JP2012094653A - Electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component mounting apparatus which can efficiently mount electronic components with high accuracy and can further reduce energy consumption.SOLUTION: An electronic component mounting apparatus for mounting electronic components sucked by nozzles onto a substrate comprises: a first suction part having one of the nozzles for sucking one of the electronic components; a second suction part which has another nozzle for sucking another electronic component, and whose nozzle faces the same direction as the nozzle of the first suction part; a head including a connection mechanism connected to the first suction part and the second suction part, and a Z-axis drive part provided with a drive mechanism which moves the connection mechanism to thereby move the first suction part and the second suction part in a direction perpendicular to the surface of the substrate; and a control unit which controls the movement of the head. The connection mechanism is moved by the drive mechanism so that it causes the first suction part and the second suction part to move in directions opposite to each other.

Description

  The present invention relates to an electronic component mounting apparatus in which an electronic component is sucked and moved by a nozzle and mounted on a substrate.

  As an apparatus for mounting (mounting) an electronic component on a substrate, there is an apparatus that has a head having a large number of nozzles and sucks and mounts the electronic component on the substrate with the nozzle. The head mounts the sucked electronic component on the substrate by moving the nozzle in a direction perpendicular to the surface of the substrate. Here, there are various mechanisms for moving the nozzle.

  For example, Patent Document 1 describes a mechanism in which a suction nozzle (nozzle) that sucks an electronic component is moved up and down by an air cylinder. Japanese Patent Application Laid-Open No. H10-228561 describes a mechanism that uses an electromagnet as a mechanism that moves a plurality of nozzles up and down by rotating a crank with a vertical slide drive motor and switches the vertical movement of each nozzle.

Japanese Patent Publication No.7-120873 Japanese Patent No. 3114469

  Here, an electronic component can be efficiently mounted by providing a plurality of nozzles in the head. However, as the number of nozzles in the head increases, the weight of the head increases and the energy required for driving the head increases. In addition, the device configuration is complicated.

  In addition, since the device described in Patent Document 1 is in a state of being pressurized with an air cylinder, a force necessary for driving the nozzle is increased, and a motor having a large output is required as a motor for driving the nozzle. Further, since an air cylinder is provided for each nozzle, the weight of the head increases and the apparatus cost also increases. In addition, positioning is performed by bringing the flange and slider into contact. However, if the contact parts are made of metal, wear due to wear and noise during driving increase, and if one is made of rubber or resin, positioning accuracy decreases. It becomes easy to do.

  Next, since the device described in Patent Document 2 moves up and down with a crank mechanism, it is difficult to increase the amount of movement in the up and down direction. Further, in order to increase the amount of movement in the vertical direction, it is necessary to enlarge the crank mechanism, which increases the size of the device. Moreover, since all the nozzles are moved up and down by the force of the motor that rotates the crank, the motor capacity tends to increase. Moreover, since the vertical movement is switched by the electromagnet, the weight increases and the wiring increases. Furthermore, since the nozzle is held by an electromagnet, the power required for driving increases and energy consumption increases.

  The present invention has been made in view of the above, and an object of the present invention is to provide an electronic component mounting apparatus that can efficiently mount electronic components with high accuracy and can further reduce energy consumption. And

  In order to solve the above-described problems and achieve the object, the present invention is an electronic component mounting apparatus for mounting an electronic component sucked by a nozzle on a substrate, the first suction including the nozzle for sucking the electronic component A second adsorbing portion, the second adsorbing portion facing the same direction as the nozzle of the first adsorbing portion, the first adsorbing portion, and the second adsorbing portion Z-axis drive provided with a drive mechanism that moves the first suction part and the second suction part in a direction perpendicular to the surface of the substrate by moving the connection mechanism connected to the part and the connection mechanism And a controller that controls the operation of the head, and the coupling mechanism is moved by the drive mechanism, so that the first suction unit and the second suction unit Are moved in opposite directions And features.

  Here, the coupling mechanism is arranged at a position spaced apart from the belt in a direction orthogonal to the surface of the substrate, and at least two rollers for stretching the belt, with respect to the surface of the substrate of the belt The first support portion that is fixed to one of the two surfaces orthogonal to each other and connected to the first suction portion and the other surface of the two surfaces that are orthogonal to the surface of the substrate of the belt are fixed to the other surface. It is preferable that a second support portion connected to the second suction portion is provided, and the first suction portion and the second suction portion are moved in opposite directions by moving the belt by the drive mechanism. .

  Moreover, it is preferable that the said drive mechanism is a linear motion linear motor connected to the said connection mechanism and moving the connection part with the said connection mechanism in the direction orthogonal to the surface of the said board | substrate.

  Further, the apparatus further includes a distance sensor arranged in connection with the first suction unit, and the control unit is configured to determine the distance between the first suction unit and the substrate based on the distance detected by the distance sensor, and It is preferable to calculate the distance between the second suction unit and the substrate.

  The head preferably includes a plurality of suction units including the first suction part, the second suction part, and the Z-axis drive part.

  In the head, the plurality of suction units are arranged adjacent to each other, the first suction portions of the plurality of suction units are arranged adjacent to each other, and the second suction units are arranged. The parts are preferably arranged adjacent to each other.

  The head moves the nozzle of the first suction part of the odd-numbered suction units among the plurality of suction units arranged in a row, and the first suction part and the second suction part move. A first θ-axis driving unit that rotates about an axis parallel to the direction to be performed, and the nozzles of the first suction unit of the even-numbered suction units among the plurality of suction units arranged in a row, Of the plurality of suction units arranged in a row, a second θ-axis drive unit that rotates about an axis parallel to a direction in which the first suction unit and the second suction unit move, and the odd-numbered ones A third θ-axis drive unit that rotates the nozzles of the second suction unit of the suction unit around an axis parallel to the direction in which the first suction unit and the second suction unit move is arranged in a row. Of the plurality of suction units, A fourth θ-axis drive unit that rotates the nozzle of the second suction part of the second suction unit about an axis parallel to a direction in which the first suction part and the second suction part move; It is preferable to have.

