in sliding contact with the lower surface of the screen mask 20 so as to be horizontally movable in the Y direction by the unit moving mechanism 26.

  The cleaning unit 10 includes a cleaning head configured to wipe the paste on the lower surface of the screen mask 20 with a cleaning sheet, and is disposed along a holding portion 26 </ b> X extending in the X direction. The holding unit 26X is coupled to a Y-axis beam 26Y disposed in the Y direction so as to be movable in the Y direction. By driving the Y-axis beam 26Y, the cleaning unit 10 cleans the lower surface of the screen mask 20 ( FIG. 10 (a)).

  In the present embodiment, as described above, the imaging unit 9 can image the substrate 2 not only at the first position [P1] but also at the second position [P2]. Thereby, the substrate recognition of the substrate 2 by the imaging unit 9 at the second position [P2] and the mask cleaning of the screen mask 20 by the cleaning unit 10 at the first position [P1] can be performed in parallel. It has become.

  Next, the configuration of the control system will be described with reference to FIG. In FIG. 4, the screen printing apparatus 1 includes a control unit 30, a storage unit 31, a mechanism drive unit 32, and a recognition processing unit 33. The control unit 30 further includes a print control unit 30a and a calibration processing unit 30b. Yes. The print control unit 30a controls a screen printing operation by each unit described below. In this screen printing operation, various print data (not shown) stored in the storage unit 31 are referred to. When the substrate recognition camera 9a of the imaging unit 9 recognizes the recognition mark 2m of the substrate 2, the calibration processing unit 30b moves the substrate holding unit 3 by the substrate holding unit moving mechanism 4 and the imaging unit by the imaging unit moving mechanism 25. The process for calibration which calibrates the position recognition error caused by the movement of 9 is performed.

  The storage unit 31 stores calibration execution data 31a and calibration data 31b in addition to data necessary for executing the screen printing operation by the screen printing apparatus 1. The calibration execution data 31a is data necessary for executing calibration by the calibration processing unit 30b, and the calibration data 31b is position correction data acquired as a result of calibration.

  The mechanism driving unit 32 is controlled by the printing control unit 30a, and the substrate transport mechanism 17, the substrate holding unit 3, the substrate holding unit moving mechanism 4, the imaging unit moving mechanism 25, the squeegee head 7, the squeegee driving mechanism 8, the cleaning unit 10, The unit moving mechanism 26 is driven. Thereby, various operations for screen printing work by the screen printing apparatus 1 are executed. The recognition processing unit 33 performs a recognition process on images acquired by the substrate recognition camera 9a and the mask recognition camera 9b of the imaging unit 9. Thereby, the position recognition of the recognition mark 2m and the recognition mark 20m on the substrate 2 and the screen mask 20 is performed.

  Next, a calibration processing flow in the screen printing apparatus 1 will be described with reference to FIG. This calibration is performed for position recognition at a plurality of positions in the first position [P1] and the second position [P2], which are recognition areas by the board recognition camera 9a, when the assembly of the screen printing apparatus 1 is started. The inherent recognition error is obtained in advance as recognition correction data.

  In FIG. 5, the jig substrate 40 is held by the substrate holder 3 (ST1). The jig substrate 40 is formed by forming marks 41 in a lattice shape with high positional accuracy at a predetermined pitch on a rectangular substrate made of a material such as glass that has little expansion and contraction. In the calibration process, first, imaging part moving mechanism calibration for obtaining a recognition error caused by the imaging part moving mechanism 25 is executed (ST2) (imaging part moving mechanism calibration step).

  That is, as shown in FIG. 6A, the lattice-shaped mark 41 formed on the jig substrate 40 is imaged at the first position [P1] (ST2a) (first imaging step). At this time, all of the plurality of marks 41 formed on the jig substrate 40 are sequentially imaged according to a predetermined imaging sequence. Thereby, the recognition image W shown in FIG.6 (c) is acquired. In this imaging, the movement of the substrate recognition camera 9a is controlled so that the optical center 9c of the optical coordinate system coincides with the center of the nth mark 41n (position coordinates (Xn, Yn) in the machine coordinate system) on the control data. However, in reality, due to the movement error caused by the mechanism error of the image pickup unit moving mechanism 25, the optical center 9c does not necessarily coincide with the center of the mark 41n, and positional deviations of Δxn and Δyn are detected.

