JP2009245969A - Substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing apparatus having a detecting device eliminating the necessity of setting adjusting operation such as a sensitivity adjustment irrespective of the color of each substrate and highly accurately detecting even a transparent substrate. <P>SOLUTION: The substrate processing apparatus includes: a carrying device for carrying a printed board along a carrying path on a pedestal; the detecting device for detecting the presence or absence of an object to be carried such as the printed board on the detecting position set on the carrying path; an executing section for executing predetermined processing such as mounting of electric components for the printed board carried to the working position on the pedestal by the carrying device. The detecting device is constituted by adjacently arranging a plurality of ultrasonic sensors each consisting of a wave transmitter for transmitting an ultrasonic radio wave; and a wave receiver for receiving a reflected wave of an ultrasonic wave transmitted by the wave transmitter and reflected on the object to be carried on the detecting position, and outputting a detecting signal according to the level of the received reflection wave. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention performs predetermined processes such as solder paste printing, adhesive application, electronic component mounting, and board inspection on a board carried from the upstream side, and the processed board is placed downstream. The present invention relates to a substrate processing apparatus to be carried out.

Conventionally, various substrate processing devices such as printers, dispensers, surface mounters, reflow devices, etc. are arranged in a line to build a production line, and solder paste printing processing, adhesive coating processing, electronic It is widely performed to manufacture a mounting board by sequentially performing component mounting processing, substrate inspection processing, and reflow processing. In this type of substrate processing apparatus, it is necessary to transport the printed circuit board to a target work position and to transfer it between adjacent apparatuses, and includes a transport apparatus for transporting the printed circuit board. Then, the conveyance device is controlled by attaching an optical sensor to the conveyance device and detecting the conveyance state of the printed circuit board (see Patent Documents 1 to 3 below).
JP 2005-93765 A JP 2005-45140 A Japanese Patent Laid-Open No. 6-211334

In the case of detecting a printed circuit board using an optical sensor, there are the following problems.
(A) There are various types of printed circuit boards, and the substrate colors are different depending on the types of boards. If the substrate color is different, the light absorbance changes accordingly, and it is necessary to perform setting adjustment work such as output adjustment on the light emitting side and adjustment of light receiving sensitivity, which is troublesome.
(B) The transparent substrate cannot be detected.
(C) Even if the printed circuit board is warped other than the transparent substrate, the light reflection direction changes, so that the substrate cannot be detected with high accuracy.
The present invention has been completed based on the above circumstances, and does not require setting adjustment work such as sensitivity adjustment regardless of the substrate color, and can detect a transparent substrate with high accuracy. An object of the present invention is to provide a substrate processing apparatus having the apparatus.

A base, a transport device that transports a printed circuit board directly or indirectly via a plate-shaped substrate support along a transport path provided on the base, the printed circuit board, and the substrate support Is defined as a transport object, a detection device for detecting the presence or absence of the transport object at a detection position set on the transport path, and the transport device transported to the work position on the base An execution unit that executes predetermined processing such as printing solder paste, applying adhesive, mounting electronic components, and inspecting a substrate on a printed circuit board,
The detection device includes:
(1) A transmitter that transmits an ultrasonic wave, and a reflected wave of the ultrasonic wave that is transmitted from the transmitter and reflected by the object to be conveyed at the detection position. A receiver that outputs a detection signal corresponding to the level, and a plurality of ultrasonic sensors that are arranged adjacent to each other;
(2) A detection operation including a transmission operation for transmitting the ultrasonic wave toward the detection position and a reception operation for receiving the reflected wave is synchronized with each ultrasonic sensor constituting the sensor group. Alternatively, a sensor control unit that is executed by shifting the detection period is provided.

As an embodiment of the present invention, the following configuration is preferable.
The ultrasonic sensor is a sensor that shares a single piezoelectric vibrator that mutually converts electrical vibration and mechanical vibration as the transmitter and the receiver. In this way, the detection device can be configured at low cost.

The sensor group includes a pair of ultrasonic sensors arranged adjacent to each other, and the sensor control unit performs the detection operation on the pair of ultrasonic sensors in the same detection cycle and simultaneously. And a second detection pattern in which one ultrasonic sensor is used as a transmitter and the other ultrasonic sensor is used as a receiver. Have
-It is determined that there is an object to be transported on the condition that the reflected wave is detected in at least one of the first detection pattern and the second detection pattern, and the transport device and its attachment Control means for controlling the driving of the apparatus to be executed or the driving of the execution unit. If it does in this way, the presence or absence of a board | substrate can be detected about the wide range of a detection position belt | band | zone with a 1st detection pattern, and what is called a short distance can be detected with a 2nd detection pattern.

  According to the present invention, an ultrasonic sensor is used to detect a conveyance object. In the case of an ultrasonic wave, if it is an obstacle that blocks air vibrations, it will be reflected in the same way even if the surface color (including transparent / opaque) of the obstacle is different, so detection is possible regardless of the surface color. Therefore, it is possible to abolish setting adjustment work that was necessary in the past.

  In addition, the present invention uses a plurality of ultrasonic sensors arranged adjacent to each other. Therefore, compared with the case where a single ultrasonic sensor is used, it is possible to irradiate ultrasonic waves in a wider range of the detection position, and the detection area can be widened. Therefore, even if a notch or opening such as a slit is provided in the object to be transported, the notch or slit fits in the detection area (within the ultrasonic irradiation area), so it is hardly affected by the slit or the like. It becomes possible to detect the presence or absence of the conveyance object.

  In addition, in the present invention, these plural ultrasonic sensors are operated synchronously or shifted by the detection period, so that mutual interference between adjacent ultrasonic sensors (detection of other ultrasonic sensors). It is possible to avoid the fact that the reflected wave due to the operation is observed at an unexpected timing, and this point is also effective.

  From the above, it is possible to accurately detect the presence or absence of a conveyance object at the detection position, and as a result, it is possible to smoothly perform conveyance control of the conveyance object, component mounting processing on the board, printing processing, etc. The substrate processing apparatus can be operated at a high operating rate.

<Embodiment 1>
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a plan view of a surface mounter, FIG. 2 is a cross-sectional view taken along line AA in FIG. 1, and FIG. 3 is a view of FIG. The surface mounter 1 is a device for mounting an electronic component B on a printed circuit board (hereinafter simply referred to as a substrate) P. As shown in FIG. 1, various devices (substrate P) are mounted on a base 10 having a flat upper surface. And a mounting conveyor 100 for mounting the electronic component B on the substrate P.

  In the following description, the longitudinal direction of the base 10 (the left-right direction in FIGS. 1 and 3) is referred to as the X direction, and the Y direction and the Z direction are defined in the directions of FIGS. Further, in FIG. 1, the description will be made assuming that the right hand side is the upstream side (loading side of the substrate P to be worked) and the left hand side is the downstream side (loading side of the worked substrate P).

1. Conveyor for transporting substrate P and apparatus attached thereto Base 10 has a long rectangular shape in the X direction, a transport conveyor (hereinafter simply referred to as a conveyor) 20 is disposed at the center, and a base on the upstream side. A carry-in conveyor 12 is disposed at the right end of the table 10 and a carry-out conveyor 13 is disposed at the left end of the base 10 on the downstream side. These three conveyors 12, 13, and 20 are continuous with each other without any step, and are configured so that the substrate P to be worked can be sequentially sent in the X direction (from the right side to the left side in FIG. 1). Here, with reference to FIG. 2, the structure of the conveyance conveyor 20 installed in the center of the base 10 shall be demonstrated.

