CN110446424B - Multifunctional double-station flexible welding head mechanism - Google Patents
Multifunctional double-station flexible welding head mechanism Download PDFInfo
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- CN110446424B CN110446424B CN201910815276.8A CN201910815276A CN110446424B CN 110446424 B CN110446424 B CN 110446424B CN 201910815276 A CN201910815276 A CN 201910815276A CN 110446424 B CN110446424 B CN 110446424B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 41
- 238000003466 welding Methods 0.000 title claims abstract description 35
- 230000033001 locomotion Effects 0.000 claims abstract description 61
- 239000003292 glue Substances 0.000 claims abstract description 39
- 238000007598 dipping method Methods 0.000 claims abstract description 37
- 238000009434 installation Methods 0.000 claims abstract description 16
- 230000003014 reinforcing effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 description 14
- 230000009471 action Effects 0.000 description 9
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 101150082208 DIABLO gene Proteins 0.000 description 1
- 102100033189 Diablo IAP-binding mitochondrial protein Human genes 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
- H05K13/0465—Surface mounting by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0817—Monitoring of soldering processes
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
The invention relates to a multifunctional double-station flexible welding head mechanism, which comprises a top plate, wherein the bottom surface of the top plate is supported by two side plates; a linear motion assembly is arranged in the middle of the bottom surface of the top plate, and two welding head mechanisms are arranged below the linear motion assembly in parallel; the single welding head mechanism comprises a base assembly, a Z-axis driving assembly is arranged on the base assembly, and a first supporting plate is arranged on the Z-axis driving assembly; one end of the first supporting plate is provided with a glue dipping component, the other end of the first supporting plate is provided with a suction nozzle component, and the first supporting plate positioned beside the suction nozzle component is also provided with a camera component; the welding head mechanism is driven by the linear motion assembly to independently perform X-direction and Y-direction motions; during the paster, dip in gluey subassembly dips in and gets and glue application on the object, and the suction nozzle subassembly absorbs the chip, dips in gluey subassembly and suction nozzle subassembly and accomplish accurate positioning under camera module's cooperation. The invention is suitable for the simultaneous or different-height installation of one or more chips, and has the advantages of high installation precision, high efficiency and in-place control of the installation force so that the chips are not damaged.
Description
Technical Field
The invention relates to the technical field of chip mounting equipment, in particular to a multifunctional double-station flexible welding head mechanism.
Background
A chip mounter, also called a "mounter" or a "surface mounting system", is a device for realizing high-speed and high-precision mounting of components, which accurately places surface mounted components, such as chips, on a PCB substrate by a moving soldering head.
In the prior art, a single chip mounter is generally only suitable for mounting a single chip, and the mounting precision is about +/-10 microns; the chip mounter capable of simultaneously mounting two or more chips is often slow in mounting speed, and the hourly productivity is about 400-500; the precision and the speed are integrated, the chip mounter is suitable for multi-chip mounting, the size is larger due to the poor functional integration level, the occupied area is larger, and the chip mounting environment is usually a hundred-grade workshop, so that chip manufacturers generally tend to have chip mounting equipment with relatively smaller size; on the other hand, the mounting accuracy of the chip mounter usually uses a camera recognition system on the soldering head to recognize the position of the chip to be mounted on the PCB substrate, so that the chip is sucked and placed on the position through the suction nozzle head, but the camera recognition system on the existing chip mounter cannot meet the requirements of mounting chips with different heights on the same PCB substrate due to the fact that the lens of the camera recognition system cannot be automatically focused.
Disclosure of Invention
Aiming at the defects in the prior art, the applicant provides a multifunctional double-station flexible welding head mechanism with reasonable structure, thereby realizing high-precision and high-efficiency chip loading of chips, being applicable to simultaneous operation of multiple chips and multi-height chip loading, having good applicability and installing the chips in place.
The technical scheme adopted by the invention is as follows:
a multifunctional double-station flexible welding head mechanism comprises a top plate, wherein two opposite edges of the bottom surface of the top plate are provided with side plates; a linear motion assembly is arranged on the bottom surface of the top plate between the two side plates, and two welding head mechanisms are arranged below the linear motion assembly in parallel;
the structure of the single welding head mechanism is as follows: the device comprises a base assembly fixedly arranged on a linear motion assembly, wherein a Z-axis driving assembly is arranged on the base assembly, a first supporting plate is arranged on the Z-axis driving assembly, and the first supporting plate is driven by a motor to move up and down; the glue dipping component is arranged at one end of the first supporting plate, the suction nozzle component is arranged at the other end of the first supporting plate, and the camera component is further arranged on the first supporting plate beside the suction nozzle component.
