JP5047856B2 - Substrate processing equipment - Google Patents

Description

  The present invention performs predetermined processes such as solder paste printing, adhesive application, electronic component mounting, and board inspection on a printed board carried from the upstream side, and the processed printed board is placed downstream. The present invention relates to a substrate processing apparatus to be carried out to the side.

Conventionally, various substrate processing devices such as printers, dispensers, surface mounters, reflow devices, etc. are arranged in a line to build a production line, and solder paste printing processing, adhesive coating processing, electronic It is widely performed to manufacture a mounting board by sequentially performing component mounting processing, substrate inspection processing, and reflow processing. In this type of substrate processing apparatus, it is necessary to transport the printed circuit board to a target work position and to transfer it between adjacent apparatuses, and includes a transport apparatus for transporting the printed circuit board. Then, the conveyance device is controlled by attaching an optical sensor to the conveyance device and detecting the conveyance state of the printed circuit board (see Patent Documents 1 to 3 below).
JP 2005-93765 A JP 2005-45140 A Japanese Patent Laid-Open No. 6-211334

In the case of detecting a printed circuit board using an optical sensor, there are the following problems.
(A) There are various types of printed circuit boards, and the substrate colors are different depending on the types of boards. If the substrate color is different, the light absorbance changes accordingly, and it is necessary to perform setting adjustment work such as output adjustment on the light emitting side and adjustment of light receiving sensitivity, which is troublesome.
(B) The transparent substrate cannot be detected.
(C) Even if the printed circuit board is warped other than the transparent substrate, the light reflection direction changes, so that the substrate cannot be detected with high accuracy.
The present invention has been completed based on the above circumstances, and does not require setting adjustment work such as sensitivity adjustment regardless of the substrate color, and can detect a transparent substrate with high accuracy. An object of the present invention is to provide a substrate processing apparatus having the apparatus.

The present invention includes a base, a transport device that transports a printed board directly or indirectly via a plate-like substrate support along a transport path provided on the base, the printed board, and When the substrate support is defined as a transport object, a detection device that detects the presence or absence of the transport object at a detection position set on the transport path, and a work position on the base by the transport device An execution unit that performs predetermined processing such as printing of solder paste, application of adhesive, mounting of electronic components, board inspection on the printed board carried in,
The detection device includes a reflector group including one or more reflectors including at least a first reflector that has a reflection surface and is disposed below the detection position; and a transmitter that transmits ultrasonic waves. An ultrasonic sensor that shares a function as a receiver and a function as a receiver that receives ultrasonic waves with a single piezoelectric vibrator that mutually converts electrical vibration and mechanical vibration, The ultrasonic wave emitted from the vibrator is incident on the conveyance object at the detection position while being reflected by the reflection surface of each reflector constituting the reflector group, and the conveyance object The reflected ultrasonic waves are incident on the piezoelectric vibrator while being reflected again by the reflecting surface , the transport direction of the transport object is defined as the X direction, and the direction orthogonal to the X direction in the horizontal plane is defined as the Y direction. Sometimes the transport device is in the Y direction The ultrasonic sensor includes a pair of side wall bodies and a conveyor belt attached to the inner peripheral surface side of the side wall body, and the ultrasonic sensor is disposed and formed below the installation position of the conveyor belt in the side wall body. The first reflector is characterized in that it is fixed on a fixed plate extending from the insertion hole toward the center side of the conveyance path, which is inward in the Y direction .

As an embodiment of the present invention, the following configuration is preferable.
A backup device that backs up the printed circuit board directly at the working position or indirectly through the board support is provided, and the detection position is set in the working position. When the vertical direction is defined as the Z direction, the ultrasonic wave is reflected approximately 90 degrees from the Y direction to the Z direction and from the Z direction to the Y direction on the reflecting surface of the first reflector. In this way, it is possible to arrange the ultrasonic sensor in an area shifted in the Y direction with respect to the arrangement space of the backup device, and the arrangement space of the backup device, that is, the backup space of the printed circuit board. Can be secured.

-Control means which controls the drive of the conveyance device and the device attached thereto or the drive of the execution unit based on the detection signal of the ultrasonic sensor. By providing such a control means, it is possible to control the transport device and the execution unit in accordance with the transport state of the transport object.

  According to the present invention, an ultrasonic sensor is used to detect a conveyance object. In the case of ultrasonic waves, obstacles that block air vibrations are reflected in the same way even if the surface color (including transparency) is different, so that it is possible to abolish setting adjustment work that was necessary in the past. In addition, according to the present invention, a reflector group is interposed between the detection position and the ultrasonic sensor. In this way, the degree of freedom of arrangement regarding the ultrasonic sensor is increased, and furthermore, it is possible to detect a short distance, which is usually difficult due to the influence of reverberation.

  This is because when no reflector group is provided, the ultrasonic sensor is installed immediately below the detection position where the first reflector is installed, but the base is located below the detection position. In this situation, it is not possible to secure a sufficient relative distance from the object to be transported. On the other hand, for example, in a substrate mounted on both sides, there is a case in which a substrate on which a large electronic component such as a capacitor is mounted on the back surface of the substrate is conveyed by a conveyance device. Is located at a very close distance (see FIG. 10A). Then, immediately after the piezoelectric vibrator transmits ultrasonic waves, the reflected wave reflected by the large electronic component is received in a time zone affected by reverberation, and detection cannot be performed correctly.