  In addition, when the control unit controls the head and mounts the electronic component attracted by the nozzle rotated by the first θ-axis driving unit or the third θ-axis driving unit on the substrate Next, the electronic component attracted by the nozzle rotated by the second θ-axis driving unit or the fourth θ-axis driving unit is mounted on the substrate, and the second θ-axis driving unit or the fourth θ-axis is mounted. When the electronic component sucked by the nozzle rotated by the driving unit is mounted on the substrate, the nozzle rotated by the first θ-axis driving unit or the third θ-axis driving unit is next sucked. It is preferable that the electronic component is mounted on the substrate.

  Further, the control unit controls the head, and when the electronic component sucked by the nozzle of the suction unit is mounted on the substrate, it is next sucked by the nozzle of another suction unit. It is preferable that the electronic component is mounted on the substrate.

  The electronic component mounting apparatus according to the present invention is capable of mounting electronic components efficiently and with high accuracy, and has the effect of further reducing energy consumption.

FIG. 1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a perspective view showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 3 is a schematic diagram showing a schematic configuration of the suction unit of the head. FIG. 4 is a partial cross-sectional view showing a schematic configuration of the θ-axis rotation unit. FIG. 5 is a schematic diagram showing a schematic configuration of the transmission mechanism of the θ-axis rotation unit. FIG. 6 is a block diagram illustrating a schematic configuration of the electronic component mounting apparatus. FIG. 7 is an explanatory diagram for explaining the operation of the suction unit of the head.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of an electronic component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. FIG. 1 is a perspective view showing a schematic configuration of an electronic component mounting apparatus.

  An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting (mounting) electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a board transport unit 12, a component supply device 14, a head 15, an XY movement mechanism 16, and a component recognition camera 18. In addition, the board | substrate 8 should just be a member which mounts an electronic component, The structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. A bonding member (solder or the like) for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X direction in the drawing. The substrate transport unit 12 includes a rail extending in the X direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X direction by moving the substrate 8 along the rails by the transport mechanism in a direction in which the surface (front surface) of the substrate 8 facing the head 15 faces. The board transport unit 12 transports the board 8 supplied from a device that supplies the board 8 to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step (for example, reflow). Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system that integrates a transport mechanism that combines a rail disposed along the transport direction of the substrate 8 and an endless belt that rotates along the rail, and transports the substrate 8 mounted on the endless belt. A transport mechanism can be used.

  The component supply device 14 holds a large number of electronic components mounted on the substrate 8, and a feeder that can supply the electronic components held by the holding portion 14 a to the head 15. Part 14b. Although various configurations can be used as the component supply device 14, in the present embodiment, the holding unit 14a in which the electronic component is attached to the tape, the tape is fed by a predetermined amount, and the electronic component is exposed at a predetermined position. It is a tape feeder comprised with the feeder part 14b made into the state which carried out. The component supply device 14 is preferably configured to be detachable from the apparatus main body.

  The head 15 is a mechanism that sucks an electronic component held by the component supply device 14 and mounts the sucked electronic component on the substrate 8 moved to a predetermined position by the substrate transport unit 12. The configuration of the head 15 will be described later.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X direction and the Y direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and includes an X axis drive unit 22 and a Y axis drive unit 24. . The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the feeder portion 14b of the component supply device 14 by moving the head 15 in the XY direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction (bidirectional) can be used. As the Y-axis drive unit 24, various mechanisms for moving the X-axis drive unit 22 in a predetermined direction (bidirectional) can be used. As a mechanism for moving the object in a predetermined direction (bidirectional), for example, a linear motor, a rack and pinion, a conveyance mechanism using a ball screw, a conveyance mechanism using a belt, or the like can be used.

  The component recognition camera 18 is an imaging device disposed in the vicinity of the component supply device 14 and at a position facing the head 15. The component recognition camera 18 detects whether an electronic component is attracted to the head 15 by photographing the head 15.

  Next, the configuration of the head 15 will be described with reference to FIGS. Here, FIG. 2 is a perspective view illustrating a schematic configuration of a head of the electronic component mounting apparatus, and FIG. 3 is a schematic diagram illustrating a schematic configuration of a suction unit of the head.

  As shown in FIG. 2, the head 15 includes a plurality of suction units 30, a Z-axis drive unit 32, a θ-axis drive unit 34, and a support base 35. The support base 35 is a member that supports the plurality of suction units 30, the Z-axis drive unit 32, and the θ-axis drive unit 34. Here, the Z axis is an axis orthogonal to the XY plane. The Z axis is a direction orthogonal to the surface of the substrate. The θ direction is a direction parallel to the circumferential direction of a circle around the Z axis (that is, the axis parallel to the direction in which the Z axis drive unit moves the first adsorption unit and the second adsorption unit). It is. The θ direction is the rotation direction of the nozzles (first nozzle 40 and second nozzle 42) described later.

  The plurality of suction units 30 are arranged in a row at positions adjacent to each other. Hereinafter, first, one adsorption unit 30 will be described with reference to FIG. As shown in FIG. 3, the suction unit 30 includes a first nozzle 40, a second nozzle 42, shafts 44 and 46, a Z-axis driving unit 48, suction mechanisms 50 and 52, and a first θ-axis driving unit 54. And a third θ-axis drive unit 58 and a distance sensor 62. 3 includes a first θ-axis drive unit 54 and a third θ-axis drive unit 58. The suction unit 30 adjacent to the suction unit illustrated in FIG. As shown by the reference numeral, instead of the first θ-axis drive unit 54 and the third θ-axis drive unit 58, a second θ-axis drive unit 56 and a fourth θ-axis drive unit 60 are provided. In the suction unit 30 of the present embodiment, a combination of the first nozzle 40, the shaft 44, and the suction mechanism 50 becomes a first suction portion, and the second nozzle 42, the shaft 46, the suction mechanism 52, The combination becomes the second adsorption part. The first adsorption unit is disposed adjacent to the first adsorption unit of the adjacent adsorption unit 30. The second adsorption unit is disposed adjacent to the second adsorption unit of the adjacent adsorption unit 30. Thus, the head 15 has the first suction portions arranged in a row and the second suction portions arranged in a row.