  The transport conveyor 20 forms a transport path Lc for the substrate P on the base 10 and is mainly composed of a side wall body 21, a transport belt 25, and a conveyor motor 27. As shown in FIG. 2, the side wall body 21 is composed of a pair facing in the Y direction, and extends in the X direction as shown in FIG. A pair of rollers 23 are stretched over the inner peripheral surface of each side wall body 21 and closer to the upper portion, and a conveyor belt 25 is attached. The conveyor belt 25 of the both side walls 21 is configured to circulate in the X direction (left and right direction in FIG. 3) by the operation of the conveyor motor 27. With such a configuration, the substrate P on the upper surface of the belt can be transported in the X direction.

  Further, reference numeral 50 shown in FIG. 1 is a substrate stopper, and reference numeral 60 is a backup device. The substrate stopper 50 is disposed slightly on the left-hand side of the center of the base, and includes a stopper pin 51 that can be moved up and down to a lowered position shown in FIG. 3 and a raised position shown in FIG.

  In the lowered position shown in FIG. 3, the tip of the stopper pin 51 is positioned below the height of the substrate P to be transported. As a result, the substrate P can pass over the substrate stopper 50. On the other hand, in the raised position shown in FIG. 4, as a result of the tip of the stopper pin 51 becoming higher than the height of the substrate P to be conveyed, the substrate P to be conveyed hits the stopper pin 51 and is in that position, that is, the center of the base. Is stopped at the mounting work position (corresponding to the “work position” of the present invention).

  The backup device 60 is attached to a mounting work position in the center of the base, and includes a backup plate 65 that holds a large number of backup pins 61 in an upright state, and a lifting device 70 that includes a lifting shaft 71 that lifts and lowers the backup plate 65. It consists of and.

  The backup plate 65 can be displaced to the lowered position shown in FIG. 2 and the raised position shown in FIG.

  When the backup plate 65 is positioned at the lowered position shown in FIG. 2, the backup pins 61 are separated from the substrate P by a predetermined distance below the substrate P conveyed on the conveyor. On the other hand, when the backup plate 65 is moved to the raised position shown in FIG. 5, the backup pin 61 lifts the center of the lower surface of the substrate from the bottom and backs up the substrate P stopped at the mounting work position. The guide piece 29 is attached to and held between the guide pieces 29.

  FIG. 6 is an enlarged view of the center of the base, and reference numeral 30 shown in the figure is a sensor unit. In the sensor unit 30, two ultrasonic sensors 31 </ b> A and 31 </ b> B are arranged side by side in the X direction on the base portion 37. The specific configuration of the ultrasonic sensors 31A and 31B is as shown in FIG. 7, and a piezoelectric ceramic vibration that mutually converts electrical vibration and mechanical vibration in a metal casing 35 having a substrate portion attached to the lower part. A child (corresponding to the “piezoelectric vibrator” of the present invention) 33 is accommodated. A terminal 34 is drawn out from the substrate portion at the bottom of the casing, and the terminal 34 and the piezoelectric ceramic vibrator 33 are connected by a lead wire Q.

  The piezoelectric ceramic vibrator 33 has both a function as a transmitter for transmitting ultrasonic waves and a function of a receiver for receiving ultrasonic waves. When a high frequency voltage is applied, ultrasonic waves are generated by the piezoelectric effect. When a wave is transmitted and an ultrasonic wave is received, an electric signal (hereinafter referred to as a detection signal Sr) corresponding to the level is output.

  In this embodiment, the piezoelectric ceramic vibrator 33 is disposed in close contact with the lower surface of the upper surface wall 36 of the casing 35, and the upper surface wall (also referred to as an emission surface in the following description) 36 is a piezoelectric ceramic. A vibrator is configured together with the vibrator 33. In this embodiment, a so-called high frequency (300 kHz to 400 kHz) with good directivity is used.

  The sensor unit 30 has the emission surfaces 36 of both the ultrasonic sensors 31A and 31B on the upper side just below the detection position (position corresponding to the mounting work position at the center of the base) K set on the conveyance path Lc. While being directed, it is attached to the inner side surface of the side wall body 21 via a bracket 39.

  Thereby, when the substrate P sent on the transport path Lc stops at the detection position K or crosses the detection position K, the substrate P reflects the ultrasonic wave emitted from the sensor unit 30 downward. Therefore, the presence or absence of the substrate P at the detection position K can be determined by receiving the reflected wave with the sensor unit 30.

  In this embodiment, the two ultrasonic sensors 31A and 31B arranged side by side constitute the sensor unit 30 because the ultrasonic waves are transmitted from both the ultrasonic sensors 31A and 31B. The substrate detection operation in the first detection pattern for receiving the reflected wave by both ultrasonic sensors 31A and 31B, one of the ultrasonic sensors 31A and 31B is used as a transmitter, and the other is a receiver. This is to enable both of the substrate detection operations with the second detection pattern used as the above, and this point will be described in detail later with reference to FIGS. .

2. The mounting work apparatus 100 for executing the mounting work and the apparatus attached thereto Returning to FIG. 1, the description will be continued. On the base 10, component supply sections 80 are provided at four places around the mounting work position. , A feeder 85 as a component supply device is arranged in the X direction. Each feeder 85 includes a reel (not shown) around which a component supply tape is wound, an electric delivery device (not shown) that pulls out the component supply tape from the reel, and the like.

  Electronic components B are held on the component supply tape at regular intervals. When the delivery device is driven, the electronic components B are supplied one by one as the component supply tape is pulled out. The supplied electronic component B is mounted on the substrate P backed up at the mounting work position by the mounting work device 100 described below.

  A pair of component recognition cameras 95 are installed on both sides of the conveyor 10 on the base 10 in the Y direction. The component recognition camera 95 is for photographing the electronic component B sucked and held by the suction head 185.

  The mounting work device 100 includes a suction head 185 that sucks and holds the electronic component B and a moving device 130. The moving device 130 is a Cartesian coordinate robot having three drive axes 145, 155, and 165 orthogonal to each other in XYZ. By driving these three drive axes 145, 155, and 165 in combination, the suction head 185 is moved. Move to an arbitrary position on the base 10.

  Specifically, as shown in FIG. 1, a pair of support legs 141 are installed on the base 10. Both support legs 141 are located on both sides (both sides in the X direction) of the mounting work position, and both extend straight in the Y direction (up and down direction in FIG. 1).

  Both support legs 141 are provided with guide rails (Y direction guide shafts) 142 extending in the Y direction on the upper surfaces of the support legs, and head support bodies 151 are fitted to the left and right guide rails 142 at both ends in the longitudinal direction. Is attached.

  In FIG. 1, a Y-axis ball screw shaft (Y-direction drive shaft) 145 extending in the Y direction is mounted on the right support leg 141, and a ball nut (not shown) is screwed onto the Y-axis ball screw shaft 145. Has been. A Y-axis motor 147 is provided at the shaft end of the Y-axis ball screw shaft 145.

  When the Y-axis motor 147 is energized, the ball nut advances and retreats along the Y-axis ball screw shaft 145. As a result, the head support 151 fixed to the ball nut, and thus the head unit 160 described below, extends along the guide rail 142. And move horizontally in the Y direction (Y-axis servo mechanism).

  As shown in FIG. 8, a guide member (X direction guide shaft) 153 extending in the X direction is installed on the head support 151, and the head unit 160 is movably attached to the guide member 153. . An X-axis ball screw shaft (X-direction drive shaft) 155 extending in the X direction is attached to the head support 151, and a ball nut is screwed onto the X-axis ball screw shaft 155.

  An X-axis motor 157 is provided at the shaft end of the X-axis ball screw shaft 155. When the X-axis motor 157 is energized, the ball nut advances and retreats along the X-axis ball screw shaft 155. The head unit 160 fixed to the ball nut moves in the X direction along the guide member 153 (X-axis servo mechanism).

  Therefore, the head unit 160 can be moved and operated in the horizontal direction (XY direction) on the base 10 by controlling the X-axis servo mechanism and the Y-axis servo mechanism in combination.