  In this respect, in the present embodiment, a reflector group is provided between the detection position and the ultrasonic sensor, and the distance from the object to be conveyed to the ultrasonic sensor is increased by reflecting the ultrasonic wave by the reflector. It can be secured. Therefore, even in the case where a large electronic component is mounted on the back side of the substrate as described above, it can be ensured to the extent that there is a distance between the large component and the ultrasonic sensor, so that it is not affected by reverberation. The presence or absence of a substrate can be detected.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of a surface mounter, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a view of FIG. The surface mounter 1 is a device for mounting an electronic component B on a printed circuit board (hereinafter simply referred to as a substrate) P. As shown in FIG. 1, various devices (substrate P) are mounted on a base 10 having a flat upper surface. And a mounting conveyor 100 for mounting the electronic component B on the substrate P.

  In the following description, the longitudinal direction of the base 10 (the left-right direction in FIGS. 1 and 3) is referred to as the X direction, and the Y direction and the Z direction are defined in the directions of FIGS. Further, in FIG. 1, the description will be made assuming that the right hand side is the upstream side (loading side of the substrate P to be worked) and the left hand side is the downstream side (loading side of the worked substrate P).

1. Conveyor for transporting substrate P and apparatus attached thereto Base 10 has a long rectangular shape in the X direction, a transport conveyor (hereinafter simply referred to as a conveyor) 20 is disposed in the center, and a base on the upstream side A carry-in conveyor 12 is disposed at the right end of the base 10, and a carry-out conveyor 13 is disposed at the left end of the base 10 on the downstream side. These three conveyors 12, 13, and 20 are continuous with each other without any step, and are configured so that the substrate P to be worked can be sequentially sent in the X direction (from the right side to the left side in FIG. 1). Here, with reference to FIG. 2, the structure of the conveyance conveyor 20 installed in the center of the base 10 shall be demonstrated.

  The transport conveyor 20 forms a transport path Lc for the substrate P on the base 10 and is mainly composed of a side wall body 21, a transport belt 25, and a conveyor motor 27. As shown in FIG. 2, the side wall body 21 is composed of a pair facing in the Y direction, and extends in the X direction as shown in FIG. A pair of rollers 23 are stretched over the inner peripheral surface of each side wall body 21 and closer to the upper portion, and a conveyor belt 25 is attached. The conveyor belt 25 of the both side walls 21 is configured to circulate in the X direction (left and right direction in FIG. 3) by the operation of the conveyor motor 27. With such a configuration, the substrate P on the upper surface of the belt can be transported in the X direction.

  Further, reference numeral 50 shown in FIG. 1 is a substrate stopper, and reference numeral 60 is a backup device. The substrate stopper 50 is disposed slightly on the left-hand side of the center of the base, and includes a stopper pin 51 that can be moved up and down to a lowered position shown in FIG. 3 and a raised position shown in FIG.

  In the lowered position shown in FIG. 3, the tip of the stopper pin 51 is positioned below the height of the substrate P to be transported. As a result, the substrate P can pass over the substrate stopper 50. On the other hand, in the raised position shown in FIG. 4, as a result of the tip of the stopper pin 51 becoming higher than the height of the substrate P to be conveyed, the substrate P to be conveyed hits the stopper pin 51 and is in that position, that is, the center of the base. Is stopped at the mounting work position (corresponding to the “work position” of the present invention).

  The backup device 60 is attached to a mounting work position in the center of the base, and includes a backup plate 65 that holds a large number of backup pins 61 in an upright state, and a lifting device 70 that includes a lifting shaft 71 that lifts and lowers the backup plate 65. It consists of and.

  The backup plate 65 can be displaced to the lowered position shown in FIG. 2 and the raised position shown in FIG.

  When the backup plate 65 is positioned at the lowered position shown in FIG. 2, the backup pins 61 are separated from the substrate P by a predetermined distance below the substrate P conveyed on the conveyor. On the other hand, when the backup plate 65 is moved to the raised position shown in FIG. 5, the backup pin 61 lifts the center of the lower surface of the substrate from the bottom and backs up the substrate P stopped at the mounting work position. The guide piece 29 is attached to and held between the guide pieces 29.

2. Sensor Unit SU and Detection Principle Reference sign SU (generic name for SUF, SUC, SUR) shown in FIG. 1 is a sensor unit. The sensor unit SU detects the substrate P transported on the base 10 by the conveyors 12, 20, and 13, and is mainly composed of the ultrasonic sensor 30 and the reflector RF.

  The ultrasonic sensor 30 includes a sensor main body 31 that performs a detection operation. The structure of the sensor main body 31 is as shown in FIG. 6, and a piezoelectric ceramic vibrator that converts electrical vibration and mechanical vibration into each other (“ (Equivalent to “piezoelectric vibrator”) 32. A terminal 34 is drawn out from the substrate portion at the bottom of the casing, and the terminal 34 and the piezoelectric ceramic vibrator 32 are connected by a lead wire Q.

  The piezoelectric ceramic vibrator 32 has a function as a transmitter for transmitting ultrasonic waves and a function of a receiver for receiving ultrasonic waves. When a high frequency voltage is applied, ultrasonic waves are generated by the piezoelectric effect. When an ultrasonic wave is received, an electrical signal (hereinafter referred to as a detection signal Sr) corresponding to the level is output. In the present embodiment, the piezoelectric ceramic vibrator 32 is disposed in close contact with the lower surface of the upper surface wall 35A of the casing 35, and the upper surface wall (also referred to as an emission surface in the following description) 35A is a piezoelectric ceramic. A vibrator is configured together with the vibrator 32. In this embodiment, a so-called high frequency (300 kHz to 400 kHz) with good directivity is used.