  The first nozzle 40 is a suction mechanism that sucks and holds an electronic component. The first nozzle 40 has an opening at the tip, and sucks air from the opening to suck and hold the electronic component at the tip. The second nozzle 42 has a configuration similar to that of the first nozzle 40 and is a mechanism that sucks and holds an electronic component at the tip.

  The shaft 44 is a rod-like member that supports the first nozzle 40, and is arranged extending in the Z-axis direction. The shaft 44 has an air pipe (pipe) that connects the first nozzle 40 and the suction mechanism 50 inside. The shaft 46 is a rod-like member that supports the second nozzle 42, and is arranged extending in the Z-axis direction. The shaft 46 has an air pipe (pipe) for connecting the second nozzle 42 and the suction mechanism 52 therein. The shaft 44 and the shaft 46 are also connected to slider mechanisms 45 and 47 that are fixed to the support base 35 and are movable in the Z-axis direction. The head 15 can suppress the positions of the shaft 44 and the shaft 46 on the XY plane from being shifted by connecting the shaft 44 and the shaft 46 to the support base 35 by the slider mechanisms 45 and 47, respectively.

  The Z-axis drive unit 48 is a mechanism that moves the first nozzle 40 and the second nozzle 42 in the Z-axis direction by moving the shaft 44 and the shaft 46 in the Z-axis direction. The Z-axis drive unit 48 includes a linear motion linear motor 70, a belt 72, rollers 73a and 73b, a first support unit 74, and a second support unit 76. The Z-axis drive unit 48 is a drive mechanism in which the linear motion linear motor 70 moves the first nozzle 40 and the second nozzle 42, and includes a belt 72, rollers 73 a and 73 b, a first support unit 74, and a second support unit 76. However, by being moved by the drive mechanism, the first nozzle 40 and the second nozzle 42 are connected to each other in the Z-axis direction in opposite directions. The linear motion linear motor 70 includes a fixed portion and a movable portion that moves in the Z-axis direction with respect to the fixed portion. In the linear motion linear motor 70, a fixed portion is fixed to the support base 35 (not shown in FIG. 3), and the movable portion moves in a direction parallel to the Z axis.

  The belt 72 is an endless belt, and is stretched by a roller 73a and a roller 73b. The rollers 73 a and 73 b are disposed between the shaft 44 and the shaft 46. Further, the roller 73a and the roller 73b are disposed at positions separated by a predetermined distance in a direction parallel to the Z axis (that is, a direction orthogonal to the surface of the substrate 8). The roller 73a is disposed at a position farther from the substrate 8 than the roller 73b. The belt 72 and the rollers 73a and 73b are arranged in such a positional relationship, and the portion of the belt 72 between the roller 73a and the roller 73b becomes two surfaces parallel to the Z axis. The rollers 73a and 73b are driven rollers and rotate as the belt 72 moves.

  Next, the first support portion 74 is connected to the movable portion of the linear motion linear motor 70, the shaft 44, and the belt 72. The first support portion 74 is fixed to one surface of the two surfaces parallel to the Z-axis of the belt 72, specifically, the surface on the shaft 44 side. Further, the second support portion 76 is connected to the shaft 46 and the belt 72. The second support portion 76 is fixed to the other surface of the two surfaces parallel to the Z-axis of the belt 72, specifically, the surface on the shaft 46 side. Thus, the 1st support part 74 is connected with the 1st adsorption part. Moreover, the 2nd support part 76 is connected with a 2nd adsorption | suction part.

  The Z-axis drive unit 48 is configured as described above. When the movable part of the linear motion linear motor 70 moves in the Z-axis direction, the first support part 74 moves in the Z-axis direction together with the movable part of the linear motion linear motor 70. Moving. As a result, the shaft 44 fixed to the first support portion 74 and the belt 72 also move. Furthermore, as the belt 72 moves, the second support portion 76 also moves in the direction opposite to the moving direction of the first support portion 74 in the Z-axis direction. Further, when the second support portion 76 moves, the shaft 46 moves together with the second support portion 76 in the direction opposite to the moving direction of the shaft 44.

  The suction mechanism 50 includes a pump connected to the first nozzle 40 and an electromagnetic valve that switches opening and closing of a pipe line that connects the first nozzle 40 and the pump, and the first nozzle is switched by switching the opening and closing of the electromagnetic valve. Whether to suck air from 40 is switched. The suction mechanism 52 includes a pump connected to the second nozzle 42 and an electromagnetic valve that switches opening and closing of a pipe line that connects the second nozzle 42 and the pump. Whether air is sucked from 42 is switched.

  The first θ-axis drive unit 54 rotates the shaft 44 in the θ direction while supporting the shaft 44 movably in the Z-axis direction. The third θ-axis drive unit 58 rotates the shaft 46 in the θ direction while supporting the shaft 46 movably with respect to the Z-axis direction. The first θ-axis drive unit 54 and the third θ-axis drive unit 58 are fixed to the support base 35. The configuration of the first θ-axis drive unit 54 to the fourth θ drive unit 60 will be described later.