As a further improvement of the above technical scheme:
the structure of the glue dipping component is as follows: the device comprises a second support plate fixedly arranged with a first support plate, wherein a cylinder is fixedly arranged on the second support plate along the vertical direction, a first guide rail is arranged on the second support plate beside the cylinder, the first guide rail is parallel to the movement direction of the cylinder, and a first slide block sliding along the first guide rail is arranged on the first guide rail; the output end of the air cylinder and the sliding block are commonly provided with a support plate III; and a guide rail II is arranged on the support plate III in the vertical direction, a slide block II which slides along the guide rail II is arranged on the guide rail II, a needle seat is arranged on the slide block II, and a glue dipping needle head is arranged at the bottom of the needle seat.
The three tops of the supporting plate are provided with a first mounting block, a guide shaft vertically penetrates through the first mounting block, the bottom end of the guide shaft extends into the top of the needle seat, and a spring is sleeved on the guide shaft between the first mounting block and the needle seat; the needle seat is characterized in that the mounting block II of the L-shaped structure is mounted on the three side edges of the supporting plate, the mounting block III of the L-shaped structure is mounted on the side edges of the needle seat, the mounting block II and the mounting block III are oppositely arranged to form a 'mouth' -shaped structure, a lower contact is mounted on the inner side surface of the mounting block II, an upper contact is mounted on the inner side surface of the mounting block III, and the upper contact is located above the lower contact and is in contact with each other.
The lower part of the second side edge of the supporting plate is provided with a fourth installation block with an L-shaped structure, and the bottom of the fourth installation block is provided with a screw rod; the screw rod penetrates through the mounting block IV, and the screw rod is located below the supporting plate III.
The structure of the Z-axis driving assembly is as follows: the device comprises a mounting block five and a mounting block six which are fixedly arranged on a base assembly and are arranged at intervals up and down, wherein a screw rod is commonly arranged on the mounting block five and the mounting block six, and a supporting plate five is arranged on the screw rod between the mounting block five and the mounting block six in a matched manner; the upper end part of the screw rod extends out of the mounting block five, and the upper end head of the screw rod is provided with a belt wheel I; the motor is installed at the bottom of the installation block five, the output end of the motor extends out of the installation block five upwards, the end head of the output end of the motor is provided with a belt wheel two, and the belt wheel two is connected with the belt wheel two through a belt.
A guide rail III is further arranged on the base component beside the screw rod, the guide rail III is parallel to the screw rod, and a sliding block III sliding along the guide rail III is arranged on the guide rail III; five ends of the supporting plate are sleeved on the screw rod, and the other ends of the supporting plate are fixedly arranged with the sliding block III.
The structure of the base component is as follows: the device comprises a bottom plate fixedly arranged with a linear motion assembly, a connecting plate is fixedly arranged on the bottom surface of the bottom plate, and a supporting plate four of an L-shaped structure is fixedly arranged at the lower part of the side edge of the connecting plate; the connecting plate is fixedly arranged on the inner side surface of the fourth supporting plate, and the outer side surface of the fourth supporting plate is fixedly arranged with the Z-axis driving assembly; reinforcing ribs are further arranged between the four side walls of the supporting plate.
The linear motion assembly has the structure that: the linear motor I is fixedly arranged in the middle of the bottom surface of the top plate, and the installation direction of the linear motor I is perpendicular to the side plate; auxiliary motion guide rails are arranged on the bottom surfaces of the top plates positioned on two sides of the linear motion motor; the auxiliary moving guide rails are parallel to the first linear moving motor, the two auxiliary moving guide rails and the first linear moving motor are jointly provided with the second linear moving motor which is parallel to each other, and each second linear moving motor is provided with a welding head mechanism.
The suction nozzle assembly has the structure that: the device comprises a support plate six fixedly arranged with the support plate one, wherein a linear and rotary actuator is fixedly arranged on the six side surfaces of the support plate, a suction nozzle is arranged at the output end of the linear and rotary actuator, and the suction nozzle is connected with an external air source; a height sensor is also mounted on the side of the linear and rotary actuator beside the suction nozzle.
The camera component has the structure that: the device comprises a support plate seven fixedly arranged with the support plate one, a zoom lens is fixedly arranged on the side face of the support plate seven, and a CCD camera is arranged at the top of the zoom lens.