  As shown in FIG. 2, the sensor main body 31 is attached to the side wall body 21 with the ultrasonic emission axis Lt facing in the horizontal direction (Y direction inner side). Specifically, the entire sensor body 31 is accommodated in an insertion hole 21 </ b> A provided in the side wall body 21, and is attached to the side wall body 21 via a bracket 36.

  A fixing plate 38 is attached to the bracket 36 so as to extend inward in the Y direction (side toward the center of the transport path Lc), and a reflector RF is fixed to the tip thereof. The reflector RF is made of a metal such as iron and is located at the front of the sensor body 31 in the X direction as shown in FIG. 7, and the width of the transport path Lc in the Y direction as shown in FIG. It is located inside (a position corresponding to the end of the substrate P conveyed on the conveyor). The reflector RF is fixed on the fixed plate 38 by tilting the reflection surface F about 45 degrees (angle θ = 45 degrees in the figure) about the emission axis Lt.

  From the above, the ultrasonic wave emitted from the sensor main body 31 can be incident on the back surface of the substrate P perpendicularly while being reflected by approximately 90 degrees on the surface of the reflector RF, and the reflection reflected by the substrate P. The light can be incident on the sensor body 31 by following the same path in the reverse direction.

  More specifically, ultrasonic waves emitted from the sensor main body 31 toward the inside in the Y direction (right side in FIG. 2) are reflected in the Z direction (upper side in FIG. 2) by the reflector RF. Then, the ultrasonic wave reflected on the upper side in FIG. Thereafter, the ultrasonic waves are reflected downward by the substrate P. Then, the reflected wave reflected downward is reflected to the outside in the Y direction (left side in FIG. 2) by the reflector RF, and is received toward the sensor body 31.

  As a result, if the substrate P stops or passes through the position on the transport path Lc and directly above the reflector RF, as shown in FIG. 8, it is constant from the time T0 when the ultrasonic wave is transmitted. The reflected wave is received at time Tsam that is delayed. On the other hand, when the substrate P does not stop at a position on the transport path Lc and directly above the reflector RF, or when the substrate P is not in the middle of passing, the ultrasonic wave passes upward, so that the reflected wave is not received. From the above, the presence or absence of the substrate P on the transport path Lc can be detected based on whether or not the reflected wave is received.

  Here, for example, as shown in FIG. 9, the same detection can be performed even if the sensor body 31 is arranged directly below the substrate P (for example, the attachment position of the reflector RF). In the embodiment, as described above, the reflector RF is interposed between the substrate P to be detected, and the ultrasonic wave emitted from the sensor main body 31 is compared with the arrangement example of FIG. 9 described above. The length of the geometric movement path up to P (hereinafter simply referred to as the distance L from the sensor body 31 to the substrate P) is increased.

  That is, in FIG. 9, the distance L from the sensor main body 31 to the substrate P is the distance L1, but in the present embodiment, the distance from the sensor main body 31 to the substrate P is shown in FIG. L is L1 + L2 obtained by adding the distance L2 from the reflector RF to the sensor main body 31 to the distance L1, and is longer than the distance L2 by a distance L2.

  With such a configuration, as shown in FIG. 10, even in the case where the large electronic component B1 is mounted on the back surface of the substrate P (mounted by an upstream surface mounting machine or the like), the substrate P Can be detected.

More specifically, the reception time T from when an ultrasonic wave is transmitted until the reflected wave is received can be obtained by the following equation (1), and the obstacle is detected from the sensor emission surface 35A. It is proportional to the distance L to (here, the substrate P).
T = 2 × L / V (1) where V is the speed of sound and is about 343 m / S.

  Therefore, if the distance L is short, the reflected wave is received immediately after the transmission. On the other hand, as shown in FIG. 8, the predetermined time t2 immediately after the transmission has so-called reverberation (residual vibration after the transmission operation of the piezoelectric ceramic vibrator 32), and the reverberation is received even if the reflected wave is received. And cannot be detected.

  In this respect, in the present embodiment, since the distance L from the sensor main body 31 to the substrate P is set to be long, even if the large electronic component B1 is mounted on the back surface of the substrate P, the sensor main body 31 is connected to the large electronic device. The distance to the component B1 can be secured to some extent. Therefore, the reception timing of the reflected wave reflected by the large electronic component B1 does not overlap the time zone t2 where reverberation occurs, and the board P on which the large electronic component B1 is mounted can be detected without difficulty.

  If the distance L2 from the reflector RF to the emission surface 35A of the sensor main body 31 is set to a value satisfying the expression (2), the reception timing of the reflected wave is almost sure from the time zone t2 where reverberation occurs. It can be removed.

  L2> (V × t2) / 2 (2) formula

  In this embodiment, as shown in FIG. 10B, the sensor main body 31 is arranged at a position (more specifically, shifted in the Y direction) that avoids the arrangement space U of the backup device 60. is doing. In this way, the arrangement space D1 of the backup pin 61 can be secured wider than that (arrangement space D2) in FIG. 10A, which is also effective.

  In the present embodiment, the sensor units SU including the ultrasonic sensor 30 and the reflector RF described above are installed at a total of three locations on the right side of the base, the center of the base, and the left end of the base as shown in FIG. The presence or absence of the substrate P at each of the detection positions K1 to K3 set on the transport path Lc of the substrate P is detected.