  The distance sensor 62 is a sensor that detects (measures) a distance from a member (for example, the substrate 8) disposed at a position facing itself, and is attached to a member connected to the first nozzle 40 and the shaft 44. Yes. The member to which the distance sensor 62 is attached is connected to the support base 35 so as to be movable in the Z-axis direction. The distance sensor 62 moves in the Z direction together with the first nozzle 40 and the shaft 44. The distance sensor 62 detects (measures) the distance between itself and a member disposed on the tip side (the surface side on which the substrate 8 is disposed) of the first nozzle 40. In this way, the distance sensor 62 can detect the distance between itself and the substrate 8. Further, since the distance sensor 62 is fixed with respect to the first nozzle 40 and the shaft 44, that is, the first suction part, the electronic component mounting apparatus 10 and the suction unit 30 are located between the distance sensor 62 and the substrate 8. By detecting this, the distance between the first suction portion (for example, the tip of the first nozzle 40) and the substrate 8 can be detected. In the present embodiment, the control unit 100 described later performs a calculation for calculating the distance to the first suction unit based on the distance between the distance sensor 62 and the substrate 8.

  Next, the θ axis drive unit 34 will be described. As shown in FIG. 3, the θ-axis drive unit 34 includes a first θ-axis drive unit 54, a second θ-axis drive unit 56, a third θ-axis drive unit 58, and a fourth θ-axis drive unit 60. Here, the first θ-axis drive unit 54 and the second θ-axis drive unit 56 are provided corresponding to the first nozzle 40, and the third θ-axis drive unit 58 and the fourth θ-axis drive unit 60 are the second It is provided corresponding to the nozzle 42. The corresponding relationship between the first θ-axis drive unit 54 and the second θ-axis drive unit 56 and the corresponding relationship between the third θ-axis drive unit 58 and the fourth θ-axis drive unit 60 are different for the nozzles provided correspondingly. Other than that, the configuration is basically the same. Further, one suction unit 30 is connected to the first θ-axis drive unit 54 and the third θ-axis drive unit 58 or is connected to the second θ-axis drive unit 56 and the fourth θ-axis drive unit 60. That is, the first nozzle 40 rotated by the first θ-axis drive unit 54 becomes the same adsorption unit 30 as the second nozzle 42 rotated by the third θ-axis drive unit 58, and the second nozzle 40 rotated by the second θ-axis drive unit 56. The one nozzle 40 is the same adsorption unit 30 as the second nozzle 42 rotated by the fourth θ-axis drive unit 60. Therefore, in the following, as a representative, a portion constituted by the first θ-axis drive unit 54 and the second θ-axis drive unit 56 will be described.

  4 is a partial cross-sectional view showing a schematic configuration of the θ-axis drive unit, and FIG. 5 is a schematic diagram showing a schematic configuration of the transmission mechanism of the θ-axis drive unit. As shown in FIG. 4, the first θ-axis drive unit 54 includes a motor 80, a transmission mechanism 82, and a plurality of ball spline units 84. The second θ-axis drive unit 56 includes a motor 90, a transmission mechanism 92, and a plurality of ball spline units 94. The ball spline unit 84 is provided on the shaft 44 a of the shaft 44, and the ball spline unit 94 is provided on the shaft 44 b of the shaft 44. Here, the shafts 44a and the shafts 44b are alternately arranged. That is, in the plurality of shafts 44 arranged in a row, the shafts 44 a connected to the ball spline units 84 and the shafts 44 b connected to the ball spline units 94 are alternately arranged. As described above, the first θ-axis drive unit 54 is connected to the shaft 44a constituting the first suction unit of the odd-numbered suction units 30 among the plurality of suction units 30 arranged in a row, and the second θ The shaft driving unit 56 is connected to the shaft 44b that constitutes the first suction unit of the even-numbered suction units 30 among the plurality of suction units 30 arranged in a row. In the present embodiment, odd and even numbers are assigned when numbers are assigned in order from left to right in FIG. 5, but it is only necessary to connect to every other shaft (every other suction portion), and the first θ axis Either the drive unit 54 or the second θ-axis drive unit 56 may be connected to the even-numbered shaft, and either may be connected to the odd-numbered shaft. Further, the ball spline unit 84 and the ball spline unit 94 are arranged at the same position on the Z-axis. Further, the transmission mechanism 82 is disposed above the ball spline unit 84 in FIG. 4 in the Z-axis direction, and the transmission mechanism 92 is disposed below the ball spline unit 84 in FIG. 4 in the Z-axis direction. Yes. The first θ-axis drive unit 54 and the second θ-axis drive unit 56 are basically the same in configuration, except for the arrangement position. Therefore, in the following, the first θ-axis drive unit 54 will be described as a representative.

  The motor 80 is a drive unit that rotates bi-directionally (that is, rotates), and rotates the plurality of ball spline units 84 via the transmission mechanism 82. The motor 80 may be a drive source that rotates in both directions, or may be configured to switch the direction of rotation that is transmitted by switching the combination of transmission elements.

  As shown in FIG. 5, the transmission mechanism 82 includes a belt 86, a plurality of gears 87, and a plurality of pulleys 88, and a driving force (rotation) generated by the motor 80 is transmitted to a plurality of ball spline units 84 (see FIG. 5). 4)). Specifically, the transmission mechanism 82 includes a pulley in which a belt 86 is engaged with a gear 87 connected to a ball spline unit 84 and a motor 80, and is further provided between the gear 87 and the gear 87. 88 is tensioned at a constant tension. Thereby, in the transmission mechanism 82, when the motor 80 rotates, the belt 86 rotates and the gear 87 on which the belt 86 is applied rotates.

  Each of the plurality of ball spline units 84 is provided on the shaft 44a and transmits a rotational force to the shaft 44a. Further, the ball spline unit 84 is in a movable state in which the shaft 44a can move in the Z-axis direction.

  The first θ-axis drive unit 54 is configured as described above, and rotates the shaft 44a by transmitting the rotational force generated by the motor 80 to the ball spline unit 84 via the transmission mechanism 82. The first θ-axis drive unit 54 rotates the shaft 44a provided with the ball spline unit 84 integrally, that is, together. Further, by rotating the first θ-axis drive unit 54 shaft 44a, the first nozzle 40 integrated with the shaft 44a is also rotated. As described above, the first θ-axis drive unit 54 moves the first nozzle 40 of the first suction unit of the odd-numbered suction units 30 out of the plurality of suction units 30 arranged in a row to the Z axis (first suction). And an axis parallel to the moving direction of the second suction portion and the second suction portion).