  The head unit 160 includes a support bracket 163 as shown in FIG. 9, and a Z-axis ball screw shaft (Z-direction drive shaft) 165 is attached to the support bracket 163 with its axis facing up and down. A ball nut 171 is screwed onto the Z-axis ball screw shaft 165, and a suction head 185 is attached to the ball nut 171. The ball nut 171 is locked to the head unit 160 by guide means (not shown).

  When the Z-axis motor 167 is energized, the ball nut 171 moves up and down along the Z-axis ball screw shaft 165. As a result, the suction head 185 fixed to the ball nut 171 can be moved up and down with respect to the head unit 160. It has become.

  A suction nozzle 186 is provided at the tip of the suction head 185. The suction nozzle 186 is configured so that a negative pressure is supplied from a negative pressure means (not shown), and generates a suction force at the tip of the head.

  From the above, the electronic component B is removed from the component supply unit 80 by appropriately moving the suction head 185 while reciprocating the head unit 160 between the component supply unit 80 and the mounting work position in the center of the base. The electronic component B that can be taken out can be mounted on the substrate P backed up at the mounting work position.

  In this embodiment, a plurality of the suction heads 185 are arranged in the X direction in the head unit 160, and a plurality of electronic components B can be taken out from the component supply unit 80 at the same time. It has become. Each suction head 185 is configured to be capable of rotating around the axis for each suction head 185 by driving an R-axis motor (not shown) attached to the head unit 160.

3. Electrical configuration of the apparatus The entire apparatus of the surface mounter (excluding the sensor unit 30) 1 is controlled by the controller 200. As shown in FIG. 10, the controller 200 includes an arithmetic processing unit 211 configured by a CPU or the like, a storage device 212, a motor control unit 213, an image processing unit 214, and an input / output unit 215.

  The storage device 212 stores a mounting program for controlling the mounting work device 100 that performs the mounting work, and various data for controlling the carry-in conveyor 12, the transport conveyor 20, and the carry-out conveyor 13, and the arithmetic processing unit 211. Is assigned a work area for temporarily storing each piece of information when performing various calculations.

  The motor control unit 213 controls energization of each motor under the command of the arithmetic processing unit 211, and the X-axis motor 157, Y-axis motor 147, Z-axis motor 167, and each conveyor 12 constituting the mounting work device 100. , 20 and 13 are electrically connected to each other.

  Further, the sensor control device 40 is electrically connected to the input / output unit 215. The sensor control device 40 controls both ultrasonic sensors 31A and 31B, and includes a sensor control unit 41, a transmission circuit unit 43, A, a reception circuit unit 45A, a transmission circuit unit 43B, a reception circuit unit 45B, a memory 46, and a counter. 47, an input / output unit 49, and the like.

  The function of each part will be described. The transmission circuit unit 43A applies a high-frequency voltage to the piezoelectric ceramic vibrator 33 of the ultrasonic sensor 31A and transmits ultrasonic waves from the piezoelectric ceramic vibrator 33 of the ultrasonic sensor 31. is there. The receiving circuit unit 45A performs an ultrasonic wave receiving operation, and amplifies and A / D converts an electric signal (detection signal Sr) output from the piezoelectric ceramic vibrator 33 of the ultrasonic sensor 31A. Output.

  Similarly, the transmission circuit unit 43B applies a high-frequency voltage to the piezoelectric ceramic vibrator 33 of the ultrasonic sensor 31A and transmits ultrasonic waves from the piezoelectric ceramic vibrator 33 of the ultrasonic sensor 31. . The receiving circuit unit 45B performs an ultrasonic wave receiving operation, and amplifies and A / D converts an electric signal (detection signal Sr) output from the piezoelectric ceramic vibrator 33 of the ultrasonic sensor 31B. Output.

  In the present embodiment, the transmission circuit units 43A and 43B and the reception circuit units 45A and 45B are electrically connected to the sensor control unit via signal lines, and the four circuit units 43A, 43B, 45A, and 45B are sensor-controlled. The unit 41 can be individually controlled.

  In addition to the control of the four circuit units 43A, 43B, 45A, and 45B, the sensor control unit 41 is configured to perform signal processing of the detection signal Sr captured through the reception circuit units 45A and 45B. Based on the detection signal Sr, the presence or absence of the substrate P is detected, and the result is notified to the surface mounter 1 through the input / output unit 49 (output signal output).

  The memory 46 also includes information necessary for the sensor control unit 41 to control the ultrasonic sensors 31A and 31B and information necessary to perform signal processing of the detection signal Sr (reception time Tmask1, reception time). Time information such as Tmask2, received time Tmask3, received time Tmax) is stored in advance. Further, the counter 47 has a function of measuring the elapsed time T in the process of executing a detection sequence described later.

4). Specific Detection Operation of Substrate P by Ultrasonic Sensors 31A and 31B (a) Detection Pattern by Both Ultrasonic Sensors 31A and 31B In the present embodiment, the detection of the presence or absence of the substrate P at the detection position K Two detection patterns different in one detection pattern and the second detection pattern are used.

  In the first detection pattern, as shown in FIG. 11, ultrasonic waves are simultaneously transmitted from both ultrasonic sensors 31A and 31B, and the reflected waves are transmitted using both ultrasonic sensors 31A and 31B. It is supposed to receive a wave. In this way, it is possible to irradiate ultrasonic waves over a wider range of the detection position K.

  Therefore, in the first detection pattern, when a large slit for cutting the substrate is formed on the substrate P, such as a so-called split substrate, the slit is located exactly at the detection position K directly above the sensor unit. However, ultrasonic waves are applied to the slit and its peripheral portion, and the presence or absence of the substrate P can be detected.

  In the second detection pattern, as shown in FIG. 11, an ultrasonic wave is transmitted from one ultrasonic sensor (here 31A), and the reflected wave is received by the ultrasonic sensor 31B on the other side. It is said. In this second detection pattern, since the ultrasonic sensor on the transmitter side responsible for the transmission function is different from the ultrasonic sensor on the receiver side responsible for the reception function, so-called short distance detection is possible.

  Accordingly, it is assumed that a large electronic component B1 such as a capacitor has already been mounted on the back surface of the substrate P, such as a so-called double-sided mounting type substrate, and the large electronic component B1 is located just at the detection position K directly above the sensor unit. (See FIG. 12), the presence or absence of the substrate P can be detected.

  In addition, when the ultrasonic sensor 31A on the transmitter side and the ultrasonic sensor 31B on the receiver side are different, the short distance can be detected because there is no reverberation on the receiver side. The reverberation is the residual vibration of the transmitter. As shown in FIG. 13, when the receiver is also used by the same ultrasonic sensor as the transmitter, the reflected wave is reflected immediately after the ultrasonic wave is transmitted. Even if no wave is received, the detection signal Sr is observed due to reverberation. Therefore, when the transmitter and receiver are combined with the same ultrasonic sensor, the reflected wave cannot be detected in the time zone in which this reverberation occurs (cannot be distinguished from reverberation), An obstacle cannot be detected. In this regard, if the transmitter and the receiver are separately provided, there is no influence on the transmitter side on the receiver side (that is, no reverberation occurs), so that an obstacle at a short distance can be detected. That is why.

  In the embodiment, as shown in FIG. 11, both the detection operation using the first detection pattern and the detection operation using the second detection pattern described above are performed in one substrate detection operation. The board P having an opening such as a so-called split board and the double-sided mounting type board P having the large electronic component B1 mounted on the back surface can be detected.

(B) Reflected wave reception timing and mask processing By the way, as shown in FIG. 14, there are obstacles such as the head unit 160 that obstruct the progress of the ultrasonic wave in addition to the substrate P above the detection position K. . Therefore, for example, even when the substrate P is transported outside the detection position K, ultrasonic waves may be reflected by these obstacles (head unit 160) and received. . In view of this point, in the present embodiment, the following mask processing is performed.