3. As shown in FIG. 1, a component supply unit 80 is provided at four locations around the mounting work position on the base 10. A feeder 85 as a supply device is arranged in alignment in the X direction. Each feeder 85 includes a reel (not shown) around which a component supply tape is wound, an electric delivery device (not shown) that pulls out the component supply tape from the reel, and the like.

  Electronic components B are held on the component supply tape at regular intervals. When the delivery device is driven, the electronic components B are supplied one by one as the component supply tape is pulled out. The supplied electronic component B is mounted on the substrate P backed up by the backup device 60 at the mounting work position by the mounting work device 100 described below.

  A pair of component recognition cameras 95 are installed on both sides of the conveyor 10 on the base 10 in the Y direction. This component recognition camera 95 is for photographing the electronic component B sucked and held by the suction head 185.

  The mounting work device 100 includes a suction head 185 that sucks and holds the electronic component B and a moving device 130. The moving device 130 is a Cartesian coordinate robot having three drive axes 145, 155, and 165 orthogonal to each other in XYZ. By driving these three drive axes 145, 155, and 165 in combination, the suction head 185 is moved. Move to an arbitrary position on the base 10.

  Specifically, as shown in FIG. 1, a pair of support legs 141 are installed on the base 10. Both support legs 141 are located on both sides (both sides in the X direction) of the mounting work position, and both extend straight in the Y direction (up and down direction in FIG. 1).

  Both support legs 141 are provided with guide rails (Y direction guide shafts) 142 extending in the Y direction on the upper surfaces of the support legs, and head support bodies 151 are fitted to the left and right guide rails 142 at both ends in the longitudinal direction. Is attached.

  In FIG. 1, a Y-axis ball screw shaft (Y-direction drive shaft) 145 extending in the Y direction is mounted on the right support leg 141, and a ball nut (not shown) is screwed onto the Y-axis ball screw shaft 145. Has been. A Y-axis motor 147 is provided at the shaft end of the Y-axis ball screw shaft 145.

  When the Y-axis motor 147 is energized, the ball nut advances and retreats along the Y-axis ball screw shaft 145. As a result, the head support 151 fixed to the ball nut, and thus the head unit 160 described below, extends along the guide rail 142. And move horizontally in the Y direction (Y-axis servo mechanism).

  As shown in FIG. 11, a guide member (X direction guide shaft) 153 extending in the X direction is installed on the head support 151, and the head unit 160 is movably attached to the guide member 153. . An X-axis ball screw shaft (X-direction drive shaft) 155 extending in the X direction is attached to the head support 151, and a ball nut is screwed onto the X-axis ball screw shaft 155.

  An X-axis motor 157 is provided at the shaft end of the X-axis ball screw shaft 155. When the X-axis motor 157 is energized, the ball nut advances and retreats along the X-axis ball screw shaft 155. The head unit 160 fixed to the ball nut moves in the X direction along the guide member 153 (X-axis servo mechanism).

  Therefore, the head unit 160 can be moved and operated in the horizontal direction (XY direction) on the base 10 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination.

  The head unit 160 includes a support bracket 163 as shown in FIG. 12, and a Z-axis ball screw shaft (Z-direction drive shaft) 165 is attached to the support bracket 163 with its axis facing up and down. A ball nut 171 is screwed onto the Z-axis ball screw shaft 165, and a suction head 185 is attached to the ball nut 171. The ball nut 171 is locked to the head unit 160 by guide means (not shown).

  When the Z-axis motor 167 is energized, the ball nut 171 moves up and down along the Z-axis ball screw shaft 165. As a result, the suction head 185 fixed to the ball nut 171 can be moved up and down with respect to the head unit 160. It has become.

  A suction nozzle 186 is provided at the tip of the suction head 185. The suction nozzle 186 is configured so that a negative pressure is supplied from a negative pressure means (not shown), and generates a suction force at the tip of the head.

  From the above, the electronic component B is removed from the component supply unit 80 by appropriately moving the suction head 185 while reciprocating the head unit 160 between the component supply unit 80 and the mounting work position in the center of the base. The electronic component B that can be taken out can be mounted on the substrate P backed up at the mounting work position.

  In this embodiment, a plurality of the suction heads 185 are arranged in the X direction in the head unit 160, and a plurality of electronic components B can be taken out from the component supply unit 80 at the same time. It has become. Each suction head 185 is configured to be capable of rotating around the axis for each suction head 185 by driving an R-axis motor (not shown) attached to the head unit 160.

4). Electrical configuration of the apparatus The entire apparatus of the surface mounter 1 (excluding the ultrasonic sensor 30) is controlled by the controller 200. As shown in FIG. 13, the controller 200 includes an arithmetic processing unit 211 configured by a CPU or the like, a storage device 212, a motor control unit 213, an image processing unit 214, and an input / output unit 215.

  The storage device 212 stores a mounting program for controlling the mounting work device 100 that performs the mounting work, and various data for controlling the carry-in conveyor 12, the transport conveyor 20, and the carry-out conveyor 13, and the arithmetic processing unit 211. Is assigned a work area for temporarily storing each piece of information when performing various calculations.

  The motor control unit 213 controls energization of each motor under the command of the arithmetic processing unit 211, and the X-axis motor 157, Y-axis motor 147, Z-axis motor 167, and each conveyor 12 constituting the mounting work device 100. , 20 and 13 are electrically connected to each other.

  In addition, the sensor control device 40 of the ultrasonic sensor 30 is electrically connected to the input / output unit 215. The electrical configuration of the sensor control device 40 is as shown in FIG. 13, and includes a sensor control unit 41, a transmission circuit unit 43, a reception circuit unit 45, an input / output unit 49, and the like.