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. FIG. 6 is a block diagram illustrating a schematic configuration of the electronic component mounting apparatus. As shown in FIG. 6, the electronic component mounting apparatus 10 includes a board transport unit 12, a component supply device 14, a head 15, an XY moving mechanism 16 (X-axis drive unit 22 and Y-axis drive unit 24), laser, and the like. The apparatus includes a recognition device 92, a storage device 94, an image processing device 96, a monitor 97, an operation unit 98, and a control unit 100. As described above, the head 15 includes the suction unit 30, the Z-axis drive unit 32, and the θ-axis drive unit 34. Further, the head 15 includes the suction mechanism 50 and the suction mechanism 52 corresponding to the suction unit 30 as described above. In the electronic component mounting apparatus 10, detailed description of the above-described configuration is omitted.

  The laser recognition device 92 is a device that detects the shape of the electronic component by irradiating the electronic component sucked by the first nozzle 40 or the second nozzle 42 of the suction unit 30 with laser light. When the laser recognition device 92 detects the shape in one direction of the electronic component sucked by the suction unit 30, the laser recognition device 92 moves or rotates the electronic component by the suction unit 30 to detect the shape in the other direction. In this way, the laser recognition device 92 can accurately detect the three-dimensional shape of the electronic component by detecting the shape from a plurality of directions.

  The storage device 94 is a primary storage device (main storage device) such as a memory, or a secondary storage device (auxiliary storage device) such as a storage, and various programs necessary for processing in the control unit 100 and information acquired by each unit. The inputted conditions, the operation history of each part, etc. are stored. Note that the primary storage device may be provided not only in the storage device 94 but also in the control unit 100.

  The image processing device 96 processes the image acquired by the component recognition camera 18 and sends information on the processed image to the monitor 97 and the control unit 100 described later.

  The monitor 97 is a display device that displays image information sent from the image processing device 96 and information sent from the control unit 100. The operation unit 98 is an input device through which an operator (user) inputs an operation, and includes a touch panel 98a. The configuration of the operation unit 98 is not limited to the touch panel 98a, and various input devices such as a controller, an operation panel, a switch, a lever, a keyboard, and a mouse can be used. The operation unit 98 sends the input operation to the control unit 100 as an operation signal.

  The control unit 100 is connected to each unit of the electronic component mounting apparatus 10, and stores in the storage device 94 based on operation signals input from the operation unit 98 and information detected by each unit of the electronic component mounting apparatus 10. The program is executed and the operation of each part is controlled. For example, the control unit 100 can transport the substrate 8 by the substrate transport unit 12, supply an electronic component by the component supply device 14, suction / release operation of the electronic component by the head 15, and each nozzle (first nozzle 40, second nozzle). The rotation operation of the nozzle 42), the movement operation in the Z-axis direction, the driving operation of the head 15 by the XY movement mechanism 16, and the like are controlled. The electronic component mounting apparatus 10 is configured as described above.

  Next, the operation of the electronic component mounting apparatus 10, particularly the operation of mounting the electronic component by the suction unit 30 of the head 15 will be described. Here, FIG. 7 is an explanatory diagram for explaining the operation of the suction unit of the head. FIG. 7 shows the operation from the suction of the electronic component by the suction unit 30 of the head 15 to the mounting position on the substrate and the mounting of the electronic component on the substrate. The electronic component mounting apparatus 10 performs the operation in the direction of the arrow in FIG. 7 (from left to right).

  First, the control unit 100 of the electronic component mounting apparatus 10 controls the XY movement mechanism 16 so that the position where the head 15 faces the component supply device 14, specifically, the electronic component supplied from the component supply device 14 is selected. The first nozzle 40 and the second nozzle 42 of the head 15 are moved to positions where they can be sucked. When the control unit 100 moves the head 15 to a position facing the component supply device 14, the control unit 100 controls the head 15 to move the linear motion linear motor 70 of the Z-axis drive unit 48 as shown in the suction unit 30 a of FIG. 7. The first nozzle 40 is moved closer to the component supply device 14 by moving the movable portion in the arrow direction (the direction in which the tip of the movable portion of the linear motion linear motor 70 approaches the fixed portion) and moving the belt 72. When the first nozzle 40 moves in a direction approaching the component supply device 14, the second nozzle 42 moves in a direction away from the component supply device 14.

  When the control unit 100 controls the head 15 to move the tip of the first nozzle 40 to a position in contact with the electronic component 102 held by the component supply device 14, the control unit 100 drives the suction mechanism 50 to drive the first nozzle. The electronic component 102 is attracted to 40. The control unit 100 controls the head 15 to rotate the first nozzle 40 by driving the first θ-axis driving unit 54 as necessary when the first nozzle 40 sucks the electronic component 102. You may let them. Further, the control unit 100 adjusts the position of the first nozzle 40 in the Z-axis direction based on the detection result of the distance sensor 62. The method for adjusting the rotation in the θ direction and the method for adjusting the distance in the Z-axis direction, which are performed as necessary, are the same both when the electronic component is attracted and released by a nozzle described later.