  That is, when the vicinity of the position coordinates (Xn, Yn) in the machine coordinate system is a position recognition target, it is necessary to further correct Δxn and Δyn with respect to the recognition position by the board recognition camera 9a. Therefore, by obtaining the positional deviations (Δxn, Δyn) for all the marks 41n, calibration data for correcting the positional deviation inherent in the machine coordinate system of the imaging unit moving mechanism 25 can be obtained. In the first imaging step shown in FIG. 6A, calibration data for the substrate 2 located at the first position [P1] is obtained.

  In the present embodiment, the position of the substrate 2 is recognized even when the substrate holding unit 3 that holds the substrate 2 is located at the second position [P2]. For this reason, it is necessary to obtain calibration data for the substrate 2 located at the second position [P2]. That is, the substrate holding part 3 holding the jig substrate 40 is moved to the second position [P2] and formed on the jig substrate 40 at the second position [P2] as shown in FIG. 6B. The lattice-shaped mark 41 thus formed is imaged in the same manner as in the first imaging process (ST2b) (second imaging process).

  At this time, the front end portion (front end portion in the movement direction) of the jig substrate 40 located at the first position [P1] and the end portion (in the movement direction) of the jig substrate 40 located at the second position [P2]. The amount of movement of the jig substrate 40 in the Y direction is set so that an overlapping range Z in which the imaging ranges in each of the rear end portions partially overlap is formed. That is, the overlapping range Z is imaged twice at the time of imaging at the first position [P1] and at the time of imaging at the second position [P2]. Here, an example is shown in which the overlapping range Z is set so that each of the mark rows in which the X-direction marks 41 at the front end portion and the rear end portion of the jig substrate 40 are arranged in a row is included. .

  Next, a deviation amount of the imaging results in the overlapping imaging range (overlapping range Z) is acquired (ST2c) (deviation acquisition step). That is, as shown in FIG. 7A, the overlapping range Z includes the most advanced mark row L1 of the jig substrate 40 (P1) located at the first position [P1] and the second position [P2]. The mark row L2 at the end of the jig substrate 40 (P2) positioned is included. In the movement of the jig substrate 40 from the first position [P1] to the second position [P2], the mark row L1 and the mark row L2 are moved due to a mechanism error of the Y-axis table 11a of the substrate holding unit moving mechanism 4. The misalignment data points 41 * corresponding to the respective marks constituting the same do not match, and the mark row L1 and the mark row L2 are in a misaligned state.

  Since the target calibration is for the entire recognition area including the first position [P1] and the second position [P2], the above-described mark row L1 and mark row L2 are used. The misregistration data points 41 * of the marks constituting the mark need to match. For this reason, here, the positional deviation of the marks 41 constituting the mark row L1 and the mark row L2 is detected, and the imaging result for the jig substrate 40 positioned at the second position [P2] by this positional deviation. The data conversion which corrects is done.

  An example of detection of this misalignment and data conversion will be described. FIG. 7B schematically illustrates this data conversion process. In FIG. 7B, each point on the mark rows L1 and L2 is a data point indicating a positional shift at each position, and each data point is obtained by detecting the position of the mark 41n at that position. A positional deviation amount (Δxn, Δyn) corresponds. At the time of data conversion, first, as shown in FIG. 7B, the data point 41 * (1) indicating the positional deviation of the leftmost mark belonging to the mark row L1 and the positional deviation of the leftmost mark belonging to the mark row L2. The error data dx, dy indicating the difference from the data point 41 * (2) indicating is obtained.

  Next, the error data dx, dy are corrected for all the positional deviation amounts (Δxn, Δyn) obtained in the jig substrate 40 (2) located at the second position [P2]. That is, as shown in FIG. 7C, the numerical data is translated so that the data point 41 * (2) overlaps the data point 41 * (1). As a result, as shown in FIG. 7B, the data points 41 * (1) and 41 * (2) are overlapped. Next, a data conversion process for superimposing all data points belonging to the mark row L1 and the mark row L2 is performed. Here, as shown in FIG. 7C, the intersection angle θ of the mark rows L1 and L2 is obtained, and all the displacement amounts obtained in the jig substrate 40 (P2) located at the second position [P2]. For the data of (Δxn, Δyn), data conversion is performed by rotating the data point 41 * (1) (data point 41 * (2)) by θ.

  Here, the difference from the leftmost data points 41 * (1) and 41 * (2) of the respective mark rows L1 and L2 and the intersection angle θ between the mark rows L1 and L2 are used as error data. Differences may be obtained for all corresponding data points in the mark rows L1 and L2, and the average value may be used as error data.