  The function of each unit will be described. The transmission circuit unit 43 applies a high-frequency voltage to the piezoelectric ceramic vibrator 32 under the instruction of the sensor control unit 41, and transmits ultrasonic waves from the piezoelectric ceramic vibrator 32. . The receiving circuit unit 45 performs an ultrasonic wave receiving operation under the command of the sensor control unit 41, and amplifies and A / D converts an electric signal (detection signal Sr) output from the piezoelectric ceramic vibrator 32. Equally output.

  The sensor control unit 41 switches and controls the transmission circuit unit 43 and the reception circuit unit 45 alternately, and transmits and transmits ultrasonic waves to the ultrasonic sensor main body 31 and receives waves. Is selectively performed.

  The sensor control unit 41 detects the presence / absence of the substrate P at the detection position based on the level of the detection signal Sr taken through the reception circuit unit 45 along with the switching of the operation described above, and the result is surface-mounted through the input / output unit 49. It is configured to notify the machine 1 (output signal output).

  Although only one ultrasonic sensor 30 is shown in FIG. 13, in this embodiment, three sensor units SUF, SUC, and SUR are provided on the base as shown in FIG. Actually, the ultrasonic sensors 30 of these three sensor units SUF, SUC, and SUR are electrically connected to the input / output unit 215 of the controller 200, respectively, and the surface mounter 1 is connected to each ultrasonic sensor 30. The output signal ("ON with substrate" is an ON signal, and "OFF with no substrate") is notified.

5. A series of operations in the surface mounter 1 The surface mounter 1 takes in output signals output from the ultrasonic sensors 30 constituting the sensor units SUF, SUC, SUR through the input / output unit 215, and configures each mounter. The apparatus is appropriately controlled. For example, when the substrate P to be worked is carried onto the base 10 via the carry-in conveyor 12, an ON signal is sent from the ultrasonic sensor (that is, the sensor unit SUF) 30 installed at the right end of the base shown in FIG. Is output, and then the conveyance conveyor 20 that is stopped on the base 10 is started to drive under the control of the controller 200. Thereby, the board | substrate P carried in via the carrying-in conveyor 12 is sent to the base center.

  Thereafter, when the output signal of the ultrasonic sensor 30 at the center of the base (that is, the sensor unit SUC) 30 is switched from the OFF signal to the ON signal (from the determination state without the substrate to the determination state with the substrate), the control of the controller 200 is performed thereafter. The process which decelerates the conveyance conveyor 20 is performed under.

  Thereby, the board | substrate P heads for the mounting work position of the base, being decelerated. Then, the front end of the board hits the stopper pin 51 at the raised position, and the board P to be worked stops at the mounting work position. Thereafter, the backup device 60 operates under the control of the controller 200 on the condition that the output signal of the ultrasonic sensor (ie, the sensor unit SUC) 30 at the center of the base is an ON signal, and the substrate P is The mounting operation of the electronic component B on the backed up substrate P is then performed by the mounting apparatus 100 under the control of the controller 200.

  When the mounting operation is completed, the stopper pin 51 in the raised position is then displaced to the lowered position, and then the conveyor 20 is driven. As a result, the component-mounted board P is carried out of the mounting work position. At this time, it can be confirmed that the substrate P has been unloaded from the mounting work position by switching the output signal of the ultrasonic sensor (ie, the sensor unit SUC) 30 at the center of the base from the ON signal to the OFF signal.

  When it is confirmed that the board P has been unloaded, the stopper pin 51 is again moved from the lowered position to the raised position under the control of the controller 200 (the new board P to be mounted next is mounted in the mounting work position). (Preparation operation for stopping at).

  Further, it is possible to confirm that the substrate P has been sent to the left end of the base 10 by outputting an ON signal from the ultrasonic sensor (that is, the sensor unit SUR) 30 at the left end of the base. Originally, the carry-out conveyor 13 in a stopped state is started to drive. As a result, the component-mounted board P is carried out to another adjacent device (for example, a reflow device) via the carry-out conveyor 13.

6). Effects of this Embodiment According to this embodiment, the ultrasonic sensor 30 is used to detect the substrate P. In the case of an ultrasonic wave, an obstacle that blocks air vibrations is reflected in the same way even if the surface color of the obstacle (including transparent / opaque) is different. Therefore, setting adjustment work according to the color of the substrate P Can be abolished.

  In addition, in the present embodiment, the ultrasonic wave transmitted from the ultrasonic sensor 30 is incident on the substrate P while being reflected by the reflector RF, and the reflected wave is incident on the ultrasonic sensor 30 via the reflector RF. It is receiving at. By adopting such a configuration, the path along which the ultrasonic wave travels can be freely set to some extent. As a result, the degree of freedom of the arrangement position of the ultrasonic sensor 30 is increased, and the ultrasonic sensor 30 is placed at the position shown in FIG. Compared with the case where it installs, the distance L from the sensor main body 31 to the board | substrate P can be set longer.

  With such a configuration, even if the large electronic component B1 is mounted on the back surface of the substrate P, the distance from the sensor body 31 to the large electronic component B1 can be secured to some extent. Therefore, the reception timing of the reflected wave reflected by the large electronic component B1 does not overlap the time zone t2 where reverberation occurs, and the board P on which the large electronic component B1 is mounted can be detected without difficulty.