  When the control unit 100 controls the head 15 and sucks the electronic component 102 by the first nozzle 40, next, as shown in the suction unit 30 b of FIG. 7, the linear motion linear motor 70 of the Z-axis drive unit 48. The second nozzle 42 is moved closer to the component supply device 14 by moving the movable portion in the arrow direction (the direction in which the tip of the movable portion of the linear motion linear motor 70 moves away from the fixed portion) and moving the belt 72. When the control unit 100 controls the head 15 to move the tip of the second nozzle 42 to a position where it comes into contact with the electronic component 104 held by the component supply device 14, the controller 100 drives the suction mechanism 52, and the second nozzle The electronic component 104 is sucked by 42. As a result, the suction unit 30 b is in a state where the electronic component 102 is sucked by the first nozzle 40 and the electronic component 104 is sucked by the second nozzle 42. Here, the control unit 100 also adjusts the position of the second nozzle 42 in the Z-axis direction based on the detection result of the distance sensor 62. That is, the distance sensor 62 moves in the opposite direction to the second nozzle 42, but the distance traveled by the Z-axis drive unit 48 is proportional to the distance sensor 62 and the second nozzle 42. For this reason, the control unit 100 calculates the movement distance of the distance sensor 62 based on the detection result of the distance sensor 62, thereby calculating the positional relationship between the second nozzle 42 and the substrate 8, more specifically the distance between the two. can do. Note that the controller 100 performs the suction operation in the same manner on each suction unit 30 constituting the head 15. Here, it is not necessary to suck the electronic components to all the nozzles of the head 15, and the electronic components to be mounted on the substrate 8 may be sucked by the selected nozzles.

  When the control unit 100 controls the head 15 to attract the electronic components 102 and 104 to the first nozzle 40 and the second nozzle 42, respectively, as shown in the suction unit 30c of FIG. In addition, the position of the first nozzle 40 and the position of the second nozzle 42 in the Z-axis direction are the same position, that is, the same height. Thereafter, the control unit 100 moves the head 15 to the position facing the substrate 8 by the XY moving mechanism 16.

  When the control unit 100 moves the head 15 to a position facing the substrate 8, the control unit 100 further moves the head by the XY movement mechanism 16 so that the electronic component 102 and the mounting position of the electronic component 102 on the substrate 8 overlap in the XY plane. 15 is moved. The control unit 100 controls the head 15 when the mounting position of the electronic component 102 and the substrate 8 overlaps in the XY plane, and rotates the first nozzle 40 in the θ direction by the θ drive unit as necessary. The direction of the electronic component 102 is adjusted. Note that the rotation of the first nozzle 40 by the θ drive unit may be performed simultaneously with the movement of the head 15 by the XY movement mechanism 16. Thereafter, the controller 100 moves the movable portion of the linear motion linear motor 70 of the Z-axis drive unit 48 in the direction of the arrow and moves the belt 72 as shown in the suction unit 30d of FIG. 40 is brought close to the substrate 8. As a result, the electronic component 102 attracted by the first nozzle 40 is in contact with or substantially in contact with a predetermined position of the substrate 8. Thereafter, the control unit 100 controls the head 15 to close the electromagnetic valve of the suction mechanism 50. If it does in this way, since it will be in the state which the 1st nozzle 40 open | released the electronic component 102, ie, the state which is not attracted | sucked, the electronic component 102 can be mounted on the board | substrate 8. FIG.

  When the control unit 100 controls the head 15 and mounts the electronic component 102 on the substrate 8, the XY movement mechanism 16 causes the electronic component 104 and the mounting position of the electronic component 104 on the substrate 8 to overlap in the XY plane. The head 15 is moved. When the mounting position of the electronic component 104 and the substrate 8 overlaps the XY plane, the control unit 100 controls the head 15 as necessary to rotate the second nozzle 42 in the θ direction by the θ drive unit. The direction of the electronic component 104 is adjusted. Thereafter, the control unit 100 controls the head 15 to move the movable portion of the linear motion linear motor 70 of the Z-axis drive unit 48 in the direction of the arrow and move the belt 72 as shown in the suction unit 30e of FIG. As a result, the second nozzle 42 is brought closer to the substrate 8. As a result, the electronic component 104 attracted by the second nozzle 42 is in contact with or substantially in contact with a predetermined position of the substrate 8. Thereafter, the control unit 100 controls the head 15 so that the electromagnetic valve of the suction mechanism 52 is closed. If it does in this way, since the 2nd nozzle 42 will be in the state which open | released the electronic component 104, ie, the state which is not attracted | sucked, the electronic component 104 can be mounted on the board | substrate 8. FIG.

  The control unit 100 can perform the operation as described above for each nozzle that sucks the electronic component, and can mount the electronic component that the head 15 sucks on the substrate 8. In addition, when all the electronic components attracted by the head 15 are mounted on the substrate 8, the control unit 100 drives the head 15 again by driving at least one of the X-axis driving unit 22 and the Y-axis driving unit 24. It conveys to the supply apparatus 14, and adsorb | sucks an electronic component to each nozzle. When the control unit 100 repeats the above processing and mounts necessary electronic components on the substrate 8, the substrate transfer unit 12 transfers the substrate 8 to the next step.

  As described above, the electronic component mounting apparatus 10 has a configuration in which the first nozzle 40 and the second nozzle 42 are moved in the reverse direction by the single Z-axis drive unit 48, so that one drive mechanism can The nozzle can be driven. Thereby, a drive mechanism can be reduced and an apparatus structure can be simplified. Further, since the apparatus configuration is simplified and the number of drive mechanisms can be reduced, the head 15 can be reduced in weight, and the energy consumed for the movement of the head 15 can be reduced. Moreover, since the head 15 can be reduced in weight, the accuracy of movement can be further increased. In addition, since one Z-axis drive unit 48 drives only two nozzles, an increase in the size of the drive mechanism (drive source) of the Z-axis drive unit 48 can be suppressed. Moreover, since the two nozzles are moved in conjunction with each other, the power transmission path can be simplified. Furthermore, since the number of objects to be controlled is reduced, the circuit configuration of the control unit 100 can be simplified.

  Further, since the two nozzles moved in the opposite directions have substantially the same configuration, that is, the weight difference is small, it is necessary when the belt 72 is rotated around the fulcrum (the roller 73a in this embodiment). The force can be reduced and the energy consumed can be reduced.

  In addition, after the mounting of the electronic component by one nozzle is completed, the other nozzle can be brought closer to the substrate by moving one nozzle, that is, away from the substrate. Thereby, the end operation of one nozzle (separation operation of the nozzle and the electronic component) and the mounting operation of the other nozzle can be automatically started simultaneously.