  More specifically, the reflected wave is received by the ultrasonic sensor 31 at a time delayed by a predetermined time from the transmission of the ultrasonic wave. In the example of FIG. 13, the reflected wave is within the time t from the time T0 in FIG. During the period, the ultrasonic wave is transmitted toward the detection position K, and the reflected wave is received at time Tsam in FIG.

The wave receiving time T from when the ultrasonic wave is transmitted to when the reflected wave is received can be obtained by the following equation (1), and the distance L from the ultrasonic wave emission surface 36 to the obstacle is obtained. Proportional.
T = 2 × L / V (1) where V is the speed of sound and is about 343 m / S.

  Since the distance from the ultrasonic emission surface 36 to the substrate P is basically constant, the reflected wave reflected by the substrate P is always observed in a specific time zone after transmission. Become. Therefore, both the first detection pattern and the second detection pattern invalidate the detection signals observed in the excess time zone (time zone after time Tmask3) exceeding the specific time zone after transmission (FIG. 14 to FIG. 14). 16), the reflected wave reflected by the obstacle (such as the head unit 160) above the substrate P can be excluded from the detection target, and erroneous detection of the substrate P due to this can be avoided.

Note that the specific setting of the time Tmask3 is as follows. As shown in FIG. 14, the distance L3 is set to a distance of several millimeters from the height position Lp3 of the upper surface of the substrate when backed up. It may be decided based on
Tmask3 = 2 × L3 / V (2) formula

  Further, as shown in FIG. 15, in the first detection pattern, the time zone from the time immediately after the transmission to the specific time zone (the time zone from T0 to Tmask2) is also invalidated. This is to invalidate the detection signal Sr output due to the reverberation already described.

The specific setting of the time Tmask2 is determined based on the following equation (3) by setting the distance L2 to a distance of about several millimeters from the height position Lp2 of the lower surface of the substrate P as shown in FIG. Just do it.
Tmask2 = 2 × L2 / V (3)

  Further, as shown in FIG. 16, in the second detection pattern, although a certain time zone is invalidated immediately after transmission, the start time of the specific time zone in which the detection signal Sr is validated is determined from time Tmask2. The time Tmask1 is set early.

The specific setting of the time Tmask1 is as follows. The distance L1 is set to a distance of about several millimeters from the height position Lp1 on the lower surface of the backup plate 65 as shown in FIG. 14, and based on the following equation (4). You just have to decide.
Tmask1 = 2 × L1 / V (4)

  By doing in this way, the detection signal obtained by receiving the reflected wave reflected by the obstacle, that is, the large-sized electronic component B1, close to the emission surface 36 of the ultrasonic sensors 31A and 31B is specified time. It can be included in the belt.

(C) Setting of detection cycle In the present embodiment, as shown in FIG. 11, although two detection patterns of the first detection pattern and the second detection pattern are provided, the substrate detection operation is performed. Basically, it is composed of a wave transmitting operation for transmitting an ultrasonic wave and a wave receiving operation for receiving the reflected wave. In this embodiment, this detection operation is repeated while changing the pattern, and the substrate P The presence or absence of is to be detected. Here, in order to detect the presence or absence of the substrate P at an early stage, the cycle of the detection operation may be set to a short cycle. However, if the cycle (that is, the detection cycle TS) is made too short, the detection operation is performed on the other hand. Mutual interference may occur between each other.

  Here, the mutual interference means that the reflected wave of the ultrasonic wave transmitted by the previous detection operation is observed during the next detection operation. For example, when the ultrasonic wave is reflected by an obstacle far from the substrate P, the reflected wave reaches the sensor 30 later than that when the ultrasonic wave is reflected by the substrate P. It occurs as a cause.

In view of this point, in the present embodiment, after ultrasonic waves are transmitted from the ultrasonic sensors 31A and 31B, it is reflected by an obstacle farthest away (for example, a ceiling F of a surface mounter). The reception time Tmax until the reflected wave is received is set to the detection cycle TS (see FIGS. 14 and 15).
Tmax = 2 × L4 / V (5)

  With such a configuration, the transmitted ultrasonic waves are always received by the detection operation of each time, so even if the detection operation is repeated, mutual interference between the detection operations may occur. Therefore, it is possible to accurately determine the presence or absence of the substrate P.

  In the first detection pattern, the two ultrasonic sensors 31A and 31B are used to perform the detection operation. In the present embodiment, the sensor control unit 41 transmits both ultrasonic sensors 31A and 31B. The circuit units 43A and 43B are simultaneously provided with a start signal for starting a transmission operation, and the reception circuit units 45A and 45B are simultaneously provided with a start signal for starting a reception operation. The detection operation (transmitting operation and receiving operation) is synchronized with 31B, that is, simultaneously executed in the same detection cycle.

  By doing so, it is possible to prevent mutual interference between the ultrasonic sensors 31A and 31B in the first detection pattern. Here, mutual interference means that the reflected wave of the ultrasonic wave emitted from one ultrasonic sensor is received by the other adjacent ultrasonic sensor, and as a result, the presence or absence of the substrate P is erroneously detected. It is what is generated. For example, if it is set to transmit ultrasonic waves at different timings from both ultrasonic sensors 31A and 31B, as shown in FIG. 17, it is emitted from one ultrasonic sensor (here, sensor 31B). The reflected wave reflected by the obstacle above the substrate such as the head unit 160 may be received by the other ultrasonic sensor (here, the sensor 31A) in a specific time zone of the sensor. In this case, it should be correctly determined that “no substrate”, but erroneously detected “with substrate”.

  In this regard, in the present embodiment, since the ultrasonic sensors 31A and 31B are set to execute detection operations (transmitting operation and receiving operation) simultaneously in the same detection cycle, in FIG. As shown, the reflected wave reflected above the substrate P such as the head unit 160 must be observed for both ultrasonic sensors 31A and 31B in the invalid time zone set for the sensors. Thus, the erroneous detection can be avoided in advance.

5. Detection Sequence Next, a detection sequence executed by the sensor control unit 41 will be described. At the start of the detection sequence, it is assumed that the memory 46 (memory related to a determination result described later) is in a reset state. When the surface mounter 1 starts to operate, a command to start the substrate detection operation is given from the controller 200 to the sensor unit 30 side through the communication line DL.

  When a command is given, the detection sequence shown in FIG. 19 is executed by the sensor control unit 41 of the sensor unit 30. To explain in order, first, in S1, a first detection pattern execution process is performed. As shown in FIG. 20, the first detection pattern execution process is composed of the processes of S10 to S60. In S10, the sensor control unit 41 performs a process of resetting the count value of the counter 47. .

  Thereafter, in step 20, under the control of the sensor control unit 41, the counter 47 starts the count operation and starts to measure the elapsed time T from the start time T0 of the detection operation. After that, in S30-1, under the control of the sensor control unit 41, both transmission circuit units 43A and 43B are driven simultaneously, and the high frequency voltage is applied to both piezoelectric ceramic vibrators 33 of both ultrasonic sensors 31A and 31B. Are applied simultaneously.

  Thereby, an ultrasonic wave is transmitted from both ultrasonic sensors 31A and 31B. As shown in FIG. 15, the ultrasonic wave transmission is continued for a time t immediately after the start time T0 when the counter 47 starts to measure time (wave transmission operation).

  After that, when the wave transmission operation is completed, next, under the command of the sensor control unit 41, the reception circuit units 45A and 45B of the ultrasonic sensors 31A and 31B are activated, and the wave reception operation is started. Simultaneously with the wave receiving operation, the sensor control unit 41 performs signal processing (that is, mask processing) of the detection signal Sr captured through the receiving circuit units 45A and 45B.

  More specifically, first, in S40-1, the elapsed time T counted by the counter 47 is compared with the information “received time Tmask2” and “received time Tmask3” stored in the memory 46 to determine the elapsed time. The sensor control unit 41 performs a process of determining whether or not the time T is within the range from “received time Tmask2” to “received time Tmask3” (Tmask2 <T <Tmask3). Here, since the elapsed time T has not reached the “reception time Tmask2”, the determination is NO.