  Therefore, it is possible to accurately grasp the presence or absence of the substrate P at each detection position, and it is possible to smoothly perform the conveyance control of the substrate P and the component mounting control with respect to the substrate P. As a result, the surface mounter 1 is operated at a high operating rate. it can.

<Embodiment 2>
In the first embodiment, the surface mounter 1 for mounting the electronic component B on the substrate P is illustrated as an example of the substrate processing apparatus of the present invention. However, in the second embodiment, the solder paste is applied to the substrate P as an example of the substrate processing apparatus. An example of a printing machine 300 that performs printing is illustrated. Hereinafter, the configuration of the printing press 300 will be briefly described with reference to FIGS. In the following description, the substrate transport direction (left-right direction in FIG. 14) is referred to as the X direction. Further, the Y direction and the Z direction are determined in the directions shown in FIGS.

  The printing machine 300 includes a base 310 having a flat upper surface. A frame 310 </ b> A is provided on the outer periphery of the base 10, and a printing work device 320 is attached on the base 310 so as to be positioned inside the frame 310 </ b> A.

  The printing work device 320 includes a support member 321, a squeegee head support frame 340, a Y-axis movement device 327, a squeegee head 331, a squeegee 335, and the like. When explaining in order, as shown in FIG. 15, a pair of support members 321 are installed on both sides in the X direction, and extend in the Y direction on the base 310, and both front and rear ends in the Y direction are supported by columns 315. It is supported.

  Rails 323 extending in the Y direction are installed on the upper surface walls of both support members 321. On these left and right support members 321, a squeegee head support frame 340 is installed sideways while a receiving portion 343 on the lower surface of the end is fitted to the rail 323. 15, a motor 325 and a Y-axis moving device (consisting of a ball screw 328 and a ball nut) 327 using the motor 325 as a drive source are installed on the left support member 321.

  As a result, when the motor 325 is energized, the Y-axis moving device 327 is activated, and the squeegee head support frame 340 is advanced and retracted along the rail 323 in the Y direction.

  Although omitted in FIG. 15, a squeegee 335 is attached to the center of the squeegee head support frame 340 in the X direction while being supported by the squeegee head 331 (see FIG. 14). The squeegee 335 has a horizontally long shape extending horizontally in the X direction and can be raised and lowered.

  A mask M is attached below the squeegee 335 via a mask holding device 350. The mask M is obtained by attaching a stencil M3 in which a printing plate opening (not shown) is formed on a thin plate via a tensioner M2 on the bottom side of a mask frame M1 in which a metal square pipe is formed in a frame shape. (See FIG. 16).

  Next, the substrate support unit 400 will be described. The substrate support unit 400 has a configuration in which a table 410, a table 420, a table 430, a table 440, and a table 450 are stacked in order from the bottom (see FIG. 14).

  As shown in FIG. 17, on the fourth-stage table 440, conveyance belts 471 are installed on both sides in the Y direction so as to sandwich the uppermost fifth-stage table 450 therebetween. Both conveyor belts 471 extend horizontally in the X direction and are supported by support portions 480A and 480B. The substrate transport belt 471 can be circulated and driven in the X direction, and constitutes a substrate transport conveyor 470 that transports the substrate P to be printed in the X direction.

  In addition, substrate clamp pieces 480C and 480D are installed on both support portions 480A and 480B, respectively. In FIG. 17, the substrate clamp piece 480D on the back side of the apparatus located on the upper side is slidable in the Y direction with respect to the support portion 480B. At the same time, it has a function of holding it from both sides in the Y direction (see FIGS. 19A and 19B).

  On the fourth-stage table 440, three sensor units SUF, SUC, and SUR are attached to a position near the right end of the table, a position near the center of the table, and a position near the left end of the table, respectively. It is configured to detect the presence or absence of the substrate P carried on the conveyor 470. These three sensor units SUF, SUC, and SUR are the same as those mounted on the surface mounter 1 in the first embodiment, and each sensor unit SU is paired with the ultrasonic sensor 30. And a reflector RF formed (see FIG. 19).

  Returning to FIG. 17, the description will be continued. On the fifth-tier table 450 corresponding to the uppermost row, a backup plate 490 in which pin holding holes (not shown) are arranged in a matrix is installed. On the backup plate 490, a plurality of backup pins 495 are held upright while the pin ends are inserted through the pin holding holes.

  Now, all of the five tables 410 to 450 constituting the substrate support unit 400 are movable tables. To explain sequentially, four Y rails 311 extending in the Y direction are installed on the base 310 (not shown in FIG. 17). The first stage table 410 is on the Y rail 311 while fitting the rail receiving portion 413 provided on the lower surface of the table. Accordingly, when the Y-axis servo mechanism (not shown) is operated, the entire substrate support unit 400 including the first stage table 410 can be moved in the Y direction along the Y rail 411.

  The first stage table 410 has a horizontally long shape extending in the X direction, and two X rails 415 extending in the X direction are provided on the upper surface of the table. Then, on the X rails 415, the second stage table 420 is on the rail receiving portion 423 provided on the lower surface of the table.

  Thus, when the X-axis servo mechanism (not shown) is operated, the second stage table 420 can be moved in the X direction along the rail. From the above, the substrate support unit 400 can be horizontally moved to an arbitrary position on the base 310 by operating the first table 410 and the second table 420 in combination.

  A rotation mechanism 425 is provided on the second stage table 420. The rotation mechanism 425 is driven by obtaining power from a rotation servo mechanism (not shown) to rotate the third-stage table 430. Also, a lifting device (not shown) is provided between the third stage table 430 and the fourth stage table 440 and between the fourth stage table 440 and the fifth stage table 450, respectively. The table 440 and the fifth table 450 can be moved up and down independently.