The beneficial effects of the invention are as follows:
the invention has compact and reasonable structure and convenient operation, realizes the independent X-direction and Y-direction movements of the welding head mechanism by the first linear movement motor and the second linear movement motor, and drives the glue dipping component, the suction nozzle component and the camera component to simultaneously perform Z-axis movements by the Z-axis driving component, thereby realizing the movements of the glue dipping component and the suction nozzle component in space; during the paster, glue dipping component dips in glue and glues to the object, like on the PCB base plate, and the suction nozzle subassembly absorbs the chip and places its accuracy, pressure equipment on the object, before glue dipping, suction piece, all treat PCB base plate, the chip of installation through camera subassembly and enlarge the shooting respectively, calculate and confirm PCB base plate, chip coordinate value through inside algorithm to realized the high accuracy of chip, automatic piece, and be applicable to the installation of multichip and many heights, application scope is wide.
The invention also has the following advantages:
the glue dipping component is matched with the guide rail I to realize independent up-and-down movement under the action of the air cylinder, and the air cylinder is contracted upwards after the glue dipping and dispensing actions are finished so as to avoid interference when the suction nozzle component is attached;
the screw is positioned below the third supporting plate, the third supporting plate is limited again by the top end of the screw when driven by the air cylinder to move to the lowest end, and the top end height of the third supporting plate is adjusted by rotating the screw, so that the falling height of the third supporting plate is adjusted;
the motor works, so that the belt wheel I is driven to rotate through the belt wheel II and the belt, and the screw rod rotates, so that the up-and-down movement of the supporting plate V is realized;
the two welding head mechanisms are independently operated, so that double-station simultaneous operation is realized, and the whole volume of the equipment is greatly reduced.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic view of the structure of the welding head mechanism of the present invention.
Fig. 3 is an exploded view (another view) of fig. 2.
Fig. 4 is a schematic structural view of the dipping glue assembly of the present invention.
Fig. 5 is an exploded view of fig. 4.
FIG. 6 is a schematic view of the structure of the Z-axis driving assembly of the present invention.
Fig. 7 is a schematic structural view of a base assembly according to the present invention.
Fig. 8 is a schematic structural view of a linear motion assembly according to the present invention.
Wherein: 1. a top plate; 2. a side plate; 3. a linear motion assembly; 31. a linear motion motor I; 32. an auxiliary moving guide rail; 33. a linear motion motor II; 4. a welding head mechanism; 41. a base assembly; 42. a Z-axis drive assembly; 43. a first supporting plate; 44. a suction nozzle assembly; 45. a camera assembly; 46. dipping the glue assembly; 411. a bottom plate; 412. a connecting plate; 413. a support plate IV; 414. reinforcing ribs; 4201. a mounting block V; 4202. a guide rail III; 4203. a third slide block; 4204. a screw rod; 4205. a fifth supporting plate; 4206. a mounting block six; 4207. a belt wheel I; 4208. a belt; 4209. a belt wheel II; 4210. a motor; 441. a sixth support plate; 442. a linear plus rotary actuator; 443. a suction nozzle; 451. a CCD camera; 452. a support plate seven; 453. a zoom lens; 4601. a cylinder; 4602. a third supporting plate; 4603. a first guide rail; 4604. a first sliding block; 4605. a second guide rail; 4606. a second slide block; 4607. needle seat; 4608. a first mounting block; 4609. a guide shaft; 4610. a mounting block IV; 4611. a screw; 4612. a second mounting block; 4613. a third mounting block; 4614. a glue dipping needle head; 4615. a second supporting plate; 4616. and (3) a spring.
Detailed Description
The following describes specific embodiments of the present invention with reference to the drawings.
As shown in fig. 1, the multifunctional double-station flexible welding head mechanism of the embodiment comprises a top plate 1, wherein two opposite edges of the bottom surface of the top plate are provided with side plates 2; a linear motion assembly 3 is arranged on the bottom surface of the top plate 1 between the two side plates 2, and two welding head mechanisms 4 are arranged below the linear motion assembly 3 in parallel;
as shown in fig. 2 and 3, the structure of the single horn mechanism 4 is: the device comprises a base component 41 fixedly arranged on a linear motion component 3, wherein a Z-axis driving component 42 is arranged on the base component 41, a first support plate 43 is arranged on the Z-axis driving component 42, and the first support plate 43 is driven by a motor 4210 to move up and down; one end of the first support plate 43 is provided with a glue dipping component 46, the other end of the first support plate 43 is provided with a suction nozzle component 44, and the first support plate 43 positioned beside the suction nozzle component 44 is also provided with a camera component 45; the Z-axis driving assembly 42 drives the dipping assembly 46, the suction nozzle assembly 44 and the camera assembly 45 to move along the Z-axis.
The two welding head mechanisms 4 are independently operated, so that double-station simultaneous operation is realized, and the whole volume of the equipment is greatly reduced.