  In the next step S60, the sensor control unit 41 performs a process for comparing the elapsed time T measured by the counter 47 with the information “received time Tmax” stored in the memory 46, and NO is also determined there. The As a result, the process returns to S40 again.

  As described above, until the elapsed time T reaches “Tmask2”, the process is repeated in the loop 1 (the processes of S40-1 and S60) shown in FIG. 20, and the other processes are performed. Absent. By doing in this way, even if the detection signal Sr is observed for the invalid time zone A shown in FIG. 15, it is not reflected in the signal confirmation processing 1 described below and is invalidated. .

  Eventually, when the elapsed time T reaches “Tmask2”, the result of the Yes determination is made when the process of S40-1 is executed, and the loop 1 is exited. Then, this time, the process of the loop 2 including the signal confirmation process 1 of S50 is repeatedly executed by the sensor control unit 41. The process of the loop 2 is continued until the elapsed time T reaches “Tmask3”.

  The contents of the signal confirmation process 1 are as shown in FIG. 21, and are composed of a determination process (S51-1) for the presence or absence of the detection signal Sr, a process for storing the determination result (S55), and the like. As a result, if the detection signal Sr is observed in any one of the ultrasonic sensors 31A and 31B in the specific time zone B shown in FIG. In the example, “1”) is stored in the memory 46, and if it is not observed, information “no detection signal Sr” (“0” in this example) is stored in the memory 46.

  Thereafter, when the elapsed time T has passed “Tmask3”, the result of the NO determination (NO also for S60) is performed when the determination process of S40-1 is performed next, and the process is performed again in the loop 1. Repeatedly, no other processing is performed. By doing so, the invalid time zone C shown in FIG. 15 is invalidated without being reflected in the signal confirmation processing even if the detection signal Sr is observed.

  Eventually, when the elapsed time T reaches “Tmax”, the determination in S60 is Yes, and the first detection pattern execution process is completed.

  Thereafter, the second detection pattern execution process of S3 shown in FIG. 19 is started. As shown in FIG. 22, the second detection pattern execution process is composed of the processes of S10 to S60 (S10, S20, and S60 are the same processes as the first detection pattern execution process). Thus, the process of resetting the count value of the counter 47 is performed by the sensor control unit 41.

  Thereafter, in step 20, under the control of the sensor control unit 41, the counter 47 starts the count operation and starts to measure the elapsed time T from the start time T0 of the detection operation.

  Thereafter, in S30-2, the transmission circuit unit 43A is driven under the control of the sensor control unit 41, and a high frequency voltage is simultaneously applied to the piezoelectric ceramic vibrators 33 of both ultrasonic sensors 31A. Thereby, an ultrasonic wave is transmitted from the ultrasonic sensor 31A. As shown in FIG. 16, the ultrasonic wave transmission is continued for a time t immediately after the start time T0 when the counter 47 starts to measure time (wave transmission operation).

  Thereafter, when the transmission operation is completed, the reception circuit unit 45B of the ultrasonic sensor 31B is activated under the instruction of the sensor control unit 41, and the reception operation is started. Simultaneously with the wave receiving operation, the sensor control unit 41 performs signal processing (that is, mask processing) of the detection signal Sr captured through the reception circuit unit 45B.

  More specifically, first, in S40-2, the elapsed time T counted by the counter 47 is compared with the information “received time Tmask1” and “received time Tmask3” stored in the memory 46 to determine the elapsed time. The sensor control unit 41 performs a process of determining whether or not the time T is within the range from “received time Tmask1” to “received time Tmask3” (Tmask1 <T <Tmask3). Here, since the elapsed time T has not reached the “reception time Tmask1”, the determination is N0.

  In the next step S60, the sensor control unit 41 performs a process for comparing the elapsed time T measured by the counter 47 with the information “received time Tmax” stored in the memory 46, and NO is also determined there. The As a result, the process returns to S40-2 again.

  As described above, until the elapsed time T reaches “Tmask1”, the process is repeated in the loop 1 (the processes in S40-2 and S60) shown in FIG. 22, and the other processes are performed. Absent. By doing in this way, even if the detection signal Sr is observed, the invalid time zone D shown in FIG. 16 is invalidated without being reflected in the signal confirmation processing 2 described below. .

  Eventually, when the elapsed time T reaches “Tmask1”, the result of Yes determination is made when the process of S40-2 is executed, and the loop 1 is exited. Then, this time, the process of loop 2 including the signal confirmation process 2 of S50-2 is repeatedly executed by the sensor control unit 41. The process of the loop 2 is continued until the elapsed time T reaches “Tmask3”.

  The contents of the signal confirmation process 2 are as shown in FIG. 23, and include a determination process (S51-2) for the presence or absence of the detection signal Sr, a process for storing the determination result (S55), and the like. As a result, if the detection signal Sr is observed by the ultrasonic sensor 31B in the specific time zone E shown in FIG. 16, the sensor control unit 41 indicates the information “there is a detection signal Sr” (“1” in this example). ) Is stored in the memory 46, and if it is not observed, information “no detection signal Sr” (“0” in this example) is stored in the memory 46.

  Thereafter, when the elapsed time T has passed “Tmask3”, the result of the NO determination (NO also for S60) when the determination processing of S40-2 is performed next, the processing is again performed in the loop 1. Repeatedly, no other processing is performed. By doing so, the invalid time zone F shown in FIG. 16 is invalidated without being reflected in the signal confirmation processing 2 even if the detection signal Sr is observed.

  Eventually, when the elapsed time T reaches “Tmax”, the determination in S60 is Yes, and the second detection pattern execution process is completed.

  Thereafter, in S <b> 5 shown in FIG. 19, processing for outputting the detection result to the controller 200 of the surface mounter 1 is performed by the sensor control unit 41. Specifically, the sensor control unit 41 accesses the memory 46 and reads both the determination result in the first detection pattern execution process and the determination result in the second detection pattern.

  As a result, “1” information is detected when the detection signal Sr is observed from the memory 46 within the specific time zone B during the first detection pattern execution process, and “0” is detected when the detection signal Sr is not observed. Information is read. In addition, information “1” is read when the detection signal Sr is observed in the specific time zone E during the second detection pattern execution process, and information “0” is read when the detection signal Sr is not observed. .

  And the sensor control part 41 takes the logical sum (OR) about the information of the determination result of both patterns which were read, and if a result is "1", it will output an ON signal to the surface mounter 1 side as an output signal. If the result is “zero”, an OFF signal is output as an output signal. Thus, the substrate detection operation in which the detection patterns of both the first detection pattern and the second detection pattern are set as one set is completed.

  After that, after the storage information regarding the determination result stored in the memory 46 in S7 is reset, the process returns to S1 again, and the above-described processing is repeated and executed. Thus, the substrate detection operation in which both the first detection pattern and the second detection pattern described above are combined as one set is repeatedly executed, and each time the sensor control unit 41 outputs an output signal (with a substrate). A corresponding ON signal / an OFF signal corresponding to no substrate) is output.

  On the other hand, on the surface mounting machine 1 side, an output signal output from the sensor control unit 41 is captured, and each device constituting the surface mounting machine 1 is appropriately controlled. For example, when the board P to be worked is carried into the mounting work position on the base 10, the output signal output from the sensor control unit 41 is switched from the OFF signal to the ON signal (the board is present from the judgment state without the board). After that, under the control of the controller 200, a process of decelerating the conveyor 20 is performed.

  Thereby, the board | substrate P heads for the mounting work position of the base, being decelerated. Then, the front end of the board hits the stopper pin 51 at the raised position, and the board P to be worked stops at the mounting work position. Thereafter, the backup device 60 operates under the control of the controller 200 to back up the board P, and then the mounting operation of the electronic component B on the backed up board P is performed under the control of the controller 200. 100.