  In this embodiment, when the fourth-stage table 440 and the fifth-stage table 450 are both set in a lowered state (hereinafter referred to as a substrate transfer posture), the backup pin 495 is transferred to the substrate. In addition to being positioned below the conveyor 470, the rail height of the substrate transport conveyor 470 is the same as the rail provided in another apparatus (such as an inspection apparatus or a mounting machine) adjacent to the printing press 300.

  Accordingly, when the substrate support unit 400 in the substrate transfer posture is moved horizontally to the end of the base 310, the substrate transfer conveyor 470 is stepped on the conveyor 700 provided in the adjacent apparatus as shown in FIG. The substrate P to be printed can be transferred to and from other adjacent devices through the conveyor.

  In the present embodiment, as already described, sensor units SUF and SUR located on both sides in the X direction of the fourth-stage table 440 are arranged, and ultrasonic waves of these sensor units SUF and SUR are arranged. Based on the output signal of the sensor 30, whether or not the delivery of the substrate P has been reliably performed can be confirmed by the arithmetic control unit 511 (see FIG. 18).

  The electrical configuration of the printing machine 300 is as shown in FIG. 18, and includes an arithmetic control unit 511, a storage device 512, an input / output unit 515, and the like. Specifically, an actuator (such as a motor) that drives each of the devices 400 and 320 is electrically connected, and the devices 400 and 320 are controlled under the control of the arithmetic control unit 511. Yes.

  Next, with reference to FIG. 19, a printing operation by the printing press 300 performed after the substrate delivery will be briefly described. After the board P to be printed is carried in from the upstream apparatus, it is carried to the left side in the X direction by the belt drive and stopped at the board stop position in the center of the board unit ((a of FIG. 19). )).

  Thereafter, on the condition that the output signal of the ultrasonic sensor (that is, the sensor unit SUC) 30 at the center of the base is an ON signal, the fifth table 440 is set under the control of the arithmetic control unit 511. The process of raising and lowering is performed, and the table 450 and the backup pin 495 that have been lowered are lifted.

  Then, the upper end of the backup pin 495 comes into contact with the lower surface of the substrate P at the substrate stop position in the process of ascending operation, and the substrate P to be printed is lifted. As a result, the substrate P to be printed is in a state of floating from the substrate transport conveyor 470 and is separated from the transport conveyor 470.

  Then, when the elevation amount of the table 450 reaches a predetermined amount and the substrate P to be printed is lifted to a height that is flush with the upper surfaces of the substrate clamp pieces 480C and 480D, as shown in FIG. 450 is stopped at that height.

  When the ascending operation of the table 450 is stopped, a cylinder device (not shown) is driven, and the substrate clamp piece 480D is reduced in the Y direction (right side in FIG. 19) so as to reduce the facing distance with the counterpart substrate clamp piece 480C. ) As a result, the substrate P to be printed, the lower surface of which is supported by the backup pins 495, is sandwiched and held from both sides in the Y direction by the two substrate clamp pieces 480C and 480D (see FIG. 19B).

  Thus, when the substrate P to be printed is held, the substrate support unit 400 moves horizontally on the base 310 and moves below the mask M, and moves the substrate P to be printed to a printing work position below the stencil (the present invention). (Corresponding to “working position” in FIG. 19). Next, a process of raising and lowering the fourth-stage table 440 is performed, and the table 440 that has been lowered is raised.

  Thereby, the substrate P to be printed in the holding state approaches the stencil M3. When the elevation of the table 440 reaches a predetermined amount, the raising operation of the table 440 is stopped. At this time, the substrate P to be printed is overlaid on the lower surface of the stencil M3 as shown in FIG. It becomes a state.

  Thereafter, paste solder is supplied onto the stencil M3 by the solder supply device while the squeegee 435 is lowered and brought into contact with the upper surface of the stencil M3. Then, if the squeegee 435 is reciprocated in the Y direction and the paste-like solder is extended, the solder is embedded in the printing opening of the stencil M3, and the solder can be printed at a desired position on the substrate P to be printed. I can do it.

  Then, when the solder printing is completed, the substrate support unit 400 can be moved to the center of the base by following the above-described operation in reverse, and the substrate support unit 400 is moved to the substrate transfer posture (that is, in FIG. 14). As shown, the fourth table 440 and the fifth table 450 are both lowered.

  Accordingly, when a part of the substrate transport conveyor 470 is projected outside the apparatus while moving the substrate support unit 400 in the substrate transport posture to the downstream apparatus side, that is, the left end side in FIG. The conveyor 470 continues to the conveyor 700 of the downstream apparatus without a step. Thereby, the printed board | substrate P can be carried out to the downstream apparatus through the conveyor 700. FIG.

  In this embodiment, as in the first embodiment, the ultrasonic sensor 30 is used to detect the substrate P. In the case of ultrasonic waves, obstacles that block air vibrations are reflected in the same way even if the surface color (including transparent / opaque) is different, so that it is possible to abolish setting adjustment work that was conventionally required.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the first embodiment, the “surface mounter 1” is illustrated as an example of the substrate processing apparatus on which the ultrasonic sensor 30 is mounted, and the “printer 300” is illustrated in the second embodiment. It can also be used in a device. The board inspection apparatus referred to here is an apparatus that inspects whether or not the processing is correctly performed after printing processing and after component mounting based on a board image. Instead of the suction head 185, an inspection camera (not shown) may be mounted on the head unit 160 of the surface mounter 1 shown in FIG.