As shown in fig. 4 and 5, the dip-coating assembly 46 is structured as follows: the device comprises a second support plate 4615 fixedly arranged with a first support plate 43, a cylinder 4601 is fixedly arranged on the second support plate 4615 along the vertical direction, a first guide rail 4603 is arranged on the second support plate 4615 beside the cylinder 4601, the first guide rail 4603 is parallel to the movement direction of the cylinder 4601, and a first slide block 4604 sliding along the first guide rail 4603 is arranged on the first guide rail; the output end of the cylinder 4601 and the first slide block 4604 are jointly provided with a third support plate 4602; a second guide rail 4605 is arranged on the third support plate 4602 along the vertical direction, a second slide block 4606 which slides along the second guide rail 4605 is arranged on the second guide rail 4605, a needle seat 4607 is arranged on the second slide block 4606, and a glue dipping needle 4614 is arranged at the bottom of the needle seat 4607.
The glue dipping needle 4614 and the needle seat 4607 together, under the action of the air cylinder 4601, are matched with the first guide rail 4603 to realize independent up-and-down movement, and after the glue dipping and dispensing actions are completed, the air cylinder 4601 is retracted upwards to avoid interference when the suction nozzle assembly 44 is attached.
The top of the supporting plate III 4602 is provided with a first mounting block 4608, a guide shaft 4609 vertically penetrates through the first mounting block 4608, the bottom end of the guide shaft 4609 stretches into the top of the needle seat 4607, and a spring 4616 is sleeved on the guide shaft 4609 between the first mounting block 4608 and the needle seat 4607; the side of the third support plate 4602 is provided with a second mounting block 4612 with an L-shaped structure, the side of the needle seat 4607 is provided with a third mounting block 4613 with an L-shaped structure, the second mounting block 4612 and the third mounting block 4613 are oppositely arranged to form a 'mouth' -shaped structure, the inner side surface of the second mounting block 4612 is provided with a lower contact, the inner side surface of the third mounting block 4613 is provided with an upper contact, and the upper contacts are positioned above the lower contacts and are mutually contacted; the upper contact and the lower contact are respectively and electrically connected with the controller through an external signal generator.
The needle seat 4607 is arranged on the guide rail II 4605 through the slide block II 4606, when the glue dipping needle 4614 at the bottom of the needle seat 4607 contacts an object, the needle seat 4607 moves upwards along the guide rail II 4605 along with the slide block II 4606 under the force of the spring 4616 to compress, the upper contact moves upwards along with the needle seat 4607, so that the upper contact and the lower contact which are contacted with each other are separated, and the signal generator sends a signal for disconnecting the upper contact from the lower contact to the controller, and the height of the disconnected signal provides real-time height information for the pasting of the subsequent suction nozzle assembly 44; after the glue-dipping needle 4614 leaves the object, the glue-dipping needle 4614 is protruded downward with the needle holder 4607 under the action of the spring 4616 and its own weight to be reset.
The lower part of the side edge of the second support plate 4615 is provided with a fourth installation block 4610 with an L-shaped structure, and the bottom of the fourth installation block 4610 is provided with a screw 4611; screw 4611 extends through mounting block four 4610, screw 4611 being located below support plate three 4602; the third support plate 4602 is limited again by the top end of the screw 4611 when the third support plate 4602 moves to the lowest end by the driving of the air cylinder 4601, and the height of the top end is adjusted by rotating the screw 4611, so that the falling height of the third support plate 4602 is adjusted.
As shown in fig. 6, the Z-axis drive assembly 42 is configured to: the base comprises a mounting block five 4201 and a mounting block six 4206 which are fixedly arranged on a support plate four 413 in the base assembly 41 and are arranged at intervals up and down, a screw rod 4204 is mounted on the mounting block five 4201 and the mounting block six 4206 together, and a support plate five 4205 is mounted on the screw rod 4204 between the mounting block five 4201 and the mounting block six 4206 in a matched mode; the upper end of the screw 4204 extends out of the mounting block five 4201, and a pulley one 4207 is mounted at the upper end of the screw 4204; the motor 4210 is installed at the bottom of the installation block five 4201, the output end of the motor 4210 extends out of the installation block five 4201 upwards, a pulley two 4209 is installed at the end of the output end of the motor 4210, and the pulley one 4207 is connected with the pulley two 4209 through a belt 4208; the motor 4210 operates to drive the first pulley 4207 to rotate through the second pulley 4209 and the belt 4208, and the screw 4204 to rotate, thereby realizing the up-and-down movement of the fifth support plate 4205.
A third guide rail 4202 is also mounted on the fourth support plate 413 beside the screw 4204, the third guide rail 4202 is parallel to the screw 4204, and a third slider 4203 is mounted on the third guide rail 4202 for sliding along the third guide rail; one end of a fifth support plate 4205 is sleeved on the screw rod 4204, and the other end of the fifth support plate 4205 is fixedly arranged with a third slide block 4203.