  When the mounting operation is completed, the stopper pin 51 in the raised position is then displaced to the lowered position, and then the conveyor 20 is driven. As a result, the component-mounted board P is carried out of the mounting work position. At this time, when the output signal of the sensor control unit 41 is switched from the ON signal to the OFF signal (switching from the determination state with the substrate to the determination state without the substrate), the stopper pin 51 is lowered again under the control of the controller 200. A displacement operation (preparation operation for stopping the new substrate P to be mounted next) at the mounting work position is performed from the position to the raised position.

  In this embodiment, the condition of the present invention is that “the reflected wave is detected in at least one of the first detection pattern and the second detection pattern”. In addition, it is determined that there is an object to be transported, and controls the driving of the transporting device and the device attached thereto, or the driving of the execution unit ”, that is,“ the first detection pattern and The sensor control unit 41 on the sensor unit 30 side is responsible for determining that there is an object to be transported on condition that the reflected wave is detected in at least one of the second detection patterns. Yes. More specifically, the sensor control unit 41 executes the detection sequence shown in FIGS. 19 to 23 so that the preceding process is executed. Also, the controller 200 on the surface mounter main body is responsible for the processing of the subsequent stage, that is, “controls the drive of the transport device and the device attached thereto, or the drive of the execution unit”. By cooperating with the control unit 41, the processing function fulfilled by the “control means” of the present invention is realized.

6). Effects of this Embodiment According to this embodiment, the ultrasonic sensor 31 is used to detect the substrate P. In the case of ultrasonic waves, obstacles that block the vibration of air can be detected regardless of the surface color because they are reflected in the same way even if the surface color (including transparent / opaque) of the obstacles is different. The setting adjustment work corresponding to the color of the substrate P can be abolished.

  In addition, in the present embodiment, two ultrasonic sensors 31A and 31B are used for detecting the substrate P, and both the first detection pattern and the second detection pattern are detected by one substrate detection operation. Is going to do. With such a configuration, it is possible to detect the presence or absence of the substrate P in a wide range of the detection position K in the first detection pattern, and it is possible to detect a so-called short distance with the second detection pattern. Become.

  Therefore, in addition to the normal substrate P, the so-called split substrate P in which a large slit ST is opened on the substrate and the double-sided mounting type substrate P in which the electronic component B is mounted on the back surface of the substrate P Presence / absence can be accurately detected, and the substrate P transport control and the component mounting control on the substrate P can be smoothly performed. As a result, the surface mounter 1 can be operated at a high operating rate.

<Embodiment 2>
Next, Embodiment 2 of the present invention will be described with reference to FIGS.
In the second embodiment, a part of the detection sequence is changed from that in the first embodiment. The detection sequence of the second embodiment also alternately performs the first detection pattern execution process and the second detection pattern execution process. In the first detection pattern execution process of S1 shown in FIG. 20, the series of processes shown in FIG. 20 is executed, and in the second detection pattern execution process of S3 shown in FIG. 24, the series of processes shown in FIG.

  Here, the first detection pattern execution process shown in FIG. 20 and the second detection pattern execution process shown in FIG. 22 include signal confirmation processes 1 and 2, respectively. In this example, the signal confirmation processes 1 and 2 are different from those of the first embodiment. Specifically, as shown in FIG. 25 and FIG. 26, when the determination is made in S51-1, S51-2 performed in the process of the signal confirmation processing 1, 2, both are output signals in S53. Is set to the ON state. As a result, when the substrate P is detected by the ultrasonic sensors 31A and 31B, the detection result is immediately notified to the surface mounter 1 side, and the surface mounter 1 side corresponds to the state of conveyance of the substrate P. Quick control is possible.

  In the second embodiment, in response to performing the above processing, as shown in FIG. 24, an output OFF determination process in S6 is newly provided (in other words, the processing in S5 in the first embodiment is performed). Abolished). The output OFF determination processing in S6 is executed by the sensor control unit 41, and the processing content is as shown in FIG. 27. First, in S100, the memory 46 is accessed and the determination result, that is, the presence or absence of the detection signal Sr. Is read for each of the first detection pattern and the second detection pattern.

  In the subsequent S110, a process for determining the presence or absence of the detection signal Sr is performed. If the detection signal Sr is observed in a specific time zone in the execution process of one of the detection patterns, a determination of YES is made. The At this time, a process for turning off the output signal is performed in the subsequent S120, and then the process ends. On the other hand, if NO is determined in S110, then the process ends.

  By performing such an output OFF determination process, the ON signal output to the mounting machine 1 in the process of the detection sequence can be turned OFF when the detection sequence of that time is completed.

<Embodiment 3>
Next, Embodiment 3 of the present invention will be described.
In the first embodiment, only the command for starting the substrate detection operation is given from the controller 200 on the surface mounter 1 side to the sensor unit 30 side, and the detection sequence shown in FIGS. 19 to 23 is given to the sensor control unit 41 of the sensor unit 30. To execute. On the other hand, in the second embodiment, the detection processing shown in FIGS. 19 to 23 is executed by the arithmetic processing unit 211 on the surface mounting machine 1 side, and a command required in the execution process of the sequence is sent to the sensor control unit 41. Therefore, the sensor unit 30 is caused to perform a substrate detection operation in which both the first detection pattern and the second detection pattern are set as one set.

  In order to execute the above processing on the controller 200 side, for example, information on the reception time Tmask1, reception time Tmask2, reception time Tmask3, and reception time Tmax is stored in the storage device 212 of the controller 200 in advance. In addition, a counter 47 may be provided on the controller 200 side, and an elapsed time from the detection operation start time T0 may be measured on the controller 200 side.

<Embodiment 4>
In the first to third embodiments, the surface mounter 1 that mounts the electronic component B on the substrate P is illustrated as an example of the substrate processing apparatus of the present invention. In the fourth embodiment, the substrate P is soldered as an example of the substrate processing apparatus. The printing machine 300 which prints a paste is illustrated. Hereinafter, the configuration of the printing press 300 will be briefly described with reference to FIGS. 28 to 33. In the following description, the substrate transport direction (left-right direction in FIG. 28) is referred to as the X direction. Further, the Y direction and the Z direction are determined in the directions shown in FIGS. 28 and 29, respectively.

  The printing machine 300 includes a base 310 having a flat upper surface. A frame 310 </ b> A is provided on the outer periphery of the base 10, and a printing work device 320 is attached on the base 310 so as to be positioned inside the frame 310 </ b> A.

  The printing work device 320 includes a support member 321, a squeegee head support frame 340, a Y-axis movement device 327, a squeegee head 331, a squeegee 335, and the like. To explain in order, as shown in FIG. 29, a pair of support members 321 are installed on both sides in the X direction, and extend in the Y direction on the base 310, and both front and rear ends in the Y direction are supported by columns 315. It is supported.

  Rails 323 extending in the Y direction are installed on the upper surface walls of both support members 321. On these left and right support members 321, a squeegee head support frame 340 is installed sideways while a receiving portion 343 on the lower surface of the end is fitted to the rail 323. In FIG. 29, a motor 325 and a Y-axis moving device (consisting of a ball screw 328 and a ball nut) 327 using the motor 325 as a drive source are installed on the support member 321 on the left side.

  As a result, when the motor 325 is energized, the Y-axis moving device 327 is activated, and the squeegee head support frame 340 is advanced and retracted along the rail 323 in the Y direction.

  Although omitted in FIG. 29, a squeegee 335 is attached to the center of the squeegee head support frame 340 in the X direction while being supported by the squeegee head 331 (see FIG. 28). The squeegee 335 has a horizontally long shape extending horizontally in the X direction and can be raised and lowered.