  (2) In the first embodiment, the “surface mounter 1” is exemplified as an example of the substrate processing apparatus on which the ultrasonic sensor 30 is mounted, and the “printer 300” is illustrated in the second embodiment. It can also be used. Here, the coating device is a device that applies an adhesive onto the substrate P after the printing process and before component mounting. The specific configuration thereof is, for example, the head unit of the surface mounter 1 shown in FIG. Instead of the suction head 185, an application head (not shown) for applying an adhesive may be mounted on 160.

  (3) In the first embodiment, the configuration is such that only one reflector RF is disposed and the ultrasonic waves are reflected only once between the sensor body 31 and the substrate P. ) Is not limited to one (one time). For example, as shown in FIG. 20, a plurality of reflectors RF (two in the figure) are arranged between the sensor body 31 and the substrate P. It is, of course, possible to reflect the ultrasonic wave multiple times (twice in the figure).

  (4) In the first embodiment, the substrate P is exemplified as the detection target of the ultrasonic sensor 30. For example, as shown in FIG. 21, the substrate P is placed on a substrate stand ("plate-like substrate support" of the present invention). For example, if the substrate 600 is to be carried, it is of course possible to detect the substrate table 600.

Plan view of a surface mounter applied to the first embodiment AA line sectional view in FIG. FIG. 2 is a view from the direction C (showing the lowering position of the stopper pin) FIG. 2 is a view from the direction C (showing the position where the stopper pin is raised) The figure which shows the state which backed up the board Diagram showing the internal structure of the sensor body Top view showing the positional relationship between the sensor body and reflector The figure which shows the signal waveform of the detection signal observed by detection operation Figure showing a comparative example Illustration showing the effect The figure which shows the support structure of the head unit Diagram showing the suction head support structure Block diagram showing the electrical configuration of the surface mounter Front view of a printing machine applied to the second embodiment A perspective view showing a configuration of a printing apparatus main body Figure showing the mask mounting structure (before pressing) Plan view of substrate support unit Block diagram showing the electrical configuration of the printing press Diagram showing printing operation The figure which shows other embodiment The figure which shows other embodiment

Explanation of symbols

1. Surface mounter (an example of the “substrate processing apparatus” of the present invention)
DESCRIPTION OF SYMBOLS 10 ... Base 20 ... Conveyor (an example of "conveyor" of the present invention)
SU: Sensor unit (an example of the “detection device” of the present invention)
DESCRIPTION OF SYMBOLS 30 ... Ultrasonic sensor 31 ... Sensor main body 32 ... Piezoelectric ceramic vibrator (equivalent to "piezoelectric vibrator" of the present invention)
RF: Reflector (corresponding to the “first reflector” of the present invention)
100 ... Mounting apparatus (an example of the “execution unit” of the present invention)
200 ... Controller (corresponding to "control means" of the present invention)
300 ... Printer (an example of the “substrate processing apparatus” of the present invention)
320 ... Printing device (an example of the “execution unit” of the present invention)
470: Substrate transport conveyor (an example of the “transport device” of the present invention)

Claims (3)

The base,
A transport device that transports a printed circuit board directly or indirectly via a plate-like substrate support along a transport path provided on the base;
A detection device that detects the presence or absence of the transport object at a detection position set on the transport path when the printed circuit board and the substrate support are defined as a transport object;
An execution unit that executes predetermined processing such as solder paste printing, adhesive application, electronic component mounting, and board inspection on the printed board carried to the work position on the base by the transport device; A substrate processing apparatus comprising:
The detection device includes a reflector group including one or more reflectors including at least a first reflector that has a reflection surface and is installed below the detection position;
Ultrasound that shares the function of a transmitter that transmits ultrasonic waves and the function of a receiver that receives ultrasonic waves with a single piezoelectric vibrator that mutually converts electrical and mechanical vibrations A sound wave sensor,
The ultrasonic wave emitted from the piezoelectric vibrator is incident on the conveyance object at the detection position while being reflected by the reflection surface of each reflector constituting the reflector group, and the conveyance object The ultrasonic wave reflected at is incident on the piezoelectric vibrator while being reflected again by the reflecting surface,
When the transport direction of the transport object is defined as the X direction, and the direction perpendicular to the X direction in the horizontal plane is defined as the Y direction,
The transfer device
A pair of side wall bodies facing the Y direction;
Including a conveyor belt attached to the inner peripheral surface side of the side wall,
The ultrasonic sensor is housed in an insertion hole disposed and formed below the installation location of the conveyor belt in the side wall body,
The substrate processing apparatus, wherein the first reflector is fixed on a fixed plate that extends from the insertion hole toward a center side of the transport path that is inward in the Y direction . A backup device that backs up the printed circuit board directly at the working position or indirectly through the board support, and the detection position is set within the working position. In
When the vertical direction is defined as the Z direction,
The ultrasonic wave is reflected by the reflecting surface of the first reflector from the Y direction to the Z direction and from the Z direction to the Y direction by approximately 90 degrees, thereby shifting the position in the Y direction with respect to the arrangement space of the backup device. The substrate processing apparatus according to claim 1, wherein the ultrasonic sensor can be disposed in a region.   The control device according to claim 1, further comprising: a control unit that controls driving of the transport device and a device attached thereto or driving of the execution unit based on a detection signal of the ultrasonic sensor. The substrate processing apparatus as described.

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