As shown in fig. 7, the base assembly 41 has the structure that: comprises a bottom plate 411 fixedly arranged with the linear motion assembly 3, a connecting plate 412 is fixedly arranged on the bottom surface of the bottom plate 411, and a supporting plate four 413 with an L-shaped structure is fixedly arranged at the lower part of the side edge of the connecting plate 412; the connecting plate 412 is fixedly arranged on the inner side surface of the fourth supporting plate 413, and the outer side surface of the fourth supporting plate 413 is fixedly arranged with the Z-axis driving assembly 42; reinforcing ribs 414 are also arranged between the two side walls of the four supporting plates 413.
As shown in fig. 8, the linear motion assembly 3 has the structure that: the device comprises a first linear motion motor 31 fixedly arranged in the middle of the bottom surface of the top plate 1, and the installation direction of the first linear motion motor 31 is perpendicular to the side plate 2; the bottom surfaces of the top plates 1 positioned on two sides of the first linear motion motor 31 are provided with auxiliary motion guide rails 32; the auxiliary moving guide rails 32 are parallel to the first linear moving motor 31, two parallel second linear moving motors 33 are jointly arranged on the two auxiliary moving guide rails 32 and the first linear moving motor 31, a group of welding head mechanisms 4 are arranged on each second linear moving motor 33, and the second single linear moving motor 33 is driven by the first linear moving motor 31 to independently move along the second linear moving motor 33; the first linear motion motor 31 and the second linear motion motor 33 realize the independent X-direction and Y-direction motions of the welding head mechanism 4 and cooperate with the respective Z-axis driving assemblies 42, so that the respective glue dipping assemblies 46 and the suction nozzle assemblies 44 can move in space.
As shown in fig. 3, the suction nozzle assembly 44 has the structure: the device comprises a six support plate 441 fixedly arranged with a first support plate 43, wherein a linear and rotary actuator 442 is fixedly arranged on the side surface of the six support plate 441, a suction nozzle 443 is arranged at the output end of the linear and rotary actuator 442, and the suction nozzle 443 is connected with an external air source; a height sensor is also mounted to the side of the linear and rotary actuator 442 beside the nozzle 443.
As shown in fig. 3, the camera assembly 45 has the structure: comprises a support plate seven 452 fixedly arranged with the support plate one 43, a zoom lens 453 is fixedly arranged on the side surface of the support plate seven 452, and a CCD camera 451 is arranged at the top of the zoom lens 453.
In the present invention, the linear plus rotary actuator 442 is a commercially available product; the linear and rotary actuator 442 is selected from the SMAC brand, model LCR20-025-75-2; the grating ruler and the voice coil motor are arranged in the interior of the device; the grating ruler is used for feeding back the Z-axis height value of the suction nozzle 443 in real time during the pasting action; the voice coil motor changes the magnitude of the acting force applied to the chip during the lamination by changing the magnitude of the current, thereby ensuring that the chip is firmly laminated and is not damaged.
The working principle of the invention is as follows:
the first linear motion motor 31 works to drive the welding head mechanism 4 to perform X-direction linear motion along the auxiliary motion guide rail 32; the second linear motion motor 33 works to drive the welding head mechanism 4 on the second linear motion motor to perform Y-direction linear motion; the motor 4210 in the Z-axis driving assembly 42 works, the belt wheel II 4209 and the belt 4208 drive the belt wheel I4207 to rotate, the screw rod 4204 further rotates, the five support plate 4205 matched with the screw rod 4204 moves up and down along the guide rail III 4202, and the glue dipping assembly 46, the camera assembly 45 and the suction nozzle assembly 44 perform Z-direction linear motion;
the first step: the welding head mechanism 4 moves to the position of the PCB substrate under the common drive of the first linear motion motor 31 and the second linear motion motor 33, so that the CCD camera 451 in the camera assembly 45 is positioned right above the position of the chip to be pasted on the PCB substrate, the PCB substrate is amplified and shot through the CCD camera 451 and the zoom lens 453, and the coordinate of the position of the chip to be pasted is calculated and confirmed through an internal algorithm;
and a second step of: the welding head mechanism 4 moves to a glue dipping position under the common drive of the first linear motor 31 and the second linear motor 33, so that the glue dipping assembly 46 is positioned right above a glue dipping disc, the air cylinder 4601 works, the glue dipping needle 4614 and the needle seat 4607 move downwards along the first guide rail 4603 along with the third support plate 4602, the glue dipping needle 4614 stretches into the glue dipping disc to dip glue, and the air cylinder 4601 acts reversely to drive the glue dipping needle 4614 to move upwards;