  A mask M is attached below the squeegee 335 via a mask holding device 350. The mask M is obtained by attaching a stencil M3 in which a printing plate opening (not shown) is formed on a thin plate via a tensioner M2 on the bottom side of a mask frame M1 in which a metal square pipe is formed in a frame shape. .

  Next, the substrate support unit 400 will be described. The substrate support unit 400 is configured by stacking a table 410, a table 420, a table 430, a table 440, and a table 450 in order from the bottom (see FIG. 28).

  As shown in FIG. 31, on the fourth stage table 440, conveyor belts 471 are installed on both sides in the Y direction with the uppermost fifth stage table 450 interposed therebetween. Both conveyor belts 471 extend horizontally in the X direction and are supported by support portions 480A and 480B. The substrate transport belt 471 can be circulated and driven in the X direction, and constitutes a substrate transport conveyor 470 that transports the substrate P to be printed in the X direction.

  In addition, substrate clamp pieces 480C and 480D are installed on both support portions 480A and 480B, respectively. In FIG. 31, the board clamp piece 480D on the back side of the apparatus located on the upper side is slidable in the Y direction with respect to the support portion 480B, and the board clamp piece 480C on the other side is transferred to the board P carried on the table 450. At the same time, it has a function of holding it from both sides in the Y direction (see FIGS. 33A and 33B).

  And the sensor unit 30 is attached to the position of the upper side of FIG. Similar to the sensor unit of the first embodiment, the sensor unit 30 is configured by arranging two ultrasonic sensors 31A and 31B as a pair, and detects the presence or absence of the substrate P carried on the substrate transfer conveyor 470. Yes.

  Referring back to FIG. 31, the description will be continued. A backup plate 490 having pin holding holes (not shown) arranged in a matrix form is installed on the table 450 at the uppermost level. On the backup plate 490, a plurality of backup pins 495 are held upright while the pin ends are inserted through the pin holding holes.

  Now, all of the five tables 410 to 450 constituting the substrate support unit 400 are movable tables. To explain sequentially, four Y rails 311 extending in the Y direction are installed on the base 310 (not shown in FIG. 29). The first stage table 410 is on the Y rail 311 while fitting the rail receiving portion 413 provided on the lower surface of the table. Accordingly, when the Y-axis servo mechanism (not shown) is operated, the entire substrate support unit 400 including the first stage table 410 can be moved in the Y direction along the Y rail 411.

  The first stage table 410 has a horizontally long shape extending in the X direction, and two X rails 415 extending in the X direction are provided on the upper surface of the table. Then, on the X rails 415, the second stage table 420 is on the rail receiving portion 423 provided on the lower surface of the table.

  Thus, when the X-axis servo mechanism (not shown) is operated, the second stage table 420 can be moved in the X direction along the rail. From the above, the substrate support unit 400 can be horizontally moved to an arbitrary position on the base 310 by operating the first table 410 and the second table 420 in combination.

  A rotation mechanism 425 is provided on the second stage table 420. The rotation mechanism 425 is driven by obtaining power from a rotation servo mechanism (not shown) to rotate the third-stage table 430. Also, a lifting device (not shown) is provided between the third stage table 430 and the fourth stage table 440 and between the fourth stage table 440 and the fifth stage table 450, respectively. The table 440 and the fifth table 450 can be moved up and down independently.

  In this embodiment, when the fourth-stage table 440 and the fifth-stage table 450 are both set in a lowered state (hereinafter referred to as a substrate transfer posture), the backup pin 495 is transferred to the substrate. In addition to being positioned below the conveyor 470, the rail height of the substrate transport conveyor 470 is the same as the rail provided in another apparatus (such as an inspection apparatus or a mounting machine) adjacent to the printing press 300.

  Accordingly, when the substrate support unit 400 in the substrate transfer posture is moved horizontally while being moved to the end of the base 310, the substrate transfer conveyor 470 is stepped on the conveyor 700 provided in the adjacent apparatus as shown in FIG. The substrate P to be printed can be transferred to and from other adjacent devices through the conveyor.

  In the present embodiment, as already described, the sensor unit 30 is arranged at the center in the X direction of the table 440 in the fourth stage, and this sensor unit 30 is the same as in the first embodiment. The detection sequence is executed to detect the presence or absence of the substrate P. And based on the output signal output from the sensor unit 30, it has the structure which can confirm the presence or absence of the board | substrate P on the board | substrate support unit 400 in the calculation control part 511 (refer FIG. 32).

  The electrical configuration of the printing press 300 is as shown in FIG. 32, and includes an arithmetic control unit 511, a storage device 512, an input / output unit 515, and the like. Specifically, an actuator (such as a motor) that drives each of the devices 400 and 320 is electrically connected, and the devices 400 and 320 are controlled under the control of the arithmetic control unit 511. Yes.

  Next, with reference to FIG. 33, a printing operation by the printing machine 300 will be briefly described. After the board P to be printed is carried in from the upstream apparatus, it is carried to the left side in the X direction by the belt drive and stopped at the board stop position in the center of the board unit ((a in FIG. 33). )).

  Thereafter, on the condition that the output signal of the sensor unit 30 at the center of the base is an ON signal, the process of raising and lowering the fifth stage table 440 is performed under the control of the arithmetic control unit 511, and the lowering The table 450 and the backup pin 495 in the state are lifted up.

  Then, the upper end of the backup pin 495 comes into contact with the lower surface of the substrate P at the substrate stop position in the process of ascending operation, and lifts the substrate P to be printed. As a result, the substrate P to be printed is in a state of floating from the substrate transport conveyor 470 and is separated from the transport conveyor 470.

  Then, when the amount of elevation of the table 450 reaches a predetermined amount and the substrate P to be printed is lifted to a height that is flush with the upper surfaces of the substrate clamp pieces 480C and 480D, as shown in FIG. 450 is stopped at that height.

  When the ascending operation of the table 450 is stopped, a cylinder device (not shown) is driven this time so that the substrate clamp piece 480D narrows the facing distance from the counterpart substrate clamp piece 480C in the Y direction (right side in FIG. 33). ) Accordingly, the substrate P to be printed, the lower surface of which is supported by the backup pins 495, is sandwiched and held from both sides in the Y direction by the both substrate clamp pieces 480C and 480D (see FIG. 33B).

  Thus, when the substrate P to be printed is held, the substrate support unit 400 moves horizontally on the base 310 and moves below the mask M, and moves the substrate P to be printed to a printing work position below the stencil (the present invention). (Corresponding to “working position” in FIG. 33). Next, a process of raising and lowering the fourth-stage table 440 is performed, and the table 440 that has been lowered is raised.

  Thereby, the substrate P to be printed in the holding state approaches the stencil M3. Then, when the elevation amount of the table 440 reaches a predetermined amount, the raising operation of the table 440 is stopped, and at this time, the substrate P to be printed is overlaid on the lower surface of the stencil M3 as shown in FIG. It becomes a state.

  Thereafter, paste solder is supplied onto the stencil M3 by the solder supply device while the squeegee 435 is lowered and brought into contact with the upper surface of the stencil M3. Then, if the squeegee 435 is reciprocated in the Y direction to extend the paste-like solder, the solder is embedded in the printing opening of the stencil M3, and the solder can be printed at a desired position on the substrate P to be printed. I can do it.

  When the solder printing is completed, the substrate support unit 400 can be moved to the center of the base by following the above-described operation in reverse, and the substrate support unit 400 is moved to the substrate transfer posture (ie, in FIG. 28). As shown, the fourth table 440 and the fifth table 450 are both lowered.

  Accordingly, when a part of the substrate transport conveyor 470 is projected outside the apparatus while moving the substrate support unit 400 in the substrate transport posture to the downstream apparatus side, that is, the left end side in FIG. The conveyor 470 continues to the conveyor 700 of the downstream apparatus without a step. Thereby, the printed board | substrate P can be carried out to the downstream apparatus through the conveyor 700. FIG.