  Moreover, the electronic component mounting apparatus 10 can be mounted on a board | substrate, adjusting a position with high precision by mounting an electronic component on a board | substrate in order one by one. Moreover, since it is the structure which mounts an electronic component on a board | substrate in order one by one, even if it is a structure where the 1st nozzle 40 and the 2nd nozzle 42 move to a reverse direction, an electronic component can be mounted efficiently.

  In addition, since the height in the Z-axis direction can be adjusted with high accuracy by the Z-axis drive unit 48, substrates having different heights and electronic components having different heights can be suitably mounted. Thereby, the kind of the board | substrate and electronic component which an electronic component mounting apparatus can process can be increased.

  In addition, the head 15 is provided with a plurality of suction units 30 so that the electronic component suction operation and the electronic component mounting operation from a single component supply device, that is, a single reciprocation between the head component supply device and the substrate, Many electronic components can be processed (sucked and mounted). Thereby, working efficiency can be made higher. Also in this case, since the weight can be reduced with respect to the number of nozzles as described above, the head can be reduced in weight and the operation can be controlled with high accuracy.

  In addition, as described above, the head 15 can adjust the height in the Z-axis direction with high accuracy and can have various heights. Therefore, when the electronic component is recognized by the laser recognition device 92 or the camera for component recognition is used. When observing an electronic component using 18, by shifting the height of the electronic component and holding it, a large number of electronic components can be recognized and observed at a time.

  Here, in the above-described embodiment, the mounting operation using two nozzles constituting one suction unit 30 has been described. However, when electronic components are mounted using a plurality of suction units 30, the control unit 100 includes the head 15. When an electronic component that is adsorbed by the nozzles of one adsorption unit 30 (that is, the first nozzle 40 or the second nozzle 42) is mounted on the substrate, the nozzles of the other adsorption units 30 are It is preferable to mount the adsorbed electronic component on the substrate. In this way, by switching the mounting unit 30 on which the electronic component is mounted for each nozzle, the electronic component mounted on the substrate can be moved to the nearest position of the substrate, and the electronic component can be mounted more efficiently ( Implementation). In addition, since an electronic component can be efficiently mounted on a substrate, the head preferably includes a plurality of suction units. However, the present invention is not limited to this, and the number of suction units may be one.

  Further, by driving a plurality of shafts as one θ-axis drive unit as the θ-axis drive unit 34, the number of drive units that rotate in the θ direction can be reduced. Further, since the rotation in the θ direction requires a smaller output than the movement in the Z-axis direction, the increase in the size of the motor can be suppressed to a certain extent as a configuration in which a plurality of shafts are rotated. Also, by providing a plurality of θ-axis drive units, the angle of the electronic component to be mounted next can be adjusted in advance.

  Here, in addition to the setting of the mounting order of the electronic components of the suction unit 30 described above, the control unit 100 controls the head 15 so that the nozzle corresponding to the shaft rotated in the θ direction by the same θ-axis drive unit. It is preferable that the electronic components are mounted on the substrate in the order in which the electronic components are not continuously mounted on the substrate. In other words, when an electronic component adsorbed by the nozzle corresponding to the shaft rotated in the θ direction by any one θ axis drive unit is mounted on the substrate, the next θ direction drive unit by any other θ axis drive unit It is preferable that the order is set and controlled so that the electronic component adsorbed by the nozzle corresponding to the shaft that is rotated is mounted on the substrate. Here, in the case of the present embodiment, when the electronic component adsorbed by the nozzle rotated by the first θ-axis drive unit 54 or the third θ drive unit 58 is mounted on the substrate, the control unit 100 next places the second θ The electronic component sucked by the nozzle rotated by the shaft driving unit 56 or the fourth θ-axis driving unit 60 is mounted on the substrate. Further, when the control unit 100 controls the head 15 to mount an electronic component adsorbed by the nozzle rotated by the second θ-axis drive unit 56 or the fourth θ-axis drive unit 60 on the substrate, the control unit 100 The electronic component sucked by the nozzle rotated by the 1θ-axis drive unit 54 or the third θ-axis drive unit 58 is mounted on the substrate. Thereby, the angle in the θ direction of the electronic component mounted on the substrate can be adjusted in advance.

  In addition, the electronic component mounting apparatus 10 can adjust the positions of the two nozzles of one suction unit based on the measurement result detected by one distance sensor, so that the apparatus configuration can be simplified. The device can be made inexpensive. That is, since the two nozzles move in proportion to the opposite directions, the position of one nozzle can be detected by detecting the position of one nozzle. Thereby, the position of the nozzle can be adjusted with high accuracy even if the mechanism for detecting the relative position between the nozzle and the substrate is common to the two nozzles. Although the number of members and mechanisms constituting the apparatus increases, a sensor for detecting the position may be provided for each of the two nozzles. In this case, the position of the nozzle can be accurately detected even if an error or a change occurs due to bending or deformation of the belt of the Z-axis drive unit.

  In the above embodiment, the distance sensor is provided because the position of the nozzle can be adjusted with higher accuracy. However, the present invention is not limited to this, and the distance sensor is not provided, and the control is performed only with the set value. Also good. That is, only the input conditions may be processed semi-closed.

  In the above embodiment, a linear motion linear motor is used as the drive mechanism of the Z-axis drive unit. However, the present invention is not limited to this, and various mechanisms can be used as the drive mechanism. For example, a rotary motor that rotates a roller that stretches the belt may be used. In this case as well, the belt can be moved by rotating the roller by the rotation motor. In this case, the position of the belt and each nozzle can be detected by measuring the rotation angle of the rotary motor with an encoder, and processing can be performed semi-closed without providing a distance sensor.

  Further, the structure of the coupling mechanism of the Z-axis drive unit is not limited to moving the shaft up and down by a belt, a support unit fixed to the belt, or the like. The connecting mechanism of the Z-axis drive unit is only required to move the first nozzle (first suction unit) and the second nozzle (second suction unit) in the reverse direction, preferably in proportion. For example, the connection mechanism of the Z-axis drive unit may have a configuration in which a shaft is connected to each end of a rod-like member supported by a fulcrum, such as a so-called seesaw or pendulum.