and a third step of: the welding head mechanism 4 moves to the position of the PCB substrate under the common drive of the first linear motor 31 and the second linear motor 33, so that the glue dipping needle 4614 is positioned at the position to be pasted with a chip on the PCB substrate, and the work of the cylinder 4601 in the second step is repeated, so that the glue dipping needle 4614 is contacted with the PCB substrate, and glue is applied to the appointed position of the PCB substrate; the glue dipping needle 4614 is retracted under the action of the cylinder 4601;
fourth step: the welding head mechanism 4 moves to the chip position under the common drive of the first linear motion motor 31 and the second linear motion motor 33, so that the CCD camera 451 in the camera assembly 45 is positioned right above the chip, the chip is amplified and shot through the CCD camera 451 and the zoom lens 453, and the chip coordinates are calculated and confirmed through an internal algorithm;
fifth step: under the common driving of the first linear motion motor 31 and the second linear motion motor 33, the welding head mechanism 4 enables the suction nozzle assembly 44 to be positioned right above the chip in the fourth step, and the suction nozzle 443 sucks the chip under the action of an external air source;
sixth step: the welding head mechanism 4 moves to the position of the PCB substrate under the common drive of the first linear motor 31 and the second linear motor 33, so that the suction nozzle assembly 44 is positioned at the position of the chip to be pasted on the PCB substrate, an external air source is disconnected, the suction nozzle 443 puts down the chip, and the suction nozzle 443 applies proper force to the chip under the action of the linear and rotary actuator 442, so that the chip is firmly pasted on the PCB substrate; thus completing the pasting work of the single chip.
When the invention is used, the glue dipping and dispensing operations in the second step and the third step can be omitted, and the invention is used for stably and efficiently mounting chips.
When the mounting requirements of different heights on the PCB substrate are met, the height of the position to be mounted is measured through the height measuring sensor, the motor 4210 works, and the height of the camera assembly 45 is adjusted according to the height measuring signal of the height measuring sensor, so that the height of the CCD camera 451 corresponds to the mounting position and reaches the optimal recognition height, and the precise mounting of each height is realized.
The two groups of welding head mechanisms 4 can work simultaneously, and the same chip or different chips can be attached or installed; the single-group welding head mechanism 4 realizes continuous coating or mounting of a single chip or multiple chips under program control.
The invention has simple operation, realizes the automatic pasting of one or more chips, has high pasting efficiency, good precision and wide application range, and is reliable in chip pasting.
The above description is intended to illustrate the invention and not to limit it, the scope of which is defined by the claims, and any modifications can be made within the scope of the invention.
Claims (6)
1. A multifunctional double-station flexible welding head mechanism is characterized in that: comprises a top plate (1), wherein two opposite edges of the bottom surface of the top plate are provided with side plates (2); the bottom surface of the top plate (1) positioned between the two side plates (2) is provided with a linear motion assembly (3), and two welding head mechanisms (4) are arranged below the linear motion assembly (3) in parallel;
the structure of the single welding head mechanism (4) is as follows: the device comprises a base assembly (41) fixedly arranged on a linear motion assembly (3), wherein a Z-axis driving assembly (42) is arranged on the base assembly (41), a first support plate (43) is arranged on the Z-axis driving assembly (42), and the first support plate (43) is driven by a motor (4210) to move up and down; one end of the first supporting plate (43) is provided with a glue dipping component (46), the other end of the first supporting plate (43) is provided with a suction nozzle component (44), and the first supporting plate (43) beside the suction nozzle component (44) is also provided with a camera component (45); the glue dipping component (46) is of a structure that: the device comprises a support plate II (4615) fixedly arranged with a support plate I (43), an air cylinder (4601) is fixedly arranged on the support plate II (4615) along the vertical direction, a guide rail I (4603) is arranged on the support plate II (4615) beside the air cylinder (4601), the guide rail I (4603) is parallel to the movement direction of the air cylinder (4601), and a slide block I (4604) sliding along the guide rail I (4603) is arranged on the guide rail I; the output end of the cylinder (4601) and the first sliding block (4604) are jointly provided with a third supporting plate (4602); a second guide rail (4605) is arranged on the third support plate (4602) along the vertical direction, a second slide block (4606) sliding along the second guide rail (4605) is arranged on the second guide rail (4606), a needle seat (4607) is arranged on the second slide block (4606), and a glue dipping needle head (4614) is arranged at the bottom of the needle seat (4607); the top of the supporting plate III (4602) is provided with a first mounting block (4608), a guide shaft (4609) vertically penetrates through the