  In this embodiment, similarly to the first embodiment, ultrasonic waves are used to detect the substrate P. In the case of an ultrasonic wave, if it is an obstacle that blocks air vibrations, it will be reflected in the same way even if the surface color (including transparent / opaque) of the obstacle is different, so detection is possible regardless of the surface color. Therefore, it is possible to abolish setting adjustment work that was necessary in the past.

  In addition, in the present embodiment, the sensor unit 30 for detecting the substrate P is composed of two ultrasonic sensors 31A and 31B as in the first embodiment, and the first detection pattern and the second detection pattern The presence or absence of the substrate P is detected by performing both of the detection patterns. In this way, since the so-called split substrate P can also be detected accurately, it becomes possible to smoothly perform the transport control of the substrate P and the print control on the substrate P. As a result, the printing press 300 can be operated at a high operating rate. Can operate.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

  (1) In the first embodiment, the “surface mounter 1” is exemplified as an example of the substrate processing apparatus on which the sensor unit 30 is mounted, and the “printer 300” is illustrated in the fourth embodiment. However, the sensor unit 30 is used as a substrate inspection apparatus. It is also possible to use it. The board inspection apparatus referred to here is an apparatus that inspects whether or not the processing is correctly performed after printing processing and after component mounting based on a board image. Instead of the suction head 185, an inspection camera (not shown) may be mounted on the head unit 160 of the surface mounter 1 shown in FIG.

  (2) In the first embodiment, the “surface mounter 1” is exemplified as an example of the substrate processing apparatus on which the sensor unit 30 is mounted, and the “printer 300” is exemplified in the fourth embodiment. However, the sensor unit 30 is used in the coating apparatus. It is also possible to do. Here, the coating device is a device that applies an adhesive onto the substrate P after the printing process and before component mounting. The specific configuration thereof is, for example, the head unit of the surface mounter 1 shown in FIG. Instead of the suction head 185, an application head (not shown) for applying an adhesive may be mounted on 160.

  (3) In the first embodiment, the substrate P is exemplified as the detection target of the sensor unit 30. However, as shown in FIG. 34, for example, the substrate P is placed on the substrate stand (the “plate-like substrate support” of the present invention For example, if it is carried on 600, it is of course possible to detect the substrate table 600.

  (4) In the first embodiment, in order to avoid mutual interference between the ultrasonic sensors 31A and 31B in the first detection pattern, a control method is adopted in which both the ultrasonic sensors 31A and 31B are synchronized. In addition to this, both ultrasonic sensors 31A and 31B may be operated by being shifted by the detection period TS, and in order to achieve this, a transmission operation is performed on the transmission circuit units 43A and 43B of both ultrasonic sensors 31A and 31B. The start signal for starting the signal may be sequentially shifted by the detection cycle TS, and the start signal for starting the reception operation to the reception circuit units 45A and 45B may be sequentially shifted by the detection cycle TS.

Plan view of a surface mounter applied to the first embodiment AA line sectional view in FIG. FIG. 2 is a view from the direction C (showing the lowering position of the stopper pin) FIG. 2 is a view from the direction C (showing the position where the stopper pin is raised) The figure which shows the state which backed up the board Enlarged view around the sensor unit Diagram showing the internal structure of the ultrasonic sensor The figure which shows the support structure of the head unit Diagram showing the suction head support structure Block diagram showing the electrical configuration of the surface mounter The figure which shows the content of the detection operation | movement of a 1st detection pattern and a 2nd detection pattern Diagram showing short-range detection The figure which shows the signal waveform of the detection signal observed by detection operation Diagram explaining mask processing (shows relationship between distance from sensor and effective range) The figure explaining mask processing (in the 1st detection pattern, the relation between the time zone made invalid and the time zone made effective is shown) The figure explaining mask processing (in the 2nd detection pattern, the relation between the time zone made invalid and the time zone made effective is shown) The figure which shows the mutual interference state of the detection signal which occurs between both ultrasonic sensors Diagram showing a state where mutual interference is avoided Flowchart diagram showing detection sequence procedure The flowchart figure which shows the process sequence of a 1st detection pattern execution process The flowchart figure which shows the process sequence of the signal confirmation process 1. The flowchart figure which shows the process sequence of a 2nd detection pattern execution process The flowchart figure which shows the process sequence of the signal confirmation process 2. The flowchart figure which shows the procedure of the detection sequence applied to Embodiment 2. The flowchart figure which shows the process sequence of the signal confirmation process 1. The flowchart figure which shows the process sequence of the signal confirmation process 2. The flowchart figure which shows the process sequence of an output OFF determination process Front view of a printing machine applied to the third embodiment A perspective view showing a configuration of a printing apparatus main body Figure showing the mask mounting structure (before pressing) Plan view of substrate support unit Block diagram showing the electrical configuration of the printing press Diagram showing printing operation The figure which shows other embodiment

Explanation of symbols

1. Surface mounter (an example of the “substrate processing apparatus” of the present invention)
DESCRIPTION OF SYMBOLS 10 ... Base 20 ... Conveyor (an example of "conveyor" of the present invention)
30 ... Sensor unit (corresponding to "detection device" of the present invention)
31A ... Ultrasonic sensor (corresponding to "a pair of ultrasonic sensors" of the present invention)
31B ... Ultrasonic sensor (corresponding to "a pair of ultrasonic sensors" of the present invention)
33 ... Piezoelectric ceramic vibrator (corresponding to "piezoelectric vibrator" of the present invention)
40 ... sensor control device 41 ... sensor control section (corresponding to "control means" of the present invention)
100 ... Mounting apparatus (an example of the “execution unit” of the present invention)
200 ... Controller (corresponding to "control means" of the present invention)
300 ... Printer (an example of the “substrate processing apparatus” of the present invention)
320 ... Printing device (an example of the “execution unit” of the present invention)
470: Substrate transport conveyor (an example of the “transport device” of the present invention)

Claims (4)

The base,
A transport device that transports a printed circuit board directly or indirectly via a plate-like substrate support along a transport path provided on the base;
A detection device that detects the presence or absence of the transport object at a detection position set on the transport path when the printed circuit board and the substrate support are defined as a transport object;
An execution unit that executes predetermined processing such as solder paste printing, adhesive application, electronic component mounting, and board inspection on the printed board carried into the work position on the base by the transport device; A substrate processing apparatus comprising:
The detection device includes:
(1) A transmitter that transmits an ultrasonic wave, and a reflected wave of the ultrasonic wave that is transmitted from the transmitter and reflected by the object to be conveyed at the detection position. A receiver that outputs a detection signal corresponding to the level, and a plurality of ultrasonic sensors that are arranged adjacent to each other;
(2) A detection operation including a transmission operation for transmitting the ultrasonic wave toward the detection position and a reception operation for receiving the reflected wave is synchronized with each ultrasonic sensor constituting the sensor group. Alternatively, a substrate processing apparatus comprising: a sensor control unit that is executed while being shifted by a detection cycle. 2. The ultrasonic sensor according to claim 1, wherein the ultrasonic sensor is a sensor sharing a single piezoelectric vibrator that mutually converts electrical vibration and mechanical vibration as the transmitter and the receiver. The substrate processing apparatus as described. The sensor group includes a pair of ultrasonic sensors arranged adjacent to each other,
The sensor control unit has a first detection pattern for causing the pair of ultrasonic sensors to execute the detection operation at the same detection period and simultaneously,
The substrate processing according to claim 2, wherein a second detection pattern using one ultrasonic sensor as a transmitter and the other ultrasonic sensor as a receiver is alternately executed. apparatus. It is determined that there is an object to be transported on the condition that the reflected wave is detected in at least one of the first detection pattern and the second detection pattern, and the transport device and its attachment The substrate processing apparatus according to claim 3, further comprising a control unit that controls driving of the apparatus to be operated or driving of the execution unit.

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