  In the above embodiment, both the component recognition camera 18 and the laser recognition device 92 are provided, but only one of them may be provided.

  In the above-described embodiment, the configuration has one head 15. However, the present invention is not limited to this, and a plurality of heads may be provided. For example, two heads 15 may be provided and electronic components may be alternately mounted on one substrate. In this way, by mounting electronic components alternately by the two heads 15, while one head is mounting the electronic component on the substrate, the other head sucks the electronic component in the component supply device. be able to. Thereby, the time when the electronic component is not mounted on the substrate can be shortened, and the electronic component can be mounted (mounted) efficiently.

  As described above, the electronic component mounting apparatus according to the present invention is useful for mounting electronic components on a substrate, and in particular, the electronic components are continuously conveyed on the substrate by transporting the electronic components by each of a plurality of suction means. Suitable for mounting electronic components.

DESCRIPTION OF SYMBOLS 8 Board | substrate 10 Electronic component mounting apparatus 12 Board | substrate conveyance part 14 Component supply apparatus 15 Head 16 XY movement mechanism 18 Component recognition camera 22 X-axis drive part 24 Y-axis drive part 30 Suction unit 32 Z-axis drive unit 34 (theta) axis drive unit 35 Support base 40 First nozzle 42 Second nozzle 44, 46 Shaft 48 Z-axis drive unit 50, 52 Suction mechanism 54 First θ-axis drive unit 56 Second θ-axis drive unit 58 Third θ-axis drive unit 60 Fourth θ-axis drive unit 62 Distance Sensor 70 Linear motion linear motor 72 Belt 74 First support portion 76 Second support portion 80, 90 Motor 82, 92 Transmission mechanism 84, 94 Ball spline unit 86 Belt 87 Gear 88 Pulley 92 Laser recognition device 94 Storage device 96 Image processing device 97 Monitor 98 Operation section 98a Keyboard 98b Mouse 100 Control unit

Claims (9)

An electronic component mounting apparatus for mounting an electronic component sucked by a nozzle on a substrate,
A first suction unit comprising the nozzle for sucking the electronic component;
A second suction part that includes the nozzle for sucking the electronic component, and the nozzle faces the same direction as the nozzle of the first suction part;
A connection mechanism connected to the first suction part and the second suction part and a direction perpendicular to the surface of the substrate by moving the connection mechanism and the first suction part and the second suction part A head including a Z-axis drive unit including a drive mechanism for moving the
A control unit for controlling the operation of the head,
The electronic component mounting apparatus according to claim 1, wherein the coupling mechanism is moved by the drive mechanism to move the first suction unit and the second suction unit in opposite directions. The coupling mechanism is disposed at a position spaced apart from the belt in a direction orthogonal to the surface of the substrate, and at least two rollers for stretching the belt, orthogonal to the surface of the substrate of the belt. A first support portion fixed to one of the two surfaces and connected to the first suction portion; and fixed to the other surface of the two surfaces orthogonal to the surface of the substrate of the belt; A second support portion connected to the two adsorption portions;
The electronic component mounting apparatus according to claim 1, wherein the belt is moved by the driving mechanism to move the first suction portion and the second suction portion in opposite directions.   3. The linear motion linear motor, wherein the drive mechanism is connected to the coupling mechanism and moves a connecting portion with the coupling mechanism in a direction orthogonal to the surface of the substrate. The electronic component mounting apparatus described in 1. A distance sensor disposed in connection with the first suction unit;
The control unit calculates a distance between the first suction unit and the substrate and a distance between the second suction unit and the substrate based on a distance detected by the distance sensor. 4. The electronic component mounting apparatus according to any one of items 1 to 3.   5. The head according to claim 1, wherein the head includes a plurality of suction units including the first suction unit, the second suction unit, and the Z-axis drive unit. Electronic component mounting equipment. In the head, a plurality of the suction units are arranged adjacent to each other, and
The first adsorption part of each of the plurality of adsorption units is disposed adjacent to each other, and the second adsorption part is disposed adjacent to each other. Electronic component mounting equipment. The head is
Of the plurality of suction units arranged in a row, an axis parallel to the direction in which the first suction part and the second suction part move through the nozzles of the first suction part of the odd-numbered suction units. A first θ-axis drive unit that rotates about
Of the plurality of suction units arranged in a line, the nozzles of the first suction units of the even-numbered suction units are parallel to the direction in which the first suction unit and the second suction unit move. A second θ-axis drive unit that rotates about
Of the plurality of suction units arranged in a row, an axis parallel to the direction in which the first suction portion and the second suction portion move through the nozzles of the second suction portion of the odd-numbered suction units. A third θ-axis drive unit that rotates about
Of the plurality of suction units arranged in a row, the nozzle of the second suction part of the even-numbered suction unit is parallel to the direction in which the first suction part and the second suction part move. The electronic component mounting apparatus according to claim 6, further comprising a fourth θ-axis driving unit that rotates about the axis. The control unit controls the head, and when the electronic component attracted by the nozzle rotated by the first θ-axis driving unit or the third θ-axis driving unit is mounted on the substrate, Mounting the electronic component adsorbed by the nozzle rotated by the second θ-axis drive unit or the fourth θ-axis drive unit on the substrate,
When the electronic component attracted by the nozzle rotated by the second θ-axis driving unit or the fourth θ-axis driving unit is mounted on the substrate, the first θ-axis driving unit or the third θ-axis driving is next performed. The electronic component mounting apparatus according to claim 7, wherein the electronic component attracted by the nozzle rotated by a portion is mounted on the substrate.   The control unit controls the head to mount the electronic component sucked by the nozzle of the suction unit on the substrate, and then sucks it by the nozzle of another suction unit. The electronic component mounting apparatus according to claim 5, wherein an electronic component is mounted on the substrate.

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