  As a result of this data conversion processing, as shown in FIG. 7D, the positional deviation obtained for the recognition mark belonging to the mark row L1 at the tip of the jig substrate 40 (P1) located at the first position [P1]. The data and the positional deviation data obtained for the last mark row L2 of the jig substrate 40 (P2) located at the second position [P2] are overlaid so as to have the same value on the numerical data. Accordingly, two pieces of positional deviation data separately obtained for the jig substrate 40 located at each of the first position [P1] and the second position [P2] are converted into the first position [P1], the second position [P1], and the second position [P2]. For the recognition area including the second position [P2], it is possible to synthesize the same misalignment data as obtained using one continuous jig substrate. That is, in the above-described data conversion, the recognition error caused by the imaging unit moving mechanism 25 is obtained based on the imaging results in (ST2a) and (ST2b) and the shift amount acquired in (ST2c) (ST2d).

  In the present embodiment, the example in which only one mark row is included in the overlapping range Z has been described. However, the range may be set so that a plurality of mark rows are included in the overlapping range Z. In this case, an average value of differences between the corresponding mark rows is obtained, and the above-described data conversion is performed using this average value. Further, the data conversion example is not limited to the example shown here, and a data conversion method further simplified according to desired position recognition accuracy may be used.

  Next, substrate holding unit moving mechanism calibration for obtaining a recognition error caused by the substrate holding unit moving mechanism is executed (ST3) (substrate holding unit moving mechanism calibration step). Here, from the state shown in FIG. 6B, as shown in FIG. 8A, the substrate holding unit 3 is moved again to the first position [P1], and the imaging unit 9 is moved to the position shown in FIG. 6B. Move to above the overlapping range Z and fix the position. In the movement of the imaging unit 9, the imaging unit 9 is moved by the imaging unit moving mechanism 25 in a state where the error is corrected by the above-described imaging unit moving mechanism calibration.

  Next, as shown in FIG. 8B, the jig substrate 40 held by the substrate holding unit 3 is moved a plurality of times at predetermined pitch increments (see arrow c) by the substrate holding unit moving mechanism 4 (ST3a). Substrate movement process). In this movement of the jig substrate 40 a plurality of times, the lattice-like mark 41 formed on the jig substrate 40 is imaged every time it is moved by the substrate recognition camera 9a of the imaging unit 9 fixed at a predetermined position (ST3b). (Third imaging step). Here, the vicinity of the center line in the Y direction of the jig substrate 40 is set as an imaging target, and a plurality of marks 41 arranged in this imaging range are sequentially imaged by the movement of the jig substrate 40. And based on this imaging result, the recognition error resulting from the board | substrate holding | maintenance part moving mechanism 4 is calculated | required (ST3c). In this third imaging step, the number of data points in the data conversion described below can be increased as much as possible by positioning the imaging unit 9 above the overlapping range Z in FIG. Can be improved.

  With reference to FIG. 8C, data conversion for obtaining the recognition error will be described. The mark row L3 is a data point 41 corresponding to the above-described imaging range among the data points 41 * obtained by imaging the jig substrate 40 located at the first position [P1] in (ST2a) described above. The mark row corresponding to * is shown. The mark row L4 indicates a mark row corresponding to the data point 41 * obtained by imaging the imaging range each time the jig substrate 40 is moved in the third imaging step.

  Here, the data point 41 * (3) at the lower end of the mark row L3 coincides with 41 * (4) at the lower end of the mark row L4, and the jig substrate 40 moves in the Y direction. The data point 41 * of the mark row L3 and the data point 41 * of the mark row L4 do not coincide with each other due to a mechanism error of the substrate holding unit moving mechanism 4. That is, the degree of mismatch between the mark row L3 and the mark row L4 indicates the degree of recognition error caused by the mechanism error of the substrate holding unit moving mechanism 4. Here, similarly to the data conversion described in FIG. 7C in the imaging unit moving mechanism calibration step, data conversion is performed so that the mark row L3 and the mark row L4 coincide with each other, and the data conversion result is expressed as (ST2d). This is applied to the recognition error caused by the imaging unit moving mechanism 25 obtained in (1). Thereby, the substrate holding part moving mechanism calibration for approximately correcting the recognition error caused by the movement of the jig substrate 40 in the Y direction due to the mechanism error of the substrate holding part moving mechanism 4 is performed.