first mounting block (4608), the bottom end of the guide shaft (4609) stretches into the top of the needle seat (4607), and a spring (4616) is sleeved on the guide shaft (4609) between the first mounting block (4608) and the needle seat (4607); the side of the third supporting plate (4602) is provided with a second mounting block (4612) with an L-shaped structure, the side of the needle seat (4607) is provided with a third mounting block (4613) with an L-shaped structure, the second mounting block (4612) and the third mounting block (4613) are oppositely arranged to form a 'mouth' -shaped structure, the inner side surface of the second mounting block (4612) is provided with a lower contact, the inner side surface of the third mounting block (4613) is provided with an upper contact, and the upper contacts are positioned above the lower contacts and are mutually contacted; a fourth mounting block (4610) with an L-shaped structure is arranged at the lower part of the side edge of the second supporting plate (4615), and a screw rod (4611) is arranged at the bottom of the fourth mounting block (4610); the screw rod (4611) penetrates through the mounting block IV (4610), and the screw rod (4611) is positioned below the support plate III (4602); the structure of the Z-axis driving assembly (42) is as follows: the base comprises a mounting block five (4201) and a mounting block six (4206) which are fixedly arranged on the base assembly (41) and are arranged at intervals up and down, a screw rod (4204) is jointly arranged on the mounting block five (4201) and the mounting block six (4206), and a support plate five (4205) is arranged on the screw rod (4204) between the mounting block five (4201) and the mounting block six (4206) in a matched mode; the upper end part of the screw rod (4204) extends out of the mounting block five (4201), and a pulley I (4207) is mounted at the upper end of the screw rod (4204); a motor (4210) is arranged at the bottom of the mounting block five (4201), the output end of the motor (4210) extends out of the mounting block five (4201) upwards, a pulley two (4209) is arranged at the output end of the motor (4210), and the pulley one (4207) is connected with the pulley two (4209) through a belt (4208).
2. The multifunctional duplex position flexible horn mechanism of claim 1, wherein: a guide rail III (4202) is further arranged on the base component (41) beside the screw rod (4204), the guide rail III (4202) is parallel to the screw rod (4204), and a sliding block III (4203) sliding along the guide rail III (4202) is arranged on the guide rail III; one end of the fifth support plate (4205) is sleeved on the screw rod (4204), and the other end of the fifth support plate (4205) is fixedly arranged with the third slide block (4203).
3. The multifunctional duplex position flexible horn mechanism of claim 1, wherein: the base assembly (41) is structured as follows: comprises a bottom plate (411) fixedly arranged with a linear motion assembly (3), a connecting plate (412) is fixedly arranged on the bottom surface of the bottom plate (411), and a supporting plate four (413) with an L-shaped structure is fixedly arranged at the lower part of the side edge of the connecting plate (412); the connecting plate (412) is fixedly arranged on the inner side surface of the fourth supporting plate (413), and the outer side surface of the fourth supporting plate (413) is fixedly arranged with the Z-axis driving assembly (42); reinforcing ribs (414) are further arranged between the two side walls of the four supporting plates (413).
4. The multifunctional duplex position flexible horn mechanism of claim 1, wherein: the linear motion assembly (3) is characterized in that: the device comprises a first linear motion motor (31) fixedly arranged in the middle of the bottom surface of a top plate (1), wherein the installation direction of the first linear motion motor (31) is perpendicular to a side plate (2); auxiliary motion guide rails (32) are arranged on the bottom surface of the top plate (1) positioned on two sides of the first linear motion motor (31); the auxiliary moving guide rails (32) are parallel to the first linear moving motors (31), two parallel second linear moving motors (33) are mounted on the two auxiliary moving guide rails (32) and the first linear moving motors (31) together, and a group of welding head mechanisms (4) are mounted on each second linear moving motor (33).
5. The multifunctional duplex position flexible horn mechanism of claim 1, wherein: the suction nozzle assembly (44) has the structure that: the device comprises a support plate six (441) fixedly arranged with a support plate one (43), wherein a linear and rotary actuator (442) is fixedly arranged on the side surface of the support plate six (441), a suction nozzle (443) is arranged at the output end of the linear and rotary actuator (442), and the suction nozzle (443) is connected with an external air source; a height sensor is also mounted on the side of the linear and rotary actuator (442) beside the nozzle (443).
6. The multifunctional duplex position flexible horn mechanism of claim 1, wherein: the camera assembly (45) is structured as follows: the device comprises a support plate seven (452) fixedly arranged with a support plate one (43), a zoom lens (453) is fixedly arranged on the side surface of the support plate seven (452), and a CCD camera (451) is arranged at the top of the zoom lens (453).