  Next, calibration data including recognition errors caused by the imaging unit moving mechanism 25 and the substrate holding unit moving mechanism 4 is created and stored (ST4). That is, the position recognition correction data acquired in each of the imaging unit moving mechanism calibration step and the substrate holding unit moving mechanism calibration step is combined to create calibration data, which is stored in the storage unit 31 as calibration data 31b. Then, the calibration process is terminated (ST5).

  Next, screen printing work by the screen printing apparatus 1 will be described with reference to FIGS. First, as shown in FIG. 9A, the substrate 2 is carried from the upstream device to the substrate transport mechanism 17 in a state where the substrate holder 3 is positioned at the first position [P1]. Next, as shown in FIG. 9B, the substrate holding part moving mechanism 4 is driven to move the substrate holding part 3 to the second position [P2] (arrow d). At this time, the second lifting / lowering motor 14 is driven to raise the second lifting / lowering plate 15 together with the substrate lower receiving portion 19 to receive the substrate 2 from the lower surface side (arrow e), and the clamp member 18 holds the substrate 2. Clamp and clamp (arrow f).

  Next, as shown in FIG. 10A, the substrate recognition operation by the imaging unit 9 and the mask cleaning by the cleaning unit 10 are performed in parallel. That is, the imaging unit 9 is moved above the substrate 2 held by the substrate holding unit 3 located at the second position [P2], and the recognition mark 2m (see FIG. 2) formed on the substrate 2 is imaged. At the same time, the cleaning unit 10 advances to the lower surface side of the mask unit 6 by the unit moving mechanism 26, and the cleaning head of the cleaning unit 10 is brought into sliding contact with the lower surface of the screen mask 20 to execute mask cleaning (arrow g). .

  When the substrate recognition operation and the mask cleaning operation are finished, as shown in FIG. 10B, the substrate holding unit 3 is moved to the first position [P1] on the lower surface side of the mask unit 6 (arrow h). Then, based on the above-described substrate recognition result and the recognition result of the recognition mark 20m obtained by imaging the lower surface of the screen mask 20 in advance by the mask recognition camera 9b of the imaging unit 9, the substrate 2 is aligned with the screen mask 20. To do.

  Next, as shown in FIG. 11A, the first elevating motor 13 is driven to raise the frame member 16 together with the first elevating plate 12 (arrow i). As a result, the substrate 2 that is received by the substrate receiving portion 19 and clamped by the clamp member 18 contacts the lower surface of the screen mask 20. Next, as shown in FIG. 11B, the squeegee head 7 is moved in the squeegeeing direction with the squeegee 22 on one side lowered and in contact with the upper surface of the screen mask 20 supplied with the paste 24. (Arrow j). Thereby, the paste 24 is printed on the electrode portion 2a of the substrate 2 through the pattern hole 20a of the screen mask 20 (see FIG. 2).

  Next, plate separation for separating the printed substrate 2 from the screen mask 20 is performed. As shown in FIG. 12A, the first elevating motor 13 is driven to lower the frame member 16 together with the first elevating plate 12 (arrow k). Thereby, the substrate 2 in a state where the paste 24 is printed on the upper surface and clamped and fixed by the clamp member 18 is separated from the lower surface of the screen mask 20.

  Next, the substrate 2 is unclamped. That is, as shown in FIG. 12B, after the clamp by the clamp member 18 is released (arrow l), the second lift motor 14 is driven to lower the substrate lower support portion 19 together with the second lift plate 15. (Arrow m). Thereby, the receiving state of the substrate 2 by the substrate receiving portion 19 is released, and the substrate 2 is supported by the substrate transport mechanism 17. Then, by driving the substrate transport mechanism 17 in this state, the printed substrate 2 is transferred to the substrate carry-out conveyor 28 (FIG. 2) and carried downstream. Thereby, the screen printing operation for dealing with one substrate 2 is completed.

  As described above, in the calibration method in the component mounting apparatus shown in the present embodiment, the imaging unit moving mechanism 25 has a configuration in which the substrate holding unit can be moved between the first position and the second position. An imaging result obtained by imaging the jig substrate 40 individually positioned at the first position [P1] and the second position [P2] in the imaging unit moving mechanism calibration step for obtaining the recognition error caused by A substrate for obtaining recognition correction data based on the position deviation detection result in the overlapping range of the jig substrate 40 located at the position [P1] and the second position [P2], and for obtaining a recognition error caused by the substrate holding unit moving mechanism. In the holding unit moving mechanism calibration step, the recognition caused by the substrate holding unit moving mechanism 4 is based on the imaging result of imaging the jig substrate 40 each time the jig substrate 40 is moved a plurality of times by the substrate holding unit moving mechanism. So that obtaining an error. Thereby, in the structure which moves the imaging part 9 and the board | substrate holding | maintenance part 3, and performs board | substrate recognition in multiple positions, a recognition error can be corrected with a simple method with high precision.

  In the above embodiment, the screen printing apparatus 1 that screen-prints the paste 24 on the substrate 2 is shown as the component mounting apparatus. However, the application of the present invention is not limited to the screen printing apparatus 1, As long as it is equipment used in the component mounting line and is configured to be able to move the board holding portion between the first position and the second position set in the direction orthogonal to the board carry-in direction, Applicable.

  The calibration method in the component mounting apparatus according to the present invention has an effect that the recognition error can be corrected with high accuracy by a simple method in a configuration in which the camera and the board holding unit are moved to perform board recognition at a plurality of positions. It is useful in the field of executing work operations for component mounting such as screen printing on a board.

DESCRIPTION OF SYMBOLS 1 Screen printing apparatus 2 Board | substrate 3 Board | substrate holding | maintenance part 4 Board | substrate holding | maintenance part moving mechanism 5 Screen printing mechanism 7 Squeegee head 8 Squeegee drive mechanism 9 Imaging part 10 Cleaning unit 20 Screen mask 25 Imaging part moving mechanism 40 Jig board 41 Mark
[P1] First position
[P2] Second position Z Overlapping range

Claims (4)

A substrate holding unit for holding the substrate loaded in the substrate loading direction;
A substrate holding portion moving mechanism that allows the substrate holding portion to move between a first position and a second position set in a direction orthogonal to the substrate carry-in direction;
An imaging unit that images the substrate held by the substrate holding unit;
A recognition processor that recognizes the position of the substrate by recognizing an image acquired by the imaging unit;
An imaging unit moving mechanism that allows the imaging unit to move within a range including a recognition area that is a target of position recognition;
In a component mounting apparatus comprising: a work mechanism that executes a predetermined component mounting work operation on the substrate;
A calibration method in a component mounting apparatus that obtains in advance a recognition error unique to the position recognition in the recognition area as recognition correction data,
An imaging unit moving mechanism calibration step for obtaining the recognition error caused by the imaging unit moving mechanism;
A substrate holding unit moving mechanism calibration step for obtaining the recognition error caused by the substrate holding unit moving mechanism,
The imaging unit moving mechanism calibration process includes:
A first imaging step of imaging a grid-like mark formed on the jig substrate held by the substrate holding unit at the first position;
A second imaging step of imaging a grid-like mark formed on the jig substrate held by the substrate holder at the second position;
Including a shift acquisition step of acquiring a shift amount of an imaging result in an imaging range overlapping in the first imaging step and the second imaging step,
Based on the imaging result in the first imaging step, the imaging result in the second imaging step, and the deviation amount in the deviation acquisition step, the recognition error caused by the imaging unit moving mechanism is obtained,
The substrate holding unit moving mechanism calibration process includes:
A jig substrate moving step of moving the jig substrate held by the substrate holding part a plurality of times by the substrate holding part moving mechanism;
In the jig substrate moving step, the lattice-shaped marks formed on the jig substrate are imaged each time the movement is performed by the imaging unit that is moved by the imaging unit moving mechanism that corrects the error and is fixed at a predetermined position. And a third imaging step to
A calibration method in a component mounting apparatus, wherein the recognition error caused by the board holding unit moving mechanism is obtained based on an imaging result in the third imaging step.   The calibration method for a component mounting apparatus according to claim 1, wherein in the third imaging step, the imaging unit is positioned in the overlapping imaging range. The component mounting apparatus is a screen printing apparatus that prints a paste by bringing the board held by the board holding unit into contact with a screen mask,
The calibration method for a component mounting apparatus according to claim 1, wherein the first position is set to a position overlapping the screen mask in plan view below the screen mask.   The second position is separated from the first position in a direction orthogonal to the substrate transport direction in the screen printing apparatus, and is set to a position that does not overlap the screen mask in plan view. The calibration method in the component mounting apparatus according to claim 3.

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