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| CN201910815276.8A CN110446424B (en) | 2019-08-30 | 2019-08-30 | Multifunctional double-station flexible welding head mechanism |
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| CN201910815276.8A CN110446424B (en) | 2019-08-30 | 2019-08-30 | Multifunctional double-station flexible welding head mechanism |
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| CN110446424B true CN110446424B (en) | 2024-03-08 |
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| CN113782473B (en) * | 2021-08-03 | 2023-10-27 | 恩纳基智能科技无锡有限公司 | Mounting structure of double-station flexible welding head mechanism for chip production |
| CN113795090B (en) * | 2021-08-03 | 2023-05-23 | 恩纳基智能科技无锡有限公司 | Automatic dispensing and welding integrated equipment for chip production |
| CN114760776B (en) * | 2022-05-12 | 2023-07-25 | 大连佳峰自动化股份有限公司 | High-precision welding head mechanism of chip mounter |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0901155A1 (en) * | 1997-09-05 | 1999-03-10 | Esec Sa | Semiconductor mounting assembly for applying an adhesive on a substrate |
| JP2010016090A (en) * | 2008-07-02 | 2010-01-21 | I-Pulse Co Ltd | Substrate manufacturing apparatus |
| JP2011054605A (en) * | 2009-08-31 | 2011-03-17 | Yamaha Motor Co Ltd | Surface mounter and drive |
| JP2012094653A (en) * | 2010-10-26 | 2012-05-17 | Juki Corp | Electronic component mounting apparatus |
| JP2013115346A (en) * | 2011-11-30 | 2013-06-10 | I-Pulse Co Ltd | Board working device |
| CN103152994A (en) * | 2013-02-04 | 2013-06-12 | 广东工业大学 | Efficient paster head of multiple suction nozzle synchronous suction |
| JP2014045185A (en) * | 2012-08-03 | 2014-03-13 | Meisho Kk | Rework device for printed circuit board |
| CN107734957A (en) * | 2017-10-11 | 2018-02-23 | 广州煌牌自动设备有限公司 | A kind of paster head device of integrated positioning identification camera |
| CN207678192U (en) * | 2017-12-27 | 2018-07-31 | 唐山国芯晶源电子有限公司 | Multi-station circulating operation chip mounter |
| WO2019116506A1 (en) * | 2017-12-14 | 2019-06-20 | ヤマハ発動機株式会社 | Workpiece processing device |
| CN210470188U (en) * | 2019-08-30 | 2020-05-05 | 恩纳基智能科技无锡有限公司 | Multifunctional double-station flexible welding head mechanism |
-
2019
- 2019-08-30 CN CN201910815276.8A patent/CN110446424B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0901155A1 (en) * | 1997-09-05 | 1999-03-10 | Esec Sa | Semiconductor mounting assembly for applying an adhesive on a substrate |
| JP2010016090A (en) * | 2008-07-02 | 2010-01-21 | I-Pulse Co Ltd | Substrate manufacturing apparatus |
| JP2011054605A (en) * | 2009-08-31 | 2011-03-17 | Yamaha Motor Co Ltd | Surface mounter and drive |
| JP2012094653A (en) * | 2010-10-26 | 2012-05-17 | Juki Corp | Electronic component mounting apparatus |
| JP2013115346A (en) * | 2011-11-30 | 2013-06-10 | I-Pulse Co Ltd | Board working device |
| JP2014045185A (en) * | 2012-08-03 | 2014-03-13 | Meisho Kk | Rework device for printed circuit board |
| CN103152994A (en) * | 2013-02-04 | 2013-06-12 | 广东工业大学 | Efficient paster head of multiple suction nozzle synchronous suction |
| CN107734957A (en) * | 2017-10-11 | 2018-02-23 | 广州煌牌自动设备有限公司 | A kind of paster head device of integrated positioning identification camera |
| WO2019116506A1 (en) * | 2017-12-14 | 2019-06-20 | ヤマハ発動機株式会社 | Workpiece processing device |
| CN207678192U (en) * | 2017-12-27 | 2018-07-31 | 唐山国芯晶源电子有限公司 | Multi-station circulating operation chip mounter |
| CN210470188U (en) * | 2019-08-30 | 2020-05-05 | 恩纳基智能科技无锡有限公司 | Multifunctional double-station flexible welding head mechanism |
Non-Patent Citations (2)
| Title |
|---|
| 刘吉安 ; 翁纪钊 ; 李克天 ; 刘建奇 ; 黄向修 ; .芯片封装设备焊头柔性铰直线缓冲结构的设计.包装工程.2007,(08),全文. * |
| 芯片封装设备焊头柔性铰直线缓冲结构的设计;刘吉安;翁纪钊;李克天;刘建奇;黄向修;;包装工程(08);全文 * |
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| CN110446424A (en) | 2019-11-12 |
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